CN102683225A - Electronic component installing device and electronic component installing method - Google Patents
Electronic component installing device and electronic component installing method Download PDFInfo
- Publication number
- CN102683225A CN102683225A CN2012100594320A CN201210059432A CN102683225A CN 102683225 A CN102683225 A CN 102683225A CN 2012100594320 A CN2012100594320 A CN 2012100594320A CN 201210059432 A CN201210059432 A CN 201210059432A CN 102683225 A CN102683225 A CN 102683225A
- Authority
- CN
- China
- Prior art keywords
- nude film
- positional information
- wafer
- obtains
- qualified product
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 23
- 239000000758 substrate Substances 0.000 claims abstract description 78
- 230000002950 deficient Effects 0.000 claims description 23
- 238000009434 installation Methods 0.000 claims description 22
- 238000012937 correction Methods 0.000 claims description 5
- 238000004904 shortening Methods 0.000 abstract description 6
- 238000012546 transfer Methods 0.000 description 57
- 238000012545 processing Methods 0.000 description 37
- 239000004065 semiconductor Substances 0.000 description 17
- 238000010586 diagram Methods 0.000 description 16
- 230000015572 biosynthetic process Effects 0.000 description 8
- 238000005755 formation reaction Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 238000010521 absorption reaction Methods 0.000 description 6
- 239000013078 crystal Substances 0.000 description 3
- 230000006870 function Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 238000003702 image correction Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
Landscapes
- Engineering & Computer Science (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Image Processing (AREA)
Abstract
The present invention provides an electronic component installing device and an electronic component installing method capable of shortening installing time for taking out a qualified bare chip from a wafer and installing the bare chip on a substrate. The electronic component installing device obtains position information of the each bare chip according to an integral image of the wafer, obtains qualified information of the each bare chip, then obtains position information of the qualified bare chip according to the position information and the qualified information of the each bare chip, and takes out the qualified bare chip from the wafer to install on the substrate based on the obtained position information of the qualified bare chip. Therefore, there is no need to take photos for the each bare chip like now, and the installing time for taking out the qualified bare chip from the wafer and installing the bare chip on the substrate can be shortened.
Description
Technical field
The nude film that the present invention relates to take out from the wafer that is made up of a plurality of nude films qualified product is installed on electronic component mounting equipment and electronic component mounting method on the substrate.
Background technology
At present, be installed on electronic component mounting equipment and electronic component mounting method on the substrate, for example patent documentation 1 disclosed electronic component pick device and pick-up method arranged as the nude film that takes out qualified product from the wafer that constitutes by a plurality of nude films.
This pick device and pick-up method enlarge the field size of filming apparatus to be taken the image of semiconductor crystal wafer, the starting point when obtaining according to the image pickup semiconductor chip taken pick up starting point.Afterwards, the semiconductor chip that picks up starting point that the field size of dwindling filming apparatus is obtained is taken, obtained the position of semiconductor chip according to the image of taking.And based on the position of obtaining, picking up semiconductor chip is installed on substrate.After, move successively from picking up starting point, this each semiconductor chip is taken, based on the position of obtaining according to the image of taking, picking up semiconductor chip is installed on the substrate.
Patent documentation 1: TOHKEMY 2003-258008 communique
But, in above-mentioned pick device and pick-up method, must take semiconductor chip before picking up, must obtain the position of semiconductor chip according to the image of taking.The semiconductor chip that only is formed in the semiconductor chip of semiconductor crystal wafer qualified product in multiform is installed under the situation on the substrate, also must judge that whether qualified semiconductor chip is according to the image of taking.Therefore, be difficult to shorten the set-up time of the semiconductor chip that takes out qualified product from semiconductor crystal wafer when being installed on the substrate.
Summary of the invention
The present invention develops in view of this problem, and its purpose is, electronic component mounting equipment and the electronic component mounting method of the set-up time in the time of can shortening the nude film that takes out qualified product from wafer and be installed on the substrate is provided.
So; Present inventors have carried out wholwe-hearted research in order to address this problem; Repeatedly the result of duplicate test finds; Through obtaining the positional information of each nude film from the whole image of wafer, from the whether qualified information of the positional information of each nude film and each nude film, obtain the positional information of the nude film of qualified product, be installed on the substrate from the nude film that wafer takes out qualified product based on the positional information of the nude film of qualified product; Set-up time in the time of can shortening the nude film that takes out qualified product from wafer and be installed on the substrate, accomplish the present invention.
That is, first described electronic component mounting equipment of the present invention is installed on the substrate from the nude film that the wafer that is made up of a plurality of nude films that are formed with electronic component takes out qualified product, it is characterized in that, has wafer and takes the unit, and it is taken wafer integral body; Positional information obtains the unit, and it takes the positional information that obtains each nude film the whole image of the wafer of unit photographs from utilizing wafer; The qualified product positional information obtains the unit, obtains the positional information of the nude film of qualified product the positional information that it obtains each nude film of obtaining the unit from positional information and the whether qualified information of each nude film; Installation unit, it obtains the positional information of the nude film of the qualified product of obtaining the unit based on the qualified product positional information, and the nude film that takes out qualified product from wafer is installed on the substrate.Constitute according to this, obtain the positional information of the nude film of qualified product from the whole image of wafer.Therefore there is no need as now each nude film being taken.Therefore, the set-up time in the time of can shortening the nude film that takes out qualified product from wafer and be installed on the substrate.
Second described electronic component mounting equipment of the present invention is characterised in that; Wafer has and is used to differentiate whether qualified whether qualified of each nude film and differentiates mark; And have whether qualified information and obtain the unit; It is taken the whole image of the wafer of unit photographs from utilizing wafer; Differentiate mark based on whether qualified, obtain the whether qualified information of each nude film, the qualified product positional information obtains the unit and obtains the positional information that obtains the nude film of qualified product the positional information of each nude film of obtaining the unit and the whether qualified information that whether qualified information obtains each nude film of obtaining the unit from positional information.Constitute according to this, can obtain the positional information of the nude film of qualified product reliably.
The 3rd described electronic component mounting equipment of the present invention is characterised in that; Whether qualified information memory cell with whether qualified information of each nude film that storage obtains through the precheck wafer, qualified product positional information are obtained the nude film of qualified product is obtained in the unit from positional information obtains the whether qualified information of each nude film of positional information and the storage of whether qualified information memory cell of each nude film of obtaining the unit positional information.Constitute according to this, can obtain the positional information of the nude film of qualified product reliably.
The 4th described electronic component mounting equipment of the present invention is characterised in that; Wafer is taken the unit after the nude film that takes out specified quantity from wafer is installed on the substrate; Once more wafer integral body is taken; Positional information obtains the unit is obtained each nude film once more from the whole image of the wafer that utilizes wafer to take to take once more the unit positional information; The qualified product positional information obtains the positional information that obtains the nude film of qualified product the whether qualified information of the positional information that obtains each nude film of obtaining once more the unit from positional information in the unit and each nude film once more; Installation unit is obtained the positional information of the nude film of the qualified product of obtaining once more the unit based on the qualified product positional information, and the nude film that takes out qualified product from wafer is installed on the substrate.When wafer takes out nude film, there is the situation of offset of other nude film.Constitute according to this, after the nude film that takes out specified quantity is installed on the substrate, obtain the positional information of the nude film of qualified product once more from the whole image of wafer.Therefore, even the offset of nude film, the nude film that also can take out qualified product reliably is installed on the substrate.
The 5th described electronic component mounting equipment of the present invention be characterised in that, has nude film and take the unit, and it relatively moves and the image of nude film is taken with respect to wafer after the nude film that takes out specified quantity from wafer is installed on the substrate; Correction obtains the unit with positional information; It takes the positional information that obtains the nude film that is used to revise the image of nude film of unit photographs from utilizing nude film; The qualified product positional information obtains the unit based on revising the positional information that obtains the nude film of obtaining the unit that is used to revise with positional information, and the positional information of the nude film of qualified product is revised.When wafer takes out nude film, there is the situation of offset of other nude film.Constitute according to this, after the nude film that takes out specified quantity is installed on the substrate, obtain the positional information of the nude film that is used to revise from the image of nude film.And, based on the positional information of the nude film that is used to revise the positional information of the nude film of qualified product is revised.Therefore, even the offset of nude film, the nude film that also can take out qualified product reliably is installed on the substrate.
The 6th described electronic component mounting equipment of the present invention is characterised in that to have: nude film is taken the unit, and it relatively moves with respect to wafer, and the image of the nude film of the qualified product that will take out installation unit is taken; The defective judging unit, its image according to the nude film of the qualified product that will take out that utilize nude film shooting unit photographs is judged having or not of defective, installation unit takes out flawless nude film from wafer and is installed on the substrate based on the judged result of defective judging unit.When wafer is carried, reaching, there is the situation of the nude film generation defective that originally is qualified product from wafer taking-up nude film.Constitute according to this, judge having or not of defective according to the image of the nude film of the qualified product that will take out.And, based on judged result, under flawless situation, take out this nude film and be installed on the substrate.The nude film that therefore, can only take out flawless qualified product reliably is installed on the substrate.
The 7th described electronic component mounting equipment of the present invention is characterised in that wafer is taken the large-field shooting machine of unit for wafer integral body is taken in the lump.According to this formation, can take wafer integral body reliably.
The 8th described electronic component mounting equipment of the present invention be characterised in that, wafer is taken the row scanning camera of unit for relatively moving with respect to wafer and wafer integral body being taken.According to this formation, can take wafer integral body reliably.And, from charging tray taking-up wafer the time, can take wafer integral body simultaneously.Therefore, the activity duration can be shortened.
The 9th described electronic component mounting method of the present invention is installed on the substrate from the nude film that the wafer that is made up of a plurality of nude films that are formed with electronic component takes out qualified product; It is characterized in that; Possess positional information and obtain operation, from the image of wafer integral body, obtain the positional information of each nude film; The qualified product positional information obtains operation, from the whether qualified information of the positional information that obtains each nude film of obtaining the operation in positional information and each nude film, obtains the positional information of the nude film of qualified product; Installation procedure is based on the positional information that the qualified product positional information obtains the nude film of the qualified product of obtaining in the operation, and the nude film that takes out qualified product from wafer is installed on the substrate.According to this method, obtain the positional information of the nude film of qualified product from the whole image of wafer.Therefore, needn't be as now each nude film being taken.Therefore, the set-up time in the time of can shortening the nude film that takes out qualified product from wafer and be installed on the substrate.
The of the present invention ten described electronic component mounting method has whether qualified information and obtains operation; Be based upon differentiate each nude film whether qualified and be provided with whether qualifiedly differentiate mark; From the whole image of wafer, obtain the whether qualified information of each nude film, the qualified product positional information obtains operation obtains the nude film of qualified product from the positional information that obtains each nude film of obtaining the operation in positional information with in whether qualified information obtains the whether qualified information of each nude film of obtaining in the operation positional information.According to this method, can obtain the positional information of the nude film of qualified product reliably.
The 11 described electronic component mounting method of the present invention be characterised in that, the qualified product positional information obtains the positional information that obtains the nude film of qualified product in the whether qualified information of each nude film that operation obtains from the positional information that obtains each nude film of obtaining the operation in positional information with through the precheck wafer.According to this method, can obtain the positional information of the nude film of qualified product reliably.
The described electronic component mounting method of the present invention's the tenth binomial is characterised in that; Positional information obtains operation obtains each nude film once more from the whole image of the wafer of after the nude film that takes out specified quantity from wafer is installed on the substrate, taking once more positional information; The qualified product positional information obtains operation obtains the nude film of qualified product once more from the whether qualified information of the positional information that obtains each nude film of obtaining once more the operation in positional information and each nude film positional information; Installation procedure is based on the positional information that the qualified product positional information obtains the nude film of the qualified product of obtaining once more in the operation, and the nude film that takes out qualified product from wafer is installed on the substrate.When wafer takes out nude film, there is the situation of offset of other nude film.According to this method, after the nude film that takes out specified quantity is installed on the substrate, obtain the positional information of the nude film of qualified product once more from the whole image of wafer.Therefore, even the offset of nude film, the nude film that also can take out qualified product reliably is installed on the substrate.
Description of drawings
Fig. 1 is the block diagram of the electronic component mounting equipment in first execution mode;
Fig. 2 is the vertical view of the wafer among Fig. 1;
Fig. 3 is the flow chart of action that is used for explaining the electronic component mounting equipment of first execution mode;
Fig. 4 is the block diagram of the electronic component mounting equipment in the mode of texturing of first execution mode;
Fig. 5 is the stereogram of the alternate manner of expression wafer shooting;
Fig. 6 is the block diagram of the electronic component mounting equipment in second execution mode;
Fig. 7 is the flow chart of action that is used for explaining the electronic component mounting equipment of second execution mode;
Fig. 8 is the block diagram of the electronic component mounting equipment in the mode of texturing of second execution mode;
Fig. 9 is the block diagram of the electronic component mounting equipment in the 3rd execution mode;
Figure 10 is the flow chart of action that is used for explaining the electronic component mounting equipment of the 3rd execution mode;
Figure 11 is other flow chart of action that is used for explaining the electronic component mounting equipment of the 3rd execution mode;
Figure 12 is the block diagram of the electronic component mounting equipment in the 4th execution mode;
Figure 13 is the key diagram of normal mode action that is used for explaining the electronic component mounting equipment of the 4th execution mode;
Figure 14 is the key diagram that is used for explaining the action of the fast mode A in the electronic component mounting equipment of the 4th execution mode;
Figure 15 is the key diagram that is used for explaining the action of the fast mode B in the electronic component mounting equipment of the 4th execution mode.
Symbol description
1～4... electronic component mounting equipment; 10; 20; 30; 40... wafer filming apparatus (wafer shooting unit); 100... row scanning camera; 11; 21; 31; 41... (positional information obtains the unit to image processing apparatus; Whether qualified information obtains the unit); 12; 23; 34; 43... operational part (the qualified product positional information obtains the unit); 13; 24; 35; 44a; 44b... transfer head (installation unit); 14; 25; A 36... transfer drive division (installation unit); 15; 26... nude film filming apparatus (nude film shooting unit); 16; 27... image processing apparatus (defective judging unit); 22; 42... storage part (whether qualified information memory cell); 32... nude film filming apparatus (nude film shooting unit); 33... image processing apparatus (revise and obtain the unit) with positional information; 40... nude film filming apparatus; 41... image processing apparatus; 45... drive division; W1～W4... wafer; D1～D4; D40; D41... nude film; B1～B4... substrate
Embodiment
Below, enumerate execution mode and illustrate in greater detail the present invention.
(first execution mode)
At first, with reference to Fig. 1 and Fig. 2, the formation of the electronic component mounting equipment of first execution mode is described.At this, Fig. 1 is the block diagram of the electronic component mounting equipment in first execution mode.Fig. 2 is the vertical view of the wafer among Fig. 1.
Electronic component mounting equipment 1 shown in Figure 1 is to be installed in the device on the substrate B1 from the nude film D1 that the wafer W1 that formed by a plurality of nude film D1 that are formed with electronic component takes out qualified product.At this, wafer W1 is as shown in Figure 2, and a plurality of nude film D1 that will form semiconductor chip (electronic component) are arranged on the wafer board and constitute.And, additional bad sheet mark (whether qualified differentiate mark) on the nude film D1 of defective item only.As shown in Figure 1, electronic component mounting equipment 1 possesses wafer filming apparatus 10 (wafer shooting unit), image processing apparatus 11 (positional information obtains the unit, whether qualified information obtains the unit), operational part 12 (the qualified product positional information obtains the unit), transfer 13 (installation unit), a transfer drive division 14 (installation unit).
Wafer filming apparatus 10 is devices that wafer W1 integral body is taken.Specifically, be the large-field shooting machine that wafer W1 integral body is taken in the lump.The position that the top that wafer filming apparatus 10 is arranged at wafer W1 promptly can be taken wafer W1 integral body in the lump.
The nude film D1 of the qualified product that the positional information that is based on a transfer drive division 14 obtains to operational part 12 drives transfer 13, and the nude film D1 that takes out qualified product from wafer W1 is installed on the parts on the substrate B1.In addition, also be after taking out the nude film D1 of specified quantity from wafer W1, the parts that wafer filming apparatus 10, image processing apparatus 11 and operational part 12 are indicated with the mode of implementing once more to handle.Specifically, constitute, drive transfer 13 based on the positional information of nude film D1 by motor and motor control part.
Below, with reference to Fig. 3 to the action of electronic component mounting equipment, be that electronic component mounting method describes.At this, Fig. 3 is the flow process of action that is used for explaining the electronic component mounting equipment of first execution mode.
When indication begins on substrate B1, nude film D1 to be installed, as shown in Figure 3, utilize the whole image of 10 couples of wafer W1 of wafer filming apparatus to take (S10).And image processing apparatus 11 is obtained the positional information (S11, positional information obtains operation) of each nude film D1 from the whole image of the wafer W1 that utilizes wafer filming apparatus 10 and take.Specifically, obtain positional information with respect to mechanical origin.In addition, from the whole image of the wafer W1 that utilizes wafer filming apparatus 10 to take,, obtain the whether qualified information (S12, whether qualified information obtains operation) of each nude film D1 based on bad sheet mark.
Afterwards, obtain the positional information (S13, the qualified product positional information obtains operation) of the nude film D1 of qualified product the whether qualified information of the positional information of each nude film D1 of obtaining from image processing apparatus 11 of operational part 12 and each nude film D1.Then, the nude film D1 of the qualified product that a transfer drive division 14 position-based information obtain to operational part 12 drives transfer 13, and the nude film D1 that takes out qualified product from wafer W1 is installed on substrate B1 and goes up (S14, installation procedure).
Afterwards, a transfer drive division 14 judges whether the taking-up quantity of nude film D1 is specified quantity (S15).
In step S15, when the taking-up quantity of nude film D1 reached specified quantity, implementation step S10～S13 once more at every turn obtained the positional information of the nude film D1 of qualified product from the whole image of wafer W1.Then, position-based information drives transfer 13 to the nude film D1 of the qualified product of obtaining once more, and the nude film D1 that takes out qualified product from wafer W1 is installed on substrate B1.
On the other hand, among the step S15, not under the situation of specified quantity in the taking-up of nude film D1, judge whether the taking-up of nude film D1 finishes (S16).And till finishing to the taking-up of nude film D1, based on the positional information of the nude film D1 of qualified product, the nude film D1 that takes out qualified product is installed on substrate B1.
Describe in the face of effect down.According to first execution mode, from the image of wafer W1 integral body, obtain the positional information of the nude film D1 of qualified product.Therefore, needn't resemble and each nude film D1 is taken present.Therefore, the set-up time in the time of can shortening the nude film D1 that takes out qualified product from wafer W1 and be installed on substrate B1.
According to first execution mode, wafer W1 has and is used to differentiate the whether qualified bad sheet mark of each nude film.From the image of wafer W1 integral body, obtain the whether qualified information of each nude film D1 based on bad sheet mark.And, obtain the positional information of the nude film D1 of qualified product the whether qualified information of each the nude film D1 that obtains from the positional information of each nude film D1 with based on bad sheet mark.Therefore, can obtain the positional information of the nude film D1 of qualified product reliably.
According to first execution mode, after the nude film D1 that takes out specified quantity is installed on the substrate B1, from the image of wafer W1 integral body, obtain the positional information of the nude film D1 of qualified product once more.Therefore, when taking out nude film D1 from wafer W1, even there is the situation of offset of other nude film D1, the nude film D1 that also can take out qualified product reliably is installed on the substrate B1.
According to first execution mode, wafer filming apparatus 10 is large-field shooting machines that wafer W1 integral body is taken in the lump.Therefore, can take wafer W1 integral body reliably.
In addition, enumerated the positional information that from the whole image of wafer W1, obtains the nude film D1 of qualified product in the first embodiment, based on this information the nude film of qualified product has been installed on the example on the substrate, but is not limited thereto.
As shown in Figure 4, also can increase nude film filming apparatus 15 (nude film shooting unit), image processing apparatus 16 (defective judging unit).Nude film filming apparatus 15 is to constitute with transfer 13 one, and W1 relatively moves with respect to wafer, and the device taken of the image of the nude film D1 of the qualified product that will take out transfer 13.Image processing apparatus 16 is devices that have or not of judging defective according to the image of the nude film D1 of the qualified product that will take out that utilize nude film filming apparatus 15 to take.The nude film D1 of the qualified product that a transfer drive division 14 position-based information obtain to operational part 12 drives transfer 13; In the time will taking out the nude film D1 of qualified product from wafer W1; Based on the judged result of image processing apparatus 16, taking out does not have the nude film D1 of defective to be installed on the substrate B1.
When the conveying of wafer W1, reaching, there is the situation of the nude film D1 generation defective that originally is qualified product from wafer W1 taking-up nude film D1.But, judge having or not of defective according to the image of the nude film D1 of the qualified product that will take out.And, based on judged result, under flawless situation, take out this nude film D1 and be installed on the substrate B1.The nude film D1 that therefore, can only take out flawless qualified product reliably is installed on the substrate B1.In addition, operational part 12 also can be judged having or not of defective according to the image of the nude film D1 of the qualified product that will take out that utilize nude film filming apparatus 15 to take.
In addition, having enumerated wafer filming apparatus 10 in the first embodiment is examples of large-field shooting machine, but is not limited thereto.Wafer filming apparatus 10 is as shown in Figure 5, also can be through wafer W1 is slided, the row scanning camera 100 that relatively moves wafer W1 integral body is taken with respect to wafer W1.Equally also can take wafer W1 integral body reliably under this situation.And, during from charging tray taking-up wafer, can take wafer W1 integral body simultaneously.Therefore, the activity duration can be shortened.
In addition, enumerated the each several part load in first execution mode and handled the example that moves, but be not limited thereto.Operational part 12 also can be handled together step S11 shown in Figure 3～step S13 and step S15, S16.
(second execution mode)
Below, the electronic component mounting equipment of second execution mode is described.The electronic component mounting equipment of first execution mode is obtained the whether qualified information of each nude film based on bad sheet mark; Relative with it, the electronic component mounting equipment of second execution mode is a device of storing the whether qualified information of each nude film of obtaining through the precheck wafer.
At first, with reference to Fig. 6 the formation of the electronic component mounting equipment of second execution mode is described.At this, Fig. 6 is the block diagram of the electronic component mounting equipment in second execution mode.
As shown in Figure 6, electronic component mounting equipment 2 possesses wafer filming apparatus 20 (wafer shooting unit), image processing apparatus 21 (positional information obtains the unit, whether qualified information obtains the unit), storage part 22 (whether qualified information memory cell), operational part 23 (the qualified product positional information obtains the unit), transfer 24 (installation unit), a transfer drive division 25 (installation unit).A wafer filming apparatus 20, transfer 24 and a transfer drive division 25 are formations identical with the wafer filming apparatus 10 of first execution mode, transfer 13 and a transfer drive division 14.At this, a plurality of nude film D2 that wafer W2 will form semiconductor chip (electronic component) are arranged on the wafer board and constitute.But, different with the wafer W1 of first execution mode, there is not the additional mark of judging that whether qualified nude film D2 is of being used to.
Below, with reference to Fig. 7 the action of electronic component mounting equipment is described.At this, Fig. 7 is the flow chart of action that is used for explaining the electronic component mounting equipment of second execution mode.
Begin when substrate B2 installs nude film D2 in indication, as shown in Figure 7, utilize the whole image of 20 couples of wafer W2 of wafer filming apparatus to take (S20).And image processing apparatus 21 is obtained the positional information (S21, positional information obtains operation) of each nude film D2 from the whole image of the wafer W that utilizes wafer filming apparatus 20 and take.Specifically, obtain positional information with respect to mechanical origin.
Afterwards, obtain the positional information (S22, the qualified product positional information obtains operation) of the nude film D2 of qualified product the whether qualified information of the positional information of each nude film D2 of obtaining from image processing apparatus 21 of operational part 23 and each the nude film D2 that is stored in storage part 22.And the nude film D2 of the qualified product that a transfer drive division 25 position-based information obtain to operational part 23 drives transfer 24, and the nude film D2 that takes out qualified product from wafer W2 is installed on substrate B2 (S23, installation procedure).
Afterwards, a transfer drive division 25 judges whether the taking-up quantity of nude film D2 is specified quantity (S24).
In step S24, when the taking-up quantity of nude film D2 reached specified quantity, implementation step S20～S22 once more at every turn obtained the positional information of the nude film D2 of qualified product from the whole image of wafer W2.And position-based information drives transfer 24 to the nude film D2 of the qualified product of obtaining once more, and the nude film D2 that takes out qualified product from wafer W2 is installed on the substrate B2.
On the other hand, in step S24, not under the situation of specified quantity in the taking-up of nude film D2, judge whether the taking-up of nude film D2 finishes (S25).And till finishing to the taking-up of nude film D2, the nude film D2 that takes out qualified product based on the positional information of the nude film D2 of qualified product is installed on the substrate B2.
Below, effect is described.According to second execution mode, the whether qualified information that storage part 22 is stored each the nude film D2 that obtains through precheck wafer W2.And, from the whether qualified information of the positional information of each nude film D2 and each nude film D2, obtain the positional information of the nude film D2 of qualified product.Therefore, can obtain the positional information of the nude film D2 of qualified product reliably.
In addition, enumerated the positional information that from the whole image of wafer W2, obtains the nude film D2 of qualified product in second execution mode, based on this information the nude film of qualified product has been installed on the example on the substrate, but is not limited thereto.
As shown in Figure 8, also can increase nude film filming apparatus 26 (nude film shooting unit), image processing apparatus 27 (defective judging unit).Nude film filming apparatus 26 is to constitute with transfer 24 one, the device that the image of the nude film D2 of the qualified product that relatively move, will take out transfer 24 with respect to wafer W2 is taken.Image processing apparatus 27 is devices that have or not of judging defective according to the image of the nude film D2 of the qualified product that will take out that utilize nude film filming apparatus 26 to take.The nude film D2 of the qualified product that a transfer drive division 25 is obtained to operational part 23 in position-based information drives transfer 24; Will be when wafer W2 takes out the nude film D2 of qualified product; Based on the judged result of image processing apparatus 27, take out flawless nude film D2 and be installed on substrate B2.
When the conveying of wafer W2, reaching, there is the situation of the nude film D2 generation defective that originally is qualified product from wafer W2 taking-up nude film D2.But, judge having or not of defective according to the image of the nude film D2 of the qualified product that will take out.And, based on judged result, be installed on the substrate B2 at this nude film of taking-up D2 under the flawless situation.The nude film D2 that therefore, can only take out flawless qualified product reliably is installed on the substrate B2.In addition, operational part 23 also can be judged having or not of defective according to the image of the nude film D2 of the qualified product that will take out that utilize nude film filming apparatus 26 to take.
In addition, in second execution mode, enumerated the each several part load and handled the example that moves, but be not limited thereto.Operational part 23 also can be handled together step S21 shown in Figure 7, S22, S24, S25.
(the 3rd execution mode)
Below, the electronic component mounting equipment of the 3rd execution mode is described.When the electronic component mounting equipment of first execution mode reaches the quantity of regulation in the taking-up quantity of nude film; From the image of wafer integral body, obtain the positional information of the nude film of qualified product once more; Relative with it, the electronic component mounting equipment of the 3rd execution mode is according to the positional information of the nude film of the image correction qualified product of nude film.
At first, with reference to Fig. 9 the formation of the electronic component mounting equipment of the 3rd execution mode is described.At this, Fig. 9 is the block diagram of the electronic component mounting equipment in the 3rd execution mode.
As shown in Figure 9, electronic component mounting equipment 3 possesses wafer filming apparatus 30 (wafer shooting unit), image processing apparatus 31 (positional information obtains the unit, whether qualified information obtains the unit), nude film filming apparatus 32 (nude film shooting unit), image processing apparatus 33 (revise and obtain the unit with positional information), operational part 34 (the qualified product positional information obtains the unit), transfer 35 (installation unit), a transfer drive division 36 (installation unit).A wafer filming apparatus 10 of a wafer filming apparatus 30, image processing apparatus 31, transfer 35 and a transfer drive division 36 and first execution mode, image processing apparatus 11, transfer 13 and a transfer drive division 14 are identical formation.At this, wafer W3 is the same with first execution mode, and bad sheet mark only is attached on the nude film D3 of defective item.
Nude film filming apparatus 32 is after the nude film D3 that takes out specified quantity from wafer W3 is installed on the substrate B3, the device that the image of the nude film D3 of the qualified product that relatively move, will take out transfer 35 with respect to wafer W3 is taken.
Image processing apparatus 33 is devices of from the image of the nude film D3 that utilizes 32 shootings of nude film filming apparatus, obtaining the positional information of the nude film D3 that is used to revise.
Operational part 34 is to have the function same with the operational part of first execution mode 12, and based on the positional information of the nude film D3 that is used to revise that utilizes image processing apparatus 33 to obtain, revises the parts of positional information of the nude film D3 of qualified product.
Below, with reference to Figure 10 and Figure 11 the action of electronic component mounting equipment is described.At this, Figure 10 is the flow chart of action that is used for explaining the electronic component mounting equipment of the 3rd execution mode.Figure 11 is other flow chart of action that is used for explaining the electronic component mounting equipment of the 3rd execution mode.
Step S30～step S34 is identical with step S10～step S14 in first execution mode.
A transfer drive division 36 judges whether the taking-up quantity of nude film D3 is specified quantity (S35).
In step S35, when the taking-up quantity of nude film D3 reaches specified quantity, utilize the image of 32 pairs of nude films that will take out of nude film filming apparatus to take (S36).And image processing apparatus 33 is obtained the nude film positional information (S37) that is used to revise from the image of the nude film D3 that utilizes nude film filming apparatus 32 and take.Specifically, obtain positional information with respect to mechanical origin.In addition, operational part 34 is revised the positional information (S38) of the nude film D3 of the qualified product of obtaining at step S33 based on the positional information of the nude film D3 that is used to revise.
And a transfer drive division 36 drives transfer 35 based on the positional information of the nude film D3 that revises good qualified product, and the D3 that takes out qualified product from wafer W3 is installed on the substrate B3.
On the other hand, in step S35, not under the situation of specified quantity in the taking-up of nude film D3, judge whether the taking-up of nude film D3 finishes (S39).And till finishing to the taking-up of nude film D3, the nude film D3 that takes out qualified product based on the positional information of the nude film D3 of qualified product is installed on the substrate B3.
Below, effect is described.According to the 3rd execution mode, after the nude film D3 that takes out specified quantity is installed on the substrate B3, from the image of nude film D3, obtain the positional information of the nude film D3 that is used to revise.And, based on the positional information of the nude film D3 that is used to revise, revise the positional information of the nude film D3 of qualified product.Therefore when wafer W3 takes out nude film D3, even there is the situation of offset of other nude film D3, the nude film D3 that also can take out qualified product reliably is installed on the substrate B3.
In addition, in the 3rd execution mode, enumerated the each several part load and handled the example that moves, but be not limited thereto.Operational part 34 also can be handled together step S31 shown in Figure 10～step S33, step S35 and step S37～step S39.
(the 4th execution mode)
Below, the electronic component mounting equipment of the 3rd execution mode is described.
At first, with reference to Figure 12 the formation of the electronic component mounting equipment of the 4th execution mode is described.At this, Figure 12 is the block diagram of the electronic component mounting equipment in the 4th execution mode.
Shown in figure 12, electronic component mounting equipment 4 has nude film filming apparatus 40, image processing apparatus 41, storage part 42, operational part 43, a transfer 44a, 44b, drive division 45.
Nude film filming apparatus 40 is to constitute with a transfer 44a, 44b one, the device that relatively moves, the image of nude film D4 is taken with respect to wafer W4.
A transfer 44a, 44b constitute with nude film filming apparatus 40 one, relatively move, take out nude film D4 with respect to wafer W4 and be installed on the device on the substrate B4.
Below, with reference to Figure 13～Figure 15 the action of electronic component mounting equipment is described.At this, Figure 13 is the key diagram that is used for explaining the action of the normal mode in the electronic component mounting equipment of the 4th execution mode.Figure 14 is the key diagram that is used for explaining the action of the fast mode A in the electronic component mounting equipment of the 4th execution mode.Figure 15 is the key diagram that is used for explaining the action of the fast mode B in the electronic component mounting equipment of the 4th execution mode.
For the action of electronic component mounting equipment, have mode standard, fast mode A and three kinds of patterns of fast mode B.These patterns are through manual switchover.
At first, mode standard is described.Shown in Figure 13 (a), utilize 40 couples of nude film D40 of nude film filming apparatus to take.Image processing apparatus 41 is obtained the positional information of nude film D40 from the image of the nude film D40 of shooting.Afterwards, shown in Figure 13 (b),, transfer nozzle 44a is moved, utilize transfer nozzle 44a absorption nude film D40 based on the positional information of the nude film D40 that obtains.In addition, shown in Figure 13 (c), utilize 40 couples of nude film D41 of nude film filming apparatus to take.Image processing apparatus 41 is obtained the positional information of nude film D41 from the image of the nude film D41 of shooting.Afterwards, shown in Figure 13 (d), transfer nozzle 44b is moved, utilize transfer nozzle 44b absorption nude film D41 based on the positional information of the nude film D41 that obtains.And, respectively nude film D40, D41 are installed on substrate.
Below, A describes to fast mode.Shown in Figure 14 (a), utilize 40 couples of nude film D40 of nude film filming apparatus to take.Image processing apparatus 41 is obtained the positional information of nude film D40 from the image of the nude film D40 of shooting.In addition, shown in Figure 14 (b), utilize 40 couples of nude film D41 of nude film filming apparatus to take.Image processing apparatus 41 is obtained the positional information of nude film D41 from the image of the nude film D41 of shooting.Afterwards, shown in Figure 14 (c), transfer nozzle 44a is moved, utilize transfer nozzle 44a absorption nude film D40 based on the positional information of the nude film D40 that obtains.In addition, shown in Figure 14 (d), transfer nozzle 44b is moved, utilize transfer nozzle 44b absorption nude film D41 based on the positional information of the nude film D41 that obtains.And, respectively nude film D40, D41 are installed on substrate.
Below, B describes to fast mode.Shown in Figure 15 (a), utilize 40 couples of nude film D40 of nude film filming apparatus to take.Image processing apparatus 41 is obtained the positional information of nude film D40 from the image of the nude film D40 of shooting.The positional information correction Image Data of the nude film D40 that operational part 43 is obtained based on image processing apparatus 41 are obtained the positional information of nude film D41.Afterwards, shown in Figure 15 (b), transfer nozzle 44a is moved, utilize transfer nozzle 44a absorption nude film D40 based on the positional information of the nude film D40 that obtains.In addition, shown in Figure 15 (c),, transfer nozzle 44b is moved, utilize transfer nozzle 44b absorption nude film D41 based on the positional information of the nude film D41 that obtains.And, respectively nude film D40, D41 are installed on the substrate.
Below, effect is described.According to the 4th execution mode,, can reduce the shooting number of times through switching to fast mode B.Therefore, can shorten the nude film D4 that takes out qualified product from wafer W4 and be installed on the set-up time of substrate B4 when going up.
In addition, in the 4th execution mode, enumerated the example that possesses two transfer nozzles, but be not limited thereto.Also can possess more than three.Through moving, can access same effect with fast mode B.
Claims (12)
1. electronic component mounting equipment, the nude film that from the wafer that is made up of a plurality of nude films that are formed with electronic component, takes out qualified product is installed on the substrate, it is characterized in that having:
Wafer is taken the unit, and it is taken said wafer integral body;
Positional information obtains the unit, and it takes the positional information that obtains each nude film the whole image of the said wafer of unit photographs from utilizing said wafer;
The qualified product positional information obtains the unit, and it obtains the positional information of said each nude film of obtaining the unit and the whether qualified information of each nude film according to said positional information, obtains the positional information of the nude film of qualified product;
Installation unit, it obtains the positional information of the nude film of the said qualified product of obtaining the unit based on said qualified product positional information, takes out the nude film of said qualified product and is installed on the said substrate from said wafer.
2. electronic component mounting equipment as claimed in claim 1 is characterized in that,
Said wafer has and is used to differentiate whether qualified whether qualified of each nude film and differentiates mark,
And have whether qualified information and obtain the unit, it is taken the whole image of the said wafer of unit photographs from utilizing said wafer, differentiates mark based on said whether qualified, obtains the whether qualified information of said each nude film,
Said qualified product positional information obtains the unit and obtains the positional information that obtains the nude film of said qualified product the positional information of said each nude film of obtaining the unit and the whether qualified information that said whether qualified information obtains said each nude film of obtaining the unit from said positional information.
3. electronic component mounting equipment as claimed in claim 1 is characterized in that,
Have whether qualified information memory cell, it stores the whether qualified information of said each nude film of obtaining through the said wafer of precheck,
Said qualified product positional information obtains the nude film of said qualified product is obtained in the unit from said positional information obtains the whether qualified information of said each nude film of positional information and said whether qualified information memory cell storage of said each nude film of obtaining the unit positional information.
4. like each described electronic component mounting equipment in the claim 1～3, it is characterized in that,
Said wafer is taken the unit after the nude film that takes out specified quantity from said wafer is installed on the said substrate, once more said wafer integral body taken,
Said positional information obtains the unit and takes the positional information that obtains said each nude film the image of the said wafer integral body of taking once more the unit once more from utilizing said wafer; Said qualified product positional information obtains the unit is obtained the nude film of said qualified product once more from said positional information obtains the whether qualified information of positional information and said each nude film of said each nude film of obtaining once more the unit positional information
Said installation unit is obtained the positional information of the nude film of the said qualified product of obtaining once more the unit based on said qualified product positional information, and the nude film that takes out said qualified product from said wafer is installed on the said substrate.
5. like each described electronic component mounting equipment in the claim 1～3, it is characterized in that having:
Nude film is taken the unit, and after taking out the nude film of specified quantity from said wafer and being installed on the said substrate, said relatively wafer relatively moves and the image of nude film is taken;
Correction obtains the unit with positional information, and it takes the positional information that obtains the nude film that is used to revise the image of nude film of unit photographs from utilizing said nude film,
Said qualified product positional information obtains the unit and obtains the positional information of the nude film of obtaining the unit that is used for said correction based on said correction with positional information, and the positional information of the nude film of said qualified product is revised.
6. like each described electronic component mounting equipment in the claim 1～4, it is characterized in that having:
Nude film is taken the unit, and it relatively moves with respect to said wafer, and the image of the nude film of the qualified product that will take out said installation unit is taken;
The defective judging unit, its image according to the nude film of the said qualified product that will take out that utilize said nude film shooting unit photographs is judged having or not of defective,
Said installation unit is based on the judged result of said defective judging unit, and taking out from said wafer does not have the nude film of defective and be installed on the said substrate.
7. like each described electronic component mounting equipment in the claim 1～6, it is characterized in that,
Said wafer is taken the large-field shooting machine of unit for said wafer integral body is taken in the lump.
8. like each described electronic component mounting equipment in the claim 1～6, it is characterized in that,
Said wafer is taken the row scanning camera of unit for relatively moving with respect to said wafer and said wafer integral body being taken.
9. electronic component mounting method takes out the nude film of qualified product and is installed on the substrate from the wafer that is made up of a plurality of nude films that are formed with electronic component, it is characterized in that possessing:
Positional information obtains operation, from the image of said wafer integral body, obtains the positional information of each nude film;
The qualified product positional information obtains operation, from the whether qualified information of the positional information that obtains said each nude film of obtaining the operation in said positional information and each nude film, obtains the positional information of the nude film of qualified product;
Installation procedure is based on the positional information that said qualified product positional information obtains the nude film of the said qualified product of obtaining in the operation and takes out the nude film of said qualified product and be installed on the said substrate from said wafer.
10. electronic component mounting method as claimed in claim 9 is characterized in that,
Have whether qualified information and obtain operation, be based upon differentiate each nude film whether qualified and be provided with whether qualifiedly differentiate mark, from the whole image of said wafer, obtain the whether qualified information of said each nude film,
Said qualified product positional information obtains operation and obtains the positional information of the nude film of said qualified product from the positional information that obtains said each nude film of obtaining the operation in said positional information with in the whether qualified information that said whether qualified information obtains said each nude film of obtaining in the operation.
11. electronic component mounting method as claimed in claim 9 is characterized in that,
Said qualified product positional information obtains operation obtains the nude film of said qualified product from the whether qualified information that obtains the positional information of said each nude film of obtaining the operation and said each nude film that said wafer is obtained through precheck in said positional information positional information.
12. like each described electronic component mounting method in the claim 9～11, it is characterized in that,
Said positional information obtains operation from obtaining the positional information of said each nude film once more at the nude film that from said wafer, takes out specified quantity and in the whole image of the said wafer of taking once more after being installed in said substrate,
Said qualified product positional information obtains operation obtains the nude film of said qualified product once more from the whether qualified information of the positional information that obtains said each nude film of obtaining once more the operation in said positional information and said each nude film positional information,
Said installation procedure is based on the positional information that said qualified product positional information obtains the nude film of the said qualified product of obtaining once more in the operation, from said wafer, takes out the nude film of said qualified product and is installed on the said substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610483290.9A CN106098567B (en) | 2011-03-09 | 2012-03-08 | Electronic component mounting equipment |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011051080A JP5721476B2 (en) | 2011-03-09 | 2011-03-09 | Electronic component mounting apparatus and electronic component mounting method |
| JP2011-051080 | 2011-03-09 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610483290.9A Division CN106098567B (en) | 2011-03-09 | 2012-03-08 | Electronic component mounting equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102683225A true CN102683225A (en) | 2012-09-19 |
| CN102683225B CN102683225B (en) | 2016-12-07 |
Family
ID=46814956
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610483290.9A Active CN106098567B (en) | 2011-03-09 | 2012-03-08 | Electronic component mounting equipment |
| CN201210059432.0A Active CN102683225B (en) | 2011-03-09 | 2012-03-08 | Electronic component mounting equipment and electronic component mounting method |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610483290.9A Active CN106098567B (en) | 2011-03-09 | 2012-03-08 | Electronic component mounting equipment |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP5721476B2 (en) |
| CN (2) | CN106098567B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104871659A (en) * | 2012-12-20 | 2015-08-26 | 富士机械制造株式会社 | Die supply device |
| CN115642098A (en) * | 2022-09-14 | 2023-01-24 | 深圳源明杰科技股份有限公司 | Chip mounting and positioning method, device and equipment and readable storage medium |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5614825B1 (en) * | 2013-11-29 | 2014-10-29 | 上野精機株式会社 | Classification device, classification method, and classification program |
| KR101496059B1 (en) | 2013-12-27 | 2015-02-25 | 세메스 주식회사 | Method of obtaining location information of dies |
| WO2016181437A1 (en) * | 2015-05-08 | 2016-11-17 | 富士機械製造株式会社 | Component mounting machine, and component supply method for component mounting machine |
| CN114798479A (en) * | 2022-03-09 | 2022-07-29 | 深圳宏芯宇电子股份有限公司 | Bare chip screening method, device, equipment and storage medium |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5946409A (en) * | 1995-05-31 | 1999-08-31 | Nec Corporation | Pick-up apparatus and method for semiconductor devices |
| JP2000294612A (en) * | 1999-04-06 | 2000-10-20 | Komatsu Ltd | Method and device for creating chip layout |
| CN1537321A (en) * | 2001-08-08 | 2004-10-13 | ���µ�����ҵ��ʽ���� | Apparatus and method for mounting electronic parts |
| JP2005032827A (en) * | 2003-07-08 | 2005-02-03 | Sharp Corp | Pickup method and pickup equipment of semiconductor chip |
| JP2006332417A (en) * | 2005-05-27 | 2006-12-07 | Matsushita Electric Ind Co Ltd | Pickup device and pickup method for chip |
| CN101364530A (en) * | 2007-08-10 | 2009-02-11 | Juki株式会社 | Electronic component mounting method and device |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3418929B2 (en) * | 1995-05-31 | 2003-06-23 | エヌイーシーマシナリー株式会社 | Pickup device and chip positioning method |
| JPH09283983A (en) * | 1996-04-10 | 1997-10-31 | Matsushita Electric Ind Co Ltd | Method and apparatus for picking-up semiconductor chip |
| JP3300264B2 (en) * | 1997-10-09 | 2002-07-08 | シャープ株式会社 | Semiconductor chip recognition method |
| JP2001250834A (en) * | 2000-03-06 | 2001-09-14 | Hitachi Ltd | Method of manufacturing semiconductor device |
| JP4828356B2 (en) * | 2006-08-29 | 2011-11-30 | ヤマハ発動機株式会社 | Electronic component take-out apparatus, surface mounter, and electronic component take-out method |
-
2011
- 2011-03-09 JP JP2011051080A patent/JP5721476B2/en active Active
-
2012
- 2012-03-08 CN CN201610483290.9A patent/CN106098567B/en active Active
- 2012-03-08 CN CN201210059432.0A patent/CN102683225B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5946409A (en) * | 1995-05-31 | 1999-08-31 | Nec Corporation | Pick-up apparatus and method for semiconductor devices |
| JP2000294612A (en) * | 1999-04-06 | 2000-10-20 | Komatsu Ltd | Method and device for creating chip layout |
| CN1537321A (en) * | 2001-08-08 | 2004-10-13 | ���µ�����ҵ��ʽ���� | Apparatus and method for mounting electronic parts |
| JP2005032827A (en) * | 2003-07-08 | 2005-02-03 | Sharp Corp | Pickup method and pickup equipment of semiconductor chip |
| JP2006332417A (en) * | 2005-05-27 | 2006-12-07 | Matsushita Electric Ind Co Ltd | Pickup device and pickup method for chip |
| CN101364530A (en) * | 2007-08-10 | 2009-02-11 | Juki株式会社 | Electronic component mounting method and device |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104871659A (en) * | 2012-12-20 | 2015-08-26 | 富士机械制造株式会社 | Die supply device |
| CN104871659B (en) * | 2012-12-20 | 2017-10-03 | 富士机械制造株式会社 | Nude film feedway |
| CN115642098A (en) * | 2022-09-14 | 2023-01-24 | 深圳源明杰科技股份有限公司 | Chip mounting and positioning method, device and equipment and readable storage medium |
| CN115642098B (en) * | 2022-09-14 | 2023-12-26 | 深圳源明杰科技股份有限公司 | Chip mounting and positioning method, device, equipment and readable storage medium |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102683225B (en) | 2016-12-07 |
| CN106098567A (en) | 2016-11-09 |
| JP2012190879A (en) | 2012-10-04 |
| CN106098567B (en) | 2018-11-02 |
| JP5721476B2 (en) | 2015-05-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102683225A (en) | Electronic component installing device and electronic component installing method | |
| JP3584845B2 (en) | Test device and test method for IC device | |
| CN107409486B (en) | Method and apparatus for optimizing component type arrangement | |
| CN101317502A (en) | Working device and working method for circuit board | |
| JP6037580B2 (en) | Component mounter | |
| CN104205289A (en) | Wafer map management device and die mounting method of die mounting system | |
| JP6374189B2 (en) | Die bonder and bonding method | |
| CN103582410A (en) | Element installing system, element installing device and element testing device | |
| WO2018073936A1 (en) | Production management device | |
| CN101668415B (en) | Component installation method and component installation system | |
| CN100506007C (en) | Electronic component mounting apparatus | |
| JPWO2014073088A1 (en) | Production monitoring system and production monitoring method for component mounting line | |
| JP7402362B2 (en) | parts mounting machine | |
| JP2010021455A (en) | Parts mounting system | |
| CN103766016A (en) | Electronic component mounting device and electronic component mounting method | |
| JP6904978B2 (en) | Parts mounting machine | |
| JP5815421B2 (en) | Component mounting apparatus, component mounting method, control program for component mounting apparatus, recording medium | |
| CN107079620A (en) | Fitting machine and used fitting machine electronic component absorption posture inspection method | |
| JP5753021B2 (en) | Board surface mounting line and bad mark detection method in board surface mounting line | |
| CN103299725A (en) | Method and apparatus for applying fluid during a placement cycle | |
| US20070109010A1 (en) | Electronic component testing apparatus and method for electronic component testing | |
| EP3594996B1 (en) | Component mounting machine | |
| JP7229416B2 (en) | Parts mounting machine | |
| CN104871659A (en) | Die supply device | |
| WO2024023926A1 (en) | Surface mounter and surface mounting method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Aichi Japan vertical city Patentee after: Fuji Corporation Address before: Aichi Japan vertical city Patentee before: Fuji Machinery Manufacturing Co., Ltd. |