CN101026948A - Single-phase ultrahigh heat flow micro-column heat exchanger - Google Patents
Single-phase ultrahigh heat flow micro-column heat exchanger Download PDFInfo
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- CN101026948A CN101026948A CN 200710013844 CN200710013844A CN101026948A CN 101026948 A CN101026948 A CN 101026948A CN 200710013844 CN200710013844 CN 200710013844 CN 200710013844 A CN200710013844 A CN 200710013844A CN 101026948 A CN101026948 A CN 101026948A
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Abstract
The heat exchanger includes body case with opening at up portion, and hollow trough, and upper cover plate matched to the body case. It is watertight seal between the body case and the upper cover plate. The body case and the upper cover plate are sealed together to constitute the heat exchanger with inlet and outlet of working medium. Tiny pole set composed of multiple cross spread tiny poles is setup on surface of bottom board of the trough in the body case. The invention is mainly applicable to heat exchanger.
Description
Technical field
The present invention relates to the minute yardstick field of heat transfer, relate in particular to a kind of single-phase ultrahigh heat flow micro-column heat exchanger.
Background technology
Along with continuous progress in science and technology, various sophisticated technologies field requires more and more higher to its cooling system, both required heat radiation power big, and cube is small again, and this just must relate to the research of (Micro HeatTransfer is called for short MHT) of little thermal conduction study.No matter still technically in science, little thermal conduction study is rising to emerging main branch in the calorifics engineering (Thermal Engineering), will very wide application prospect be arranged in fields such as micromachine (MEMS), new forms of energy, space flight, biotechnology, microelectronics, high power laser, high performance heat exchanger, high-temperature fuel gas turbine and the poly-reactors of nuclear.In various miniature heat-exchange systems, most studies person is engaged in micro heat pipe technique, comprises the research of the inner single-phase and phase transformation of capillary type, forced vibration (vibration) type etc. and microflute (group), and has obtained many achievements in research.In the micro heat pipe technical research, owing to be subjected to the restriction of microcapillary internal flow characteristics, capillary type micro heat pipe technology has run into the critical heat flux restriction problem; And for the self-oscillation heat pipe, because extremely insufficient to its mechanism understanding, its research also is in elementary class.
Result of calculation shows, the theoretical boundary of the inner heat of evaporation current density of microflute group has reached more than the 1000W/cm2, simultaneously by phase transformation evaporative power and capillary force, with the microflute group is that the heat-exchanger rig of core component can be realized circulation under unpowered situation, yet the inner phase transformation of microsize (such as the inner phase transformation of microflute group) is long (in experiment stabilization time, generally need several hrs stabilization time), and there is the phase transformation oscillatory occurences, therefore cause the fluctuation by a relatively large margin of heat-transfer surface temperature easily, adopt the infantile feverish perspiration of microflute faciation to send out heat exchange and be used for various extreme occasions coolings and temporarily exist the difficulty that can't overcome.During the inside microchannels single phase flow, cooling rate is fast, stable, needs on can satisfying some extreme cooling following times of occasion fully and stablizing, but in order to satisfy the needs of superelevation hot-fluid cooling, the inner single-phase heat exchange of micro-channel must be flow through the microchannel with higher flow velocity, and this needs the extra motive force that increases.The micro-channel hydraulic diameter is little, reach than high reynolds number (Re number) and need high pressure, and still can not produce at present the high pressure of long-time running continuously, the micropump of low discharge, therefore develop and a kind ofly realize that under low flow velocity superelevation hot-fluid heat exchange and fast, the stable heat dissipation technology of cooling rate seem particularly important.
Microtrabeculae group augmentation of heat transfer technology is the another kind of low-grade fever systems technology of developing and developing that is different from the inner phase transformation cooling technology of air cooling technique, micro heat pipe technique and microflute group.Also there are not university or research institution these to be carried out systematic research at present both at home and abroad.We know, the streaming characteristic and when Reynolds number (Re number) is less than 150, just can form Karman vortex street in the wake zone of single-column under the conventional yardstick, when Reynolds number (Re number) greater than 300 the time, the wake zone fully just becomes turbulent flow; And for the microtrabeculae group, after the size decreases, streaming between microvoid more is subject to post surface and the influence of bottom surface roughness, the also disturbance mutually of flowing between post and the post simultaneously, these can cause under low reynolds number (Re number) more, form Karman vortex street and turbulent flow in microtrabeculae group's wake zone, just further reduce originally between microvoid than conventional space thin that layer heat conduction liquid layer of Duoing.Therefore, the microtrabeculae group structure may improve convection transfer rate down greatly at low reynolds number (Re number).Also find by contrasting us, when the hydraulic diameter of hydraulic diameter in the microtrabeculae group (here this hydraulic diameter is the hydraulic diameter with the high passage that formed of average intercolumniation and post) and microflute is identical, microtrabeculae group inside heat transfer intensity will be higher than the interior heat transfer intensity of micro-channel far away.In the microtrabeculae group, because it has the commentaries on classics of low reynolds number when (Re number) current downflow of higher area and volume to twist, thereby under identical flow velocity, the inner heat transfer intensity of microtrabeculae group will be higher than the heat transfer intensity in the micro-channel far away.Although under low reynolds number (Re number), disturbance or turbulent flow just appear between the microtrabeculae group, can increase certain flow resistance, generation pressure falls, but twist the superpower exchange capability of heat that is caused and to make it under identical exchange capability of heat, have a lower pressure to fall owing to flow to change, that is to say when identical hydraulic diameter and flow velocity are identical, to have the lower pressure loss.As seen through the above analysis, in theory, the microtrabeculae group can effectively solve little space, the heat dissipation problem of golf calorific value components and parts.We know that again the present type of cooling all exists the drawback that can't overcome simultaneously.The widely used type of cooling has following several in thermal design at present: (1) natural cooling; (2) forced air cooling; (3) force liquid cooling; (4) liquid evaporation refrigeration.All be to adopt certain type of cooling and corresponding radiator structure and combination of materials to finish the heat radiation of heater element in heat-generating system.Below be general two kinds of radiating modes that adopt in the CPU heat radiation: 1. fin adds fan (as Fig. 1), adopts forced convertion and free convection in conjunction with heat radiation.2. the forced convertion heat radiation is adopted in liquid cooling (single-phase, as to be different from phase transformation, as Fig. 2).And the heat-sinking capability of existing CPU liquid cooling heat exchanger is limited, be to be starting point substantially when considering the passage inner structure, so its exchange capability of heat have only tens watts (generally below 50 watts) every square centimeter (area of dissipations that depend on fan power and fin) to increase heat exchange area.
Summary of the invention
The present invention is directed to deficiency of the prior art has proposed a kind ofly can satisfy the heat exchanger that carries out high efficiency and heat radiation under short space, the high hot-fluid, this heat exchanger is at first introduced the minute yardstick space with this notion of post group, compare characteristics such as having volume is little, heat transfer efficiency height with common heat exchanger, these characteristics mainly rely on the conductive coefficient of the superelevation that has in the microtrabeculae group on the inner refrigerating module of cooler and structural design thereof to realize.
This programme is realized by following technical measures: it comprises top opening and the upper cover plate that has the housing of medium altitude groove and cooperate with it, water-stop between described housing and the upper cover plate, described housing and upper cover plate are packaged together and constitute the heat exchanger that has working medium import and sender property outlet jointly, it is characterized in that the groove backplate surface in described housing is provided with the microtrabeculae group who is made up of a plurality of microtrabeculae cross arrangements.
The concrete characteristics of this programme also have, the material of described heat exchanger is red copper or aluminium alloy, what this heat exchanger was mainly considered on its material is selected is the metal of high thermal conductivity coefficient, the conductive coefficient of metal depends primarily on the kind and the temperature of material, can select different metals as required, the core of general radiating module is selected the higher red copper of conductive coefficient in the nonferrous materials, its conductive coefficient is up to 388W/K.m, and in order to reduce the own wt of micro heat exchanger, the encapsulating housing of heat exchanger also can be selected aluminium alloy for use.
Described microtrabeculae is cylinder or prism.Described prism comprises triangular prism and quadrangular.Described microtrabeculae group is the cylinder group.Described microtrabeculae group is the triangular prism group.Triangular prism cross section among the described triangular prism group can be equilateral triangle, isosceles triangle, right-angled triangle, acute triangle, obtuse triangle.Described microtrabeculae group is the quadrangular group.The cross section of the quadrangular among the described quadrangular group can be square, rectangle, rhombus or other quadrangles.The microtrabeculae group that described microtrabeculae group is made up of cylinder and triangular prism.The microtrabeculae group that described microtrabeculae group is made up of cylinder and quadrangular.The microtrabeculae group that described microtrabeculae group is made up of triangular prism and quadrangular.The microtrabeculae group that described microtrabeculae group is made up of cylinder, triangular prism and quadrangular.The scope of microtrabeculae processing dimension is among the described post group: long: 0.1～5 millimeter; Wide: 0.1～5 millimeter, height: 0.1～5 millimeter.Many micro-columns are arranged in the refrigerating module of heat exchanger of the present invention, comprise the combination of cylinder, triangular prism, quadrangular and two or more cylindricality, two kinds of cylindricality combinations comprise cylinder and triangular prism, cylinder and quadrangular, triangular prism and quadrangular; Cylinder, triangular prism and the quadrangular of three kinds of cylindricality combinations.In the upper prop group, the microtrabeculae top end face is parallel with groove base plate face, and microtrabeculae can with the angled α of base plate face, 0 °＜α＜180 °, relate generally to α=30 ° in the present invention, α=45 °, α=60 °, α=90 °, α=120 °, α=135 °, situation such as α=150 °, wherein the situation of α=90 ° is main research object.Described working medium import and sender property outlet are arranged on the upper cover plate.Described working medium import and sender property outlet are arranged on the housing.
The beneficial effect of this programme can be learnt according to the narration to such scheme, the heat exchanger that the present invention is designed, liquid working substance mobile in the microtrabeculae group is single-phase, in the process of heat radiation, do not undergo phase transition that (heater element general work temperature does not allow above 80 ℃, the temperature of the working medium of therefore dispelling the heat can not surpass this temperature, generally select for use working medium all to be in liquid state), compare with common heat exchanger that not only volume is small, and have the cooling performance of superelevation.When selecting for use 40 ℃ pure water as working medium, the inlet flow velocity of control working medium is when 1m/s, and all above various microtrabeculae group heat exchange modules all can effectively be taken away the heat of high heating module, and its heat-sinking capability scope is from 50W/cm
2To 300W/cm
2Change.Therefore the enhancing of heat exchanger heat-sinking capability is conspicuous among the present invention.In the present invention, the post group structure is used for minute yardstick conducts heat, especially in the core of micro heat exchanger, it has following advantage: (1) flows through the post group time when fluid working substance, because spatial limitation between the post group forms than laminar sublayer thinner in the conventional space, makes it have bigger heat exchange coefficient; (2) along with the reducing of post group's size, its dignity reduces than also thereupon, increases heat exchange area greatly; (3) reasonably the post group arranges and makes up effectively control flows and cross the flow field of post group's liquid, thereby strengthens its heat exchange effect greatly.Comprehensive above-mentioned 3 points, the heat exchanger of being invented can be taken away more heat in unit space.Therefore the present invention has compared with prior art realized technical purpose.
Description of drawings
The present invention is described in further detail below in conjunction with accompanying drawing.
Fig. 1 traditional C PU wind-cooling heat dissipating system schematic;
Fig. 2 traditional C PU liquid cooling heat radiation system schematic diagram;
Fig. 3 is for having the heat exchanger encapsulating structure schematic diagram of working medium gateway on the housing;
Fig. 4 has the heat exchanger assembly schematic diagram of working medium gateway for housing;
Fig. 5 is for having the heat exchanger encapsulating structure schematic diagram of working medium gateway on the upper cover plate;
Fig. 6 is for having the heat exchanger assembly schematic diagram of working medium gateway on the upper cover plate;
Fig. 7 is provided with the microtrabeculae group who is made up of cylinder in the housing;
Fig. 8 is the microtrabeculae group that the triangular prism of equilateral triangle is formed for being provided with in the housing by cross section;
Fig. 9 is the microtrabeculae group that the quadrangular of rhombus is formed for being provided with in the housing by cross section;
Figure 10 is the microtrabeculae group that rectangular quadrangular is formed for being provided with by cross section in the housing;
Figure 11 is the microtrabeculae group that rectangular quadrangular and cylinder are formed for being provided with by cross section in the housing;
Figure 12 is the triangular prism of equilateral triangle and the microtrabeculae group that cylinder is formed for being provided with by cross section in the housing;
Figure 13 is the quadrangular of rhombus and the microtrabeculae group that cylinder is formed for being provided with by cross section in the housing;
Figure 14 is that rectangular quadrangular and cross section are the microtrabeculae group that the quadrangular of rhombus is formed for being provided with in the housing by cross section;
Figure 15 is that rectangular quadrangular and cross section are the microtrabeculae group that leg-of-mutton triangular prism is formed for being provided with by cross section in the housing;
Figure 16 is that leg-of-mutton triangular prism and cross section are the microtrabeculae group that the quadrangular of rhombus is formed for being provided with in the housing by cross section;
Figure 17 is a microtrabeculae group heat exchanger circulatory system schematic diagram;
Among the figure, 1, working medium inlet, 2, sender property outlet, 3, screwed hole, 4, the microtrabeculae group, 5, the groove base plate, 6, through hole, 7, upper cover plate, 8, bolt, 9, sealing gasket, 10, shell.
Embodiment
As shown in Figure 1, this pattern is the general mode of existing general computer CPU heat radiation, its groundwork principle is exactly to install radiating fin additional at CPU heating end face, by fin the heat among the CPU is taken out of, the wind that is brought by fan is taken away the heat in the fin then, this scenario-frame is simple, realizes than being easier to.But we know, when the caloric value of heater element reaches 20W/cm
2, air-cooled with regard to difficult to solve, be the efficiently radiates heat of realizing CPU by the method (fin processing) that increases heat exchange area in Fig. 1 scheme.In the Pentium 4 processor (3.06GHz) of Intel Company, its golf calorific value is near 50W/cm
2, be exactly that radiator structure is huge and heavy by the result of above scheme.It is the certainty of development that yet the caloric value of euthermic chip improves fast, although chip manufacturer reduces the caloric value of chip itself by various technology.
As shown in Figure 2, this pattern is gone on the arena of history under the air-cooled situation that can not satisfy existing demand, this scheme is exactly effectively and timely the golf calorific value of CPU to be taken out of by a liquid cooling module, by a secondary cooling system heat is shed then.In the liquid cooling heat exchanger in Fig. 2, generally being one is material by metal, and a cavity by machine work is produced has on the portioned product internal structure simple process is arranged, but be to be starting point to increase heat exchange area substantially, cooling liquid flows in cavity heat is taken away.This simple mode must cause the low of liquid cooling radiating efficiency, and its making yardstick is generally bigger simultaneously, is difficult on some little spaces, the golf calorific value element to be applied.
By above analysis, we know that it also is feasible that the application of microtrabeculae group heat exchanger in the heat radiation of little space, high heating components and parts is inevitable.And traditional CPU liquid cooling radiating module inside is starting point to increase heat exchange area as the structure of liquid heat-exchanger among Fig. 2 substantially.
Mainly adopted two kinds of packaged types among the present invention: a kind of is shown in Fig. 3～4, and sender property outlet 1 and inlet 2 are arranged on the housing 10, and upper cover plate 7 links together by sealing gasket 9 and housing 10 usefulness bolts 8; A kind of is shown in Fig. 5～6, and sender property outlet 1 and inlet 2 are arranged on the upper cover plate 7, and upper cover plate 7 links together by sealing gasket 9 and housing 10 usefulness bolts 8.Requirement for the heat radiation of satisfying little space, high hot-fluid, the present invention selects very thin copper plate for use, adopt extraordinary machining technique on copper plate, to make the micro-column group structure, promptly on a metallic plate, make the medium altitude groove that can flow through for liquid by machine work, the microtrabeculae group who makes on the groove base plate, here microtrabeculae group 4 and groove base plate 5 are one.Shown in Fig. 7～10, be respectively the microtrabeculae group who is made up of cylinder is set in the housing; By cross section is the microtrabeculae group that the triangular prism of equilateral triangle is formed; By cross section is the microtrabeculae group that the quadrangular of rhombus is formed; By cross section is the microtrabeculae group that rectangular quadrangular is formed;
Micro-column group's arrangement can also be carried out the variation on the permutation and combination of the microtrabeculae of different arrangement modes, several shapes of position successively of size, each cylindricality according to actual needs, shown in Figure 11～16, microtrabeculae group 4 version is identical with the front, main difference be this several all be that the combination of two kinds of cylindricalitys is arranged.In addition, microtrabeculae group of the present invention also comprises by cylinder and prismatic all compound modes that can constitute; Simultaneously, can also put in order to the difference of various cylindricalitys in the microtrabeculae group, arranging density and shared row's number select and make up.
Its operation principle as shown in figure 17, circulation for the entire heat dissipation system, the loop of single-phase ultrahigh heat flow micro-column heat exchanger design is simple, be divided into twice heat exchange, a heat exchange is imported the heat in the height heating thermal source in the working medium by microtrabeculae group heat exchanger and takes out of, secondary heat exchange with the heat release in the working medium in environment.Cooling working medium flows through in the heat exchanger the microtrabeculae group, after the structure of cooling working medium through the micro heat exchanger particular design, taken away most of heat of pyrotoxin, remaining heat is distributed by the material of fin itself, at this moment the cooling working medium temperature raises, high temperature refrigerant is transported in the secondary heat abstractor through pipeline, and after the heat radiation through the secondary heat abstractor, high temperature refrigerant becomes cryogenic fluid.Here two times heat changing device can be selected different heat exchange modes and equipment as required.
Certainly; above-mentioned explanation is not to be limitation of the present invention; the present invention also is not limited in above-mentioned giving an example, and variation, remodeling, interpolation or replacement that those skilled in the art are made in essential scope of the present invention also should belong to protection scope of the present invention.
Claims (10)
1, a kind of single-phase ultrahigh heat flow micro-column heat exchanger, it comprises top opening and the upper cover plate that has the housing of medium altitude groove and cooperate with it, water-stop between described housing and the upper cover plate, described housing and upper cover plate are packaged together and constitute the heat exchanger that has working medium import and sender property outlet jointly, it is characterized in that the groove backplate surface in described housing is provided with the microtrabeculae group who is made up of a plurality of microtrabeculae cross arrangements.
2, single-phase ultrahigh heat flow micro-column heat exchanger according to claim 1, the material that it is characterized in that described heat exchanger is red copper or aluminium alloy.
3, single-phase ultrahigh heat flow micro-column heat exchanger according to claim 1 is characterized in that described microtrabeculae is cylinder or prism.
4, single-phase ultrahigh heat flow micro-column heat exchanger according to claim 3 is characterized in that described prism comprises triangular prism and/or quadrangular.
5, single-phase ultrahigh heat flow micro-column heat exchanger according to claim 1 is characterized in that the microtrabeculae group that described microtrabeculae group is made up of cylinder and triangular prism.
6, single-phase ultrahigh heat flow micro-column heat exchanger according to claim 1 is characterized in that the microtrabeculae group that described microtrabeculae group is made up of cylinder and quadrangular.
7, single-phase ultrahigh heat flow micro-column heat exchanger according to claim 1 is characterized in that the microtrabeculae group that described microtrabeculae group is made up of cylinder, triangular prism and quadrangular.
8, single-phase ultrahigh heat flow micro-column heat exchanger according to claim 1 is characterized in that the scope of microtrabeculae processing dimension among the described post group is: long: 0.1～5 millimeter; Wide: 0.1～5 millimeter, height: 0.1～5 millimeter.
9, single-phase ultrahigh heat flow micro-column heat exchanger according to claim 1 it is characterized in that the microtrabeculae top end face is parallel with groove base plate face, and microtrabeculae can be angled with the base plate face, and promptly the angle of microtrabeculae incline and base plate face is 0 °＜α＜180 °.
10, single-phase ultrahigh heat flow micro-column heat exchanger according to claim 9 is characterized in that α is 30 ° or 45 ° or 60 ° or 90 ° or 120 ° or 135 ° or 150 °.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB200710013844XA CN100450336C (en) | 2007-03-26 | 2007-03-26 | Single-phase ultrahigh heat flow micro-column heat exchanger |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB200710013844XA CN100450336C (en) | 2007-03-26 | 2007-03-26 | Single-phase ultrahigh heat flow micro-column heat exchanger |
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| CN101026948A true CN101026948A (en) | 2007-08-29 |
| CN100450336C CN100450336C (en) | 2009-01-07 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102790027A (en) * | 2012-08-27 | 2012-11-21 | 无锡市福曼科技有限公司 | Multi-runner water-cooling device for computer CPU (central processing unit) |
| CN103580545A (en) * | 2013-10-29 | 2014-02-12 | 浙江大学 | Micro convex array type thermoelectric generator heat exchange module |
| CN103594430A (en) * | 2013-10-25 | 2014-02-19 | 上海交通大学 | Micro-channel radiator for dissipating heat of power electronic device |
| CN103715148A (en) * | 2012-09-29 | 2014-04-09 | 北京新创椿树整流器件有限公司 | Copper-free base plate DCB ceramic welding module |
| CN105338796A (en) * | 2015-12-08 | 2016-02-17 | 山东超越数控电子有限公司 | Method and device for enhancing convective heat transfer intensity of fluid in liquid cooling plate |
| CN105609475A (en) * | 2016-03-21 | 2016-05-25 | 南京师范大学 | Ultrasonic reinforced micro-channel heat exchanger |
| CN105865089A (en) * | 2016-04-19 | 2016-08-17 | 华北电力大学 | Pin-fin wall surface micro-channel heat exchanger |
| CN106601703A (en) * | 2016-10-27 | 2017-04-26 | 湖北工程学院 | Microchannel heat sink adopting secondary backflow cooling mode |
| CN106767042A (en) * | 2016-12-30 | 2017-05-31 | 南京师范大学 | Intensified by ultrasonic wave spirality micro-channel descaling heat exchanger |
| CN107403775A (en) * | 2017-07-24 | 2017-11-28 | 北京无线电测量研究所 | A kind of microchannel heat sink and electronic equipment |
| CN108024486A (en) * | 2018-01-04 | 2018-05-11 | 钦州学院 | Minitype radiator and its manufacture method based on dragonfly wing microcosmic surface |
| CN109103156A (en) * | 2018-08-10 | 2018-12-28 | 桂林电子科技大学 | A kind of fractals microchannel heat sink |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US5940270A (en) * | 1998-07-08 | 1999-08-17 | Puckett; John Christopher | Two-phase constant-pressure closed-loop water cooling system for a heat producing device |
| AU2003230243A1 (en) * | 2002-05-15 | 2003-12-02 | Matsushita Electric Industrial Co., Ltd. | A liquid cooling device for a notebook computer |
| CN1278414C (en) * | 2002-12-11 | 2006-10-04 | 中国科学院广州能源研究所 | Thermally driven heat exchanger |
| CN1302544C (en) * | 2003-06-18 | 2007-02-28 | 中国科学院理化技术研究所 | Mini refrigeration system for computer chip heat radiating |
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- 2007-03-26 CN CNB200710013844XA patent/CN100450336C/en not_active Expired - Fee Related
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| CN102790027A (en) * | 2012-08-27 | 2012-11-21 | 无锡市福曼科技有限公司 | Multi-runner water-cooling device for computer CPU (central processing unit) |
| CN103715148A (en) * | 2012-09-29 | 2014-04-09 | 北京新创椿树整流器件有限公司 | Copper-free base plate DCB ceramic welding module |
| CN103594430B (en) * | 2013-10-25 | 2017-01-18 | 上海交通大学 | Micro-channel radiator for dissipating heat of power electronic device |
| CN103594430A (en) * | 2013-10-25 | 2014-02-19 | 上海交通大学 | Micro-channel radiator for dissipating heat of power electronic device |
| CN103580545A (en) * | 2013-10-29 | 2014-02-12 | 浙江大学 | Micro convex array type thermoelectric generator heat exchange module |
| CN105338796A (en) * | 2015-12-08 | 2016-02-17 | 山东超越数控电子有限公司 | Method and device for enhancing convective heat transfer intensity of fluid in liquid cooling plate |
| CN105609475A (en) * | 2016-03-21 | 2016-05-25 | 南京师范大学 | Ultrasonic reinforced micro-channel heat exchanger |
| CN105865089B (en) * | 2016-04-19 | 2018-05-25 | 华北电力大学 | A kind of pin rib wall surface micro-channel heat exchanger |
| CN105865089A (en) * | 2016-04-19 | 2016-08-17 | 华北电力大学 | Pin-fin wall surface micro-channel heat exchanger |
| CN106601703A (en) * | 2016-10-27 | 2017-04-26 | 湖北工程学院 | Microchannel heat sink adopting secondary backflow cooling mode |
| CN106601703B (en) * | 2016-10-27 | 2019-08-02 | 湖北工程学院 | Using the micro-channel heat sink of secondary back refrigerating mode |
| CN106767042A (en) * | 2016-12-30 | 2017-05-31 | 南京师范大学 | Intensified by ultrasonic wave spirality micro-channel descaling heat exchanger |
| CN107403775A (en) * | 2017-07-24 | 2017-11-28 | 北京无线电测量研究所 | A kind of microchannel heat sink and electronic equipment |
| CN107403775B (en) * | 2017-07-24 | 2020-01-14 | 北京无线电测量研究所 | Micro-channel heat dissipation device and electronic equipment |
| CN108024486A (en) * | 2018-01-04 | 2018-05-11 | 钦州学院 | Minitype radiator and its manufacture method based on dragonfly wing microcosmic surface |
| CN109103156A (en) * | 2018-08-10 | 2018-12-28 | 桂林电子科技大学 | A kind of fractals microchannel heat sink |
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| CN100450336C (en) | 2009-01-07 |
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