JP2009053472A - Liquid crystal device and electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a liquid crystal device for forming a coating type conductive film in a specified range even when electrically connecting an electrode for connecting substrates to a shielding conductive film formed on the outside of a counter substrate with the coating type conductive film, and to provide an electronic apparatus comprising the liquid crystal device. <P>SOLUTION: In the liquid crystal device 100, both a pixel electrode and a common electrode are formed on the element substrate 10 side and, therefore, a light-transmissive shielding conductive film 25 is formed on the whole surface or substantially whole surface of the outside 20f of the counter substrate 20. The coating type conductive film 61 formed over the extended area 10s and a substrate edge 20c of the counter substrate 20, the electrode 106 for connecting substrates of the element substrate 10 is electrically connected to the shielding conductive film 25. A liquid-repellent treatment layer 28 which restricts a coating range on the polarizing plate 51 side of the coating type conductive film 61 between the polarizing plate 51 and the coating type conductive film 61 is formed on the outer surface 20f side of the counter substrate 20. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a liquid crystal device that drives a liquid crystal by a lateral electric field, and an electronic apparatus including the liquid crystal device.

  In recent years, a so-called fringe field switching (hereinafter referred to as FFS (Fring Field Switching)) system or in-plane switching (hereinafter referred to as IPS) is aimed at realizing a wide viewing angle of a liquid crystal device used in a mobile phone or a mobile computer. A liquid crystal device of a type that drives a liquid crystal by a lateral electric field, such as a method (called “In Plane Switching”), is being put into practical use.

  In this type of liquid crystal device, the pixel electrode and the common electrode for driving the liquid crystal are both formed on the element substrate side, and the common electrode is not formed on the counter substrate side. For this reason, since the counter substrate does not have a shielding function against the intrusion of static electricity from the outside, there is a problem that the alignment of the liquid crystal is disturbed by the static electricity and proper display cannot be performed.

Therefore, a configuration has been proposed in which a light-transmitting shielding conductive film is formed on the entire surface of the counter substrate opposite to the side where the liquid crystal is located, and the shielding conductive film is electrically connected to the outside. (See Patent Document 1).
Japanese Patent No. 2758864

  In electrically connecting the shielding conductive film formed on the outer surface of the counter substrate to the outside, for example, the configuration shown in FIGS. 9A and 9B can be employed. In the configuration shown in FIGS. 9A and 9B, the inter-substrate connection electrode 106 is formed in the projecting region 10 s projecting from the substrate edge 20 c of the counter substrate 20 in the element substrate 10, while the shield is formed on the outer surface of the counter substrate 20. The conductive film 25 is formed, the conductive paste 60 is applied across the overhanging region 10 s and the substrate edge 20 c of the counter substrate 20, and the inter-substrate connection electrode 106 and the shielding conductive film 25 are applied to the coated conductive film 61. Connect electrically. Note that the configurations shown in FIGS. 9A and 9B are not conventional techniques, but are reference examples configured by the inventor of the present application to clarify differences from the present invention.

  However, the configuration as shown in FIGS. 9A and 9B has the following problems. First, after the polarizing plate 51 is bonded to the counter substrate 20 with the adhesive 55, the conductive paste 60 may be applied to the position where it contacts the polarizing plate 51 when the coating type conductive film 61 is formed. In such a case, the polarizing plate 51 deteriorates due to the organic solvent contained in the conductive paste 60 and becomes cloudy, or the adhesive 55 that has joined the polarizing plate 51 is attacked to partially damage the polarizing plate 51. The problem of peeling off occurs. Such inconvenience is not preferable because the display light is partially prevented from being emitted.

  Even when the polarizing plate 51 is bonded to the counter substrate 20 after forming the coating type conductive film 61 and electrically connecting the inter-substrate connection electrode 106 and the shielding conductive film 25, the conductive paste 60 is used. However, the coating-type conductive film 61 protrudes between the counter substrate 20 and the polarizing plate 51. If such a situation occurs, it is not preferable because emission of display light is partially disturbed.

  Therefore, when the configuration shown in FIGS. 9A and 9B is adopted, the polarizing plate 51 has to be disposed at a position separated from the substrate edge 20c of the counter substrate 20 by a sufficient distance d0, for example, 1 mm or more. Therefore, there is a problem that a region that does not directly contribute to the display becomes wide.

  In view of the above problems, an object of the present invention is to electrically connect the inter-substrate connection electrode formed on the first substrate and the shielding conductive film formed on the outer surface of the counter substrate by a coating-type conductive film. However, it is an object to provide a liquid crystal device capable of forming a coating-type conductive film within a predetermined range, and an electronic apparatus including the liquid crystal device.

  In order to solve the above problems, in the present invention, a first substrate including a pixel electrode formed in each of a plurality of pixels, and a common electrode that forms an electric field between the pixel electrode, and the first substrate And a liquid crystal layer held between the second substrate and the first substrate. In the liquid crystal device, a substrate edge of the second substrate in the first substrate An inter-substrate connection electrode is formed in an overhang region projecting from the second substrate, and a translucent shielding conductive material is formed on the entire or substantially entire surface of the second substrate on the opposite side to the inner surface where the liquid crystal layer is located. A film is formed, and a polarizing plate is bonded to the outer surface side of the second substrate at a predetermined distance from the substrate edge so as to cover the shielding conductive film, and the overhang region of the first substrate and The base of the second substrate; A coating-type conductive film that electrically connects the inter-substrate connection electrode and the shielding conductive film is formed across an edge, and the polarizing plate and the coating-type conductive film are formed on the outer surface side of the second substrate. A liquid-repellent treatment layer that restricts the coating range of the coating-type conductive film on the polarizing plate side is formed between the coating-type conductive film and the coating-type conductive film.

  In the present invention, “a translucent shielding conductive film is formed on“ substantially the entire surface ”on the outer surface side of the second substrate” means that, for example, a shield is formed even if the shielding conductive film is not formed on the entire surface. In the configuration of the conductive film, the conductive film for shielding is formed in a lattice pattern, or the conductive film for shielding is formed in a region including at least the display region in the region where the conductive film for shielding is formed, This means that it only needs to have a shielding effect.

  In the present invention, when the shield conductive film is electrically connected to the outside, an inter-substrate connection electrode is formed in the extended region of the first substrate, and the conductive film is formed across the extended region and the substrate edge of the second substrate. A coating material such as a paste is applied to electrically connect the inter-substrate connection electrode and the shielding conductive film with a coating-type conductive film. Here, on the outer surface side of the second substrate, a liquid-repellent treatment layer is formed between the polarizing plate and the coating type conductive film to limit the coating range on the polarizing plate side of the coating type conductive film. The conductive film can be formed within a predetermined range. Therefore, when manufacturing a liquid crystal device, after forming a coating-type conductive film after bonding a polarizing plate to the second substrate, a coating material such as a conductive paste is applied to a position in contact with the polarizing plate. Therefore, the problem that the polarizing plate becomes clouded by the solvent contained in the coating material does not occur. Even when a polarizing plate is bonded to the second substrate after forming a coating-type conductive film and electrically connecting the inter-substrate connection electrode and the shielding conductive film, a coating material such as a conductive paste is used. Since the bonding region of the polarizing plate does not protrude, the coating type conductive film does not protrude between the second substrate and the polarizing plate. Therefore, it is possible to avoid a situation in which the emission of display light is partially hindered due to the protrusion of the coating-type conductive film. Therefore, the polarizing plate may be bonded to a position spaced a short distance from the substrate edge of the second substrate, so that a region that does not directly contribute to display can be narrowed.

  In the present invention, the coating-type conductive film is formed, for example, by applying a coating material in which conductive particles are dispersed in an organic solvent together with a binder resin and then curing the coating material.

  In the present invention, the liquid repellent layer may employ a configuration formed on at least the outer surface of the second substrate. If comprised in this way, a liquid-repellent process layer can be formed easily.

  In the present invention, the liquid repellent treatment layer may adopt a configuration formed at least on the side end face of the polarizing plate. If comprised in this way, since a useless space does not generate | occur | produce between a liquid repellent process layer and the side end surface of a polarizing plate, the area | region which does not contribute directly to a display can be narrowed.

  In the present invention, the liquid repellent treatment layer is preferably formed in a straight line along the side end face of the polarizing plate. If comprised in this way, since the application | coating range of the coating material for forming a coating type electrically conductive film is restrict | limited reliably by a liquid repellent treatment layer, the protrusion of a coating material can be prevented reliably, and liquid repellent A treatment layer can be easily formed.

  In the present invention, the liquid repellent layer includes a first portion extending linearly along a side end surface of the polarizing plate, and a second portion extending from the first portion toward the substrate edge of the counter substrate. Are preferably provided. If comprised in this way, since a coating material is apply | coated to the inner side surrounded by the 1st part and 2nd part of a liquid repellent process layer, a coating material wraps around the 1st part and the side by which a polarizing plate is arrange | positioned It is possible to reliably avoid the occurrence of a situation that protrudes.

  The liquid crystal device to which the present invention is applied can be applied to both the FFS mode and the IPS mode. However, in the case of the FFS type liquid crystal device, the common electrode can be formed in a solid shape and there is an advantage that it is not necessary to separately form a storage capacitor. Therefore, the present invention is applied to the FFS type liquid crystal device. It is preferable.

  A liquid crystal device to which the present invention is applied is used as a display unit of an electronic device such as a mobile phone or a mobile computer.

  Embodiments of the present invention will be described below. In the drawings to be referred to in the following description, the scales are different for each layer and each member so that each layer and each member have a size that can be recognized on the drawing.

[Embodiment 1]
(overall structure)
1A and 1B are plan views of the liquid crystal device according to the first embodiment of the present invention as viewed from the side of the counter substrate together with the components formed thereon, and HH ′ thereof. It is sectional drawing.

  1A and 1B, a liquid crystal device 100 of this embodiment is a transmissive active matrix liquid crystal device, and a liquid crystal panel 100p is connected to an element substrate 10 (first substrate) and an element substrate 10. And a counter substrate 20 (second substrate) disposed opposite to each other, and a liquid crystal layer 50 that is homogeneously aligned between the counter substrate 20 and the element substrate 10. A sealing material 103 is formed on the element substrate 10 along the edge of the counter substrate 20, and the counter substrate 20 and the element substrate 10 are bonded together by the sealing material 103. The liquid crystal layer 50 is a liquid crystal composition having a positive dielectric anisotropy having a dielectric constant in the alignment direction larger than that in the normal direction, and exhibits a nematic phase in a wide temperature range.

  The counter substrate 20 is smaller than the element substrate 10, and the element substrate 10 includes an extended region 10 s that protrudes from the substrate edge 20 c of the counter substrate 20. In the overhanging region 10 s, along one side of the element substrate 10, a driving IC 102 in which the data line driving circuit 101 and the scanning line driving circuit 104 are configured is mounted. In the overhanging region 10s, a plurality of terminals 108 are formed along one side of the element substrate 10. A flexible substrate (not shown) is connected to the terminals 108, and is electrically connected to the outside. Is done.

  As will be described in detail later, a plurality of pixel electrodes 7 a are formed in a matrix on the element substrate 10. On the other hand, a frame-shaped light shielding layer 23a made of a light shielding material is formed in the inner area of the sealing material 103 on the counter substrate 20, and the inner side thereof is an image display area 10a. In the counter substrate 20, a light shielding layer 23 b called a black matrix or a black stripe is formed in a region facing the vertical and horizontal pixel boundary regions of the pixel electrode 7 a of the element substrate 10.

  The liquid crystal device 100 of this embodiment drives the liquid crystal layer 50 in the FFS mode. For this reason, in addition to the pixel electrode 7a, a common electrode (not shown in FIGS. 1A and 1B), which will be described later, is formed on the element substrate 10 and is opposed to the counter substrate 20. The electrode is not formed.

  In the liquid crystal device 100 configured as described above, the liquid crystal panel 100p is disposed such that the counter substrate 20 is positioned on the display light emitting side, and the liquid crystal panel 100p is located on the counter substrate 20 side and the element substrate 10 side with respect to the liquid crystal panel 100p. A first polarizing plate 51 and a second polarizing plate 52 are bonded to each by an adhesive. Further, a backlight device (not shown) is disposed on the element substrate 10 side with respect to the liquid crystal panel 100p.

(Electrical configuration of the liquid crystal device 100)
FIG. 2 is an equivalent circuit diagram showing an electrical configuration of the image display region 10a of the element substrate 10 used in the liquid crystal device 100 to which the present invention is applied. As shown in FIG. 2, a plurality of pixels 100 a are formed in a matrix in the image display region 10 a of the liquid crystal device 100. In each of the plurality of pixels 100a, a pixel electrode 7a and a pixel switching thin film transistor 30 for controlling the pixel electrode 7a are formed. Each of the plurality of pixels 100a is provided with a common electrode 9a for forming a horizontal electric field with the pixel electrode 7a, and the common electrode 9a is electrically connected to the common wiring 3c. . Although FIG. 2 shows a configuration in which the common electrode 9a is connected to the common wiring 3c, a configuration in which the common electrode 9a is formed on substantially the entire surface of the image display region 10a of the element substrate 10 may be employed. .

  The data line 5 a is electrically connected to the source of the thin film transistor 30, and the data signal is supplied from the data line driving circuit 101 to the data line 5 a line-sequentially. Further, the scanning line 3 a is electrically connected to the gate of the thin film transistor 30, and the scanning signal is supplied line-sequentially from the scanning line driving circuit 104 to the scanning line 3 a. The pixel electrode 7a is electrically connected to the drain of the thin film transistor 30, and by turning on the thin film transistor 30 for a certain period, a data signal supplied from the data line 5a is sent to each pixel 100a at a predetermined timing. Write. Thus, the pixel signal of a predetermined level written in the liquid crystal layer 50 through the pixel electrode 7a is held for a certain period with the common electrode 9a formed on the element substrate 10. Here, a storage capacitor 6a is formed between the pixel electrode 7a and the common electrode 9a, and the voltage of the pixel electrode 7a is held for a time that is, for example, three orders of magnitude longer than the time when the source voltage is applied. The Thereby, the charge retention characteristic is improved, and the liquid crystal device 100 capable of performing display with a high contrast ratio can be realized.

(Configuration of each pixel)
3A, 3B, and 3C each show a cross-sectional view of one pixel of the liquid crystal device 100 according to Embodiment 1 of the present invention, a plan view thereof, an arrangement direction of polarizing plates, and the like. FIG. 3A is an explanatory diagram, and FIG. 3A corresponds to a cross-sectional view when the liquid crystal device 100 is cut at a position corresponding to the line AA ′ in FIG. In FIG. 3B, the pixel electrode 7a is indicated by a thick and long dotted line, the scanning line 3a and a wiring formed simultaneously with the scanning line 3a are indicated by a two-dot chain line, and the data line 5a and a thin film formed simultaneously with the scanning line 3a. A thin solid line is shown, and the common electrode 9a is shown by a thick solid line.

  As shown in FIGS. 3A and 3B, on the element substrate 10, a transparent pixel electrode 7a made of an ITO (Indium Tin Oxide) film is formed in a matrix for each pixel 100a. Along the vertical and horizontal pixel boundary regions of the pixel electrode 7a, a data line 5a and a scanning line 3a electrically connected to the thin film transistor 30 (pixel switching element) are formed. A common wiring 3c is formed so as to be parallel to the scanning line 3a, and the common wiring 3c is a wiring layer formed simultaneously with the scanning line 3a. A transparent common electrode 9a made of an ITO film is electrically connected to the common wiring 3c. Here, the common electrode 9a is solid, while the pixel electrode 7a is formed with a plurality of slit-like openings 7b (shown by thick and long dotted lines).

  In FIG. 3A, the base of the element substrate 10 includes a light-transmitting substrate 10b such as a quartz substrate or a heat-resistant glass substrate, and the base of the counter substrate 20 includes a transparent substrate such as a quartz substrate or a heat-resistant glass substrate. It consists of the optical substrate 20b. In this embodiment, a glass substrate is used for both of the translucent substrates 10b and 20b.

  3A and 3B again, the element substrate 10 is provided with a base protective film (not shown) made of a silicon oxide film or the like on the surface of the translucent substrate 10b, and on the surface side thereof. In FIG. 2, a bottom gate thin film transistor 30 is formed at a position adjacent to each pixel electrode 7a. In the thin film transistor 30, a gate electrode formed of a part of the scanning line 3a, a gate insulating layer 2, a semiconductor layer 1a formed of an amorphous silicon film constituting an active layer of the thin film transistor 30, and a contact layer (not shown) are stacked in this order. Has been. In the semiconductor layer 1a, the data line 5a is overlapped as a source electrode via a contact layer at the end on the source side, and the drain electrode 5b is overlapped at the end on the drain side via the contact layer. . The data line 5a and the drain electrode 5b are made of a conductive film formed simultaneously. An insulating protective film 4 made of a silicon nitride film or the like is formed on the surface side of the data line 5a and the drain electrode 5b. A pixel electrode 7a made of an ITO film is formed on the insulating protective film 4, and a plurality of slit-like openings are formed in the pixel electrode 7b. A contact hole 8a is formed in a region overlapping the drain electrode 5b in the insulating protective film 4, and the pixel electrode 7a is electrically connected to the drain electrode 5b through the contact hole 8a. An alignment film 16 is formed on the surface side of the pixel electrode 7a. The alignment film 16 is a polyimide resin film that is aligned by a linear rubbing process, and aligns a portion of the liquid crystal layer 50 adjacent to the alignment film 16 in accordance with the rubbing direction.

  In the element substrate 10, the common wiring 3c is formed on the surface of the translucent substrate 10b. A common electrode 9a made of a solid ITO film is formed on the common wiring 3c, and the common electrode 9a is electrically connected to the common wiring 3c. A gate insulating layer and an insulating protective film 4 are formed on the surface of the common electrode 9a. The common electrode 9a and the pixel electrode 7a face each other with the gate insulating layer 2 and the insulating protective film 4 interposed therebetween, and a storage capacitor 6a having the gate insulating layer 2 and the insulating protective film 4 as a dielectric film is formed. Further, the liquid crystal layer 50 is driven in the slit-like opening 7b and its periphery by a lateral electric field formed between the pixel electrode 7a and the common electrode 9a.

  In the counter substrate 20, a light shielding layer 23b is formed on the inner surface 20e (the surface on which the liquid crystal layer 50 is located) of the light transmitting substrate 20b so as to face the thin film transistor 30, and in a region surrounded by the light shielding layer 23b. Each color filter 22 is formed. The light shielding layer 23 b and the color filter 22 are covered with an insulating protective film 24, and an alignment film 26 is formed on the surface side of the insulating protective film 24. The alignment film 26 is a polyimide resin film that is aligned by a linear rubbing process, and aligns a portion of the liquid crystal layer 50 adjacent to the alignment film 26 according to the rubbing direction. Here, the rubbing treatment for the alignment films 16 and 26 is anti-parallel, and the rubbing direction for the alignment film 16 and the rubbing direction for the alignment film 26 are opposite to each other. For this reason, the liquid crystal layer 50 can be homogeneously aligned.

  As shown in FIG. 3B, a columnar protrusion 13 (not shown in FIG. 3A) is formed between the element substrate 10 and the counter substrate 20 with respect to the element substrate 10 by a photosensitive resin. The distance between the element substrate 10 and the counter substrate 20 is set to a predetermined value by the columnar protrusions 13.

  Here, when the liquid crystal device 100 is viewed from the normal direction, the plurality of slit-shaped openings 7b are formed in parallel to each other, but extend with an inclination of 5 degrees with respect to the scanning line 3a. As shown in FIG. 3C, the alignment film 26 on the counter substrate 20 side is rubbed in parallel with the scanning line 3a, and the alignment film 16 on the element substrate 10 side is A rubbing process is performed in the direction opposite to the rubbing direction on the alignment film 26. For this reason, the alignment films 16 and 26 are rubbed at an angle of 5 degrees in the direction in which the opening 7b extends. The first polarizing plate 51 and the second polarizing plate 52 are arranged so that their polarization axes are orthogonal to each other, and the polarization axis of the first polarizing plate 51 is orthogonal to the rubbing direction with respect to the alignment films 16 and 26. The polarization axis of the second polarizing plate 52 is parallel to the rubbing direction with respect to the alignment films 16 and 26.

  In the liquid crystal device 100 configured as described above, the backlight light emitted from the backlight device (not shown) is incident from the element substrate 10 side and emitted as display light from the counter substrate 20 side. Light modulation is performed by the liquid crystal layer 50 to display an image.

(Shield structure)
4A and 4B are an enlarged cross-sectional view and a plan view showing an end portion of the liquid crystal device 100 according to Embodiment 1 of the present invention.

  In the liquid crystal device 100 of this embodiment, the pixel electrode 7 a and the common electrode 9 a for driving the liquid crystal layer 50 are both formed on the element substrate 10 side, and the common electrode 9 a is formed on the counter substrate 20 side. Absent. For this reason, since the counter substrate 20 does not have a shielding function against the intrusion of static electricity from the outside, there is a problem in that the orientation of the liquid crystal layer 50 is disturbed by static electricity and proper display cannot be performed. Therefore, in this embodiment, as shown in FIGS. 4A and 4B, a translucent shielding conductive film 25 made of an ITO film is formed on the entire or substantially entire outer surface 20f of the counter substrate 20. . On the other hand, an inter-substrate connection electrode 106 is formed in the overhanging region 10 s of the element substrate 10, and the wiring 107 extending from the inter-substrate connection electrode 106 is connected to the terminal 108 a among the plurality of terminals 108. Yes. Further, a sheet polarizing plate 51 made of a resin film is bonded by an adhesive 55 so as to cover the shielding conductive film 25 at a position separated from the substrate edge 20c by a predetermined distance d1 on the outer surface 20f side of the counter substrate 20. In the vicinity of the substrate edge 20c of the counter substrate 20, the shielding conductive film 25 is exposed. Further, a coating-type conductive film 61 is formed so as to straddle the overhanging region 10 s of the element substrate 10 and the substrate edge 20 c of the counter substrate 20, and the inter-substrate connection electrode 106 and the shielding conductive film 25 are formed of the coating-type conductive film. 61 is electrically connected. Accordingly, when a flexible substrate (not shown) is connected to the terminal 108 in the overhanging region 10 s of the element substrate 10, the shielding conductive film 25 is connected to the ground via the element substrate 10 and the flexible substrate. Therefore, the alignment of the liquid crystal layer 50 can be prevented from being disturbed by the entry of static electricity.

  Here, the coating-type conductive film 61 is applied after a room-temperature curable conductive paste 60 (coating material) is applied by a printing method, a discharge method from a dispenser, or a spray method in a state of being partially covered with a mask. It is a layer obtained by curing at room temperature. The conductive paste 60 has a composition in which conductive particles such as silver powder and carbon powder are dispersed in an organic solvent composed of an aromatic solvent such as toluene or an alcohol solvent together with a binder resin. For this reason, when applying the conductive paste 60, the conductive paste 60 may protrude into the bonding region of the polarizing plate 51. Therefore, in this embodiment, a liquid repellent treatment layer that limits the coating range on the polarizing plate 51 side of the coating type conductive film 61 between the polarizing plate 51 and the coating type conductive film 61 on the outer surface 20 f side of the counter substrate 20. 28 is formed. In this embodiment, the liquid-repellent treatment layer 28 is made of a liquid-repellent resin such as a fluorine resin or a silicon resin, and a position on the outer surface 20f of the counter substrate 20 with a predetermined gap from the side end surface 511 of the polarizing plate 51. It is formed linearly along the side end face 511.

(Manufacturing method 1 of the liquid crystal device 100 and main effects of the present embodiment)
In manufacturing the liquid crystal device 100 according to the present embodiment, various thin films are formed in a state of a large substrate on which a large number of element substrates 10 and counter substrates 20 can be obtained, and then the large substrates are bonded to each other. A method of cutting out the panel 100p or a method of obtaining the liquid crystal panel 100p by bonding the single-size element substrate 10 and the counter substrate 20 is employed. In any of these methods, an ITO film is formed on the outer surface 20f of the counter substrate 20 by sputtering to form a shielding conductive film 25, and a polarizing plate for the outer surface 20f of the counter substrate 20 in the state of the liquid crystal panel 100p. A bonding step 51 and a coating type conductive film 61 are formed. If the liquid repellent layer 28 is formed before the coating conductive film 61 is formed, the element substrate 10 and the counter substrate 20 are bonded together, or the element substrate 10 and the counter substrate 20 are bonded together. Any of the liquid crystal panels 100p may be used. However, when the liquid repellent layer 28 is formed after the polarizing plate 51 is bonded to the counter substrate 20 with the adhesive 55, the polarizing plate 51 and the adhesive 55 are not affected when the liquid repellent layer 28 is formed. Resin materials with low fluidity, solvent-free resin materials that do not contain any organic solvents, low-solvent resin materials that contain a small amount of organic solvents, and weak-solvent resin materials that have relatively low swelling with resin materials Use.

In such a manufacturing method, for example, the above steps are performed in the following order: (1) bonding step of polarizing plate 51 (2) formation step of liquid repellent treatment layer 28 (3) formation step of coating type conductive film 61 When performing, in the formation process of the coating type conductive film 61, when the conductive paste 60 for forming the coating type conductive film 61 is applied, the side surface 511 of the polarizing plate 51 is formed on the outer surface 20 f side of the counter substrate 20. A liquid repellent layer 28 is formed along the straight line. For this reason, the conductive paste 60 does not protrude to the side where the polarizing plate 51 is bonded. Therefore, since the polarizing plate 51 does not come into contact with the conductive paste 60, the problem that the polarizing plate 51 is partially clouded by the organic solvent contained in the conductive paste 60 does not occur. Therefore, the polarizing plate 51 can be disposed at a position separated by a short distance d1 from the substrate edge 20c of the counter substrate 20, and a region not directly contributing to display can be narrowed.

(Manufacturing method 2 of the liquid crystal device 100 and main effects of the present embodiment)
In manufacturing the liquid crystal device 100 of this embodiment, the above steps are performed in the following order: (1) Step of forming the liquid repellent layer 28 (2) Step of bonding the polarizing plate 51 (3) Step of forming the coating type conductive film 61 Even when the process is performed, when the conductive paste 60 for forming the coating type conductive film 61 is applied in the step of forming the coating type conductive film 61, the side end face of the polarizing plate 51 is disposed on the outer surface 20 f side of the counter substrate 20. A liquid repellent layer 28 is formed in a straight line along the line 511. For this reason, the conductive paste 60 does not protrude to the side where the polarizing plate 51 is bonded. Therefore, since the polarizing plate 51 does not come into contact with the conductive paste 60, the problem that the polarizing plate 51 is partially clouded by the organic solvent contained in the conductive paste 60 does not occur. Therefore, the polarizing plate 51 can be disposed at a position separated by a short distance d1 from the substrate edge 20c of the counter substrate 20, and a region not directly contributing to display can be narrowed.

  Further, since the liquid repellent treatment layer 28 is formed before the polarizing plate 51 is bonded, the liquid repellent treatment layer 28 can be formed by using a material containing an organic solvent as a material for forming the liquid repellent treatment layer 28. If the organic solvent is removed at the stage where the film has been formed, there is an advantage that the polarizing plate 51 is not likely to deteriorate.

(Manufacturing method 3 of the liquid crystal device 100 and main effects of the present embodiment)
In manufacturing the liquid crystal device 100 of this embodiment, the above steps are performed in the following order: (1) Step of forming the liquid repellent layer 28 (2) Step of forming the coating type conductive film 61 (3) Step of bonding the polarizing plate 51 When the conductive paste 60 for forming the coating type conductive film 61 is applied in the step of forming the coating type conductive film 61, the polarizing plate 51 is bonded to the outer surface 20f side of the counter substrate 20. A liquid repellent treatment layer 28 is formed linearly along the edge of the region to be formed. For this reason, the conductive paste 60 does not protrude to the region where the polarizing plate 51 is to be bonded. Accordingly, it is possible to reliably prevent the coating type conductive film 61 from entering between the polarizing plate 51 and the counter substrate 20. Therefore, the polarizing plate 51 can be disposed at a position separated by a short distance d1 from the substrate edge 20c of the counter substrate 20, and a region not directly contributing to display can be narrowed. Further, since the liquid repellent treatment layer 28 is formed before the polarizing plate 51 is bonded, the liquid repellent treatment layer 28 can be formed by using a material containing an organic solvent as a material for forming the liquid repellent treatment layer 28. If the organic solvent is removed at the stage where the film has been formed, there is an advantage that the polarizing plate 51 is not likely to deteriorate.

[Embodiment 2]
FIGS. 5A and 5B are an enlarged cross-sectional view and a plan view showing an end portion of the liquid crystal device 100 according to Embodiment 2 of the present invention. Since the basic configuration of this embodiment is the same as that of Embodiment 1, common portions are denoted by the same reference numerals and description thereof is omitted.

  As shown in FIGS. 5A and 5B, in the liquid crystal device 100 of the present embodiment as well, the common electrode is not formed on the counter substrate 20 as in the first embodiment. A translucent shielding conductive film 25 made of an ITO film is formed on the entire or substantially entire surface of the outer surface 20f opposite to the inner surface 20e side where 50 is located. On the other hand, an inter-substrate connection electrode 106 is formed in the overhanging region 10 s of the element substrate 10, and the wiring 107 extending from the inter-substrate connection electrode 106 is connected to the terminal 108 a among the plurality of terminals 108. Yes. A coating-type conductive film 61 is formed so as to straddle the overhanging region 10 s and the substrate edge 20 c of the counter substrate 20. The inter-substrate connection electrode 106 and the shielding conductive film 25 are electrically connected by the coating-type conductive film 61. It is connected to the.

  In adopting such a configuration, in this embodiment, the coating range on the polarizing plate 51 side of the coating-type conductive film 61 is disposed between the polarizing plate 51 and the coating-type conductive film 61 on the side of the outer surface 20 f of the counter substrate 20. A liquid repellent treatment layer 28 is formed to limit the above.

  In the present embodiment, the liquid repellent treatment layer 28 is made of a fluorine-based resin or a silicon-based resin, and extends along the side end surface 511 at a position spaced apart from the side end surface 511 of the polarizing plate 51 on the outer surface 20f of the counter substrate 20. The first portion 281 extending linearly and a pair of second portions 282 extending from the first portion 281 toward the substrate edge 20c of the counter substrate 20 are provided. Therefore, on the outer surface 20 f of the counter substrate 20, the coating type conductive film 61 is formed in a region surrounded by the first portion 281 and the second portion 282.

Even in this configuration, as in the first embodiment, the following order (1) Bonding process of polarizing plate 51 (2) Formation process of liquid repellent treatment layer 28 (3) Formation process of coating type conductive film 61 In each step, when applying the conductive paste 60 for forming the coating type conductive film 61 in the coating type conductive film 61 forming step, the polarizing plate 51 is formed on the outer surface 20f side of the counter substrate 20. Since the liquid repellent treatment layer 28 is formed along the side end face 511, the conductive paste 60 does not protrude to the side where the polarizing plate 51 is bonded. In addition, the liquid repellent layer 28 includes a first portion 281 that extends linearly along the side end surface 511 of the polarizing plate 51, and a second portion that extends from the first portion 281 toward the substrate edge 20 c of the counter substrate 20. 282, the occurrence of a situation in which the conductive pace 60 wraps around the first portion 281 and protrudes to the side where the polarizing plate 51 is disposed can be reliably avoided. Accordingly, since the polarizing plate 51 does not come into contact with the conductive paste 60, there is no problem that the polarizing plate 51 is partially clouded by the organic solvent contained in the conductive paste 60. Therefore, the polarizing plate 51 can be disposed at a position spaced a short distance d1 from the substrate edge 20c of the counter substrate 20, and the area not directly contributing to the display can be narrowed. Has the same effect as

Further, the following order (1) Step of forming the liquid-repellent treatment layer 28 (2) Step of bonding the polarizing plate 51 (3) When performing each step in the step of forming the coating type conductive film 61, the coating type conductive film 61 In the forming step, when applying the conductive paste 60 for forming the coating type conductive film 61, the liquid repellent treatment layer 28 is formed along the side end face 511 of the polarizing plate 51 on the outer surface 20 f side of the counter substrate 20. Since it is formed, the conductive paste 60 does not protrude to the side where the polarizing plate 51 is bonded. Therefore, since the polarizing plate 51 does not come into contact with the conductive paste 60, the problem that the polarizing plate 51 is partially clouded by the organic solvent contained in the conductive paste 60 does not occur. Further, since the liquid repellent treatment layer 28 is formed before the polarizing plate 51 is bonded, even if a material containing an organic solvent is used as a material for forming the liquid repellent treatment layer 28, There is an advantage that the polarizing plate 51 is not likely to deteriorate.

Further, in the following order: (1) Step of forming the liquid repellent treatment layer 28 (2) Step of forming the coating type conductive film 61 (3) When each step is performed in the bonding step of the polarizing plate 51, In the forming step, when applying the conductive paste 60 for forming the coating type conductive film 61, the liquid repellent treatment is performed on the outer surface 20f side of the counter substrate 20 along the edge of the region where the polarizing plate 51 is to be bonded. Since the layer 28 is formed, the conductive paste 60 does not protrude to the region where the polarizing plate 51 is to be bonded. Therefore, it is possible to reliably prevent the coating type conductive film 61 from entering between the polarizing plate 51 and the counter substrate 20.

[Embodiment 3]
FIGS. 6A and 6B are an enlarged cross-sectional view and a plan view showing an end portion of the liquid crystal device 100 according to Embodiment 3 of the present invention. Since the basic configuration of this embodiment is the same as that of Embodiment 1, common portions are denoted by the same reference numerals and description thereof is omitted.

  As shown in FIGS. 6A and 6B, in the liquid crystal device 100 of the present embodiment as well, the common electrode is not formed on the counter substrate 20 as in the first embodiment. A translucent shielding conductive film 25 made of an ITO film is formed on the entire outer surface 20f opposite to the inner surface 20e side where 50 is located. On the other hand, an inter-substrate connection electrode 106 is formed in the overhanging region 10 s of the element substrate 10, and the wiring 107 extending from the inter-substrate connection electrode 106 is connected to the terminal 108 a among the plurality of terminals 108. Yes. A coating-type conductive film 61 is formed so as to straddle the overhanging region 10 s and the substrate edge 20 c of the counter substrate 20. The inter-substrate connection electrode 106 and the shielding conductive film 25 are electrically connected by the coating-type conductive film 61. It is connected to the.

  In adopting such a configuration, in this embodiment, the coating range on the polarizing plate 51 side of the coating-type conductive film 61 is disposed between the polarizing plate 51 and the coating-type conductive film 61 on the side of the outer surface 20 f of the counter substrate 20. A liquid repellent treatment layer 28 is formed to limit the above.

  In this embodiment, the liquid repellent treatment layer 28 is made of a fluorine-based resin or a silicon-based resin, and is formed in a linear shape so as to cover the side end surface 511 of the polarizing plate 51 on the outer surface 20 f side of the counter substrate 20. Here, the liquid repellent layer 28 is a layer formed before the polarizing plate 51 is bonded to the counter substrate 20 or after the polarizing plate 51 is bonded to the counter substrate 20. Here, when forming the liquid repellent layer 28, a solventless resin material that does not contain any organic solvent and a small solvent resin material that contains a small amount of organic solvent so that the polarizing plate 51 and the adhesive are not attacked. A weak solvent type resin material having a relatively low swelling property with respect to the resin material is used.

Even in such a configuration, the following order (1) Bonding step of polarizing plate 51 (2) Formation step of liquid repellent treatment layer 28 on side end surface 511 of polarizing plate 51 (3) Coating type conductive film 61 When each process is performed in the forming process, when the conductive paste 60 for forming the coating type conductive film 61 is applied in the forming process of the coating type conductive film 61, a polarizing plate is formed on the outer surface 20 f side of the counter substrate 20. Since the liquid-repellent treatment layer 28 is formed along the side end surface 511 of the 51, the conductive paste 60 does not protrude to the side where the polarizing plate 51 is bonded. Therefore, since the polarizing plate 51 does not come into contact with the conductive paste 60, the problem that the polarizing plate 51 is partially clouded by the organic solvent contained in the conductive paste 60 does not occur. Therefore, the polarizing plate 51 can be disposed at a position spaced a short distance d1 from the substrate edge 20c of the counter substrate 20, and the area not directly contributing to the display can be narrowed. Has the same effect as In addition, since no useless space is generated between the liquid repellent layer 28 and the side end surface 511 of the polarizing plate 51, the polarizing plate 51 is positioned at a distance d1 shorter than that in the first embodiment. The region that does not directly contribute to the display can be narrowed.

Further, in the following order: (1) Step of forming the liquid repellent layer 28 on the side end surface 511 of the polarizing plate 51 (2) Step of bonding the polarizing plate 51 (3) Each step in the step of forming the coating type conductive film 61 Even when it is performed, when applying the conductive paste 60 for forming the coating type conductive film 61 in the step of forming the coating type conductive film 61, the side end surface 511 of the polarizing plate 51 is disposed on the outer surface 20 f side of the counter substrate 20. Since the liquid repellent treatment layer 28 is formed along the conductive paste 60, the conductive paste 60 does not protrude to the side where the polarizing plate 51 is bonded. Therefore, since the polarizing plate 51 does not come into contact with the conductive paste 60, the problem that the polarizing plate 51 is partially clouded by the organic solvent contained in the conductive paste 60 does not occur.

[Embodiment 4]
7A and 7B are an enlarged cross-sectional view and a plan view of an end portion of the liquid crystal device 100 according to Embodiment 4 of the present invention. Since the basic configuration of this embodiment is the same as that of Embodiment 1, common portions are denoted by the same reference numerals and description thereof is omitted.

  As shown in FIGS. 7A and 7B, in the liquid crystal device 100 of the present embodiment as well, the common electrode is not formed on the counter substrate 20 as in the first embodiment. A translucent shielding conductive film 25 made of an ITO film is formed on the entire outer surface 20f opposite to the inner surface 20e side where 50 is located. On the other hand, an inter-substrate connection electrode 106 is formed in the overhanging region 10 s of the element substrate 10, and the wiring 107 extending from the inter-substrate connection electrode 106 is connected to the terminal 108 a among the plurality of terminals 108. Yes. A coating-type conductive film 61 is formed so as to straddle the overhanging region 10 s and the substrate edge 20 c of the counter substrate 20. The inter-substrate connection electrode 106 and the shielding conductive film 25 are electrically connected by the coating-type conductive film 61. It is connected to the.

  In adopting such a configuration, in this embodiment, the coating range on the polarizing plate 51 side of the coating-type conductive film 61 is disposed between the polarizing plate 51 and the coating-type conductive film 61 on the side of the outer surface 20 f of the counter substrate 20. A liquid repellent treatment layer 28 is formed to limit the above.

  In this embodiment, the liquid repellent treatment layer 28 is made of a fluorine-based resin or a silicon-based resin, and has a linear first portion 286 formed so as to cover the side end surface 511 of the polarizing plate 51, and the outer surface 20 f of the counter substrate 20. And a pair of second portions 287 extending from the first portion 286 toward the substrate edge 20 c of the counter substrate 20. Accordingly, the coating-type conductive film 61 is formed in the region surrounded by the first portion 286 and the second portion 287 on the outer surface 20 f of the counter substrate 20.

  Here, the liquid repellent layer 28 is a layer formed before the polarizing plate 51 is bonded to the counter substrate 20 with the adhesive 55 or after the polarizing plate 51 is bonded to the counter substrate 20 with the adhesive 55. When forming the first portion 286 of the liquid repellent layer 28, a solventless resin material that does not contain any organic solvent or a small amount of organic solvent is used so that the polarizing plate 51 and the adhesive 55 are not attacked. A solvent type resin material or a weak solvent type resin material having a relatively low swelling property with respect to the resin material is used. In addition, when forming the second portion 287 of the liquid repellent layer 28, a resin material with low fluidity and a solventless resin material that does not contain any organic solvent so that the polarizing plate 51 and the adhesive 55 are not attacked. A small solvent type resin material with a small amount of organic solvent and a weak solvent type resin material having a relatively low swelling property with respect to the resin material are used.

Even in such a configuration, the following order (1) Bonding process of polarizing plate 51 (2) Forming process of liquid repellent treatment layer 28 on side end surface 511 of polarizing plate 51 and counter substrate 20 (3) Coating type When each process is performed in the formation process of the conductive film 61, the conductive paste 60 for forming the coating type conductive film 61 is applied to the outer surface 20 f side of the counter substrate 20 in the formation process of the coating type conductive film 61. Since the liquid repellent layer 28 is formed, the conductive paste 60 does not protrude to the side where the polarizing plate 51 is bonded. Moreover, the liquid repellent layer 28 includes a first portion 286 that extends linearly along the side end surface 511 of the polarizing plate 51, and a second portion that extends from the first portion 286 toward the substrate edge 20 c of the counter substrate 20. 287, the occurrence of a situation in which the conductive pace 60 wraps around the first portion 286 and protrudes to the side where the polarizing plate 51 is disposed can be reliably avoided. Therefore, since the polarizing plate 51 does not come into contact with the conductive paste 60, there is no problem that the polarizing plate 51 is partially clouded by the organic solvent contained in the conductive paste 60. Therefore, the polarizing plate 51 can be disposed at a position spaced a short distance d1 from the substrate edge 20c of the counter substrate 20, and the area not directly contributing to the display can be narrowed. Has the same effect as

Further, the following order (1) Step of forming first portion 286 on side end surface 511 of polarizing plate 51 (2) Step of bonding polarizing plate 51 (3) Step of forming second portion 287 on counter substrate 20 ( 4) Even when each step is performed in the formation process of the coating type conductive film 61, when the conductive paste 60 for forming the coating type conductive film 61 is applied in the formation process of the coating type conductive film 61, Since the liquid repellent layer 28 is formed on the outer surface 20f side, the conductive paste 60 does not protrude to the side where the polarizing plate 51 is bonded. Therefore, since the polarizing plate 51 does not come into contact with the conductive paste 60, the problem that the polarizing plate 51 is partially clouded by the organic solvent contained in the conductive paste 60 does not occur.

Further, the following order: (1) Step of forming first portion 286 on side end surface 511 of polarizing plate 51 (2) Step of forming second portion 287 on counter substrate 20 (3) Step of bonding polarizing plate 51 ( 4) Even when each step is performed in the formation process of the coating type conductive film 61, when the conductive paste 60 for forming the coating type conductive film 61 is applied in the formation process of the coating type conductive film 61, Since the liquid repellent layer 28 is formed on the outer surface 20f side, the conductive paste 60 does not protrude to the side where the polarizing plate 51 is bonded. Therefore, since the polarizing plate 51 does not come into contact with the conductive paste 60, the problem that the polarizing plate 51 is partially clouded by the organic solvent contained in the conductive paste 60 does not occur.

[Other embodiments]
In the above-described embodiment, an example in which the present invention is applied to the FFS liquid crystal device 100 as a type using a lateral electric field has been described. However, the present invention may be applied to an IPS transflective liquid crystal device. . In such an IPS liquid crystal device, a comb-like pixel electrode connected to a thin film transistor and a comb-like common electrode formed across a plurality of pixels are formed on the surface of a common insulating layer. Has been.

  In the above embodiment, an amorphous silicon film is used as the semiconductor film. However, the present invention may be applied to the element substrate 10 using a polysilicon film or a single crystal silicon layer. Further, the present invention may be applied to a liquid crystal device using a thin film diode element (nonlinear element) as a pixel switching element.

[Example of mounting on electronic equipment]
Next, an electronic apparatus to which the liquid crystal device 100 according to the above-described embodiment is applied will be described. FIG. 8A illustrates a configuration of a mobile personal computer including the liquid crystal device 100. The personal computer 2000 includes a liquid crystal device 100 as a display unit and a main body 2010. The main body 2010 is provided with a power switch 2001 and a keyboard 2002. FIG. 8B shows a configuration of a mobile phone provided with the liquid crystal device 100. The cellular phone 3000 includes a plurality of operation buttons 3001, scroll buttons 3002, and the liquid crystal device 100 as a display unit. By operating the scroll button 3002, the screen displayed on the liquid crystal device 100 is scrolled. FIG. 8C shows the configuration of a portable information terminal (PDA: Personal Digital Assistants) to which the liquid crystal device 100 is applied. The information portable terminal 4000 includes a plurality of operation buttons 4001, a power switch 4002, and the liquid crystal device 100 as a display unit. When the power switch 4002 is operated, various kinds of information such as an address book and a schedule book are displayed on the liquid crystal device 100.

  Electronic devices to which the liquid crystal device 100 is applied include those shown in FIG. 8, a digital still camera, a liquid crystal television, a viewfinder type, a monitor direct-view type video tape recorder, a car navigation device, a pager, an electronic notebook, a calculator. , Word processors, workstations, videophones, POS terminals, devices with touch panels, and the like. And the liquid crystal device 100 mentioned above is applicable as a display part of these various electronic devices.

(A), (b) is the top view which looked at the liquid crystal device based on Embodiment 1 of this invention from the opposing substrate side with each component formed on it, and its HH 'sectional drawing, respectively. It is. It is an equivalent circuit diagram which shows the electrical structure of the image display area | region of the element substrate used for the liquid crystal device to which this invention is applied. (A), (b), (c) is sectional drawing for one pixel of the liquid crystal device which concerns on Embodiment 1 of this invention, its top view, and explanatory drawing which shows the arrangement direction of a polarizing plate, etc. is there. (A), (b) is sectional drawing and the top view which expand and show the edge part of the liquid crystal device which concerns on Embodiment 1 of this invention. (A), (b) is sectional drawing and the top view which expand and show the edge part of the liquid crystal device which concerns on Embodiment 2 of this invention. (A), (b) is sectional drawing and the top view which expand and show the edge part of the liquid crystal device which concerns on Embodiment 3 of this invention. (A), (b) is sectional drawing and the top view which expand and show the edge part of the liquid crystal device which concerns on Embodiment 4 of this invention. It is explanatory drawing of the electronic device using the liquid crystal device which concerns on this invention. (A), (b) is sectional drawing and the top view which expand and show the edge part of the conventional liquid crystal device.

Explanation of symbols

7a ... Pixel electrode, 9a ... Common electrode, 10 ... Element substrate (first substrate), 10s ... Projection area of element substrate, 20 ... Counter substrate (second substrate), 20c ... Substrate of counter substrate Edge, 25... Conductive layer for shielding, 28... Liquid repellent layer, 50 .. Liquid crystal layer, 51 .. First polarizing plate, 52 .. Second polarizing plate, 30. ), 100... Liquid crystal device, 100 a... Pixel, 106.. Inter-substrate connection electrode 281, 286... First part of liquid repellent treatment layer, 282, 287. 511 .. Side end surface of polarizing plate

Claims (7)

A first substrate provided with a pixel electrode formed in each of a plurality of pixels, and a common electrode for forming an electric field between the pixel electrode, a second substrate disposed opposite to the first substrate, In a liquid crystal device having a liquid crystal layer held between the second substrate and the first substrate,
In the first substrate, an inter-substrate connection electrode is formed in a projecting region projecting from a substrate edge of the second substrate,
A translucent shielding conductive film is formed on the outer surface side opposite to the inner surface side on which the liquid crystal layer is positioned in the second substrate,
On the outer surface side of the second substrate, a polarizing plate is bonded so as to cover the shielding conductive film at a position separated by a predetermined distance from the substrate edge,
A coating-type conductive film is formed to electrically connect the inter-substrate connection electrode and the shield conductive film across the overhang region of the first substrate and the substrate edge of the second substrate;
On the outer surface side of the second substrate, a liquid repellent treatment layer is formed between the polarizing plate and the coating-type conductive film to limit a coating range on the polarizing plate side of the coating-type conductive film. A characteristic liquid crystal device.   The liquid crystal device according to claim 1, wherein the coating type conductive film is formed by applying a coating material in which conductive particles are dispersed in an organic solvent together with a binder resin, and then curing the coating material.   The liquid crystal device according to claim 1, wherein the liquid repellent layer is formed on at least an outer surface of the second substrate.   The liquid crystal device according to claim 1, wherein the liquid repellent layer is formed at least on a side end surface of the polarizing plate.   5. The liquid crystal device according to claim 1, wherein the liquid repellent layer is formed in a straight line along a side end surface of the polarizing plate.   The liquid repellent layer includes a first portion extending linearly along a side end surface of the polarizing plate, and a second portion extending from the first portion toward the substrate edge of the counter substrate. The liquid crystal device according to claim 1, wherein the liquid crystal device is a liquid crystal device.   An electronic apparatus comprising the liquid crystal device according to claim 1.

Images