CN109216235A - Processing unit (plant) - Google Patents
Processing unit (plant) Download PDFInfo
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- CN109216235A CN109216235A CN201810717324.5A CN201810717324A CN109216235A CN 109216235 A CN109216235 A CN 109216235A CN 201810717324 A CN201810717324 A CN 201810717324A CN 109216235 A CN109216235 A CN 109216235A
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- input picture
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- 238000012545 processing Methods 0.000 title claims abstract description 61
- 239000004973 liquid crystal related substance Substances 0.000 description 11
- 235000012431 wafers Nutrition 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 8
- 238000013479 data entry Methods 0.000 description 6
- 238000003754 machining Methods 0.000 description 5
- 238000012216 screening Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 3
- 230000035699 permeability Effects 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Automation & Control Theory (AREA)
- Dicing (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- User Interface Of Digital Computer (AREA)
- Laser Beam Processing (AREA)
Abstract
Processing unit (plant) is provided, the input operation of the mistake of operator is reliably prevented from.The processing unit (plant) includes operation panel, the input picture (66a) of the processing conditions of display input chip；And control unit, each component is controlled, control unit includes input picture register, is registered with input picture (66a)；And masking-out register, it registers masking-out (67a) according to each input picture (66a), the masking-out (67a) will input the defined region overlay of picture (66a) and carry out the input of operator can not, when registering masking-out (67a) to masking-out register, the region (85) covered with masking-out and the region (86) that remove masking-out of input picture (66a) are specified and registered.
Description
Technical field
The present invention relates to processing unit (plant)s, have the operation panel of display input picture.
Background technique
It is generally known following processing unit (plant), using chuck table to various semiconductor wafers, package substrate, ceramics
The machined object of the plates such as substrate is kept, and is carried out using cutting tool, grinding grinding tool or laser beam etc. to machined object
Processing.In this processing unit (plant), there is operation in order to be set to the various processing conditions such as process velocity and machining area
Panel, the input picture which has touch surface board-like (for example, referring to patent document 1).
Patent document 1: Japanese Unexamined Patent Publication 2009-117776 bulletin
In addition, there are following conditions in processing conditions (numerical value, option etc.): can not be according to pre- when the condition of change
Phase implements processing, such as generating causes the fatal processing of wafer breakage etc. bad.It is therefore contemplated that following composition: in order to
Inhibit operator mistakenly to change processing conditions in common production (processing), is arranged to set so-called screen protection
(screen saver) is such to lock picture, input operator can not to input picture entirety.
But at production (processing), although the less input operation there is still a need for input picture, therefore in setting
In the composition for stating locking picture, whenever carrying out input operation, the setting for the picture that unlock, therefore presence can not can
The problem of input operation of mistake is prevented by ground.
Summary of the invention
The present invention has been made in view of the above-described circumstances, and an object thereof is to provide processing unit (plant)s, are reliably prevented from behaviour
The input operation of the mistake of author.
In order to solve the above problems and realize purpose, the present invention is processing unit (plant), includes chuck table, to quilt
Machining object is kept；Unit is processed, the machined object kept to the chuck table is processed；Operation panel,
Display inputs the input picture of the processing conditions of the machined object；And control unit, each component is controlled, it should
Processing unit (plant) is characterized in that the control unit includes input picture register, is registered with multiple input pictures；And
Masking-out register registers masking-out according to each input picture, and the masking-out is by the defined region overlay of the input picture
And cannot achieve the input of operator, when registering the masking-out to the masking-out register, to the input picture illiteracy
It is specified and is registered in the region of version covering.
According to this constitution, masking-out can be set separately in the desired region of each input picture, therefore can reliably prevent
The only input operation of the mistake of operator.In addition, using input picture in the region for not setting masking-out can be realized it is required most
The input of lower bound degree operates, and can be realized the raising of the workability of operator.
In this composition, it is also possible to when the region covered with the masking-out to the input picture or removes the illiteracy
When the region of version is specified, the angle in the region covered with the masking-out or the region that remove the masking-out to the input picture
It is specified and is registered in portion.
Alternatively, it is also possible to be, covered when specifying the predetermined specific region in the input picture to be used as with the masking-out
The region of lid or when removing the region of the masking-out, specifies a part in the specific region and is registered.
Alternatively, it is also possible to be, switching push button is shown in the input picture, which switches to illiteracy for display and hide picture
Face or standard picture, wherein the illiteracy hides picture and is overlapped the display masking-out on the input picture, and the standard picture is not in the input
Overlapping shows the masking-out on picture.
Alternatively, it is also possible to be, the deep or light of color of the masking-out is adjusted, so that setting is shown across the masking-out
The visibility of the input picture.
In accordance with the invention it is possible to which masking-out is set separately in the desired region of each input picture, therefore can reliably prevent
The only input operation of the mistake of operator.In addition, using input picture in the region for not setting masking-out can be realized it is required most
The input of lower bound degree operates, and can be realized the raising of the workability of operator.
Detailed description of the invention
Fig. 1 is the figure for showing the configuration example of laser processing device of present embodiment.
Fig. 2 is the figure for showing the configuration example of display panel.
Fig. 3 is the functional block diagram of control unit.
Fig. 4 is the figure for showing an example of input picture.
The figure that sequence of movement when Fig. 5 is to setting masking-out is illustrated.
The figure that sequence of movement when Fig. 6 is to setting masking-out is illustrated.
The figure that sequence of movement when Fig. 7 is to setting masking-out is illustrated.
The figure that sequence of movement when Fig. 8 is to setting masking-out is illustrated.
The figure that sequence of movement when Fig. 9 is to setting masking-out is illustrated.
The figure that sequence of movement when Figure 10 is the concentration to adjustment masking-out is illustrated.
Figure 11 is the figure being illustrated to sequence of movement when releasing masking-out.
Label declaration
1: laser processing device (processing unit (plant))；10: chuck table；20: laser light irradiation portion (processing unit)；
60: control unit；61: control unit；62: input picture register；63: display control section；64: touch panel control portion；65: covering
Version register；66a~66c: input picture；67a~67c: masking-out；70: operation panel；71: display panel；73: liquid crystal drive
Circuit substrate；74: liquid crystal display panel；75: touch panel；82a:Enter key (specific region)；82b:Exit key (specific region)；
83a: setting/releasing key；83b: switch key (switching push button)；85: masked area (region covered with masking-out)；85a, 85b:
Corner；86: removing the region of masking-out；86a, 86b: corner；88: Password Input frame；90: covering and hide picture；91: standard picture；
100: chip (machined object).
Specific embodiment
Referring to attached drawing, mode for carrying out the present invention (embodiment) is described in detail.The present invention not by
Content documented by following implementation limits.In addition, including those skilled in the art in following documented constituent element
Content, substantially the same content that can be readily apparent that.It can be appropriately combined in addition, being constituted documented by following.In addition, can
With various omissions, displacement or the change constituted without departing from the spirit and scope of the invention.
Fig. 1 is the figure for showing the configuration example of laser processing device of present embodiment.Fig. 2 is the composition for showing display panel
The figure of example.Fig. 3 is the functional block diagram of control unit.As shown in Figure 1, laser processing device (processing unit (plant)) 1 has chucking work
Platform 10 and laser light irradiation portion (processing unit) 20.Laser processing device 1 is laser machined, such as from laser light irradiation
The chip (machined object) 100 that portion 20 keeps chuck table 10 irradiates laser beam, chip 100 is divided into defined
The device chip (not shown) of size.Chip 100 is, for example, semiconductor wafer or optical device wafer.On the front of chip 100
It is clathrate to be formed with a plurality of spacing track (segmentation preset lines), device is respectively formed in each region divided by these spacing tracks
Part.In addition, chip 100 in the form of being held in the wafer cell 103 of cricoid frame 102 by splicing tape 101 to be processed
And conveying.
Laser processing device 1 includes X-axis mobile unit (processing feed unit) 30, makes chuck table 10 along X-axis
Direction (processing direction of feed) is mobile；And Y-axis moving portion (index feed unit) 40, make chuck table 10 along Y-axis
Direction (index feed direction) is mobile.It is configured to make chuck table 10 and laser light irradiation portion 20 above-mentioned as a result,
X-direction and Y direction on relatively move respectively.
Laser processing device 1 has box mounting table 51, loads the 100 (wafer cell of chip to laser processing front and back
103) box 50 stored.In addition, there is laser processing device 1 protective film to form simultaneous cleaning part 52, which forms simultaneous
Cleaning part 52 forms protective film on the chip 100 before laser processing, and protective film is gone from the chip 100 after laser processing
It removes.In addition, laser processing device 1 includes transport unit 53, by the conveying of wafer cell 103 to above-mentioned each position；Control is single
Member 60, integrally controls the movement of laser processing device 1；And operation panel 70, which is carried out
The input of various information operates.The operation panel 70 includes display panel 71, can input various information, and shows each
Kind information；And frame 72, which is kept.
When laser machining to chip 100, chuck table 10 keeps wafer cell 103.Chucking work
Platform 10 includes retaining surface 11, and wafer cell 103 is loaded and attracted；And clamping part 12, in the retaining surface 11
Peripheral side configured with multiple clamping parts 12 and frame 102 is fixed.
The wall portion 3 of apparatus main body 2 is fixed in laser light irradiation portion 20, the chip kept towards chuck table 10
100 (wafer cells 103) irradiate laser beam.Laser light irradiation portion 20 includes oscillator (not shown), vibrates laser out
Light；Condenser (not shown) vibrates laser beam out to the oscillator and assembles；And irradiation head 21, it will
The laser beam assembled is irradiated towards chip 100.Oscillator is according to type, the processing method etc. of chip 100, according to setting in advance
Fixed processing conditions carries out appropriate adjustment to the wavelength (frequency) for the laser beam to be vibrated, output, repetition rate.Irradiation head 21
Can by the optical systems such as condenser in Z-direction (vertical direction) to the converged position (focal position) of laser beam into
Row adjustment.
Condenser is configured to: total reflection mirror, and the direction of travel for vibrating laser beam out to oscillator carries out
Change；And collector lens, laser beam is assembled；Etc..In addition, in the present embodiment, laser light irradiation
Portion 20 has shoot part 22, and the shoot part 22 and irradiation head 21 are arranged side-by-side in the X-axis direction.The shoot part 22 is to chuck work
The camera that configuration state and the machining status of chip 100 etc. for making the chip 100 on platform 10 are shot.
X-axis mobile unit 30 includes ball-screw 31, extends in the X-axis direction；Guide rail 32, with ball-screw 31
It is arranged in parallel；Pulse motor 33 links with one end of ball-screw 31 and rotates ball-screw 31；And sliding panel
34, its underpart is slidably connected with guide rail 32, and in the internal nut (not shown) for having and screwing togather with ball-screw 31.With rolling
The rotation of ballscrew 31, sliding panel 34 are guided and moved in the X-axis direction by guide rails 32.In addition, being fixed on sliding panel 34
Rotary driving part 35 has pulse motor (not shown) in inside, and rotary driving part 35 can be such that chuck table 10 revolves
Angle as defined in turning.In the present embodiment, such as the image of chip 100 according to captured by shoot part 22 makes chuck table
10 (chips 100) rotation, to make cross one another spacing track be respectively facing X-direction and Y direction.
In addition, Y-axis mobile unit 40 includes ball-screw 41, extend in the Y-axis direction；Guide rail 42, with ball wire
Thick stick 41 is arranged in parallel；Pulse motor 43 links with one end of ball-screw 41 and rotates ball-screw 41；And it is sliding
Movable plate 44, its underpart are slidably connected with guide rail 42, and have the nut (not shown) screwed togather with ball-screw 41 in inside, with
The rotation of ball-screw 41, sliding panel 44 guided and moved in the Y-axis direction by guide rail 42.It is equipped on sliding panel 44
The X-axis mobile unit 30 stated, with the movement of the Y direction of sliding panel 44, X-axis mobile unit 30 also moves in the same direction.
Box 50 can store multiple above-mentioned wafer cells 103.Box mounting table 51 is set in a manner of going up and down in the Z-axis direction freely
Apparatus main body 2.
As shown in Fig. 2, display panel 71 possessed by operation panel 70 has liquid crystal display drive circuit substrate 73, liquid crystal display panel
74 and touch panel 75, they are according to the sequence laminated configuration.Touch panel 75 is for example using the touch surface of resistive film mode
Plate, transparency (light permeability) is high, so as to across the display of touch panel 75 and visuognosis liquid crystal display panel 74.Cause
This, when showing the input picture and operation screen for setting various processing conditions on liquid crystal display panel 74, by with finger
Point etc. thus allows for various operations to 75 touch operation of touch panel (such as click, sliding (swipe) etc.).In addition,
It can replace above-mentioned liquid crystal display panel 74, for example organic EL (Electro-Luminescence: the electroluminescent) panel of use etc..
As shown in figure 3, control unit 60 has control unit 61 and input picture register 62.Control unit 61 includes display
Control unit 63 controls liquid crystal display panel 74 by liquid crystal display drive circuit substrate 73；And touch panel control portion 64,
According to the touch operation of touch panel 75, the movement in each portion is controlled.Display control section 63 makes multiple figure layers be overlapped in liquid
Crystal panel 74 and shown.In the present embodiment, display control section 63 make the figure layer (masking-out) of masking-out overlap show it is each
It is shown in the figure layer of the input picture of the image of kind input picture, wherein the figure layer of the masking-out, which is shown, will input picture
The image of the defined region overlay in face.The figure layer of masking-out is located above compared with the figure layer of input picture, for operator
Speech sees the figure layer of the masking-out in the nearby side of the figure layer of input picture.Therefore, the defined area of picture will be inputted by masking-out
Domain covering.
Display control section 63 be configured to the color of the figure layer of the Chong Die masking-out of the input figure layer of picture into
Row is adjusted and is shown.Accordingly, when keeping the color of figure layer of masking-out denseer, the area for being provided with masking-out can be easily identified out
The region in domain and not set masking-out.In addition, can be improved and shown across masking-out when making the paler colour of figure layer of masking-out
Input the visibility of picture.In addition, display control section 63 can be Chong Die with the input figure layer of picture to the figure layer of masking-out is made
And the illiteracy shown hides picture and the standard picture for the figure layer for only showing input picture switches over display.In standard picture, show
Show that control unit 63 easily verifies that input picture and enabling the figure layer of masking-out to be shown as transparent.
Touch panel control portion 64 is according to the operation button and the touch of numerical value input unit that are shown in input picture or defeated
Enter operation, each portion is controlled.Indicate touch panel 75 face on touch position coordinate information as touch information and
It is transferred to touch panel control portion 64, can identify the touch position on touch panel 75.In this composition, touch panel control
Portion 64 does not receive the operation to the region for being provided with masking-out, so that making the input of operator cannot achieve.
Input picture register 62 is registered with the input of processing conditions when laser machining for inputting to chip 100
Picture 66a, 66b, 66c.In the present embodiment, for ease of description, make the quantity three for inputting picture 66a, 66b, 66c
It is a, but can of course be suitably changed according to the quantity of processing conditions.According in each manufacturing procedure each processing conditions (1,
2,3) multiple input picture 66a~66c are registered with.Display control section 63 is by input picture corresponding with performed processing conditions
The input picture figure layer of 66a~66c is shown on liquid crystal display panel 74.
Inputting picture register 62 has masking-out register 65.The masking-out register 65 is registered with and multiple input pictures
Masking-out 67a~67c that 66a~66c is specified in association.These masking-outs 67a~67c and input picture 66a~66c mono- are a pair of
It answers, can be set according to each input picture.It is being registered with masking-out 67a~67c corresponding with input picture 66a~66c
In the case where, display control section 63 makes the figure layer of corresponding masking-out 67a~67c overlap in the figure layer of input picture and carry out
Display.Masking-out 67a~67c prevents operator from mistakenly carrying out input operation to input picture, such as by production management department
Masking-out setting person is set.
Then, the set action of masking-out is illustrated.Fig. 4 is the figure for showing an example of input picture.Fig. 5~Fig. 9 is
The figure that sequence of movement when to setting masking-out is illustrated.In Fig. 4, input picture 66a is divided into: data entry region
80, centrally located portion, for inputting process data；Key range 81 is inputted, the lower section of data entry region 80 is located at；Operation
Key range 82 is set to a part (right corner) of data entry region 80；And non-illiteracy hides region 83, is located at data and inputs
The top in region 80.As an example of the division only in these regions, position, size, the type in each region etc. can be suitably changed.
Data entry region 80 is the region for inputting the processing conditions laser machined, is be set masking-out excellent
The first higher region of grade.Data entry region 80 is such as can set ID, workpiece size, processing feed speed, laser output.
Inputting key range 81 is to be provided with number, letter etc. for inputting the key of various information (switch).It is desirable for operating key range 82
The key (switch) operated in production (processing), such as it is provided with the Enter (entrance) of the instruction for inputting operator
Key 82a and Exit for being withdrawn into upper page from the current display page (exit) key 82b.In the present embodiment, it grasps
Making key range 82 is the minimum region of priority for being set masking-out.It is the region for not being set masking-out that non-illiteracy, which hides region 83,
Non- cover hides setting/releasing key 83a that region 83 is for example provided with setting or off mode for going to masking-out；And it uses
In switch key (switching push button) 83b for switching above-mentioned illiteracy screening picture and standard picture in the state of being set with masking-out.It is not right
Non- illiteracy hides region 83 and sets masking-out, therefore even if in addition to the non-each region 80~82 covered other than hiding region 83 is set with masking-out
In the state of, setting/releasing key 83a and switch key 83b can also be operated.
In the present embodiment, the movement for setting masking-out in data entry region 80 and input key range 81 is said
It is bright.In the case where masking-out to be set, masking-out setting person (such as production management department), which touches, is arranged in the non-of input picture 66a
Cover the setting/releasing key 83a for hiding region 83.Then, as shown in figure 5, showing selection label 84 in input picture 66a, therefore
Masking-out setting person touches the setting of the masking-out in the selection label 84 label 84a.Masking-out register 65 goes to registration to input as a result,
The masking-out of masked area specified by picture 66a sets mode.In masking-out setting mode, masking-out figure layer lower section successively
Overlap with the figure layer of transparent figure layer and input picture.Transparent figure layer, which has, to be protected in masking-out setting mode to input picture
The function of operation of figure layer transparent figure layer is deleted at the end of masking-out setting mode.
Then, masked area is specified.The specified of masked area is to be desired with the region covered and hidden by specified
Corner carries out.Specifically, as shown in fig. 6, masking-out setting person touches the upper left angle for being desired with and covering the region hidden
Portion 85a, then the corner 85b towards lower right is slided.As a result, as shown in fig. 7, specified go out diagonally have corner 85a, 85b
Rectangular masked area 85.The specified of masked area is not limited to slide, can also click above-mentioned corner 85a,
85b can also click on the four corners (quadrangle) in the region (such as rectangle) for wishing specified.
Then, the region of masking-out to be removed is specified.To the specified of the region of masking-out to be removed with to masked area
It is specified similarly, be to be carried out by the corner in the specified region for wishing to remove masking-out.Specifically, as shown in figure 8, covering
Version setting person touches the upper left corner 86a for wishing to remove the region of masking-out on masked area 85, then towards lower right
Corner 86b sliding.As a result, as shown in figure 9, specified go out diagonally there is the rectangular of corner 86a, 86b to remove masking-out
Region 86 (with the region that is equal of operation key range 82), and specified go out to go from the region 86 that masked area 85 will remove masking-out
Masking-out 67a obtained by removing.Finally, touching the setting/releasing key 83a for being set to the non-illiteracy screening region 83 of input picture 66a, thus
Masking-out setting mode terminates.Masking-out register 65 is registered with masking-out 67a corresponding with input picture 66a.Masking-out 67a and input
Picture 66a overlappingly shown, making can not be into the touch operation other than the operation key range 82 for not setting masking-out 67a
Row.In addition, being set to the switching in the non-illiteracy screening region 83 of input picture 66a by touching in the state of being set with masking-out 67a
Key 83b hides picture 90 (referring to Fig. 9) so as to the illiteracy to overlapping show mask 67a and masking-out 67a is made to become transparent and only show
Show that the standard picture 91 (referring to Fig. 4) of input picture 66a switches over.In this case, by making masking-out 67a become transparent,
It can rapidly and easily confirm the processing conditions for being set in input picture.
According to the present embodiment, masking-out 67a can be set in the desired region of input picture 66a, therefore can forbidden
Touch operation to the region for being set with masking-out 67a is reliably prevented from the input operation of the mistake of operator.In addition,
Using the operation key range 82 for not setting masking-out 67a in input picture 66a, the input behaviour of required bottom line can be realized
Make, therefore can be realized the raising of the workability of operator.
Then, the concentration adjustment movement of masking-out is illustrated.Sequence of movement when Figure 10 is the concentration to adjustment masking-out
The figure being illustrated.The concentration adjustment of masking-out can be executed by operator.It is arranged in input picture 66a's when operator touches
When the non-setting/releasing key 83a for covering screening region 83, as shown in figure 5, showing selection label 84 in input picture 66a.Operator
Touch the deep or light adjustment label 84c of masking-out in the selection label 84.Masking-out register 65 goes to adjustment to input picture as a result,
The deep or light deep or light adjustment modes for the masking-out 67a that 66a is registered.
When going to deep or light adjustment modes, as shown in Figure 10, the display of region 83 is hidden for adjusting masking-out permeability in non-illiteracy
The adjustment item 87 of (deep or light).It is formed in this embodiment are as follows: when the right side that will adjust point 87a to adjustment item 87 is mobile, masking-out is penetrated
Property gets higher (color of masking-out 67a is thin out)；When the left side that will adjust point 87a to adjustment item 87 is mobile, masking-out permeability is lower
(color of masking-out 67a thickens).When making the color of masking-out 67a thicken, can easily identify be provided with masking-out 67a region and
The region of not set masking-out 67a.In addition, when make masking-out 67a color it is thin out when, can be improved and shown across masking-out 67a
Input the visibility of picture 66a.By masking-out 67a it is deep or light be adjusted to desired value after, operator touch again setting/
Key 83a is released, so as to terminate deep or light adjustment modes.
Then, the releasing movement of masking-out is illustrated.Figure 11 is illustrated to sequence of movement when releasing masking-out
Figure.The releasing of masking-out preferably by masking-out releasing person (such as production management department) etc. there are the personnel of permission to execute.Work as masking-out
When releasing person touches the setting/releasing key 83a in the non-illiteracy screening region 83 that input picture 66a is arranged in, as shown in figure 5, inputting
Picture 66a shows selection label 84.Masking-out releasing person touches the masking-out in the selection label 84 and releases label 84b.It covers as a result,
Version register 65 goes to masking-out off mode, releases the masking-out 67a registered to input picture 66a.
When going to masking-out off mode, as shown in figure 11, the Password Input frame of releasing is shown on masking-out 67a
88.In this case, it is temporarily released with the input comparable masking-out in key range 81, it is close to input so as to use enter key
Code.In addition, in the case where being able to use other input units input password, it is suitable with input key range 81 without interim releasing
Masking-out.Alternatively, it is also possible to constitute as follows: not only in the releasing movement of masking-out, but also also being needed in the set action of masking-out
Input password.
When inputting regular password in Password Input frame 88, masking-out register 65 will be registered and input picture
The registration of the corresponding masking-out 67a of 66a releases.Masking-out releasing person (such as production management department) touches setting/releasing key again
83a, so as to terminate masking-out off mode.Thereby, it is possible to freely carry out the input to input picture 66a.
As discussed above, the laser processing device 1 of present embodiment includes chuck table 10, to crystalline substance
Piece 100 is kept；Laser light irradiation portion 20, the chip 100 kept to the chuck table 10 are processed；Operation
Panel 70, input picture 66a~66b of the processing conditions of display input chip 100；And control unit 60, to each structure
It is controlled at element, control unit 60 includes input picture register 62, is registered with multiple input picture 66a~66c；
And masking-out register 65, it is registered with masking-out 67a~67c according to each input picture 66a~66c, masking-out 67a~67c
The defined region overlay of picture 66a~66c will be inputted, carry out the input of operator can not, stepped on when to masking-out register 65
When remembering masking-out 67a, the region 85 covered with masking-out and the region 86 that remove masking-out of input picture 66a are specified
And it is registered.According to this constitution, the customer of use device can set according to its purposes in the desired region of input picture 66a
Determine masking-out 67a, therefore can properly and reliably prevent the input operation of the mistake of operator.In addition, utilizing input picture 66a
In the operation key range 82 for not setting masking-out 67a, can be realized required bottom line input operation, can be realized operator
Workability raising.
In addition, according to the present embodiment, when masked area 85 to input picture 66a or removing the region 86 of masking-out
When being specified, the corner of the masked area 85 for inputting picture 66a or the region 86 that remove masking-out is specified and carried out
Registration, therefore can easily specify masked area 85 or to remove the region 86 of masking-out, the finger in the region can be easily performed
Fixed operation.
In addition, according to the present embodiment, the display switching key 83b in input picture 66a, switch key 83b cut display
It changes illiteracy into and hides picture 90 or standard picture 91, which hides picture 90 and be overlapped show mask 67a, the standard on input picture 66a
Picture 91 is not overlapped show mask 67a on input picture 66a, therefore passes through the operation of switch key 83b, being capable of quick and appearance
Confirmation of changing places is set in the processing conditions in input picture 66a.
In addition, according to the present embodiment, setting can be could be adjusted to across masking-out to the deep or light of the color of masking-out 67a
67a and show input picture 66a visibility, therefore when make masking-out 67a color it is denseer when, can readily recognize
It is provided with the region of masking-out 67a and the region of not set masking-out 67a out.In addition, when making the paler colour of masking-out 67a, it can
Improve the visibility across the masking-out 67a input picture 66a shown.
More than, present embodiment is illustrated, but present embodiment has been presented by way of example only, not to invention
Range be defined.In the present embodiment, it to masked area 85 or to remove the region 86 of masking-out and carry out specified feelings
Under condition, carried out by respectively specifying that corner 85a, 85b, 86a, the 86b in these regions 85,86, but it is not limited to this.Such as
In the case where being specified to the region 86 of masking-out to be removed, as specific region determine "enter" key" 82a and Exit key 82b,
The regions such as the smaller input frames such as cooked mode and feed speed shown in Fig. 4.Then, masking-out setting person by click etc. come
It specifies as a part in the "enter" key" 82a and Exit key 82b of the specific region, to remove masking-out so as to specified
Region 86.Button part as "enter" key" 82a and Exit key 82b is since area is small, by specifying to its inside
It is specified to can easily be done region for the composition of (click).In addition, be not only to the specified of the region 86 of masking-out to be removed, and
And it can also be using to carrying out specified method in specific region to the specified of masked area 85.The present invention can also apply to cut
Turning device or grinding attachment.
In addition, in the present embodiment, as the processing unit (plant) of the operation panel 70 with display input picture, exemplifying
Laser processing device is illustrated, and but it is not limited to this, is cut in the cutting tool using rotation machined object
It can also be using the present invention in cutting apparatus, the grinding attachment being ground using the grinding grinding tool of rotation to machined object.
Claims (5)
1. a kind of processing unit (plant), includes
Chuck table keeps machined object；
Unit is processed, the machined object kept to the chuck table is processed；
Operation panel, display input the input picture of the processing conditions of the machined object；And
Control unit controls each component,
The processing unit (plant) is characterized in that,
The control unit includes
Picture register is inputted, multiple input pictures are registered with；And
Masking-out register registers masking-out according to each input picture, and the masking-out is by the defined region of the input picture
It covers and carry out the input of operator can not,
When registering the masking-out to the masking-out register, which is specified with the region that the masking-out covers and
It is registered.
2. processing unit (plant) according to claim 1, wherein
It is defeated to this when the region covered to the input picture with the masking-out or the region that remove the masking-out are specified
It is specified and is registered in the corner in the region covered with the masking-out or the region that remove the masking-out that enter picture.
3. processing unit (plant) according to claim 1 or 2, wherein
When specifying the predetermined specific region in the input picture as the region covered with the masking-out or to remove this
When the region of masking-out, a part in the specific region is specified and is registered.
4. according to claim 1 to processing unit (plant) described in any one in 3, which is characterized in that
Switching push button is shown in the input picture, which switches to illiteracy for display and hide picture or standard picture, wherein
The illiteracy hides picture and is overlapped the display masking-out on the input picture, which is overlapped not on the input picture shows the illiteracy
Version.
5. according to claim 1 to processing unit (plant) described in any one in 4, wherein
The deep or light of color of the masking-out is adjusted, so that the vision for setting the input picture shown across the masking-out is distinguished
Recognizing property.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017131996A JP6944291B2 (en) | 2017-07-05 | 2017-07-05 | Processing equipment |
| JP2017-131996 | 2017-07-05 |
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| Publication Number | Publication Date |
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| CN109216235A true CN109216235A (en) | 2019-01-15 |
| CN109216235B CN109216235B (en) | 2024-02-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810717324.5A Active CN109216235B (en) | 2017-07-05 | 2018-07-02 | Processing device |
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| Country | Link |
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| JP (1) | JP6944291B2 (en) |
| KR (1) | KR102559738B1 (en) |
| CN (1) | CN109216235B (en) |
| TW (1) | TWI773768B (en) |
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| JP7290428B2 (en) * | 2019-02-13 | 2023-06-13 | 株式会社ディスコ | processing equipment |
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| JPH06149525A (en) * | 1992-10-30 | 1994-05-27 | Oki Electric Ind Co Ltd | Diplay control method |
| CN1257247A (en) * | 1998-12-16 | 2000-06-21 | 国际商业机器公司 | Method and device for protecting pattern user interface central control element of computer system |
| CN101153852A (en) * | 2006-09-29 | 2008-04-02 | 奥林巴斯株式会社 | Appearance detecting device |
| JP2013045358A (en) * | 2011-08-25 | 2013-03-04 | Disco Abrasive Syst Ltd | Processor |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6149525A (en) * | 1984-08-17 | 1986-03-11 | Fujitsu Ltd | Analog and digital converter |
| JP5118445B2 (en) | 2007-11-09 | 2013-01-16 | 株式会社ディスコ | Processing equipment |
| JP2012000701A (en) * | 2010-06-15 | 2012-01-05 | Disco Corp | Processing device |
| JP2014231123A (en) * | 2013-05-29 | 2014-12-11 | 株式会社ディスコ | Processing device and information exchange method |
| JP6678375B2 (en) * | 2013-11-18 | 2020-04-08 | 東京エレクトロン株式会社 | Information processing apparatus, information processing method, and information processing system |
| AU2016204168B2 (en) * | 2016-02-01 | 2017-11-09 | Komatsu Ltd. | Work machine control system, work machine, and work machine management system |
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2017
- 2017-07-05 JP JP2017131996A patent/JP6944291B2/en active Active
-
2018
- 2018-06-05 TW TW107119322A patent/TWI773768B/en active
- 2018-07-02 CN CN201810717324.5A patent/CN109216235B/en active Active
- 2018-07-04 KR KR1020180077639A patent/KR102559738B1/en active IP Right Grant
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06149525A (en) * | 1992-10-30 | 1994-05-27 | Oki Electric Ind Co Ltd | Diplay control method |
| CN1257247A (en) * | 1998-12-16 | 2000-06-21 | 国际商业机器公司 | Method and device for protecting pattern user interface central control element of computer system |
| CN101153852A (en) * | 2006-09-29 | 2008-04-02 | 奥林巴斯株式会社 | Appearance detecting device |
| JP2013045358A (en) * | 2011-08-25 | 2013-03-04 | Disco Abrasive Syst Ltd | Processor |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20190005130A (en) | 2019-01-15 |
| TWI773768B (en) | 2022-08-11 |
| JP2019016666A (en) | 2019-01-31 |
| JP6944291B2 (en) | 2021-10-06 |
| TW201907255A (en) | 2019-02-16 |
| KR102559738B1 (en) | 2023-07-25 |
| CN109216235B (en) | 2024-02-09 |
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