CN112297546A - Preparation method of display panel - Google Patents

Preparation method of display panel Download PDF

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Publication number
CN112297546A
CN112297546A CN201910672787.9A CN201910672787A CN112297546A CN 112297546 A CN112297546 A CN 112297546A CN 201910672787 A CN201910672787 A CN 201910672787A CN 112297546 A CN112297546 A CN 112297546A
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CN
China
Prior art keywords
thin glass
glass substrate
display panel
carrier
manufacturing
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910672787.9A
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Chinese (zh)
Inventor
李青
李赫然
崔海舰
史伟华
李保臣
常慧
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dongxu Optoelectronic Technology Co Ltd
Original Assignee
Dongxu Optoelectronic Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dongxu Optoelectronic Technology Co Ltd filed Critical Dongxu Optoelectronic Technology Co Ltd
Priority to CN201910672787.9A priority Critical patent/CN112297546A/en
Publication of CN112297546A publication Critical patent/CN112297546A/en
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1284—Application of adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/16—Drying; Softening; Cleaning
    • B32B38/164—Drying
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
    • B32B2037/268—Release layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/16—Drying; Softening; Cleaning
    • B32B38/164—Drying
    • B32B2038/166—Removing moisture
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Nonlinear Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Mathematical Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Joining Of Glass To Other Materials (AREA)

Abstract

The invention relates to the technical field of display panel manufacturing, and discloses a preparation method of a display panel, which comprises the following steps: step S10: respectively attaching two thin glass substrates (10) to two carrier plates (12) capable of supporting the thin glass substrates (10); step S20: bonding the thin glass substrate (10) and the carrier plate (12) together using a bonding agent; step S30: respectively depositing corresponding film layers on the surfaces, deviating from the carrier plate (12), of the thin glass substrates (10), and then oppositely arranging the two film layers deposited thin glass substrates (10) to prepare a display panel; step S40: heating the adhesive causes the adhesive to evaporate to remove the carrier sheet (12). The preparation method of the display panel can effectively remove the adhesive, so that the adhesive is basically free of residues.

Description

Preparation method of display panel
Technical Field
The invention relates to the technical field of display panel manufacturing, in particular to a preparation method of a display panel.
Background
With the increasing demand for the lightness and thinness of mobile terminals, the lightness and thinness of display panels applied to mobile phones, wearable devices and vehicle-mounted displays also become a trend, and therefore, the lightness and thinness of glass substrates used for manufacturing the display panels are also required. At present, in order to obtain a light and thin display panel, a series of processes such as exposure and etching are performed on a glass substrate to prepare a display panel, and then surfaces of two glass substrates constituting the display panel are thinned to thin the display panel. Since the thinning is usually performed by a chemical method, the environmental pollution is large, and the thinning needs cleaning and other steps, so that the manufacturing cost of the light and thin display panel is high.
Therefore, more and more panel factories bear thin glass substrates on the carrier plates, then carry out a series of processes such as exposure, etching and the like to prepare displays, and finally remove the carrier plates. In order to combine the thin glass substrate and the carrier plate, an adhesive is usually selected to bond the thin glass substrate and the carrier plate together, so that the adhesive needs to be removed first in the process of removing the carrier plate, however, the adhesive is difficult to remove and is very easy to remain on the thin glass substrate, which not only brings difficulty to the operation of removing the carrier plate, but also affects the display effect of the display panel due to the residual adhesive.
Disclosure of Invention
The invention aims to overcome the problem that the display effect of a display panel is influenced by the residual of an adhesive for adhering a thin glass substrate and a carrier plate together in the prior art, and provides a preparation method of the display panel.
In order to achieve the above object, an aspect of the present invention provides a method for manufacturing a display panel, including:
step S10: respectively attaching two thin glass substrates to two carrier plates capable of supporting the thin glass substrates;
step S20: bonding the thin glass substrate and the carrier plate together using a bonding agent;
step S30: depositing corresponding film layers on the surfaces, deviating from the carrier plate, of the thin glass substrates respectively, and then oppositely arranging the two thin glass substrates with the film layers deposited and preparing to obtain a display panel;
step S40: heating the adhesive to evaporate the adhesive to remove the carrier plate.
In the technical scheme, the thin glass substrate and the carrier plate capable of supporting the thin glass substrate are bonded together, so that the thin glass substrate can be supported, a display panel can be prepared by performing process steps such as film deposition and the like when the thin glass substrate is used, for example, the glass substrate with the thickness not greater than 0.2mm, the display panel is prepared without using a thick glass substrate, then the thick glass substrate is thinned to be less than 0.2mm by adopting a chemical method, and after the display panel is prepared, the carrier plate can be removed by heating the binder to enable the binder to be gasified and evaporated, so that the binder is not easy to remain on the display panel to influence the display effect of the display panel, and meanwhile, the carrier plate removing mode is simple and is convenient for repeated operation. In addition, the gas generated by the gasification of the binder can destroy the vacuum state between the thin glass substrate and the carrier plate, so that the thin glass substrate and the carrier plate can be separated more easily, the thin glass substrate is prevented from being cracked in the separation process, and in addition, the carrier plate can be recycled due to the fact that the binder is removed cleanly.
Preferably, in the step S40, the adhesive is heated using a laser generator.
Preferably, the power of the laser generator is set at 10-50W.
Preferably, in step S10, a glass substrate is used as the carrier.
Preferably, in the step S10: using a glass substrate having a thickness of not more than 0.2mm as the thin glass substrate; and/or
A glass substrate with the thickness not less than 0.3mm is used as the carrier plate.
Preferably, the thin glass substrate used has an expansion amount, light transmittance and young's modulus similar to or the same as those of the carrier.
Preferably, in the step S10, the thin glass substrates are attached to the respective carrier plates in a vacuum atmosphere.
Preferably, in the step S10: so that the size of the thin glass substrate is the same as that of the carrier plate or the size of the thin glass substrate is smaller than that of the carrier plate, and the thin glass substrate is completely supported on the carrier plate in the attaching process.
Preferably, in the step S20, the adhesive is applied to the periphery of the thin glass substrate to encapsulate the gap between the periphery of the thin glass substrate and the carrier plate.
Preferably, the applied adhesive has a thickness of not more than 10 μm.
Drawings
Fig. 1 is a schematic flow chart of a method for manufacturing a display panel according to a preferred embodiment of the present invention;
fig. 2 is a schematic structural view of step S10 in the method for manufacturing a display panel according to the preferred embodiment of the present invention.
Fig. 3 is a schematic structural diagram of step S10 in the method for manufacturing a display panel according to another preferred embodiment of the present invention.
Description of the reference numerals
10-a thin glass substrate; 12-a carrier plate.
Detailed Description
In the present invention, the use of directional terms such as "upper, lower, left and right" in the absence of a contrary explanation generally means that the directions shown in the drawings and the practical application are considered to be the same, and "inner and outer" mean the inner and outer of the outline of the component.
The present invention provides a method for manufacturing a display panel, as shown in fig. 1, including: step S10: the two thin glass substrates 10 are respectively attached to two carrier plates 12 capable of supporting the thin glass substrates 10, and it can be understood that the two thin glass substrates 10 constituting the display panel are respectively attached to the corresponding carrier plates 12 capable of supporting the thin glass substrates 10; step S20: bonding the thin glass substrate 10 and the carrier plate 12 together using a bonding agent; step S30: depositing corresponding film layers on the surfaces, which are far away from the carrier plate 12, of the thin glass substrates 10, and then opposing the two thin glass substrates 10 on which the film layers are deposited and preparing a display panel, it is to be noted that the method for preparing the display panel is not particularly limited herein, and the display panel can be prepared by using the existing method, for example, in the process of depositing the film layers, corresponding materials can be selectively deposited on the corresponding thin glass substrates 10, then related patterns are defined by a photolithography process, then etching is performed, and finally the corresponding film layers are obtained, and finally the two thin glass substrates 10 on which the film layers are deposited are opposed, and a liquid crystal material is filled between the two thin glass substrates 10, and the like, and then the display panel is prepared, and the processes are the existing processes and are not described herein again; step S40: the adhesive is heated so that the adhesive evaporates to remove the carrier plate 12. The thin glass substrate 10 and the carrier plate 12 which can support the thin glass substrate 10 are bonded together, so that the thin glass substrate 10 can be supported, a display panel can be prepared by performing process steps such as film deposition and the like when a thin glass substrate is used, for example, a glass substrate with the thickness not greater than 0.2mm, without using a thick glass substrate, the thick glass substrate is thinned to be less than 0.2mm by adopting a chemical method, and after the display panel is prepared, the carrier plate 12 can be removed by heating the binder to evaporate the binder in a gasification manner, so that the binder is not easy to remain on the display panel to influence the display effect of the display panel, and meanwhile, the carrier plate 12 is simple to remove and convenient to repeat operation. In addition, the gas generated by the gasification of the adhesive may destroy the vacuum state between the thin glass substrate 10 and the carrier 12, so that the separation of the thin glass substrate 10 and the carrier 12 is easier, the thin glass substrate 10 is prevented from being broken during the separation process, and in addition, the carrier 12 may be recycled due to the cleaner removal of the adhesive, as shown in fig. 1, the method for manufacturing the display panel may include step S50: the recycling carrier 12 may be used again in step S10 directly or after being simply cleaned and dried. Here, the kind of the adhesive is not particularly limited as long as the thin glass substrate 10 and the corresponding carrier plate 12 can be adhered together and vaporized after being heated. It should also be noted that the shape of the thin glass substrate 10 matches the shape of the carrier 12, for example, when the thin glass substrate 10 is plate-shaped, the carrier 12 is also plate-shaped to provide better support for the thin glass substrate 10, and when the thin glass substrate 10 is curved, the carrier 12 is also correspondingly curved to provide better support for the thin glass substrate 10. Of course, the thin glass substrate 10 may have other shapes, and correspondingly, the carrier 12 may have a corresponding shape so as to fit the two together to better support the thin glass substrate 10.
In order to facilitate the deposition of the film on the corresponding thin glass substrate 10, in step S10, a glass substrate is preferably used as the carrier 12. In addition, in the step S10, a glass substrate with a thickness not less than 0.3mm may be used as the carrier 12, so that a better supporting effect can be provided for the thin glass substrate 10 on the premise of facilitating the deposition of the film layer on the corresponding thin glass substrate 10.
As shown in fig. 2 and fig. 3, in the step S10, the thin glass substrate 10 and the carrier plate 12 may have the same size, and the size of the thin glass substrate 10 may also be smaller than that of the carrier plate 12, so that the thin glass substrate 10 is completely supported on the carrier plate 12 during the attaching process, and thus the carrier plate 12 may perform a better supporting function on the thin glass substrate 10.
Preferably, the mechanical properties of the thin glass substrate 10 and the carrier 12, such as the expansion amount, the transmittance and the young's modulus, are similar or identical, and it should be noted that, taking the expansion amount as an example, the "similar" here can be understood that when the expansion amounts of the thin glass substrate 10 and the carrier 12 are different by plus or minus 0.1% to 2%, the expansion amounts of the two can be considered to be similar; in addition, when the light transmittance of the thin glass substrate 10 and the carrier 12 is different by plus or minus 0.1% -2%, the light transmittance of the two is considered to be similar; similarly, when the difference between the young's moduli of the thin glass substrate 10 and the carrier 12 is 0.1% to 2%, the young's moduli of the two are considered to be similar. By making the mechanical properties of the thin glass substrate 10 and the carrier 12 similar or identical, the probability that the thin glass substrate 10 is damaged during the bonding process and the process of manufacturing the display panel can be reduced.
For better and more convenient removal of the adhesive, in the step S40, the adhesive may be heated by a laser generator, and the adhesive may be heated, vaporized and evaporated by the laser generator, so that the thin glass substrate 10 and the carrier plate 12 may be separated from each other. Wherein the power of the laser generator can be set to 10-50W, so that the adhesive can be effectively removed without damaging the glass.
In addition, in the step S10, the thin glass substrate 10 may be attached to the corresponding carrier plate 12, preferably in a vacuum atmosphere, so that the thin glass substrate 10 and the carrier plate 12 may be attached more closely.
As shown in fig. 2 and 3, in the step S20, the adhesive may be applied to the periphery of the thin glass substrate 10 to encapsulate the gap between the periphery of the thin glass substrate 10 and the carrier plate 12. It will be appreciated that the use of said adhesive not only allows a firm bonding together of the thin glass substrate 10 and the respective carrier plate 12, but also protects the vacuum environment between the thin glass substrate 10 and the respective carrier plate 12.
In order to achieve both of the strong adhesion and the easy removal of the adhesive, the thickness of the applied adhesive may be made not more than 10 μm, and furthermore, the thickness of the applied adhesive is set within the above range, and the gap between the periphery of the thin glass substrate 10 and the carrier plate 12 may be sealed, so that air is not substantially allowed to enter the vacuum environment between the thin glass substrate 10 and the carrier plate 12.
The preferred embodiments of the present invention have been described in detail above with reference to the accompanying drawings, but the present invention is not limited thereto. Within the scope of the technical idea of the invention, numerous simple modifications can be made to the technical solution of the invention, including combinations of the individual specific technical features in any suitable way. The invention is not described in detail in order to avoid unnecessary repetition. Such simple modifications and combinations should be considered within the scope of the present disclosure as well.

Claims (10)

1. A method for manufacturing a display panel, comprising:
step S10: respectively attaching two thin glass substrates (10) to two carrier plates (12) capable of supporting the thin glass substrates (10);
step S20: bonding the thin glass substrate (10) and the carrier plate (12) together using a bonding agent;
step S30: respectively depositing corresponding film layers on the surfaces, deviating from the carrier plate (12), of the thin glass substrates (10), and then oppositely arranging the two film layers deposited thin glass substrates (10) to prepare a display panel;
step S40: heating the adhesive causes the adhesive to evaporate to remove the carrier sheet (12).
2. The method of manufacturing a display panel according to claim 1, wherein in the step S40, the adhesive is heated using a laser generator.
3. The method of manufacturing a display panel according to claim 2, wherein the power of the laser generator is set to 10 to 50W.
4. The method of manufacturing a display panel according to claim 1, wherein in step S10, a glass substrate is used as the carrier (12).
5. The method for manufacturing a display panel according to claim 4, wherein in the step S10: using a glass substrate having a thickness of not more than 0.2mm as the thin glass substrate (10); and/or
A glass substrate having a thickness of not less than 0.3mm is used as the carrier plate (12).
6. The method for manufacturing a display panel according to claim 5, wherein the thin glass substrate (10) used has an expansion amount, a light transmittance, and a Young's modulus similar to or the same as those of the carrier (12).
7. The method of manufacturing a display panel according to claim 1, wherein in the step S10, the thin glass substrates (10) are bonded to the respective support plates (12) in a vacuum atmosphere.
8. The method for manufacturing a display panel according to claim 1, wherein in the step S10: the thin glass substrate (10) and the carrier plate (12) are made to have the same size or the size of the thin glass substrate (10) is smaller than the size of the carrier plate (12), so that the thin glass substrate (10) is completely supported on the carrier plate (12) during the attaching process.
9. The method of manufacturing a display panel according to any one of claims 1 to 8, wherein in the step S20, the adhesive is applied to the periphery of the thin glass substrate (10) to encapsulate the gap between the periphery of the thin glass substrate (10) and the carrier board (12).
10. The method of manufacturing a display panel according to claim 9, wherein the applied adhesive has a thickness of not more than 10 μm.
CN201910672787.9A 2019-07-24 2019-07-24 Preparation method of display panel Pending CN112297546A (en)

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Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110026236A1 (en) * 2008-04-17 2011-02-03 Asahi Glass Company, Limited Glass laminate, display panel with support, method for producing glass laminate and method for manufacturing display panel with support
CN102637577A (en) * 2011-04-02 2012-08-15 京东方科技集团股份有限公司 Preparation method of display device
US20140051192A1 (en) * 2012-08-17 2014-02-20 Samsung Display Co., Ltd. Method and carrier substrate for manufacturing display device
WO2014031372A1 (en) * 2012-08-22 2014-02-27 Corning Incorporated Processing flexible glass substrates
CN105355591A (en) * 2015-10-12 2016-02-24 武汉华星光电技术有限公司 Manufacturing method of flexible display substrate
CN105722798A (en) * 2013-08-29 2016-06-29 康宁股份有限公司 Method of separating glass sheet from carrier
JP2017024368A (en) * 2015-07-27 2017-02-02 パナソニックＩｐマネジメント株式会社 Laminated body and method for manufacturing the same, and electronic device and method for manufacturing the same
CN106444130A (en) * 2016-12-26 2017-02-22 武汉华星光电技术有限公司 Display panel manufacturing method
CN106773206A (en) * 2016-12-26 2017-05-31 武汉华星光电技术有限公司 The manufacture method of display panel

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110026236A1 (en) * 2008-04-17 2011-02-03 Asahi Glass Company, Limited Glass laminate, display panel with support, method for producing glass laminate and method for manufacturing display panel with support
CN102007524A (en) * 2008-04-17 2011-04-06 旭硝子株式会社 Glass laminate, display panel with support, method for producing glass laminate and method for manufacturing display panel with support
CN102637577A (en) * 2011-04-02 2012-08-15 京东方科技集团股份有限公司 Preparation method of display device
US20140051192A1 (en) * 2012-08-17 2014-02-20 Samsung Display Co., Ltd. Method and carrier substrate for manufacturing display device
WO2014031372A1 (en) * 2012-08-22 2014-02-27 Corning Incorporated Processing flexible glass substrates
CN105722798A (en) * 2013-08-29 2016-06-29 康宁股份有限公司 Method of separating glass sheet from carrier
JP2017024368A (en) * 2015-07-27 2017-02-02 パナソニックＩｐマネジメント株式会社 Laminated body and method for manufacturing the same, and electronic device and method for manufacturing the same
CN105355591A (en) * 2015-10-12 2016-02-24 武汉华星光电技术有限公司 Manufacturing method of flexible display substrate
CN106444130A (en) * 2016-12-26 2017-02-22 武汉华星光电技术有限公司 Display panel manufacturing method
CN106773206A (en) * 2016-12-26 2017-05-31 武汉华星光电技术有限公司 The manufacture method of display panel

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Application publication date: 20210202