JP2000100677A - Device and method for separating sample and manufacture of substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the occurrence of defects in samples at the time of separating the samples. SOLUTION: A laminated substrate 101 is held between substrate holding sections 102 and 103 in such a way that the sections 102 and 103 press the substrate 101 against each other from both sides. While the substrate 101 is rotated, the substrate 101 is separated into single substrates from a porous layer 101b by a jet by spraying the jet from a nozzle 136. In the first stage of separation, the substrate 101 is pressed with a spring 117. As the separation progresses, the already separated parts of the substrate warp due to the pressure of the jet constituting medium (water) injected into the substrate 101. When the warping amounts become larger, the substrate holding section 103 retreats and a transmitting plate 120 comes into contact with springs 118 and 119. When the plate 120 comes into contact with the springs 118 and 119, the second stage of separation starts. In the second stage, the substrate 101 is pressed by the springs 117-119. In the second stage, therefore, the laminated substrate 101 is pressed with strong pressing forces.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus and a method for separating a sample, and a method for manufacturing a substrate. For example, the present invention relates to an apparatus and a method suitable for separating a plate-shaped sample having a separation layer inside. Further, the present invention relates to a method for manufacturing a substrate to which the above-described methods are applied.

[0002]

2. Description of the Related Art As a substrate having a single crystal Si layer on an insulating layer, a substrate (SOI substrate) having an SOI (silicon on insulator) structure is known. Devices using this SOI substrate have a number of advantages that cannot be achieved with a normal Si substrate. The advantages include, for example, the following. (1) Dielectric separation is easy and suitable for high integration. (2) Excellent radiation resistance. (3) The stray capacitance is small, and the operation speed of the element can be increased. (4) No well step is required. (5) Latch-up can be prevented. (6) A complete depletion type field effect transistor can be formed by thinning.

[0003] Since the SOI structure has various advantages as described above, research on a forming method thereof has been advanced in recent decades.

As an SOI technique, SOS (silicon on s) is conventionally formed by forming Si on a single crystal sapphire substrate by heteroepitaxial growth by a CVD (chemical vapor deposition) method.
apphire) technology is known. Although this SOS technology has gained a reputation as the most mature SOI technology,
Practical due to large number of crystal defects due to lattice mismatch at the interface between the Si layer and the underlying sapphire substrate, mixing of aluminum constituting the sapphire substrate into the Si layer, cost of the substrate, delay in increasing the area, etc. Has not progressed.

[0005] Next to the SOS technology, various SOI technologies have appeared. With respect to this SOI technology, various methods have been attempted with the aim of reducing crystal defects and reducing manufacturing costs. As this method, a method of implanting oxygen ions into a substrate to form a buried oxide layer, bonding two wafers with an oxide film interposed therebetween, and polishing or etching one of the wafers to form a thin single-crystal Si layer A method of leaving on an oxide film, furthermore, hydrogen ions are implanted at a predetermined depth from the surface of the Si substrate on which the oxide film is formed, and after bonding with the other substrate, a thin film is formed on the oxide film by heat treatment or the like. A method of removing the bonded substrate (the other substrate) while leaving the single crystal Si layer, or the like can be given.

The present applicant has disclosed a new SOI technique in Japanese Patent Application Laid-Open No. Hei 5-21338. According to this technique, a first substrate in which a non-porous single crystal layer (including a single crystal Si layer) is formed on a single crystal semiconductor substrate in which a porous layer is formed is connected to a second substrate via an insulating layer. After bonding, the two substrates are separated by a porous layer, and the non-porous single crystal layer is transferred to a second substrate. This technology has an excellent thickness uniformity of the SOI layer, can reduce the crystal defect density of the SOI layer, has a good surface flatness of the SOI layer, and does not require an expensive special specification manufacturing apparatus. Is, several hundred dollars
It is excellent in that an SOI substrate having an SOI film in a range of about 10 μm to about 10 μm can be manufactured by the same manufacturing apparatus.

[0007] Further, the present applicant has disclosed in
In No. 9, after the first substrate and the second substrate are bonded to each other, the first substrate is separated from the second substrate without breaking, and then the separated surface of the first substrate is removed. A technique has been disclosed in which a porous layer is formed again after smoothing and reused. This technique has excellent advantages that the first substrate can be used without waste, so that the manufacturing cost can be greatly reduced and the manufacturing process is simple.

[0008]

In the above technique,
When a substrate in which two substrates are bonded to each other (hereinafter, a bonded substrate) is separated by a porous layer, it is desired that the separated substrates be separated with good reproducibility without damaging the separated substrates.

The present invention has been made in view of the above background, and provides, for example, an apparatus and method suitable for separating a plate-like sample (for example, a bonded substrate) having a separation layer inside. The purpose is to do.

[0010]

A separation apparatus according to a first aspect of the present invention is a separation apparatus for separating a plate-like sample having a separation layer therein by the separation layer, the separation apparatus comprising: A holding unit for holding the liquid, a fluid is ejected toward the sample held by the holding unit, and an ejection unit for separating the sample by the separation layer, whereby the holding unit presses the sample. And an application unit for applying a force to the holding unit, wherein the application unit changes the force applied to the holding unit in accordance with the progress of separation of the sample.

In the above-described separation apparatus according to the first aspect of the present invention, for example, the application unit may be configured so that a force of the holding unit pressing the sample increases as the separation of the sample progresses. It is preferable to change the force applied to the holding unit.

[0012] In the separation apparatus according to the first aspect of the present invention, for example, in the first stage of separation, the applying section causes the holding section to press the sample with a relatively small force,
In the second stage of separation, it is preferable to change the force applied to the holding unit so that the sample is pressed by the holding unit with a relatively large force.

[0013] In the separation apparatus according to the first aspect of the present invention, for example, the application unit may be configured to increase the force with which the holding unit presses the sample before reaching the final stage of separation. It is preferable to change the force applied to the holding unit.

In the separation apparatus according to the first aspect of the present invention, for example, the application unit includes a first application unit that continuously applies a force to the holding unit, and a separated portion of the sample. And a second application unit that applies a force to the holding unit when the holding unit retreats by a predetermined distance or more due to warping due to the pressure of the fluid.

In the separation device according to the first aspect of the present invention, for example, the first and second application sections preferably apply a force to the holding section by a spring.

In the separation device according to the first aspect of the present invention, for example, the application unit includes an actuator for applying a force to the holding unit, and a changing unit for changing a force generated by the actuator. It is preferable to provide

In the separation device according to the first aspect of the present invention, for example, the application unit changes an air cylinder for applying a force to the holding unit and a pressure of air supplied to the air cylinder. It is preferable to include a change unit that performs the change.

In the separating apparatus according to the first aspect of the present invention, for example, a shaft member connected to the holding portion;
A guide mechanism for supporting the shaft member in a state movable in a direction substantially perpendicular to the surface of the sample, whereby the holding unit can be moved in a direction substantially perpendicular to the surface of the sample. Is preferred.

In the separation device according to the first aspect of the present invention, for example, the guide mechanism injects a high-pressure gas to the shaft member and supports the shaft member by the pressure of the gas. Is preferred.

In the separation device according to the first aspect of the present invention, for example, the guide mechanism preferably has an air guide for supporting the shaft member.

[0021] In the separation device according to the first aspect of the present invention, for example, the fluid injected from the injection unit is
It is preferable to further include a cover member for preventing the mechanism from being attached to all or a predetermined portion of the mechanism connected to the holding portion.

In the separation device according to the first aspect of the present invention, it is preferable that the separation device further includes, for example, a cover member for preventing the fluid ejected from the ejection unit from adhering to the application unit.

In the separation device according to the first aspect of the present invention, for example, the separation device further includes a cover member for preventing fluid ejected from the ejection unit from adhering to the application unit and the guide mechanism. Is preferred.

[0024] In the separation device according to the first aspect of the present invention, for example, the cover member has a structure that does not generate substantial friction when the holding portion and the member connected to the holding portion move. It is preferable to include a sealing member.

In the separation device according to the first aspect of the present invention, for example, the seal member preferably includes a labyrinth seal.

In the separation device according to the first aspect of the present invention, for example, the seal member preferably includes a bellows.

In the separation apparatus according to the first aspect of the present invention, for example, a gas is supplied into a space covered by the cover member, and thereby the gas is supplied to make the inside of the space higher than the outside pressure. Preferably, it further comprises a mouth.

In the separation apparatus according to the first aspect of the present invention, for example, a driving source for rotating the sample held by the holding section around an axis substantially orthogonal to the separation layer is provided. Further, it is preferable to separate the sample while rotating it.

In the separation device according to the first aspect of the present invention, for example, the separation layer is preferably a layer having a fragile structure.

[0030] In the separation device according to the first aspect of the present invention, for example, the layer having the fragile structure is preferably a porous layer.

In the separation device according to the first aspect of the present invention, for example, the layer having the fragile structure is preferably a microbubble layer.

A separation device according to a second aspect of the present invention is a separation device for separating a plate-shaped sample having a separation layer therein by the separation layer, comprising: a holding portion for holding the sample; Ejecting a fluid toward the sample held by the holding unit,
Thus, the jetting unit for separating the sample in the separation layer, a support mechanism that supports the holding unit in a state that can be moved in a direction substantially perpendicular to the surface of the sample, and a separated portion of the sample A control unit that controls a retreat operation of the holding unit caused by warping due to the pressure of the fluid in accordance with a retreat amount.

In the separation apparatus according to the second aspect of the present invention, for example, the control unit has an application unit that applies a force to the holding unit in a direction in which the holding unit presses the sample, It is preferable that the application unit changes a force applied to the holding unit so that a force of the holding unit pressing the sample increases in accordance with an increase in a retreat amount of the holding unit.

[0034] In the separation apparatus according to the second aspect of the present invention, for example, in the first stage of separation, the application section causes the holding section to press the sample with a relatively small force,
In the second stage of separation, it is preferable to change the force applied to the holding unit so that the sample is pressed by the holding unit with a relatively large force.

In the above-described separation apparatus according to the second aspect of the present invention, for example, the applying unit may increase the force of pressing the sample by the holding unit before reaching the final stage of separation. It is preferable to change the force applied to the holding unit.

In the separation apparatus according to the second aspect of the present invention, for example, the application unit includes a first application unit that continuously applies a force to the holding unit, and a separated portion of the sample. And a second application unit that applies a force to the holding unit when the holding unit retreats by a predetermined distance or more due to warping due to the pressure of the fluid.

In the separation device according to the second aspect of the present invention, for example, it is preferable that the first and second application units apply a force to the holding unit by a spring.

In the separation device according to the second aspect of the present invention, for example, the application section includes an actuator for applying a force to the holding section, and a control section for controlling a force generated by the actuator. It is preferable to provide

In the separation device according to the second aspect of the present invention, for example, the application section adjusts an air cylinder for applying a force to the holding section and a pressure of air supplied to the air cylinder. It is preferable to include an adjusting unit that performs the adjustment.

[0040] In the separation device according to the second aspect of the present invention, for example, the control unit restricts further retreat of the holding unit when the retreat amount of the holding unit reaches a predetermined distance. Is preferred.

[0041] In the separation apparatus according to the second aspect of the present invention, for example, the control unit includes: an application unit that applies a force to the holding unit in a direction in which the holding unit presses the sample; It is preferable to further comprise a restricting member for further restricting the holding portion from retreating when the retreat amount reaches a predetermined distance.

In the separation device according to the second aspect of the present invention, for example, the applying section preferably applies a force to the holding section by a spring.

In the above-described separation apparatus according to the second aspect of the present invention, for example, the support mechanism may include a shaft member connected to the holding portion and a shaft member movable in a direction substantially perpendicular to a sample surface. It is preferable to have a guide mechanism for supporting the shaft member.

[0044] In the separation device according to the second aspect of the present invention, for example, the guide mechanism injects a high-pressure gas to the shaft member and supports the shaft member by the pressure of the gas. Is preferred.

In the separation device according to the second aspect of the present invention, for example, the guide mechanism preferably has an air guide for supporting the shaft member.

In the separation device according to the second aspect of the present invention, for example, the fluid ejected from the ejection unit is
It is preferable to further include a cover member for preventing the mechanism from being attached to all or a predetermined portion of the mechanism connected to the holding portion.

In the separation device according to the second aspect of the present invention, it is preferable that the separation device further includes, for example, a cover member for preventing the fluid ejected from the ejection unit from adhering to the control unit.

[0048] In the separation device according to the second aspect of the present invention, for example, a cover member for preventing the fluid ejected from the ejection unit from adhering to the control unit and the guide mechanism is further provided. Is preferred.

In the separation device according to the second aspect of the present invention, for example, the cover member has a structure that does not generate substantial friction when the holding portion and the member connected to the holding portion move. It is preferable to include a sealing member.

In the separation device according to the second aspect of the present invention, for example, the seal member preferably includes a labyrinth seal.

In the separation device according to the second aspect of the present invention, for example, the seal member preferably includes a bellows.

In the separation apparatus according to the second aspect of the present invention, for example, a gas is supplied into a space sealed by the cover member, thereby supplying the gas in the space higher than the outside pressure. Preferably, it further comprises a mouth.

In the separation apparatus according to the second aspect of the present invention, for example, a drive source for rotating the holding unit such that the sample rotates about an axis substantially orthogonal to the separation layer. Preferably, the sample is further separated while rotating.

In the separation device according to the second aspect of the present invention, for example, the separation layer is preferably a layer having a fragile structure.

In the separation device according to the second aspect of the present invention, for example, the layer having the fragile structure is preferably a porous layer.

In the separation device according to the second aspect of the present invention, for example, the layer having a fragile structure is preferably a microbubble layer.

A separation device according to a third aspect of the present invention is a separation device for separating a sample, wherein a holding portion for holding the sample, a shaft member connected to the holding portion, and a surface substantially parallel to the surface of the sample. A guide mechanism for supporting the shaft member in a state in which the sample can be moved in the orthogonal direction, and a fluid for jetting a fluid toward the sample held by the holding unit, thereby separating the sample in the separation layer. An ejecting section, wherein the guide mechanism ejects a high-pressure gas to the shaft member, and supports the shaft member by the pressure of the gas.

In the separation device according to the third aspect of the present invention, for example, the guide mechanism preferably has an air guide that supports the shaft member.

In the separation device according to the third aspect of the present invention, for example, the fluid ejected from the ejection unit is
It is preferable to further include a cover member for preventing the shaft member and the guide mechanism from adhering to all or a predetermined portion thereof.

[0060] In the separating apparatus according to the third aspect of the present invention, for example, the cover member has a structure that does not generate substantial friction when the holding portion and a mechanism connected to the holding portion move. It is preferable to include a sealing member.

[0061] In the separation device according to the third aspect of the present invention, for example, the seal member preferably includes a labyrinth seal.

[0062] In the separation device according to the third aspect of the present invention, for example, the seal member preferably includes a bellows.

A separation device according to a fourth aspect of the present invention is a separation device for separating a sample, wherein a holding portion for holding the sample, a shaft member connected to the holding portion, and a substantially perpendicular to the sample surface. A guide mechanism for supporting the shaft member in a state capable of moving in a direction in which the fluid is ejected, and ejecting a fluid toward the sample held by the holding portion, thereby ejecting the sample at the separation layer. And a cover member for preventing fluid ejected from the ejection unit from adhering to all or a predetermined portion of the shaft member and the guide mechanism,
The cover member includes a seal member having a structure that does not substantially cause friction when the holding portion and a member connected to the holding portion move.

In the separation device according to the fourth aspect of the present invention, for example, the seal member preferably includes a labyrinth seal.

In the separation device according to the fourth aspect of the present invention, for example, the seal member preferably includes a bellows.

A separation method according to a fifth aspect of the present invention is a separation method for separating a sample having a separation layer therein, the step of pressing and holding the sample by a holding unit, A separation step of separating the sample by the separation layer by injecting a fluid toward the sample held by the method, and changing the force by which the holding unit presses the sample according to the progress of the separation step. And a process.

In the separation method according to the fifth aspect of the present invention, for example, in the changing step, it is preferable to increase the force of the holding unit pressing the sample as the separation of the sample progresses.

In the separation method according to the fifth aspect of the present invention, for example, in the changing step, in the first stage of separation, the force of pressing the sample by the holding unit is relatively reduced, and In the second stage, it is preferable that the force with which the holding unit presses the sample is relatively increased.

[0069] In the separation method according to the fifth aspect of the present invention, for example, in the changing step, it is preferable to increase the force with which the holding unit presses the sample before reaching the final stage of separation.

In the separation method according to the fifth aspect of the present invention, for example, the separation layer is preferably a layer having a fragile structure.

In the above-described separation method according to the fifth aspect of the present invention, for example, the layer having a fragile structure is preferably a porous layer.

In the separation method according to the fifth aspect of the present invention, for example, the layer having a fragile structure is preferably a microbubble layer.

A separation method according to a sixth aspect of the present invention is a separation method for separating a sample having a separation layer therein, the step of holding the sample by a holding unit, and the step of holding the sample by the holding unit. A separating step of separating the sample by the separation layer by injecting a fluid toward the sample, and a retreating of the holding section caused by a separated portion of the sample being warped by the pressure of the fluid. And a control step of controlling according to the amount.

In the separation method according to the sixth aspect of the present invention, for example, in the control step, the force with which the holding unit presses the sample may be increased in accordance with an increase in the amount of retreat of the holding unit. preferable.

In the above-described separation method according to the sixth aspect of the present invention, for example, in the control step, in the first stage of separation, the force with which the holding unit presses the sample is made relatively small, and In the second stage, it is preferable that the force with which the holding unit presses the sample is relatively increased.

In the separation method according to the sixth aspect of the present invention, for example, in the control step, it is preferable to increase the force of the holding unit pressing the sample before reaching the final stage of separation.

In the separation method according to the sixth aspect of the present invention, for example, in the control step, when the retreat amount of the holding part reaches a predetermined distance, further retreat of the holding part is limited. Is preferred.

In the separation method according to the sixth aspect of the present invention, for example, the separation layer is preferably a layer having a fragile structure.

In the above-described separation method according to the sixth aspect of the present invention, for example, the layer having a fragile structure is preferably a porous layer.

In the separation method according to the sixth aspect of the present invention, for example, it is preferable that the layer having the fragile structure is a microbubble layer.

The method for manufacturing a substrate according to the seventh aspect of the present invention is a method for manufacturing a substrate, comprising: bonding a first substrate having a layer having a fragile structure therein to a second substrate; A forming step of forming a bonded substrate, a separating step of separating the bonded substrate at the fragile layer by any of the separating devices according to the first to fourth aspects, and a step of separating the second substrate after the separating step. Removing the fragile layer remaining on the substrate side.

A method of manufacturing a substrate according to an eighth aspect of the present invention includes a manufacturing step of bonding a first substrate having a layer having a fragile structure therein to a second substrate to form a bonded substrate. A separation step of separating the bonded substrate at the fragile layer by the separation method according to the fifth or sixth aspect, and removing a fragile layer remaining on the second substrate after the separation step. And a removing step.

[0083]

Preferred embodiments of the present invention will be described below with reference to the accompanying drawings.

FIG. 1 is a view for explaining a method of manufacturing an SOI substrate according to a preferred embodiment of the present invention in the order of steps.

In the step shown in FIG. 1A, a single crystal Si substrate 11 is prepared, and a porous Si layer 12 is formed on the surface thereof by anodization or the like. Next, in a step shown in FIG. 1B, a non-porous single-crystal Si layer 13 is formed on the porous Si layer 12.
Is formed by an epitaxial growth method, and an insulating layer (for example, an SiO 2 layer) 15 is formed thereon. This allows
A first substrate () is formed.

In the step shown in FIG. 1C, the second substrate 1
4 () is prepared, and the first layer is placed so that the insulating layer 15 faces.
The substrate () and the second substrate () are brought into close contact with each other at room temperature. After that, the first substrate () and the second substrate 14 () are bonded to each other by anodic bonding, pressing, heat treatment, or a combination thereof. By this processing, the insulating layer 15 and the second substrate 14 () are firmly bonded.
The insulating layer 15 is made of non-porous single-crystal Si as described above.
Although it may be formed on the layer 13, the second substrate 14 ()
1 and may be formed on both. As a result, when the first substrate and the second substrate are brought into close contact with each other, FIG.
The state shown in FIG.

In the step shown in FIG. 1D, the two bonded substrates are separated from each other at the porous Si layer 12. Thereby, the second substrate side ("+") has a laminated structure of the porous Si layer 12 "/ the single-crystal Si layer 13 / the insulating layer 15 / the single-crystal Si substrate 14. On the other hand, on the first substrate side (')
Has a structure having a porous Si layer 12 ′ on a single-crystal Si substrate 11.

The substrate (′) after the separation is used to form the first substrate () again by removing the remaining porous Si layer 12 ′ and flattening the surface as necessary. Used as a single crystal Si substrate 11.

After separating the bonded substrates, FIG.
In the step shown in (e), the porous layer 12 '' on the surface of the second substrate side ("+") is selectively removed. This allows
A substrate having a stacked structure of single crystal Si layer 13 / insulating layer 15 / single crystal Si substrate 14, that is, a substrate having an SOI structure is obtained.

As the second substrate, for example, single crystal Si
In addition to the substrate, an insulating substrate (for example, a quartz substrate) and a light-transmitting substrate (for example, a quartz substrate) are suitable.

In this embodiment, a porous layer 12 having a fragile structure is formed in a region for separation in order to facilitate a process of separating two substrates after they are bonded to each other.
Instead of this porous layer, for example, a microbubble layer may be formed. The microbubble layer can be formed, for example, by implanting ions into a semiconductor substrate.

In this embodiment, in at least a part of the step shown in FIG. 1D, ie, the step of separating the bonded substrate, the separation layer of porous Si is used.
A separation apparatus is used in which a liquid or a gas (fluid) is jetted toward the layer to separate the bonded substrates into two at the separation layer.

[Basic Configuration of Separation Apparatus]
The water jet method was applied. In general,
In the water jet method, water is jetted onto a target in a high-speed, high-pressure bundle flow to cut, process, remove coating films on the surface of ceramics, metal, concrete, resin, rubber, wood, etc. This is a method of cleaning the surface (see “Water Jet”, Vol. 1, No. 1, (1984), page 4).

In this separation apparatus, a high-speed, high-pressure fluid is jetted into a porous layer (separation layer) of a bonded substrate, which is a fragile structure, in the direction of the surface of the substrate in a bundled flow. Then, the substrate is separated at the portion of the porous layer by selectively collapsing the porous layer. Hereinafter, this bundled flow is referred to as a “jet”. Further, the fluid constituting the jet is referred to as “jet constituting medium”. As a jet constituting medium, water, an organic solvent such as alcohol, hydrofluoric acid, nitric acid and other acids, potassium hydroxide and other alkalis, air, nitrogen gas, carbon dioxide gas, rare gas, etching gas and other gases, or plasma, etc. There may be.

When this separation apparatus is applied to a manufacturing process of a semiconductor device, for example, a separation process of a bonded substrate, it is preferable to use pure water from which impurity metals, particles and the like have been removed as much as possible as a jet constituting medium.

The jet injection conditions may be determined according to, for example, the type of the separation area (for example, the porous layer), the shape of the outer peripheral portion of the bonded substrate, and the like. Jet injection conditions include, for example, pressure applied to the jet constituent medium,
The scanning speed of the jet, the width or diameter of the nozzle (substantially the same as the diameter of the jet), the nozzle shape, the distance between the nozzle and the separation area, the flow rate of the jet constituting medium, and the like are important parameters.

The method for separating the bonded substrates includes, for example,
1) A method in which a jet is inserted parallel to the bonding surface in the vicinity of the bonding surface and the nozzle is scanned along the bonding surface, and 2) The nozzle is parallel to the bonding surface in the vicinity of the bonding surface. 3) a method in which a jet is inserted and a bonded substrate is scanned, and 3) a method in which a jet is inserted in parallel with the bonding surface with respect to the vicinity of the bonding surface and the jet is scanned in a fan shape with the nozzle vicinity as a hip. 4)
A method in which a jet is inserted in the vicinity of the bonding surface in parallel with the bonding surface and the bonded substrate is rotated about the center of the bonded substrate as an axis (particularly effective when the bonded substrate has a disk shape). ).

Hereinafter, preferred embodiments of the present invention will be listed. The separation device according to each of the following embodiments is suitable for separating a bonded substrate having a porous layer or a microbubble layer that is a fragile structure inside, for example, a fragile structure inside. It is also suitable for the separation of other specimens.

[First Embodiment] FIG. 2 is a diagram showing a schematic configuration of a separation apparatus according to a first embodiment of the present invention. The separation apparatus 100 has substrate holding portions 102 and 103 located on the same central axis, and holds the bonded substrate 101 by sandwiching the bonded substrate 101 from both sides by the substrate holding portions 102 and 103. The bonded substrate 101 includes a porous layer 101 having a fragile structure inside.
b, and the porous layer 1
01b separates the two substrates 101a and 101c. In the separation apparatus 100, for example, the substrate 101a is the first substrate side (') in FIG.
01c is set on the second substrate side ("+") in FIG.

In the separation apparatus 100, the bonded substrate 101 is held by a pair of substrate holding units 102 and 103 so as to sandwich the bonded substrate 101 from both sides. The bonded substrate 101 is separated by the jet jet. Separation of the bonded substrate 101
It spirals from the outer periphery toward the center. More specifically, the separation of the bonded substrate 101 proceeds in such a manner that a boundary between a region already separated (separated region) and a region not yet separated (unseparated region) draws a spiral trajectory. . The separation region is warped by the pressure of the jet constituting medium injected therein. When the separation proceeds and the warp increases, the substrate holding unit 103 moves the bonded substrate 101
And gradually retreats.

The substrate holding unit 102 includes a rotating shaft 10 rotatably supported by a support table 134 via a bearing 112.
4, and the other end of the rotating shaft 104 is connected to a rotating shaft of a motor 107. Therefore, the motor 1
The bonded substrate 101 held by the substrate holding unit 102 is rotated by the rotation force generated by 07. The motor 107 is controlled by a controller (not shown), and rotates the rotating shaft 104 at a rotation speed supported by the controller.

The substrate holding section 102 is provided with a vacuum suction mechanism.
5. It is connected to an external vacuum pump via a rotary ring 106 for sealing and a vacuum joint 108.

The support table 134 has a rear end portion (a portion where the jet forming medium is not preferably adhered) of the substrate holding portion 102, for example, a bearing 112, a sealing ring 106, a motor 107, and the like. Cover 11 for preventing a medium (for example, water) from adhering.
1 is attached. The cover 111 has a supply port 109 for supplying a gas such as air into the cover 111.
And an exhaust port 110 for discharging the gas to the outside. By supplying gas into the cover 111 from the supply port 109 and keeping the inside of the cover 111 higher than the outside air pressure, it is possible to prevent the jet forming medium from entering the cover 111.

The substrate holding section 103 is connected to one end of a rotating shaft 113 rotatably and reciprocally supported by an air guide (air slide) 130 of a support 131. The air guide 130 blows high-pressure gas (for example, air) from around the rotation shaft 113 toward the rotation shaft 113, and supports the rotation shaft 113 by the pressure of the gas. Therefore, the resistance (friction) when the rotating shaft 113 rotates or reciprocates is kept extremely small. Therefore, the rotating shaft 113 and the substrate holding part 103 connected thereto rotate smoothly and reciprocate.

The substrate support section 103 is provided with a vacuum suction mechanism.
And a rotary vacuum joint 116 connected to an external vacuum pump.

A transmission plate 120 is mounted on the rotating shaft 113 via a bearing 123. Also, the rotating shaft 11
3, a ring member 113a is fixed. Furthermore,
A spring (first application unit) 117 that applies a force to the transmission plate 120 in a direction in which the transmission plate 120 is pushed out is provided on the rotation shaft 113.
Is installed. This force is transmitted to the substrate holding unit 103 via the transmission plate 120, the ring member 113a, and the rotation shaft 113. That is, a force acts on the substrate holding unit 103 in the direction of pressing the bonded substrate 101 by the spring 117.

The transmission plate 120 has a reciprocating guide 121,
Guide shafts 128 and 129 are loosely inserted through 122, respectively. It is preferable that the reciprocating guides 121 and 122 are constituted by, for example, the air guide as described above. Each of the guide shafts 128 and 129 has a spring (second applying unit) 11.
8, 119 are mounted. Springs 118 and 119
When the substrate holding unit 103 is retracted by a predetermined distance (moves rightward in FIG. 2) due to the separated area (separated area) of the bonded substrate 101 warping due to the pressure of the jet forming medium, the transmission is performed. A force is applied to the transmission plate 121 in a direction in which the plate 121 is pushed back. In this embodiment, the reciprocating guides (121, 122) and the guide shaft (12
8, 129) and two sets of springs (118, 119), but may be one set or three or more sets.

The support 131 has a portion on the rear end side of the substrate holding portion 103 (a portion on which the jet forming medium is not preferably adhered), such as the transmission plate 120 and the bearing 12.
3, reciprocating guides 121 and 122, springs 117 to 11
9, a cover 124 that covers the air guide 130, the rotating shaft 113, and the like is attached.

The cover 124 is provided with an opening through which the rotating shaft 114 passes. The opening serves as a seal member for preventing the jet medium from entering the inside of the cover 124. Labyrinth seal 125
Is provided. Thus, the labyrinth seal 125
By adopting the above, substantial resistance (friction) at the time of rotation or reciprocation of the rotating shaft 114 can be eliminated.
Thereby, the rotating shaft 114 rotates smoothly and reciprocates.

The cover 124 is provided with a supply port 127 for supplying a gas such as air to the inside of the cover 124 and an exhaust port 126 for discharging the gas to the outside. By supplying a gas into the cover 124 from the supply port 127 and keeping the inside of the cover 124 higher than the outside air pressure, it is possible to prevent the jet forming medium from entering the cover 124. The gas supplied into the cover 124 is exhausted to the outside via the labyrinth seal 125 and the air guide 130 in addition to the exhaust port 126.
Therefore, it is possible to effectively prevent the jet forming medium from entering the labyrinth seal 125 and the air guide 130.

The support 131 is connected to a piston rod 132 of an air cylinder 133 fixed to a support table 134, and is driven by the air cylinder 133. Specifically, when the air cylinder 133 pushes out the piston rod 132, the support 132 moves forward (moves leftward in FIG. 2), and the bonded substrates 101 are pressed from both sides by the substrate holders 102 and 103. Further, when the air cylinder 133 accommodates the peston rod 132, the support 132 moves backward (moves rightward in FIG. 2), and the substrate holding unit 102 and the substrate holding unit 103 are separated.

When the bonded substrate 101 is separated, a high-pressure jet forming medium is sent from the pump 137 to the nozzle 136 and the shutter 135 is opened while holding the bonded substrate 101 as shown in FIG. . Thus, the jet ejected from the nozzle 136 is sandwiched between the porous layers 101b of the bonded substrate 101.

As described above, in this separation apparatus 100,
In the first stage of separation of the bonded substrate 101, ie, before the amount of retreat of the substrate holding unit 103 due to warping of the bonded substrate 101 reaches a predetermined distance, the spring (first application unit) 117 is actuated. Then, the bonded substrate 101 is pressed by the substrate holding unit 103. And the second stage of separation,
That is, in a stage after the amount of retreat of the substrate holding unit 103 due to the warp of the bonded substrate 101 reaches a predetermined distance, the spring (first application unit) 117 and the spring (second application unit) 11
8, the bonded substrate 101 is pressed by the substrate holding unit 103.

That is, in the separation apparatus 100, the force applied to the substrate holding unit 103 is changed according to the progress of the separation of the bonded substrate 101. More specifically, in the separation apparatus 100, the force applied to the substrate holding unit 103 is increased in accordance with the progress of separation of the bonded substrate 101, and the substrate holding unit 103 is rapidly retracted in the final stage of separation. To prevent

From another viewpoint, the separating apparatus 100 controls the retreat operation of the substrate holder 103 according to the amount of retreat of the substrate holder 103. More specifically,
In the separation apparatus 100, the retreating operation of the substrate holding unit 103 accompanying the warping of the separation region of the bonded substrate 101 by the fluid is controlled by increasing the force applied to the substrate holding unit 103, and the final stage of separation is performed. Prevents the substrate holding unit 103 from retreating rapidly.

As described above, by preventing the substrate holder 103 from retreating rapidly in the final stage of separation of the bonded substrate 101, the portion of the porous layer 101b separated in the final stage is peeled off. Prevent the phenomenon,
This can prevent defects from occurring.

As described above, in the bonded substrate 101, the separation region is warped by the pressure of the jet forming medium injected into the inside (between the substrate 101a and the substrate 101c). When the separation proceeds and reaches the stage where the vicinity of the center of the bonded substrate 101 is separated, the warpage causes the substrate holding unit 103 to start retreating. At this stage, the smaller the force with which the substrate holding unit 103 presses the bonded substrate 101, the larger the amount of warpage of the separation region, and thus the separation force due to the pressure of the jet constituent medium injected into the bonded substrate 101. (The force acting in the direction of separating the substrate 101a and the substrate 101c) efficiently acts on the boundary between the separation region and the unseparated region, and the separation proceeds efficiently.

However, in the final stage of separation, the separation force rapidly increases, while the unseparated region rapidly decreases, so that the bonding force between the substrate 101a and the substrate 101c rapidly decreases. Therefore, when the force with which the substrate holding unit 103 presses the bonded substrate 101 is not sufficient, the warpage of the unseparated region rapidly increases while the substrate holding unit 103 is rapidly retracted. As a result, there is a possibility that the separating force acts on the unseparated area in a concentrated manner, and the unseparated area is peeled off at once to cause a defect.

Then, as described above, the bonded substrate 1
It is preferable to prevent the occurrence of defects by preventing the substrate holding unit 103 from retreating rapidly in the final stage of the separation of No. 01.

Further, in the separation apparatus 100, as described above, the rotating shaft 113 connected to the substrate holding unit 103 is supported by the air guide 130, so that the resistance when the rotating shaft 113 reciprocates is extremely small. Have been. Therefore, the substrate holding unit 103 smoothly retreats as the separation proceeds. As a result, it is possible to more effectively prevent the above-described defects from occurring.

The reason is as follows. Rotating shaft 11
When the resistance of the reciprocating motion of the motor 3 is large, it can be said that the difference between the dynamic friction coefficient and the static friction coefficient is large. Therefore,
The rotating shaft 113 has a possibility of causing so-called knocking at the time of retreat. In this case, the substrate holding portion 103 is instantaneously retracted, whereby the separating force acts intensively on the unseparated region, and the unseparated region may be peeled off at once to cause a defect. . Therefore, as described above, the rotating shaft 11
3, that is, it is preferable to smooth the retreat of the substrate holding unit 103. In this way, by smoothing the retreat of the substrate holding unit 103, even when the force applied to the substrate holding unit 103 is not changed in accordance with the progress of the separation of the bonded substrate 101, the occurrence of the above-described defect is prevented. can do.

Further, in the separating apparatus 100, as described above, the cover 124 is provided, and the rotating shaft serves as a seal member for preventing the jet constituting medium from entering the cover 124 from the opening of the cover 124. 114
A labyrinth seal 125 that eliminates substantial resistance during the reciprocating motion of the motor is adopted. Therefore, even when the jet forming medium adheres to the seal member (labyrinth seal 125), the increase in resistance during reciprocation of the rotating shaft 113 is small, and the possibility of knocking is low. As a result, it is possible to more effectively prevent the above-described defects from occurring.

Further, in the separation device 100, as described above, by supplying gas into the cover 124, the pressure inside the cover 124 is maintained higher than the outside pressure. Therefore, in the separation device 100, the jet constituent medium can be effectively prevented from entering the labyrinth seal 125 and the air guide 130, and the occurrence of knocking can be more efficiently prevented.

Hereinafter, the procedure of the separation processing of the bonded substrate 101 by the separation apparatus 100 will be described.

First, the support 1 is moved by the air cylinder 133.
31 is moved backward (moved to the right in FIG. 2) to provide a corresponding space between the substrate holding unit 102 and the substrate holding unit 103. Then, between the substrate holding unit 102 and the substrate holding unit 103, the bonded substrate 1
01 is conveyed, and the center axes of the substrate holding units 102 and 103 and the center of the bonded substrate 101 are aligned. Thereafter, the support 131 is moved forward (moves to the left in FIG. 2) by the air cylinder 133, and the bonded substrate 101 is pressed by the substrate holder 103 (the state shown in FIG. 2). In this state, the driving force of the air cylinder 133 and the force of the spring 117 act on the bonded substrate 101, and the bonded substrate 101 is pressed and held by the substrate holding unit 102 and the substrate holding unit 103 so as to be sandwiched from both sides.

Next, the vacuum suction mechanism of the substrate holding units 102 and 103 is operated to operate the substrate holding units 102 and 103.
Then, the bonded substrate 101 is sucked. Note that the bonded substrate 101 does not necessarily need to be adsorbed to the substrate holding units 102 and 103, but by adhering, the bonded substrate 101 can be held more stably.

Next, the bonded substrate 101 is rotated at a predetermined rotation speed by operating the motor 107. At this time, the rotating shaft 104, the substrate holding unit 102, the bonded substrate 101, the substrate holding unit 103, and the rotating shaft 113 rotate integrally.

Next, the pump 137 is operated to feed a jet forming medium (eg, water) to the nozzle 136.
When the jet is stabilized, the shutter 135 is opened, and the jet is sandwiched between the porous layers 101b of the bonded substrate 101. As a result, the impact force due to the jet and the separating force due to the pressure of the jet constituting medium injected into the bonded substrate 101 act on the porous layer 101b of the bonded substrate 101, and the separation proceeds. In this embodiment, the jet pressure is, for example, 500 kg
f / square cm is preferable, and the diameter of the nozzle 136 is
For example, about 0.1 mm is suitable.

FIG. 3 is a diagram schematically showing a state of a part of the bonded substrate 101 and the separation apparatus 100 in the first stage of separation. As shown in FIG. 3, in the first stage (including the initial stage) of the separation, the separation proceeds such that the already separated region on the outer peripheral portion of the bonded substrate 101 is warped by the pressure of the jet constituting medium. However, at this stage, since the central portion of the bonded substrate 101 is not separated, the substrate holding portion 103 does not retreat (move rightward in FIG. 3). Therefore, the bonded substrate 101
Are not acted on by the springs 118 and 119, but are acted on by the force of the spring 117 to be pressed by the substrate holder 103. Note that the bonded substrate 101 is attached to the substrate holding unit 10.
In the case of holding by the vacuum suction mechanisms 2 and 103, in the first stage of separation, the bonded substrate 101 may be held while being pulled in a direction of separating the bonded substrate 101 to both sides, or a pressing force or a pulling force may be applied to the bonded substrate 101. It may be held without applying force.

FIG. 4 is a diagram schematically showing a state of a part of the bonded substrate 101 and the separation apparatus 100 in the second stage of separation. At the second stage of separation (including the final stage of separation), as shown in FIG.
1 proceeds to near the center, and the bonded substrate 10
The warpage of the substrate 101a and the substrate 101c due to the pressure of the jet forming medium injected into the inside of the substrate 101 increases. As a result, the substrate holding unit 103 moves backward (moves rightward in FIG. 4), and the transmission plate 120 moves backward, so that the transmission plate 120 comes into contact with the springs 118 and 119 as shown in FIG.

At this stage, the substrate holder 103 receives not only the spring 117 but also the forces of the springs 118 and 119,
The bonded substrate 101 is pressed. That is, the bonded substrate 101 is pressed by the substrate holding unit 103 with a larger force. As a result, in the final stage of separation, the substrate holding unit 103 rapidly retracts, and the substrate 101a and the substrate 1
01c can be prevented from being defective.

Here, the transmission plate 120 (substrate holder 10)
Regarding the extent to which the springs 118 and 119 act when 3) is retracted, for example, the diameter and pressure of the jet, the size and strength of the bonded substrate 101, the substrate holding unit 1
It can be changed as appropriate according to the size of 03, the spring constant of the springs 117 to 119, and the like. In this embodiment, for example, the transmission plate 120 (the substrate holding portion 103) has a thickness of 0.1 mm.
When retracted, the springs 118 and 119 are configured to operate.

In the above description, for the sake of convenience, immediately after the start of the separation, the initial stage of the separation, and immediately before the completion of the separation until the completion of the separation, the final stage of the separation. The first stage of separation is performed until 103 is retracted and the transmission plate 120 contacts the springs 118 and 119,
The subsequent stage is the second stage of separation.

When the separation is completed, the shutter 135 is closed to stop the jet from being inserted into the bonded substrate 101, and the pump 137 and the motor 107 are stopped.

Next, the support 131 is moved backward by the air cylinder 133 to separate the substrates 101a and 101c. Then, for example, after the substrates 101a and 101c are sucked by the robot hand of the transfer robot, the suction by the substrate holding units 102 and 103 is released, and the substrates 101a and 101c are delivered to the transfer robot.

[Second Embodiment] FIG. 5 is a diagram showing a schematic configuration of a separation apparatus according to a second embodiment of the present invention. The separation device 100 according to the first embodiment
The same components as those described above are denoted by the same reference numerals.

The separation device 200 according to the second embodiment
Are limiting members 201 and 20 for limiting the retreat amount of the transmission plate 120 to a predetermined distance instead of the springs 118 and 119 in the separation device 100 according to the first embodiment.
2

That is, the separation apparatus 1 according to the first embodiment
In the case of 00, the substrate holding unit 103 is not less than a predetermined distance (for example,
When retracted (0.1 mm or more), a force (drag) is applied to the substrate holding unit 103 via the transmission plate 120. However, in the separation device 200 according to the second embodiment, the substrate holding unit 10
The amount of retreat is limited so that 3 does not retreat more than a predetermined distance.

The restricting members 201 and 202 have, for example, a ring shape and are fixed to the guide shafts 128 and 129, respectively. In this embodiment, a reciprocating guide (12
1, 122), two sets of guide shafts (128, 129) and restriction members (201, 202), but these may be one set or three or more sets. Note that the other components are the same as those of the separation device 100 according to the first embodiment and the separation device 200 according to the second embodiment, and a description thereof will be omitted.

Hereinafter, the procedure of the separation processing of the bonded substrate 101 by the separation apparatus 200 will be described.

First, the support 1 is moved by the air cylinder 133.
31 is moved backward (moved to the right in FIG. 5) to provide an appropriate space between the substrate holding unit 102 and the substrate holding unit 103. Then, between the substrate holding unit 102 and the substrate holding unit 103, the bonded substrate 1
01 is conveyed, and the center axes of the substrate holding units 102 and 103 and the center of the bonded substrate 101 are aligned. Thereafter, the support 131 is moved forward (moves leftward in FIG. 5) by the air cylinder 133, and the bonded substrate 101 is pressed by the substrate holding unit 103 (the state shown in FIG. 5). In this state, the driving force of the air cylinder 133 and the force of the spring 117 act on the bonded substrate 101, and the bonded substrate 101 is pressed and held by the substrate holding unit 102 and the substrate holding unit 103 so as to be sandwiched from both sides.

Next, the vacuum suction mechanism of the substrate holding units 102 and 103 is operated to operate the substrate holding units 102 and 103.
Then, the bonded substrate 101 is sucked. Note that the bonded substrate 101 does not necessarily need to be adsorbed to the substrate holding units 102 and 103, but by adhering, the bonded substrate 101 can be held more stably.

Next, the bonded substrate 101 is rotated at a predetermined rotation speed by operating the motor 107. At this time, the rotating shaft 104, the substrate holding unit 102, the bonded substrate 101, the substrate holding unit 103, and the rotating shaft 113 rotate integrally.

Next, the pump 137 is operated to feed a jet forming medium (for example, water) to the nozzle 136.
When the jet is stabilized, the shutter 135 is opened, and the jet is sandwiched between the porous layers 101b of the bonded substrate 101. As a result, the impact force due to the jet and the separating force due to the pressure of the jet constituting medium injected into the bonded substrate 101 act on the porous layer 101b of the bonded substrate 101, and the separation proceeds. In this embodiment, the jet pressure is, for example, 500 kg
f / square cm is preferable, and the diameter of the nozzle 136 is
For example, about 0.1 mm is suitable.

FIG. 6 is a diagram schematically showing a state of a part of the bonded substrate 101 and the separation apparatus 200 in the first stage of separation. As shown in FIG. 6, in the first stage (including the initial stage) of the separation, the already separated region (separation region) on the outer peripheral portion of the bonded substrate 101 is deflected by the pressure of the jet constituting medium. Progresses. However, at this stage, since the central portion of the bonded substrate 101 is not separated, the substrate holding portion 103 does not retreat (move rightward in FIG. 6). Therefore, the transmission plate 120 does not contact the restriction members 201 and 202.
Note that the bonded substrate 101 is attached to the substrate holding units 102 and 1
03 is held by the vacuum suction mechanism of
At this stage, the bonded substrate 101 may be held while being pulled in the direction in which the bonded substrate 101 is separated from both sides.
01 may be held without applying any pressing force or pulling force.

FIG. 7 is a diagram schematically showing a state of a part of the bonded substrate 101 and the separation apparatus 200 in the second stage of separation. At the second stage of separation (including the final stage of separation), as shown in FIG.
1 proceeds to near the center, and the bonded substrate 10
The warpage of the substrate 101a and the substrate 101c due to the pressure of the jet forming medium injected into the inside of the substrate 101 increases. As a result, the substrate holding unit 103 moves backward (moves rightward in FIG. 7), and the transmission plate 120 moves backward. As shown in FIG. 7, the transmission plate 120 comes into contact with the restricting members 201 and 202. Further, further retreat of the substrate holding unit 103 is restricted by the restriction members 201 and 202.

As described above, the limiting members 201 and 202
In the final stage of separation, the substrate holding unit 1
03 can be prevented from rapidly retreating and causing defects in the substrates 101a and 101c.

Here, the transmission plate 120 (substrate holder 10)
3) Regarding how much the retreat amount is limited, for example, the diameter and pressure of the jet, the size and strength of the bonded substrate 101, the size of the substrate holding unit 103, the springs 117 to 11
9 can be appropriately changed according to the spring constant and the like. In this embodiment, for example, the retreat amount of the transmission plate 120 (substrate holder 103) is limited to, for example, about 0.1 mm.

In the above description, for the sake of convenience, immediately after the start of the separation, the initial stage of the separation, and immediately before the completion of the separation until the completion of the separation, the final stage of the separation. Is the first stage of separation until it contacts the limiting members 201 and 202, and the second stage of separation thereafter.

When the separation is completed, the shutter 135 is closed to stop the jet from being inserted into the bonded substrate 101, and the pump 137 and the motor 107 are stopped.

Next, the support 131 is moved backward by the air cylinder 133 to separate the substrates 101a and 101c. Then, for example, the substrate 101 is transferred by the transfer robot.
a and 101c, the suction by the substrate holding units 102 and 103 is released, and the transfer robot 1
Hand over 01a and 101c.

[Third Embodiment] FIG. 8 is a diagram showing a schematic configuration of a part of a separation apparatus according to a preferred embodiment of the present invention. In the third embodiment, a bellows 125 'is used instead of the labyrinth seal 125 in the separation device 100 according to the first embodiment. The other components and the procedure of the separation process are the same as in the first embodiment.

The bellows 125 'is fixed to the opening of the cover 124 and functions as a sealing member. The tip of the bellows 125 ′ is pressed against the back surface of the substrate holding member 103, and expands and contracts in accordance with the reciprocating movement (movement to the left or right in FIG. 8) of the substrate holding member 103, and jets into the cover 124. Prevent the constituent media from entering.

[Fourth Embodiment] FIG. 9 is a diagram showing a schematic configuration of a part of a separation apparatus according to a preferred embodiment of the present invention. In the fourth embodiment, a bellows 125 'is used instead of the labyrinth seal 125 in the separation device 200 according to the second embodiment. The other components and the procedure of the separation process are the same as in the second embodiment.

The bellows 125 'is fixed to the opening of the cover 124, and functions as a sealing member. The tip of the bellows 125 ′ is pressed against the back surface of the substrate holding member 103, and expands and contracts in accordance with the reciprocating movement (movement to the left or right in FIG. 9) of the substrate holding member 103, and jets into the cover 124. Prevent the constituent media from entering.

[Fifth Embodiment] FIG. 10 is a diagram showing a schematic configuration of a separation apparatus according to a fifth embodiment of the present invention. The separation device 300 has substrate holding portions 301 and 302 located on the same central axis, and presses and holds the bonded substrate 101 by sandwiching the bonded substrate 101 from both sides. The bonded substrate 101 has a porous layer 10 having a fragile structure inside.
1b, and is separated into two substrates 101a and 101c at the portion of the porous layer 101b by the separation device 300. In the separation apparatus 100, for example, the substrate 101 is the first substrate side (') in FIG.
01c is set on the second substrate side ("+") in FIG.

The substrate holding unit 301 includes a rotary shaft 30 rotatably supported by a support table 309 via a bearing 304.
3 and the other end of the rotating shaft 303 is connected to the rotating shaft of a motor 305. Therefore, the motor 3
The bonded substrate 101 pressed by the substrate holding unit 301 is rotated by the rotational force generated by the 05. The motor 305 is controlled by the controller 314, and rotates the rotation shaft 303 at a rotation speed specified by the controller 314 or stops the rotation.

The substrate holder 302 is provided with the reciprocating rotary guide 30.
7, a rotating shaft 30 slidably and rotatably supported
6. The rear end of the rotation shaft 306 is connected to a piston rod of the air cylinder 308. The reciprocating guide 307 is, as in the first to fourth embodiments,
It is preferable to form the guide member (for example, an air guide) having a small resistance (friction) during reciprocation. The reason is as described above.

The air cylinder 308 has first and second regulators 311 and 31 set to different values from each other.
Compressed air is supplied through the two-way three-way valve 310. The regulators 311 and 312 include a controller 314.
Compressed air from a pressure source is selectively supplied via an electromagnetic valve 313 controlled by the controller. Therefore, the air cylinder 3
08 is selectively supplied with compressed air having different pressures under the control of the controller 314. This allows
The air cylinder 308 can selectively apply two types of forces (first and second forces) to the substrate holding unit 302.

When the bonded substrate 101 is separated, a high-pressure jet forming medium is sent from the pump 315 to the nozzle 316 and the shutter 317 is opened while the bonded substrate is held as shown in FIG. Thus, the jet ejected from the nozzle 316 is sandwiched between the porous layers 101b of the bonded substrate 101.

In this embodiment also, the first to fourth
Similarly to the embodiment, a cover member (corresponding to the cover member 124) and a seal member (corresponding to the labyrinth seal 125 or the bellows 125 ') for preventing the jet constituting medium from adhering to the reciprocating guide 307 and the like are provided. Preferably, it is provided. Further, it is preferable that the pressure in the space inside the cover is higher than the outside pressure to prevent the jet forming medium from entering the inside of the cover and the seal member.

Hereinafter, a procedure of the separation processing of the bonded substrate 101 by the separation apparatus 300 will be described.

First, the substrate holding section 302 is moved backward (moved to the right in FIG. 10) by the air cylinder 308 to provide an appropriate gap between the substrate holding section 301 and the substrate holding section 302. Then, the substrate holding unit 301 and the substrate holding unit 302
For example, the bonded substrate 101 is transported by a transport robot or the like, and the center axes of the substrate holding units 301 and 302 and the center of the bonded substrate 101 are aligned.

Next, the controller 314 controls the solenoid valve 313 to supply compressed air of the first pressure from the first regulator 311 to the air cylinder 308 via the three-way valve 310. At this time, the air cylinder 308 advances the substrate holding unit 302, and the bonded substrate 101
It is pressed and held by a first force (for example, 600 gf).

Next, under the control of the controller 314, the motor 305 is operated to rotate the bonded substrate 101 at a predetermined rotation speed. At this time, the rotating shaft 303,
The substrate holder 301, the bonded substrate 101, the substrate holder 302, the rotating shaft 306, and the piston rod of the air cylinder 308 rotate integrally.

Next, the pump 315 is operated to feed a jet forming medium (eg, water) to the nozzle 316.
When the jet is stabilized, the shutter 316 is opened, and the jet is inserted into the porous layer 101b of the bonded substrate 101. As a result, the impact force of the jet and the separating force due to the pressure of the jet forming medium injected into the bonded substrate 101 act on the porous layer 101b of the bonded substrate 101, and the first stage of separation starts. Is done. In this embodiment, the jet pressure is preferably, for example, about 500 kgf / square cm.
The diameter of 16 is preferably, for example, about 0.1 mm.

Next, before reaching the final stage of the separation, the first stage is shifted to the second stage. Specifically, the controller 314 controls the solenoid valve 313 to shut off the supply of compressed air to the first regulator 311, that is, the supply of compressed air at the first pressure to the air cylinder 308. The compressed air of the second pressure is supplied from the second regulator 312 to the air cylinder 308 via the three-way valve 310. At this time, the air cylinder 308 presses the substrate holding unit 302 against the bonded substrate 101 with a second force (for example, 1.5 kgf).

In the above description, for convenience of description, the step of supplying compressed air from the first regulator 311 to the air cylinder 308 and pressing and holding the bonded substrate 101 with the first force to separate the bonded substrate 101 is described. The first stage, a stage in which compressed air is supplied from the second regulator 312 to the air cylinder 308 and the bonded substrate 101 is separated while being pressed and held by the second force, is a second stage.

As described above, by increasing the force applied to the substrate holding section 302 before the final stage of separation (from the first stage to the second stage), the substrate is moved to the final stage of the separation. The holding unit 302 is rapidly retracted and the substrate 1
01a and the substrate 101c can be prevented from being defective.

Here, in the first and second stages of separation, the force (pressure of compressed air supplied to the air cylinder 308) for pressing the bonded substrate 101 by the substrate holding portion 302 is, for example, the diameter or pressure of the jet. The size and strength of the bonded substrate 101, the size of the substrate holder 302, and the like can be changed as appropriate. In this embodiment, in the first stage of separation, the bonded substrate 101
In the second stage of separation, the bonded substrate 101 is pressed with a force of, for example, 1.5 kgf. The transition from the first stage to the second stage of the separation can be controlled, for example, by time.

When the separation is completed, the shutter 317 is closed to stop the jet from being inserted into the bonded substrate 101, and the pump 315 and the motor 305 are stopped.

Next, for example, after the substrates 101a and 101c are sucked by the robot hand of the transfer robot, the substrate holding unit 302 is moved backward, and
Convey 1a and 101c.

[0173]

According to the present invention, for example, an apparatus and a method suitable for separating a plate-like sample (for example, a bonded substrate) having a separation layer inside can be provided.

For example, according to the present invention, it is possible to prevent defects from occurring in a sample during separation.

[0175]

[Brief description of the drawings]

FIG. 1 is a view illustrating a method of manufacturing an SOI substrate according to a preferred embodiment of the present invention in the order of steps.

FIG. 2 is a diagram showing a schematic configuration of a separation device according to the first embodiment of the present invention.

FIG. 3 is a diagram schematically showing a state of a part of a bonded substrate and a separation device in a first stage of separation.

FIG. 4 is a diagram schematically showing a state of a part of a bonded substrate and a separation device in a second stage of separation.

FIG. 5 is a diagram showing a schematic configuration of a separation device according to a second embodiment of the present invention.

FIG. 6 is a diagram schematically showing a state of a part of a bonded substrate and a separation device in a first stage of separation.

FIG. 7 is a diagram schematically showing a state of a bonded substrate and a part of a separation device in a second stage of separation.

FIG. 8 is a diagram showing a schematic configuration of a part of a separation device according to a third embodiment of the present invention.

FIG. 9 is a diagram showing a schematic configuration of a part of a separation device according to a fourth embodiment of the present invention.

FIG. 10 is a diagram illustrating a schematic configuration of a separation device according to a fifth embodiment of the present invention.

[Explanation of symbols]

 REFERENCE SIGNS LIST 100 Separation device 101 Bonded substrate 101a, 101c Substrate 101b Porous layer 102, 103 Substrate holding unit 104, 113 Rotating shaft 105, 114 Vacuum line 106 Rotating ring 107 Motor 108 Vacuum joint 109 Supply port 110 Exhaust port 111 Cover 112 Bearing 116 Vacuum joint 117 Spring (first application section) 118, 119 Spring (second application section) 120 Transmission plate 121, 122 Reciprocating guide 123 Bearing 124 Cover 125 Labyrinth seal 126 Exhaust port 127 Supply port 128, 129 Guide shaft 130 Air guide (Air slide) 131 Support member 132 Piston rod 133 Air cylinder 134 Support stand 135 Shutter 136 Nozzle 137 Pump 200 Separation device 201, 202 Restriction member 125 'Velo 3300 Separating device 301,302 Substrate holding unit 303,306 Rotating shaft 304 Bearing 305 Motor 307 Reciprocating guide 308 Air cylinder 309 Support base 310 Tripod valve 311 First regulator 312 Second regulator 313 Solenoid valve 314 Controller 315 Pump 316 Nozzle 317 Shutter

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Kazuaki Omi 3-30-2 Shimomaruko, Ota-ku, Tokyo Inside Canon Inc. (72) Inventor Takao Yonehara 3-30-2 Shimomaruko, Ota-ku, Tokyo Non Corporation

Claims (73)

[Claims] 1. A separation device for separating a plate-shaped sample having a separation layer therein by the separation layer, comprising: a holding unit for holding the sample; And a jetting unit for separating the sample with the separation layer, thereby applying a force to the holding unit so that the holding unit presses the sample. The separation device, wherein the application unit changes a force applied to the holding unit according to progress of separation of the sample. 2. The method according to claim 1, wherein the applying unit increases a force with which the holding unit presses the sample as the separation of the sample progresses.
The separation device according to claim 1, wherein a force applied to the holding unit is changed. 3. The application section causes the holding section to press the sample with a relatively small force in the first stage of separation, and the sample section applies a relatively large force to the holding section in the second stage of separation. The separation device according to claim 1, wherein a force applied to the holding unit is changed so as to press. 4. The method according to claim 1, wherein the applying unit changes a force applied to the holding unit so that a force pressing the sample on the sample increases before reaching a final stage of separation. Item 2. The separation device according to Item 1. 5. The application unit includes: a first application unit that continuously applies a force to the holding unit; and a holding unit that is separated by a predetermined distance by warping a separated portion of a sample by a pressure of a fluid. The separation device according to claim 1, further comprising: a second application unit configured to apply a force to the holding unit when retracted. 6. The separation device according to claim 5, wherein the first and second application units apply a force to the holding unit by a spring. 7. The application unit according to claim 1, wherein the application unit includes: an actuator for applying a force to the holding unit; and a change unit for changing a force generated by the actuator. The separation device according to any one of the above. 8. The apparatus according to claim 1, wherein the applying unit includes: an air cylinder for applying a force to the holding unit; and a changing unit for changing a pressure of air supplied to the air cylinder. The separation device according to claim 4. 9. A shaft member connected to the holding portion, and a guide mechanism for supporting the shaft member so as to be movable in a direction substantially perpendicular to the surface of the sample, whereby the holding portion The separation device according to any one of claims 1 to 8, wherein the separation device can be moved in a direction substantially perpendicular to a surface of the sample. 10. The separation device according to claim 9, wherein the guide mechanism ejects high-pressure gas to the shaft member and supports the shaft member by the pressure of the gas. 11. The separation device according to claim 9, wherein the guide mechanism has an air guide that supports the shaft member. 12. The apparatus according to claim 1, further comprising a cover member for preventing the fluid ejected from the ejection unit from adhering to all or a predetermined portion of the mechanism connected to the holding unit. The separation device according to any one of claims 11 to 11. 13. The apparatus according to claim 1, further comprising a cover member for preventing a fluid ejected from the ejection unit from adhering to the application unit. Separation equipment. 14. The apparatus according to claim 9, further comprising a cover member for preventing the fluid ejected from the ejection unit from adhering to the application unit and the guide mechanism.
The separation device according to any one of claims 11 to 11. 15. The cover member according to claim 12, wherein the cover member includes a seal member having a structure that does not substantially cause friction when the holding portion and a member connected to the holding portion are moved. 15. The separation device according to any one of 14. 16. The separation device according to claim 15, wherein the seal member includes a labyrinth seal. 17. The separation device according to claim 15, wherein the seal member includes a bellows. 18. The apparatus according to claim 12, further comprising a supply port for supplying gas into a space covered by said cover member, whereby the inside of said space is made higher than the outside air pressure. 18. The separation device according to any one of items 17 to 17. 19. The apparatus according to claim 19, further comprising a driving source for rotating the sample held by the holding section around an axis substantially perpendicular to the separation layer, wherein the sample is separated while rotating. The separation device according to any one of claims 1 to 18. 20. The separation apparatus according to claim 1, wherein the separation layer is a layer having a fragile structure. 21. The separation device according to claim 20, wherein the layer having the fragile structure is a porous layer. 22. The separation device according to claim 20, wherein the layer having the fragile structure is a microbubble layer. 23. A separation apparatus for separating a plate-shaped sample having a separation layer therein by the separation layer, comprising: a holding section for holding the sample; A jetting unit for jetting a fluid through the separation layer to thereby separate the sample in the separation layer; a support mechanism for supporting the holding unit in a state movable in a direction substantially perpendicular to the surface of the sample; A control unit that controls a retreat operation of the holding unit in accordance with a retreat amount when the separated part warps due to a pressure of a fluid. 24. The control unit has an application unit that applies a force to the holding unit in a direction in which the holding unit presses the sample, and the application unit is configured to respond to an increase in the amount of retreat of the holding unit. 24. The separation apparatus according to claim 23, wherein a force applied to the holding unit is changed so that a force of the holding unit pressing the sample increases. 25. The method according to claim 25, wherein the applying unit includes:
Changing the force applied to the holding unit so that the holding unit presses the sample with a relatively small force, and in the second stage of separation, the holding unit presses the sample with a relatively large force. 24. The separation device according to claim 23, wherein: 26. The apparatus according to claim 26, wherein the applying unit changes a force applied to the holding unit so that a force of pressing the sample by the holding unit increases before reaching a final stage of separation. Item 24. The separation device according to item 23. 27. The application unit, comprising: a first application unit that continuously applies a force to the holding unit; and a holding unit that is separated by a predetermined distance by warping a separated portion of the sample by a pressure of a fluid. 24. The separation device according to claim 23, further comprising: a second application unit that applies a force to the holding unit when retracted. 28. The apparatus according to claim 2, wherein the first and second applying units apply a force to the holding unit by a spring.
8. The separation device according to 7. 29. The apparatus according to claim 23, wherein the applying unit includes: an actuator for applying a force to the holding unit; and an adjusting unit for adjusting a force generated by the actuator. The separation device according to any one of the above. 30. The application unit according to claim 23, wherein the application unit includes an air cylinder for applying a force to the holding unit, and an adjustment unit for adjusting a pressure of air supplied to the air cylinder. 27. The separation device according to claim 26. 31. The separation apparatus according to claim 23, wherein when the amount of retreat of the holding unit reaches a predetermined distance, the control unit further restricts further retreat of the holding unit. 32. The control unit, further comprising: an application unit configured to apply a force to the holding unit in a direction in which the holding unit presses the sample; and further comprising, when a retreat amount of the holding unit reaches a predetermined distance, The separation device according to claim 23, further comprising: a restriction member configured to restrict retreat of the holding unit. 33. The separation device according to claim 32, wherein the applying unit applies a force to the holding unit by a spring. 34. The support mechanism, comprising: a shaft member connected to the holding portion; and a guide mechanism for supporting the shaft member in a state movable in a direction substantially orthogonal to a sample surface. The separation device according to any one of claims 23 to 33. 35. The separation device according to claim 34, wherein the guide mechanism ejects high-pressure gas to the shaft member, and supports the shaft member by the pressure of the gas. 36. The separation device according to claim 34, wherein the guide mechanism has an air guide that supports the shaft member. 37. The apparatus according to claim 23, further comprising a cover member for preventing the fluid ejected from the ejection unit from adhering to all or a predetermined portion of the mechanism connected to the holding unit. 37. The separation device according to claim 36. 38. The apparatus according to claim 23, further comprising a cover member for preventing a fluid ejected from the ejection unit from adhering to the control unit. Separation equipment. 39. The apparatus according to claim 3, further comprising a cover member for preventing the fluid ejected from the ejection unit from adhering to the control unit and the guide mechanism.
The separation device according to any one of claims 4 to 36. 40. The cover member according to claim 37, wherein the cover member includes a seal member having a structure that does not substantially cause friction when the holding portion and a member connected to the holding portion are moved. 40. The separation device according to any one of 39. 41. The separation device according to claim 40, wherein the seal member includes a labyrinth seal. 42. The separation device according to claim 40, wherein the seal member includes a bellows. 43. The apparatus according to claim 41, further comprising a supply port for supplying a gas into the space sealed by the cover member, whereby the inside of the space is made higher than the outside air pressure. 43. The separation device according to any one of 43. 44. The apparatus further comprises a drive source for rotating the holding portion so that the sample rotates around an axis substantially orthogonal to the separation layer, wherein the sample is separated while rotating. The separation device according to any one of claims 23 to 43. 45. The separation apparatus according to claim 23, wherein the separation layer is a layer having a fragile structure. 46. The separation device according to claim 45, wherein the layer having the fragile structure is a porous layer. 47. The separation device according to claim 45, wherein the layer having the fragile structure is a microbubble layer. 48. A separation device for separating a sample, comprising: a holding portion for holding the sample; a shaft member connected to the holding portion; and a shaft movable in a direction substantially perpendicular to a surface of the sample. A guide mechanism for supporting the member, and an ejection unit for ejecting a fluid toward the sample held by the holding unit, thereby separating the sample at the separation layer. A high-pressure gas is injected to the shaft member, and the shaft member is supported by the pressure of the gas. 49. The separation device according to claim 48, wherein the guide mechanism has an air guide for supporting the shaft member. 50. The apparatus according to claim 50, further comprising a cover member for preventing the fluid ejected from said ejecting portion from adhering to all or a predetermined portion of said shaft member and said guide mechanism. 50. The separation device according to claim 48 or 49. 51. The cover member according to claim 50, wherein the cover member includes a seal member having a structure that does not generate substantial friction when the holding portion and a mechanism connected to the holding portion move. Separation device. 52. The separation device according to claim 51, wherein the seal member includes a labyrinth seal. 53. The separation device according to claim 51, wherein the seal member includes a bellows. 54. A separation device for separating a sample, comprising: a holding portion for holding a sample; a shaft member connected to the holding portion; and a shaft member movable in a direction substantially perpendicular to a sample surface. A jet mechanism for jetting a fluid toward the sample held by the holding unit, thereby separating the sample at the separation layer, and a fluid jetted from the jet unit A cover member for preventing the shaft member and the guide mechanism from adhering to all or a predetermined portion of the guide member, wherein the cover member moves when the holding portion and the member connected to the holding portion move. A separation device comprising a seal member having a structure that does not substantially cause friction. 55. The separation device according to claim 54, wherein the seal member includes a labyrinth seal. 56. The separation device according to claim 54, wherein the seal member includes a bellows. 57. A separation method for separating a sample having a separation layer therein, wherein the holding unit presses and holds the sample, and ejects a fluid toward the sample held by the holding unit. A separation step of separating the sample by the separation layer, and a changing step of changing a force with which the holding unit presses the sample according to the progress of the separation step. Method. 58. The separation method according to claim 57, wherein, in the changing step, a force of the holding unit pressing the sample is increased as the separation of the sample progresses. 59. In the changing step, in the first stage of separation, the force by which the holding unit presses the sample is relatively reduced. In the second stage of separation, the force by which the holding unit presses the sample is reduced. 58. The method according to claim 57, wherein the separation is made relatively large. 60. The separation method according to claim 57, wherein in the changing step, a force of pressing the sample by the holding unit is increased before reaching a final stage of separation. 61. The separation method according to claim 57, wherein the separation layer is a layer having a fragile structure. 62. The separation method according to claim 61, wherein the layer having the fragile structure is a porous layer. 63. The separation method according to claim 61, wherein the layer having a fragile structure is a microbubble layer. 64. A separation method for separating a sample having a separation layer therein, comprising: a step of holding the sample by a holding unit; and ejecting a fluid toward the sample held by the holding unit. A separation step of separating the sample with the separation layer, and a control step of controlling the retreat of the holding unit due to the separated portion of the sample being warped by the pressure of the fluid in accordance with the retreat amount. A separation method, comprising: 65. The separation method according to claim 64, wherein, in the control step, a force with which the holding unit presses the sample increases in accordance with an increase in a retreat amount of the holding unit. 66. In the control step, in the first stage of separation, the force by which the holding unit presses the sample is relatively reduced, and in the second stage of separation, the force by which the holding unit presses the sample is reduced. 65. The method of claim 64, wherein the separation is relatively large. 67. The separation method according to claim 64, wherein in the control step, before reaching the final stage of the separation, the force by which the holding unit presses the sample is increased. 68. The separation method according to claim 64, wherein in the control step, when the retreat amount of the holding unit reaches a predetermined distance, further retreat of the holding unit is limited. 69. The separation method according to claim 64, wherein the separation layer is a layer having a fragile structure. 70. The separation method according to claim 69, wherein the layer having a fragile structure is a porous layer. 71. The separation method according to claim 69, wherein the layer having a fragile structure is a microbubble layer. 72. A method for manufacturing a substrate, comprising: a step of bonding a first substrate having a layer having a fragile structure therein to a second substrate to form a bonded substrate; Claim 19 and Claims 23 to 44
A separation step of separating the bonded substrate at the fragile layer by the separation device according to any one of claims 48 to 56; and a fragile layer remaining on the second substrate after the separation step. And a removing step of removing a critical layer. 73. A method for manufacturing a substrate, comprising: a step of bonding a first substrate having a layer having a fragile structure therein to a second substrate to form a bonded substrate; Claim 60 and Claims 64 to 6
8. A separation step of separating the bonded substrate at the fragile layer by the separation method according to any one of 8 above, and a removing step of removing the fragile layer remaining on the second substrate after the separation step A method for manufacturing a substrate, comprising: