TWI773768B - Processing device - Google Patents

Processing device Download PDF

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TWI773768B
TWI773768B TW107119322A TW107119322A TWI773768B TW I773768 B TWI773768 B TW I773768B TW 107119322 A TW107119322 A TW 107119322A TW 107119322 A TW107119322 A TW 107119322A TW I773768 B TWI773768 B TW I773768B
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mask
area
input screen
input
screen
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TW201907255A (en
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遠藤智章
高乘佑
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日商迪思科股份有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Dicing (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • User Interface Of Digital Computer (AREA)
  • Laser Beam Processing (AREA)

Abstract

[課題]提供一種可以確實地防止操作人員的錯誤的輸入操作的加工裝置。 [解決手段]具備有：操作面板，顯示輸入晶圓之加工條件的輸入畫面；及控制單元，控制各構成要素，控制單元具備有：輸入畫面登錄部，可登錄輸入畫面；及遮罩登錄部，按每個輸入畫面來登錄遮罩，其中該遮罩是覆蓋輸入畫面之規定的區域而讓由操作人員進行的輸入變得不可行，在將該遮罩登錄於遮罩登錄部時，是對輸入畫面的欲以遮罩覆蓋的區域或欲去除遮罩的區域進行指定來登錄。[Problem] To provide a processing apparatus that can reliably prevent an operator's erroneous input operation. [Solution] It is provided with: an operation panel that displays an input screen for inputting wafer processing conditions; and a control unit that controls each component, and the control unit is provided with: an input screen registration unit that can register the input screen; and a mask registration unit , and register a mask for each input screen, wherein the mask covers a predetermined area of the input screen and makes the input by the operator infeasible, and when the mask is registered in the mask registration section, it is Register by specifying the area to be covered with the mask or the area to remove the mask of the input screen.

Description

加工裝置Processing device

發明領域 本發明是有關於一種具備有顯示輸入畫面的操作面板的加工裝置。FIELD OF THE INVENTION The present invention relates to a processing apparatus including an operation panel that displays an input screen.

發明背景 已知有一般是將各種半導體晶圓或封裝基板、陶瓷基板等板狀的被加工物保持於工作夾台，且利用切割刀片、磨削磨石、或是雷射光束等加工被加工物的加工裝置。此種加工裝置會為了設定進行加工的速度或進行加工的區域等各種加工條件，而具備有具有觸控面板方式之輸入畫面的操作面板(參照例如專利文獻1)。 先前技術文獻 專利文獻BACKGROUND OF THE INVENTION It is known that plate-shaped workpieces such as various semiconductor wafers, package substrates, and ceramic substrates are generally held on a work chuck, and processed by a dicing blade, a grinding stone, or a laser beam. object processing device. Such a processing apparatus is provided with an operation panel having an input screen of a touch panel type in order to set various processing conditions such as a processing speed and an area to be processed (see, for example, Patent Document 1). Prior Art Documents Patent Documents

專利文獻1：日本專利特開2009-117776號公報Patent Document 1: Japanese Patent Laid-Open No. 2009-117776

發明概要 發明欲解決之課題 可是，在加工條件(數值或選項等)之中，會有下述之條件：當變更條件時即無法按照原本意圖地實施加工，而產生例如導致晶圓破損等致命的加工不良。因此，在通常的生產(加工)時，為了抑制操作人員誤變更加工條件之情形，所設想的是下述構成：設置成可設定所謂的螢幕保護程式之類的鎖屏畫面，而設成為無法對輸入畫面整體進行輸入。SUMMARY OF THE INVENTION The problem to be solved by the invention is that, among the processing conditions (values, options, etc.), there is a condition that when the conditions are changed, the processing cannot be performed as originally intended, and fatalities such as wafer breakage may occur. poor processing. Therefore, in order to prevent the operator from changing the machining conditions by mistake during normal production (processing), a configuration is envisaged in which a lock screen such as a so-called screen saver can be set, and a lock screen such as a so-called screen saver can be set. Enter the entire input screen.

然而，在生產(加工)時，因為對輸入畫面的輸入操作多少都是必要的，所以在上述的設定鎖屏畫面的構成中，因為每當需要輸入操作時，就會解除鎖屏畫面的設定，而有無法確實地防止錯誤的輸入操作的問題。However, at the time of production (processing), since some input operations on the input screen are necessary, in the above-described configuration of setting the lock screen, the setting of the lock screen is canceled every time an input operation is required. , and there is a problem that erroneous input operations cannot be reliably prevented.

本發明是有鑒於上述而作成的發明，其目的在於提供一種可以確實地防止操作人員的錯誤的輸入操作的加工裝置。 用以解決課題之手段The present invention has been made in view of the above, and an object of the present invention is to provide a processing apparatus that can surely prevent an operator's erroneous input operation. means of solving problems

為了解決上述課題並達成目的，本發明是一種加工裝置，具備有：工作夾台，保持被加工物；加工單元，對已保持於該工作夾台之被加工物進行加工；操作面板，顯示輸入該被加工物之加工條件的輸入畫面；及控制單元，控制各構成要素，該加工裝置的特徵在於：該控制單元具備有：輸入畫面登錄部，可登錄複數個該輸入畫面；及遮罩登錄部，按每個該輸入畫面來登錄遮罩，其中該遮罩是覆蓋該輸入畫面之規定的區域而讓由操作人員進行的輸入變得不可行，在將該遮罩登錄於該遮罩登錄部時，是指定該輸入畫面的欲以該遮罩覆蓋的區域來登錄。In order to solve the above-mentioned problems and achieve the object, the present invention is a processing device comprising: a work chuck for holding a workpiece; a processing unit for processing the workpiece held on the work chuck; and an operation panel for displaying input An input screen for processing conditions of the workpiece; and a control unit for controlling each component, and the processing apparatus is characterized in that: the control unit includes: an input screen registration unit capable of registering a plurality of the input screens; and a mask registration unit section, register a mask for each input screen, wherein the mask covers a predetermined area of the input screen to make input by the operator infeasible, and the mask is registered in the mask registration When the part is selected, the area of the input screen to be covered by the mask is designated for registration.

根據此構成，因為可以對各輸入畫面的所期望的區域各自設定遮罩，所以可以確實地防止操作人員的錯誤的輸入操作。此外，在輸入畫面中的不設定遮罩的區域中，可以實現必要之最低限度的輸入操作，而可以謀求操作人員的作業性的提升。According to this structure, since a mask can be set individually to a desired area|region of each input screen, an erroneous input operation by an operator can be reliably prevented. In addition, in the area where the mask is not set on the input screen, the minimum necessary input operation can be realized, and the workability of the operator can be improved.

在此構成中，在指定該輸入畫面的欲以該遮罩覆蓋的區域、或是欲去除該遮罩的區域時，亦可對該輸入畫面的欲以該遮罩覆蓋的區域、或是欲去除該遮罩的區域的角部進行指定來登錄。In this configuration, when specifying the area of the input screen to be covered by the mask, or the area to be removed from the mask, the area of the input screen to be covered by the mask, or the area to be removed Register by specifying the corner of the area where the mask is removed.

又，將該輸入畫面中的預先決定之特定區域作為欲以該遮罩覆蓋的區域、或是欲去除該遮罩的區域來指定時，亦可對該特定區域內的一部分進行指定來登錄。Furthermore, when a predetermined specific area on the input screen is designated as the area to be covered with the mask or the area to be removed from the mask, a part of the specific area may be designated and registered.

又，於該輸入畫面中，亦可顯示切換按鈕，該切換按鈕是將顯示切換成遮罩畫面及標準畫面，該遮罩畫面是將該遮罩重疊於該輸入畫面而顯示之畫面，該標準畫面是未將該遮罩重疊於該輸入畫面而顯示之畫面。In addition, a switch button may be displayed on the input screen. The switch button switches the display to a mask screen and a standard screen. The mask screen is a screen displayed by overlaying the mask on the input screen. The standard screen is displayed. The picture is a picture displayed without overlapping the mask on the input picture.

又，該遮罩亦可調整顏色的濃淡而設定隔著該遮罩所顯示的該輸入畫面的可見性。 發明效果In addition, the mask can adjust the shade of color to set the visibility of the input screen displayed through the mask. Invention effect

根據本發明，因為可以對各輸入畫面的所期望的區域各自設定遮罩，所以可以確實地防止操作人員錯誤的輸入操作。此外，在輸入畫面中的不設定遮罩的區域中，可以實現必要之最低限度的輸入操作，而可以謀求操作人員的作業性的提升。According to the present invention, since a mask can be set for each desired area of each input screen, erroneous input operation by the operator can be reliably prevented. In addition, in the area where the mask is not set on the input screen, the minimum necessary input operation can be realized, and the workability of the operator can be improved.

用以實施發明之形態 針對用於實施本發明之形態(實施形態)，一邊參照圖式一邊詳細地說明。本發明並不因以下的實施形態所記載之內容而受到限定。又，在以下所記載之構成要素中，包含所屬技術領域中具有通常知識者可輕易設想得到的或實質上是相同的。此外，以下所記載之構成是可適當組合的。又，在不脫離本發明之要旨的範圍內，可進行各種構成之省略，置換或變更。MODE FOR IMPLEMENTING THE INVENTION The form (embodiment) for implementing the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. In addition, the constituent elements described below include those that can be easily assumed by those skilled in the art or are substantially the same. In addition, the configurations described below can be appropriately combined. In addition, omissions, substitutions, or changes of various configurations can be made without departing from the gist of the present invention.

圖1是顯示本實施形態之雷射加工裝置之構成例的圖。圖2是顯示顯示面板之構成例的圖。圖3是控制單元的功能方塊圖。雷射加工裝置(加工裝置)1是如圖1所示，具備有工作夾台10、及雷射光線照射部(加工單元)20。雷射加工裝置1是對保持於工作夾台10上之晶圓(被加工物)100進行例如由雷射光線照射部20照射雷射光線的雷射加工，而將晶圓100分割成規定的大小的元件晶片(圖未示)。晶圓100是例如半導體晶圓或光元件晶圓。於晶圓100之正面格子狀地形成有複數條切割道(分割預定線)，且在以這些切割道所區劃的各區域中各自形成有元件。又，晶圓100是以藉由黏貼膠帶101而保持在環狀的框架102上之晶圓單元103的形態被加工及搬送。FIG. 1 is a diagram showing a configuration example of a laser processing apparatus according to the present embodiment. FIG. 2 is a diagram showing a configuration example of a display panel. FIG. 3 is a functional block diagram of the control unit. As shown in FIG. 1 , the laser processing apparatus (processing apparatus) 1 includes a work chuck 10 and a laser beam irradiation unit (processing unit) 20 . The laser processing apparatus 1 performs laser processing such as irradiating a laser beam with a laser beam by a laser beam irradiating unit 20 on a wafer (object to be processed) 100 held on a table 10, and divides the wafer 100 into predetermined pieces. The size of the component wafer (not shown). The wafer 100 is, for example, a semiconductor wafer or an optical element wafer. On the front surface of the wafer 100 , a plurality of scribe lines (planned dividing lines) are formed in a lattice shape, and elements are formed in respective regions defined by these scribe lines. Moreover, the wafer 100 is processed and conveyed in the form of the wafer unit 103 held on the ring-shaped frame 102 by the adhesive tape 101 .

雷射加工裝置1具備：使工作夾台10沿著X軸方向(加工進給方向)移動的X軸移動機構(加工進給機構)30、及使工作夾台10沿著Y軸方向(分度進給方向)移動的Y軸移動部(分度進給機構)40。藉此，工作夾台10及雷射光線照射部20是成為可各自在上述之X軸方向及Y軸方向上相對地移動的構成。The laser processing apparatus 1 includes an X-axis moving mechanism (processing feed mechanism) 30 that moves the table 10 in the X-axis direction (processing feed direction), and an X-axis moving mechanism (processing feed mechanism) 30 that moves the table 10 in the Y-axis direction (min. The Y-axis moving part (indexing feed mechanism) 40 that moves in the feed direction). Thereby, the stage 10 and the laser beam irradiation unit 20 are configured to be relatively movable in the above-mentioned X-axis direction and Y-axis direction, respectively.

雷射加工裝置1具備片匣載置台51，該片匣載置台51載置有收容雷射加工前後之晶圓100(晶圓單元103)的片匣50。又，雷射加工裝置1具備有保護膜形成兼洗淨部52，該保護膜形成兼洗淨部52是對雷射加工前之晶圓100形成保護膜，並且從雷射加工後之晶圓100去除保護膜。又，雷射加工裝置1具備：將晶圓單元103搬送至上述之各部位的搬送機構53、控制雷射加工裝置1之動作整體的控制單元60、及進行對該控制單元60輸入各種資訊之操作的操作面板70。該操作面板70具有顯示面板71與框架72，該顯示面板71是設成可輸入各種資訊並且顯示各種資訊，該框架72是保持該顯示面板71。The laser processing apparatus 1 includes a cassette mounting table 51 on which a cassette 50 for accommodating the wafers 100 (wafer units 103 ) before and after laser processing is mounted. In addition, the laser processing apparatus 1 includes a protective film forming and cleaning unit 52 that forms a protective film on the wafer 100 before laser processing and removes the protective film from the wafer 100 after laser processing. 100 Remove the protective film. In addition, the laser processing apparatus 1 includes a transport mechanism 53 for transporting the wafer unit 103 to the above-mentioned respective positions, a control unit 60 for controlling the overall operation of the laser processing apparatus 1 , and a control unit 60 for inputting various information. Operation panel 70. The operation panel 70 includes a display panel 71 and a frame 72 . The display panel 71 is configured to input various information and display various information, and the frame 72 holds the display panel 71 .

工作夾台10是在對晶圓100進行雷射加工時保持晶圓單元103。工作夾台10具有：保持面11，載置並吸引晶圓單元103；及夾具部12，於該保持面11之外周側配置複數個以固定框架102。The work chuck 10 holds the wafer unit 103 during the laser processing of the wafer 100 . The work chuck 10 has a holding surface 11 on which the wafer unit 103 is placed and sucked, and a jig portion 12 , a plurality of which are arranged on the outer peripheral side of the holding surface 11 to fix the frame 102 .

雷射光線照射部20是固定於裝置本體2之壁部3，且朝向保持於工作夾台10之晶圓100(晶圓單元103)照射雷射光線。雷射光線照射部20具備振盪產生雷射光線的振盪器(圖未示)、將藉由該振盪器所振盪產生之雷射光線聚光的聚光器(圖未示)、及將已聚光的雷射光線朝向晶圓100照射的照射頭21。振盪器是因應於晶圓100之種類、加工形態等，並依照事先設定的加工條件，以適當調整振盪產生之雷射光線的波長(頻率)或輸出、重複頻率。照射頭21可以藉由聚光器等的光學系統而在Z軸方向(鉛直方向)上調整雷射光線之聚光位置(焦點位置)。The laser light irradiating portion 20 is fixed to the wall portion 3 of the device body 2 and irradiates the laser light toward the wafer 100 (wafer unit 103 ) held on the work chuck 10 . The laser light irradiating part 20 includes an oscillator (not shown) that oscillates to generate laser light, a condenser (not shown) that condenses the laser light generated by the oscillation of the oscillator, and The laser beam of light is directed toward the irradiation head 21 , which is irradiated on the wafer 100 . The oscillator can appropriately adjust the wavelength (frequency) or output and repetition frequency of the laser light generated by the oscillation according to the type and processing form of the wafer 100, and in accordance with the processing conditions set in advance. The irradiation head 21 can adjust the condensing position (focus position) of the laser beam in the Z-axis direction (vertical direction) by an optical system such as a condenser.

聚光器是包含全反射鏡或聚光透鏡等而構成，該全反射鏡是將藉由振盪器所振盪產生之雷射光線的行進方向改變，該聚光透鏡會將雷射光線L聚光。又，在本實施形態中，雷射光線照射部20具備有在X軸方向上與照射頭21橫排地配置的拍攝部22。該拍攝部22是拍攝在工作夾台10上之晶圓100的配置狀況及對晶圓100的加工狀況等的相機。The condenser is composed of a total reflection mirror or a condenser lens. The total reflection mirror changes the traveling direction of the laser light oscillated by the oscillator, and the condenser lens condenses the laser light L. . Moreover, in this embodiment, the laser beam irradiation part 20 is provided with the imaging part 22 arrange|positioned horizontally to the irradiation head 21 in the X-axis direction. The imaging unit 22 is a camera for imaging the arrangement status of the wafers 100 on the stage 10 , the processing status of the wafers 100 , and the like.

X軸移動機構30具備朝X軸方向延伸的滾珠螺桿31、與滾珠螺桿31平行地配設的導軌32、連結於滾珠螺桿31之一端且使滾珠螺桿31旋動的脈衝馬達33、及下部滑接於導軌32並且在內部具備有螺合於滾珠螺桿31之螺帽(圖未示)的滑動板34。滑動板34是隨著滾珠螺桿31的旋動並被導軌32所導引而在X軸方向上移動。又，於滑動板34上固定有於內部具備有脈衝馬達(圖未示)之旋轉驅動部35，旋轉驅動部35可以使工作夾台10旋轉規定角度。在本實施形態中，是例如依據藉由拍攝部22所拍攝之晶圓100的圖像，來將工作夾台10(晶圓100)旋轉成使相互交叉之切割道各自朝向X軸方向及Y軸方向。The X-axis moving mechanism 30 includes a ball screw 31 extending in the X-axis direction, a guide rail 32 arranged in parallel with the ball screw 31, a pulse motor 33 connected to one end of the ball screw 31 and rotating the ball screw 31, and a lower slide The slide plate 34 is connected to the guide rail 32 and has a nut (not shown) screwed to the ball screw 31 inside. The slide plate 34 moves in the X-axis direction while being guided by the guide rail 32 with the rotation of the ball screw 31 . In addition, a rotation driving part 35 having a pulse motor (not shown) inside is fixed to the sliding plate 34 , and the rotation driving part 35 can rotate the table 10 by a predetermined angle. In the present embodiment, for example, based on the image of the wafer 100 captured by the imaging unit 22 , the table 10 (wafer 100 ) is rotated so that the intersecting scribe lines face the X-axis direction and the Y-direction, respectively. axis direction.

又，Y軸移動機構40具備朝Y軸方向延伸的滾珠螺桿41、與滾珠螺桿41平行地配設的導軌42、連結於滾珠螺桿41之一端且使滾珠螺桿41旋動的脈衝馬達43、及下部滑接於導軌42並且在內部具備有螺合於滾珠螺桿41之螺帽(圖未示)的滑動板44，滑動板44是隨著滾珠螺桿41的旋動並被導軌42所導引而在Y軸方向上移動。於滑動板44上配設有上述之X軸移動機構30，隨著滑動板44在Y軸方向上的移動，X軸移動機構30也朝同方向移動。片匣50是收容複數片上述之晶圓單元103的構成。片匣載置台51是在Z軸方向上升降自如地設置在裝置本體2上。Further, the Y-axis moving mechanism 40 includes a ball screw 41 extending in the Y-axis direction, a guide rail 42 arranged in parallel with the ball screw 41, a pulse motor 43 connected to one end of the ball screw 41 and rotating the ball screw 41, and The lower part is slidably connected to the guide rail 42 and has a sliding plate 44 inside which is screwed with a nut (not shown) of the ball screw 41. The sliding plate 44 is guided by the guide rail 42 along with the rotation of the ball screw 41. Move in the Y-axis direction. The above-mentioned X-axis moving mechanism 30 is disposed on the sliding plate 44 , and the X-axis moving mechanism 30 also moves in the same direction as the sliding plate 44 moves in the Y-axis direction. The cassette 50 is configured to accommodate a plurality of the above-mentioned wafer units 103 . The cassette mounting table 51 is provided on the apparatus main body 2 so as to be movable up and down in the Z-axis direction.

操作面板70所具備的顯示面板71是如圖2所示，具有液晶驅動電路基板73、液晶面板74、及觸控面板75，且依此順序將其等積層配置。於觸控面板75上所利用的是例如電阻膜方式的面板，而使透明度(光透射度)較高，且變得可通過觸控面板75目視辨識液晶面板74的顯示。從而，當在液晶面板74顯示有用於設定各種加工條件的輸入畫面或操作畫面時，變得可藉由用指尖等觸控操作(例如點擊或滑動等)觸控面板75而進行各種操作。又，亦可取代上述之液晶面板74，而使用例如有機EL(電激發光，Electro-Luminescence)面板等。The display panel 71 included in the operation panel 70 includes, as shown in FIG. 2 , a liquid crystal drive circuit substrate 73 , a liquid crystal panel 74 , and a touch panel 75 , which are arranged in equal layers in this order. For the touch panel 75 , for example, a resistive film type panel is used, so that the transparency (light transmittance) is high, and the display of the liquid crystal panel 74 can be visually recognized through the touch panel 75 . Therefore, when an input screen or an operation screen for setting various processing conditions is displayed on the liquid crystal panel 74, various operations can be performed by touching the touch panel 75 with a fingertip or the like (for example, clicking or sliding). In addition, instead of the above-mentioned liquid crystal panel 74, for example, an organic EL (Electro-Luminescence) panel or the like may be used.

控制單元60是如圖3所示，具備控制部61及輸入畫面登錄部62。控制部61具備透過液晶驅動電路基板73來控制液晶面板74的顯示控制部63、及依據觸控面板75之觸控操作來控制各部的動作的觸控面板控制部64。顯示控制部63是將複數個圖層重合而顯示在液晶面板74上。在本實施形態中，顯示控制部63是將遮罩之圖層(遮罩)重合於輸入畫面之圖層而顯示，該輸入畫面之圖層是顯示各種輸入畫面之圖像，該遮罩之圖層是顯示覆蓋輸入畫面之規定的區域之圖像。遮罩的圖層是位於比輸入畫面的圖層更上位，且從操作人員看來是在輸入畫面的圖層的前側。因此，可藉由遮罩覆蓋輸入畫面之規定的區域。The control unit 60 includes a control unit 61 and an input screen registration unit 62 as shown in FIG. 3 . The control unit 61 includes a display control unit 63 that controls the liquid crystal panel 74 through the liquid crystal drive circuit board 73 , and a touch panel control unit 64 that controls the operation of each unit in accordance with a touch operation of the touch panel 75 . The display control unit 63 displays a plurality of layers on the liquid crystal panel 74 by overlapping them. In the present embodiment, the display control unit 63 displays a layer of a mask (mask) that is superimposed on a layer of the input screen, the layer of the input screen is to display images of various input screens, and the layer of the mask is to display An image that covers the specified area of the input screen. The mask layer is positioned higher than the layer of the input screen, and is located on the front side of the layer of the input screen as viewed by the operator. Therefore, a predetermined area of the input screen can be covered by the mask.

顯示控制部63是構成為可調整重疊於輸入畫面之圖層的遮罩之圖層的顏色濃淡而顯示。藉此，當將遮罩圖層的顏色設得較濃時，可以容易地辨識設有遮罩的區域與未設有遮罩的區域。又，當將遮罩圖層的顏色設得較淡時，可以提高隔著遮罩所顯示之輸入畫面的可見性。又，顯示控制部63可以切換並顯示遮罩畫面及標準畫面，該遮罩畫面是將遮罩之圖層重疊於輸入畫面之圖層而顯示的畫面，該標準畫面是只顯示輸入畫面之圖層的畫面。在標準畫面中，顯示控制部63可以藉由透明地顯示遮罩之圖層而容易地確認輸入畫面。The display control unit 63 is configured to adjust the color gradation of the layer of the mask superimposed on the layer of the input screen, and display it. Therefore, when the color of the mask layer is set to be darker, the area with the mask and the area without the mask can be easily distinguished. Also, when the color of the mask layer is set to be lighter, the visibility of the input screen displayed through the mask can be improved. In addition, the display control unit 63 may switch and display a mask screen, which is a screen displayed by superimposing the layer of the mask on the layer of the input screen, and a standard screen, which is a screen in which only the layer of the input screen is displayed. . In the standard screen, the display control unit 63 can easily confirm the input screen by transparently displaying the mask layer.

觸控面板控制部64是因應於對顯示於輸入畫面之操作按鈕或數值輸入部的觸控或輸入操作而控制各部。於觸控面板控制部64上是將顯示觸控面板75的面上之觸控處的座標資訊作為觸控資訊來傳遞，而變得可辨識觸控面板75上之觸控處。在本構成中，觸控面板控制部64是以不受理對設有遮罩的區域的操作的方式，來將由操作人員進行的輸入變得不可行。The touch panel control unit 64 controls each unit in response to a touch or an input operation on an operation button or a numerical input unit displayed on the input screen. The touch panel control unit 64 transmits the coordinate information of the touch point on the surface of the touch panel 75 as touch information, so that the touch point on the touch panel 75 can be recognized. In this configuration, the touch panel control unit 64 makes the input by the operator infeasible so as not to accept the operation on the area where the mask is provided.

輸入畫面登錄部62是登錄用於輸入雷射加工晶圓100時之加工條件的輸入畫面66a、66b、66c。在本實施形態中，雖然為了方便說明，而將輸入畫面66a、66b、66c之數量設為三個，但當然可因應於加工條件的數量而適當地變更。輸入畫面66a~66c是按各加工步驟中的加工條件(1、2、3)而進行複數次登錄。顯示控制部63是將對應於所實行的加工條件的輸入畫面66a~66c之輸入畫面圖層顯示於液晶面板74。The input screen registration unit 62 is to register input screens 66a, 66b, and 66c for inputting processing conditions when the wafer 100 is laser-processed. In the present embodiment, the number of the input screens 66a, 66b, and 66c is set to three for convenience of description, but of course, it can be appropriately changed according to the number of processing conditions. The input screens 66a to 66c are registered a plurality of times for each processing condition (1, 2, 3) in each processing step. The display control unit 63 displays, on the liquid crystal panel 74 , the input screen layers of the input screens 66 a to 66 c corresponding to the executed processing conditions.

輸入畫面登錄部62具備遮罩登錄部65。該遮罩登錄部65是登錄對複數個輸入畫面66a~66c建立關連而被指定的遮罩67a~67c。這些遮罩67a~67c可以和輸入畫面66a~66c一對一對應，而按輸入畫面來設定。顯示控制部63在登錄有對應於輸入畫面66a~66c之遮罩67a~67c的情況下，是將對應的遮罩67a~67c之圖層重疊於輸入畫面之圖層來顯示。遮罩67a~67c是防止操作人員誤對輸入畫面進行輸入操作的構成，且可由例如生產管理部門之遮罩設定人員來設定。The input screen registration unit 62 includes a mask registration unit 65 . The mask registration unit 65 registers the masks 67a to 67c designated in association with the plurality of input screens 66a to 66c. These masks 67a to 67c can correspond one-to-one with the input screens 66a to 66c, and can be set according to the input screens. When the masks 67a to 67c corresponding to the input screens 66a to 66c are registered, the display control unit 63 displays the layers of the corresponding masks 67a to 67c superimposed on the layers of the input screen. The masks 67a to 67c are configured to prevent the operator from erroneously performing an input operation on the input screen, and can be set by, for example, a mask setter in the production management department.

接著，說明遮罩的設定動作。圖4是顯示輸入畫面之一例的圖。圖5~圖9是說明設定遮罩時之動作程序的圖。在圖4中，是將輸入畫面66a區分成用於在中央部輸入加工資料的資料輸入區域80、位於資料輸入區域80的下方的輸入鍵區域81、設於資料輸入區域80之局部(右邊角落)的操作鍵區域82、及位於資料輸入區域80上方的非遮罩區域83。這些區域的區分僅是一例，各區域之位置、大小、種類等可進行適當變更。Next, the mask setting operation will be described. FIG. 4 is a diagram showing an example of an input screen. FIG. 5 to FIG. 9 are diagrams for explaining the operation procedure when setting the mask. In FIG. 4, the input screen 66a is divided into a data input area 80 for inputting processing data in the center, an input key area 81 located below the data input area 80, and a part (right corner) provided in the data input area 80. ) of the operation key area 82 , and the non-mask area 83 located above the data input area 80 . The division of these areas is only an example, and the position, size, type, etc. of each area can be appropriately changed.

資料輸入區域80是用於輸入進行雷射加工之加工條件的區域，且是設定遮罩之優先順序較高的區域。資料輸入區域80是形成為可設定例如ID、工件尺寸、加工進給速度、雷射輸出等。輸入鍵區域81是用於輸入各種資訊的按鍵(開關)，且設有數字、字母等。操作鍵區域82是成為在生產(加工)中必須操作的鍵(開關)，且設有例如用於輸入操作人員的指示的Enter鍵82a，或用於從現在的顯示頁面離開而回到上一層的頁面的Exit鍵82b。在本實施形態中，操作鍵區域82是設定遮罩之優先順序最低的區域。非遮罩區域83是不設定遮罩的區域，於該非遮罩區域83中設有例如用於轉換到遮罩之設定或解除之模式的設定/解除鍵83a、及用於在設定有遮罩之狀態下切換上述之遮罩畫面與標準畫面的切換鍵(切換按鈕)83b。非遮罩區域83因為不設定遮罩，所以即使是對除了非遮罩區域83以外之各區域80~82皆設定有遮罩之狀態，仍然可以操作設定/解除鍵83a及切換鍵83b。The data input area 80 is an area for inputting processing conditions for laser processing, and is a high priority area for setting a mask. The data input area 80 is formed so that, for example, ID, workpiece size, processing feed rate, laser output, and the like can be set. The input key area 81 is a key (switch) for inputting various information, and is provided with numbers, letters, and the like. The operation key area 82 is a key (switch) that must be operated during production (processing), and is provided with, for example, an Enter key 82a for inputting an operator's instruction, or for leaving the current display page and returning to the previous level Exit key 82b of the page. In the present embodiment, the operation key area 82 is the area with the lowest priority for setting the mask. The non-mask area 83 is an area in which the mask is not set. In the non-mask area 83, for example, a set/release key 83a for switching to a mode of setting or canceling the mask, and a setting/release button 83a for setting or canceling the mask are provided in the non-mask area 83. The switch key (switch button) 83b for switching between the mask screen and the standard screen in this state. Since the non-mask area 83 has no mask set, even if the mask is set for each of the areas 80 to 82 except the non-mask area 83, the set/release key 83a and the switch key 83b can still be operated.

針對在本實施形態中，於資料輸入區域80及輸入鍵區域81設定遮罩之動作來進行說明。在設定遮罩時，遮罩設定人員(例如生產管理部門)是觸控設於輸入畫面66a之非遮罩區域83的設定/解除鍵83a。如此一來，如圖5所示，因為可在輸入畫面66a中顯示選擇標籤84，所以可從該選擇標籤84中觸控遮罩設定標籤84a。藉此，遮罩登錄部65會轉換到遮罩設定模式，以登錄相對於輸入畫面66a所指定之遮罩區域。在遮罩設定模式中，是於遮罩之圖層下將透明之圖層及輸入畫面之圖層依此順序重疊。透明之圖層具有在遮罩設定模式中，保護輸入畫面之圖層被操作之功能，當遮罩設定模式結束時透明之圖層即被刪除。In this embodiment, the operation of setting the mask in the data input area 80 and the input key area 81 will be described. When setting the mask, the mask setting personnel (for example, the production management department) touches the set/release key 83a provided in the non-mask area 83 of the input screen 66a. In this way, as shown in FIG. 5 , since the selection tab 84 can be displayed on the input screen 66 a, the mask setting tab 84 a can be touched from the selection tab 84 . Thereby, the mask registration part 65 is switched to the mask setting mode, and the mask area designated with respect to the input screen 66a is registered. In the mask setting mode, the transparent layer and the input screen layer are overlapped in this order under the mask layer. The transparent layer has the function of protecting the layer of the input screen from being manipulated in the mask setting mode. When the mask setting mode ends, the transparent layer will be deleted.

接著，指定遮罩區域。遮罩區域的指定是藉由指定欲進行遮罩的區域的角部來進行。具體而言，如圖6所示，遮罩設定人員是觸控欲進行遮罩的區域的左上的角部85a後，朝向右下角部85b滑動。藉此，如圖7所示，可指定於對角具有角部85a、85b之長方形的遮罩區域85。遮罩區域的指定並不限於滑動操作，亦可為點擊上述之角部85a、85b之操作，亦可各自點擊欲指定的區域(例如長方形)的四個角部(四端)。Next, specify the mask area. The mask area is specified by specifying the corners of the area to be masked. Specifically, as shown in FIG. 6 , the mask setting person touches the upper left corner 85a of the area to be masked, and then slides it toward the lower right corner 85b. Thereby, as shown in FIG. 7, the mask area|region 85 of the rectangle which has corner|angular part 85a, 85b diagonally can be designated. The designation of the mask area is not limited to the sliding operation, and may also be the operation of clicking the above-mentioned corners 85a and 85b, or clicking the four corners (four ends) of the area to be designated (eg, rectangle).

接著，指定將去除遮罩的區域。將去除遮罩的區域的指定是與遮罩區域的指定同樣地藉由指定欲去除遮罩的區域的角部來進行。具體而言，是如圖8所示，遮罩設定人員是在遮罩區域85上觸控欲去除遮罩的區域的左上角部86a後，朝向右下之角部86b滑動。藉此，如圖9所示，可指定於對角具有角部86a、86b之長方形的去除遮罩的區域86(與操作鍵區域82同等之區域)，而從遮罩區域85中指定已將去除遮罩的區域86去除的遮罩67a。最後，藉由觸控設於輸入畫面66a之非遮罩區域83中的設定/解除鍵83a，以結束遮罩設定模式。遮罩登錄部65會登錄對應於輸入畫面66a之遮罩67a。該遮罩67a是與輸入畫面66a重疊而顯示，而將未設定有遮罩67a之操作鍵區域82以外的觸控操作設為不可行。又，在設定有遮罩67a的狀態下，可以藉由觸控設於輸入畫面66a之非遮罩區域83的切換鍵83b，而切換將遮罩67a重疊顯示之遮罩畫面90(參照圖9)、及將遮罩67a設為透明而僅顯示輸入畫面66a的標準畫面91(參照圖4)。在該情況下，可以藉由將遮罩67a設為透明，以儘快地且容易地確認設定於輸入畫面之加工條件。Next, specify the area where the mask will be removed. The designation of the area to be masked is performed by designating the corners of the area to be masked similarly to designation of the masked area. Specifically, as shown in FIG. 8 , the mask setting person touches the upper left corner 86a of the region where the mask is to be removed on the mask area 85, and then slides toward the lower right corner 86b. Thereby, as shown in FIG. 9 , a mask-unmasked area 86 (an area equivalent to the operation key area 82 ) having diagonal corners 86 a and 86 b can be designated, and the masked area 85 can be designated by Removal of mask 67a in region 86 of mask removal. Finally, the mask setting mode is ended by touching the set/release key 83a provided in the non-mask area 83 of the input screen 66a. The mask registration unit 65 registers the mask 67a corresponding to the input screen 66a. The mask 67a is displayed overlapping the input screen 66a, and touch operations other than the operation key area 82 in which the mask 67a is not set are rendered infeasible. In addition, in the state where the mask 67a is set, by touching the switch key 83b provided in the non-mask area 83 of the input screen 66a, the mask screen 90 in which the mask 67a is displayed superimposed can be switched (refer to FIG. 9 ). ), and the standard screen 91 (see FIG. 4 ) in which only the input screen 66a is displayed by making the mask 67a transparent. In this case, by making the mask 67a transparent, it is possible to quickly and easily confirm the processing conditions set on the input screen.

根據本實施形態，因為可以在輸入畫面66a的所期望的區域設定遮罩67a，所以可以禁止對設定有該遮罩67a的區域的觸控操作，且可以確實地防止操作人員的錯誤的輸入操作。又，在輸入畫面66a中的未設定遮罩67a的操作鍵區域82中，因為可以實現必要最低限度的輸入操作，所以可以謀求操作人員的作業性的提升。According to the present embodiment, since the mask 67a can be set in a desired area of the input screen 66a, the touch operation on the area where the mask 67a is set can be prohibited, and erroneous input operations by the operator can be reliably prevented . In addition, in the operation key area 82 in which the mask 67a is not set on the input screen 66a, since the minimum necessary input operation can be realized, the operator's workability can be improved.

接著，說明遮罩之濃度調整動作。圖10是說明調整遮罩的濃度時之動作程序的圖。遮罩的濃度調整亦可由操作人員實行。當操作人員觸控設於輸入畫面66a之非遮罩區域83的設定/解除鍵83a時，如圖5所示，會在輸入畫面66a上顯示選擇標籤84。操作人員是從該選擇標籤84中觸控遮罩濃淡調整標籤84c。藉此，遮罩登錄部65會轉換到濃淡調整模式，以調整相對於輸入畫面66a所登錄之遮罩67a的濃淡。Next, the operation of adjusting the density of the mask will be described. FIG. 10 is a diagram illustrating an operation procedure for adjusting the density of the mask. The density adjustment of the mask can also be performed by the operator. When the operator touches the set/release key 83a provided in the non-mask area 83 of the input screen 66a, as shown in FIG. 5, a selection label 84 is displayed on the input screen 66a. The operator touches the mask shading adjustment tab 84 c from the selection tab 84 . As a result, the mask registration unit 65 switches to the shading adjustment mode to adjust the shading with respect to the mask 67a registered on the input screen 66a.

當轉換到濃淡調整模式時，如圖10所示，會在非遮罩區域83顯示用於調整遮罩透明度(濃淡)的調整條87。在此例中，是形成為當將調整點87a朝調整條87之右側移動時，會使遮罩的透射性變高(遮罩67a的顏色變淡)，當將調整點87a朝調整條87之左側移動時，會使遮罩的透射性變低(遮罩67a的顏色變濃)。當將遮罩67a的顏色設得較濃時，可以容易地辨識設有遮罩67a的區域與未設有的區域。又，當將遮罩67a的顏色設得較淡時，可以提高隔著遮罩67a所顯示之輸入畫面66a的可見性。將遮罩67a的濃淡調整成所期望的值之後，可藉由操作人員再次觸控設定/解除鍵83a，而結束濃淡調整模式。When switching to the shading adjustment mode, as shown in FIG. 10 , an adjustment bar 87 for adjusting the transparency (shading) of the mask is displayed in the non-mask area 83 . In this example, when the adjustment point 87a is moved to the right of the adjustment bar 87, the transmittance of the mask is increased (the color of the mask 67a becomes lighter), and when the adjustment point 87a is moved toward the adjustment bar 87 When moving to the left, the transmittance of the mask becomes lower (the color of the mask 67a becomes darker). When the color of the mask 67a is set to be darker, the area where the mask 67a is provided and the area where the mask 67a is not provided can be easily distinguished. In addition, when the color of the mask 67a is made lighter, the visibility of the input screen 66a displayed through the mask 67a can be improved. After adjusting the shading of the mask 67a to a desired value, the operator can touch the set/release key 83a again to end the shading adjustment mode.

接著，說明遮罩之解除動作。圖11是說明解除遮罩時之動作程序的圖。遮罩的解除宜由遮罩解除人員(例如生產管理部門)等具有權限的人員來實行。當遮罩解除人員觸控設於輸入畫面66a之非遮罩區域83的設定/解除鍵83a時，如圖5所示，可在輸入畫面66a顯示選擇標籤84。遮罩解除人員是從該選擇標籤84中觸控遮罩解除標籤84b。藉此，遮罩登錄部65會轉換到遮罩解除模式，以解除相對於輸入畫面66a所登錄的遮罩67a。Next, the operation of releasing the mask will be described. FIG. 11 is a diagram illustrating an operation procedure when the mask is released. The removal of the mask should be carried out by personnel with authority such as mask removal personnel (such as the production management department). When the mask releasing person touches the set/release key 83a provided in the non-mask area 83 of the input screen 66a, as shown in FIG. 5, a selection label 84 can be displayed on the input screen 66a. The mask releasing person touches the mask releasing label 84 b from the selection label 84 . Thereby, the mask registration part 65 is switched to the mask release mode, and the mask 67a registered with respect to the input screen 66a is cancelled|released.

當轉換到遮罩解除模式時，如圖11所示，會在遮罩67a上顯示解除用之密碼輸入框88。在此情況下，是將相當於輸入鍵區域81之遮罩暫時解除，而變得可利用輸入鍵來輸入密碼。再者，在設為可利用其他的輸入機構來輸入密碼的情況下，則毋須將相當於輸入鍵區域81之遮罩暫時地解除。又，亦可設成下述構成：不僅是在遮罩的解除動作時，連在遮罩的設定動作時也需要密碼的輸入。When switching to the mask release mode, as shown in FIG. 11, a password input box 88 for release is displayed on the mask 67a. In this case, the mask corresponding to the input key area 81 is temporarily released, so that the input key can be used to input the password. In addition, in the case where the password can be input by another input means, it is not necessary to temporarily release the mask corresponding to the input key area 81 . In addition, it is also possible to have a configuration in which the input of a password is required not only during the mask release operation but also during the mask setting operation.

當將正規之密碼輸入至密碼輸入框88時，遮罩登錄部65會解除已登錄之對應於輸入畫面66a之遮罩67a的登錄。遮罩解除人員(例如生產管理部門)可以藉由再次觸控設定/解除鍵83a，以結束遮罩解除模式。藉此，可以自由地進行對輸入畫面66a的輸入。When a regular password is input into the password input box 88, the mask registration unit 65 cancels the registration of the mask 67a corresponding to the input screen 66a already registered. The mask releasing personnel (for example, the production management department) can end the mask releasing mode by touching the set/release key 83a again. Thereby, the input to the input screen 66a can be freely performed.

如以上所說明，本實施形態之雷射加工裝置1具備：工作夾台10，保持晶圓100；雷射光線照射部20，對已保持於該工作夾台10之晶圓100進行加工；操作面板70，顯示輸入晶圓100之加工條件的輸入畫面66a~66b；及控制單元60，控制各構成要素，控制單元60是具備：輸入畫面登錄部62，可登錄複數個輸入畫面66a~66c；及遮罩登錄部65，按每個輸入畫面66a~66c來登錄遮罩67a~67c，其中該等遮罩67a~67c是覆蓋輸入畫面66a~66c之規定的區域而讓由操作人員進行的輸入變得不可行，在將遮罩67a登錄於遮罩登錄部65時，是對輸入畫面66a的欲以遮罩覆蓋的區域85、以及欲去除遮罩的區域86進行指定來登錄。根據此構成，因為使用裝置之顧客可因應於其用途，而在輸入畫面66a的所期望的區域設定遮罩67a，所以可以適當地且確實地防止操作人員的錯誤的輸入操作。此外，在輸入畫面66a中的未設定遮罩67a之操作鍵區域82中，可以實現必要之最低限度的輸入操作，而可以謀求操作人員的作業性的提升。As described above, the laser processing apparatus 1 of the present embodiment includes: a work chuck 10 for holding the wafer 100 ; a laser beam irradiation unit 20 for processing the wafer 100 held on the work chuck 10 ; The panel 70 displays input screens 66a to 66b for inputting processing conditions of the wafer 100; and the control unit 60 controls each component, and the control unit 60 is provided with: an input screen registration unit 62, which can register a plurality of input screens 66a to 66c; and the mask registration unit 65 to register masks 67a to 67c for each of the input screens 66a to 66c, wherein the masks 67a to 67c cover predetermined areas of the input screens 66a to 66c to allow input by the operator When it becomes impossible to register the mask 67a in the mask registration unit 65, the area 85 to be covered with the mask and the area 86 to be removed from the mask on the input screen 66a are designated and registered. According to this structure, since the customer using the apparatus can set the mask 67a in a desired area of the input screen 66a according to the application, it is possible to appropriately and surely prevent an erroneous input operation by the operator. In addition, in the operation key area 82 in which the mask 67a is not set on the input screen 66a, the necessary minimum input operation can be realized, and the operator's workability can be improved.

又，根據本實施形態，因為在指定輸入畫面66a之遮罩區域85或去除遮罩的區域86時，是對輸入畫面66a之遮罩區域85或去除遮罩的區域86的角部進行指定來登錄，所以可以容易地指定遮罩區域85或去除遮罩的區域86，且可以容易地實行該區域的指定操作。Furthermore, according to the present embodiment, when specifying the mask area 85 or the mask removal area 86 of the input screen 66a, the corners of the mask area 85 or the mask removal area 86 of the input screen 66a are specified. Since it is registered, the mask area 85 or the mask-removal area 86 can be easily designated, and the designation operation of the area can be easily performed.

又，根據本實施形態，因為可在輸入畫面66a中顯示切換鍵83b，該切換鍵83b可將顯示切換成遮罩畫面90及標準畫面91，該遮罩畫面90是將遮罩67a重疊於輸入畫面66a而顯示之畫面，該標準畫面91是未將遮罩67a重疊於輸入畫面66a而顯示之畫面，所以可以藉由該切換鍵83b之操作而儘速地且容易地確認設定於輸入畫面66a之加工條件。In addition, according to the present embodiment, since the switch key 83b can be displayed on the input screen 66a, the switch key 83b can switch the display between the mask screen 90 and the standard screen 91 in which the mask 67a is superimposed on the input screen 90. The standard screen 91 is a screen displayed without the mask 67a being superimposed on the input screen 66a, so the setting on the input screen 66a can be quickly and easily confirmed by the operation of the switch key 83b. processing conditions.

又，根據本實施形態，因為遮罩67a可調整顏色的濃淡而設定隔著遮罩67a所顯示之輸入畫面66a的可見性，所以當將遮罩67a的顏色設得較濃時，可以容易地辨識設有遮罩67a的區域與未設有的區域。又，當將遮罩67a的顏色設得較淡時，可以提高隔著遮罩67a所顯示之輸入畫面66a的可見性。Furthermore, according to the present embodiment, since the mask 67a can adjust the shade of color to set the visibility of the input screen 66a displayed through the mask 67a, when the mask 67a is set to be darker, it is possible to easily The area where the mask 67a is provided and the area where the mask 67a is not provided are identified. In addition, when the color of the mask 67a is made lighter, the visibility of the input screen 66a displayed through the mask 67a can be improved.

以上，雖然針對本實施形態進行了說明，但本實施形態是作為例子而提示的實施形態，並非意欲限定發明的範圍。在本實施形態中，在指定遮罩區域85或去除遮罩的區域86的情況下，雖然是以將這些區域85、86之角部85a、85b、86a、86b各自指定之作法來進行，但並非受限於此。例如，在指定去除遮罩的區域86時，預先將Enter鍵82a和Exit鍵82b、或圖4所示之加工模式或進給速度等，相較下較小的輸入框等的區域決定為特定區域。並且，遮罩設定人員亦可藉由點擊作為該特定區域之Enter鍵82a及Exit鍵82b內的一部分等來進行指定之作法，指定去除遮罩的區域86。因為如Enter鍵82a或Exit鍵82b之按鈕部分面積較小，所以在內部進行指定(點擊)之構成下可以容易地進行區域指定。再者，不僅是去除遮罩的區域86之指定時，針對遮罩區域85之指定，也可以利用於特定區域內進行指定之方法。連在切割裝置或磨削裝置中也可以適用，以上意旨承蒙記載。Although the present embodiment has been described above, the present embodiment is presented as an example, and is not intended to limit the scope of the invention. In this embodiment, when specifying the mask area 85 or the area 86 to be removed from the mask, the corners 85a, 85b, 86a, and 86b of these areas 85 and 86 are designated respectively. Not limited to this. For example, when specifying the area 86 to remove the mask, the Enter key 82a and the Exit key 82b, or the processing mode or feed speed shown in FIG. area. In addition, the mask setting personnel can also designate the area 86 to remove the mask by clicking the Enter key 82a and part of the Exit key 82b as the specific area to designate. Since the area of the button portion such as the Enter key 82a or the Exit key 82b is small, the area designation can be easily performed with the configuration in which designation (click) is performed inside. Furthermore, not only the designation of the area 86 to remove the mask, but also the designation of the mask area 85 can be used in a method of designating within a specific area. It can also be applied to a cutting device or a grinding device, and the above purpose is hereby described.

又，在本實施形態中，雖然作為具備有顯示輸入畫面之操作面板70的加工裝置而以雷射加工裝置來例示並說明，但並非受限於此，亦可將本發明適用於藉由旋轉之切割刀片來切割被加工物的切割裝置上、或藉由旋轉之磨削磨石來磨削被加工物的磨削裝置上。In addition, in the present embodiment, a laser processing apparatus is exemplified and described as a processing apparatus having the operation panel 70 displaying an input screen, but the present invention is not limited to this, and the present invention can also be applied to On a cutting device that cuts the workpiece with a cutting blade, or a grinding device that grinds the workpiece with a rotating grinding whetstone.

1‧‧‧雷射加工裝置(加工裝置)2‧‧‧裝置本體3‧‧‧壁部10‧‧‧工作夾台11‧‧‧保持面12‧‧‧夾具部20‧‧‧雷射光線照射部(加工單元)21‧‧‧照射頭22‧‧‧拍攝部30‧‧‧X軸移動機構(加工進給機構)31、41‧‧‧滾珠螺桿32、42‧‧‧導軌33、43‧‧‧脈衝馬達34、44‧‧‧滑動板35‧‧‧旋轉驅動部40‧‧‧Y軸移動部(Y軸移動機構、分度進給機構)50‧‧‧片匣51‧‧‧片匣載置台52‧‧‧保護膜形成兼洗淨部53‧‧‧搬送機構60‧‧‧控制單元61‧‧‧控制部62‧‧‧輸入畫面登錄部63‧‧‧顯示控制部64‧‧‧觸控面板控制部65‧‧‧遮罩登錄部66a、66b、66c‧‧‧輸入畫面67a、67b、67c‧‧‧遮罩70‧‧‧操作面板71‧‧‧顯示面板72、102‧‧‧框架73‧‧‧液晶驅動電路基板74‧‧‧液晶面板75‧‧‧觸控面板80‧‧‧資料輸入區域81‧‧‧輸入鍵區域82‧‧‧操作鍵區域82a‧‧‧Enter鍵(特定區域)82b‧‧‧Exit鍵(特定區域)83‧‧‧非遮罩區域83a‧‧‧設定/解除鍵83b‧‧‧切換鍵(切換按鈕)84‧‧‧選擇標籤84a‧‧‧遮罩設定標籤84b‧‧‧遮罩解除標籤84c‧‧‧遮罩濃淡調整標籤85‧‧‧遮罩區域(以遮罩覆蓋的區域)85a、86a‧‧‧左上角部85b、86b‧‧‧右下角部86‧‧‧去除遮罩的區域87‧‧‧調整條87a‧‧‧調整點88‧‧‧密碼輸入框90‧‧‧遮罩畫面91‧‧‧標準畫面100‧‧‧晶圓(被加工物)101‧‧‧黏貼膠帶103‧‧‧晶圓單元X、Y、Z‧‧‧方向1‧‧‧Laser processing device (processing device) 2‧‧‧Apparatus body 3‧‧‧Wall part 10‧‧‧Working table 11‧‧‧Holding surface 12‧‧‧Clamp part 20‧‧‧Laser beam Irradiation part (processing unit) 21‧‧‧Irradiation head 22‧‧‧photography part 30‧‧‧X-axis moving mechanism (processing feed mechanism) 31, 41‧‧‧ball screw 32, 42‧‧‧guide rails 33, 43 ‧‧‧Pulse motor 34, 44‧‧‧Sliding plate 35‧‧‧Rotation drive part 40‧‧‧Y-axis moving part (Y-axis moving mechanism, indexing feeding mechanism) 50‧‧‧Cassette 51‧‧‧ Cassette stage 52‧‧‧Protective film forming and cleaning part 53‧‧‧Conveying mechanism 60‧‧‧Control unit 61‧‧‧Control part 62‧‧‧Input screen registration part 63‧‧‧Display control part 64‧ ‧‧Touch panel control part 65‧‧‧Shield registration part 66a, 66b, 66c‧‧‧Input screen 67a, 67b, 67c‧‧‧Shield 70‧‧‧Operation panel 71‧‧‧Display panel 72, 102 ‧‧‧Frame 73‧‧‧LCD drive circuit substrate 74‧‧‧LCD panel 75‧‧‧Touch panel 80‧‧‧Data input area 81‧‧‧Input key area 82‧‧‧Operation key area 82a‧‧‧ Enter key (specific area) 82b‧‧‧Exit key (specific area) 83‧‧‧non-masked area 83a‧‧‧Set/Release key 83b‧‧‧Switch key (toggle button) 84‧‧‧Select tab 84a‧ ‧‧Mask setting label 84b‧‧‧Mask release label 84c‧‧‧Mask shading adjustment label 85‧‧‧Mask area (area covered by mask) 85a, 86a‧‧‧Top left corner 85b, 86b ‧‧‧Lower right corner 86‧‧‧Remove mask area 87‧‧‧Adjustment bar 87a‧‧‧Adjustment point 88‧‧‧Password input box 90‧‧‧Mask screen 91‧‧‧Standard screen 100‧‧ ‧Wafer (object to be processed) 101‧‧‧Adhesive tape 103‧‧‧Wafer unit X, Y, Z‧‧‧ directions

圖1是顯示本實施形態之雷射加工裝置之構成例的圖。 圖2是顯示顯示面板之構成例的圖。 圖3是控制單元的功能方塊圖。 圖4是顯示輸入畫面之一例的圖。 圖5是說明設定遮罩時之動作程序的圖。 圖6是說明設定遮罩時之動作程序的圖。 圖7是說明設定遮罩時之動作程序的圖。 圖8是說明設定遮罩時之動作程序的圖。 圖9是說明設定遮罩時之動作程序的圖。 圖10是說明調整遮罩的濃度時之動作程序的圖。 圖11是說明解除遮罩時之動作程序的圖。FIG. 1 is a diagram showing a configuration example of a laser processing apparatus according to the present embodiment. FIG. 2 is a diagram showing a configuration example of a display panel. FIG. 3 is a functional block diagram of the control unit. FIG. 4 is a diagram showing an example of an input screen. FIG. 5 is a diagram illustrating an operation procedure when setting a mask. FIG. 6 is a diagram illustrating an operation procedure when setting a mask. FIG. 7 is a diagram illustrating an operation procedure when setting a mask. FIG. 8 is a diagram illustrating an operation procedure when setting a mask. FIG. 9 is a diagram illustrating an operation procedure when setting a mask. FIG. 10 is a diagram illustrating an operation procedure for adjusting the density of the mask. FIG. 11 is a diagram illustrating an operation procedure when the mask is released.

66a‧‧‧輸入畫面 66a‧‧‧Input screen

67a‧‧‧遮罩 67a‧‧‧Mask

82‧‧‧操作鍵區域 82‧‧‧Operation key area

83a‧‧‧設定/解除鍵 83a‧‧‧Set/Cancel key

83b‧‧‧切換鍵(切換按鈕) 83b‧‧‧Switch key (switch button)

85‧‧‧遮罩區域(以遮罩覆蓋的區域) 85‧‧‧Mask area (area covered by mask)

86‧‧‧去除遮罩的區域 86‧‧‧Removal of masked areas

86a‧‧‧左上角部 86a‧‧‧Top left corner

86b‧‧‧右下角部 86b‧‧‧Lower right corner

90‧‧‧遮罩畫面 90‧‧‧Mask Screen

Claims (5)

一種加工裝置，具備有：工作夾台，保持被加工物；加工單元，對已保持於該工作夾台之被加工物進行加工；操作面板，顯示輸入該被加工物之加工條件的輸入畫面；及控制單元，控制各構成要素，該加工裝置的特徵在於：該控制單元具備有：輸入畫面登錄部，可登錄複數個該輸入畫面；及遮罩登錄部，按每個該輸入畫面來登錄遮罩，其中該遮罩是覆蓋該輸入畫面之規定的區域而讓由操作人員進行的輸入變得不可行，在將該遮罩登錄於該遮罩登錄部時，是指定該輸入畫面的欲以該遮罩覆蓋的區域來登錄，且該輸入畫面中顯示有切換按鈕，該切換按鈕是將顯示切換成遮罩畫面及標準畫面，該遮罩畫面是將該遮罩重疊於該輸入畫面而顯示之畫面，該標準畫面是未將該遮罩重疊於該輸入畫面而顯示之畫面。 A processing device, comprising: a work clamp table for holding a workpiece; a processing unit for processing the workpiece held on the work clamp table; an operation panel for displaying an input screen for inputting processing conditions of the workpiece; and a control unit for controlling each component, and the processing apparatus is characterized in that: the control unit includes: an input screen registration unit that can register a plurality of the input screens; and a mask registration unit that registers the mask for each input screen A mask, wherein the mask covers a predetermined area of the input screen so that input by the operator becomes infeasible, and when the mask is registered in the mask registration section, it specifies the intended use of the input screen. The area covered by the mask is used to log in, and a switch button is displayed on the input screen. The switch button switches the display to a mask screen and a standard screen. The mask screen is displayed by overlaying the mask on the input screen. The standard screen is a screen displayed without overlapping the mask on the input screen. 如請求項1之加工裝置，其中在指定該輸入畫面的欲以該遮罩覆蓋的區域、或是欲去除該遮罩的區域時，是對該輸入畫面的欲以該遮罩覆蓋的區域、或是欲去除該遮罩的區域的角部進行指定來登錄。 The processing device of claim 1, wherein when specifying the area of the input screen to be covered by the mask, or the area to be removed from the mask, the area of the input screen to be covered by the mask, Alternatively, specify and register the corner of the area where the mask is to be removed. 如請求項1或2之加工裝置，其中在將該輸入畫面中的預先決定之特定區域作為欲以該遮罩覆蓋的區域、或是欲去除該遮罩的區域來指定時，是對該特定區 域內的一部分進行指定來登錄。 The processing device of claim 1 or 2, wherein when a predetermined specific area in the input screen is designated as the area to be covered with the mask or the area to be removed from the mask, the specific Area A part of the domain is designated to log in. 如請求項1或2之加工裝置，其中該遮罩可調整顏色的濃淡而設定隔著該遮罩所顯示的該輸入畫面的可見性。 The processing device of claim 1 or 2, wherein the mask can adjust the shade of color to set the visibility of the input screen displayed through the mask. 如請求項3之加工裝置，其中該遮罩可調整顏色的濃淡而設定隔著該遮罩所顯示的該輸入畫面的可見性。 The processing device of claim 3, wherein the mask can adjust the shade of color to set the visibility of the input screen displayed through the mask.
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