JP2002134684A - Mounting structure of semiconductor device and communication device using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a mounting device of IC and a communication device capable of improving the structure of a circuit board, further optimizing the position relation of IC and an antenna body and preventing the influence of high frequency noise generated from the active face of IC. SOLUTION: In an arm mounting communication device, IC 9 generating the high frequency noise is faced down and bonded on the circuit board 7 toward the contrary side to the direction where the whole or the greater part of the antenna body 4 positions the active face 90. The circuit board 7 is a multi-layer board, and a shielding electrode layer 73 held ground potential or power source potential thereto is constituted. The high frequency noise which the active face 90 of IC 9 generates is attenuated by the shielding electrode layer 73, and an electromagnetic field leaked to the circumference is small. Thus, the influence given to the antenna body 4 is small.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a structure for mounting a semiconductor device (hereinafter, referred to as an IC) on a circuit board. More specifically, the present invention relates to a shield structure for noise generated by an IC mounted on a circuit board.

[0002]

2. Description of the Related Art As a portable transmitter or receiver, a wristwatch equipped with an FM radio, a wristwatch-type individual selective calling receiver, and the like are known. With these small communication devices,
For example, by incorporating a conductive plate or film into an arm band for attaching the device body to the arm, a loop antenna (antenna body) is constituted by the above plate or film when the arm band is attached to the arm. It is supposed to be.

In such a communication device, as schematically shown in FIG. 7, a circuit board 7A is built in the main body of the device, and a surface portion 71A thereof (where the whole or most of the antenna body 4 is located). High frequency analog IC 9A for transmitting or receiving, a few MHz
An IC 9 such as a digital IC 9B for signal processing driven by a high-frequency drive signal is face-down bonded. Here, the circuit board 7A is made of glass-
A copper layer, which is made of an epoxy substrate or a phenolic resin substrate and has a base 70A, and a copper layer stuck on the surface of the base 70A constitutes a surface pattern 72A to which terminals 92 of the IC 9 are connected. .

[0004]

However, in the wrist-worn type communication device and the like, the inventor of the present application has examined various effects of high frequency noise. As a result, as in the prior art, a high frequency analog IC 9A or a digital IC 9B for signal processing was used.
When face down bonding is performed on the front surface portion 72A of a conventionally used normal circuit board 7A, a new finding is obtained that the receiving sensitivity and the transmitting sensitivity are low. That is, the high-frequency analog IC 9A and the digital I / O for signal processing are used.
From the active surface 90 of the IC 9 such as C9B (which means the surface where the terminals are exposed, the wiring surface, and the element surface), high-frequency noise is generated as shown by an arrow D. The antenna 4 passes through the circuit board 7A as it is.
Because it will arrive at

[0005] In addition to portable communication devices such as portable telephones and PHSs, there is a remarkable demand for miniaturization not only of wrist-worn communication devices. In order to satisfy these demands for miniaturization, the circuit area is reduced by integrating each circuit into an integrated circuit (IC), and high-density mounting of circuit elements is performed.

As examples of these high-density mountings, there are a method of reducing the size of an IC package, disposing an IC directly on a substrate and directly connecting the substrate and the IC by wire bonding, and a face-down bonding as shown in the present invention. It can be used.

On the other hand, in a wireless device, noise generated from each circuit interferes and reaches a circuit that receives a small signal, such as an antenna or a preceding stage of a receiving circuit. The influence of these noises is inconsistent with the demand for miniaturization of the equipment, and becomes greater as the antennas and circuits are closer to each other. Therefore, there is a great problem in improving the reception sensitivity and the like.

[0008] In view of the above problems, an object of the present invention is to provide:
An object of the present invention is to provide an IC mounting structure and a communication device in which the influence of high-frequency noise generated from the IC does not reach the periphery by improving the structure of the circuit board on which the IC serving as a noise source is face-down bonded. is there.

Further, an object of the present invention is to provide such an IC
Optimizing the positional relationship between the IC and the antenna body in a communication device using the mounting structure of the above, more reliably preventing the influence of high-frequency noise generated from the active surface of the IC from affecting the antenna body, and increasing the sensitivity. It is to provide a configuration that can be used.

[0010]

In order to solve the above-mentioned problems, the mounting structure of the present invention has the following features.
In a mounting structure of an integrated circuit having an integrated circuit and a circuit board in which the integrated circuit is face-down bonded to a substrate surface, the circuit board includes a shield electrode layer facing an active surface of the integrated circuit, The shielding electrode layer is maintained at a ground potential or a power supply potential.

In the mounting structure of the present invention, face-down bonding refers to bonding a surface electrode or wiring lead previously attached to an IC semiconductor chip and a wiring electrode formed on a substrate to face each other. This means all the methods of electrically connecting the electrodes, and also includes flip chip bonding.

In the mounting structure of the present invention, the shield electrode layer of the circuit board faces the active surface of the IC, and the shield electrode layer is maintained at a predetermined potential.
Even if high-frequency noise is generated from the active surface, the high-frequency noise is attenuated by the shield electrode layer, and the electromagnetic field leaking to the surroundings is small. Therefore, when the IC mounting structure according to the present invention is used in, for example, a communication device, high sensitivity can be obtained because high-frequency noise generated from the active surface of the IC does not reach the antenna body. In addition, since high frequency noise can be shielded only by replacing the conventional circuit board with a circuit board having a shield electrode layer, it is suitable for cost reduction and size reduction.

In the mounting structure of the present invention, it is preferable that the shield electrode layer is formed at least on the entire surface of the region facing the active surface of the integrated circuit. With this configuration, the effect of shielding noise is high because the formation region of the shield electrode layer is large. Further, as set forth in claim 3, the circuit board has one
It is preferable that the substrate is a multilayer substrate having one or more inner layers and a surface layer. Further, as described in claim 4, the circuit board includes:
The shield electrode layer is configured as a double-sided substrate provided on either the substrate surface on which the integrated circuit is mounted or the opposite substrate surface, and the shield electrode layer is held at a ground potential or a power supply potential. May be. In the case of the multilayer board, as described in claim 5, the circuit board includes a through hole for conducting the surface layer pattern formed on the surface of the circuit board and the shield electrode layer, It is preferable that the shield electrode layer is held at a ground potential or a power supply potential via the through hole and the surface layer pattern.

[0014] In the mounting structure of the present invention, it is preferable that the multilayer substrate has one or more shielding electrode layers in an inner layer thereof. Further, the shield electrode layer may be provided in both the surface layer pattern and the inner layer of the multilayer substrate.

It is preferable that the communication apparatus of the present invention has the mounting structure of the present invention and an antenna used for at least one of transmission and reception.

In this case, as described in claim 9,
The integrated circuit is at least one of a high-frequency analog integrated circuit having at least one of a transmission function and a reception function, and a digital integrated circuit for signal processing driven by a high-frequency drive signal. Is preferred.

Preferably, the antenna body is located on the same side as the side opposite to the direction in which the integrated circuit faces. Further, as set forth in claim 11, it is preferable that the antenna body is configured on the same circuit board on which the integrated circuit is mounted or on a different substrate from the circuit board.

In the communication device according to the present invention, there is a case where the communication device is configured as a wrist-worn type. In this case, an apparatus in which the side on which the display surface is configured is the front side is described. It is preferable that a main body and an arm band extending from the device main body to the rear surface side for mounting the device main body on an arm are provided, and the antenna body is formed on the arm band.

[0019]

Embodiments of the present invention will be described with reference to the drawings.

[First Embodiment] FIG. 1 is an explanatory diagram showing the configuration of an arm-mounted communication device to which the present invention is applied.

Referring to FIG. 1, an arm-mounted communication device 1 includes a device main body 2 having a liquid crystal display panel 6 (display surface) disposed on the front side, and a pair of arm bands 4R and 4L. ing. Each arm band 4R, 4L,
The base end of each band is attached to both ends of the device body,
These bands can be connected to each other by a buckle 41 at each end. Wristband 4R, 4L
Has an electric conductor plate installed therein, and is configured to form an antenna body 4 (loop antenna) when it is attached to the user's wrist and the ends of the arm bands 4R and 4L are connected to each other. ing. The device main body 2 includes a casing 3a on the front surface side and a back cover 3b fixed to the back side of the casing 3a on the back side of the device main body 2. Apparatus main body 2 composed of casing 3a and back cover 3b
Has a built-in circuit assembly 5.

FIGS. 2A and 2B show the front and back surfaces of the circuit assembly 5, respectively. FIG. 3A is an explanatory diagram schematically showing a cross section of the circuit assembly 5 taken along line XX ′ in FIGS. 2A and 2B.

As shown in FIGS. 2 (a) and 2 (b), the circuit assembly 5 has a structure in which main components are stacked in the thickness direction inside the apparatus main body 2.
That is, in the circuit assembly 5, the liquid crystal display panel 6, the circuit board 7, and the circuit driving battery 8 are arranged in the thickness direction.

As shown in FIG. 3A, the antenna 4
Are extended to the back side of the circuit board 7 while being held by the arm bands 4R and 4L. Note that the antenna body 4 does not necessarily need to be directly fixed to the circuit board 7 and may be electrically connected to the terminal portion of the circuit board 7, and may be simply press-contacted or wired and connected with a lead wire or the like. You may.

On the circuit board 7, on the back side where most of the antenna body 4 formed when the ends of the arm bands 4 R and 4 L attached to the wrist are joined together, and on the back side 77, An IC 9 that generates high-frequency noise, such as a high-frequency analog IC 9A having a transmitting and receiving function and a digital IC 9B for signal processing, is face-down bonded. Therefore, high frequency analog IC
9A and IC9 such as digital IC9B for signal processing
In any case, the active surface 90 faces the side of the circuit board 7 (the side where the liquid crystal display panel 6 is located), and does not face the direction in which the whole or most of the antenna body 4 is located. Among these ICs 9, the high-frequency analog IC 9 </ b> A has a property of generating high-frequency noise from the active surface 90, as shown by an arrow A, for transmitting and receiving signals of a high frequency of several tens MHz to several hundred MHz. In addition, the digital IC 9B for signal processing incorporates a digital circuit for sampling a received signal before analog / digital conversion, a phase lock loop circuit, and the like, and is driven by a high frequency drive signal such as several MHz. As shown by A, the active surface 90 has a property of generating high-frequency noise.

In this embodiment, a multilayer board is used as the circuit board 7, and in this circuit board 7, a surface layer pattern 72 (wiring pattern) is formed on a base 70 made of a glass-epoxy substrate or a phenol resin substrate. Further, a shield electrode layer 73 is formed in an inner layer portion of the circuit board 7 in a region corresponding to a mounting region of the IC 9 (a region facing the active surface 90 of the IC 9). Here, the shield electrode layer 73 may be formed as one or two layers in the thickness direction of the circuit board 7, or even more, as shown, for example, as the shield electrode layer 73 '.

In the circuit board 7, a plurality of through holes 74 are formed around the mounting area of the IC 9, and these through holes 74 are formed in the surface layer pattern 72 to which the terminals 92 of the IC 9 are electrically connected. The surface layer pattern 72 held at the power supply potential and the shield electrode layer 73 are electrically connected.

Here, as schematically shown in FIG. 3B, the planar shape of the shield electrode layer 73 is, in this embodiment, the formation area of the shield electrode layer 73 over a wider area than the mounting area of the IC 9. I have. Also, the shield electrode layer 73
Are formed on the entire surface of the formation region, and have a so-called solid electrode pattern.

In the arm-mounted communication device 1 thus configured, even if high-frequency noise is generated from the active surface 90 of the IC 9 such as the high-frequency analog IC 9A or the digital IC 9B for signal processing as shown by the arrow A, A shield electrode layer 73 facing the active surface 90 of the IC 9 is formed on the circuit board 7, and the shield electrode layer 73 is held at the ground potential or the power supply potential through the through hole 74 and the surface layer pattern 72. . Therefore, high-frequency noise generated from the active surface 90 of the IC 9 is attenuated by the shield electrode layer 73, and the electromagnetic field leaking to the surroundings is small.
Therefore, each circuit portion and the antenna 4 constituting the arm-mounted communication device 1 are not affected by high-frequency noise generated from the active surface 90 of the IC 9. In addition, since the conventional circuit board is replaced with the circuit board 7 having the shield electrode layer 73, high-frequency noise can be shielded, which is suitable for cost reduction and miniaturization. Since the formation region is formed as a solid electrode pattern in a region wider than the mounting region of the IC 9, the effect of shielding high-frequency noise is high. Moreover, even if such a shield electrode layer 73 is formed, since the shield electrode layer 73 is formed only in the inner layer of the multilayer substrate, other components are mounted on the front surface portion 71 and the rear surface portion 77 of the circuit board 7. There is no problem to implement.

Further, since a surface layer pattern 72 always held at the ground potential or the power supply potential is formed on the surface of the circuit board 7, the surface layer pattern 72 and the shield electrode layer 73 are connected through the through holes 74. To make it conductive. Therefore, the shield electrode layer 73 can be maintained at a predetermined potential (ground potential or power supply potential) without supplying special power to the shield electrode layer 73.

In addition, in the arm-mounted communication device 1 of the present embodiment, the high-frequency analog IC 9 for generating high-frequency noise is used.
A and IC9 such as digital IC9B for signal processing
In any case, the active surface 90 faces the circuit board 7 side (the side where the liquid crystal display panel 6 is located) on the back surface portion 77 of the circuit board 7, and the direction in which most of the antenna body 4 is located is Not turned. Therefore, high-frequency noise generated from the active surface 90 of the IC 9 hardly reaches the antenna body 4 even if it leaks to the surroundings. Therefore, the arm-mounted communication device 1 to which the present invention is applied has high sensitivity.

[Second Embodiment] In the above embodiment, a communication device in which an antenna body is formed in an arm band for mounting the device main body on an arm has been described as an example, but as shown in FIG. The mounting structure according to the present invention may be applied to a communication device in which the IC 9 and the antenna body 4 are formed on the same circuit board 7. In the following description and the descriptions of Embodiments 3 and 4 described later, the portions having the same functions as those of Embodiment 1 are denoted by the same reference numerals, and detailed description thereof will be omitted.

FIG. 4A is a perspective view schematically showing the arrangement of the antenna and the circuit board in the communication apparatus according to the present embodiment, and FIG. 4B is a longitudinal sectional view of this arrangement.

As shown in FIGS. 4A and 4B, the wrist-mounted communication device 1 of this embodiment has a circuit board 7 on which various electronic components are mounted, and a surface portion 71 of the circuit board 7. And an antenna body 4 configured. Among the electronic components, an IC 9 that generates high-frequency noise, such as a high-frequency analog IC 9A or a digital IC 9B for signal processing, is face-down bonded to the surface portion 71 of the circuit board 7. Therefore, all of the ICs 9 such as the high-frequency analog IC 9A and the digital IC 9B for signal processing have the active surface 90 facing the circuit board 7 (the side where the liquid crystal display panel 6 is located), and the entire antenna body 4 or It is not oriented in the direction where most are located.

The circuit board 7 is a multilayer board similar to that described with reference to FIGS. 3A and 3B in the first embodiment, and is a base made of a glass-epoxy board or a phenol resin board. A surface layer pattern 72 (wiring pattern) is formed on 70, and a shield electrode layer 73 is formed in a region corresponding to a mounting region of the IC 9 (a region facing the active surface 90 of the IC 9) in the inner layer portion. . Also,
The circuit board 7 includes, among the surface patterns 72 to which the terminals 92 of the IC 9 are electrically connected, a surface pattern 72 held at a ground potential or a power supply potential, and a shielding electrode layer 73.
And a through hole 74 for electrically connecting the two.

Therefore, in the communication device of this embodiment, as in the first embodiment, even if the IC 9 generates high-frequency noise from the active surface 90 as shown by the arrow B, the through hole 74 is formed in the active surface 90 of the IC 9. Further, since the shield electrode layer 73 held at the ground potential or the power supply potential is opposed via the surface layer pattern 72, high-frequency noise generated from the active surface 90 of the IC 9 is attenuated by the shield electrode layer 73, and The leaked electromagnetic field is small. In addition, the IC 9 has the active surface 90 facing the circuit board 7, and does not face the direction in which the whole or most of the antenna body 4 is located. Therefore, as in the first embodiment, the sensitivity of the communication device is high, such that high-frequency noise generated from the active surface 90 of the IC 9 does not easily reach the antenna 4 even if it leaks to the surroundings.

[Third Embodiment] The invention in which the effect of high frequency noise generated from an active surface of an IC on an antenna body is prevented by a shield electrode layer of a multilayer substrate is shown in FIGS. As shown in FIG. 2), an IC 9 that generates high-frequency noise, such as a high-frequency analog IC 9 </ b> A or a digital IC 9 </ b> B for signal processing, is face-down bonded to the circuit board 7 on the side of the back surface 77 opposite to the antenna body 4. Can be applied to the communication device 1 having a certain structure.

That is, in the present embodiment, FIG.
As shown in (b), the antenna 9 is mounted on the front surface 71 of the circuit board 7, and the IC 9 that generates high-frequency noise such as the high-frequency analog IC 9 </ b> A or the digital IC 9 </ b> B for signal processing is mounted on the rear surface 77 of the circuit board 7. Face down bonding. For this reason, the high frequency analog IC 9A and the digital IC 9B
All of C9 face the active surface 90 in the direction where the whole or most of the antenna body 4 is located.

Nevertheless, the circuit board 7 is a multilayer board as described with reference to FIGS. 3A and 3B in the first embodiment, and a circuit board 7 made of a glass-epoxy board or a phenol resin board is used. A surface layer pattern 72 (wiring pattern) is formed, and a shield electrode layer 73 is formed in an inner layer portion thereof in a region corresponding to a mounting region of the IC 9 (a region facing the active surface 90 of the IC 9). Also,
The circuit board 7 includes, among the surface patterns 72 to which the terminals 92 of the IC 9 are electrically connected, a surface pattern 72 held at a ground potential or a power supply potential, and a shielding electrode layer 73.
And a through hole 74 for electrically connecting the two.

Therefore, even in the communication device of this embodiment, as in the first embodiment, even if the IC 9 emits high-frequency noise from the active surface 90 as shown by the arrow C, the active surface 90 of the IC 9 has
Since the shield electrode layer 73 held at the ground potential or the power supply potential is opposed to the shield electrode layer 73 through the through hole 74 and the surface layer pattern 72, high-frequency noise generated from the active surface 90 of the IC 9 is attenuated by the shield electrode layer 73. The electromagnetic field leaking to the surroundings is small. Therefore, there is an effect that high-frequency noise generated from the active surface 90 of the IC 9 hardly reaches the antenna 4.

[Embodiment 4] FIG. 6A is an explanatory view of an IC mounting structure formed in a communication device according to the present embodiment as seen through the IC from above, and FIG. 6B is a longitudinal section thereof. FIG.

In the communication device according to the present embodiment, FIG.
As shown in (b), the surface pattern 720 (the hatched area shown in FIG. 6A) formed on the surface portion 71 of the circuit board 7 is used as a shielding electrode layer, and the terminal 92 is connected to the circuit board 7. IC9 face-down bonded through
This is for attenuating high-frequency noise generated from the active surface 90 of an (IC that generates high-frequency noise). That is,
In the present embodiment, a large-area surface pattern 720 is formed on the surface portion 71 of the circuit board 7 directly below the IC 9 so as to avoid terminals and wiring patterns other than terminals used for shielding the IC 9. Pattern 7
Reference numeral 20 is held at the ground potential or the power supply potential. With such a configuration, the shielding is performed immediately below the IC 9, so that the effect is large.

The circuit board 7 is a multi-layer board, and is composed of a base 7 made of a glass-epoxy board or a phenol resin board.
The area (I) corresponding to the mounting area of the IC 9
An electrode layer 73 for shielding is formed in a region facing the active surface 90 of C9). Here, the surface layer pattern 720 for the shield and the electrode layer 73 for the shield are formed in the through holes 7.
4 for electrical connection. Therefore, even if the IC 9 emits high-frequency noise from the active surface 90, the high-frequency noise is attenuated by both the surface layer pattern 720 and the shield electrode layer 73, and the electromagnetic field leaking to the surroundings is extremely small.

Here, the through holes for electrically connecting the surface layer pattern 720 and the shield electrode layer 73 are shown in FIG.
As shown as a through hole 740 in FIG.
One or more may be formed in the mounting area. With this configuration, the IC 9 can be mounted in a relatively small area on the circuit board 7.
Can be shielded against the active surface 90.

[Other Examples] In the first to third embodiments, the case where a loop antenna is used as the antenna body 4 has been described. However, a slit is formed in the longitudinal direction of the antenna body to constitute a slot antenna. May be.

The present invention is not limited to the case where the antenna 4 is also formed on the same circuit board 7 on which the IC 9 is mounted.
Even when the antenna body 4 is formed on a substrate different from the circuit board 7, the shield electrode layer 73 of the circuit board 7 is opposed to the active surface 90 of the IC 9, and the shield electrode layer If 73 is held at the ground potential or the power supply potential, the effect of high-frequency noise generated by the active surface 90 can be prevented from affecting the antenna 4. Further, even when the antenna body 4 is formed on a substrate different from the circuit board 7, the active surface 90 is located in a direction opposite to the direction in which the whole or most of the antenna body 4 is located with respect to the circuit board 7. If the IC 9 that generates high-frequency noise is mounted on the circuit board 7 such that the IC 9 emits high-frequency noise from the active surface 90, the effect of the high-frequency noise will not affect the antenna 4.
, The effect of high sensitivity is obtained.

Furthermore, a double-sided board may be used as the circuit board 7, and the shield electrode layer 73 may be formed on the board surface opposite to the board surface on which the IC 9 is mounted. It is most effective to form the shield electrode layer 73 as a solid electrode layer over as large an area as possible. However, in order to avoid other wiring patterns and through holes, an electrode layer patterned in a predetermined shape is used. May be used.

Further, the mounting structure of the IC 9 according to the present invention includes a wristwatch with an FM radio, a wristwatch-type individual selective calling receiver, a pocket type pager, a mobile phone, and a PHS.
The present invention can be applied to any type of communication device, and is not limited to communication devices, and can be applied to any device that needs to prevent the influence of high-frequency noise generated by the IC 9. May be.

[0049]

As described above, the IC according to the present invention is
Is characterized in that the shield electrode layer of the circuit board faces the active surface of the IC, and the shield electrode layer is maintained at a predetermined potential. Therefore, according to the present invention, even if high-frequency noise is generated from the active surface of the IC, the high-frequency noise is attenuated by the shield electrode layer, and the electromagnetic field leaking to the surroundings is small. In addition, the shielding electrode layer has a greater shielding effect as it comes closer to the active circuit, but the mounting structure according to the present invention has a structure in which the shielding electrode layer is extremely close compared to other mounting structures. Also in this respect, the shielding effect is large. Therefore,
When the mounting structure of the IC according to the present invention is used in, for example, a communication device, high-frequency noise generated from the IC does not reach the antenna body, so that high sensitivity can be obtained.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram illustrating an overall configuration of a wrist-worn communication device according to Embodiment 1 of the present invention.

2A is a plan view of a circuit assembly mounted on the wrist-worn communication device shown in FIG. 1, and FIG. 2B is a bottom view thereof.

3A is an explanatory view schematically showing a cross section of a main part of the circuit assembly shown in FIG. 2 taken along the line XX ′, and FIG. 3B is a view showing the circuit assembly; It is a top view which shows the formation area of the shield electrode layer formed in the built-in circuit board (multilayer board).

FIG. 4A is a perspective view schematically showing an arrangement of an antenna body and a circuit board in a wrist-worn communication device according to Embodiment 2 of the present invention, and FIG.
It is a longitudinal cross-sectional view which shows the mounting structure of C typically.

FIG. 5A is a perspective view schematically showing an arrangement of an antenna body and a circuit board in a wrist-mounted communication device according to Embodiment 3 of the present invention, and FIG.
It is a longitudinal cross-sectional view which shows the mounting structure of C typically.

FIG. 6A is an explanatory diagram of an IC mounting structure configured in a communication device according to a fourth embodiment of the present invention when the IC is viewed from above, and FIG. 6B is a longitudinal sectional view thereof. is there.

FIG. 7 is a vertical sectional view schematically showing a conventional IC mounting structure.

[Description of Signs] 1 ... Communication device 2 ... Device main body 4 ... Antenna body 4R, 4L ... Arm band 5 ... Circuit assembly 6 ... Liquid crystal display panel (display surface) 7 ... Circuit board 70 ... Base of circuit board 71 ... Surface part 72 ... Surface layer pattern 720 ... Surface layer pattern for shield 73 ... Shield electrode layer 74,740 ... Through hole 77: Back surface 9: IC for generating high frequency noise 9A: High frequency analog IC for generating high frequency noise 9B: Digital IC for signal processing for generating high frequency noise 90: High frequency noise Active surface of the generated IC

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H05K 9/00 H01L 25/04 Z // H04B 1/034 F term (Reference) 5E321 AA17 BB25 GG05 5F044 KK02 KK09 5K011 AA06 AA15 AA16 JA01 JA11 KA04 5K016 AA06 AA07 BA06 CA03 EA10 GA02 JA03 5K060 AA02 AA10 AA12 BB08 CC04 DD04

Claims (12)

[Claims] 1. A mounting structure of an integrated circuit having an integrated circuit and a circuit board having the integrated circuit face-down bonded to a substrate surface, wherein the circuit board has a shield electrode facing an active surface of the integrated circuit. A mounting structure for a semiconductor device, comprising a layer, and wherein the shield electrode layer is held at a ground potential or a power supply potential. 2. The mounting structure of a semiconductor device according to claim 1, wherein the shield electrode layer is formed at least over an entire surface of the region facing the active surface of the integrated circuit. 3. The mounting structure of a semiconductor device according to claim 1, wherein the circuit board is a multilayer board having at least one inner layer and a surface layer. 4. The circuit board according to claim 1, wherein the circuit board is configured as a double-sided board including the shield electrode layer on one of a substrate surface on which an integrated circuit is mounted and an opposite substrate surface. Wherein the shield electrode layer is held at a ground potential or a power supply potential. 5. The method according to claim 1, wherein
The circuit board includes a through hole for conducting a surface layer pattern formed on a surface of the circuit board and the shield electrode layer, and the shield electrode layer is connected to a ground potential via the through hole and the surface layer pattern. Alternatively, a mounting structure of a semiconductor device which is held at a power supply potential. 6. The mounting structure of a semiconductor device according to claim 3, wherein one or more shielding electrode layers are provided in an inner layer of the multilayer substrate. 7. The mounting structure of a semiconductor device according to claim 3, wherein the shield electrode layer is provided on both a surface layer pattern and an inner layer of the multilayer substrate. 8. A communication device having the mounting structure of the semiconductor device according to claim 1 and having an antenna used for at least one of transmission and reception. 9. The integrated circuit according to claim 8, wherein the integrated circuit includes a high-frequency analog integrated circuit having at least one of a transmission function and a reception function, and a digital integrated circuit for signal processing driven by a high-frequency drive signal. A communication device comprising at least one of the integrated circuits. 10. The communication device according to claim 8, wherein the antenna body is located on a side opposite to or on the same side as a direction in which the integrated circuit faces. 11. The antenna according to claim 8, wherein the antenna is formed on the same circuit board on which the integrated circuit is mounted or on a different base from the circuit board. A communication device. 12. The device body according to claim 8, wherein the side on which the display surface is formed is the front side, and the device body extends from the apparatus body to the back side and is attached to the arm. A communication device comprising: an arm band; and the antenna body is configured in the arm band.