CN104820474A - Cloud server mainboard, cloud server and realization method thereof - Google Patents
Cloud server mainboard, cloud server and realization method thereof Download PDFInfo
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- CN104820474A CN104820474A CN201510244507.6A CN201510244507A CN104820474A CN 104820474 A CN104820474 A CN 104820474A CN 201510244507 A CN201510244507 A CN 201510244507A CN 104820474 A CN104820474 A CN 104820474A
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Abstract
The application provides a cloud server mainboard, a cloud server and a realization method thereof. A plurality of SOCs (system on chip) are integrated on the cloud server mainboard, each SOC is externally connected with a DIMM (dual in-line memory module) and a SATA (serial advanced technology attachement) connector; each SOC is respectively interconnected with a PCIe (peripheral component interconnect express) Switch chip and a GbE (Gigabit Ethernet) Switch chip, the PCIe Switch chip and the GbE Switch chip are interconnected with a backboard connector, the backboard connector is interconnected with a management system, the management system is interconnected with a PHY chip, the PHY chip is respectively interconnected with the GbE Switch chip and a RJ45 interface. Through the adoption of the scheme provided by the embodiment of the application, the plurality of SOCs are integrated on the cloud server mainboard, and the PCIe Switch and the GbE Switch chip are integrated to realize internal interconnection and external interconnection, thereby realizing the condition that the cloud server mainboard can be placed in a chassis in low height to be normally used without majorly changing the existing cabinet.
Description
Technical field
The application relates to Cloud Server technical field, particularly relates to a kind of Cloud Server mainboard, Cloud Server and its implementation.
Background technology
General Cloud Server needs integrated polylith central processing unit (CPU, CentralProcessing Unit) chip in standard PC case, and the thing that application is more at present inserts polylith CPU card, an integrated cpu chip in every block CPU card on one piece of substrate.
Adopt the mode inserting polylith CPU card on one piece of substrate, its major defect is highly higher, can not realize in 1U height, generally needs 2U or 4U height.When existing rack insufficient height, then need to do larger change to existing rack.
Prior art deficiency is:
The mode adopting one piece of substrate to insert polylith CPU card causes highly higher, can not realize in 1U height.
Summary of the invention
The embodiment of the present application proposes a kind of Cloud Server mainboard, Cloud Server and its implementation, causes highly higher, the technical matters that can not realize in 1U height to solve the mode adopting one piece of substrate to insert polylith CPU card in prior art.
The embodiment of the present application provides a kind of Cloud Server mainboard, all external DIMM and the SATA connector of integrated multiple SOC (system on a chip) SOC, each SOC on described Cloud Server mainboard;
On described Cloud Server mainboard, each SOC all with PCIe Switch chip, GbE Switch chip interconnect, described PCIe Switch chip, described GbE Switch chip are all interconnected with back panel connector, described back panel connector and management system interconnected, described management system and PHY chip interconnected, described PHY chip respectively with described GbE Switch chip, RJ45 interface inter-link.
The embodiment of the present application additionally provides a kind of Cloud Server, parallelly in Cloud Server cabinet is placed with the above-mentioned Cloud Server mainboard of polylith.
The embodiment of the present application provides a kind of implementation method of Cloud Server, comprises the steps:
Parallel holding multiple pieces Cloud Server mainboard in Cloud Server cabinet, integrated multiple SOC (system on a chip) SOC on every block mainboard;
By external for each SOC DIMM and SATA connector;
Each SOC is connected with PCIe Switch chip, GbE Switch chip respectively, described PCIeSwitch chip, described GbE Switch chip are connected with back panel connector respectively, described back panel connector is connected with management system, described management system is connected with PHY chip, described PHY chip is connected with described GbE Switch chip, RJ45 interface respectively.
Beneficial effect is as follows:
The Cloud Server mainboard that the embodiment of the present application provides, Cloud Server and its implementation, integrated multiple SOC (system on a chip) SOC on every block Cloud Server mainboard, each SOC external small outline dual inline memory modules SODIMM and SATA connector, each SOC respectively with PCIe Switch chip, GbE Switch chip interconnect, described PCIe Switch, described GbE Switch chip is interconnected with back panel connector respectively, described back panel connector and management system interconnected, described management system and PHY chip interconnected, described PHY chip respectively with described GbE Switch chip, RJ45 interface inter-link.Prior art needs vertical insertion polylith CPU card on base plate, and the width of CPU card and the height of cabinet, in same direction, cause cannot inserting CPU card when cabinet height is lower, and the scheme that the embodiment of the present application provides, integrated multiple SOC on every block mainboard, and integrated PCIe Switch, GbE Switch chip realizes interconnected and external interconnections, can be understood as is directly be integrated on base plate by CPU, parallel with bottom cabinet in cabinet, the described width of Cloud Server mainboard and the width of cabinet are in same direction, the described length of Cloud Server mainboard and the length of cabinet are in same direction, guarantee that mainboard height can not be too high, when existing cabinet height is lower, also described Cloud Server mainboard can be put into cabinet normally to use, do not need to carry out larger change to existing cabinet.
Accompanying drawing explanation
The specific embodiment of the application is described below with reference to accompanying drawings, wherein:
Fig. 1 shows the structural representation of the embodiment of the present application medium cloud server master board;
Fig. 2 shows the circuit diagram of the embodiment of the present application medium cloud server master board;
Fig. 3 shows the structural representation in the embodiment of the present application in Cloud Server 1U cabinet;
The schematic flow sheet that the implementation method that Fig. 4 shows Cloud Server in the embodiment of the present application is implemented.
Embodiment
In order to the technical scheme and advantage that make the application are clearly understood, be described in more detail below in conjunction with the exemplary embodiment of accompanying drawing to the application, obviously, described embodiment is only a part of embodiment of the application, instead of all embodiments is exhaustive.And when not conflicting, the embodiment in this explanation and the feature in embodiment can be combined with each other.
For the deficiencies in the prior art, the embodiment of the present application proposes a kind of Cloud Server mainboard, Cloud Server and its implementation, is described below.
Fig. 1 shows the structural representation of the embodiment of the present application Cloud Server mainboard, as shown in the figure, the upper integrated multiple SOC (system on a chip) (SOC of described Cloud Server mainboard (also can be called cpu motherboard), System onChip), the all external DIMM (DIMM of each SOC, Dual In-line MemoryModule) and Serial Advanced Technology Attachment (SATA, Serial Advanced Technology Attachment) connector;
On described Cloud Server mainboard, each SOC all with PCIe Switch chip, GbE Switch chip interconnect, described PCIe Switch chip, described GbE Switch chip are all interconnected with back panel connector, described back panel connector and management system interconnected, described management system and PHY chip interconnected, described PHY chip respectively with described GbE Switch chip, RJ45 interface inter-link.
SOC can be called system level chip or SOC (system on a chip), refers on one chip integrated for some critical components of system.In the embodiment of the present application, SOC can adopt Intel Avoton SOC, and because SOC is as monolithic integrated device, does not need to connect the chipset such as south bridge, north bridge, therefore, reduce the quantity of peripheral components, the small size being conducive to pcb board card realizes; On the other hand, because Intel Avoton SOC series power consumption is lower, the highest less than 20W, therefore, more data processing card can be inserted in, cabinet that size is limited certain in power consumption.
In concrete enforcement, also can adopt the SOC of other types, the application is not restricted this.
In the embodiment of the present application, each SOC outside can connect DIMM and SATA as storage system, during concrete enforcement can on each SOC external 2 small outline dual inline memory modules (SODIMM, Small Outline Dual In-line Memory Module) memory bar and 1 SATA connector, energization pins is set by choosing weldering device, 1 SATA hard disc or 1 DOMSATA hard disk (being also the solid state hard disc of SATA interface or the DOM electronic hard disc of SATA interface) can be connected.
PCIe Switch chip is also PCI (Peripheral Component Interconnect) Express Ethernet chip; GbE Switch chip is also Gigabit Ethernet gigabit Ethernet chip; PHY chip is then physical chip.
In the specific implementation, the power-supply system power-on and power-off sequential of Cloud Server mainboard can pass through CPLD (CPLD, Complex Programmable Logic Device) control, implement comparatively simple, can require to carry out programming Control according to concrete SOC, compatibility is stronger.
The Cloud Server mainboard that the embodiment of the present application provides is integrated with multiple SOC, can be placed in parallel in cabinet, guarantee that the height of Cloud Server mainboard can not be too high, even if also can use in 1U cabinet.When existing rack height is lower, also directly can place described Cloud Server mainboard in the space of existing rack, thus reach compatible with existing rack, not need the object existing rack being done to larger change.
In addition, the mode that prior art inserts polylith CPU card on substrate causes that size is comparatively large, weight is larger, inconvenient overall plug operation, and the embodiment of the present application is owing to every block cpu motherboard being integrated with multiple SOC, entirety plug operation can be carried out, and can hot plug be realized, and without rack power-off during plug Cloud Server mainboard, the not normal work of influential system other parts.
In enforcement, each SOC can be connected to four-way SFP interface (QSFP, Quad Small Form-factor Pluggable) by gigabit Ethernet GbE interface.
In the embodiment of the present application, each SOC connects road gigabit Ethernet GbE to a four-way SFP interface QSFP, can realize the direct external interconnections of SOC.
In enforcement, described GbE Switch chip can be connected with the small-sized hot swap devices SFP+ of front panel by serializer/de-serializers SERDES interface.
Wherein, SFP (Small Form-factor Pluggable) simply can be interpreted as the upgraded version of GBIC, GBIC (Gigabit Interface Converter) is interface device kilomegabit electric signal being converted to light signal, and SFP+ can be understood as the device of the signal with the size the same with SFP transmission 10G.
In the embodiment of the present application, each SOC by GbE Switch chip to back panel connector, and then by SERDES to front panel SFP+, can realize external interconnections.
In enforcement, described management system can by the Gigabit Media stand-alone interface (RGMII simplified, Reduced Gigabit Media Independent Interface) be directly connected to outside electric mouth with PHY is interconnected, and/or, described management system can be carried out RGMII by PHY and be turned Serial Gigabit Media Independent Interface (SGMII, Serial Gigabit Media Independent Interface) be connected to back panel connector by described GbE Switch chip again, and/or, described management system can be carried out RGMII by PHY chip and be turned SGMII and be connected to outside electric mouth by described GbE Switch chip again.
In the embodiment of the present application, management system external interface can comprise:
1) RGMII directly by PHY chip to outside electric mouth, namely the network of plate level management system (BMC, Baseboard Management Controller) is directly connected with external interconnections equipment;
2) carry out RGMII by PHY chip and turn SGMII, to GbE Switch chip, then to back panel connector;
3) carry out RGMII by PHY chip and turn SGMII, to GbE Switch chip, then to outside electric mouth.
In the embodiment of the present application, management system can adopt various ways and external interface, thus can meet the different implementation of management system under different application.
In enforcement, described management system comprises BMC and companion chip (CC, Companion Chip).
The function of BMC can be automatic detection, management system event, event is recorded in non-volatile System Event Log, the event type of record can comprise temperature exceeding standard, voltage over standard, fan failure, cabinet invasion, and BMC can also according to case system temperature conditions automatic rotational speed regulation realizing fan etc.CC can be used for expanding BMC interface, helps BMC to realize the more cpu system of management.
In the embodiment of the present application, management system can adopt the design of BMC+CC, also namely only just can realize management system with a BMC device.
The Cloud Server mainboard that the embodiment of the present application provides, is directly integrated on base plate by CPU, places bottom parallel cabinet, and also, the width of Cloud Server mainboard and the width of cabinet are in the same direction; Namely and CPU card vertically inserts on base plate in prior art, also the height of the width of CPU card and cabinet is in the same direction.Therefore, compared with prior art, even if the Cloud Server mainboard that the embodiment of the present application provides also can normally be put into when cabinet height is lower, without the need to changing existing cabinet.
In addition, the Cloud Server mainboard that the embodiment of the present application provides can also support hot plug, also, when plugging Cloud Server mainboard, without the need to cabinet power-off, does not also affect the normal work of other parts of cloud server system.
In enforcement, integrated 8 SOC on described Cloud Server mainboard.
In the embodiment of the present application, can integrated multiple SOC on Cloud Server mainboard, but consider the restrictions such as heat radiation, chip size, generally can place 8 SOC.
For the ease of the enforcement of the application, be described as an example with integrated 8 SOC below.
Fig. 2 shows the circuit diagram of the embodiment of the present application medium cloud server master board, and as shown in the figure, mainboard comprises 8 SOC, is respectively CPU NODE0 ~ CPU NODE7.Each CPU NODE externally all connects two SODIMM (SODIMM0, SODIMM1) by DDR3, and is connected with 1 SATA connector (SATA Con) by a road SATA3.0.
Each CPU NODE is all interconnected, interconnected by two-way GbE and GbE_SW by a road GbE and QSFP, interconnected by 4 road PCIe and PCIe_SW, and it is interconnected that PCIe_SW and back panel connector pass through 8 road PCIe, and it is interconnected that GbE_SW and back panel connector pass through 1 road GbE.
GbE_SW and SFP+ is interconnected by 1 road SERDES, interconnected by 2 road SERDES or GbE with PHY.
PHY and RJ45 is interconnected, and PHY is interconnected by 1 road RGMII and management system BMC+CC, and it is interconnected that BMC+CC and back panel connector pass through I2C.
Power-supply system controls power-on and power-off sequential by CPLD.
In the embodiment of the present application, system data link can comprise PCIe, and GbE, SATA 3 overlaps interacted system:
PCIe interacted system is interconnected system, and namely 8 SOC can be interconnected by PCIe Switch.Also by PCIe Switch to backboard, external interconnections can be realized.
GbE interacted system is interconnected system, and namely 8 SOC can be interconnected by GbE Switch.Also can as external interconnections system, every SOC connects road GbE a to QSFP, can realize the direct external interconnections of SOC, also by GbE Switch to backboard, to front panel SFP+, can realize external interconnections.
SATA interacted system is storage system, and every SOC goes out 2 port, and a port is as internal interface, and the SATA interface namely on data processing card, a port, as external interface, connects SATA hard disc by other system on substrate.
Based on same inventive concept, the embodiment of the present application additionally provides a kind of Cloud Server, parallelly in Cloud Server cabinet is placed with the above-mentioned Cloud Server mainboard of polylith.
Generally, Cloud Server cabinet has the different sizes such as 1U, 2U, 4U, and in cabinet, parallel placement can be understood as is parallel with place plane bottom cabinet.
In enforcement, in 1U cabinet, the left and right sides places two pieces of above-mentioned Cloud Server mainboards respectively.
Fig. 3 shows the structural representation in the embodiment of the present application in Cloud Server 1U cabinet, and as shown in the figure, in 1U cabinet, the left and right sides places two pieces of above-mentioned Cloud Server mainboards respectively.
In the embodiment of the present application, can holding multiple pieces Cloud Server mainboard in the cabinet of different size, because cabinet size is fixing, if will place more Cloud Server mainboard in cabinet, then the size of every block mainboard just needs to reduce accordingly.
Based on same inventive concept, additionally provide a kind of implementation method of Cloud Server in the embodiment of the present application, be described below.
The schematic flow sheet that the implementation method that Fig. 4 shows Cloud Server in the embodiment of the present application is implemented, as shown in the figure, described method can comprise the steps:
Step 401, in Cloud Server cabinet parallel holding multiple pieces Cloud Server mainboard, integrated multiple SOC on every block mainboard;
Step 402, by external for each SOC DIMM and SATA connector;
Step 403, each SOC to be connected with PCIe Switch chip, GbE Switch chip respectively, described PCIe Switch chip, described GbE Switch chip are connected with back panel connector respectively;
Step 404, described back panel connector to be connected with management system, described management system to be connected with PHY chip, described PHY chip is connected with described GbE Switch chip, RJ45 interface respectively.
In enforcement, described method may further include:
Each SOC is connected to four-way SFP QSFP interface by gigabit Ethernet GbE interface.
In enforcement, described method may further include:
Described GbE Switch chip is connected serializer/de-serializers SERDES to front panel SFP+.
In enforcement, described method may further include:
By described management system by RGMII and PHY chip is interconnected is directly connected to outside electric mouth;
And/or,
Described management system is carried out RGMII by PHY chip turn SGMII and be connected to back panel connector by described GbESwitch chip again;
And/or,
Described management system is carried out RGMII by PHY chip turn SGMII and be connected to outside electric mouth by described GbESwitch chip again.
In enforcement, described method may further include:
Each SOC is arranged 2 interfaces, an interface is as inner SATA interface, and another is connected with SATA hard disc or DOM SATA hard disc as external interface.
The embodiment of the present application by placing 2 pieces of cpu motherboards in the cabinet of 1U height, integrated 8 SOC on every block cpu motherboard, guarantee that the height of Cloud Server mainboard can not be too high, when existing rack height is lower, also can directly distribute 2 pieces of cpu motherboards about the space of existing rack, thus reach compatible with existing rack, do not need the object existing rack being done to larger change.
Cloud Server mainboard, Cloud Server and its implementation that the embodiment of the present application provides, go for the cloud server system that density is higher, power consumption constraints is stricter.
Although described the preferred embodiment of the application, those skilled in the art once obtain the basic creative concept of cicada, then can make other change and amendment to these embodiments.So claims are intended to be interpreted as comprising preferred embodiment and falling into all changes and the amendment of the application's scope.
Claims (10)
1. a Cloud Server mainboard, is characterized in that, all external DIMM DIMM of integrated multiple SOC (system on a chip) SOC, each SOC and Serial Advanced Technology Attachment SATA connector on described Cloud Server mainboard;
On described Cloud Server mainboard, each SOC all with PCIe Switch chip, GbE Switch chip interconnect, described PCIe Switch chip, described GbE Switch chip are all interconnected with back panel connector, described back panel connector and management system interconnected, described management system and PHY chip interconnected, described PHY chip respectively with described GbE Switch chip, RJ45 interface inter-link.
2. Cloud Server mainboard as claimed in claim 1, it is characterized in that, each SOC is all connected to four-way SFP QSFP interface by gigabit Ethernet GbE interface.
3. Cloud Server mainboard as claimed in claim 1, is characterized in that, described GbE Switch chip is connected with the small-sized hot swap devices SFP+ of front panel by serializer/de-serializers SERDES interface.
4. Cloud Server mainboard as claimed in claim 1, is characterized in that, described management system is by the Gigabit Media stand-alone interface RGMII that simplifies and PHY chip is interconnected is directly connected to outside electric mouth; And/or described management system is undertaken being connected to back panel connector by described GbE Switch chip again after RGMII turns Serial Gigabit Media Independent Interface SGMII by PHY chip; And/or described management system is carried out RGMII by PHY chip and is turned SGMII and be connected to outside electric mouth by described GbE Switch chip again.
5. Cloud Server mainboard as claimed in claim 1, it is characterized in that, described management system comprises plate level management system BMC and companion chip CC.
6. Cloud Server mainboard as claimed in claim 1, is characterized in that, integrated 8 SOC on described Cloud Server mainboard.
7. a Cloud Server, is characterized in that, in Cloud Server cabinet parallel be placed with polylith as arbitrary in claim 1 to 6 as described in Cloud Server mainboard.
8. Cloud Server as claimed in claim 7, is characterized in that, in 1U cabinet the left and right sides place respectively two pieces as arbitrary in claim 1 to 6 as described in Cloud Server mainboard.
9. an implementation method for Cloud Server, is characterized in that, comprises the steps:
Parallel holding multiple pieces Cloud Server mainboard in Cloud Server cabinet, integrated multiple SOC (system on a chip) SOC on every block mainboard;
By external for each SOC DIMM DIMM and SATA connector;
Each SOC is connected with PCIe Switch chip, GbE Switch chip respectively, described PCIeSwitch chip, described GbE Switch chip are connected with back panel connector respectively;
Described back panel connector is connected with management system, described management system is connected with PHY chip, described PHY chip is connected with described GbE Switch chip, RJ45 interface respectively.
10. method as claimed in claim 9, is characterized in that, comprise further:
By described management system by RGMII and PHY chip is interconnected is directly connected to outside electric mouth;
And/or,
Described management system is carried out RGMII by PHY chip turn SGMII and be connected to back panel connector by described GbESwitch chip again;
And/or,
Described management system is carried out RGMII by PHY chip turn SGMII and be connected to outside electric mouth by described GbESwitch chip again.
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| CN201510244507.6A CN104820474A (en) | 2015-05-14 | 2015-05-14 | Cloud server mainboard, cloud server and realization method thereof |
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| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 100193 5, 36 building, Zhongguancun Software Park, 8 Northeast Northeast Road, Haidian District, Beijing. Applicant after: Shuguang Cloud Computing Group Co Ltd Address before: 100193 building 36, Zhongguancun Software Park, 8 North East West Road, Haidian District, Beijing. Applicant before: Shuguang Cloud Computing Technology Co., Ltd. |
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150805 |