CN102683225B - Electronic component mounting equipment and electronic component mounting method - Google Patents
Electronic component mounting equipment and electronic component mounting method Download PDFInfo
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- CN102683225B CN102683225B CN201210059432.0A CN201210059432A CN102683225B CN 102683225 B CN102683225 B CN 102683225B CN 201210059432 A CN201210059432 A CN 201210059432A CN 102683225 B CN102683225 B CN 102683225B
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- 238000000034 method Methods 0.000 title claims abstract description 25
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- 238000009434 installation Methods 0.000 claims description 22
- 238000002372 labelling Methods 0.000 claims description 17
- 230000004069 differentiation Effects 0.000 claims 1
- 238000012546 transfer Methods 0.000 description 55
- 238000012545 processing Methods 0.000 description 35
- 230000007547 defect Effects 0.000 description 16
- 239000004065 semiconductor Substances 0.000 description 16
- 238000010586 diagram Methods 0.000 description 14
- 239000000203 mixture Substances 0.000 description 13
- 230000000694 effects Effects 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- 238000012937 correction Methods 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- 230000002950 deficient Effects 0.000 description 3
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- 238000005516 engineering process Methods 0.000 description 1
- 238000003702 image correction Methods 0.000 description 1
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Abstract
The present invention provides a kind of electronic component mounting equipment and electronic component mounting method, and it can shorten the set-up time when the nude film of wafer taking-up certified products is installed on substrate.Electronic component mounting equipment obtains the positional information of each nude film from the image that wafer is overall.It addition, obtain the whether qualified information of each nude film.And then from the positional information and whether qualified information of each nude film, obtain the positional information of the nude film of certified products.And, the positional information of nude films based on the certified products obtained, the nude film taking out certified products from wafer is installed on substrate.Therefore, there is no need to as now, each nude film be shot.Therefore, it is possible to shorten the set-up time when the nude film of wafer taking-up certified products is installed on substrate.
Description
Technical field
The nude film that the present invention relates to take out certified products from the wafer being made up of multiple nude films is installed on base
Electronic component mounting equipment on plate and electronic component mounting method.
Background technology
At present, it is installed on base as the nude film taking out certified products from the wafer being made up of multiple nude films
Electronic component mounting equipment on plate and electronic component mounting method, have such as patent documentation 1 public
The electronic component pick device opened and pick-up method.
This pick device and pick-up method expand the field size of filming apparatus to semiconductor crystal wafer
Image shoots, and obtains the pickup according to the starting point during image pickup semiconductor chip shot
Starting point.Afterwards, the semiconductor core of the pickup starting point field size reducing filming apparatus obtained
Sheet shoots, and obtains the position of semiconductor chip according to the image of shooting.And, based on asking
The position gone out, pickup semiconductor chip is installed on substrate.After, move successively from pickup starting point,
This each semiconductor chip is shot, based on the position obtained according to the image of shooting, picks up
Take semiconductor chip to be installed on substrate.
Patent documentation 1: Japanese Unexamined Patent Publication 2003-258008 publication
But, in above-mentioned pick device and pick-up method, have to be to quasiconductor before pickup
Chip shoots, it is necessary to obtain the position of semiconductor chip according to the image of shooting.In multiform
Become in the semiconductor chip of semiconductor crystal wafer and only the semiconductor chip of certified products is installed on substrate
In the case of on, it is necessary to judge that whether qualified semiconductor chip is according to the image of shooting.Therefore,
It is difficult to shorten the peace when the semiconductor chip of semiconductor crystal wafer taking-up certified products is installed on substrate
ETL estimated time of loading.
Summary of the invention
The present invention develops in view of this problem, its object is to, it is provided that can shorten from
The electronic component of the set-up time when nude film of wafer taking-up certified products is installed on substrate installs dress
Put and electronic component mounting method.
Then, the present inventors have carried out wholwe-hearted research to solve this problem, and examination is repeated several times
That test it was found that obtained the positional information of each nude film by the image overall from wafer, from respectively
The positional information of nude film and the whether qualified information of each nude film obtain the position of the nude film of certified products
Information, the nude film that the positional information of nude films based on certified products takes out certified products from wafer is installed on
On substrate, it is possible to when shortening the installation when the nude film of wafer taking-up certified products is installed on substrate
Between, complete the present invention.
That is, the electronic component mounting equipment described in Section 1 of the present invention is from by being formed with electronic component
Multiple nude films constitute wafer take out certified products nude film be installed on substrate, it is characterised in that
Having wafer shooting unit, wafer entirety is shot by it；Positional information acquisition unit, its
The position letter of each nude film is obtained from the image that the wafer utilizing wafer shooting unit photographs is overall
Breath；Certified products positional information acquisition unit, its each nude film obtained from positional information acquisition unit
Positional information and each nude film whether qualified information in obtain certified products nude film position letter
Breath；Installation unit, the nude film of its certified products obtained based on certified products positional information acquisition unit
Positional information, from wafer take out certified products nude film be installed on substrate.According to this composition,
The positional information of the nude film of certified products is obtained from the image that wafer is overall.Therefore there is no need as existing
Equally each nude film is being shot.Therefore, it is possible to shorten the nude film taking out certified products from wafer
Set-up time when being installed on substrate.
Electronic component mounting equipment described in Section 2 of the present invention is characterised by, wafer has use
In differentiating that whether qualified whether qualified of each nude film differentiates labelling, and there is whether qualified information take
Obtaining unit, it is from the image of the wafer entirety utilizing wafer shooting unit photographs, based on qualified
Whether differentiating labelling, obtain the whether qualified information of each nude film, certified products positional information obtains single
The positional information of each nude film that unit obtains from positional information acquisition unit and whether qualified information obtain
The whether qualified information of each nude film that unit obtains obtains the positional information of the nude film of certified products.
According to this composition, it is possible to reliably obtain the positional information of the nude film of certified products.
Electronic component mounting equipment described in Section 3 of the present invention is characterised by, has storage logical
The whether qualified information storage of the whether qualified information of each nude film crossing precheck wafer and obtain
Unit, each nude film that certified products positional information acquisition unit obtains from positional information acquisition unit
The whether qualified information of each nude film of positional information and the storage of whether qualified information memory cell takes
Obtain the positional information of the nude film of certified products.According to this composition, it is possible to reliably obtain certified products
The positional information of nude film.
Electronic component mounting equipment described in Section 4 of the present invention is characterised by, wafer shooting is single
Wafer entirety, after the nude film taking out specified quantity from wafer is arranged on substrate, is entered by unit again
Row shooting, positional information acquisition unit is overall from the wafer utilizing wafer shooting unit again to shoot
Image in again obtain the positional information of each nude film, certified products positional information acquisition unit is from position
Positional information and the whether qualified of each nude film of each nude film that confidence breath acquisition unit obtains again are believed
Again obtaining the positional information of the nude film of certified products in breath, installation unit is believed based on certified products position
The positional information of the nude film of the certified products that breath acquisition unit obtains again, takes out certified products from wafer
Nude film be installed on substrate.When taking out nude film from wafer, there is the position of other nude film
The situation of skew.According to this composition, after the nude film taking out specified quantity is installed on substrate,
The positional information of the nude film of certified products is again obtained from the image that wafer is overall.Therefore, though naked
The position skew of sheet, it is also possible to the nude film reliably taking out certified products is installed on substrate.
Electronic component mounting equipment described in Section 5 of the present invention is characterised by, has nude film and claps
Taking the photograph unit, it is after the nude film taking out specified quantity from wafer is installed on substrate, relative to crystalline substance
The image of nude film is also shot by circle relative movement；Revise and use positional information acquisition unit, its
The position for the nude film revised is obtained from the image of the nude film utilizing nude film shooting unit photographs
Information, certified products positional information acquisition unit obtains by positional information acquisition unit based on correction
The positional information of the nude film for revising, is modified the positional information of the nude film of certified products.
When taking out nude film from wafer, there is the situation of the position skew of other nude film.According to this structure
Become, after the nude film taking out specified quantity is installed on substrate, obtains from the image of nude film and be used for
The positional information of the nude film revised.And, positional information based on the nude film for revising is involutory
The positional information of the nude film of lattice product is modified.Therefore, even if the position skew of nude film, also can
Enough nude films reliably taking out certified products are installed on substrate.
Electronic component mounting equipment described in the Section 6 of the present invention is characterised by having: naked
Sheet shooting unit, it is relative to wafer relative movement, the certified products to be taken out to installation unit
The image of nude film shoots；Defect dipoles unit, it is according to utilizing nude film shooting unit photographs
The image of nude film of certified products to be taken out judge the presence or absence of defect, installation unit is based on defect
The judged result of judging unit, takes out flawless nude film from wafer and is installed on substrate.At crystalline substance
During circle conveying and when wafer takes out nude film, there is originally nude film for certified products and produce defect
Situation.According to this composition, judge having of defect according to the image of the nude film of certified products to be taken out
Nothing.And, based on judged result, in the case of flawless, take out this nude film be installed on substrate
On.Therefore, it is possible to the nude film the most only taking out flawless certified products is installed on substrate.
Electronic component mounting equipment described in Section 7 of the present invention is characterised by, wafer shooting is single
Unit is the large-field shooting machine shot wafer entirety in the lump.According to this composition, it is possible to reliably
Wafer entirety is shot.
Electronic component mounting equipment described in Section 8 of the present invention is characterised by, wafer shooting is single
Unit is for relative to wafer relative movement the row scanning camera that shoots wafer entirety.Root
According to this composition, it is possible to reliably wafer entirety is shot.Further, crystalline substance is being taken out from charging tray
Bowlder, it is possible to simultaneously wafer entirety is shot.Therefore, it is possible to shorten the activity duration.
Electronic component mounting method described in Section 9 of the present invention is from many by being formed with electronic component
The wafer that individual nude film is constituted takes out the nude film of certified products and is installed on substrate, it is characterised in that tool
Standby positional information obtains operation, obtains the positional information of each nude film from the image that wafer is overall；
Certified products positional information obtains operation, each nude film obtained from obtain operation at positional information
The whether qualified information of positional information and each nude film obtains the positional information of the nude film of certified products；
Installation procedure, nude films based on the certified products obtained in obtaining operation at certified products positional information
Positional information, the nude film taking out certified products from wafer is installed on substrate.According to the method, from
The positional information of the nude film of the image acquirement certified products that wafer is overall.Therefore, it is not necessary to as present one
Each nude film is shot by sample.Therefore, it is possible to shorten the nude film installation taking out certified products from wafer
Set-up time time on substrate.
Electronic component mounting method described in the Section 10 of the present invention has whether qualified information and obtains
Operation, be based upon differentiate whether qualified each nude film is and arrange whether qualified differentiate labelling, from crystalline substance
Obtaining the whether qualified information of each nude film in the image of rounding body, certified products positional information obtains work
Sequence is from obtaining the positional information of each nude film obtained operation at positional information and believing whether qualified
Breath obtains the position of the nude film obtaining certified products in operation in the whether qualified information of each nude film of acquirement
Confidence ceases.According to the method, it is possible to reliably obtain the positional information of the nude film of certified products.
Electronic component mounting method described in Section 11 of the present invention is characterised by, qualified grade
Confidence breath obtain operation from the positional information obtaining each nude film obtained operation at positional information and
The whether qualified information of each nude film obtained by precheck wafer obtains the naked of certified products
The positional information of sheet.According to the method, it is possible to reliably obtain the position letter of the nude film of certified products
Breath.
Electronic component mounting method described in Section 12 of the present invention is characterised by, positional information
Obtain what operation shot after being installed on substrate at the nude film taking out specified quantity from wafer again
Again obtaining the positional information of each nude film in the image that wafer is overall, certified products positional information obtains
The positional information of each nude film that operation obtains from obtain operation at positional information again and each nude film
Whether qualified information in again obtain the positional information of nude film of certified products, installation procedure based on
The positional information of the nude film of the certified products again obtained in certified products positional information obtains operation,
The nude film taking out certified products from wafer is installed on substrate.When taking out nude film from wafer, exist
The situation of the position skew of other nude film.According to the method, at the nude film taking out specified quantity
After being installed on substrate, again obtain the position letter of the nude film of certified products from the image that wafer is overall
Breath.Therefore, even if the position of nude film offsets, it is also possible to reliably take out the nude film peace of certified products
It is loaded on substrate.
Accompanying drawing explanation
Fig. 1 is the block diagram of the electronic component mounting equipment in the first embodiment；
Fig. 2 is the top view of the wafer in Fig. 1；
Fig. 3 is the stream of the action for the electronic component mounting equipment in the first embodiment is described
Cheng Tu；
Fig. 4 is the square frame of the electronic component mounting equipment in the mode of texturing of the first embodiment
Figure；
Fig. 5 is the axonometric chart of the alternate manner representing that wafer shoots；
Fig. 6 is the block diagram of the electronic component mounting equipment in the second embodiment；
Fig. 7 is the stream of the action for the electronic component mounting equipment in the second embodiment is described
Cheng Tu；
Fig. 8 is the square frame of the electronic component mounting equipment in the mode of texturing of the second embodiment
Figure；
Fig. 9 is the block diagram of the electronic component mounting equipment in the 3rd embodiment；
Figure 10 is the action for the electronic component mounting equipment in the 3rd embodiment is described
Flow chart；
Figure 11 is the action for the electronic component mounting equipment in the 3rd embodiment is described
Other flow chart；
Figure 12 is the block diagram of the electronic component mounting equipment in the 4th embodiment；
Figure 13 is the usual mould for the electronic component mounting equipment in the 4th embodiment is described
The explanatory diagram of formula action；
Figure 14 is for the high speed in the electronic component mounting equipment in the 4th embodiment is described
The explanatory diagram of the action of Mode A；
Figure 15 is for the high speed in the electronic component mounting equipment in the 4th embodiment is described
The explanatory diagram of the action of Mode B.
Symbol description
1～4... electronic component mounting equipment, 10,20,30,40... wafer filming apparatus (brilliant
Circle shooting unit), 100... row scanning camera, 11,21,31,41... image processing apparatus
(positional information acquisition unit, whether qualified information acquisition unit), 12,23,34,43...
Operational part (certified products positional information acquisition unit), 13,24,35,44a, 44b... transfer head
(installation unit), 14,25,36... transfer head drive division (installation unit), 15,26...
Nude film filming apparatus (nude film shooting unit), 16,27... image processing apparatus (defect dipoles
Unit), 22,42... storage part (whether qualified information memory cell), 32... nude film shooting
(correction obtains single with positional information for device (nude film shooting unit), 33... image processing apparatus
Unit), 40... nude film filming apparatus, 41... image processing apparatus, 45... drive division, W1～W4...
Wafer, D1～D4, D40, D41... nude film, B1～B4... substrate
Detailed description of the invention
Below, enumerate embodiment and illustrate in greater detail the present invention.
(the first embodiment)
First, with reference to Fig. 1 and Fig. 2, to the electronic component mounting equipment of the first embodiment
Composition illustrates.Here, Fig. 1 is the electronic component mounting equipment in the first embodiment
Block diagram.Fig. 2 is the top view of the wafer in Fig. 1.
Electronic component mounting equipment 1 shown in Fig. 1 is from by being formed with the multiple naked of electronic component
The wafer W1 that sheet D1 is formed takes out the nude film D1 of certified products and is arranged on the device on substrate B1.
Here, wafer W1 will be as in figure 2 it is shown, the multiple naked of semiconductor chip (electronic component) will be formed
Sheet D1 is arranged in wafer board and constitutes.And, only additional on the nude film D1 of defective work
Bad sheet labelling (whether qualified differentiate labelling).As it is shown in figure 1, electronic component mounting equipment 1
Possess wafer filming apparatus 10 (wafer shooting unit), image processing apparatus 11 (positional information
Acquisition unit, whether qualified information acquisition unit), (certified products positional information takes operational part 12
Unit), transfer head 13 (installation unit), transfer head drive division 14 (installation unit).
Wafer filming apparatus 10 is the device shooting wafer W1 entirety.Specifically,
It it is the large-field shooting machine that wafer W1 entirety is shot in the lump.Wafer filming apparatus 10 sets
It is placed in the position that wafer W1 entirety i.e. can be shot by the top of wafer W1 in the lump.
Image processing apparatus 11 is overall from the wafer W1 utilizing wafer filming apparatus 10 to shoot
Image in obtain each nude film D1 position relative to the mechanical origin of electronic component mounting equipment 1
The device of information.It addition, be also overall from the wafer W1 utilizing wafer filming apparatus 10 to shoot
Image in obtain the device of whether qualified information of each nude film D1 based on bad sheet labelling.
Operational part 12 is that the positional information of each nude film D1 from image processing apparatus 11 acquirement is with each
The whether qualified information of nude film D1 obtains the parts of the positional information of the nude film D1 of certified products.
Transfer head 13 is relative to wafer W1 relative movement, takes out nude film D1 and is installed on base
Device on plate B1.Specifically, along XY direction identical with wafer W1 and substrate B1
Plane on move, and in above-below direction slip-on head leading section, nude film D1 is arranged on substrate
On B1.
Transfer head drive division 14 is the naked of the certified products that obtain to operational part 12 based on positional information
Sheet D1 drives transfer head 13, and the nude film D1 taking out certified products from wafer W1 is installed on substrate
Parts on B1.It addition, be also after wafer W1 takes out the nude film D1 of specified quantity, right
Wafer filming apparatus 10, image processing apparatus 11 and operational part 12 are to be again carried out the side processed
Formula carries out the parts indicated.Specifically, it is made up of motor and motor control part, based on
The positional information of nude film D1 drives transfer head 13.
Below, with reference to Fig. 3 to the action of electronic component mounting equipment, i.e. electronic component installation side
Method illustrates.Install here, Fig. 3 is the electronic component for illustrating in the first embodiment
The flow process of the action of device.
When instruction starts to install nude film D1 on substrate B1, as it is shown on figure 3, utilize wafer
Filming apparatus 10 shoots (S10) to the image that wafer W1 is overall.And, at image
Reason device 11 obtains each from image overall for the wafer W1 utilizing wafer filming apparatus 10 to shoot
The positional information (S11, positional information obtains operation) of nude film D1.Specifically, phase is obtained
Positional information for mechanical origin.It addition, from the wafer utilizing wafer filming apparatus 10 to shoot
In the image that W1 is overall, based on bad sheet labelling, obtain the whether qualified information of each nude film D1
(S12, whether qualified information obtains operation).
Afterwards, the positional information of each nude film D1 that operational part 12 obtains from image processing apparatus 11
Positional information with the nude film D1 obtaining certified products in the whether qualified information of each nude film D1
(S13, certified products positional information obtains operation).Then, transfer head drive division 14 is based on position
The nude film D1 of the certified products that confidence breath obtains to operational part 12 drives transfer head 13, from wafer
W1 takes out the nude film D1 of certified products and is installed on substrate B1 (S14, installation procedure).
Afterwards, transfer head drive division 14 judges whether the taking-up quantity of nude film D1 is specified quantity
(S15)。
In step S15, when the taking-up quantity of nude film D1 reaches specified quantity, the most again
Secondary enforcement step S10～S13, obtain the nude film D1 of certified products from image overall for wafer W1
Positional information.Then, again drive to the nude film D1 of the certified products obtained based on positional information
Transfer head 13, the nude film D1 taking out certified products from wafer W1 is installed on substrate B1.
On the other hand, in step S15, the taking-up at nude film D1 is not the situation of specified quantity
Under, it is judged that whether the taking-up of nude film D1 terminates (S16).And, to the taking-up of nude film D1
Till end, the positional information of nude film D1 based on certified products, takes out the nude film D1 of certified products
It is installed on substrate B1.
Below effect is illustrated.According to the first embodiment, from the figure that wafer W1 is overall
The positional information of the nude film D1 of certified products is obtained in Xiang.Therefore, it is not necessary to each naked as now
Sheet D1 shoots.Therefore, it is possible to shorten the nude film D1 peace taking out certified products from wafer W1
It is loaded on set-up time during substrate B1.
According to the first embodiment, wafer W1 has for differentiating whether qualified bad of each nude film
Sheet labelling.From image overall for wafer W1, the qualified of each nude film D1 is obtained based on bad sheet labelling
Whether information.And, from the positional information of each nude film D1 and based on bad sheet labelling obtain each naked
The whether qualified information of sheet D1 obtains the positional information of the nude film D1 of certified products.Accordingly, it is capable to
The positional information of enough nude film D1 reliably obtaining certified products.
According to the first embodiment, it is installed on substrate B1 at the nude film D1 taking out specified quantity
After, from image overall for wafer W1, again obtain the positional information of the nude film D1 of certified products.
Therefore, when taking out nude film D1 from wafer W1, even if there is the position of other nude film D1
The situation of skew, it is also possible to the nude film D1 reliably taking out certified products is installed on substrate B1.
According to the first embodiment, wafer filming apparatus 10 is to carry out wafer W1 entirety in the lump
The large-field shooting machine of shooting.Therefore, it is possible to reliably wafer W1 entirety is shot.
From image overall for wafer W1, conjunction is obtained it addition, list in the first embodiment
The positional information of the nude film D1 of lattice product, is installed on the nude film of certified products on substrate based on this information
Example, but be not limited to this.
As shown in Figure 4, it is also possible to increase nude film filming apparatus 15 (nude film shooting unit), figure
As processing means 16 (defect dipoles unit).Nude film filming apparatus 15 is and transfer head 13 1
Rise and be integrally formed, relative to wafer W1 relative movement, and to be taken out qualified of transfer head 13
The image of the nude film D1 of product carries out the device shot.Image processing apparatus 16 is naked according to utilizing
The image of the nude film D1 of the certified products to be taken out of film shooting device 15 shooting judges having of defect
The device of nothing.The certified products that transfer head drive division 14 obtains to operational part 12 based on positional information
Nude film D1 drive transfer head 13, when from the nude film D1 of wafer W1 certified products to be taken out,
Judged result based on image processing apparatus 16, takes out and does not has defective nude film D1 to be installed on base
On plate B1.
When the conveying of wafer W1 and when wafer W1 takes out nude film D1, exist originally for closing
The nude film D1 of lattice product produces the situation of defect.But, according to the nude film of certified products to be taken out
The image of D1 judges the presence or absence of defect.And, based on judged result, in the case of flawless,
Take out this nude film D1 to be installed on substrate B1.Therefore, it is possible to the most only take out flawless
The nude film D1 of certified products is arranged on substrate B1.It addition, operational part 12 can also be according to utilization
The image of the nude film D1 of the certified products to be taken out of nude film filming apparatus 15 shooting judges defect
With or without.
It addition, listing wafer filming apparatus 10 in the first embodiment is large-field shooting machine
Example, but be not limited to this.Wafer filming apparatus 10 is as shown in Figure 5, it is also possible to be by making
Wafer W1 slides, the row shot wafer W1 entirety relative to wafer W1 relative movement
Smear camera 100.It also is able to equally in the case of Gai reliably wafer W1 entirety be shot.
Further, when charging tray takes out wafer, wafer W1 entirety can be shot simultaneously.Therefore,
The activity duration can be shortened.
It addition, the first embodiment lists each several part load process the example carrying out action, but
It is not limited to this.Operational part 12 can also handle together step S11 shown in Fig. 3～step S13
And step S15, S16.
(the second embodiment)
Below, the electronic component mounting equipment of the second embodiment is illustrated.First implements
The electronic component mounting equipment of mode obtains the whether qualified information of each nude film based on bad sheet labelling,
In contrast, the electronic component mounting equipment of the second embodiment is to store by precheck crystalline substance
The device of the whether qualified information of each nude film justified and obtain.
First, with reference to Fig. 6, the composition of the electronic component mounting equipment of the second embodiment is carried out
Explanation.Here, Fig. 6 is the block diagram of the electronic component mounting equipment in the second embodiment.
As shown in Figure 6, electronic component mounting equipment 2 possesses wafer filming apparatus 20 (wafer bat
Take the photograph unit), (positional information acquisition unit, whether qualified information obtain for image processing apparatus 21
Unit), storage part 22 (whether qualified information memory cell), operational part 23 (qualified grade
Confidence breath acquisition unit), transfer head 24 (installation unit), transfer head drive division 25 (install
Unit).Wafer filming apparatus 20, transfer head 24 and transfer head drive division 25 are real with first
Execute the composition that the wafer filming apparatus 10 of mode, transfer head 13 and transfer head drive division 14 are identical.
Here, the multiple nude film D2 forming semiconductor chip (electronic component) are arranged in by wafer W2
Constitute in wafer board.But, different from the wafer W1 of the first embodiment, the most additional use
In judging the whether qualified labelling of nude film D2.
Image processing apparatus 21 is overall from the wafer W2 utilizing wafer filming apparatus 20 to shoot
Image in obtain the position of each nude film D2 relative to the mechanical origin of electronic component mounting equipment 2
The device of confidence breath.But, due to bad sheet labelling the most additional on wafer W2, therefore cannot
Obtain from image overall for wafer W2 as the first embodiment the qualified of each nude film D2 with
No information.
Storage part 22 be storage obtained by precheck wafer W2 each nude film D2 with
Positional information that benchmark on wafer W2 is corresponding and the Image Data of whether qualified information structure
Parts.
Operational part 23 is to have the function as the operational part 12 of the first embodiment, and
The positional information of each nude film D2 that obtains from image processing apparatus 11 and be stored in storage part 22
The whether qualified information of each nude film 2 obtains the parts of the positional information of the nude film D2 of certified products.
Below, with reference to Fig. 7, the action of electronic component mounting equipment is illustrated.Here, figure
7 is the flow chart of the action for the electronic component mounting equipment in the second embodiment is described.
When instruction starts to install nude film D2 to substrate B2, as it is shown in fig. 7, utilize wafer to clap
Take the photograph device 20 and the image that wafer W2 is overall is shot (S20).And, image procossing
Device 21 obtains each naked from image overall for the wafer W utilizing wafer filming apparatus 20 to shoot
The positional information (S21, positional information obtains operation) of sheet D2.Specifically, obtain relatively
Positional information in mechanical origin.
Afterwards, the positional information of each nude film D2 that operational part 23 obtains from image processing apparatus 21
With the nude film obtaining certified products in the whether qualified information of each nude film D2 being stored in storage part 22
The positional information (S22, certified products positional information obtains operation) of D2.And, transfer head is driven
The nude film D2 of the certified products that dynamic portion 25 obtains to operational part 23 based on positional information drives transfer head
24, the nude film D2 taking out certified products from wafer W2 is installed on substrate B2 (S23, installation procedure).
Afterwards, transfer head drive division 25 judges whether the taking-up quantity of nude film D2 is specified quantity
(S24)。
In step s 24, when the taking-up quantity of nude film D2 reaches specified quantity, the most again
Secondary enforcement step S20～S22, obtain the nude film D2 of certified products from the image that wafer W2 is overall
Positional information.And, drive to the nude film D2 of the certified products again obtained based on positional information
Transfer head 24, the nude film D2 taking out certified products from wafer W2 is installed on substrate B2.
On the other hand, in step s 24, the taking-up at nude film D2 is not the feelings of specified quantity
Under condition, it is judged that whether the taking-up of nude film D2 terminates (S25).And, to taking of nude film D2
Going out till terminating, the positional information of nude film D2 based on certified products takes out the nude film D2 of certified products
It is installed on substrate B2.
Below, effect is illustrated.According to the second embodiment, storage part 22 storage is passed through
Precheck wafer W2 and the whether qualified information of each nude film D2 that obtains.And, from each naked
The positional information of sheet D2 and the whether qualified information of each nude film D2 obtain the nude film D2 of certified products
Positional information.Therefore, it is possible to reliably obtain the positional information of the nude film D2 of certified products.
It addition, the second embodiment lists obtain from image overall for wafer W2 qualified
The positional information of the nude film D2 of product, is installed on the nude film of certified products on substrate based on this information
Example, but it is not limited to this.
As shown in Figure 8, it is also possible to increase nude film filming apparatus 26 (nude film shooting unit), figure
As processing means 27 (defect dipoles unit).Nude film filming apparatus 26 is and transfer head 24 1
Rise and be integrally formed, relative to wafer W2 relative movement, the certified products to be taken out to transfer head 24
The image of nude film D2 carry out the device that shoots.Image processing apparatus 27 is according to utilizing nude film
The image of the nude film D2 of the certified products to be taken out of filming apparatus 26 shooting judges the presence or absence of defect
Device.Transfer head drive division 25 is at the certified products obtained to operational part 23 based on positional information
Nude film D2 drive transfer head 24, from wafer W2 take out certified products nude film D2 time, base
In the judged result of image processing apparatus 27, take out flawless nude film D2 and be installed on substrate B2.
When the conveying of wafer W2 and when wafer W2 takes out nude film D2, exist originally for closing
The nude film D2 of lattice product produces the situation of defect.But, according to the nude film of certified products to be taken out
The image of D2 judges the presence or absence of defect.And, based on judged result, in the case of flawless
Take out this nude film D2 to be installed on substrate B2.Therefore, it is possible to the most only take out flawless
The nude film D2 of certified products is installed on substrate B2.It addition, operational part 23 can also be according to utilization
The image of the nude film D2 of the certified products to be taken out of nude film filming apparatus 26 shooting judges defect
With or without.
It addition, list each several part load in this second embodiment to process the example carrying out action,
But it is not limited to this.Operational part 23 can also handle together step S21 shown in Fig. 7, S22, S24,
S25。
(the 3rd embodiment)
Below, the electronic component mounting equipment of the 3rd embodiment is illustrated.First implements
The electronic component mounting equipment of mode is when the taking-up quantity of nude film reaches the quantity of regulation, again
The positional information of the nude film of certified products, in contrast, the 3rd is obtained from the image that wafer is overall
The electronic component mounting equipment of embodiment is according to the position of the nude film of the image correction certified products of nude film
Confidence ceases.
First, with reference to Fig. 9, the composition of the electronic component mounting equipment of the 3rd embodiment is carried out
Explanation.Here, Fig. 9 is the block diagram of the electronic component mounting equipment in the 3rd embodiment.
As it is shown in figure 9, electronic component mounting equipment 3 possesses wafer filming apparatus 30, (wafer is clapped
Take the photograph unit), (positional information acquisition unit, whether qualified information obtain for image processing apparatus 31
Unit), nude film filming apparatus 32 (nude film shooting unit), image processing apparatus 33 (revise
Use positional information acquisition unit), operational part 34 (certified products positional information acquisition unit), move
Carrier head 35 (installation unit), transfer head drive division 36 (installation unit).Wafer filming apparatus
30, image processing apparatus 31, transfer head 35 and transfer head drive division 36 and the first embodiment
Wafer filming apparatus 10, image processing apparatus 11, transfer head 13 and transfer head drive division 14
For identical composition.Here, wafer W3 and the first embodiment are the same, bad sheet labelling is merely appended to
On the nude film D3 of defective work.
Nude film filming apparatus 32 is to be installed at the nude film D3 taking out specified quantity from wafer W3
After on substrate B3, relative to wafer W3 relative movement, to be taken out qualified of transfer head 35
The image of the nude film D3 of product carries out the device shot.
Image processing apparatus 33 is the image from the nude film D3 utilizing nude film filming apparatus 32 to shoot
Middle acquirement is for the device of the positional information of the nude film D3 of correction.
Operational part 34 is to have the function as the operational part 12 of the first embodiment, and
Positional information based on the nude film D3 for revising utilizing image processing apparatus 33 to obtain, repaiies
The parts of the positional information of the nude film D3 of positive certified products.
Below, with reference to Figure 10 and Figure 11, the action of electronic component mounting equipment is illustrated.
Here, Figure 10 is the action for the electronic component mounting equipment in the 3rd embodiment is described
Flow chart.Figure 11 is the action for the electronic component mounting equipment in the 3rd embodiment is described
Other flow chart.
Step S10 in step S30～step S34 and the first embodiment～step S14 phase
With.
Transfer head drive division 36 judges whether the taking-up quantity of nude film D3 is specified quantity (S35).
In step s 35, when the taking-up quantity of nude film D3 reaches specified quantity, utilize naked
Film shooting device 32 shoots (S36) to the image of nude film to be taken out.And, image
Processing means 33 obtain from the image of the nude film D3 utilizing nude film filming apparatus 32 to shoot for
The nude film positional information (S37) revised.Specifically, the position relative to mechanical origin is obtained
Information.It addition, operational part 34 positional information based on the nude film D3 for revising, revise
The positional information (S38) of the nude film D3 of the certified products that step S33 obtains.
And, the position letter of transfer head drive division 36 nude film based on the certified products revised D3
Breath drives transfer head 35, and the D3 taking out certified products from wafer W3 is installed on substrate B3.
On the other hand, in step s 35, the taking-up at nude film D3 is not the feelings of specified quantity
Under condition, it is judged that whether the taking-up of nude film D3 terminates (S39).And, to taking of nude film D3
Going out till terminating, the positional information of nude film D3 based on certified products takes out the nude film D3 of certified products
It is installed on substrate B3.
Below, effect is illustrated.According to the 3rd embodiment, taking out specified quantity
After nude film D3 is installed on substrate B3, obtain naked for revise from the image of nude film D3
The positional information of sheet D3.And, positional information based on the nude film D3 for revising, revise
The positional information of the nude film D3 of certified products.Therefore when wafer W3 takes out nude film D3, even if
There is the situation of the position skew of other nude film D3, it is also possible to reliably take out the naked of certified products
Sheet D3 is installed on substrate B3.
It addition, list each several part load in the third embodiment to process the example carrying out action,
But it is not limited to this.Operational part 34 can also handle together step S31 shown in Figure 10～step
S33, step S35 and step S37～step S39.
(the 4th embodiment)
Below, the electronic component mounting equipment of the 3rd embodiment is illustrated.
First, with reference to Figure 12, the composition of the electronic component mounting equipment of the 4th embodiment is carried out
Explanation.Here, Figure 12 is the block diagram of the electronic component mounting equipment in the 4th embodiment.
As shown in figure 12, electronic component mounting equipment 4 has nude film filming apparatus 40, image
Processing means 41, storage part 42, operational part 43, transfer head 44a, 44b, drive division 45.
Nude film filming apparatus 40 is to be integrally formed, relative to crystalline substance together with transfer head 44a, 44b
The device that circle W4 relative movement, image to nude film D4 shoot.
Image processing apparatus 41 is to take from the image of the nude film D4 of nude film filming apparatus 40 shooting
Obtain the dress of positional information relative to the nude film D4 of the mechanical origin of electronic component mounting equipment 4
Put.
Storage part 42 be storage obtained by precheck wafer W4 each nude film D4 with
Positional information that benchmark on wafer W4 is corresponding and the Image Data of whether qualified information structure
Parts.
Operational part 43 is acquirement conjunction from the Image Data of each nude film D4 being stored in storage part 45
The parts of the positional information of the nude film D4 of lattice product.
Transfer head 44a, 44b are to be integrally formed, relative to crystalline substance together with nude film filming apparatus 40
Circle W4 relative movement, taking-up nude film D4 are installed on the device on substrate B4.
Drive division 45 is the nude film D4 of the certified products obtained from Image Data based on operational part 43
Positional information and the positional information of nude film D4 of certified products that obtains of image processing apparatus 41,
The nude film D4 driving transfer head 44a, 44b to take out certified products from wafer W4 is installed on substrate B4
On parts.
Below, with reference to Figure 13～Figure 15, the action of electronic component mounting equipment is illustrated.
Here, Figure 13 is usual for illustrate in the electronic component mounting equipment in the 4th embodiment
The explanatory diagram of the action of pattern.Figure 14 is the electronic component peace for illustrating in the 4th embodiment
The explanatory diagram of the action of the fast mode A in assembling device.Figure 15 is for the 4th embodiment party is described
The explanatory diagram of the action of the fast mode B in the electronic component mounting equipment in formula.
For the action of electronic component mounting equipment, there is mode standard, fast mode A and height
Fast mode B Three models.These action patterns manually switch.
First, mode standard is illustrated.As shown in Figure 13 (a), utilize nude film shooting dress
Put 40 couples of nude film D40 to shoot.Image processing apparatus 41 is from the figure of the nude film D40 of shooting
The positional information of nude film D40 is obtained in Xiang.Afterwards, as shown in Figure 13 (b), based on acquirement
The positional information of nude film D40, make transfer nozzle 44a move, utilize transfer nozzle 44a to inhale
Attached nude film D40.It addition, as shown in Figure 13 (c), utilize nude film filming apparatus 40 to nude film
D41 shoots.Image processing apparatus 41 obtains nude film from the image of the nude film D41 of shooting
The positional information of D41.Afterwards, as shown in Figure 13 (d), position based on the nude film D41 obtained
Confidence breath makes transfer nozzle 44b move, and utilizes transfer nozzle 44b to adsorb nude film D41.And,
Respectively nude film D40, D41 are installed on substrate.
Below, fast mode A is illustrated.As shown in Figure 14 (a), nude film is utilized to clap
Take the photograph device 40 nude film D40 is shot.Image processing apparatus 41 is from the nude film D40 of shooting
Image in obtain nude film D40 positional information.It addition, as shown in Figure 14 (b), utilize
Nude film D41 is shot by nude film filming apparatus 40.Image processing apparatus 41 is naked from shooting
The image of sheet D41 obtains the positional information of nude film D41.Afterwards, as shown in Figure 14 (c),
Positional information based on the nude film D40 obtained makes transfer nozzle 44a move, and utilizes transfer nozzle
44a adsorbs nude film D40.It addition, as shown in Figure 14 (d), based on the nude film D41 obtained
Positional information makes transfer nozzle 44b move, and utilizes transfer nozzle 44b to adsorb nude film D41.And
And, respectively nude film D40, D41 are installed on substrate.
Below, fast mode B is illustrated.As shown in Figure 15 (a), nude film is utilized to clap
Take the photograph device 40 nude film D40 is shot.Image processing apparatus 41 is from the nude film D40 of shooting
Image in obtain nude film D40 positional information.Operational part 43 is based on image processing apparatus 41
The positional information correction Image Data of the nude film D40 obtained, obtain the positional information of nude film D41.
Afterwards, as shown in Figure 15 (b), positional information based on the nude film D40 obtained makes transfer spray
Mouth 44a moves, and utilizes transfer nozzle 44a to adsorb nude film D40.It addition, such as Figure 15 (c) institute
Show that positional information based on the nude film D41 obtained makes transfer nozzle 44b move, utilizes and move
Carry nozzle 44b and adsorb nude film D41.And, respectively nude film D40, D41 are arranged on substrate.
Below, effect is illustrated.According to the 4th embodiment, by switching to high speed mould
Formula B, it is possible to reduce shooting number of times.The naked of certified products is taken out from wafer W4 therefore, it is possible to shorten
Set-up time when sheet D4 is installed on substrate B4.
It addition, in the 4th embodiment, list the example possessing two transfer nozzles, but not
It is limited to this.Can also possess more than three.By carrying out action with fast mode B, it is possible to
To same effect.
Claims (8)
1. an electronic component mounting equipment, is constituted from by the multiple nude films being formed with electronic component
Wafer in take out the nude film of certified products and be arranged on substrate, it is characterised in that have:
Wafer shooting unit, described wafer entirety is shot by it；
Positional information acquisition unit, it is from the described wafer utilizing described wafer shooting unit photographs
Overall image obtains the positional information of each nude film；
Certified products positional information acquisition unit, it obtains according to described positional information acquisition unit
The positional information of described each nude film and the whether qualified information of each nude film, obtain the nude film of certified products
Positional information；
Installation unit, its based on described certified products positional information acquisition unit obtain described qualified
The positional information of the nude film of product, takes out the nude film of described certified products from described wafer and is installed on institute
State on substrate,
Described wafer shooting unit is arranged on described at the nude film taking out specified quantity from described wafer
After on substrate, again described wafer entirety is shot,
Described positional information acquisition unit is described in utilize the shooting of described wafer unit shoots again
The image that wafer is overall obtains the positional information of described each nude film, described certified products position again
The position of described each nude film that information acquisition unit obtains again from described positional information acquisition unit
The whether qualified information of information and described each nude film obtains the position of the nude film of described certified products again
Confidence ceases,
Described in described installation unit obtains again based on described certified products positional information acquisition unit
The positional information of the nude film of certified products, the nude film taking out described certified products from described wafer is installed on
On described substrate.
2. electronic component mounting equipment as claimed in claim 1, it is characterised in that
Described wafer has for differentiating that whether qualified whether qualified of each nude film sentences labelling,
And there is whether qualified information acquisition unit, it is from utilizing described wafer shooting unit photographs
The overall image of described wafer in, whether qualified sentence labelling based on described, obtain described respectively
The whether qualified information of nude film,
The institute that described certified products positional information acquisition unit obtains from described positional information acquisition unit
State positional information and described each nude film of described whether qualified information acquisition unit acquirement of each nude film
Whether qualified information in obtain the positional information of nude film of described certified products.
3. electronic component mounting equipment as claimed in claim 1, it is characterised in that
Having whether qualified information memory cell, its storage is taken by wafer described in precheck
The whether qualified information of the described each nude film obtained,
The institute that described certified products positional information acquisition unit obtains from described positional information acquisition unit
State positional information and described each nude film of described whether qualified information memory cell storage of each nude film
Whether qualified information in obtain the positional information of nude film of described certified products.
4. electronic component mounting equipment as claimed in claim 1, it is characterised in that
Described wafer shooting unit is the large-field shooting machine shot described wafer entirety in the lump.
5. electronic component mounting equipment as claimed in claim 1, it is characterised in that
Described wafer shooting unit is relative to described wafer relative movement and to described wafer entirety
Carry out the row scanning camera shot.
6. an electronic component mounting method, is constituted from by the multiple nude films being formed with electronic component
Wafer take out the nude film of certified products and be installed on substrate, it is characterised in that possess:
Positional information obtains operation, obtains the position of each nude film from the image that described wafer is overall
Information；
Certified products positional information obtains operation, obtains from obtain operation at described positional information
The positional information of described each nude film and the whether qualified information of each nude film obtain the nude film of certified products
Positional information；
Installation procedure, based on the described conjunction obtained in obtaining operation at described certified products positional information
The positional information of the nude film of lattice product takes out the nude film of described certified products from described wafer and is installed on institute
State on substrate,
Described positional information obtains operation from taking out the nude film of specified quantity also from described wafer
The image that the described wafer that again shoots after being arranged on described substrate is overall obtains again described respectively
The positional information of nude film,
Described certified products positional information obtains operation from obtaining operation again at described positional information
The positional information of described each nude film obtained and the whether qualified information of described each nude film take again
Obtain the positional information of the nude film of described certified products,
Described installation procedure obtains again based on obtaining in operation at described certified products positional information
The positional information of the nude film of described certified products, takes out the nude film of described certified products from described wafer
And be installed on described substrate.
7. electronic component mounting method as claimed in claim 6, it is characterised in that
There is whether qualified information and obtain operation, be based upon each nude film of differentiation whether qualified and arrange
Whether qualified sentence labelling, from the image that described wafer is overall, obtain the conjunction of described each nude film
Lattice whether information,
Described certified products positional information obtains operation and obtains from obtain operation at described positional information
The positional information of described each nude film and obtain the institute obtained in operation in described whether qualified information
State the positional information of the nude film of the whether qualified information described certified products of acquirement of each nude film.
Electronic component mounting method the most as claimed in claims 6 or 7, it is characterised in that
Described certified products positional information obtains operation and obtains from obtain operation at described positional information
The positional information of described each nude film and obtained by wafer described in precheck described each naked
The whether qualified information of sheet obtains the positional information of the nude film of described certified products.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610483290.9A CN106098567B (en) | 2011-03-09 | 2012-03-08 | Electronic component mounting equipment |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011051080A JP5721476B2 (en) | 2011-03-09 | 2011-03-09 | Electronic component mounting apparatus and electronic component mounting method |
| JP2011-051080 | 2011-03-09 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610483290.9A Division CN106098567B (en) | 2011-03-09 | 2012-03-08 | Electronic component mounting equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102683225A CN102683225A (en) | 2012-09-19 |
| CN102683225B true CN102683225B (en) | 2016-12-07 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610483290.9A Active CN106098567B (en) | 2011-03-09 | 2012-03-08 | Electronic component mounting equipment |
| CN201210059432.0A Active CN102683225B (en) | 2011-03-09 | 2012-03-08 | Electronic component mounting equipment and electronic component mounting method |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610483290.9A Active CN106098567B (en) | 2011-03-09 | 2012-03-08 | Electronic component mounting equipment |
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| CN (2) | CN106098567B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014097463A1 (en) * | 2012-12-20 | 2014-06-26 | 富士機械製造株式会社 | Die supply device |
| JP5614825B1 (en) * | 2013-11-29 | 2014-10-29 | 上野精機株式会社 | Classification device, classification method, and classification program |
| KR101496059B1 (en) | 2013-12-27 | 2015-02-25 | 세메스 주식회사 | Method of obtaining location information of dies |
| WO2016181437A1 (en) * | 2015-05-08 | 2016-11-17 | 富士機械製造株式会社 | Component mounting machine, and component supply method for component mounting machine |
| CN114798479A (en) * | 2022-03-09 | 2022-07-29 | 深圳宏芯宇电子股份有限公司 | Bare chip screening method, device, equipment and storage medium |
| CN115642098B (en) * | 2022-09-14 | 2023-12-26 | 深圳源明杰科技股份有限公司 | Chip mounting and positioning method, device, equipment and readable storage medium |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN106098567A (en) | 2016-11-09 |
| CN102683225A (en) | 2012-09-19 |
| JP2012190879A (en) | 2012-10-04 |
| CN106098567B (en) | 2018-11-02 |
| JP5721476B2 (en) | 2015-05-20 |
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Address after: Aichi Japan vertical city Patentee after: Fuji Corporation Address before: Aichi Japan vertical city Patentee before: Fuji Machinery Manufacturing Co., Ltd. |