CN105837057A - Glass coating structure manufacturing method - Google Patents
Glass coating structure manufacturing method Download PDFInfo
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- CN105837057A CN105837057A CN201610046709.4A CN201610046709A CN105837057A CN 105837057 A CN105837057 A CN 105837057A CN 201610046709 A CN201610046709 A CN 201610046709A CN 105837057 A CN105837057 A CN 105837057A
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- Prior art keywords
- plating layer
- film plating
- nitrogen
- layer
- titanium
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- 238000000576 coating method Methods 0.000 title claims abstract description 152
- 239000011248 coating agent Substances 0.000 title claims abstract description 148
- 239000011521 glass Substances 0.000 title claims abstract description 98
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 43
- NCMAYWHYXSWFGB-UHFFFAOYSA-N [Si].[N+][O-] Chemical compound [Si].[N+][O-] NCMAYWHYXSWFGB-UHFFFAOYSA-N 0.000 claims abstract description 129
- 238000000034 method Methods 0.000 claims abstract description 125
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 80
- 239000000758 substrate Substances 0.000 claims abstract description 48
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 40
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 39
- 239000001301 oxygen Substances 0.000 claims abstract description 38
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 38
- 230000015572 biosynthetic process Effects 0.000 claims abstract 3
- 238000007747 plating Methods 0.000 claims description 287
- HEGVYZJCELUPOJ-UHFFFAOYSA-N [N].[O].[Ti] Chemical compound [N].[O].[Ti] HEGVYZJCELUPOJ-UHFFFAOYSA-N 0.000 claims description 152
- 238000007639 printing Methods 0.000 claims description 22
- 239000000463 material Substances 0.000 claims description 18
- 239000000049 pigment Substances 0.000 claims description 16
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 12
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 12
- 239000010703 silicon Substances 0.000 claims description 12
- 229910052710 silicon Inorganic materials 0.000 claims description 12
- 239000010936 titanium Substances 0.000 claims description 12
- 229910052719 titanium Inorganic materials 0.000 claims description 12
- 241000222065 Lycoperdon Species 0.000 claims description 9
- 241000768494 Polymorphum Species 0.000 claims description 9
- MWUXSHHQAYIFBG-UHFFFAOYSA-N nitrogen oxide Inorganic materials O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 claims description 9
- 239000003921 oil Substances 0.000 claims description 8
- 239000002994 raw material Substances 0.000 claims description 8
- 230000000694 effects Effects 0.000 abstract description 45
- 238000001514 detection method Methods 0.000 abstract description 40
- LGLRLDQPSSWHKG-UHFFFAOYSA-N [N]=O.[Ti] Chemical compound [N]=O.[Ti] LGLRLDQPSSWHKG-UHFFFAOYSA-N 0.000 abstract description 8
- DOTMOQHOJINYBL-UHFFFAOYSA-N molecular nitrogen;molecular oxygen Chemical compound N#N.O=O DOTMOQHOJINYBL-UHFFFAOYSA-N 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 430
- 238000010586 diagram Methods 0.000 description 22
- 239000003990 capacitor Substances 0.000 description 18
- 238000007789 sealing Methods 0.000 description 16
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 14
- 238000003825 pressing Methods 0.000 description 11
- 239000010939 rose gold Substances 0.000 description 11
- 229910001112 rose gold Inorganic materials 0.000 description 11
- UMVBXBACMIOFDO-UHFFFAOYSA-N [N].[Si] Chemical compound [N].[Si] UMVBXBACMIOFDO-UHFFFAOYSA-N 0.000 description 7
- 125000004433 nitrogen atom Chemical group N* 0.000 description 7
- 125000004430 oxygen atom Chemical group O* 0.000 description 7
- 208000031481 Pathologic Constriction Diseases 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 6
- 230000004313 glare Effects 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 229910052709 silver Inorganic materials 0.000 description 6
- 239000004332 silver Substances 0.000 description 6
- 210000001215 vagina Anatomy 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 5
- 239000000945 filler Substances 0.000 description 5
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 235000014692 zinc oxide Nutrition 0.000 description 4
- 239000011787 zinc oxide Substances 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 238000005034 decoration Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 239000011247 coating layer Substances 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- -1 wherein Chemical compound 0.000 description 2
- 241000628997 Flos Species 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 230000000739 chaotic effect Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000010985 leather Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/3411—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions with at least two coatings of inorganic materials
- C03C17/3429—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions with at least two coatings of inorganic materials at least one of the coatings being a non-oxide coating
- C03C17/3435—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions with at least two coatings of inorganic materials at least one of the coatings being a non-oxide coating comprising a nitride, oxynitride, boronitride or carbonitride
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/22—Surface treatment of glass, not in the form of fibres or filaments, by coating with other inorganic material
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Life Sciences & Earth Sciences (AREA)
- Organic Chemistry (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Laminated Bodies (AREA)
Abstract
The invention provides a glass coating structure manufacturing method. The method comprises feeding nitrogen and oxygen into a vacuum space of which the upper part is provided with a glass substrate according to a fixed ratio of nitrogen to oxygen of 0.4: 1 to 1.5: 1 and alternately carrying out a titanium-nitrogen oxide coating film formation process and a silicon-nitrogen oxide coating film formation process to downward form alternately overlapped silicon-nitrogen oxide coating films and titanium-nitrogen oxide coating films at the lower surface of the glass substrate. The silicon-nitrogen oxide coating films and titanium-nitrogen oxide coating films are alternately overlapped at the lower surface of the glass substrate and nitrogen-oxygen ratios are the same and are in a range of 0.4: 1 to 1.5: 1 so that insulating properties are guaranteed, a glass coating structure with minute surface effects is formed and coating thickness has small influence on fingerprint detection in a very small range.
Description
Technical field
The present invention relates to the manufacture method of a kind of glass coating structure, particularly relate to a kind of glass being applied to fingerprint detection
The manufacture method of coating structure.
Background technology
At present, fingerprint identification technology has been applied on the products such as mobile terminal (e.g., computer).Wherein, electric capacity pressing type
Fingerprint detection method application is relatively broad, is divided into the most again active pressing detection and passive type pressing detection.
The ultimate principle of passive type pressing detection is as it is shown in figure 1, whole detecting system includes: the condenser type being positioned at bottom refers to
Stricture of vagina sensor 10 and cover sealing coat on capacitive fingerprint sensing device 10 and (or be protective layer, be also that finger directly connects
The region touched) 11, wherein, capacitive fingerprint sensing device 10 includes with multiple capacitor plates of two-dimensional array (example in figure
Property mark out 5 capacitor plate P1-P5), after skin and the sealing coat 11 of finger 12 are fitted, the skin of finger 12 and electric capacity
Form electric capacity between pole plate, due to the existence of fingerprint, microcosmic form situation as shown in Figure 1, the skin of finger 12 with every
Absciss layer 11 surface defines many places ridge and valley, and the distance between diverse location and each capacitor plate of the skin of finger 12 is not
Equal, thus, each capacitor plate just from create different capacitances between the skin of finger 12, such as formed at ridge
Capacitance be Cv, at valley formed capacitance be Cr, by measuring these capacitances, it is possible to obtain information in fingerprint,
I.e. each capacitor plate is as a pixel, collects information in fingerprint.
The principle of active pressing detection as in figure 2 it is shown, add on the basis of passive type detecting system be looped around every
The becket 13 of 11 around absciss layer, becket 13 is connected with bottom circuit, and the effect of becket 13 is used to wake up up the electricity of bottom
Appearance formula fingerprint sensor 10 and apply certain current signal to finger 12 by becket 13, thus increase the skin of finger 12
Amount of charge on skin, and then enhance the signal detected by capacitor plate.Condenser type is passed through as it is shown on figure 3, it illustrates
The fingerprint image signal that the detection of fingerprint sensor is presented.
In above-mentioned fingerprint detection system, the upper and lower surface of sealing coat 11 have to be formed by insulant, not so will
The electric capacity between skin and the capacitor plate of finger 12 can be destroyed, thus finger print information cannot be detected.Additionally, with metal
In the detecting system of ring 13, the part that sealing coat 11 contacts with becket 13 also must be insulation, if sealing coat 11 conducts electricity,
Electric current on becket 13 will flow through sealing coat 11, thus causes signal chaotic, finger print information cannot be detected equally.
Additionally, due to the detection range of the capacitor plate array of capacitive fingerprint sensing device 10 is the least, this is accomplished by finger
12 distance capacitor plate arrays are close, i.e. require that sealing coat 11 thickness can not be very big, the most also can affect fingerprint detection effect, especially
It is the system for passive type pressing detection, and capacitive fingerprint sensing device 10 is to the thickness of the sealing coat 11 that top covers more
Sensitive, it is impossible to use the sealing coat 11 that thickness is bigger.
Along with developing rapidly of the mobile terminal such as mobile phone, panel computer, mobile terminal while trending towards slimming also
Constantly investigating aesthetic, the region that sealing coat 11 is covered namely carries out the region of fingerprint recognition, and it is on mobile terminals
It is typically in more prominent position, such as, is arranged on the bonnet centre position of mobile phone, or is arranged on the bottom in mobile phone front
Deng.Therefore, fingerprint recognition region aesthetic measure will directly affect the overall appearance of mobile phone.But, due to above-mentioned many limits
System, the mobile terminal of the fingerprint detection mode of employing electric capacity pressing type of the prior art, the sealing coat in its fingerprint recognition region
11 mostly use the materials such as pottery or plastics, the most only simple realization protection capacitive fingerprint sensing device 10 every
From encapsulation effect, but, finger print detection device cannot realize glass-mirror.
In prior art, the coating technique of glass-mirror is the most ripe, but, due to general filming on mirror surface, will not be right
Insulating properties and thickness requirement are higher, typically can use the mode of direct plating metal, or realize wanting by the plated film of multilamellar
Effect, the film plating layer so formed is typically the thickest or on-insulated, therefore, it is impossible to meet the thickness requirement of fingerprint detection.This
Outward, above-mentioned fingerprint detection system itself uses capacitance detecting principle, and the skin of finger 12 is with capacitor plate array respectively
As the two poles of the earth of electric capacity, according to capacitance calculation formula, the size of electric capacity is except the distance dependent between capacitor plate, also
Relevant with the medium between capacitor plate, the introducing of film plating layer will increase the media quantity between capacitor plate, thus affects
The size of capacitance, the thickness of film plating layer is the biggest, and the impact on capacitance is the biggest, therefore, in order to not cause fingerprint detection
Serious impact, the most also cannot allow to there is the thickest film plating layer and exist.
Summary of the invention
It is an object of the invention to provide the manufacture method of a kind of glass coating structure, the glass coating structure that it produces
Can to fingerprint detection influential effect less on the premise of so that fingerprint detection region presents mirror effect.
To achieve these goals, the invention provides a kind of glass coating structure, including a glass substrate, at described glass
The lower surface of glass substrate is down-set alternately laminated titanium-nitrogen-oxygen compound film plating layer and a silicon nitrogen oxides film plating layer, wherein,
Titanium-nitrogen-oxygen compound in each film plating layer is with the molecular formula of silicon nitrogen oxides, and nitrogen is identical with the ratio of oxygen, and span is
0.4:1 to 1.5:1.
Present invention also offers a kind of finger print detection device, including: capacitive fingerprint sensing device, at described capacitance type fingerprint
The top of sensor is pasted with above-mentioned glass coating structure.
Invention further provides a kind of mobile terminal including above-mentioned finger print detection device, on the bonnet of described mobile terminal
Offering the opening for carrying out fingerprint detection, described finger print detection device is positioned at described lower opening portion, and described fingerprint detection fills
The above of the glass coating structure put exposes from described opening.
The present invention has reoffered the manufacture method of a kind of glass coating structure, including:
Be provided with in the vacuum space of glass substrate to top, nitrogen that the ratio that is passed through is fixing and oxygen, wherein, nitrogen with
The span of the ratio of oxygen is 0.4:1 to 1.5:1;
It is alternately performed titanium-nitrogen-oxygen compound film plating layer generation process and silicon nitrogen oxides film plating layer generation process, at glass substrate
Lower surface be formed down alternately laminated silicon nitrogen oxides film plating layer and titanium-nitrogen-oxygen compound film plating layer;
Described titanium-nitrogen-oxygen compound film plating layer generation process includes: is excited by electron gun and is arranged in described confined space
Titanium material, makes described titanium material evaporate, after reacting with the nitrogen in described confined space and oxygen, under glass substrate
Surface is formed down titanium-nitrogen-oxygen compound film plating layer;
Described silicon nitrogen oxides film plating layer generation process includes: is excited by electron gun and is arranged in described confined space
Silicon raw material, makes described silicon raw material evaporate, after reacting with the nitrogen in described confined space and oxygen, under glass substrate
Surface is formed down silicon nitrogen oxides film plating layer.
The present invention provide glass coating structure manufacture method with, by replacing titanizing nitrogen at the lower surface of glass substrate
Oxide coating layer and silicon nitrogen oxides film plating layer, and make the nitrogen in coating compound identical with the ratio of oxygen, and arrive at 0.4:1
Value is carried out in the range of 1.5:1, thus on the premise of ensureing insulating properties, it is achieved that there is the glass coating knot of mirror effect
Structure, and the impact of fingerprint detection is controlled in the least scope by the thickness of coating itself.
Accompanying drawing explanation
Fig. 1 is one of schematic diagram of fingerprint detection principle of prior art;
Fig. 2 is the two of the schematic diagram of the fingerprint detection principle of prior art;
Fig. 3 is the schematic diagram of the fingerprint detection picture signal of prior art;
One of schematic diagram of glass coating structure of Fig. 4 embodiment of the present invention;
Fig. 5 is the two of the schematic diagram of the glass coating structure of the embodiment of the present invention;
Fig. 6 is the Principle of plating schematic diagram of the embodiment of the present invention;
Fig. 7 is one of reflectance curve schematic diagram that in the embodiment of the present invention two, first group of film structure is corresponding;
Fig. 8 is the two of the reflectance curve schematic diagram that in the embodiment of the present invention two, second group of film structure is corresponding;
Fig. 9 is the three of the reflectance curve schematic diagram that in the embodiment of the present invention two, the 3rd group of film structure is corresponding;
Figure 10 is one of reflectance curve schematic diagram that in the embodiment of the present invention three, first group of film structure is corresponding;
Figure 11 is the two of the reflectance curve schematic diagram that in the embodiment of the present invention three, second group of film structure is corresponding;
Figure 12 is the three of the reflectance curve schematic diagram that in the embodiment of the present invention three, the 3rd group of film structure is corresponding;
Figure 13 is one of reflectance curve schematic diagram that in the embodiment of the present invention four, first group of film structure is corresponding;
Figure 14 is the two of the reflectance curve schematic diagram that in the embodiment of the present invention four, second group of film structure is corresponding;
Figure 15 is the three of the reflectance curve schematic diagram that in the embodiment of the present invention four, the 3rd group of film structure is corresponding;
Figure 16 is one of reflectance curve schematic diagram that in the embodiment of the present invention 12, first group of film structure is corresponding;
Figure 17 is the two of the reflectance curve schematic diagram that in the embodiment of the present invention 12, second group of film structure is corresponding;
Figure 18 is the three of the reflectance curve schematic diagram that in the embodiment of the present invention 12, the 3rd group of film structure is corresponding;
Figure 19 is one of reflectance curve schematic diagram that in the embodiment of the present invention 18, first group of film structure is corresponding;
Figure 20 is the two of the reflectance curve schematic diagram that in the embodiment of the present invention 18, second group of film structure is corresponding;
Figure 21 is the three of the reflectance curve schematic diagram that in the embodiment of the present invention 18, the 3rd group of film structure is corresponding.
Detailed description of the invention
Below in conjunction with the accompanying drawings the embodiment of the present invention is described in detail.
The principle of the embodiment of the present invention is, by the lower surface of glass substrate replace titanizing nitrogen oxides film plating layer and
Silicon nitrogen oxides film plating layer, realizes mirror effect, insulating properties to be ensured and will be by the THICKNESS CONTROL of overall coating
In the thinnest scope, thus reduce the impact on fingerprint detection.
Specifically, as it is shown on figure 3, the present embodiment relates to a kind of glass coating structure, it is mainly used in electric capacity pressing type and refers to
In stricture of vagina detecting system, serving as the sealing coat covered on capacitive fingerprint sensing device, the structure of this glass coating includes glass
Substrate 1 and in the down-set alternately laminated titanium-nitrogen-oxygen compound film plating layer 2 of the lower surface of described glass substrate and the oxidation of silicon nitrogen
Thing film plating layer 3, the overall film plating layer structure that multicoating layer is formed is also referred to as film system.
The glass coating structure of the embodiment of the present invention, including a glass substrate, downward at the lower surface of described glass substrate
It is provided with alternately laminated titanium-nitrogen-oxygen compound film plating layer and silicon nitrogen oxides film plating layer, wherein, the titanium nitrogen in each film plating layer
Oxide is with the molecular formula of silicon nitrogen oxides, and nitrogen is identical with the ratio of oxygen, and span is 0.4:1 to 1.5:1.
In said structure, by using alternately laminated titanium-nitrogen-oxygen compound film plating layer and silicon nitrogen oxides film plating layer, and
Identical with the ratio of oxygen by controlling nitrogen, the refractive index of titanium-nitrogen-oxygen compound is controlled at about 1.8-2.1, by silicon nitrogen oxides
Refractive index controls at about 1.3-1.4, in combination with the number of plies and the control of thickness, in the case of integral thickness is relatively thin, it is achieved
Mirror effect, and there is insulating properties, do not interfere with the detection of fingerprint sensor.
Specifically, affected by the distance between capacitor plate, in the embodiment of the present invention due to the size of capacitance
In structure, it is possible to overall coating film thickness is controlled the thinnest (on the premise of meeting desirable effect, it is possible to control 1um with
In), therefore, the capacitance detection impact for fingerprint sensor is the least.
Additionally, the size of capacitance also can be affected by the medium of the filling between capacitor plate, when filler kind
When class is the most, also capacitance can be affected, in the coating structure of embodiments of the invention, use only two kinds
Nitrogen oxides is as coating, and therefore, the kind of the material between finger skin and capacitor plate array is less, and does not has gold
Belonging to class coating, and the integral thickness of coating is the thinnest, between capacitor plate for the angle of filler, impact also reduces
Arrive the least.
The most preferably, titanium-nitrogen-oxygen compound film plating layer is positioned at ground floor, plates titanium-nitrogen-oxygen compound film plating layer the most at first, by
Higher in the luminance factor of titanium-nitrogen-oxygen compound, therefore, it is located at ground floor and whole film system can be made to present more gorgeous
Color.
Specifically, the plated film ratio of the following number of plies, thickness and titanium-nitrogen-oxygen compound and silicon nitrogen oxides can be used, come real
Existing mirror effect: the film plating layer sum of described titanium-nitrogen-oxygen compound film plating layer and described silicon nitrogen oxides film plating layer is 4-7 layer, coating
Gross thickness between 100nm to 950nm, the plated film of the gross thickness of the film plating layer of described titanium-nitrogen-oxygen compound and described silicon nitrogen oxides
The ratio of the gross thickness of layer is between 0.4 to 1.65.It is seen from the above data that by reasonably carrying out Film Design, it is possible to
The gross thickness of film plating layer being arranged controls within 1um, and the capacitance detection impact on fingerprint sensor is the least.
Correspondingly, as shown in Figure 6, the glass coating structure of the present embodiment is permissible for the producing principle of above-mentioned glass coating structure
NCVM (non-conducting vacuum plating) technique is used to realize.Specifically, vacuum space as shown in Figure 6 is set, and leads to wherein
Entering the fixing nitrogen of ratio and oxygen, wherein, nitrogen is 0.4:1 to 1.5:1 with the span of the ratio of oxygen, then replaces
Perform titanium-nitrogen-oxygen compound film plating layer generation process and silicon nitrogen oxides film plating layer generation process, thus at the lower surface of glass substrate
It is formed down alternately laminated silicon nitrogen oxides film plating layer and titanium-nitrogen-oxygen compound film plating layer.
Wherein, titanium-nitrogen-oxygen compound film plating layer generation process is particularly as follows: excite by electron gun and be arranged on described confined space
In titanium material, make described titanium material evaporate, after reacting with the nitrogen in described confined space and oxygen, at glass substrate
Lower surface be formed down titanium-nitrogen-oxygen compound film plating layer.
Silicon nitrogen oxides film plating layer generation process includes: excited the silicon being arranged in described confined space former by electron gun
Material, makes described silicon raw material evaporate, after reacting with the nitrogen in described confined space and oxygen, at the lower surface of glass substrate
It is formed down silicon nitrogen oxides film plating layer.
The number of times being alternately performed titanium-nitrogen-oxygen compound film plating layer generation process and silicon nitrogen oxides film plating layer generation process depends on
In the number of plies finally to obtain, and the thickness of every layer aoxidizes by controlling each titanium-nitrogen-oxygen compound film plating layer generation process and silicon nitrogen
Thing film plating layer generation process realizes.
In above-mentioned technique, the nitrogen being passed through by control and the ratio of oxygen, realize in the compound to film plating layer
The control of the ratio of nitrogen-atoms and oxygen atom, thus reach titanium-nitrogen-oxygen compound and the adjustment of the reflectance of silicon nitrogen oxides, from
And the refractive index of titanium-nitrogen-oxygen compound is controlled at about 1.8-2.1, the refractive index of silicon nitrogen oxides is controlled at 1.3-1.4 left
The right side, in combination with the number of plies and the control of thickness, in the case of integral thickness is relatively thin, it is achieved that the minute surface effect that effect is the most beautiful
Really.The present embodiment uses technique, owing to only used two kinds of common metals and semi-conducting material, therefore, in the realization of its technique
Relatively simple, it is simple to carry out Mass production.
Additionally, the most preferably, in coating process, first carry out titanium-nitrogen-oxygen compound film plating layer generation process so that titanium
Nitrogen oxides film plating layer is positioned at ground floor, and owing to the luminance factor of titanium-nitrogen-oxygen compound is higher, therefore, being located at ground floor can
Whole film system is made to present more gorgeous color.
Specifically can be by the control (such as plated film time, operation number of times etc.) of process, it is achieved the above-mentioned number of plies, thickness
And the plated film ratio of titanium-nitrogen-oxygen compound and silicon nitrogen oxides, the most described titanium-nitrogen-oxygen compound film plating layer and described silicon nitrogen oxides plated film
The film plating layer sum of layer is 4-7 layer, coating gross thickness between 100nm to 950nm, the film plating layer of described titanium-nitrogen-oxygen compound total
The ratio of the gross thickness of the film plating layer of thickness and described silicon nitrogen oxides is between 0.4 to 1.65.
Following is illustrated separately below as a example by the minute surface coating structure of rose gold, silver color and tarnish these three color
The technical scheme of invention, wherein, the structural representation of three kinds of colors and manufacturing theory schematic diagram all use Fig. 4 to Fig. 6 to carry out example
The explanation of property.
Wherein, the detailed description of the invention of the mirror effect of the corresponding rose gold of embodiment one to ten, embodiment ten one to ten six
The detailed description of the invention of the mirror effect of corresponding silver color, the mirror effect of the corresponding tarnish of embodiment ten seven to two 12 concrete real
Executing mode, embodiment 23 and 24 is the concrete application product embodiment of the glass coating structure of the present invention.
Embodiment one
As it is shown on figure 3, the present embodiment relates to a kind of glass coating structure, it is mainly used in electric capacity pressing type fingerprint detection system
In system, serve as and cover sealing coat on capacitive fingerprint sensing device, the structure of this glass coating include glass basic 1 and
Alternately laminated titanium-nitrogen-oxygen compound film plating layer 2 that the lower surface of described glass substrate is down-set and silicon nitrogen oxides film plating layer 3,
The overall film plating layer structure that multicoating layer is formed is also referred to as film system.
Wherein, in the molecular formula of titanium-nitrogen-oxygen compound and silicon nitrogen oxides, nitrogen and the ratio substantially 1.3:1 to 1.5:1 of oxygen
Between, in actual applications, as the scheme more selected, the ratio of nitrogen Yu oxygen is positioned at 1.4:1, i.e. titanium-nitrogen-oxygen compound and silicon
Nitrogen oxides molecular formula can be expressed as TINxOyAnd SINxOy, wherein x=1.4y.
In said structure, have employed titanium-nitrogen-oxygen compound film plating layer and the alternately laminated plating of described silicon nitrogen oxides film plating layer
Rotating fields, realizes the mirror effect of glass substrate, on the premise of ensureing insulating properties, it is possible to the coating that integral thickness is relatively thin
Realize brightly painted mirror effect.
Specifically, by the ratio of nitrogen-atoms in titanium-nitrogen-oxygen compound and silicon nitrogen oxides Yu oxygen atom is controlled at 1.3:1
Between 1.5:1, the reflectance of titanium-nitrogen-oxygen compound and silicon nitrogen oxides is adjusted, by the refractive index control of titanium-nitrogen-oxygen compound
The refractive index of silicon nitrogen oxides, about 1.84, is controlled about 1.31, in combination with the number of plies and the control of thickness, whole by system
In the case of body thickness is relatively thin, it is achieved that the mirror effect of the rose gold that effect is the most beautiful.Rose gold color mentioned here
Corresponding optical wavelength substantially in the range of 565-570nm, L=80, A value of this color=8.65-11.1, B value=0.9-
3.4。
The most preferably, titanium-nitrogen-oxygen compound film plating layer is positioned at ground floor, plates titanium-nitrogen-oxygen compound film plating layer the most at first, by
Higher in the luminance factor of titanium-nitrogen-oxygen compound, therefore, it is located at ground floor and whole film system can be made to present more gorgeous
Color.
In the present embodiment, the film plating layer sum of described titanium-nitrogen-oxygen compound film plating layer 2 and described silicon nitrogen oxides film plating layer 3
Can be 5-7 layer, coating gross thickness can control between 280nm to 1000nm.It addition, in an embodiment of the present invention, glass
The thickness of glass substrate can be in the range of 170-180um, preferably 175um.
Embodiment two
The present embodiment, on the basis of embodiment one, gives a kind of concrete coating structure: described film plating layer sum is 5
Layer, the gross thickness of the film plating layer of described titanium-nitrogen-oxygen compound arrives 1.55 with the ratio of the gross thickness of the film plating layer of described silicon nitrogen oxides
Between 1.65, it is ensured that this ratio just can realize the mirror effect of rose gold, and energy in the case of only plating 5 layers of film plating layer
Enough gross thickness is controlled at below 500nm, thus reduce the impact on capacitance detecting.
Wherein, the structure of every layer can use following thickness to distribute:
Described ground floor film plating layer is titanium-nitrogen-oxygen compound coating, and thickness range is 45-70nm;
Described second layer film plating layer is silicon nitrogen oxides coating, and thickness range is 55-90nm;
Described third layer film plating layer is titanium-nitrogen-oxygen compound coating, and thickness range is 45-70nm;
Described 4th layer of film plating layer is silicon nitrogen oxides coating, and thickness range is 55-90nm;
Described layer 5 film plating layer is titanium-nitrogen-oxygen compound coating, and thickness range is 95-150nm;
Wherein, ground floor is identical with the thickness of third layer, and the thickness of the second layer and the 4th layer is identical, and the second layer and
The thickness of four layers is more than the thickness of ground floor with third layer.
Specifically, three groups of concrete film structure examples in following table are given:
Layer numbering | First group | Second group | 3rd group |
Ground floor (TINxOy) | 46nm | 69nm | 50nm |
The second layer (SINxOy) | 59nm | 89nm | 66nm |
Third layer (TINxOy) | 46nm | 69nm | 50nm |
4th layer of (SINxOy) | 59nm | 89nm | 66nm |
Layer 5 (TINxOy) | 99nm | 149nm | 110nm |
Gross thickness | 309nm | 465nm | 342nm |
TINxOyWith SINxOyThickness ratio | 1.61 | 1.61 | 1.59 |
In upper table, the reflectance curve of three groups of film structures is as shown in Figure 7 to 9, and wherein transverse axis coordinate is wavelength (nm),
The longitudinal axis is refractive index (%), and the curve chart transverse and longitudinal coordinate of following example is identical.
Embodiment three
The present embodiment, on the basis of embodiment one, gives another kind of concrete coating structure: described film plating layer is total
Being 6 layers, the ratio of the gross thickness of the film plating layer of described titanium-nitrogen-oxygen compound and the gross thickness of the film plating layer of described silicon nitrogen oxides is 0.8
Between 0.9, it is ensured that this ratio just can realize the mirror effect of rose gold in the case of only plating 6 layers of film plating layer, and
Gross thickness can be controlled at below 600nm, thus reduce the impact on capacitance detecting.
Wherein, the structure of every layer can use following thickness to distribute:
Described ground floor film plating layer is titanium-nitrogen-oxygen compound coating, and thickness range is 75-95nm;
Described second layer film plating layer is silicon nitrogen oxides coating, and thickness range is 75-95nm;
Described third layer film plating layer is titanium-nitrogen-oxygen compound coating, and thickness range is 75-95nm;
Described 4th layer of film plating layer is silicon nitrogen oxides coating, and thickness range is 75-95nm;
Described layer 5 film plating layer is titanium-nitrogen-oxygen compound coating, and thickness range is 75-95nm;
Described layer 6 film plating layer is silicon nitrogen oxides coating, and thickness range is 110-135nm;
Wherein, the thickness of ground floor, third layer and layer 5 is identical, and the thickness of the second layer and the 4th layer is identical, and
The thickness of the second layer and the 4th layer is more than, third layer and the thickness of layer 5.
Specifically, three groups of concrete film structure examples in following table are given:
In upper table, the reflectance curve of three groups of film structures is as shown in Figure 10 to Figure 12.
Embodiment four
The present embodiment, on the basis of embodiment one, gives another concrete coating structure: described film plating layer is total
Being 7 layers, the ratio of the gross thickness of the film plating layer of described titanium-nitrogen-oxygen compound and the gross thickness of the film plating layer of described silicon nitrogen oxides is 1.4
Between 1.5, it is ensured that this ratio just can realize the mirror effect of rose gold in the case of only plating 7 layers of film plating layer, and
Gross thickness can be controlled at below 950nm, thus reduce the impact on capacitance detecting.
Wherein, the structure of every layer can use following thickness to distribute:
Described ground floor film plating layer is titanium-nitrogen-oxygen compound coating, and thickness range is 65-130nm;
Described second layer film plating layer is silicon nitrogen oxides coating, and thickness range is 65-130nm;
Described third layer film plating layer is titanium-nitrogen-oxygen compound coating, and thickness range is 65-130nm;
Described 4th layer of film plating layer is silicon nitrogen oxides coating, and thickness range is 65-130nm;
Described layer 5 film plating layer is titanium-nitrogen-oxygen compound coating, and thickness range is 65-130nm;
Described layer 6 film plating layer is silicon nitrogen oxides coating, and thickness range is 65-130nm;
Described layer 7 film plating layer is titanium-nitrogen-oxygen compound coating, and thickness range is 80-170nm;
Wherein, the thickness of ground floor to layer 6 is identical, and the thickness of layer 7 is more than the thickness of ground floor to layer 6.
Specifically, three groups of concrete film structure examples in following table are given:
In upper table, the reflectance curve of three groups of film structures is as shown in Figure 13 to Figure 16.
Embodiment five
As it is shown in figure 5, the present embodiment is on the basis of the various embodiments described above, the lower section of whole coating is provided with one layer
Ink layer, by arranging ink layer, it is possible to preferably carries out shading, prevents the interference of veiling glare, for the color that invention is to be realized,
Preferably printing gray oil layer of ink, background color can be adjusted by gray oil layer of ink, thus presents more preferable rose gold effect.
Further, it is also possible to printing gray oil layer of ink when, printing certain pierced pattern, such as, printing refers to
The pierced pattern of stricture of vagina figure, openwork part and the part of non-hollow out, there are differences in light transmission and reflexive, thus from
Layer glass is observed and will be presented corresponding pattern under mirrored background such that it is able to realizes finger-print region and is identified or fills
Decorations.Preferably, the pigment being different from Lycoperdon polymorphum Vitt can be set in pierced pattern again, present a contrast with Lycoperdon polymorphum Vitt it is highly preferred that fill
Pigment, thus allow pattern become apparent from.
Embodiment six
The present embodiment mainly illustrates to manufacture the glass coating structure manufacture method of above-described embodiment one, as indicated with 6, this enforcement
The glass coating structure of example can use NCVM (non-conducting vacuum plating) technique to realize.
Specifically, vacuum space as shown in Figure 6 is set, and is passed through ratio nitrogen between 1.3:1 to 1.5:1 wherein
With oxygen (preferably, the ratio of being passed through is nitrogen and the oxygen of 1.4:1), then it is alternately performed titanium-nitrogen-oxygen compound film plating layer and generates work
Sequence and silicon nitrogen oxides film plating layer generation process, thus it is formed down alternately laminated silicon nitrogen oxidation at the lower surface of glass substrate
Thing film plating layer and titanium-nitrogen-oxygen compound film plating layer.
Wherein, titanium-nitrogen-oxygen compound film plating layer generation process is particularly as follows: excite by electron gun and be arranged on described confined space
In titanium material, make described titanium material evaporate, after reacting with the nitrogen in described confined space and oxygen, at glass substrate
Lower surface be formed down titanium-nitrogen-oxygen compound film plating layer.
Silicon nitrogen oxides film plating layer generation process includes: excited the silicon being arranged in described confined space former by electron gun
Material, makes described silicon raw material evaporate, after reacting with the nitrogen in described confined space and oxygen, at the lower surface of glass substrate
It is formed down silicon nitrogen oxides film plating layer.
The number of times being alternately performed titanium-nitrogen-oxygen compound film plating layer generation process and silicon nitrogen oxides film plating layer generation process depends on
In the number of plies finally to obtain, and the thickness of every layer aoxidizes by controlling each titanium-nitrogen-oxygen compound film plating layer generation process and silicon nitrogen
Thing film plating layer generation process realizes.
In above-mentioned technique, the nitrogen being passed through by control and the ratio of oxygen, realize in the compound to film plating layer
The control of the ratio of nitrogen-atoms and oxygen atom, thus reach titanium-nitrogen-oxygen compound and the adjustment of the reflectance of silicon nitrogen oxides, from
And the refractive index of titanium-nitrogen-oxygen compound is controlled about 1.84, the refractive index of silicon nitrogen oxides is controlled about 1.31, simultaneously
In conjunction with the number of plies and the control of thickness, in the case of integral thickness is relatively thin, it is achieved that the minute surface of the rose gold that effect is the most beautiful
Effect.The present embodiment uses technique, and owing to only used two kinds of common metals and semi-conducting material, therefore, its technique realizes
Upper relatively simple, it is simple to carry out Mass production.
Additionally, the most preferably, in coating process, first carry out titanium-nitrogen-oxygen compound film plating layer generation process so that titanium
Nitrogen oxides film plating layer is positioned at ground floor, and owing to the luminance factor of titanium-nitrogen-oxygen compound is higher, therefore, being located at ground floor can
Whole film system is made to present more gorgeous color.
Additionally, in the present embodiment, film plating layer sum can control at 5-7 layer, and coating gross thickness can control at 280nm
Between 1000nm, it addition, in an embodiment of the present invention, the thickness of glass substrate can be excellent in the range of 170-180um
Elect 175um as.
Embodiment seven
The present embodiment relates to the manufacture method manufacturing the coating structure of above-described embodiment two, including: it is alternately performed titanium-nitrogen-oxygen
Compound film plating layer generation process and silicon nitrogen oxides film plating layer generation process (can be alternately performed five times can realize), make described
Film plating layer sum is 5 layers, and the film plating layer of the gross thickness of the film plating layer of described titanium-nitrogen-oxygen compound and described silicon nitrogen oxides
The ratio of gross thickness is between 1.55 to 1.65.
Specifically, by being alternately performed titanium-nitrogen-oxygen compound film plating layer generation process and silicon nitrogen oxides film plating layer operation, raw
Become the coating structure of following thickness:
Described ground floor film plating layer is titanium-nitrogen-oxygen compound coating, and thickness range is 45-70nm;
Described second layer film plating layer is silicon nitrogen oxides coating, and thickness range is 55-90nm;
Described third layer film plating layer is titanium-nitrogen-oxygen compound coating, and thickness range is 45-70nm;
Described 4th layer of film plating layer is silicon nitrogen oxides coating, and thickness range is 55-90nm;
Described layer 5 film plating layer is titanium-nitrogen-oxygen compound coating, and thickness range is 95-150nm;
Wherein, ground floor is identical with the thickness of third layer, and the thickness of the second layer and the 4th layer is identical, and the second layer and
The thickness of four layers is more than the thickness of ground floor with third layer.
Wherein, the thickness of every layer can realize by controlling the plated film time, and the example of the concrete thickness of every layer is being implemented
It is stated that do not repeating at this in example two.
Embodiment eight
The present embodiment relates to the manufacture method manufacturing the coating structure of above-described embodiment three, is alternately performed the plating of titanium-nitrogen-oxygen compound
Film layer generation process and silicon nitrogen oxides film plating layer generation process (can be alternately performed six times can realize), make described film plating layer
Sum is 6 layers, the ratio of the gross thickness of the film plating layer of described titanium-nitrogen-oxygen compound and the gross thickness of the film plating layer of described silicon nitrogen oxides
Between 0.8 to 0.9.
Specifically, by being alternately performed titanium-nitrogen-oxygen compound film plating layer generation process and silicon nitrogen oxides film plating layer operation, raw
Become the coating structure of following thickness:
Described ground floor film plating layer is titanium-nitrogen-oxygen compound coating, and thickness range is 75-95nm;
Described second layer film plating layer is silicon nitrogen oxides coating, and thickness range is 75-95nm;
Described third layer film plating layer is titanium-nitrogen-oxygen compound coating, and thickness range is 75-95nm;
Described 4th layer of film plating layer is silicon nitrogen oxides coating, and thickness range is 75-95nm;
Described layer 5 film plating layer is titanium-nitrogen-oxygen compound coating, and thickness range is 75-95nm;
Described layer 6 film plating layer is silicon nitrogen oxides coating, and thickness range is 110-135nm;
Wherein, the thickness of ground floor, third layer and layer 5 is identical, and the thickness of the second layer and the 4th layer is identical, and
The thickness of the second layer and the 4th layer is more than, third layer and the thickness of layer 5.
Wherein, the thickness of every layer can realize by controlling the plated film time, and the example of the concrete thickness of every layer is being implemented
It is stated that do not repeating at this in example three.
Embodiment nine
The present embodiment relates to the manufacture method manufacturing the coating structure of above-described embodiment four, is alternately performed the plating of titanium-nitrogen-oxygen compound
Film layer generation process and silicon nitrogen oxides film plating layer generation process (can be alternately performed seven times can realize), described film plating layer is total
Number is 7 layers, and the gross thickness of the film plating layer of described titanium-nitrogen-oxygen compound exists with the ratio of the gross thickness of the film plating layer of described silicon nitrogen oxides
Between 1.4 to 1.5.
Specifically, by being alternately performed titanium-nitrogen-oxygen compound film plating layer generation process and silicon nitrogen oxides film plating layer operation, raw
Become the coating structure of following thickness coating:
Described ground floor film plating layer is titanium-nitrogen-oxygen compound coating, and thickness range is 65-130nm;
Described second layer film plating layer is silicon nitrogen oxides coating, and thickness range is 65-130nm;
Described third layer film plating layer is titanium-nitrogen-oxygen compound coating, and thickness range is 65-130nm;
Described 4th layer of film plating layer is silicon nitrogen oxides coating, and thickness range is 65-130nm;
Described layer 5 film plating layer is titanium-nitrogen-oxygen compound coating, and thickness range is 65-130nm;
Described layer 6 film plating layer is silicon nitrogen oxides coating, and thickness range is 65-130nm;
Described layer 7 film plating layer is titanium-nitrogen-oxygen compound coating, and thickness range is 80-170nm;
Wherein, the thickness of ground floor to layer 6 is identical, and the thickness of layer 7 is more than the thickness of ground floor to layer 6.
Wherein, the thickness of every layer can realize by controlling the plated film time, and the example of the concrete thickness of every layer is being implemented
It is stated that do not repeating at this in example four.
Embodiment ten
The present embodiment mainly illustrates to make the structure that above-described embodiment five relates to.Set by ink printing in the present embodiment
Standby, after being alternately performed titanium-nitrogen-oxygen compound film plating layer generation process and silicon nitrogen oxides film plating layer generation process, under coating
One layer of ink layer of side's printing such that it is able to preferably carry out shading, prevent the interference of veiling glare, for the color that invention is to be realized,
Preferably printing gray oil layer of ink, it is possible to background color is adjusted, thus presents more preferable rose gold effect.
Further, may include that printing has fingerprint graph hollow out figure in coating one layer of gray oil layer of ink printed below
The gray oil layer of ink of case, is different from the pigment of Lycoperdon polymorphum Vitt having being partially filled with of hollow out;Can also only printing pierced pattern and not
Filler pigment.Wherein, fill the pigment preferably presented a contrast with Lycoperdon polymorphum Vitt, thus allow pattern become apparent from.
Embodiment 11
As shown in Figure 4, the present embodiment relates to a kind of glass coating structure, is mainly used in electric capacity pressing type fingerprint detection system
In system, serve as and cover sealing coat on capacitive fingerprint sensing device, the structure of this glass coating include glass basic 1 and
Alternately laminated titanium-nitrogen-oxygen compound film plating layer 2 that the lower surface of described glass substrate is down-set and silicon nitrogen oxides film plating layer 3,
The overall film plating layer structure that multicoating layer is formed is also referred to as film system.
Wherein, in the molecular formula of titanium-nitrogen-oxygen compound and silicon nitrogen oxides, the ratio of nitrogen and oxygen substantially 0.8:1 to 1:1 it
Between, in actual applications, the most preferably, the ratio of nitrogen Yu oxygen is positioned at 0.9:1, i.e. titanium-nitrogen-oxygen compound and silicon nitrogen oxides
Molecular formula can be expressed as TINxOyAnd SINxOy, wherein x=0.9y.
In said structure, have employed titanium-nitrogen-oxygen compound film plating layer and the alternately laminated plating of described silicon nitrogen oxides film plating layer
Rotating fields, realizes the mirror effect of glass substrate, on the premise of ensureing insulating properties, it is possible to the coating that integral thickness is relatively thin
Realize brightly painted mirror effect.
Specifically, by the ratio of nitrogen-atoms in titanium-nitrogen-oxygen compound and silicon nitrogen oxides Yu oxygen atom is controlled at 0.8:1
Between 1:1, the reflectance of titanium-nitrogen-oxygen compound and silicon nitrogen oxides is adjusted, the refractive index of titanium-nitrogen-oxygen compound is controlled
About 1.92, the refractive index of silicon nitrogen oxides is controlled about 1.35, in combination with the number of plies and the control of thickness, in entirety
In the case of thinner thickness, it is achieved that the mirror effect of the silver color that effect is the most beautiful.L=75, A value of silver color mentioned here
=-1.5-0.8, B value=-2.5-5.6.
The most preferably, titanium-nitrogen-oxygen compound film plating layer is positioned at ground floor, plates titanium-nitrogen-oxygen compound film plating layer the most at first, by
Higher in the luminance factor of titanium-nitrogen-oxygen compound, therefore, it is located at ground floor and whole film system can be made to present more gorgeous
Color.
In the present embodiment, the film plating layer sum of described titanium-nitrogen-oxygen compound film plating layer 2 and described silicon nitrogen oxides film plating layer 3
Being 6 layers, coating gross thickness can control between 300nm to 550nm.It addition, in an embodiment of the present invention, glass substrate
Thickness can be in the range of 170-180um, preferably 175um.
Embodiment 12
The present embodiment, on the basis of embodiment stone 11, gives a kind of concrete coating structure: described film plating layer is total
Number is 6 layers, and the gross thickness of the film plating layer of described titanium-nitrogen-oxygen compound exists with the ratio of the gross thickness of the film plating layer of described silicon nitrogen oxides
Between 0.4 to 0.5, it is ensured that this ratio just can realize the mirror effect of silver color in the case of only plating 6 layers of film plating layer, and
Gross thickness can be controlled at below 550nm, thus reduce the impact on capacitance detecting.
Wherein, the structure of every layer can use following thickness to distribute:
Described ground floor film plating layer is titanium-nitrogen-oxygen compound coating, and thickness range is 50-80nm;
Described second layer film plating layer is silicon nitrogen oxides coating, and thickness range is 70-120nm;
Described third layer film plating layer is titanium-nitrogen-oxygen compound coating, and thickness range is 20-40nm;
Described 4th layer of film plating layer is silicon nitrogen oxides coating, and thickness range is 60-105nm;
Described layer 5 film plating layer is titanium-nitrogen-oxygen compound coating, and thickness range is 30-45nm;
Described layer 6 film plating layer is silicon nitrogen oxides coating, and thickness range is 85-145nm;
Wherein, the thickness of the layer 6 thickness more than first five layer any one layer.
Specifically, three groups of concrete film structure examples in following table are given:
Layer numbering | First group | Second group | 3rd group |
Ground floor (TINxOy) | 59nm | 77nm | 50nm |
The second layer (SINxOy) | 91nm | 118nm | 75nm |
Third layer (TINxOy) | 29nm | 38nm | 25nm |
4th layer of (SINxOy) | 80nm | 104nm | 65nm |
Layer 5 (TINxOy) | 34nm | 44nm | 37nm |
Layer 6 (SINxOy) | 110nm | 143nm | 88nm |
Gross thickness | 403nm | 524nm | 340nm |
TINxOyWith SINxOyThickness ratio | 0.43 | 0.43 | 0.49 |
In upper table, the reflectance curve of three groups of film structures is as shown in Figure 16 to Figure 18, and wherein transverse axis coordinate is wavelength
(nm), the longitudinal axis is refractive index (%), and the curve chart transverse and longitudinal coordinate of following example is identical.
Embodiment 13
As it is shown in figure 5, the present embodiment is on the basis of the various embodiments described above 11 and embodiment 12, at whole coating
Lower section is provided with one layer of black ink layer, by arranging ink layer, it is possible to preferably carries out shading, prevents the interference of veiling glare.
Further, it is also possible to process black ink layer when, printing certain pierced pattern, such as, printing refers to
The pierced pattern of stricture of vagina figure, openwork part and the part of non-hollow out, there are differences in light transmission and reflexive, thus from
Layer glass is observed and will be presented corresponding pattern under mirrored background such that it is able to realizes finger-print region and is identified or fills
Decorations.Preferably, the pigment being different from black can be set in pierced pattern again, present a contrast with Lycoperdon polymorphum Vitt it is highly preferred that fill
Pigment, such as, fill Chinese white, thus allow pattern become apparent from.
Embodiment 14
The present embodiment mainly illustrates to manufacture the glass coating structure manufacture method of above-described embodiment 11, as indicated with 6, this reality
The glass coating structure executing example can use NCVM (non-conducting vacuum plating) technique to realize.
Specifically, vacuum space as shown in Figure 6 is set, and the ratio that is passed through wherein between 0.8:1 to 1:1 nitrogen and
Oxygen, is then alternately performed titanium-nitrogen-oxygen compound film plating layer generation process and silicon nitrogen oxides film plating layer generation process, thus at glass
The lower surface of glass substrate is formed down alternately laminated silicon nitrogen oxides film plating layer and titanium-nitrogen-oxygen compound film plating layer.
Wherein, titanium-nitrogen-oxygen compound film plating layer generation process is particularly as follows: excite by electron gun and be arranged on described confined space
In titanium material, make described titanium material evaporate, after reacting with the nitrogen in described confined space and oxygen, at glass substrate
Lower surface be formed down titanium-nitrogen-oxygen compound film plating layer.
Silicon nitrogen oxides film plating layer generation process includes: excited the silicon being arranged in described confined space former by electron gun
Material, makes described silicon raw material evaporate, after reacting with the nitrogen in described confined space and oxygen, at the lower surface of glass substrate
It is formed down silicon nitrogen oxides film plating layer.
The number of times being alternately performed titanium-nitrogen-oxygen compound film plating layer generation process and silicon nitrogen oxides film plating layer generation process depends on
In the number of plies finally to obtain, and the thickness of every layer aoxidizes by controlling each titanium-nitrogen-oxygen compound film plating layer generation process and silicon nitrogen
Thing film plating layer generation process realizes.
In above-mentioned technique, the nitrogen being passed through by control and the ratio of oxygen, realize in the compound to film plating layer
The control of the ratio of nitrogen-atoms and oxygen atom, thus reach titanium-nitrogen-oxygen compound and the adjustment of the reflectance of silicon nitrogen oxides, from
And the refractive index of titanium-nitrogen-oxygen compound is controlled about 1.92, the refractive index of silicon nitrogen oxides is controlled about 1.35, simultaneously
In conjunction with the number of plies and the control of thickness, in the case of integral thickness is relatively thin, it is achieved that the minute surface effect of the silver color that effect is the most beautiful
Really.The present embodiment uses technique, owing to only used two kinds of common metals and semi-conducting material, therefore, in the realization of its technique
Relatively simple, it is simple to carry out Mass production.
Additionally, the most preferably, in coating process, first carry out titanium-nitrogen-oxygen compound film plating layer generation process so that titanium
Nitrogen oxides film plating layer is positioned at ground floor, and owing to the luminance factor of titanium-nitrogen-oxygen compound is higher, therefore, being located at ground floor can
Whole film system is made to present more gorgeous color.
Additionally, in the present embodiment, film plating layer sum can control at 6 layers, and coating gross thickness can control at 300nm extremely
Between 550nm, it addition, in an embodiment of the present invention, the thickness of glass substrate can be in the range of 170-180um, preferably
For 175um.
Embodiment 15
The present embodiment relates to the manufacture method manufacturing the coating structure of above-described embodiment 12, including: it is alternately performed titanium nitrogen
Oxide coating layer generation process and silicon nitrogen oxides film plating layer generation process (can be alternately performed six times can realize), make institute
Stating film plating layer sum is 6 layers, and the film plating layer of the gross thickness of the film plating layer of described titanium-nitrogen-oxygen compound and described silicon nitrogen oxides
The ratio of gross thickness between 0.4 to 0.5.
Specifically, by being alternately performed titanium-nitrogen-oxygen compound film plating layer generation process and silicon nitrogen oxides film plating layer operation, raw
Become the coating structure of following thickness:
Described ground floor film plating layer is titanium-nitrogen-oxygen compound coating, and thickness range is 50-80nm;
Described second layer film plating layer is silicon nitrogen oxides coating, and thickness range is 70-120nm;
Described third layer film plating layer is titanium-nitrogen-oxygen compound coating, and thickness range is 20-40nm;
Described 4th layer of film plating layer is silicon nitrogen oxides coating, and thickness range is 60-105nm;
Described layer 5 film plating layer is titanium-nitrogen-oxygen compound coating, and thickness range is 30-45nm;
Described layer 6 film plating layer is silicon nitrogen oxides coating, and thickness range is 85-145nm;
Wherein, the thickness of the layer 6 thickness more than first five layer any one layer.
Wherein, the thickness of every layer can realize by controlling the plated film time, and the example of the concrete thickness of every layer is being implemented
It is stated that do not repeating at this in example 12.
Embodiment 16
The present embodiment mainly illustrates to make the structure that above-described embodiment 13 relates to.Pass through ink printing in the present embodiment
Equipment, after being alternately performed titanium-nitrogen-oxygen compound film plating layer generation process and silicon nitrogen oxides film plating layer generation process, at coating
One layer of black ink layer printed below such that it is able to preferably carry out shading, prevent the interference of veiling glare.
Further, may include that printing has fingerprint graph hollow out figure in coating one layer of black ink layer printed below
The black ink layer of case, is different from the pigment of Lycoperdon polymorphum Vitt having being partially filled with of hollow out;Can also only printing pierced pattern and not
Filler pigment.Wherein, fill the pigment preferably presented a contrast with black, such as, fill Chinese white, thus make pattern brighter
Aobvious.
Embodiment 17
As shown in Figure 4, the present embodiment relates to a kind of glass coating structure, is mainly used in electric capacity pressing type fingerprint detection system
In system, serve as and cover sealing coat on capacitive fingerprint sensing device, the structure of this glass coating include glass basic 1 and
Alternately laminated titanium-nitrogen-oxygen compound film plating layer 2 that the lower surface of described glass substrate is down-set and silicon nitrogen oxides film plating layer 3,
The overall film plating layer structure that multicoating layer is formed is also referred to as film system.
Wherein, titanium-nitrogen-oxygen compound is with the molecular formula of silicon nitrogen oxides, and the ratio of nitrogen and oxygen is substantially at 0.4:1 to 0.6:1
Between, in actual applications, the most preferably, the ratio of nitrogen Yu oxygen is positioned at 0.5:1, i.e. titanium-nitrogen-oxygen compound and the oxidation of silicon nitrogen
Thing molecular formula can be expressed as TINxOyAnd SINxOy, wherein x=0.5y.
In said structure, have employed titanium-nitrogen-oxygen compound film plating layer and the alternately laminated plating of described silicon nitrogen oxides film plating layer
Rotating fields, realizes the mirror effect of glass substrate, on the premise of ensureing insulating properties, it is possible to the coating that integral thickness is relatively thin
Realize brightly painted mirror effect.
Specifically, by the ratio of nitrogen-atoms in titanium-nitrogen-oxygen compound and silicon nitrogen oxides Yu oxygen atom is controlled at 0.4:1
Between 0.6:1, the reflectance of titanium-nitrogen-oxygen compound and silicon nitrogen oxides is adjusted, by the refractive index control of titanium-nitrogen-oxygen compound
The refractive index of silicon nitrogen oxides, about 2.08, is controlled about 1.39, in combination with the number of plies and the control of thickness, whole by system
In the case of body thickness is relatively thin, it is achieved that the mirror effect of the tarnish that effect is the most beautiful.L=54, A of tarnish mentioned here
Value=-3.5-2.9, B value=-7.6-6.1.
The most preferably, titanium-nitrogen-oxygen compound film plating layer is positioned at ground floor, plates titanium-nitrogen-oxygen compound film plating layer the most at first, by
Higher in the luminance factor of titanium-nitrogen-oxygen compound, therefore, it is located at ground floor and whole film system can be made to present more gorgeous
Color.
In the present embodiment, the film plating layer sum of described titanium-nitrogen-oxygen compound film plating layer 2 and described silicon nitrogen oxides film plating layer 3
Being 4 layers, coating gross thickness can control between 100nm to 150nm.It addition, in an embodiment of the present invention, glass substrate
Thickness can be in the range of 170-180um, preferably 175um.
Embodiment 18
The present embodiment, on the basis of embodiment 17, gives a kind of concrete coating structure: described film plating layer is total
Being 4 layers, the ratio of the gross thickness of the film plating layer of described titanium-nitrogen-oxygen compound and the gross thickness of the film plating layer of described silicon nitrogen oxides is 0.4
Between 0.5, it is ensured that this ratio just can realize the mirror effect of tarnish, and energy in the case of only plating 4 layers of film plating layer
Enough gross thickness is controlled at below 150nm, thus reduce the impact on capacitance detecting.
Wherein, the structure of every layer can use following thickness to distribute:
Described ground floor film plating layer is titanium-nitrogen-oxygen compound coating, and thickness range is 5-10nm;
Described second layer film plating layer is silicon nitrogen oxides coating, and thickness range is 50-85nm;
Described third layer film plating layer is titanium-nitrogen-oxygen compound coating, and thickness range is 25-40nm;
Described 4th layer of film plating layer is silicon nitrogen oxides coating, and thickness range is 15-25nm.
Specifically, three groups of concrete film structure examples in following table are given:
Layer numbering | First group | Second group | 3rd group |
Ground floor (TINxOy) | 6nm | 9nm | 7nm |
The second layer (SINxOy) | 54nm | 81nm | 67nm |
Third layer (TINxOy) | 25nm | 37.5nm | 30nm |
4th layer of (SINxOy) | 15nm | 22.5nm | 18nm |
Gross thickness | 100nm | 150nm | 122nm |
TINxOyWith SINxOyThickness ratio | 0.44 | 0.44 | 0.43 |
In upper table, the reflectance curve of three groups of film structures is as shown in Figure 7 to 9, and wherein transverse axis coordinate is wavelength (nm),
The longitudinal axis is refractive index (%), and the curve chart transverse and longitudinal coordinate of following example is identical.
Embodiment 19
As it is shown in figure 5, the present embodiment is on the basis of above-described embodiment 17 and 18, arrange in the lower section of whole coating
There is one layer of black ink layer, by arranging ink layer, it is possible to preferably carry out shading, prevent the interference of veiling glare.
Further, it is also possible to process black ink layer when, printing certain pierced pattern, such as, printing refers to
The pierced pattern of stricture of vagina figure, openwork part and the part of non-hollow out, there are differences in light transmission and reflexive, thus from
Layer glass is observed and will be presented corresponding pattern under mirrored background such that it is able to realizes finger-print region and is identified or fills
Decorations.Preferably, the pigment being different from black can be set in pierced pattern again, present a contrast with Lycoperdon polymorphum Vitt it is highly preferred that fill
Pigment, such as, fill Chinese white, thus allow pattern become apparent from.
Embodiment 20
The present embodiment mainly illustrates to manufacture the glass coating structure manufacture method of above-described embodiment 17, as indicated with 6, this reality
The glass coating structure executing example can use NCVM (non-conducting vacuum plating) technique to realize.
Specifically, vacuum space as shown in Figure 6 is set, and is passed through ratio nitrogen between 0.4:1 to 0.6:1 wherein
Gas and oxygen (preferably, the ratio of nitrogen and oxygen is 0.5:1), be then alternately performed titanium-nitrogen-oxygen compound film plating layer generation process
With silicon nitrogen oxides film plating layer generation process, thus it is formed down alternately laminated silicon nitrogen oxides at the lower surface of glass substrate
Film plating layer and titanium-nitrogen-oxygen compound film plating layer.
Wherein, titanium-nitrogen-oxygen compound film plating layer generation process is particularly as follows: excite by electron gun and be arranged on described confined space
In titanium material, make described titanium material evaporate, after reacting with the nitrogen in described confined space and oxygen, at glass substrate
Lower surface be formed down titanium-nitrogen-oxygen compound film plating layer.
Silicon nitrogen oxides film plating layer generation process includes: excited the silicon being arranged in described confined space former by electron gun
Material, makes described silicon raw material evaporate, after reacting with the nitrogen in described confined space and oxygen, at the lower surface of glass substrate
It is formed down silicon nitrogen oxides film plating layer.
The number of times being alternately performed titanium-nitrogen-oxygen compound film plating layer generation process and silicon nitrogen oxides film plating layer generation process depends on
In the number of plies finally to obtain, and the thickness of every layer aoxidizes by controlling each titanium-nitrogen-oxygen compound film plating layer generation process and silicon nitrogen
Thing film plating layer generation process realizes.
In above-mentioned technique, the nitrogen being passed through by control and the ratio of oxygen, realize in the compound to film plating layer
The control of the ratio of nitrogen-atoms and oxygen atom, thus reach titanium-nitrogen-oxygen compound and the adjustment of the reflectance of silicon nitrogen oxides, from
And the refractive index of titanium-nitrogen-oxygen compound is controlled about 2.08, the refractive index of silicon nitrogen oxides is controlled about 1.39, simultaneously
In conjunction with the number of plies and the control of thickness, in the case of integral thickness is relatively thin, it is achieved that the minute surface effect of the tarnish that effect is the most beautiful
Really.The present embodiment uses technique, owing to only used two kinds of common metals and semi-conducting material, therefore, in the realization of its technique
Relatively simple, it is simple to carry out Mass production.
Additionally, the most preferably, in coating process, first carry out titanium-nitrogen-oxygen compound film plating layer generation process so that titanium
Nitrogen oxides film plating layer is positioned at ground floor, and owing to the luminance factor of titanium-nitrogen-oxygen compound is higher, therefore, being located at ground floor can
Whole film system is made to present more gorgeous color.
Additionally, in the present embodiment, film plating layer sum can control at 4 layers, and coating gross thickness can control at 100nm extremely
Between 150nm, it addition, in an embodiment of the present invention, the thickness of glass substrate can be in the range of 170-180um, preferably
For 175um.
Embodiment 21
The present embodiment relates to the manufacture method manufacturing the coating structure of above-described embodiment two, including: it is alternately performed titanium-nitrogen-oxygen
Compound film plating layer generation process and silicon nitrogen oxides film plating layer generation process (can be alternately performed four times can realize), make described
Film plating layer sum is 4 layers, and the film plating layer of the gross thickness of the film plating layer of described titanium-nitrogen-oxygen compound and described silicon nitrogen oxides
The ratio of gross thickness is between 0.4 to 0.5.
Specifically, by being alternately performed titanium-nitrogen-oxygen compound film plating layer generation process and silicon nitrogen oxides film plating layer operation, raw
Become the coating structure of following thickness:
Described ground floor film plating layer is titanium-nitrogen-oxygen compound coating, and thickness range is 5-10nm;
Described second layer film plating layer is silicon nitrogen oxides coating, and thickness range is 50-85nm;
Described third layer film plating layer is titanium-nitrogen-oxygen compound coating, and thickness range is 25-40nm;
Described 4th layer of film plating layer is silicon nitrogen oxides coating, and thickness range is 15-25nm.
Wherein, the thickness of every layer can realize by controlling the plated film time, and the example of the concrete thickness of every layer is being implemented
It is stated that do not repeating at this in example 18.
Embodiment 22
The present embodiment mainly illustrates to make the structure that above-described embodiment 19 relates to.Pass through ink printing in the present embodiment
Equipment, after being alternately performed titanium-nitrogen-oxygen compound film plating layer generation process and silicon nitrogen oxides film plating layer generation process, at coating
One layer of black ink layer printed below such that it is able to preferably carry out shading, prevent the interference of veiling glare.
Further, may include that printing has fingerprint graph hollow out figure in coating one layer of black ink layer printed below
The black ink layer of case, is different from the pigment of Lycoperdon polymorphum Vitt having being partially filled with of hollow out;Can also only printing pierced pattern and not
Filler pigment.Wherein, fill the pigment preferably presented a contrast with black, such as, fill Chinese white, thus make pattern brighter
Aobvious.
Embodiment 23
The present embodiment relates to a kind of finger print detection device, including: capacitive fingerprint sensing device, this capacitive fingerprint sensing device
Can be the arbitrary a capacitive fingerprint sensing device used in prior art, can be active capacitive fingerprint sensing device
(fingerprint sensor that such as FPC company produces), it is also possible to be passive type capacitive fingerprint sensing device.At above-mentioned capacitance type fingerprint
The top of sensor is pasted with the glass coating structure of the various embodiments described above, using as sealing coat or protective layer, the one of plated film
Facing to the capacitor plate array of capacitive fingerprint sensing device, glass above externally, for contact finger grain leather skin.
Embodiment 24
The present embodiment relates to the mobile terminal of a kind of finger print detection device comprising embodiment 11, such as mobile phone, flat board
Computers etc., offer the opening for carrying out fingerprint detection on the bonnet of mobile terminal, and described finger print detection device is positioned at institute
Stating lower opening portion, the above of the glass coating structure of described finger print detection device exposes from described opening.In said structure, will refer to
The region of stricture of vagina identification has been arranged on after mobile terminal, by offering opening on bonnet, allows and has the Flos Rosae Rugosae of mirror effect
The glass of gold color exposes, as the region of fingerprint recognition.Owing to the glass coating of the embodiment of the present invention can present beautiful
Rose gold mirror effect, therefore, it is possible to make the fingerprint recognition region of mobile terminal the most substantially with attractive in appearance, it is possible to deduction is mobile
The overall appearance effect of terminal.
Last it is noted that various embodiments above is only in order to illustrate technical scheme, it is not intended to limit;To the greatest extent
The present invention has been described in detail by pipe with reference to foregoing embodiments, it will be understood by those within the art that: it depends on
So the technical scheme described in foregoing embodiments can be modified, or the most some or all of technical characteristic is entered
Row equivalent;And these amendments or replacement, do not make the essence of appropriate technical solution depart from various embodiments of the present invention technology
The scope of scheme.
Claims (14)
1. the manufacture method of a glass coating structure, it is characterised in that including:
Being provided with in the confined space of glass substrate to side, be passed through nitrogen and oxygen, described confined space is vacuum space;Its
In, the nitrogen being passed through and the ratio of oxygen are between 0.4:1 to 1.5:1;
Perform oxynitride generation process, form oxynitride film plating layer in the side of described glass substrate.
Manufacture method the most according to claim 1, it is characterised in that described execution oxynitride generation process, in institute
The side formation oxynitride film plating layer stating glass substrate includes:
Alternately perform oxynitride generation process, form alternately laminated oxynitride in the side of described glass substrate
Film plating layer.
Manufacture method the most according to claim 2, it is characterised in that the described oxynitride that alternately performs generates work
Sequence, forms alternately laminated oxynitride film plating layer and includes in the side of described glass substrate:
Alternately perform the generation process of at least two oxynitride, formed alternately laminated in the side of described glass substrate
The film plating layer of at least two oxynitride.
Manufacture method the most according to claim 3, it is characterised in that described alternately execution at least two oxynitride
Generation process, the film plating layer forming alternately laminated at least two oxynitride in the side of described glass substrate includes:
Alternately perform titanium-nitrogen-oxygen compound film plating layer generation process and silicon nitrogen oxides film plating layer generation process, at described glass base
The side of plate forms alternately laminated silicon nitrogen oxides film plating layer and titanium-nitrogen-oxygen compound film plating layer.
Manufacture method the most according to claim 4, it is characterised in that described execution titanium-nitrogen-oxygen compound film plating layer generation process
Including:
Excited the titanium material being arranged in described confined space by electron gun, make described titanium material evaporate, with described confined air
Nitrogen between and oxygen form titanium-nitrogen-oxygen compound film plating layer after reacting.
Manufacture method the most according to claim 4, it is characterised in that described execution silicon nitrogen oxides film plating layer generation process
Including:
Excited the silicon raw material being arranged in described confined space by electron gun, make described silicon raw material evaporate, with described confined air
Nitrogen and oxygen between react and form silicon nitrogen oxides film plating layer.
Manufacture method the most according to claim 4, it is characterised in that described alternately execution titanium-nitrogen-oxygen compound film plating layer is raw
Operation and silicon nitrogen oxides film plating layer generation process is become to include:
First carry out titanizing nitrogen oxides film plating layer generation process, then perform silicon nitrogen oxides film plating layer generation process.
Manufacture method the most according to claim 4, it is characterised in that the described described titanium-nitrogen-oxygen compound plating alternately performed
The total degree of film layer generation process and described silicon nitrogen oxides film plating layer generation process is 4-7 time, makes described titanium-nitrogen-oxygen compound plate
Total number of plies of the film plating layer of film layer and described silicon nitrogen oxides film plating layer is 4-7 layer, coating gross thickness 100nm to 950nm it
Between, and the ratio of the gross thickness of described titanium-nitrogen-oxygen compound film plating layer and the gross thickness of described silicon nitrogen oxides film plating layer 0.4 to
Between 1.65.
9. according to the arbitrary described manufacture method of claim 1 to 8, it is characterised in that the film plating layer generated the last time
One layer of gray oil layer of ink of side printing.
Manufacture method the most according to claim 9, it is characterised in that the one of the described film plating layer generated the last time
Side one layer of gray oil layer of ink of printing includes:
The side printing of the film plating layer generated the last time has the black ink layer of pierced pattern.
11. manufacture methods according to claim 10, it is characterised in that described pierced pattern is the hollow out figure of fingerprint graph
Case.
12. manufacture methods according to claim 10, it is characterised in that there is in described pierced pattern the part of hollow out
Fill the pigment being different from Lycoperdon polymorphum Vitt.
13. according to the arbitrary described manufacture method of claim 1 to 8, it is characterised in that the thickness of described glass substrate is at 170-
180um。
14. manufacture methods according to claim 13, it is characterised in that the thickness of described glass substrate is 175um.
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JPH04285033A (en) * | 1991-03-12 | 1992-10-09 | Central Glass Co Ltd | Tision-based multilayer thin film-coated glass and its production |
US20030228413A1 (en) * | 2002-06-11 | 2003-12-11 | Konica Corporation | Surface treatment method and optical part |
CN101400619A (en) * | 2006-03-10 | 2009-04-01 | 法国圣戈班玻璃厂 | Antireflecttion-coated transparent substrate exhibiting neutral colour in reflection |
CN102615875A (en) * | 2012-03-22 | 2012-08-01 | 东莞劲胜精密组件股份有限公司 | Discontinuous metallic silver membrane and membrane coating method for same |
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CA1333270C (en) * | 1987-03-26 | 1994-11-29 | Ppg Industries Ohio, Inc. | Sputtered titanium oxynitride films |
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Publication number | Priority date | Publication date | Assignee | Title |
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JPH04285033A (en) * | 1991-03-12 | 1992-10-09 | Central Glass Co Ltd | Tision-based multilayer thin film-coated glass and its production |
US20030228413A1 (en) * | 2002-06-11 | 2003-12-11 | Konica Corporation | Surface treatment method and optical part |
CN101400619A (en) * | 2006-03-10 | 2009-04-01 | 法国圣戈班玻璃厂 | Antireflecttion-coated transparent substrate exhibiting neutral colour in reflection |
CN102615875A (en) * | 2012-03-22 | 2012-08-01 | 东莞劲胜精密组件股份有限公司 | Discontinuous metallic silver membrane and membrane coating method for same |
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