WO2017067111A1

WO2017067111A1 - Method for manufacturing glass coating structure

Info

Publication number: WO2017067111A1
Application number: PCT/CN2016/071765
Authority: WO
Inventors: 郝亚可; 孙坤; 孟祥发; 梁倩
Original assignee: 乐视移动智能信息技术（北京）有限公司
Priority date: 2015-10-20
Filing date: 2016-01-22
Publication date: 2017-04-27
Also published as: CN105837056A

Abstract

A method for manufacturing a glass coating structure, comprising: introducing nitrogen and oxygen in a proportion between 1.3: 1 to 1.5:1 into a vacuum space with a glass substrate provided at the upper; alternately performing a titanium oxynitride coating layer production step and a silicon oxynitride coating layer production step, to form alternately laminated silicon oxynitride coating layers and titanium oxynitride coating layers on the lower surface down the glass substrate. The lower surface of the glass substrate is alternately coated with a titanium oxynitride coating layer and a silicon oxynitride coating layer, and the proportion of nitrogen to oxygen in the coating compound is maintained between 1.3: 1 to 1.5: 1 and thereby insofar as the insulation is ensured, a glass coating structure of a mirror effect in the colour of rose gold is realized, and the effect of the thickness of the coating itself on the fingerprint detection is controlled within a very small range.

Description

Method for manufacturing glass coating structure

The present application claims the priority of the Chinese Patent Application Serial No. PCT Application No.

Technical field

The invention relates to a method for manufacturing a glass coating structure, in particular to a method for manufacturing a glass coating structure applied to fingerprint detection.

Background technique

At present, fingerprint recognition technology has been applied to products such as mobile terminals (such as computers). Among them, the capacitive push fingerprint detection method is widely used, and is specifically divided into active press detection and passive press detection.

The basic principle of passive press detection is shown in Figure 1. The entire detection system includes: a capacitive fingerprint sensor 10 at the bottom and an isolation layer (or a protective layer) overlying the capacitive fingerprint sensor 10, which is also the area where the finger is in direct contact. 11) wherein the capacitive fingerprint sensor 10 includes a plurality of capacitor plates arranged in a two-dimensional array (the five capacitive plates P1-P5 are exemplarily illustrated in the figure), when the skin of the finger 12 and the isolation layer 11 After the bonding, a capacitance is formed between the skin of the finger 12 and the capacitor plate. Due to the presence of the fingerprint, a situation as shown in FIG. 1 is formed microscopically, and the skin of the finger 12 and the surface of the isolation layer 11 form a plurality of ridges and ridges. The distance between the different positions of the skin of the finger 12 and the respective capacitive plates is unequal, whereby different capacitance values are generated between the respective capacitive plates and the skin of the finger 12, for example, formed at the ankle. The capacitance value is Cv, and the capacitance value formed at the 峪 is Cr. By measuring these capacitance values, fingerprint image information can be obtained, that is, each capacitor plate is used as a pixel to collect fingerprint image information.

The principle of active press detection is shown in FIG. 2. On the basis of the passive detection system, a metal ring 13 surrounding the isolation layer 11 is added. The metal ring 13 is connected to the bottom circuit, and the metal ring 13 functions to wake up the bottom layer. The capacitive fingerprint sensor 10 and a certain current signal are applied to the finger 12 through the metal ring 13, thereby increasing the charge on the skin of the finger 12. The quantity, in turn, enhances the signal detected by the capacitor plates. As shown in FIG. 3, it shows a fingerprint image signal presented by the detection of the capacitive fingerprint sensor 10.

In the above fingerprint detecting system, the upper and lower surfaces of the spacer layer 11 must be formed of an insulating material, otherwise the capacitance of the skin of the finger 12 and the capacitor plate will be destroyed, so that the fingerprint information cannot be detected. In addition, in the detection system with the metal ring 13, the portion of the isolation layer 11 that is in contact with the metal ring 13 must also be insulated. If the isolation layer 11 is electrically conductive, current on the metal ring 13 will flow through the isolation layer 11, thereby The signal is confusing and the fingerprint information cannot be detected.

In addition, since the detection range of the capacitive plate array of the capacitive fingerprint sensor 10 is small, the finger 12 needs to be close to the capacitor plate array, that is, the thickness of the isolation layer 11 is not required to be large, or the fingerprint detection effect is affected. Especially for the passive press detection system, the capacitive fingerprint sensor 10 is more sensitive to the thickness of the upper covered isolation layer 11, and the isolation layer 11 having a larger thickness cannot be used.

With the rapid development of mobile terminals such as mobile phones and tablet computers, mobile terminals tend to be thinner while continuing to pursue aesthetic effects. The area covered by the isolation layer 11 is also the area for fingerprint recognition, which is generally located on mobile terminals. The more prominent position, for example, is placed in the middle of the back cover of the mobile phone, or placed in the lower part of the front of the mobile phone. Therefore, the aesthetic appearance of the fingerprint recognition area will directly affect the overall appearance of the mobile phone. However, due to the above-mentioned limitations, in the prior art mobile terminal using the capacitive pressing type fingerprint detection method, the isolation layer 11 of the fingerprint recognition area is mostly made of ceramic or plastic, and the protection capacitor is simply realized in function. The fingerprint sensor 10 functions as an isolation package, but the glass mirror cannot be realized on the fingerprint detecting device.

In the prior art, the coating technology of the glass mirror surface is relatively mature. However, since the general mirror coating does not require high insulation and thickness, it is generally adopted by direct metal plating or by multi-layer coating. The effect of the coating layer thus formed is generally thick or non-insulating, and therefore, the thickness requirement for fingerprint detection cannot be satisfied. In addition, the fingerprint detection system itself adopts the principle of capacitance detection. The skin of the finger 12 and the array of the capacitor plates respectively serve as the two poles of the capacitor. According to the calculation formula of the capacitance, the size of the capacitor is related to the distance between the capacitor plates. Also related to the medium between the capacitor plates, the introduction of the coating layer will increase the amount of medium between the capacitor plates, thereby affecting the size of the capacitance, the thickness of the coating layer The larger the effect, the greater the influence on the capacitance value. Therefore, in order not to have a serious influence on the fingerprint detection, it is objectively impossible to allow the existence of a thick coating layer.

Summary of the invention

It is an object of the present invention to provide a method for fabricating a glass coating structure, which can produce a mirror-like region with a mirror effect of a rose gold color under the premise that the coating structure can be less affected by the fingerprint detection effect.

In order to achieve the above object, the present invention provides a method of fabricating a glass coating structure, comprising:

Nitrogen and oxygen in a ratio of between 1.3:1 and 1.5:1 are introduced into the vacuum space in which the glass substrate is disposed in the upper portion;

The titanium oxynitride plating layer forming step and the silicon oxynitride plating layer forming step are alternately performed, and an alternately stacked silicon oxynitride plating layer and a titanium oxynitride coating layer are formed downward on the lower surface of the glass substrate;

The titanium oxynitride coating layer forming step includes: exciting a titanium raw material disposed in the sealed space by an electron gun, evaporating the titanium raw material, reacting with nitrogen and oxygen in the sealed space, and then performing a reaction on the glass substrate Forming a titanium oxynitride coating layer downwardly on the lower surface;

The silicon oxynitride coating layer forming process includes: exciting a silicon raw material disposed in the sealed space by an electron gun, evaporating the silicon raw material, reacting with nitrogen and oxygen in the sealed space, and then performing a reaction on the glass substrate The lower surface of the lower surface forms a silicon oxynitride coating layer.

The method for manufacturing a glass coating structure provided by the present invention comprises: alternately plating a titanium oxynitride coating layer and a silicon oxynitride coating layer on a lower surface of the glass substrate, and maintaining a ratio of nitrogen to oxygen in the plating compound at 1.3:1. Between 1.5:1, a glass-plated structure exhibiting a mirror effect of rose gold color is realized under the premise of ensuring insulation, and the influence of the thickness of the plating itself on fingerprint detection is controlled to a very small range.

DRAWINGS

1 is a schematic diagram of a prior art fingerprint detection principle;

2 is a second schematic diagram of the principle of fingerprint detection in the prior art;

3 is a schematic diagram of a fingerprint detection image signal of the prior art;

Figure 4 is a schematic view showing the structure of a glass plating layer according to Embodiment 1 of the present invention;

Figure 5 is a schematic view showing the structure of a glass plating layer according to Embodiment 5 of the present invention;

6 is a schematic view showing the principle of coating of the sixth embodiment of the present invention;

7 is a schematic diagram of a reflectance curve corresponding to a first group of film structures in Embodiment 2 of the present invention;

8 is a second schematic diagram of a reflectance curve corresponding to a second group of film structures in Embodiment 2 of the present invention;

9 is a third schematic diagram of a reflectance curve corresponding to a third group of film structures in Embodiment 2 of the present invention;

10 is a schematic diagram of a reflectance curve corresponding to a first group of film structures in Embodiment 3 of the present invention;

11 is a second schematic diagram of a reflectance curve corresponding to a second group of film structures in Embodiment 3 of the present invention;

12 is a third schematic diagram of a reflectance curve corresponding to a third group of film structures in Embodiment 3 of the present invention;

13 is a schematic diagram of a reflectance curve corresponding to a first group of film structures in Embodiment 4 of the present invention;

14 is a second schematic diagram of a reflectance curve corresponding to a second group of film structures in Embodiment 4 of the present invention;

FIG. 15 is a third schematic diagram of a reflectance curve corresponding to the third group of film structures in the fourth embodiment of the present invention.

detailed description

The embodiments of the present invention are described in detail below with reference to the accompanying drawings.

The principle of the embodiment of the present invention is to achieve a mirror effect with a specific color by alternately plating a titanium oxynitride coating layer and a silicon oxynitride coating layer on the lower surface of the glass substrate, while ensuring insulation and overall The thickness of the coating is controlled to a very thin range, thereby reducing the impact on fingerprint detection.

Embodiment 1

As shown in FIG. 4, the embodiment relates to a glass plating structure, which is mainly used in a capacitive press type fingerprint detecting system, and functions as an isolation layer covering a capacitive fingerprint sensor. The structure of the glass plating layer includes a glass substrate 1 and Setting downward on the lower surface of the glass substrate The overall coating layer structure formed by the alternately stacked titanium oxynitride coating layer 2 and the silicon oxynitride plating layer 3 and the multilayer coating layer is also referred to as a film system.

Among them, in the molecular formula of titanium oxynitride and silicon oxynitride, the ratio of nitrogen to oxygen is approximately between 1.3:1 and 1.5:1. In practical applications, the ratio of nitrogen to oxygen is positioned as a preferred solution. At 1.4:1, the formulas of titanium oxynitride and silicon oxynitride can be expressed as TIN _x O _y and SIN _x O _y , where x = 1.4 _y .

In the above structure, a plating structure in which a titanium oxynitride plating layer and the silicon oxynitride coating layer are alternately laminated is used to realize a mirror effect of the glass substrate, and the thickness can be thinner as a whole while ensuring insulation. The coating is used to achieve a brightly colored mirror effect.

Specifically, the reflectance of titanium oxynitride and silicon oxynitride is adjusted by controlling the ratio of nitrogen atoms to oxygen atoms in titanium oxynitride and silicon oxynitride between 1.3:1 and 1.5:1. The refractive index of titanium oxynitride is controlled to about 1.84, and the refractive index of silicon oxynitride is controlled to about 1.31. At the same time, the combination of layer number and layer thickness is controlled, and the effect is relatively thin when the overall thickness is thin. The mirror effect of bright rose gold. The wavelength of light corresponding to the rose gold color referred to herein is approximately in the range of 565-570 nm, and the color has L = 80, A value = 8.65-11.1, and B value = 0.9-3.4.

In addition, since the magnitude of the capacitance value is affected by the distance between the capacitor plates, in the structure of the embodiment of the present invention, the overall coating thickness can be controlled to be thin (can be controlled under the premise that the desired effect is satisfied) Within 1um), therefore, the impact on the capacitance value detection of the fingerprint sensor is small.

In addition, the magnitude of the capacitance value is also affected by the filled medium between the capacitor plates. When the type of the filler material is more, the capacitance value is also affected. In the plating structure of the embodiment of the present invention, only Two kinds of nitrogen oxides are used as the plating layer. Therefore, there are few kinds of substances between the finger skin and the capacitor plate array, and there is no metal plating layer, and the overall thickness of the plating layer is very thin, from between the capacitor plates. From the perspective of the filling material, the effect is also reduced to a small extent.

More preferably, the titanium oxynitride coating layer is located in the first layer, that is, the titanium oxynitride coating layer is first plated, and since the reflectance of the titanium oxynitride is relatively high, setting it on the first layer enables The entire film system is more colorful.

In this embodiment, the titanium oxynitride coating layer 2 and the silicon oxynitride coating layer The total number of coating layers of 3 may be 5-7 layers, and the total thickness of the plating layer may be controlled between 280 nm and 1000 nm. Further, in the embodiment of the invention, the thickness of the glass substrate may be in the range of 170-180 um, preferably 175 um.

Embodiment 2

This embodiment provides a specific plating structure on the basis of the first embodiment: the total number of the coating layers is 5, the total thickness of the coating layer of the titanium oxynitride and the silicon oxynitride The ratio of the total thickness of the coating layer is between 1.55 and 1.65. This ratio is guaranteed to achieve the mirror effect of rose gold in the case of plating only 5 layers, and the total thickness can be controlled below 500 nm, thereby reducing the The effect of capacitance detection.

Among them, the structure of each layer can be distributed as follows:

The first coating layer is a titanium oxynitride coating having a thickness ranging from 45 to 70 nm;

The second coating layer is a silicon oxynitride coating having a thickness ranging from 55 to 90 nm;

The third coating layer is a titanium oxynitride coating having a thickness ranging from 45 to 70 nm;

The fourth coating layer is a silicon oxynitride coating having a thickness ranging from 55 to 90 nm;

The fifth layer coating layer is a titanium oxynitride coating layer, and the thickness ranges from 95 to 150 nm;

Wherein the first layer and the third layer have the same thickness, the second layer and the fourth layer have the same thickness, and the second layer and the fourth layer have a thickness greater than the thicknesses of the first layer and the third layer.

Specifically, three examples of specific membrane system structures in the following table are given:

Table I

The reflectance curves of the three groups of film structures in the above table are shown in Figs. 7 to 9, in which the horizontal axis coordinate is the wavelength (nm) and the vertical axis is the refractive index (%), and the graphs of the following examples have the same horizontal and vertical coordinates. .

Embodiment 3

This embodiment is based on the first embodiment, and another specific plating structure is given: the total number of the coating layers is 6 layers, the total thickness of the coating layer of the titanium oxynitride and the silicon oxynitride. The ratio of the total thickness of the coating layer is between 0.8 and 0.9. This ratio is ensured to achieve the mirror effect of rose gold with only 6 layers of plating, and the total thickness can be controlled below 600 nm, thereby reducing The effect on capacitance detection.

Among them, the structure of each layer can be distributed as follows:

The first coating layer is a titanium oxynitride coating having a thickness ranging from 75 to 95 nm;

The second coating layer is a silicon oxynitride coating having a thickness ranging from 75 to 95 nm;

The third coating layer is a titanium oxynitride coating having a thickness ranging from 75 to 95 nm;

The fourth coating layer is a silicon oxynitride coating having a thickness ranging from 75 to 95 nm;

The fifth layer coating layer is a titanium oxynitride coating layer having a thickness ranging from 75 to 95 nm;

The sixth layer coating layer is a silicon oxynitride coating layer having a thickness ranging from 110 to 135 nm;

Wherein the first layer, the third layer and the fifth layer have the same thickness, the second layer and the fourth layer have the same thickness, and the thicknesses of the second layer and the fourth layer are greater than the thicknesses of the third layer and the fifth layer.

Table II

The reflectance curves of the three groups of membrane structures in the above table are shown in Figures 10 to 12.

Embodiment 4

In this embodiment, based on the first embodiment, another specific plating structure is given: the total number of the coating layers is 7 layers, the total thickness of the coating layer of the titanium oxynitride and the silicon oxynitride. The ratio of the total thickness of the coating layer is between 1.4 and 1.5. This ratio is ensured to achieve the mirror effect of rose gold with only 7 layers of plating, and the total thickness can be controlled below 950 nm, thereby reducing The effect on capacitance detection.

Among them, the structure of each layer can be distributed as follows:

The first coating layer is a titanium oxynitride coating having a thickness ranging from 65 to 130 nm;

The second coating layer is a silicon oxynitride coating having a thickness ranging from 65 to 130 nm;

The third coating layer is a titanium oxynitride coating having a thickness ranging from 65 to 130 nm;

The fourth coating layer is a silicon oxynitride coating having a thickness ranging from 65 to 130 nm;

The fifth layer coating layer is a titanium oxynitride coating layer, and the thickness ranges from 65 to 130 nm;

The sixth layer coating layer is a silicon oxynitride plating layer, and the thickness ranges from 65 to 130 nm;

The seventh layer coating layer is a titanium oxynitride coating layer having a thickness ranging from 80 to 170 nm;

Wherein, the thicknesses of the first layer to the sixth layer are the same, and the thickness of the seventh layer is greater than the thickness of the first layer to the sixth layer.

Table 3

The reflectance curves of the three groups of membrane structures in the above table are shown in Figures 13 to 16.

Embodiment 5

As shown in FIG. 5, in the present embodiment, on the basis of the above embodiments, an ink layer is disposed under the entire plating layer, and by providing an ink layer, light shielding can be better, and interference of stray light can be prevented. For the color to be achieved, it is preferred to print a gray ink layer which is capable of adjusting the background color to give a better rose gold effect.

Further, it is also possible to print a certain hollow pattern when printing the gray ink layer, for example, a hollow pattern of the printed fingerprint pattern, a hollow portion and a non-hollow portion, and there is a difference in light transmittance and reflectivity, thereby The upper glass observation will present a corresponding pattern on the mirror background, so that the fingerprint area can be identified or decorated. Preferably, a pigment different from gray may be further disposed in the hollow pattern, and more preferably, a pigment that contrasts with gray is filled, for example, a white pigment is filled, thereby making the pattern more conspicuous.

Embodiment 6

This embodiment mainly describes a method for manufacturing the glass plating structure of the first embodiment. As shown in FIG. 6, the glass plating structure of the present embodiment can be realized by an NCVM (non-conductive vacuum plating) process.

Specifically, a vacuum space as shown in FIG. 6 is set, and a ratio of 1.3:1 is introduced thereto. Nitrogen and oxygen (for example, a nitrogen ratio of 1.4:1 and oxygen) to between 1.5:1, and then alternately performing a titanium oxynitride coating layer formation process and a silicon oxynitride coating layer formation process, thereby The lower surface of the substrate is formed with an alternately stacked silicon oxynitride coating layer and a titanium oxynitride coating layer.

The step of forming the titanium oxynitride coating layer is specifically: exciting the titanium raw material provided in the sealed space by an electron gun, evaporating the titanium raw material, reacting with nitrogen and oxygen in the sealed space, and then in the glass. A titanium oxynitride coating layer is formed downward on the lower surface of the substrate.

The silicon oxynitride coating layer forming process includes: exciting a silicon raw material disposed in the sealed space by an electron gun, evaporating the silicon raw material, reacting with nitrogen and oxygen in the sealed space, and then under the glass substrate A silicon oxynitride coating layer is formed on the surface downward.

The number of times of alternately performing the titanium oxynitride coating layer formation step and the silicon oxynitride coating layer formation step depends on the number of layers to be finally obtained, and the thickness of each layer is controlled by controlling the titanium oxynitride coating layer formation process and silicon nitrogen each time. The oxide plating layer formation step is realized.

In the above process, by controlling the ratio of nitrogen and oxygen to be introduced, the ratio of the nitrogen atom to the oxygen atom in the compound of the coating layer is controlled to achieve the reflectance of the titanium oxynitride and the silicon oxynitride. Adjusting, so that the refractive index of titanium oxynitride is controlled at about 1.84, and the refractive index of silicon oxynitride is controlled at about 1.31, and the combination of layer number and layer thickness is controlled, and the overall thickness is thin. The mirror effect of the brighter rose gold. This embodiment adopts a process. Since only two common metal and semiconductor materials are used, the process is simple to implement and convenient for batch generation.

Further, in the coating process, first, a titanium oxynitride plating layer forming step is performed so that the titanium oxynitride coating layer is located in the first layer, and since the reflectance of the titanium oxynitride is relatively high, In the first layer, the entire film system can be rendered more vivid colors.

In addition, in this embodiment, the total number of coating layers can be controlled in 5-7 layers, and the total thickness of the plating layer can be controlled between 280 nm and 1000 nm. In addition, in the embodiment of the present invention, the thickness of the glass substrate can be 170-180 um. Within the range, it is preferably 175 um.

Example 7

The embodiment relates to a manufacturing method for manufacturing the plating structure of the second embodiment, which comprises: The titanium oxynitride plating layer forming step and the silicon oxynitride plating layer forming step (which can be performed alternately five times) are performed, and the total number of the plating layers is 5 layers, and the titanium oxynitride coating layer is formed. The ratio of the total thickness to the total thickness of the coating layer of the silicon oxynitride is between 1.55 and 1.65.

Specifically, by alternately performing the titanium oxynitride plating layer forming step and the silicon oxynitride coating layer step, a plating structure having the following thickness is produced:

Wherein, the thickness of each layer can be realized by controlling the coating time, and an example of the specific thickness of each layer has been described in the second embodiment, and details are not described herein.

Example eight

The present embodiment relates to a method for producing a plating structure of the above-described third embodiment, which alternately executes a titanium oxynitride plating layer forming step and a silicon oxynitride coating layer forming step (which can be performed alternately six times) to make the coating The total number of layers is 6 layers, and the ratio of the total thickness of the coating layer of the titanium oxynitride to the total thickness of the coating layer of the silicon oxynitride is between 0.8 and 0.9.

Wherein the first layer, the third layer and the fifth layer have the same thickness, the second layer and the fourth layer The thickness is the same, and the thicknesses of the second and fourth layers are greater than the thicknesses of the third and fifth layers.

Wherein, the thickness of each layer can be realized by controlling the coating time, and an example of the specific thickness of each layer has been described in the third embodiment, and details are not described herein.

Example nine

The present embodiment relates to a method for manufacturing the plating structure of the fourth embodiment, which alternately performs a titanium oxynitride coating layer forming step and a silicon oxynitride coating layer forming step (which can be performed alternately seven times), the coating layer The total number is 7 layers, and the ratio of the total thickness of the coating layer of the titanium oxynitride to the total thickness of the coating layer of the silicon oxynitride is between 1.4 and 1.5.

Specifically, by alternately performing the titanium oxynitride plating layer forming step and the silicon oxynitride coating layer step, a plating structure having the following thickness plating layer is produced:

Wherein, the thickness of each layer can be realized by controlling the coating time, and an example of the specific thickness of each layer has been described in the fourth embodiment, and details are not described herein.

Example ten

This embodiment mainly describes the structure of the above-described fifth embodiment. In the present embodiment, after the titanium oxynitride plating layer forming step and the silicon oxynitride plating layer forming step are alternately performed by the ink printing apparatus, an ink layer is printed on the lower side of the plating layer, whereby light shielding can be performed better. To prevent the interference of stray light, it is preferable to print a gray ink layer for the color to be realized by the invention, and it is possible to adjust the ground color to exhibit a better rose gold effect.

Further, printing a layer of gray ink under the plating layer may include: printing a gray ink layer having a fingerprint pattern hollow pattern, filling a pigment different from gray in a portion having a hollow; or printing only a hollow pattern without filling the pigment. Among them, the filling is preferably a pigment which contrasts with the gray color, thereby making the pattern more conspicuous.

Embodiment 11

The embodiment relates to a fingerprint detecting device, including: a capacitive fingerprint sensor, which can be any capacitive fingerprint sensor used in the prior art, and can be an active capacitive fingerprint sensor (for example, The fingerprint sensor produced by FPC can also be a passive capacitive fingerprint sensor. The glass plating structure of each of the above embodiments is attached to the upper portion of the capacitive fingerprint sensor as an isolation layer or a protective layer. The coated side faces the capacitive plate array of the capacitive fingerprint sensor, and the upper surface of the glass is externally used for contact. Fingerprint skin.

Example twelve

The embodiment relates to a mobile terminal including the fingerprint detecting device of the eleventh embodiment, such as a mobile phone, a tablet computer, etc., and an opening for performing fingerprint detection is disposed on a back cover of the mobile terminal, and the fingerprint detecting device is located at the The upper portion of the opening is exposed from the opening of the glass plating structure of the fingerprint detecting device. In the above configuration, the area where the fingerprint is recognized is placed behind the mobile terminal, and the opening of the back cover is opened to expose the glass of the rose gold color having the mirror effect as the area for fingerprint recognition. Since the glass plating layer of the embodiment of the present invention can present a bright rose gold mirror effect, the fingerprint recognition area of the mobile terminal can be made abnormal and beautiful, and the overall aesthetic effect of the mobile terminal can be improved.

Finally, it should be noted that the above embodiments are merely illustrative of the technical solutions of the present invention, and are not intended to be limiting; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art will understand that The technical solutions described in the foregoing embodiments may be modified, or some or all of the technical features may be equivalently replaced; and the modifications or substitutions do not deviate from the technical solutions of the embodiments of the present invention. range.

Claims

A method for manufacturing a glass coating structure, comprising:

The sealed space provided with the glass substrate on one side is filled with nitrogen gas and oxygen gas, and the sealed space is a vacuum space; wherein the ratio of nitrogen gas to oxygen gas is between 1.3:1 and 1.5:1;

The oxynitride production step is performed to form an oxynitride plating layer on one side of the glass substrate.
The manufacturing method according to claim 1, wherein the step of performing an oxynitride production step of forming an oxynitride coating layer on one side of the glass substrate comprises:

The oxynitride production step is alternately performed, and an oxynitride plating layer which is alternately laminated is formed on one side of the glass substrate.
The manufacturing method according to claim 2, wherein said alternately performing an oxynitride generating step of forming an alternately laminated oxynitride coating layer on one side of said glass substrate comprises:

At least two steps of forming the oxynitride are alternately performed, and a plating layer of at least two kinds of oxynitrides which are alternately laminated is formed on one side of the glass substrate.
The manufacturing method according to claim 3, wherein the step of forming at least two oxynitrides is alternately performed, and a plating layer of at least two oxynitride layers alternately laminated is formed on one side of the glass substrate include:

The titanium oxynitride plating layer forming step and the silicon oxynitride plating layer forming step are alternately performed, and a silicon oxynitride plating layer and a titanium oxynitride plating layer which are alternately laminated are formed on one side of the glass substrate.
The manufacturing method according to claim 4, wherein the performing the step of forming the titanium oxynitride coating layer comprises:

The titanium raw material disposed in the sealed space is excited by an electron gun, and the titanium raw material is evaporated to react with nitrogen and oxygen in the sealed space to form a titanium oxynitride plating layer.
The manufacturing method according to claim 4, wherein the performing the silicon oxynitride coating layer forming process comprises:

Exciting a silicon raw material disposed in the sealed space by an electron gun to make the silicon raw material Evaporation forms a silicon oxynitride coating layer after reacting with nitrogen and oxygen in the sealed space.
The manufacturing method according to claim 4, wherein the alternately performing the titanium oxynitride plating layer forming step and the silicon oxynitride plating layer forming step comprises:

First, a titanium oxide oxynitride coating layer formation step is performed, and a silicon oxynitride plating layer formation step is performed.
The manufacturing method according to claim 1, wherein a ratio of nitrogen gas to oxygen gas is 1.4:1.
The manufacturing method according to claim 4, wherein the titanium oxynitride plating layer forming step and the silicon oxynitride plating layer forming step are performed five times in total, so that the titanium The total number of layers of the oxynitride coating layer and the silicon oxynitride coating layer is 5 layers, and the ratio of the total thickness of the titanium oxynitride coating layer to the total thickness of the silicon oxynitride coating layer is 1.55. Between 1.65.
The manufacturing method according to claim 9, wherein the titanium oxynitride plating layer forming step and the silicon oxynitride plating layer step are alternately performed to form the following plating layer:

The first coating layer is a titanium oxynitride coating layer, and the thickness ranges from 45 to 70 nm;

The second coating layer is a silicon oxynitride coating layer, and the thickness ranges from 55 to 90 nm;

The third layer coating layer is a titanium oxynitride coating layer, and the thickness ranges from 45 to 70 nm;

The fourth coating layer is a silicon oxynitride coating layer, and the thickness ranges from 55 to 90 nm;

The fifth layer coating layer is a titanium oxynitride coating layer having a thickness ranging from 95 to 150 nm.
The manufacturing method according to claim 4, wherein the titanium oxynitride plating layer forming step and the silicon oxynitride plating layer forming step are performed six times in total, so that the titanium The total number of layers of the oxynitride coating layer and the silicon oxynitride coating layer is 6 layers, and the ratio of the total thickness of the titanium oxynitride coating layer to the total thickness of the silicon oxynitride coating layer is 0.8 Between 0.9.
The manufacturing method according to claim 11, wherein the titanium oxynitride plating layer forming step and the silicon oxynitride plating layer step are alternately performed to form the following plating layer:

The first coating layer is a titanium oxynitride coating layer, and the thickness ranges from 75 to 95 nm;

The second coating layer is a silicon oxynitride coating layer, and the thickness ranges from 75 to 95 nm;

The third layer coating layer is a titanium oxynitride coating layer, and the thickness ranges from 75 to 95 nm;

The fourth coating layer is a silicon oxynitride coating layer, and the thickness ranges from 75 to 95 nm;

The fifth layer coating layer is a titanium oxynitride coating layer, and the thickness ranges from 75 to 95 nm;

The sixth coating layer is a silicon oxynitride coating having a thickness ranging from 110 to 135 nm.
The manufacturing method according to claim 4, wherein the titanium oxide layer forming step and the silicon oxynitride layer forming step are performed seven times in total, so that the titanium The total number of layers of the oxynitride coating layer and the silicon oxynitride coating layer is 7 layers, and the ratio of the total thickness of the titanium oxynitride coating layer to the total thickness of the silicon oxynitride coating layer is 1.4. Between 1.5.
The manufacturing method according to claim 13, wherein the titanium oxynitride plating layer forming step and the silicon oxynitride plating layer step are alternately performed to form the following plating layer:

The first coating layer is a titanium oxynitride coating layer, and the thickness ranges from 65 to 130 nm;

The second coating layer is a silicon oxynitride coating layer, and the thickness ranges from 65 to 130 nm;

The third layer coating layer is a titanium oxynitride coating layer, and the thickness ranges from 65 to 130 nm;

The fourth coating layer is a silicon oxynitride coating layer, and the thickness ranges from 65 to 130 nm;

The fifth layer coating layer is a titanium oxynitride coating layer, and the thickness ranges from 65 to 130 nm;

The sixth layer coating layer is a silicon oxynitride coating layer, and the thickness ranges from 65 to 130 nm;

The seventh layer coating layer is a titanium oxynitride coating layer having a thickness ranging from 80 to 170 nm.
The manufacturing method according to any one of claims 1 to 14, further comprising: after alternately performing the titanium oxynitride plating layer forming step and the silicon oxynitride coating layer forming step, further comprising:

A layer of black ink is printed on one side of the last formed coating layer.
The method of manufacturing according to claim 15, wherein printing a layer of gray ink on one side of the last formed coating layer comprises:

A gray ink layer having a hollow pattern is printed on one side of the last formed coating layer.
The manufacturing method according to claim 16, wherein the hollow pattern is a hollow pattern of a fingerprint pattern.
The manufacturing method according to claim 16, wherein a portion having a hollow in the hollow pattern is filled with a pigment different from gray.
The manufacturing method according to any one of claims 1 to 14, wherein the glass substrate has a thickness of 170 to 180 um.
The manufacturing method according to claim 19, wherein the glass substrate has a thickness of 175 um.