GB2296132A - Cooling electrical apparatus - Google Patents

Cooling electrical apparatus Download PDF

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Publication number
GB2296132A
GB2296132A GB9424987A GB9424987A GB2296132A GB 2296132 A GB2296132 A GB 2296132A GB 9424987 A GB9424987 A GB 9424987A GB 9424987 A GB9424987 A GB 9424987A GB 2296132 A GB2296132 A GB 2296132A
Authority
GB
United Kingdom
Prior art keywords
duct
passageway
cooling system
cooling
air
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB9424987A
Other versions
GB2296132B (en
GB9424987D0 (en
Inventor
William Morris Graham
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BAE Systems Defence Systems Ltd
Original Assignee
Siemens Plessey Electronic Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Plessey Electronic Systems Ltd filed Critical Siemens Plessey Electronic Systems Ltd
Priority to GB9424987A priority Critical patent/GB2296132B/en
Publication of GB9424987D0 publication Critical patent/GB9424987D0/en
Publication of GB2296132A publication Critical patent/GB2296132A/en
Application granted granted Critical
Publication of GB2296132B publication Critical patent/GB2296132B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136Forced ventilation, e.g. by fans
    • H05K7/20154Heat dissipaters coupled to components

Abstract

A cooling system for electrical apparatus 4 has a cooling fan 1 which causes air to pass over the apparatus from an air inlet port to an air outlet port 8 through a duct or passageway 3 whose effective volume reduces from the inlet port to the outlet port. <IMAGE>

Description

IMPROVEMENTS IN OR RELATING TO COOLING SYSTEMS This invention relates to cooling systems and more especially although not exclusively it relates to cooling systems for electronic or electrical apparatus.
In operation, electronic apparatus generates heat and for some applications it is necessary to provide a cooling system which serves to prevent the temperature to which electronic components which form a part of the apparatus are subjected, rising above a predetermined upper limit. The cooling of electronic apparatus, which comprises closely packed devices, can be a particular problem especially when high power dissipation is involved. In known systems temperature is sometimes effectively controlled by providing, in operative association with electronic devices which dissipate heat, cooling fins over which cool air is blown by means of a cooling fan.
One of the problems however with known cooling systems is that the air used for cooling purposes becomes progressively heated as it passes over electronic apparatus to be cooled from an inlet port to an outlet port, whereby the cooling effect, which is thereby provided, is progressively reduced between the ports.
Thus in a rack of electronic apparatus for example, those parts of the apparatus which are positioned near a cooling air inlet may be suitably cooled, whereas those parts of the apparatus positioned near a cooling air outlet may not be cooled sufficiently because the air which passes over them has in effect been preheated by the apparatus near the inlet port over which it has previously passed.
It is an object of the present invention to provide a cooling system in which the foregoing problem is at least to some extent overcome.
According to the present invention a cooling system for apparatus comprises a cooling fan which is arranged to cause air to pass over the apparatus from an air inlet port to an air outlet port through a duct or passageway within which the apparatus is positioned, the duct or passageway being formed so that its effective volume reduces from the inlet port to the outlet port.
By arranging that the volume reduces between the inlet and outlet ports, it follows that the air flow velocity therebetween will increase correspondingly as the volume decreases whereby the cooling effect throughout the length of the duct or passageway can be arranged, at least to some extent, to be linearised.
Although the apparatus may take any form the invention is eminently suitable for cooling electronic apparatus comprising electronic devices which dissipate significant power.
Such devices are commonly mounted on printed circuit boards in racks and therefore lend themselves to cooling by means of air which is constrained to move through a duct or passageway in which the racks are positioned.
The devices may form a part of an active array antenna for a radar system.
In order to provide a progressive volume reduction it may be arranged that a wall or walls of the duct or passageway taper from an air input port end to an air output port end thereof.
One embodiment of the invention will now be described by way of example only with reference to the accompanying drawing in which: Figure 1 is a somewhat schematic sectional side view of an arrangement of electronic devices mounted in a cooling duct and wherein; Figure 2 is an end view of the arrangement shown in Figure 1 on the broken line xy.
Referring now to Figure 1 the arrangement comprises a fan 1 which is used to blow cooling air in the direction indicated by an arrow 2 through a duct or passageway 3 in which devices 4 to be cooled are mounted on a printed circuit board 5. As shown more dearly in Figure 2 the devices 4 are provided with a heat sink which embodies cooling fins 6. In operation cooling air is driven by the fan in the direction of the arrow 2 so as to be forced through the duct or passageway 3 from an input port 7 to an output port 8.
It will be apparent that in this example the volume of the duct or passageway 3 reduces progressively from the inlet port 7 to the outlet port 8. It will therefore be appreciated that the air velocity will increase progressively along the duct or passageway 3 from the inlet port 7 to the outlet port 8 as the volume decreases, thus enhancing the cooling effect whereby it can be arranged that the cooling effect is approximately linearised throughout the length of the duct or passageway.
By using a tapered duct, temperature differentials vary along the duct allowing a smaller quantity of air to be used. This will reduce pressure losses, the size and power of fan required, and the duct sizes between the fan and equipment to be cooled.
By applying the invention to radar active array antennas more elements may be used and performance improved.
The foregoing embodiment is intended to serve as an example only and various modifications may be made without departing from the scope of the invention. For example, although as shown is Figure 1 the volume tends to decrease linearly, other configurations are envisaged in accordance with the particular application in view. Thus for example constrictions in the duct may be formed where hot spots are to be found so that in these regions higher air velocity obtains whereby improved cooling is afforded.

Claims (8)

1. A cooling system for apparatus comprising a cooling fan which is arranged to cause air to pass over the apparatus from an air inlet port to an air outlet port through a duct or passageway within which the apparatus is positioned, the duct or passageway being formed so that its effective volume reduces from the inlet port to the outlet port.
2. A cooling system as claimed in Claim 1 wherein the apparatus is electronic apparatus comprising electronic devices which dissipate significant power.
3. A cooling system as claimed in Claim 2 wherein the devices are mounted on a printed circuit board or boards in racks, which racks are mounted in the said duct or passageway.
4. A cooling system as claimed in any preceding Claim wherein a wall or walls of the duct or passageway are arranged to taper from the said input port to the said output port.
5. A cooling system as claimed in Claim 3 or Claim 4 wherein the printed circuit board or boards define at least a part of one wall of the said duct or passageway.
6. A cooling system as claimed in any of Claims 2 to 5 wherein the said devices are provided with heat sinks which include cooling fins, which fins are arranged to project into the said duct or passageway.
7. A cooling system as claimed in Claim 1 and substantially as hereinbefore described with reference to the accompanying drawings.
8. An active array antenna for a radar system including a cooling system as claimed in any preceding claim which is used to cool active elements of the array.
GB9424987A 1994-12-12 1994-12-12 Improvements in or relating to cooling systems Expired - Fee Related GB2296132B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB9424987A GB2296132B (en) 1994-12-12 1994-12-12 Improvements in or relating to cooling systems

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9424987A GB2296132B (en) 1994-12-12 1994-12-12 Improvements in or relating to cooling systems

Publications (3)

Publication Number Publication Date
GB9424987D0 GB9424987D0 (en) 1995-02-15
GB2296132A true GB2296132A (en) 1996-06-19
GB2296132B GB2296132B (en) 1999-02-24

Family

ID=10765759

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9424987A Expired - Fee Related GB2296132B (en) 1994-12-12 1994-12-12 Improvements in or relating to cooling systems

Country Status (1)

Country Link
GB (1) GB2296132B (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2347020A (en) * 1999-02-02 2000-08-23 3Com Technologies Ltd Cooling equipment
US6364009B1 (en) 1999-11-24 2002-04-02 3Com Corporation Cooling devices
US6515859B2 (en) * 2000-07-11 2003-02-04 Peavey Electronics Corporation Heat sink alignment
US7040384B2 (en) * 2004-01-27 2006-05-09 Molex Incorporated Heat dissipation device
EP2348801A3 (en) * 2010-01-07 2011-10-12 Samsung Electronics Co., Ltd. Display device
WO2013085618A1 (en) * 2011-12-08 2013-06-13 Oracle International Corporation Design of a heat dissipation structure for an integrated circuit (ic) chip
WO2013167203A1 (en) * 2012-05-11 2013-11-14 Huawei Technologies Co., Ltd. Cooling system and method for cooling radio unit
EP2717311A3 (en) * 2012-10-08 2017-09-13 Hamilton Sundstrand Corporation Efficient cooling duct

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018032493A1 (en) * 2016-08-19 2018-02-22 深圳市赛亿科技开发有限公司 Chip heat dissipation apparatus and electronic device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1018623A (en) * 1962-02-16 1966-01-26 Gen Electric Co Ltd Improvements in or relating to electronic assemblies
US4103737A (en) * 1976-12-16 1978-08-01 Marantz Company, Inc. Heat exchanger structure for electronic apparatus
WO1993006340A1 (en) * 1991-09-23 1993-04-01 Benton Christopher E Method and apparatus for cooling an object
GB2280989A (en) * 1993-07-30 1995-02-15 Fujitsu Ltd Semiconductor element cooling apparatus

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2934493B2 (en) * 1990-10-24 1999-08-16 株式会社日立製作所 Electronic equipment cooling device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1018623A (en) * 1962-02-16 1966-01-26 Gen Electric Co Ltd Improvements in or relating to electronic assemblies
US4103737A (en) * 1976-12-16 1978-08-01 Marantz Company, Inc. Heat exchanger structure for electronic apparatus
WO1993006340A1 (en) * 1991-09-23 1993-04-01 Benton Christopher E Method and apparatus for cooling an object
GB2280989A (en) * 1993-07-30 1995-02-15 Fujitsu Ltd Semiconductor element cooling apparatus

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2347020A (en) * 1999-02-02 2000-08-23 3Com Technologies Ltd Cooling equipment
US6330154B1 (en) 1999-02-02 2001-12-11 3Com Corporation Cooling equipment
GB2347020B (en) * 1999-02-02 2003-05-14 3Com Technologies Ltd Cooling equipment
US6364009B1 (en) 1999-11-24 2002-04-02 3Com Corporation Cooling devices
US6515859B2 (en) * 2000-07-11 2003-02-04 Peavey Electronics Corporation Heat sink alignment
US7040384B2 (en) * 2004-01-27 2006-05-09 Molex Incorporated Heat dissipation device
EP2348801A3 (en) * 2010-01-07 2011-10-12 Samsung Electronics Co., Ltd. Display device
US8894477B2 (en) 2010-01-07 2014-11-25 Samsung Electronics Co., Ltd. Display device
WO2013085618A1 (en) * 2011-12-08 2013-06-13 Oracle International Corporation Design of a heat dissipation structure for an integrated circuit (ic) chip
US9184108B2 (en) 2011-12-08 2015-11-10 Oracle International Corporation Heat dissipation structure for an integrated circuit (IC) chip
WO2013167203A1 (en) * 2012-05-11 2013-11-14 Huawei Technologies Co., Ltd. Cooling system and method for cooling radio unit
EP2717311A3 (en) * 2012-10-08 2017-09-13 Hamilton Sundstrand Corporation Efficient cooling duct

Also Published As

Publication number Publication date
GB2296132B (en) 1999-02-24
GB9424987D0 (en) 1995-02-15

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Legal Events

Date Code Title Description
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)

Free format text: REGISTERED BETWEEN 20090827 AND 20090902

PCNP Patent ceased through non-payment of renewal fee

Effective date: 20111212