JP2008135623A - Wiring board, and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a wiring board, and also a method of manufacturing the wiring board which can inspect an open- or short-circuiting at a high speed and in a simple and convenient manner using a flying probe inspection machine or a moving probe inspection machine while eliminating the need for adding a special inspection circuit or element. <P>SOLUTION: A wiring board 1A is provided thereon with first power terminals 20, 22, second power terminals 21, 23 to which different powers are supplied, and inspection target terminals 24. The wiring board comprises an effective region 10 to be used for a wiring board 1B, and a non-effective region 11 formed integrally with the effective region 10 to be arranged at part of the periphery of the effective region and not to be used for the wiring board 1B. The wiring board 1A also comprises conductive inspection patterns 15, 16 which are connected at their one ends to the first power terminals 20, 22 and which are routed on the surface of the non-effective region 11 not to be used for the wiring board 1B and then connected at other ends to the second power terminals 21, 23. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a wiring board and a manufacturing method thereof, and more particularly to a wiring board effective for electrical inspection of a semiconductor element to be mounted and a manufacturing method of a wiring board including a semiconductor element electrical inspection process.

  Patent Document 1 and Patent Document 2 listed below disclose a mounting technique in which an IC chip is embedded in an inner layer of a multilayer printed wiring board. Compared to mounting an IC chip on the surface of a printed wiring board, in a multilayer printed wiring board in which an IC chip is embedded in the inner layer, not only the inner layer but also elements including passive elements can be mounted on the surface. The mounting area can be increased, and downsizing can be realized. Further, since the elements can be three-dimensionally mounted, the wiring length connecting the upper and lower elements can be shortened compared to the wiring length drawn around the surface. In the multilayer printed wiring board configured as described above, the parasitic resistance and the parasitic capacitance added to the wiring can be reduced, so that application to high frequency devices is expected.

  The external terminal (bonding pad) of the embedded IC chip is electrically connected to the internal terminal of the multilayer printed wiring board. The internal terminals are connected to wirings arranged on the multilayer printed wiring board. As a connection method between the IC chip and the multilayer printed wiring board, a connection method using a via or the like is used.

  In the manufacturing process of a multilayer printed wiring board, an electrical inspection is performed after an IC chip is mounted on the multilayer printed wiring board. The electrical inspection includes inspection of connection failure between the multilayer printed wiring board and the IC chip, destruction inspection of the internal circuit of the IC chip caused by static electricity or mechanical stress, and the like. As a simple method of electrical inspection, there is a method of measuring a diode characteristic provided in an internal circuit of an IC chip. In the internal circuit of the IC chip, between the external terminals for input, output or input / output of signals such as clock signals, control signals, data signals, etc. A protection circuit to prevent is inserted.

  In the IC chip 100 shown in FIG. 6, a protection circuit 120 is inserted between the external terminal 110 for signal input, output, or input / output and the interface 130. The protection circuit 120 includes a protection diode 125 inserted in a forward direction when viewed from the external terminal 110 between the signal line between the external terminal 110 and the interface 130 and the power supply 121, and an external terminal between the signal line and the ground 122. And a protective diode 126 inserted in the opposite direction as viewed from 110. By measuring the diode characteristics of the protection diodes 125 and 126 of the protection circuit 120, it is determined whether or not the external terminal 110 and the internal terminal (not shown) of the multilayer printed wiring board are normally connected. Can be detected. Further, it is possible to detect whether or not a connection failure due to electrostatic breakdown or mechanical stress has occurred. Such an electrical test is called an open / short test.

  Hereinafter, the open / short inspection method will be described. In the IC chip 100 shown in FIG. 6, the open / short inspection is first connected to the ground external terminal (not shown) of the printed wiring board to which the same potential as the ground 122 is applied and the external terminal 110 of the IC chip 100. An inspection probe (measuring needle) is brought into contact with the signal external terminal (not shown) of the printed wiring board. Thereafter, a current is allowed to flow from the ground external terminal to the signal external terminal, and the voltage-current characteristics between both external terminals can be acquired.

FIG. 7 shows the voltage-current characteristics of an ideal diode element 126. Such characteristics can be obtained if the connection of the signal wiring path and the power supply wiring path is normal. Accordingly, the open / short tests, determines that the previously determined test current I _F, greater if connection failure compared to a voltage set value voltage V _F at that time (open failure). Conversely, if the open / short inspection is smaller than the set value voltage V _F , it can be predicted that the signal wiring path and the power supply wiring path (ground path) are short-circuited (short circuit failure). It can be determined that electrostatic breakdown or breakdown due to mechanical stress has occurred. FIG. 8 is a characteristic example of the diode element 126 when an open failure occurs. FIG. 9 is a characteristic example of the diode element 126 when a short circuit failure occurs.

  Next, in the open / short inspection, the inspection probe is brought into contact with each of the power supply external terminal (not shown) of the printed wiring board to which the same potential as that of the power supply 121 is applied and the aforementioned signal external terminal. Thereafter, a current is allowed to flow from the signal external terminal to the power supply external terminal, voltage-current characteristics are acquired, and the same determination as described above can be performed.

  Further, the connection failure inspection can also be performed by the methods disclosed in Patent Document 3 and Patent Document 4 below. In the inspection method disclosed in Patent Document 3, an inspection circuit is added inside the IC chip, and an inspection element is also added inside the printed wiring board. By supplying power to both the inspection circuit added to the IC chip and the detection element added to the printed wiring board, and measuring the potential of the detection terminal provided on the printed wiring board, the IC chip to be inspected is measured. Terminal connection failure can be detected. In the inspection method disclosed in Patent Document 4, an inspection circuit (test circuit) is added only inside the IC chip. By supplying power to the inspection circuit and measuring the potential of the detection signal output from the IC chip, it is possible to detect a connection failure of the terminal to be inspected.

JP 2001-196522 A JP 2001-332863 A JP-A-7-218582 JP-A-9-281190

  In the inspection method described above, the following points have not been considered. First, in the open / short inspection method, for the inspection of one external terminal (signal external terminal) 110 of the IC chip 100, the step of measuring the diode characteristics of the diode element 123 with respect to the ground 122, and the diode with respect to the power supply 121 And measuring the diode characteristics of the element 125. That is, a process of measuring the diode characteristics twice for one terminal to be inspected is required, and the inspection time increases.

  This technical problem can be solved by using an inspection machine capable of multi-pin batch probing. In this type of inspection machine, the inspection probe is simultaneously in contact with each of the power supply external terminal, ground external terminal, and signal external terminal (not shown) of the printed wiring board, and the potential of the power supply external terminal is The potential of the ground external terminal can be set to the same potential. That is, the open / short inspection can be performed in one measurement process for one signal external terminal.

  FIG. 10 shows a case where the potential supplied to the power supply external terminal of the printed wiring board and the potential supplied to the ground external terminal are the same when the IC chip 100 shown in FIG. 6 is mounted on the printed wiring board. It is a normal diode characteristic view of each of the diode elements 125 and 126. FIG. 11 is a diode characteristic diagram of the diode element 125 or 126 when an open failure occurs. FIG. 12 is a diode characteristic diagram of the diode element 125 or 126 when a short circuit failure occurs.

  However, although an inspection machine capable of multi-pin batch probing has a high inspection speed, it is necessary to manufacture an inspection probe fixing jig every time the arrangement pattern of the external terminals of the printed wiring board is changed. Since the fixing jig is very expensive, the inspection cost increases, and it cannot be used for a low-volume product.

  Therefore, it is preferable to use an inspection machine called a flying probe or a moving probe that does not require a fixing jig for electrical inspection of small-quantity products. However, in any of the inspection machines, an inspection probe is brought into contact with a maximum of two inspection points to measure electrical characteristics. For this reason, the inspection probe cannot be brought into contact with the signal external terminal while the inspection probe is in contact with the power supply external terminal and the ground external terminal. In some types of inspection machines, open / short inspection cannot be performed in a single measurement process.

  On the other hand, adding an inspection circuit for detecting contact failure inside the IC chip disclosed in Patent Document 3 or Patent Document 4 increases the area of the IC chip, thereby reducing the size of the IC chip. Is difficult. Also, the manufacturing cost of the IC chip increases. In addition, in order to add a test circuit to an IC chip, it is necessary to add a test circuit from the design stage of an integrated circuit mounted on the IC chip, and it is difficult to apply the test circuit to a general-purpose IC or a standard IC for a specific application.

  The present invention has been made to solve the above-mentioned problems, and the object of the present invention is to use a flying probe inspection machine or a moving probe inspection machine at high speed without adding a special inspection circuit or inspection element. An object of the present invention is to provide a wiring board capable of simply performing an open / short inspection.

  Furthermore, the objective of this invention is providing the manufacturing method of the wiring board which can implement an open / short test | inspection at high speed and simply using a flying probe inspection machine or a moving probe inspection machine.

  A first feature according to the embodiment of the present invention is that a wiring board is provided with a first power supply terminal to which a first power supply is supplied, and a second power supply having a power supply level different from that of the first power supply. A second power supply terminal and a terminal to be inspected on the surface, the effective area used for the wiring board, and the non-use of the effective area integrated with the effective area and disposed in a part of the periphery thereof. And an effective region, and further includes a conductive test pattern having one end connected to the first power supply terminal and the other end routed on the surface of the non-effective region and connected to the second power supply terminal.

  A second feature according to the embodiment of the present invention is that, in the method for manufacturing a wiring board, a first power supply terminal to which a first power supply is supplied, a second power supply having a power supply level different from that of the first power supply. The second power supply terminal to be supplied and the terminal to be inspected are provided on the surface, integrated with the effective area used for the wiring board, and the effective area, and disposed in a part of the periphery thereof. An ineffective area that is not used, and a conductive inspection pattern in which one end is connected to the first power supply terminal and the other end is routed on the surface of the ineffective area and connected to the second power supply terminal. A step of manufacturing a wiring board, a step of mounting semiconductor elements electrically connected to the first power supply terminal, the second power supply terminal, and the terminal to be inspected in an effective area of the wiring board, an inspection pattern, Apply inspection probes to each of the terminals to be inspected. And comprises a step of performing electrical inspection of the semiconductor device in between and between the second power supply terminal and the inspected terminal of the first power supply terminal and the test terminal, and a step of breaking the test pattern.

  According to the present invention, there is provided a wiring board capable of performing open / short inspection at high speed and simply using a flying probe inspection machine or a moving probe inspection machine without adding a special inspection circuit or inspection element. can do.

  Furthermore, according to the present invention, it is possible to provide a method of manufacturing a wiring board capable of performing open / short inspection at high speed and simply using a flying probe inspection machine or a moving probe inspection machine.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the first to third embodiments, the same function or the same component is given the same reference numeral, and the duplicate description is omitted.

(First embodiment)
[Configuration of wiring board before inspection process]
As shown in FIG. 1A, the wiring board 1A according to the first embodiment of the present invention is connected to the first power supply terminals 20 and 22 to which the first power supply is supplied, and the first power supply. The second power supply terminals 21 and 23 and the inspected terminal 24 to which the second power supply having different power supply levels is supplied are provided on the surface, and the effective area 10 used for the wiring board 1B and the effective area 10 are integrated. And an ineffective area 11 that is not used for the wiring substrate 1B, and has one end connected to the first power supply terminal 20 and the other end routed over the surface of the ineffective area 11. The conductive test pattern 15 connected to the second power supply terminal 21 and one end connected to the first power supply terminal 22 and the other end routed over the surface of the ineffective area 11 And a test pattern 16 having conductivity connected to 23. .

  In the first embodiment, the wiring board 1A is a multilayer printed wiring board having a plurality of layers of wiring with an epoxy resin as a base substrate. The wiring is made of, for example, a Cu film coated with a Ni plating layer, and the wiring of each layer is electrically connected to each other through a through-hole wiring or a via-hole wiring. Although not shown, the wiring substrate 1A can be mounted with one or a plurality of elements such as an IC chip, a resistor element, and a capacitor element embedded in the effective region 10 or mounted on the surface. be able to.

  The effective area 10 is an area that finally remains as a result of mounting the IC chip or the like on the wiring board 1A and removing the non-effective area 11 after these electrical inspections are completed. This is an area used as 1B (see FIG. 1B) (as an individual piece). The non-effective area 11 is an area where an IC chip or the like is mounted on the wiring board 1A and the electrical area is removed after the electrical inspection is completed, and becomes a discarded plate. Therefore, it does not exist in the wiring board 1B as the final product. The boundary between the effective area 10 and the ineffective area 11 is a processing line 12, and this processing line 12 does not actually exist, but is indicated by a broken line for convenience. The processing line 12 is a position where the effective area 10 is left and the ineffective area 11 is removed mechanically or physically.

  In the first embodiment, the first power supply is a power supply for driving an element such as an IC chip, for example, 2V to 5V, and the second power supply is a ground, for example, 0V. Therefore, the first power supply terminal is a power supply external terminal of the wiring board 1A for supplying power to an element such as an IC chip. The second power supply terminal is a ground external terminal of the wiring board 1A for supplying the ground.

  Both of the inspection patterns 15 and 16 are used for contacting the inspection probe in the electrical inspection process in the manufacturing process (assembly mounting process) of the wiring board 1B including the electrical inspection process. In addition, both of the inspection patterns 15 and 16 are electrically disconnected after the non-effective area 11 is removed after the electrical inspection process is completed. That is, the connection between the first power supply terminal 20 and the second power supply terminal 21 and the connection between the first power supply terminal 22 and the second power supply terminal 23 are electrically disconnected. The inspection patterns 15 and 16 are basically the same as one of a plurality of layers of wiring arranged in the effective region 10, most preferably the uppermost layer wiring that can easily perform contact with the inspection probe. The wiring layer is formed of the same conductive material. If comprised in this way, in the manufacturing process of 1 A of wiring boards, the test patterns 15 and 16 can be simply formed only by changing the mask pattern which forms wiring, without adding a manufacturing process.

  Here, the inspection pattern 15 simply has the same line width, crosses the processing line 12 from the first power supply terminal 20 of the effective area 10 and draws the processing line 12 again on the non-effective area 11 in a plane U shape. It is formed in a planar shape connected to the second power supply terminal 21 of the transverse effective region 10. Similarly, the inspection pattern 16 is simply drawn around the non-effective area 11 from the first power supply terminal 22 of the effective area 10 to the U-shape in the same line width, and the second power supply terminal of the effective area 10 again. It is formed in the planar shape connected to 23. Note that the inspection patterns 15 and 16 are not limited to such a planar shape, and for example, the line width may be partially widened so that the region in contact with the inspection probe can be easily contacted.

[Configuration of wiring board after inspection process and after processing]
A wiring board 1B shown in FIG. 1B has a planar shape after the electrical inspection process of the wiring board 1A shown in FIG. The outline 12 </ b> A of the wiring board 1 </ b> B coincides with the processing line 12 because the ineffective area 11 is removed based on the processing line 12.

  In the wiring board 1B, most of the inspection patterns 15 and 16 of the wiring board 1A are removed along with the removal of the ineffective area 11, but a part of the inspection pattern from the first power supply terminal 20 to the contour 12A (processing line 12). 15B remains. Similarly, a part 15B of the inspection pattern from the second power supply terminal 21 to the contour 12A, a part 16B of the inspection pattern from the first power supply terminal 22 to the contour 12A, and a part from the second power supply terminal 23 to the contour 12A. A part 16B of the inspection pattern remains. Further, the cross sections of the portions 15B and 16B of these inspection patterns are exposed at the contour 12A.

[Method of manufacturing a wiring board]
Next, a method for manufacturing the wiring board 1B including an electrical inspection process will be described with reference to FIGS. 1 (a), 1 (b), and 2. FIG. First, the wiring board 1A shown in FIG. 1A is manufactured, and the wiring board 1A is prepared as shown in FIG. 2 (S1). Next, as shown in FIG. 2, an element (not shown) such as an IC chip is mounted on the effective area 10 of the wiring board 1A (S2). Here, similarly to the IC chip 100 shown in FIG. 6, the external terminals to which the power supply 121 of the mounted IC chip is supplied are the first power supply terminals 20 and 22 of the wiring board 1A shown in FIG. The external terminal to which the ground 122 is supplied is electrically connected to the second power supply terminals 21 and 23. Further, a terminal to be inspected (signal external terminal) 24 of the wiring board 1A is electrically connected to an external terminal for inputting, outputting or inputting / outputting signals of the IC chip.

Next, an open / short inspection is performed on the wiring board 1A using a flying probe inspection machine or a moving probe inspection machine (not shown) (S3). In this probe test, since the test pattern 15 is electrically connected between the first power supply terminal 20 and the second power supply terminal 21 at this time, two test points, that is, the test pattern 15 (or 16) and the inspected terminal 24 only need to be brought into contact with the inspected terminal 24. By this probe inspection, it is possible to determine in one inspection process an open failure that detects a connection failure of the terminal 24 to be inspected and a short failure caused by electrostatic breakdown or a short failure caused by mechanical stress or the like. Determination method set, as shown in FIGS. 10 to 11 described above, based on the normal diode characteristics of the diode element 125 and 126 of the protection circuit 120, as previously reference value voltage V _F at a current I _F and, if greater than the reference value V _F is obtained by measuring open failure, short circuit defective smaller.

  After the completion of the open / short inspection, the non-effective area 11 of the wiring board 1A is removed by machining with reference to the processing line 12, and the wiring board 1B including the effective area 10 is completed as shown in FIG. (S4). In removing the non-effective area 11, most of the inspection patterns 15 and 16 on the non-effective area 11 are simultaneously removed, and as a result, the inspection patterns 15 and 16 can be disconnected.

[Features of the embodiment]
In the first embodiment, an inspection for connecting the first power supply terminals 20 and 22 and the second power supply terminals 21 and 23 to the ineffective area 11 of the wiring board 1A shown in FIG. Since the pattern 15 (and 16) is provided, both inspection potentials are set to the same potential, and the inspection probe is brought into contact with two portions of the inspection pattern 15 and the terminal 24 to be inspected, thereby performing one inspection process. Thus, the open / short inspection of one terminal 24 to be inspected can be completed. Therefore, the time required for the electrical inspection can be shortened, and as a result, the time required for the entire manufacturing time of the wiring board 1B can be shortened. Moreover, since a flying probe inspection machine or a moving probe inspection machine can be used, it can respond to the wiring board 1B of a small quantity product. Further, since it is not necessary to use a multi-pin batch probing inspection machine, the manufacturing cost of the fixing jig is eliminated.

  In the first embodiment, the inspection patterns 15 and 16 of the wiring board 1A shown in FIG. 1A are formed of the same conductive material in the same conductive layer as the wiring in the effective region 10. Accordingly, since no special inspection circuit or new wiring layer is required for the open / short inspection, the manufacturing process of the wiring board 1B does not increase. Furthermore, since the disconnection of the inspection patterns 15 and 16 is performed simultaneously with the removal of the ineffective area 11, similarly, the manufacturing process of the wiring board 1B does not increase.

  In the wiring board 1A shown in FIG. 1A, the inspection patterns 15 and 16 are arranged on the left and right sides of the effective area 10, but the present invention is not limited to this layout. One inspection pattern may be provided on either side of the effective area 10 or on either side of the effective area 10.

(Second Embodiment)
The second embodiment of the present invention is an example in which the number of effective regions 10 of the wiring board 1A according to the first embodiment is increased, that is, the wiring board 1B manufactured from one wiring board 1A. An example in which the number of items is increased will be described.

[Configuration of wiring board before inspection process]
As shown in FIG. 3A, the wiring board 1A according to the second embodiment of the present invention includes a total of four effective areas 10 (a) to 10 (d) in the vertical and horizontal directions. The effective regions 10 (a) to 10 (d) are omitted in the configuration here, but are basically the same as the configuration of the effective region 10 of the wiring board 1 </ b> A according to the first embodiment. It is a configuration. That is, each of the effective areas 10 (a) and 10 (c) is connected between the first power supply terminal and the second power supply terminal, and the inspection is routed to the non-effective area 11 on the left side in the drawing. A pattern 15 is provided. In the effective areas 10 (b) and 10 (d), the test pattern 16 is connected between the first power supply terminal and the second power supply terminal, and is routed to the non-effective area 11 on the right side in the drawing. Is arranged. The processing line 12 is set so as to surround each of the effective areas 10 (a) to 10 (d).

[Configuration of wiring board after inspection process and after processing]
The wiring board 1B shown in FIG. 3B has a planar shape after the electrical inspection process of the wiring board 1A shown in FIG. The outline 12 </ b> A of the wiring board 1 </ b> B coincides with the processing line 12 because the ineffective area 11 is removed based on the processing line 12. In the second embodiment, from one wiring board 1A, a wiring board 1B having an effective area 10 (a), a wiring board 1B having an effective area 10 (b), and a wiring board having an effective area 10 (c). A total of four wiring boards 1B having 1B and effective area 10 (d) can be manufactured.
[Method of manufacturing a wiring board]
Since the manufacturing method of the wiring board 1B according to the second embodiment is the same as the manufacturing method of the wiring board 1B according to the first embodiment shown in FIG. 2, the description thereof is omitted here.

[Features of the embodiment]
In the second embodiment, the same effect as that obtained by the first embodiment described above can be obtained. In the wiring board 1A shown in FIG. 3A, the inspection patterns 15 and 16 are arranged on the left and right sides of the effective area 10, but the present invention is not limited to this layout. It may be arranged above and below the effective area 10.

(Third embodiment)
The third embodiment of the present invention includes an effective area further subdivided in one effective area 10 of the wiring board 1A according to the second embodiment described above, and between the subdivided effective areas. An example in which an inspection pattern for connecting them is provided will be described.

[Configuration of wiring board before inspection process]
As shown in FIG. 4A, the wiring board 1A according to the third embodiment of the present invention includes a total of four effective regions 10 (a) to 10 (d) in the vertical and horizontal directions. Further, each of the effective regions 10 (a) to 10 (d), for example, the effective region 10 (c) is divided into four subdivided effective regions 10 (ca) as shown in FIG. 4 (b). ), 10 (cb), 10 (cc) and 10 (cd). Similarly, the effective areas 10 (a), 10 (b) and 10 (d) other than the effective area 10 (c) are subdivided into effective areas.

  For example, as shown in FIGS. 4A and 4B, the effective area 10 (c) includes the inspection pattern 15 in the non-effective area 11, and the effective area 10 (ca) subdivided inside. Between the first power supply terminal (not shown) and the first power supply terminal (not shown) of the effective region 10 (cb) and the inspection pattern 18 and the second power supply terminal (not shown). The inspection pattern 18 is connected. Similarly, the test pattern 18 is disposed between the first power supply terminals and the second power supply terminals of the effective area 10 (cc) and the effective area 10 (cd).

  Between the subdivided effective area 10 (ca) and effective area 10 (cb), a processing line 17 that crosses the inspection pattern 18 is disposed. Like the processing line 12, the processing line 17 does not actually exist, but is indicated by a solid line for convenience. The processing line 17 is a position where the inspection pattern 18 is mechanically or physically disconnected after the electrical inspection process is completed. The disconnection of the inspection pattern 18 is specifically performed by forming a groove for partially removing the inspection pattern 18 from the front surface to the bottom surface. The groove includes a groove having a V-shaped cross section, a groove having a U-shaped cross section, and the like. The step of disconnecting the inspection pattern 18 is preferably performed in the same step as the step of disconnecting the inspection patterns 15 and 16 (step of removing the ineffective area 11), but if the disconnection method is different, it should be performed separately. Can do.

[Configuration of wiring board after inspection process and after processing]
In the wiring board 1B shown in FIGS. 5A and 5B, the electrical inspection process of the wiring board 1A shown in FIGS. 4A and 4B is finished, and the processing process is finished. It is a later planar shape. The outline 12 </ b> A of the wiring board 1 </ b> B coincides with the processing line 12 because the ineffective area 11 is removed based on the processing line 12. In the third embodiment, from one wiring board 1A, a wiring board 1B having an effective area 10 (a), a wiring board 1B having an effective area 10 (b), and a wiring board having an effective area 10 (c). A total of four wiring boards 1B having 1B and effective area 10 (d) can be manufactured.

  Further, for example, the wiring board 1B having the effective area 10 (c) includes the effective areas 10 (ca) to 10 (cd) subdivided in the effective area 10 (c). The inspection pattern 18 between (cb) is disconnected by the groove 17B, and the inspection pattern 18 between the effective areas 10 (cc) and 10 (cd) is similarly disconnected by the groove 17B. The wiring board 1B having any one of the other effective areas 10 (a), 10 (b), and 10 (d) similarly disconnects the inspection pattern 18. The groove 17 </ b> B is disposed in a region corresponding to the processing line 17. Further, when the inspection pattern 18 is disconnected, a part 18B of the inspection pattern remains to ensure an alignment margin for processing the groove 17B.

[Method of manufacturing a wiring board]
Since the manufacturing method of the wiring board 1B according to the third embodiment is the same as the manufacturing method of the wiring board 1B according to the first embodiment shown in FIG. 2, the description thereof is omitted here.

[Features of the embodiment]
In the third embodiment, the same effect as that obtained by the first embodiment described above can be obtained. In the wiring board 1A shown in FIGS. 4A and 4B, the inspection pattern 18 is disposed between the effective regions 10 (ca) and 10 (cb) subdivided into the left and right. However, in the present invention, the test pattern 18 may be disposed between the effective areas 10 (ca) and 10 (cc) subdivided vertically.

  The present invention is not limited to the embodiment described above. For example, the present invention can be applied to a wiring board based on ceramics, silicon, silicon carbide, glass or the like and a manufacturing method thereof. Further, the present invention does not necessarily require that an element is embedded in the wiring board.

(A) is a top view before the test | inspection of the wiring board based on the 1st Embodiment of this invention, (b) is a top view after the test | inspection of a wiring board. It is a flowchart explaining the manufacturing method of the wiring board which concerns on 1st Embodiment. (A) is a top view before the test | inspection of the wiring board based on the 2nd Embodiment of this invention, (b) is a top view after the test | inspection of a wiring board. (A) is a top view before the test | inspection of the wiring board based on the 3rd Embodiment of this invention, (b) is an enlarged plan view of the principal part of the wiring board shown to (a). (A) is the top view after the test | inspection of the wiring board based on 3rd Embodiment, (b) is an enlarged plan view of the principal part of the wiring board shown to (a). It is a circuit diagram of the principal part of the IC chip which concerns on the prior art of this invention. It is a diode characteristic view of the protection diode element of the IC chip concerning a prior art. It is a diode characteristic figure in case of an open defect. It is a diode characteristic figure in case of a short circuit defect. It is a diode characteristic view of the protection diode element of the IC chip concerning a prior art. It is a diode characteristic figure in case of an open defect. It is a diode characteristic figure in case of a short circuit defect.

Explanation of symbols

1A, 1B Wiring board 10, 10 (a) to 10 (d), 10 (ca) to 10 (cd) Effective area 11 Ineffective area 12, 17 Processing line 12A Outline 17B Groove 20, 22 First power supply terminal 21 , 23 Second power supply terminal 24 Inspected terminal 15, 16, 18 Inspection pattern 15B, 16B, 18B Part of inspection pattern

Claims (6)

A first power supply terminal to which a first power supply is supplied, a second power supply terminal to which a second power supply having a power supply level different from that of the first power supply is supplied, and a terminal to be inspected are provided on the surface. Effective area used for the wiring board,
A non-effective area that is integrated with the effective area and disposed in a part of the periphery thereof and is not used for the wiring board,
The wiring further comprising a conductive test pattern having one end connected to the first power supply terminal and the other end routed on the surface of the ineffective region and connected to the second power supply terminal. substrate.   A wiring connected to any one of the first power supply terminal, the second power supply terminal, and the terminal to be inspected is further provided, and the inspection pattern is the same in the same conductive layer as the wiring. The wiring board according to claim 1, wherein the wiring board is made of a conductive material.   The boundary area between the effective area and the ineffective area is a processing line that removes the ineffective area and disconnects the inspection pattern or forms a groove to disconnect the inspection pattern. The wiring board according to claim 1 or 2.   4. The wiring board according to claim 1, wherein a plurality of layers of wirings are provided and a semiconductor element is embedded in the effective region. 5. A first power supply terminal to which a first power supply is supplied, a second power supply terminal to which a second power supply having a power supply level different from that of the first power supply is supplied, and a terminal to be inspected are provided on the surface. An effective area that is used for the wiring board, and an ineffective area that is integrated with the effective area and disposed in a part of the periphery thereof, and is not used for the wiring board. A wiring board having a conductive inspection pattern connected to the second power supply terminal with the other end routed over the surface of the non-effective area,
Mounting a semiconductor element electrically connected to each of the first power supply terminal, the second power supply terminal, and the terminal to be inspected in an effective area of the wiring board; and
An inspection probe is brought into contact with each of the inspection pattern and the terminal to be inspected, and the semiconductor element is interposed between the first power supply terminal and the terminal to be inspected and between the second power supply terminal and the terminal to be inspected. A process of performing electrical inspection of
Disconnecting the inspection pattern;
A method of manufacturing a wiring board, comprising:   6. The step of disconnecting the inspection pattern is performed simultaneously with a step of removing the ineffective region or a step of forming a groove in a boundary region between the effective region and the ineffective region. A method for manufacturing a wiring board.

Images