CN102273321B - LED heat management system and method - Google Patents
LED heat management system and method Download PDFInfo
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- CN102273321B CN102273321B CN200980153529.4A CN200980153529A CN102273321B CN 102273321 B CN102273321 B CN 102273321B CN 200980153529 A CN200980153529 A CN 200980153529A CN 102273321 B CN102273321 B CN 102273321B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/50—Circuit arrangements for operating light-emitting diodes [LED] responsive to malfunctions or undesirable behaviour of LEDs; responsive to LED life; Protective circuits
- H05B45/56—Circuit arrangements for operating light-emitting diodes [LED] responsive to malfunctions or undesirable behaviour of LEDs; responsive to LED life; Protective circuits involving measures to prevent abnormal temperature of the LEDs
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B47/00—Circuit arrangements for operating light sources in general, i.e. where the type of light source is not relevant
- H05B47/20—Responsive to malfunctions or to light source life; for protection
- H05B47/28—Circuit arrangements for protecting against abnormal temperature
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Abstract
A kind of heat management system of degenerating for the thermic reduced or eliminate LED performance and/or operation lifetime.Described system can comprise heat controller, and heat controller is arranged to make response and the temperature limited responsively in described LED to LED operating condition.In one implementation, described heat controller comprises the bypass circuit comprising Bypass Control element, the all rheostats in this way of Bypass Control element, Zener diode or antifuse equipment, such as, and described Bypass Control element is arranged to shift the electric current flowing to described LED and is remained on cold state to make described LED, less than 75 DEG C.Described system can be arranged to power that (I) reduce to be fed to LED at least in part and generate with the heat be reduced in such LED and described LED maintained below threshold temperature and/or (II) removes heat, so that the temperature of described LED is maintained below threshold temperature from described LED.
Description
The cross reference of related application
This application claims the priority enjoying the U.S. Patent application 12/325,208 that on November 30th, 2008 submits.Here the disclosed full content of this U.S. Patent application is incorporated with for various purposes by reference.
Technical field
The present invention relates to LED device and comprise the assembly of this equipment.Various aspect of the present invention relates to LED component, and this LED component has thermal management capabilities to protect the LED component of LED component from overheated.Other side of the present invention relates to the thermal management algorithm of LED to eliminate the generation of excessive temperature in LED at least in part, and this LED is in use subject to the impact of thermic degeneration (heat-mediated degradation) of performance and/or operation lifetime.
Background technology
In recent years, increasingly adopt LED as the light source in various household electrical appliance, illuminating product, instrument and display application.
LED has long operation lifetime relative to traditional incandescent lamp and fluorescence light source, and allows and carry out Electronic Control with many LED array, and this many array provides wide region light output, colour temperature and luminous intensity.
Although the advantage of LED and the use day by day increased, the LED of raised temperature is subject to the degradation effects of performance and/or operation lifetime.Such as, the obvious degeneration of fluorophor that the LED in ambient temperature (~ 25 DEG C) with given light output can experience LED itself in the temperature raised (such as 80 DEG C and more than) and be associated, becomes less transmitting to make LED component and luminous intensity obviously decays.In some cases, temperature degeneration can relate to quantum well fault, and makes LED component defectiveness or even expect that object is useless for it.
Thermic LED degenerates to be increased along with the rising of temperature.On assigned temperature level, between the speed of degenerating at temperature and LED and degree, there is strong correlation.LED performance and operation lifetime become and are subject to the temperature threshold that thermal effect has a strong impact on and change according to the particular type of involved LED, but usually such threshold temperature is at the order of magnitude of 75 DEG C-95 DEG C.
Under such threshold temperature, LED performance and operation lifetime are normally gratifying, but on such threshold temperature, LED is heated the negative effect of bringing out degeneration and can experience fault fast increasingly.For such object, the fault of LED can be appointed as to be less than under identical current operating conditions the lumen of 25 DEG C export 70% the lumen of reduction export.
Thus, LED has maximum operating temp, will cause the degeneration of the relatively quick and progression of LED performance and/or operation lifetime when exceeding this temperature.Too high LED operating temperature can cause due to a variety of causes, comprise the inferior installation of LED element, less desirable high ambient temperature, the drive circuit of inferior design, the transition " spike " inputted to the high power of LED or other systematic failures, and LED intentional " overdriving ".
Therefore the excessive temperature operation of LED is harmful, the physics cause the thermal conditioning of LED to be degenerated, relate to negative chemical modification, being showed by hardening of resin is worsened, variable color and embrittlement, to the sharply decline of the fluorophor that the incident radiation from LED responds and quantum well fault.
There is provided a kind of and wherein improve or eliminate LED component that such thermic degenerates and structure will be obviously advanced in the art.
Summary of the invention
The heat that the present invention relates to for being in use subject to cause the thermic of performance and/or operation lifetime to degenerate generates the apparatus and method of the heat management of the LED of impact.
In one aspect, the present invention relates to a kind of LED component, comprising:
One or more LED; And
Heat controller, is arranged to make response to LED operating condition and the temperature limiting one or more LED described responsively.
On the other hand, the present invention relates to a kind of thermal control system being suitable for operating together with one or more LED, described thermal control system comprises heat controller, and described heat controller is arranged to make response to LED operating condition and the temperature limiting one or more LED described responsively.
Another embodiment of the present invention relates to a kind of LED heat management system for LED, and described system comprises:
Thermal protection assembly, described Thermal protection assembly comprises bypass circuit, and described bypass circuit can be coupled with the main circuit comprising described LED; And
Described bypass circuit comprises Bypass Control element, described Bypass Control element is arranged in described LED when being powered and being in the temperature of below threshold temperature, described bypass circuit is maintained no current flows condition, wherein, described threshold temperature is from the scope of 75 DEG C to 95 DEG C, and described Bypass Control element be arranged in the described LED in described main circuit electric current otherwise by make described LED extend period in operate in more than described threshold temperature or described threshold temperature time, make at least partly the electric current in described main circuit re-route (re-route) around described LED (around) described bypass circuit and turn back to described main circuit, described LED is made to maintain below described threshold temperature.
On the other hand, the present invention relates to a kind of method extending the operation lifetime of LED, being fed to the power of described LED otherwise will described LED being made to generate when making the temperature of described LED be elevated to more than threshold temperature hot, the temperature of described LED more than described threshold temperature is subject to the impact that thermic is degenerated, described method comprises at least one in lower surface technology: (I) reduces the described power being fed to described LED at least in part, generates and described LED is maintained below described threshold temperature or described threshold temperature to operate with the heat reduced in described LED; And (II) removes heat from described LED, operates described LED to be maintained below described threshold temperature or described threshold temperature.
In an embodiment again, the present invention relates to the LED component that a kind of heat is controlled, comprising:
One or more LED; And
Heat management system, be arranged to make response at least one LED operating condition, if at least one LED operating condition described is not responded, then the cause thermal damage to one or more LED described will be produced, described heat management system is inactive when there is not at least one LED operating condition described, and is activated to reduce or prevent described cause thermal damage when there is at least one LED operating condition described.
By ensuing open and appended claim, other side of the present invention, characteristic sum embodiment will become more fully obviously.
Accompanying drawing explanation
Fig. 1 is thermal management circuit according to an embodiment of the invention, for being in use subject to the heat management of the LED of the thermic degradation effects of performance and/or operation lifetime;
Fig. 2 is the figure of the voltage of the function as temperature of LED for the heat management elements be not associated;
Fig. 3 is the figure of the voltage of the function as temperature of circuit for Fig. 1 shown type, shows the temperature be controlled in lower than within the scope of the scheduled operation of ceiling temperature;
Fig. 4 is the LED component comprising thermal management circuit according to another embodiment of the present invention;
Fig. 5 is the LED component comprising heat management structure according to yet another embodiment of the invention;
Fig. 6 is operationally provided with schematically showing of LED device in use the temperature of LED being maintained the following thermoelectric (al) cooler of predetermined limits (limit) and control element.
Embodiment
The present invention relates to the heat management of the LED of the thermic degradation effects being in use subject to performance and/or operation lifetime, and the apparatus and method particularly related to for the heat management of LED are degenerated with the thermic of the performance and/or operation lifetime that weaken such LED at least in part.
In one aspect, the present invention imagines a kind of LED component, the heat comprising the thermic degeneration being in use subject to cause performance and/or operation lifetime generates at least one LED of impact, and generates to make described heat generation not exceed the heat controller of predetermined limits for the heat controlled in such a or multiple LED.
The predetermined limits that heat generates can comprise other limit yardstick that in predetermined LED temperature margin, admissible heat flux limit, the radiation-emitting limit of heat energy or LED device, heat generates.This predetermined limits can even join to relevant parameter correlation, such as, be the resistance of LED in steady state operation.Along with temperature raises, the steadying resistance of LED will increase.
The heat management system that LED utilizes can be any applicable type.In one embodiment, heat management system can comprise the controller for removing heat from LED, and can such as comprise by conduction, radiation, convection current or other heat transfer mechanisms from LED remove heat and thus for reducing the heat accumulation LED and by heat generate maintain lower than predeterminated level, such as lower than predetermined temperature limit, heat spreader structures.Heat spreader structures in such embodiments or can have high specific heat its other material being suitable as heat eliminating medium is formed by metal, pottery, synthetic material.
Heat controller in another embodiment comprises the heat transfer surface arranging and cool for the convection current of LED.Other surface area configuration expanded that such heat transfer surface such as can comprise fin or arrange about convection current cooling device, such as fan, hair-dryer, injector or heat are transferred to the environmental gas the environment comprising LED by it from the heat transfer surface of expansion, such as air, other structure.
In an embodiment again, LED can be provided with the heat controller comprising thermoelectric (al) cooler, is suitable for removing heat from LED device thermoelectricity.
One more embodiment of the present invention relates to the heat controller using and comprise bypass circuit, activate described bypass circuit with when occurring otherwise the heat caused in LED generation is exceeded the condition of predetermined limits, electric current is shifted away from LED, can not reach to make the electric current obtaining LED and will heat be allowed to generate the level exceeding predetermined limits.As described in more detail below, bypass circuit can comprise the Bypass Control element of such as Zener diode, rheostat or antifuse equipment.Predetermined limits can be associated with the circuit parameter of the resistance of the LED in such as such as steady state operation, thus utilizes following true: along with the temperature of LED raises, the steadying resistance of LED will increase.
LED component is set and can be arranged so that thermal control is suitable for occurring the heat caused in LED to generate to exceed the power condition of predetermined limits, such as overload power condition, transient power etc., time will to the Power Limitation of LED in predeterminated level.
The heat management system operated for heat management LED can have all kinds, be arranged to make response at least one LED operating condition, if do not make response at least one LED operating condition, at least one LED operating condition described produces cause thermal damage by one or more LED that may exist.This heat management system can be set to make response to one or more LED operating condition, described heat management system is inertia when such operating condition does not exist, and is activated to reduce or prevent the cause thermal damage to LED when there is one or more of such operating condition.
One embodiment of the present of invention utilize the heat controller comprising thermocouple, and described thermocouple is suitable for the temperature of supervision LED and generates the signal representing LED temperature responsively.Then the actuator be coupled with thermocouple with Signal reception relation operates to receive this signal representing temperature, and modulates the operation of the cooling device of such as thermoelectric (al) cooler responsively, generates do not exceed predetermined limits to make the heat in LED.
In one embodiment, the present invention relates to the thermal control system being suitable for operating together with one or more LED, the heat that one or more LED described is in use subject to cause the thermic of performance and/or operation lifetime to degenerate generates impact, wherein said thermal control system comprises heat controller, for preventing the excessive heat in LED from generating, do not exceed predetermined limits to make described heat generate.Heat controller in such structure can comprise bypass circuit, described bypass circuit is actuatable with when occurring otherwise the heat made in LED generation is exceeded the condition of predetermined limits, by the current transfer from LED, do not allow heat to generate to make the electric current obtaining LED and exceed such limit.Mentioned bypass circuit can comprise Bypass Control element, such as Zener diode, rheostat or antifuse equipment, or the combination of any one and other Bypass Control element in the combination of one or more such equipment or such equipment.
The present invention relates to the LED heat management system for LED on the other hand, and described LED is subject to thermic degradation effects more than predetermined temperature.Described system comprises Thermal protection assembly; described Thermal protection assembly is affecting for being reduced to the power of LED at least in part under the condition that thermic degenerates, and generates and is maintained below predetermined temperature or predetermined temperature operate to reduce heat in LED accordingly.Such Thermal protection assembly can comprise the bypass circuit previously describing type, and described bypass circuit is coupled with the main circuit comprising LED.Described bypass circuit can comprise Bypass Control element, described Bypass Control element is arranged in LED when being powered and being in below predetermined temperature, described bypass circuit is maintained no current flows (current non-flow) condition, and described Bypass Control element be arranged in LED be powered and otherwise by generate make its temperature be elevated to more than predetermined temperature hot time, make the electric current from LED re-route through bypass and turn back to main circuit at least in part.Electric current route perform for making, the LED in main circuit electric current otherwise when LED will be made to operate more than predetermined temperature, LED is maintained under predetermined temperature or predetermined temperature.
In another embodiment, the present invention relates to the LED component that heat is controlled, comprising:
One or more LED; And
Be arranged to make corresponding heat management system at least one LED operating condition, if do not make response, described LED operating condition will produce cause thermal damage to one or more LED described, such heat management system is inertia when there is not at least one LED operating condition described, and is activated to reduce or prevent such cause thermal damage when there is at least one LED operating condition described.
In the LED component of such thermal control, at least one operating condition described can comprise any one in electric current, voltage, power, resistance and/or temperature conditions, such as, be the temperature higher than the threshold temperature in the scope from 75 DEG C to 95 DEG C in one or more LED.Such as, the set-point temperature conditions of 80 DEG C can being adopted, programming in the actuator device being arranged to actuating active cooling device when reaching such set-point temperature.Described active cooling device is movable when being connected by actuator, otherwise inertia.Active cooling device useful in such enforcement of the present invention can be any applicable type, comprises fan, hair-dryer, thermoelectric (al) cooler etc.
Heat management system in such embodiments can be configured with bypass circuit, arranges described bypass circuit to make response at least one LED operating condition described at least in part by the energy trasfer from one or more LED.
At least one LED operating condition for triggering described heat management behavior can comprise previously described set-point operating condition, or such operating condition can comprise scope or the mode (regime) of operating condition, if obstructed overheated administration behaviour solves, then the scope of this operating condition or mode will cause other heat of the excessive heat accumulation of affected LED or performance and/or operation lifetime to be degenerated.
By all structures described above, the invention provides at least one by lower surface technology a kind of and extend the effective ways being subject to the operation lifetime of the LED of thermic degradation effects in the temperature higher than predetermined temperature: the power that (I) is reduced to LED at least in part generates with the heat be reduced in accordingly in described LED and maintained below predetermined temperature or this predetermined temperature and operates, and (II) removes heat from LED, operates LED to be maintained below predetermined temperature or predetermined temperature.
Significantly, the present invention's imagination is used for the heat management of LED device and the various structure of control and technology.Although describe the present invention referring to the illustrative circuit comprising single LED element, but recognize, heat management system of the present invention and method can realize in the circuit comprising multiple LED device, such as many light-emitting diode displays, interior lighting structure, exterior illumination assemblies, individual illuminating product etc.Also will recognize, the LED utilized in enforcement of the present invention can be arranged on have on the assembly of single or multiple phosphor element of light launched from LED of conversion and/or lower conversion.Also will recognize, technology of the present invention and scheme can be utilized to provide the heat management to more than one LED with identical heat management structure or equipment.
Such as, the bypass circuit of the bypass circuit such as comprising Zener diode Bypass Control element can be used between series connection or the multiple LED be arranged in parallel, serve multiple LED device to make the bypass circuit comprising a bypass elements.As another example, thermoelectric (al) cooler can be associated with multiple LED device.In other embodiments, LED component can be set to make to utilize for the single special hot management component of single led equipment or component pieces to protect each LED.
As used herein, " " of singulative, " one " and " described " comprise plural form, unless otherwise clearly shown within a context.
In one embodiment, the present invention utilizes the equipment in parallel with one or more LED, to reduce the electric current through LED in " overload " situation responsively.The present invention also imagines utilization for reducing the heat generated by LED, or the ACTIVE CONTROL and feedback extracted from the heat of LED for using the equipment of such as thermoelectric (al) cooler to perform.Thermoelectric (al) cooler uses paltie effect to tie generation heat flux at two kinds of different kind of material.Such equipment is known for the person of ordinary skill of the art.
Referring now to accompanying drawing, Fig. 1 has set forth the LED component comprising thermal management circuit according to an embodiment of the invention, and described thermal management circuit is set to the LED that heat management is in use subject to the thermic degradation effects of performance and/or operation lifetime.Different from the use of the Zener diode for surge protection, select the Zener voltage in this embodiment in 50% of low current room temperature (the such as 25 DEG C) operating voltage of LED.In various embodiments, selected Zener voltage in 25% of such operating voltage, 10% or even 5%, for realize LED operation heat management.
As shown, assembly 10 comprises the LED12 be coupled with power supply 16 with circuit relationships.LED component 10 is provided with Zener diode 14 in branched line 22, select the voltage of this Zener diode with make when to LED12 power otherwise will LED be made overheated and throw light on export and/or function life-span in degenerate Zener diode be used as shunt.It should be understood that for protection object, voltage should be selected to prevent too high temperature, but this voltage can not the too low so that prevention LED connection when supplying power to circuit.
Fig. 2 is the figure of the voltage of the function as temperature of LED for the heat management be not associated.
Represent LED voltage performance Fig. 2 figure in, the actuating that the some A of this figure represents power supply is with to powering up for photoemissive light emitting diode.Along with light emitting diode heating (some B), voltage drop, and then along with temperature raises and rise (some C).If then diode is by excessive large driven current density or experience power surge, then temperature and voltage will rise (some D) and LED will correspondingly be subject to the negative effect of excessive heat generation.
Fig. 3 is the figure of the voltage of the function as temperature of LED circuit for Fig. 1 shown type, shows temperature to be controlled within scheduled operation scope and lower than predetermined temperature margin.
Voltage-temperature curve in Fig. 3 shows the performance of the circuit of the Fig. 1 with the by-pass line 22 comprising the Zener diode in parallel with LED12.
Again turn-on voltage is represented at an A place, and the development that curve experience is similar with Fig. 2, along with diode heating in operation, voltage drop (some B), and along with voltage and temperature raise further, activate Zener diode 14 and deboost and temperature (some C).Thus, Zener diode is used as shunt and does not experience increase for heat management LED12 with the temperature making it on a C.The temperature of some C is predetermined temperature, and under this temperature place or this temperature, thermic is degenerated and is minimized or is additionally contained in acceptable limit.But electrical voltage point C must higher than voltage A to make it possible to connect LED.
Fig. 4 is the LED component comprising thermal management circuit according to another embodiment of the present invention.
Thermal management circuit in Fig. 4 represents another structure, and wherein thermal control equipment and LED are arranged in parallel.In this circuit 40, LED42 is arranged in the main circuit 44 comprising power supply 46.LED42 is set in parallel with the by-pass line 48 comprising resistor 50 and switch 52.Switch can be any type and such as can comprise metal (bilayer) switch, this switch-linear hybrid becomes in temperature lower than disconnection during a certain value, and rise to higher than closed during such value in temperature, with the bypass of impact to the electric current through by-pass line 48,41 to make to reduce the electric current through LED42.Switch can alternatively by semiconductor layer structure etc., semiconductor layer be thermal response to allow according to specified temp or to prevent current flowing, rise to make the temperature in LED and be activated through the by-pass current of bypass circuit, described switch otherwise disconnect to make whole electric current through LED device.Described switch can such as use the wide band gap semiconducter with dark grade dopant to form, and described switch and LED are attached to mounting panel.At room temperature, minority carrier, if present, is activated, and semiconductor switch disconnects.When mounting panel heating, charge carrier becomes hot activation and electric current can along the shunting of this alternative route until mounting panel temperature declines.If semiconductor switch is chosen as have suitable value, then it can be used as switch and resistor 48.
Fig. 5 shows another LED component structure, and it comprises heat management system according to yet another embodiment of the invention.
In LED component 60, main circuit 64 comprises the LED62 be coupled with power supply 66.Heat controller 70 is arranged in by-pass line 68.Heat controller can be any applicable type and such as can comprise to otherwise will condition that undesirably heat generates to be caused in LED to make the material of response, parts and/or sub-component, described condition is such as the LED temperature higher than predeterminated level, the electric current of LED is reduced, or otherwise by by-pass line 68 and heat controller transfer.Can configured and disposed heat controller to make electric current in whole or in part through by-pass line 68, to make LED can not the overheated and temperature place maintained lower than threshold value, degenerate at this threshold value place in speed and/or degree, become unacceptably high.
Heat controller 70 can adopt any applicable structure, and such as can comprise temperature controller, temperature controller to be embedded in modular board and to be arranged to control electric current and/or provide heat-sink capabilities, or otherwise thermal control LED with the temperature levels making it not be heated to exceed expectation.
In other embodiments, the part of some or all heat controller structure as LED component can be embedded in lamp or module.In other embodiments, heat controller can be positioned at multiple LED two ends of series connection and/or configuration in parallel.According to various mode, heat controller can be set to control to the electric current of LED, to make at variable power condition modulated electric current, to be maintained in the expectation envelope of operating current condition by LED.
Fig. 6 is operationally provided with schematically showing of LED for the operating temperature of LED being maintained thermoelectric (al) cooler under predetermined limits and control element.
LED component 80 shown in Fig. 6 comprises by 90 and 92 LED82 being coupled to power supply 88 that go between.As described, LED is arranged on thermoelectric (al) cooler 84, and thermoelectric (al) cooler 84 has the cold sink 86 hung from its lower surface downwards.
LED component also comprises the temperature being arranged to sense LED and generates responsively and is transferred to the thermocouple lead 96 of the signal of feedback actuators 94.Feedback actuators 94 is coupled with power supply 100 by power lines 102, to make to arrange described actuator to be modulated in power transmission line 98 to the power that thermoelectric (al) cooler 84 transmits making response by thermocouple lead 96 to the temperature signal of actuator transfer.
In this manner, modulation is sent to the power of thermoelectric (al) cooler, to make response for the temperature of the thermocouple sensing being attached to actuator with Signal transmissions relation, and changes the heat abstraction factor of such cooler.
Thus LED82 is maintained the temperature operating ranges consistent with good illumination performance and long operation lifetime, to make to avoid otherwise any condition that will excessive heat caused to generate.
Should be appreciated that and can adopt power-monitoring and control structure, utilize variable resistor control element that power is maintained predeterminated level, with make electric current supplied wherein characteristically alterable height when, LED is powered and can not be overheated.Such power-monitoring and control under structure is used in " cold " mode of operation LED being maintained under variable current condition expectation, to prevent the not controlled change of power level will occurred when not adopting the resistance of the control element in thermal control assembly to change to come offset current change.
Thus, the present invention imagines the controlled LED component of a kind of heat, comprising:
One or more LED; And
Be arranged to make response to LED operating condition and be limited in the heat controller of the temperature in such a or multiple LED responsively.
LED operating condition for such object can have any applicable characteristic and can such as be selected from: to the electric current of one or more LED described, be applied to the voltage of one or more LED described, be fed to the power of one or more LED described, the temperature of one or more LED described, and the temperature of the surrounding environment of LED component.Should be appreciated that the value that can regulate these parameters, or these parameters can be modulated in time domain, regulate duty ratio.Such as can turn on and off LED as required and become excessive heat so that will be prevented it.
LED in such assembly can use the electric current of one or more LED described as LED operating condition, and can arrange heat controller to be restricted to the electric current of one or more LED described to be correspondingly limited in the temperature of such a or multiple LED.
In another embodiment, LED operating condition is the applying voltage to one or more LED described, and arranges heat controller and be applied to the voltage of one or more LED described with restriction to limit the temperature of one or more LED described accordingly.
In an embodiment again, LED operating condition is the power being fed to one or more LED described, and arrange heat controller with supply on restriction to the power of one or more LED described to limit the temperature in one or more LED described accordingly.
LED operating condition alternatively can comprise the temperature of one or more LED described, such as, higher than the temperature of the threshold temperature be arranged in from the scope of 75 DEG C to 95 DEG C.
The controlled LED component of heat can be set to comprise the temperature of one or more LED described as LED operating condition, described heat controller is set to activate cooling for one or more LED described responsively to limit the cooling element of temperature wherein accordingly.Heat controller can alternatively comprise to be arranged to make response to LED operating condition and shift the bypass circuit of the energy from one or more LED described at least in part, and wherein said bypass circuit can comprise the Bypass Control element being selected from Zener diode, rheostat and antifuse equipment.The controlled LED component of heat can be initiatively or passive in essence.Active system such as can be operated by the set-point relating to relevant specified conditions of degenerating to the heat of LED and activate, to make to propagate actuated signal when described condition occurs by heat management system.Such active heat management system can be provided with the continuous of condition interested or be interrupted supervision, to make to show the negative heating of the reality of LED or when not adjusting during the potential negative heating of LED, initialization heat management operation responsively in monitored condition.
Heat controller differently can be configured to such as comprise heat spreader structures, be arranged for the heat transfer surface of the convection current cooling of one or more LED, or thermoelectric (al) cooler.In another structure of the controlled LED component of heat, heat controller comprises further: thermocouple, is suitable for monitoring the temperature of one or more LED and generates the signal of the temperature representing so responsively; And actuator, to be coupled the receiving signal that represents temperature with thermocouple with Signal reception relation and the operation of modulating thermoelectric (al) cooler responsively to limit the temperature of one or more LED.
Another aspect of the present invention comprises the thermal control system being suitable for operating together with one or more LED, and such thermal control system comprises to be arranged to make response to LED operating condition and limit the heat controller of the temperature of one or more LED responsively.Described heat controller such as can comprise bypass circuit, the energy that bypass circuit is arranged to make response to LED operating condition and is shifted at least in part from one or more LED.Bypass circuit such as can be configured with the Bypass Control element being selected from Zener diode, rheostat and antifuse equipment.The Bypass Control element more than a type can be adopted and described bypass circuit can be arranged in the two ends of a LED element of such assembly in given LED component, or be positioned at the two ends of more than one LED element.
Another aspect of the invention relates to the LED heat management system for LED.Described system can such as comprise:
Comprise the Thermal protection assembly of bypass circuit, described bypass circuit can be coupled with the main circuit comprising LED; And
Described bypass circuit comprises Bypass Control element, described Bypass Control element is arranged in described LED when powering up and be in the temperature under threshold temperature, under described bypass circuit is maintained no current flows condition, wherein said threshold temperature can such as in the scope of 75 DEG C to 95 DEG C, and described Bypass Control element be arranged in the LED in main circuit electric current otherwise by make LED within the period extended with described threshold temperature or higher than the operation of described threshold temperature time, the electric current in described main circuit is made to re-route the bypass circuit around described LED and turn back in main circuit at least in part, described LED is made to maintain lower than described threshold temperature.Can bypass circuit described in activation when LED is overheated, to reduce the heating in LED, postpone to make to exist in active heat management, or can arrange other bypass circuit realized with make reach so overheated time start active heat management.
Bypass Control element in above-mentioned LED heat management system can be any suitable type, such as, be selected from the parts of the group be made up of Zener diode, rheostat and thermoelectric (al) cooler.
The present invention correspondingly provides a kind of method extending the operation lifetime of LED, being fed to the power of LED otherwise will the temperature of LED being made to raise as during higher than threshold temperature hot by making LED generate, in the temperature higher than threshold temperature, described LED is subject to the impact that thermic is degenerated, such method comprises at least one in lower surface technology: the power that (I) reduces to be fed to described LED at least in part generates with the heat reduced in described LED and described LED maintained described threshold temperature or operate lower than described threshold temperature, and (II) removes heat from described LED, operate described LED to be maintained below described threshold temperature or described threshold temperature.Both technology (I) or (II) or (I) and (II) can be adopted.
Such method can comprise makes the electric current around LED re-route through bypass circuit and turn back to the main circuit comprising LED at least in part, makes described LED maintain below threshold temperature or threshold temperature.Bypass circuit can comprise Bypass Control element, such as Zener diode, rheostat and/or antifuse equipment.Described method also can comprise the heat spreader structures using and be arranged to remove heat from LED, comprises using being arranged for convection current cooling to remove the heat transfer surface of heat from LED, or uses the thermoelectric (al) cooler being arranged to remove heat from LED.
Method in another variant can comprise the temperature monitoring LED, generate the signal of the temperature representing so responsively, by described Signal transmissions to actuator, actuator is arranged to regulate the cooler being arranged for cooling LED responsively, operate to be maintained by LED under threshold temperature or threshold temperature, described cooler is such as thermoelectric (al) cooler.
As here about feature of the present invention, in and embodiment describe respectively, the present invention can be configured in specific implementation various other of the present invention realize comprising such feature, in and embodiment some or all, and element and parts, or by or be substantially made up of above-mentioned.
Industrial usability
Heat management system of the present invention and method can carry out heat management to the LED of the thermic degradation effects being in use subject to performance and/or operation lifetime, degenerate to weaken such thermic at least in part.Generating to make it not exceed predetermined limits by controlling heat, the remarkable performance improvement of LED can be realized in the present implementation.This makes it possible to realize corresponding improvement comprising in the performance of such heat management LED as the equipment of parts in turn, such as, realize the operation lifetime extended in fact.
Claims (15)
1. the LED assembly that heat is controlled, comprising:
Multiple LED, is attached to mounting panel, and wherein said multiple LED is arranged by one of following: (i) is arranged in series; (ii) be arranged in parallel; And (iii) series and parallel connections is arranged; And
By-pass line, wherein said by-pass line comprises resistor and the switch in response to temperature, wherein said by-pass line and described multiple LED parallel coupled are also arranged to make response to the temperature of described mounting panel, with when the described temperature of described mounting panel exceedes predetermined value, at least part of transfer is from the electric current of described multiple LED, and limit the operating temperature of described multiple LED responsively, maintain simultaneously through described multiple LED at least part of electric current with give described multiple LED power up
And the controlled LED assembly of described heat also comprises heat controller, described heat controller is arranged to activate cooling element responsively, described cooling element is for cooling described multiple LED to reduce the described operating temperature of described multiple LED accordingly, wherein, described cooling element comprises heat transfer surface, described heat transfer surface is arranged for carries out convection current cooling to described multiple LED, and wherein, described cooling element comprises thermoelectric (al) cooler.
2. the LED component that heat as claimed in claim 1 is controlled, wherein, when the described temperature of described mounting panel exceedes from described predetermined value the scope of 75 DEG C to 95 DEG C, described switch-linear hybrid becomes transfer at least partly from the described electric current of described multiple LED.
3. the LED component that heat as claimed in claim 1 is controlled, wherein, described thermoelectric controller also comprises: (i) thermocouple, is suitable for monitoring the described operating temperature of described multiple LED and generates the signal of the described operating temperature representing described multiple LED responsively; And (ii) actuator, be coupled with described thermocouple with Signal reception relation, to receive the described signal of the described operating temperature representing described multiple LED and to modulate the operation of described thermoelectric (al) cooler responsively.
4. the LED component that heat as claimed in claim 1 is controlled, wherein, the described operating temperature of described multiple LED is the ambient temperature of the environment comprising described multiple LED.
5. the LED component that heat as claimed in claim 1 is controlled, wherein, described switch is the semiconductor switch be made up of the wide band gap semiconducter being attached to described mounting panel, the charge carrier in wherein said wide band gap semiconducter by hot activation, wherein:
When the temperature of described mounting panel is below predetermined value, described semiconductor switch disconnects; And
When the temperature of described mounting panel reaches described predetermined value, the charge carrier in described semiconductor switch makes it possible to current distributing by described semiconductor switch.
6. be suitable for the thermal control system operated together with the multiple light-emitting diodes (LED) being attached to mounting panel, described multiple LED is arranged by one of following: (i) is arranged in series, (ii) be arranged in parallel, and (iii) series and parallel connections is arranged, described thermal control system comprises the bypass circuit comprising Bypass Control element, described bypass circuit and described multiple LED parallel coupled are also arranged to make response to the temperature of described mounting panel, with the electric current of part transfer from described multiple LED, thus limit the described operating temperature of described multiple LED responsively, maintain simultaneously through described multiple LED at least part of electric current with give described multiple LED power up, and comprise heat controller, described heat controller is arranged to activate cooling element responsively, described cooling element is for cooling described multiple LED to reduce the described operating temperature of described multiple LED accordingly, wherein, described cooling element comprises heat transfer surface, described heat transfer surface is arranged for carries out convection current cooling to described multiple LED, and wherein, described cooling element comprises thermoelectric (al) cooler.
7. thermal control system as claimed in claim 6, wherein, described Bypass Control element is selected from the group be made up of Zener diode, rheostat and antifuse equipment.
8. thermal control system as claimed in claim 6, wherein, described thermal control system is arranged to make response to the described temperature of described mounting panel and shift described electric current from described multiple LED at least in part, thus responsively by the described temperature limiting of described multiple LED in from the opereating specification of 75 DEG C to 95 DEG C.
9., for a LED heat management system for multiple light-emitting diode (LED), described system comprises:
Thermal protection assembly, described Thermal protection assembly comprises initiatively bypass circuit, described active bypass circuit and described multiple LED parallel coupled, and wherein said multiple LED is by one of following setting: (i) is arranged in series; (ii) be arranged in parallel; And (iii) series and parallel connections is arranged, and wherein said multiple LED and described active bypass circuit are attached to mounting panel; And
Described active bypass circuit comprises Bypass Control element, described Bypass Control element is arranged to: described active bypass circuit, when described multiple LED is powered and described mounting panel is in from temperature below the predetermined value the scope of 75 DEG C to 95 DEG C, is maintained no current flows condition by (i), and (ii) be not if reduced at the electric current through described multiple LED, when the described electric current of described multiple LED will make described multiple LED operate in more than described predetermined value or described predetermined value, part makes the described active bypass circuit of electric current rerouting around described multiple LED, the described temperature of described mounting panel is made to maintain below described predetermined value, maintain simultaneously through described multiple LED at least part of electric current with give described multiple LED power up, described LED heat management system also comprises thermoelectric (al) cooler, described thermoelectric (al) cooler is configured to be powered when the temperature of the supervision of described multiple LED exceedes threshold temperature.
10. LED heat management system as claimed in claim 9, wherein, described Bypass Control element comprises the parts being selected from the group be made up of rheostat and antifuse equipment.
11. LED heat management systems as claimed in claim 9, wherein, described Bypass Control element comprises rheostat.
12. 1 kinds of methods of operation lifetime extending multiple light-emitting diode (LED), described multiple LED is by one of following setting: (i) is arranged in series, (ii) be arranged in parallel, and (iii) series and parallel connections is arranged, if do not reduced at the power being fed to described multiple LED, the described power being fed to described multiple LED generates when making the operating temperature of described multiple LED be elevated to more than threshold temperature hot by making described multiple LED, the temperature of described multiple LED more than described threshold temperature is subject to the impact that thermic is degenerated, described method comprises: the temperature determining mounting panel, described multiple LED is attached to described mounting panel, when the described temperature of described mounting panel reaches predetermined value, by shifting with the active bypass circuit comprising Bypass Control element of described multiple LED parallel coupled the described power being fed to described multiple LED at least partly, generate with the heat reducing described multiple LED, simultaneously described multiple LED is retained to small part and is powered, so that described operating temperature is maintained below described threshold temperature or described threshold temperature, described method also comprises the described operating temperature monitoring described multiple LED, generate the signal representing described operating temperature responsively, and by described Signal transmissions to actuator, described actuator is arranged to modulate cooler responsively, described cooler is arranged for removes heat from described multiple LED, so that described multiple LED is maintained below described threshold temperature or described threshold temperature, wherein, described cooler comprises thermoelectric (al) cooler.
13. methods as claimed in claim 12, wherein, described Bypass Control element is selected from the group be made up of rheostat and antifuse equipment.
14. methods as claimed in claim 12, wherein, described threshold temperature is from the scope of 75 DEG C to 95 DEG C.
Light-emitting diode (LED) assembly that 15. 1 kinds of heat is controlled, comprising:
Multiple LED, is attached to mounting panel; And
Bypass circuit, with described multiple LED parallel coupled, wherein said bypass circuit comprises the double-level-metal switch and resistor that are attached to described mounting panel, wherein said double-level-metal switch is suitable for disconnecting when the temperature of described mounting panel is below predetermined value, and be suitable for when described temperature at least reaches described predetermined value closed, make the flowing being reduced the electric current by described multiple LED by the flowing of the by-pass current of described double-level-metal switch and described resistor, to reduce the operating temperature of described multiple LED, maintain simultaneously through described multiple LED at least part of electric current with give described multiple LED power up, and the controlled light-emitting diode component of described heat also comprises heat controller, described heat controller is arranged to activate cooling element responsively, described cooling element is for cooling described multiple LED to reduce the described operating temperature of described multiple LED accordingly, wherein, described cooling element comprises thermoelectric (al) cooler.
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|---|---|---|---|
| US12/325,208 | 2008-11-30 | ||
| US12/325,208 US9781803B2 (en) | 2008-11-30 | 2008-11-30 | LED thermal management system and method |
| PCT/US2009/066081 WO2010063025A2 (en) | 2008-11-30 | 2009-11-30 | Led thermal management system and method |
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| US (1) | US9781803B2 (en) |
| EP (1) | EP2356885B1 (en) |
| JP (1) | JP2012510719A (en) |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP2012510719A (en) | 2012-05-10 |
| EP2356885B1 (en) | 2013-04-17 |
| US9781803B2 (en) | 2017-10-03 |
| CN102273321A (en) | 2011-12-07 |
| US20100134024A1 (en) | 2010-06-03 |
| KR20110096140A (en) | 2011-08-29 |
| EP2356885A2 (en) | 2011-08-17 |
| EP2356885A4 (en) | 2011-09-28 |
| WO2010063025A2 (en) | 2010-06-03 |
| WO2010063025A3 (en) | 2010-09-02 |
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