CN1912571A - Method for measuring compression strength of IC card module and measuring instrument - Google Patents
Method for measuring compression strength of IC card module and measuring instrument Download PDFInfo
- Publication number
- CN1912571A CN1912571A CN 200510090261 CN200510090261A CN1912571A CN 1912571 A CN1912571 A CN 1912571A CN 200510090261 CN200510090261 CN 200510090261 CN 200510090261 A CN200510090261 A CN 200510090261A CN 1912571 A CN1912571 A CN 1912571A
- Authority
- CN
- China
- Prior art keywords
- module
- compressive strength
- colloid
- card module
- measurement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
Abstract
A method for measuring compression resisting strength of IC card module includes placing IC card module metal strip on test table as strip surface being set upwards to let module colloid part be at hanging state and to let module center be at the same vertical line as axle of pressure rod, exerting pressure on module by pressing head in uniform speed way, reading out pressure valve when IC card module is broken then calculating out compression resisting strength of module by utilizing set formula based on obtained pressure value. The measurer for realizing said method is also disclosed.
Description
Technical field
The present invention relates to a kind of strength measurement method, particularly relate to a kind of IC-card module strength measuring method.
Background technology
Every performance of the parts that will produce each procedure in the manufacture process of IC-card detects, to guarantee that parts are qualified parts when entering next process, thereby guarantee the quality of final finished, in the manufacture process of IC-card, the measurement of each intermediate product comprised measurement to the adhesive property of the compressive strength of module and colloid and band or the like.
Existing compressive strength to the IC-card module detects several different experimental techniques:
Shore hardness (D) experimental method: with the hardness of the colloid of compressive strength measuring instrument measurement module, but high its intensity of object of hardness is not necessarily high, so the shore hardness experiment can not reflect the compressive strength performance of module.
The dynamic twisting stress experiment of card: this experiment can be measured the quality of the cementability of colloid and band indirectly.But because this experiment must become card to module package, increased the time and the step of experiment, in the process of experiment, the metal band that module itself may occur does not separate with colloid, and the situation that the module and card base separates can not reflect the cementability of colloid and band more exactly.
Also has the experiment of a kind of common point pressure, the compressive strength that it can measurement module itself, but the quality of the adhesive property of energy measurement colloid and band not.
Summary of the invention
The present invention has overcome the deficiency of existing measurement and experimental technique, provides a kind of and need not directly measure the compressive strength of the module of IC-card with module package to card, detects colloid and band adhesive property, detects the measuring method of the performance quality of colloid simultaneously.
The method of measurement IC-card module compressive strength of the present invention comprises the steps:
A. IC-card module metal band being faced up places on the testing table, makes the colloid part branch of module be in vacant state;
The center of module and the axis of press rods are positioned on same the vertical curve;
C. pressure head is at the uniform velocity exerted pressure to module;
When fracture appears in the module of d.IC card, the force value f when reading fracture;
Preferably, after steps d, also comprise the step of the compressive strength P mould=f/A of computing module, wherein A is the colloid area.
Preferably, the speed that at the uniform velocity descends of pressure head is less than 1mm/s.
Preferably the quantity of measurement module is at least 20, and the mean value of getting the compressive strength of described measurement module is the compression strength value of measured module.
The present invention also provides a kind of measuring instrument that is used to measure IC-card module compressive strength, comprises module testing table placed on it part and the press rods of exerting pressure to module, and described testing table has the recess that the colloid that can make module partly suspends.
The recess of described testing table is a groove.The width of described groove is than the length or the big 0.05-0.1mm of width of the colloid of module.
The recess of described testing table is rectangular opening preferably.The length of described rectangular opening or width are than the length or the big 0.05-0.1mm of width of the colloid of module.
The pressure head of the press rods of compressive strength measuring instrument of the present invention partly is a semisphere.
The size of pressure head can require decide according to the size of measured module and the degree of accuracy of measuring, and the diameter of pressure head is generally with the length of module colloid or width is identical or than the length or the little 0.05-0.1mm of width of module colloid.As, be of a size of the colloid of 4.8 * 5.0mm, then can use the pressure head of diameter as 5.0mm, 3.0mm, 1.0mm.
The material of pressure head is made with No. 45 steel quenchings or other hard material.
The method that the compressive strength of formula IC-card module is measured of the present invention is compared with existing other experimental technique, can directly measure the compressive strength size of module, and can detect the quality of the adhesive property of colloid and band qualitatively, can detect the quality of used colloidal property simultaneously.Measuring method is simple, directly perceived, is easy to realize.
Description of drawings
Fig. 1 is the partial schematic diagram of compressive strength measuring instrument of the present invention;
Fig. 2 is the schematic top plan view of the experiment table of groove for recess of the present invention;
Fig. 3 is the schematic top plan view of the experiment table of rectangular opening for recess of the present invention.
The concrete rectangular of implementing
Below by instantiation the method that the compressive strength of formula IC-card is measured of the present invention is described in detail:
At first before measuring, the compressive strength measuring instrument is calibrated, the metal band 1 of module is faced up is positioned on the experiment table then, and the colloid 2 of the protrusion of module is stuck in downwards in the groove 4 of experiment table 3, and colloid 2 parts of module just are in vacant state.Mobile module is arranged on the vertical curve center of the center of module and pressure head 7 as far as possible and (can realizes by range estimation or by means of other instrument in operating process).Start the switch of compressive strength measuring instrument then, pressure head 7 is at the uniform velocity moved down to module exerts pressure, because of the present invention's measurement is the compressive strength of IC-card module, and do not relate to shock proof intensity, therefore pressure head 7 is exerted pressure with less speed to module, pressure head 7 is at the uniform velocity moved downward with the speed less than 1mm/s; Pressure head 7 at the uniform velocity descends downwards always, module fracture up to IC-card, maximum pressure value f when this moment, the compressive strength measuring instrument was read fracture automatically, and the compressive strength measuring instrument continues to move downward afterwards, but the force value on the reader 8 of compressive strength measuring instrument can not change again, be the reader 8 of compressive strength measuring instrument read be maximum pressure value f, according to the colloid area A, calculate the compressive strength P of module
Mould=f/A.
If the recess of experiment table is a rectangular opening 5, center and press rods 6 axis with rectangular opening 5 before measuring are adjusted on same the vertical curve, and experiment table fixed, then in the process of measuring, only need colloid 2 parts of module are positioned in the rectangular opening 5, can finish the center of module and press rods 6 axis to the heart.
In order to improve the accuracy of measurement, generally a plurality of modules to be measured, the mean value of getting the compressive strength of all measurement modules is the compression strength value of measured module.
Preferably, the minimum number of measurement module is 20, and the mean value of compressive strength of getting 20 modules is as the compression strength value of survey module.
The present invention provides a kind of compressive strength measuring instrument simultaneously, comprise module testing table placed on it 3 parts and the press rods 6 of exerting pressure to module, described testing table 3 has a recess, recess can be designed to groove 4, the width of groove 4 is more bigger than the length or the width of the colloid 2 of module, standard is not for influencing the minimum clearance that colloid fracture is fallen, as greater than colloid 0.05-0.1mm.When measuring module is positioned on the groove 4, colloid 2 is held in the groove 4, and metal band 1 part of module contacts with groove 4 tops, and colloid 2 is suspended in the groove 4.When measuring, in groove 4,, the center of module and the axis of press rods 6 are positioned on same the vertical curve along the length direction mobile module of groove.
When module is exerted pressure, bad with the cementability of band 1 at pressure head 7 as colloid 2, before the module fracture, colloid 2 can separate with band 1, because the colloid of module 2 is suspended in the groove 4, colloid 2 will drop in the groove 4, thereby can detect the adhesive property of colloid 2 and band 1 qualitatively; Relatively good with the adhesive property of band 1 as colloid 2, when possible module ruptured, colloid 2 was still bonding with band 1.
The recess of testing table 3 is rectangular opening 5 preferably.The length of described rectangular opening 5 or width are more bigger than the length or the width of module colloid 2, and standard is not for influencing the minimum clearance that colloid fracture is fallen, as greater than colloid 0.05-0.1mm.
Recess is that the advantage of the experiment table of rectangular opening 5 is: before measuring, elder generation is adjusted to the center of the rectangular opening 5 of testing table 3 and the axis of press rods 6 on same the vertical curve, and is then that testing table 3 is fixing.Because the length of rectangular opening 5 or width are only than the length or the big 0.05-0.1mm of width of the colloid 2 of module, therefore when placing the colloid 2 of module in the rectangular opening 5, even the position of module is not adjusted, the center of the center of module and press rods 6 also is close to and is positioned on the vertical curve.In the measuring process of reality, needn't adjust the position of each module to be measured, each module centers to be measured and press rods 6 are close to and are positioned on same the vertical curve, have both reduced the deviation of measurement result, have shortened Measuring Time simultaneously again.
And for the testing table 3 of rectangular opening 5, the colloid 2 of module is suspended in the rectangular opening 5, and four limits of the metal band 1 of module all contact with the plane of testing table 3, have increased measuring reliability and stability.
The pressure head 7 of the press rods 6 of compressive strength measuring instrument is designed to semisphere, and its size requires to decide according to the size of module to be measured and the degree of accuracy of measuring, and its diameter is generally than the length or the identical or little 0.05-0.1mm of width of module to be measured.
The shape of pressure head also can be a frusto-spherical.
In order to guarantee that pressure head 7 has certain rigidity, pressure head 7 is generally made by No. 45 steel quenched materials, can certainly use the bigger material of hardness to make.
More than disclosed accompanying drawing, explanation only be specific embodiments of the invention, be not used for limiting protection scope of the present invention.The recess of experiment table of the present invention also can be a dovetail groove, or square hole, can be when module is placed thereon, makes colloid unsettled, and any suitable shape that band is supported.The equalization that those skilled in the art is made according to the present invention changes and revises, all in protection scope of the present invention.
Claims (10)
1. a method of measuring IC-card module compressive strength is characterized in that, comprises the steps:
A. IC-card module metal band being faced up places on the testing table, makes the colloid part branch of module be in vacant state;
The center of module and the axis of press rods are positioned on same the vertical curve;
C. pressure head is at the uniform velocity exerted pressure to module;
When fracture appears in the module of d.IC card, the force value f when reading fracture.
2. the method for measurement IC-card module compressive strength as claimed in claim 1 is characterized in that: the compressive strength P that also comprises computing module after steps d
MouldThe step of=f/A, wherein A is the colloid area.
3. the method for measurement IC-card module compressive strength as claimed in claim 1 or 2, it is characterized in that: the speed that pressure head at the uniform velocity descends is less than 1mm/s.
4. compressive strength measuring instrument of measuring IC-card module compressive strength comprises testing table part that module is placed on it and to the press rods that module is exerted pressure, it is characterized in that: described testing table has the recess that the colloid that can make module partly suspends.
5. the compressive strength measuring instrument of measurement IC-card module compressive strength as claimed in claim 4 is characterized in that: the recess of described testing table is a groove.
6. the compressive strength measuring instrument of measurement IC-card module compressive strength as claimed in claim 4 is characterized in that: the recess of described testing table is a rectangular opening.
7. the compressive strength measuring instrument of measurement IC-card module compressive strength as claimed in claim 5 is characterized in that: the width of the groove of described testing table is than the length or the big 0.05-0.10mm of width of the colloid of module.
8. the compressive strength measuring instrument of measurement IC-card module compressive strength as claimed in claim 6 is characterized in that: the length of the rectangular opening of described testing table or width are than the length or the big 0.05-0.10mm of width of the colloid of module.
9. the compressive strength measuring instrument of measurement IC-card module compressive strength as claimed in claim 5 is characterized in that: the pressure head of press rods partly is semisphere.
10. the compressive strength measuring instrument of measurement IC-card module compressive strength as claimed in claim 9 is characterized in that: the diameter of the pressure head part of press rods is less than or equal to the length or the width of colloid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200510090261A CN1912571B (en) | 2005-08-12 | 2005-08-12 | Method for measuring compression strength of IC card module and measuring instrument |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200510090261A CN1912571B (en) | 2005-08-12 | 2005-08-12 | Method for measuring compression strength of IC card module and measuring instrument |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1912571A true CN1912571A (en) | 2007-02-14 |
| CN1912571B CN1912571B (en) | 2010-05-26 |
Family
ID=37721568
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200510090261A Active CN1912571B (en) | 2005-08-12 | 2005-08-12 | Method for measuring compression strength of IC card module and measuring instrument |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1912571B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103471988A (en) * | 2013-09-09 | 2013-12-25 | 东莞市曙光自动化设备科技有限公司 | Card performance detection system |
| CN113899619A (en) * | 2021-11-15 | 2022-01-07 | 中国建筑材料科学研究总院有限公司 | Sheet ceramic impact strength testing device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102768154B (en) * | 2012-08-09 | 2014-05-21 | 华东理工大学 | Method for characterizing apparent strength of carbon foam layer |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB8527459D0 (en) * | 1985-11-07 | 1985-12-11 | British American Tobacco Co | Packet blank creases |
| US5827974A (en) * | 1996-02-03 | 1998-10-27 | Nussinovitch; Amos | System for measuring the crispiness of materials |
| FR2785393B1 (en) * | 1998-10-28 | 2001-01-19 | Solaic Sa | TEST APPARATUS FOR ELECTRONIC MEMORY CARDS |
-
2005
- 2005-08-12 CN CN200510090261A patent/CN1912571B/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103471988A (en) * | 2013-09-09 | 2013-12-25 | 东莞市曙光自动化设备科技有限公司 | Card performance detection system |
| CN113899619A (en) * | 2021-11-15 | 2022-01-07 | 中国建筑材料科学研究总院有限公司 | Sheet ceramic impact strength testing device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1912571B (en) | 2010-05-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| AU2021101826A4 (en) | Micro-nano indentation testing device and method | |
| CN109540663B (en) | Method for correcting mechanical parameters of indentation test material by perpendicularity of flat pressing head | |
| CN2783316Y (en) | Mechanics performance tester for coating layer | |
| CN102493986A (en) | Splicing tool with precise and controllable glue layer thickness | |
| CN109342246B (en) | Method and device for rapidly evaluating wear resistance of coating sample array | |
| CN109238830B (en) | Wood single-fiber micro-mechanical measurement device and measurement method | |
| CN110926933A (en) | Simple material dynamic mechanical property testing device | |
| CN1912571A (en) | Method for measuring compression strength of IC card module and measuring instrument | |
| CN107229144B (en) | Testing jig and testing method for display panel | |
| CN111426552A (en) | Method for analyzing mechanical properties of 3D printing samples with different construction orientations | |
| US8917105B2 (en) | Solder bump testing apparatus and methods of use | |
| CN211376591U (en) | Detection device for integrated circuit packaging mold | |
| CN201653820U (en) | Paster type component bending resistance testing device | |
| CN102338720A (en) | Large-stroke pressure measurement testing machine | |
| CN218895752U (en) | Micro deformation comprehensive test bed | |
| CN1912564A (en) | Partial fibre-optical passive tester and its application | |
| CN217132795U (en) | Unconfined hydrogel compression performance testing device capable of monitoring compression sectional area | |
| US10101253B2 (en) | Method of and apparatus for detecting a crack in a pair of piezoelectric elements based on transfer function | |
| CN209857944U (en) | High-precision thickness gauge for thin film | |
| Reuther et al. | A novel experimental approach to calibrating cohesive zone elements for advanced risk analysis of interface delamination in semiconductor packages | |
| CN200968919Y (en) | Weight automatic adding-unloading device of lever type geotechnical tester | |
| CN113237747A (en) | Test piece, mold, test fixture and test method for direct tensile test of pavement material | |
| CN215375027U (en) | Fingerprint module TPU thrust test tool | |
| CN2888451Y (en) | Probe head of micro-elastic contactor | |
| CN102042938B (en) | Device and method for measuring deformability of micro metal wire/sphere |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |