DE3922478A1 - Excimer laser structuring or etching process - for plastics-coated copper-clad base materials - Google Patents

Excimer laser structuring or etching process - for plastics-coated copper-clad base materials

Info

Publication number
DE3922478A1
DE3922478A1 DE3922478A DE3922478A DE3922478A1 DE 3922478 A1 DE3922478 A1 DE 3922478A1 DE 3922478 A DE3922478 A DE 3922478A DE 3922478 A DE3922478 A DE 3922478A DE 3922478 A1 DE3922478 A1 DE 3922478A1
Authority
DE
Germany
Prior art keywords
fine
excimer laser
structuring
clad base
etching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE3922478A
Other languages
German (de)
Inventor
Karl-Heinz Dipl Phys Pietsch
Horst Blaesing
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bayer Pharma AG
Original Assignee
Schering AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schering AG filed Critical Schering AG
Priority to DE3922478A priority Critical patent/DE3922478A1/en
Publication of DE3922478A1 publication Critical patent/DE3922478A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/34—Coated articles, e.g. plated or painted; Surface treated articles
    • B23K2101/35—Surface treated articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/12—Copper or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B23K2103/166—Multilayered materials
    • B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/52—Ceramics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

(A) Structuring or etching of a plastics coated Cu clad base material is effected by pulsed irradiation with light, the novelty being that an excimer laser is used for the irradiation. (B) Appts. for carrying out the process is also claimed. Fine and ultra-fine conductor line structures are produced on rigid and flexible base materials by structuring the desired line pattern on the coated Cu clad base material by means of an excimer laser using a mask or by direct image scanning using a scanner; forming the conductor lines by metal electrodeposition and removing the coating and etching the Cu in conventional manner or by use of an excimer laser. USE/ADVANTAGE - The process is useful for photoresist-free prodn. of fine circuit structures on circuit board substrates. It avoids the expense and pollution of conventional photochemical process steps.

Description

Die Erfindung betrifft ein Verfahren zum Strukturieren oder Ätzen von mit Kunststoff beschichtetem, kupferkaschiertem Basismaterial durch impulsförmige Bestrahlung mit Licht.The invention relates to a method for structuring or etching with Plastic-coated, copper-clad base material thanks to pulse-shaped Irradiation with light.

Bisherige Verfahren versuchen Leiterbahnstrukturen entweder im Subtraktiv- oder im Semiadditivverfahren so herzustellen, indem sie auf das Ausgangssubstrat ei­ ne photosensible Schicht aufbringen. Diese wird mit herkömmlichen Maskalignern oder Laserplottern belichtet und anschließend entwickelt, worauf die Schritte des Ätzens für das Subtraktivverfahren oder des Leiterbahnaufbaus in an sich bekannter Weise erfolgen.Previous methods try conductor track structures either in the subtractive or to produce in the semi-additive process by ei on the starting substrate Apply a photosensitive layer. This is done with conventional mask aligners or laser plotter exposed and then developed, followed by the steps of etching for the subtractive process or the construction of the conductor track in itself done in a known manner.

Die Erfindung hat die Aufgabe, die relativ teuren und stark umweltbelastenden photochemischen Schritte der herkömmlichen Verfahren durch preisgünstigere und umweltfreundlichere zu ersetzen.The invention has the task of being relatively expensive and extremely polluting photochemical steps of conventional methods through less expensive and to replace more environmentally friendly.

Diese Aufgabe wird erfindungsgemäß durch ein Verfahren gemäß dem kennzeichnen­ den Teil des Patentanspruches gelöst.According to the invention, this object is characterized by a method according to the solved the part of the claim.

Weitere Ausgestaltungen der Erfindung sind den Kennzeichnungsteilen der Unteran­ sprüche zu entnehmen.Further refinements of the invention are the labeling parts of the Unteran to take sayings.

Das erfindungsgemäße Verfahren wird im Prinzip wie folgt durchgeführt: Man bestrahlt Materialien impulsförmig mit Strahlung (<300 nm), während bei Überschreitung einer bestimmten benötigten Schwellenbestrahlung (bei Kunststof­ fen ca. 70 mJ/cm2) eine Ablation des Materials eintritt. Optimiert man die Be­ strahlung, so lassen sich Abtragsraten von bis zu 1E-6 m/puls erreichen. Bei Kunststoffen liegt die dafür nötige Bestrahlung bei 1-2 J/cm2, bei Kupfer bei ca. 10 J/cm2. Die dabei entstehenden Ablationsprodukte erreichen Geschwindig­ keiten von einigen 1E3 m/s und sollten, um eine Redeposition auf dem Substrat zu vermeiden, elektrostatisch abgesaugt werden (typ. U = 1E3 V). Die dabei verwendeten Repetierraten liegen bei ca. 10 Hz, übliche Pulsdauern bei ca. 15 ns. Geht man zu noch kürzeren Impulsdauern (300 fs), so ist es auch mög­ lich, Materialien zu ablatieren, die in diesem Spektralbereich keine Absorption zeigen. The method according to the invention is carried out in principle as follows: materials are irradiated in pulsed form with radiation (<300 nm), while when a certain required threshold radiation is exceeded (in the case of plastics approx. 70 mJ / cm 2 ) the material ablates. If the radiation is optimized, removal rates of up to 1E-6 m / pulse can be achieved. The radiation required for plastics is 1-2 J / cm 2 , for copper approx. 10 J / cm 2 . The resulting ablation products reach speeds of a few 1E3 m / s and should be suctioned off electrostatically in order to avoid repositioning on the substrate (typ. U = 1E3 V). The repetition rates used are around 10 Hz, the usual pulse durations are around 15 ns. If you go to even shorter pulse durations (300 fs), it is also possible to ablate materials that show no absorption in this spectral range.

Als Basismaterialien können grundsätzlich alle üblichen Leiterplattensubstrate verwendet werden, wie zum Beispiel solche auf Basis von FR4, Epoxidharzen, Polyimiden, Keramika, Polyamiden und anderen.Basically, all conventional circuit board substrates can be used are used, such as those based on FR4, epoxy resins, Polyimides, ceramics, polyamides and others.

Zur elektrolytischen Metallabscheidung werden die hierfür üblichen galvanischen Bäder, wie zum Beispiel Kupfer- oder Nickelbäder, verwendet.The usual galvanic ones are used for electrolytic metal deposition Baths such as copper or nickel baths are used.

Die Bestrahlung erfolgt unter Verwendung des an sich bekannten Excimer-Lasers.The irradiation is carried out using the excimer laser known per se.

Die folgenden Beispiele dienen zur Erläuterung der Erfindung.The following examples serve to illustrate the invention.

Beispiel 1example 1 Flexmaterial (TAB) roll to roll semiadditivFlex material (TAB) roll to roll semi-additive

Auf 5E-6 m kupferkaschiertes Polyimid wird eine 35E-6 m dicke Polymethyl­ methacrylate (PMMA)-Schicht aufgebracht und getrocknet. Über eine auf einen UV­ durchlässigen Träger aufgebrachte Metallmaske wird der Spider in ca. 5 s (ArF 10 Hz 1 J/cm2) herausgeätzt. Nach dem galvanischen Leiterbahnaufbau wird der Kunststoff gestrippt und die 5E-6 m Restkupfer chemisch geätzt.A 35E-6 m thick polymethyl methacrylate (PMMA) layer is applied to 5E-6 m copper-clad polyimide and dried. The spider is etched out in about 5 s (ArF 10 Hz 1 J / cm 2 ) using a metal mask applied to a UV-permeable carrier. After the galvanic conductor track construction, the plastic is stripped and the 5E-6 m residual copper is chemically etched.

Eine Anlage zur Durchführung des Verfahrens ist aus der Figur ersichtlich. Hierin bedeutenA plant for carrying out the method can be seen from the figure. Mean here

 1: Abspuleinheit Polyimid-Kupfer-Folie
 2: Abspuleinheit Dielektrikumsfolie
 3: Laminator
 4: Warteschleife
 5: Excimer-Laser-Leiterbahnstrukturierung
 6: Reinigung
 7: Leiterbahnaufbau
 8: Reinigen und Warteschleife
 9: Trocknen
10: Excimer-Laser-Polyimid entfernen
11: Dielektrikum strippen
12: Differenzätzen
13: Spülen
14: Trocknen
15: Warteschleife
16: Aufspuleinheit 1 : Unwinding unit polyimide copper foil
2 : Unwinding unit dielectric film
3 : laminator
4 : On hold
5 : Excimer laser circuit pattern structuring
6 : cleaning
7 : trace construction
8 : Clean and hold
9 : drying
10 : Remove excimer laser polyimide
11 : Strip dielectric
12 : Differential etching
13 : Rinse
14 : drying
15 : On hold
16 : winding unit

Beispiel 2Example 2

Statt des chemischen Ätzens und Strippens wird über eine Negativmaske die Kunststoffschicht mit einer Bestrahlung von ca. 10 J/cm2 entfernt und ebenso die Restkupferschicht zwischen den Leiterbahnen (Dauer ca. 5-10 s).Instead of chemical etching and stripping, the plastic layer is removed with an irradiation of approx. 10 J / cm 2 using a negative mask, as is the residual copper layer between the conductor tracks (duration approx. 5-10 s).

Claims (5)

1. Verfahren zum Strukturieren oder Ätzen von mit Kunststoff beschichtetem, kupferkaschiertem Basismaterial durch impulsförmige Bestrahlung mit Licht, dadurch gekennzeichnet, daß für die Bestrahlung Excimer-Laser verwendet werden.1. A method for structuring or etching plastic-coated, copper-clad base material by pulsed irradiation with light, characterized in that excimer lasers are used for the irradiation. 2. Verfahren gemäß Anspruch 1 zur Herstellung von Fein- und Feinstleiterstruk­ turen auf starren und flexiblen Basismaterialien, gekennzeichnet durch fol­ gende Verfahrensschritte:
  • - Strukturierung des gewünschten Leiterbahnmusters auf dem beschichteten, kupferkaschierten Basismaterial mittels des Excimer-Lasers unter Verwen­ dung einer Maske oder durch direkte Bildberasterung unter Verwendung eines Scanners,
  • - Aufbau der Leiterbahn durch elektrolytische Metallabscheidung,
  • - Entfernen der Beschichtung und Ätzen des Kupfers in üblicher Weise oder mittels eines Excimer-Lasers.
2. The method according to claim 1 for the production of fine and fine conductor structures on rigid and flexible base materials, characterized by the following process steps:
  • Structuring of the desired conductor track pattern on the coated, copper-clad base material by means of the excimer laser using a mask or by direct image scanning using a scanner,
  • - construction of the conductor track by electrolytic metal deposition,
  • - Removal of the coating and etching of the copper in the usual way or using an excimer laser.
3. Verfahren gemäß Anspruch 2 zur Inline-Herstellung von Fein- und Feinstlei­ terstrukturen in Form von Folien, insbesondere von Flachbandleitern und Flexschaltungen.3. The method according to claim 2 for the in-line production of fine and very fine lead ter structures in the form of foils, in particular ribbon conductors and Flex circuits. 4. Verfahren gemäß Ansprüchen 1 bis 3 zur photoresistfreien Herstellung von Fein- und Feinstleiterstrukturen.4. The method according to claims 1 to 3 for the photoresist-free production of Fine and fine conductor structures. 5. Vorrichtung zur Durchführung der Verfahren gemäß Ansprüchen 1 bis 4.5. Apparatus for performing the method according to claims 1 to 4.
DE3922478A 1989-07-06 1989-07-06 Excimer laser structuring or etching process - for plastics-coated copper-clad base materials Withdrawn DE3922478A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE3922478A DE3922478A1 (en) 1989-07-06 1989-07-06 Excimer laser structuring or etching process - for plastics-coated copper-clad base materials

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3922478A DE3922478A1 (en) 1989-07-06 1989-07-06 Excimer laser structuring or etching process - for plastics-coated copper-clad base materials

Publications (1)

Publication Number Publication Date
DE3922478A1 true DE3922478A1 (en) 1991-01-17

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DE3922478A Withdrawn DE3922478A1 (en) 1989-07-06 1989-07-06 Excimer laser structuring or etching process - for plastics-coated copper-clad base materials

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0535620A1 (en) * 1991-10-02 1993-04-07 ANNA HÜTTE GmbH Method for patterning and polishing glass workpieces, in particular made of lead crystal
EP0790123A2 (en) * 1996-02-14 1997-08-20 James River Corporation Of Virginia Patterned metal foil laminate and method for making same
DE19810809C1 (en) * 1998-03-12 1999-12-16 Fraunhofer Ges Forschung Flexible conducting film production
DE10357525B3 (en) * 2003-12-08 2005-02-24 Lpkf Laser & Electronics Ag Applying cover layer to moving structured base layer involves determining base layer structure position, triggering signal from control unit, making aperture in cover layer by laser to synchronize
US7892849B2 (en) 2003-06-20 2011-02-22 Roche Diagnostics Operations, Inc. Reagent stripe for test strip
US8287703B2 (en) 1999-10-04 2012-10-16 Roche Diagnostics Operations, Inc. Biosensor and method of making

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0535620A1 (en) * 1991-10-02 1993-04-07 ANNA HÜTTE GmbH Method for patterning and polishing glass workpieces, in particular made of lead crystal
EP0790123A2 (en) * 1996-02-14 1997-08-20 James River Corporation Of Virginia Patterned metal foil laminate and method for making same
EP0790123A3 (en) * 1996-02-14 1998-12-23 Fort James Corporation Patterned metal foil laminate and method for making same
DE19810809C1 (en) * 1998-03-12 1999-12-16 Fraunhofer Ges Forschung Flexible conducting film production
US8287703B2 (en) 1999-10-04 2012-10-16 Roche Diagnostics Operations, Inc. Biosensor and method of making
US8551308B2 (en) 1999-10-04 2013-10-08 Roche Diagnostics Operations, Inc. Biosensor and method of making
US7892849B2 (en) 2003-06-20 2011-02-22 Roche Diagnostics Operations, Inc. Reagent stripe for test strip
DE10357525B3 (en) * 2003-12-08 2005-02-24 Lpkf Laser & Electronics Ag Applying cover layer to moving structured base layer involves determining base layer structure position, triggering signal from control unit, making aperture in cover layer by laser to synchronize

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