KR20170096242A - Laser processing apparatus and laser processing method - Google Patents

Laser processing apparatus and laser processing method Download PDF

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Publication number
KR20170096242A
KR20170096242A KR1020150188904A KR20150188904A KR20170096242A KR 20170096242 A KR20170096242 A KR 20170096242A KR 1020150188904 A KR1020150188904 A KR 1020150188904A KR 20150188904 A KR20150188904 A KR 20150188904A KR 20170096242 A KR20170096242 A KR 20170096242A
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KR
South Korea
Prior art keywords
laser
cooling fluid
laser processing
processing apparatus
unit
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Application number
KR1020150188904A
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Korean (ko)
Inventor
도상회
이경민
Original Assignee
주식회사 이오테크닉스
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Application filed by 주식회사 이오테크닉스 filed Critical 주식회사 이오테크닉스
Priority to KR1020150188904A priority Critical patent/KR20170096242A/en
Priority to PCT/KR2016/009943 priority patent/WO2017115975A1/en
Priority to CN201680076632.3A priority patent/CN108449937A/en
Priority to TW105130286A priority patent/TWI621499B/en
Publication of KR20170096242A publication Critical patent/KR20170096242A/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/703—Cooling arrangements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
    • B23Q11/0003—Arrangements for preventing undesired thermal effects on tools or parts of the machine

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Laser Beam Processing (AREA)

Abstract

A laser processing apparatus according to an embodiment of the present invention includes: a first laser irradiation unit; And a cooling head for spraying a cooling fluid so as to surround the irradiation area of the laser beam formed by the first laser irradiation part.

Description

[0001] The present invention relates to a laser processing apparatus and a laser processing method,

The present invention relates to a laser machining apparatus and a laser machining method, and more particularly, to a laser machining apparatus and a laser machining method including a cooling head for cutting a substrate.

The laser processing apparatus is applied in various forms to a semiconductor device manufacturing process requiring formation and processing of a fine pattern. For example, in a semiconductor device manufacturing process, a laser processing apparatus is used in a process of cutting (separating) active regions of a wafer as a workpiece and separating the active regions as individual semiconductor chips.

The basic principle of the laser processing apparatus is that the laser is used to heat the cutting substrate below the softening point and then cool it to maximize the expansion / compression force inside the cutting substrate to minimize the loss of the material. Such a laser thermal cutting method can be performed by heating a cut region using a laser beam generated from a laser light source, and then spraying a cooling fluid along the cut region to induce a crack.

At this time, when the cut region has a curvature, the movement route of the laser beam and the movement route of the cooling head for jetting the cooling fluid may be different, so that the cooling process after heating for the cut region may not be easily performed.

The present invention provides a laser processing apparatus and a laser processing method having a cooling head for substrate cutting capable of cooling a cutting region having a curvature.

The laser processing apparatus according to one example comprises: a first laser irradiation unit; And a cooling head for spraying a cooling fluid so as to surround the irradiation area of the laser beam formed by the first laser irradiation part.

The cooling fluid may be injected at a distance that is the same distance from the center of the irradiation area of the laser beam.

The cooling head may include a plurality of nozzle portions for ejecting the cooling fluid.

And the jetting direction of the cooling fluid jetted from the plurality of nozzle units may coincide with the irradiation direction of the laser.

And a jetting direction adjusting unit adjusting the jetting direction of the cooling fluid jetted from the plurality of nozzles.

And a control unit controlling the injection direction adjusting unit according to the area of the laser irradiation area to adjust the injection direction of the cooling fluid.

The control unit may control a flow rate of the cooling fluid ejected from the plurality of nozzles.

And a second laser irradiating unit disposed in front of the first laser irradiating unit with a predetermined gap therebetween.

The first and second laser irradiation units may be CO 2 laser irradiation units.

The cooling fluid may comprise at least one of water or alcohol.

And a transfer unit for transferring the first laser irradiation unit and the cooling head.

The first laser irradiation unit and the cooling head may be transported along the direction having the linear direction and the curvature by the transfer unit.

A laser processing method according to an embodiment includes: inputting a line to be divided for a substrate including curvature; And moving the first laser irradiation unit and the plurality of nozzle units along the line along which the material is to be divided.

Determining an irradiation area of the first laser beam by the first laser irradiation part; And determining an injection angle of the plurality of nozzle units.

And determining a jet flow rate of the cooling fluid jetted from the plurality of nozzle units.

According to the laser processing apparatus according to one example, it is possible to perform laser processing on a cut region having various shapes, more specifically, a cut region having a curvature.

In addition, efficient cutting of the substrate by the laser processing apparatus can be performed by using the cooling fluid which can be injected by adjusting the injection angle and the injection flow rate.

1 is a block diagram showing a configuration of a laser machining apparatus according to an embodiment.
2 is a perspective view of a laser processing apparatus according to an embodiment.
3 is a schematic diagram of a laser processing apparatus including a laser irradiation unit and a cooling head according to an embodiment of the present invention.
4 is a plan view of a substrate cut by a laser machining apparatus according to an embodiment of the present invention.
5 is a schematic configuration diagram of a laser processing apparatus including a laser irradiation unit and a cooling head according to another embodiment of the present invention.
6 is a plan view of a substrate cut by a laser machining apparatus according to another embodiment of the present invention.
7 is a flowchart schematically illustrating an operation method of the laser processing apparatus according to an example.

While the present invention has been described in connection with what is presently considered to be the most practical and preferred embodiment, it is to be understood that the invention is not limited to the disclosed embodiments. Also, in certain cases, there may be a term selected arbitrarily by the applicant, in which case the meaning thereof will be described in detail in the description of the corresponding invention. Therefore, the term used in the present invention should be defined based on the meaning of the term, not on the name of a simple term, but on the entire contents of the present invention.

When an element is referred to as "including" an element throughout the specification, it is to be understood that the element may include other elements, without departing from the spirit or scope of the present invention. Also, the terms " part ", "... module ", etc. in the specification mean units for processing at least one function or operation, and may be implemented in hardware or software, .

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily carry out the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

1 is a block diagram showing a configuration of a laser machining apparatus according to an embodiment. 2 is a perspective view of a laser processing apparatus according to an embodiment.

1 and 2, a laser processing apparatus 1 according to one example is a processing apparatus for cutting a substrate M. Here, the substrate M is a plate-like member, for example, a semiconductor wafer such as a silicon wafer or a glass substrate may be used, but the present invention is not limited thereto.

The laser processing apparatus 1 includes a stage 10 on which a substrate M is supported, a laser irradiation unit 20 for irradiating the substrate M with a laser beam L, (Not shown) for controlling the overall operation of the laser machining apparatus 1 and a transfer head 40 for transferring the laser irradiating unit 20 and the cooling head 30, A user interface module 60 having a control unit 50, an input unit 610 and a display unit 620 and a driving unit 70 for providing a driving force to the transfer unit 40.

The stage 10 is a support member capable of supporting the substrate M. The stage 10 on which the substrate M is supported is fixed and the laser irradiation unit 20 and the cooling head 30 to be described later can be moved along the line along which the substrate is to be cut S However, the present invention is not limited thereto. The stage 10 on which the substrate M is supported while the laser irradiation unit 20 and the cooling head 30 are fixed may be moved along the line along which the substrate should be divided.

The laser irradiation unit 20 includes a first laser irradiation unit 21 for cutting the substrate M along the line along which the substrate should be cut S and a second laser irradiation unit 22 for advancing a crack along the line along which the substrate is intended to be cut S ). The first and second laser irradiation units 21 and 22 irradiate the substrate M supported on the stage 10 with a laser beam L having a wavelength that absorbs the substrate M, It may be a CO 2 laser irradiation apparatus capable of forming a crack on the surface of the substrate M and cutting the substrate M. At this time, the second laser irradiation part 22 may be disposed ahead of the first laser irradiation part 21 with respect to the line along which the material is to be divided S. The laser beam L may also be a pulsed ultraviolet laser beam and may have a pulse width in the femtosecond (fs), picosecond (ps) or nanosecond (ns) The present invention is not limited thereto.

The cooling head 30 is a cooling device capable of advancing a crack by spraying a cooling fluid I along a line along which the substrate is to be cut S of the substrate M to form a crack. As one example, the cooling head 30 includes a cooling fluid reservoir 31 in which the cooling fluid I can be received, a nozzle unit 32 capable of ejecting the cooling fluid I to the substrate M, And a jetting direction adjusting unit 33 capable of rotating the nozzle unit 32 at a predetermined angle?.

The cooling fluid reservoir 31 provides a housing space for accommodating the cooling fluid I, and the cooling fluid I is stored in the housing space. At this time, the cooling fluid (I) may be water, a highly volatile alcohol, or a solution in which water and alcohol are mixed. Thus, the use of a highly volatile material as a coolant makes it possible to minimize the amount of coolant remaining on the substrate. However, the present invention is not limited thereto, and any cooling fluid (I) capable of cooling the substrate (M) heated by the laser irradiation part (20) may be used.

The nozzle portion 32 is a jetting device capable of jetting the cooling fluid I to the substrate M. As one example, the nozzle portion 32 may be disposed on the upper portion of the substrate M so as to face the substrate M to eject the cooling fluid I. At this time, the injection amount of the cooling fluid I injected from the nozzle unit 32 can be adjusted by the control unit 50 described later according to the cutting speed of the substrate M. The nozzle unit 32 may be disposed to surround the first laser irradiation unit 21 with a predetermined gap therebetween. For example, the nozzle unit 32 may include a plurality of nozzles. The matters related to the arrangement of the nozzle unit 32 and the first laser irradiation unit 21 will be described later with reference to FIG. 3 and FIG. The present invention is not limited to this, and the cooling fluid I may be sprayed onto the upper portion of the substrate M. In this embodiment, Any injection device that can be used may be used.

The spraying direction adjusting unit 33 is provided at one end of the nozzle unit 32 and adjusts the angle of the nozzle unit 32 to adjust the spraying angle of the cooling fluid I injected through the nozzle unit 32 Which is an angle adjusting member. The injection direction regulating portion 33 includes a first linking member 331 disposed at one end of the nozzle unit 32, a second linking member 332 disposed at the transferring unit 40 to be described later, And a link portion 333 to which the first and second linking members 331 and 332 can be connected. The first connecting member 331 can be rotatably fastened to one end of the second connecting member 332 through the link portion 333. [ The nozzle portion 32 can also be rotated by a predetermined angle a as the first connecting member 331 rotates with respect to the second connecting member 332. As the nozzle portion 32 rotates, M can be changed. It is possible to adjust the distance T between the laser beam L and the cooling fluid I sprayed on the line along which the liquid is intended to be cut along with the rotation of the nozzle portion 32 by the jet direction regulating portion 33 have. The matters related to the change in the distance T between the laser beam L and the cooling fluid I due to the rotation of the nozzle unit 32 will be described later with reference to FIGS. 5 and 6. FIG.

The transfer unit 40 is installed on the stage 10 and the laser irradiation unit 20 and the cooling head 30 are mounted on the stage 10 in the first axis X direction and the second axis Y direction, In the direction in which it is provided. According to one example, the transfer unit 40 may include a first transfer guide 410, a second transfer guide 420, and a transfer guide block 430. The first conveying guide 410 may be disposed on the stage 10 and extend in the first axis X direction. The second conveyance guide 420 may also be disposed on the stage 10 and extend in the second axis Y direction intersecting the first axis X direction. The second conveying guide 420 is coupled to the first conveying guide 410 so as to be movable along the first axis X direction. The conveyance guide block 430 is coupled to the second conveyance guide 420 so as to be movable along the second axis Y along the second conveyance guide 420. The laser irradiation unit 20 and the cooling head 30 are installed in the transfer guide block 430 of the transfer unit 40 and can be transferred together with the transfer guide block 430.

The control unit 50 may be hardware for controlling the operation of the laser irradiation unit 20, the cooling head 30, and the driving unit 70 to be described later. The control unit 50 can generate a control signal for the laser irradiation unit 20, the cooling head 30, and the driving unit 70 from the program stored in the memory (not shown) and the input signal or the like input from the input unit 610 . The control unit 50 may control the intensity of the laser beam L emitted from the laser irradiation unit 20 according to the input signal input from the input unit 610 and may control the intensity of the laser beam L emitted from the cooling head 30 The flow rate of the fluid I can be controlled and the moving direction and the moving speed of the laser irradiation unit 20 and the cooling head 30 by the driving unit 70 can be controlled. At this time, the control unit 50 may be implemented in the form of a single microprocessor module or in a form in which two or more microprocessor modules are combined. That is, the implementation form of the control unit 50 is not limited by any one.

The user interface module 60 may include an input unit 610 and a display unit 620. The input unit 610 may include a button for operating the laser machining apparatus 1, a keypad, a switch, a dial or a touch interface. The display unit 620 may be implemented as a display panel or the like for displaying cutting information on the substrate M. [ As an example, the display unit 620 may include an LCD panel, an OLED panel, and the like, and may display cutting information of the analyzed substrate M as an image or text.

The driving unit 70 is a power generating device capable of generating a driving force for moving the laser irradiation unit 20 and the cooling head 30 along the first axial direction X or the second axial direction Y. The driving unit 70 includes a first driving unit 71 for moving the laser irradiation unit 20 and the cooling head 30 in the second axial direction Y and a second driving unit 71 for driving the laser irradiation unit 20 and the cooling head 30 ) In the first axis (X) direction. At this time, the driving unit 70 can generate the driving force in accordance with the control signal generated from the control unit 50.

The method of cutting the substrate M by the laser machining apparatus 1 including the laser irradiation unit 20 and the cooling head 30 along the line along which the substrate is intended to be cut with the curvature will be described in more detail .

3 is a schematic diagram of a laser processing apparatus including a laser irradiation unit and a cooling head according to an embodiment of the present invention. 4 is a plan view of a substrate cut by a laser machining apparatus according to an embodiment of the present invention.

3 and 4, the first laser irradiation unit 21 and the second laser irradiation unit 22 are arranged to be spaced apart from each other with a predetermined interval therebetween along the line along which the substrate is intended to be divided. At this time, the second laser irradiation part 22 may be arranged in front of the first laser irradiation part 21. The plurality of nozzle portions 32 included in the cooling head 30 may be arranged so as to surround the first laser irradiation portion 21. As an example, the cooling fluid I may be injected in a circular shape so as to be spaced apart from each other with the same distance T 1 between the first laser beam L 1 irradiated by the first laser irradiation part 21 At this time, a plurality of nozzle units 32 for jetting the cooling fluid I may also be arranged in a circular shape surrounding the first laser irradiation unit 21. [ In the present embodiment, the arrangement of the plurality of nozzle units 32 with respect to the first laser irradiation unit 21 is described as being circular. However, the present invention is not limited to this, 1, if the cooling fluid (I) so as to surround the laser beam (L 1) can be placed, a first plurality of nozzle unit 32 for the laser irradiation section 21 but may be arranged in any form.

Even if the line along which the object is intended to be cut has the curvature as the cooling fluid I arranged from the plurality of nozzle units 32 is injected so as to surround the first laser beam L 1 , And may be ejected along the movement path of the first laser beam L 1 . When the first and second laser irradiation units 21 and 22 and the plurality of nozzle units 32 are transported along the line along which the substrate is intended to be cut by the transfer unit 40, The second laser beam L 2 can be irradiated onto the substrate M along the line along which the substrate is intended to be cut to form a scribing line and the first laser beam L 2 irradiated by the first laser irradiation section 22 The cutting of the substrate M can be performed by the laser beam L 1 . The cooling fluid I that can be injected so as to surround the first laser beam L 1 at this time can be applied to the substrate M regardless of the moving path of the first laser beam L 1 , So that the substrate M can be broken. For example, the cooling fluid I can be ejected along the movement path of the first laser beam L 1 , not only when the line along which the object is intended to be cut is a straight line but also when it has a curvature, (M) can be cut. In addition, cooling fluid (I) may be injected into the front and rear of the moving path of the second since it can be injected to 1 to surround the laser beam (L 1), the first laser beam (L 1), thereby the substrate (M) can be more effectively broken through thermal deformation due to two temperature differences.

5 is a schematic configuration diagram of a laser processing apparatus including a laser irradiation unit and a cooling head according to another embodiment of the present invention. 6 is a plan view of a substrate cut by a laser machining apparatus according to another embodiment of the present invention.

The irradiation area A of the first laser beam L 1 irradiated on the substrate M can be formed variously according to the cutting time. When the irradiation area A of the first laser beam L 1 is increased, the ejecting direction of the cooling fluid I injected so as to surround the first laser beam L 1 must also be deformed.

5 and 6, the cooling head 30 according to an embodiment of the present invention includes a spray direction adjusting unit 33 that can rotate the nozzle unit 32 by a predetermined spray angle? The injection direction of the cooling fluid I injected from the nozzle portion 32 can be changed. As an example, when the irradiation area A of the first laser beam L 1 is increased from the first irradiation area A 1 to the second irradiation area A 2 , Can be rotated from the angle? 1 to the second injection angle? 2 . Thus, the cooling fluid I can be injected so as to surround the second irradiation area A 2 of the first laser beam L 1 . For example, the first laser beam when (L 1) which is centered round the cooling fluid (I) injected into the, the first cooling fluid from the center (O) of the first laser beam (L 1) (I 1) and The spacing distance T to the second cooling fluid I 2 can be increased from the first spacing distance T 1 to the second spacing distance T 2 .

As described above, as the nozzle unit 32 rotates, the injection angle of the cooling fluid I can be changed, and the injection area of the cooling fluid I can be changed. The cooling rate for the substrate M by the cooling fluid I injected at the same flow rate as the injection area of the cooling fluid I increases can be reduced. At this time, the flow rate of the cooling fluid I ejected from the nozzle unit 32 can be changed, and accordingly, the cooling rate for the substrate M is also maintained, so that the substrate M can be cut uniformly.

7 is a flowchart schematically illustrating an operation method of the laser processing apparatus according to an example.

As an example, the user may input the line to be cut S for the substrate M to the input unit 610. [ At this time, the line along which the object is intended to be cut S may be formed in various shapes including curvature as well as a straight line. (S210)

Next, the first laser irradiation section 21, the first laser beam has a radiation area (A) of (L 1) may be determined (S230) by the irradiation. By way of example, it can be the intensity of the first laser beam (L 1) changes according to the cutting speed of the substrate (M), the first laser beam according to the intensity of the first laser beam (L 1) (L 1 ) Can be determined.

Next, the injection angle alpha of the nozzle portion 32 is determined. (S250)

As one example, when the first irradiated region (A) of the laser beam (L 1) of the first laser beam (L 1) in accordance with the intensity of the crystal, the cooling fluid (I) by the first laser, as described above The spraying angle alpha of the nozzle portion 32 can be determined such that it can be sprayed around the irradiation region A of the beam L 1 . The irradiated area A of the first laser beam L 1 can be cooled in all the lines to be cut S according to the change in the spray angle alpha of the nozzle part 32 according to one example.

Next, the injection flow rate of the cooling fluid I injected from the nozzle portion 32 is determined. (S260)

As described above, when the injection angle alpha of the nozzle portion 32 is determined as described above, the irradiation region A of the first laser beam L 1 can be cooled in all the lines along which the material is to be divided S The injection flow rate of the cooling fluid I injected from the nozzle portion 32 can be determined. The matters related to this are substantially the same as those described with reference to FIG. 5 and FIG. 6, so that the description will be omitted here for the sake of explanation.

Next, the first and second laser irradiation units 21 and 22 and the plurality of nozzle units 32 can be moved along the line along which the substrate should be divided. (S270)

The first and second laser irradiation units 21 and 22 and the plurality of nozzle units 32 arranged to be supported by the transfer unit 40 are moved along the line along which the material is to be cut S entered into the input unit 610 So that a scribing line for the substrate M can be formed and the substrate M can be broken along the scribing line.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. It will be understood that various modifications may be made by those skilled in the art without departing from the spirit and scope of the present invention.

Claims (14)

A first laser irradiation unit; And
And a cooling head having a plurality of nozzle portions for jetting a cooling fluid and for ejecting the cooling fluid so as to surround an irradiation region of the laser beam formed by the first laser irradiation portion,
Laser processing apparatus.
The method according to claim 1,
Wherein the cooling fluid is injected at a distance that is the same distance from the center of the irradiation area of the laser beam,
Laser processing apparatus. The method according to claim 1,
Wherein a direction of ejection of the cooling fluid ejected from the plurality of nozzle portions coincides with an irradiation direction of the laser,
Laser processing apparatus. The method according to claim 1,
And a jetting direction regulating unit capable of regulating a jetting direction of the cooling fluid jetted from the plurality of nozzles,
Laser processing apparatus. The method according to claim 1,
And a control unit controlling the injection direction adjusting unit according to an area of the laser irradiation area to adjust an injection direction of the cooling fluid,
Laser processing apparatus. 6. The method of claim 5,
Wherein the controller controls the flow rate of the cooling fluid ejected from the plurality of nozzles,
Laser processing apparatus. The method according to claim 1,
And a second laser irradiating unit disposed in front of the first laser irradiating unit with a predetermined gap therebetween,
Laser processing apparatus. 8. The method of claim 7,
Wherein the first and second laser irradiating portions are CO 2 laser irradiating portions,
Laser processing apparatus. The method according to claim 1,
Wherein the cooling fluid comprises at least one of water or an alcohol.
Laser processing apparatus. The method according to claim 1,
And a transfer unit for transferring the first laser irradiation unit and the cooling head.
Laser processing apparatus. 11. The method of claim 10,
Wherein the first laser irradiation unit and the cooling head are moved along a direction having a linear direction and a curvature by the transfer unit,
Laser processing apparatus. Inputting a line along which a line is to be cut with respect to a substrate including curvature; And
Moving the first laser irradiating portion and the plurality of nozzle portions along the line along which the object is intended to be cut;
Laser processing method. 13. The method of claim 12,
Determining an irradiation area of the first laser beam by the first laser irradiation part; And
Further comprising determining an injection angle of the plurality of nozzle portions,
Laser processing method. 14. The method of claim 13,
Further comprising determining a jet flow rate of a cooling fluid jetted from the plurality of nozzle portions,
Laser processing method.
KR1020150188904A 2015-12-29 2015-12-29 Laser processing apparatus and laser processing method KR20170096242A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020150188904A KR20170096242A (en) 2015-12-29 2015-12-29 Laser processing apparatus and laser processing method
PCT/KR2016/009943 WO2017115975A1 (en) 2015-12-29 2016-09-06 Laser processing apparatus and laser processing method
CN201680076632.3A CN108449937A (en) 2015-12-29 2016-09-06 Laser processing apparatus and laser processing method
TW105130286A TWI621499B (en) 2015-12-29 2016-09-20 Laser processing apparatus and laser processing method

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KR1020150188904A KR20170096242A (en) 2015-12-29 2015-12-29 Laser processing apparatus and laser processing method

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TW (1) TWI621499B (en)
WO (1) WO2017115975A1 (en)

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TWI621499B (en) 2018-04-21

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