CN102248302A - Device and method for abnormally cutting toughened glass by ultra-short pulse laser - Google Patents
Device and method for abnormally cutting toughened glass by ultra-short pulse laser Download PDFInfo
- Publication number
- CN102248302A CN102248302A CN2011100065233A CN201110006523A CN102248302A CN 102248302 A CN102248302 A CN 102248302A CN 2011100065233 A CN2011100065233 A CN 2011100065233A CN 201110006523 A CN201110006523 A CN 201110006523A CN 102248302 A CN102248302 A CN 102248302A
- Authority
- CN
- China
- Prior art keywords
- glass
- pulse laser
- ultra
- short pulse
- platform
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Glass Compositions (AREA)
Abstract
The invention relates to a device and method for abnormally cutting a toughened glass by ultra-short pulse laser. An output end of an ultra-short pulse laser apparatus is provided with an optical gate, an output end of the optical gate is provided with a beam expander, an output end of the beam expander is provided with a 45-degree holophote, an output end of the 45-degree holophote is provided with a three-dimensional (3D) dynamical focusing system, an output end of the 3D dynamical focusing system is provided with a telecentric field lens which is arranged facing to a platform above which a blowing device is arranged. When the ultra-short pulse laser device is used to cut, a heating device is used for heating the glass; the ultra-short pulse laser is focused in the glass by the 3D dynamical focusing system to abnormally scan the glass along with the laser, and the whole processing procedure is in helical processing; a suction dust-collecting device at the bottom of the platform is used for collecting the scanned glass slag; and the blowing device on the platform is used for blowing the slag and dust particles processed on the surface of the glass. The abnormal graph processing to the toughened glass is a processing form with smooth cutting surface and high cutting efficiency.
Description
Technical field
The present invention relates to a kind of devices and methods therefor of ultra-short pulse laser abnormity cutting safety glass.
Background technology
Because the electronic product sustainable growth demand of IT industry (small-sized cell) and TV different purposes such as (large-scale cell), for glass substrate special-shaped split requirement has been arranged, following split requirement of glass-cutting thickness 0.6mm and cutting back strength of glass keep high-level split requirement.
Traditional glass abnormity cutting method is to use diamond or hard metal wheel interpolation, in the process and have the cutting auxiliary liquid adding, this mechanical interpolation cutting method cutting efficiency is low, yields is low, and assistant is cut in artificial interpolation in the cutting, there is the short circuit influence in the sample that sticks that causes liquid assistant to having circuit structure ITO electro-conductive glass circuit; In addition; the cutting tangent plane is more coarse; there is fine crackle; exist local stress; owing to be directly to contact processing with sample; can produce molecule in the cutting can be splashed on the base of electro-conductive glass and cause the circuit mechanism collapse; also must clean after the cutting; post processings such as polishing; complicated pattern cut also needs repeatedly to change again cutter head and anchor clamps; manufacturing procedure is more; machinery interpolation patterning method becomes the key factor that causes display and touch-screen to lose efficacy to the destruction of glass inherence, and these cutting defective products all are near a kind of important waste of the electronic glass of finished product.
The laser cutting of glass can be avoided the appearance of these problems, and laser has noncontact, nonpollution environment, characteristic such as easy to control, makes its important application focus that becomes contemporary glass-cutting, and can be widely used in industry gradually.At first, glass is a kind of inorganic product of fusion, and unique machinery and thermal conductance are arranged, and these performances and temperature are closely related, and under the normal temperature, glass has non-ductility, is a kind of desirable fragile material.If glass is heated, along with the rising of temperature, glass intensity will descend, and ductility will increase, and when temperature was elevated to softening temperature, glass showed plasticity.Therefore, in the laser cutting of glass, the control temperature is a technological parameter that cut quality is had material impact.Glass has stronger absorption for Ultra-Violet Laser and far infrared laser, and generally more than 90%, therefore general glass is fit to Ultra-Violet Laser and CO
2Laser is processed.But these two kinds of laser have the existence of certain taper to than the heavy sheet glass deep processing time, and along with thickness of glass increases and the complexity increase of the processing profiled figure of institute, tapering is more obvious, influences the actual use of product.
Summary of the invention
The objective of the invention is to overcome the deficiency that prior art exists, a kind of devices and methods therefor of ultra-short pulse laser abnormity cutting safety glass is provided.
Purpose of the present invention is achieved through the following technical solutions:
The device of ultra-short pulse laser abnormity cutting safety glass, characteristics are: the output of ultrashort pulse laser is furnished with optical gate, the output of optical gate is provided with beam expanding lens, the output of beam expanding lens is furnished with 45 degree completely reflecting mirrors, the output of 45 degree completely reflecting mirrors is furnished with the Three-Dimensional Dynamic focusing system, the output of Three-Dimensional Dynamic focusing system is furnished with psychological field mirror far away, and described psychological field mirror far away is right against platform, and the top of described platform also is equipped with blowning installation; Described platform comprises refractory ceramics substrate and resistance wire heater, and air-breathing dust collect plant and resistance wire heater are arranged on the refractory ceramics substrate.
Further, the device of above-mentioned ultra-short pulse laser abnormity cutting safety glass, wherein, described ultrashort pulse laser is that wavelength is the laser instrument of 532nm green light band.
Apparatus of the present invention realize the method for ultra-short pulse laser abnormity cutting safety glass, comprise the steps:
A) adopt heater that glass is heated;
B) by the Three-Dimensional Dynamic focusing system ultra-short pulse laser is focused in the glass, be accompanied by laser special-shaped scanning glass, whole process presents helical form processing;
C) the air-breathing dust collect plant of platform bottom is collected the glass slag after the scanning;
D) blowning installation on the platform blows away the slag and the dust granules of Surface Machining on glass.
Substantive distinguishing features and obvious improvement that technical solution of the present invention is outstanding are mainly reflected in:
The present invention is by selecting the non-absorbent ultrashort pulse visible light wave range of glass as lasing light emitter, ultra-short pulse laser is focused on the glass interior zone, focus under the galvanometer light path system in Three-Dimensional Dynamic, after glass preheated, aid in down air-breathing dust collect plant and last blowning installation, to the processing of tempered glass abnormity figure, realize the processing mode of the ultra-short pulse laser cutting tempered glass that cut surface is smooth and cutting efficiency is higher.
Description of drawings
Below in conjunction with accompanying drawing technical solution of the present invention is described further:
Fig. 1: the structural representation of platform;
Fig. 2: the structural representation of apparatus of the present invention.
The implication of each Reference numeral sees the following form among the figure:
The specific embodiment
The present invention utilizes Three-Dimensional Dynamic to focus on galvanometer focused light passages system, and 10mm is carried out the abnormal shape cutting with interior glass, realizes that cut surface is comparatively smooth, cutting back strength of glass keeps higher cutting glass by laser mode.
As shown in Figure 2, the device of ultra-short pulse laser abnormity cutting safety glass, the output of ultrashort pulse laser 10 is furnished with optical gate 16, ultrashort pulse laser 10 is that wavelength is the laser instrument of 532nm green light band, the output of optical gate 16 is provided with beam expanding lens 15, the output of beam expanding lens 15 is furnished with 45 degree completely reflecting mirrors 11, the output of 45 degree completely reflecting mirrors 11 is furnished with Three-Dimensional Dynamic focusing system 12 and Three-Dimensional Dynamic focusing system 13, the output of Three-Dimensional Dynamic focusing system 13 is furnished with psychological field mirror 14 far away, psychological field mirror 14 far away is right against platform 19, and the top of platform 19 also is equipped with blowning installation 20.Ultrashort pulse laser 10 sends laser 17 and arrives optical gate 16, realize the amplification of light beam through the beam expanding lens 15 of adjustable multiple, behind 45 degree completely reflecting mirrors 11, arrive Three-Dimensional Dynamic focusing system 12 and Three-Dimensional Dynamic focusing system 13, and in the Three-Dimensional Dynamic focusing system, regulate the theoretical dead-center position of light beam in this system, after passing through psychological field mirror 14 far away then, light beam arrives platform 19, and beginning is at glass 18 inner focusings, in the process, blowning installation 20 entrys into service.
As shown in Figure 1, platform 19 comprises air-breathing dust collect plant 1, refractory ceramics substrate 2, resistance wire heater 4 and glass sample 5, air-breathing dust collect plant 1 and resistance wire heater 4 are arranged on the refractory ceramics substrate 2, resistance wire heater 4 connects power supply 3, resistance wire putting position and watt level can change according to the size of sample and graphics processing in the resistance wire heater 4, to realize variation processing.
During ultra-short pulse laser abnormity cutting safety glass, its technology is:
A) with the resistance wire heater glass heats is arrived proper temperature earlier, reduce the thermal stress that produces in the follow-up Laser Processing; Resistance wire heating platform resistance wire base can preheat glass below the ANNEALING OF GLASS temperature according to graphics processing and glass sample adjustment;
B) adopt Three-Dimensional Dynamic focused light passages system, ultra-short pulse laser is focused in the glass, be accompanied by laser special-shaped scanning glass, the figure layer same moved further of focus after with optimization process, the abnormity figure layer processing of being optimized, can be groove shape and arbitrary curve shape figure, whole process presents helical form processing; Three-Dimensional Dynamic focused light passages system realizes that the laser focal plane has the depth of focus of 10mm under the constant situation of external circuits;
C) pass through the sealing platform, air-breathing dust collect plant is adopted in the bottom, and the tempered glass slag that produces during with scanning is collected, and helps the raising of working (machining) efficiency and the lifting of processing the smoothness at edge;
D) blowning installation on the refractory ceramics substrate platform, the slag and the dust granules of Surface Machining on glass are blown away, the slag of avoiding glass surface to add man-hour forms solidification layer and granular glass is splashed to undressed zone, cause micro-crack to produce and the ITO circuit damage, cause product strength to reduce and the yield reduction.Resistant to elevated temperatures ceramic bases platform is avoided the platform of glass heats and the direct heat exchange of external environment, improves energy utilization ratio; Blowning installation dispels glass processing surface dust particle and melting range, reduces the sound of sth. throbbing or bursting limit probability of glass surface, improves the smoothness at glass-cutting edge.The ultra-short pulse laser wavelength that is adopted is the green light band of 532nm or to specifying the ultra-short pulse laser of the non-absorbent wave-length coverage of processed glass sample, pulsewidth is the subpicosecond magnitude, can directly penetrate glass, focus at assigned address, and do not influence other undressed zone.
The method of ultra-short pulse laser of the present invention cutting tempered glass, adopt wavelength be the ultrashort pulse of subpicosecond magnitude of 532nm or similar glass not to certain visible light of light absorption, rapidoprint is glazed transparent, hardness is higher and fragility the is bigger material of class.Owing to adopt ultra-short pulse laser, laser is bigger in focus place peak power, focus on the galvanometer optical system by means of Three-Dimensional Dynamic customized, the laser depth of focus is darker, and in pre-warmed transparent glass inside, laser can focus on the optional position, realize the processing up and down of this position, thermal stress produces minimumly in the process, until special-shaped figure is processed, realizes the ultra-short pulse laser cutting safety glass that the edge is better, efficient is higher.
Because the laser of the ultrashort pulse visible light wave range that adopts absorbs seldom glass, therefore, can focus on the arbitrary region that galvanometer is implemented in the glass by Three-Dimensional Dynamic focuses on, and focus on the long depth of focus characteristic of galvanometer according to Three-Dimensional Dynamic, can in glass, realize any special-shaped pattern of processing of arbitrary region, in the processing, owing to glass is preheated uniform temperature, it is very little to produce thermal stress like this in the process, in conjunction with blowning installation on the air-breathing dust collect plant of platform and the platform, machining path shape in the shape of a spiral rises again, and the pattern edge that processes is smooth, internal stress is less, intensity is higher, and integral processing method is few to sample contamination, and working (machining) efficiency is higher, the product yields is higher, is a kind of novel environment amenable green processing process.Can be used to process transparent, the material high with hardness that fragility is strong with the glass similarity, processing method is novel, environmentally friendly, has high product yields and working (machining) efficiency simultaneously.
What need understand is: the above only is a preferred implementation of the present invention; for those skilled in the art; under the prerequisite that does not break away from the principle of the invention, can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.
Claims (3)
1. the ultra-short pulse laser abnormity cuts the device of safety glass, it is characterized in that: the output of ultrashort pulse laser (10) is furnished with optical gate (16), the output of optical gate (16) is provided with beam expanding lens (15), the output of beam expanding lens (15) is furnished with 45 degree completely reflecting mirrors (11), the output of 45 degree completely reflecting mirrors (11) is furnished with the Three-Dimensional Dynamic focusing system, the output of Three-Dimensional Dynamic focusing system is furnished with psychological field mirror far away (14), described psychological field mirror far away (14) is right against platform (19), and the top of described platform (19) also is equipped with blowning installation (20); Described platform (19) comprises refractory ceramics substrate (2) and resistance wire heater (4), and air-breathing dust collect plant (1) and resistance wire heater (4) are arranged on the refractory ceramics substrate (2).
2. the device of ultra-short pulse laser abnormity cutting safety glass according to claim 1, it is characterized in that: described ultrashort pulse laser (10) is that wavelength is the laser instrument of 532nm green light band.
3. utilize the described device of claim 1 to realize the method for ultra-short pulse laser abnormity cutting safety glass, it is characterized in that comprising the steps:
A) adopt heater that glass is heated;
B) by the Three-Dimensional Dynamic focusing system ultra-short pulse laser is focused in the glass, be accompanied by laser special-shaped scanning glass, whole process presents helical form processing;
C) the air-breathing dust collect plant of platform bottom is collected the glass slag after the scanning;
D) blowning installation on the platform blows away the slag and the dust granules of Surface Machining on glass.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011100065233A CN102248302A (en) | 2011-01-13 | 2011-01-13 | Device and method for abnormally cutting toughened glass by ultra-short pulse laser |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011100065233A CN102248302A (en) | 2011-01-13 | 2011-01-13 | Device and method for abnormally cutting toughened glass by ultra-short pulse laser |
Publications (1)
Publication Number | Publication Date |
---|---|
CN102248302A true CN102248302A (en) | 2011-11-23 |
Family
ID=44976061
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2011100065233A Pending CN102248302A (en) | 2011-01-13 | 2011-01-13 | Device and method for abnormally cutting toughened glass by ultra-short pulse laser |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN102248302A (en) |
Cited By (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102717190A (en) * | 2012-06-07 | 2012-10-10 | 江阴德力激光设备有限公司 | Device and method for pulse laser etching of conducting film on organic glass |
CN102718398A (en) * | 2012-06-07 | 2012-10-10 | 江阴德力激光设备有限公司 | Device and method for carrying out special-shaped cutting on glass by utilizing ultrashort-pulse double-light-path laser |
CN102814591A (en) * | 2012-05-23 | 2012-12-12 | 苏州德龙激光有限公司 | Laser processing method and laser processing equipment |
CN102990229A (en) * | 2012-11-20 | 2013-03-27 | 深圳市大族激光科技股份有限公司 | LED (Light Emitting Diode) wafer cutting method |
CN103008887A (en) * | 2012-06-29 | 2013-04-03 | 苏州德龙激光有限公司 | Method and device for cutting machined target from two surfaces by using ultra-short pulse laser |
CN103962727A (en) * | 2013-01-28 | 2014-08-06 | 鸿富锦精密工业(深圳)有限公司 | Sapphire cutting device |
CN104043904A (en) * | 2014-06-09 | 2014-09-17 | 江苏大学 | Back side-blown gas-assisted laser cutting method and device |
CN104741799A (en) * | 2015-04-21 | 2015-07-01 | 大族激光科技产业集团股份有限公司 | Laser hole drilling method of hard and brittle material |
CN106029293A (en) * | 2013-12-17 | 2016-10-12 | 康宁股份有限公司 | Laser processing of slots and holes |
TWI576193B (en) * | 2016-05-11 | 2017-04-01 | 住華科技股份有限公司 | Cutting apparatus for optical film |
CN107127459A (en) * | 2017-06-01 | 2017-09-05 | 深圳光韵达激光应用技术有限公司 | A kind of laser accurate processing method of diamond cutter |
US9850159B2 (en) | 2012-11-20 | 2017-12-26 | Corning Incorporated | High speed laser processing of transparent materials |
US9850160B2 (en) | 2013-12-17 | 2017-12-26 | Corning Incorporated | Laser cutting of display glass compositions |
CN107745190A (en) * | 2017-10-17 | 2018-03-02 | 李俊强 | A kind of planar laser cutter device |
CN109014629A (en) * | 2018-10-26 | 2018-12-18 | 上海费米激光科技有限公司 | A kind of four axis laser precision machining devices of micron of line width |
US10335902B2 (en) | 2014-07-14 | 2019-07-02 | Corning Incorporated | Method and system for arresting crack propagation |
US10377658B2 (en) | 2016-07-29 | 2019-08-13 | Corning Incorporated | Apparatuses and methods for laser processing |
US10392290B2 (en) | 2013-12-17 | 2019-08-27 | Corning Incorporated | Processing 3D shaped transparent brittle substrate |
US10522963B2 (en) | 2016-08-30 | 2019-12-31 | Corning Incorporated | Laser cutting of materials with intensity mapping optical system |
US10626040B2 (en) | 2017-06-15 | 2020-04-21 | Corning Incorporated | Articles capable of individual singulation |
RU2720791C1 (en) * | 2019-09-06 | 2020-05-13 | Общество с ограниченной ответственностью "НАУЧНО-ТЕХНИЧЕСКОЕ ОБЪЕДИНЕНИЕ "ИРЭ-Полюс" (ООО НТО "ИРЭ-Полюс") | Method of laser processing of transparent brittle material and device for its implementation |
US10688599B2 (en) | 2017-02-09 | 2020-06-23 | Corning Incorporated | Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines |
US10730783B2 (en) | 2016-09-30 | 2020-08-04 | Corning Incorporated | Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots |
US10752534B2 (en) | 2016-11-01 | 2020-08-25 | Corning Incorporated | Apparatuses and methods for laser processing laminate workpiece stacks |
CN111822879A (en) * | 2020-06-24 | 2020-10-27 | 深圳中科光子科技有限公司 | Ultrafast laser processing device and processing method for ferrite material |
CN112531135A (en) * | 2020-11-30 | 2021-03-19 | Oppo广东移动通信有限公司 | Manufacturing method of display screen, display screen and electronic device |
CN112975162A (en) * | 2021-04-21 | 2021-06-18 | 武汉华工激光工程有限责任公司 | Ground glass cutting device and method based on adaptive optics |
US11111170B2 (en) | 2016-05-06 | 2021-09-07 | Corning Incorporated | Laser cutting and removal of contoured shapes from transparent substrates |
US11148225B2 (en) | 2013-12-17 | 2021-10-19 | Corning Incorporated | Method for rapid laser drilling of holes in glass and products made therefrom |
US11186060B2 (en) | 2015-07-10 | 2021-11-30 | Corning Incorporated | Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same |
CN114473247A (en) * | 2022-03-18 | 2022-05-13 | 广东中科微精光子制造科技有限公司 | Laser cutting device and laser cutting method |
US11345625B2 (en) | 2013-01-15 | 2022-05-31 | Corning Laser Technologies GmbH | Method and device for the laser-based machining of sheet-like substrates |
CN115215538A (en) * | 2021-04-15 | 2022-10-21 | 大族激光科技产业集团股份有限公司 | Laser hole cutting method and laser cutting device for glass |
US11542190B2 (en) | 2016-10-24 | 2023-01-03 | Corning Incorporated | Substrate processing station for laser-based machining of sheet-like glass substrates |
US11556039B2 (en) | 2013-12-17 | 2023-01-17 | Corning Incorporated | Electrochromic coated glass articles and methods for laser processing the same |
US11648623B2 (en) | 2014-07-14 | 2023-05-16 | Corning Incorporated | Systems and methods for processing transparent materials using adjustable laser beam focal lines |
US11697178B2 (en) | 2014-07-08 | 2023-07-11 | Corning Incorporated | Methods and apparatuses for laser processing materials |
US11713271B2 (en) | 2013-03-21 | 2023-08-01 | Corning Laser Technologies GmbH | Device and method for cutting out contours from planar substrates by means of laser |
US11773004B2 (en) | 2015-03-24 | 2023-10-03 | Corning Incorporated | Laser cutting and processing of display glass compositions |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2854762Y (en) * | 2005-11-18 | 2007-01-03 | 上海市激光技术研究所 | Short pulse laser precision etching device for optical disk master disk surface and interior |
CN101157515A (en) * | 2007-09-29 | 2008-04-09 | 四川省洪雅维国光学有限公司 | Glass cutting process |
CN201087172Y (en) * | 2006-12-28 | 2008-07-16 | 上海市激光技术研究所 | Ultra-thin glass substrate laser cutting machine |
JP2009045637A (en) * | 2007-08-17 | 2009-03-05 | Fuji Xerox Co Ltd | Laser beam machining apparatus |
CN202022849U (en) * | 2011-01-13 | 2011-11-02 | 苏州德龙激光有限公司 | Short-pulse laser toughened-glass abnormal cutting device |
-
2011
- 2011-01-13 CN CN2011100065233A patent/CN102248302A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2854762Y (en) * | 2005-11-18 | 2007-01-03 | 上海市激光技术研究所 | Short pulse laser precision etching device for optical disk master disk surface and interior |
CN201087172Y (en) * | 2006-12-28 | 2008-07-16 | 上海市激光技术研究所 | Ultra-thin glass substrate laser cutting machine |
JP2009045637A (en) * | 2007-08-17 | 2009-03-05 | Fuji Xerox Co Ltd | Laser beam machining apparatus |
CN101157515A (en) * | 2007-09-29 | 2008-04-09 | 四川省洪雅维国光学有限公司 | Glass cutting process |
CN202022849U (en) * | 2011-01-13 | 2011-11-02 | 苏州德龙激光有限公司 | Short-pulse laser toughened-glass abnormal cutting device |
Cited By (47)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102814591B (en) * | 2012-05-23 | 2016-06-01 | 苏州德龙激光股份有限公司 | Laser processing and laser process equipment |
CN102814591A (en) * | 2012-05-23 | 2012-12-12 | 苏州德龙激光有限公司 | Laser processing method and laser processing equipment |
TWI460045B (en) * | 2012-05-23 | 2014-11-11 | Suzhou Delphi Laser Co Ltd | Laser processing method and laser processing equipment |
CN102718398A (en) * | 2012-06-07 | 2012-10-10 | 江阴德力激光设备有限公司 | Device and method for carrying out special-shaped cutting on glass by utilizing ultrashort-pulse double-light-path laser |
CN102717190A (en) * | 2012-06-07 | 2012-10-10 | 江阴德力激光设备有限公司 | Device and method for pulse laser etching of conducting film on organic glass |
CN102718398B (en) * | 2012-06-07 | 2015-06-17 | 江阴德力激光设备有限公司 | Method for carrying out special-shaped cutting on glass by utilizing ultrashort-pulse double-light-path laser |
CN103008887A (en) * | 2012-06-29 | 2013-04-03 | 苏州德龙激光有限公司 | Method and device for cutting machined target from two surfaces by using ultra-short pulse laser |
TWI462793B (en) * | 2012-06-29 | 2014-12-01 | Suzhou Delphi Laser Co Ltd | Method of cutting workpiece from both sides by ultrashort laser pulse light and apparatus by same |
CN102990229A (en) * | 2012-11-20 | 2013-03-27 | 深圳市大族激光科技股份有限公司 | LED (Light Emitting Diode) wafer cutting method |
US9850159B2 (en) | 2012-11-20 | 2017-12-26 | Corning Incorporated | High speed laser processing of transparent materials |
US11345625B2 (en) | 2013-01-15 | 2022-05-31 | Corning Laser Technologies GmbH | Method and device for the laser-based machining of sheet-like substrates |
CN103962727A (en) * | 2013-01-28 | 2014-08-06 | 鸿富锦精密工业(深圳)有限公司 | Sapphire cutting device |
US11713271B2 (en) | 2013-03-21 | 2023-08-01 | Corning Laser Technologies GmbH | Device and method for cutting out contours from planar substrates by means of laser |
CN106029293A (en) * | 2013-12-17 | 2016-10-12 | 康宁股份有限公司 | Laser processing of slots and holes |
US11556039B2 (en) | 2013-12-17 | 2023-01-17 | Corning Incorporated | Electrochromic coated glass articles and methods for laser processing the same |
US9850160B2 (en) | 2013-12-17 | 2017-12-26 | Corning Incorporated | Laser cutting of display glass compositions |
US11148225B2 (en) | 2013-12-17 | 2021-10-19 | Corning Incorporated | Method for rapid laser drilling of holes in glass and products made therefrom |
US10233112B2 (en) | 2013-12-17 | 2019-03-19 | Corning Incorporated | Laser processing of slots and holes |
US10392290B2 (en) | 2013-12-17 | 2019-08-27 | Corning Incorporated | Processing 3D shaped transparent brittle substrate |
CN106029293B (en) * | 2013-12-17 | 2019-05-14 | 康宁股份有限公司 | The laser processing of slot and hole |
CN104043904A (en) * | 2014-06-09 | 2014-09-17 | 江苏大学 | Back side-blown gas-assisted laser cutting method and device |
US11697178B2 (en) | 2014-07-08 | 2023-07-11 | Corning Incorporated | Methods and apparatuses for laser processing materials |
US10335902B2 (en) | 2014-07-14 | 2019-07-02 | Corning Incorporated | Method and system for arresting crack propagation |
US11648623B2 (en) | 2014-07-14 | 2023-05-16 | Corning Incorporated | Systems and methods for processing transparent materials using adjustable laser beam focal lines |
US11773004B2 (en) | 2015-03-24 | 2023-10-03 | Corning Incorporated | Laser cutting and processing of display glass compositions |
CN104741799A (en) * | 2015-04-21 | 2015-07-01 | 大族激光科技产业集团股份有限公司 | Laser hole drilling method of hard and brittle material |
US11186060B2 (en) | 2015-07-10 | 2021-11-30 | Corning Incorporated | Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same |
US11111170B2 (en) | 2016-05-06 | 2021-09-07 | Corning Incorporated | Laser cutting and removal of contoured shapes from transparent substrates |
TWI576193B (en) * | 2016-05-11 | 2017-04-01 | 住華科技股份有限公司 | Cutting apparatus for optical film |
US10377658B2 (en) | 2016-07-29 | 2019-08-13 | Corning Incorporated | Apparatuses and methods for laser processing |
US10522963B2 (en) | 2016-08-30 | 2019-12-31 | Corning Incorporated | Laser cutting of materials with intensity mapping optical system |
US11130701B2 (en) | 2016-09-30 | 2021-09-28 | Corning Incorporated | Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots |
US10730783B2 (en) | 2016-09-30 | 2020-08-04 | Corning Incorporated | Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots |
US11542190B2 (en) | 2016-10-24 | 2023-01-03 | Corning Incorporated | Substrate processing station for laser-based machining of sheet-like glass substrates |
US10752534B2 (en) | 2016-11-01 | 2020-08-25 | Corning Incorporated | Apparatuses and methods for laser processing laminate workpiece stacks |
US10688599B2 (en) | 2017-02-09 | 2020-06-23 | Corning Incorporated | Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines |
CN107127459A (en) * | 2017-06-01 | 2017-09-05 | 深圳光韵达激光应用技术有限公司 | A kind of laser accurate processing method of diamond cutter |
CN107127459B (en) * | 2017-06-01 | 2019-04-05 | 深圳光韵达激光应用技术有限公司 | A kind of laser accurate processing method of diamond cutter |
US10626040B2 (en) | 2017-06-15 | 2020-04-21 | Corning Incorporated | Articles capable of individual singulation |
CN107745190A (en) * | 2017-10-17 | 2018-03-02 | 李俊强 | A kind of planar laser cutter device |
CN109014629A (en) * | 2018-10-26 | 2018-12-18 | 上海费米激光科技有限公司 | A kind of four axis laser precision machining devices of micron of line width |
RU2720791C1 (en) * | 2019-09-06 | 2020-05-13 | Общество с ограниченной ответственностью "НАУЧНО-ТЕХНИЧЕСКОЕ ОБЪЕДИНЕНИЕ "ИРЭ-Полюс" (ООО НТО "ИРЭ-Полюс") | Method of laser processing of transparent brittle material and device for its implementation |
CN111822879A (en) * | 2020-06-24 | 2020-10-27 | 深圳中科光子科技有限公司 | Ultrafast laser processing device and processing method for ferrite material |
CN112531135A (en) * | 2020-11-30 | 2021-03-19 | Oppo广东移动通信有限公司 | Manufacturing method of display screen, display screen and electronic device |
CN115215538A (en) * | 2021-04-15 | 2022-10-21 | 大族激光科技产业集团股份有限公司 | Laser hole cutting method and laser cutting device for glass |
CN112975162A (en) * | 2021-04-21 | 2021-06-18 | 武汉华工激光工程有限责任公司 | Ground glass cutting device and method based on adaptive optics |
CN114473247A (en) * | 2022-03-18 | 2022-05-13 | 广东中科微精光子制造科技有限公司 | Laser cutting device and laser cutting method |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102248302A (en) | Device and method for abnormally cutting toughened glass by ultra-short pulse laser | |
JP7313390B2 (en) | Laser cutting and processing of display glass compositions | |
KR101163394B1 (en) | Method for the freeform cutting of curved substrates made from brittle material | |
US6787732B1 (en) | Method for laser-scribing brittle substrates and apparatus therefor | |
CN106966580B (en) | Method for cutting glass by femtosecond laser | |
JP2011079690A (en) | Laser thermal stress dividing of thick plate glass using diffraction grating | |
TWI490176B (en) | Process and apparatus for splitting glass sheet | |
TWI469841B (en) | Method and apparatus for machining workpieces using tilted laser scanning | |
CN202022849U (en) | Short-pulse laser toughened-glass abnormal cutting device | |
CN101875156B (en) | Laser machining method and laser machining apparatus | |
JP2006150984A (en) | Method and device for rapid cutting of a workpiece made of brittle material | |
JP6703286B2 (en) | Brittle material cutting method | |
CN102310285B (en) | Laser processing device of silicon glass bonding slice and method thereof | |
CN106825944B (en) | A kind of ultrafast femtosecond laser cutting machine | |
CN102026926A (en) | Method of machining vulnerable material substrate | |
WO2022012069A1 (en) | Method for machining three-dimensional contour of transparent material | |
CN108788451A (en) | A kind of processing method and device of ultrafast laser transparent material | |
JP2007260749A (en) | Laser beam machining method and apparatus, and machined product of brittle material | |
CN101982285A (en) | Laser grooving and scribing system and laser grooving and scribing method for solar panel | |
CN102718398B (en) | Method for carrying out special-shaped cutting on glass by utilizing ultrashort-pulse double-light-path laser | |
CN110312590A (en) | A kind of processing method, device and the system of hard brittle prod | |
CN103387335B (en) | Cutter for substrate and method thereof | |
CN103058508A (en) | A device and a method for processing a glass ink jet sheet | |
CN201971737U (en) | Device for cutting glass | |
CN202174351U (en) | Laser processing device of a silicon-glass bonding slice |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C53 | Correction of patent of invention or patent application | ||
CB02 | Change of applicant information |
Address after: 215021 Suzhou Industrial Park, Jiangsu, Hong Zhong Road, No. 77 Applicant after: Suzhou Delphi Laser Co., Ltd. Address before: 215021 Suzhou Industrial Park, Jiangsu, Hong Zhong Road, No. 77 Applicant before: Suzhou Delphi Laser Co., Ltd. |
|
C12 | Rejection of a patent application after its publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20111123 |