JP2000223876A - Electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic apparatus in which a heat generating component on a circuit board can be cooled by utilizing cooling air sucked by a fan device and cooling air sent by the fan device and improve the cooling efficiency of the heat generating component. SOLUTION: An electronic apparatus has a housing 4. A circuit board 30 is housed in the housing. The inside of the housing is partitioned by a suction path 36 and an exhaustion path 37 by the circuit board. An MPU(micro procesing unit) 32 which is exposed to either one of the suction path or exhaustion path is mounted on the circuit board. A fan device 43 is housed in the housing. The fan device has a suction inlet 50 linked with the suction path and a blowing outlet 51 linked with the exhaustion path. Cooling air is made to circulate through the suction path and the exhaustion path by driving the fan device.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device such as a portable computer, and more particularly to a structure for forcibly cooling a heating element housed in a housing of the electronic device.

[0002]

2. Description of the Related Art In recent years, portable electronic devices represented by book-type portable computers and mobile information devices have been developed.
In order to process various types of multimedia information such as characters, voices, and images, the processing speed of a microprocessing unit (MPU) has been increased and the functions thereof have been increased. In this type of MPU, power consumption is steadily increasing with higher integration and higher performance, and the amount of heat generated during operation tends to increase rapidly in proportion thereto.

Therefore, when housing an MPU having a large heat value in a housing of a portable computer, it is necessary to enhance the heat radiation of the MPU inside the housing, and therefore, the MPU must be forcibly attached. A dedicated cooling device for cooling is required.

[0004] As a cooling device for the MPU, a cooling device in which a heat sink and an electric fan device are integrated is conventionally known. The heat sink includes a heat receiving unit that receives the heat of the MPU, and a heat exchange unit connected to the heat receiving unit.
It is housed inside the housing together with the circuit board on which the MPU is mounted.

[0005] The fan device has a fan casing for supporting the fan. The fan casing has a suction port for sucking cooling air and a blow port connected to the suction port, and the suction port is supported by the heat exchange section of the heat sink in a posture facing the heat receiving section. The fan device is adjacent to a side wall or a rear wall of the housing, and an exhaust port connected to an air outlet of the fan casing is opened in the side wall or the rear wall.

For this reason, when the fan device is driven, the air inside the housing is sucked into the inlet of the fan casing,
This air becomes cooling air and is guided to the heat sink. As a result, the heat sink is cooled by forced convection using the cooling air as a medium, and the M
The heat of the PU is multiplied by the flow of the cooling air and is discharged from the fan opening of the fan casing to the outside of the housing through the exhaust port.

[0007]

However, according to the conventional cooling device, since the air outlet of the fan device is directly connected to the air outlet of the housing, the cooling air blown from the air outlet of the fan device. Is directly discharged to the outside of the housing through the exhaust port.

Therefore, only the flow path of the cooling air flowing toward the fan device exists inside the housing, and the cooling air blown from the fan device does not contribute to the cooling of the MPU or the heat sink at all. become.

Therefore, in order to increase the cooling efficiency of the MPU and the heat sink, it is necessary to use a heat pipe together or to increase the rotation speed of the fan to increase the flow rate of the cooling air guided to the heat sink. In addition, the number of components increases, which leads to an increase in cost and an increase in noise.

The present invention has been made in view of such circumstances, and cools a circuit board and a heating element using cooling air sucked into the fan device and cooling air discharged from the fan device. It is an object of the present invention to provide an electronic device capable of improving the cooling efficiency of a heating element.

[0011]

According to a first aspect of the present invention, there is provided an electronic apparatus according to the first aspect of the present invention, wherein the electronic apparatus is housed in a housing; A circuit board partitioned into an exhaust passage; a heating element mounted on the circuit board and exposed to at least one of the intake passage and the exhaust passage; housed inside the housing;
And a fan device for circulating cooling air through each of the intake passage and the exhaust passage.

In such a configuration, when the fan device is driven, a flow of cooling air toward the suction port of the fan device is formed in the intake passage of the housing, and the fan device is formed in the exhaust passage of the housing. A flow of the cooling air discharged from the air outlet is formed. Therefore, the cooling air flowing through at least one of the intake passage and the exhaust passage is directly blown to the heating element, and the heating element can be forcibly cooled by forced convection using the cooling air as a medium.

Further, part of the heat generated by the heating element is diffused throughout the circuit board by heat conduction from the heating element to the circuit board. Since the circuit board partitions the inside of the housing into an intake passage and an exhaust passage, both surfaces of the circuit board are cooled by contact with cooling air flowing through the intake and exhaust passages. The transmitted heat of the heating element
The air can be efficiently discharged by multiplying the flow of the cooling air.

Therefore, both the cooling air flowing through the intake passage of the housing and the cooling air flowing through the exhaust passage of the housing can be positively used for cooling the heating element.
The cooling efficiency of the heating element can be increased without adding a special heat pipe or increasing the rotation speed of the fan device.

According to another aspect of the present invention, there is provided an electronic apparatus according to the present invention, wherein a housing is housed in the housing, and the interior of the housing is partitioned into an intake passage and an exhaust passage. A board; a heating element mounted on the circuit board and exposed to either the intake passage or the exhaust passage; and an air blower accommodated in the housing and connected to the suction port and the exhaust passage connected to the intake passage. A fan device having an opening, and for allowing cooling air to flow through the intake passage and the exhaust passage, respectively; and a fan device housed inside the housing and guiding the cooling air toward the heating element. A heat sink thermally connected to the body.

In such a configuration, when the fan device is driven, a flow of cooling air toward the suction port of the fan device is formed in the intake passage of the housing, and the fan device is provided in the exhaust passage of the housing. A flow of the cooling air discharged from the air outlet is formed. Therefore, the cooling air flowing through at least one of the intake passage and the exhaust passage is directly blown to the heating element, and the heating element can be forcibly cooled by forced convection using the cooling air as a medium.

A part of the heat generated by the heating element is diffused to the entire circuit board by heat conduction from the heating element to the circuit board, and is also diffused to the entire heat sink by heat conduction to the heat sink. In this case, since the circuit board partitions the inside of the housing into an intake passage and an exhaust passage,
Both surfaces of the circuit board are cooled by contact with the cooling air flowing through the intake / exhaust passages, and the heat of the heating element transmitted to the circuit board can be efficiently released by multiplying the flow of the cooling air. .

At the same time, the cooling air is guided to the heating element through the heat sink, so that the flow of the cooling air can be concentrated on the heating element, and the cooling air guided to the heating element is correspondingly increased. The flow rate increases, and the heat radiation performance of the heating element can be improved. In addition, since the heat sink is in direct contact with the cooling air, the heat sink can be actively cooled by forced convection using the cooling air as a medium, and the heat of the heating element transmitted to the heat sink can be efficiently released. Can be.

As a result, both the cooling air flowing through the intake passage of the housing and the cooling air flowing through the exhaust passage of the housing can be positively used for cooling the heating element. The cooling performance of the heating element can be improved without adding a pipe or increasing the rotation speed of the fan device.

[0020]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 and FIG. 2 show a first embodiment of the present invention applied to a portable computer.
It will be described based on the following.

FIG. 1 discloses a portable computer 1 as an electronic device. The portable computer 1 includes a computer main body 2 and a display unit 3 supported by the computer main body 2.

The computer main body 2 has a box-shaped housing 4. The housing 4 includes a bottom wall 5, a front wall 6 extending upward from a peripheral edge of the bottom wall 5, left and right side walls 7 a and 7 b, and a rear wall 8.
And an upper wall 9 connected to upper ends of the front wall 6, the side walls 7a and 7b, and the rear wall 8. This housing 4 has a bottom wall 5
And a top cover 1 having an upper wall 9
It is divided into two. The base 11 is made of a metal material having thermal conductivity such as a magnesium alloy. The top cover 12 is made of a synthetic resin material,
It is detachably mounted on the base 11.

The upper wall 9 of the housing 4 has a palm rest 13 and a keyboard mounting opening 14. Palm rest 13
Extends in the width direction of the housing 4 in the front half of the upper wall 9. As shown in FIG. 2, the keyboard mounting port 14 is opened at the rear end of the palm rest 13 toward the inside of the housing 4, and a keyboard 15 is disposed in the keyboard mounting port 14.

The keyboard 15 includes a keyboard base 16
And a number of keys 17. The keyboard base 16 has a rectangular plate shape that fits tightly into the keyboard mounting port 14, and its lower surface is exposed to the inside of the housing 4 via the keyboard mounting port 14.
The keys 17 are arranged on the upper surface of the keyboard base 16.

The upper wall 9 of the housing 4 has a projection 20 projecting upward. The protrusion 20 extends in the width direction of the housing 4 at the rear end of the housing 4. This projection 20
Has a pair of display support portions 21a and 21b. The display supporting portions 21a and 21b are
Are formed so as to be continuously open forward, upward, and rearward of the housing 4 and are spaced apart from each other in the width direction of the housing 4.

The display unit 3 has a box-shaped display housing 23 and a flat liquid crystal display module 24 housed inside the display housing 23. The display housing 23 has a display opening 25 on the front surface, and a display screen 26 of the liquid crystal display module 24 is exposed to the outside of the display housing 23 through the opening 25.

The display housing 23 has a pair of legs 28a and 28b. Legs 28a, 28b
Are guided to the display support portions 21a and 21b of the housing 4 and are connected to the hinge device 27 shown in FIG.
Is rotatably connected to the housing 4 via the. For this reason, the display unit 3 is selectively turned over between a closed position where the palm rest 13 and the keyboard 15 are covered from above and an open position where the palm rest 13, the keyboard 15 and the display screen 26 are exposed. It can rotate.

As shown in FIG. 2, a circuit board 30 is housed inside the housing 4. The circuit board 30 has a bottom wall 5
Are fixed via screws to a plurality of seats 5a protruding upward from. The circuit board 30 is disposed substantially parallel to the bottom wall 5 below the keyboard 15 and the rear end of the upper wall 9 connected to the rear end of the keyboard 15. It is adjacent to the rear wall 8 of the housing 4. The circuit board 30 has a back surface 30a as a first surface and a front surface 30b as a second surface. The back surface 30a faces the bottom wall 5 and the front surface 30a
Faces the lower surface of the keyboard base 16 and the rear end of the upper wall 9.

Back surface 30a and front surface 30 of circuit board 30
In b, a number of circuit components 31 such as a semiconductor package and a connector are mounted. The surface 30b of the circuit board 30 is provided with an MPU: microp as a heating element.
A rocessing unit 32 is implemented. The MPU 32
The lower part of the keyboard 15 is adjacent to the left side wall 7 a of the housing 4.

The MPU 32 includes a wiring board 33 and an IC chip 34 flip-chip connected on the wiring board 33.
And a BGA type semiconductor package having
The IC chip 34 is exposed on the surface 30b of the circuit board 30. Since the IC chip 34 processes a large amount of multimedia information such as characters, voices, and images, the power consumption during the operation is large, and accordingly, the heat generation of the IC chip 34 needs to be cooled. It is big enough to do.

As shown in FIG. 2A, the circuit board 30
Divides the inside of the housing 4 up and down into an intake passage 36 and an exhaust passage 37. The intake passage 36 is formed between the bottom wall 5 of the housing 4 and the back surface 30 a of the circuit board 30, and some of the circuit components 31 are exposed in the intake passage 36. The rear end of the intake passage 36 is connected to the lower end of the rear wall 8 of the housing 4, and the lower end of the rear wall 8 is provided with an intake hole 38 connected to the intake passage 36.

The exhaust passage 37 is provided on the surface 30 of the circuit board 30.
b, the rear end of the upper wall 9 of the housing 4 and the keyboard base 1
6 and a part of the circuit components 31 and the MPU 32 that generates heat are exposed in the exhaust passage 37. The rear end of the exhaust passage 37 extends below the rear end of the upper wall 9, and a guide wall 39 extending downward is formed at the rear end of the upper wall 9. Guide wall 39
Is located inside the housing 4 and immediately before the protrusion 20 of the housing 4. The lower end of the guide wall 39 is close to the surface 30b of the circuit board 30, and closes the rear end of the exhaust passage 37. The upper wall 9 corresponding to the rear end of the exhaust passage 37
The rear end portion has a plurality of exhaust holes 40 connected to the exhaust passage 37.
Is open. Therefore, the intake hole 38 and the exhaust hole 40
Is located at a rear end of the housing 4 so as to be adjacent to each other with the circuit board 30 interposed therebetween.

As shown in FIG. 2, a fan device 43 is accommodated in the housing 4. The fan device 43 is arranged inside the housing 4 along with the circuit board 30 in order to cope with the thinning of the housing 4. For this reason,
The fan device 43 is located below the front half of the keyboard 15 and behind the MPU 32 that generates heat.

The fan device 43 includes a fan casing 44
And a fan 45 rotated by a flat motor (not shown). The fan casing 44 is made of a metal material having excellent thermal conductivity such as an aluminum alloy, for example, and has a flat frame shape in the thickness direction of the housing 4. The fan casing 44 is screwed to a plurality of seats 46 projecting upward from the bottom wall 5 of the housing 4. A gap 47 corresponding to the height of the seat 46 is formed between the fan casing 44 and the bottom wall 5, and the gap 47 is connected to the intake passage 36 inside the housing 4. I have.

The fan casing 44 has a suction port 50 and a blow port 51. The suction port 50 faces the bottom wall 5 of the housing 4 and communicates with the intake passage 36 through the gap 47. The air outlet 51 is opened upward on the side opposite to the suction port 50, and communicates with the exhaust passage 37 inside the housing 4.

The fan 45 is supported by the fan casing 44 via the flat motor. Fan 45
It has a rotation axis O1 passing through the center of rotation, and the rotation axis O1 is housed between the suction port 50 and the blower port 51 in a horizontal position along the thickness direction of the housing 4. And
The flat motor that rotationally drives the fan 45 is the MPU3
2 is activated when the temperature reaches a predetermined value.

Therefore, when the fan 45 is driven to rotate, a negative pressure acts on the intake passage 36 from the suction port 50 through the gap 47, and cool air outside the housing 4 is supplied to the intake passage 36 through the intake hole 38. It is being sucked.

As shown in FIG. 2A, the fan device 4
3 has a heat sink 53. Heat sink 5
3 is integrated with the fan casing 44 and extends from the blower port 51 of the fan casing 44 toward the exhaust passage 37.

The heat sink 53 has a wind guide 54 and a heat receiving portion 55. The wind guide unit 54 covers the fan casing 44 from above, thereby partitioning the air outlet 51 of the fan casing 44 from the inside of the housing 4. The air guide section 54 has a flat guide surface 56 interposed between the air outlet 51 and the keyboard base 16.
And a communication port 57 connected to the guide surface 56. The communication port 57 communicates with the exhaust passage 37 and faces the MPU 32 on the circuit board 30.

For this reason, when the fan 45 is driven to rotate, the cooling air blown from the blower port 51 is blown to the guide surface 56, and the flow direction is changed to the communication port 57 by contact with the guide surface 56. The angle is converted by approximately 90 ° toward the exhaust port 37.

The heat receiving section 55 has a flat plate shape that enters between the circuit board 30 and the keyboard base 16. The heat receiving section 55 has a lower surface 55 a facing the MPU 32. The lower surface 55a of the heat receiving portion 55 is continuous with the guide surface 56. Lower surface 55a of this heat receiving portion 55
Is formed with a seat portion 59 projecting toward the exhaust passage 37. The lower end of the seat portion 59 forms a flat heat receiving surface 60. The heat receiving surface 60 is thermally connected to the IC chip 34 that generates heat via the heat conductive grease 61.

Since the lower surface 55a of the heat receiving portion 55 is located below the keyboard base 16, the heat receiving portion 5
5, the height between the lower surface 55a of the circuit board 30 and the front surface 30b of the circuit board 30 is reduced, and the flow rate of the cooling air flowing from the communication port 57 to the MPU 32 is forcibly reduced. As a result, the flow velocity of the cooling air flowing toward the MPU 32 through the exhaust passage 37 is increased, and the MPU by the cooling air is correspondingly increased.
32 is designed to increase the heat radiation effect.

As shown in FIG. 2A, a plurality of radiation fins 62 are integrally formed on the lower surface 55a of the heat receiving portion 55. The radiation fins 62 protrude toward the exhaust passage 37 around the seat 59.

In the portable computer 1 having such a configuration, when the IC chip 34 of the MPU 32 generates heat, a part of the heat of the IC chip 34 is diffused throughout the circuit board 30 by heat conduction to the circuit board 30. . A part of the heat of the IC chip 34 is transferred to the heat receiving surface 6 of the seat 46.
In addition, the heat is transmitted to the heat receiving portion 55 through the heat receiving portion 55, and is diffused throughout the heat sink 53 by heat conduction from the heat receiving portion 46 to the wind guide portion 54.

When the temperature of the MPU 32 exceeds a predetermined value, the fan 45 is driven to rotate via a flat motor. As a result, a negative pressure acts on the suction port 50 of the fan casing 44, and as shown by an arrow in FIG.
Through the intake passage 36. The cooling air flows through the intake passage 36 along the back surface 30a of the circuit board 30 toward the fan device 43, and forcibly cools the circuit board 30 in the course of this flow.

The cooling air flowing through the intake passage 36 is sucked into the fan device 43 through the gap 47 and the suction port 50, and is directly blown from the blower port 51 to the guide surface 56 of the air guide 54 with the rotation of the fan 45. Can be After the cooling air has its flow direction changed by 90 ° by contact with the guide surface 56, it is intensively guided to the exhaust passage 37 through the communication port 57. And this cooling air is
The guide surface 56 of the heat receiving portion 55 and the surface 30b of the circuit board 30
IC chip 3 that flows backward along
4 is sprayed directly. As a result, the cooling air flows through the exhaust path 37, including the IC chip 34, the air guide 54, the heat receiving section 55, and the
Force cooling.

At this time, the guide surface 56 of the heat receiving portion 55
Since the radiation fins 62 facing the exhaust passage 37 are formed, the contact area between the cooling air flowing through the exhaust passage 37 and the heat receiving portion 55 increases, and the heat radiation of the heat receiving portion 55 improves accordingly.

The cooling air that has reached the rear end of the exhaust passage 37 has its flow direction changed upward by contact with the guide wall 39 as shown by the arrow in FIG. It is discharged to the outside of the housing 4 through 40.

According to the first embodiment of the present invention, the circuit board 30 on which the MPU 32 is mounted is
Is divided into upper and lower portions of an intake passage 36 and an exhaust passage 37, a flow of cooling air sucked toward the fan device 43 is formed in the intake passage 36, and a fan device is formed in the exhaust passage 37. The flow of the cooling air discharged from 43 is formed.

Therefore, both sides of the back surface 30a and the front surface 30b of the circuit board 30 can be forcibly cooled by the cooling air flowing through the intake / exhaust passages 36 and 37. The contact area increases. Therefore, the heat of the IC chip 34 transmitted to the circuit board 30 can be efficiently released by multiplying the flow of the cooling air.

Further, since the cooling air flowing through the exhaust passage 37 is directly blown onto the IC chip 34 which generates heat, the IC chip 34 can be actively cooled by forced convection using the cooling air as a medium. The cooling efficiency of the MPU 32 including the IC chip 34 can be improved.

As a result, the heat dissipation of the circuit board 30 is improved, and the cooling efficiency of the MPU 32 is further improved. Under a normal operating temperature environment, a special heat pipe may be added or a fan may be added. The operating environment temperature of the MPU 32 can be properly maintained without increasing the rotation speed of the MPU 45.

Further, according to the above configuration, the fan device 4
3 has a heat sink 53 extending from the blower port 51 toward the exhaust passage 37, and the cooling air is blown to the exhaust passage 37 through the communication port 57 of the heat sink 53, so that the cooling air is supplied to the MPU 32 which generates heat. The concentration can be concentrated, and the amount of cooling air guided to the MPU 32 increases.

In addition, since the flow rate of the cooling air toward the MPU 32 is increased by the presence of the heat sink 53, the heat radiation effect of the MPU 32 by the cooling air is increased accordingly. The cooling air flowing toward the exhaust passage 37 is supplied to the guide surface 56 of the heat exchange unit 54 and the lower surface 5 of the heat receiving unit 55.
5A, the heat sink 53 itself receiving heat from the IC chip 34 can be actively cooled by forced convection using cooling air as a medium.

As a result, the heat of the IC chip 34 transmitted to the heat sink 53 can be efficiently radiated.
There is an advantage that it effectively contributes to increasing the cooling efficiency of the PU 32.

The present invention is not limited to the first embodiment, and FIG. 3 shows a second embodiment of the present invention.

In the second embodiment, the heat sink of the first embodiment is omitted and the heat radiation performance of the circuit board 30 is enhanced. The basic configuration of the portable computer is as follows. This is the same as the first embodiment. Therefore, in the second embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.

As shown in FIG. 3A, the fan device 4
The third air outlet 51 faces the lower surface of the keyboard base 16 inside the housing 4. A gap 70 communicating with the exhaust passage 37 is formed between the air outlet 51 and the keyboard base 16.

Further, a shielding wall 71 extending downward is formed on the lower surface of the upper wall 9 facing the front edge of the opening of the keyboard mounting opening 14. The shielding wall 71 closes a gap 70 between the air outlet 51 of the fan device 43 and the keyboard base 16 from behind. Therefore, as shown by the arrow in FIG. 3A, the cooling air blown from the blower opening 51 has a flow direction of 90 ° due to the contact with the keyboard base 16.
After being converted, most of them are guided to the exhaust passage 37 along the lower surface of the keyboard base 16.

The back surface 30a and the front surface 30 of the circuit board 30
A large number of heat radiation pins 73 as heat radiation protrusions protrude from b. The heat radiating pins 73 are made of a metal wire, and are disposed near the MPU 32 respectively.
And project toward the exhaust passage 37. And
The heat radiating pins 73 are surface-mounted on the circuit board 30 by soldering to the back surface 30a and the front surface 30b of the circuit board 30, respectively.

Specifically, as shown in FIG.
A plurality of dummy pads 74 are arranged on the back surface 30a and the front surface 30b of the circuit board 30, respectively. The dummy pad 74 is formed at a position avoiding the circuit component 31 and the circuit pattern, and the heat radiation pin 73 is soldered on the dummy pad 74 using the same mounting process as that for the circuit component 31.

According to the second embodiment having such a structure, the heat radiation pins 73 protruding from the intake passage 36 and the exhaust passage 37 are soldered to the circuit board 30, so that they flow through the intake and exhaust passages 36 and 37. Cooling air and circuit board 3
The contact area with zero increases. Therefore, the heat of the MPU 32 released to the circuit board 30 can be efficiently released into the cooling air, and the cooling efficiency of the MPU 32 can be increased accordingly.

Moreover, since the heat radiating pins 73 are soldered to the dummy pads 74 on the circuit board 30, these heat radiating pins 73 are mounted on the circuit board 30 by using the same mounting process as the conventional general circuit component 31. Can be surface mounted. Therefore, there is an advantage that the work of mounting the heat radiation pins 73 on the circuit board 30 can be automated, and the work of mounting the heat radiation pins 73 can be easily performed.

When the amount of heat generated by the MPU 32 is smaller than that of the first and second embodiments, the heat sink and the radiation fins need to be mounted as in the third embodiment of the present invention shown in FIG. The circuit board 30 may be cooled by the cooling air flowing through the intake / exhaust passages 36 and 37, and the MPU 32 may be cooled by directly blowing the cooling air flowing through the exhaust passage 37 onto the MPU 32. .

Further, in each of the above embodiments, the MPU that generates heat is exposed to the exhaust passage. However, the present invention is not limited to this, and the MPU may be exposed to the intake passage, or both the exhaust passage and the intake passage may be exposed. May be exposed.

[0066]

According to the present invention described in detail above, the circuit board and the heating element are formed by utilizing both the cooling air flowing through the intake passage of the housing and the cooling air flowing through the exhaust passage of the housing. Can be cooled. Therefore, the cooling efficiency of the heating element can be increased without adding a special heat pipe or increasing the number of revolutions of the fan device, and the operating environment of the heating element can be appropriately maintained under a normal use temperature environment. Can be.

[Brief description of the drawings]

FIG. 1 is an exemplary perspective view of a portable computer according to a first embodiment of the present invention;

FIG. 2A is a sectional view of a computer main body showing a positional relationship between an intake passage and an exhaust passage inside a housing. FIG. 2B is a sectional view taken along the line 2F-2F in FIG.

FIG. 3A is a cross-sectional view of a computer main body showing a positional relationship between an intake passage and an exhaust passage inside a housing according to a second embodiment of the present invention. FIG. 3 (A) shows the state of FIG.
Sectional drawing which expands and shows 3F part of FIG.

FIG. 4 is a sectional view of a computer main body showing a positional relationship between an intake passage and an exhaust passage inside a housing according to a third embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 4 ... Housing | casing 30 ... Circuit board 32 ... Heating element (MPU) 36 ... Intake passage 37 ... Exhaust passage 43 ... Fan device 50 ... Suction port 51 ... Ventilation port 53 ... Heat sink

Claims (8)

[Claims] 1. A housing; a circuit board housed inside the housing and partitioning the inside of the housing into an intake passage and an exhaust passage; and a circuit board mounted on the circuit board and provided with the intake passage or the exhaust passage. A heating element that is exposed to at least one of them; and a cooling air accommodated in the housing and connected to the intake passage and the exhaust passage connected to the intake passage, and cooling air is provided in each of the intake passage and the exhaust passage. And a fan device for distributing the electronic device. 2. The electronic device according to claim 1, wherein the circuit board has a heat radiation protrusion protruding toward at least one of the intake passage and the exhaust passage. 3. The circuit board according to claim 2, wherein the circuit board has a first surface facing the intake passage and a second surface facing the exhaust passage, and the first and second surfaces are provided. Electronic equipment, wherein a pad is formed on at least one of the above, and the heat radiation projection is surface-mounted on the circuit board by soldering to the pad. 4. The fan device according to claim 1, wherein the fan device has a fan that is driven to rotate, and the suction port and the blow port face each other with the fan interposed therebetween.
The electronic device, wherein the fan device and the circuit board are arranged side by side inside the housing. 5. The electronic device according to claim 1, wherein the heating element is thermally connected to a heat sink. 6. A housing; a circuit board housed inside the housing and partitioning the inside of the housing into an intake passage and an exhaust passage; and a circuit board mounted on the circuit board and provided with the intake passage or the exhaust passage. A heating element that is exposed to one of them; a heating element that is housed inside the housing and has a suction port connected to the intake path and a blow port connected to the exhaust path, and supplies cooling air to the intake path and the exhaust path, respectively. And a heat sink housed inside the housing, guiding the cooling air toward the heating element, and thermally connected to the heating element. Electronic equipment characterized. 7. The heat generating element according to claim 6, wherein the heat generating element is exposed to the exhaust passage, and the heat sink includes a heat receiving part thermally connected to the heat generating element, and a fan receiving part from the heat receiving part. An electronic device, comprising: a wind guide extending toward the device, wherein the wind guide faces the air outlet of the fan device. 8. The electronic device according to claim 1, wherein the housing includes an intake port connected to the intake path and an exhaust port connected to the exhaust path.