KR101039049B1 - Chip scale package for detecting open/short of elcectrode pettern using noncontact inspection method and the inspection apparatus thereof - Google Patents

Abstract

The disclosed invention relates to a CSP substrate for detecting disconnection and short circuit using a non-contact inspection method, and an inspection apparatus thereof, the apparatus for inspecting disconnection and short circuit of a pattern while scanning a plurality of electrodes formed on the substrate, the short circuit of the outer edge of the strip And a chip scale package substrate manufactured by inserting at least one test coupon for disconnection inspection, and an electrical change value generated by supplying a voltage to one side of the substrate through a test coupon of the chip scale package substrate and generating a voltage on the other side of the substrate. And a non-contact inspection unit for inspecting whether the pattern is disconnected or short-circuited by measuring a non-contact measurement method, and detecting a signal that is electrically changed by a non-contact measurement method using a test coupon. Allows you to check for shorts.

Non-Contact, Single Wire, Short Circuit, Detect, Chip Scale Package

Description

Chip scale package for detecting disconnection and short circuit using a non-contact inspection method and its inspection apparatus {chip scale package for detecting open / short of elcectrode pettern using noncontact inspection method and the inspection apparatus}

The present invention relates to a chip scale package (hereinafter referred to as a CSP) substrate and an inspection apparatus thereof capable of detecting disconnection and short circuit of a pattern by applying a non-contact inspection method, and more particularly, to one side of the substrate. A non-contact inspection method is provided in which voltage is supplied through at least one probe electrode, and an electric field sensor is used to detect a signal that is electrically changed by a non-contact measurement method to inspect the pattern electrode for disconnection and short circuit. The present invention relates to an applied chip scale package substrate for disconnection and short circuit detection and an inspection apparatus thereof.

In general, in order to detect disconnection or short circuit of a flat panel display device such as an LCD or a PDP, a current is applied at one end of each pattern electrode and a voltage is measured at the opposite end of the corresponding pattern electrode to inspect the disconnection and short circuit of the pattern electrode, The disconnection and the short circuit were detected by conducting wire tracking by a microscope or the like.

Therefore, at least two probe probes are required to measure disconnection and short circuit of one pattern electrode and check the presence / absence of the pattern electrode. Therefore, a large number of probe probes are required, which causes cost increase. If the length of the pattern electrode is long, there is a problem in that a lot of time and manpower is wasted as two or more measurers are needed to measure at different positions.

In addition, in the case of using a touch probe, the contact probe may not be contacted as the probe is pressed or contacted with the pattern electrode, and scratches may occur on the pattern electrode to be measured, thereby causing another defect. have.

On the other hand, in the case of a multilayer substrate in which two or more layers are stacked, a ground layer is designed on an inner layer, as shown in FIG. 1, and a ground plane (GP) is formed on a front surface of the ground layer, Correspondingly, the epoxy resin exposed portion 2 and through holes 3 TH are formed. That is, the epoxy resin exposed portion 2 is formed at a position corresponding to the pattern, the through hole 3 is formed through the drilling process, and the through hole plating connection layer 4 is formed inside the through hole through the plating process. Is formed. The through-hole plating connection layer 4 is formed in the center of the epoxy resin exposed portion 2, as shown in FIG. 2A, and has a sufficient gap 5: clearance to prevent short-circuit with the ground plane 1 of the inner layer. It should be formed in a maintained state.

However, if the drill is pulled in the process of forming the through-hole in the drilling process, as shown in the left or right of Fig. 2b, it can be biased toward one side of the epoxy resin exposed portion (2), in this case As shown in the right side of FIG. 2B, when a severely deviated from either side, a short circuit defect occurs between the through hole plating connecting layer 4 and the ground plane 1 of the inner layer.

Meanwhile, in the case of the chip scale package as shown in FIG. 3, since the plating lines are connected to the outer bus lines 6, the nets are all connected to the plating lines, so that short and disconnection defect inspections are performed. The electrical inspection itself is not possible, so in the case of such a chip-scale package, there was a limit in that short circuit and disconnection detection were impossible by the electrical inspection method.

Accordingly, a first object of the present invention for solving the above problems is to supply a voltage through at least one probe electrode on one side of the substrate, and to use a non-contact measurement method using an electric field sensor on the pattern electrode on the other side of the substrate. The present invention provides a disconnection and short circuit inspection apparatus using a non-contact inspection method that detects an electrically changing signal and inspects whether the corresponding pattern electrode is disconnected or shorted.

In addition, a second object of the present invention is to prepare a substrate by inserting a test coupon on the outside of the strip, using the test coupon to supply a voltage to one side of the substrate through one or more probe electrodes, the other side of the substrate Chip scale package for disconnection and short circuit detection using a non-contact inspection method that detects a signal that is electrically changed by a non-contact measurement method using an electric field sensor on the pattern electrode of the circuit and inspects whether the corresponding pattern electrode is disconnected or shorted. scale package) to provide a substrate and its inspection apparatus.

In order to achieve the first object, the present invention, in the device for inspecting the disconnection and short circuit of each pattern while scanning a plurality of pattern electrodes formed on the panel, applying a voltage to the pattern electrode on one side of the substrate The electrical change value generated on the opposite side of the pattern electrode by the probe electrode, the power supply part supplying power to the probe electrode, and the voltage applied from the probe electrode is measured in a non-contact manner, and the electrical change value is used to check whether there is a short circuit or disconnection. Provided is a disconnection and short circuit inspection apparatus using a non-contact inspection method including a non-contact inspection unit to determine.

In order to achieve the second object, the present invention, by inserting one or more test coupons capable of electrically connecting the probe electrode and the through-hole plating connecting layer to the outer edge of the substrate, disconnection to one side of the substrate through each test coupon And short-circuit detection chip scale package substrates for applying the short-circuit inspection voltage and measuring the electrical change generated on the other side of the substrate to check for disconnection and short-circuit of the pattern electrode. To provide.

In addition, to achieve the second object of the present invention, in the apparatus for inspecting the disconnection and short circuit of the pattern while scanning a plurality of electrodes formed on the substrate, at least one test coupon for short circuit and disconnection inspection on the outer edge of the strip The chip scale package substrate manufactured by inserting the chip and the test coupon of the chip scale package substrate are supplied with voltage to one side of the substrate, and the electrical change generated from the other side of the substrate is measured by a non-contact measurement method. The present invention provides a chip scale package substrate inspection apparatus for detecting disconnection and short circuit to which a non-contact inspection method is applied, including a non-contact inspection unit for inspecting whether a pattern is disconnected or shorted.

In each embodiment of the present invention, the non-contact inspection unit may include an electric field sensor and a non-contact electric field sensor for measuring an electric change value generated at an opposite surface of the pattern electrode by a voltage applied from the probe electrode, and an electric change measured at the electric field sensor. The signal processor may be configured to determine whether the pattern electrode has a short circuit or a disconnection.

In addition, in each embodiment of the present invention, the test coupon may be inserted into a dummy region outside the strip of the substrate, and may be inserted into a top layer, a bottom layer, and one or more inner layers, respectively.

In addition, in each embodiment of the present invention, the test coupon is formed by extending from one side of the probe electrode contact portion and the probe electrode contact portion providing an area for electrical contact with the probe electrode for supplying voltage for disconnection and short circuit inspection. And a plated connection layer connection portion providing an area for electrical connection with the through hole plated connection layer, extending from one side of the probe electrode contact portion, and being electrically contacted with the circuit pattern of the inner layer. It may further include a plating connection line.

According to the present invention, the disconnection and the short circuit of the pattern electrode of the general substrate and the pattern electrode of the chip scale package substrate can be easily checked by measuring the electrical change value through the non-contact probe electrode to determine the disconnection and the short circuit of the pattern electrode. There is an advantage to this.

The terms or words used in this specification and claims are not to be construed as limiting in their usual or dictionary meanings, and the inventors may properly define the concept of terms in order to best explain their invention in the best way possible. It should be interpreted as meaning and concept corresponding to the technical idea of the present invention.

Hereinafter, an inspection apparatus for chip scale substrates for detecting disconnection and short circuit to which a non-contact inspection method including a non-contact inspection unit according to the present invention is applied will be described with reference to the accompanying drawings. In the drawings, the size and shape of the components, etc. may be exaggerated or simplified to aid in understanding the invention.

4 is a block diagram of a disconnection and short circuit inspection apparatus to which a non-contact inspection method including a non-contact inspection unit according to the present invention is applied. As shown in the drawings, a disconnection and short circuit inspection apparatus using a non-contact inspection method including a non-contact inspection unit according to an embodiment of the present invention includes a probe electrode 10, a power supply unit 20, and a non-contact inspection unit 30. It is configured by.

The probe electrode 10 is an electrode that applies a voltage to the pattern electrode 12 existing on one side of the substrate 11.

The power supply unit 20 is a power circuit unit for supplying power to the probe electrode.

The non-contact inspection unit 30 measures the electrical change value generated on the opposite side of the pattern electrode by the voltage applied from the probe electrode in a non-contact manner, and determines whether the short circuit and disconnection are the electrical change value. The non-contact inspection unit 30 is composed of an electric field sensor 31 and the signal processor 32.

The electric field sensor 31 measures the electrical change value generated on the opposite side of the pattern electrode by the voltage applied from the probe electrode, and transmits the electrical change value to the signal processor.

The signal processor 32 determines whether the pattern electrode is shorted or disconnected based on the electrical change value measured by the electric field sensor.

Referring to the inspection process in the non-contact disconnection and short circuit inspection apparatus according to the present invention configured as described above are as follows.

First, when a voltage is applied from the power supply unit 20 to the pattern electrode 12 existing on one surface of the substrate 11 through the probe electrode 10, the voltage is applied from the outside through the probe electrode 10. As a result, an electrical change occurs on the opposite side of the pattern electrode 12 depending on whether the pattern electrode is disconnected or short-circuited.

Accordingly, the non-contact inspection unit 30 can measure the changed value through the electric field sensor 31 on the opposite side of the pattern electrode 12 in a non-contact manner, and the detected electric change value is measured by the signal processor 32. By transmitting to the substrate, it is possible to determine whether a short circuit or a disconnection of the pattern electrode 12 on the substrate 11.

FIG. 5 is a schematic diagram illustrating a chip scale package (CSP) substrate for disconnection and short circuit detection using the non-contact inspection method according to the present invention. The left side of FIG. 5 shows that the photosolder resist 100A is formed on the top layer 101 of the substrate. FIG. 5 is a view illustrating an applied state, and a right view of FIG. 5 illustrates a state in which a photosolder resist 100B is applied to a lowermost layer 103 of a substrate.

As shown in the figure, the CSP substrate according to the present invention includes one or more test coupons 50 that can electrically and simultaneously connect the probe electrode 10 and the through hole plating connection layer 4 to the outside of the strip 100C of the substrate. By inserting, through each test coupon to supply a voltage for disconnection and short-circuit inspection to one side of the substrate and to measure the electrical change value generated on the other side of the substrate configured to inspect the disconnection and short circuit of the pattern electrode do. Here, each of the photosolder resists 100A and 100B forms a coupon opening 110 at a corresponding position to expose the test coupon to the outside when a voltage is applied through the probe electrode. The test coupon, as one embodiment 50, is composed of a probe electrode contact 51 and a plating connection layer connection 52 as shown in FIG.

FIG. 6 is a detailed view illustrating test coupons and circuit patterns inserted into respective layers of a substrate, and FIG. 7 illustrates a state in which test coupons 50, 50A, and 50B are inserted into a CSP substrate according to the present invention. 8 is an exploded perspective view illustrating the test coupon 50 inserted into the uppermost layer and the test coupon 50A inserted into the lowermost layer and the inner layer. It consists of a test coupon 50B. Each of these test coupons 50, 50A, 50B is preferably inserted into a dummy region outside the strip 100C of the substrate.

In addition, the test coupon 50 inserted into the uppermost layer may be composed of the probe electrode contact portion 51 and the plating connection layer connecting portion 52, as shown in Figure 8 (a), the test coupon 50B is inserted into the inner layer ) Is formed by forming one or more plating connecting layer through-holes as shown in (b) and (c) of FIG. 8, and the test coupon 50A inserted in the lowermost layer is shown in (d) of FIG. The probe electrode contact part 51, the plating connection layer connection part 52, and the plating connection line 53 are formed.

The probe electrode contact portion 51 provides an area for electrical contact with the probe electrode for supplying voltages for disconnection and short circuit inspection.

The plating connection layer connection portion 52 is formed to extend from one side of the probe electrode contact portion, and provides a region for electrical connection with the through hole plating connection layer.

The plating connection line 53 extends from one side of the probe electrode contact portion 51 so as to be in electrical contact with the circuit pattern as shown in FIGS. 6 and 7.

One or more plating connection layer through holes are formed in the test coupon 50B inserted into the inner layer.

9 is a schematic diagram of a chip scale package substrate inspection device for detecting disconnection and short circuit to which a non-contact inspection method according to the present invention is applied, and a probe electrode 10, a power supply unit 20, a CSP substrate 100 into which a test coupon is inserted, And a non-contact inspection unit 30.

The CSP substrate is made by inserting one or more test coupons for short and disconnection inspection on the outside of the strip as already described in FIGS. 5 to 8.

The non-contact inspection unit 30 is also configured as described above, the voltage is supplied to one side of the substrate through the test coupon of the CSP substrate 100 and the electrical change value generated on the other side of the substrate is measured by a non-contact measurement method. By doing so, it is possible to inspect the disconnection and short circuit of the pattern inside the substrate.

The inspection process in the non-contact type disconnection and short circuit detection chip scale package (CSP) substrate and its inspection apparatus according to the present invention configured as described above are as follows.

First, at least one test coupon (top layer: 50, bottom layer: 50A, inner layer: outside the strip 100C of the CSP substrate for non-contact disconnection and short circuit detection according to the present invention is shown in Figs. 50B) are respectively inserted and constituted. At this time, the photosolder resists 100A and 100B are coated on the uppermost layer and the lowermost layer of the CSP substrate, and each of the photosolder resists has a coupon opening 110 for exposing the test coupon to the outside.

When voltage is applied to the lowermost test coupon 50A through the coupon opening 110 from the external probe electrode 10, the through-hole plating connection layer 4, the inner test coupon 50B, and the uppermost test coupon At 50, electrical connection is possible at the same time.

When the voltage for disconnection and short circuit inspection is supplied to one side of the substrate through the lowermost test coupon 50A to check for disconnection or short circuit, the test coupon 50B for the inner layer depends on whether the pattern electrode is disconnected or short circuited. Through this, an electrical change occurs in the uppermost layer, which is the other side of the substrate, depending on whether the pattern electrode is disconnected or shorted.

Accordingly, the non-contact inspection unit 30 can measure the changed value in a non-contact manner through the electric field sensor 31 on the opposite side of the pattern electrode, and transmit the detected electric change value to the signal processor 32. By zooming in, it is possible to easily determine whether the pattern electrode of the CSP substrate is shorted or disconnected.

The present invention is a signal method through the electric field to improve the problems caused by the impossibility of contact and damage to the surface as a complement to the existing disadvantages for the detection of the inspection method, since the detection principle is made in a non-contact method, Electrical inspection of the product without expensive expensive jig used will be available as a useful method.

As described above, preferred embodiments of the present invention have been described, but the present invention is not limited to the above-described embodiments, and the present invention is not limited to the scope of the present invention as claimed in the following claims. Anyone with knowledge of the present invention will have the methodology of the present invention to the extent that various modifications can be made.

1 to 3 is a reference diagram illustrating a conventional inspection method.

4 is a block diagram of a disconnection and short circuit inspection apparatus to which a non-contact inspection method including a non-contact inspection unit according to the present invention is applied.

5 is a schematic diagram illustrating a chip scale package (CSP) substrate for disconnection and short circuit detection to which a non-contact inspection method according to the present invention is applied.

6 is a detailed diagram illustrating an example of a circuit pattern inserted into each layer of a substrate.

7 is an exploded perspective view illustrating a test coupon insertion state of another form inserted into a CSP substrate according to the present invention.

8 is a detailed view illustrating an example of a test coupon inserted into each layer of a substrate.

9 is a schematic diagram of a chip scale package substrate inspection apparatus for detecting disconnection and short circuit to which the non-contact inspection method according to the present invention is applied.

<Explanation of symbols for main parts of the drawings>

1: ground plane (GP) 2: epoxy resin exposed portion

3: through-hole (TH) 4: through-hole plating connection layer

10: probe electrode 11: substrate

12 pattern electrode 20 feeding part

30: non-contact inspection unit 31: electric field sensor

32: signal processing unit 50,50A, 50B: test coupon

51: probe electrode contact 52: plating connection layer connection

53: plating connection line 100A, 100B: photo solder resist

100C: strip 101: top layer

102: inner layer 103: lowest layer

110: coupon opening

Claims (13)

delete delete Insert one or more test coupons capable of simultaneously connecting the probe electrode and through-hole plating connection to the outside of the strip of the substrate, through which the test coupons supply voltage for disconnection and short-circuit inspection to one side of the substrate and the other side of the substrate. A chip scale package substrate for detecting disconnection and short circuit using a non-contact inspection method, which is configured to inspect whether a pattern electrode is disconnected or shorted by measuring an electrical change generated in a plane. The method of claim 3, wherein the test coupon, A chip scale package substrate for detecting disconnection and short circuit using a non-contact inspection method, which is inserted into a dummy region outside a strip of a substrate. The method of claim 3, wherein the test coupon, A chip scale package substrate for disconnection and short circuit detection using a non-contact inspection method, each of which is inserted into an uppermost layer, a lowermost layer, and one or more inner layers. The method of claim 3, wherein the test coupon, A probe electrode contact portion providing an area for electrical contact with a probe electrode for supplying voltages for disconnection and short circuit inspection; And a plating connection layer connection part formed extending from one side of the probe electrode contact part and providing a region for electrical connection with the through hole plating connection layer. Chip scale package substrate for short circuit detection. The method of claim 6, wherein the test coupon, A chip scale package substrate for detecting disconnection and short circuit to which the non-contact inspection method is applied, further comprising: a plating connection line extending from one side of the probe electrode contact portion and electrically contacting the circuit pattern of the inner layer. . An apparatus for inspecting disconnection and short circuit of a pattern while scanning a plurality of electrodes formed on a substrate, A chip scale package substrate manufactured by inserting one or more test coupons for inspecting short circuits and short circuits on the outer edge of the strip; Supplying voltage to one side of the substrate through a test coupon of the chip scale package substrate and measuring the electrical change generated from the other side of the substrate by a non-contact measurement method to check for disconnection and short circuit of the pattern inside the substrate. Chip scale package substrate inspection apparatus for detecting disconnection and short circuit using a non-contact inspection method, characterized in that it comprises a non-contact inspection unit. The method of claim 8, wherein the non-contact inspection unit, An electric field sensor for measuring, in a non-contact manner, an electrical change value generated at an opposite surface of the pattern electrode by a voltage applied from the probe electrode; A signal processor to determine whether the pattern electrode is shorted or disconnected based on an electrical change value measured by the electric field sensor; Chip scale package substrate inspection apparatus for detecting disconnection and short circuit applying a non-contact inspection method, characterized in that consisting of. The method of claim 8, wherein the test coupon, Chip scale package substrate inspection apparatus for detecting disconnection and short circuit using a non-contact inspection method, characterized in that inserted into the dummy region of the outer strip of the substrate. The method of claim 8, wherein the test coupon, A chip scale package substrate inspection device for detecting disconnection and short circuit using a non-contact inspection method, which is inserted into an uppermost layer, a lowermost layer, and one or more inner layers, respectively. The method of claim 8, wherein the test coupon, A probe electrode contact portion providing an area for electrical contact with a probe electrode for supplying voltages for disconnection and short circuit inspection; And a plating connection layer connection part formed extending from one side of the probe electrode contact part and providing a region for electrical connection with the through hole plating connection layer. Chip scale package board inspection device for short circuit detection. The method of claim 12, wherein the test coupon, A chip scale package substrate for detecting disconnection and short circuit to which the non-contact inspection method is applied, further comprising: a plating connection line extending from one side of the probe electrode contact portion and electrically contacting the circuit pattern of the inner layer. Inspection device.

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