CN107097004A

CN107097004A - Cutting equipment and cutting method

Info

Publication number: CN107097004A
Application number: CN201710300627.2A
Authority: CN
Inventors: A·A·阿布拉莫夫; R·A·贝尔曼; D·C·布克宾德; 庄大可; J·J·多梅; D·G·阿尼克斯; L·加斯基尔; K·C·康; M·W·凯默尔; 郭冠廷; 林仁杰; R·G·曼利; J·C·托马斯; 曾珮琏; J-Z·J·张
Original assignee: Corning Inc
Current assignee: Corning Inc
Priority date: 2012-02-08
Filing date: 2013-02-07
Publication date: 2017-08-29
Also published as: KR20140129153A; JP2018020957A; CN104541365B; TWI605948B; JP2015515431A; WO2013119737A3; CN104541365A; TW201725125A; TW201343403A; WO2013119737A2

Abstract

The present invention relates to cutting equipment and cutting method.Cutting equipment, including：Head, the head has multiple holes；Lasing light emitter, the lasing light emitter is connected to the first hole in the multiple hole laser beam conveying is passed through into first hole；And cooling fluid source, the cooling fluid source is in fluid communication with least the second hole and at least the 3rd hole in the multiple hole, wherein the First Line for extending to second hole from first hole is set relative to the second line that the 3rd hole is extended to from first hole with first angle.

Description

Cutting equipment and cutting method

The application be international filing date be on 2 7th, 2013, international application no be PCT/US2013/025035, in The patent of invention Shen of the Application No. 201380017841.7 of state's thenational phase, entitled " flexible glass of the processing with carrier " Divisional application please.

The U.S. Provisional Application Serial No. the 61/th that the application requires to submit for 8th for 2 months for 2012 according to 35U.S.C. § 119 The benefit of priority of No. 596727, and be integrally hereby incorporated by its content based on its content and by quoting.

Technical field

The application is related to the apparatus and method of the thin plate on processing carrier, and the flexible glass related more specifically on carrier is thin Plate.

Background technology

At present, flexible plastic substrates are manufactured using the plastic-based materials of one or more polymer films are laminated with.These Laminated substrates are usually used in flexible package that is related to PV, OLED, LCD and being formed with thin film transistor (TFT) (TFT) electronics pattern, because it Cost it is low.

Flexible glass substrate has multiple technical advantages compared to flexiplast technology.One technical advantage is that glass can Moisture or gas shield are served as, it is the principal degradation mechanism of outdoor electrical.Second advantage is can be by reducing or eliminating One or more layers package base layer reduces overall package size (thickness).

With electronic display industry to thinner/flexible base board (<0.3mm is thick) demand, it is thinner/soft for processing these Property substrate, manufacturer all suffer from some challenge.

One option is to process thicker glass plate, then by panel etching or is polished to thinner overall net thickness.This Existing panel manufacture infrastructure is made it possible for, but in process finishing, adds finishing cost.

Second method is, for thinner substrate, to redesign existing panel process.In the technique, glass loss is Main obstacle, and will need substantial amounts of capital come in sheet material to sheet material or volume to volume technique in minimize operational losses.

The third method is for thin flexible base board, using volume to volume process technology.

4th kind of method is to use carrier technique, wherein thin substrate of glass is adhered to thicker glass carrier with bonding agent.

(have it is expected that making it possible to process thin glass using the carrier of the present capital infrastructure of manufacturer Have the thick glass of thickness≤0.3mm) without weakening or losing the bonding between thin glass and carrier at higher processing temperatures Intensity, and wherein in process finishing, thin glass is easily from carrier unsticking.

The content of the invention

It is (such as another the present invention relates to the thin plate of such as flexible glass plate is bonded into carrier initially through Van der Waals for One glass plate), then keeping processing thin plate/carrier, to be formed on device, (such as electronics or display device, electronics show The part of showing device, OLED material, the structure of photovoltage (PV), or thin film transistor (TFT)) after remove the ability of thin plate Increase the bond strength of some regions simultaneously.At least a portion of thin glass is bonded to carrier so that prevent device technique fluid Into the probability between thin plate and carrier, thus reducing pollution downstream process, i.e., the bonded seal part between thin plate and carrier Sealed, and in some preferred embodiments, the seal around the outside of product thus prevent liquid or gas invade or Discharge any region of sealing article.

A kind of commercial benefit of this method is that manufacturer can utilize its existing capital investment on a processing device, together When obtain thin film transistor (TFT) (TFT) electronic device for such as PV, OLED, LCD and patterning glass plate advantage.This Outside, this method can realize technological flexibility, including：Cleaning and surface for thin plate and carrier prepare to be bonded；With Strengthen being bonded in bond area thin plate and carrier bracket；For in nonbonding (or reduction/low-intensity) region thin plate and carrier Releasable property；And for cutting thin plate in order to being extracted from carrier.Strictly, nonbonding region may include thin plate and carrier Between certain bonding, but the bonding it is weak enough with allow thin plate easily from carrier remove without damage thin plate；In whole sheet In open, only for convenient, these regions are referred to as nonbonding region.Substantially, nonbonding region has significantly less than bonding The bond strength of region bond strength.

In some device techniques, the temperature and/or vacuum environment close to 600 DEG C or bigger can be used.These conditions are limited The workable material of system simultaneously proposes high request to carrier/thin plate.Inventor have discovered that by make to be captured in thin plate and carrier it Between gas flow can at least increase the ability that product (including being bonded to the thin plate of carrier) bears these conditions.Various ways can be used Make the gas of trapping minimum, for example, pass through：It is subjected to annealing to it after releasing layer depositing operation in carrier/thin glass plate, thus Subsequent deflation is minimum after the annealing has bonded together thin plate and carrier-and the annealing can be positioned in carrier/thin glass plate Completed before or after being in contact with each other；Thin plate and carrier are initially bonded each other in vacuum environment；By using for example ventilating Bar and/or groove provide the path that gas is escaped between thin plate and carrier；Properly select cleaning/etching solution；And control The surface roughness of carrier and/or thin plate processed.It is every kind of in the aforementioned manner for minimizing captured gas that can be used alone, or combine Any one or more of other manner for minimizing trapping air and/or other gases is used.

Middle elaboration will be described in detail below in further feature and advantage, and to those skilled in the art will partly Be readily appreciated that from specification or by putting into practice written explanation and accompanying drawing in example and as limited in appended claims Present invention recognizes that.It should be understood that foregoing overall description and it is described in detail below be all only the present invention example, and accompanying drawing provides reason Solve general introduction or the framework of the characteristic and feature of the present invention for required protection.

Including accompanying drawing to provide further understanding for the principle of the invention, accompanying drawing includes in this specification and constitutes the explanation A part for book.Accompanying drawing shows one or more embodiments, is used to explain principle of the invention and behaviour together with specification Make.It should be understood that the various features of the invention disclosed in specification and in accompanying drawing can be used alone and be applied in combination.For example, this Each feature of invention can be combined according to following each side.

According to first aspect there is provided a kind of method that thin plate is bonded to carrier, including：

A) thin plate and carrier are provided；

B) thin plate is bonded to carrier；

C) gas trapped after at least one in processing thin plate and carrier is so that be bonded between thin plate and carrier is most It is few.

According to second aspect there is provided a kind of method of first aspect, wherein step (c) is performed before step (b), and Including releasing layer is deposited at least one in thin plate and carrier, and pre- higher than when device is subsequently machined on thin plate By at least one annealing in thin plate and carrier at the high temperature of phase temperature.

According to the third aspect, there is provided a kind of method of first aspect, in addition to step (d)：To in thin plate and carrier extremely Few one provides surface treatment so as to form nonbonding region, and wherein step (c) includes being at least one in thin plate and carrier Individual offer outer perimeter edge of at least one from thin plate and carrier extends to the groove in nonbonding region.

According to fourth aspect there is provided a kind of method of the third aspect, wherein step (b) is carried out in vacuum environment, and step Suddenly (c) be additionally included in thin plate and carrier be bonded after but seal the groove before vacuum environment removal at them.

According to the 5th aspect there is provided a kind of method of fourth aspect, wherein the sealed bundle include it is following in one or many It is individual：With frit filling groove and heated frit；With can thermosetting resin filling groove and and then heated resin.

According to the 6th aspect there is provided a kind of method of first aspect, in addition to：Step (d)：To in thin plate and carrier extremely Few one provides surface treatment so as to form nonbonding region during step (b), and wherein step (c) includes using fluid cleaning At least one in thin plate and carrier, fluid makes minimum in the residue that gas is transferred with post-processing temperature when rinsing.

According to the 7th aspect there is provided a kind of method of first aspect, wherein step (c) is carried out simultaneously with step (b), and is wrapped Include in vacuum environment and thin plate is bonded to carrier, and water vapour is flowed into vacuum environment.

According to eighth aspect there is provided a kind of method of first aspect, wherein step (b) produces key between thin plate and carrier Region is closed, and also includes step (d)：Heat is applied by para-linkage region or pressure increase between thin plate and carrier be bonded it is strong Degree.

According to the 9th aspect there is provided a kind of method of eighth aspect, wherein step (d) is included in 400 to 625 DEG C of temperature Lower combustion thin plate and carrier.

According to the tenth aspect there is provided a kind of product, including：

Carrier；

Thin plate；

Bond area, the bond area has outer perimeter, and thin plate is remained into carrier；

Nonbonding region, the nonbonding region is arranged to be surrounded by bond area, wherein in thin plate and carrier at least One includes the extension from nonbonding region and causes the groove of welding region outer perimeter.

According to the tenth one side, there is provided the product of the tenth aspect, wherein trench fill oil seal material.

According to the 12nd aspect there is provided a kind of method of tenth one side, wherein, encapsulant is selected from：Frit；Sintering Frit；Heat reactive resin；Heat reactive resin；UV solidified resins；Ultraviolet curable resin；Polyimides；From glass plate and load The material of one of body fusing.

According to the 13rd aspect, there is provided a kind of required portion that thin plate is removed from the thin plate that carrier is bonded to by bond area The method divided, the bond area surrounds nonbonding region, and the thin plate has thickness, including：

Circumference passage is formed, the circumference of part needed for the circumference passage is limited, wherein the circumference passage is set Put in the nonbonding region and depth >=lamella thickness 50%.

According to fourteenth aspect there is provided the method for a kind of 13rd aspect, in addition to：Form two release ventilation holes, institute State release ventilation hole neither parallel to each other nor conllinear in the nonbonding region.

According to the 15th aspect there is provided the method for a kind of 13rd aspect, in addition to：

Two release ventilation holes are formed, described two release ventilation holes are parallel to each other or conllinear, wherein each release Passage extends in the bond area and nonbonding region, and

The release ventilation hole is propagated through both the thin plate and the carrier, so as to remove the thin plate and carrier Permission needed for part slip away the part of the carrier.

According to the 16th aspect there is provided the method for a kind of 15th aspect, wherein, the release ventilation hole is in the circumference Contacted in 500 microns of passage but not with the circumference passage.

According to the 17th aspect there is provided the method for either side in a kind of 13 to 16 aspects, in addition to：Use laser Form at least one in passage.

According to the 18th aspect there is provided a kind of method for forming the device based on thin plate, including：

Thin plate is attached to by carrier by the bond area around nonbonding region；

The thin plate is handled with the forming apparatus on the nonbonding region；And

Method according to either side in aspect 13 to 17 removes the required part of the thin plate.

According to the 19th aspect there is provided a kind of cutting equipment, including：

Head, the head has multiple holes；

Lasing light emitter, the first hole that the lasing light emitter is, optionally, coupled in the multiple hole passes through so as to which laser beam be conveyed First hole；And

Cooling fluid source, with least the second hole in the multiple hole and at least, the 3rd hole fluid connects the cooling fluid source It is logical, wherein extending to the First Line in second hole relative to from first hole from first hole extends to the 3rd hole The second line set with first angle.

According to the 20th aspect there is provided the cutting equipment of a kind of 19th aspect, wherein first angle is 90 degree, wherein cold But fluid source is also in fluid communication with the 5th hole in the 4th hole and the multiple hole in the multiple hole, and in addition from described the The 3rd line that one hole extends to the 4th hole is substantially collinear with the First Line, and extends to described from first hole 4th line in five holes is substantially collinear with second line.

According to the 20th one side there is provided the cutting equipment of a kind of 19th aspect, wherein the first angle is different In 90 degree of angles or its multiple.

According to the 22nd aspect there is provided a kind of cutting equipment, including：

Head, the head has multiple holes；

Cooling fluid source, the cooling fluid source is in fluid communication with least the second hole in the multiple hole,

Wherein described head is rotatable.

According to the 23rd aspect there is provided the cutting equipment of either side in 19 to 22 aspects, wherein described cold But fluid source is compressed air source.

According to twenty-fourth aspect there is provided the cutting equipment of either side in 19 to 23 aspects, its mesopore has ≤ 1mm diameter.

According to the 25th aspect there is provided a kind of cutting method, including：

Cutting equipment according to either side in the 19th to 21,23,24 aspects is provided；

By laser beam conveying by first hole, and the same of the head is being moved along the first direction along the First Line When by cooling fluid conveying pass through second hole；

Cut off conveying of the cooling fluid by second hole；

The 3rd hole is delivered the fluid through while the head is moved in a second direction along second line；

Cut off conveying of the cooling fluid by the 3rd hole.

According to the 26th aspect there is provided a kind of cutting method, including：

Cutting equipment according to the 22nd aspect is provided；

By laser beam conveying by first hole, and by cooling fluid while the head is moved along the first direction Conveying passes through second hole；

Rotate the head and to move the head into the second direction of non-zero angle relative to the first direction.

According to the 27th aspect there is provided a kind of product, including：

Carrier；

Thin plate；

Bond area, the bond area is formed around the circumference of the thin plate, and the thin plate is remained into the carrier；

Releasing layer, the releasing layer is arranged to be surrounded by the bond area, wherein the releasing layer first by making a reservation for At a temperature of be not bonded to the thin plate but the material of the thin plate be bonded under the second predetermined temperature and be made, wherein described second Predetermined temperature is higher than first predetermined temperature.

According to twenty-eighth aspect there is provided the product of a kind of 27th aspect, wherein, the releasing layer includes described carry There is the silicon fiml of 100 to 500nm thick degree, wherein the surface of the dorsad described carrier of the silicon fiml makes its surface on the surface of body Dehydrogenation.

According to the 29th aspect there is provided a kind of product of twenty-eighth aspect, wherein, the releasing layer also includes described Thin plate towards the metal film on the surface of the carrier, wherein the metal film has 100 to 500nm thickness.

According to the 30th aspect there is provided the product of a kind of 29th aspect, wherein, the metal is selected from will be >=600 With the race of silicon formation silicide at a temperature of DEG C, and cause it that there is Ra >=2nm surface roughness due to sputtering crystallite dimension.

According to the 30th one side there is provided the product of a kind of 29th or 30 aspects, wherein, the metal is selected from Aluminium, molybdenum and tungsten.

According to the 32nd aspect there is provided the product of either side in a kind of 27 to 30 one side, wherein described Thin plate is the glass of thickness≤300 micron.

According to the 33rd aspect there is provided the product of either side in a kind of 27 to 32 aspects, wherein described Carrier is the glass of thickness >=50 micron.

According to the 34th aspect there is provided the product of either side in a kind of 27 to 33 aspects, wherein described The combination thickness of thin plate and the carrier is 125 to 700 microns.

According to the 35th aspect there is provided it is a kind of from either side in terms of 27 to 34 described in product The method for forming multiple required parts, including：

The releasing layer is locally heated to >=temperature of second predetermined temperature to be to form multiple bonding profile lines.

According to the 36th aspect there is provided the method for a kind of 35th aspect, in addition to：Using not making the releasing layer Be subjected to higher than first predetermined temperature temperature technique on the thin plate forming apparatus.

According to the 37th aspect there is provided the method for a kind of 35th aspect, in addition to：According to claim ten three to Part needed for the method for either side is removed in 17 aspects.

According to the 38th aspect there is provided a kind of method of the forming apparatus on thin plate, including：

At least a portion of described device is worked on the thin plate of product, wherein the product includes thickness≤300 Micron and be bonded to thickness >=100 micron carrier thin plate, and also described bonding include it is multiple with a bond strength First area and the second area with the second bond strength for being significantly higher than first bond strength；

At least described carrier of the product is cut, so that the first product part and the second product part are formed, wherein First product part includes at least a portion of one in the multiple first area and the second area；

The extention of described device is worked on first product part.

According to the 39th aspect there is provided the method for a kind of 38th aspect, wherein, it is described to cut along secondth area Line in domain is carried out.

According to the 40th aspect there is provided the method for a kind of 38th or 39 aspects, wherein, performing the cutting makes Obtaining first product part includes at least a portion around its circumference of the second area.

According to the 40th one side there is provided the method for either side in a kind of 38 to 40 aspects, in addition to：From such as First product part in aspect 13 to 17 described in either side removes at least a portion of the thin plate.

According to the 42nd aspect, in first to the 18th or 27 to 40 in one side in either side, thin plate It is glass plate, and carrier is glass plate.

Brief description of the drawings

Fig. 1 is the schematic plan of the product with the thin plate for being bonded to carrier.

Fig. 2 is the schematic end of the product from Fig. 1 in terms of the direction of arrow 3.

The flow chart for the step of Fig. 3 is thin plate of the processing with carrier.

Fig. 4 is indicative flowchart the step of cleaning to plate.

Fig. 5 is the schematic plan of the product with the thin plate for being bonded to carrier according to one embodiment.

Fig. 6 is the partial sectional view of the product with the thin plate for being bonded to carrier according to another embodiment.

Fig. 7 is the schematic plan of the product with the thin plate for being bonded to carrier according to another embodiment.

Fig. 8 is the schematic plan of the product with the part for needing to remove from carrier.

Fig. 9 is analogous to Fig. 8 schematic diagram, but including cross section.

Figure 10 is the sectional view of the product with ventilating opening formed therein.

Figure 11 is the top view of the product with ventilating opening formed therein.

Figure 12 is the sectional view of the required part 56 removed from product.

Figure 13 is the top view of the product with the thin plate for being bonded to carrier according to another embodiment.

Figure 14 be along 14-14 interception Figure 13 product sectional view.

Figure 15 is the top view of Figure 13 products with bonding profile.

Figure 16 is the schematic diagram that laser and cooling agent convey head.

Figure 17 is the schematic diagram of another embodiment on laser and cooling agent conveying head.

Figure 18 is the curve map of the solubility of the various compound elements of the glass in ammonium acid fluoride.

Figure 19 is the curve map for showing the decomposition aluminium in the etching solution with various compound elements.

Figure 20 is the curve map for the concentration for showing the decomposition calcium in the etching solution with various compound elements.

Embodiment

In the following detailed description, in order to illustrate rather than the purpose of limitation, showing for specific detail is disclosed by illustrating Example embodiment so as to be fully understood by the present invention each principle.But, one of ordinary skill in the art is using for reference this paper institutes After the content of announcement, for them it is readily apparent that can without departing from detail disclosed herein other implementations Example puts into practice the present invention.In addition, omitting to the description of known devices, method and material so that the description of the principle of the invention is clear. Finally, identical component is denoted by the same reference numerals as far as possible.

Scope can be expressed as from " about " particular value and/or to " about " another particular value herein.When represent so When one scope, another embodiment is included from a particular value and/or to another particular value.Similarly, when before use When sewing " about " expression numerical value for approximation, it should be appreciated that concrete numerical value forms another embodiment.It should also be understood that each scope End value either connects with another end value and is also independently of another end value, all meaningful.

Directional terminology used herein-for example upper and lower, right, left, forward and backward, top, bottom-provide only referring to accompanying drawing and It is not intended to imply that absolute direction.

Clearly indicate unless otherwise, any method described in this paper in any way be not considered require with Specifically sequentially perform its step.Correspondingly, claim to a method be actually not required for following its sequence of steps or Do not particularly point out step in claims or specification otherwise and be limited to specific order, in all respects not purports Order is being specified in any way.In understanding, this all sets up for any possible non-express basis, including：Relative to work The logic item of sequence arrangement or operation stream；The clear meaning obtained from grammatical organization or label；Embodiment described in specification Quantity or type.

As used herein, " one " of singulative, " one " and "the" also include plural thing, unless up and down Text clearly otherwise provides.Thus, for example, the reference to " part " includes the side with two or more such parts Face, unless context clearly otherwise provides.

Overall description

With reference to Fig. 1 and 2, the carrier 10 with thickness 12 is bonded to thin plate 20 so that thin plate 20, i.e., with 300 microns or The thin plate of smaller thickness 22 (includes but is not limited to such as 10-50 microns, 50-100 microns, 100-150 microns and 150-300 The thickness of micron) it can be used for existing apparatus to process foundation structure.When carrier 10 and thin plate 20 bond together, its combination thickness 24 It is identical with the thicker plate designed by device process equipment.If for example, processing equipment is designed for 700 microns of plates, and thin plate With 300 microns of thickness 22, then thickness 12 elects 400 microns as.

Carrier 10 can be made up of any suitable material, including such as glass or glass-ceramic.If be made up of glass, Carrier 10 can have any suitable composition, including alumino-silicate, borosilicate, aluminoborosilicate, sodium-calcium-silicate and root According to and final application can be containing alkali or alkali-free.Thickness 12 can from about 0.3 to 3mm, such as 0.3,0.4,0.5,0.6,0.65, 0.7th, 1.0,2.0 or 3mm, and thickness 22 will be depended on as described above.In addition, carrier can be by one layer (as shown in the figure) or bonding Multilayer (including multiple thin plates) together is made.

Thin plate 20 can be made up of any suitable material, including such as glass or glass-ceramic.It is when being made up of glass, then thin Plate 20 can have any suitable composition, including alumino-silicate, borosilicate, aluminoborosilicate, sodium-calcium-silicate and according to And final application can be containing alkali or alkali-free.The thickness 22 of thin plate 20 is 300 microns or smaller, as described above.

Thin plate 20 is bonded to carrier by region 40, wherein having between the surface of thin plate 20 and the surface of carrier 10 directly Contact.It is not bonded between carrier 10 and thin glass plate 20 or relatively weak bonding (as described above) in region 50, this Afterwards only for being referred to as nonbonding region with reference to convenient, even if may there is some form of weak bond to close.Nonbonding region 50 has side Boundary 52, is arranged on outside bond area 40.

This concept is related to by Van der Waals for is initially bonded to carrier 10 by flexible board 20, then increases in some regions Plus bond strength is while remove thin plate with the ability of forming apparatus after being maintained at processing thin plate/carrier products.This concept is also related to And：Clean and surface prepares thin plate 20 and carrier 10 to be bonded；Thin plate 20 is initially bonded to carrier 10；In bond area Initial being bonded between 40 reinforcing thin plates 20 and carrier 10；The releasable of thin plate 20 and carrier 10 is provided in nonbonding region 50 Property；And pull out the required part 56 of thin plate 20.

Overall craft flow

Fig. 3 shows the overall craft flow for this concept.Carrier process 102 is included on the choosing of size, thickness and material Select suitable carrier.Then carrier is cleaned in process 104.106, handle carrier to realize that from thin plate there are different bond strengths Region.Then carrier can be cleaned again in process 104a, process 104a can be identical or different with process 104.Or, according to making Which process to realize the region of bond strengths different from thin plate with, carrier can use different cleaning process cleans, or complete It is complete unclean.Then prepare carrier being bonded to thin plate in initial bonding process 108.In technological process 122, on its size, Thickness and material selection thin plate.Thin plate can have the size about the same with carrier, slightly larger or smaller.After selection, at 124 Clean thin plate.Cleaning process 124 can with used in 104 it is identical or different.The purpose of cleaning process is to reduce carrier and thin plate Bonding face on particle or other impurity amount.At 108, the bonding face of thin plate and carrier is in contact with each other.At 110, perform For the process being bonded between enhancement vector and thin plate.At 112, carrier/sheet products are formed through being subject to processing on thin plate Device.At 114, alternatively, carrier and thin plate can cut into smaller portions when thin plate is still bonded to carrier.At 114 Cutting (in the presence of) can occur after processing 112, before processing 112 or between two different steps of processing 112.Then 116, at least a portion of thin plate is removed from carrier.

Carrier and thin plate selection-example 1

Carrier is chosen to have：0.7mm thickness；The Circular wafer of 200mm diameters；Corning Incorporated EagleGlass Composition.Thin plate is chosen to have：100 microns of thickness；Less than the size of carrier；And Corning Incorporated EagleGlass into Point.

Cleaning glass -104,104a, 124

The cleaning process is mainly used in removing the particle that may interfere with and be bonded between thin plate and carrier.But, this was cleaned Journey can also be used for making carrier surface coarse, and thus form nonbonding region to realize different keys with reference to processing as described below Close intensity 106.The cleaning process can at 104 carrier (and/or thin plate, if thin plate is also or alternatively through being subject to processing on 106) Carried out before processing 106, carry out or all enter before and after processing 106 after this processing 106 at 104a OK.Cleaning process can also be carried out before initial bonding on thin plate, even if thin plate is not subjected to surface treatment at 106.

Cleaning process 104 generally includes up to four steps：The overall first step for removing organic matter；The of additional cleaning Two steps；The third step of rinsing；And the four steps dried.

The overall first step for removing organic matter may include to be cleaned with one or more of following：With dissolving The DI water of ozone；O₂Plasma；Sulfuric-acid-hydrogen-peroxide mixture；And/or UV- ozone.

The second step of additional cleaning may include standard clean -1 (SC1).SC1 is alternatively referred to as " RCA cleanings " in this area. The process may include ammonia solution, and following article is discussed on processing 106, and cleaning can be not only performed with some materials but also surface is performed Roughening.Instead of SC1, it can be used JTB100 or Bake cleaning (Baker clean) 100 (can be from company of Jie Te Australia (J.T.Baker Corp.) is bought), it does not include ammonia solution, and does not therefore carry out surface together with cleaning for some materials Roughening, also following article combination processing 106 is discussed.

Rinsing can be in DI water by quick dump rinse (QDR) progress, such as by the way that water is flowed through into plate (appropriate carrier Or thin plate) and carry out.

Four steps is drying steps, and may include that kalimeris dagger-axe Buddhist nun (Marangoni) type is dried, including isopropanol.

The cleaning process 104a and 124 just occurred before initial bonding at 108 in some cases can be as initial key Final step before conjunction includes cleaning to remove organic material.Therefore, the various processes order above in association with 104 descriptions is arranged Arrange into and cause step 2 after step 1.It is preferably, thus if having any notable delay between cleaning 1 and 2 Organic matter (environment deposited from carrier and/or thin plate) is collected thereon.But, if do not had between step 1 and 2 Significant practice, or carrier/thin plate are stored in the environment containing a small amount of organic particle, such as clean room, then step 1 and 2 can the order generation, cleaning organic matter before thus just need not being initially bonded at 108.At all other aspect, process is cleaned It is identical that 104a, 124 still above in conjunction 104 are described.

Clean example -1

Each carrier and thin plate from carrier and thin plate selection-example 1 are by by four step process, wherein matching somebody with somebody substantially Side be the dissolved ozone cleaning in casing 403, the SC1 steps 420 in casing 402, the rinse step 430 in casing 403, And the drying steps in casing 404.All mixtures are by volume unless otherwise stated.NH used herein₄OH is 14.5 moles of (28 w/w NH in water₃).H used herein₂O₂It is 30 weight %H in water₂O₂.DI or DIH₂O refers to Deionized water and these terms are used interchangeably herein.

Fig. 4 is the cabinet arrangement of service machine, including each casing relative position, in the esoteric mistake of the particular box Journey, the technological process by machine and used design parameter.In this process, casing 401, without using etching (including HF/HCl is etched).Following steps are performed in casing 402 to 404 is respectively designated as.

In first step 410, glass is put into comprising dissolved ozone (DIO₃) casing 403 in.Details as Follows：

DI water with dissolved ozone

Ozone concentration：30ppm

Time：10 minutes

Temperature：Environment temperature (about 22 DEG C)

Flood flow：44Lpm

In second step 420, sample is put into the casing 402 comprising SC1 solution.Details as Follows：

1 part of NH₄OH：2 parts of H₂O₂：40 parts of DI water

Temperature：65℃

Time：5 minutes

Million sound：350w,850kHz

In third step 430, sample is put into casing 403 to carry out quick dump rinse (QDR).Details as Follows：

Time：10 minutes

Rinsing：44Lpm DI water high flow capacity jet flows

Temperature：Environment temperature (about 22 DEG C)

In four steps 440, it is dried in IPA steams.Details as Follows：

Time：10 minutes (including the advance jet flow of Marangoni type is rinsed and N₂/ IPA low discharges are dried)

Time：2 minutes final 150 DEG C of N₂High flow capacity is dried

Clean example -2

The carrier from releasing layer application-example 1 is fetched below and is carried out identical clear described in cleaning example -1 above Clean process.

Processing -106 for realizing different bond strength regions

It is simple in order to explain in the whole specification, description is carried out on carrier from realizing different bond strength areas The processing in domain.It should be noted, however, that or this processing can be performed on thin plate or on both carrier and thin plate perform.

A kind of mode for forming nonbonding region is that material is deposited on carrier, is subjected to being expected in device process Thin plate, which is not provided with into, during temperature is bonded to the nonbonding region.Therefore institute's deposition materials are formed between carrier and the surface of thin plate Releasing layer.Preferably institute's deposition materials are that cleanable (so as to be subjected to cleaning process as described herein, the process is used to promote Realize the good bonding of bond area) it is removable from carrier by etching, and can also easily be formed rough surface (for example when It is in preferably crystal form when they are present on carrier) it is bonded in order to which thin plate is disengaged with carrier.For the appropriate of releasing layer Material includes aluminium-doped zinc oxide (AZO), the 0.2-4.0% Ga-doped zinc oxide of such as zinc oxide (ZnO), 0.2-4.0% (GZO), tin oxide (SnO2), aluminum oxide (Al2O3), gallium oxide (Ga2O3), bismuth oxide (Bi2O3), F-SnO₂、F-SiO₂, with And TiON and TiCN.It can be used standard deposition technique that material is placed on carrier.

The releasing layer can be run based on the principle for increasing the roughness at interface between thin plate and carrier, be consequently formed nonbonding Region.Thus, releasing layer may include >=2nm Ra surface roughness (average surface roughness) is in order to preventing nonbonding area The secure bond in domain.However, as surface roughness increases, the gas flow being captured between thin plate and carrier also increases, and this leads Cause the process problem being discussed herein.Thus, the amount of workable surface roughness may have the upper limit in practice.The upper limit may take Certainly nonbonding region is ventilated in the treatment technology for being initially bonded and by using the ventilation bar or groove being discussed herein.

The roughness on surface can adjust to increase surface roughness by acid etch step.Acid etching can be used as independent step To perform, or it can suitably be selected and be combined with cleaning by the clean solution of the material relative to releasing layer.But from technique Viewpoint is seen, it is advantageous that while carrying out surface roughening and cleaning.

For example, using AZO films, can be then clear by alkali by using acid (such as pH value is 2 HCl solution, room temperature) etching Clean (such as with ammonium hydroxide (TMAH)) and will etching be used as independent step perform.Alkali cleaning can be used in carboxylate buffer TMAH H₂O₂Carried out with standard JTB100.In one example, using with 30%H₂O₂JTB100, in carboxylate buffer TMAH, surface roughness is reduced to 1.1nm from 2nm.In addition, the clean solution is easily from the rinsing of AZO films, this is bonded in carrier To advantageously causing low deflation during thin plate and/or when product is processed by device.Thus, which can be carried out in some cases Surface roughening and cleaning, when such as using the less measure of gas trapping between carrier and thin plate is prevented.

In order to be cleaned and be roughened in one step, to AZO films, such as SC1 techniques (40 can be used:1:2DI: NH₄OH:H₂O₂) surface roughness from 2.0 is increased into 37nmRa.(wherein need the situation of process simplification in some cases Under), when using the further measure of gas trapping between carrier and thin plate is prevented, combination cleaning and roughening are preferably.

Alternatively, releasing layer can be based on the principle operation being bonded with thin glass plate formation without OH, and need not have is specific thick Rugosity is to provide nonbonding region；Such material may include such as tin oxide, TiO₂, silica (SiO₂), heat proof material, SiN (silicon nitride), SiC, diamond-like-carbon, graphitic carbon, graphite, titanium nitride, aluminum oxide, titanium dioxide (TiO₂), SiON (nitrogen oxidations Silicon), F-SnO₂、F-SiO₂And/or the material of fusing point<1000 DEG C, and/or strain point>About 1000 DEG C those materials.

The releasing layer thickness should be selected such that its do not cause the gap between carrier and the bonding surface of thin plate to cause Thin plate when bonding surface is contacted by excessive stresses degree.Excessive stresses in thin plate may cause to attempt to be bonded to carrier The damage of thin plate during period and/or the processing of subsequent device.That is, for example, it is assumed that thin plate have flat surfaces (i.e. towards carrier and There is no the surface of depressions or protrusions in the region of releasing layer, releasing layer can not should bear to be more than 1 above the bonding surface of carrier Micron, such as the gap between the bonding surface of thin plate and carrier should be, for example ,≤1 micron ,≤500nm ,≤200nm ,≤ 100nm ,≤50nm ,≤25nm ,≤15nm ,≤10nm or≤5nm.On the other hand, releasing layer is needed with enough thickness Degree is so as to prevent the surface bond of thin plate and carrier.Thus, there is the completely flat surface of face each other in thin plate and carrier In the case of, releasing layer should have >=0.2nm thickness.In other cases, thickness 10-500nm releasing layer is acceptable. In other cases, thickness 100 to 400nm releasing layer are acceptable；These pass through test and find to allow bonding Abundant bonding in region, but nonbonding region is also provided.In some cases, releasing layer can part be arranged on carrier and/ Or in the depression in thin plate.

Releasing layer can allow selected portion less than pattern is formed between thin plate 20 and carrier 10 in whole contact area Divide and nonbonding region 50 is formed between thin plate and carrier.For example, with reference to Fig. 5.Nonbonding region 50 has circumference 52.That is, release Put layer and can form pattern to allow releasable material and/or surface treatment to be applied to region 50 and non-area 40.Thin plate 20 and carrier 10 remainder, i.e. bond area 40 are bonded together.Therefore, can by along dotted line 5 or its each subset cutting and will be any The required part 56 of quantity is separated with any amount of other required parts 56, and all required parts 56 are still bonded to carrier 10.It may be desirable that and be divided into smaller subelement further to handle by product 2.In this case, bond area 40 and non- The arrangement of bond area 50 be advantageous in that thin plate 20 and each several part of carrier 10 still around its circumference be bonded so that place Reason fluid does not enter therebetween, and treatment fluid may pollute subsequent process, or may separate thin plate 20 with carrier 10.

Although being shown in Figure 5 for a thin plate is bonded to a carrier, multiple thin plates 20 are bonded to a carrier 10, any of which thin plate 20 is bonded to carrier 10, with any appropriate number of nonbonding area surrounded by bond area 40 Domain 50.In this case, when required part 56 is separated with other required parts 56, carrier 10 can be in each of different thin plates 20 Separated between bond area 40.

The second way for forming nonbonding region is that have different bond strengths by being used between thin plate and carrier Different materials.For example, SiN can be used in nonbonding region_x, and SiO can be used in bond area₂.In order to form these two kinds Different materials region, can be used following technique.Can be by PECVD by SiN_xFilm is deposited in the whole surface of carrier.Then may be used By PECVD by SiO₂Film is deposited on SiN_xOn top, the pattern of formation causes its region for being deposited on needs bonding.

The third mode for forming nonbonding region is to use O₂Plasma increases the bond strength of material, otherwise can be with Thin plate formation weak bond is closed.For example, SiN_x(silicon nitride) can be deposited on whole carrier surface.Shutter can be used to stop nonbonding Region is closed, and then by O₂Plasma is applied to de-occlusion region.Pass through O₂The SiN of plasma treatment_xIt is sufficiently tight by being formed Bonding by sheets of glass to be fixed to carrier, and untreated SiN_xNonbonding region will be formed.

The 4th kind of mode for forming nonbonding region is the surface roughening by using carrier, thin plate or both.Nonbonding Close increase of the surface roughness relative to bond area in region so that be bonded the enhancing phase in device processing or bond area Between heat when do not form thin plate to the bonding of carrier.Surface roughening can be with forming the first, second or third of nonbonding region The technology of the mode of kind is used together.For example, the surface of carrier forms texture or roughening at least nonbonding region.For example, carrying Body surface face can be handled with the acid solution of increase carrier surface roughness.For example, the acid in solution can be H₂SO₄、NaF/H₃PO₄It is mixed Compound, HCl or HNO₃.The other manner of surface roughening includes such as sandblasting and reactive ion etching (RIE).

According to an embodiment of the 4th kind of mode, roughened surface can be by printing on one needed for thin plate and carrier Glass etching cream is provided.

More specifically, reactive ion etching (RIE) and such as Gateway solution etch process need mask process Form bonding and nonbonding region.Photoetching is expensive but accurate.The additive method of such as thin film deposition can also be used for forming nonbonding Close region.Pass through the chemical vapor deposition of the tin oxide (FTO), carborundum (SiC) and silicon nitride (SiNx) of such as Fluorin doped (CVD) film of deposition needs the lithographic patterning and wet type or dry-etching of costliness that nonbonding region is formed into pattern.Pass through The film of physical vapour deposition (PVD) (PVD) deposition of such as alumina doped zinc oxide (AZO) and tin indium oxide (ITO) can shadow cover Cover that nonbonding region is patterned and formed in a processing step.But, all these film process need heavy to vacuum A large amount of capital investment, photoetching and the etch capabilities of product equipment.

The formation in nonbonding region and patterning are combined to the less capital intensive of a step and the mode of low cost It is etchable and roughening glass substrate the glass etching cream of printing.Glass etching cream uses the villiaumite and inertia as etchant Material is etched or " frostization " soda-lime glass with covering.The nonbonding region patterned on carrier can by screen printing etch cream with Low cost easily forms.The etching paste method of surface roughening makes it possible to the pattern of etching restriction to form nonbonding area Domain, and roughness can be caused in the limited area while reserving remaining glass surface for reset condition.In addition, surface roughening The multipurpose of etching paste method be that the viscosity of cream is adjustable so as in silk-screen printing, and the composition of cream is customizable with to difference Glass ingredient produce needed for etching roughness.

Display glass composition available for thin plate and/or carrier is made with high strain-point, high chemical durability and height Rigidity.These characteristics cause the rate of etch of display glass in etching paste significantly less than soda-lime glass.In addition, such as display glass The multicomponent glass of glass may not be etched uniformly.The solubility of multicomponent glass can be estimated from equilbrium solubility theory.Health Peaceful EAGLE XG^TMGlass (healthy and free from worry Corning Incorporated is commercially available from New York) is calcium aluminoborosilicate.Assuming that with by allow precipitation End pieces constitute infinite solid contact, use ChemEQL for the etching composition of various concentration(http:// www.eawag.ch/research_e/surf/Researchgroups/sensors_and_analytic/ chemeql.html) estimation EAGLE XG^TMSolubility.Figure 18 is shown according to calcium in ammonium acid fluoride (line 1801, triangle data Point), aluminium (line 1802, x data points), the pH value of boron (line 1803, square data points) and silicon (line 1804, diamond data points) Solubility.Other component oxides of the solubility of calcium than pH value higher than 5 are much lower.Because cream etching is generally near neutral pH To improve security and processing, people are expected the selective etch of calcium-aluminium borosilicate glass and leave deposition on etching surface Calcium oxide and salt.Figure 19 shows influence of the various etching paste composition compositions to the solubility of aluminium.With sodium bifluoride (line 1902, Triangular data points) ammonium acid fluoride (line 1901, square data points) is replaced, and with ammonium chloride (in line 1903, x data points) portion Divide the changes in solubility that aluminium is not almost provided instead of ammonium acid fluoride.Only ammonia is replaced to have little to no effect with another univalent cation (alternative line 1901 and 1902).Chlorine additive (line 1903) somewhat suppresses the aluminum concentration of dissolving.But, add sulfuric acid and barium sulfate (such as in use, line 1904, diamond data points in Armour etching frosts) is shown in the aluminium solubility reduction (line with ammonium acid fluoride 1901 are compared).In addition, such as from Figure 19 and 20, compared with the situation of ammonium acid fluoride (2001 lines, square data points), With the reduction of the aluminium (line 1904) always dissolved, the addition of barium sulfate and sulfuric acid (2004 lines, diamond data points) is considered as notable Increase the calcium always dissolved.Therefore, the acid etching cream of barium sulfate-containing and sulfuric acid compared with ammonium acid fluoride with only substantially reducing calcium aluminium boron The preferential corrosion of silicate glass.Sulfate is a good selection, because most of sulfate remove barium and strontium high soluble, institute So that barium sulfate can be added as masking material.Further, it is noted that calcium solubility is dramatically increased as pH value is reduced, so can By using the preferential etching of simple pH value regulation reduction (wherein calcium etching is less) of sulfuric acid (so that calcium etching is more, and therefore more Equably remaining composition with glass is constituted).

Verified glass etching cream forms nonbonding region.Carrier (0.63mm Eagle XG) is by by carrier surface Roughening forms bond area and forms bond area and be bonded to thin plate (0.1mm Eagle XG), allows in bond area former Beginning state glass surface carries out van der waals bond before the strong covalent bond that 500 DEG C of annealing are formed.In this example, it is fast light Mask forms nonbonding by lithographic patterning, and using commercially available etching paste (Armour etching pastes) (10 minutes etching periods) Region.Calcium-aluminium borosilicate glass is etched for being formed under conditions of examples detailed above with etching paste, and finds surface roughness Increase to 0.42nm from 0.34nm.Typical bonding technology is used, 0.1mm sheets of glass is bonded, leaves nonbonding central area With strong bonding edge.The carrier of the bonding passes through 70mTorr vacuum cycle, 600 DEG C of heat treatment, and generally LTPS works The wet processing of skill.

Etching paste can be applied to the figure of restriction by the various typographies of such as silk-screen printing, ink jet printing or transfer Etchant pastes are applied to each region of carrier to form nonbonding region by case, typography.Silk-screen printing is the mould of printing The open area that plate method, wherein etching paste can be forced through template during scraper stroke via filling blade or scraper is arrived Up on carrier.Apply etching paste in the given time to realize required roughness.By change etching paste application time, temperature and Composition can change roughness.For example, application time at room temperature can be from 2 to 20 minutes.After cream etching, generally with heating Alkaline aqueous solution, using or without using such as scrub mechanical agitation, ultrasound or million sound stirring cleaning carrier.After flushing, Substrate is molten in the standard clean 1 (SC1) of the alkali by DI water, such as ammonium hydroxide or tetramethylammonium hydroxide and hydrogen peroxide Cleaned in addition in liquid.Then by carrier and the contact of thin glass part to form van der waals bond, and higher than 450 DEG C (for example 500 DEG C) it is heat-treated to form the covalent bond between thin glass and carrier.

According to the second embodiment of the 4th kind of mode, synthesis under normal pressure ion(ic) etching (AP-RIE) can be used.AP-RIE can Glass carrier region is roughened for the method by using mask method or the photoresist of polymer.These film sides Method needs substantial amounts of fund input.If manufacturer has possessed processing equipment, manufacturer can utilize the existing of process equipment Capital investment, while obtaining for PV, OLED, LCD and the thin glass plate of other application manufacture advantage.

AP-RIE is the technology used in micro manufacturing.The technique using chemical reactivity plasma with from substrate remove material Material.In the process, plasma is generated using low pressure (usual vacuum) by electromagnetic field.Cream energetic ion from plasma is invaded Erosion substrate surface simultaneously forms surface roughness.Using plasma gun or the jet being incident in limited area conveying AP-RIE with It is roughened, that is, in the case of needing nonbonding region.Plasma uses the attached region exposed of two methods.For the mesh Suitable reactivity gas be NF₃、CF₄、C₂F₆、SF₆Or usual any fluorine gas.Now the mask for implementing AP-RIE will be described The method of the photoresist of method or polymer.In the description of these methods, carrier is described as etching is used for nonbonding to be formed Close the carrier of the rough region in region.But, according to the final application of thin plate, thin plate also can or be alternatively etching to be formed Thin plate for the appropriate surface roughness in nonbonding region.

Mask method

Mask method is lower than the method cost of the photoresist of polymer, at least partly because there is less processing step Suddenly, it is necessary to less equipment.Mask material can be several materials for being not easy etching of such as metal, plastics, polymer or ceramics Material.But, mask method may be accurate not as the method for photoresist, and is therefore not suitable for some applications.More specifically, passing through What mask method was formed exposes edge not as edge limited must understand of the method formation of the photoresist of polymer.

Program for implementing mask method is as follows.Mask is placed on glass carrier.Then AP-RIE plasmas are used To etch the glass carrier region exposed.Then mask is removed from glass carrier.And it is last, glass carrier is cleaned to move Except the particle that is bonded, bond area and the nonbonding so formed are may interfere between thin glass plate and carrier in bond area Region is adjacent.

The method of the photoresist of polymer

The method of the photoresist of polymer is higher than mask means cost, is thrown at least partly because being related to more capitals Money, and have more processing steps.But, this method is more accurate than mask means, and therefore may be more suitable for some applications.By poly- The exposed edge that the method for the photoresist of compound is produced more clearly is limited than the exposed edge produced by mask means.For The program for implementing the method for the photoresist of polymer is as follows.By the photoresist of polymer be deposited on glass carrier with Bond area needed for stopping.Photoetching (exposure and development photoresist) is performed with the pattern of bond area needed for limiting, wherein By the surface roughening of carrier.AP-RIE plasma etchings are carried out on the exposed region of glass carrier.Exposure can occur in glass The front portion or rear portion of glass.In any case, polymer protection is referred to as the region of bond area.

Then removed agent with the polymer resist of such as oxygen ash or the mixture of sulfuric acid hydroperoxides (SPM) and removed and gathered Compound.Finally clean glass carrier may interfere with being bonded in required bond area between thin glass plate and carrier to remove Grain.

Clean method suitable for being used after above-mentioned AP-RIE methods may include detergent washing or RCA-type cleaning (such as It is known in the art).These conventional cleansing methods can be used after the etch is completed.The cleaning process is mainly used in removing required key Close in region and may interfere with the particle being bonded between thin plate and carrier.The cleaning process generally includes to remove organic matter, extra clear Clean, flushing and drying.

Detergent washing methods is washed in ultrasonic wave with KG, Parker 225 or Parker 225X detergent are removed Particle and light residue.Pass through such as KG washings, the removable Asia of Parker 225 or Parker 225X detergent in million sound Micron particles.Rinsing may include to rinse in room temperature to the DI water at 80 DEG C in ultrasound or million sound.In addition, rinsing may include to use IPA is rinsed.After flushing, carrier glass is dried.Compressed air can be used to dry the carrier of mask with air knife.Polymer The carrier of photoresist formation can be dried with nitrogen.In either case, it can be dried in kalimeris dagger-axe Buddhist nun's drying machine.

RCA clean methods include three cleanings, rinse and dry.It can carry out the first cleaning to remove with SPM Weight organic matter.Second cleaning may include standard clean 1 (SC1), wherein using as needed with or without ultrasound or million sound The solution of the ammonium hydroxide of dilution, hydrogen peroxide and DI water.The cleaning removes little particle and submicron particles.Second After cleaning, it is rinsed with or without ultrasound or million sound in DI water.Alternatively, in second cleaning therebetween, The washing with brush can be carried out.Nylon, PVA or PVDF materials can be used for brush.If washed using brush, hereafter exist Room temperature with DI water in ultrasound or million sound to can carry out another once flushing at 80 DEG C.3rd cleaning includes standard clean 2 (SC2) it is used to remove metal pollutant.SC2 be included in room temperature at 80 DEG C with ultrasound or million sound HCL：H₂O₂：DI or HCL：DI Amount the time required to solution is carried out.After the 3rd cleaning, sample is rinsed in DI water with or without ultrasound or million sound.Most Afterwards, using compressed air air knife drying sample.Alternatively, nitrogen can be used to be done with kalimeris dagger-axe Buddhist nun's drying machine for sample It is dry.

The fifth procedure for forming nonbonding region is directed to use with photoetching process.The material closed with thin plate formation weak bond is deposited On carrier；Such as material can be SiNx.SiNx for example by photoetching process formation pattern, thus removes bond area SiNx, thus allows thin plate to contact and be bonded with the surface of carrier.

It is above-mentioned that 80 combined uses are bonded with edge for forming any of nonbonding region method.See Fig. 6.Periphery keys Closing 80 can be by thin plate 20 to the laser fusion of carrier 10 or for example, by being applied to the edge of thin plate 20 and the table of carrier 10 Frit or polyimides (or other adhesives of expected temperature during device processing can be born) between face and formed.As schemed Shown, the edge of thin plate 20 is from the marginal trough of carrier 10 to aid in preventing thin plate 20 to be processed equipment or other damage. Edge bonding 80 may extend into edge lower section as the cladding region 81 of carrier to reduce treatment fluid into thin plate 20 and carrier Probability between 10, this can increase the risk that thin plate 20 comes off from carrier 10.Bent in thin plate 20 or otherwise miscellaneous side Not in full conformity with the case of the surface profile of carrier 10 at edge, this is probably using situation during ventilation bar 70, edge bonding 80 come in handy.Under any circumstance, being bonded 80 using edge helps to increase the reliability of product.Although Fig. 6 shows thin plate Releasing layer 30 between carrier, but this method is available for any other mode for forming nonbonding region.In addition, edge is bonded 80 entirety that can be provided between thin plate 20 and carrier 10 are bonded, or can supplement other bonding regions between thin plate 20 and carrier 10 Domain, such as bond area of formation as described herein.

Releasing layer application-example 1

AZO is splashed on carrier using the carrier for carrying out automatically cleaning example 1 and in nonbonding region.That is, using mask Stop the AZO of sputtering in bond area coated carrier.AZO passes through the 1%O in 10mT pressure, Ar gas₂And 2.5W/cm₂Power is close Deposited under spending (at target) by being sputtered from 0.5 weight %ZAO targets RF.

Selection AZO is that crystal AZO can hold because it is easy to from inexpensive metallic target reactive sputtering to form crystal AZO Change places roughening, cleaning and remove (formation pattern).Crystal AZO grainiess can provide appropriate surface roughness.In addition, AZO is easy to by acid or alkaline solution roughening or removed.Specifically, roughening can pass through alkali after acid etching after deposition Cleaning also cleans and removed the alkaline etching of organic matter to realize.Etch and realized at room temperature with pH value for 2 HCl solution, Thus surface roughness is increased into 9.0nmRa from 2.9nmRa with the etching period of 5 seconds.

Initial bonding process 108

In order to prepare the initial bonding of the plate (thin plate and/or carrier) with releasing layer thereon, preheating step can be used.In advance One target of hot step is cleaning and/or formed after releasing layer to drive away the volatile matter of any residual.Preheating step is advantageously Then bonded support/sheet products device processing during at a temperature of desired temperature is close to or higher than heating plate.Such as The temperature that fruit uses during preheating is less than prediction mechanism processing temperature, then can drive away additional volatile matter during device is processed, make Gas buildup can cause thin plate to be discharged from carrier or web breaks in nonbonding region, in some cases this.Even if not thin The separation or fracture of plate, these gases may also cause thin plate to swell, and this can cause it to be unsuitable for for example needing a fixed board to put down Handled in the apparatus and method of smooth degree.

Heating stepses can be used for minimizing or prevent the water absorbed from being formed on bonding surface at once before bonding, and this is big It is big to improve vacuum and performance under high temperature and allow to form strong bonding between carrier and thin glass.

Such as empty gas and water caused by during bonding technology or the captured gas of volatile matter can be due to during user is handled Elevated temperature (150 DEG C -600 DEG C) or vacuum environment and expand, this can cause the separation of thin glass, fracture or to influence or interfere User is handled or the mode of processing equipment is swelled.But, need hydroxy-end capped surface thin to realize for bonding glass surface Being bonded between glass and carrier.Have from the absorption of nonbonding (coarse) region removing of physical and chemical absorbed water and be bonded without removing Delicate balance between silanol stopped group needed for region is to keep being bonded between thin glass and carrier.

The balance can prepare to realize by following bonding surface.Carrier and thin glass are first in conventional cleaning line alkalescence Detergent and ultrasonic agitation cleaning, and carry out DI water flushings.Followed by O₂Plasma cleans, and in 75 DEG C of dilution SC1 baths (40： 1：2DI:NH₄OH:H₂O₂Or 40：1：2DI：JTB100：H₂O₂) in carry out 10 minutes.According to the property on nonbonding surface, carrier and Thin glass is subjected to the water that the baking of 150 DEG C of hot plates of 1 minute is adsorbed with removing of physical, or be subjected to 450 DEG C of vacuum annealings of 1 hour with Remove the chip of chemisorbed.After free water is removed, thin glass and carrier are contacted with pre- by Van der Waals for quickly Bonding, and in T>It is heat-treated to form covalent bond at 450 DEG C.

After SC1 cleaning processes, people are expected glass surface and are full of hydroxyl (~4.6OH/nm², this should shape after condensation Into 2.3OH/nm²), the individual layer (~15OH/nm covered with the hydrogen combination water combined closely²), and more loosely combine free water (~2.5 individual layer).Free water is lost in a vacuum at as little as 25 DEG C.Reportedly in heating under vacuum to 190 DEG C of removal hydrogen knots The individual layer of Heshui.400 DEG C are heated in addition and removed above except all substances of single silane alcohol groups, but this reduction surface hydroxyl The degree of change.The temperature more than 1000 DEG C is needed to remove all oh groups, but according to the present invention, these are for realizing The suitable performance of thin plate on carrier is not required.

The additive process deposited by such as alumina doped zinc oxide (AZO) or subtracting such as reactive ion etching Except the formation in the nonbonding region of process, or etching paste form increased surface roughness, and it can cause to increase absorption in table Water and the increased chemical change of other gas flows on face.Specifically, with containing NH₄OH and H₂O₂SC1 AZO cleaning draw React the Zn to be formed (OH)₂.The reaction greatly increases surface roughness and forms white dim surface.In heating, Zn (OH)₂Only start the ZnO and water being decomposed to form at 125 DEG C.Also absorbing carbon dioxide is steady to be formed from air for zinc hydroxide Fixed to 300 DEG C of zinc carbonate.

The water and silane alcohols that the free water, hydrogen are combined are to thin glass by being constituted with reference to circumference and nonbonding center by force Carrier on the influence of compatibility can be by estimating the amount of each class reclaimed water and calculating LTPS techniques typical various PVD, CVD Described with the pressure applied when being expanded under dopant activation step by perfect gas law.

(table 1)

		PVD	CVD	Dopant is acted on
					Temperature		100	400	630
Pressure		0.000001	1	760
						H2O/nm2	Δ P (support)	Δ P (support)	Δ P (support)
Silanol	2.3	4.74E+04	8.55E+04	1.14E+05
					What hydrogen was combined	15	3.09E+05	5.58E+05	7.47E+05
Free water	37.5	7.72E+05	1.39E+06	1.87E+06

The evaporation of condensed water should produce the pressure difference of 104 to 106 supports.The pressure difference can cause bending of the thin glass away from carrier and Deviate.The deviation increases the volume between carrier and thin plate, reduces pressure difference.The pressure of application and the thin glass skew produced make thin Glass is by tension force.If tension force is too big, the possibility of thin glass failure can become unacceptable for manufacturing process. The least risk that failure can be caused due to surface water evaporation by making water at least make before bonding.

At once heating carrier and the thin glass carrier of thin glass part degassing para-linkage are passed through before being bonded after the cleaning The influence of vacuum compatibility shown in table 2 and 3.

Table 2

Table 3

Sample	SC1	Degassing	Vacuum failure pressure
				3-1	NH₄OH	450C/1hr	Bear 70 millitorr 25C
3-2	NH₄OH	450C/1hr	Bear 70 millitorr 25C
				3-3	NH₄OH	450C/1hr	Bear but difference bonding, ventilation
3-4	JTB100	450C/1hr	Bear 70 millitorr 25C
				3-5	JTB100	450C/1hr	Bear 70 millitorr 25C
3-6	JTB100	450C/1hr	Failed under 300C under 1 support

These samples are included with containing NH₄The carrier for scribbling AZO of OH or JT Baker 100 SC1 solvent cleans.Such as Upper described, zinc oxide is with containing NH₄OH and H₂O₂SC1 solution reactions, formed Zn (OH)₂.Pass through the vacuum phase of the carrier of bonding Capacitive is estimated by the filling locking pumping in conventional CVD instruments.The system has soft pump valve to slow down initial vacuum surge, And dry pump reaches<The final pressure of 70 millitorrs.Because cleaning between being bonded with not deaerating, all parts near atmospheric pressure with Thin glass breakage and fail.Table 2 shows 150 DEG C of 1 minute hot plate degassings by the failure of the AZO samples cleaned in Baker 100 Point is transferred to close to 1 support, and uses NH₄The sample of OH cleanings fails still near atmospheric pressure.From silicon dioxide meter cited above In the aquation research in face, people are contemplated by 150 DEG C of 1 minute hot plate degassings and remove most of hydrogen combination water.But, possibly can not Complete Zn (OH)₂With Zn (CO)₃Decomposition.Sample 2-1 to 2-7 comparison shows that 150 DEG C of 1 minute hot plate degassings are helpful, but only This is inadequate.In addition, with sample 2-1,2-2,2-3 and the 2-4 cleaned of JTB 100 and using NH₄The sample 2-5 of OH cleanings, 2-6's and 2-7 is relatively shown between both clean solutions almost without difference.Table 3 shows 450 DEG C of vacuum annealings in 1 hour Influence to the vacuum tolerances of carrier.Do not have in bond area flaw (visible before test) all bonded supports pass through it is true No matter whether hollow testing, used chemical agent in cleaning.The sample of table 3 and the comparison of the sample of table 2 show higher temperature and The longer heat time bears more effective in the ability of vacuum condition in improvement thin-walled and carrier.When used in combination, this is found Two kinds of heating stepses are highly effective.Specifically, by 450 DEG C of vacuum annealings in 1 hour (according to the agreement of the sample of table 3) to pattern The carrier that change scribbles AZO is de-gassed, and by heating 1 minute (according to the agreement of the sample of table 2) on hot plate at 150 DEG C Thin glass is de-gassed, 32/33 sample being made has passed through vacuum test.Although thin glass plate has been subjected to the sample of table 3 Agreement, but the lower temperature of the agreement of table 2 and short period may be more economical in some cases.

After any heating stepses, then thin plate and carrier are in contact with each other.A kind of mode so done is by thin plate Float on carrier top, and then make to put contact between the two.Bonding (such as Van der Waals type key is formed at contact point Close) and extended across the interface between thin plate and carrier.This is advantageously avoided between thin plate and carrier trapped bubbles (initial Be bonded air or other gases in environment) because the gas of this trapping can be expanded during subsequent device processing (due to Treatment temperature or vacuum environment), and in some cases, thin plate is caused from the fracture of carrier release, or thin plate.Similarly, such as With above-mentioned volatile matter, even if separation or fracture without thin plate, the gas of these captures may also cause thin plate to swell, this meeting So that it is unsuitable for being handled in the apparatus and method for for example needing a fixed board flatness.

A kind of mode for avoiding bubble is to bend thin plate and/or carrier while contact point is formed, and is then allowed Bending relaxation is straightened until thin plate and carrier.If bubble is trapped between thin plate and carrier, advantageously by right Bubble apply directional pressure until they from the edge of such as product or by venting channels escape and they are removed.In the rank Section, after initial bonding is formed, can treatment articles without worrying arrested particles between thin plate and carrier.Thus, for example, system Then product can transport clean room to handle.

The another way for avoiding bubble is initially bonded in vacuum environment, this contribute to from thin plate and carrier it Between remove gas.However, it is desirable that having thin water film even individual layer on the surface to be bonded.Moved from nonbonding region Except gas, volatile matter and water vapour to limit the gas of trapping, and both the opposition interests for having water on bond area can lead to Crossing makes water vapour flow through vacuum environment to adjust.Suitable temperature, relative humidity and flow rate may be selected to adjust these opposition Interests.

If not having the volatilization of the plate removal sufficient amount of releasing layer from it before thin plate initially is bonded into carrier Thing, then can carry out further degassing before initial bonding.In this point, product can be enough to cause the temperature further volatilized Lower heating.But, if the complete seal part that bond area forms around nonbonding region (such as prevents device technique fluid from entering Required between thin plate and carrier, thus they may pollute downstream process, i.e. seal is sealed), then volatile matter Deflation may cause thin plate to swell.The protuberance can be forced by applying directional pressure trapping gas discharge thin plate and carrier it Between remove, such as removed in edge or via following venting channels.Other ventilation positions can be set as described below.If needed Will, it can allow to be cooled to room temperature in the stage articles.

Initial bonding-example 1

Fetch the carrier of automatically cleaning example -2 and place it on 250 DEG C of hot plate, and kept for 5 minutes in this place, and Then allow to return to room temperature.The thin plate for carrying out automatically cleaning example -1 is floated on the top of the carrier.Thin plate is forced in sheet edges Contacted in portion position and bond area with carrier point.Formed and be bonded between thin plate and carrier, and it is logical to observe that the bonding is propagated Cross bond area.Then the product is placed on hot plate and heated at a temperature of between 350 DEG C to 400 DEG C.It was observed that non- The protuberance of bond area, and then extruded between thin plate and carrier.

Nonbonding region is ventilated

It is non-when being captured in when product 2 is subjected to elevated temperature environment during reduction such as bonding reinforcing can be taken steps to The amount of uplift capacity and/or other undesired effects to thin plate 20 during gas expansion in bond area 50.Reduce these not A kind of mode of desired influence, which is to provide from nonbonding region 50, extends through the logical of arrival thin plate 20 edge of bond area 40 Gas bar 70.Referring to Fig. 7.Ventilation bar 70 can be formed in nonbonding region in identical or different mode.Advantageously, ventilation bar 70 is non- Bond area 50 is formed as releasing layer with identical material.The quantity of each ventilation bar 70 and position depend on the size in nonbonding region And shape.Each ventilation bar 70 allows during any technique of heating product 2, for example during reinforcement process is bonded or worked as product 2 be in vacuum environment when thin plate 20 and carrier 10 between trap gas effusion.Each ventilation bar 70 have width 71 and more than Nonbonding effect is produced on the width 73 of width 71 between thin plate 20 and carrier 10.According to the size and thickness in nonbonding region 50 Degree, can be used any appropriate number of ventilation bar 71.

During each ventilation bar 70 can also be used for improving initial bonding or during device processing when product 2 is in vacuum environment The performance of product 2.For example, initial bonding can occur in vacuum environment to reduce the gas being captured between thin plate 20 and carrier 10 The scale of construction and/or auxiliary initial bonding process.That is, when initial bonding process occurs in vacuum environment, ventilation bar 70 allows Gas is escaped between thin plate 20 and carrier 10 when initial bonding occurs.At the end of initial bonding process, although product is still Under vacuum environment, the gas and moisture of vent seal formula are not reentered between thin plate 20 and carrier 10.Or, example Such as, it has been bonded and (has been strengthened by whole initial bonding and/or bonding) in thin plate 20 and arrived after carrier 10, product 2 can be put into vacuum In environment, and ventilation bar 70 is sealed at it with the edge intersection of thin plate 20.So, it can reduce and be captured in thin plate 20 and carrier 10 Between gas flow, thus make in vacuum or elevated temperature environment its undesired influence during device processing minimum.Then The sealing prevents air and moisture from being reentered by bar 70 of ventilating.

A kind of mode of sealing ventilation bar 70 is that product 2 is put into ald (ALD) chamber, the chamber is evacuated and right The end deposit thin of ventilation bar 70 is crossed in the edge of thin plate 20 afterwards.ALD is related to the individual layer pulse of reactant, reactant It can spread and go deep into narrow structure (end for bar 70 of such as ventilating) and absorbed before the second pulse reaction with another precursor.Example Such as, in Al₂O₃ALD deposition in, the individual layer aluminum precursor of such as trimethylaluminum compound reacts with individual layer water and forms Al₂O₃。

Ventilation bar-example 1

Carrier from releasing layer application-example 1 is additionally formed figure with each 100 microns of wide four passage in addition Case.Then the carrier is handled according to initial bonding example -1 and increase bond strength example -1.It is wide after bonding enhancing Degree 73 extends about half millimeter on every side of width 71.The sample bears initial vacuum test under 100 millitorrs.

Ventilation bar-example 2

Carrier from releasing layer application-example 1 is additionally formed figure with each 100 microns of wide eight passage in addition Case.Then the carrier is handled according to initial bonding example -1 and increase bond strength example -1.It is wide after bonding enhancing Degree 73 extends about half millimeter on every side of width 71.The sample bears initial vacuum test under 100 millitorrs.

Ventilation bar-example 3

Carrier from releasing layer application-example 1 is additionally formed pattern with four passages of each 1 mm wide in addition. Then the carrier is handled according to initial bonding example -1 and increase bond strength example -1.After bonding enhancing, width 73 extend about half millimeter on every side of width 71.The sample bears initial vacuum test under 100 millitorrs.

Ventilation bar-example 4

Carrier from releasing layer application-example 1 is additionally formed pattern with four passages of each 10 mm wide in addition. Then the carrier is handled according to initial bonding example -1 and increase bond strength example -1.After bonding enhancing, width 73 extend about half millimeter on every side of width 71.The sample bears initial vacuum test under 100 millitorrs.

Ventilation bar-example 5

Carrier from releasing layer application-example 1 is additionally formed pattern with four passages of each 25 mm wide in addition. Then the carrier is handled according to initial bonding example -1 and increase bond strength example -1.After bonding enhancing, width 73 extend about half millimeter on every side of width 71.The sample bears initial vacuum test under 100 millitorrs.

Alternately or additionally in ventilation bar 70, groove can be formed with 10, carrier.That is, instead of being formed through bond area Reach in the bar in the nonbonding region at product 2 edge (or suitably reaching edge of thin plate 20), carrier 10 recess paths (or Groove) executable identical function.Or, instead of the groove in carrier 10, groove may be formed in thin plate 20, or in the He of thin plate 20 In both carriers 10.The position of groove can be similar to the position of ventilation bar 70 shown in Fig. 7.Under any circumstance, groove allows true Altitude is moved with any time before initial bonding, bonding enhancing, and/or device processing between thin plate 20 and carrier 10 Except gas and/or moisture.Although still in vacuum environment, the injection and solidification sealing of groove usable polymers, polymer is for example Polyimides, Thermocurable polymer or the curable polymer of UV.Or, groove can be put into matching somebody with somebody in groove by heating Close material or sealed by directly heating the material around groove with melting and/or melting closing groove, such as added by laser Heat is achievable like that.These grooves can be set to and ventilation bar 70 identical construction and quantity.But, because groove can be made into With the cross section bigger than ventilation bar 70, less groove can be used.In addition, in order that using less groove, groove may extend away To nonbonding region 50, and its center is even extended in certain embodiments.The quantity of groove and/or vacuum bar may depend on The size in nonbonding region 50.

Strengthen in desired zone and be bonded -110 between thin plate and carrier

At 108, being bonded for being formed between carrier and thin plate can be by various process strengthenings so that product 2 can bear dress Put harsh conditions (high temperature, such as temperature, the vacuum higher than 350 DEG C, 400 DEG C, 450 DEG C, 500 DEG C, 550 DEG C or 600 DEG C of processing Environment and/or high-pressure fluid injection) and thin plate does not depart from from carrier.

A kind of mode being bonded between reinforcing thin plate and carrier is to carry out anode linkage.Retouched in US 2012/0001293 A kind of mode of anode linkage is stated, it discusses the deposition of barrier layer, and the use of anode linkage is so that these layers to be attached to Substrate can also be used to thin glass plate being bonded on carrier substrate.

Between reinforcing thin plate and carrier the another way that is bonded be by using temperature and pressure, wherein product (including Thin plate and carrier) it is heated and withstanding pressure application.Pressure apply can by being carried out with the plate of carrier and sheet contacts, or For example in the pressure chamber for applying Fluid pressure to product carry out.These plates can be used as thermal source in itself, or these plates can be set In heating environment.The amount of pressure used can may for example need lower pressure when the temperature increases according to temperature change.

When using pressure plare, in thin plate and it can be applied space bar or thin slice are used between stressed plate.Space bar It is shaped to and is contacted in bond area with sheet contacts and in bond area as big as possible.It is using an advantage of distance piece Thickness of the amount equal to space bar that thin plate swells during it may allow to apply heat and pressure during bonding reinforcement.The amount of the protuberance It is acceptable during device is processed, it would still be possible to the problem of being caused during reinforcement is bonded to thin plate or damage.If non- This protuberance may then occur for remaining limited amount volatile matter and/or bubble between thin plate and carrier in bond area.Or, Pressure, which applies plate, can be shaped to depression or recess, or otherwise make it that it is direct not with thin plate in nonbonding region Contact.So, it is allowed to which thin plate has acceptable protuberance during reinforcement is bonded.If not allowing thin plate to swell, in some feelings (such as the residual volatile matter and/or air pocket for example with sufficient amount) under condition, it may be destroyed in the pressure of nonbonding zone-accumulation The bonding occurred in bond area is strengthened.

On heating product to increase bond strength, heating produces acceptable key at a temperature of about 400 DEG C to about 625 DEG C Close intensity.In general, as temperature is raised, bond strength increase.The actual temperature upper limit by involved material, i.e. carrier material The strain point of the material of material and/or thin plate is limited.It is similar with temperature on applying pressure to product to increase bond strength, with Pressure increase, bond strength also increases.In fact, in terms of manufacture angle, it is generally desirable to can in alap pressure and At a temperature of produce acceptable bond strength.

, may when releasing layer is sufficiently thin when heating initial bond area with laser in the environment with atmospheric pressure It can realize that the acceptable glass-glass between thin plate and carrier is bonded between thin plate and carrier.

Glass is discussed in the healthy and free from worry Corning Incorporated R Sabia in the New York B2 of patent US 6,814,833 to be bonded to glass Technology.According to idea of the invention, it can be used " Direct Bonding of siliceous product " that thin glass plate is bonded into carrier.

Increase bond strength example -1

The product of initial bonding example -1 generation is taken at room temperature and is placed between heating platen, uses graphene film (figure Case makes the pattern match for causing grapheme material and bond area, and cut-away area and the pattern in nonbonding region in plate With) it is used as the pad between thin plate and heating platen.These plates are brought together after to contact product, but do not apply any notable pressure Power.These plates are heated at a temperature of 300 DEG C, do not have notable pressure on product.These plates are increased to 300 DEG C from room temperature, And kept for 5 minutes.Then each plate is increased to 625 DEG C, and the pressure on product simultaneously from 300 DEG C with 40 DEG C/min of speed It is increased to 20psi.The state is kept for 5 minutes, is then turned off heater and is discharged pressure.These plates allow to be cooled to 250 DEG C, The point, object is taken out from press and allows to be cooled to room temperature.On inspection, find product when thin plate and carrier are presented as monomer There is this bonding in bond area, and thin plate and carrier are very independent entities in nonbonding region.

Increase bond strength example -2 (contrast)

Implement as strengthened the process described in bond strength example 1, except maximum temperature is 180 DEG C and using pressure is 100psi.These conditions do not produce the bonding of the acceptable intensity for high temperature, low-voltage device processing conditions.

The required part -116 of thin plate is extracted by carrier

One of significant challenge of flexible glass concept is the ability for the required part that thin plate is extracted by carrier on carrier.With reference to Fig. 1,2 and 8-12, the part summary are that free shape delineation is performed using scribe wheel 90 and thin plate 20 is removed from carrier 10 The innovative approach of required part 56.A kind of method is also described, this method uses (such as CO of laser beam 94₂Laser beam) perform The free shape integral cutting and mechanical scratching of thin plate 20, to form a series of passages 61,63,65,67 and/or 69, with The required part 56 of thin plate 20 is removed from carrier 10.

This method avoid need whole thin plate 20 disengaging bonding from carrier 10；Reduce the possibility of the fracture of thin plate 20 Property.On the contrary, effect can be realized by the part 56 needed for only cutting and extracting, the required part 56 can be, TFT, CF, Touch membrane or other films.Further, since machinery and laser cutting do not cut the thickness 22 more than thin plate 20, this allows to make again With carrier (after the unnecessary portion for removing thin plate from carrier) and reduce overall manufacturing cost.

Next, with reference to Fig. 1 and 2, how description is removed to the required part 56 of thin plate 20 from carrier 10, i.e., with formation Device thereon or the part of other required structures.

In order to which required part 56 is removed from carrier 10, multiple otch are formed on thin plate 20.When for example, by scribe wheel When 90 mechanical device is to implement, these otch can be score line or breathing line.Or, (such as dioxy of laser 94 can be used Change carbon laser) form ventilation or the overall otch through whole thickness 22.The air vent has depth 62.In order to easily and can Part 56 needed for being removed by ground, depth 62 is chosen to >=50% thickness 22.If hole depth 62 of ventilating is less than 50% thickness 22, then thin plate 20 and carrier 10 will not be sufficient to bending due to bonding together come so that passage is propagated through whole thickness 22 The otch of part 56 needed for forming release.In integrally laser cutting, ventilation hole depth 62 is 100% thickness 22.For letter Neutralizing is released and quoted, and passage described below is to be fabricated to the passage for being not passed through whole thickness 22.In addition, though all Passage is shown as with identical depth 62, but is needed not be so；On the contrary, passage can have depth different from each other.

Passage includes circumference passage 60, y to release ventilation hole 61,63 and x to release ventilation hole 65,67,69. Circumference 57 of the circumference passage 60 along required part 56, and be formed in the circumference 52 in nonbonding region 50.Release ventilation hole shows Go out for there is different constructions relative to bond area 40 and nonbonding region and relative to circumference passage 60, this can be This situation, or they can have similar construction.For example, y is shown as in bond area 40 and nonbonding area to passage 61 Extend in domain 50, i.e. y crosses over circumference 52 to passage but is not extend to the circumference of thin plate 20.The circumference of passage 61 and thin plate 20 It is spaced a distance 66.Distance 66 can be selected as any suitable value, including zero.In the null situation of distance 66, this A little passages have the construction of passage 63.Similar to passage 61, x is to passage 65 in bond area 40 and nonbonding region All extend in 50, and be spaced apart with the circumference of thin plate 20.Passage 67 is completely in nonbonding region 50, and do not reach circumference 52.Similarly, passage 69 is completely in nonbonding region 50, but extend to circumference 52.In one kind arrangement, such as the institute of passage 65 The arrangement shown, each passage is positioned to conllinear with the straight line portion of circumference passage 60.In another arrangement, such as passage 63, 67th, the arrangement shown in 69, straight line portion of each passage perpendicular to circumference passage 60.In another arrangement, such as passage 61 Shown arrangement, each passage can align with the bent portion of circumference passage 60.

For all passages 61,63,65,67,69, common ground is to be not extend to touch circumference passage 60.Need The circumference 57 of required part is kept high-quality as much as possible.That is, the intensity of part 56 depends, at least partially, on circumference 57 Edge strength.Therefore, it may be desirable to avoid damaging circumference 57.When forming passage 61,63,65,67,69, the quarter for hitting its target is spent Scoring wheel or laser may cause to damage circumference 57, part 56 needed for thus weakening.On the other hand, it is propagated through towards circumference 57 thin The passage of plate 20 will be stopped at circumference passage 60 without causing damage to circumference 57.Moreover, each passage is arranged to In the distance 64 of circumference passage 60.Distance 64 is chosen to≤500 microns, for example≤400 ,≤300 ,≤200 ,≤100 ,≤ ,≤10 or≤5 microns 50 ,≤25.If distance 64 is more than 500 microns, undesired possibility is there is when spreading, Passage can not merge in desired position with circumference passage 60.

Any appropriate number of passage 61,63,65,67,69 can be used.That is, any suitable total passage can be used Quantity, or any suitable every kind of passage number of types.But, inventor is had found using relative to each other with various The passage of angle arrangement is conducive to part 56 needed for removing.That is, with using only x to type or using only y to type passage Compare, at the same using x to type and y to type passage be favourable.

After all passages 60,61,63,65,67,69 are formed, thin plate 20 bend with by passage 60,61,63, 65th, 67,69 along its x to or y to thickness 22 is propagated through so that the circumference passage 60 that merges.Next, as shown in figure 12, leading to Cross and come off, such as by attached suction cup 91 and required part 56 is dragged away from carrier 10, come part 56 needed for removing.In order to be conducive to Remove, at part 56 needed for dilatory, can force to be passed through air or liquid between required part 56 and carrier 10.Because required The circumference 57 of part 56 easily removes thin plate 20 without damaging completely in nonbonding region 50 from carrier 10.

The second embodiment of part 56 needed for extracting is explained below in conjunction with Fig. 1,2,8 and 9.In the embodiment, by master Difference with first embodiment is described, it should be understood that remaining element is similar to those for combining first embodiment and describing, and In all embodiments, identical reference represents identical element.

In the embodiment, formed as in the first embodiment circumference passage 60 and required passage 61,63,65,67, 69.Carrier 10 and thin plate 20 also bend to spread passage 60,61,63,65,67,69.In addition, as shown in figure 9, then when thin When plate 20 and carrier 10 are supported by soft elastic base plate 98, depression bar or fracture bar 92 can be used to apply pressure to thin plate 20 and carrier 10 Power.Approximately along parallel to the line through passage 61 and the line of passage 63, to being applied on the right side of circumference 57 (circumference passage 60) Plus-pressure, so that passage 61 and 63 is not only propagated through thin plate 20, is also propagated through carrier 10, such as extends through Fig. 9 thickness Shown in the dotted line of degree.That is, being bonded at the boundary 41 between thin plate 20 and carrier 10 is strong, so that these elements are in key Region 40 is closed as one.Accordingly, because passage 61,63 extends on the surface of thin plate 20 on boundary 41, when them When spreading, passage 61 and 63 can be made is propagated through carrier 10 in addition to being propagated through thin plate 20.The passage spreads Do not controlled well through carrier 10, the especially outside of bond area, but need not control well.Although in carrier In the outside of bond area 40 on 10, and/or on thin plate 20 it there may be zigzag on the outside of circumference 57 (circumference passage 60) Edge, main thing is to remove a part of thin plate 20, so that arrow 58 direction of the part 56 for example shown in Fig. 8 needed for allowing Slipped away from carrier 10.I.e., although when drawing on thin plate 20 with away from carrier, the Van der Waals for of any presence may Relatively strong, these power are weak in shearing.Thus, a part of thin plate 20 and a part of carrier 10 are removed, thus allows institute Need part 56 to be slipped away from carrier 10, greatly facilitate part 56 needed for removal.Certainly, the depression bar extended in the x-direction or fracture Bar can be used for passage 65 and 69 being propagated through carrier 10, with part 56 needed for allowing along y to the carrier 10 that slips away.

Although score line is shown as being produced on thin plate 20, for forming score line in bond area 40, it is not necessary to be this Sample.That is, at bond area 40, thin plate 20 and carrier 10 are used as one, thus when product is bent, the delineation in any one Line will be propagated through another.Correspondingly, the score line in bond area can be formed on the thin plate side of product or formed In carrier side.

Comprised the following steps using mechanical scratching to extract each several part：

1. delineating thin plate along required profile, i.e., form circumference passage 60 in nonbonding region 50 with scribe wheel 90.Delineation Wheel type, scoring pressure and delineation speed are chosen to produce the passage of depth 62 (D), and the depth is equal to or more than half thin plate Thickness 22 (T), i.e. (D >=0.5T).Before extraction, multiple profiles can be delineated.The profile of delineation can have fillet or can have Tilt corner.

2. forming the array of such as release otch or passage 61,63,65,67 and/or 69, it makes it possible to extract required portion Divide 56.If required part 56 to be extracted have rectangular shape (or round rectangle), should required part 56 each corner Direction of the place along every side perpendicular to the part forms release ventilation hole (see Fig. 1 and 8).If required part 56 is " big ", One or more of the other release ventilation hole 67 can be formed between each corner.Release otch (passage) should extend close to follow institute The circumference passage 60 (preferably in less than 0.5mm) of the profile 57 of part 56 is needed, but they should not be crossed over or " touching " should Profile, to avoid damaging the part edge.

3. after the profile of the part is delineated, that is, being formed after circumference passage 60, and forming the (choosing of release ventilation hole From one or more types of the passage shown in 61,63,65,67,69) after, should around required part 56 circumference 57 with Slight curvature (curved) flexible glass together of carrier 10, passage is extended through the thickness 22 of thin plate 20, is divided completely with realizing From required part 56.

4. by using with surface into close to right angle (for example relative to thin plate 20 surface into 60-90 degree) suction force, To overcome any Van der Waals at nonbonding region 50, the interior part that required part 56 departs from carrier 10 has been come The part into needed for extracting without destroying.See Figure 12.

Fig. 8 and 9 shows another extracting method.This method including the use of the release ventilation hole 61 in the top of bond area 40, 63 along required part 56 curving and fracture carrier 10, be used as the beginning of fracture.The carrier should be placed on relatively soft On flexible material 98.Passage starts at the release ventilation hole 61 or 63 on bond area 40, and by being produced by fracture bar 92 Raw bending stress, crackle is propagated through carrier 10 below thin plate 20 along fracture bar 92.In the extension of carrier 10 and thin plate 20 Part to the right side of passage 61,63 is after the right side disconnection of required part 56, and required part 56 can be along the side of arrow 58 Slipped away to from carrier.

Alternatively or additionally, mechanical scratching, laser cutting can be used.For example, it can be advantageous to make as follows with reference to Figure 10 Use CO₂Laser.

Work as CO₂Laser beam 94 is used to form circumference passage 60, the circumference 57 of part 56 needed for for cutting, and can be used The constructed and array of face description completes the formation and extraction (via coming off or sliding) in release ventilation hole.But, with machine Tool delineation is different, CO₂Laser being capable of integral cutting thin plate 20.CO₂Laser cutting does not require bending carrier 10 and thin plate 20 to cause Passage extends through its thickness 22, and thicker carrier 10 is may be advantageously used with so as to be cut by laser.Laser cutting is at least all Boundary's passage 60 also creates the higher quality part edge with higher intensity, and this allows the more reliable process and faster of coming off Obtain the required part 56 extracted.For CO₂Laser cutting, laser beam 94 is focused on the surface of thin plate 20 small diameter circular Light beam, and moved along the required track followed by cooling nozzles 96.Separation by laser can be started by identical scribe wheel 90, This forms release ventilation hole.Cooling nozzles 96 may, for example, be air nozzle, and it is delivered compressed air to by small diameter bore On the surface of thin plate.Water or air liquid mist are preferably used, because which increase the gravitation between thin plate 20 and carrier 10.

As seen in figures 11 and 16, a kind of design of nozzle 96 includes head 200, head 200 with 4 small diameter bores 201, 202nd, 203,204, to allow to project cooling fluid, for cutting rectangle part.Preferably, bore dia≤1mm.Each hole 201, 202nd, 203,204 are used for the cutting in a direction.(the example when corner of the laser beam 94 projected by hole 205 close to circumference hole Such as, 90 degree rotation), control system (not shown) gradually by a bore closure and opens another hole, for along for example perpendicular to The direction of first otch forms a kerf.Or, head 200 need not be moved in the vertical direction.That is, the and of hole 201,202,203 204, which are shown around head 200, is spaced 90 degree of placements, but need not it can't be otherwise.

Although for cutting substantially rectangular part, above-mentioned 4 Cooling Holes 201-204 arrangements are favourable, difference arrangements It is also possible.For example, as shown in figure 16, the first hole 201 can be in shown position, and the second hole 212 can be located at from the The position that 120 ° clockwise of one hole, and the 3rd hole 213 can be positioned at from the position clockwise another 90 ° of the second hole 212.With this side Formula, each hole can be used for cutting triangle pattern, for example, pass through the edge first party conllinear with the Cooling Holes 201 of laser hole 205 and first To moving-head 200, then the edge line conllinear with the line extended between the hole 212 of laser hole 205 and second is upwards (such as Figure 16 institutes The direction shown), and then the edge line conllinear with the line extended between the hole 213 of laser hole 205 and the 3rd is downward (such as Figure 16 institutes The direction shown).Certainly, the Cooling Holes of any requirement can be used to adapt to variously-shaped circumference passage 60.

As shown in figure 17, the design of another nozzle include with a Cooling Holes 201 and rotating mechanism (it is not shown, but its Can be along the direction rotatable head 200 of arrow 215) head 200, it moves through the corner of circumference passage 60 on head 200 Simultaneously, it is allowed to which Cooling Holes 201 follow laser beam (launching from hole 205).As seen from Figure 10,11,16 and 17, laser nozzle It can be separated with cooling nozzles, or can be conveyed by identical head.

CO₂Another advantage of laser is laser beam formation flexible glass and the local heating of carrier, and this can reduce glass Between gravitation.Laser heating can also cause flexible glass locally corrugation so that extraction process is easier.

Thin plate/vector product and use process

It described above is the situation that one of them required part 56 is formed by the thin plate 20 for being bonded to carrier 10.But, can The required part 56 of any requirement is made up of the thin plate 20 for being bonded to carrier 10, size and required portion depending on thin plate 20 Points 56 size.For example, thin plate can have second generation size or bigger, such as third generation, forth generation, the 5th generation, eighth generation Or bigger (for example, plate size from 100mm x 100mm to 33 meters or bigger of meter x).In order to allow user to determine that he will be from key Be bonded to carrier 10 a thin plate 20 production required part 56 arrangement, for example on the size of required part 56, quantity and Shape, thin plate 20 can be supplied as shown in Figs. 13 and 14.More particularly there is provided have the product with thin plate 20 and carrier 10 2.Thin plate 20 is bonded to carrier 10 in the bond area 40 around nonbonding region 50.

Bond area 40 is arranged at the circumference of thin plate 20.Advantageously bond area sealed thin at the circumference of product 2 Any gap between plate 20 and carrier 10, so that process fluid will not be captured, because otherwise captured process fluid Subsequent technique may be polluted, product 2 is conveyed through the subsequent technique.

Nonbonding region 50 can be by the above method or material is any is formed.But, what is be particularly suitable is to carrier The releasing layer being made up of a kind of material is coated with, this kind of material maintains itself and thin plate 20 at expected temperature during equipment is processed Nonbonding characteristic, but thin plate 20 can be bonded at higher temperatures.For example, releasing layer 30 can have the inorganic of such as oxide-film Material is made.For example, material may be selected from following ITO (indium tin oxide), SiO, SiO₂、F-SiO₂、SnO₂、F-SnO₂、Bi₂O₃、 AZO、GAO、Ga₂O₃、Al₂O₃、MgO、Y₂O₃、La₂O₃、Pr₆O₁₁、Pr₂O₃、Sc₂O₃、WO₃、HfO₂、In₂O₃、ZrO₂、Nd₂O₃、 Ta₂O₅、CeO₂、Nb₂O₅、TiO、TiO₂、Ti₃O₅、F-TiO₂, TiN (titanium nitride), TiON (titanium oxynitrides), one in NiO, ZnO Plant or a variety of, or its combination.Suitable metal is for example including aluminium, molybdenum and tungsten.When being heated at a temperature of about 450 DEG C to 600 DEG C, Such material will not be bonded with thin glass sheet 20.But, when being heated to (predetermined temperature >=625 DEG C), or selectively, heating At temperature in 100 degree of the strain point of thin glass plate, or in certain embodiments, such as the strain point in thin glass plate In 50 degree, thin glass plate 20 will be bonded to.In some cases, can use the metal of sputtering, such as Ti, Si, Sn, Au, Ag, Al、Cr、Cu、Mg.Therefore, even if product is processed at a temperature of up to 450 DEG C to 600 DEG C, the nonbonding region 50 is still protected Hold the ability of its part for discharging thin plate 20.On the other hand, by being heated to predetermined temperature, the part of releasing layer 30 can be chosen Selecting property it is bonded to thin glass plate 20.This local heating can for example pass through laser, other rasterisation thermals source, heater strip or sense Heater is answered to realize.For nonbonding region, other suitable materials include, more generally, metal oxide, metal oxynitride Compound or metal nitride, wherein the metal ingredient can include In, Si, Sn, Bi, Zn, Ga, Al, Mg, Ca, Y, La, Pr, Sc, W, Hf, Zr, Nd, Ta, Ce, Nb, Ti, Mo, or its combination.

Description is now realized to the ad hoc fashion of this function, that is, allows to be bonded to the week around thin plate 20 in thin plate 20 After the carrier 10 on boundary, variously-shaped bond area 40 is formed.This ad hoc fashion includes：By sputtering or PECVD, next By the hot dehydrogenation of film surface, deposited about on carrier (being made up of glass, such as the Eagle codes glass of Corning Incorporated) For the thick silicon fimls of 100-500nm, and sputter on the back side of thin plate 20 the thick metal films of 100-500nm.Metal is chosen to It forms silicide under high temperature (for example, >=600 DEG C) with silicon, and causes it to have foot due to the grain size in sputtering Enough surface roughnesses (for example, Ra >=2nm), to form nonbonding region.The part irradiated by laser through carrier 10 adds Heat can make silicon and metal react, to form refractory metal silicide and form bond area 40.Suitable metal is included (simultaneously It is not limited only to) aluminium, molybdenum and tungsten.

In order to make the required part 56 of requirement on a product 2, making has what is surrounded by bonding profile line 42 Requirement nonbonding region 50.See Figure 15.Bonding profile line 42 can be retouched optionally through with required shape selective Laser is painted, releasing layer 30 is locally heated to predetermined temperature, releasing layer will be bonded and be sealed air tight to thin plate at such a temperature 20.Then, fabricated product 2, so that the forming apparatus in the region limited by contour line 42.After device processing, required portion Divide 56 any through the above way can be separated from carrier 10.If necessary to which required part 56 is slipped away from carrier, product 2 can Cut first by any pattern or subset along dotted line 5 between the suitable profile line of adjacent contour line 42, be cut into and appoint The component of what more smallest number.Alternately, product 2 can be along a plurality of wire cutting, and these lines are fabricated to so as to limiting required portion The circumference passage of 56 circumference 57 is divided to intersect.In this way, similar to above in conjunction with described by Fig. 8 and 9, it is necessary to less Step is come part 56 needed for being slipped away from carrier.After cut product 2, the other devices that can occur on thin plate 20 add Work.

Conclusion

The test of product (in the situation, the thin glass on carrier) sealing, including liquid can be realized by multiple methods Or gas invades or left vision or the spectral photometry in any region on sealing article.

It should be emphasized that, the above embodiment of the present invention, particularly any " preferable " embodiment are only the possibility of embodiment Example, only illustrates the various principles for being used for being clearly understood that the present invention.Can be not deviate substantively from the spiritual and various of the present invention In the case of principle, the above-mentioned embodiment to the present invention carries out many changes and adjustment.All these changes and modification exist This is intended to be included in the range of the disclosure and claims below.

Claims

1. a kind of cutting equipment, including：

Head, the head has multiple holes；

Lasing light emitter, the lasing light emitter is connected to the first hole in the multiple hole laser beam conveying is passed through into described first Hole；And

Cooling fluid source, the cooling fluid source is in fluid communication with least the second hole and at least the 3rd hole in the multiple hole, The First Line that second hole is wherein extended to from first hole extends to the 3rd hole relative to from first hole Second line is set with first angle.

2. cutting equipment as claimed in claim 1, it is characterised in that first angle is 90 degree, wherein cooling fluid source also with The 5th hole in the 4th hole and the multiple hole in the multiple hole is in fluid communication, and extends to institute from first hole in addition State that the 3rd line in the 4th hole is conllinear with the First Line, and from first hole extend to the 4th line in the 5th hole with it is described Second line is conllinear.

3. cutting equipment as claimed in claim 2, it is characterised in that the first angle be different from 90 degree of angle or its Multiple.

4. a kind of cutting equipment, including：

Head, the head has multiple holes；

Lasing light emitter, it is described so as to which laser beam conveying be passed through that the lasing light emitter is, optionally, coupled to the first hole in the multiple hole First hole；And

Wherein described head is rotatable.

5. the cutting equipment as any one of claim 1-4, it is characterised in that the cooling fluid source is compressed air Source.

6. the cutting equipment as any one of claim 1-5, it is characterised in that the hole has≤1mm diameter.

7. a kind of cutting method, including：

Cutting equipment as any one of claim 1-3 is provided；

By laser beam conveying by first hole, and will while the head is moved along the first direction along the First Line Cooling fluid conveying passes through second hole；

Cut off conveying of the cooling fluid by second hole；

Cut off conveying of the cooling fluid by the 3rd hole.

8. a kind of cutting method, including：

Cutting equipment as claimed in claim 4 is provided；

By laser beam conveying by first hole, and cooling fluid is conveyed while the head is moved along the first direction Pass through second hole；