JP6904978B2 - Parts mounting machine - Google Patents

Description

The present invention relates to a component mounting machine.

The component mounting machine executes a mounting process for mounting electronic components on a circuit board. A plurality of component mounting machines are installed in the transport direction of the circuit board to form a production line for producing board products. On the production line, for example, as shown in Patent Document 1, an inspection device for inspecting the quality of the solder printing process and the quality of the mounting process may be arranged between the component mounting machines. Further, in the case of inspecting the mounting state of each component, for example, as shown in Patent Document 2, it is possible to execute a partial visual inspection in the component mounting machine by diverting the substrate camera.

Japanese Unexamined Patent Publication No. 2016-046487 International Publication No. 2016/1101717

Production lines such as those described above are required to improve productivity per installation area. In addition, the production line is required to improve the efficiency of production processing including mounting processing and inspection processing.
An object of the present specification is to provide a component mounting machine capable of shortening a production line, improving productivity per installation area, and improving the efficiency of production processing.

This specification is a component mounting machine that mounts electronic components on a circuit board and is installed in a plurality of directions in the transport direction of the circuit board to form a production line for producing a board product. The circuit board is carried into the machine. The board transfer device to be carried out of the machine, the component supply device for supplying the electronic component at the component supply position, and the electronic component supplied by the component supply device are collected and placed at a predetermined mounting position of the circuit board. A mounting head to be mounted, an inspection camera provided integrally with the mounting head and capable of capturing an image of the upper surface of the circuit board, and a mounting step of moving the mounting head to mount the electronic component on the circuit board. It is provided with an inspection step of inspecting the appearance of the circuit board using the inspection camera, and a control device for executing a carry-out step of carrying out the circuit board to the downstream side of the production line using the board transfer device. In the inspection step, a camera movement for moving the inspection camera from the current position to an inspection position where the inspection target on the circuit board can be imaged, and an imaging process for acquiring image data by imaging the inspection camera at the inspection position. And the visual inspection for inspecting the appearance quality of the circuit board based on the acquired image data, and the control device includes the visual inspection performed before the execution of the mounting step. The inspection step and the second inspection step including the visual inspection executed after the execution of the mounting step are executed, and the control device is performed in parallel with the visual inspection of the first inspection step. Then, when the mounting head is moved from the current position to the component supply position and the inspection result in the first inspection step is defective and the defect can be repaired, the defect is used. When the inspection result in the first inspection step is good, the acquisition of the electronic component by the mounting head as the mounting step is started, and the control device performs the second inspection. in parallel to the appearance inspection step executes the unloading step, after the inspection process of the second of the inspection process is completed, the downstream side of the production device of the host computer managing the production line or the production line, against, and notifies the result of the visual inspection, discloses a parts products placement machine.

According to the configuration of the first component mounting machine and the second component mounting machine, the quality of the production process (solder printing process, mounting process, etc.) executed on the upstream side of the production line in the component mounting machine is inspected. be able to. As a result, the production line can be shortened and the productivity per installation area can be improved as compared with the configuration in which a dedicated inspection device is installed on the production line. Further, in the first component mounting machine, at least a part of at least two processes of the loading process, the inspection process, and the mounting process is executed in parallel, so that the time required for the production process is shortened and the efficiency of the production process is improved. Can be planned. Further, in the second component mounting machine, since the unloading process is executed in parallel with the visual inspection of the inspection process, the time required for the production process can be shortened and the efficiency of the production process can be improved.

It is a top view which shows the whole of the component mounting machine in an embodiment. It is a side view which shows through the inspection camera in the mounting head. It is a block diagram which shows the control device of a component mounting machine. It is a flowchart which shows the 1st aspect of a production process. It is a timing diagram which shows the relationship between each process and time in the 1st aspect of a production process by comparing the normal aspect and the 1st aspect. It is a flowchart which shows the 2nd aspect of a production process. It is a timing diagram which shows the relationship between each process and time in the 2nd aspect of a production process by comparing the normal aspect and the 2nd aspect. It is a flowchart which shows the 3rd mode of a production process. It is a timing diagram which shows the relationship between each process and time in the 3rd aspect of a production process by comparing the normal aspect and the 3rd aspect. It is a timing diagram which shows the relationship between each inspection cycle and time in an inspection process by comparing a normal mode and an efficiency mode.

(1. Embodiment)
(1-1. Configuration of parts mounting machine 1)
The component mounting machine 1 is a production device that mounts electronic components on a circuit board 90 to produce a board product. Hereinafter, the "circuit board" is simply referred to as a "board", and the electronic component is simply referred to as a "component". As shown in FIG. 1, a plurality of component mounting machines 1 are arranged side by side in, for example, in the transport direction of the substrate 90 (left-right direction in FIG. 1) to form a production line for producing substrate products. The above production line may include, for example, a screen printing machine, a mounting inspection machine, a reflow furnace, and the like.

The component mounting machine 1 includes a board transfer device 10, a component supply device 20, a component transfer device 30, a component camera 41, a board camera 42, an inspection camera 50, and a control device 70. In the following description, the horizontal width direction of the component mounting machine 1 (horizontal direction in FIG. 1) is the X-axis direction, the horizontal depth direction of the component mounting machine 1 (vertical direction in FIG. 1) is the Y-axis direction, and the X-axis and The vertical direction perpendicular to the Y-axis (front-back direction in FIG. 1) is defined as the Z-axis direction.

The substrate transfer device 10 is composed of a belt conveyor or the like, and sequentially conveys the substrate 90 in the transfer direction (in the present embodiment, the X-axis direction). The board transfer device 10 carries the board into the machine of the component mounting machine 1 and positions the board 90 at a predetermined position in the machine to put it in a clamped state. Then, after the mounting of the components by the component mounting machine 1 is completed, the board transfer device 10 releases the clamp state and carries the board 90 out of the component mounting machine 1.

The component supply device 20 supplies components to be mounted on the substrate 90. The component supply device 20 has a plurality of slots 21 arranged side by side in the X-axis direction. The feeders 22 are interchangeably set in the plurality of slots 21. The feeder 22 feeds and moves a carrier tape that stores a large number of parts, and supplies the parts so that the parts can be collected at a supply position located on the tip side of the feeder 22.

The component transfer device 30 includes a head drive device 31, a moving table 32, and a mounting head 33. The head drive device 31 is configured so that the moving table 32 can be moved in the X-axis direction and the Y-axis direction by a linear motion mechanism. The mounting head 33 collects the components supplied by the component supply device 20 and mounts them at a predetermined mounting position on the substrate 90. The mounting head 33 is fixed to the moving table 32 by a clamp member (not shown).

Further, as shown in FIG. 2, the mounting head 33 has one or a plurality of suction nozzles 34 that are detachably provided (in the present embodiment, it has one suction nozzle 34). The mounting head 33 supports the suction nozzle 34 so as to be rotatable and ascending / descending around the R axis parallel to the Z axis. The suction nozzle 34 controls the elevating position and angle with respect to the mounting head 33, and the supply state of negative pressure. By supplying negative pressure, the suction nozzle 34 sucks the parts supplied by the feeder 22 of the parts supply device 20.

The component camera 41, the substrate camera 42, and the inspection camera 50 are digital image pickup devices having an image pickup element such as a CCD (Charge Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor). The component camera 41, the board camera 42, and the inspection camera 50 take an image in a range within the camera field of view based on a control signal by the control device 70 connected communicably, and the image data acquired by the image pickup is obtained by the control device 70. Send to.

The component camera 41 is fixed to the base of the component mounting machine 1 so that the optical axis faces upward in the vertical direction (Z-axis direction). The component camera 41 is configured to be able to image a component held by the suction nozzle 34 of the mounting head 33 from below the component transfer device 30. The substrate camera 42 is provided on the moving table 32 of the component transfer device 30 so that the optical axis faces downward in the vertical direction (Z-axis direction). The substrate camera 42 is configured so that the substrate 90 can be imaged.

The substrate camera 42 is mainly used for reading a reference mark attached to the substrate 90 in order to accurately recognize the position of the substrate 90 positioned by the substrate transport device 10. Therefore, the substrate camera 42 generally includes an optical unit that forms a camera field of view of several mm square in which the reference mark fits, and an image sensor set to a resolution sufficient to recognize the outer shape of the reference mark. As the image sensor of the substrate camera 42, a monochrome image sensor that does not include color information in the image data is adopted from the above-mentioned applications and from the viewpoint of reducing the size of the image data.

Like the substrate camera 42, the inspection camera 50 is a camera that is integrally provided with the mounting head 33 and can image the upper surface of the substrate 90. In the present embodiment, as shown in FIG. 2, the inspection camera 50 is arranged inside the mounting head 33, and is configured to be detachably attached to the moving table 32 together with the mounting head 33. The inspection camera 50 is used for visual inspection of the substrate 90 in the inspection process executed by the component mounting machine 1. The inspection camera 50 includes an optical unit 51 and an image sensor 52.

The optical unit 51 of the inspection camera 50 forms a camera field of view that accommodates the work area of the substrate 90 that has been subjected to the production process for producing the substrate product in one imaging. Here, the above-mentioned "working area" means a part of the upper surface of the substrate 90 where the production process is executed before the visual inspection is executed. The above production process includes a solder printing process by a screen printing machine constituting the production line, a component mounting process by another component mounting machine on the upstream side of the production line, or a component mounting process on the substrate 90 by the own machine (part mounting machine 1). Is included.

The image sensor 52 of the inspection camera 50 has a resolution that enables the parts in the work area to be recognized in the inspection process. The resolution of the image sensor 52 can be appropriately changed depending on the size of the inspection area, but for example, it is set to about 5 million pixels so that about 100 inspection targets (parts, etc.) included in the work area of 30 mm × 30 mm can be recognized. Can be set. Further, the image sensor 52 is a color image sensor capable of including color information in addition to brightness in the image data. As described above, the inspection camera 50 in the present embodiment has the same function as the inspection camera used in the inspection device that constitutes the production line together with the component mounting machine.

(1-2. Configuration of control device 70)
The control device 70 is mainly composed of a CPU, various memories, and a control circuit, and is based on a control program for operating the component mounting machine 1, image data acquired by imaging the component camera 41 and the substrate camera 42, and the substrate 90. Controls the mounting of parts on the. As shown in FIG. 3, the control device 70 includes a transport control unit 71, a mounting control unit 72, an imaging control unit 73, and an appearance inspection unit 74.

The transfer control unit 71 controls the transfer operation of the substrate 90 by the substrate transfer device 10. More specifically, the transfer control unit 71 operates the belt conveyor of the substrate transfer device 10 to carry the board 90 into the machine and executes a carry-in step of positioning the board 90 at a predetermined position. Further, after the mounting of the parts is completed, the transport control unit 71 releases the clamped state of the substrate 90 and operates the belt conveyor to execute the carry-out step of carrying the substrate 90 out of the machine.

The mounting control unit 72 controls the component supply operation by the component supply device 20 and the component transfer operation by the component transfer device 30. The mounting control unit 72 controls the position of the mounting head 33 and the operation of the suction mechanism by sending a control signal to the component transfer device 30. More specifically, the mounting control unit 72 inputs information output from various sensors provided in the component mounting machine 1 and the results of various recognition processes. Then, the mounting control unit 72 transmits a control signal based on a control program stored in a storage device (not shown), information from various sensors, and the results of image processing and recognition processing. As a result, the position and rotation angle of the suction nozzle 34 supported by the mounting head 33 are controlled.

The image pickup control unit 73 controls the image pickup process of each camera so that a predetermined object is imaged by the component camera 41, the substrate camera 42, and the inspection camera 50. Specifically, when acquiring image data containing an inspection target on the upper surface of the substrate 90, the image pickup control unit 73 is an inspection camera integrally provided on the mounting head 33 with respect to the component transfer device 30. The 50 is moved to a position where the inspection target is within the camera field of view of the inspection camera 50. Then, the image pickup control unit 73 sends a control signal so as to execute the image pickup process on the inspection camera 50 that has moved above the inspection target.

The appearance inspection unit 74 inspects the appearance of a predetermined inspection target on the upper surface of the substrate 90. Specifically, the appearance inspection unit 74 determines the quality of the appearance by comparing the sample template with the image data acquired by the image pickup of the inspection camera 50. Further, the above-mentioned inspection target is included in the work area where the production process is executed, and may include, for example, parts mounted on the substrate 90, solder printed on the substrate 90, and the like. The visual inspection unit 74 determines whether or not the mounting state of the component and the printing state of the solder are good or bad by the visual inspection comparing the template and the image data.

(1-3. Production processing by parts mounting machine 1)
The component mounting machine 1 having the above configuration, as a production device constituting the production line, inspects the substrate 90 carried in from the upstream side of the production line, mounts the parts, and carries out the production process to the downstream side. To execute. As shown in FIGS. 4, 6 and 8, the above production process mainly includes a carry-in step (step 10 (hereinafter, “step” is referred to as “S”)), an inspection step (S20), and the inspection step (S20). The mounting step (S40) and the unloading step (S50) are included.

Here, the carry-in step (S10) is a step of carrying in the substrate 90 from the upstream side of the production line using the substrate transport device 10. The inspection step (S20) is a step of inspecting the appearance of the substrate 90 using the inspection camera 50. The mounting step (S40) is a step of moving the mounting head 33 to mount the components on the substrate 90. The unloading step (S50) is a step of unloading the substrate 90 to the downstream side of the production line using the substrate transport device 10.

The inspection step (S20) includes camera movement (S21), imaging processing (S22), and visual inspection (S23), as shown in FIG. 4 and the like. The camera movement (S21) is a process of moving the inspection camera 50 from the current position to an inspection position where the inspection target on the substrate 90 can be imaged. The imaging process (S22) is a process of acquiring image data by imaging the inspection camera 50 at the inspection position. The appearance inspection (S23) is a process of inspecting the appearance quality of the substrate 90 based on the acquired image data by the appearance inspection unit 74.

As shown in FIG. 4, the mounting step (S40) includes a preparatory process (S41), an initial head movement (S42), and a mounting operation (S43). The preparatory process (S41) is a process of collecting parts by the mounting head 33 and recognizing the state of the parts held by the mounting head 33. More specifically, in the preparatory process (S41), the control device 70 first moves the mounting head 33 from the current position to the component supply position in the component supply device 20. Next, the control device 70 collects by sucking the parts supplied by the suction nozzle 34 of the mounting head 33.

Then, the control device 70 moves the mounting head 33 above the component camera 41 to perform image capture, and acquires image data. Based on the above image data, the control device 70 recognizes the state of the component held by the suction nozzle 34, that is, the position and angle of the component with respect to the reference position of the mounting head 33. When the mounting head 33 has a plurality of suction nozzles 34, the control device 70 recognizes the state of each component held by each suction nozzle 34.

The head initial movement (S42) is a process of moving the mounting head 33 above the initial mounting position after the preparatory process (S41). The mounting operation (S43) is a process of lowering the suction nozzle 34 of the mounting head 33 to mount the component at a predetermined mounting position on the substrate 90. In the above-mentioned "mounting", in addition to the operation of placing the component on the solder printed on the upper surface of the substrate 90, the engaging portion formed on the component is engaged with the substrate 90 or the component on the substrate 90. Includes mounting operations to engage the parts. Specifically, in the mounting operation (S43), a protrusion as an engaging portion of a cover component that protects a plurality of electronic components already mounted on the substrate 90 is provided in a mounting hole as an engaged portion of the substrate 90. The operation to insert is included.

Here, the visual inspection (S23) of the inspection step (S20) in the production process may be executed before, after, or both of the mounting operation (S43) of the mounting step (S40), depending on the inspection target. Specifically, when the inspection target is a production process such as screen printing or component mounting executed on the upstream side of the production line, the visual inspection (S23) is performed before the mounting operation (S43) of the own machine. Be done. In particular, when the mounting operation (S43) of the own machine is the mounting of the cover component, the visual inspection of the part covered with the cover component becomes impossible after the mounting, so such a visual inspection (S23). Needs to be executed before the execution of the mounting operation (S43) for mounting the cover component.

Further, when inspecting the quality of the mounting state of the parts by the mounting operation (S43) of the own machine, the appearance inspection (S23) needs to be executed after the mounting operation (S43) of the own machine is executed. In this visual inspection (S23), the quality of the mounting state of the parts by the mounting operation (S43) of the own machine may be checked for the quality of the production process executed on the upstream side of the production line. Further, as described above, the visual inspection (S23) can be performed before and after the mounting operation (S43), but in the following, for the sake of simplicity, an embodiment in which only one of them is executed will be illustrated.

(1-3-1. First aspect of production processing)
In the first aspect of the production process, the visual inspection (S23) is performed before the mounting operation (S43) is executed. In the first aspect, the control device 70 executes a part of at least two steps of the carry-in step (S10), the inspection step (S20), and the mounting step (S40) in parallel. Specifically, as shown in FIG. 4, the control device 70 executes the preparatory process (S41) of the mounting step (S40) in parallel with the visual inspection (S23) of the inspection step (S20).

Specifically, after the carry-in step (S10), the control device 70 first starts the inspection step (S20) to execute the camera movement (S21) and the imaging process (S22). Here, the image data acquired by the imaging process (S22) is transferred to the control device 70, and the visual inspection (S23) is executed by the visual inspection unit 74 of the control device 70. Therefore, when the imaging process (S22) is completed, the appearance inspection (S23) can be executed regardless of the position of the inspection camera 50 provided integrally with the mounting head 33.

Therefore, the control device 70 executes the preparatory process (S41) in parallel before the visual inspection (S23) is completed. As a result, as shown in the upper part of FIG. 5, in the normal mode, the mounting step (S40) was executed after waiting for the completion of the inspection step (S20), whereas in the first aspect as shown in the lower part of FIG. Then, the execution start of the mounting step (S40) is accelerated, and the execution period C1 of the preparatory process (S41) overlaps with the execution period B3 of the visual inspection (S23). As a result, the time required for the production process is shortened by the time T1 as a whole.

The first aspect of the production process includes a repair step (S30) executed after the inspection step (S20). The repair step (S30) is a step of repairing defects according to the results of the inspection step (S20) and the like. In the repair step (S30), the control device 70 first determines whether or not the inspection result is good (S31). When the inspection result is good (S31: Yes), the control device 70 ends the repair step (S30) and shifts to the initial head movement (S42). The head initial movement (S42) is a process of moving the mounting head 33 from the imaging position above the component camera 41 to the initial mounting position.

If the inspection result is defective (S31: No), the control device 70 determines whether or not the defect can be repaired (S32). Specifically, the control device 70 determines that the defect can be repaired if, for example, the content of the defect is a deviation in the mounting position of the component and the repair can be performed using the suction nozzle 34 of the mounting head 33 (. S32: Yes). In this case, the control device 70 interrupts the execution of the mounting step (S40) that has already been started, and uses the mounting head 33 to repair the defect (S33). Then, the control device 70 executes the inspection step (S20) in order to inspect the repaired substrate 90 again.

The result of the initial inspection or the re-inspection is good (S31: Yes), and the head initial movement (S42) and the mounting operation (S43) are executed as described above. The control device 70 executes the unloading step (S50) after the mounting step (S40) to end the production process. On the other hand, if the defect cannot be repaired using the mounting head 33, for example, the content of the defect is a defect in solder printing or an excess or deficiency of parts, the control device 70 determines that the defect cannot be repaired. (S32: No). In this case, the control device 70 outputs an error indicating that the substrate 90 has a defect that cannot be repaired by its own machine (S34), and ends the production process.

(1-3-2. Second aspect of production processing)
In the second aspect of the production process, the visual inspection (S23) is performed before the mounting operation (S43) is executed. In the second aspect, the control device 70 executes a part of at least two steps of the carry-in step (S10), the inspection step (S20), and the mounting step (S40) in parallel. Specifically, as shown in FIG. 6, the control device 70 executes the preparatory process (S41) of the mounting step (S40) in parallel with the loading step (S10). Further, the control device 70 executes the camera movement (S21) of the inspection step (S20) in parallel with the carry-in step (S10).

Here, during the execution of the carry-in step (S10), the substrate transfer device 10 can be operated regardless of the position of the mounting head 33. Therefore, the control device 70 starts the carry-in step (S10) and executes the preparatory process (S41) of the mounting step (S40) in parallel with this. That is, before the substrate 90 is carried into the machine and positioned, the control device 70 sucks the parts using the suction nozzle 34 of the mounting head 33 and recognizes the state using the parts camera 41.

As a result, as shown in the upper part of FIG. 7, in the normal mode, the mounting step (S40) was executed after waiting for the completion of the carry-in step (S10) and the inspection step (S20), whereas in the lower part of FIG. As shown, in the second aspect, the execution start of the mounting step (S40) is accelerated, and the execution period C1 of the preparation process (S41) overlaps with the execution period A1 of the carry-in step (S10). Further, when the preparatory process (S41) is completed, the inspection camera 50 provided integrally with the mounting head 33 can be moved.

Therefore, the control device 70 moves the camera (S21) in the inspection step (S20) in parallel with the carry-in step (S10) when the preparatory process (S41) is completed even before the carry-in step (S10) is completed. To execute. As a result, as shown in the upper part of FIG. 7, in the normal mode, the inspection step (S20) was executed after waiting for the completion of the carry-in step (S10), whereas in the second aspect as shown in the lower part of FIG. Then, the execution start of the inspection step (S20) is accelerated, and the execution period B1 of the camera movement (S21) overlaps with the execution period A1 of the carry-in process (S10).

Since the camera movement (S21) is executed after the preparation process (S41), the current position of the inspection camera 50 corresponding to the imaging position above the component camera 41 used for the state recognition is used. This is a process of moving the inspection target on the substrate 90 to an inspection position where an image can be taken. Here, in the second aspect, the position of the mounting head 33 when the inspection camera 50 is moved to the inspection position by moving the camera (S21) is the first mounting in which the mounting head 33 is moved by the initial head movement (S42). I try to be in position.

As described above, the inspection camera 50 has a wider camera field of view than the substrate camera 42, and is configured to be capable of taking an image even if the inspection target deviates to some extent from the optical axis Pt (see FIG. 2) of the optical unit 51. That is, even if the mounting head 33 is moved to the initial mounting position (a position where parts can be mounted only by lowering the suction nozzle 34), the inspection target may be within the camera field of view. Therefore, the control device 70 does not set the position where the optical axis Pt of the inspection camera 50 is aligned with the inspection target as the inspection position, but moves the camera by setting the position where the mounting head 33 is aligned with the initial mounting position as the inspection position (S21). )I do.

According to such a configuration, the movement distance in the head initial movement (S42) executed after the inspection result is determined to be good (S31: Yes) can be set to 0. As a result, the initial head movement (S42) in the mounting step (S40) can be substantially omitted. As a result, the time required for the production process is shortened by the time T2 as a whole. It is possible to recognize the position of the substrate 90 positioned by the carry-in step (S10) based on the image data obtained by the imaging process (S22). Therefore, the mounting control unit 72 may correct the position of the mounting head 33 based on the recognized position of the substrate 90 in the mounting operation (S43) executed after the inspection step (S20), for example. As a result, the position recognition process of the board 90 by the board camera 42 before the mounting operation (S43) can be omitted.

Further, when the inspection target is removed from the camera field of view when the optical axis Pt of the inspection camera 50 is shifted from the inspection target as described above, the control device 70 is in parallel with the visual inspection (S23) of the inspection step (S20). The head initial movement (S42) of the mounting step (S40) may be executed. As a result, the head initial movement (S42) is executed in advance for the execution period B3 of the visual inspection (S23), so that the time required for the production process is shortened.

(1-3-3. Third aspect of production processing)
In the third aspect of the production process, the visual inspection (S23) is performed after the mounting operation (S43) is executed. In the third aspect, the control device 70 executes the unloading step (S50) in parallel with the visual inspection (S23) of the inspection step (S20). Specifically, as shown in FIG. 8, the control device 70 starts the inspection step (S20) after the mounting step (S40) to execute the camera movement (S21) and the imaging process (S22).

Here, since the visual inspection (S23) is executed by the visual inspection unit 74, when the imaging process (S22) is completed, the carry-out step (S50) can be executed regardless of the position of the substrate 90. Therefore, the control device 70 executes the carry-out step (S50) in parallel before the visual inspection (S23) is completed. As a result, as shown in the upper part of FIG. 9, in the normal mode, the carry-out step (S50) was executed after waiting for the completion of the inspection step (S20), whereas in the third aspect as shown in the lower part of FIG. Then, the execution start of the unloading process (S50) is accelerated, and the execution period D1 of the unloading process (S50) overlaps with the execution period B3 of the visual inspection (S23). As a result, the time required for the production process is shortened by the time T3 as a whole.

In the third aspect of the production process, the control device 70 notifies the inspection result after the inspection step (S20) is completed (S61). Notification of the inspection result (S61) is performed to, for example, a host computer that manages the production line or a production apparatus on the downstream side of the production line. As a result, if the inspection result of the substrate 90 carried out by the component mounting machine 1 is received and the inspection result is good, for example, the production apparatus on the downstream side of the production line continues the production process. On the other hand, if the inspection result is defective, for example, repair is attempted in the production equipment on the downstream side of the production line, or if repair is not possible, it is treated as a disposal target.

(1-3-4. Fourth aspect of production processing)
As described above, the inspection camera 50 of the present embodiment has an optical unit 51 having a wider camera field of view than the substrate camera 42. However, when the inspection area on the substrate 90 does not fit in the camera field of view, as shown in the upper part of FIG. 10, in the inspection step (S20), the camera movement (S21), the imaging process (S22), and the visual inspection (S23). ) May be repeated multiple times in correspondence with a plurality of different inspection positions.

Here, the camera movement (S21) and the imaging process (S22) in the inspection step (S20) are defined as the data acquisition process Rd for acquiring image data. That is, in the inspection step (S20), the inspection cycle in which the data acquisition process Rd and the visual inspection (S23) are sequentially executed is repeated a plurality of times (FIG. 10 illustrates an embodiment in which the inspection cycle is repeated four times).

In the fourth aspect of the production process, the control device 70 is in parallel with the visual inspection (S23) of the first inspection cycle, which is the first of the two consecutive inspection cycles, and is after the two consecutive inspection cycles. The data acquisition process Rd of the second inspection cycle is executed. Specifically, the control device 70 performs data acquisition processing of the second inspection cycle (second inspection cycle) in parallel before the appearance inspection (S23) of the first inspection cycle (first inspection cycle) is completed. Execute Rd.

As a result, as shown in the upper part of FIG. 10, in the normal mode, the second inspection cycle was executed after waiting for the end of the first inspection cycle, whereas in the fourth aspect as shown in the lower part of FIG. Then, the execution of the second inspection cycle is started earlier. Similarly, the second inspection cycle (first inspection cycle), the third inspection cycle (second inspection cycle), the third inspection cycle (first inspection cycle), and the fourth inspection cycle (second inspection cycle). In this case as well, the execution of the later inspection cycle is started earlier.

As a result, the execution period (B1 + B2) of the data acquisition process Rd of the later inspection cycle (second inspection cycle) overlaps with the execution period B3 of the visual inspection (S23). As a result, the time required for the production process is shortened by the time T4 as a whole. It should be noted that, for example, the data acquisition process Rd is executed rather than the execution period B3 of the visual inspection (S23) of the first inspection cycle because the moving distance of the camera movement (S21) becomes shorter depending on the positional relationship of the plurality of inspection positions. The period (B1 + B2) may be shorter.

In such a case, if the visual inspection unit 74 can execute the visual inspection (S23) based on different image data in parallel, the visual inspection (S23) of the first inspection cycle is performed in parallel with the second inspection cycle. A visual inspection (S23) may be performed. When the visual inspection unit 74 cannot execute a plurality of visual inspections (S23) at the same time, a processing wait may occur between the data acquisition process Rd of the second inspection cycle and the visual inspection (S23).

(2. Effect of the configuration of the embodiment)
The component mounting machine 1 constitutes a production line in which components are mounted on the substrate 90 and a plurality of components are installed in the transport direction of the substrate 90 to produce substrate products. The component mounting machine 1 collects the substrate transfer device 10 that carries the board 90 into the machine and carries it out of the machine, the parts supply device 20 that supplies the parts, and the parts supplied by the parts supply device 20, and the board 90. A mounting head 33 to be mounted at a predetermined mounting position, an inspection camera 50 provided integrally with the mounting head 33 and capable of capturing an image of the upper surface of the board 90, and a board 90 from the upstream side of the production line using the board transport device 10. The carry-in step (S10), the inspection step (S20) of inspecting the appearance of the board 90 using the inspection camera 50, and the mounting step (S40) of moving the mounting head 33 to mount the parts on the board 90. A control device 70 for executing the above.
In the inspection step (S20), image data is acquired by moving the camera 50 from the current position to an inspection position where the inspection target on the substrate 90 can be imaged (S21) and imaging the inspection camera 50 at the inspection position. The imaging process (S22) and the appearance inspection (S23) for inspecting the appearance quality of the substrate 90 based on the acquired image data are included. In the mounting step (S40), a preparatory process (S41) for collecting parts by the mounting head 33 and recognizing the state of the parts held by the mounting head 33, and a first preparatory process (S41) followed by the mounting head 33. The head initial movement (S42) of moving the head to the upper side of the mounting position is included. The control device 70 executes a part of at least two steps of the carry-in step (S10), the inspection step (S20), and the mounting step (S40) in parallel.

According to such a configuration, it is possible to inspect the quality of the production process (solder printing process, mounting process, etc.) executed on the upstream side of the production line in the component mounting machine 1. As a result, the production line can be shortened and the productivity per installation area can be improved as compared with the configuration in which a dedicated inspection device is installed on the production line. Further, since at least a part of at least two processes of the carry-in process (S10), the inspection process (S20), and the mounting process (S40) is executed in parallel, the time required for the production process is shortened and the efficiency of the production process is improved. Can be planned.

Further, in the first aspect of the production process, the control device 70 executes the preparatory process (S41) of the mounting step (S40) in parallel with the visual inspection (S23) of the inspection step (S20).
According to such a configuration, in parallel with the visual inspection (S23) of the inspection step (S20), the preparatory process (S41) of the mounting process (S40) (movement to the suction position, suction process, movement of the component camera upward). , Imaging processing, state recognition processing, etc.) are executed. As a result, the preparatory process (S41) is started in advance for the execution period B3 of the visual inspection (S23), so that the time required for the production process can be shortened. As a result, the efficiency of production processing can be improved.

Further, in the second aspect of the production process, the control device 70 executes the preparatory process (S41) of the mounting step (S40) in parallel with the carry-in step (S10).
According to such a configuration, the preparation process (S41) (movement to the suction position, suction process, upward movement of the component camera, imaging process, state recognition) of the mounting process (S40) in parallel with the carry-in process (S10). Processing etc.) is executed. As a result, the time required for the production process can be shortened by the shorter period of the carry-in process (S10) and the preparatory process (S41). As a result, the efficiency of production processing can be improved.

Further, in the second aspect of the production process, the control device 70 may execute the head initial movement (S42) of the mounting step (S40) in parallel with the visual inspection (S23) of the inspection step (S20). ..
According to such a configuration, the head initial movement (S42) of the mounting step (S40) is executed in parallel with the visual inspection (S23) of the inspection step (S20). Since the head initial movement (S42) is executed in advance for the execution period B3 of the visual inspection (S23), the time required for the production process can be shortened. As a result, the efficiency of production processing can be improved.

Further, in the second aspect of the production process, the control device 70 executes the camera movement (S21) of the inspection step (S20) in parallel with the carry-in step (S10).
According to such a configuration, the camera movement (S21) of the inspection step (S20) is executed in parallel with the carry-in step (S10). As a result, the camera movement (S21) required for the inspection process (S20) is executed in advance during the execution of the carry-in process (S10), so that the time required for the production process can be shortened by the execution period B1 of the camera movement (S21). .. As a result, the efficiency of production processing can be improved.

Further, in the first aspect and the second aspect of the production process, the control device 70 determines that the inspection result in the inspection step (S20) is defective (S31: No) and the defect can be repaired (S32:). Yes), the execution of the mounting step (S40) is interrupted, and the defect is repaired using the mounting head 33 (S33).

The component mounting machine 1 has a function of collecting components at the supply position of the component supply device 20 and transferring the components to a predetermined mounting position of the substrate 90. Therefore, even if the inspection result is defective, it may be possible to repair the defect and avoid discarding the substrate 90 depending on the cause of the defect. Therefore, when the control device 70 determines that the defect can be repaired (S32: Yes), the control device 70 executes the defect repair (S33). As a result, the component mounting machine 1 also functions as an inspection device and a repair device, which contributes to shortening of the production line and can improve the productivity per installation area.

Further, in the second aspect of the production process, the position of the mounting head 33 when the inspection camera 50 is moved to the inspection position by moving the camera (S21) is the first position where the mounting head 33 is moved by the initial head movement (S42). It is the mounting position.

In the inspection step (S20), when the subsequent mounting step (S40) is executed, the appearance inspection (S23) may not be able to be performed because it is covered with a cover component or the like. Therefore, in the mounting step (S40), the appearance inspection (S23) is performed before the cover component is mounted on the substrate 90. At this time, if the camera field of view of the inspection camera 50 moved to the inspection position includes the mounting position of the cover component, the position of the mounting head 33 at that time can be set as the first mounting position.

Therefore, by adopting the above configuration, when the inspection result is good and the cover component can be attached, the movement of the mounting head 33 in the XY axis direction is omitted and the cover component is immediately attached. can. Therefore, the movement distance of the camera movement (S21) in the inspection step (S20) and the head initial movement (S42) in the mounting step (S40), whichever is executed later, becomes 0 (in the second aspect of the production process, the movement distance is 0). The head initial movement (S42) is executed later). As described above, in the production process in which the visual inspection (S23) needs to be executed before the mounting process, the efficiency of the inspection step (S20) and the mounting process (S40) can be improved, and the present embodiment The application of the configuration illustrated in is useful.

The component mounting machine 1 constitutes a production line in which components are mounted on the substrate 90 and a plurality of components are installed in the transport direction of the substrate 90 to produce substrate products. The component mounting machine 1 collects the substrate transfer device 10 that carries the board 90 into the machine and carries it out of the machine, the parts supply device 20 that supplies the parts, and the parts supplied by the parts supply device 20, and the board 90. A mounting head 33 to be mounted at a predetermined mounting position, an inspection camera 50 that is integrally provided with the mounting head 33 and capable of capturing an image of the upper surface of the substrate 90, and a mounting that moves the mounting head 33 to mount parts on the board 90. A step (S40), an inspection step (S20) of inspecting the appearance of the substrate 90 using the inspection camera 50, and a unloading step of unloading the substrate 90 to the downstream side of the production line using the substrate transport device 10 are executed. It includes a control device 70.
In the inspection step (S20), image data is acquired by moving the camera 50 from the current position to an inspection position where the inspection target on the substrate 90 can be imaged (S21) and imaging the inspection camera 50 at the inspection position. The imaging process (S22) and the appearance inspection (S23) for inspecting the appearance quality of the substrate 90 based on the acquired image data are included. In the third aspect of the production process, the control device 70 executes the unloading step in parallel with the visual inspection (S23) of the inspection step (S20).

According to such a configuration, it is possible to inspect the quality of the mounting process (S40) executed by the own machine in the component mounting machine 1. As a result, the production line can be shortened and the productivity per installation area can be improved as compared with the configuration in which a dedicated inspection device is installed on the production line. Further, since the unloading process is executed in parallel with the visual inspection (S23) of the inspection process (S20), the time required for the production process can be shortened and the efficiency of the production process can be improved.

Further, in the fourth aspect of the production process, the camera movement (S21) and the image pickup process (S22) in the inspection step (S20) are defined as the data acquisition process Rd for acquiring image data. In the inspection step (S20), the inspection cycle in which the data acquisition process Rd and the visual inspection (S23) are sequentially executed is repeated a plurality of times corresponding to a plurality of different inspection positions. The control device 70 performs data acquisition processing of the second inspection cycle after the two consecutive inspection cycles in parallel with the visual inspection (S23) of the first inspection cycle which is the first of the two consecutive inspection cycles. Execute Rd.

In the inspection step (S20), the data acquisition process Rd (camera movement (S21) and image pickup process (S22)) is executed a plurality of times due to the relationship between the camera field of view of the inspection camera 50 and the area of the mounting area on the substrate 90. May be done. In such a case, the appearance inspection (S23) is executed with the wearing area contained in the image data as the inspection target as soon as the image data is acquired without synthesizing the acquired image data. Therefore, the control device 70 performs the data acquisition process Rd of the second inspection cycle in parallel with the appearance inspection (S23) of the first inspection cycle in the inspection cycle as described above. As a result, the time required for the production process can be shortened by the execution period B3 of the visual inspection (S23). As a result, the efficiency of production processing can be improved.

Further, the inspection camera 50 includes an optical unit 51 that forms a camera field of view that accommodates a work area in which a production process for producing a board product is executed in the board 90 in one image pickup, and a plurality of inspection targets in the work area. Is provided with a color image sensor 52 having a resolution that makes it recognizable in the inspection step (S20). The inspection camera 50 is a camera dedicated to the visual inspection (S23).

According to such a configuration, the inspection camera 50 is not a camera diverted from a general substrate camera for inspection, but a dedicated camera dedicated to visual inspection (S23). Since the main purpose of a general substrate camera is to read the reference mark attached to the substrate 90, the optical unit that forms the camera field of view in which the reference mark fits and the monochrome that is sufficient to recognize the outer shape of the reference mark. It is equipped with an image sensor. Therefore, if a general board camera is simply diverted to the visual inspection, it is difficult to perform an appropriate visual inspection, and it is assumed that the inspection cannot be performed.

On the other hand, the inspection camera 50 illustrated in the present embodiment employs a camera equivalent to the inspection camera 50 used in the inspection device. As a result, an appropriate visual inspection (S23) is possible, the amount of movement of the camera movement (S21) in the inspection step (S20) is reduced, and the imaging process (S22) is performed as compared with the configuration in which the substrate camera is diverted. It is possible to reduce the number of times. Therefore, the time required for the production process can be shortened, and the efficiency of the production process can be improved.

(3. Deformation mode of the embodiment)
(3-1. Execution of each process)
The control device 70 may appropriately combine the first to fourth aspects of the production process exemplified in the embodiment so that a part of each step is executed in parallel. For example, when the inspection step (S20) is executed before and after the mounting operation (S43), it is assumed that the fourth aspect is combined with the first or second aspect of the production process. Further, when the inspection cycle is repeated a plurality of times in the inspection step (S20), it is assumed that the fourth aspect is combined with any of the first to third aspects of the production process.

Further, in the first and second aspects of the production process, the preparatory process (S41) of the mounting process (S40) is executed in parallel with the visual inspection (S23) and the carry-in process (S10). Here, only a part of the preparatory process (S41) may be executed in parallel with the visual inspection (S23) and the carry-in process (S10). For example, the control device 70 may execute only the head movement of the mounting head 33 from the current position to the component supply position in the component supply device 20 in the preparatory process (S41) in parallel with the carry-in step (S10).

Then, the control device 70 may restart the rest of the preparatory process (S41) (part collection, state recognition process, etc.) when the visual inspection (S23) is completed and the inspection result is output. .. This makes it easier to deal with the repair process (S33) that can be executed depending on the inspection result, and it is possible to omit the collection of parts that may become unnecessary and the execution of the state recognition process.

Further, in the first and second aspects of the production process, when the inspection result in the inspection step (S20) is defective (S31: No) and the defect can be repaired (S32: Yes), the defect is defective. The configuration is such that the repair is executed (S33). On the other hand, when the inspection result is defective (S31: No), the control device 70 may carry out the substrate 90 to the downstream side of the production line without performing repair of the defect, for example. .. The production apparatus on the downstream side of the production line may, for example, repair the defective substrate 90 that has been carried in, or may perform a process of removing it from the production line.

(3-2. Others)
In the embodiment, the inspection camera 50 has a configuration having the same function as the inspection camera used in the inspection device. On the other hand, when the inspection target is a narrow range and the existing board camera 42 can be diverted, or when the board camera 42 has the same function as the inspection camera 50, the board camera 42 is used. It may be diverted to the inspection camera 50. Even in such a configuration, the same effect as that of the embodiment is obtained. However, the configuration illustrated in the embodiment is preferable from the viewpoint of executing an appropriate inspection step with the entire substrate 90 as the inspection area.

Further, in the embodiment, the visual inspection unit 74 that executes the visual inspection (S23) is provided in the control device 70. On the other hand, the visual inspection unit 74 may be provided outside the control device 70. For example, the visual inspection unit 74 may be provided in the inspection camera 50, or may be provided in another component mounting machine 1 or a host computer outside the component mounting machine 1.

1: Parts mounting machine, 10: Board transfer device, 20: Parts supply device, 21: Slot, 22: Feeder, 30: Parts transfer device, 31: Head drive device, 32: Moving table, 33: Mounting head, 34 : Suction nozzle, 41: Parts camera, 42: Board camera, 50: Inspection camera, 51: Optical unit, 52: Imaging element, 70: Control device, 71: Transport control unit, 72: Mounting control unit, 73: Imaging control Department, 74: Visual inspection department, 90: Board (circuit board)

Claims (6)

It is a component mounting machine that mounts electronic components on a circuit board and is installed in a plurality of directions in the transport direction of the circuit board to form a production line for producing board products.
A board transfer device that carries the circuit board into and out of the machine, and
A component supply device that supplies the electronic components at the component supply position, and
A mounting head that collects the electronic components supplied by the component supply device and mounts them at a predetermined mounting position on the circuit board.
An inspection camera that is provided integrally with the mounting head and can image the upper surface of the circuit board.
A mounting step of moving the mounting head to mount the electronic component on the circuit board, an inspection step of inspecting the appearance of the circuit board using the inspection camera, and a board transfer device of the production line. A control device for executing the unloading process of unloading the circuit board is provided on the downstream side.
The inspection step includes moving the camera from the current position to an inspection position where the inspection target on the circuit board can be imaged, and an imaging process for acquiring image data by imaging the inspection camera at the inspection position. Includes visual inspection, which inspects the appearance of the circuit board based on the acquired image data.
The control device has both a first inspection step including the visual inspection performed before the execution of the mounting step and a second inspection step including the visual inspection performed after the execution of the mounting step. And run
The control device moves the mounting head from the current position to the component supply position in parallel with the visual inspection in the first inspection step, and the inspection result in the first inspection step is defective and said. When the defect can be repaired, the defect is repaired using the mounting head, and when the inspection result in the first inspection step is good, the mounting head as the mounting step is used. Started collecting electronic parts,
Said controller, in parallel with the appearance inspection of the second of the inspection process by executing the unloading step, after the inspection process of the second of the inspection process is completed, the host computer that manages the production line, Alternatively, a component mounting machine that notifies the production apparatus on the downstream side of the production line of the result of the visual inspection. The control device executes a carry-in step of carrying in the circuit board from the upstream side of the production line using the board transfer device, the inspection step, and the mounting step.
In the mounting step, a preparatory process for collecting the electronic component by the mounting head and recognizing the state of the electronic component held by the mounting head, and a preparatory process for recognizing the state of the electronic component held by the mounting head, and a mounting position where the mounting head is first placed after the preparatory process. Includes initial head movement to move up to
The component mounting machine according to claim 1, wherein the control device executes the carry-in process and the inspection part in parallel. The component mounting machine according to claim 2, wherein the control device executes the camera movement in the inspection process in parallel with the carry-in process. The mounting position according to claim 2 or 3 , wherein the position of the mounting head when the inspection camera is moved to the inspection position by moving the camera is the first mounting position where the mounting head is moved by the initial movement of the head. Parts mounting machine. The camera movement and the imaging process in the inspection step are defined as a data acquisition process for acquiring the image data.
In the inspection step, the inspection cycle of sequentially executing the data acquisition process and the visual inspection is repeated a plurality of times in correspondence with a plurality of different inspection positions.
The control device acquires the data of the second inspection cycle after the two consecutive inspection cycles in parallel with the appearance inspection of the first inspection cycle earlier of the two consecutive inspection cycles. The component mounting machine according to any one of claims 1 to 4 , which executes the process. The inspection camera includes an optical unit that forms a camera field of view that accommodates a work area in which a production process for producing the substrate product of the circuit board is executed in one image pickup, and a plurality of inspection targets in the work area. The component mounting machine according to any one of claims 1 to 5 , further comprising a color image sensor having a resolution capable of recognizing in the inspection step, and a camera dedicated to the visual inspection.

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