CN211376591U - Detection device for integrated circuit packaging mold - Google Patents
Detection device for integrated circuit packaging mold Download PDFInfo
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- CN211376591U CN211376591U CN202020263400.2U CN202020263400U CN211376591U CN 211376591 U CN211376591 U CN 211376591U CN 202020263400 U CN202020263400 U CN 202020263400U CN 211376591 U CN211376591 U CN 211376591U
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- detection
- integrated circuit
- circuit packaging
- workbench
- plate
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Abstract
The utility model relates to the technical field of integrated circuit packaging mold detection, in particular to a detection device for an integrated circuit packaging mold, which comprises a workbench, wherein the left side of the top of the workbench is provided with a vertical plate, the middle part of the front side end of the vertical plate is provided with a controller, the utility model provides a detection device for an integrated circuit packaging mold, through the design and the use of a series of structures, the hardness detection of the integrated circuit packaging mold by most single-group detection equipment is avoided, the contrast analysis of multiple groups of detection data is achieved, the accuracy and the reliability of the detection data of the hardness are improved, simultaneously, when the hardness detection value is not in accordance with the preset threshold value in the using process, the detection device has the functions of prompt and display in time, the automation degree is higher, and the use efficiency of the detection device for the integrated circuit packaging mold is improved, and further the practicability of the detection device for the integrated circuit packaging mould is improved.
Description
Technical Field
The utility model relates to an integrated circuit packaging mold detects technical field, concretely relates to a detection device for integrated circuit packaging mold.
Background
In recent years, due to the progress of manufacturing process technology, electronic products are developed toward being light, thin, short, multi-functional and fast in transmission, wherein the electronic products are based on integrated circuits, and the electronic packaging process can ensure that the integrated circuit components can perform stable operation functions. The integrated circuit devices fabricated in wafer processes based on semiconductor fabrication technology are very small in size and fragile in structure, and therefore, they must be packaged in a method for preventing the devices from being damaged by environmental factors such as external forces during transportation, and preventing physical damage and chemical corrosion, so as to ensure normal transmission of signals and energy and to ensure their normal functions. Thus, integrated circuit packages are creating a protection and organization architecture for integrated circuit components.
When the detection device for the integrated circuit packaging mold is used, most of the detection devices adopt a single group of detection equipment to detect the hardness of the integrated circuit packaging mold, the detection data lack of multiple groups are used for carrying out contrastive analysis, the accuracy and the reliability of the detection data of the hardness are reduced, meanwhile, in the using process, when the hardness detection value is inconsistent with a preset threshold value, the functions of prompt and display are not carried out timely, the automation degree is lower, the use efficiency of the detection device for the integrated circuit packaging mold is further reduced, the practicability of the detection device for the integrated circuit packaging mold is further reduced, and therefore the problem is solved by urgently researching and developing the detection device for the integrated circuit packaging mold.
SUMMERY OF THE UTILITY MODEL
Aiming at the defects of the prior art, the utility model provides a detection device for an integrated circuit packaging mould, through the design and the use of a series of structures, the utility model discloses in the use process, avoided adopting single group check out test set to detect the hardness of integrated circuit packaging mould mostly, reached multiunit detected data and carried out contrastive analysis, the detected data accuracy and the reliability of hardness have been improved, simultaneously in the use process, when hardness detected value is inconsistent with preset threshold value, possess the function of in time carrying out suggestion and display, and degree of automation is higher, and then improved the availability factor of the detection device for the integrated circuit packaging mould, and then improved the practicality of the detection device for the integrated circuit packaging mould; and the utility model discloses novel structure, reasonable in design, convenient to use has stronger practicality.
The utility model discloses a following technical scheme realizes:
a detection device for an integrated circuit packaging mold comprises a workbench, wherein a vertical plate is arranged on the left side of the top of the workbench, the middle part of the front side end of the vertical plate is provided with a controller, the top of the vertical plate is provided with a top plate, the left side of the top plate is provided with an alarm, a positioning driving cylinder is fixedly inserted at the right side of the top plate, a positioning disc is arranged at the piston rod end of the positioning driving cylinder, a placing plate is arranged in the middle of the top of the workbench, fixing plates are symmetrically arranged on the top of the workbench around the placing plate, the upper portion symmetry of fixed plate is fixed to be pegged graft and is had the detection to drive actuating cylinder, the tailpiece of the piston rod that detects and drive actuating cylinder is equipped with pressure sensor, keeps away from detect and drive actuating cylinder one side pressure sensor's one end is equipped with the detection pressure head, the front end middle part of workstation inlays and is equipped with LED liquid crystal display.
Preferably, the bottom of the worktable is plated with a zinc-nickel alloy layer.
Preferably, the vertical plate and the top plate are both made of Q235 steel.
Preferably, the alarm is a buzzer alarm.
Preferably, the number that the fixed plate set up is four groups, and be the symmetric distribution in place the board all around.
Preferably, the positioning disc is located right above the placing plate, the bottom of the positioning disc and the top of the placing plate are both provided with anti-slip pads, and the anti-slip pads are made of silica gel materials with anti-slip protrusions.
Preferably, the type of the pressure sensor is MPX2200, the type of the controller is HAD-SC200, and the controller is electrically connected with the alarm, the positioning driving cylinder, the detection driving cylinder, the pressure sensor and the LED liquid crystal display screen respectively.
The utility model has the advantages that:
by the mutual matching use of the components such as the worktable, the vertical plate, the controller, the top plate, the alarm, the positioning driving cylinder, the positioning disc, the placing plate, the fixed plate, the detection driving cylinder, the pressure sensor, the detection pressure head, the LED liquid crystal display screen and the like, when the utility model is used, avoids the detection of the hardness of the integrated circuit packaging mould by mostly adopting a single group of detection equipment, achieves the comparative analysis of a plurality of groups of detection data, improves the accuracy and the reliability of the detection data of the hardness, meanwhile, when the hardness detection value is not in accordance with the preset threshold value in the using process, the hardness detection device has the functions of prompt and display in time, has higher automation degree, the use efficiency of the detection device for the integrated circuit packaging mould is improved, and the practicability of the detection device for the integrated circuit packaging mould is improved;
and the utility model discloses novel structure, reasonable in design, convenient to use has stronger practicality.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a front view of the present invention;
fig. 2 is a top view of the present invention;
FIG. 3 is an enlarged view of A of the present invention;
fig. 4 is a circuit diagram of the present invention.
In the figure: 1-workbench, 2-vertical plate, 3-controller, 4-top plate, 5-alarm, 6-positioning driving cylinder, 7-positioning disc, 8-placing plate, 9-fixing plate, 10-detection driving cylinder, 11-pressure sensor, 12-detection pressure head and 13-LED liquid crystal display screen.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
The utility model provides a detection device for integrated circuit packaging mold, comprises a workbench 1, the top left side of workstation 1 is equipped with riser 2, the preceding side middle part of riser 2 is equipped with controller 3, the top of riser 2 is equipped with roof 4, the top left side of roof 4 is equipped with alarm 5, the right side of roof 4 is fixed to be pegged graft and is had location actuating cylinder 6, the tailpiece of the piston rod of location actuating cylinder 6 is equipped with location disc 7, the top middle part of workstation 1 is equipped with places board 8, the top symmetry that is located and places board 8 workstation 1 all around is equipped with fixed plate 9, the upper portion symmetry of fixed plate 9 is fixed to be pegged graft and is had detection actuating cylinder 10, the tailpiece of the piston rod that detects actuating cylinder 10 is equipped with pressure sensor 11, the one end of keeping away from to detect actuating cylinder 10 one side pressure sensor 11 is equipped with and detects pressure head.
Specifically, the bottom of the table 1 is plated with a zinc-nickel alloy layer.
Specifically, the vertical plate 2 and the top plate 4 are made of Q235 steel.
Specifically, the alarm 5 is a buzzer alarm 5.
Specifically, the number of the fixing plates 9 is four, and the fixing plates are symmetrically distributed around the placing plate 8.
Specifically, the positioning disc 7 is located right above the placing plate 8, the bottom of the positioning disc 7 and the top of the placing plate 8 are both provided with anti-slip pads, and the anti-slip pads are made of silica gel materials with anti-slip protrusions.
Specifically, the type of the pressure sensor 11 is MPX2200, the type of the controller 3 is HAD-SC200, and the controller 3 is electrically connected with the alarm 5, the positioning driving cylinder 6, the detection driving cylinder 10, the pressure sensor 11 and the LED liquid crystal display 13 respectively.
The utility model discloses when using, at first place the integrated circuit packaging mould that treats measuring on placing board 8, control location drive actuating cylinder 6 work afterwards, location drive actuating cylinder 6 drives positioning disc 7 downstream through the extension of piston rod, when downstream to with the integrated circuit packaging mould's that treats measuring top butt, control location drive actuating cylinder 6 stop work, and then reached the purpose of treating the integrated circuit packaging mould that detects and fix a position, avoid taking place the displacement phenomenon when detecting hardness;
then, the detection driving cylinder 10 is controlled to work, a piston rod of the detection driving cylinder 10 extends to drive the pressure sensor 11 and the detection pressure head 12 to approach towards the direction of the integrated circuit packaging mold to be detected, hardness detection is carried out until the detection pressure head 12 abuts against and presses the integrated circuit packaging mold to be detected, when hardness detection is carried out, the pressure sensor 11 sends a pressure signal received by the detection pressure head 12 to the controller 3, and the controller 3 carries out real-time display on the LED liquid crystal display 13 after analyzing the signal;
in the hardness detection, four groups of detection pressure heads 12 are arranged to synchronously detect the hardness of the integrated circuit packaging die to be detected, and data values are synchronously displayed on an LED liquid crystal display screen 13 in real time; when the four groups of data values do not accord with the preset threshold value of the controller 3, the controller 3 sends a signal to the alarm 5, the alarm 5 buzzes the alarm 5, and the alarm 5 gives out a buzzing alarm for reminding; the accuracy and the reliability of the hardness detection data are improved by comparing a plurality of groups of hardness detection data;
moreover, the zinc-nickel alloy layer is plated at the bottom of the workbench 1, so that the corrosion resistance of the workbench 1 is enhanced; the bottom of the positioning disc 7 and the top of the placing plate 8 are both provided with anti-slip pads, and the anti-slip pads are made of silica gel materials with anti-slip bulges, so that the effect of positioning and fixing can be further improved;
and then under the design and the use of above-mentioned structure, the utility model discloses in carrying out the use, avoided the most hardness that adopts singly to organize check out test set to integrated circuit packaging mold to detect, it carries out contrastive analysis to have reached multiunit detected data, the detected data accuracy and the reliability of hardness have been improved, simultaneously in carrying out the use, when hardness detection value and preset threshold value disagree, possess the function that in time indicates and show, and degree of automation is higher, and then improved the availability factor that is used for integrated circuit packaging mold's detection device, and then improved the practicality that is used for integrated circuit packaging mold's detection device.
Above-mentioned alarm 5, location drive actuating cylinder 6, detect the control mode that drives actuating cylinder 10, pressure sensor 11 and LED liquid crystal display 13 isoelectrical component and carry out control through rather than supporting controller 3, and pressure sensor 11's model is MPX2200, and controller 3's model is HAD-SC200, and control circuit can realize through the simple programming of technical staff in this field, belongs to the common general knowledge in this field, only uses it, does not improve it, and the utility model discloses mainly be used for protecting mechanical device, so the utility model discloses no longer detail control mode and circuit connection are repeated.
The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.
Claims (7)
1. A detection device for integrated circuit packaging molds, comprising a worktable (1), characterized in that: the device is characterized in that a vertical plate (2) is arranged on the left side of the top of a workbench (1), a controller (3) is arranged in the middle of the front side end of the vertical plate (2), a top plate (4) is arranged on the top of the vertical plate (2), an alarm (5) is arranged on the left side of the top plate (4), a positioning driving cylinder (6) is fixedly inserted and connected on the right side of the top plate (4), a positioning disc (7) is arranged at the piston rod end of the positioning driving cylinder (6), a placing plate (8) is arranged in the middle of the top of the workbench (1), fixing plates (9) are symmetrically arranged on the top of the workbench (1) and positioned around the placing plate (8), detection driving cylinders (10) are symmetrically inserted and connected on the upper portions of the fixing plates (9), pressure sensors (11) are arranged on the piston rod ends of the detection driving cylinders (10), and detection pressure heads (12) are arranged at one ends, and an LED liquid crystal display screen (13) is embedded in the middle of the front side end of the workbench (1).
2. The inspection apparatus of claim 1, wherein: the bottom of the workbench (1) is plated with a zinc-nickel alloy layer.
3. The inspection apparatus of claim 1, wherein: the vertical plate (2) and the top plate (4) are both made of Q235 steel.
4. The inspection apparatus of claim 1, wherein: the alarm (5) is a buzzer alarm (5).
5. The inspection apparatus of claim 1, wherein: the number that fixed plate (9) set up is four groups, and be the symmetric distribution in place board (8) all around.
6. The inspection apparatus of claim 1, wherein: the positioning disc (7) is located right above the placing plate (8), the bottom of the positioning disc (7) and the top of the placing plate (8) are both provided with anti-slip pads, and the anti-slip pads are made of silica gel materials with anti-slip protrusions.
7. The inspection apparatus of claim 1, wherein: the type of pressure sensor (11) is MPX2200, the type of controller (3) is HAD-SC200, just controller (3) respectively with alarm (5) location drive actuating cylinder (6) detect drive actuating cylinder (10) pressure sensor (11) with LED liquid crystal display (13) electric connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020263400.2U CN211376591U (en) | 2020-03-06 | 2020-03-06 | Detection device for integrated circuit packaging mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020263400.2U CN211376591U (en) | 2020-03-06 | 2020-03-06 | Detection device for integrated circuit packaging mold |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211376591U true CN211376591U (en) | 2020-08-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020263400.2U Expired - Fee Related CN211376591U (en) | 2020-03-06 | 2020-03-06 | Detection device for integrated circuit packaging mold |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211376591U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113933686A (en) * | 2021-10-13 | 2022-01-14 | 深圳台达创新半导体有限公司 | Detection equipment for integrated circuit packaging finished product |
| CN114530392A (en) * | 2022-04-24 | 2022-05-24 | 山东中策新能源有限公司 | Hardness detection device for photovoltaic backboard |
-
2020
- 2020-03-06 CN CN202020263400.2U patent/CN211376591U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113933686A (en) * | 2021-10-13 | 2022-01-14 | 深圳台达创新半导体有限公司 | Detection equipment for integrated circuit packaging finished product |
| CN113933686B (en) * | 2021-10-13 | 2023-10-03 | 深圳台达创新半导体有限公司 | Detection equipment for integrated circuit packaging finished product |
| CN114530392A (en) * | 2022-04-24 | 2022-05-24 | 山东中策新能源有限公司 | Hardness detection device for photovoltaic backboard |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200828 Termination date: 20210306 |