US5304248A
(en)
*
|
1990-12-05 |
1994-04-19 |
Applied Materials, Inc. |
Passive shield for CVD wafer processing which provides frontside edge exclusion and prevents backside depositions
|
JP3566740B2
(ja)
*
|
1992-09-30 |
2004-09-15 |
アプライド マテリアルズ インコーポレイテッド |
全ウエハデポジション用装置
|
JP3250628B2
(ja)
*
|
1992-12-17 |
2002-01-28 |
東芝セラミックス株式会社 |
縦型半導体熱処理用治具
|
US5444217A
(en)
|
1993-01-21 |
1995-08-22 |
Moore Epitaxial Inc. |
Rapid thermal processing apparatus for processing semiconductor wafers
|
US5580388A
(en)
*
|
1993-01-21 |
1996-12-03 |
Moore Epitaxial, Inc. |
Multi-layer susceptor for rapid thermal process reactors
|
US5565382A
(en)
*
|
1993-10-12 |
1996-10-15 |
Applied Materials, Inc. |
Process for forming tungsten silicide on semiconductor wafer using dichlorosilane gas
|
US5888304A
(en)
*
|
1996-04-02 |
1999-03-30 |
Applied Materials, Inc. |
Heater with shadow ring and purge above wafer surface
|
US6279506B1
(en)
|
1995-06-26 |
2001-08-28 |
Aixtron Ag |
Reactor for coating plane substrates and method for producing said substrates
|
WO1996000314A2
(de)
*
|
1994-06-24 |
1996-01-04 |
Aixtron Gmbh |
Reaktor und verfahren zum beschichten von flächigen substraten
|
IT1271233B
(it)
*
|
1994-09-30 |
1997-05-27 |
Lpe |
Reattore epitassiale munito di suscettore discoidale piano ed avente flusso di gas parallelo ai substrati
|
JP2701767B2
(ja)
*
|
1995-01-27 |
1998-01-21 |
日本電気株式会社 |
気相成長装置
|
JP3430277B2
(ja)
*
|
1995-08-04 |
2003-07-28 |
東京エレクトロン株式会社 |
枚葉式の熱処理装置
|
US6086680A
(en)
*
|
1995-08-22 |
2000-07-11 |
Asm America, Inc. |
Low-mass susceptor
|
AU6962196A
(en)
*
|
1995-09-01 |
1997-03-27 |
Advanced Semiconductor Materials America, Inc. |
Wafer support system
|
US6113702A
(en)
|
1995-09-01 |
2000-09-05 |
Asm America, Inc. |
Wafer support system
|
US5881208A
(en)
*
|
1995-12-20 |
1999-03-09 |
Sematech, Inc. |
Heater and temperature sensor array for rapid thermal processing thermal core
|
US6001183A
(en)
*
|
1996-06-10 |
1999-12-14 |
Emcore Corporation |
Wafer carriers for epitaxial growth processes
|
US6217663B1
(en)
|
1996-06-21 |
2001-04-17 |
Kokusai Electric Co., Ltd. |
Substrate processing apparatus and substrate processing method
|
US5846332A
(en)
*
|
1996-07-12 |
1998-12-08 |
Applied Materials, Inc. |
Thermally floating pedestal collar in a chemical vapor deposition chamber
|
US5993916A
(en)
*
|
1996-07-12 |
1999-11-30 |
Applied Materials, Inc. |
Method for substrate processing with improved throughput and yield
|
US5756157A
(en)
*
|
1996-10-02 |
1998-05-26 |
Silicon Valley Group |
Method for processing flat panel displays and large wafers
|
US6395363B1
(en)
|
1996-11-05 |
2002-05-28 |
Applied Materials, Inc. |
Sloped substrate support
|
US6157106A
(en)
*
|
1997-05-16 |
2000-12-05 |
Applied Materials, Inc. |
Magnetically-levitated rotor system for an RTP chamber
|
EP1308989A3
(de)
*
|
1997-11-03 |
2007-12-26 |
ASM America, Inc. |
Verbesserte kleinmassige Waferhaleeinrichtung
|
WO1999023691A2
(en)
|
1997-11-03 |
1999-05-14 |
Asm America, Inc. |
Improved low mass wafer support system
|
JPH11176822A
(ja)
|
1997-12-05 |
1999-07-02 |
Hitachi Ltd |
半導体処理装置
|
US6048403A
(en)
*
|
1998-04-01 |
2000-04-11 |
Applied Materials, Inc. |
Multi-ledge substrate support for a thermal processing chamber
|
US6188044B1
(en)
|
1998-04-27 |
2001-02-13 |
Cvc Products, Inc. |
High-performance energy transfer system and method for thermal processing applications
|
US6129048A
(en)
*
|
1998-06-30 |
2000-10-10 |
Memc Electronic Materials, Inc. |
Susceptor for barrel reactor
|
US6170433B1
(en)
*
|
1998-07-23 |
2001-01-09 |
Applied Materials, Inc. |
Method and apparatus for processing a wafer
|
JP2000058470A
(ja)
*
|
1998-08-07 |
2000-02-25 |
Ushio Inc |
光照射式加熱装置のガードリング
|
JP3296300B2
(ja)
*
|
1998-08-07 |
2002-06-24 |
ウシオ電機株式会社 |
光照射式加熱装置
|
US6449428B2
(en)
|
1998-12-11 |
2002-09-10 |
Mattson Technology Corp. |
Gas driven rotating susceptor for rapid thermal processing (RTP) system
|
US6368404B1
(en)
|
1999-04-23 |
2002-04-09 |
Emcore Corporation |
Induction heated chemical vapor deposition reactor
|
US6464795B1
(en)
|
1999-05-21 |
2002-10-15 |
Applied Materials, Inc. |
Substrate support member for a processing chamber
|
US6100505A
(en)
*
|
1999-05-27 |
2000-08-08 |
Advanced Micro Devices, Inc. |
Hotplate offset ring
|
US6214121B1
(en)
|
1999-07-07 |
2001-04-10 |
Applied Materials, Inc. |
Pedestal with a thermally controlled platen
|
US20020062792A1
(en)
*
|
1999-07-14 |
2002-05-30 |
Seh America, Inc. |
Wafer support device and reactor system for epitaxial layer growth
|
US6280646B1
(en)
*
|
1999-07-16 |
2001-08-28 |
Micron Technology, Inc. |
Use of a chemically active reticle carrier for photomask etching
|
JP4592849B2
(ja)
|
1999-10-29 |
2010-12-08 |
アプライド マテリアルズ インコーポレイテッド |
半導体製造装置
|
DE10100328A1
(de)
|
2001-01-05 |
2002-07-11 |
Zeiss Carl |
Vorrichtung zur Aufnahme eines optischen Elements aus einem kristallinen Material
|
US6506252B2
(en)
|
2001-02-07 |
2003-01-14 |
Emcore Corporation |
Susceptorless reactor for growing epitaxial layers on wafers by chemical vapor deposition
|
US6709721B2
(en)
|
2001-03-28 |
2004-03-23 |
Applied Materials Inc. |
Purge heater design and process development for the improvement of low k film properties
|
DE50212020D1
(de)
*
|
2001-05-29 |
2008-05-15 |
Aixtron Ag |
Aus einem tragkörper und darauf gasgelagerten und drehangetriebenen substrathalter bestehende anordnung
|
US20030168174A1
(en)
|
2002-03-08 |
2003-09-11 |
Foree Michael Todd |
Gas cushion susceptor system
|
US6776849B2
(en)
*
|
2002-03-15 |
2004-08-17 |
Asm America, Inc. |
Wafer holder with peripheral lift ring
|
US6838114B2
(en)
|
2002-05-24 |
2005-01-04 |
Micron Technology, Inc. |
Methods for controlling gas pulsing in processes for depositing materials onto micro-device workpieces
|
US6955725B2
(en)
|
2002-08-15 |
2005-10-18 |
Micron Technology, Inc. |
Reactors with isolated gas connectors and methods for depositing materials onto micro-device workpieces
|
US7704327B2
(en)
*
|
2002-09-30 |
2010-04-27 |
Applied Materials, Inc. |
High temperature anneal with improved substrate support
|
US7166168B1
(en)
*
|
2002-10-18 |
2007-01-23 |
Carl Zeiss Smt Ag |
Substrate-coating system and an associated substrate-heating method
|
US20050170314A1
(en)
*
|
2002-11-27 |
2005-08-04 |
Richard Golden |
Dental pliers design with offsetting jaw and pad elements for assisting in removing upper and lower teeth and method for removing teeth utilizing the dental plier design
|
US6926775B2
(en)
|
2003-02-11 |
2005-08-09 |
Micron Technology, Inc. |
Reactors with isolated gas connectors and methods for depositing materials onto micro-device workpieces
|
WO2004075233A1
(ja)
*
|
2003-02-18 |
2004-09-02 |
Matsushita Electric Industrial Co., Ltd. |
プラズマディスプレイパネルの製造方法および基板保持具
|
EP1715640A3
(de)
*
|
2003-02-20 |
2006-11-29 |
Strongmail Systems, Inc. |
Begläubigung eines Email-Softwares
|
KR100527672B1
(ko)
*
|
2003-07-25 |
2005-11-28 |
삼성전자주식회사 |
서셉터 및 이를 포함하는 증착 장치
|
US7581511B2
(en)
|
2003-10-10 |
2009-09-01 |
Micron Technology, Inc. |
Apparatus and methods for manufacturing microfeatures on workpieces using plasma vapor processes
|
US7169234B2
(en)
*
|
2004-01-30 |
2007-01-30 |
Asm America, Inc. |
Apparatus and methods for preventing rotational slippage between a vertical shaft and a support structure for a semiconductor wafer holder
|
US7019268B2
(en)
*
|
2004-02-23 |
2006-03-28 |
Asml Netherlands B.V. |
Wafer processing apparatus and method of use
|
JP4435610B2
(ja)
*
|
2004-03-23 |
2010-03-24 |
パナソニック株式会社 |
ダミー基板
|
US7584942B2
(en)
|
2004-03-31 |
2009-09-08 |
Micron Technology, Inc. |
Ampoules for producing a reaction gas and systems for depositing materials onto microfeature workpieces in reaction chambers
|
US8133554B2
(en)
|
2004-05-06 |
2012-03-13 |
Micron Technology, Inc. |
Methods for depositing material onto microfeature workpieces in reaction chambers and systems for depositing materials onto microfeature workpieces
|
US7699932B2
(en)
|
2004-06-02 |
2010-04-20 |
Micron Technology, Inc. |
Reactors, systems and methods for depositing thin films onto microfeature workpieces
|
US8211230B2
(en)
*
|
2005-01-18 |
2012-07-03 |
Asm America, Inc. |
Reaction system for growing a thin film
|
US20060194059A1
(en)
*
|
2005-02-25 |
2006-08-31 |
Honeywell International Inc. |
Annular furnace spacers and method of using same
|
TWI297908B
(en)
*
|
2005-03-16 |
2008-06-11 |
Ngk Insulators Ltd |
Processing device
|
US7662437B2
(en)
*
|
2005-03-24 |
2010-02-16 |
Honeywell International Inc. |
Template for arranging spacers on a preform and method of densifying a preform including the use of spacers positioned by a template
|
JP4849829B2
(ja)
*
|
2005-05-15 |
2012-01-11 |
株式会社ソニー・コンピュータエンタテインメント |
センタ装置
|
TWI354320B
(en)
|
2006-02-21 |
2011-12-11 |
Nuflare Technology Inc |
Vopor phase deposition apparatus and support table
|
US8951351B2
(en)
*
|
2006-09-15 |
2015-02-10 |
Applied Materials, Inc. |
Wafer processing hardware for epitaxial deposition with reduced backside deposition and defects
|
US8852349B2
(en)
*
|
2006-09-15 |
2014-10-07 |
Applied Materials, Inc. |
Wafer processing hardware for epitaxial deposition with reduced auto-doping and backside defects
|
DE102006055038B4
(de)
*
|
2006-11-22 |
2012-12-27 |
Siltronic Ag |
Epitaxierte Halbleiterscheibe sowie Vorrichtung und Verfahren zur Herstellung einer epitaxierten Halbleiterscheibe
|
US20080314319A1
(en)
*
|
2007-06-19 |
2008-12-25 |
Memc Electronic Materials, Inc. |
Susceptor for improving throughput and reducing wafer damage
|
US8092606B2
(en)
|
2007-12-18 |
2012-01-10 |
Asm Genitech Korea Ltd. |
Deposition apparatus
|
US8404049B2
(en)
*
|
2007-12-27 |
2013-03-26 |
Memc Electronic Materials, Inc. |
Epitaxial barrel susceptor having improved thickness uniformity
|
US20090194026A1
(en)
*
|
2008-01-31 |
2009-08-06 |
Burrows Brian H |
Processing system for fabricating compound nitride semiconductor devices
|
US20100098519A1
(en)
*
|
2008-10-17 |
2010-04-22 |
Memc Electronic Materials, Inc. |
Support for a semiconductor wafer in a high temperature environment
|
US8801857B2
(en)
|
2008-10-31 |
2014-08-12 |
Asm America, Inc. |
Self-centering susceptor ring assembly
|
US9394608B2
(en)
|
2009-04-06 |
2016-07-19 |
Asm America, Inc. |
Semiconductor processing reactor and components thereof
|
JP5038365B2
(ja)
*
|
2009-07-01 |
2012-10-03 |
株式会社東芝 |
サセプタおよび成膜装置
|
JP5359698B2
(ja)
*
|
2009-08-31 |
2013-12-04 |
豊田合成株式会社 |
化合物半導体の製造装置、化合物半導体の製造方法及び化合物半導体
|
JP5038381B2
(ja)
*
|
2009-11-20 |
2012-10-03 |
株式会社東芝 |
サセプタおよび成膜装置
|
JP5435039B2
(ja)
|
2009-12-11 |
2014-03-05 |
株式会社Sumco |
Cvd用トレーおよびそれを用いた成膜方法
|
JP2011171450A
(ja)
*
|
2010-02-17 |
2011-09-01 |
Nuflare Technology Inc |
成膜装置および成膜方法
|
US9324590B2
(en)
*
|
2010-02-24 |
2016-04-26 |
Veeco Instruments Inc. |
Processing methods and apparatus with temperature distribution control
|
KR101808054B1
(ko)
*
|
2010-11-15 |
2017-12-12 |
신에쯔 한도타이 가부시키가이샤 |
서셉터 및 에피택셜 웨이퍼의 제조 방법
|
US8728831B2
(en)
*
|
2010-12-30 |
2014-05-20 |
Stmicroelectronics Pte. Ltd. |
Reconstituted wafer warpage adjustment
|
US20130023129A1
(en)
|
2011-07-20 |
2013-01-24 |
Asm America, Inc. |
Pressure transmitter for a semiconductor processing environment
|
US20130025538A1
(en)
*
|
2011-07-27 |
2013-01-31 |
Applied Materials, Inc. |
Methods and apparatus for deposition processes
|
TWI541928B
(zh)
*
|
2011-10-14 |
2016-07-11 |
晶元光電股份有限公司 |
晶圓載具
|
US9196471B1
(en)
|
2012-06-01 |
2015-11-24 |
Yen Fui Choo |
Scanner for wafers, method for using the scanner, and components of the scanner
|
US8865602B2
(en)
*
|
2012-09-28 |
2014-10-21 |
Applied Materials, Inc. |
Edge ring lip
|
US10714315B2
(en)
|
2012-10-12 |
2020-07-14 |
Asm Ip Holdings B.V. |
Semiconductor reaction chamber showerhead
|
US9403251B2
(en)
*
|
2012-10-17 |
2016-08-02 |
Applied Materials, Inc. |
Minimal contact edge ring for rapid thermal processing
|
CN103805967B
(zh)
*
|
2012-11-14 |
2016-05-25 |
理想能源设备(上海)有限公司 |
金属有机化学气相沉积装置
|
US20160376700A1
(en)
|
2013-02-01 |
2016-12-29 |
Asm Ip Holding B.V. |
System for treatment of deposition reactor
|
US9543186B2
(en)
*
|
2013-02-01 |
2017-01-10 |
Applied Materials, Inc. |
Substrate support with controlled sealing gap
|
US9273413B2
(en)
|
2013-03-14 |
2016-03-01 |
Veeco Instruments Inc. |
Wafer carrier with temperature distribution control
|
TWI648427B
(zh)
*
|
2013-07-17 |
2019-01-21 |
應用材料股份有限公司 |
用於交叉流動類型的熱cvd腔室之改良的氣體活化的結構
|
ITCO20130041A1
(it)
*
|
2013-09-27 |
2015-03-28 |
Lpe Spa |
Suscettore con elemento di supporto
|
JP2015119005A
(ja)
*
|
2013-12-17 |
2015-06-25 |
三菱電機株式会社 |
成膜装置
|
JP6559706B2
(ja)
|
2014-01-27 |
2019-08-14 |
ビーコ インストルメンツ インコーポレイテッド |
化学蒸着システム用の複合半径を有する保持ポケットを有するウェハキャリア
|
CN104851832B
(zh)
*
|
2014-02-18 |
2018-01-19 |
北京北方华创微电子装备有限公司 |
一种固定装置、反应腔室及等离子体加工设备
|
US11015245B2
(en)
|
2014-03-19 |
2021-05-25 |
Asm Ip Holding B.V. |
Gas-phase reactor and system having exhaust plenum and components thereof
|
US10858737B2
(en)
|
2014-07-28 |
2020-12-08 |
Asm Ip Holding B.V. |
Showerhead assembly and components thereof
|
EP2993699B1
(de)
*
|
2014-09-04 |
2018-03-21 |
IMEC vzw |
Verfahren zur Herstellung kristalliner photovoltaischer Zellen
|
US10941490B2
(en)
|
2014-10-07 |
2021-03-09 |
Asm Ip Holding B.V. |
Multiple temperature range susceptor, assembly, reactor and system including the susceptor, and methods of using the same
|
DE102014223301B8
(de)
|
2014-11-14 |
2016-06-09 |
Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. |
Substrathalter, Plasmareaktor und Verfahren zur Abscheidung von Diamant
|
CN105762095B
(zh)
*
|
2014-12-18 |
2018-08-24 |
北京北方华创微电子装备有限公司 |
反应腔室及半导体加工设备
|
US10276355B2
(en)
|
2015-03-12 |
2019-04-30 |
Asm Ip Holding B.V. |
Multi-zone reactor, system including the reactor, and method of using the same
|
US10458018B2
(en)
|
2015-06-26 |
2019-10-29 |
Asm Ip Holding B.V. |
Structures including metal carbide material, devices including the structures, and methods of forming same
|
DE102015113962A1
(de)
*
|
2015-08-24 |
2017-03-02 |
Meyer Burger (Germany) Ag |
Substratbehandlungsvorrichtung
|
US10211308B2
(en)
|
2015-10-21 |
2019-02-19 |
Asm Ip Holding B.V. |
NbMC layers
|
US11139308B2
(en)
|
2015-12-29 |
2021-10-05 |
Asm Ip Holding B.V. |
Atomic layer deposition of III-V compounds to form V-NAND devices
|
US10428425B2
(en)
*
|
2016-01-26 |
2019-10-01 |
Tokyo Electron Limited |
Film deposition apparatus, method of depositing film, and non-transitory computer-readable recording medium
|
US10529554B2
(en)
|
2016-02-19 |
2020-01-07 |
Asm Ip Holding B.V. |
Method for forming silicon nitride film selectively on sidewalls or flat surfaces of trenches
|
US10190213B2
(en)
|
2016-04-21 |
2019-01-29 |
Asm Ip Holding B.V. |
Deposition of metal borides
|
US10367080B2
(en)
|
2016-05-02 |
2019-07-30 |
Asm Ip Holding B.V. |
Method of forming a germanium oxynitride film
|
US11453943B2
(en)
|
2016-05-25 |
2022-09-27 |
Asm Ip Holding B.V. |
Method for forming carbon-containing silicon/metal oxide or nitride film by ALD using silicon precursor and hydrocarbon precursor
|
US9859151B1
(en)
|
2016-07-08 |
2018-01-02 |
Asm Ip Holding B.V. |
Selective film deposition method to form air gaps
|
US10612137B2
(en)
|
2016-07-08 |
2020-04-07 |
Asm Ip Holdings B.V. |
Organic reactants for atomic layer deposition
|
KR102528559B1
(ko)
|
2016-07-26 |
2023-05-04 |
삼성전자주식회사 |
대면적 기판 제조 장치
|
US9887082B1
(en)
|
2016-07-28 |
2018-02-06 |
Asm Ip Holding B.V. |
Method and apparatus for filling a gap
|
US9812320B1
(en)
|
2016-07-28 |
2017-11-07 |
Asm Ip Holding B.V. |
Method and apparatus for filling a gap
|
KR102532607B1
(ko)
|
2016-07-28 |
2023-05-15 |
에이에스엠 아이피 홀딩 비.브이. |
기판 가공 장치 및 그 동작 방법
|
DE102016115614A1
(de)
*
|
2016-08-23 |
2018-03-01 |
Aixtron Se |
Suszeptor für einen CVD-Reaktor
|
US10643826B2
(en)
|
2016-10-26 |
2020-05-05 |
Asm Ip Holdings B.V. |
Methods for thermally calibrating reaction chambers
|
US11532757B2
(en)
|
2016-10-27 |
2022-12-20 |
Asm Ip Holding B.V. |
Deposition of charge trapping layers
|
US10714350B2
(en)
|
2016-11-01 |
2020-07-14 |
ASM IP Holdings, B.V. |
Methods for forming a transition metal niobium nitride film on a substrate by atomic layer deposition and related semiconductor device structures
|
KR102546317B1
(ko)
|
2016-11-15 |
2023-06-21 |
에이에스엠 아이피 홀딩 비.브이. |
기체 공급 유닛 및 이를 포함하는 기판 처리 장치
|
KR20180068582A
(ko)
|
2016-12-14 |
2018-06-22 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치
|
US11447861B2
(en)
|
2016-12-15 |
2022-09-20 |
Asm Ip Holding B.V. |
Sequential infiltration synthesis apparatus and a method of forming a patterned structure
|
US11581186B2
(en)
|
2016-12-15 |
2023-02-14 |
Asm Ip Holding B.V. |
Sequential infiltration synthesis apparatus
|
KR20180070971A
(ko)
|
2016-12-19 |
2018-06-27 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치
|
US10269558B2
(en)
|
2016-12-22 |
2019-04-23 |
Asm Ip Holding B.V. |
Method of forming a structure on a substrate
|
US10867788B2
(en)
|
2016-12-28 |
2020-12-15 |
Asm Ip Holding B.V. |
Method of forming a structure on a substrate
|
US11390950B2
(en)
|
2017-01-10 |
2022-07-19 |
Asm Ip Holding B.V. |
Reactor system and method to reduce residue buildup during a film deposition process
|
US10468261B2
(en)
|
2017-02-15 |
2019-11-05 |
Asm Ip Holding B.V. |
Methods for forming a metallic film on a substrate by cyclical deposition and related semiconductor device structures
|
US10529563B2
(en)
|
2017-03-29 |
2020-01-07 |
Asm Ip Holdings B.V. |
Method for forming doped metal oxide films on a substrate by cyclical deposition and related semiconductor device structures
|
KR102457289B1
(ko)
|
2017-04-25 |
2022-10-21 |
에이에스엠 아이피 홀딩 비.브이. |
박막 증착 방법 및 반도체 장치의 제조 방법
|
US10770286B2
(en)
|
2017-05-08 |
2020-09-08 |
Asm Ip Holdings B.V. |
Methods for selectively forming a silicon nitride film on a substrate and related semiconductor device structures
|
US10892156B2
(en)
|
2017-05-08 |
2021-01-12 |
Asm Ip Holding B.V. |
Methods for forming a silicon nitride film on a substrate and related semiconductor device structures
|
KR102417931B1
(ko)
*
|
2017-05-30 |
2022-07-06 |
에이에스엠 아이피 홀딩 비.브이. |
기판 지지 장치 및 이를 포함하는 기판 처리 장치
|
US10886123B2
(en)
|
2017-06-02 |
2021-01-05 |
Asm Ip Holding B.V. |
Methods for forming low temperature semiconductor layers and related semiconductor device structures
|
US11306395B2
(en)
|
2017-06-28 |
2022-04-19 |
Asm Ip Holding B.V. |
Methods for depositing a transition metal nitride film on a substrate by atomic layer deposition and related deposition apparatus
|
KR20190009245A
(ko)
|
2017-07-18 |
2019-01-28 |
에이에스엠 아이피 홀딩 비.브이. |
반도체 소자 구조물 형성 방법 및 관련된 반도체 소자 구조물
|
US10541333B2
(en)
|
2017-07-19 |
2020-01-21 |
Asm Ip Holding B.V. |
Method for depositing a group IV semiconductor and related semiconductor device structures
|
US11018002B2
(en)
|
2017-07-19 |
2021-05-25 |
Asm Ip Holding B.V. |
Method for selectively depositing a Group IV semiconductor and related semiconductor device structures
|
US11374112B2
(en)
|
2017-07-19 |
2022-06-28 |
Asm Ip Holding B.V. |
Method for depositing a group IV semiconductor and related semiconductor device structures
|
US10590535B2
(en)
|
2017-07-26 |
2020-03-17 |
Asm Ip Holdings B.V. |
Chemical treatment, deposition and/or infiltration apparatus and method for using the same
|
US10692741B2
(en)
|
2017-08-08 |
2020-06-23 |
Asm Ip Holdings B.V. |
Radiation shield
|
US10770336B2
(en)
|
2017-08-08 |
2020-09-08 |
Asm Ip Holding B.V. |
Substrate lift mechanism and reactor including same
|
US11769682B2
(en)
|
2017-08-09 |
2023-09-26 |
Asm Ip Holding B.V. |
Storage apparatus for storing cassettes for substrates and processing apparatus equipped therewith
|
US11139191B2
(en)
|
2017-08-09 |
2021-10-05 |
Asm Ip Holding B.V. |
Storage apparatus for storing cassettes for substrates and processing apparatus equipped therewith
|
US11830730B2
(en)
|
2017-08-29 |
2023-11-28 |
Asm Ip Holding B.V. |
Layer forming method and apparatus
|
KR102491945B1
(ko)
|
2017-08-30 |
2023-01-26 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치
|
US11295980B2
(en)
|
2017-08-30 |
2022-04-05 |
Asm Ip Holding B.V. |
Methods for depositing a molybdenum metal film over a dielectric surface of a substrate by a cyclical deposition process and related semiconductor device structures
|
US11056344B2
(en)
|
2017-08-30 |
2021-07-06 |
Asm Ip Holding B.V. |
Layer forming method
|
CN109423626B
(zh)
*
|
2017-08-30 |
2021-07-09 |
胜高股份有限公司 |
成膜装置、成膜用托盘、成膜方法、成膜用托盘的制造方法
|
KR102630301B1
(ko)
|
2017-09-21 |
2024-01-29 |
에이에스엠 아이피 홀딩 비.브이. |
침투성 재료의 순차 침투 합성 방법 처리 및 이를 이용하여 형성된 구조물 및 장치
|
US10844484B2
(en)
|
2017-09-22 |
2020-11-24 |
Asm Ip Holding B.V. |
Apparatus for dispensing a vapor phase reactant to a reaction chamber and related methods
|
US10658205B2
(en)
|
2017-09-28 |
2020-05-19 |
Asm Ip Holdings B.V. |
Chemical dispensing apparatus and methods for dispensing a chemical to a reaction chamber
|
US10403504B2
(en)
|
2017-10-05 |
2019-09-03 |
Asm Ip Holding B.V. |
Method for selectively depositing a metallic film on a substrate
|
US10923344B2
(en)
|
2017-10-30 |
2021-02-16 |
Asm Ip Holding B.V. |
Methods for forming a semiconductor structure and related semiconductor structures
|
US10910262B2
(en)
|
2017-11-16 |
2021-02-02 |
Asm Ip Holding B.V. |
Method of selectively depositing a capping layer structure on a semiconductor device structure
|
KR102538177B1
(ko)
*
|
2017-11-16 |
2023-05-31 |
삼성전자주식회사 |
상부 샤워 헤드 및 하부 샤워 헤드를 포함하는 증착 장치
|
US11022879B2
(en)
|
2017-11-24 |
2021-06-01 |
Asm Ip Holding B.V. |
Method of forming an enhanced unexposed photoresist layer
|
US11639811B2
(en)
|
2017-11-27 |
2023-05-02 |
Asm Ip Holding B.V. |
Apparatus including a clean mini environment
|
KR102597978B1
(ko)
|
2017-11-27 |
2023-11-06 |
에이에스엠 아이피 홀딩 비.브이. |
배치 퍼니스와 함께 사용하기 위한 웨이퍼 카세트를 보관하기 위한 보관 장치
|
US10872771B2
(en)
|
2018-01-16 |
2020-12-22 |
Asm Ip Holding B. V. |
Method for depositing a material film on a substrate within a reaction chamber by a cyclical deposition process and related device structures
|
US11482412B2
(en)
|
2018-01-19 |
2022-10-25 |
Asm Ip Holding B.V. |
Method for depositing a gap-fill layer by plasma-assisted deposition
|
TW202325889A
(zh)
|
2018-01-19 |
2023-07-01 |
荷蘭商Asm 智慧財產控股公司 |
沈積方法
|
US11018047B2
(en)
|
2018-01-25 |
2021-05-25 |
Asm Ip Holding B.V. |
Hybrid lift pin
|
USD880437S1
(en)
|
2018-02-01 |
2020-04-07 |
Asm Ip Holding B.V. |
Gas supply plate for semiconductor manufacturing apparatus
|
US11081345B2
(en)
|
2018-02-06 |
2021-08-03 |
Asm Ip Holding B.V. |
Method of post-deposition treatment for silicon oxide film
|
WO2019158960A1
(en)
|
2018-02-14 |
2019-08-22 |
Asm Ip Holding B.V. |
A method for depositing a ruthenium-containing film on a substrate by a cyclical deposition process
|
US10896820B2
(en)
|
2018-02-14 |
2021-01-19 |
Asm Ip Holding B.V. |
Method for depositing a ruthenium-containing film on a substrate by a cyclical deposition process
|
KR102636427B1
(ko)
|
2018-02-20 |
2024-02-13 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 방법 및 장치
|
US10975470B2
(en)
|
2018-02-23 |
2021-04-13 |
Asm Ip Holding B.V. |
Apparatus for detecting or monitoring for a chemical precursor in a high temperature environment
|
US11473195B2
(en)
|
2018-03-01 |
2022-10-18 |
Asm Ip Holding B.V. |
Semiconductor processing apparatus and a method for processing a substrate
|
US11629406B2
(en)
|
2018-03-09 |
2023-04-18 |
Asm Ip Holding B.V. |
Semiconductor processing apparatus comprising one or more pyrometers for measuring a temperature of a substrate during transfer of the substrate
|
US11114283B2
(en)
|
2018-03-16 |
2021-09-07 |
Asm Ip Holding B.V. |
Reactor, system including the reactor, and methods of manufacturing and using same
|
KR102646467B1
(ko)
|
2018-03-27 |
2024-03-11 |
에이에스엠 아이피 홀딩 비.브이. |
기판 상에 전극을 형성하는 방법 및 전극을 포함하는 반도체 소자 구조
|
US11088002B2
(en)
|
2018-03-29 |
2021-08-10 |
Asm Ip Holding B.V. |
Substrate rack and a substrate processing system and method
|
US11230766B2
(en)
|
2018-03-29 |
2022-01-25 |
Asm Ip Holding B.V. |
Substrate processing apparatus and method
|
KR102501472B1
(ko)
|
2018-03-30 |
2023-02-20 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 방법
|
TWI811348B
(zh)
|
2018-05-08 |
2023-08-11 |
荷蘭商Asm 智慧財產控股公司 |
藉由循環沉積製程於基板上沉積氧化物膜之方法及相關裝置結構
|
TWI816783B
(zh)
|
2018-05-11 |
2023-10-01 |
荷蘭商Asm 智慧財產控股公司 |
用於基板上形成摻雜金屬碳化物薄膜之方法及相關半導體元件結構
|
KR102596988B1
(ko)
|
2018-05-28 |
2023-10-31 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 방법 및 그에 의해 제조된 장치
|
US11270899B2
(en)
|
2018-06-04 |
2022-03-08 |
Asm Ip Holding B.V. |
Wafer handling chamber with moisture reduction
|
US11718913B2
(en)
|
2018-06-04 |
2023-08-08 |
Asm Ip Holding B.V. |
Gas distribution system and reactor system including same
|
US11286562B2
(en)
|
2018-06-08 |
2022-03-29 |
Asm Ip Holding B.V. |
Gas-phase chemical reactor and method of using same
|
KR102568797B1
(ko)
|
2018-06-21 |
2023-08-21 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 시스템
|
US10797133B2
(en)
|
2018-06-21 |
2020-10-06 |
Asm Ip Holding B.V. |
Method for depositing a phosphorus doped silicon arsenide film and related semiconductor device structures
|
JP2021529254A
(ja)
|
2018-06-27 |
2021-10-28 |
エーエスエム・アイピー・ホールディング・ベー・フェー |
金属含有材料ならびに金属含有材料を含む膜および構造体を形成するための周期的堆積方法
|
CN112292477A
(zh)
|
2018-06-27 |
2021-01-29 |
Asm Ip私人控股有限公司 |
用于形成含金属的材料的循环沉积方法及包含含金属的材料的膜和结构
|
US10612136B2
(en)
|
2018-06-29 |
2020-04-07 |
ASM IP Holding, B.V. |
Temperature-controlled flange and reactor system including same
|
KR20200002519A
(ko)
|
2018-06-29 |
2020-01-08 |
에이에스엠 아이피 홀딩 비.브이. |
박막 증착 방법 및 반도체 장치의 제조 방법
|
US10388513B1
(en)
|
2018-07-03 |
2019-08-20 |
Asm Ip Holding B.V. |
Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition
|
US10755922B2
(en)
|
2018-07-03 |
2020-08-25 |
Asm Ip Holding B.V. |
Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition
|
US11053591B2
(en)
|
2018-08-06 |
2021-07-06 |
Asm Ip Holding B.V. |
Multi-port gas injection system and reactor system including same
|
US10883175B2
(en)
|
2018-08-09 |
2021-01-05 |
Asm Ip Holding B.V. |
Vertical furnace for processing substrates and a liner for use therein
|
US11430674B2
(en)
|
2018-08-22 |
2022-08-30 |
Asm Ip Holding B.V. |
Sensor array, apparatus for dispensing a vapor phase reactant to a reaction chamber and related methods
|
KR20200030162A
(ko)
|
2018-09-11 |
2020-03-20 |
에이에스엠 아이피 홀딩 비.브이. |
박막 증착 방법
|
US11024523B2
(en)
|
2018-09-11 |
2021-06-01 |
Asm Ip Holding B.V. |
Substrate processing apparatus and method
|
US11049751B2
(en)
|
2018-09-14 |
2021-06-29 |
Asm Ip Holding B.V. |
Cassette supply system to store and handle cassettes and processing apparatus equipped therewith
|
CN110970344A
(zh)
|
2018-10-01 |
2020-04-07 |
Asm Ip控股有限公司 |
衬底保持设备、包含所述设备的系统及其使用方法
|
US11232963B2
(en)
|
2018-10-03 |
2022-01-25 |
Asm Ip Holding B.V. |
Substrate processing apparatus and method
|
KR102592699B1
(ko)
|
2018-10-08 |
2023-10-23 |
에이에스엠 아이피 홀딩 비.브이. |
기판 지지 유닛 및 이를 포함하는 박막 증착 장치와 기판 처리 장치
|
KR102605121B1
(ko)
|
2018-10-19 |
2023-11-23 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치 및 기판 처리 방법
|
KR102546322B1
(ko)
|
2018-10-19 |
2023-06-21 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치 및 기판 처리 방법
|
USD948463S1
(en)
|
2018-10-24 |
2022-04-12 |
Asm Ip Holding B.V. |
Susceptor for semiconductor substrate supporting apparatus
|
US11087997B2
(en)
|
2018-10-31 |
2021-08-10 |
Asm Ip Holding B.V. |
Substrate processing apparatus for processing substrates
|
KR20200051105A
(ko)
|
2018-11-02 |
2020-05-13 |
에이에스엠 아이피 홀딩 비.브이. |
기판 지지 유닛 및 이를 포함하는 기판 처리 장치
|
US11572620B2
(en)
|
2018-11-06 |
2023-02-07 |
Asm Ip Holding B.V. |
Methods for selectively depositing an amorphous silicon film on a substrate
|
US11031242B2
(en)
|
2018-11-07 |
2021-06-08 |
Asm Ip Holding B.V. |
Methods for depositing a boron doped silicon germanium film
|
US10847366B2
(en)
|
2018-11-16 |
2020-11-24 |
Asm Ip Holding B.V. |
Methods for depositing a transition metal chalcogenide film on a substrate by a cyclical deposition process
|
US10818758B2
(en)
|
2018-11-16 |
2020-10-27 |
Asm Ip Holding B.V. |
Methods for forming a metal silicate film on a substrate in a reaction chamber and related semiconductor device structures
|
US11217444B2
(en)
|
2018-11-30 |
2022-01-04 |
Asm Ip Holding B.V. |
Method for forming an ultraviolet radiation responsive metal oxide-containing film
|
KR102636428B1
(ko)
|
2018-12-04 |
2024-02-13 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치를 세정하는 방법
|
US11158513B2
(en)
|
2018-12-13 |
2021-10-26 |
Asm Ip Holding B.V. |
Methods for forming a rhenium-containing film on a substrate by a cyclical deposition process and related semiconductor device structures
|
JP2020096183A
(ja)
|
2018-12-14 |
2020-06-18 |
エーエスエム・アイピー・ホールディング・ベー・フェー |
窒化ガリウムの選択的堆積を用いてデバイス構造体を形成する方法及びそのためのシステム
|
CN111446185A
(zh)
|
2019-01-17 |
2020-07-24 |
Asm Ip 控股有限公司 |
通风基座
|
USD920936S1
(en)
|
2019-01-17 |
2021-06-01 |
Asm Ip Holding B.V. |
Higher temperature vented susceptor
|
TWI819180B
(zh)
|
2019-01-17 |
2023-10-21 |
荷蘭商Asm 智慧財產控股公司 |
藉由循環沈積製程於基板上形成含過渡金屬膜之方法
|
USD914620S1
(en)
|
2019-01-17 |
2021-03-30 |
Asm Ip Holding B.V. |
Vented susceptor
|
KR20200091543A
(ko)
|
2019-01-22 |
2020-07-31 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치
|
CN111524788B
(zh)
|
2019-02-01 |
2023-11-24 |
Asm Ip私人控股有限公司 |
氧化硅的拓扑选择性膜形成的方法
|
US11482533B2
(en)
|
2019-02-20 |
2022-10-25 |
Asm Ip Holding B.V. |
Apparatus and methods for plug fill deposition in 3-D NAND applications
|
KR102626263B1
(ko)
|
2019-02-20 |
2024-01-16 |
에이에스엠 아이피 홀딩 비.브이. |
처리 단계를 포함하는 주기적 증착 방법 및 이를 위한 장치
|
JP2020136677A
(ja)
|
2019-02-20 |
2020-08-31 |
エーエスエム・アイピー・ホールディング・ベー・フェー |
基材表面内に形成された凹部を充填するための周期的堆積方法および装置
|
KR102638425B1
(ko)
|
2019-02-20 |
2024-02-21 |
에이에스엠 아이피 홀딩 비.브이. |
기판 표면 내에 형성된 오목부를 충진하기 위한 방법 및 장치
|
JP2020133004A
(ja)
|
2019-02-22 |
2020-08-31 |
エーエスエム・アイピー・ホールディング・ベー・フェー |
基材を処理するための基材処理装置および方法
|
US11742198B2
(en)
|
2019-03-08 |
2023-08-29 |
Asm Ip Holding B.V. |
Structure including SiOCN layer and method of forming same
|
KR20200108243A
(ko)
|
2019-03-08 |
2020-09-17 |
에이에스엠 아이피 홀딩 비.브이. |
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|
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(ko)
|
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2020-09-17 |
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|
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(ja)
|
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2020-10-08 |
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|
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|
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|
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(en)
|
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|
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(ko)
|
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|
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|
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|
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|
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|
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|
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|
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(ja)
|
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|
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(en)
|
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|
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(en)
|
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|
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(zh)
|
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|
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(en)
|
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|
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(en)
|
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Asm Ip Holding B.V. |
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|
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(ko)
|
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|
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|
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|
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(en)
|
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|
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(en)
|
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|
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(ko)
|
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|
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(ja)
|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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(en)
|
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|
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(zh)
|
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|
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|
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|
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(zh)
|
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|
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(zh)
|
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|
US11587814B2
(en)
|
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2023-02-21 |
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|
US11227782B2
(en)
|
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2022-01-18 |
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Vertical batch furnace assembly
|
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(en)
|
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2023-02-21 |
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|
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(zh)
|
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|
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(en)
|
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|
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(en)
|
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|
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(ja)
|
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|
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(en)
|
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Insulator
|
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(en)
|
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2021-09-14 |
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|
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(ko)
|
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2021-03-05 |
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|
USD940837S1
(en)
|
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2022-01-11 |
Asm Ip Holding B.V. |
Electrode
|
USD949319S1
(en)
|
2019-08-22 |
2022-04-19 |
Asm Ip Holding B.V. |
Exhaust duct
|
KR20210024420A
(ko)
|
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2021-03-05 |
에이에스엠 아이피 홀딩 비.브이. |
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|
US11286558B2
(en)
|
2019-08-23 |
2022-03-29 |
Asm Ip Holding B.V. |
Methods for depositing a molybdenum nitride film on a surface of a substrate by a cyclical deposition process and related semiconductor device structures including a molybdenum nitride film
|
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(ko)
|
2019-09-04 |
2021-03-15 |
에이에스엠 아이피 홀딩 비.브이. |
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|
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(ko)
|
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2021-03-16 |
에이에스엠 아이피 홀딩 비.브이. |
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|
US11562901B2
(en)
|
2019-09-25 |
2023-01-24 |
Asm Ip Holding B.V. |
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|
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(zh)
|
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2023-12-22 |
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|
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(zh)
|
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|
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(zh)
|
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|
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(ko)
|
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에이에스엠 아이피 홀딩 비.브이. |
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|
US11637014B2
(en)
|
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2023-04-25 |
Asm Ip Holding B.V. |
Methods for selective deposition of doped semiconductor material
|
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(ko)
|
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2021-04-30 |
에이에스엠 아이피 홀딩 비.브이. |
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|
US11764101B2
(en)
|
2019-10-24 |
2023-09-19 |
ASM IP Holding, B.V. |
Susceptor for semiconductor substrate processing
|
US11646205B2
(en)
|
2019-10-29 |
2023-05-09 |
Asm Ip Holding B.V. |
Methods of selectively forming n-type doped material on a surface, systems for selectively forming n-type doped material, and structures formed using same
|
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(ko)
|
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2021-05-14 |
에이에스엠 아이피 홀딩 비.브이. |
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|
US11501968B2
(en)
|
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2022-11-15 |
Asm Ip Holding B.V. |
Method for providing a semiconductor device with silicon filled gaps
|
KR20210062561A
(ko)
|
2019-11-20 |
2021-05-31 |
에이에스엠 아이피 홀딩 비.브이. |
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|
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(zh)
|
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2021-06-11 |
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|
US11450529B2
(en)
|
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2022-09-20 |
Asm Ip Holding B.V. |
Methods for selectively forming a target film on a substrate comprising a first dielectric surface and a second metallic surface
|
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(zh)
|
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2021-06-01 |
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|
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(zh)
|
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2021-06-01 |
Asm Ip私人控股有限公司 |
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|
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(ja)
|
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2021-06-10 |
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|
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(ko)
|
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2021-06-15 |
에이에스엠 아이피 홀딩 비.브이. |
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|
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(ja)
|
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|
US11527403B2
(en)
|
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2022-12-13 |
Asm Ip Holding B.V. |
Methods for filling a gap feature on a substrate surface and related semiconductor structures
|
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(ja)
|
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|
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|
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|
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(zh)
|
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|
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(zh)
|
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|
US11776846B2
(en)
|
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2023-10-03 |
Asm Ip Holding B.V. |
Methods for depositing gap filling fluids and related systems and devices
|
US11781243B2
(en)
|
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Asm Ip Holding B.V. |
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|
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(zh)
|
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|
US11876356B2
(en)
|
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|
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(ko)
|
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에이에스엠 아이피 홀딩 비.브이. |
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|
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(zh)
|
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|
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(ko)
|
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에이에스엠 아이피 홀딩 비.브이. |
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|
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(zh)
|
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|
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(zh)
|
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|
US11821078B2
(en)
|
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2023-11-21 |
Asm Ip Holding B.V. |
Method for forming precoat film and method for forming silicon-containing film
|
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(ko)
|
2020-04-24 |
2021-11-04 |
에이에스엠 아이피 홀딩 비.브이. |
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|
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(zh)
|
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2021-10-26 |
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|
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(zh)
|
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2021-12-16 |
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垂直批式熔爐總成、及用於冷卻垂直批式熔爐之方法
|
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(ko)
|
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2021-11-09 |
에이에스엠 아이피 홀딩 비.브이. |
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|
KR20210134869A
(ko)
|
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2021-11-11 |
에이에스엠 아이피 홀딩 비.브이. |
Foup 핸들러를 이용한 foup의 빠른 교환
|
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(ko)
|
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2021-11-23 |
에이에스엠 아이피 홀딩 비.브이. |
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|
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(zh)
|
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|
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(ko)
|
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2021-12-01 |
에이에스엠 아이피 홀딩 비.브이. |
다수의 탄소 층을 포함한 구조체 및 이를 형성하고 사용하는 방법
|
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(ko)
|
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2021-12-01 |
에이에스엠 아이피 홀딩 비.브이. |
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|
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(zh)
|
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2022-01-01 |
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|
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(zh)
|
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2022-05-01 |
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|
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(zh)
|
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|
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(ko)
|
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2022-01-25 |
에이에스엠 아이피 홀딩 비.브이. |
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|
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(zh)
|
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用於沉積鉬層之方法及系統
|
US11380575B2
(en)
*
|
2020-07-27 |
2022-07-05 |
Applied Materials, Inc. |
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