CN108788451A - A kind of processing method and device of ultrafast laser transparent material - Google Patents
A kind of processing method and device of ultrafast laser transparent material Download PDFInfo
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- CN108788451A CN108788451A CN201811052348.XA CN201811052348A CN108788451A CN 108788451 A CN108788451 A CN 108788451A CN 201811052348 A CN201811052348 A CN 201811052348A CN 108788451 A CN108788451 A CN 108788451A
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- 238000003672 processing method Methods 0.000 title claims abstract description 19
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- 239000013307 optical fiber Substances 0.000 claims abstract description 17
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
Abstract
The invention discloses a kind of processing method of transparent material and devices, optical fiber laser of one wavelength between 1020 nanometers~1090 nanometers is provided, after the laser beam of seed laser output is carried out energy amplification using fiber amplifier, output laser pulse string, include at least two laser pulses in each train of pulse, pulse width is less than 200ps, the peak power of pulse is more than 100kW, the time between each laser pulse in each train of pulse is less than 90ns, interval time between train of pulse is more than 240ns, each second overall pulse number is more than 50,000；Wherein, the ultrafast laser beam of laser output carries out energy amplification only with fiber amplifier；The position to be processed that above-mentioned laser is focused on to transparent material is processed and is stepped up focus point by mobile focal position by setting track, realize the processing to transparent material from the bottom to top.The present invention can greatly improve material removal efficiency, need not heat or the subsequent handling invaded of acid, will not generate oblique angle.
Description
Technical field
The present invention relates to a kind of transparent material processing methods, and in particular to a kind of ultrafast laser for transparent material is processed
Method.
Background technology
Glass and sapphire transparent material have become an indispensable part in people's daily life, with economy
Development, it is growing day by day to the demand of glassware.In glass and sapphire production industry, glass and sapphire processing
It is a particularly significant link.
In general, glass and sapphire processing（Cold working）Include mainly polishing, cutting, drilling, engraving, edging etc..
For the purpose that the above-mentioned glass of realization of industrialization and sapphire are processed, the processing method used in the prior art mainly has machinery to add
Work method, chemical processes（It is mainly used for polishing and etches）, high-pressure water jet processing method（It is mainly used for cutting and bores
Hole）And laser processing.Wherein, laser processing will be far superior to other in terms of process velocity and the degree of automation
Method.
In general, being laser machined the CO using wavelength near 10.6 μm to glass and sapphire2Laser,
Output power, which generally requires, reaches 100W or more.CO2Laser process glass and sapphire be by laser light incident make glass by
After heat occur fracture and realize.By taking the cutting of plate glass as an example, by CO2The laser beam focus that laser is sent out is to tablet glass
On glass, high-power laser makes glass is heated in the focal position of laser to be broken, and crack is prolonged to the upper and lower surface of glass
It stretches to complete to cut.During by thermal cutting, it usually needs using quenching mouth by cold water or cool air injection to Cutting Road
On, so that glass is split.This method cutting accuracy is relatively low, while being difficult to complex figure.
Glass and sapphire can be laser machined using ps pulsed laser and ns pulsed laser, reaches and compare CO2Laser is better
Processing effect.With traditional CO2Laser is different, and this nanosecond laser is that glass processing is realized by way of micro-explosion
's.Equally by taking the cutting of plate glass as an example, the focus of laser can be made to move in the vertical direction by 3D scanning galvanometers,
The explosion of micron dimension can occur for the place that laser spot is passed through, glass, this microlesion be superimposed in the vertical direction thus
Realize the higher cutting of precision.
However, above-mentioned this nanosecond laser is in terms of glass and sapphire processing, there is also some defects.Nanosecond
Chipping after laser processing is generally higher than 50 microns, however in many application scenarios, it is desirable that chipping is less than 20 microns.
In order to which the laser processing for being less than 20 microns is horizontal, ultrafast laser processing may be used.And ultrafast laser is processed
An oblique angle generally can be generated in cutting position.A kind of method is using ultrafast laser into silk cutting method, however, being cut at silk
When there is no the removal of material, so generally requiring heating or the subsequent handlings such as acid is invaded can just be such that material separates.Heating or acid are invaded
Harmful effect can be generated to material in many cases.And when the diameter of laser processing be less than 5 millimeters when, even with heating or
Acid, which is invaded, also is difficult to that material is made to separate.
So find a kind of new ultrafast laser transparent material processing method to realize transparent material it is quick, low at
This processing and no oblique angle are very significant.
Invention content
The goal of the invention of the present invention is to provide a kind of processing method of transparent material, to overcome processing in the prior art limited
The problem of, improve the accuracy and speed of laser light absorbent material processing.
Another goal of the invention of the present invention is to provide a kind of processing unit (plant) of transparent material that realizing the processing method.
To achieve the above object of the invention, the technical solution adopted by the present invention is：A kind of processing of ultrafast laser transparent material
Method provides optical fiber laser of the wavelength between 1020 nanometers~1090 nanometers as seed laser, by seed laser
The laser beam of device output carries out energy amplification using fiber amplifier, and the laser beam of output forms laser pulse train, each laser
Include at least two laser pulses in train of pulse, the pulse width of each laser pulse is less than 200ps, the peak work of pulse
Rate is more than 100kW, and the time between adjacent laser pulse in train of pulse is less than 90ns, and the interval time between train of pulse is more than
240ns, each second overall pulse number are more than 50000；Wherein, the ultrafast laser beam of laser output is only with fiber amplifier
Carry out energy amplification；
It is realized to transparent material by mobile focal position the position to be processed that above-mentioned laser pulse train is focused on to transparent material
The processing of material；
When processing, the lower surface of transparent material to be processed is focused the laser beam to, is processed and is stepped up by setting track
Focus point realizes the processing to transparent material from the bottom to top.
In above-mentioned technical proposal, pulse output laser is to use optical fiber laser of the wavelength near 1 μm.The pulse of output
It goes here and there, includes at least two laser pulses in each train of pulse, pulse width is less than 200ps, and the peak power of pulse is more than
100kW, the time between each laser pulse in each train of pulse are less than 90ns, and the interval time between train of pulse is more than 240ns.
Make material that the removal of micron dimension (1 ~ 20 micron) occur in first impulse action to material, generates material and remove and increase
The temperature of adjacent material.Adjacent material heat by before spreading, the second pulse reaches and further quickly increases surrounding material
Then the temperature of material generates more material removals.Third pulse can utilize the waste heat of two pulses in front, effectively generate
More material removals, and so on, this train of pulse can greatly improve material removal efficiency.Thermal diffusion needs the time of microsecond
Level, but subsequent pulse is usually reached in or so more than ten nanoseconds.It was divided into for more than ten nanoseconds between the typical pulse of train of pulse, it is remote small
Gsec needed for thermal diffusion.Therefore the waste heat from previous pulse can be effectively utilized.Laser arteries and veins in train of pulse
It is 2~50 to rush number, preferably 2~15.Because laser processing procedure is the removal of material, therefore need not heat or acid
The subsequent handling invaded.The subsequent handling that the aperture that 0.1 millimeter of diameter need not also heat or acid is invaded.Because laser is picosecond
Laser, so chipping is less than 20 microns.
Preferably, each second overall pulse number is more than 100000；Wherein, optical fiber laser output laser beam only with
Fiber amplifier carries out energy amplification；Solid state laser of this laser system based on optical fiber laser than free space
Possess higher stability, the spectral region for exporting laser is 1020 nanometers~1090 nanometers.The transparent material of processing can be
Building glass, base plate glass, reinforcing glass, tempered glass, optical glass, quartz glass, ultra-thin glass, sapphire, crystal material
Material, semiconductor and plastics etc..The thickness of transparent material can be 0.005mm to 150mm.
In above-mentioned technical proposal, the mobile focal position can realize that the laser of output is through sweeping by scanning galvanometer
The position to be processed for focusing on transparent material after galvanometer by condenser lens is retouched, makes transparent material that the removal of micron dimension occur, is led to
The position for over-scanning galvanometer moving focal point makes removal point be superimposed to realize processing in the region of required processing.
When specific processing, laser beam focus to the lower surface of transparent material to be processed, be processed by setting track and by
Step increases focus point, realizes the processing to transparent material from the bottom to top.Such ultrafast laser processes no oblique angle.
Alternatively, the mobile focal position is real by the relative position for changing condenser lens and transparent material to be processed
Existing, the laser line focus lens focus of output makes material that the removal of micron dimension occur, leads to the position to be processed of transparent material
It crosses and moves the optical head including laser and lens, or mobile transparent material to be processed, change focus on transparent material
Position, make removal point required processing region be superimposed to realize processing.
In above-mentioned technical proposal, the processing is one kind in drilling, cutting, edging, chamfering.
Further application of the invention method is that above-mentioned laser is focused on to the lower surface of the position to be processed of transparent material,
By mobile focal position, it is processed and is stepped up focus point by setting track, is realized from the bottom to top to transparent material
The diameter of drilling, drilling is less than 3 millimeters.
Another goal of the invention to realize the present invention, the technical solution adopted is that, a kind of ultrafast laser transparent material adds
Tooling is set, and is made of optical fiber ultrafast laser, condenser lens and focus adjustment mechanism, and the optical fiber ultrafast laser is mainly by defeated
Go out seed laser, multistage or single-stage fiber amplifier of the wavelength between 1020 nanometers~1090 nanometers, collimator is constituted, institute
It states seed laser and is equipped with pulse control unit, include in each laser pulse train of the pulse control unit control output
The pulse width of at least two laser pulses, each laser pulse is less than 200ps, and the peak power of pulse is more than 100kW,
The time between adjacent laser pulse in train of pulse is less than 90ns, and the interval time between train of pulse is more than 240ns, each second
Overall pulse number is more than 50000；The output light of seed laser exports after fiber amplifier amplifies, after being collimated by collimator to swash
Optical pulse train；The laser pulse train line focus lens focus is in the position to be processed of transparent material, and by focus adjustment mechanism
The position of focus point relative transparent material is adjusted by setting track.
In above-mentioned technical proposal, the focus adjustment mechanism includes scanning galvanometer, and the scanning galvanometer is located in the optical path
Between the output and condenser lens of laser pulse train laser.
The scanning galvanometer is one kind in 2-D vibration mirror, 2.5 dimension galvanometers or three-dimensional galvanometer.
Alternatively, the optical fiber ultrafast laser and the condenser lens constitute optical head, the focus adjustment mechanism includes
Optical head position adjustment mechanism, using plane is X-Y plane where transparent material to be processed, Z axis is perpendicular to X-Y plane, the light
Learning the saturating complete machine structure in head position makes optical head have X-axis, Y-axis, the degree of freedom of Z axis translation.
Alternatively, the focus adjustment mechanism includes the platform for placing transparent material to be processed, with transparent material to be processed
Plane where material is X-Y plane, and for Z axis perpendicular to X-Y plane, the focus adjustment mechanism makes the platform have X-axis, Y-axis flat
The degree of freedom of shifting has the degree of freedom along Z axis relative motion between the condenser lens and the platform.
Since above-mentioned technical proposal is used, the present invention has following advantages compared with prior art：
1, the present invention in, laser output be train of pulse, make in first impulse action to material material occur micron dimension (1 ~
20 microns) removal, generate material remove and increase the temperature of adjacent material.Adjacent material heat by before spreading,
Second pulse reaches and further quickly increases the temperature of adjacent material, more material removals is then generated, if a pulse
Two pulses are had more than in string, then third pulse can utilize the waste heat of two pulses in front, effectively generate more materials
Removal, and so on, this train of pulse can greatly improve material removal efficiency.
2. in the present invention, the pulse width of laser output is less than 200 picoseconds, so issuable chipping is small when processing
It is more much smaller than the chipping of nanosecond laser in 20 microns.
3. in the present invention, because laser processing procedure is the removal of material, therefore need not heat or follow-up work that acid is invaded
Sequence, a diameter of 0.1 millimeter of aperture need not also heat or the subsequent handling invaded of acid, is cut at silk than ultrafast laser bright
Aobvious advantage.
4. laser beam focus is processed and is stepped up poly- to the lower surface of transparent material to be processed, by setting track
Focus realizes that no oblique angle is processed in the processing to transparent material, such ultrafast laser from the bottom to top.General ultrafast laser because
For peak power height, can only from top to bottom process, therefore have oblique angle.
5, in the present invention, multi-pulsed laser device generates seed laser using optical fiber laser, and energy is carried out through fiber amplifier
Optical frequency-doubling acquisition is carried out after amount amplification, laser no longer carries out any type of energy amplification after fiber amplifier output, no longer
It using the solid of free space, does not vibrate back and forth, therefore laser output can be highly stable, thereby ensures that material processing
Precision is processed to various complex patterns.
6, each second overall pulse number of optical-fiber laser multi-pulsed laser device output light of the invention is more than 50,000,
Each second overall pulse number is more than 600,000 in most cases, to ensure process velocity.
7, optical-fiber laser train of pulse ultrafast laser of the invention（Special mean power is more than 30 watts of laser）Valence
Lattice are generally cheaper than solid ultrafast laser, so the cost of ultrafast laser processing is relatively low.
8, when only with condenser lens without using scanning galvanometer, due to using optical fiber laser, the device of the invention
It is lighter, it may be mounted in mobile device.
Description of the drawings
Fig. 1 is the structural framing schematic diagram of multi-pulsed laser device in the embodiment of the present invention；
Fig. 2 is the structural schematic diagram of the embodiment of the present invention one；
Fig. 3 is the structural schematic diagram of the embodiment of the present invention two.
Specific implementation mode
The invention will be further described with reference to the accompanying drawings and embodiments：
Embodiment one：It is shown in Figure 2, a kind of processing unit (plant) of transparent material, by ultrafast pulse string laser, scanning galvanometer,
Condenser lens form, referring to Fig. 1, the ultrafast pulse string laser mainly by output wavelength 1020 nanometers~1090 nanometers it
Between train of pulse seed laser, multistage or single-stage fiber amplifier and collimating element constitute, train of pulse seed laser it is defeated
Light extraction is after fiber amplifier amplifies, output laser pulse string after being collimated by collimator；The scanned galvanometer of laser pulse train
The position to be processed of transparent material is focused on by condenser lens afterwards.
In the present embodiment, scanning galvanometer is three-dimensional galvanometer, and the repetition rate of laser is each second overall pulse number 600000
A, pulse width is 180ps, and the laser pulse number in train of pulse is 2, and the time between each laser pulse in train of pulse is
12.5ns, spot diameter are 20 microns.The Duplication of laser facula is 67% in the moving process of laser pulse train, therefore is swashed
Light is moved forward under the drive of galvanometer with the speed of 1.8 meter per seconds.When drilling on transparent material, each rotation generates several microns of thickness
The cutting of degree.Cutting is promoted by mobile galvanometer, realizes high efficiency drilling.
Embodiment two：Shown in attached drawing 3, a kind of processing unit (plant) of transparent material by ultrafast pulse string laser, focuses
Lens form, and referring to Fig. 1, the ultrafast pulse string laser is mainly by output wavelength between 1020 nanometers~1090 nanometers
Ultrafast pulse string seed laser, multistage or single-stage fiber amplifier and collimator are constituted, the output of train of pulse seed laser
Light is after fiber amplifier amplifies, output laser pulse string after being collimated by collimator；The laser pulse train is gathered by condenser lens
Coke is in the position to be processed of transparent material.
In the present embodiment, multi-pulsed laser by lens focus on transparent material, install on the moving belt, passes through shifting by lens
It moves lens and realizes linear cutting, transparent material is arranged on Mechanical Moving platform, passes through Mechanical Moving platform and realizes transparent material
Expect the change in location relative to focus point.Each second overall pulse number 2000000, pulse width 150ps, in train of pulse
Laser pulse number is 5, and the time between each laser pulse in train of pulse is 12.5ns, and spot diameter is 20 microns, overlapping
Rate is 55%, and laser is moved forward with 3.6 meters of speed per second, and laser generates removal in transparent material surface.Realize transparent material
High-speed cutting.
Claims (15)
1. a kind of processing method of ultrafast laser transparent material provides light of the wavelength between 1020 nanometers~1090 nanometers
Fibre laser carries out energy amplification as seed laser, by the laser beam of seed laser output using fiber amplifier, defeated
The laser beam gone out forms laser pulse train, it is characterised in that：Include at least two laser pulses in each laser pulse train, it is each
The pulse width of the laser pulse is less than 200ps, and the peak power of pulse is more than 100kW, the adjacent laser arteries and veins in train of pulse
Time between punching is less than 90ns, and the interval time between train of pulse is more than 240ns, and each second overall pulse number is more than 50000；
Wherein, the ultrafast laser beam of laser output carries out energy amplification only with fiber amplifier；
It is realized to transparent material by mobile focal position the position to be processed that above-mentioned laser pulse train is focused on to transparent material
The processing of material；
When processing, the lower surface of transparent material to be processed is focused the laser beam to, is processed and is stepped up by setting track
Focus point realizes the processing to transparent material from the bottom to top.
2. the processing method of transparent material according to claim 1, it is characterised in that：The seed laser is optical fiber
The semiconductor laser of laser or fiber coupling.
3. the processing method of transparent material according to claim 1, it is characterised in that：The mobile focal position passes through
Scanning galvanometer is realized, is focused on the position to be processed of transparent material after the scanned galvanometer of laser beam of output by condenser lens, is made
The removal of micron dimension occurs for material, by the position of scanning galvanometer moving focal point, keeps removal point folded in the region of required processing
Add to realize processing.
4. the processing method of transparent material according to claim 1, it is characterised in that：The mobile focal position passes through
The relative position for changing condenser lens and transparent material to be processed realizes, the laser line focus lens focus of output to transparent material
The position to be processed of material makes material that the removal of micron dimension occur, includes the optical head of laser and lens by movement, or
Mobile transparent material to be processed changes position of the focus on transparent material, removal point is made to be superimposed in the region of required processing
To realize processing.
5. the processing method of the transparent material according to any claim in Claims 1-4, it is characterised in that：It is described
Transparent material is one kind in glass, crystalline material, semiconductor and plastics.
6. the processing method of the transparent material according to any claim in Claims 1-4, it is characterised in that：It is described
Processing is one kind in drilling, cutting, edging, chamfering.
7. a kind of processing method of ultrafast laser transparent material, it is characterised in that：A wavelength is provided to receive 1020 nanometers~1090
The laser beam of seed laser output is carried out energy by the optical fiber laser between rice as seed laser using fiber amplifier
After amount amplification, output laser pulse string, it is characterised in that：Include at least two laser pulses in each laser pulse train, it is each
The pulse width of the laser pulse is less than 200ps, and the peak power of pulse is more than 100kW, the adjacent laser arteries and veins in train of pulse
Time between punching is less than 90ns, and the interval time between train of pulse is more than 240ns, and each second overall pulse number is more than 50000；
Wherein, the ultrafast laser beam of laser output carries out energy amplification only with fiber amplifier；
The lower surface that above-mentioned laser is focused on to the position to be processed of transparent material, by mobile focal position, by setting track
It is processed and is stepped up focus point, realizes that the drilling to transparent material, the diameter of drilling are less than 3 millimeters from the bottom to top.
8. the processing method of transparent material according to claim 7, it is characterised in that：The mobile focal position passes through
Scanning galvanometer is realized, is focused on the position to be processed of transparent material after the scanned galvanometer of laser of output by condenser lens, is made material
The removal of micron dimension occurs for material, by the position of scanning galvanometer moving focal point, removal point is made to be superimposed in the region of required processing
To realize processing.
9. the processing method of transparent material according to claim 7, it is characterised in that：The mobile focal position passes through
The relative position for changing condenser lens and transparent material to be processed realizes, the laser line focus lens focus of output to transparent material
The position to be processed of material makes material that the removal of micron dimension occur, includes the optical head of laser and lens by movement, or
Mobile transparent material to be processed changes position of the focus on transparent material, removal point is made to be superimposed in the region of required processing
To realize processing.
10. the processing method of the transparent material according to any claim in claim 7 to 9, it is characterised in that：It is described
Transparent material is one kind in glass, crystalline material, semiconductor and plastics.
11. a kind of processing unit (plant) of ultrafast laser transparent material adjusts machine by optical fiber ultrafast laser, condenser lens and focus
Structure forms, it is characterised in that：The optical fiber ultrafast laser is mainly by output wavelength between 1020 nanometers~1090 nanometers
Seed laser, multistage or single-stage fiber amplifier, collimator are constituted, and the seed laser is equipped with pulse control unit,
Include at least two laser pulses, each laser arteries and veins in each laser pulse train of the pulse control unit control output
The pulse width of punching is less than 200ps, and the peak power of pulse is more than 100kW, the time between adjacent laser pulse in train of pulse
Less than 90ns, the interval time between train of pulse is more than 240ns, and each second overall pulse number is more than 50000；Seed laser
Output light after fiber amplifier amplifies, output laser pulse string after being collimated by collimator；The laser pulse train line focus
Lens focus adjusts focus point relative transparent material in the position to be processed of transparent material, and by focus adjustment mechanism by setting track
The position of material.
12. the processing unit (plant) of transparent material according to claim 11, it is characterised in that：The focus adjustment mechanism includes
Scanning galvanometer, the scanning galvanometer are located between the output and condenser lens of laser pulse train laser in the optical path.
13. the processing unit (plant) of transparent material according to claim 12, it is characterised in that：The scanning galvanometer is that two dimension is shaken
One kind in mirror, 2.5 dimension galvanometers or three-dimensional galvanometer.
14. the processing unit (plant) of transparent material according to claim 11, it is characterised in that：The optical fiber ultrafast laser and
The condenser lens constitutes optical head, and the focus adjustment mechanism includes optical head position adjustment mechanism, with to be processed transparent
Plane where material is X-Y plane, and for Z axis perpendicular to X-Y plane, the saturating complete machine structure of the optical head position makes optical head have X-axis, Y
The degree of freedom that axis, Z axis translate.
15. the processing unit (plant) of transparent material according to claim 11, it is characterised in that：The focus adjustment mechanism includes
The platform for placing transparent material to be processed, using plane where transparent material to be processed as X-Y plane, Z axis is flat perpendicular to X-Y
Face, the focus adjustment mechanism make the degree of freedom that there is the platform X-axis, Y-axis to translate, the condenser lens and the platform it
Between have along Z axis relative motion degree of freedom.
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