CN110211465A - A kind of immune antiboidy intelligent teaching device - Google Patents
A kind of immune antiboidy intelligent teaching device Download PDFInfo
- Publication number
- CN110211465A CN110211465A CN201910547688.8A CN201910547688A CN110211465A CN 110211465 A CN110211465 A CN 110211465A CN 201910547688 A CN201910547688 A CN 201910547688A CN 110211465 A CN110211465 A CN 110211465A
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- China
- Prior art keywords
- disulfide bond
- domain component
- structural domain
- processor
- immune antiboidy
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- 230000008520 organization Effects 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 3
- 238000001514 detection method Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 8
- 230000006870 function Effects 0.000 description 3
- 229920001184 polypeptide Polymers 0.000 description 3
- 102000004196 processed proteins & peptides Human genes 0.000 description 3
- 108090000765 processed proteins & peptides Proteins 0.000 description 3
- RBORURQQJIQWBS-QVRNUERCSA-N (4ar,6r,7r,7as)-6-(6-amino-8-bromopurin-9-yl)-2-hydroxy-2-sulfanylidene-4a,6,7,7a-tetrahydro-4h-furo[3,2-d][1,3,2]dioxaphosphinin-7-ol Chemical compound C([C@H]1O2)OP(O)(=S)O[C@H]1[C@@H](O)[C@@H]2N1C(N=CN=C2N)=C2N=C1Br RBORURQQJIQWBS-QVRNUERCSA-N 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 239000005864 Sulphur Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 210000004556 brain Anatomy 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001900 immune effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 238000003032 molecular docking Methods 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09B—EDUCATIONAL OR DEMONSTRATION APPLIANCES; APPLIANCES FOR TEACHING, OR COMMUNICATING WITH, THE BLIND, DEAF OR MUTE; MODELS; PLANETARIA; GLOBES; MAPS; DIAGRAMS
- G09B23/00—Models for scientific, medical, or mathematical purposes, e.g. full-sized devices for demonstration purposes
- G09B23/28—Models for scientific, medical, or mathematical purposes, e.g. full-sized devices for demonstration purposes for medicine
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09B—EDUCATIONAL OR DEMONSTRATION APPLIANCES; APPLIANCES FOR TEACHING, OR COMMUNICATING WITH, THE BLIND, DEAF OR MUTE; MODELS; PLANETARIA; GLOBES; MAPS; DIAGRAMS
- G09B5/00—Electrically-operated educational appliances
- G09B5/04—Electrically-operated educational appliances with audible presentation of the material to be studied
Abstract
It include several structural domain components, interchain disulfide bond and disulfide bond the invention discloses a kind of immune antiboidy intelligent teaching device, the encoded signal of memory domain component, processor reads the encoded signal in memory and encoded signal is sent to contact pair, the signal of simultaneous processor detection contact pair simultaneously judges, and then controls loudspeaker and make a sound.The signal that interchain disulfide bond and disulfide bond are issued for processor in connection structure domain component and transferring structure domain component, when two structural domain components mutually splice or are spliced by interchain disulfide bond and disulfide bond, processor in structural domain component receives the encoded signal of other side and judges whether this connecting method is correct, and then controls loudspeaker and issue corresponding sound.All structural domain components are assembled into immune antiboidy model after correctly splicing, the structure of immune antiboidy model is showed student with specific material object, deepens understanding of the student to antibody structure by the present invention, keep immune antiboidy teaching no longer abstract.
Description
Technical field
Teaching mode when imparting knowledge to students the present invention relates to teaching mode more particularly to antibody.
Background technique
" antibody " this chapters and sections are the most important thing of " immunological test " rudimentary knowledge, structure, functional areas, each function of antibody
The function in area is the knowledge point for requiring to grasp, and the grasp ability of the student knowledge of School of High Profession Technology is limited, and learning initiative is not very
Height, simple text add picture not vivid enough, and many students in mist, know after finishing antibody or in cloud so that influence is subsequent
The understanding of knowledge.Antibody basic structure is made of 4 polypeptide chains, and links shape by disulfide bond in varying numbers between polypeptide chain
At " Y " character form structure, polypeptide chain is formed by structural domain VH, CH1, CH2, CH3, CL and VL each two, and structure interchain part exists
Interchain disulfide bond.
In teaching now, antibody basic structure is main or oral explanation, or some PPT pictures of auxiliary, or draws
Figure, can not concrete image the architectural characteristic that antibody is shown to student, Most students can only all be imagined as one by brain
Three-dimensional antibody, different people's imagination is different, will one antibody structure of a people, although being almost identical in structure
, but always difference, such classmates exchange not only inconvenient or even also have error, and What is more can not also lead to
Cross two-dimentional antibody image recognition antibody.
Summary of the invention
In order to solve student to the basic structure of immune antiboidy, the function of functional areas as abstract and caused by be difficult to understand
And grasp, while improving the interest of study, the present invention proposes a kind of immune antiboidy intelligent teaching device, six kinds of structural domain VH,
CH1, CH2, CH3, CL and VL are designed to unified structural domain component, set in this structural domain component power supply, memory, processor,
If loudspeaker and dry contact pair, the encoded signal of memory domain component, represent six kinds of structural domain VH, CH1, CH2,
One of which in CH3, CL and VL, processor read the encoded signal in memory and encoded signal are sent to contact pair,
The signal of simultaneous processor detection contact pair simultaneously judges, and then controls loudspeaker and make a sound.Interchain disulfide bond and two sulphur
The signal that key is issued for processor in connection structure domain component and transferring structure domain component, when two structural domain components are mutually spelled
When connecing or being spliced by interchain disulfide bond and disulfide bond, the processor in structural domain component receives encoded signal and the judgement of other side
Whether this connecting method is correct, and then controls loudspeaker and issue corresponding sound, and student is guided correctly to be assembled into step by step completely
And correct immune antiboidy model.
The invention has the beneficial effects that student can be deepened by splicing structure domain component of starting to different structure territory portion
The impression of part keeps immune antiboidy teaching no longer abstract to deepen memory and understanding to immune antiboidy basic structure, allows student
It is easier to understand and is grasped the basic structure and relevant knowledge of immune antiboidy, improves the learning initiative of student.
Detailed description of the invention
Fig. 1 is structural domain part structure diagram;
Fig. 2 is that circuit and its element schematic are set in structural domain component;
Fig. 3 is interchain disulfide bond structure and circuit diagram;
Fig. 4 is disulfide bond pattern and circuit diagram;
Fig. 5 is immune antiboidy basic block diagram.
Specific embodiment
Immune antiboidy basic structure includes six kinds of structural domains VH, CH1, CH2, CH3, CL and VL, and for connecting difference
The interchain disulfide bond and disulfide bond of structural domain, six kinds of structural domains are arranged by ad hoc fashion and are connected by interchain disulfide bond with disulfide bond
It forms " Y " shape structure and preferably remembers and understand immune antiboidy basic structure, this reality to allow student by way of splicing
It applies example and six kinds of structural domains VH, CH1, CH2, CH3, CL and VL is designed to unified structural domain component, different structural domain components
It is distinguished by label, such design can form a variety of structural domains as playing with building blocks and splice and combine, and be convenient for student
It continuously attempts to, repeatedly practises, only correctly splice immune antiboidy model as student and just prompt to complete to splice.
Structural domain part structure diagram structural domain component 1 as shown in Fig. 1 includes label 101, several notches 102 and flange
103.The mark content of label 101 is one of which in six kinds of structure field marks VH, CH1, CH2, CH3, CL and VL, for uniting
Different structure territory is distinguished in the design of one structural domain component 1.Several notches 102 and flange 103 are set to the four of structural domain component 1
Week, flange 103 are matched with notch 102 for bumps, and flange 103 can be inserted into notch 102, are conducive between structural domain component 1 in this way
Docking, can play the role of fastening between structural domain component.
Circuit and its element schematic are set in structural domain component as shown in Fig. 2, are equipped with power supply in structural domain component 1
If 109, memory 107, processor 106, loudspeaker 108 and dry contact are to 110.Power supply 109 provides processor 106, memory
107 and loudspeaker 108 needed for electric energy.Contact is set in attached notch shown in FIG. 1 102 and flange 103 to 110, and each slot
Mouth 102 and flange 103 have corresponding contact to 110.The encoded signal of 107 storage organization domain component 1 of memory, this coding letter
Number represent one of in six kinds of structural domains VH, CH1, CH2, CH3, CL and VL, encoded signal can be by processor 106 from storage
It is read in device 107, and the contact by being connected with processor is sent in other structures domain component 1 to 110, is finally tied by other
Processor 106 in structure domain component 1 receives.After processor 106 receives the encoded signal of the sending of other structures domain component 1, knot
It compiles in collaboration with code signal and is received from the contact of that notch 102 or flange 103 to 110, synthesis judge between structural domain component
Whether splicing is correct, and processor 106 controls loudspeaker 108 and issues the correct prompt tone of splicing if splicing correctly, such as splices not
Correct then processor 106 controls the prompt tone that loudspeaker 108 issues splicing failure, allows student to reattempt to and splices other label marks
The structural domain component 1 shown.
Interchain disulfide bond structure as shown in Fig. 3 and circuit diagram, interchain disulfide bond 2 show rectilinear form, are equipped with
Two flanges 103 and two contacts are to 110.Contact is set in flange 103 to 110, and each flange 103 has corresponding touching
O'clock to 110.Two contacts are to having circuit connection between 110.The flange 103 of interchain disulfide bond 2 can be inserted into the structure such as attached drawing 1
In any one notch 102 in domain component 1, while the contact in interchain disulfide bond 2 is to the touching in 110 and structural domain component 1
It o'clock contacts with each other to 110, forms circuit connection, this circuit connection plays the work of the encoded signal between transferring structure domain component 1
With.
Disulfide bond pattern and circuit diagram as shown in Fig. 4, disulfide bond 3 show " H " word shape, set there are four flange
103 and four contacts to 110.Contact is set in flange 103 to 110, and each flange 103 has corresponding contact to 110.
Four flanges 103 in disulfide bond 3 are located at four angles of " H " word shape, and two flanges 103 in left side are one group, while its is right
There is circuit connection, similarly, two flanges 103 on right side are another group, corresponding two between two contacts 110 answered
Also there is circuit connection between contact 110.The flange 103 of disulfide bond 3 can be inserted into any in the structural domain component 1 such as attached drawing 1
In one notch 102, while the contact in disulfide bond 3 contacts with each other to the contact in 110 and structural domain component 1 to 110, is formed
Circuit connection, this circuit connection play the role of the encoded signal between transferring structure domain component 1.
Immune antiboidy basic block diagram as shown in Fig. 5, immune antiboidy basic structure 100 have 12 structural domain portions
1, two interchain disulfide bond 2 of part and a disulfide bond 3.The label 101 of structural domain component 1 indicate VH, CH1, CH2, CH3, CL and
VL symbol, and every kind of symbol each two, respectively represents six kinds of structural domains VH, CH1, CH2, CH3, CL and VL each two, and totally ten two
A structural domain.Structural domain component 1, interchain disulfide bond 2 and disulfide bond 3 with different label symbols form as shown in Fig. 3
The splicing for successfully completing immune antiboidy basic structure is represented when particular arrangement.The structural domain component when student continuously attempts to splicing
Processor 106 in 1 is constantly judged, is carried out correct or failure prompt by loudspeaker 108, is promoted student correct in this way
Assembly is adjacent or the structural domain component 1 that is connected by 2/ disulfide bond 3 of interchain disulfide bond, guide student to complete step by step immune anti-
The splicing of body basic structure, when splice complete when, between the processor 106 in all structural domain components 1 by contact to 110 into
Row communication, and judge whether the quantity of structural domain component 1 is correct, whether mutual direct position relationship is correct, all such as both of the above
Correctly, then processor 106 controls loudspeaker 108 and issues the assembled successful prompt tone of immune antiboidy basic structure.
By allowing student by splicing structure domain component 1 of starting in the present embodiment, during structural domain 1 assembly of component into
Row is correctly or the prompt of failure, guidance student complete the successful stitch of immune antiboidy basic structure model 100 step by step, both improved
The learning initiative of student, and make immune antiboidy teaching no longer abstract, allow the student to be easier to understand and grasp immune antiboidy
Basic structure and relevant knowledge, so that student be allowed to deepen memory and understanding to immune antiboidy basic structure.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field
For art personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, made any to repair
Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.
Claims (4)
1. a kind of immune antiboidy intelligent teaching device, which is characterized in that including several structural domain components (1), interchain disulfide bond (2)
With disulfide bond (3);
Power supply (109), memory (107), processor (106), loudspeaker (108) and several are set in the structural domain component (1)
Contact is to (110), electric energy needed for power supply (109) provides processor (106), memory (107) and loudspeaker (108), memory
(107) encoded signal of storage organization domain component (1), processor (106) read the encoded signal in memory (107) and volumes
Code signal is sent to contact to (110), and simultaneous processor (106) detects contact to the signal of (110) and judges, and then controls
Loudspeaker (108) processed makes a sound;
The interchain disulfide bond (2) is equipped with two contacts of intercommunication to (110);
The disulfide bond (3) is equipped with four contacts of two groups of intercommunications to (110);
The interchain disulfide bond (2) and disulfide bond (3) are used for connection structure domain component (1), processing in transferring structure domain component (1)
The signal that device (106) issues, and it is assembled into immune antiboidy basic structure (100).
2. a kind of immune antiboidy intelligent teaching device according to claim 1, it is characterised in that structural domain component (1) also wraps
Label (101), several notches (102) and flange (103) are included, label (101) is fixed on the outside of structural domain component (1), label
(101) one of them of " VL ", " VH ", " CL ", " CH1 ", " CH2 " and " CH3 " can be identified;Notch (102) and flange (103) are set
It is placed in the surrounding of structural domain component (1), flange (103) can be inserted into notch (102), for the company between structural domain component (1)
It connects.
3. a kind of immune antiboidy intelligent teaching device according to claim 2, it is characterised in that interchain disulfide bond (2) is also set
There are two flange (103), flange (103) can be inserted into any one notch (102) in the structural domain component (1), be used for
Connection structure domain component (1).
4. a kind of immune antiboidy intelligent teaching device according to claim 2, it is characterised in that disulfide bond (3) is additionally provided with four
A flange (103), flange (103) can be inserted into any one notch (102) in the structural domain component (1), for connecting
Structural domain component (1).
Priority Applications (1)
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CN201910547688.8A CN110211465B (en) | 2019-06-24 | 2019-06-24 | Immune antibody teaching intelligent device |
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CN201910547688.8A CN110211465B (en) | 2019-06-24 | 2019-06-24 | Immune antibody teaching intelligent device |
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CN110211465B CN110211465B (en) | 2024-02-06 |
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1256277A (en) * | 1968-04-22 | 1971-12-08 | Burroughs Corp | Data processing apparatus |
CN101561880A (en) * | 2009-05-11 | 2009-10-21 | 华北电力大学(保定) | Pattern recognition method based on immune antibody network |
CN210244804U (en) * | 2019-06-24 | 2020-04-03 | 漳州卫生职业学院 | Immune antibody teaching intelligent device |
-
2019
- 2019-06-24 CN CN201910547688.8A patent/CN110211465B/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1256277A (en) * | 1968-04-22 | 1971-12-08 | Burroughs Corp | Data processing apparatus |
CN101561880A (en) * | 2009-05-11 | 2009-10-21 | 华北电力大学(保定) | Pattern recognition method based on immune antibody network |
CN101655911A (en) * | 2009-05-11 | 2010-02-24 | 华北电力大学(保定) | Mode identification method based on immune antibody network |
CN210244804U (en) * | 2019-06-24 | 2020-04-03 | 漳州卫生职业学院 | Immune antibody teaching intelligent device |
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