JP2003059405A

JP2003059405A - Method of manufacturing image display panel

Info

Publication number: JP2003059405A
Application number: JP2001241975A
Authority: JP
Inventors: Kohei Nakada; 耕平中田; Tetsuya Kaneko; 哲也金子; Toshihiko Miyazaki; 俊彦宮崎
Original assignee: Canon Inc
Current assignee: Canon Inc
Priority date: 2001-08-09
Filing date: 2001-08-09
Publication date: 2003-02-28

Abstract

PROBLEM TO BE SOLVED: To easily maintain pressure up to a sealing processing chamber 11 from a getter processing chamber 10 in required low pressure when manufacturing an image display panel 5 by performing sealing processing by the sealing processing chamber 11 after laying a getter film on at least a part by the getter processing chamber 10 by successively carrying a set of panel members 1 to 4 for constituting the image display panel 5 to a plurality of pressure-reduced processing chambers including at least the sealing processing chamber 11. SOLUTION: Every time when the new panel members 1 to 4 are sent into the getter processing chamber 10, the getter film by an evaporative getter agent is laid via the same mask 37 arranged in the getter processing chamber 10, and a degree of vacuum in the getter processing chamber 10 is maintained by using a residual getter film remaining in the getter processing chamber 10 by sticking to the mask 37.

Description

Detailed Description of the Invention

【０００１】[0001]

【発明の属する技術分野】本発明は、一組のパネル部材
を、密封された隙間を有するパネル状に封着することで
形成される平板状の画像表示パネルの製造方法に関す
る。更に詳しくは、表示面を構成するフェースプレート
と、背面を構成するリアプレートとを、相対向して隙間
を開けて配置し、周縁部を密封状態に封着することによ
り形成される画像表示パネルの製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a flat image display panel formed by sealing a set of panel members in a panel shape having a sealed gap. More specifically, an image display panel formed by arranging a face plate forming a display surface and a rear plate forming a back surface so as to face each other with a gap therebetween and sealing the peripheral edge portion in a hermetically sealed state. Manufacturing method.

【０００２】[0002]

【従来の技術】一般に、平板状の画像像表示パネルの場
合、ＣＲＴに比して内部空間容積がきわめて小さいこと
から、封着後に内壁面などからガスの放出があった場合
に、内部の真空度が大きく低下しやすい。このようなこ
とから、画像表示パネルを構成するフェースプレートと
リアプレートを、少なくとも封着処理室を含む減圧され
た同一装置内の複数の処理室に順次搬送し、該封着処理
室でフェースプレートとリアプレートを封着処理して画
像表示パネルを形成できるようにすると共に、封着処理
に先立って、上記フェースプレートをゲッタ処理室に搬
送して、蒸発型ゲッタ剤によるゲッタ処理でゲッタ膜を
被着させた後、ゲッタ膜の活性を維持したまま封着し、
このゲッタ膜のガス吸着作用により、封着後の画像表示
パネル内部の真空度を高く維持できるようにすることが
提案されている（ＷＯ００／６０６３４号公報）。2. Description of the Related Art Generally, in the case of a flat image display panel, the internal space volume is extremely smaller than that of a CRT. Therefore, when gas is released from the inner wall surface or the like after sealing, the internal vacuum is reduced. The degree is likely to drop significantly. Therefore, the face plate and the rear plate that form the image display panel are sequentially transferred to a plurality of processing chambers in the same depressurized apparatus including at least the sealing processing chamber, and the face plate is transferred in the sealing processing chamber. The rear plate and the rear plate are sealed so that the image display panel can be formed.Before the sealing process, the face plate is conveyed to the getter processing chamber, and the getter film is formed by the getter processing using the evaporative getter agent. After depositing, seal while maintaining the activity of the getter film,
It has been proposed that the gas adsorption function of the getter film can maintain a high degree of vacuum inside the image display panel after sealing (WO00 / 60634).

【０００３】更に上記ＷＯ００／６０６３４号公報に記
載された技術について説明すると、蛍光体を有するフェ
ースプレートを、ベーク処理室に搬送してベーク処理
し、冷却処理室で冷却してからゲッタ処理室へ搬送して
内面にゲッタ膜を被着させた後、更にアライメント処理
室を介して封着処理室へ搬送する一方、電子源を有する
リアプレートを、上記フェースプレートとは別途ベーク
処理室に搬送してベーク処理し、冷却処理室で冷却して
からアライメント処理室を介して封着処理室へ搬送し、
アライメント処理室でアライメントされた上記フェース
プレートとリアプレートを封着室で封着して画像表示パ
ネルを製造することが提案されている。この従来の製造
方法によれば、予めフェースプレート内面に被着された
ゲッタ膜に、封着後の内部雰囲気中のガスを吸着させる
ことができ、製造される画像表示パネル内の真空度の維
持もしくは真空度の更なる向上を図ることが可能であ
る。To further explain the technique described in WO 00/60634, a face plate having a phosphor is conveyed to a bake treatment chamber for bake treatment, cooled in a cooling treatment chamber, and then cooled to a getter treatment chamber. After transporting and depositing the getter film on the inner surface, it is further transported to the sealing process chamber through the alignment process chamber, while the rear plate having the electron source is transported to the bake process chamber separately from the face plate. Bake treatment, cooling in the cooling treatment chamber, and then transfer to the sealing treatment chamber via the alignment treatment chamber,
It has been proposed to manufacture an image display panel by sealing the face plate and the rear plate aligned in the alignment processing chamber in the sealing chamber. According to this conventional manufacturing method, the getter film previously deposited on the inner surface of the face plate can adsorb the gas in the internal atmosphere after sealing, thereby maintaining the degree of vacuum in the manufactured image display panel. Alternatively, it is possible to further improve the degree of vacuum.

【０００４】[0004]

【発明が解決しようとする課題】ところで、上記製造方
法において、ゲッタ処理室においてフェースプレートに
被着されるゲッタ膜の活性を、封着後まで良好な状態に
維持するためには、少なくともゲッタ処理室から封着処
理室までを高真空度に維持しておく必要がある。ゲッタ
処理室から封着処理室までの圧力が高い場合、せっかく
フェースプレートに被着ゲッタ膜を被着しても、その活
性が当該雰囲気中のガスを吸着することで消失し、封着
後の内部真空度の維持又は向上に作用させることができ
ないことになる。In the above manufacturing method, in order to maintain the activity of the getter film deposited on the face plate in the getter processing chamber in a good state until after the sealing, at least the getter processing is performed. It is necessary to maintain a high degree of vacuum from the chamber to the sealing treatment chamber. When the pressure from the getter processing chamber to the sealing processing chamber is high, even if the getter film is adhered to the face plate, its activity disappears by adsorbing the gas in the atmosphere, and It will not be possible to act on the maintenance or improvement of the internal vacuum degree.

【０００５】上記ゲッタ処理室から封着処理室までを高
真空度に維持しておくためには、ゲッタ処理室やアライ
メント処理室の前に接続された他の処理室の真空度を高
く維持しておき、当該他の処理室からフェースプレート
又はリアプレートをゲッタ処理室又はアライメント処理
室に受け入れる際に真空度が低下しないようにすること
が考えられる。In order to maintain a high degree of vacuum from the getter processing chamber to the sealing processing chamber, the degree of vacuum of the other processing chambers connected in front of the getter processing chamber and the alignment processing chamber is kept high. It is conceivable that the degree of vacuum is not lowered when the face plate or the rear plate is received from the other processing chamber into the getter processing chamber or the alignment processing chamber.

【０００６】しかしながら、当該他の処理室の真空度を
必要以上に高いものとすることになり、装置内の真空度
の維持効率が悪くなる問題がある。However, the degree of vacuum in the other processing chamber becomes higher than necessary, and there is a problem that the efficiency of maintaining the degree of vacuum in the apparatus deteriorates.

【０００７】また、ゲッタ処理室にフェースプレートを
受け入れる都度ゲッタ処理室内を十分減圧すると共に、
アライメント処理室内にリアプレートを受け入れる都度
アライメント処理室内を十分減圧することで対応するこ
とも考えられる。Further, each time the face plate is received in the getter processing chamber, the pressure inside the getter processing chamber is sufficiently reduced, and
It is possible to deal with this by sufficiently reducing the pressure in the alignment processing chamber each time the rear plate is received in the alignment processing chamber.

【０００８】しかしながら、ゲッタ処理室やアライメン
ト処理室の前に接続された他の処理室での処理時間が、
ゲッタ処理室やアライメント処理室の減圧に要する時間
より短くても済む場合、この減圧の待ちの時間を生じる
ことになり、製造効率が低下する問題がある。However, the processing time in another processing chamber connected before the getter processing chamber or the alignment processing chamber is
If the time required for depressurizing the getter processing chamber or the alignment processing chamber is shorter than the time required for depressurizing, the waiting time for depressurizing is generated, and there is a problem that manufacturing efficiency is reduced.

【０００９】本発明は、上記従来の問題点に鑑みてなさ
れたもので、画像表示パネルを構成する一組のパネル部
材を、少なくとも封着処理室を含む減圧された複数の処
理室に順次搬送し、少なくともその一部にゲッタ処理室
でゲッタ膜を被着させた後に封着処理して画像表示パネ
ルを製造するに際し、ゲッタ処理室の圧力を、他の処理
室の必要以上の減圧による装置内の真空度維持効率の低
下及び減圧待ちの時間を生じることによる製造効率の低
下を来すことなく、必要な低圧に維持しやすくすること
を目的とする。The present invention has been made in view of the above conventional problems, and sequentially conveys a set of panel members constituting an image display panel to a plurality of depressurized processing chambers including at least a sealing processing chamber. Then, when a getter film is applied to at least a part of the getter processing chamber and then a sealing process is performed to manufacture an image display panel, the pressure in the getter processing chamber is reduced by an unnecessary pressure reduction in another processing chamber. It is an object of the present invention to easily maintain the required low pressure without lowering the vacuum degree maintaining efficiency and reducing the manufacturing efficiency due to waiting time for pressure reduction.

【００１０】[0010]

【課題を解決するための手段】本発明の第１は、画像表
示パネルを構成する一組のパネル部材を、少なくともゲ
ッタ処理室を含む減圧された複数の処理室に順次搬送
し、所定の処理を経た前記一組のパネル部材を封着処理
して画像表示パネルを形成する画像表示パネルの製造方
法において、前記一組のパネル部材のうちの少なくとも
一部を、前記封着処理に先立ってゲッタ処理室に搬送す
ると共に、該ゲッタ処理室において、新たなパネル部材
が送り込まれる都度、前記ゲッタ処理室に設けられた同
じマスクを介して、送り込まれた該パネル部材の少なく
とも一部に蒸発型ゲッタ剤によるゲッタ膜を被着させる
ゲッタ処理を施すことを特徴とする画像表示パネルの製
造方法を提供するものである。According to a first aspect of the present invention, a set of panel members constituting an image display panel are sequentially conveyed to a plurality of depressurized processing chambers including at least a getter processing chamber to perform a predetermined processing. In the method of manufacturing an image display panel, wherein the set of panel members that have undergone the sealing process is formed into an image display panel, at least a part of the set of panel members is gettered prior to the sealing process. Each time a new panel member is fed into the getter treatment chamber while being transported to the treatment chamber, the evaporation type getter is applied to at least a part of the fed panel member through the same mask provided in the getter treatment chamber. A method for manufacturing an image display panel, characterized in that a getter process for depositing a getter film with an agent is performed.

【００１１】上記本発明の第１は、前記一組のパネル部
材が、蛍光体を有するフェースプレートと、電子源を有
するリアプレートとを備えており、前記ゲッタ処理室に
前記フェースプレートと前記リアプレートの少なくとも
一方を搬送し、前記ゲッタ処理室におけるゲッタ処理
を、前記フェースプレートと前記リアプレートの少なく
とも一方の内面に対して行うこと、前記ゲッタ処理室に
おけるゲッタ処理を、ゲッタ処理を施す前記フェースプ
レート及び／又は前記リアプレートの周縁部を前記マス
クで遮蔽して行い、前記封着処理を、隙間を持たせて向
かい合わせた前記フェースプレートと前記リアプレート
の前記周縁部を封着することで行うこと、前記ゲッタ処
理室に少なくともフェースプレートを搬送し、ゲッタ処
理をフェースプレートに対して行うこと、前記フェース
プレートが、ブラックマトリクスを有し、前記ゲッタ処
理室におけるゲッタ処理を、前記ブラックマトリクス以
外の箇所を前記マスクで遮蔽して行うこと、前記一組の
パネル部材が、前記封着処理時に前記フェースプレート
と前記リアプレートの周縁部間に介在される外枠をも備
えていること、前記外枠を、予め前記リアプレートの周
縁部に固定しておくこと、前記一組のパネル部材が、前
記封着処理時に前記フェースプレートと前記リアプレー
トの中央部間に介在されるスペーサをも備えているこ
と、前記スペーサを、予め前記リアプレートに固定して
おくこと、前記ゲッタ処理室へ搬送するパネル部材につ
いては前記ゲッタ処理室への搬送に先立ち、前記ゲッタ
処理室を経ないで前記封着処理を行う封着処理室へ搬送
するパネル部材については前記封着処理室への搬送に先
立ち、それぞれベーク処理室へ搬送し、ベーク処理を施
すこと、前記ベーク処理室でベーク処理された前記パネ
ル部材を前記ゲッタ処理室へ搬送する前に他の処理室に
搬送し、該他の処理室で前記パネル部材を降温させるこ
と、前記他の処理室が、前記パネル部材に表面浄化処理
を施す表面浄化処理室であること、前記表面浄化処理室
における表面浄化処理が、搬入したパネル部材の表面に
電子線を照射する処理であること、前記表面浄化処理室
における表面浄化処理が、搬入したパネル部材の表面に
イオンを照射する処理であること、前記表面浄化処理室
における表面浄化処理が、搬入したパネル部材の表面に
紫外線を照射する処理であること、前記表面浄化処理室
における表面浄化処理が、搬入したパネル部材の表面に
プラズマを照射する処理であること、をその好ましい態
様として含むものである。According to the first aspect of the present invention, the set of panel members includes a face plate having a phosphor and a rear plate having an electron source, and the face plate and the rear are provided in the getter processing chamber. The face that carries at least one of the plates, performs getter processing in the getter processing chamber on the inner surface of at least one of the face plate and the rear plate, and performs getter processing in the getter processing chamber. The peripheral edge of the plate and / or the rear plate is shielded by the mask, and the sealing is performed by sealing the peripheral edge of the face plate and the peripheral edge of the rear plate facing each other with a gap. Perform at least the face plate into the getter processing chamber to perform getter processing. The face plate has a black matrix, and the gettering process in the gettering chamber is performed by shielding the parts other than the black matrix with the mask, and the set of panel members comprises: An outer frame interposed between the peripheral portions of the face plate and the rear plate at the time of the sealing process, the outer frame being fixed to the peripheral portion of the rear plate in advance, The pair of panel members also includes a spacer interposed between the center portions of the face plate and the rear plate during the sealing process, the spacer being fixed to the rear plate in advance, Regarding the panel member to be transferred to the getter processing chamber, the sealing process is performed before the transfer to the getter processing chamber without passing through the getter processing chamber. Regarding the panel member to be transferred to the processing chamber, prior to the transfer to the sealing processing chamber, the panel member is transferred to the bake processing chamber and subjected to a baking process, and the panel member baked in the bake processing chamber is subjected to the getter process. Before being transferred to a chamber, the panel member is transferred to another processing chamber and the temperature of the panel member is lowered in the other processing chamber, and the other processing chamber is a surface cleaning processing chamber that performs a surface cleaning process on the panel member. That, the surface purification treatment in the surface purification treatment chamber is a treatment of irradiating the surface of the loaded panel member with an electron beam, the surface purification treatment in the surface purification treatment chamber, ions on the surface of the loaded panel member. That the surface purification treatment in the surface purification treatment chamber is a treatment of irradiating the surface of the panel member carried in with ultraviolet rays; The surface purifying treatment is a treatment of irradiating the surface of the carried-in panel member with plasma as a preferable mode.

【００１２】また、本発明の第２は、画像表示パネルを
構成する一組のパネル部材を、少なくともゲッタ処理室
を含む減圧された複数の処理室に順次搬送し、所定の処
理を経た前記一組のパネル部材を封着処理して画像表示
パネルを形成する画像表示パネルの製造方法において、
前記一組のパネル部材を、前記封着処理に先立ってゲッ
タ処理室に搬送すると共に、該ゲッタ処理室において、
新たな一組のパネル部材が送り込まれる都度、前記ゲッ
タ処理室に設けられた同じマスクを介して、送り込まれ
た該一組のパネル部材の少なくとも一部に蒸発型ゲッタ
剤によるゲッタ膜を被着させるゲッタ処理を施すことを
特徴とする画像表示パネルの製造方法を提供するもので
ある。In a second aspect of the present invention, a set of panel members constituting an image display panel is sequentially conveyed to a plurality of depressurized processing chambers including at least a getter processing chamber, and a predetermined processing is performed. In a method of manufacturing an image display panel, which comprises sealing the pair of panel members to form an image display panel,
The set of panel members is conveyed to the getter processing chamber prior to the sealing process, and in the getter processing chamber,
Each time a new set of panel members is sent, a getter film made of an evaporative getter agent is applied to at least a part of the set of panel members sent through the same mask provided in the getter processing chamber. The present invention provides a method for manufacturing an image display panel, characterized by performing a getter process.

【００１３】上記本発明の第２は、前記一組のパネル部
材が、蛍光体を有するフェースプレートと、電子源を有
するリアプレートとを備えており、前記ゲッタ処理室に
おけるゲッタ処理を、前記フェースプレートと前記リア
プレートの少なくとも一方の内面に対して行うこと、前
記ゲッタ処理室におけるゲッタ処理を、ゲッタ処理を施
す前記フェースプレート及び／又は前記リアプレートの
周縁部を前記マスクで遮蔽して行い、前記封着処理を、
隙間を持たせて向かい合わせた前記フェースプレートと
前記リアプレートの前記周縁部を封着することで行うこ
と、前記ゲッタ処理を前記フェースプレートに対して行
うこと、前記フェースプレートが、ブラックマトリクス
を有し、前記ゲッタ処理室におけるゲッタ処理を、前記
ブラックマトリクス以外の箇所を前記マスクで遮蔽して
行うこと、前記一組のパネル部材が、前記封着処理時に
前記フェースプレートと前記リアプレートの周縁部間に
介在される外枠をも備えていること、前記外枠を、予め
前記リアプレートの周縁部に固定しておくこと、前記一
組のパネル部材が、前記封着処理時に前記フェースプレ
ートと前記リアプレートの中央部間に介在されるスペー
サをも備えていること、前記スペーサを、予め前記リア
プレートに固定しておくこと、前記一組のパネル部材
を、前記ゲッタ処理室への搬送に先立ち、ベーク処理室
へ搬送し、ベーク処理を施すこと、前記ベーク処理室で
ベーク処理された前記パネル部材を前記ゲッタ処理室へ
搬送する前に他の処理室に搬送し、該他の処理室で前記
パネル部材を降温させること、前記他の処理室が、前記
パネル部材に表面浄化処理を施す表面浄化処理室である
こと、前記表面浄化処理室における表面浄化処理が、搬
入したパネル部材の表面に電子線を照射する処理である
こと、前記表面浄化処理室における表面浄化処理が、搬
入したパネル部材の表面にイオンを照射する処理である
こと、前記表面浄化処理室における表面浄化処理が、搬
入したパネル部材の表面に紫外線を照射する処理である
こと、前記表面浄化処理室における表面浄化処理が、搬
入したパネル部材の表面にプラズマを照射する処理であ
ること、をその好ましい態様として含むものである。According to a second aspect of the present invention, the set of panel members includes a face plate having a phosphor and a rear plate having an electron source, and the getter treatment in the getter treatment chamber is performed by the face. Performing on the inner surface of at least one of the plate and the rear plate, the gettering process in the gettering chamber is performed by shielding the peripheral portion of the face plate and / or the rear plate to which the gettering process is applied with the mask, The sealing process,
Sealing the peripheral portions of the face plate and the rear plate facing each other with a gap therebetween, performing the getter process on the face plate, and the face plate having a black matrix. Then, the gettering process in the gettering chamber is performed by shielding the portions other than the black matrix with the mask, and the pair of panel members is provided with a peripheral portion of the face plate and the rear plate during the sealing process. An outer frame interposed therebetween; the outer frame being fixed to the peripheral portion of the rear plate in advance; and the pair of panel members being the face plate during the sealing process. The rear plate is also provided with a spacer interposed between the central portions, and the spacer is fixed to the rear plate in advance. Prior to the transfer to the getter processing chamber, the set of panel members is transferred to a bake processing chamber and subjected to a baking process, and the panel member baked in the bake processing chamber is subjected to the getter processing. Before being transferred to a chamber, the panel member is transferred to another processing chamber and the temperature of the panel member is lowered in the other processing chamber, and the other processing chamber is a surface cleaning processing chamber that performs a surface cleaning process on the panel member. That, the surface purification treatment in the surface purification treatment chamber is a treatment of irradiating the surface of the loaded panel member with an electron beam, the surface purification treatment in the surface purification treatment chamber, ions on the surface of the loaded panel member. That the irradiation is a treatment, that the surface purification treatment in the surface purification treatment chamber is a treatment that irradiates the surface of the carried-in panel member with ultraviolet rays, Purification process, it is a process of irradiating plasma on the surface of the loading panels member, it is intended to include the preferred embodiments thereof with.

【００１４】特に以上の各発明において、ゲッタ処理室
の圧力は、前記ゲッタ処理の後新たなパネル部材が導入
されるときまで、ゲッタ処理室直前の部屋の該導入時の
圧力よりも低い状態に維持されると好適である。In particular, in each of the above inventions, the pressure in the getter processing chamber is lower than the pressure at the time of introduction in the room immediately before the getter processing chamber until a new panel member is introduced after the getter processing. It is preferably maintained.

【００１５】また、前記封着処理は前記ゲッタ処理室と
は別個に設けた封着処理室で行うと好適である。It is preferable that the sealing process is performed in a sealing process chamber provided separately from the getter processing chamber.

【００１６】[0016]

【発明の実施の形態】以下、図面に基づいて本発明を更
に説明する。BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be further described below with reference to the drawings.

【００１７】図１は、本発明の製造方法に用いる製造装
置の一例と共に、この製造装置におけるパネル部材の温
度プロファイル及び各処理室間の真空度プロファイルを
模式的に示した図である。FIG. 1 is a diagram schematically showing an example of a manufacturing apparatus used in the manufacturing method of the present invention, and a temperature profile of a panel member and a vacuum degree profile between processing chambers in this manufacturing apparatus.

【００１８】図１において、１〜４は、画像表示パネル
５を構成する一組のパネル部材で、１は、画像表示パネ
ル５の背面を構成するリアプレート（以後ＲＰと表記す
る）である。本例におけるＲＰ１は、蛍光体励起手段と
して、複数の電子放出素子がマトリクス配置された電子
源を有するものとなっている。２は、画像表示パネル５
の前面を構成するフェィスプレート（以後ＦＰと表記す
る）である。本例におけるＦＰ２は、蛍光体、メタルバ
ックなどが形成されたものとなっている。３は、画像表
示パネル５の側面を構成する外枠であり、ＲＰ１とＦＰ
２の間に配置され、ＲＰ１及びＦＰ２と共に板状気密容
器である画像表示パネル５を構成する。４はスペーサで
あり、ＲＰ１とＦＰ２との間隔を維持するものである。
本例では、外枠３は、予めＲＰ１の内面側周縁部に固定
され、スペーサ４は、予めＲＰ１の内面側中央部に固定
されている。また、外枠３の端面には、予め封着材６が
設けられている。In FIG. 1, 1 to 4 are a set of panel members constituting the image display panel 5, and 1 is a rear plate (hereinafter referred to as RP) constituting the back surface of the image display panel 5. The RP1 in this example has an electron source, in which a plurality of electron-emitting devices are arranged in a matrix, as a phosphor excitation means. 2 is an image display panel 5
Is a face plate (hereinafter referred to as FP) that constitutes the front surface of the. The FP2 in this example is formed with a phosphor, a metal back, and the like. Reference numeral 3 denotes an outer frame which constitutes a side surface of the image display panel 5, and includes RP1 and FP.
The image display panel 5, which is a plate-like airtight container, is arranged between the two and the RP1 and FP2. Reference numeral 4 denotes a spacer, which maintains the distance between RP1 and FP2.
In this example, the outer frame 3 is fixed to the inner peripheral edge of the RP1 in advance, and the spacer 4 is fixed to the inner central portion of the RP1 in advance. A sealing material 6 is provided on the end surface of the outer frame 3 in advance.

【００１９】図１に示される製造装置は、内部を減圧で
きる複数の処理室を、当該処理室間に上記一組のパネル
部材１〜４を搬送可能な状態に接続したもので、７は前
処理室、８はベーク処理室、９は表面浄化処理室、１０
はゲッタ処理室、１１は封着室、１２は後処理室であ
る。この各処理室は、パネル部材１〜４の搬送方向に図
示される順で直列に配列されて接続されており、それぞ
れ不図示の真空ポンプで排気されて、必要な真空雰囲気
が形成されている。In the manufacturing apparatus shown in FIG. 1, a plurality of processing chambers whose inside pressure can be reduced is connected so that the set of panel members 1 to 4 can be transported between the processing chambers. Treatment chamber, 8 a bake treatment chamber, 9 a surface purification treatment chamber, 10
Is a getter processing chamber, 11 is a sealing chamber, and 12 is a post-processing chamber. The processing chambers are arranged and connected in series in the order shown in the drawing of the panel members 1 to 4 and are exhausted by a vacuum pump (not shown) to form a necessary vacuum atmosphere. .

【００２０】ベーク処理室８、表面浄化処理室９、ゲッ
タ処理室１０及び封着処理室１１は、パネル部材１〜４
を所定の温度に制御するために、温度制御手段１２〜１
９を備えたものとなっている。本例における温度制御手
段１２〜１９は、所望の温度に設定可能なホットプレー
トで構成されている。温度制御手段１２〜１５は、昇降
機２０〜２３にそれぞれ支持されていて昇降可能となっ
ており、ＲＰ１を保持して、ＲＰ１及びこれに固定され
た外枠３及びスペーサ４を所定の温度に制御すると共
に、ＲＰ１を各処理工程に必要な高さに昇降させる機能
を有する。また、温度制御手段１６〜１９は、ＦＰ２を
保持してこれを所定の温度に制御するものとなってい
る。The bake treatment chamber 8, the surface purification treatment chamber 9, the getter treatment chamber 10 and the sealing treatment chamber 11 have panel members 1 to 4 respectively.
In order to control the temperature at a predetermined temperature, temperature control means 12-1
It is equipped with 9. The temperature control means 12 to 19 in this example are composed of hot plates that can be set to desired temperatures. The temperature control means 12 to 15 are respectively supported by the elevators 20 to 23 and can move up and down, hold the RP1, and control the RP1 and the outer frame 3 and the spacer 4 fixed thereto to a predetermined temperature. In addition, it has a function of raising and lowering the RP1 to a height required for each processing step. Further, the temperature control means 16 to 19 hold the FP2 and control it to a predetermined temperature.

【００２１】温度制御手段１３〜２０としてホットプレ
ートを用いる場合、特に上側に位置する温度制御手段１
３〜１６は、ＲＰ１を脱落することなく十分な力で固定
することができるチャックを有するものとすることが好
ましい。このチャックとしては、例えば、ＲＰ１の周辺
をツメなどで機械的に掴む機械方式、静電気により吸着
する静電方式、真空吸引により吸着する真空方式などの
ものを用いることができる。When a hot plate is used as the temperature control means 13 to 20, the temperature control means 1 located particularly on the upper side is used.
It is preferable that 3 to 16 have a chuck that can fix RP1 with sufficient force without dropping it. As this chuck, for example, a mechanical system in which the periphery of RP1 is mechanically gripped by a claw or the like, an electrostatic system in which it is adsorbed by static electricity, or a vacuum system in which it is adsorbed by vacuum suction can be used.

【００２２】前処理室７及び後処理室１２と大気間、並
びに、各処理室の間は、ゲートバルブ２５〜３１で隔て
られている。パネル部材１〜４は、ゲートバルブ２５〜
３１を開閉させて、前処理室７に搬入されてた後、ベー
ク処理室８、表面浄化処理室９、ゲッタ処理室１０、封
着処理室１１、後処理室１２へと順次搬送され、後処理
室１２から搬出されるものである。尚、３２は、パネル
部材１〜４を各処理室へと移動させるための搬送ローラ
ーである。The pre-treatment chamber 7 and the post-treatment chamber 12 are separated from the atmosphere, and the respective treatment chambers are separated by gate valves 25 to 31. The panel members 1 to 4 are gate valves 25 to
After opening and closing 31 and being carried into the pretreatment chamber 7, the baking treatment chamber 8, the surface purification treatment chamber 9, the getter treatment chamber 10, the sealing treatment chamber 11, and the posttreatment chamber 12 are sequentially conveyed, and It is carried out from the processing chamber 12. In addition, 32 is a conveyance roller for moving the panel members 1 to 4 to each processing chamber.

【００２３】前処理室７は、ゲートバルブ２６を閉じ、
内部が大気圧となった状態でゲートバルブ２５を開き、
パネル部材１〜４が搬入された後、ゲートバルブ２５を
閉じて内部を所定の減圧状態まで排気してからゲートバ
ルブ２６を開いて、パネル部材１〜４をベーク処理室８
へと送り出すもので、パネル部材１〜４の搬入によっ
て、ベーク処理室８以降の処理室の真空雰囲気が損なわ
れないようにするためのものである。前処理室７は、パ
ネル部材１〜４をベーク処理室８へ送り出した後、ゲー
トバルブ２６を閉じて、再度大気圧まで徐々に昇圧され
て、次のパネル部材１〜４の搬入に備えることになる。In the pretreatment chamber 7, the gate valve 26 is closed,
Open the gate valve 25 while the inside is at atmospheric pressure,
After the panel members 1 to 4 are carried in, the gate valve 25 is closed to evacuate the inside to a predetermined depressurized state, and then the gate valve 26 is opened to open the panel members 1 to 4 in the baking processing chamber 8
It is intended to prevent the vacuum atmosphere in the processing chambers after the bake processing chamber 8 from being damaged by the loading of the panel members 1 to 4. After the panel members 1 to 4 are sent out to the bake processing chamber 8, the pretreatment chamber 7 closes the gate valve 26 and is gradually pressurized to the atmospheric pressure again to prepare for the next panel member 1 to 4 loading. become.

【００２４】ベーク処理室８は、温度制御手段１３，１
７によってパネル部材１〜４を加熱し、パネル部材１〜
４に付着又は吸着されている水分、ガスなどを放出させ
るベーク処理を行うためのものである。The bake processing chamber 8 has temperature control means 13, 1
The panel members 1 to 4 are heated by 7 and the panel members 1 to 4 are heated.
The purpose is to perform a baking process for releasing the water, gas, etc. attached or adsorbed on 4.

【００２５】表面浄化処理室９は、パネル部材１〜４の
表面に電子線、イオン、紫外線あるいはプラズマを照射
することで、吸着不純物のガス脱離による表面浄化処理
を行うためのものである。本例におけるこの表面浄化処
理室９は、電子銃３３が設けられており、電子線の照射
によって表面浄化処理を行うものとなっているが、上記
イオンの照射、紫外線の照射あるいはプラズマの照射に
よりパネル部材１〜４の表面を浄化する表面浄化処理を
行うものとすることもできる。尚、３４は、電子銃３３
から照射された電子線である。The surface cleaning chamber 9 is for performing a surface cleaning process by desorbing adsorbed impurities by irradiating the surfaces of the panel members 1 to 4 with an electron beam, ions, ultraviolet rays or plasma. The surface cleaning processing chamber 9 in the present example is provided with an electron gun 33 and performs the surface cleaning processing by irradiation of an electron beam. However, by irradiation of the above-mentioned ions, irradiation of ultraviolet rays or irradiation of plasma. It is also possible to perform a surface cleaning treatment for cleaning the surfaces of the panel members 1 to 4. Incidentally, 34 is an electron gun 33.
It is an electron beam emitted from.

【００２６】ゲッタ処理室１０は、パネル部材１〜４を
組み合わせて封着した後の画像表示パネル５内の真空度
を維持もしくは向上させる目的で、全部又は一部のパネ
ル部材１〜４について、画像表示パネル５の内側に露出
する表面の一部に、蒸発型ゲッタ剤でゲッタ膜を被着さ
せるゲッタ処理を行うためのものである。３５は、ゲッ
タフラッシュ装置３６から発生されるゲッタフラッシュ
であり、Ｂａなどの蒸発型ゲッタ剤を瞬間的に蒸発させ
たものである。本例では、ゲッタ膜をＦＰ２の内面に被
着させるものとなっている。The getter processing chamber 10 includes all or some of the panel members 1 to 4 for the purpose of maintaining or improving the degree of vacuum in the image display panel 5 after the panel members 1 to 4 are combined and sealed. This is for performing a gettering process of depositing a getter film with an evaporation type gettering agent on a part of the surface exposed inside the image display panel 5. Reference numeral 35 denotes a getter flash generated from the getter flash device 36, which is obtained by instantaneously evaporating an evaporative getter agent such as Ba. In this example, the getter film is deposited on the inner surface of the FP2.

【００２７】また、ゲッタ処理室１０内には、ゲッタ処
理するパネル部材１〜４の不必要な部分へのゲッタ膜の
被着を防止するためのマスク３７が設けられている。図
示される例においては、ＦＰ２の内面上にマスク３７が
位置しており、このマスク３７を介して上記ゲッタ処理
が行われるものとなっている。本発明におけるゲッタ処
理は、ゲッタ処理室１０に新たなパネル部材１〜４が搬
送されてくる都度、同じマスク３７を用いてゲッタ処理
が行われるものである。A mask 37 is provided in the getter processing chamber 10 to prevent the getter film from being deposited on unnecessary portions of the panel members 1 to 4 which are to be getter processed. In the illustrated example, the mask 37 is located on the inner surface of the FP2, and the getter process is performed via the mask 37. In the getter processing according to the present invention, the getter processing is performed using the same mask 37 each time new panel members 1 to 4 are transferred to the getter processing chamber 10.

【００２８】封着処理室１１は、パネル部材１〜４を、
軟化もしくは溶融した封着材６を用いて封着し、画像表
示パネル５を組み上げる処理を行うためのもので、図示
される例においては、封着室処理１１内においてパネル
部材１〜４のアライメントも行われるが、パネル部材１
〜４のアライメントを、ゲッタ処理室１０と封着処理室
間に別の処理室（アライメント処理室）を設け、そこで
行うようにすることもできる。In the sealing processing chamber 11, the panel members 1 to 4 are
This is for performing a process of assembling the image display panel 5 by sealing using the softened or melted sealing material 6. In the illustrated example, the alignment of the panel members 1 to 4 in the sealing chamber process 11 is performed. Also performed, but the panel member 1
It is also possible to provide another process chamber (alignment process chamber) between the getter process chamber 10 and the sealing process chamber and perform the alignments 4 to 4 there.

【００２９】後処理室１２は、ゲートバルブ３１が閉じ
られ、内部が低圧に排気された状態でゲートバルブ３０
を開いて封着処理室１１から画像表示パネル５を受け入
れ、ゲートバルブ３０を閉じた後、徐々にリークさせて
内部を大気圧にまで昇圧すると共に、画像表示パネル５
を冷却した後、ゲートバルブ３１を開いて画像表示パネ
ル５を装置外へ送り出すもので、画像表示パネル５の搬
出によって封着処理室１１の真空雰囲気が大きく損なわ
れないようにすると共に、画像表示パネル５を取り出し
可能な温度まで冷却するためのものである。後処理室１
２は、画像表示パネル５を搬出した後、ゲートバルブ３
１を閉じて、再度元の低圧状態にまで排気されて、次の
画像表示パネル５の受け入れに備えることになる。In the post-treatment chamber 12, the gate valve 31 is closed and the inside of the post-treatment chamber 12 is evacuated to a low pressure.
Open to receive the image display panel 5 from the sealing processing chamber 11, close the gate valve 30, and then gradually leak the air to raise the pressure to the atmospheric pressure.
After cooling, the gate valve 31 is opened and the image display panel 5 is sent out of the apparatus, so that the vacuum atmosphere of the sealing processing chamber 11 is not greatly impaired by carrying out the image display panel 5 and the image display is performed. This is for cooling the panel 5 to a temperature at which it can be taken out. Aftertreatment room 1
2 is the gate valve 3 after carrying out the image display panel 5.
1 is closed, the original low pressure state is exhausted again, and the next image display panel 5 is ready to be received.

【００３０】本例においては、一組のパネル部材１〜４
を、搬送手段である搬送ローラ３２の駆動によって、順
次矢印方向に搬送されて各処理室を通過し、この通過中
に各種の処理が施される。In this example, a set of panel members 1 to 4 is used.
Are sequentially transported in the direction of the arrow by the transport roller 32, which is a transport unit, to pass through the respective processing chambers, and various processing is performed during the transport.

【００３１】本例においては、まず、ゲートバルブ２６
が閉じた状態で前処理室７を大気圧とし、ゲートバルブ
２５を開いて、予め電子源が配置され、外枠３及びスペ
ーサ４が所定の位置に取り付けられたＲＰ１と、予め蛍
光体及びメタルバックが配置されたＦＰ２とを搬入し、
ゲートバルブ２５を閉じて前処理室７内を所定の真空雰
囲気とした後に、ゲートバルブ２６を開いて、パネル部
材１〜４をベーク処理室８へ送り出す。以降、外枠及び
スペーサ４を有するＲＰ１、ＦＰ２の搬送に際して、対
応する処理室間のゲートバルブ２６〜３１を順次、開
放、遮断する。尚、外枠３の端面には、前述したとお
り、予め封着材６が設けられている。In this example, first, the gate valve 26
The pretreatment chamber 7 is set to atmospheric pressure in a closed state, the gate valve 25 is opened, the electron source is arranged in advance, the outer frame 3 and the spacer 4 are attached at predetermined positions, and the RP1 and the phosphor and the metal are arranged in advance. Bring in the FP2 with the back placed,
After closing the gate valve 25 to create a predetermined vacuum atmosphere in the pretreatment chamber 7, the gate valve 26 is opened and the panel members 1 to 4 are sent to the bake treatment chamber 8. After that, when the RP1 and FP2 having the outer frame and the spacer 4 are conveyed, the gate valves 26 to 31 between the corresponding processing chambers are sequentially opened and closed. As described above, the sealing material 6 is provided on the end surface of the outer frame 3 in advance.

【００３２】上記のＲＰ１とＦＰ２の搬入に際しては、
搬送用の治具に上記のＲＰ１とＦＰ２とを配置し、ＲＰ
１とＦＰ２間に間隔が形成されるようにしてある。尚、
搬入及び搬送は、治具を用いることに限るものではな
く、ＲＰ１及びＦＰ２をそのまま装置本体側の支持搬送
ユニットで搬送することも可能である。When carrying in the above RP1 and FP2,
Place the above RP1 and FP2 on the jig for transportation, and
A space is formed between 1 and FP2. still,
The carrying in and the carrying are not limited to using the jig, and the RP1 and FP2 can be carried as they are by the supporting and carrying unit on the apparatus main body side.

【００３３】前処理室７におけるパネル部材１〜４の温
度は、通常、室温であるが、ベーク処理室８におけるベ
ーク処理のための予熱を行うこともできる。また、前処
理室１は、ベーク処理室８の必要な真空雰囲気を維持し
やすくするために、ゲートバルブ２６を開いてパネル部
材１〜４をベーク処理室８へ送り出す前に１０^-4Ｐａ以
下に減圧することが好ましく、１０^-5Ｐａ以下に減圧す
ることが更に好ましい。図示される例においては、ゲー
トバルブ２６を開く前に、前処理室７を１０^-5Ｐａまで
減圧している。The temperature of the panel members 1 to 4 in the pretreatment chamber 7 is usually room temperature, but preheating for the bake treatment in the bake treatment chamber 8 can also be performed. In addition, in order to make it easier to maintain the necessary vacuum atmosphere in the bake treatment chamber 8, the pretreatment chamber 1 has a pressure of 10 ⁻⁴ Pa or less before opening the gate valve 26 and sending the panel members 1 to 4 into the bake treatment chamber 8. The pressure is preferably reduced to 10 ^-5 Pa or less, and more preferably to 10 ^-5 Pa or less. In the illustrated example, the pretreatment chamber 7 is depressurized to 10 ⁻⁵ Pa before opening the gate valve 26.

【００３４】次いで、パネル部材１〜４は、ベーク処理
室８に搬送され、ベーク処理が施される。Next, the panel members 1 to 4 are conveyed to the bake treatment chamber 8 and subjected to a bake treatment.

【００３５】図示される例においては、ベーク処理室８
に搬送されたパネル部材１〜４のＲＰ１が温度制御手段
１３に取り付け保持されると共に、ＦＰ２が温度制御手
段１７に取り付け保持され、ゲートバルブ２６と２７を
閉じた状態で、温度制御手段１３，１７によりパネル部
材１〜４が加熱され、ベーク処理が施される。In the illustrated example, the baking chamber 8
The RP1 of the panel members 1 to 4 conveyed to the temperature control means 13 is attached and held by the temperature control means 13, and the FP2 is attached and held by the temperature control means 17, and the gate valves 26 and 27 are closed. The panel members 1 to 4 are heated by 17 and baked.

【００３６】ベーク処理は、パネル部材１〜４を損傷す
ることなく、吸着されている水素、酸素、水などの不純
物をガスとして放出させることができるよう、パネル部
材１〜４を３００℃〜４００℃に加熱することが好まし
く、３５０℃〜３８０℃に加熱することが更に好まし
い。また、ベーク処理室８は、パネル部材１〜４から放
出される水分やガス成分などによって真空度が低下する
が、このベーク処理室８に続く表面浄化処理室９におい
て要求される真空度を維持しやすくするために、少なく
ともパネル部材１〜４を表面浄化処理室９へ送り出す前
に、１０^-4Ｐａ以下に減圧することが好ましい。図面に
示される例においては、パネル部材１〜４を３８０℃ま
で加熱すると共に、ベーク処理室８内を１０^-4Ｐａまで
減圧している。The baking treatment is performed at 300 ° C. to 400 ° C. on the panel members 1 to 4 so that the adsorbed impurities such as hydrogen, oxygen and water can be released as a gas without damaging the panel members 1 to 4. It is preferable to heat to 0 ° C, and it is more preferable to heat to 350 ° C to 380 ° C. Further, the degree of vacuum of the bake treatment chamber 8 is lowered by the moisture and gas components released from the panel members 1 to 4, but the required degree of vacuum is maintained in the surface cleaning treatment chamber 9 following the bake treatment chamber 8. In order to make it easy, it is preferable to reduce the pressure to 10 ⁻⁴ Pa or less at least before sending out the panel members 1 to 4 to the surface purification treatment chamber 9. In the example shown in the drawings, the panel members 1 to 4 are heated to 380 ° C., and the inside of the baking processing chamber 8 is depressurized to 10 ⁻⁴ Pa.

【００３７】上記ベーク処理室８におけるベーク処理が
施されたパネル部材１〜４は、次の表面浄化処理室９に
搬送され、降温されながら、表面浄化処理を受ける。The panel members 1 to 4 which have been subjected to the baking treatment in the baking treatment chamber 8 are conveyed to the next surface purification treatment chamber 9 and subjected to the surface purification treatment while being cooled.

【００３８】図示される例においては、パネル部材１〜
４は、温度制御手段１３，１７から外されて、表面浄化
処理室９へ搬送され、ＲＰ１を温度制御手段１４に取り
付け保持し、ＦＰ２を温度制御手段１８に取り付け保持
した後、昇降機２２によってＲＰ１を表面浄化処理室９
の上部に移動させて、ＲＰ１とＦＰ２の間隔を広げ、Ｒ
Ｐ１とＦＰ２の間に位置する電子銃３２から電子線をＲ
Ｐ１とＦＰに照射することで、両者の表面浄化処理が行
われる。In the illustrated example, the panel members 1 to 1
4 is removed from the temperature control means 13 and 17 and is conveyed to the surface purification processing chamber 9, where RP1 is attached and held to the temperature control means 14 and FP2 is attached and held to the temperature control means 18, and then the RP1 is lifted by the elevator 22. Surface purification treatment room 9
To the upper part of the RP1 to widen the space between RP1 and FP2,
R electron beam from the electron gun 32 located between P1 and FP2
By irradiating P1 and FP, both surfaces are cleaned.

【００３９】表面浄化処理室９における表面浄化処理
は、パネル部材１〜４の温度が比較的高い方が効果的で
あり、ベーク処理室８の直後にこの表面浄化処理室９を
接続しておくと、ベーク処理室８における加熱の余熱を
利用して効果的な表面浄化処理を行いやすいので好まし
い。The surface purification treatment in the surface purification treatment chamber 9 is effective when the temperature of the panel members 1 to 4 is relatively high, and the surface purification treatment chamber 9 is connected immediately after the baking treatment chamber 8. It is preferable that the effective surface cleaning treatment is easily performed by utilizing the residual heat of the heating in the baking treatment chamber 8.

【００４０】表面浄化処理は、外枠３及びスペーサ４を
有するＲＰ１とＦＰ２の両方に対して行うことが好まし
いが、いずれか一方のみに対して行うこともできる。ま
た、表面浄化処理は、ＲＰ１及びＦＰ２に限らず、表面
浄化処理室９の任意の領域に対して行うこともできる。
表面浄化処理室９内に電子線などを照射することによ
り、ベーク処理及び表面浄化処理によってパネル部材１
〜４から脱離したガスをイオン化し、次のゲッタ処理室
１０における処理で説明する残留ゲッタ膜への吸着を促
進することができる。The surface cleaning treatment is preferably performed on both RP1 and FP2 having the outer frame 3 and the spacer 4, but can be performed on only one of them. Further, the surface purification treatment is not limited to RP1 and FP2, and can be performed on any area of the surface purification treatment chamber 9.
By irradiating the surface purification treatment chamber 9 with an electron beam or the like, the panel member 1 is subjected to a baking treatment and a surface purification treatment.
It is possible to ionize the gas desorbed from 4 to 4 and promote the adsorption to the residual getter film described in the next treatment in the getter treatment chamber 10.

【００４１】表面浄化処理室９における温度制御手段１
４，１８の設定温度は、ベーク処理室８における温度制
御手段１３，１７の設定温度より低い温度となってお
り、パネル部材１〜４を冷却して、表面浄化処理室９か
ら次のゲッタ処理室１０へ運び出すときのパネル部材１
〜４の温度を、表面浄化処理室９へ運び入れたときの温
度より下げることができるようになっている。このパネ
ル部材１〜４の降温は、次のゲッタ処理室１０において
被着されるゲッタ膜が熱劣化するのを防止するためのも
のである。Temperature control means 1 in the surface purification processing chamber 9
The set temperatures of 4 and 18 are lower than the set temperatures of the temperature control means 13 and 17 in the bake processing chamber 8, the panel members 1 to 4 are cooled, and the next getter processing is performed from the surface cleaning processing chamber 9. Panel member 1 when carried out to the chamber 10
The temperatures of 4 to 4 can be made lower than the temperature at which they are carried into the surface purification treatment chamber 9. The temperature decrease of the panel members 1 to 4 is for preventing the getter film deposited in the next getter processing chamber 10 from being thermally deteriorated.

【００４２】表面浄化処理室９は、この表面浄化処理室
９に続くゲッタ処理室１０において要求される真空度を
維持しやすくするために、少なくともパネル部材１〜４
をゲッタ処理室１０へ送り出す前に、１０^-4Ｐａ以下に
減圧することが好ましく、１０^-5Ｐａ以下に減圧するこ
とが更に好ましい。図面に示される例においては、３８
０℃で搬入されたパネル部材１〜４を１００℃まで降温
させると共に、表面浄化処理室９内を１０^-5Ｐａまで減
圧している。At least the panel members 1 to 4 are provided in the surface purification treatment chamber 9 in order to easily maintain the degree of vacuum required in the getter treatment chamber 10 following the surface purification treatment chamber 9.
Before being sent to the getter processing chamber 10, the pressure is preferably reduced to 10 ⁻⁴ Pa or less, more preferably 10 ⁻⁵ Pa or less. In the example shown in the drawings, 38
The panel members 1 to 4 carried in at 0 ° C. are cooled to 100 ° C., and the inside of the surface purification treatment chamber 9 is depressurized to 10 ⁻⁵ Pa.

【００４３】図示される例においては、前処理室７に続
いて、ベーク処理室８と表面浄化処理室９が設けられて
いるが、ベーク処理室８を省略して、前処理室７と表面
浄化処理室９を直接接続したり、表面浄化処理室９を設
けることなく、ベーク処理室８とゲッタ処理室１０を直
接接続したり、両者を設けることなく、前処理室７を直
接ゲッタ処理室１０に接続することもできる。但し、封
着後の画像表示パネル５内でのガスの発生を抑制する上
で、少なくともベーク処理室８は設けることが好まし
い。また、ベーク処理室８を設ける場合、上記表面浄化
処理室９を介在させておくと、封着後の画像表示パネル
５内でのガスの発生を更に抑制しやすくなるだけでな
く、ゲッタ処理室１０で被着されるゲッタ膜の熱劣化防
止のための降温制御が行いやすいので、表面浄化処理室
９を設けることが好ましい。このゲッタ膜の熱劣化防止
ののための降温制御の観点からすれば、上記表面浄化処
理室８の代わりに、パネル部材１〜４の冷却処理だけを
行う冷却処理室（図示されていない）を介在させること
もできる。また、ベーク処理室８とゲッタ処理室１０の
間に表面浄化処理室９を介在させると共に、ベーク処理
室８と表面浄化処理室９の間や表面浄化処理室９とゲッ
タ処理室１０の間に上記冷却処理室を介在させ、上記降
温制御を更に行いやすくすることもできる。In the illustrated example, the pretreatment chamber 7 is followed by a bake treatment chamber 8 and a surface cleaning treatment chamber 9, but the bake treatment chamber 8 is omitted and the pretreatment chamber 7 and the surface are removed. The pretreatment chamber 7 is directly connected to the pretreatment chamber 7 without directly connecting the purification treatment chamber 9 or directly connecting the bake treatment chamber 8 and the getter treatment chamber 10 without providing the surface purification treatment chamber 9. It can also be connected to 10. However, in order to suppress the generation of gas in the image display panel 5 after sealing, it is preferable to provide at least the baking processing chamber 8. When the bake processing chamber 8 is provided, interposing the surface cleaning processing chamber 9 not only facilitates further suppression of gas generation in the image display panel 5 after sealing, but also the getter processing chamber. It is preferable to provide the surface purification treatment chamber 9 because it is easy to control the temperature decrease for preventing the thermal deterioration of the getter film deposited at 10. From the viewpoint of temperature reduction control for preventing the heat deterioration of the getter film, a cooling treatment chamber (not shown) for performing only the cooling treatment of the panel members 1 to 4 is used instead of the surface purification treatment chamber 8. It is possible to intervene. Further, the surface cleaning processing chamber 9 is interposed between the bake processing chamber 8 and the getter processing chamber 10, and the space between the bake processing chamber 8 and the surface cleaning processing chamber 9 or between the surface cleaning processing chamber 9 and the getter processing chamber 10 is provided. It is also possible to interpose the cooling processing chamber to further facilitate the temperature reduction control.

【００４４】表面浄化処理室９で表面浄化処理を受け、
降温されたパネル部材１〜４は、ゲッタ処理室１０へ搬
送され、ゲッタ処理室１０において、パネル部材１〜４
の全部または一部にマスク３７を介して、蒸発型ゲッタ
剤によるゲッタ処理が施され、マスク３７によって選択
される箇所にゲッタ膜が被着される。これにより、パネ
ル部材１〜４の全部又は一部には、マスク３７によって
選択された箇所にゲッタ膜が被着されると共に、マスク
３７にもゲッタ膜が被着される。このマスク３７に被着
したゲッタ膜は、全部又は一部にゲッタ処理を施したパ
ネル部材１〜４を送り出した後もマスク３７と共にゲッ
タ処理室１０内に留まる残留ゲッタ膜となる。この残留
ゲッタ膜は、次の新たなパネル部材１〜４を受け入れる
ためにゲートバルブ２８を開くことでゲッタ処理室１０
内の真空度が低下したときに、真空度が低下したゲッタ
処理室１０内のガス成分を吸着し、ゲッタ処理室１０内
を所定の低圧に維持しやすくする働きをなす。In the surface purification treatment chamber 9, the surface purification treatment is performed,
The lowered panel members 1 to 4 are conveyed to the getter processing chamber 10, and in the getter processing chamber 10, the panel members 1 to 4 are cooled.
All or a part of the above is subjected to a gettering treatment with an evaporative gettering agent through the mask 37, and a getter film is deposited on a portion selected by the mask 37. As a result, the getter film is deposited on the parts selected by the mask 37 on all or part of the panel members 1 to 4, and the getter film is also deposited on the mask 37. The getter film adhered to the mask 37 becomes a residual getter film that remains in the getter processing chamber 10 together with the mask 37 even after the panel members 1 to 4 which are all or partly subjected to the getter process are sent out. This residual getter film is formed by opening the gate valve 28 to receive the next new panel member 1 to 4.
When the degree of vacuum in the getter processing chamber 10 is reduced, the gas component in the getter processing chamber 10 having the reduced degree of vacuum is adsorbed to facilitate maintaining the inside of the getter processing chamber 10 at a predetermined low pressure.

【００４５】図示される例においては、パネル部材１〜
４は、温度制御手段１４，１８から外されてゲッタ処理
室１０へ搬送され、ＲＰ１が温度制御手段１５に固定さ
れ、ＦＰ２が温度制御手段１９に固定された後、昇降機
２３によってＲＰ１がゲッタ処理室１０の上部に移動さ
れ、ＲＰ１とＦＰ２間の間隔をあけた状態で、ＦＰ２上
にマスク３７を位置させ、ゲッタフラッシュ装置３６内
に内蔵させている蒸発型ゲッタ剤（例えば、バリウムな
どのゲッタ剤）を抵抗加熱などの方法で加熱蒸発させて
パネルゲッタフラッシュ３５を生じさせ、ＦＰ２の内面
に対してマスク３７を介してゲッタ処理を施すものとな
っている。In the illustrated example, the panel members 1 to
4 is removed from the temperature control means 14 and 18 and conveyed to the getter processing chamber 10, RP1 is fixed to the temperature control means 15, FP2 is fixed to the temperature control means 19, and then RP1 is gettered by the elevator 23. The evaporation type getter agent (for example, getter such as barium) which is moved to the upper portion of the chamber 10 and has the mask 37 positioned on the FP2 with the space between the RP1 and the FP2 being opened, is incorporated in the getter flash device 36. The agent) is heated and evaporated by a method such as resistance heating to generate a panel getter flash 35, and a getter process is performed on the inner surface of the FP2 through a mask 37.

【００４６】全部又は一部のパネル部材１〜４に被着さ
せるゲッタ膜の膜厚は、一般的に５ｎｍ〜５００ｎｍ、
好ましくは１０ｎｍ〜２００ｎｍ、より好ましくは、２
０ｎｍ〜２００ｎｍである。The thickness of the getter film applied to all or some of the panel members 1 to 4 is generally 5 nm to 500 nm,
Preferably 10 nm to 200 nm, more preferably 2
It is 0 nm to 200 nm.

【００４７】本例において、表面浄化処理室９から搬入
されるパネル部材１〜４は、前述のようにして降温され
ていることから、ゲッタ処理室１０におけるゲッタ処理
によって全部又は一部のパネル部材１〜４の表面に被着
されたゲッタ膜が、パネル部材１〜４の熱によって劣化
してしまい、封着後の画像表示パネル５内の高真空度維
持のためのゲッタとして機能させにくくなるのを防止す
ることができる。In this example, since the panel members 1 to 4 carried in from the surface purification treatment chamber 9 have been cooled down as described above, all or a part of the panel members are obtained by the getter treatment in the getter treatment chamber 10. The getter films deposited on the surfaces of 1 to 4 are deteriorated by the heat of the panel members 1 to 4, and it becomes difficult to function as a getter for maintaining a high degree of vacuum in the image display panel 5 after sealing. Can be prevented.

【００４８】ゲッタ処理室１０は、そこで全部又は一部
のパネル部材１〜４の表面に被着されるゲッタ膜の機能
維持及びゲッタ処理室１０に続く封着処理室１１を高い
真空度に維持しやすくするために、少なくともゲッタ処
理時に、１０^-5Ｐａ以下の低圧状態に維持されているこ
とが好ましい。また、次の基板が導入されてきた時の真
空度の劣化を抑制する能力（ガス成分の吸着能力）をマ
スクに付着したゲッタが維持できる圧力状態を、ゲッタ
処理後次の基板が導入されてくるときまで維持すると良
い。具体的にはゲッタ処理後次の基板が導入されてくる
ときまで１０^-6Ｐａ以下の低圧状態に維持されていると
好適である。特には、ゲッタ処理後次の基板が導入され
てくるときまでの圧力は、ゲッタ処理室の直前の部屋
(本実施例では表面浄化処理室；その他の処理室もしく
は移動用の部屋がある場合はそれを含む)の圧力よりも
低いとよい。また本発明においては、残留ゲッタ膜の一
部をこの低圧状態の維持に利用できる。以上のようにゲ
ッタ処理室内のゲッタの存在により、ゲッタ処理室１０
内に新たなパネル部材１〜４を受け入れてた後、ゲッタ
処理室１０内を必要な低圧にまで減圧する時間を短縮す
ることができる。In the getter processing chamber 10, the function of the getter film deposited on the surfaces of all or some of the panel members 1 to 4 is maintained, and the sealing processing chamber 11 following the getter processing chamber 10 is maintained at a high degree of vacuum. In order to facilitate the operation, it is preferable that the pressure is maintained at a low pressure of 10 ⁻⁵ Pa or less at least during the getter treatment. In addition, after the getter processing, the next substrate is introduced so that the getter attached to the mask can maintain the ability to suppress the deterioration of the degree of vacuum (gas component adsorption ability) when the next substrate is introduced. It is good to maintain until the time of arrival. Specifically, it is preferable that the substrate is maintained at a low pressure of 10 ⁻⁶ Pa or less after the getter treatment until the next substrate is introduced. In particular, the pressure before the next substrate is introduced after the getter processing is the same as the room before the getter processing room.
It is preferable that the pressure is lower than the pressure in the surface purification processing chamber (in this embodiment; other processing chambers or moving chambers, if any). Further, in the present invention, a part of the residual getter film can be utilized for maintaining this low pressure state. As described above, due to the presence of the getter in the getter processing chamber, the getter processing chamber 10
After receiving the new panel members 1 to 4, the time for depressurizing the getter processing chamber 10 to the required low pressure can be shortened.

【００４９】度図示される例におけるゲッタ処理室１０
は、１０^-6Ｐａの低圧下でゲッタ処理が行われるものと
なっている。また、図示されるゲッタ処理室１０は、表
面浄化処理室９から１００℃で運び入れられたパネル部
材１〜４を同じ１００℃で封着処理室１１へ送り出すも
のとなっているが、パネル部材１〜４の受け入れ時の温
度がゲッタ処理をするのに高過ぎる場合には、このゲッ
タ処理室１０においてパネル部材１〜４を更に降温させ
てからゲッタ処理を行うものとすることもできる。The getter processing chamber 10 in the illustrated example
The getter process is performed under a low pressure of 10 ⁻⁶ Pa. In the getter processing chamber 10 shown in the figure, the panel members 1 to 4 carried in at 100 ° C. from the surface purification processing chamber 9 are sent out to the sealing processing chamber 11 at the same 100 ° C. If the temperature at the time of receiving 1 to 4 is too high for the getter processing, the getter processing may be performed after further lowering the temperature of the panel members 1 to 4 in the getter processing chamber 10.

【００５０】図示される例では、ＦＰ２の内面にゲッタ
膜を被着させているが、ゲッタ膜を被着させるパネル部
材１〜４はこれに限るものではなく、ＲＰ１などに形成
することも可能である。ＲＰ１やＦＰ２にゲッタ膜を被
着させる場合、次の封着処理室１１で行われる封着がゲ
ッタ膜で損なわれないよう、ゲッタ処理を施すＲＰ１及
び／又はＦＰ２の少なくとも内面側周縁部を前記マスク
３６で遮蔽してゲッタ処理を施すことが好ましい。In the illustrated example, the getter film is deposited on the inner surface of the FP2, but the panel members 1 to 4 to which the getter film is deposited are not limited to this, and can be formed on the RP1 or the like. Is. When depositing a getter film on RP1 and FP2, at least the inner peripheral edge portion of RP1 and / or FP2 to be gettered is treated so that the sealing performed in the next sealing treatment chamber 11 is not damaged by the getter film. It is preferable to perform a getter process by blocking with a mask 36.

【００５１】また、ゲッタ剤は一般に導電性を有するた
め、製造した画像表示パネル５の画像表示駆動時に、大
きなリーク電流を発生させたり、駆動電圧の耐圧性を低
下させるなどの問題を発生させる場合がある。例えば、
図示される例においてＲＰ１にゲッタ膜を被着させる
と、外枠３及びスペーサ４にも導電性のゲッタ膜が成膜
されるために、駆動時の電気的な問題が発生する場合が
ある。この様な場合には、上記リーク電流を発生させな
い領域や駆動電圧の耐圧性を損なわない領域のみにゲッ
タ膜が被着されるよう、前記マスク３７でゲッタ膜の被
着領域を制御すればよが、このような問題を生じにくい
ＦＰ２にゲッタ膜を被着させることが好ましい。特にＦ
Ｐ２にゲッタ膜を被着させる場合で、ＦＰがブラックマ
トリクスを有する場合、マスク３７でこのブラックマト
リクス以外の領域を遮蔽してゲッタ処理を施すと、ブラ
ックマトリクス部分にのみゲッタ膜を形成することがで
き、ゲッタ膜の被着による画像表示への悪影響を防止す
ることができる。In addition, since the getter agent generally has conductivity, when a problem such as a large leak current is generated or the withstand voltage of the drive voltage is lowered when the manufactured image display panel 5 is driven for image display. There is. For example,
When a getter film is deposited on the RP1 in the illustrated example, a conductive getter film is also formed on the outer frame 3 and the spacer 4, which may cause an electrical problem during driving. In such a case, the getter film deposition area may be controlled by the mask 37 so that the getter film is deposited only on the area where the leak current is not generated or the area where the withstand voltage of the drive voltage is not impaired. However, it is preferable to deposit a getter film on the FP2 that does not easily cause such a problem. Especially F
When the getter film is deposited on P2 and the FP has a black matrix, if the getter process is performed by masking the area other than the black matrix with the mask 37, the getter film can be formed only on the black matrix portion. Therefore, it is possible to prevent an adverse effect on the image display due to the deposition of the getter film.

【００５２】尚、ゲッタ処理室１０においては、ゲッタ
剤をフラッシュさせた時に一時的に真空度が低下する
が、真空排気により高真空へと移行させる。また、上述
した蒸発型ゲッタ剤によるゲッタ膜の形成の他に、ＲＰ
１又はＦＰ２上に、予め、チタン材などからなる非蒸発
型ゲッタ膜又は非蒸発型ゲッタ部材を設けることを併用
することもできる。In the getter processing chamber 10, although the degree of vacuum temporarily decreases when the getter agent is flushed, the getter processing chamber 10 is evacuated to a high vacuum. In addition to the formation of the getter film using the evaporative getter agent described above, RP
It is also possible to use a non-evaporable getter film or a non-evaporable getter member made of a titanium material or the like in advance on 1 or FP2.

【００５３】上記ゲッタ処理室１０でを経た一組のパネ
ル部材１〜４は、封着処理室１１に搬送され、封着処理
が行われる。The set of panel members 1 to 4 that have passed through the getter processing chamber 10 are conveyed to the sealing processing chamber 11 and subjected to sealing processing.

【００５４】図示される例においては、パネル部材１〜
４は、温度制御手段１５，１９から外されて、１０^-6Ｐ
ａ台まで真空排気された封着処理室１１へ搬送され、封
着処理室１１において、ＲＰ１が温度調整手段１６に取
り付け保持され、ＦＰ２が温度制御手段２０に取り付け
保持される。この時、ＲＰ１に配置固定された外枠３の
封着材６はＦＰ２と接触せず、わずかに間隔が開けられ
る。また、この取り付け時に、ＲＰ１とＦＰ２の相対位
置が決定される。相対位置の決定は、突き当てピンによ
る端面基準などで行うことができるが、これに限るもの
ではない。In the illustrated example, the panel members 1 to
4 is removed from the temperature control means 15 and 19, and 10 ^-6 P
It is conveyed to the sealing processing chamber 11 that has been evacuated to the a-th stage, and in the sealing processing chamber 11, RP1 is attached and held by the temperature adjusting means 16 and FP2 is attached and held by the temperature control means 20. At this time, the sealing material 6 of the outer frame 3 arranged and fixed to the RP1 does not come into contact with the FP2, and a slight space is provided. Moreover, at the time of this attachment, the relative position of RP1 and FP2 is determined. The relative position can be determined based on the end face reference by the abutting pin, but not limited to this.

【００５５】この後、昇降機２４を下降させて、ＲＰ１
に取り付け保持された外枠１をＦＰ２に接触、押圧させ
ながら、温度制御手段１６，２０により、パネル部材１
〜４を再加熱して、封着材６による封着に適した封着温
度まで昇温させ、封着材６を軟化又は溶解させてから、
ピーク温度で所要時間（例えば１０分間程度）保持す
る。図示される例では、パネル部材１〜４を１６０℃ま
で再加熱している。その後、パネル部材１〜４の温度を
降温させて、封着材６を固化させる。このとき、図示さ
れる例における封着処理室１１の真空度は１０^-6Ｐａを
維持しており、本工程で封着された画像表示パネル５内
も１０^-6Ｐａの真空度となる。また、前述したように、
本発明により製造される画像表示パネル５は、内部にゲ
ッタ膜が被着されたものとなるため、この封着後に内部
にガスの放出が発生しても、このガスをゲッタ膜で吸着
することができ、圧力低下を防止することができる。After that, the elevator 24 is lowered and the RP1
While contacting and pressing the outer frame 1 attached and held by the FP2 with the temperature control means 16 and 20, the panel member 1
4 to 4 are reheated and heated to a sealing temperature suitable for sealing with the sealing material 6 to soften or melt the sealing material 6,
Hold at the peak temperature for the required time (for example, about 10 minutes). In the illustrated example, the panel members 1 to 4 are reheated to 160 ° C. Then, the temperature of the panel members 1 to 4 is lowered to solidify the sealing material 6. At this time, the degree of vacuum in the sealing treatment chamber 11 in the illustrated example is maintained at 10 ⁻⁶ Pa, and the inside of the image display panel 5 sealed in this step also has a degree of vacuum of 10 ⁻⁶ Pa. Also, as mentioned above,
Since the image display panel 5 manufactured according to the present invention has a getter film deposited inside, even if gas is released inside after the sealing, the gas is adsorbed by the getter film. The pressure drop can be prevented.

【００５６】図示される例においては、外枠３の端面に
設けられた封着材６を用いて封着するものとなっている
が、この封着材６は、上記外枠３に対応するＦＰ２の位
置に予め設けておいてもよい。また、外枠３のみ又は外
枠３とスペーサ４を予めＦＰ２に設けておき、この外枠
３の端面に封着材６を設けておいたり、この外枠３に対
応するＲＰ１の位置に封着材６を設けておくこともで
き、更には外枠３の端面と、この外枠３に対応するＦＰ
２又はＲＰ１の位置との両者に封着材６を設けておくこ
ともできる。In the illustrated example, the sealing material 6 provided on the end surface of the outer frame 3 is used for sealing, and the sealing material 6 corresponds to the outer frame 3. It may be provided in advance at the position of FP2. Further, only the outer frame 3 or the outer frame 3 and the spacer 4 are provided in advance in the FP2, and the sealing material 6 is provided on the end surface of the outer frame 3, or the position of the RP1 corresponding to the outer frame 3 is sealed. A dressing material 6 can be provided, and further, the end surface of the outer frame 3 and the FP corresponding to the outer frame 3 can be provided.
It is also possible to provide the sealing material 6 both at the position 2 or at the position of RP1.

【００５７】封着材６としては、封着処理室１１におけ
る再加熱時間及びその熱量を軽減するためには低融点の
ものが好ましく、低融点金属もしくはその合金、例えば
ガリウム−インジウム系合金、ガリウム−錫系合金、ア
ルミニウム−ガリウム系合金などを用いることが好まし
い。しかし、本発明における封着材６は、このような低
融点のものに限らず、封着材６として、汎用されている
フリットガラスを用いることもできる。The sealing material 6 is preferably one having a low melting point in order to reduce the reheating time in the sealing processing chamber 11 and the amount of heat thereof, and a low melting point metal or its alloy, for example, gallium-indium alloy, gallium. It is preferable to use a tin-based alloy, an aluminum-gallium-based alloy, or the like. However, the sealing material 6 in the present invention is not limited to such a low melting point material, and frit glass that is widely used can be used as the sealing material 6.

【００５８】封着材６によって封着するときの温度は、
例えば封着材６がガリウム−インジュウム系金属であれ
ば、加熱ピーク温度が１６０℃程度、硬化固定温度が１
４０℃程度である。また、封着材６がフリットガラスの
場合は、ピーク温度が３９０℃程度、硬化固定温度が３
００℃程度である。加熱の昇温レートは２０℃／分、降
温レートは５℃／分程度が好ましいが、これに限るもの
ではない。また加熱ピーク温度、硬化固定温度も上記に
限るものではない。The temperature for sealing with the sealing material 6 is
For example, when the sealing material 6 is a gallium-indium-based metal, the heating peak temperature is about 160 ° C. and the curing fixing temperature is 1
It is about 40 ° C. When the sealing material 6 is frit glass, the peak temperature is about 390 ° C. and the curing fixing temperature is 3
It is about 00 ° C. The heating rate of heating is preferably 20 ° C./minute and the cooling rate is preferably 5 ° C./minute, but not limited to this. Further, the heating peak temperature and the curing fixing temperature are not limited to the above.

【００５９】図示される例においては、封着処理室１１
内においてアライメント（パネル部材１〜４の位置合わ
せ）をも行うものとなっているが、前述したように、ゲ
ッタ処理室１０と封着室処理１１の間にアライメント処
理室（図示されていない）を設け、ここでアライメント
処理を行った後に封着処理室１１で封着処理のみを行う
ようにすることもできる。In the illustrated example, the sealing processing chamber 11
Although alignment (positioning of the panel members 1 to 4) is also performed inside, as described above, an alignment processing chamber (not shown) is provided between the getter processing chamber 10 and the sealing chamber processing 11. It is also possible to provide the above and perform only the sealing process in the sealing process chamber 11 after performing the alignment process here.

【００６０】パネル部材１〜４の温度が、封着材６の硬
化固定温度以下に温度が下がった時点で封着処理が終了
し、この後、温度制御手段１６からＲＰ１部分を取り外
し、昇降機１４２を上昇させると共に、温度制御手段２
０からＦＰ２部分を取り外し、ゲートバルブ３０を開い
て、封着処理が完了して形成された画像表示パネル５を
後処理室１２へ搬送する。この時、図示される例におけ
る後処理室１２は、１０^-6Ｐａに真空排気されている。When the temperature of the panel members 1 to 4 has dropped below the curing and fixing temperature of the sealing material 6, the sealing process is completed, after which the RP1 portion is removed from the temperature control means 16 and the elevator 142. And temperature control means 2
The FP2 portion is removed from 0, the gate valve 30 is opened, and the image display panel 5 formed after the sealing process is completed is transported to the post-processing chamber 12. At this time, the post-treatment chamber 12 in the illustrated example is evacuated to 10 ⁻⁶ Pa.

【００６１】後処理室１２に搬送された画像表示パネル
５は、取り出し可能な温度まで冷却される。この冷却
は、例えば水冷機能を有する冷却プレートの接触などに
よって行うことができる。また、ゲートバルブ３０を閉
じた後、後処理室１２内に外気をリークさせて、自然冷
却することもできる。画像表示パネル５は、この冷却
後、ゲートバルブ３１を開いて搬出されるものである。
また、画像表示パネル５の搬出後の後処理室１２は、再
び以前の減圧状態に排気されるものである。The image display panel 5 transported to the post-processing chamber 12 is cooled to a temperature at which it can be taken out. This cooling can be performed by, for example, contacting a cooling plate having a water cooling function. Further, after the gate valve 30 is closed, the outside air may be leaked into the post-treatment chamber 12 to be naturally cooled. After this cooling, the image display panel 5 is to be carried out with the gate valve 31 opened.
The post-treatment chamber 12 after the image display panel 5 is carried out is again evacuated to the previous depressurized state.

【００６２】図示される例においては、前述の通り、装
置内と外気間及び各処理室間にゲートバルブ２５〜３１
が設けられており、各処理室は不図示の真空排気系で真
空排気されるものとなっている。しかし、このゲートバ
ルブ２５〜３１は、図示する圧力プロファイルの圧力が
大きく相違する処理室間および装置内と外気間のみでよ
く、例えば、ゲッタ処理室１０と封着処理室１１の間の
ゲートバルブ２９は省略することも可能である。In the illustrated example, as described above, the gate valves 25 to 31 are provided between the inside of the apparatus and the outside air and between each processing chamber.
Are provided, and each processing chamber is evacuated by a vacuum exhaust system (not shown). However, the gate valves 25 to 31 may be provided only between the processing chambers in which the pressures of the illustrated pressure profiles greatly differ, and between the inside of the apparatus and the outside air, for example, the gate valves between the getter processing chamber 10 and the sealing processing chamber 11. It is also possible to omit 29.

【００６３】隣接した処理室間にゲートバルブ（例えば
ゲートバルブ２９）を設けない場合であって、図示する
温度プロファイルの温度がこの処理室間で相違する場合
（例えばゲッタ処理室１０と封着処理室１１間）、当該
処理室間には、例えばアルミニウム、クロム、ステンレ
スなどの反射性金属によって形成した熱遮蔽部材（板形
状、フィルム形状など）を、配置することが好ましい。
この熱遮蔽部材は、パネル部材１〜４の搬送を妨げない
ように設けられる。When a gate valve (for example, gate valve 29) is not provided between the adjacent processing chambers and the temperatures of the temperature profiles shown in the drawings differ between the processing chambers (for example, getter processing chamber 10 and sealing treatment). It is preferable to dispose a heat shield member (plate shape, film shape, etc.) formed of a reflective metal such as aluminum, chromium, or stainless between the chambers 11) and between the processing chambers.
The heat shield member is provided so as not to interfere with the transportation of the panel members 1 to 4.

【００６４】図示される例においては、一組のパネル部
材１〜４を、予め外枠３とスペーサ４が固定されたＲＰ
１と、ＦＰ２とに分けて搬送しているが、ＲＰ１と、予
め外枠３及びスペーサ４が固定されたＦＰ２とに分けて
搬送したり、ＲＰ１と、ＦＰ２と、スペーサ４が予め固
定された外枠３の３つに分けて搬送することもできる。
外枠３へのスペーサ４の事前固定は、例えばスペーサ４
を、外枠３内側を横切る板状もしくは棒状のものとし、
このスペーサ４の両端を予め外枠３に固定しておくこと
で行うことができる。いずれの場合も、外枠３やスペー
サ４の事前固定は、安定した固定状態が得やすいよう、
封着処理室１１における封着に使用する封着材６よりも
高い融点の封着材（図示されていない）を用いて行うこ
とが好ましい。In the illustrated example, a set of panel members 1 to 4 is an RP in which the outer frame 3 and the spacer 4 are fixed in advance.
1 and FP2 are separately conveyed, but RP1 and FP2 to which the outer frame 3 and the spacer 4 are previously fixed are separately conveyed, or RP1, FP2, and the spacer 4 are previously fixed. It is also possible to convey the outer frame 3 separately.
The pre-fixing of the spacer 4 to the outer frame 3 is performed by, for example, the spacer 4
Is a plate-like or rod-like one that traverses the inside of the outer frame 3,
This can be done by fixing both ends of the spacer 4 to the outer frame 3 in advance. In either case, the outer frame 3 and the spacer 4 are pre-fixed so that a stable fixed state can be easily obtained.
It is preferable to use a sealing material (not shown) having a melting point higher than that of the sealing material 6 used for sealing in the sealing processing chamber 11.

【００６５】図示される例においては、一組のパネル部
材１〜４を、総て同じ処理室への順次搬送しているが、
上記のように分けたパネル部材１〜４を、それぞれ別々
の処理室に搬送して処理し、最終的に封着処理室１１
（又は前記アライメント処理室）で合流させて封着する
こともできる。この場合、分かれて搬送されるパネル部
材１〜４のうちのいずれか１つを前記ゲッタ処理室１０
へ搬送してゲッタ処理を施せば足るが、前述したリーク
電流の発生や駆動電圧の耐圧性の低下を生じにくいこと
から、ＦＰ２をゲッタ処理室１０へ搬送してゲッタ処理
を施すことが好ましい。In the illustrated example, a set of panel members 1 to 4 are all sequentially transferred to the same processing chamber.
The panel members 1 to 4 divided as described above are conveyed to different processing chambers for processing, and finally, the sealing processing chamber 11
It is also possible to join and seal in (or the alignment processing chamber). In this case, one of the panel members 1 to 4 which are separately conveyed is connected to the getter processing chamber 10
Although it is sufficient to carry out the getter processing by carrying the FP2 to the getter processing chamber 10, it is preferable that the FP2 is carried to the getter processing chamber 10 because the generation of the leak current and the decrease in the withstand voltage of the driving voltage are unlikely to occur.

【００６６】上記のように、一組のパネル部材１〜４を
複数の分けてそれぞれ異なる処理室に搬送する場合、分
けた部材毎に最も適した処理を施しやすい利点がある。
例えば、高い耐熱性を有する部材については高い温度で
のベーク処理を施し、耐熱性の劣る部材については温度
を下げたベーク処理を施すなどの処理の区分けが容易と
なる。また、封着処理室１１（又はアライメント処理
室）に、パネル部材１〜４を送り込む複数の処理室が接
続されることになり、この各処理室を必要な低圧に制御
することが必要となるが、少なくとも１つの部材をゲッ
タ処理している時間を利用してこの低圧の形成を行うこ
とができることから、製造効率の低下を防止することが
できる。As described above, when a set of panel members 1 to 4 is divided into a plurality of parts and conveyed to different processing chambers, there is an advantage that it is easy to perform the most suitable processing for each divided member.
For example, it is easy to classify treatments such as baking treatment at a high temperature for a member having high heat resistance, and baking treatment at a lower temperature for a member having poor heat resistance. Further, a plurality of processing chambers for feeding the panel members 1 to 4 are connected to the sealing processing chamber 11 (or the alignment processing chamber), and it is necessary to control each of the processing chambers to a required low pressure. However, since it is possible to form this low pressure by utilizing the time during which at least one member is gettered, it is possible to prevent a decrease in manufacturing efficiency.

【００６７】一方、本例のように、一組のパネル部材１
〜４を総て同じ処理室へと搬送する場合、搬送制御が容
易となるだけでなく、前述したように、一組のパネル部
材１〜４が、総て低圧雰囲気を維持しやすいゲッタ処理
室１０を介して封着処理室１１へ搬送されるので、ゲッ
タ処理室１０から封着処理室１１の低圧雰囲気の維持を
図りやすい利点がある。On the other hand, as in this example, a set of panel members 1
In the case where all of the members 4 to 4 are transferred to the same processing chamber, not only the transfer control becomes easy, but also, as described above, the set of panel members 1 to 4 all easily maintain the low pressure atmosphere. Since it is conveyed to the sealing processing chamber 11 via 10, there is an advantage that it is easy to maintain the low-pressure atmosphere from the getter processing chamber 10 to the sealing processing chamber 11.

【００６８】一組のパネル部材１〜４を３つに分けてそ
れぞれ異なる処理室に搬送する具体的方法としては、例
えば前処理室７からゲッタ処理室１０までの１つのライ
ンと、前処理室７から表面浄化処理室９までの２つのラ
インの合計３ラインを並べ、各ラインを封着処理室１１
（又はアライメント処理室）に合流させるようにし、合
流して揃った一組のパネル部材１〜４を封着処理室１１
で封着処理する方法を挙げることができる。一組のパネ
ル部材１〜４を２つに分けた場合には、前処理室７から
表面浄化処理室９までのラインを１つにすればよい。こ
の場合、前述したように、ゲッタ処理室１０を含むライ
ンには、ＦＰ２を搬送することが好ましい。また、上記
３ライン又は２ラインの処理においても、ベーク処理室
８と表面浄化処理室９は設けることが好ましいが、いず
れか一方又は両者を省略可能であることは前述のとおり
である。As a specific method of dividing one set of panel members 1 to 4 into three different processing chambers, for example, one line from the pretreatment chamber 7 to the getter processing chamber 10 and the pretreatment chamber are provided. 7 lines from the surface cleaning treatment chamber 9 to a total of 3 lines are arranged, and each line is sealed in the sealing treatment chamber 11
(Or the alignment processing chamber), and the pair of panel members 1 to 4 that have been merged and aligned are joined to the sealing processing chamber 11
The method of performing the sealing treatment can be mentioned. When the set of panel members 1 to 4 is divided into two, the line from the pretreatment chamber 7 to the surface purification treatment chamber 9 may be one. In this case, as described above, it is preferable to convey the FP2 to the line including the getter processing chamber 10. Further, it is preferable to provide the bake processing chamber 8 and the surface cleaning processing chamber 9 also in the above-mentioned three-line or two-line processing, but as described above, either one or both can be omitted.

【００６９】図示される例においては、前処理室７、ベ
ーク処理室８、表面浄化処理室９、ゲッタ処理室１０、
後処理室１２は、それぞれ単一の処理室となっている
が、いずれも複数直列させ、必要な真空度を維持しやす
くすると共に、処理時間又は処理回数を調整することも
できる。In the illustrated example, the pretreatment chamber 7, the bake treatment chamber 8, the surface cleaning treatment chamber 9, the getter treatment chamber 10,
Although each of the post-treatment chambers 12 is a single treatment chamber, a plurality of post-treatment chambers 12 can be connected in series to easily maintain a required degree of vacuum, and the treatment time or the number of treatments can be adjusted.

【００７０】図２は、本発明に係る製造方法を用いて作
成した画像表示パネル５の一部を示す断面図である。図
中、図１と同一符号は同一部材である。FIG. 2 is a sectional view showing a part of the image display panel 5 created by the manufacturing method according to the present invention. In the figure, the same reference numerals as those in FIG. 1 denote the same members.

【００７１】図示されるように、画像表示パネル５は、
ＲＰ１とＦＰ２と外枠３とによって、密封されたパネル
状の真空容器又は減圧容器として形成されている。減圧
容器として形成する場合、その内部には、アルゴンガ
ス、ネオンガスなどの不活性ガス又は水素ガスを減圧下
で含有させることができる。また、真空容器として形成
する場合には、その内部を１０^-5Ｐａ以上、好ましく
は、１０^-6Ｐａ以上の高真空に設定することができる。As shown in the figure, the image display panel 5 is
The RP1, the FP2, and the outer frame 3 form a sealed panel-shaped vacuum container or reduced pressure container. When it is formed as a reduced pressure container, an inert gas such as argon gas or neon gas or hydrogen gas can be contained therein under reduced pressure. Further, in the case of forming it as a vacuum container, the inside thereof can be set to a high vacuum of 10 ^-5 Pa or higher, preferably 10 ^-6 Pa or higher.

【００７２】上記画像表示パネル５内には、スペーサ４
が配置されており、耐大気圧構造を形成している。図示
されるスペーサ４は、無アルカリガラスなどの無アルカ
リ絶縁物質からなる本体２０１と、該本体２０１の表面
を覆って配置した高抵抗物質で成膜された高抵抗膜２０
２と、本体２０１の両端に設けた金属（タングステン、
銅、銀、金、モリブデンやこれらの合金など）膜２０３
とを有し、配線２０４上に導電性接着剤２０５を介して
電気的に接続接着されている。図１の例に基づいてこの
画像表示パネル５を製造する場合、スペーサ４を、前記
前処理室７に搬入する前に、予め一方の端部をＲＰ１の
配線２０４上に導電性接着剤２０５によって接着固定し
ておき、封着処理室１１において封着処理が終了した時
点で、上記スペーサ４のもう一方の端部とＦＰ２とが電
気的に接続された状態で接して配置されるようにすれば
よい。In the image display panel 5, the spacer 4 is provided.
Are arranged to form an atmospheric pressure resistant structure. The illustrated spacer 4 includes a main body 201 made of an alkali-free insulating material such as an alkali-free glass, and a high-resistance film 20 formed of a high-resistance material arranged so as to cover the surface of the main body 201.
2 and a metal (tungsten,
(Copper, silver, gold, molybdenum and alloys thereof) Film 203
And is electrically connected and bonded onto the wiring 204 via the conductive adhesive 205. When the image display panel 5 is manufactured based on the example of FIG. 1, one end of the spacer 4 is previously attached to the wiring 204 of the RP1 by the conductive adhesive 205 before the spacer 4 is carried into the pretreatment chamber 7. Adhesion is fixed, and when the sealing processing is completed in the sealing processing chamber 11, the other end of the spacer 4 and the FP2 are arranged in contact with each other while being electrically connected. Good.

【００７３】ＲＰ１は、ガラスなどの透明基板２０６上
に、ナトリウムなどのアルカリの侵入を防止するための
下地膜（ＳｉＯ₂、ＳｎＯ₂など）２０７を設け、この下
地膜２０７上にＸＹマトリクス配列した複数の電子線放
出素子２０８を設けたものとなっている。配線２０４
は、電子放出素子２０８と接続されたＸＹマトリクス配
線の一方を構成する。In RP1, a base film (SiO ₂ , SnO ₂ etc.) 207 for preventing the invasion of alkali such as sodium is provided on a transparent substrate 206 such as glass, and an XY matrix is arranged on this base film 207. A plurality of electron beam emitting elements 208 are provided. Wiring 204
Constitutes one of the XY matrix wirings connected to the electron-emitting device 208.

【００７４】また、本発明によれば、蛍光体励起手段で
ある電子放出素子２０８に代えて、プラズマ発生素子を
有する画像表示パネル５を製造することもできる。この
画像表示パネル５の場合、その内部には、アルゴンガ
ス、ネオンガスなどの不活性ガス又は水素ガスを減圧下
で含有させる。Further, according to the present invention, it is possible to manufacture the image display panel 5 having a plasma generating element instead of the electron emitting element 208 which is the phosphor exciting means. In the case of the image display panel 5, an inert gas such as argon gas or neon gas or hydrogen gas is contained therein under reduced pressure.

【００７５】ＦＰ２は、ガラスなどの透明基板２０９上
に、蛍光体２１０とアノード源（図示せず）に接続した
アノード金属（アルミニウム、銀、銅など）膜２１１と
を配置したものとなっている。また、上記プラズマ発生
素子を有する画像表示パネル５とする場合には、蛍光体
２１０に代えて、カラーフィルターを用いることができ
る。In the FP2, a phosphor 210 and an anode metal (aluminum, silver, copper, etc.) film 211 connected to an anode source (not shown) are arranged on a transparent substrate 209 such as glass. . Further, in the case of the image display panel 5 having the plasma generating element, a color filter can be used instead of the phosphor 210.

【００７６】図１の例に基づいて画像表示パネル５を製
造する場合、外枠３は、前記前処理室７に搬入する前
に、予め一方の端面がＲＰ１に封着材２１２によって接
着固定され、封着処理室１１における封着処理により、
他方の端面が封着材６でＦＰ２に固定接着されるもので
ある。When the image display panel 5 is manufactured based on the example of FIG. 1, one end surface of the outer frame 3 is preliminarily adhered and fixed to the RP1 by the sealing material 212 before being carried into the pretreatment chamber 7. By the sealing process in the sealing process chamber 11,
The other end face is fixedly adhered to the FP2 with the sealing material 6.

【００７７】[0077]

【発明の効果】本発明によれば、画像表示パネル内部の
高真空状態を維持するために封着前に施されるゲッタ処
理時に、マスクに付着するゲッタ膜を利用してゲッタ処
理室の高真空雰囲気を維持することができるので、ゲッ
タ処理室から封着処理室までの圧力を、他の処理室の必
要以上の減圧による装置内の真空度維持効率の低下及び
減圧待ちの時間を生じることによる製造効率の低下を来
すことなく、必要な低圧に維持することができ、内部が
高真空で耐久性のよい画像表示パネルを容易に製造する
ことができるものである。According to the present invention, the height of the getter processing chamber is increased by utilizing the getter film adhered to the mask during the getter processing performed before sealing in order to maintain the high vacuum state inside the image display panel. Since the vacuum atmosphere can be maintained, the pressure from the getter processing chamber to the sealing processing chamber will be reduced more than necessary in the other processing chambers, and the efficiency of maintaining the degree of vacuum in the equipment will be reduced and the waiting time for pressure reduction will occur. It is possible to easily manufacture an image display panel which can be maintained at a necessary low pressure and which has a high vacuum inside and has good durability without causing a decrease in manufacturing efficiency due to.

[Brief description of drawings]

【図１】本発明の製造方法に用いる製造装置の一例と共
に、この製造装置におけるパネル部材の温度プロファイ
ル及び各処理室間の真空度プロファイルを模式的に示し
た図である。FIG. 1 is a diagram schematically showing an example of a manufacturing apparatus used in a manufacturing method of the present invention, along with a temperature profile of a panel member and a vacuum degree profile between processing chambers in the manufacturing apparatus.

【図２】本発明の製造方法を用いて作成した画像表示装
置の一部を示す断面図である。FIG. 2 is a cross-sectional view showing a part of an image display device created by using the manufacturing method of the present invention.

[Explanation of symbols]

１リアプレート（ＲＰ）２フェィスプレート（ＦＰ）３外枠４スペーサ５画像表示装置６封着材７前処理室８ベーク処理室９表面浄化処理室１０ゲッタ処理室１１封着処理室１２後処理室１３〜２０温度制御手段２１〜２４昇降機２５〜３１ゲートバルブ３２搬送ローラー３３電子銃３４電子線３５ゲッタフラッシュ装置３６ゲッタフラッシュ３７マスク２０１本体２０２高抵抗膜２０３金属膜２０４配線２０５導電性接着剤２０６透明基板２０７下地膜２０８電子線放出素子２０９透明基板２１０蛍光体２１１アノード金属膜２１２封着材 1 Rear plate (RP) 2 face plates (FP) 3 outer frame 4 spacers 5 Image display device 6 sealing material 7 Pretreatment room 8 Baking process room 9 Surface purification treatment room 10 Getter processing room 11 Sealing chamber 12 Aftertreatment room 13-20 Temperature control means 21-24 elevator 25-31 Gate valve 32 transport rollers 33 electron gun 34 electron beam 35 Getter flash device 36 getter flash 37 Mask 201 body 202 High resistance film 203 metal film 204 wiring 205 conductive adhesive 206 transparent substrate 207 Base film 208 Electron Beam Emitting Element 209 transparent substrate 210 phosphor 211 Anode metal film 212 sealing material

───────────────────────────────────────────────────── フロントページの続き (72)発明者宮崎俊彦東京都大田区下丸子３丁目30番２号キヤノン株式会社内Ｆターム(参考） 5C012 AA05 ─────────────────────────────────────────────────── ─── Continued front page (72) Inventor Toshihiko Miyazaki 3-30-2 Shimomaruko, Ota-ku, Tokyo Non non corporation F-term (reference) 5C012 AA05

Claims

[Claims]

1. A set of panel members constituting an image display panel are sequentially conveyed to a plurality of depressurized processing chambers including at least a getter processing chamber, and the set of panel members subjected to a predetermined process are depressurized. In the method of manufacturing an image display panel, wherein at least a part of the set of panel members is transported to a getter processing chamber prior to the sealing processing, Every time a new panel member is sent in the getter processing chamber, a getter film made of an evaporative getter agent is applied to at least a part of the sent panel member through the same mask provided in the getter processing chamber. A method for manufacturing an image display panel, characterized by performing a getter process.

2. The set of panel members includes a face plate having a phosphor and a rear plate having an electron source, and conveys at least one of the face plate and the rear plate to the getter processing chamber. The method of manufacturing an image display panel according to claim 1, wherein the getter processing in the getter processing chamber is performed on an inner surface of at least one of the face plate and the rear plate.

3. The getter processing in the getter processing chamber is performed by shielding the peripheral portion of the face plate and / or the rear plate to which the getter processing is applied with the mask, and the sealing processing is performed with a gap. The method of manufacturing an image display panel according to claim 2, wherein the face plate and the rear plate facing each other are sealed by the peripheral edge portions.

4. The method of manufacturing an image display panel according to claim 3, wherein at least the face plate is conveyed to the getter processing chamber, and the getter processing is performed on the face plate.

5. The face plate has a black matrix, and the getter process in the getter process chamber is performed by shielding a portion other than the black matrix with the mask. Image display panel manufacturing method.

6. The panel member according to claim 2, further comprising an outer frame interposed between peripheral portions of the face plate and the rear plate during the sealing process. The method for manufacturing an image display panel according to any one of 1.

7. The method of manufacturing an image display panel according to claim 6, wherein the outer frame is fixed to a peripheral portion of the rear plate in advance.

8. The panel member according to claim 6, further comprising a spacer interposed between the center portions of the face plate and the rear plate during the sealing process. A method for manufacturing the described image display panel.

9. The method of manufacturing an image display device according to claim 8, wherein the spacer is fixed to the rear plate in advance.

10. A panel member to be transferred to the getter processing chamber, a panel member to be transferred to a sealing processing chamber for performing the sealing process without passing through the getter processing chamber, before being transferred to the getter processing chamber. The method of manufacturing an image display panel according to claim 1, wherein a baking process is performed on each of the baking processes before the transfer to the sealing process chamber.

11. The panel member that has been baked in the bake processing chamber is transferred to another processing chamber before being transferred to the getter processing chamber, and the temperature of the panel member is lowered in the other processing chamber. The method for manufacturing an image display panel according to claim 10.

12. The method of manufacturing an image display panel according to claim 11, wherein the other processing chamber is a surface purification processing chamber that performs a surface purification treatment on the panel member.

13. The method of manufacturing an image display panel according to claim 12, wherein the surface purification treatment in the surface purification treatment chamber is a treatment of irradiating the surface of the carried-in panel member with an electron beam.

14. The method of manufacturing an image display panel according to claim 12, wherein the surface purification treatment in the surface purification treatment chamber is a treatment of irradiating the surface of the loaded panel member with ions.

15. The method of manufacturing an image display panel according to claim 12, wherein the surface purification treatment in the surface purification treatment chamber is a treatment of irradiating the surface of the panel member carried in with ultraviolet rays.

16. The method of manufacturing an image display panel according to claim 12, wherein the surface purification treatment in the surface purification treatment chamber is a treatment of irradiating the surface of the panel member carried in with plasma.

17. A set of panel members constituting an image display panel are sequentially transported to a plurality of depressurized processing chambers including at least a getter processing chamber, and the set of panel members that have undergone a predetermined process are depressurized. In a method of manufacturing an image display panel to form an image display panel by a sealing process, the one set of panel members, while conveying to the getter processing chamber prior to the sealing process, in the getter processing chamber,
Each time a new set of panel members is sent, a getter film made of an evaporative getter agent is applied to at least a part of the set of panel members sent through the same mask provided in the getter processing chamber. A method for manufacturing an image display panel, characterized by performing a getter process.

18. The set of panel members includes a face plate having a phosphor and a rear plate having an electron source, and the getter treatment in the getter treatment chamber is performed by the face plate and the rear plate. The method is performed on at least one inner surface.
7. The method for manufacturing the image display panel according to 7.

19. The getter processing in the getter processing chamber is performed by shielding the peripheral portion of the face plate and / or the rear plate to which the getter processing is applied with the mask, and the sealing processing is performed with a gap. The method of manufacturing an image display panel according to claim 18, wherein the face plate and the rear plate facing each other are sealed by the peripheral edge portions.

20. The method of manufacturing an image display panel according to claim 19, wherein the getter process is performed on the face plate.

21. The face plate has a black matrix, and the gettering process in the gettering chamber is performed by shielding a portion other than the black matrix with the mask. Image display panel manufacturing method.

22. The set of panel members also includes an outer frame interposed between the peripheral portions of the face plate and the rear plate during the sealing process. The method for manufacturing an image display panel according to any one of 1.

23. The method of manufacturing an image display panel according to claim 22, wherein the outer frame is fixed to a peripheral portion of the rear plate in advance.

24. The set of panel members also includes a spacer interposed between the central portions of the face plate and the rear plate during a sealing process in the sealing chamber. 22. A method for manufacturing an image display panel according to 22 or 23.

25. The method of manufacturing an image display device according to claim 24, wherein the spacer is fixed to the rear plate in advance.

26. The method of manufacturing an image display panel according to claim 17, wherein the set of panel members is subjected to a baking process before being conveyed to the getter processing chamber.

27. The panel member that has been baked in the bake processing chamber is transferred to another processing chamber before being transferred to the getter processing chamber, and the temperature of the panel member is lowered in the other processing chamber. The method for manufacturing an image display panel according to claim 26.

28. The method of manufacturing an image display panel according to claim 27, wherein the other processing chamber is a surface cleaning processing chamber that performs a surface cleaning process on the panel member.

29. The method of manufacturing an image display panel according to claim 28, wherein the surface purification treatment in the surface purification treatment chamber is a treatment of irradiating the surface of the carried-in panel member with an electron beam.

30. The method of manufacturing an image display panel according to claim 28, wherein the surface purification treatment in the surface purification treatment chamber is a treatment of irradiating the surface of the carried-in panel member with ions.

31. The method of manufacturing an image display panel according to claim 28, wherein the surface purification treatment in the surface purification treatment chamber is a treatment of irradiating the surface of the panel member carried in with ultraviolet rays.

32. The method of manufacturing an image display panel according to claim 28, wherein the surface purification treatment in the surface purification treatment chamber is a treatment of irradiating the surface of the panel member carried in with plasma.

33. The pressure in the getter processing chamber is kept lower than the pressure at the time of introduction in a room immediately before the getter processing chamber until a new panel member is introduced after the getter processing. The method for manufacturing an image display panel according to any one of claims 1 to 32.

34. The method of manufacturing an image display panel according to claim 1, wherein the sealing treatment is performed in a sealing treatment chamber provided separately from the getter treatment chamber.