JP2000075960A - Electronic equipment system and extension device for extending function of electronic equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain an electronic equipment system which can efficiently cool the housing and heating body of the electronic equipment by utilizing an extension device. SOLUTION: The electronic equipment system has a portable computer 1 having a housing 5 in which an IC chip 20 is stored and a mount part (36) where the housing of the portable computer is mounted detachably and is equipped with the extension device 2 which is used when the function of the portable computer is extended. The extension device 2 is equipped with a heat sink 75 which is thermally connected to the housing when the housing is mounted on the mount part.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device system including an electronic device such as a portable computer, and an extension device used to extend the function of the electronic device, and a desired extended function for the electronic device. More particularly, the present invention relates to a structure for promoting heat radiation of an electronic device.

[0002]

2. Description of the Related Art A portable electronic device represented by a portable computer and a mobile communication terminal device is a major factor in enhancing its commercial value due to its excellent portability. For this reason, recent electronic devices have been enhanced in thickness and weight of the housing, and can be easily carried in a bag or the like.

[0003] By the way, as the housing becomes thinner and more compact, the space for installing connectors for connecting external peripheral devices and the space for accommodating a floppy disk drive or a CD-ROM drive are lost from the housing. Would. For this reason, recent compact portable computers are equipped with an extension connector for adding a desired extension function, and an extension device called a docking station is connected to the extension connector so that the portable computer can be kept stationary. It is possible to secure expandability that is not inferior to a computer of a form.

This type of expansion device has a flat box-shaped device main body. The apparatus main body has a flat mounting surface on an upper part thereof, and a housing of the portable computer is removably mounted on the mounting surface.

In addition, a circuit board on which various circuit components are mounted, a floppy disk drive, and a CD-ROM drive are housed inside the apparatus main body, and a side wall or a rear wall of the apparatus main body is mounted on the circuit board. And a plurality of connectors for connecting various external peripheral devices such as an external keyboard or a printer. The circuit board, the floppy disk drive, the CD-ROM drive, and the connector are electrically connected to the portable computer via the expansion connector when the housing is mounted on the mounting surface. ing.

On the other hand, recent portable computers are
MPU: mi for processing a lot of multimedia information
The processing speed of the croprocessing unit has been increased and its function has been increased. In this type of MPU, power consumption is steadily increasing with higher integration and higher performance, and the amount of heat generated during operation tends to increase rapidly in proportion thereto. Therefore, when accommodating an MPU having a large calorific value in a housing of a portable computer, it is necessary to efficiently release the heat of the MPU to the outside of the housing.

For this reason, in the conventional portable computer, a heat sink thermally connected to the MPU and a fan for sending cooling air around the heat sink are accommodated in the housing, and the MPU is forcibly air-cooled. That is being done.

[0008]

However, in recent years, in a portable computer in which the thickness has been reduced, a circuit board and circuit components are housed at a high density in a housing.
Here, it tends to be difficult to secure an extra space for accommodating a fan or a heat sink. Therefore, the size of the fan and the heat sink must be reduced, and the cooling performance of the MPU cannot be sufficiently improved.

In particular, when a portable computer is connected to an expansion device and causes the MPU to execute complicated arithmetic processing, the amount of heat generated by the MPU increases in proportion thereto. It is not possible to obtain cooling performance that matches the amount, and this MPU
Is insufficiently cooled.

As a result, the temperature of the MPU may exceed the guaranteed operation temperature, and the processing speed may be reduced or malfunction may occur. As a result, the original performance of the MPU cannot be maximized. Come.

The present invention has been made in view of such circumstances, and it is possible to efficiently cool a housing and a heating element of an electronic device by using an extension device, and to sufficiently improve the original performance of the electronic device. It is an object of the present invention to provide an electronic device system that can be used in a computer and an expansion device for expanding the functions of the electronic device.

[0012]

In order to achieve the above object, an electronic apparatus system according to the present invention according to claim 1 includes an electronic apparatus having a housing in which a heating element is housed; An expansion device for detachably connecting the electronic device with a desired expansion function. The extension device is characterized in that it has a heat conducting means thermally connected to the housing of the electronic device when the expansion device is connected to the housing.

In such a configuration, when the electronic device is connected to the expansion device, the heat conducting means is thermally connected to the housing. Therefore, the heat of the heating element is released from the housing to the expansion device via the heat conducting means, and apparently,
The heat capacity of the housing increases. As a result, the heat of the heating element can be efficiently released to the outside of the housing using the expansion device, and the heat radiation of the heating element can be improved.

According to a ninth aspect of the present invention, there is provided an electronic equipment system having a housing in which a first heat sink thermally connected to a heating element is accommodated; An extension device for adding a desired extension function to the electronic device, the device having a device main body in which a cooling air passage through which cooling air flows is formed in a mounting portion on which the device is removably mounted I have. The device main body of the extension device has a second heat sink that is thermally connected to the housing when the housing of the electronic device is mounted on the mounting portion. Is characterized by being disposed in the cooling air passage.

In such a configuration, when the heating element housed in the housing generates heat, the heat of the heating element is released to the first heat sink and the housing. When the housing is mounted on the mounting portion of the expansion device, the housing faces the cooling air passage, and the cooling air flowing through the cooling air passage is blown to the housing. Therefore, the housing that is affected by the heat of the heating element is intensively cooled by forced convection using air as a medium, and the heat dissipation of the housing itself is enhanced.

In addition, as long as the housing of the electronic device is mounted on the mounting portion of the extension device, the second heat sink is thermally connected to this housing. From the second
Through the heat sink to the expansion device. In addition, since the second heat sink is forcibly cooled by the cooling air flowing through the cooling air passage, the heat radiation of the second heat sink is also sufficient.

Therefore, by using heat conduction from the housing to the second heat sink and forced convection using air as a medium, the heat of the heating element can be efficiently released to the outside of the housing. Even if the size of the first heat sink in the housing must be reduced, the heat radiation of the heating element can be maintained well.

To achieve the above object, an electronic equipment system according to the present invention according to claim 11, comprising: an electronic equipment having a housing accommodating a first heat sink thermally connected to a heating element; An extension device for adding a desired extension function to the electronic device, the device having a device main body in which a cooling air passage through which a cooling air flows is formed in a mounting portion on which the device is removably mounted. I have. The device main body of the extension device is configured such that when the housing of the electronic device is mounted on the mounting portion, a second body that penetrates the housing and is thermally connected to the first heat sink. , And the second heat sink is disposed in the cooling air passage.

According to a nineteenth aspect of the present invention, an electronic device having a housing in which a heating element and a first heat sink for promoting heat radiation of the heating element are added, a desired extension function is added. An apparatus main body having a mounting portion on which the housing is removably mounted, and a cooling air passage through which the cooling air flows is formed in the mounting portion; A second heat sink penetrating through the housing and thermally connected to the first heat sink when the housing is mounted on the mounting portion; It is characterized by being arranged in a wind passage.

In such a configuration, when the heating element housed in the housing generates heat, the heat of the heating element is released to the first heat sink. When the housing is placed on the mounting portion of the expansion device, the housing faces the cooling air passage, and the cooling air flowing through the cooling air passage is blown against the housing. For this reason, the housing which is thermally affected by the heating element and the first heat sink is intensively cooled by forced convection using air as a medium.

In addition, as long as the housing of the electronic device is mounted on the mounting portion of the expansion device, the second heat sink is thermally connected to the first heat sink of the housing. Much of the heat is transferred directly from the first heat sink to the second heat sink. For this reason, apparently, the heat capacity of the first heat sink increases, and the heat of the heating element can be efficiently released to the outside of the housing by diffusion due to heat conduction to the second heat sink. In addition, since the second heat sink is forcibly cooled by the cooling air flowing through the cooling air passage, the heat radiation of the second heat sink is also sufficient, and the heat generated by the second heat sink is transmitted to the second heat sink. The heat of the body can be quickly released outward by multiplying the flow of the cooling air.

Therefore, the second heat sink is moved from the first heat sink to the second heat sink.
By using heat conduction to the heat sink and forced convection using air as a medium, the heat of the heating element can be efficiently released to the outside of the housing, and the size of the first heat sink can be reduced. Even if forced to do so, the heat dissipation of the heating element can be enhanced.

In order to achieve the above object, an expansion device according to the present invention is for adding a desired expansion function to an electronic device having a housing in which a heating element is accommodated. An apparatus main body having a mounting portion on which a housing of an electronic device is removably mounted; and when the housing is mounted on the mounting portion of the apparatus main body, the housing is thermally connected to the housing. And heat conducting means.

In such a configuration, when the housing of the electronic device is mounted on the mounting portion of the apparatus main body, the heat conducting means is thermally connected to the housing. Therefore, the heat of the heating element is released from the housing to the apparatus main body through the heat conducting means, and the heat capacity of the housing is apparently increased. As a result,
The heat of the heating element can be efficiently released to the outside of the housing using the apparatus main body, and the heat radiation of the heating element can be improved.

[0025]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described below with reference to FIGS. 1 to 3
Discloses a portable computer 1 as an electronic device and an extension device 2 for adding a desired extension function to the portable computer 1.

The portable computer 1 has a computer main body 3 and a display unit 4 supported by the computer main body 3. The computer main body 3 has a housing 5 made of a magnesium alloy. The housing 5 includes a bottom wall 5a, an upper wall 5b, a front wall 5c, left and right side walls 5d.
And a rear wall 5e. The housing 5 has a flat box shape with a thickness dimension of about 20 mm, and is thinner than a conventional general portable computer.

On the lower surface of the bottom wall 5a of the housing 5, a plurality of seats 6 are formed as shown in FIG. The seats 6 protrude downward from the bottom wall 5a at four corners of the bottom wall 5a.

The upper wall 5b of the housing 5 has a palm rest 7 and a keyboard mounting opening 8. Palm rest 7
At the front of the upper wall 5b, it extends in the width direction of the housing 5.
The keyboard mounting opening 8 is located behind the palm rest 7. The keyboard mounting port 8 is formed of a recess that is recessed toward the inside of the housing 5, and a keyboard 9 is attached to the keyboard mounting port 8.

At the rear end portions of the left and right side walls 5d of the housing 5, engagement portions 10 as shown in FIG. 3 are respectively formed. The engaging portion 10 is used when the portable computer 1 is connected to the expansion device 2, and is formed by a concave portion that opens to the side, downward and rearward of the housing 5.

The rear end of the upper wall 5b of the housing 5 has a pair of display support portions 11a, 11
b is formed. Display support parts 11a, 11
b are arranged behind the keyboard 9 so as to be separated from each other in the width direction of the housing 5.

As shown in FIGS. 3 and 5, a circuit board 12 is accommodated in the housing 5. The circuit board 12 is arranged in parallel with the bottom wall 5 a of the housing 5. Various circuit components 13 such as semiconductor packages are mounted on the upper and lower surfaces of the circuit board 12, respectively. Circuit board 1
The first expansion connector 14 is mounted on the lower surface of the rear end of the second expansion connector 2. The first expansion connector 14 is located at the rear of the housing 5 and faces a connector outlet (not shown) opened on the bottom wall 5 a of the housing 5.

As shown in FIGS. 5 and 6, a circuit module 15 is accommodated in the housing 5. The circuit module 15 includes a module substrate 16 and an MPU (micr) as a heating element mounted on the module substrate 16.
and an oprocessing unit 17. The circuit module 15 is located on the right side of the rear part of the housing 5 away from the palm rest 7.

The module board 16 is arranged above the circuit board 12 in parallel with the bottom wall 5a of the housing 5. The module board 16 is electrically connected to the circuit board 12 via a pair of stacking connectors 18.

The MPU 17 is mounted on the lower surface of the module board 16 via an MPU holder 19. This MP
U17 has an IC chip 20 as a heating element. Since the IC chip 20 processes a large amount of multimedia information such as characters, voices, and images, the power consumption during operation is large.
The heat value of 0 is so large that cooling is required. The IC chip 20 is housed in a flat metal case 21. This case 21 is used for the MPU holder 19
And is screwed to the lower surface of the module substrate 16 via.

On the lower surface of the case 21 of the MPU 17, a first
Is mounted. The first heat sink 23 is made of a metal material having excellent thermal conductivity, such as an aluminum alloy, and has a flat plate shape. The first heat sink 23 is thermally connected to the IC chip 20. Then, the first heat sink 2
3 is arranged along the inner surface of the bottom wall 5a of the housing 5 and is screwed to the bottom wall 5a.

The first heat sink 23 has a fan mounting portion 24 that projects to the right of the MPU 17.
A fan unit 25 is mounted on the upper surface of the fan mounting section 24. The fan unit 25 has M
The fan 17 is located between the PU 17 and the right side wall 5 d of the housing 5, and the side wall 5 d has an exhaust port 26 connected to the fan unit 25.

The display unit 4 includes a flat box-shaped display housing 28 and a liquid crystal display device 29 accommodated in the display housing 28. The display housing 28 has a front surface on which a display opening 30 is formed. Liquid crystal display device 29
Has a display screen 29a on which characters and images are displayed,
The display screen 29a is exposed to the outside of the display housing 28 through the display opening 30.

The display housing 28 has a pair of legs 31a and 31b. Legs 31a, 31b
Are guided to the display supporting portions 11a and 11b of the housing 5, and are rotatably connected to the housing 5 via a hinge device 32 shown in FIG. For this reason, the display unit 4 can be selectively rotated between a closed position where the palm rest 7 and the keyboard 9 are covered from above and an open position where the palm rest 7, the keyboard 9 and the display screen 29a are exposed. Has become.

The extension device 2 for adding a desired extension function to the portable computer 1 has a device body 35 made of synthetic resin as shown in FIGS. Device body 3
5 has a bottom wall 35a, an upper wall 35b facing the bottom wall 35a, a front wall 35c connecting the bottom wall 35a and the upper wall 35b, left and right side walls 35d and a rear wall 35e. The device body 35 has a thickness of 20 mm.
It is shaped like a flat box, and the thickness is reduced as in the case 5 of the portable computer 1.

The apparatus main body 35 has a mounting section 36. The mounting section 36 is a housing 5 of the portable computer 1.
Are detachably mounted on the upper wall 35b of the apparatus main body 35. The upper surface of the upper wall 35b
A flat mounting surface 37 faces the bottom wall 5 a of the housing 5, and the mounting surface 37 has a size corresponding to the bottom wall 5 a of the housing 5. When the housing 5 is mounted on the mounting surface 37, the seat 6 of the bottom wall 5 a of the housing 5 contacts the mounting surface 37, and the mounting surface 37 and the bottom wall of the housing 5 are contacted. A gap 38 as shown in FIGS.

A CD-ROM drive 40, a floppy disk drive 41 and a circuit board 42 are housed inside the apparatus main body 35. The CD-ROM drive device 40 and the floppy disk drive device 41 constitute a means for expanding the function of the portable computer 1, and are arranged in the front half of the device body 35 in the width direction of the device body 35. .

The circuit board 42 is arranged in the rear half of the apparatus main body 35 in parallel with the bottom wall 35a and the upper wall 35b. The circuit board 42 is electrically connected to the CD-ROM drive 40 and the floppy disk drive 41 via a flexible wiring board (not shown). On the upper surface of the circuit board 42, a plurality of connectors 44 (FIG. 5) for connecting peripheral devices such as a printer and an external keyboard.
Shown) has been implemented. These connectors 44 are exposed to the rear of the apparatus main body 35 through a rear wall 35e of the apparatus main body 35.

On the upper surface of the circuit board 42, a second extension connector 45 is mounted. The second expansion connector 45 corresponds to the first expansion connector 14 of the portable computer 1, and protrudes upward through the mounting surface 36 described above. Therefore, when the housing 5 of the portable computer 1 is placed at a predetermined position on the placement surface 37, the first extension connector 14
5, the portable computer 1 and the extension device 2 are electrically connected via the extension connectors 14 and 45.

As shown in FIG. 2 and FIG.
Is provided with a pair of rear hook levers 46a and 46b and a front hook 47 for locking the housing 5 of the portable computer 1 to the mounting surface 37.

The rear hook levers 46a and 46b are arranged at the rear end of the apparatus main body 35 so as to be separated from each other in the width direction of the apparatus main body 35. Rear hook lever 4
Each of 6a and 46b has a lever main body 48. The lever body 48 is connected to the device body 35 via a pivot shaft 49.
Is rotatably supported at the rear end. Lever body 48
Is superimposed on the side wall 35d of the apparatus main body 35,
The upper part of the lever body 48 projects above the mounting surface 37. Therefore, when the housing 5 of the portable computer 1 is mounted on the mounting surface 37, the upper part of the lever body 48 faces the side wall 5d of the housing 5.

A lock pin 50 is fixed to the upper side surface of the lever body 48. The lock pin 50 is detachably engaged with the engagement portion 10 of the housing 5 and projects horizontally on the mounting surface 37 of the apparatus main body 35. For this reason, the lever main body 48 is rotatable between an engagement position where the lock pin 50 is fitted into the engagement portion 10 and a release position where the lock pin 50 is separated behind the engagement portion 10. And is constantly biased toward the engagement position via a not-shown torsion coil spring.

The front hook 47 is located at the front end of the mounting surface 37 at the center of the mounting surface 37 in the width direction. The front hook 47 has an axial shape extending in the vertical direction.
At the upper end of 7, a claw portion 51 is formed. The front hook 47 is movable up and down in the vertical direction, and is rotatable in the direction around the axis over an angle range of about 90 °.
5 is supported.

For this reason, the front hook 47 is
A release position where the majority including 1 protrudes above the mounting surface 37;
Only the claw portion 51 is movable over an engagement position located on the mounting surface 37.
Is always pushed up to the release position by a spring (not shown).

When the housing 5 of the portable computer 1 is placed at a predetermined position on the mounting surface 37, the engaging portion 10 of the housing 5 comes into contact with the lock pins 50 of the rear hook levers 46a and 46b, and Bottom wall 5a is front hook 4
7 respectively contact the upper ends. By this contact, the rear hook levers 46a and 46b return from the engagement position to the release position so that the lever body 48 avoids the engagement portion 10, and then return to the engagement position by the urging force of the spring.
The lock pin 50 is hooked on the engaging portion 10 of the housing 5 as shown in FIG. Similarly, the front hook 47 is pushed from the release position to the engagement position by contact with the bottom wall 5 a of the housing 5, and the claw portion 51 at the upper end of the front hook 47 is hooked on the bottom wall 5 a of the housing 5.

Therefore, the housing 5 of the portable computer 1 is locked on the mounting surface 37 at two places at the rear end and one place at the front end, so that the first expansion connector 1
4 and the second expansion connector 44 are maintained in a fitted state.

The lever body 48 of the rear hook levers 46a and 46b has an eject roller 52. The eject roller 52 faces the bottom wall 5a of the housing 5 as long as the lever body 48 is rotated to the engagement position. Therefore, when the lever main body 48 is moved from the engagement position to the release position, the eject pin 52 comes into contact with the bottom wall 5 a of the housing 5 after the lock pin 50 is disengaged from the engagement portion 10 of the housing 5. The housing 5 is pushed up in a direction away from the mounting surface 37. As a result, the lock of the housing 5 by the lock pin 50 is released, and the fitting between the first extension connector 14 and the second extension connector 45 is released, and the portable computer 1 is taken out from the mounting surface 37. Can be.

As shown in FIG. 4 to FIG.
5 has a circular concave portion 55. The concave portion 55 is formed at the rear of the mounting surface 37 at a position deviated to the right from the center in the width direction. Therefore, when the housing 5 is placed on the mounting surface 37, the recess 55 is located immediately below the MPU 17 housed in the housing 5.

The bottom of the concave portion 55 is inclined downward toward the right side of the apparatus main body 35. An exhaust port 56 is formed at the bottom of the recess 55. The exhaust port 56 faces the bottom wall 5 a of the housing 5 mounted on the mounting surface 37 and communicates with the inside of the apparatus main body 35. This recess 55
A guard 57 for preventing foreign matter from entering the exhaust port 56 is formed at the bottom of the cover.

On the mounting surface 37 of the apparatus main body 35, a groove-shaped cooling air passage 60 is formed. The cooling air passage 60 extends along the width direction of the mounting surface 37. The upstream end of the cooling air passage 60 is connected to the bottom of the recess 55, and the downstream end of the cooling air passage 60 is opened at an upper portion of the right side wall 35 of the apparatus main body 35. The cooling air passage 60 is located below the first heat sink 23 inside the housing 5 when the housing 5 is mounted on the mounting surface 37.

As shown in FIG. 6 and FIG.
A rib-shaped protrusion 61 is formed integrally with the edge of the cooling air passage 60 and the opening edge of the recess 55. The protrusion 61 protrudes upward from the mounting surface 37. The convex portion 61 is disposed on the mounting surface 37 so as to continuously surround the concave portion 55 and the cooling air passage 60, and an end thereof reaches the right side wall 5 d of the housing 5.
When the housing 5 is mounted on the mounting surface 37,
This contact is made with the bottom wall 5a of the housing 5, and by this contact, the gap 38 on the mounting surface 32 and the cooling air passage 60
And the exhaust port 56 are separated from each other without communication.

A large number of suction ports 62 are formed at substantially the center of the mounting surface 37 in the width direction and the depth direction. The suction ports 62 are arranged in a matrix at substantially the center of the mounting surface 37. These suction ports 62 are connected to the inside of the apparatus main body 35, and when the housing 5 is placed on the placement surface 37,
It is opened in the gap 38 between the housing 5 and the housing 5.

As shown in FIG. 5 and FIG.
An electric fan unit 65 is arranged inside the unit 5. The fan unit 65 includes a fan casing 66
And a fan 67 supported at the center of the fan casing 66. The fan casing 66 has a flat rectangular frame shape having four corners. The fan casing 66 has a suction port 68 and a discharge port 69 that face each other across the fan 67.

A bracket 71 is fixed to the outer periphery of the fan casing 66. This bracket 71
The apparatus main body 35 has a plurality of support pieces 72 facing the inner surface of the upper wall 35b. Also, on the inner surface of the upper wall 35b,
A plurality of mounting seats 73 extending downward are formed. The mounting seat 73 is disposed around the exhaust port 56, and the support piece 72 of the bracket 71 is screwed to the lower surface of the mounting seat 73.

For this reason, the fan unit 65 is fixed to the upper wall 35b of the apparatus main body 35 in a horizontal position with the discharge port 69 facing the exhaust port 56, and the suction port 68 of the fan unit 65 is The bottom wall 35a faces the bottom wall 35a. As a result, when the fan 67 is driven to rotate, air inside the apparatus main body 35 is sucked through the suction port 68, and this air is discharged upward from the discharge port 69 toward the exhaust port 56.

The fan 67 is connected to the I
The C chip 20 is driven when the temperature of the C chip 20 reaches a predetermined value. As shown in FIGS. 4 to 7, a second heat sink 75 as a heat conducting means is arranged on the mounting portion 36 of the apparatus main body 35. The second heat sink 75 is made of a metal material having excellent thermal conductivity, such as an aluminum alloy or a copper-based alloy.

The second heat sink 75 is connected to the cooling air passage 6
The heat receiving unit 76 includes a heat receiving unit 76 disposed at 0 and a heat radiating unit 77 connected to the heat receiving unit 76. The heat receiving portion 76 has a block shape having a width substantially equal to that of the cooling air passage 60, and protrudes upward from the bottom of the cooling air passage 60. The upper end of the heat receiving portion 76 is a flat rectangular heat receiving surface 78, and the heat receiving surface 78 is located on the same plane as the upper end of the convex portion 61. The heat receiving surface 78 is in surface contact with the bottom wall 5a of the housing 5 when the housing 5 is mounted on the mounting surface 37, and a contact portion between the heat receiving surface 78 and the bottom wall 5a. Are located below the first heat sink 23 and near the IC chip 20 that generates heat. for that reason,
The heat receiving portion 76 of the second heat sink 75 is thermally connected to the bottom wall 5 a of the housing 5.

The heat receiving section 76 has a plurality of through holes 79. The through holes 79 extend in the direction of the passage in the cooling air passage 60 and are arranged at intervals in the width direction so that cooling air flows through these through holes 79. Therefore, the heat receiving portion 7 is provided in the cooling air passage 60.
Despite the arrangement of the cooling air passages 6, a smooth flow of the cooling air in the cooling air passage 60 is guaranteed.

The heat radiating portion 77 of the second heat sink 75
The cooling air passes through the bottom of the cooling air passage 60 and protrudes into the device main body 35. The heat radiating portion 77 is adjacent to the fan unit 65, and a large number of heat radiating fins 81 are formed on a lower surface of the heat radiating portion 77.

In order to add a desired extended function to the portable computer 1 in such a configuration, first, the housing 5 of the portable computer 1 is mounted on the mounting surface 37 of the expansion device 2, Body 5 to rear hook lever 4
It is locked to the mounting surface 37 via 6a, 46b and the front hook 47. As a result, the first extension connector 14 of the housing 5 and the second extension connector 45 of the extension device 2
And the portable computer 1 and the extension device 2 are electrically connected via the first and second extension connectors 14 and 45.

In the process of using the portable computer 1 connected to the extension device 2, the IC of the MPU 17
When the temperature of the chip 20 rises, the heat of the IC chip 20 is transmitted to the first heat sink 23. This first
Is screwed to this bottom wall 5a in a state of being along the inner surface of the bottom wall 5a of the housing 5,
The heat of the IC chip 20 transmitted to the first heat sink 23 is diffused by heat conduction to the bottom wall 5 a of the housing 5.

When the fan unit 65 of the expansion device 2 is driven as the temperature of the IC chip 20 rises, the air inside the device main body 35 is sucked into the suction port 68 of the fan casing 66. This air is blown from the outlet 69 to the cooling air passage 60 through the outlet 56, and is blown directly to the bottom wall 5 a of the housing 5 as cooling air. After flowing along the cooling air passage 60, the cooling air is discharged from the downstream end of the cooling air passage 60 to the right side of the apparatus main body 35.

At this time, the exhaust port 56 and the cooling air passage 60 on the mounting surface 37 face the bottom wall 5a which is affected by the heat of the MPU 37 and the first heat sink 23. It is intensively cooled by forced convection as a medium. Therefore, the heat of the IC chip 20 transmitted to the bottom wall 5a can be efficiently released to the outside of the housing 5.

On the other hand, when the housing 5 of the portable computer 1 is mounted on the mounting surface 37 of the extension device 2, the second heat sink is mounted on the bottom wall 5 a of the housing 5 which receives the heat of the IC chip 20. The second heat sink 75 is thermally connected to the bottom wall 5a.

For this reason, the heat of the IC chip 20 transmitted to the bottom wall 5 a is transferred from the heat receiving surface 37 to the second heat sink 75.
To the heat receiving section 76, and from there, the heat radiating section 7
6, and the apparent heat capacity of the bottom wall 5a increases. Since the heat radiating portion 76 has a sufficient contact area with the air due to the presence of the large number of heat radiating fins 81, the heat transmitted to the heat radiating portion 76 is radiated from the heat radiating portion 76 into the inside of the device body 35. You.

Further, since the heat receiving portion 76 of the second heat sink 75 is disposed in the cooling air passage 60, it is forcibly cooled by the cooling air flowing through the cooling air passage 60. Therefore, the IC chip 20 transmitted to the heat receiving unit 60
Can be positively discharged outward by multiplying the heat of the cooling air by the flow of the cooling air.

Therefore, according to this configuration, as long as the portable computer 1 is connected to the expansion device 2, the heat of the IC chip 20 of the portable computer 1 is reduced.
By using both the forced air cooling of the housing 5 using air as a medium and the heat conduction to the second heat sink 75, the heat can be efficiently discharged to the outside of the housing 5, and the IC chip 20
Can improve the heat dissipation. Therefore, even if the first heat sink 23 and the fan unit 25 must be miniaturized, the temperature of the MPU 17 can be kept within the operation guarantee temperature range, and the original performance of the MPU 17 can be maximized to achieve high-speed operation. Processing and the like can be reliably executed.

The present invention is not limited to the first embodiment, and FIG. 9 shows a second embodiment of the present invention. In the second embodiment, the heat transfer member 9 is attached to the heat receiving surface 78 of the second heat sink 75 via the adhesive 90.
1 is fixed. The heat transfer member 91 is made of, for example, a rubber-like elastic body obtained by adding alumina to a silicone resin, and has a sheet shape having excellent heat conductivity. When the housing 5 of the portable computer 1 is mounted on the mounting surface 37, the heat transfer member 91 is mounted on the IC chip 20.
And is sandwiched between the bottom wall 5a and the heat receiving surface 78. Therefore, the bottom wall 5 a of the housing 5 is thermally connected to the second heat sink 75 via the heat transfer member 91.

According to such a configuration, since the heat transfer member 91 can be elastically deformed, when the housing 5 is mounted on the mounting surface 37, the dimensional tolerance of the housing 5 and the apparatus main body 35 is reduced. It absorbs and comes into contact with the bottom wall 5a of the housing 5 without any gap. Therefore, the bottom wall 5a and the heat receiving surface 7 of the second heat sink 75
8 can be prevented from forming a space that hinders heat conduction, the thermal resistance from the bottom wall 5a to the second heat sink 75 can be reduced, and the heat radiation of the bottom wall 5a can be further improved.

The heat transfer member 91 is not limited to the rubber-like elastic material as described above. For example, the heat transfer member 91 is formed of a heat-conductive liquid or gel-like substance inside a flexible film bag. A so-called liquid-containing pack enclosing a medium may be used.

FIG. 10 discloses a third embodiment of the present invention. In the third embodiment, the specific configuration of the second heat sink 100 is different from that of the first embodiment.
The basic configuration of the expansion device 2 is the same as that of the first embodiment.

As shown in FIG. 10, the second heat sink 100 of the expansion device 2 has a rod shape with a circular or square cross section. The second heat sink 100 is made of a metal material having excellent thermal conductivity, such as aluminum or a copper alloy, and is supported by the device main body 35.

The second heat sink 100 includes a first portion 101 disposed in the cooling air passage 60, and a second portion 102 penetrating the bottom of the cooling air passage 60 and introduced into the apparatus main body 35. And The first part 101 is
The first cooling air passage 60 extends upward from the bottom of the cooling air passage 60.
The upper part of the portion 101 constitutes a fitting projection 103 projecting above the mounting surface 37. The second portion 102 has a heat radiating portion 104 extending along the bottom wall 35a of the apparatus main body 35, and the heat radiating portion 104 is in contact with the upper surface of the bottom wall 35a.

The bottom wall 5 a of the housing 5 has a fitting recess 105 at a portion facing the cooling air passage 60. The fitting concave portion 105 is configured such that the fitting projection 103 of the second heat sink 100 is removably fitted when the housing 5 is placed on the mounting surface 37, and is opened in the bottom wall 5 a of the housing 5. The insertion slot 106 is provided. The fitting recess 105 protrudes inside the housing 5, and the MPU
17 and the fan unit 25, and penetrates the first heat sink 23.

Then, the fitting projection 103 is fitted to the fitting recess 105.
In this state, the outer peripheral surface of the fitting projection 103 is in contact with the inner peripheral surface of the fitting concave portion 105, and the housing 5 is thermally connected to the second heat sink 100 by this contact. ing.

In this case, since the fitting recess 105 and the fitting projection 103 extend along the thickness direction of the housing 5, respectively, the fitting length between the fitting recess 105 and the fitting projection 103, As a result, the contact area between them can be easily secured.

According to such a configuration, when the housing 5 of the portable computer 1 is mounted on the mounting surface 37 of the extension device 2, the fitting protrusion 103 of the second heat sink 100 is The second heat sink 100 and the housing 5 are thermally connected to each other.

Therefore, the heat of the IC chip 20 transmitted to the bottom wall 5a is released from the fitting recess 105 to the second heat sink 100, and the apparent heat capacity of the bottom wall 5a increases. Then, the second heat sink 1
Since the heat radiating portion 104 is in contact with the bottom wall 35 a of the device main body 35, the heat transmitted to the heat radiating portion 104 is released to the outside of the expansion device 2 by natural air cooling due to diffusion into the device main body 35. .

Therefore, the heat of the IC chip 20 transmitted to the housing 5 can be efficiently released to the outside of the housing 5 by transmitting the heat to the second heat sink 100.
First heat sink 2 for promoting heat radiation of C chip 20
3 and the fan unit 25 must be miniaturized,
The temperature of the MPU 17 can be kept within the operation guarantee temperature range.

FIG. 11 discloses a fourth embodiment of the present invention. The fourth embodiment is similar to the third embodiment.
The second embodiment is an extension of the third embodiment, and the basic configuration of the second heat sink 100 is the same as that of the third embodiment.

The fitting projection 10 of the second heat sink 100
A leaf spring 110 is fixed to the outer peripheral surface of the third member 3 by means such as welding. The leaf spring 110 has a band shape extending in the axial direction of the fitting protrusion 103. This leaf spring 110 has a pressing portion 111. The pressing portion 111 has the fitting protrusion 1.
Elastic deformation occurs between a first position (shown in FIG. 11A) projecting outward in the radial direction of No. 03 and a second position (shown in FIG. 11B) overlapping the outer peripheral surface of the fitting projection 103. It is possible. The pressing portion 111 has an elastic force that always returns to the first position.

The fitting recess 105 of the housing 5 has a diameter through which the fitting projection 103 can be inserted with play. Therefore, when the fitting protrusion 103 of the second heat sink 100 is inserted into the fitting recess 105 through the insertion opening 106,
The pressing portion 111 of the leaf spring 110 slidably contacts the inner peripheral surface of the fitting concave portion 105, and the pressing portion 111 is deformed from the first position to the second position as shown in FIG. I do. Due to this deformation, the outer peripheral surface of the fitting projection 103 on the side opposite to the leaf spring 110 is pressed against the inner peripheral surface of the fitting concave portion 105,
The fitting projection 103 and the fitting recess 105 are thermally connected.

According to such a configuration, the fitting projection 103
Is formed by the pressing portion 111 of the leaf spring 110.
5 are pressed against the inner peripheral surface of the
3 and the fitting recess 105 are in good contact with each other. Therefore, the thermal resistance of the contact portion between the fitting protrusion 103 and the fitting recess 105 is suppressed to be small, and the heat of the bottom wall 5a can be efficiently released to the second heat sink 100.

FIG. 12 discloses a fifth embodiment of the present invention. In the fifth embodiment, the heat conducting means of the expansion device 2 is constituted by a heat pipe 120.
The heat pipe 120 has a pipe main body 121 in which a working medium such as water or alcohol is sealed.
The pipe main body 121 is connected to the first
And a second portion 123 penetrating through the bottom of the cooling air passage 60 and being introduced into the apparatus main body 35.

The first portion 122 extends upward from the bottom of the cooling air passage 60, and the upper portion of the first portion 122 projects above the mounting surface 37. Second part 1
23 has a heat radiating portion 124 extending along the bottom wall 35a of the apparatus main body 35, and the heat radiating portion 124 is in contact with the upper surface of the bottom wall 35a.

The first portion 122 of the heat pipe 120 is provided with a pipe cover 125. The pipe cover 125 is made of a metal material having excellent heat conductivity, such as aluminum or a copper-based alloy. The pipe cover 125 covers the first portion 122 of the heat pipe 120 without any gap, and is detachably fitted to the fitting recess 105 of the housing 5.

According to such a configuration, when the housing 5 of the portable computer 1 is mounted on the mounting surface 37 of the expansion device 2, the first portion 122 of the heat pipe 120 covers the pipe cover 125. The heat pipe 120 and the housing 5 are thermally connected to each other through the fitting recess 105 of the bottom wall 5a of the housing 5 through the housing.

Therefore, when the heat of the IC chip 20 is transmitted to the bottom wall 5a of the housing 5 via the first heat sink 23, this heat is transmitted through the fitting recess 105 of the bottom wall 5a to the heat pipe 120. To the first part 122 of the By this heat transfer, the working medium in the pipe main body 121 is heated to become steam,
From the portion 122 through the second portion 123
Flow to 4. The heat radiation part 124 of the heat pipe 120
Since it is introduced inside the expansion device 2, the first part 1
22 and the internal pressure is kept low.

[0093] Therefore, the steam guided to the heat radiating section 124 releases heat and condenses here. The working medium liquefied by the condensation returns to the first portion 122 from the heat radiating portion 124, and is heated again by receiving the heat of the bottom wall 5a. By repeating the evaporation and condensation of the working medium, the heat of the bottom wall 5 a is positively transferred to the device main body 35 of the expansion device 2.

Therefore, the heat of the IC chip 20 transmitted to the housing 5 can be efficiently released to the outside of the housing 5 through the heat pipe 120, and the first heat dissipation of the IC chip 20 can be promoted. Even if the heat sink 23 and the fan unit 25 need to be miniaturized, the temperature of the MPU 17 can be kept within the operation guarantee temperature range.

FIG. 13 to FIG. 15 show a sixth embodiment of the present invention. In the sixth embodiment, the specific configuration of the second heat sink 130 is different from the first to fifth embodiments.
The basic configuration of the portable computer 1 and the expansion device 2 other than the above is the same as that of each embodiment.

As shown in FIG. 13, the second heat sink 130 disposed in the cooling air passage 60 is made of a bar made of a metal having excellent thermal conductivity such as an aluminum alloy or a copper alloy. It is located immediately after the exhaust port 56. The second heat sink 130 includes a pair of fitting protrusions 131a and 131b, and the fitting protrusions 131a and 131b.
And a connecting portion 132 for connecting the connecting portions 31b.

The fitting protrusions 131a and 131b are
7 are spaced apart from each other in the depth direction and extend upward from the bottom of the cooling air passage 60. The upper portions of the fitting projections 131a and 131b are provided with the cooling air passage 6
0 protrudes upward from the mounting surface 37. The connecting portion 132 is supported by the bottom of the cooling air passage 60 and extends straight so as to cross the cooling air passage 60.

A plurality of radiating fins 133 are attached to the outer peripheral surface of the connecting portion 132. Radiation fin 133
Are arranged at intervals in the axial direction of the connecting portion 132, and extend along the flow direction of the cooling air in the cooling air passage 60, respectively.

As shown in FIGS. 14 and 15,
The bottom wall 5a of the housing 5 has a pair of fitting recesses 135a and 135b at a portion facing the cooling air passage 60. When the housing 5 is placed on the placement surface 37, the fitting recesses 135a and 135b
1a and 131b are removably fitted, and each has an insertion opening 136 opened in the bottom wall 5a of the housing 5. The fitting recesses 135a and 135b protrude inside the housing 5, and inside the housing 5, the MPU 17
And the fan unit 25, and penetrates the first heat sink 23.

When the housing 5 of the portable computer 1 is mounted on the mounting surface 37 of the extension device 2, the outer peripheral surfaces of the fitting projections 131a and 131b are formed on the inner peripheral surfaces of the fitting recesses 135a and 135b. The second heat sink 130 and the housing 5 are thermally connected to each other.

According to such a configuration, the heat of the IC chip 20 transmitted to the bottom wall 5a is dissipated by the fitting recesses 135a and 135a.
5b to the fitting protrusion 131 of the second heat sink 130
a, 131b, and from here the connecting portion 1
Since the heat is diffused by heat conduction to the bottom wall 32, the heat capacity of the bottom wall 5a apparently increases.

When the fan unit 65 of the expansion device 2 is driven as the temperature of the IC chip 20 rises, the air in the device body 35 blows out from the exhaust port 56 to the cooling air passage 60, and this air is cooled by the cooling air. And the bottom wall 5a of the housing 5
Or the second heat sink 130. At this time, since the connecting portion 132 of the second heat sink 130 extends in the direction crossing the flow of the cooling air and has a plurality of radiating fins 133, a sufficient contact area with the cooling air is ensured. Intensive cooling by forced convection using air as a medium together with the bottom wall 5a.

Therefore, the heat of the IC chip 20 transmitted to the housing 5 is efficiently used outside the housing 5 by using the heat conduction to the second heat sink 130 and the forced air cooling by the cooling air. Even if the first heat sink 23 and the fan unit 25 for promoting heat radiation of the IC chip 20 must be miniaturized, the MP
The temperature of U17 can be kept within the operation guarantee temperature range.

FIG. 16 discloses a seventh embodiment of the present invention. The seventh embodiment differs from the first embodiment mainly in that the heat receiving surface 78 of the second heat sink 75 is brought into direct contact with the first heat sink 23 of the housing 5. The other basic configurations of the portable computer 1 and the expansion device 2 are the same as those of the first embodiment.

As shown in FIG. 16, the heat receiving surface 78 of the second heat sink 75 protrudes above the projection 61 on the mounting surface 37. The bottom wall 5a of the housing 5 is
The heat sink 75 has an opening 140 at a position corresponding to the heat receiving section 76. The opening 140 has an opening shape through which the heat receiving section 76 can be inserted, and the first heat sink 23 is exposed to the outside of the housing 5 through the opening 140.

Therefore, when the housing 5 of the portable computer 1 is mounted on the mounting surface 37 of the extension device 2, the heat receiving portion 76 of the second heat sink 75 enters the housing 5 through the opening 140, The heat receiving surface 78 of the heat receiving portion 76 comes into surface contact with the lower surface of the first heat sink 23.

According to such a configuration, when the housing 5 of the portable computer 1 is mounted on the mounting surface 37 of the expansion device 2, the heat receiving surface 78 of the second heat sink 75 is connected to the first heat sink 75. 23, the second heat sink 75 and the first heat sink 23 are thermally connected. Therefore, the heat of the IC chip 20 transmitted to the first heat sink 23 is directly transmitted to the second heat sink 75 without passing through the housing 5, and apparently the heat capacity of the first heat sink 23 increases.

When the fan unit 65 of the expansion device 2 is driven as the temperature of the IC chip 20 rises, air in the device body 35 blows out from the exhaust port 56 to the cooling air passage 60, and this air is cooled by the cooling air. And is blown to the bottom wall 5 a of the housing 5 and the heat receiving portion 76 of the second heat sink 75. Therefore, the second heat sink 75 is intensively cooled by forced convection using air as a medium together with the bottom wall 5a, and the IC chip 2 transmitted to the first heat sink 23 is cooled.
The heat of 0 can be efficiently released to the outside of the housing 5 by using both the heat conduction to the second heat sink 75 and the forced air cooling by the cooling air.

FIG. 17 to FIG. 21 disclose an eighth embodiment of the present invention. The eighth embodiment is an extension of the fifth embodiment, and is similar to the eighth embodiment.
The main difference from this embodiment is that the heat pipe 120 is routed and the heat pipe 120 is thermally connected to the first heat sink 23.

As shown in FIGS. 18 and 19, the pipe main body 121 of the heat pipe 120 is
And a third portion 150 connected to the third portion 150. Third part 1
50 is guided below the fan unit 65 and is bent below the fan unit 65 in an L-shape along two adjacent sides of the fan casing 66. Tip 150a of third portion 150
Extends in the depth direction of the device body 35,
It faces the inlet 68 of the fan casing 66. And, at the tip 150a of the third part 150,
A plurality of heat radiation fins 151 are attached at intervals.

Further, the first portion 1 of the heat pipe 120
The pipe cover 125 covering the radiating fins 1
52. The radiation fins 152 are provided in the cooling air passage 6.
Within 0, they are arranged at intervals in the axial direction of the pipe cover 125.

As shown in FIG. 19, the module board 16 of the portable computer 1 is arranged along the bottom wall 5a of the housing 5. The MPU 17 is supported on an upper surface of the module substrate 16 via an MPU holder 19, and a first heat sink 23 is mounted on an upper surface of a case 21 of the MPU 17. The first heat sink 23 is separated from the bottom wall 5a of the housing 5 by an amount corresponding to the thickness of the module substrate 16 or the MPU 17,
A fan unit 25 is mounted on the lower surface of the fan mounting portion 24 of the first heat sink 23.

The first heat sink 23 is integrally provided with a boss 154 projecting downward. Boss 154
Are located between the MPU 17 and the fan unit 25, and the lower surface of the boss 154 has a fitting recess 155.
Are formed. The fitting recess 155 is a portion into which the pipe cover 125 is removably fitted.
54 has an insertion port 156 opened on the lower surface.

The lower surface of the boss 154 is adjacent to the inner surface of the bottom wall 5a of the housing 5. The bottom wall 5a has a boss 1
An opening 157 is provided at a position corresponding to the opening 54, and the opening 157 faces the insertion opening 156 of the boss 154.

Therefore, when the housing 5 of the portable computer 1 is mounted on the mounting surface 37 of the extension device 2, the first portion 122 of the heat pipe 120 is connected to the opening 15 of the bottom wall 5a.
6, is guided to the insertion port 156. As a result, the first portion 122 of the heat pipe 120 is
The heat pipe 120 and the first heat sink 23 are thermally connected by fitting into the fitting concave portion 155 of the first heat sink 23 via the heat sink 5.

In such a configuration, the IC chip 20
Is transmitted to the first heat sink 23, the heat is transmitted directly to the first portion 122 of the heat pipe 120 without passing through the housing 5. Due to this heat conduction,
The working medium in the pipe body 121 is heated to form steam, and the steam is supplied to the first portion 122 of the heat pipe 120.
From the second part 123 to the third part 150.

The third part 150 of the heat pipe 120
Is introduced into the expansion device 2, the temperature is lower than that of the first portion 122, and the internal pressure is kept low. Moreover, since the third portion 150 faces the suction port 68 of the fan casing 66, under the condition that the fan unit 65 is driven,
A third portion 150 is located on the flow path of the air flowing toward the inlet 68. In particular, since a plurality of radiating fins 151 are attached to the tip 150a of the third portion 150, a sufficient contact area with air can be ensured, and the third portion 150 can be forced to use air as a medium. Cooling can be concentrated by convection.

Therefore, the vapor guided to the third portion 150 radiates and condenses here, and then returns from the second portion 123 to the first portion 122, and again returns to the first heat sink 2.
Evaporate under the heat of 3. By repeating the evaporation and condensation of the working medium, heat of the first heat sink 23 is released to the outside of the housing 5.

When the fan unit 65 is driven, the air in the apparatus main body 35 is blown out from the exhaust port 56 to the cooling air passage 60, and this air becomes cooling air and the bottom wall 5a of the housing 5 and the pipe cover are formed. 125 is sprayed. Therefore, the bottom wall 5a affected by the heat of the MPU 17 and the first heat sink 23 can be intensively cooled by forced convection using air as a medium, and the heat radiation of the housing 5 can be enhanced.

Therefore, the heat of the IC chip 20 transmitted to the first heat sink 23 is efficiently transferred to the outside of the housing 5 by using the heat conduction by the heat pipe 120 and the forced air cooling of the housing 5 in combination. Even if the first heat sink 23 and the fan unit 25 that can release the heat and promote the heat radiation of the IC chip 20 are forced to be downsized, the MPU 1
7 can be kept within the operation guarantee temperature range.

FIG. 22 discloses a ninth embodiment of the present invention. This ninth embodiment is similar to the sixth embodiment.
The sixth embodiment is similar to the sixth embodiment, and is different from the sixth embodiment in that the second heat sink 130 disposed in the cooling air passage 60 is thermally connected to the first heat sink 23. is there.

As shown in FIG. 22, the first heat sink 23 of the housing 5 has a pair of bosses 160 projecting downward.
(Only one is shown). Boss part 160
Is between the MPU 17 and the fan unit 25,
Are arranged apart from each other in the depth direction of the housing 5,
On the lower surface of the boss 160, a fitting recess 161 is formed. The fitting recess 161 is adapted to be removably fitted with the fitting projections 131a and 131b of the second heat sink 130, and has an insertion opening 162 opened on the lower surface of the boss 160, respectively.

The lower surface of the boss 160 is adjacent to the inner surface of the bottom wall 5a of the housing 5. The bottom wall 5a has a boss 1
A pair of openings 163 (only one is shown) is provided at a position corresponding to the opening 60, and the opening 163 faces the insertion opening 162 of the boss 160.

According to such a configuration, when the housing 5 of the portable computer 1 is mounted on the mounting surface 37 of the extension device 2, the fitting protrusions 131a and 131b of the second heat sink 130 are not 1 heat sink 23
Of the second heat sink 130 and the first heat sink 23 are thermally connected to each other.

Therefore, the heat of the IC chip 20 transmitted to the first heat sink 23 is transferred from the fitting recess 161 to the second
Is transmitted to the fitting projections 131a and 131b of the heat sink 130, and is diffused by heat conduction therefrom to the connecting portion 132, so that the heat capacity of the first heat sink 23 increases apparently.

When the fan unit 65 of the expansion device 2 is driven as the temperature of the IC chip 20 rises, the air in the device body 35 blows out from the exhaust port 56 to the cooling air passage 60, and this air is cooled. And the bottom wall 5a of the housing 5
Or the second heat sink 130. At this time, since the connecting portion 132 of the second heat sink 130 extends in the direction crossing the flow of the cooling air and has a plurality of radiating fins 133, a sufficient contact area with the cooling air is ensured. Intensive cooling by forced convection using air as a medium together with the bottom wall 5a.

Therefore, the heat of the IC chip 20 transmitted to the first heat sink 23 is transferred to the second heat sink 1.
The combined use of the heat conduction to the cooling air 30 and the forced air cooling by the cooling air allows efficient discharge to the outside of the housing 5. Therefore, even if the first heat sink 23 and the fan unit 25 must be miniaturized, the temperature of the MPU 17 can be kept within the operation guarantee temperature range.

In each of the above embodiments, the fan unit is provided at the exhaust port of the apparatus main body. However, the present invention is not limited to this. May be arranged in the vicinity of.

[0129]

According to the first and eighteenth aspects of the present invention, as long as the electronic device is connected to the extension device, the heat of the heating element is
Since the heat is transmitted from the housing to the expansion device through the heat conduction means, the heat capacity of the housing is apparently increased, and the heat of the heating element can be efficiently discharged to the outside of the housing.

According to the ninth aspect of the present invention, as long as the electronic device is connected to the extension device, the housing affected by the heat of the heating element is intensively cooled by forced air cooling. Sex is enhanced. In addition, the heat of the heating element is released from the housing to the expansion device through the second heat sink, so that the heat capacity of the housing increases, and the second heat sink itself is cooled by the cooling air flowing through the cooling air passage. Therefore, the heat dissipation of the second heat sink can be sufficiently ensured. Therefore, by using heat conduction from the housing to the second heat sink and forced convection using air as a medium, the heat of the heating element can be efficiently released to the outside of the housing, and the heat dissipation of the heating element can be achieved. Even if the first heat sink which promotes the heat generation is forced to be downsized, the heat radiation of the heating element can be improved.

According to the eleventh and nineteenth aspects of the present invention, as long as the electronic device is connected to the extension device, the housing which is affected by the heat generator and the first heat sink is intensively cooled by forced air cooling. The heat dissipation of the housing is improved. In addition, since the heat of the heating element is directly transmitted from the first heat sink to the second heat sink, apparently, the heat capacity of the first heat sink increases, and the heat of the heating element is transferred by heat conduction to the second heat sink. It can be released outside the housing by diffusion. Moreover, since the second heat sink is forcibly cooled by the cooling air flowing through the cooling air passage,
The heat radiation of the second heat sink itself can be sufficiently ensured, and the heat of the heating element transmitted to the second heat sink can be quickly released outward by multiplying by the flow of the cooling air. Therefore, heat of the heating element can be efficiently released to the outside of the housing by heat conduction from the first heat sink to the second heat sink and forced convection using air as a medium, and heat dissipation of the heating element is promoted. Even if it is necessary to reduce the size of the first heat sink, the heat radiation of the heating element can be improved.

[Brief description of the drawings]

FIG. 1 is an exemplary perspective view showing a state in which a portable computer is mounted on a mounting surface of an extension device according to a first embodiment of the present invention;

FIG. 2 is an exemplary perspective view showing a state where the portable computer is removed from a mounting surface of the extension device;

FIG. 3 is a side view of the portable computer.

FIG. 4 is a perspective view of an expansion device.

FIG. 5 is an exemplary rear view showing a state in which the portable computer is mounted on the mounting surface of the extension device in a partial cross section;

FIG. 6 is a cross-sectional view showing a positional relationship between a fan unit of the expansion device and an MPU in a housing when the portable computer is mounted on the mounting surface of the expansion device.

FIG. 7 is a plan view showing a cooling air passage of the expansion device.

FIG. 8 is a side view showing a positional relationship between a cooling air passage and a housing of the expansion device.

FIG. 9 is a sectional view showing a contact portion between a bottom wall of a housing and a second heat sink in the second embodiment of the present invention.

FIG. 10 is an exemplary sectional view showing a state in which a portable computer is mounted on a mounting surface of an extension device according to a third embodiment of the present invention;

FIG. 11A is a cross-sectional view illustrating a positional relationship between a fitting protrusion of a second heat sink and a fitting recess of a housing according to the fourth embodiment of the present invention. (B) is a sectional view showing a state where the fitting projection of the second heat sink has been fitted into the fitting recess of the housing.

FIG. 12 is a sectional view showing a state in which a heat pipe is fitted into a fitting concave portion of a housing according to a fifth embodiment of the present invention.

FIG. 13 is a perspective view of an expansion device showing shapes of a cooling air passage and a second heat sink arranged in the cooling air passage in the sixth embodiment of the present invention.

FIG. 14 is a plan view of the expansion device showing shapes of the cooling air passage and a second heat sink disposed in the cooling air passage.

FIG. 15 is an exemplary sectional view showing a state where the portable computer is mounted on the mounting surface of the extension device;

FIG. 16 is an exemplary sectional view showing a state in which a portable computer is mounted on a mounting surface of an extension device according to a seventh embodiment of the present invention;

FIG. 17 is a perspective view of an expansion device showing a cooling air passage and a heat pipe protruding into the cooling air passage in the eighth embodiment of the present invention.

FIG. 18 is a plan view of the expansion device, showing a cooling air passage and a routing path of a heat pipe to a fan unit.

FIG. 19 is an exemplary sectional view showing a state where the portable computer is mounted on the mounting surface of the extension device;

FIG. 20 is a sectional view showing a fitted state of the heat pipe and the first heat sink.

FIG. 21 is a sectional view showing a positional relationship between a third portion of the heat pipe and an inlet of a fan casing.

FIG. 22 is an exemplary sectional view showing a state in which a portable computer is mounted on a mounting surface of an extension device according to a ninth embodiment of the present invention;

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Electronic device (portable computer) 2 ... Expansion device 5 ... Housing 20 ... Heating element (IC chip) 23 ... 1st heat sink 36 ... Placement part 60 ... Cooling air passage 75, 91, 100, 120, 130 ... Heat conducting means, second heat sink, heat pipe

Claims (19)

[Claims] An electronic device having a housing in which a heating element is housed; detachably connected to the housing of the electronic device;
An extension device for adding a desired extension function to the electronic device, wherein the extension device is connected to a casing of the electronic device when the extension device is connected to the casing. An electronic apparatus system comprising a heat conducting means thermally connected. 2. The expansion device according to claim 1, wherein the extension device has a mounting portion on which the housing is removably mounted, and the housing has a bottom wall facing the mounting portion. A first heat sink thermally connected to the heating element is supported on the bottom wall, and the heat conducting means is in contact with the bottom wall of the housing in the vicinity of the heating element. An electronic device system characterized in that: 3. The heat conducting means according to claim 2, further comprising a second heat sink disposed on the mounting portion, wherein the second heat sink comes into surface contact with a bottom wall of the housing. An electronic device system comprising a heat receiving unit. 4. The heat transfer member according to claim 3, wherein an elastically deformable heat transfer member having heat conductivity is interposed between the heat receiving portion of the second heat sink and the bottom wall of the housing. An electronic device system characterized by the above-mentioned. 5. The electronic device system according to claim 3, wherein the second heat sink has a heat radiating portion projecting into the expansion device. 6. The heat conducting means according to claim 1, wherein said heat conducting means comprises at least one metal fitting projection projecting from said mounting portion, and said electronic device housing is made of metal. An electronic device system, comprising: at least one fitting recess in which the fitting protrusion is detachably fitted. 7. The heat pipe according to claim 1, wherein the heat conduction means has a first portion protruding from the mounting portion and a second portion guided inside the expansion device. And a metal pipe cover that covers a first portion of the heat pipe, and the housing has a fitting recess into which the pipe cover is detachably fitted. Electronic equipment system characterized. 8. The electronic equipment system according to claim 2, wherein the mounting portion of the expansion device has a passage through which cooling air flows, and the heat conducting means is arranged in the passage. . 9. An electronic device having a housing accommodating a first heat sink thermally connected to a heating element; and cooling in which cooling air flows through a mounting portion on which the electronic device is removably mounted. An extension device for adding a desired extension function to the electronic device, the extension device having a device main body in which an air passage is formed; A second heat sink that is thermally connected to the housing when the housing of the device is mounted on the mounting portion; the second heat sink is disposed in the cooling air passage; An electronic device system characterized in that: 10. The electronic device system according to claim 9, wherein the second heat sink has a plurality of radiating fins facing the cooling air passage. 11. An electronic device having a housing in which a first heat sink thermally connected to a heating element is accommodated; and cooling in which cooling air flows through a mounting portion on which the electronic device is removably mounted. An extension device for adding a desired extension function to the electronic device, the extension device having a device main body in which an air passage is formed; A second heat sink that penetrates the housing and is thermally connected to the first heat sink when the housing of the device is mounted on the mounting portion; And an electronic device system disposed in the cooling air passage. 12. The electronic apparatus system according to claim 9, wherein the apparatus main body has a built-in fan for sending cooling air to the cooling air passage. 13. The method according to claim 12, wherein the second
The heat sink protrudes from the mounting portion and is provided with the first heat sink.
A first portion detachably fitted to the heat sink, and a second portion guided to the inside of the apparatus main body, wherein the first portion faces the cooling air passage and The electronic device system according to claim 2, wherein the portion (2) faces the fan inside the apparatus main body. 14. The method according to claim 13, wherein the second
Wherein the heat sink is a heat pipe, and a plurality of heat radiation fins are formed on at least one of the first portion and the second portion of the heat pipe. 15. The heat pipe according to claim 14, wherein the first portion of the heat pipe is covered with a metal pipe cover, and the cooling fin is formed on an outer peripheral surface of the pipe cover. Electronic equipment system characterized. 16. The method according to claim 13, wherein the first
The electronic device system according to claim 1, wherein the heat sink has a fitting recess in which the first portion of the second heat sink is detachably fitted. 17. The method according to claim 11, wherein the second
The electronic device system according to claim 1, wherein the heat sink includes a heat receiving portion that is in surface contact with the first heat sink. 18. An extension device for adding a desired extended function to an electronic device having a housing in which a heating element is housed, wherein a mounting portion on which the housing of the electronic device is removably mounted. And a heat conducting means thermally connected to the housing when the housing is mounted on the mounting portion of the device main body. apparatus. 19. An extension device for adding a desired extension function to an electronic device having a housing in which a heat generating body and a first heat sink for promoting heat radiation of the heat generating body are provided, wherein the housing is provided. An apparatus main body having a mounting section detachably mounted thereon, and a cooling air passage through which the cooling air flows is formed; and a housing is mounted on the mounting section of the apparatus main body. A second heat sink penetrating through the housing and thermally connected to the first heat sink, wherein the second heat sink is arranged in the cooling air passage. Expansion device.