CN102405436B - Duplexer with polaroid, the display device panel being with supporting mass, display device panel, display device and their manufacture method - Google Patents

Abstract

The invention provides the duplexer of band polaroid, the display device panel being with supporting mass, display device panel, display device and their manufacture method.The duplexer (10) of this band polaroid has: device substrate (12), and it has the 1st first type surface (12a) and the 2nd first type surface (12b); Supporting substrates (13), it has the 1st first type surface (13a) and the 2nd first type surface (13b); And resin bed (14), between the 1st first type surface of its existence and said apparatus substrate and the 1st first type surface of above-mentioned supporting substrates; Wherein, the 1st first type surface of said apparatus substrate has reflection type polarizer (11), and the surface of the above-mentioned resin bed contacted with the face having reflection type polarizer of said apparatus substrate has rippability.

Description

Duplexer with polaroid, the display device panel being with supporting mass, display device panel, display device and their manufacture method

Technical field

The display device panel of the duplexer that the present invention relates to the device substrate of the band polaroid comprised for display device, the band supporting mass comprising this duplexer, use this band supporting mass display device panel and the display device panel formed, the display device comprising this display device panel and their manufacture method.

Background technology

In the field of image display device, the particularly portable display apparatus such as digital camera or mobile phone such as liquid crystal indicator (LCD), rear-projection TV, front projector, lightweight, the slimming of display device are just becoming important problem.

In order to tackle this problem, expect that the thickness of slab of the device substrate self making to use in display device is thinning further.When glass substrate, as the usual method making thickness of slab thinning, after before carrying out having on surface display device component being formed in glass substrate or on the surface being formed in glass substrate, use hydrofluorite etc. that glass substrate is carried out to etch processes, carries out physical grinding further and the method making it thinning as required.

But carry out etch processes etc. before on surface display device component being formed in glass substrate when making the thickness of slab of glass substrate thinning, the intensity of glass substrate reduces, and deflection also increases.Therefore, create and be difficult to use the manufacturing line of existing display device panel to carry out processing such problem.

In addition, carry out etch processes etc. after on surface display device component being formed in glass substrate when making the thickness of slab of glass substrate thinning, display device component is being formed in the process on the surface of glass substrate, is creating the problem of the tiny cut apparition be formed on the surface of glass substrate, namely occur the problem that etch pit (etchpit) is such.

Therefore, for the purpose of addressing this is that, propose thin for thickness of slab glass substrate (following, also referred to as " glass sheet substrate ") is pasted together mutually with other support glass substrate be used as glass laminate, the process of implementing the regulation for the manufacture of display device in this condition, the method etc. of peeling off support glass substrate afterwards from glass sheet substrate.

Such as in patent documentation 1, record the method that following manufacture employs the display device of the glass substrate of product, namely, utilize glass substrate electrostatic adsorption force each other or vacuum adsorption force to be pasted together with reinforcement glass substrate by the glass substrate of product and integrated, thus manufacture the display device employing the glass substrate of product.

Such as in patent documentation 2, record the manufacture method of following liquid crystal indicator, that is, use the bonding agent of frit system come adhering liquid crystal device the end of substrate with supporting mass, form electrode pattern etc. afterwards, thus manufacture liquid crystal indicator.

Such as in patent documentation 3, record and there is near the end face of at least circumference of two glass substrates irradiating laser to make the manufacture method of the base board for display device of the operation of above-mentioned two glass substrates fusion.

Such as in patent documentation 4, record on supporting mass, be provided with bonding material layer substrate transporting clamp on adhesive substrate, carry out conveying substrate transporting clamp by the manufacturing process of liquid crystal display cells thus the substrate be pasted onto on substrate transporting clamp carried out to liquid crystal display cells formation processing successively, after the operation of regulation terminates, peels off the manufacture method of the liquid crystal indicator of substrate from substrate transporting clamp.

Such as in patent documentation 5, record the manufacture method of liquid crystal display cells, it is characterized in that, adhering liquid crystal display element electrode base board on the fixture being provided with ultraviolet-curing adhesive on supporting mass, after electrode base board used for liquid crystal display element being implemented to the processing of regulation, to ultraviolet-curing adhesive irradiation ultraviolet radiation, thus the bounding force of above-mentioned ultraviolet-curing adhesive is reduced, peel off above-mentioned electrode base board used for liquid crystal display element from above-mentioned fixture.

Such as in patent documentation 6, record and utilize jointing material to be temporarily fixed on by thin plate on support plate, utilize that encapsulant seals the circumference of above-mentioned jointing material, conveying is temporarily fixed with the carrying method of the support plate of thin plate.

Such as in patent documentation 7, record the stacked body of sheet glass, the stacked body of this sheet glass is laminated glass sheet substrate and support glass substrate, it is characterized in that, above-mentioned sheet glass and above-mentioned support glass substrate are by having the silicone resin layer of easy rippability and non-adhesive and stacked.And, record following content, namely, when peeling off support glass substrate from glass sheet substrate, as long as apply the power pulling open glass sheet substrate from support glass substrate to vertical direction, utilizing the blade of razor etc. to output the osculum of stripping in end, by injecting air to stacked boundary, thus can more easily peel off.

Except the trial making the thickness of slab of the glass substrate self used in display device as above thinning further, certainly also have the method for the lower thickness of the member of formation except glass substrate making formation liquid crystal display substrate.As one of them method, have and make the method that in liquid crystal indicator, indispensable, show polarized light separating power in visible region polaroid (also referred to as polarization separating element) is thinning.Usually, this polaroid carries out bonding in the mode be formed on the base material of film-form after formation liquid crystal cell.Therefore, the thickness of base film is added.On the other hand, in patent documentation 8, it is also proposed the method forming polaroid on the glass substrate.

Patent documentation 1: Japanese Unexamined Patent Publication 2000-241804 publication

Patent documentation 2: Japanese Laid-Open Patent Publication 58-54316 publication

Patent documentation 3: Japanese Unexamined Patent Publication 2003-216068 publication

Patent documentation 4: Japanese Unexamined Patent Publication 8-86993 publication

Patent documentation 5: Japanese Unexamined Patent Publication 9-105896 publication

Patent documentation 6: Japanese Unexamined Patent Publication 2000-252342 publication

Patent documentation 7: International Publication No. 2007/018028 separate edition

Patent documentation 8: Japanese Unexamined Patent Publication 2005-242080 publication

But, utilizing electrostatic adsorption force or the vacuum adsorption force use frit fixed described in glass substrate method each other, patent documentation 2 to fix to make in the method for two glass substrates fusions to irradiating laser near the end face of circumference described in the method at the two ends of glass substrate or patent documentation 3 described in patent documentation 1, closely sealed owing to not making glass substrate be laminated to each other across any middle layer, therefore produce deformation defect on the glass substrate due to the foreign matter such as bubble or dust that is mixed between glass substrate.Therefore, the glass substrate laminate obtaining surface smoothing is difficult to.

In addition, configure in the methods such as bonding coat between glass substrate described in patent documentation 4 ~ 6, although can avoid the generation deformation defect caused by the bubble etc. be mixed between glass substrate as above, be difficult to separation two glass substrate, when being separated, glass sheet substrate is likely damaged.And be separated after glass sheet substrate on adhesive residue also become problem.

On the other hand, adopt the stacked body of sheet glass described in patent documentation 7, be not easy to produce the deformation defect caused by the bubble etc. be mixed between glass substrate as above.In addition, also glass sheet substrate and support glass substrate can be peeled off.And the problem solved on adhesive residue glass sheet substrate after isolation.Therefore, this method is effective as the method that the thickness of slab of the glass substrate making to use in display device self is thinning further.

Then, the substrate being formed with polaroid on the glass substrate described in patent documentation 8, mainly as the polarization separating element of liquid crystal projection apparatus and the component made, be the component arranged separately in the middle of the optical path, making it flow in color filter formation process and tft array formation process used as substrate is impossible.This is because in above-mentioned two-step during conveying substrate, the mode conveying substrate contacted with conveying roller or metal tray with the face being formed with polaroid, therefore polaroid contacts with conveying roller or metal tray, produces the unfavorable condition producing cut on polaroid.In addition, when after combination of liquid crystals element on the glass substrate directly formed polarizer time, by the process in polaroid formation process, the organism of color filter or liquid crystal self likely deteriorated.

Summary of the invention

The present inventor has carried out conscientiously discussing to solve above-mentioned problem repeatedly, completes the present invention.

The present invention relates to following (1) ~ (14).

(1) duplexer with polaroid, this duplexer has: device substrate, and it has the 1st first type surface and the 2nd first type surface; Supporting substrates, it has the 1st first type surface and the 2nd first type surface; And resin bed, it is present between the 1st first type surface of said apparatus substrate and the 1st first type surface of above-mentioned supporting substrates; Wherein, the 1st first type surface of said apparatus substrate has reflection type polarizer, the surface contacted with the face having reflection type polarizer of said apparatus substrate of above-mentioned resin bed has rippability.

(2) duplexer of the band polaroid Gen Ju (1), wherein, above-mentioned reflection type polarizer is wire grid polarizers.

(3) duplexer of the band polaroid Gen Ju (2), wherein, the spacing (Pm) of the metal fine of above-mentioned wire grid polarizers is 50 ~ 200nm, and the width (Dm) of above-mentioned metal fine and the ratio (Dm/Pm) of spacing (Pm) are 0.1 ~ 0.6.

(4) according to the duplexer of the band polaroid according to any one of (1) ~ (3), wherein, the resin forming above-mentioned resin bed is at least one resin selected from fluororesin, acryl resin, polyolefin resin, urethane resin and organic siliconresin.

(5) according to the duplexer of the band polaroid according to any one of (1) ~ (4), wherein, the thickness of above-mentioned resin bed is 5 ~ 50 μm.

(6) according to the duplexer of the band polaroid according to any one of (1) ~ (5), wherein, said apparatus substrate is made up of identical material with above-mentioned supporting substrates, and the difference of the linear expansion coefficient of this device substrate and this supporting substrates is 150 × 10 ^-7/ DEG C below.

(7) according to the duplexer of the band polaroid according to any one of (1) ~ (5), wherein, said apparatus substrate is made up of different materials from above-mentioned supporting substrates, and the difference of the linear expansion coefficient of this device substrate and this supporting substrates is 700 × 10 ^-7/ DEG C below.

(8) the display device panel with supporting mass, wherein, the 2nd first type surface of the said apparatus substrate of the duplexer of the band polaroid according to any one of (1) ~ (7) has display device component.

(9) a display device panel, wherein, this display device panel uses the display device panel of the band supporting mass described in (8) and is formed.

(10) display device, wherein, this display device uses the display device panel described in 9 and is formed.

(11) a kind of manufacture method of the duplexer with polaroid, the duplexer of the band polaroid of duplexer according to any one of (1) ~ (7) of this band polaroid, wherein, the manufacture method of the duplexer of this band polaroid has following operation: polaroid formation process, and it forms reflection type polarizer on the 1st first type surface of said apparatus substrate; Resin bed formation process, it forms the resin bed with rippability surface on the 1st first type surface of above-mentioned supporting substrates; Closely sealed operation, it is by stacked for the supporting substrates of the device substrate of above-mentioned band reflection type polarizer and above-mentioned tape tree lipid layer, makes the rippability of above-mentioned resin bed surface closely sealed with the face having reflection type polarizer of said apparatus substrate.

(12) a kind of manufacture method of the display device panel with supporting mass, wherein, the operation during the manufacture method of the display device panel of this band supporting mass has described in (11) a manufacture method and form the operation of display device component on the 2nd first type surface of the said apparatus substrate of the duplexer of obtained band polaroid.

(13) a kind of manufacture method of display device panel, wherein, the operation during the manufacture method of this display device panel has described in (12) a manufacture method and by the stripping process of the face having reflection type polarizer of the said apparatus substrate in the display device panel of obtained band supporting mass and the rippability sur-face peeling of above-mentioned resin bed.

(14) manufacture method for display device, wherein, the manufacture method of this display device has display device panel that operation in the manufacture method described in (13) and use obtain to obtain the operation of display device.By the duplexer that the present invention obtains, a kind of duplexer that can make the band polaroid of the display device thinner than display device in the past can be provided.

In addition, a kind of method that there is not the foreign matter such as bubble or dust ground between device substrate and supporting substrates, simply and economically can manufacture the duplexer of band polaroid as above can be provided.

In addition, to provide for the purpose of a kind of display device panel comprising the band supporting mass of the duplexer of this band polaroid.

In addition, can provide and use the display device panel of this band supporting mass and the display device panel formed and display device.

And, the method for display device panel, display device panel and the display device manufacturing this band supporting mass can be provided.

Accompanying drawing explanation

Fig. 1 is the general profile chart of the embodiment of the duplexer representing band polaroid of the present invention.

Fig. 2 is the general principal view of the embodiment representing Fig. 1.

Fig. 3 is the approximate three-dimensional map of the embodiment of the device substrate representing band polaroid.

Fig. 4 is the approximate three-dimensional map of another embodiment of the device substrate representing band polaroid.

Fig. 5 is the general profile chart for illustration of the process forming raised line on web-like device substrate.

Fig. 6 is the general principal view of the embodiment of the device substrate of band raised line for illustration of embodiment 2.

Fig. 7 is the general profile chart of the evaporation condition for illustration of embodiment 2.

Embodiment

Use accompanying drawing that the embodiment of the duplexer of band polaroid of the present invention is described.

Fig. 1 is the general profile chart of the embodiment of the duplexer (following, also referred to as " duplexer ") representing band polaroid of the present invention.

Fig. 2 is the general principal view overlooked from the 2nd main surface side of the device substrate of present embodiment.But for the ease of understanding, Fig. 2 only marked the 1st first type surface of device substrate, the 1st first type surface and reflection type polarizer of supporting substrates.

The duplexer 10 of present embodiment has device substrate 12, supporting substrates 13, resin bed 14, and resin bed 14 is present between the 1st first type surface 12a of device substrate 12 and the 1st first type surface 13a of supporting substrates 13.In addition, the 1st first type surface 12a of device substrate 12 has reflection type polarizer 11.

Resin bed 14 is fixed on the 1st first type surface 13a of supporting substrates 13, closely engages with the face having reflection type polarizer 11 of device substrate 12.In addition, resin bed 14 has rippability relative to the mask having reflection type polarizer 11 of device substrate 12.At this, the first type surface by supporting substrates 13 side (resin bed 14 side) in two first type surfaces that device substrate 12 has is the 1st first type surface 12a, and the first type surface of opposition side is the 2nd first type surface 12b.And the first type surface of device substrate 12 side (having the side of resin bed 14) in two first type surfaces that supporting substrates 13 has is the 1st first type surface 13a, the first type surface of opposition side is the 2nd first type surface 13b.

Then, reflection type polarizer device substrate that duplexer of the present invention has, supporting substrates, resin bed being described respectively and being present on the 1st first type surface of device substrate.

Device substrate of the present invention is described.

The thickness, shape, size, physical characteristics (percent thermal shrinkage, surface configuration, resistance to chemical reagents etc.), composition etc. of device substrate are not restricted especially, such as can be identical with the glass substrate of display device in the past.In addition, also can be resinous substrate.

The thickness of device substrate is not restricted especially, but is preferably discontented 0.7mm, is more preferably below 0.5mm, more preferably below 0.4mm.In addition, be preferably more than 0.05mm, be more preferably more than 0.07mm, more preferably more than 0.1mm.

The shape of device substrate is not restricted especially, but is preferably rectangle.At this, rectangle is essentially substantially rectangular, also comprises the shape at the angle (corner cut) of having cut away periphery.

The size of device substrate is not restricted especially, but when such as rectangle, can be 100mm ~ 2000mm × 100mm ~ 2000mm, is preferably 500mm ~ 1000mm × 500mm ~ 1000mm.

Even this preferred thickness and preferred size, the device substrate of band polaroid and supporting substrates also can easily be peeled off by duplexer of the present invention.

The characteristic such as percent thermal shrinkage, surface configuration, resistance to chemical reagents of device substrate is not also restricted especially, different because of the kind of manufactured display device.

But the percent thermal shrinkage of preferred embodiment substrate is less.Specifically, if device substrate is glass, then the linear expansion coefficient of the index of percent thermal shrinkage is preferably used as to be 150 × 10 ^-7/ DEG C below substrate, be more preferably 100 × 10 ^-7/ DEG C below, further preferably linear expansion coefficient is 45 × 10 ^-7/ DEG C below.If device substrate is synthetic resin, then preferably use 700 × 10 ^-7/ DEG C below substrate, be more preferably 650 × 10 ^-7/ DEG C below, more preferably 500 × 10 ^-7/ DEG C below.Its reason is because be difficult to the display device making fine when percent thermal shrinkage is larger.In addition, when device substrate be glass situation and for synthetic resin, the linear expansion coefficient of equal preferred embodiment substrate is 5 × 10 ^-7/ DEG C more than.

In addition, in the present invention, linear expansion coefficient refers to the linear expansion coefficient of regulation in Japanese Industrial Standards JISR3102 (nineteen ninety-five).

When device substrate is glass, its composition can be identical with the such as in the past known glass containing alkaline metal oxide or alkali-free glass.Wherein, because percent thermal shrinkage is less, be therefore preferably alkali-free glass.

On the other hand, when resin-made substrate, as long as have the resin of the transparency, be not just restricted especially.But, as the purposes of advantageous applications duplexer of the present invention, be liquid crystal indicator.Therefore, the following resin of preferred use, it is the resin be made up of heat-curing resins such as thermoplastic resin or epoxy, clear polyimides, acrylic acid such as polyester, polycarbonate, polyarylate, polyethersulfone, poly-(ring) alkene, and it has optical isotropy.

Then, supporting substrates of the present invention is described.

Supporting substrates across resin bed fulcrum arrangement substrate, the intensity of stiffening device substrate.

The thickness, shape, size, physical characteristics (percent thermal shrinkage, surface configuration, resistance to chemical reagents etc.), composition etc. of supporting substrates are not restricted especially.

The thickness of supporting substrates is not restricted especially, but must be the thickness that can process duplexer of the present invention with the manufacturing line of existing display device panel.

Such as be preferably the thickness of 0.1mm ~ 1.1mm, be more preferably 0.3mm ~ 0.8mm, more preferably 0.4mm ~ 0.7mm.

Such as, when existing manufacturing line is designed to the substrate that can process thickness 0.5mm, when the thickness of device substrate is 0.1mm, the thickness sum of the thickness of supporting substrates and resin bed is set to 0.4mm.In addition, the glass substrate being designed to existing manufacturing line can process thickness 0.7mm is the most general, if the thickness of such as device substrate is 0.4mm, then the thickness sum of the thickness of supporting substrates and resin bed is set to 0.3mm.

The thickness of the Thickness Ratio said apparatus substrate of preferred supporting substrates is thick.

The shape of supporting substrates is not restricted especially, but is preferably rectangle.At this, rectangle is essentially substantially rectangular, also comprises the shape at the angle (corner cut) of having cut away periphery.

The size of supporting substrates is not restricted especially, but is preferably the degree identical with the size of device substrate, preferably larger a little than said apparatus substrate (large about the 0.05mm ~ 10mm of vertical or horizontal difference).Reason is because can easily prevent from contacting with device substrate and the end of damage device substrate and more easily can carry out the stripping of device substrate and supporting substrates at locating devices such as the register pins manufacturing display device panel.

At this, longitudinally refer to the short side direction of device substrate in Fig. 2, the direction of arrow Xa, laterally refer to the long side direction of device substrate in Fig. 2, the direction of arrow Xb.

The linear expansion coefficient of supporting substrates can be identical in fact with the linear expansion coefficient of device substrate, also can be different.When identical in fact, when heat-treating the duplexer of present embodiment, it is preferred for device substrate or supporting substrates being difficult to produce in warpage this point.

Device substrate is made up of identical material with supporting substrates, and preferably the difference of the linear expansion coefficient of this device substrate and this supporting substrates is 150 × 10 ^-7/ DEG C below, be more preferably 100 × 10 ^-7/ DEG C below, more preferably 50 × 10 ^-7/ DEG C below.

Device substrate is made up of different materials from supporting substrates, and preferably the difference of the linear expansion coefficient of this device substrate and this supporting substrates is 700 × 10 ^-7/ DEG C below, be more preferably 650 × 10 ^-7/ DEG C below, more preferably 500 × 10 ^-7/ DEG C below.

The material of supporting substrates is not restricted especially, can be glass system, synthetic resin system, metal etc., as long as can the material with rigidity of fulcrum arrangement substrate, its material be just unrestricted.

When the material as supporting substrates adopts glass, its composition can with such as identical containing the glass of alkaline metal oxide, alkali-free glass.Wherein, because percent thermal shrinkage is less, be therefore preferably alkali-free glass.

When the material as supporting substrates adopts plastics (synthetic resin), its kind is not restricted especially, and such as illustrating has pet resin, poly-(ring) olefin resin, polycarbonate resin, polyimide resin, fluororesin, polyamide, Nomex resin, polyethersulfone resin, polyether ketone resin, polyether-ether-ketone resin, PEN resin, poly epoxy resin, polyacrylic resin, various liquid crystal polymer resin, organic siliconresin etc.

When the material as supporting substrates adopts metal, its kind is not restricted especially, and such as illustrating has stainless steel, copper etc.

Then, resin bed of the present invention is described.

In duplexer of the present invention, resin bed is fixed on the 1st first type surface of above-mentioned supporting substrates.And resin bed closely engages with the face having reflection type polarizer of said apparatus substrate, but this resin bed can easily be peeled off.That is, resin bed combines with adhesion to a certain degree relative to the face having reflection type polarizer, but not apply harmful effect ground to reflection type polarizer when peeling off, the adhesion of degree that can easily peel off combines.Such as, when peeling off, the structure ground of reflection type polarizer can not be damaged and do not peel off with producing resin residue on the surface at reflection type polarizer.In the present invention, the character that can easily peel off of resin layer surface is called rippability.

In duplexer of the present invention, the face having reflection type polarizer and the resin bed of preferred embodiment substrate be not utilize as bonding agent the bonding force that has mutually bonding, but mutually bonding by the power caused by the Van der Waals force between molecular solids, i.e. closing force.

On the other hand, the adhesion of the 1st first type surface of resin bed and above-mentioned supporting substrates is relatively higher than resin bed and the adhesion in face having reflection type polarizer.In the present invention, the combination having the face of reflection type polarizer of resin bed and device substrate is called closely sealed, the combination of the 1st first type surface of resin bed and supporting substrates is called fixing.In addition, below, also by the face having reflection type polarizer of device substrate referred to as device substrate surface or the 1st first type surface of device substrate.

The thickness of resin bed is not restricted especially, but is preferably 5 μm ~ 50 μm, is more preferably 5 μm ~ 30 μm, more preferably 7 μm ~ 20 μm.This is because when the thickness of resin bed is in this scope, device substrate surface is fully closely sealed with resin bed.In addition, this is because, even if be folded with bubble or foreign matter, also deformation defect can be produced by restraining device substrate.In addition, when the thickness of resin bed is blocked up, needing time and material when forming resin bed, is therefore uneconomic.

In addition, resin bed also can be formed more than two-layer.In this case, " thickness of resin bed " refers to the aggregate thickness of all layers.

In addition, at resin bed by when forming more than two-layer, the kind forming the resin of each layer also can be different.

The surface tension on resin bed its rippability surface preferred is below 30mN/m, is more preferably below 25mN/m, more preferably below 22mN/m.In addition, the surface tension on resin bed its rippability surface preferred is more than 15mN/m.This is because, when for this surface tension, can more easily by resin bed from device substrate sur-face peeling, simultaneously resin bed and device substrate surface is closely sealed also abundant.

In addition, preferred resin layer by glass transition point lower than room temperature (about 25 DEG C) or do not have the material of glass transition point to form.This is because, inviscid resin bed can be become like this, there is higher rippability, can more easily by resin bed from device substrate sur-face peeling, simultaneously resin bed and device substrate surface is closely sealed also abundant.

In addition, preferred resin layer has thermotolerance.This is because, such as, when forming display device component on the 2nd first type surface of said apparatus substrate, heat treated can supply duplexer of the present invention.

In addition, when the elastic modulus of resin bed is too high, due to the tendency that the adaptation with resin bed and device substrate surface reduces, therefore not preferred.In addition, when elastic modulus is too low, rippability reduces.

The kind forming the resin of resin bed is not restricted especially.Such as can enumerate fluororesin, acryl resin, polyolefin resin, urethane resin and organic siliconresin.Also can several resin used in combination.Wherein, preferred organic siliconresin.This is because heat resistance of organic silicon resin is excellent, and, excellent relative to the rippability of device substrate.And, this is because, when forming silicone resin layer when making curable silicone resin solidification on support substrate surface, according to the condensation reaction between the silanol of support substrate surface, be easy to fixing resin layer on supporting substrates.Even if silicone resin layer substantially not deteriorated this point is also being also such as preferred with 300 DEG C ~ about 400 DEG C process 1 hours, rippability.

In addition, the solidfied material of resin bed curable silicone of preferred peeling paper in organic siliconresin.Peeling paper organosilicon to comprise the organosilicon of the diformazan polysiloxane of straight-chain for host in molecule.The resin bed using catalyzer, Photoepolymerizationinitiater initiater etc. that the composition comprising this host and crosslinking chemical is solidified to form on the surface (the 1st first type surface) of above-mentioned supporting substrates, has excellent rippability, therefore preferably.In addition, because flexibility is high, even if be therefore mixed into the foreign matter such as bubble or dust between device substrate and resin bed, also deformation defect can be produced by restraining device substrate.

This peeling paper organosilicon is categorized as condensation reaction type organosilicon, addition reaction-type organosilicon, ultraviolet hardening organosilicon and electronic beam solidified organosilicon according to its curing mechanism, can use any one organosilicon.Among those, preferred addition reaction-type organosilicon.This is because rippability degree when being easily cured reaction, formation resin bed is good, and thermotolerance is also high.

In addition, peeling paper organosilicon morphologically has solvent-borne type, emulsion-type and no-solvent type, also can use the organosilicon of any one type.In these organosilicons, preferred no-solvent type.This is because, excellent in productivity, security, protection of the environment characteristic.And, this is because, when forming resin bed owing to not being included in the curing process that carries out, be heating and curing, ultraviolet curing or electronic beam curing time produce the solvent of bubble, therefore in resin bed, bubble is difficult to remain.

In addition, as peeling paper organosilicon, specifically, as the trade name that market is sold or model, KNS-320A can be enumerated, KS-847 (being organosilicon company of SHIN-ETSU HANTOTAI to manufacture), TPR6700 (manufacture of organosilicon company of GE Toshiba), the combination of ethene organosilicon " 8500 " (Arakawa Chemical Industries, Ltd.'s manufacture) and methylhydrogenpolysi,oxane " 12031 " (Arakawa Chemical Industries, Ltd. manufactures), the combination of ethene organosilicon " 11364 " (Arakawa Chemical Industries, Ltd.'s manufacture) and methylhydrogenpolysi,oxane " 12031 " (Arakawa Chemical Industries, Ltd. manufactures), the combination etc. of ethene organosilicon " 11365 " (Arakawa Chemical Industries, Ltd.'s manufacture) and methylhydrogenpolysi,oxane " 12031 " (Arakawa Chemical Industries, Ltd. manufactures).

In addition, KNS-320A, KS-847 and TPR6700 are the organosilicon in advance containing host and crosslinking chemical.

In addition, the organic siliconresin composition had in silicone resin layer being preferably formed resin bed is difficult to character, the i.e. low organosilicon animal migration of moving to device substrate.

Then, reflection type polarizer of the present invention is described.

Polaroid is that must use in the image display devices such as liquid crystal indicator, rear-projection TV, front projector, represent polarized light separating power in visible region element.In polaroid (also referred to as polarization separating element), there are absorption-type polaroid and reflection type polarizer.

Absorption-type polaroid is the polaroid such as making the dichroism pigments such as iodine orientation in resin film, and thermotolerance is low.

On the other hand, reflection type polarizer has the light reflected by making not incide polaroid and again incides polaroid and can improve the feature of the utilization ratio of light.Therefore, for the purpose of the high brightness of LCD etc., the demand of reflection type polarizer improves.

As reflection type polarizer, there are circular polarizing disk, wire grid polarizers that the linear polarization sheet, the cholesteryl liquid crystal that are made up of birefringence laminated resin body are formed.Wherein, the object of the present invention that the slimming for display device is such, particularly preferably wire grid polarizers.

Wire grid polarizers has the structure being parallel to each other on light-transmitting substrate and being arranged with multiple metal fine with constant spacing.When the wavelength of the gap ratio incident light of metal fine is abundant in short-term, in incident light, that there is the electric field intensity orthogonal with the length direction of metal fine composition (i.e. p polarized light) through, the composition (i.e. s polarized light) with the electric field intensity parallel with the length direction of metal fine is reflected.

Fig. 3 and Fig. 4 is the approximate three-dimensional map as being formed with the device substrate of the band polaroid of a part for the duplexer of the present invention of wire grid polarizers on the 1st first type surface of device substrate.

As the wire grid polarizers showing polarized light separating power in visible region, the wire grid polarizers being formed with metal fine 35 on the 1st first type surface 32a of device substrate 32 with the width of regulation, spacing and length as shown in Figure 3 can be enumerated; As shown in Figure 4 with the width of regulation, spacing, highly, the length top that is formed in the multiple raised lines 46 on the 1st first type surface 42a of device substrate 42 covers by the film 47 be made up of metal material and formed the wire grid polarizers of metal fine; And on the 1st first type surface of board device with regulation width, spacing and be highly formed with metal fine and antiradar reflectivity component (SiO ₂deng) wire grid polarizers etc.

Then, the shape of the metal fine of wire grid polarizers is described.The height H m of preferable alloy fine rule is 30nm ~ 200nm, is more preferably 40nm ~ 150nm.As long as this height, just can particularly suppress in short wavelength region s polarized light through, wire grid polarizers can play fully high polarized light separating power.In addition, owing to inhibit the generation of the diffraction phenomena caused by metal fine, therefore, it is possible to suppress the transmitance of polaroid to reduce.

The basic function of wire grid polarizers is determined by the width D m of metal fine and spacing Pm.As shown in Figures 3 and 4, the width D m of metal fine is the distance in the direction orthogonal with the length Lm direction of metal fine, and the spacing Pm of metal fine is the repeat distance of the Width of metal fine.The width D m of preferable alloy fine rule is 0.1 ~ 0.6 with the ratio of the ratio (Dm/Pm) of spacing Pm, is more preferably 0.2 ~ 0.5.By the ratio of Dm/Pm is set to more than 0.1, wire grid polarizers shows for the high further degree of polarization of light from surface (being formed with the face of metal fine) side incidence.Improve further by the ratio of Dm/Pm being set to less than 0.6, p polarized light transmitance.

The spacing Pm of preferable alloy fine rule is below 300nm, is more preferably 50nm ~ below 200nm.By the spacing Pm of metal fine is set to below 300nm, even if wire grid polarizers shows the also fully high polarized light separating power of fully high reflectivity and the short wavelength region near 400nm.In addition, inhibit the coloring phenomenon caused by diffraction.

More preferably the width D m of metal fine is 10nm ~ 120nm, when further contemplating easiness when to utilize evaporation on the top of raised line to carry out the formation of metal level, and particularly preferably 30nm ~ 100nm.

As long as the material of metal fine has the metal material of sufficient electric conductivity, except electric conductivity, preferably have also contemplated that the material of the characteristics such as corrosion resistance.As metal material, metallic monomer, alloy, metal etc. containing the impurity below alloy or ormal weight can be enumerated.Such as can enumerate aluminium, silver, chromium, magnesium, aluminum series alloy, silver system alloy etc.In addition, alloy etc. also can be used as to comprise the metal of the nonmetalloids such as carbon.For, visible ray high relative to visible light reflectance absorption less and there is higher conductance this point, preferred aluminium, aluminum series alloy, silver, chromium, magnesium, particularly preferably aluminium or aluminum series alloy.

In addition, metal fine can be formed directly on the 1st first type surface of device substrate, also can across the basalis of metal oxide etc.In addition, as mentioned above, also can be formed in and be formed at the cambial raised line of the raised line be made up of materials such as resins on the 1st first type surface of device substrate on the surface.

By the 2nd first type surface of the device substrate of the above-mentioned band polaroid in this duplexer of the present invention forms display device component, the display device panel of band supporting mass can be obtained.

Display device component refers to, the protective seam had on the surface of the device substrate of liquid crystal indicator in the past, tft array (hereinafter referred to as " array "), color filter, liquid crystal, the transparency electrode, various circuit patterns etc. that are made up of tin indium oxide (ITO) or zinc paste etc.

In the display device panel of band supporting mass of the present invention, such as, also comprise the form making the array forming surface of the display device panel of the band supporting mass of the present invention being formed with array on the 2nd first type surface of device substrate by encapsulant etc., paste mutually with the color filter forming surface of display device panel of another band supporting mass of the present invention being formed with color filter on the 2nd first type surface of device substrate.

In addition, according to the display device panel of this band supporting mass, display device panel can be obtained.From the device substrate of the display device panel of the resin bed release band supporting mass be fixed on supporting substrates, display device panel and display device can be obtained.As display device, liquid crystal indicator can be enumerated.As liquid crystal indicator, TN type, STN type, FE type, TFT type, mim type can be enumerated.

Then, the manufacture method of duplexer of the present invention is described.

The manufacture method of duplexer of the present invention is not restricted especially, be preferably and manufacture duplexer with the manufacture method of following duplexer, namely, the manufacture method of this duplexer has the polaroid formation process forming reflection type polarizer on the 1st first type surface of said apparatus substrate, 1st first type surface of above-mentioned supporting substrates is formed the resin bed formation process with the resin bed on rippability surface, the device substrate of stacked above-mentioned band reflection type polarizer and the supporting substrates of above-mentioned tape tree lipid layer and make the closely sealed operation that the rippability of above-mentioned resin bed surface closely engages with the face having reflection type polarizer of said apparatus substrate.Below, by this manufacture method also referred to as " manufacture method of the present invention ".

The manufacture method of the said apparatus substrate in manufacture method of the present invention and above-mentioned supporting substrates self is not restricted especially.Can known method be used respectively manufacture.Such as when substrate is glass, such as after the known frit of melting is as melten glass, draw (slot down) method under utilizing float glass process, fusion method, drop-down (down draw) method, discharge orifice, traction method again (redraw) method etc. can be configured as tabular, thus obtain glass substrate.

Polaroid formation process in manufacture method of the present invention is described.

As the method forming wire grid polarizers on device substrate, be not restricted especially.Such as can adopt the 2 kinds of methods enumerated below.A kind of be after metallic film is formed on device substrate, use photoetching process to form the method for metal fine.And another kind forms the resin bed with raised line, the method utilizing the method such as evaporation or CVD formation metal level, formation metal fine on the top of this raised line on device substrate.

As forming the method with the resin bed of raised line on device substrate, stamped method (light stamped method, hot stamping) can be enumerated, for throughput rate forming raised line this point and can the groove this point of roller mould accurately, particularly preferably light stamped method well.

Optical pressure print rule in this way by the combination of electron beam drawing and etching make be parallel to each other and on having the mould of multiple groove with the gap-forming specified, being transferred to the groove of this mould on the surface coating any base material Photocurable composition, make this Photocurable composition photocuring simultaneously and form the method for the resin bed with raised line.

Specifically, the making of the raised line of light stamped method is carried out via following operation (A) ~ (D).

(A) Photocurable composition is coated on the operation on the 1st first type surface of device substrate.

(B) by have the mould of the multiple grooves be parallel to each other to contact with Photocurable composition with groove with the gap-forming of regulation mode by the operation be pressed on Photocurable composition.

(C) making irradiating radioactive ray (ultraviolet, electron beam etc.) under the state of mold compresses on Photocurable composition Photocurable composition solidify, making the operation with the resin bed of the multiple raised lines corresponding with the groove of mould.

(D) operation of mould is peeled off from the resin bed with multiple raised line.

Specifically, the making of the raised line of hot stamping is carried out via following operation (E) ~ (G).

(E) on the 1st first type surface of device substrate, form the operation being transferred film of thermoplastic resin or make the operation being transferred film of thermoplastic resin.

(F) by have with the gap-forming of regulation the mould of the multiple grooves be parallel to each other with groove be transferred film or be transferred mode that film contacts by be pressed in be heated to thermoplastic resin glass transition temperature (Tg) or fusing point (Tm) more than be transferred film or be transferred on film, make the operation of the resin bed with the multiple raised lines corresponding with the groove of mould.

(G) resin bed with multiple raised line is cooled to the temperature lower than Tg or Tm and from the operation of mould peeling base.

After utilizing stamped method formation raised line, from the oblique upper evaporation metal material of multiple raised line, thus form metal fine.As vapour deposition method, the physical vapor depositions such as vacuum vapour deposition, sputtering method, ion plating method can be enumerated.

In addition, when the thickness of device substrate is very thin, such as, when below 0.1mm, it can be web-like take-up mechanism substrate self.Therefore, the device substrate temporarily batched in web-like is arranged on outlet roller, carrying device substrate continuously, uses the resin-coated parts of polaroid to form polaroid resin bed on the 1st first type surface of device substrate.Afterwards, make above-mentioned polaroid resin bed and the cylindrical roller close contact on curved surface with recessed bar, make raised line be transferred on polaroid resin bed, form the polaroid resin bed with raised line.Now, if use active energy ray-curable resin etc. in the polaroid resin bed with raised line, then in the stage with above-mentioned cylindrical roller close contact, from the opposition side of device substrate (polaroid of the raised line opposition side of resin bed forming surface) irradiation ultraviolet radiation etc., just can fix the shape of the raised line given more reliably, be preferred.After imparting above-mentioned raised line, the device substrate of the polaroid resin bed with raised line there is is to batch on winding roller imparting.

Then, then above-mentioned winding roller is set on the unloading part of continuous evaporation coating device, sends said apparatus substrate continuously, at the top evaporation metal material of raised line.Utilize above-mentioned operation, the 1st first type surface of device substrate forms wire grid polarizers continuously.Finally, suitably cut the device substrate being formed with wire grid polarizers continuously, become single sheet, thus can with the device substrate of very high throughput rate fabricated ribbon wire grid polarizers.

As the method forming wire grid polarizers on the device substrate of web-like, according to the height of throughput rate, particularly preferably light stamped method.Fig. 5 represents the schematic diagram utilizing light stamped method to form the method for the polaroid resin bed with raised line on the device substrate of web-like.This manufacture method is made up of the parts 57 that batch of device substrate supply part 51, polaroid resin (referring to above-mentioned Photocurable composition, as follows) coated components 52, roll 53, the gravure roll 54 be pasted onto by the tabular mould with raised line on roller curved surface, polaroid resin solidification parts 55, stripper roll 56, device substrate.

Device substrate supply part 51 sends the device substrate of web-like with resin-coated parts 52 to polaroid, by device substrate outlet roller 51a, for the protective film of stripping off device substrate stripper roll 51b, form for the winding roller 51c batching peeled off protective film.

Polaroid is by being coated with the device that polaroid resin forms polaroid resin bed on the 1st first type surface of device substrate with resin-coated parts 52, by polaroid resin supply source 52a, the dispense tip 52b of supply polaroid resin, is wrapping with and the applicator roll 52c of fulcrum arrangement substrate, forms for pipe arrangement 52d, the pump 52e supplying polaroid resin from polaroid resin supply source 52a to dispense tip 52b when being coated with.

Gravure roll 54 is the devices polaroid resin bed on the 1st first type surface coating device substrate being formed raised line, the cylindrical shape of gravure roll 54, the curved surface of gravure roll 54 is formed fine irregularities pattern that overturn the shape of the raised line being formed at polaroid resin bed, rule.Require that this fine irregularities pattern has form accuracy, physical strength, flatness etc.As the shape of fine irregularities pattern, expect for rectangle.

In addition, as the material of this gravure roll 54, be preferably metal or resin-made.

As the formation method of the fine irregularities pattern of the rule be positioned on the curved surface of gravure roll 54, can adopt utilize the cut of diamond cutter to be formed method, utilize photoetch, electron beam drawing, Laser Processing etc. to carry out the method formed.In addition, also can adopt on the surface of the thin metal tabular body of thickness of slab, to utilize photoetch, electron beam drawing, Laser Processing, photoetching molding etc. to form fine irregularities pattern, be fastened by above-mentioned tabular body forms the method for gravure roll 54 on the curved surface of the cylindrical roller of the base material as gravure roll 54.In addition, also can adopt to utilize on the surface of the tabular body being easy to the material processed than metal photoetch, electron beam drawing, Laser Processing, photoetching molding etc. formed fine irregularities patterns turnover mould, use that electroforming forms fine irregularities pattern on the surface of the thin metal tabular body of thickness of slab, be fastened by above-mentioned tabular body forms the method for gravure roll 54 on the curved surface of the base material of gravure roll 54.

Preferably on the curved surface of gravure roll 54, implement demoulding process.Like this, by implementing demoulding process on the curved surface of gravure roll 54, the shape of fine irregularities pattern can be maintained well.As demoulding process, the coating process of known various method, such as fluororesin can be adopted.In addition, preferably on gravure roll 54, driver part is provided with.

Roll 53 be with gravure roll 54 in couples press device substrate carry out the device of rolling formation processing simultaneously, require to have the physical strength, circularity etc. of regulation.When the vertical elasticity coefficient (Young modulus) on the surface of roll 53 is too small, roller formed machining is insufficient, when excessive, to more responsive during being involved in of the foreign matters such as dust, easy generation shortcoming, is therefore preferably set to suitable value, such as, be preferably 4MPa ~ 100MPa.In addition, preferably on roll 53, driver part is provided with.Roll 53 rotates along the direction contrary with gravure roll 54.Preferred gravure roll 54 is synchronous with the rotational speed of roll 53.

In order to apply the pressing force specified between gravure roll 54 and roll 53, preferably gravure roll 54 and roll 53 any one on pressure-producing part is set.Preferably gravure roll 54 and roll 53 any one on the such trickle adjustment component in the gap (space) that can control gravure roll 54 and roll 53 is exactly set.

Polaroid resin solidification parts 55 are the light irradiation elements in the downstream being relatively arranged on roll 53 with gravure roll 54.These polaroid resin solidification parts 55 are penetrated by illumination and the polaroid resin bed be formed on the 1st first type surface of device substrate are solidified.Preferably can irradiate the light of the wavelength corresponding with the curing characteristics of polaroid resin bed, the light of the light quantity corresponding with the transporting velocity of device substrate can be irradiated.As polaroid resin solidification parts 55, the cylindric lamp of length roughly the same with the width of device substrate can be adopted.In addition, this cylindric lamp multiple also can be set abreast, also reflecting plate can be set at the back side of this cylindric lamp.

In addition, when the temperature of polaroid resin bed rises such because of polaroid resin solidification parts 55, the structure that cooling-part is set on gravure roll 54 can also be adopted.

Stripper roll 56 peels off the device of the device substrate giving the resin bed with raised line in couples, requires the physical strength, circularity etc. with regulation.In stripping position, gravure roll 54 and stripper roll 56 that utilization rotates clamp the said apparatus substrate on the curved surface being wound around gravure roll 54, peel off said apparatus substrate simultaneously and be wound around in stripper roll 56 from gravure roll 54.In order to reliably carry out this action, preferably in stripper roll 56, be provided with driver part.Stripper roll 56 rotates along the direction contrary with gravure roll 54.

The parts 57 that batch of device substrate are for batching the device substrate after stripping and the device held it in web-like, being made up of the winding roller etc. of device substrate.Batch in parts 57 at this device substrate, also can adopt to device substrate the 1st main surface side supply protective film, be contained in the structure of batching in parts 57 of device substrate with the state that device substrate is overlapping with protective film.

In above-mentioned polaroid manufacture method, polaroid with between resin-coated parts 52 and gravure roll 54, the batching between parts 57 etc. of stripper roll 56 and device substrate, the guide reel etc. of the carrying path of forming apparatus substrate also can be set, in addition, in order to lax in conveying of absorption plant substrate as required, also can idler roller etc. be set.

In addition, the formation method of fine irregularities pattern not only comprise be used in cylindrical roller curved surface on be formed with the method for the gravure roll of fine irregularities pattern, also comprise the method for the component surface being used in the shoestring such as endless belt being formed with fine irregularities pattern.Even use the formation method of this shoestring, also the functions and effects identical with the formation method of cylindric gravure roll can be obtained.

After utilizing light stamped method formation raised line, utilize on the top of raised line evaporation form metal level and form metal fine, manufacture reflection type polarizer.

Then, the resin bed formation process in manufacture method of the present invention is described.

On the surface (the 1st first type surface) of supporting substrates, the upper method forming resin bed is not also restricted especially.Such as can enumerate the method for the resin bonding of film-form on the surface of supporting substrates.Specifically, can enumerate to apply higher bonding force to the surface of film and on the surface of supporting substrates, carry out surface modification treatment (linging process (priming)) and the method be bonded in by resin bed on the 1st first type surface of supporting substrates.Such as, illustrate the chemical method (prime treatment (primer)) that chemically improve closing force such just like organo silane coupling agent, as flame (frame) process, increase the physical method of surface active groups, carried out the mechanical processing method etc. of contact-enhancing by the roughness increasing surface as blasting treatment.

In addition, the method such as utilizing known method to be coated on as the resin combination of resin bed on the 1st first type surface of supporting substrates can be enumerated.As known method, spraying process, squash type rubbing method, method of spin coating, dip coating, rolling method, bar shaped rubbing method, silk screen print method, gravure coating process can be enumerated.Suitably can select from these methods according to the kind of resin combination.

Such as, when using the peeling paper organosilicon of no-solvent type as resin combination, preferred squash type rubbing method, method of spin coating or silk screen print method.

In addition, when on the 1st first type surface resin combination being coated on supporting substrates, preferably its coating weight is 1g/m ²~ 100g/m ², be more preferably 5g/m ²~ 20g/m ².

Such as when forming resin bed by addition reaction-type organosilicon, utilize the known methods such as above-mentioned spraying process to be coated on the 1st first type surface of supporting substrates by the resin combination of the organosilicon (host) of the diformazan polysiloxane be included in containing straight-chain in molecule, crosslinking chemical and catalyzer, be heated solidification afterwards.The condition that is heating and curing is also different because of the combined amount of catalyzer, but such as when total amount 100 mass parts relative to host and crosslinking chemical is mixed with platinum group catalyst 2 mass parts, make it react with 50 DEG C ~ 250 DEG C in an atmosphere, preferably make it react with 100 DEG C ~ 200 DEG C.In addition, the reaction time in this situation is set to 5 minutes ~ 60 minutes, is preferably set to 10 minutes ~ 30 minutes.In order to be set to the silicone resin layer with low organosilicon animal migration, being preferably cured reaction as much as possible and making in silicone resin layer, do not remain unreacted silicone ingredients.

When for temperature of reaction as above and reaction time, preferably can be set to and not remain unreacted silicone ingredients in silicone resin layer.When reacted cross be longer than the above-mentioned reaction time or temperature of reaction too high time, produce the oxygenolysis of organic siliconresin simultaneously and generate low-molecular-weight silicone ingredients, organosilicon animal migration likely improves.In order to make the rippability after heating good, being also preferably cured reaction as much as possible and making in silicone resin layer, do not remain unreacted silicone ingredients.

In addition, such as when using peeling paper organosilicon to manufacture resin bed, the peeling paper organosilicon be coated on the 1st first type surface of supporting substrates be heating and curing and form silicone resin layer, in closely sealed operation, making device substrate be layered in the organic siliconresin forming surface of supporting substrates afterwards.By making peeling paper organosilicon be heating and curing, organic siliconresin solidfied material and supporting substrates chemical bond.In addition, by anchor effect, silicone resin layer combines with supporting substrates.Under these effects, silicone resin layer is securely fixed on supporting substrates.

Closely sealed operation in manufacture method of the present invention is described.

Closely sealed operation is that the device substrate of stacked above-mentioned band reflection type polarizer makes with the supporting substrates of above-mentioned tape tree lipid layer the operation that the rippability of above-mentioned resin bed surface closely engages with the face having reflection type polarizer of said apparatus substrate.The rippability surface of the face having reflection type polarizer of preferred embodiment substrate and resin bed combines by the power, the i.e. closing force that are caused by the Van der Waals force between very close, relative molecular solids.In this case, supporting substrates and device substrate can remain across the stacked state of resin bed.In addition, the height of the raised line of polaroid is discontented with 100nm, and the thickness of resin bed is more than 5 μm on the other hand, therefore can follow raised line shape fully by the distortion of resin bed.

The stacked method of the supporting substrates of the device substrate of above-mentioned band reflection type polarizer and above-mentioned tape tree lipid layer is not restricted especially.Such as can use known method to implement.Such as, can be set forth under atmospheric pressure environment on the surface of resin bed after overlapping device substrate, to use roller or pressing machine to crimp the method for resin bed and device substrate.By utilizing roller or pressing machine to crimp, resin bed closely engages with device substrate, is therefore preferred.In addition, by the crimping undertaken by roller or pressing machine, the bubble be mixed between resin bed and device substrate can be removed with comparalive ease.When utilizing vacuum layer platen press or Vacuum Pressure force method crimps, inhibit being mixed into of bubble better, ensure that good closely sealed, being therefore more preferably.By crimping under vacuo, though when remaining have when small bubble bubble also can be made can not to grow up because of heating, also there is the advantage being not easy to cause the deformation defect of device substrate such.

In closely sealed operation, preferably the surface of cleaning device substrate fully when the supporting substrates of the device substrate of laminated belt reflection type polarizer and tape tree lipid layer, carries out stacked in the environment that cleanliness are high.Even if be mixed into foreign matter between resin bed and device substrate, due to resin bed distortion, therefore can not bring impact to the flatness on the surface of device substrate, but cleanliness its flatness higher being better, has therefore been preferred.

Utilize this manufacture method of the present invention, duplexer of the present invention can be manufactured.

In manufacture method of the present invention, the display device panel of fabricated ribbon supporting mass can also be carried out by the manufacture method the 2nd first type surface with the said apparatus substrate in obtained duplexer of the present invention being formed the operation of display device component.

At this, display device component is not restricted especially.Such as can enumerate array or color filter that liquid crystal indicator has.

The method forming this display device component is not also restricted especially, can be identical with known method.

Such as, when manufacturing TFT-LCD as display device, the operation that can form array on the glass substrate with known, the operation forming color filter, the various operation such as operation (array, color filter adhering processes) of pasting the glass substrate being formed with array and the glass substrate being formed with color filter by encapsulant etc. are identical.More particularly, as the process implemented in these operations, such as, can enumerate clean water, drying, film forming, resist coating, exposure, development, etching and resist and remove.And as in the operation implementing array, carry out after color filter adhering processes, the sealing process of inlet having Liquid crystal pour operation and carry out after this process is implemented, can be set forth in the process implemented in these operations.

Like this, can the display device panel of fabricated ribbon supporting mass.

In addition, after the display device panel obtaining this band supporting mass, can also by have by the display device panel of obtained band supporting mass, the face having reflection type polarizer of said apparatus substrate obtains display device panel with the manufacture method of the surperficial stripping process peeled off mutually of the rippability of above-mentioned resin bed.Stripping means is not restricted especially.Specifically, such as can thrust the component of sharp keen cutter shape or injection water and compressed-air actuated fluid-mixing to peel off to the boundary of device substrate and resin bed.Preferably with the supporting substrates side of the display device panel of above-mentioned band supporting mass become upside, panel side become downside mode be arranged on base plate, by panel side substrate vacuum suction on base plate (when being laminated with supporting substrates on two sides, carry out successively), in this condition to the band device substrate of display device panel of supporting mass and the boundary injection water of resin bed and compressed-air actuated fluid-mixing, pull open the end of supporting substrates vertically upward.Like this, air layer is formed successively at above-mentioned intersection, this air layer is expanded on whole of above-mentioned boundary, easily can peel off supporting substrates (when being laminated with supporting substrates on two first type surfaces of display device panel being with supporting mass, one side simultaneously repeats above-mentioned stripping process).

And the display device panel obtained by having use obtains the manufacture method of the operation of display device, can manufacture display device.At this, the manufacture method of display device is not restricted especially, such as, known manufacture method can be used to manufacture display device.

embodiment

embodiment 1

First long 170mm, wide 100mm, thickness of slab 0.3mm, linear expansion coefficient 38 × 10 is prepared ^-7/ DEG C device of glass substrate (Asahi Glass Co., Ltd's manufacture, AN100, alkali-free glass substrate), carry out clean water, UV cleaning come clean surface.

Afterwards, on the 1st first type surface of said apparatus substrate with 0.9 × 10 ^-5torr, aM aluminum metallization (Al), makes the Al layer of thickness 200nm.Then, the resist of method of spin coating coating thickness 100nm on Al layer (manufacture of Japanese ZEON company, ZEP520A) is utilized.Use electron beam lithography system (manufacture of HighTechnologies company of Hitachi, HL800D (50keV)), carry out EB exposure, development, formation is parallel to each other and is formed with the resist film of multiple groove (width: 100nm) with the spacing (200nm) of regulation.

Then, use plasma etching apparatus (manufacture of SAMCO Co., Ltd., RIE-140iPC), utilize SF ₆etch, remove unnecessary Al, 1st first type surface of device substrate is formed the wire grid polarizers of the Al metal fine of size (spacing Pm:200nm, width D m:100nm, height H m:200nm), obtains the device substrate of band wire grid polarizers.

Then, long 180mm, wide 110mm, thickness of slab 0.4mm, linear expansion coefficient 38 × 10 is prepared ^-7/ DEG C glass supporting substrates (Asahi Glass Co., Ltd's manufacture, AN100, alkali-free glass substrate), carry out clean water, UV cleaning come clean surface.

Afterwards, on the 1st first type surface of above-mentioned supporting substrates, screen process press is utilized to be coated with potpourri (the coating weight 30g/m of solvent-free addition reaction-type peeling paper organosilicon 100 mass parts and platinum group catalyst 2 mass parts with the size of long 178mm, wide 108mm ²).Then, be heating and curing 30 minutes with 180 DEG C in an atmosphere, obtain the silicone resin layer of thickness 20 μm.

Then, at room temperature utilize vacuum press to paste the polaroid forming surface of the device substrate of above-mentioned band wire grid polarizers and to be fixed on the surface of the silicone resin layer on the 1st first type surface of above-mentioned supporting substrates, and the center of gravity of two substrates is overlapped, obtain duplexer A (duplexer of the present invention).

In the duplexer A of this embodiment 1, device substrate and the supporting substrates of band wire grid polarizers closely do not engage with silicone resin layer with not producing bubble, and both do not had convex defect, flatness is also good.

embodiment 2

To be provided with stirring machine and condenser pipe 1000mL 4 mouthfuls of flasks in add monomer 1 (chemical industrial company of Xin Zhong village manufacture, NK ESTER A-DPH, dipentaerythritol six acrylic acid acid esters) 60g, (chemical industrial company of Xin Zhong village manufactures monomer 2, NK ESTER A-NPG, neopentyl glycol diacrylate acid esters) 40g, (CIBA SPECIALTY CHEMICALS INC. manufactures Photoepolymerizationinitiater initiater, IRGACURE907) 4.0g, (Asahi Glass Co., Ltd manufactures fluorochemical surfactant, fluorine-containing acid esters (CH ₂=CHCOO (CH ₂) ₂(CF ₂) ₈f) with co-oligomer, the Oil repellent of acryllic acid butyl ester: about 30 quality %, weight-average molecular weight: about 3000) 0.1g, polymerization inhibitor (manufacture with Guang Chun medicine company, Q1301) 1.0g and cyclohexanone 65.0g.

Under the state being set to normal temperature and lucifuge in flask, stir and make its homogenising in 1 hour.Then, in stirred flask, on one side colloidal silica 100g (solid constituent: 30g) is slowly added, further within 1 hour, making its homogenising by stirring under the state being set to normal temperature and lucifuge in flask.Then, add cyclohexanone 340g, stir 1 hour under the state being set to normal temperature and lucifuge in flask, obtain the solution of Photocurable composition.

Then, at long 500mm, wide 400mm, thickness of slab 0.3mm, linear expansion coefficient 38 × 10 ^-7/ DEG C device of glass substrate (Asahi Glass Co., Ltd's manufacture, AN100, alkali-free glass substrate) the 1st first type surface on, utilize method of spin coating to be coated with Photocurable composition, form the polaroid resin bed be made up of the Photocurable composition of thickness 1 μm.

With 25 DEG C, 0.5MPa (gauge pressure) by the quartzy molding jig (die area: long 150mm × wide 130mm, fine irregularities pattern area: long 140mm × wide 120mm, separation: 150nm, groove width: 50nm, groove depth: 100nm, flute length: 140mm, groove cross-sectional shape: rectangle) being formed with the multiple grooves be parallel to each other as fine irregularities pattern using the spacing of regulation by being pressed on the polaroid resin bed that is formed on the 1st first type surface of device substrate.

Former state keeps this state, irradiates high-pressure sodium lamp (frequency: 1.5kHz ~ 2.0kHz, predominant wavelength light: the irradiation energy 255nm, 315nm and 365nm: 1000mJ/cm from the rear side (opposition side of fine irregularities pattern forming surface) of quartzy molding jig ²) light 15 second, polaroid resin bed is solidified, makes and there is the polaroid resin bed (raised line spacing: 150nm, raised line width: 50nm, raised line height: 100nm) of the multiple raised lines corresponding with the groove of quartzy molding jig.Then, from device substrate, quartzy molding jig is slowly peeled off.

A device substrate repeats implement to be penetrated by the pressing of quartzy molding jig, illumination, a succession of operation that the stripping of quartzy molding jig is formed.Fig. 6 is general principal view be formed with multiple raised line on the 1st first type surface of a device substrate, that be with the device substrate of raised line.Amount to 9 positions form raised lines 61 in longitudinally 3 positions, horizontal 3 positions of the 1st first type surface 62a of device substrate.In addition, the gap Wp not being formed with raised line 61 is 10mm.

Afterwards, use can change the vacuum deposition apparatus (manufacture of Showa vacuum company, SEC-16CM) at the angle of inclination of the device substrate relative with vapor deposition source, the top evaporating Al of the raised line on the 1st first type surface being formed at device substrate, 1st first type surface of device substrate forms metal fine, obtains the device substrate of band wire grid polarizers.The skeleton diagram of evaporation coating method has been shown in Fig. 7.Utilize roughly orthogonal from the length direction relative to raised line 76 and relative to raised line short transverse the 1st 76a side, side of raised line angularly 30 degree direction V1 evaporation and from the length direction relative to raised line roughly orthogonal and relative to raised line short transverse the 2nd 76b side, side of raised line angularly 30 degree direction V2 evaporation in each evaporation at the Al layer of raised line top formation thickness 25nm, at the Al layer of the top of raised line formation width 50nm, thickness 50nm.

Then, at long 500mm, wide 400mm, thickness of slab 0.4mm, linear expansion coefficient 38 × 10 ^-7/ DEG C supporting substrates (Asahi Glass Co., Ltd manufacture, AN100) the 1st first type surface on, be blended in two ends there is the straight-chain polysiloxane of vinyl and there is the methylhydrogenpolysi,oxane of hydrosilyl in molecule, then, it is mixed mutually with platinum group catalyst and prepares potpourri, utilize extrusion coater to carry out being coated with (coating weight 20g/m with the area of long 498mm, wide 398mm ²), be heating and curing 30 minutes with 180 DEG C in an atmosphere, form the silicone resin layer of thickness 20 μm.At this, the mixing ratio of adjustment straight-chain polysiloxane and methylhydrogenpolysi,oxane, makes the mol ratio of hydrosilyl and vinyl be 1/1.Platinum group catalyst 5 mass parts is added relative to total 100 mass parts of straight-chain polysiloxane and methylhydrogenpolysi,oxane.

Then, at room temperature utilize vacuum press to the surface of the silicone resin layer on the 1st first type surface of the polaroid forming surface and above-mentioned supporting substrates of pasting the device substrate of above-mentioned band wire grid polarizers, obtain duplexer B (duplexer of the present invention).

In the duplexer B of this embodiment 2, device substrate and the supporting substrates of band polaroid closely do not engage with silicone resin layer with not producing bubble, and both do not had convex defect, flatness is also good.

embodiment 3

Utilize fusion method shaped wire expansion coefficient 38 × 10 continuously ^-7/ DEG C, the device of glass substrate (Asahi Glass Co., Ltd's manufacture, AN100, alkali-free glass substrate) of thick 0.1mm, wide 400mm, slowly after cooling, the tygon made membrane of thick 30 μm of thermal welding on two first type surfaces of device substrate.Afterwards, the spool of core diameter 200mm batches the said apparatus substrate of long 50m, is formed as web-like.Then, the device substrate unloading part of the continuous WEB coating machine of Toshiba Machine Co. Ltd's manufacture arranges the said apparatus substrate of web-like, the tygon made membrane of hot-rolling to the side becoming the 1st first type surface is utilized again to heat afterwards, peel off the 1st first type surface and tygon made membrane surface simultaneously continuously, then utilize the resin-coated parts of polaroid to be above coated with at the 1st first type surface (not having the face of tygon made membrane) of device substrate the polaroid resin be made up of above-mentioned Photocurable composition.

In the metallic roll (wide 450mm, diameter 250mm) implementing chromium plating, with the curved surface being interposed between metallic roll between 61mm is pasted 3 with the gap-forming of regulation have the multiple grooves be parallel to each other, the nickel molding jig of thick 0.2mm (die area: 150mm × 400mm, pattern area: 120mm × 170mm, pattern number: two, area of the pattern interval: 20mm, separation: 150nm, groove width: 50nm, groove depth: 100nm, flute length: 120mm, groove cross-sectional shape: rectangle), make gravure roll.In the mode that the groove on the curved surface of above-mentioned gravure roll contacts with the polaroid resin bed on the 1st first type surface being formed in device substrate, use roll to gravure roll direction press device substrate.Environment temperature during pressing is 25 DEG C.

Former state keeps this pressed state, from tygon made membrane side (the 2nd main surface side of device substrate) Continuous irradiation high-pressure sodium lamp (frequency: 1.5kHz ~ 2.0kHz, predominant wavelength light: the irradiation energy 255nm, 315nm and 365nm: 1000mJ/cm ²) light, polaroid resin bed is solidified, produces the polaroid resin bed (raised line spacing: 150nm, raised line width: 50nm, raised line height: 100nm) with the raised line corresponding with the groove of nickel molding jig.After use stripper roll peels off nickel molding jig from device substrate, device substrate is batched on winding roller.On the 1st first type surface of batched web-like device substrate, there is raised line in two positions of the Width of device substrate with the gap-forming of 30mm, be formed with raised line continuously with the interval of 30mm along its length.

The above-mentioned web-like device substrate batched is arranged on the unloading part of continuous evaporation coating device, with deposition angles 25 degree to 30 degree evaporating Al continuously, forms the Al layer of wide 50nm, thick 50nm on the top of raised line.By above operation, the 1st first type surface of glass sheet substrate forms wire grid polarizers continuously.

Be formed with the device substrate of wire grid polarizers with the cut-space of long 750mm continuously, obtain the device substrate of band wire grid polarizers of sheet of long 750mm, wide 400mm, thick 0.1mm.

Then, at long 760mm, wide 405mm, thickness of slab 0.6mm, linear expansion coefficient 38 × 10 ^-7/ DEG C glass supporting substrates (Asahi Glass Co., Ltd's manufacture, AN 100, alkali-free glass substrate) the 1st first type surface on, be blended in two ends there is the straight-chain polysiloxane of vinyl and there is the methylhydrogenpolysi,oxane of hydrosilyl in molecule, then, it is mixed mutually with platinum group catalyst and prepares potpourri, utilize extrusion coater to carry out being coated with (coating weight 20g/m with the area of long 757mm, wide 402mm ²), be heating and curing 30 minutes with 180 DEG C in an atmosphere, form the silicone resin layer of thickness 20 μm.At this, the mixing ratio of adjustment straight-chain polysiloxane and methylhydrogenpolysi,oxane, makes the mol ratio of hydrosilyl and vinyl be 1/1.Relative to total 100 mass parts of straight-chain polysiloxane and methylhydrogenpolysi,oxane, add platinum group catalyst 5 mass parts.

Then, at room temperature utilize vacuum press to the surface of the silicone resin layer on the 1st first type surface of the polaroid forming surface and above-mentioned supporting substrates of pasting the device substrate of above-mentioned band wire grid polarizers, obtain duplexer C (duplexer of the present invention).

In the duplexer C of this embodiment 3, device substrate and the supporting substrates of band polaroid closely do not engage with silicone resin layer with not producing bubble, and both do not had convex defect, flatness is also good.

embodiment 4

Except Photocurable composition being replaced with thermotolerance organic siliconresin (manufacture of ADEKA company, FX-V550), other are all identical with embodiment 2, not to be formed with the interval of the gap 10mm of raised line on the 1st first type surface of device substrate, in vertical 3 positions, laterally 3 positions amount to 9 positions and form raised lines.

And ground sticker substrate identical with embodiment 2 and supporting substrates, obtain duplexer D (duplexer of the present invention).

In the duplexer D of this embodiment 4, device substrate and the supporting substrates of band polaroid closely do not engage with silicone resin layer with not producing bubble, and both do not had convex defect, flatness is also good.

embodiment 5

In the present example, duplexer B, the D of acquisition in embodiment 2,4 is used in manufacture liquid crystal indicator.

Prepare duplexer D, on the 2nd first type surface of device substrate, form array to the supply of array formation process.On the other hand, duplexer B forms color filter to the supply of color filter formation process on the 2nd first type surface of device substrate.Paste by encapsulant and be formed with the duplexer D of array and be formed with the duplexer B of color filter, obtain the display device panel of band supporting mass.In addition, be designed to duplexer D in advance, the polarization axle of polaroid of duplexer B becomes suitable combination.Then, the supporting mass (supporting substrates) on two first type surfaces of the display device panel being fixed on band supporting mass is peeled off.Stripping means is on each face of above-mentioned two first type surfaces, is spraying on the basis of the fluid-mixing of pressurized air and water to the boundary of resin bed and thin plate duplexer, peels off supporting substrates.Device substrate after stripping outwardly less than causing intensity to reduce such cut.And, polaroid also be can't see the cut causing display performance to reduce.

Then, after the device substrate peeling off supporting substrates being blocked 54 elements into long 51mm × wide 38mm, implement the sealing process of Liquid crystal pour operation and inlet and form liquid crystal cell.Then implement module generation operation and obtain liquid crystal indicator.The liquid crystal indicator obtained like this can not produce the problem in characteristic.

embodiment 6

In the present example, use the duplexer C obtained in embodiment 3 to manufacture very thin liquid crystal indicator.

Prepare two duplexer C, one forms array to the supply of array formation process on the 2nd first type surface of device substrate.Remaining one forms color filter to the supply of color filter formation process on the 2nd first type surface of device substrate.The polarization axle aliging polaroid towards basis on, by encapsulant paste be formed the duplexer of array be formed with the duplexer of color filter, obtain band supporting mass display device panel.Afterwards, the supporting mass (supporting substrates) on two first type surfaces of the display device panel adhering to band supporting mass is peeled off.Stripping means is on each face of above-mentioned two first type surfaces, is spraying on the basis of the fluid-mixing of pressurized air and water to the boundary of resin bed and thin plate duplexer, peels off supporting substrates.Device substrate after stripping outwardly less than causing intensity to reduce such cut.And, polaroid also be can't see the cut causing display performance to reduce.

Afterwards, after the device substrate peeling off supporting substrates being blocked 64 elements into long 51mm × wide 38mm, implement the sealing process of Liquid crystal pour operation and inlet and form liquid crystal cell.Then implement module generation operation and obtain very thin liquid crystal indicator.The very thin liquid crystal indicator obtained like this can not produce the problem in characteristic.

embodiment 7

In the present example, use the duplexer A obtained in embodiment 1 to manufacture liquid crystal indicator.

Prepare two duplexer A, one forms array to the supply of array formation process on the 2nd first type surface of device substrate.On the other hand, another duplexer A forms color filter to the supply of color filter formation process on the 2nd first type surface of device substrate.The polarization axle aliging polaroid towards basis on, by encapsulant paste be formed the duplexer of array be formed with the duplexer of color filter, obtain band supporting mass display device panel.Afterwards, the supporting mass (supporting substrates) on two first type surfaces of the display device panel adhering to band supporting mass is peeled off.Stripping means is on each face of above-mentioned two first type surfaces, is spraying on the basis of the fluid-mixing of pressurized air and water to the boundary of resin bed and thin plate duplexer, peels off supporting substrates.Device substrate after stripping outwardly less than causing intensity to reduce such cut.And, polaroid also be can't see the cut causing display performance to reduce.

Afterwards, after the device substrate peeling off supporting substrates being blocked 6 elements into perpendicular 51mm × horizontal 38mm, implement the sealing process of Liquid crystal pour operation and inlet and form liquid crystal cell.Then implement module generation operation and obtain liquid crystal indicator.The liquid crystal indicator obtained like this can not produce the problem in characteristic.

embodiment 8

Linear expansion coefficient 700 × 10 is used as device substrate ^-7/ DEG C, the film substrate of the cyclic olefin polymer of thick 0.1mm, wide 400mm (Japanese ZEON (strain) manufactures, ZEONORFilm ZF14), the roller of this film substrate is arranged on the device substrate unloading part of the continuous WEB coating machine that Toshiba Machine Co. Ltd manufactures, utilizes the resin-coated parts of polaroid to be coated with the polaroid resin be made up of above-mentioned Photocurable composition on the 1st first type surface of glass sheet substrate.

In the metallic roll (wide 450mm, diameter 250mm) implementing chromium plating, with the curved surface being interposed between metallic roll between 61mm is pasted 3 with the gap-forming of regulation have the multiple grooves be parallel to each other, the nickel molding jig of thick 0.2mm (die area: 150mm × 400mm, pattern area: 120mm × 170mm, pattern number: two, area of the pattern interval: 20mm, separation: 150nm, groove width: 50nm, groove depth: 100nm, flute length: 120mm, groove cross-sectional shape: rectangle), make gravure roll.In the mode that the groove on the curved surface of above-mentioned gravure roll contacts with the polaroid resin bed on the 1st first type surface being formed in above-mentioned film substrate, roll is used to press above-mentioned film substrate to gravure roll direction.Environment temperature during pressing is 25 DEG C.

Former state keeps this pressed state, from the 2nd main surface side Continuous irradiation high-pressure sodium lamp (frequency: 1.5kHz ~ 2.0kHz, predominant wavelength light: the irradiation energy 255nm, 315nm and 365nm: 1000mJ/cm of film substrate ²) light, polaroid resin bed is solidified, makes and there is the polaroid resin bed (raised line spacing: 150nm, raised line width: 50nm, raised line height: 100nm) of the raised line corresponding with the groove of nickel molding jig.In use stripper roll from after above-mentioned film substrate peels off nickel molding jig, above-mentioned film substrate is batched on winding roller.On the 1st first type surface of the above-mentioned film substrate of batched web-like, there is raised line in two positions of the Width of above-mentioned film substrate with the gap-forming of 30mm, be formed with raised line continuously with the interval of 30mm along its length.

The above-mentioned roll film base material batched is arranged on the unloading part of continuous evaporation coating device, with deposition angles 25 degree to 35 degree evaporating Al continuously, forms the Al layer of wide 50nm, thick 50nm on the top of raised line.By above operation, the 1st first type surface of above-mentioned film substrate forms wire grid polarizers continuously.

Be formed with the above-mentioned film substrate of wire grid polarizers with the cut-space of long 750mm continuously, obtain the device substrate of band wire grid polarizers of sheet of long 750mm, wide 400mm, thick 0.1mm.

Then, at long 760mm, wide 405mm, thickness of slab 0.6mm, linear expansion coefficient 700 × 10 ^-7/ DEG C supporting substrates (Japanese ZEON (strain) manufacture, ZEONORSheet 1020R) the 1st first type surface on, be blended in two ends there is the straight-chain polysiloxane of vinyl and there is the methylhydrogenpolysi,oxane of hydrosilyl in molecule, then, it is mixed mutually with platinum group catalyst and prepares potpourri, utilize extrusion coater to carry out being coated with (coating weight 20g/m with the area of long 757mm, wide 402mm ²), be heating and curing 60 minutes with 120 DEG C in an atmosphere, form the silicone resin layer of thickness 20 μm.At this, the mixing ratio of adjustment straight-chain polysiloxane and methylhydrogenpolysi,oxane, makes the mol ratio of hydrosilyl and vinyl be 1/1.Relative to total 100 mass parts of straight-chain polysiloxane and methylhydrogenpolysi,oxane, add platinum group catalyst 5 mass parts.

Then, at room temperature utilize vacuum press to the surface of the silicone resin layer on the 1st first type surface of the polaroid forming surface and above-mentioned supporting substrates of pasting the device substrate of above-mentioned band wire grid polarizers, obtain duplexer E (duplexer of the present invention).

In the duplexer E of this embodiment 8, device substrate and the supporting substrates of band polaroid closely do not engage with silicone resin layer with not producing bubble, and both do not had convex defect, flatness is also good.

embodiment 9

In the present example, the duplexer E of acquisition in embodiment 8 is used in manufacture very thin liquid crystal indicator.

Prepare two duplexer E, one forms array to the supply of array formation process on the 2nd first type surface of device substrate.Remaining one forms color filter to the supply of color filter formation process on the 2nd first type surface of device substrate.The polarization axle aliging polaroid towards basis on, by encapsulant paste be formed the duplexer of array be formed with the duplexer of color filter, obtain band supporting mass display device panel.Afterwards, the supporting mass (supporting substrates) on two first type surfaces of the display device panel adhering to band supporting mass is peeled off.Stripping means is on each face of above-mentioned two first type surfaces, is spraying on the basis of the fluid-mixing of pressurized air and water to the boundary of resin bed and thin plate duplexer, peels off supporting substrates.Device substrate after stripping outwardly less than causing intensity to reduce such cut.In addition, polaroid also be can't see the cut causing display performance to reduce.

Afterwards, after the device substrate peeling off supporting substrates being blocked 64 elements into long 51mm × wide 38mm, implement the sealing process of Liquid crystal pour operation and inlet and form liquid crystal cell.Then implement module generation operation and obtain very thin liquid crystal indicator.The very thin liquid crystal indicator obtained like this can not produce the problem in characteristic.

comparative example

Use long 170mm, wide 100mm, thickness of slab 0.7mm, linear expansion coefficient 38 × 10 ^-7/ DEG C device of glass substrate (Asahi Glass Co., Ltd's manufacture, AN100, alkali-free glass substrate), obtain in the same manner as in Example 1 and be formed with the device substrate of the wire grid polarizers of the Al metal fine of size (spacing Pm:200nm, width D m:100nm, height H m:200nm).

Use two device substrates being formed with the thickness of slab 0.7mm of this wire grid polarizers, one, to the supply of array formation process, the first type surface of device substrate not being formed with wiregrating forms array.Remaining one supplies to color filter formation process, also on the first type surface of device substrate not being formed with wiregrating, forms color filter.The polarization axle aliging polaroid towards basis on, by encapsulant paste be formed the device substrate of array be formed with the device substrate of color filter, obtain band supporting mass display device panel.On the surface of above-mentioned panel, scattered visible haze value (atomization) lifting position owing to contacting and producing with conveying roller or metal tray in array formation process and color filter formation process.This has cut and the phenomenon that produces owing to drawing in wire grid polarizers, when for display device, is cause the shortcoming that significantly display is bad.

Understanding the present invention in detail with reference to specific embodiment, but can not apply various distortion or amendment with departing from thought of the present invention and scope, is apparent to those skilled in the art.

The Japanese Patent that the application applied for based on February 5th, 2009 goes out to be willing to 2009-025025, this using its content as with reference to and adopt.

industrial applicibility

By the duplexer that the present invention obtains, a kind of duplexer that can make the band polaroid of the display device thinner than display device in the past can be provided.

description of reference numerals

10, the duplexer (duplexer of the present invention) of polaroid is with; 11, reflection type polarizer; 12,32,42,72, device substrate; 12a, 32a, 42a, 62a, device substrate the 1st first type surface; 12b, device substrate the 2nd first type surface; 13, supporting substrates; 13a, supporting substrates the 1st first type surface; 13b, supporting substrates 2 first type surface; 14, resin bed; 35, metal fine; 46,61,76, raised line; 47, the film be made up of metal material; 51, device substrate supply part; 51a, device substrate outlet roller; 51b, protective film stripper roll; 51c, protective film winding roller; 52, the resin-coated parts of polaroid; 52a, polaroid resin supply source; 52b, dispense tip; 52c, applicator roll; 52d, pipe arrangement; 52e, pump; 53, roll; 54, gravure roll; 55, polaroid resin solidification parts; 56, stripper roll; 57, parts are batched; 1st side of 76a, raised line; 2nd side of 76b, raised line; The width of Dm, metal fine; The spacing of Pm, metal fine; The height of Hm, metal fine; The length of Lm, metal fine; V1, V2, evaporation direction; Wp, gap; Xa, longitudinal arrow; Xb, lateral arrows.

Claims (12)

1. the duplexer with polaroid, this duplexer has:

Device substrate, it has the 1st first type surface and the 2nd first type surface;

Supporting substrates, it has the 1st first type surface and the 2nd first type surface; And

Resin bed, it is present between the 1st first type surface of said apparatus substrate and the 1st first type surface of above-mentioned supporting substrates; Wherein,

1st first type surface of said apparatus substrate has reflection type polarizer, the face having reflection type polarizer of said apparatus substrate combines by the closing force caused by the Van der Waals force between molecular solids with above-mentioned resin bed, the surface of above-mentioned resin bed is made to have rippability

Adhesion between 1st first type surface of above-mentioned supporting substrates and above-mentioned resin bed is relatively higher than above-mentioned closing force.

2. the duplexer of band polaroid according to claim 1, wherein,

Above-mentioned reflection type polarizer is wire grid polarizers.

3. the duplexer of band polaroid according to claim 2, wherein,

The spacing Pm of the metal fine of above-mentioned wire grid polarizers is 50 ~ 200nm, and the width D m of above-mentioned metal fine and the ratio Dm/Pm of spacing Pm is 0.1 ~ 0.6.

4. the duplexer of the band polaroid according to any one of claims 1 to 3, wherein,

The resin forming above-mentioned resin bed is at least one resin selected from fluororesin, acryl resin, polyolefin resin, urethane resin and organic siliconresin.

5. the duplexer of the band polaroid according to any one of claims 1 to 3, wherein,

The thickness of above-mentioned resin bed is 5 ~ 50 μm.

6. the duplexer of the band polaroid according to any one of claims 1 to 3, wherein,

Said apparatus substrate is made up of identical material with above-mentioned supporting substrates, and the difference of the linear expansion coefficient of this device substrate and this supporting substrates is 150 × 10 ^-7/ DEG C below.

7. the duplexer of the band polaroid according to any one of claims 1 to 3, wherein,

Said apparatus substrate is made up of different materials from above-mentioned supporting substrates, and the difference of the linear expansion coefficient of this device substrate and this supporting substrates is 700 × 10 ^-7/ DEG C below.

8. the display device panel with supporting substrates, wherein,

The display device panel of this band supporting substrates comprises the duplexer of the band polaroid according to any one of claim 1 ~ 7, and the 2nd first type surface of the said apparatus substrate of the duplexer of above-mentioned band polaroid has display device component.

9. a manufacture method for the duplexer with polaroid, the duplexer of the band polaroid of duplexer according to any one of claim 1 ~ 7 of this band polaroid, wherein, the manufacture method of the duplexer of this band polaroid has following operation:

Polaroid formation process, it forms reflection type polarizer on the 1st first type surface of said apparatus substrate;

Resin bed formation process, it forms the resin bed with rippability surface on the 1st first type surface of above-mentioned supporting substrates;

Closely sealed operation, it is stacked with the supporting substrates of above-mentioned tape tree lipid layer and crimp by the device substrate of above-mentioned band reflection type polarizer, makes the rippability of above-mentioned resin bed surface closely sealed with the face having reflection type polarizer of said apparatus substrate.

10. a manufacture method for the display device panel with supporting mass, wherein,

The manufacture method of the display device panel of this band supporting mass has the operation in manufacture method according to claim 9 and on the 2nd first type surface of the said apparatus substrate of the duplexer of obtained band polaroid, forms the operation of display device component.

The manufacture method of 11. 1 kinds of display device panels, wherein,

The manufacture method of this display device panel has operation in manufacture method according to claim 10 and by the stripping process of the face having reflection type polarizer of the said apparatus substrate in the display device panel of obtained band supporting mass and the rippability sur-face peeling of above-mentioned resin bed.

The manufacture method of 12. 1 kinds of display device, wherein,

The manufacture method of this display device has display device panel that operation in manufacture method according to claim 11 and use obtain to obtain the operation of display device.