JP2003280028A - Optoelectronic device and electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent the glass of a liquid crystal display device from being broken. <P>SOLUTION: The liquid crystal display device 100 has liquid crystal charged between an array glass substrate 1 and a glass substrate 2 sealed with a sealing material 3. The glass substrate 2 is nearly as large as the array glass substrate 1 and has an opening 8 for a driver IC 4 formed opposite the mount position of the driver IC 4. While the array glass substrate 1 and glass substrate 2 are put one over the other, the driver IC 4 is exposed in the opening 8. This configuration nearly eliminates a position where stress converges on edges of the glass substrates 1 and 2, so the glass substrates 1 and 2 can effectively be from being broken. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electro-optical device and an electronic device which are used in an electronic device such as a mobile phone and in which glass breakage hardly occurs even when an impact is applied.

[0002]

2. Description of the Related Art FIG. 11 is a perspective view showing an example of a conventional liquid crystal display device. FIG. 12 is a plan view of the liquid crystal display device shown in FIG. The liquid crystal display device 500 has a pixel IT
TFT (Thin Film Transi) for each O (Indium Tin Oxide)
stor) and MIM (Metal Insulator Metal) active elements are formed on the array glass substrate 501 and the common electrode is formed on the glass substrate 502.
This is a structure in which the liquid crystal is sealed by. The edge of the TFT array glass substrate 501 is the COG (Ch
ip On Glass) mounting area 504, and an input terminal 505 is formed on the edge thereof.

In the IC mounting area 504 of the array glass substrate 501, a wiring pattern 506 made of an ITO film is formed. A polarization plate (not shown) is spread on the array glass substrate 501 and the glass substrate 502. As the material of the glass substrates 501 and 502, heat resistant non-alkali glass containing no ion source is used. If necessary, the glass substrates 501 and 502 are heat-treated or a blocking layer is formed.

[0004]

Recently, when a liquid crystal display device is frequently used in portable electronic equipment such as a mobile phone and a notebook computer, the portable electronic equipment may drop during use by the user or may be used in the portable electronic equipment. When a load is applied, the glass substrates 501 and 502 of the liquid crystal display device 500
There is a problem that glass breakage occurs. In particular, C
IC mounting area 504 compared to OF (Chip On Film) method
In the COG type liquid crystal display device 500 in which the
2, the array glass substrate 5 on the side edge of the glass substrate
In many cases, stress concentration occurs in a portion P which is a boundary between 01 and the glass substrate 502, and a glass break C is generated from the portion P.

Therefore, the present invention has been made in view of the above, and an object thereof is to provide an electro-optical device and an electronic apparatus which can effectively prevent the occurrence of glass breakage.

[0006]

In order to achieve the above-mentioned object, an electro-optical device according to the present invention has a structure in which two glass substrates of approximately the same size are superposed, and a mounting area of one glass substrate. A semiconductor element is mounted on the glass substrate, and an opening into which the mounted semiconductor element enters when the other glass substrate is superposed on the glass substrate is provided in the other glass substrate.

Since the semiconductor element is inserted into the opening of the other glass substrate, both glass substrates can be closely adhered and overlapped. As a result, the thickness of the glass substrate of the electro-optical device becomes substantially uniform over the entire circumference, and there is no portion where the mechanical strength changes abruptly. As a result, there is no portion where stress is concentrated due to an impact such as a drop, so that glass breakage can be effectively prevented. Note that the semiconductor element is typically a driver IC, but is not limited to this.

The electro-optical device according to the next invention is characterized in that, in the above structure, the opening is further covered with a light shielding sheet.

By covering the opening with the light shielding sheet, it is possible to prevent external light from reaching the semiconductor element, particularly the driver IC. Thereby, malfunction of the semiconductor element can be prevented. As the light shielding sheet, a sheet having a color such as black that absorbs light, or a sheet whose surface serves as a reflecting surface and reflects light can be used.

An electro-optical device according to the next invention is characterized in that, in the above structure, at least a gap between the opening and the semiconductor element is filled with a molding material.

By filling the mold material between the opening and the semiconductor element, it is possible to prevent ionic impurities and water from entering the mounting region of the glass substrate. As a result, it is possible to prevent electrolytic corrosion of the wiring pattern and the like formed in the mounting region due to the ionic substance. Not only the gap between the opening and the semiconductor element but also the semiconductor element may be buried by filling the opening with a molding material.

The electro-optical device according to the next invention is characterized in that, in the above structure, the molding material has a light-shielding property.

By filling the opening with the light-shielding mold, the external light hardly reaches the semiconductor element in the filled portion. As a result, the light incident on the semiconductor element is reduced, so that malfunction of the semiconductor element can be suppressed.

The electro-optical device according to the next invention is characterized in that, in the above structure, a light-shielding layer is further formed between the glass substrates and in a mounting region of the semiconductor element.

By providing the light-shielding layer between the glass substrates, it is possible to block the progress of light in the glass substrate and shield the light incident from the outside. As a result, malfunction of the semiconductor element due to light can be prevented. The light-shielding layer can be formed, for example, by sandwiching a light-shielding sealing material or sheet-shaped material between glass substrates.

The electro-optical device according to the next invention is characterized in that, in the above structure, the light shielding layer is composed of a sealing material.

By forming the light shielding layer with the sealing material,
It is possible to prevent ionic impurities and water from entering the wiring pattern in the mounting area from the outside. This can prevent electrolytic corrosion of the wiring pattern in the mounting area.

The electro-optical device according to the next invention is characterized in that, in the above structure, one glass substrate is further provided with an input terminal, and the other glass substrate has an input terminal opening into which the input terminal is inserted.

The input terminal is exposed from the input terminal opening and is connected to an external circuit board by FPC or the like. The connection is made by, for example, ACF.

The electro-optical device according to the next invention is characterized in that, in the above-mentioned structure, the input terminal opening and the opening are common openings and are opened at the edge side of the glass substrate.

That is, the common opening has a shape cut out from the edge of the glass substrate, and the shape is easy to process. Moreover, since it has a simple shape, it is less likely to be damaged.

In the electro-optical device according to the next invention, two glass substrates are superposed, one glass substrate is provided with a mounting area for a semiconductor element, and the semiconductor element is mounted in this mounting area. It is characterized in that an auxiliary glass substrate having the same size and having an opening into which a semiconductor element enters is superposed on the mounting region.

By superimposing the auxiliary glass substrate on the mounting region, the thickness of the glass substrate of the electro-optical device becomes substantially uniform over the entire circumference. For this reason, stress concentration is less likely to occur due to impact such as dropping, and thus glass breakage can be suppressed. A light-shielding sheet similar to the above may be provided in this opening, or preferably a light-shielding molding material may be filled. Further, the auxiliary glass substrate may be formed with an input terminal opening into which the input terminal is inserted.

An electro-optical device according to the next invention is characterized in that, in the above structure, chamfers are further provided at the corners of the auxiliary glass substrate and the glass substrate on the same surface as the auxiliary glass substrate, which face each other. .

Since the auxiliary glass substrate is not integrated with the glass substrate, the mechanical strength may change at these joints and stress concentration may occur. It is possible to prevent a sudden change in mechanical strength at a portion where the glass substrate and the glass substrate face each other. From this viewpoint, it is preferable that chamfering is as large as possible.

An electronic apparatus according to the next invention is characterized by using the electro-optical device as a display device.

[0027]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described below in detail with reference to the drawings. The present invention is not limited to this embodiment. Further, the constituent elements of this embodiment include those that can be easily replaced by those skilled in the art, or those that are substantially the same.

(Embodiment 1) FIG. 1 is an assembly view showing a liquid crystal display device according to Embodiment 1 of the present invention. Figure 2
1 is a plan view of the liquid crystal display device shown in FIG. 1, and FIG.
3 is a cross-sectional view of the liquid crystal display device shown in FIG. The liquid crystal display device 100 has a structure in which liquid crystal is sealed by a sealing material 3 between an array glass substrate 1 on which active elements of TFT and MIM are formed for each pixel ITO and a glass substrate 2 on which a common electrode is formed. . The sealing material 3 is applied with an adhesive such as an epoxy resin by screen printing or a dispenser. The end of the array glass substrate 1 has a driver IC 4
The COG mounting area 5 is formed, and the input terminal 6 is formed on the edge thereof. A wiring pattern 7 made of an ITO film is formed in the mounting area 5 of the array glass substrate 1.

On the other hand, the glass substrate 2 has substantially the same size as the array glass substrate 1, and an opening 8 of the driver IC 4 is formed at a position facing the mounting position of the driver IC 4. Further, a terminal opening 9 for exposing the input terminal 6 is provided at a position facing the input terminal 6. The cutting process of the glass substrate 2 is performed, for example, in Japanese Examined Patent Publication 3-
The known laser break method disclosed in Japanese Patent No. 13040, Japanese Patent Publication No. 6-69680, etc. is used. Specifically, a cutting line is attached to the glass substrate 2 with a hard tool, and the vicinity of this cutting line is locally heated to perform a desired cutting.

With the array glass substrate 1 and the glass substrate 2 superposed on each other, the driver IC 4 enters the opening 8 and is exposed from the opening 8, and similarly, the input terminal 6 is exposed from the terminal opening 9. The terminal opening 9 has an FPC for connecting with a circuit board on which a signal control circuit, a power supply circuit, etc. are formed.
(Flexible Printed Circuit) is ACF (AnisotropicC)
onductive film) (not shown). Polarizing plates 10 and 11 are spread on the array glass substrate 1 and the glass substrate 2 as shown in FIG.

Although the driver IC 4 is exposed from the opening 8, it is preferable to fill the gap between the driver IC 4 and the opening 8 with the molding material 12 as shown in FIG.
By sealing the gap between the driver IC 4 and the opening 8 with the molding material 12, it is possible to prevent ionic impurities and water from entering from the outside. On the other hand, in the above-described conventional liquid crystal display device 500, the driver IC 503 and the wiring pattern 506 are exposed, so that the wiring pattern 506 is concerned.
However, the electrolytic corrosion of the wiring pattern 7 can be effectively prevented by preventing the infiltration of water and impurities by the molding material 12 as in the above configuration.

Furthermore, it is preferable that the molding material 12 has a color such as black having a high light-shielding property. Driver I
If light enters the active surface of C4, the driver IC 4 may malfunction. Therefore, the side surface of the driver IC 4 is sealed with the light-shielding molding material 12, and the driver I
By blocking the light entering from the side of C4, the driver I
The malfunction of C4 can be suppressed. Alternatively, the driver IC 4 may be embedded by filling the opening 8 with the molding material 12. By embedding the driver IC 4 in it, the waterproof property and the light blocking property can be further enhanced.

Next, in order to prevent malfunction due to light from the driver IC 4, a light shielding tape 13 may be attached to the upper surface of the opening 8 as shown in FIG. As the light-shielding tape 13, it is preferable to use a light-shielding tape having a color such as black, which has a light-shielding property. Further, the array glass substrate 1
It is preferable that the light-shielding tape 14 is attached to the back surface of the driver mounting surface. By blocking light with the light blocking tapes 13 and 14, light can be prevented from entering the driver IC 4, and malfunction of the driver IC 4 can be prevented. Further, since the light shielding tape 13 can prevent water and ionic impurities from entering the opening 8, electrolytic corrosion of the wiring pattern 7 and the like can be effectively prevented. In that case, if the light shielding tape 13 is made water repellent, the waterproof effect is further improved.

The light-shielding tape 13 may be made of a unidirectionally permeable material having a function of releasing moisture inside. For the unidirectionally permeable material, for example, GORE-TEX membrane used for GORE-TEX (registered trademark of Gore-tex) is suitable. GORE-TEX membrane is polytetrafluoroethylene (PT
FE) is specially stretched to form about 1.4 billion fine holes per square centimeter (pore diameter 0.05 μm to 100 μm, preferably about 0.2 μm). These micropores are 5,000 of water droplets in which water molecules are collected.
Since it is 1 / 20,000, it does not transmit water droplets,
Larger than water vapor molecule (about 700 times water vapor molecule)
Therefore, water vapor and gas can be transmitted.

In the above liquid crystal display device 100, by reducing the portion of the single glass substrate 2 as much as possible,
A portion where the stress is concentrated (a portion where the mechanical strength changes abruptly) is not generated at the side edge of the glass substrate 2. That is, in the conventional liquid crystal display device 500, the glass substrate 502 is smaller than the array glass substrate 501, and therefore a boundary P where stress concentrates is generated on the side edge of the glass substrate. Since the glass substrate 2 and the glass substrate 2 have substantially the same size and shape, there is almost no site where stress is concentrated on the side edges of the glass substrates 1 and 2. Therefore, glass breakage of the glass substrates 1 and 2 can be effectively prevented. It should be noted that the above-mentioned terminal opening 9 has almost no problem because its cutout area is small.

Further, the ITO formed in the IC mounting region 5
Since the wiring pattern 7 is covered with the glass substrate 2, it becomes difficult for impurities and moisture to come into contact with the wiring pattern 7, and electrolytic corrosion of the wiring pattern 7 is suppressed. Particularly, if the molding material 12 and the light shielding tape 13 are used as described above, the electrolytic corrosion of the wiring pattern 7 can be further effectively prevented.

FIG. 6 is a partial plan view showing a modification of the liquid crystal display device shown in FIG. As shown in the figure, not only the liquid crystal sealing area but also the periphery of the IC mounting area 5 may be sealed with a sealing material. The sealing material 21 around the IC mounting area 5 may be the same as that for sealing the liquid crystal, or may have a light-shielding color such as black. By sealing the periphery of the IC mounting area 5 with the sealing material 21, it is possible to prevent moisture and ionic impurities from entering the area where the wiring pattern 7 is provided. Further, by using the color sealing material 21 having a light blocking property, it is possible to block the light entering from the side surface and suppress the malfunction of the driver IC 4.

FIG. 7 is a partial plan view showing another modification of the liquid crystal display device shown in FIG. In this liquid crystal display device, the sealing material 22 is applied to the area where the wiring pattern 7 is provided by screen printing, a sealing layer is formed between the array glass substrate 1 and the glass substrate 2, and the wiring pattern 7 is sealed. With such a configuration, ionic impurities and water do not enter the wiring pattern 7, so that electrolytic corrosion of the wiring pattern 7 can be reliably prevented. Further, similarly to the above, by making the sealing material 22 a light-shielding color such as black, it is possible to reduce light entering from the periphery of the driver IC 4 and prevent malfunction of the driver IC 4. In particular, by forming the light-shielding sealing material 22 in a planar shape, the light transmitted through the glass substrate 2 can be effectively captured, so that the light-shielding property becomes high.

Further, in the above embodiment, the driver IC
Although the openings 8 of 4 and the terminal openings 9 of the input terminals 6 were formed separately, as shown in FIG.
It is also possible to use a relatively large escape terminal opening 23 that also serves as. Since the cutout shape is simplified by using the glass substrate in this way, the glass substrate 2 can be easily processed. Moreover, since it has a simple shape, it is not easily damaged. Note that, similarly to the above, the gap between the escape terminal opening 23 and the driver IC 4 may be filled with a molding material to prevent ionic impurities and moisture from entering the wiring pattern 7 (not shown). In that case, it is preferable to take measures such as forming a weir during filling so that the molding material does not cover the input terminal 6.

Further, similarly to the above, a light shielding tape may be attached to the upper surface of the escape terminal opening 23 (not shown). As a result, it is possible to prevent light from entering the active surface of the driver IC 4 and prevent malfunction of the driver IC 4. Further, the periphery or almost the entire area of the wiring pattern 7 may be sealed with a sealing material (not shown). By doing so, it is possible to prevent ionic impurities and water from entering the wiring pattern 7 and prevent electrolytic corrosion of the wiring pattern 7.

(Second Embodiment) FIG. 9 is a plan view showing a liquid crystal display device according to a second embodiment of the present invention. In the liquid crystal display device 200, the liquid crystal is sealed between the array glass substrate 201 and the glass substrate 202 by the sealing material 203, and further, the IC mounting area 2 of the array glass substrate 201.
Auxiliary glass substrate 205 having substantially the same shape and size as 04
Is further provided. The auxiliary glass substrate 205 has an opening 207 for the driver IC 206 and a terminal opening 209 for the input terminal 208. Auxiliary glass substrate 20
The processing of No. 5 is preferably performed by the laser break method as in the first embodiment.

The auxiliary glass substrate 205 seals the sealing material 210 to the IC mounting area 204 of the array glass substrate 201.
Are glued by. The sealing material 210 is provided around the area where the wiring pattern 211 is provided. A sealing material may be screen-printed on the entire surface of the area where the wiring pattern 211 is provided, so that the auxiliary glass substrate 205 is bonded and the wiring pattern 211 is sealed. Furthermore,
At the corners of the auxiliary glass substrate 205 and the glass substrate 202, R chamfers 212 having a relatively large radius,
213 has been applied. Since the R chamfers 212 and 213 are provided in the region P where the array glass substrate 501 and the glass substrate 502 do not overlap each other, which is a region where stress concentration easily occurs in the related art, the mechanical strength does not suddenly change. . From this viewpoint, the R chamfer 212,
The same effect can be obtained by chamfering C instead of 213.

Liquid crystal display device 20 according to the second embodiment
In the case of 0, by providing the auxiliary glass substrate 205, the thickness of the glass substrates 201 and 202 is balanced over the entire circumference, and the portion formed of one glass substrate can be minimized. Further, the stress tends to be concentrated on the portion P where the array glass substrate 201 and the glass substrate 202 are not overlapped, but by applying the R chamfers 212 and 213, the stress concentration is relaxed and the glass breakage is further prevented. I have to.

The gap between the opening 207 and the driver IC 206 may be sealed with a molding material as in the first embodiment. Further, a light shielding tape may be attached on the opening 207.

(Embodiment 3) FIG. 10 is a perspective view showing a portable telephone which is an electronic apparatus according to Embodiment 3 of the present invention. This mobile phone 2000 includes operation buttons 2
001 is provided with a main body 2002 having a built-in microphone,
Display unit 2 with display screen, antenna, and speaker
002, and the main body portion 2001 and the display portion 2002 are configured to be mutually foldable. Display unit 2002
The liquid crystal display device 100 is incorporated therein. Reference numeral 110 is a display unit. Since the mobile phone 2000 according to the third embodiment is configured by using the liquid crystal display device 100, the liquid crystal panel 100 is unlikely to be damaged even if an impact such as a drop is applied.

[0046]

As described above, the electro-optical device of the present invention has a structure in which two glass substrates having substantially the same size are stacked, and a semiconductor element is mounted in the mounting region of one glass substrate, Since the opening into which the mounted semiconductor element enters when the other glass substrate is superposed on the glass substrate is provided in the other glass substrate, glass breakage can be effectively prevented.

Further, in the electro-optical device of the present invention, since the opening is covered with the light shielding sheet, malfunction of the semiconductor element can be prevented.

Further, in the electro-optical device of the present invention, at least the gap between the opening and the semiconductor element is filled with the molding material, so that electrolytic corrosion in the mounting region can be prevented.

Further, in the electro-optical device of the present invention, since the molding material has a light shielding property, it is possible to prevent malfunction of the semiconductor element.

Further, in the electro-optical device of the present invention, since the light-shielding layer is formed between the glass substrates in the mounting area of the semiconductor element, malfunction of the semiconductor element can be prevented.

Further, in the electro-optical device of the present invention, since the light shielding layer is made of the sealing material, it is possible to prevent electrolytic corrosion of the wiring pattern in the mounting area.

Further, in the electro-optical device of the present invention, the input terminal is provided on one glass substrate, and the other glass substrate has the input terminal opening into which the input terminal is inserted, so that it can be normally connected to the external circuit board. .

Further, in the electro-optical device of the present invention, the input terminal opening and the opening become a common opening and are opened on the edge side of the glass substrate, so that the processing is easy and is not easily damaged.

Further, in the electro-optical device of the present invention, two glass substrates are superposed, one glass substrate is provided with a mounting area for a semiconductor element, and the semiconductor element is mounted in this mounting area. Since the auxiliary glass substrate having substantially the same size and having the opening into which the semiconductor element is inserted is superposed on the mounting region, it is possible to prevent the glass from breaking even when an impact is applied.

Further, in the electro-optical device according to the present invention, the auxiliary glass substrate and the glass substrate on the same surface as the auxiliary glass substrate are chamfered at the opposite corners, so that glass breakage can be effectively prevented.

[Brief description of drawings]

FIG. 1 is an assembly diagram showing a liquid crystal display device according to a first embodiment of the present invention.

FIG. 2 is a plan view of the liquid crystal display device shown in FIG.

3 is a cross-sectional view of the liquid crystal display device shown in FIG.

FIG. 4 is a partial cross-sectional view showing a modified example of the liquid crystal display device shown in FIG.

5 is a partial cross-sectional view showing a modified example of the liquid crystal display device shown in FIG.

6 is a partial plan view showing a modified example of the liquid crystal display device shown in FIG.

7 is a partial plan view showing another modification of the liquid crystal display device shown in FIG.

8 is a partial plan view showing another modification of the liquid crystal display device shown in FIG.

FIG. 9 is a plan view showing a liquid crystal display device according to Embodiment 2 of the present invention.

FIG. 10 is a perspective view showing a mobile phone which is an electronic device according to a third embodiment of the present invention.

FIG. 11 is a perspective view showing an example of a conventional liquid crystal display device.

12 is a plan view of the liquid crystal display device shown in FIG.

[Explanation of symbols]

100 liquid crystal display 1 Array glass substrate 2 glass substrates 3 sealant 4 driver IC 5 mounting area 6 input terminals 7 wiring pattern 8 openings 9 terminal opening

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Claims (11)

[Claims] 1. A structure in which two glass substrates having substantially the same size are stacked, and a semiconductor element is mounted in a mounting region of one glass substrate, and the other glass substrate is stacked on the glass substrate. An electro-optical device characterized in that an opening into which a mounted semiconductor element is inserted is provided in the other glass substrate. 2. The electro-optical device according to claim 1, further comprising a light shielding sheet covering the opening. 3. The electro-optical device according to claim 1, further comprising a molding material filled in at least a gap between the opening and the semiconductor element. 4. The electro-optical device according to claim 3, wherein the molding material has a light blocking property. 5. The electro-optical device according to claim 1, further comprising a light-shielding layer formed between the glass substrates in a semiconductor element mounting region. 6. The electro-optical device according to claim 5, wherein the light shielding layer is made of a sealing material. 7. The glass substrate according to claim 1, further comprising an input terminal provided on one glass substrate, and the other glass substrate having an input terminal opening into which the input terminal is inserted. Electro-optical device. 8. The electro-optical device according to claim 7, wherein the input terminal opening and the opening serve as a common opening, which is open on the edge side of the glass substrate. 9. Two glass substrates are overlapped with each other, a mounting area for a semiconductor element is provided on one glass substrate, and the semiconductor element is mounted on this mounting area. An electro-optical device characterized in that an auxiliary glass substrate having an opening into which an element enters is superposed on a mounting region. 10. The electro-optical device according to claim 9, wherein chamfers are provided at corners of the auxiliary glass substrate and the glass substrate on the same surface as the auxiliary glass substrate, which face each other. 11. An electronic apparatus using the electro-optical device according to any one of claims 1 to 10 as a display device.