JP2003006601A - Method for forming rf-id media by using insulating adhesive - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for forming RF-ID media, with which an electric connection is not cut off even when external forces are concentrated to a conductive part for connection by strongly conducting and bonding an interposer with packaged IC chip and an antenna holder. SOLUTION: A base material is provided with a conductive pattern equipped with the conductive part for connection at least, the interposer with packaged IC chip is formed by packaging an IC chip in the conductive part for connection, and the antenna holder is formed by providing the base material with the conductive pattern composed of an antenna conducting part and the conductive part for connection positioned at the terminal part of this antenna conducting part. Then, the interposer and the antenna holder are overlapped so that the respective conductive parts for connection can face each other, and the interposer and the antenna holder are conducted and bonded by using an insulating adhesive intermittently applied in the pattern of dot, line or grid preferably.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to an RF-ID (Radio Frequency I) using an insulating adhesive.
The present invention relates to a method of forming an RF-ID medium used for a thin information transmission / reception type recording medium such as a non-contact IC tag using an insulating adhesive, and more particularly to a method of forming an RF-ID medium. .

[0002]

2. Description of the Related Art Recent methods for forming an RF-ID medium are those in which an IC chip is directly mounted on an antenna.
There is a tendency to adopt the interposer method. In this method, a conductive portion for connection corresponding to an antenna conductive portion (land portion) on the RF-ID medium substrate is formed on a small sheet,
Further, an IC chip mounted (interposer) is used.

A conventional method of forming an RF-ID medium (for example, Japanese Patent Laid-Open No. 2001-35989) will be described with reference to FIGS. In this method, the antenna circuit is I
The structure is divided into a C-chip mounted interposer and an antenna holder, and the IC chip-mounted interposer and the antenna holder are formed in advance, and an antenna circuit body is formed using them. FIG. 8 shows a process of forming one of the IC chip mounting interposers A1. First, a base material 1 having a predetermined size is prepared so as to cover a terminal portion of an antenna holder described later (a).
A pair of conductive patterns 4 in which the IC chip mounting conductive portion 2 and the connecting conductive portion 3 are continuous are provided on the base material 1 (b). After that, the IC chip 5 is mounted so as to straddle the conductive portion 2 for mounting the IC chip to form an IC chip mounting interposer A1 (c), and a conductive adhesive is applied to the entire one surface on which the IC chip 5 is mounted. Apply 6 (d).

FIG. 9 shows a process of forming the other antenna holder B1. A base material 7 having a predetermined size is prepared (a), and the antenna conductive portion 8 and the antenna conductive portion 8 are provided on the base material 7. A conductive pattern 10 including a conductive portion 9 for connection, which is a terminal portion, is provided at the end portion of (2), and the antenna holder B1 is formed by this. The connecting conductive portion 9 is provided so as to correspond to the connecting conductive portion 3 of the IC chip mounting interposer A1. Reference numeral 11 is an insulating portion. The IC chip mounting interposer A1
And the antenna holder B1 for connecting the conductive portions 3,
The IC chip mounting interposer A1 and the antenna holder B1 are bonded to each other by superimposing the conductive adhesive 6 so that they face each other, and the RF-ID medium C1 shown in FIG. 10 is obtained.

RF by such an interposer system
-The ID medium forming method has advantages such as improvement in yield and support for small-lot production of a wide variety of products, but the RF-ID medium C1 formed by the interposer method has an external force applied to the conductive portions 3 and 9 for connection. There is a problem that electrical connection may be interrupted due to concentration, and in particular, when the base materials 1 and 7 are thin paper or the like having low strength and rigidity, the interposer A1 is peeled off.

[0006]

SUMMARY OF THE INVENTION An object of the present invention is to solve the problems of the prior art, and to use the interposer system for RF-ID.
Even if a medium is formed, the electrical connection is interrupted when an external force is concentrated on the conductive portions 3 and 9 for connection, and even if the base materials 1 and 7 are thin paper or the like having low strength and rigidity, the interposer A1 is An object of the present invention is to provide a method for forming an RF-ID medium that does not come off.

[0007]

As a result of intensive studies to solve the above-mentioned problems, the inventors of the present invention have made the interposer for mounting the IC chip and the conductive portion for connection of the antenna holder face to face with each other, and intermittently performed. The inventors have found that the problem can be solved by conductively joining the two with an insulating adhesive, and have completed the present invention.

That is, in the method for forming an RF-ID medium using the insulating adhesive according to the first aspect of the present invention, a conductive pattern having at least a conductive portion for connection is provided on the base material, and the conductive portion for connection is provided. An IC chip is mounted on the substrate to form an IC chip mounting interposer, and a conductive pattern including an antenna conductive portion and a conductive portion for connection located at an end of the antenna conductive portion is provided on a base material to form an antenna holder. Then, the interposer and the antenna holder are superposed such that the connecting conductive portions face each other, and the interposer and the antenna holder are conductively joined using an insulating adhesive that is intermittently applied. Is characterized by.

The method for forming an RF-ID medium using the insulating adhesive according to claim 2 of the present invention is the same as the method for forming an RF-ID medium according to claim 2, wherein the insulating adhesive is applied in a pattern. The interposer and the antenna holder are electrically connected to each other.

According to the method of the present invention, the electrically conductive adhesive 6 which contains a large amount of electrically conductive powder is not used, but an insulating adhesive is used instead. Then, the IC chip-mounted interposer and the conductive portion for connection of the antenna holder are superposed so as to be conductively connected to each other, and this insulating adhesive does not hinder the conduction between the interposer and the antenna holder. However, it may be applied intermittently, but in consideration of the balance of the adhesive force in the surface direction, it is preferable that the pattern is applied intermittently in a pattern such as dots, lines, grids, or combs. Since the IC chip mounting interposer and the antenna holder are conductively joined using an insulating adhesive,
In addition to maintaining good continuity, the joint becomes strong, and as a result, the electrical connection is interrupted even if external force is concentrated on the conductive part for connection, and the base material has low strength and rigidity such as thin paper. However, the interposer does not come off.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a process of forming one of the IC chip mounting interposers A2. First, a base material 1 having a predetermined size is prepared so as to extend over a terminal portion of an antenna holder B2 described later (a). 1 is provided with a pair of conductive patterns 4 in which a conductive portion 2 for mounting an IC chip and a conductive portion 3 for connection are continuous (b). Thereafter, the IC chip 5 is mounted so as to straddle the conductive portion 2 for mounting the IC chip (C), and then the mounted IC chip 5 is sealed with the sealant 13.
(D), and then the insulating adhesive 12 is intermittently applied in a dot shape to form the IC chip mounting interposer A2 (e).

FIG. 2 shows a process of forming the other antenna holder B2. A base material 7 having a predetermined size is prepared (a), and the antenna conductive portion 8 and the antenna conductive portion 8 are provided on the base material 7. A conductive pattern 10 including a conductive portion 9 for connection, which is a terminal portion, is provided at the end portion of (2), and thereby the antenna holder B2 is formed. The connecting conductive portion 9 is provided so as to correspond to the connecting conductive portion 3 of the IC chip mounting interposer A2. And I
C chip mounting interposer A2 and antenna holder B2
And the conductive portions 3 and 9 for connection are opposed to each other, and the IC chip mounting interposer A2 and the antenna holder B2 are conductively joined by using the insulating adhesive 12 applied intermittently. The RF-ID medium C2 shown in is obtained.

In this embodiment, the insulating adhesive 12 is used as an IC.
Although the example in which it is applied to the chip mounting interposer A2 side is shown, the insulating adhesive 12 may be applied to the corresponding place on the antenna holder B2 side, or both the IC chip mounting interposer A2 side and the antenna holder B2 side. May be applied to.

FIG. 4 shows the RF-ID medium C shown in FIG.
It is a cross-sectional explanatory view of the II line of FIG. Since the IC chip mounting interposer A2 and the antenna holder B2 are conductively joined by the insulating adhesive 12, good continuity can be maintained and the joining becomes strong. As a result, the conductive parts 3 and 9 for connection are connected. Even if external force is concentrated, the electrical connection may be interrupted,
Even if the base materials 1 and 7 are thin paper or the like having low strength and rigidity, the interposer A2 does not peel off.

FIG. 5 is a sectional explanatory view of an RF-ID medium C3 formed by another embodiment of the method of the present invention. The RF-ID medium C3 is shown in FIG. 1 except that the insulating adhesive 12 is not applied on the IC chip 5 and the sealing agent 13.
It is made in the same way as ~ 3. The insulating adhesive 12 is not applied on the IC chip 5 and the encapsulant 13, but the insulating adhesive 12 applied to the other places conductively joins the IC chip mounting interposer A2 and the antenna holder B2. As a result, good conduction can be maintained, and the joint is still strong. As a result, for example, the conductive portions 3 and 9 for connection are connected.
Even if external force is concentrated on the
The interposer A2 does not come off even if 7 is a thin paper or the like having low strength and rigidity.

FIG. 6 is an explanatory cross-sectional view of an RF-ID medium C4 formed by another embodiment of the method of the present invention. The RF-ID medium C4 is manufactured in the same manner as in FIGS. 1 to 3 except that the insulating adhesive 12 is not applied on the conductive portion 3 for connection. The insulating adhesive 12 is not applied on the conductive portion 3 for connection, but the insulating adhesive 12 applied on the other parts of the IC chip mounting interposer A.
2 and the antenna holder B2 are conductively joined, the conduction is better and the joint is still stronger, and as a result, the electrical connection is interrupted even if an external force is concentrated on the conductive portions 3 and 9 for connection. Even if the base materials 1 and 7 are thin paper or the like having low strength and rigidity, the interposer A2 does not peel off.

FIG. 7 is an explanatory cross-sectional view of an RF-ID medium C5 formed by another embodiment of the method of the present invention. In the RF-ID medium C5, the insulating adhesive 12 is intermittently applied in a dot shape on the conductive portion 3 for connection, and the insulating adhesive 12 is entirely applied to other portions, as shown in FIGS. Three
It is made in the same way as. The IC chip mounting interposer A2 and the antenna holder B2 are made by the insulating adhesive 12 which is intermittently applied on the conductive portion 3 for connection in a dot shape and the insulating adhesive 12 which is entirely applied to other portions. Are connected to each other by conduction, so that the connection is improved and the connection becomes very strong. As a result, even if an external force is concentrated on the conductive portions 3 and 9 for connection, the electrical connection is interrupted or the base materials 1 and 7 are connected. The interposer A2 will not be peeled off even if the paper has low strength or rigidity such as thin paper.

In the embodiments shown in FIGS. 5 to 7, an example in which the insulating adhesive 12 is applied to the IC chip mounting interposer A2 side is shown. However, the insulating adhesive 12 is used as the antenna holder B2.
It may be applied to the corresponding position on the side, or may be applied to both the IC chip mounting interposer A2 side and the antenna holder B2 side.

The material of the base material 1 or base material 7 used in the present invention is a woven fabric, a non-woven fabric, a mat, a paper or a combination thereof made of an inorganic or organic fiber such as glass fiber, alumina fiber, polyester fiber or polyamide fiber. Or a composite substrate formed by impregnating these with resin varnish, a polyamide resin substrate, a polyester resin substrate, a polyolefin resin substrate, a polyimide resin substrate, an ethylene / vinyl alcohol copolymer group Material,
Polyvinyl alcohol resin substrate, polyvinyl chloride resin substrate, polyvinylidene chloride resin substrate, polystyrene resin substrate, polycarbonate resin substrate, acrylonitrile butadiene styrene copolymer resin substrate, polyether sulfone resin Select from known plastic substrates such as substrates, or those that have undergone surface treatment such as corona discharge treatment, plasma treatment, ultraviolet irradiation treatment, electron beam irradiation treatment, flame plasma treatment and ozone treatment. Can be used.

The IC chip mounting interposer and the antenna carrier may be formed of the same base material or different base materials. Further, the IC chip mounting interposer and the antenna carrier may not be formed one by one, but may be formed in plural (and may be of the same kind or different kinds).

The formation of the conductive pattern 4 on the IC chip mounting interposer and the formation of the conductive pattern 10 on the antenna holder can be carried out by known methods. For example, a method in which a conductive paste is printed by screen printing or inkjet printing to be dried and fixed, attachment of a coated or uncoated metal wire, etching, dispersion, metal foil attachment, direct vapor deposition of metal, metal vapor deposition film transfer, Examples thereof include formation of a conductive polymer layer, but are not limited thereto.

Further, in the antenna holder, the conductive pattern 10 is not necessarily limited to one side, and may be formed on the back side as well as on the inner layer as long as the connection which finally functions as the antenna is guaranteed. Further, it may be an antenna in which they are multiplexed. Further, it may be a pattern in which other lines are crossed by jumper lines as needed. It may be coated to protect the formed antenna.

The mounting of the IC chip in the process of forming the IC chip mounting interposer includes wire bonding (WB) and anisotropic conductive film (AC).
F), conductive paste (ACP), insulating resin (NCP),
The connection can be made by a known method such as using an insulating film (NCF) or a cream solder ball. If necessary, the connection portion may be protected and reinforced with a known underfill material or potting material.

The insulating adhesive used in the present invention is not particularly limited as long as it has an insulating property and can be used for the above-mentioned adhesion. Specific examples thereof include adhesives, hot melt type thermoplastic adhesives, thermosetting adhesives, and photocurable adhesives. Specific examples of the adhesive include, for example, natural rubber (NR) and styrene / butadiene copolymer rubber (SB
R), polyisobutylene (PIB), isobutylene / isoprene copolymer (butyl rubber, IIR), isoprene rubber, butadiene polymer (BR), styrene / butadiene copolymer (HSR), styrene / isoprene copolymer, styrene / Isoprene / styrene block polymer (SIS), styrene / butadiene / styrene block polymer (SBS), chloroprene rubber (CR), butadiene / acrylonitrile copolymer rubber (NBR), butyl rubber, acrylic polymer, vinyl ether polymer, polyvinyl alcohol (PVA) , Polyvinyl butyral (PVB), polyvinyl pyrrolidone (PVP),
Vinylpyrrolidone / vinyl acetate copolymer, dimethylaminoethyl methacrylic acid / vinylpyrrolidone copolymer,
Polyvinylcaprolactam, polyvinylpyrrolidone, maleic anhydride copolymer, silicone adhesive (polyvinylsiloxane), polyurethane, polyvinyl chloride, gelatin, shellac, gum arabic, rosin, rosin ester, ethylcellulose, carboxymethylcellulose, paraffin, tristearin, One or a mixture of two or more of polyethylene, polypropylene, acrylic resin, vinyl resin, polyisobutene, polybutadiene, epoxy resin, phenol resin, polyurethane resin, polyester, polyamide, silicone, polystyrene, melamine resin and the like can be mentioned. . These include liquid polybutene, mineral oil, liquid polyisobutylene, softening agents such as liquid polyacrylic acid esters, rosin, rosin derivatives, polyterpene resins, terpene phenolic resins,
Tackifiers such as petroleum resins can be added.

Specific examples of the photo-curable adhesive include acrylate compounds, methacrylate compounds, propenyl compounds, allyl compounds, vinyl compounds, acetylene compounds, unsaturated polyesters, epoxy poly (meth) acrylates, poly (meth) ) Acrylate polyurethanes, polyester polyol poly (meth) acrylates, polyether polyol poly (meth) acrylates, phenoxyethyl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, styrene,
Examples thereof include one or a mixture of two or more kinds of α-alkylstyrene and the like, and a mixture of these with a known photopolymerization initiator, photopolymerization accelerator and the like. These photocurable adhesives include softening agents such as liquid polybutene, mineral oil, liquid polyisobutylene, and liquid polyacrylic acid esters, and tackifiers such as rosin, rosin derivatives, polyterpene resins, terpene phenol resins, and petroleum resins. It can be added. If necessary, it can be diluted with an organic solvent or a reactive organic solvent.

The epoxy resin of the thermosetting adhesive may be any resin having two or more epoxy groups in one molecule and can be cured into a resinous form. Specific examples are bisphenol A.
Type epoxy resin, bisphenol F type epoxy resin, tetrabromobisphenol A type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, glycidyl ester type epoxy resin, alicyclic epoxy resin, hydantoin type epoxy resin, etc. .

Examples of the curing agent include phenol resins, acid anhydrides and amine compounds. Examples of the phenol resin include phenol novolac resin, cresol novolac resin, naphthol modified phenol resin, dicyclopentadiene modified phenol resin, and paraxylene modified phenol resin.

A curing accelerator such as an imidazole type, a tertiary amine type, a phosphorus compound type, or a mixture of two or more of these may be added as necessary.

If desired, a solvent, a flame retardant such as a bromine compound or a phosphorus compound, an antifoaming agent such as a silicone compound, a coloring agent such as carbon black or an organic pigment, a coupling agent, etc. may be added. .

Further, silica, alumina, calcium carbonate,
One or more powders such as titanium oxide and carbon black can be added as a filler.

The method of intermittently applying the insulating adhesive used in the present invention to a predetermined place is not particularly limited, and for example, a manual coating method such as brush coating, or automatic printing, coating, or tape is used. The method of pasting can be mentioned. In the present invention, in order to firmly join the IC chip mounting interposer and the antenna holder and to achieve good conduction, an insulating adhesive is applied at a predetermined position,
It is preferable to apply it intermittently in a pattern such as a line, a lattice, or a comb. However, this pattern is not limited to these, and if the IC chip mounting interposer and the antenna holder can be well conductively coupled,
One or a combination of two or more patterns such as lines, grids, and combs may be used. In the present invention, it may be applied intermittently, but in order to balance the adhesive force in the surface direction and achieve good conduction of the connecting conductive portion, dots, lines, grids, combs, etc. A pattern is desirable.

Since the adhesive used in the present invention has an insulating property, an insulating layer is not always necessary, but printing, coating, tape sticking, etc. are known on the IC chip mounting interposer side and / or the antenna holder side. An insulating layer can be provided by the method of.

The conductive part for connecting the IC chip mounting interposer and the antenna holder may be formed by any method that is easy to design and manufacture, and the processing tolerance is not required to be as precise as the conductive part for IC chip mounting. High structure is enough.

Since the present invention is not limited to the above embodiment, various modifications can be made without departing from the spirit of the claims.

[0035]

According to the method of forming the RF-ID medium using the insulating adhesive according to the first aspect of the present invention, the IC chip mounting interposer and the antenna carrier are superposed such that the conductive portions for connection face each other. At the same time, since the IC chip mounting interposer and the antenna holder are conductively joined by using the insulating adhesive which is intermittently applied, good continuity can be maintained and the joining can be strengthened. Even if external force is concentrated on the conductive part, the electrical connection may be interrupted,
Even if the base material has low strength and rigidity such as thin paper, the interposer is not peeled off.

The method for forming an RF-ID medium using the insulating adhesive according to claim 2 of the present invention is the same as the method for forming RF-ID medium according to claim 1, wherein the insulating adhesive is applied in a pattern. Since the interposer and the antenna holder are electrically connected to each other, the same effect as that of the forming method according to the first aspect can be obtained, and a further remarkable effect can be obtained such that better electrical connection can be maintained without damaging the connection.

[Brief description of drawings]

FIG. 1 is an explanatory diagram showing a process of forming an IC chip mounting interposer in an embodiment of a method of forming an RF-ID medium using an insulating adhesive of the present invention.

FIG. 2 is an explanatory diagram showing a process of forming an antenna holder according to one embodiment.

FIG. 3 is an explanatory diagram showing an RF-ID medium.

FIG. 4 is an explanatory diagram schematically illustrating a cross section taken along line I-I of the RF-ID medium illustrated in FIG.

FIG. 5 is an RF-ID formed by another method of the present invention.
It is explanatory drawing which illustrates the cross section of a medium typically.

FIG. 6 is an RF-ID formed by another method of the present invention.
It is explanatory drawing which illustrates the cross section of a medium typically.

FIG. 7 is an RF-ID formed by another method of the present invention.
It is explanatory drawing which illustrates the cross section of a medium typically.

FIG. 8 is an explanatory diagram showing a process of forming an IC chip mounting interposer in a conventional method of forming an RF-ID medium.

FIG. 9 is an explanatory diagram showing a process of forming a conventional antenna holder.

FIG. 10 is an explanatory diagram showing a conventional RF-ID medium.

[Explanation of symbols]

1 base material 2 IC chip mounting conductive part 3 Conductive part for connection 4 Conductive pattern 5 IC chip 7 Base material 8 Antenna conductive part 9 Conductive part for connection 10 Conductive pattern 11 Insulation part 12 Insulating adhesive 13 Sealant A1, A2 IC chip mounting interposer B1, B2 antenna holder C1, C2, C3, C4, C5 RF-ID media

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Shingo Naoi             1-6, Kanda Surugadai, Chiyoda-ku, Tokyo             Within Toppan Forms Co., Ltd. F-term (reference) 2C005 MA10 NA08 NA31 NA34 NB03                 5B035 AA07 BA05 BB09 CA02 CA23

Claims (2)

[Claims] 1. A conductive pattern having at least a conductive portion for connection is provided on a base material, an IC chip is mounted on the conductive portion for connection to form an IC chip mounting interposer, and an antenna conductive portion and this antenna conductive portion are provided. An antenna holder is formed by providing a conductive pattern on the base material with a conductive portion for connection located at the end of, and the interposer and the antenna holder are superposed so that the respective conductive portions for connection face each other. An RF-ID using an insulating adhesive, characterized in that the interposer and the antenna holder are conductively joined by using an insulating adhesive applied intermittently.
Method of forming media. 2. The method of forming an RF-ID medium according to claim 1, wherein the interposer and the antenna holder are conductively joined to each other by using an insulating adhesive provided in a pattern.