DE112015004631A5 - Laserbauelement und Verfahren zu seiner Herstellung - Google Patents

Laserbauelement und Verfahren zu seiner Herstellung Download PDF

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Publication number
DE112015004631A5
DE112015004631A5 DE112015004631.3T DE112015004631T DE112015004631A5 DE 112015004631 A5 DE112015004631 A5 DE 112015004631A5 DE 112015004631 T DE112015004631 T DE 112015004631T DE 112015004631 A5 DE112015004631 A5 DE 112015004631A5
Authority
DE
Germany
Prior art keywords
production
laser component
laser
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE112015004631.3T
Other languages
English (en)
Other versions
DE112015004631B4 (de
Inventor
Dominik Scholz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of DE112015004631A5 publication Critical patent/DE112015004631A5/de
Application granted granted Critical
Publication of DE112015004631B4 publication Critical patent/DE112015004631B4/de
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H01S5/02326—Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02255—Out-coupling of light using beam deflecting elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)
DE112015004631.3T 2014-10-08 2015-10-07 Laserbauelement und Verfahren zu seiner Herstellung Expired - Fee Related DE112015004631B4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102014114618.2 2014-10-08
DE102014114618.2A DE102014114618A1 (de) 2014-10-08 2014-10-08 Laserbauelement und Verfahren zu seiner Herstellung
PCT/EP2015/073145 WO2016055520A1 (de) 2014-10-08 2015-10-07 Laserbauelement und verfahren zu seiner herstellung

Publications (2)

Publication Number Publication Date
DE112015004631A5 true DE112015004631A5 (de) 2017-09-07
DE112015004631B4 DE112015004631B4 (de) 2022-01-13

Family

ID=54260759

Family Applications (2)

Application Number Title Priority Date Filing Date
DE102014114618.2A Withdrawn DE102014114618A1 (de) 2014-10-08 2014-10-08 Laserbauelement und Verfahren zu seiner Herstellung
DE112015004631.3T Expired - Fee Related DE112015004631B4 (de) 2014-10-08 2015-10-07 Laserbauelement und Verfahren zu seiner Herstellung

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE102014114618.2A Withdrawn DE102014114618A1 (de) 2014-10-08 2014-10-08 Laserbauelement und Verfahren zu seiner Herstellung

Country Status (5)

Country Link
US (1) US10256602B2 (de)
JP (1) JP6393414B2 (de)
CN (1) CN106797103B (de)
DE (2) DE102014114618A1 (de)
WO (1) WO2016055520A1 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016107715A1 (de) * 2016-04-26 2017-10-26 Osram Opto Semiconductors Gmbh Lasermodul mit einem optischen Bauteil
DE102018102961A1 (de) 2018-02-09 2019-08-14 Msg Lithoglas Gmbh Bauteilanordnung, Package und Package-Anordnung sowie Verfahren zum Herstellen
DE102018129343A1 (de) * 2018-11-21 2020-05-28 Osram Opto Semiconductors Gmbh Verfahren zur herstellung von halbleiterlasern und halbleiterlaser
DE102019118797B4 (de) 2019-06-24 2023-01-12 Msg Lithoglas Gmbh Verfahren zum Herstellen einer Bauteilanordnung für ein Package, Verfahren zum Herstellen eines Packages mit einer Bauteilanordnung, Bauteilanordnung und Package
CN111490441B (zh) * 2020-05-21 2022-04-05 王志杰 高带宽激光器信号光与背光分离处理结构
DE102020114371A1 (de) 2020-05-28 2021-12-02 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches halbleiterbauelement und verfahren zur herstellung eines optoelektronischen halbleiterbauelements
CN116027502B (zh) * 2023-03-24 2023-06-30 镭神技术（深圳）有限公司 耦合方法

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4807238A (en) * 1986-03-12 1989-02-21 Ricoh Co., Ltd. A semiconductor laser device
JPH05175614A (ja) 1991-12-26 1993-07-13 Canon Inc 光半導体装置
JP3294379B2 (ja) 1993-06-03 2002-06-24 オリンパス光学工業株式会社 受発光素子
EP0664585B1 (de) * 1993-12-22 1998-03-04 Siemens Aktiengesellschaft Sende- und Empfangsmodul für eine bidirektionale optische Nachrichten- und Signalübertragung
US5793785A (en) 1994-03-04 1998-08-11 Matsushita Electronics Corporation Semiconductor laser device
JP2000114655A (ja) * 1998-09-30 2000-04-21 Toshiba Corp サブマウントミラー方式面型レーザ
JP3091448B2 (ja) * 1999-01-13 2000-09-25 松下電子工業株式会社 光半導体装置
JPWO2003077389A1 (ja) * 2002-03-08 2005-07-07 シャープ株式会社 光源装置およびそれを用いた光通信モジュール
DE10297846D2 (de) * 2002-12-04 2005-10-27 Infineon Technologies Ag Bidirektionales Sende- und Empfangsmodul
US6998691B2 (en) * 2003-09-19 2006-02-14 Agilent Technologies, Inc. Optoelectronic device packaging with hermetically sealed cavity and integrated optical element
JP4069856B2 (ja) 2003-12-02 2008-04-02 株式会社日立製作所 光半導体素子実装用基板及びその製造方法
EP1544966B1 (de) * 2003-12-16 2006-11-29 Matsushita Electric Industrial Co., Ltd. Optischer Halbleiter und Verfahren zu seiner Herstellung
JP4659421B2 (ja) * 2004-09-30 2011-03-30 株式会社トクヤマ 発光素子収納用パッケージの製造方法
KR100682868B1 (ko) * 2004-10-05 2007-02-15 삼성전기주식회사 마이크로 미러 및 그 제조방법
WO2008114991A1 (en) * 2007-03-19 2008-09-25 Jeong Soo Kim Self-standing parallel plate beam splitter, method for manufacturing the same, and laser diode package structure using the same
JP5103633B2 (ja) 2007-07-11 2012-12-19 株式会社リコー 周回光路装置およびリングレーザジャイロ
US20100002235A1 (en) * 2008-07-07 2010-01-07 IRMicrosystems SA Laser diode arrangements and method for gas detection
DE102008063634B4 (de) * 2008-12-18 2021-03-11 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Leuchtmittel und Projektor mit mindestens einem solchen Leuchtmittel
US8471289B2 (en) * 2009-12-28 2013-06-25 Sanyo Electric Co., Ltd. Semiconductor laser device, optical pickup device and semiconductor device
JP2012054527A (ja) * 2010-08-04 2012-03-15 Sanyo Electric Co Ltd 半導体レーザ装置、半導体レーザ装置の製造方法および光装置
CN103380551A (zh) * 2011-03-17 2013-10-30 松下电器产业株式会社 半导体发光元件以及使用它的发光装置
DE102012205513B4 (de) * 2012-04-04 2021-12-09 Osram Gmbh Verfahren zum Herstellen einer Strahlungsanordnung und Strahlungsanordnung
US9008139B2 (en) * 2013-06-28 2015-04-14 Jds Uniphase Corporation Structure and method for edge-emitting diode package having deflectors and diffusers
DE102014102258B4 (de) * 2014-02-21 2021-08-05 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Bauelement
DE102014106882A1 (de) * 2014-05-15 2015-11-19 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
US9608731B2 (en) * 2014-11-05 2017-03-28 Innovative Micro Technology Microfabricated optical apparatus
US20170237228A1 (en) * 2014-11-05 2017-08-17 Innovative Micro Technology Microfabricated optical apparatus
US11431146B2 (en) * 2015-03-27 2022-08-30 Jabil Inc. Chip on submount module
CN107195751B (zh) * 2016-03-14 2020-01-14 光宝光电(常州)有限公司 发光二极管封装结构
DE102016213902A1 (de) * 2016-07-28 2018-02-01 Osram Gmbh Strahlquelle mit Laserdiode

Also Published As

Publication number Publication date
CN106797103B (zh) 2020-03-03
DE112015004631B4 (de) 2022-01-13
CN106797103A (zh) 2017-05-31
WO2016055520A1 (de) 2016-04-14
US10256602B2 (en) 2019-04-09
US20170310079A1 (en) 2017-10-26
JP2017528920A (ja) 2017-09-28
JP6393414B2 (ja) 2018-09-19
DE102014114618A1 (de) 2016-04-14

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R012 Request for examination validly filed
R016 Response to examination communication
R016 Response to examination communication
R018 Grant decision by examination section/examining division
R020 Patent grant now final
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee