CN111664733A - Heat radiator combining micro-channel heat exchanger with heat pipe - Google Patents
Heat radiator combining micro-channel heat exchanger with heat pipe Download PDFInfo
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- CN111664733A CN111664733A CN202010420564.6A CN202010420564A CN111664733A CN 111664733 A CN111664733 A CN 111664733A CN 202010420564 A CN202010420564 A CN 202010420564A CN 111664733 A CN111664733 A CN 111664733A
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- heat
- heat exchanger
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/025—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes having non-capillary condensate return means
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D2015/0225—Microheat pipes
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- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a heat dissipation device combining a micro-channel heat exchanger with a heat pipe, which mainly comprises the micro-channel heat exchanger, the heat pipe and a substrate. The substrate is provided with an evaporation section provided with a heat pipe, and the surface of the heat pipe and the surface of the substrate are in the same horizontal plane, namely the heat source is directly contacted with the evaporation section of the heat pipe when working; the micro-channel heat exchanger consists of an upper part, a middle part and a lower part, wherein the upper part and the lower part are heat pipe condensation section parts, the middle part is a micro-channel, and an inlet and an outlet of a coolant are respectively arranged at two ends of the heat exchanger. The device is using gravity and heat pipe theory of operation and the excellent radiating effect of microchannel, and the heat source passes through the heat pipe and transmits heat to the microchannel heat exchanger and cools down. The invention combines the outstanding heat exchange performance of the heat pipe and the effective cooling effect of the micro-channel to form a heat dissipation device, fully absorbs heat of a heat source and obviously contributes to the heat management technology, thereby improving the comprehensive application of a cooled object.
Description
Technical Field
The invention relates to the field of heat dissipation devices, in particular to a heat dissipation device combining a micro-channel heat exchanger with a heat pipe.
Background
With the rapid development of modern scientific technology, many modern electronic devices generate a large amount of heat during operation, resulting in device damage, reduced reliability, and shortened life. For many electronic devices, thermal management is critical, and for example, LED lamps generally have a light-emitting efficiency of less than 35%, so that the remaining part of the LED lamps is dissipated as heat, which greatly reduces the sustainability and reliability if not treated for reasonable heat dissipation.
Due to the limitation of the traditional cooling method, the electronic equipment in practical application cannot be well thermally managed in both air cooling and liquid cooling modes. With the large number of microchannels, there have been studies showing that a cooling system using a microchannel heat sink (MEMS) in combination with a coolant is the most effective way to cool modern electronic devices. In recent years, MEMS technology has been developed and matured, and as it can make up for some of the defects of the conventional heat sink, more attention is paid to the use of micro channels.
The heat pipe is a heat transfer element with high heat conductivity, and transfers heat through evaporation and condensation of working medium in the totally-enclosed vacuum pipe shell. The heat pipe technology is a novel heat dissipation technology, fully utilizes the heat conduction principle and the rapid heat transfer property of a phase change medium, and has strong heat conduction capability exceeding that of any known metal. In addition, the heat pipe is designed and installed flexibly, can be put into use in different occasions, and is a high-efficiency and environment-friendly heat conducting element.
Heat dissipation devices have been developed and different devices have been used in many areas, but have not been perfected to date with respect to the thermal management of high power electronic devices. Accordingly, further improvements and improvements are needed in the art.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a heat dissipation device combining a micro-channel heat exchanger and a heat pipe.
The purpose of the invention is realized by the following technical scheme:
a heat dissipation device of a micro-channel heat exchanger combined with a heat pipe mainly comprises a substrate, a heat pipe set and a heat exchanger. The substrate is arranged on the heat source and is in contact with the heat source to absorb heat. The heat exchanger is arranged above the substrate and is arranged in parallel with the substrate. The heat pipe set is arranged on the substrate, one end of the heat pipe set is in contact with one side of the heat exchanger, and the other end of the heat pipe set is in contact with the other side of the heat exchanger.
Specifically, the heat pipe set is formed by arranging a plurality of connecting substrates and heat pipes of the heat exchanger side by side, and each heat pipe comprises an evaporation section, a first transition section, a second transition section, a first condensation section and a second condensation section. The evaporation section is arranged on the substrate and fixedly connected with the substrate. The first condensation section is arranged on the side face, close to the base plate, of the heat exchanger and is fixedly connected with the heat exchanger. The second condensation section is arranged on the other side face, far away from the base plate, of the heat exchanger and is fixedly connected with the heat exchanger. One end of the first transition section is connected with one end of the evaporation section, the other end of the first transition section is connected with one end of the first condensation section, and the other end of the first condensation section is closed. One end of the second transition section is connected with the other end of the evaporator, the other end of the second transition section is connected with one end of the second condensation section, and the other end of the second condensation section is closed.
Specifically, the heat exchanger adopts a micro-channel heat exchanger, and comprises a heat exchanger body, a cooling liquid inlet, a cooling liquid outlet and a micro-channel. The cooling liquid inlet is formed in one end of the heat exchanger body and fixedly connected with the heat exchanger body, one end of the cooling liquid inlet is communicated with the outside, and the other end of the cooling liquid inlet is communicated with the inside of the heat exchanger body. The cooling liquid outlet is arranged at the other end of the heat exchanger body and fixedly connected with the heat exchanger body, one end of the cooling liquid outlet is communicated with the outside, and the other end of the cooling liquid outlet is communicated with the inside of the heat exchanger body. The micro-channel is arranged in the heat exchanger body in a curling mode, one end of the micro-channel is connected with the cooling liquid inlet, and the other end of the micro-channel is connected with the cooling liquid outlet.
As a preferable scheme of the present invention, the first transition section and the second transition section on one side of the adjacent heat pipe in the heat pipe set are arranged at intervals.
As a preferable scheme of the invention, the first transition section and the second transition section are designed in an arc or semicircular structure.
As a preferable scheme of the invention, the coiled shape of the microchannel adopts a structural design of a snake shape, a zigzag shape, a spiral shape and a zigzag shape.
As a preferable scheme of the invention, the micro-channel is filled with water or nano fluid as a cooling liquid.
As a preferred scheme of the invention, the heat pipe is filled with a phase-change material as a cooling working medium, and the phase-change material is a mixture of water, paraffin, graphite powder and metal powder.
As the preferred scheme of the invention, the heat pipe is designed by adopting a square pipe or circular pipe structure.
As a preferable scheme of the invention, the evaporation section is partially embedded or completely embedded in the substrate, so that the contact area with the substrate is increased.
As a preferable scheme of the invention, the condensation section is partially embedded or completely embedded in the heat exchanger, so that the contact area with the heat exchanger is increased.
The working process and principle of the invention are as follows: when in use, the invention is arranged in a small heat exchange occasion, and the heat source radiates heat under the device. The heat source and the heat conduction layer thereof can be bonded with the substrate through the heat conduction silicone grease, when the heat source starts to work, the heat dissipation capacity is increased, so that the temperature rises, the heat pipe which is in contact with the heat source absorbs heat, the phase change working medium in the evaporation section of the heat pipe is evaporated into gas from liquid and is transmitted to the condensation section of the heat pipe, the condensation section of the heat pipe is in close contact with the micro-channel heat exchanger, the micro-channel heat exchanger takes away the heat of the condensation section of the heat pipe through the inflow and outflow of a coolant, so that the gas in the condensation section of the heat pipe is condensed into liquid, and the liquid flows back to the evaporation section of the heat pipe under the action of gravity. The device has two using conditions, when the heat of a heat source is less, the gas at the evaporation section of the heat pipe can only be transferred to the condensation section of the heat pipe close to the substrate; when the heat of the heat source is larger, enough gas is generated, so that the gas at the evaporation section of the heat pipe can be transferred to the condensation sections of the heat pipe at the two sides of the micro-channel heat exchanger for heat dissipation, the effect of double condensation sections is achieved, and more heat is effectively absorbed. The invention skillfully combines the micro-channel heat exchanger and the heat pipe together, has the characteristics of compact structure, outstanding performance, high efficiency, environmental protection and the like, and can be used in occasions with small space and high power.
Compared with the prior art, the invention also has the following advantages:
(1) the heat dissipation device of the micro-channel heat exchanger combined with the heat pipe provided by the invention adopts the direct contact of the heat source and the evaporation section of the heat pipe, thereby greatly improving the heat transfer effect and fully absorbing the heat of the heat source.
(2) The heat pipe and the micro-channel heat exchanger realize the effect of double condensing sections when the heat quantity is larger, and the heat pipe and the micro-channel heat exchanger are also the effect obtained by the heat pipe with the combination of the long pipe and the short pipe, so that the cooling liquid of the micro-channel heat exchanger does not influence the heat exchange effect and is uniformly heated.
(3) The microchannel heat exchanger of the heat dissipation device combining the microchannel heat exchanger with the heat pipe has a very outstanding cooling effect on electronic equipment, has extremely low thermal resistance, and remarkably promotes the solution of a heat management problem; the micro-channel heat exchanger and the heat pipe are combined for use, and the device is not only simple and practical, but also efficient and environment-friendly.
Drawings
Fig. 1 is a schematic structural diagram of a heat dissipation device of a microchannel heat exchanger combined with a heat pipe according to the present invention.
Fig. 2 is a perspective view of a heat dissipation device of a microchannel heat exchanger combined with a heat pipe according to the present invention.
FIG. 3 is a schematic structural diagram of a substrate and an evaporation section of a heat pipe according to the present invention.
FIG. 4 is a side view of a heat sink incorporating a heat pipe for a microchannel heat exchanger as provided by the present invention.
Fig. 5 is a schematic view of the overall structure of the heat pipe provided by the present invention.
Fig. 6 is a schematic view of the internal structure of the heat exchanger provided by the present invention.
The reference numerals in the above figures illustrate:
1-heat exchanger, 2-cooling liquid inlet, 3-cooling liquid outlet, 4-base plate, 5/A-evaporation section, 6/(B)1And B2) Transition section, 7/(C)1And C2) -a condensing section.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer and clearer, the present invention is further described below with reference to the accompanying drawings and examples.
Example 1:
as shown in fig. 1 to fig. 6, the present embodiment discloses a heat dissipation device combining a micro-channel heat exchanger and a heat pipe, which has a simple and compact structure, low power consumption, and excellent heat exchange and heat dissipation effects, and provides an effective way for heat dissipation of high-power electronic devices.
In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a heat abstractor that microchannel heat exchanger combines heat pipe, includes base plate 4, and the evaporation zone 5 of heat pipe is installed at the top of base plate 4, and the heat source is settled in base plate 4 top, and the condensation segment 7 of the upper and lower part surface mounting heat pipe of microchannel heat exchanger 1, 6 crooked connection evaporation zone 5 and the condensation segment 7 of changeover portion of heat pipe, the heat pipe is at base plate 4 and 1 surface evenly distributed of microchannel heat exchanger, and 1 middle part of microchannel heat exchanger then designs the snakelike pipeline and has coolant import and export the pipeline.
The bottom surface of the heat source is provided with a heat conduction layer, and the bottom surface of the heat conduction layer is attached to the top of the substrate 4 through heat conduction glue, so that the effect of direct contact between the evaporation section 5 of the heat pipe and the evaporation section is realized;
the substrate 4 and the micro-channel heat exchanger 1 are balanced and have symmetrical center points, the micro-channel heat exchanger 1 is provided with a coolant inlet and a coolant outlet (a coolant inlet 2 and a coolant outlet 3), and the length of the micro-channel heat exchanger 1 is slightly longer than that of the substrate 4;
the phase-change working medium is arranged in the heat pipe, so that the effects of heating evaporation, cooling and condensation are achieved, the top of the substrate 4 can face downwards when the heat pipe is used, and the working medium forms backflow after condensation under the action of gravity, so that circulation is achieved;
the transition section 6 of the heat pipe is bent to be 180 degrees, and is fixedly connected with the heat pipe evaporation section 5 and the condensation section 7 on the substrate 4 through heat conducting glue after forming a U-shaped structure;
optionally, the phase-change material in the heat pipe is a mixture of water, paraffin, graphite powder and metal powder;
optionally, the specification and size of the substrate 4 and the microchannel heat exchanger 1 are selected, and reasonable design and processing can be performed according to the requirement of a heat source;
optionally, the size and the number of the heat pipes are set according to actual requirements, and design and processing are performed on the basis of keeping uniform distribution and compact structure;
optionally, the heat pipe may be made of different materials, such as copper, aluminum, stainless steel, and the like, and the substrate 4 and the microchannel heat exchanger 1 may be made of materials with good heat conductivity, such as copper or aluminum;
alternatively, the liquid flowing into the microchannel heat exchanger 1 may use other coolants such as water or nanofluid;
optionally, the microchannel heat exchanger 1 has an internal microchannel structure in a serpentine shape.
Fig. 1 is a schematic structural diagram of an integral heat dissipation device provided by the present invention; the heat pipe heat exchanger mainly comprises three major parts, namely a substrate 4, a heat pipe and a micro-channel heat exchanger 1, wherein the substrate 4 is connected with the micro-channel heat exchanger 1 through the heat pipe. As shown in FIG. 2, the upper and lower surfaces of the microchannel heat exchanger 1 are provided with the condensation sections 7 of the heat pipes and are regularly and uniformly distributed; as shown in fig. 3, the top of the base plate 4 is provided with an evaporation section 5 of the heat pipe, and when in use, a heat source is arranged on the top of the base plate 4; fig. 4 is a side view of the heat sink, which shows the compactness of the structure and the uniform distribution of the heat pipes; FIG. 5 shows a transition section (B) of the heat pipe1And B2) The evaporation section A and the condensation section (C) are connected in a bending way1And C2) The heat pipes are uniformly distributed on the surfaces of the substrate 4 and the micro-channel heat exchanger 1; referring to fig. 6, the center of the microchannel heat exchanger 1 is shown, and the microchannel heat exchanger 1 is designed with a serpentine pipe and a liquid inlet and outlet pipe.
The specification and size of the micro-channel heat exchanger 1, the substrate 4, the heat pipe and the like can be determined by performing corresponding calculation according to the actually required heat source.
When in use, the invention is arranged in a small heat exchange occasion, and the heat source radiates heat under the device. The heat source and the heat conduction layer thereof can be bonded with the substrate 4 through the heat conduction silicone grease, when the heat source starts to work, the heat dissipation capacity is increased, so that the temperature rises, the heat pipe contacted with the heat source absorbs heat, the phase change working medium in the heat pipe evaporation section 5 is evaporated from liquid into gas and transferred to the heat pipe condensation section 7, the heat pipe condensation section 7 is closely contacted with the micro-channel heat exchanger 1, the micro-channel heat exchanger 1 takes away the heat of the heat pipe condensation section 7 through the inflow and outflow of a coolant, so that the gas in the heat pipe condensation section 7 is condensed into liquid, and the liquid flows back to the heat pipe evaporation section 5 under the action of gravity, thereby forming a closed circulation loop and continuous circulation. The device has two using conditions, when the heat of a heat source is less, the gas of the evaporation section 5 of the heat pipe can only be transferred to the condensation section 7 of the heat pipe which is close to the substrate 4; when the heat of the heat source is large, enough gas is generated, so that the gas at the evaporation section 5 of the heat pipe can be transferred to the condensation sections 7 of the heat pipe at the two sides of the micro-channel heat exchanger 1 for heat dissipation, the effect of double condensation sections is achieved, and more heat is effectively absorbed. The invention skillfully combines the micro-channel heat exchanger 1 and the heat pipe together, has the characteristics of compact structure, outstanding performance, high efficiency, environmental protection and the like, and can be used in small space and high power occasions.
The above embodiments are preferred embodiments of the present invention, but the present invention is not limited to the above embodiments, and any other changes, modifications, substitutions, combinations, and simplifications which do not depart from the spirit and principle of the present invention should be construed as equivalents thereof, and all such changes, modifications, substitutions, combinations, and simplifications are intended to be included in the scope of the present invention.
Claims (10)
1. A heat dissipation device combining a micro-channel heat exchanger and a heat pipe is characterized by comprising a substrate, a heat pipe set and a heat exchanger; the substrate is arranged on the heat source and is in contact with the heat source to absorb heat; the heat exchanger is arranged above the substrate and is arranged in parallel with the substrate; the heat pipe set is arranged on the substrate, one end of the heat pipe set is connected and contacted with one side of the heat exchanger, and the other end of the heat pipe set is connected and contacted with the other side of the heat exchanger;
the heat pipe group is formed by arranging a plurality of connecting substrates and heat pipes of the heat exchanger side by side, and each heat pipe comprises an evaporation section, a first transition section, a second transition section, a first condensation section and a second condensation section; the evaporation section is arranged on the substrate and fixedly connected with the substrate; the first condensation section is arranged on the side surface of the heat exchanger close to the substrate and is fixedly connected with the heat exchanger; the second condensation section is arranged on the other side face, far away from the base plate, of the heat exchanger and is fixedly connected with the heat exchanger; one end of the first transition section is connected with one end of the evaporation section, the other end of the first transition section is connected with one end of the first condensation section, and the other end of the first condensation section is closed; one end of the second transition section is connected with the other end of the evaporator, the other end of the second transition section is connected with one end of the second condensation section, and the other end of the second condensation section is closed.
2. The heat sink combining a microchannel heat exchanger and a heat pipe according to claim 1, wherein the heat exchanger is a microchannel heat exchanger, and comprises a heat exchanger body, a coolant inlet, a coolant outlet, and microchannels; the cooling liquid inlet is arranged at one end of the heat exchanger body and is fixedly connected with the heat exchanger body, one end of the cooling liquid inlet is communicated with the outside, and the other end of the cooling liquid inlet is communicated with the inside of the heat exchanger body; the cooling liquid outlet is arranged at the other end of the heat exchanger body and is fixedly connected with the heat exchanger body, one end of the cooling liquid outlet is communicated with the outside, and the other end of the cooling liquid outlet is communicated with the inside of the heat exchanger body; the micro-channel is arranged in the heat exchanger body in a curling mode, one end of the micro-channel is connected with the cooling liquid inlet, and the other end of the micro-channel is connected with the cooling liquid outlet.
3. The microchannel heat exchanger in combination with a heat pipe heat sink of claim 1, wherein the first and second transition sections on one side of adjacent heat pipes in the heat pipe set are spaced apart.
4. The heat dissipating device of a microchannel heat exchanger in combination with a heat pipe as claimed in claim 1, wherein the first transition section and the second transition section are designed to have an arc or semicircular structure.
5. The heat sink combined with a heat pipe of a microchannel heat exchanger as recited in claim 2, wherein the coiled shape of the microchannel is designed to have a serpentine, zigzag, spiral or zigzag structure.
6. The heat sink combined with a heat pipe of a microchannel heat exchanger as recited in claim 2, wherein the microchannel is filled with water or nano-fluid as a cooling liquid.
7. The heat dissipating device of a micro-channel heat exchanger combined with a heat pipe as claimed in claim 1, wherein the heat pipe is filled with a phase change material as a cooling working medium, and the phase change material is a mixture of water, paraffin, graphite powder and metal powder.
8. The heat dissipating device of a microchannel heat exchanger in combination with a heat pipe as set forth in claim 1, wherein the heat pipe is designed in a square tube or round tube structure.
9. A heat sink incorporating a heat pipe for a microchannel heat exchanger as recited in claim 1, wherein the evaporator end is partially or completely embedded in the substrate to increase a contact area with the substrate.
10. The heat sink in combination with a heat pipe for a microchannel heat exchanger as recited in claim 1, wherein the condenser section is partially or completely embedded in the heat exchanger to increase a contact area with the heat exchanger.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010420564.6A CN111664733A (en) | 2020-05-18 | 2020-05-18 | Heat radiator combining micro-channel heat exchanger with heat pipe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010420564.6A CN111664733A (en) | 2020-05-18 | 2020-05-18 | Heat radiator combining micro-channel heat exchanger with heat pipe |
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| Publication Number | Publication Date |
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| CN111664733A true CN111664733A (en) | 2020-09-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010420564.6A Pending CN111664733A (en) | 2020-05-18 | 2020-05-18 | Heat radiator combining micro-channel heat exchanger with heat pipe |
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| CN (1) | CN111664733A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112762744A (en) * | 2021-01-29 | 2021-05-07 | 西南交通大学 | Electronic component pulsation and integral heat pipe coupling type air cooling radiator and method |
| CN114302608A (en) * | 2021-03-31 | 2022-04-08 | 华为数字能源技术有限公司 | Heat exchanger, cabinet and communication base station |
-
2020
- 2020-05-18 CN CN202010420564.6A patent/CN111664733A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112762744A (en) * | 2021-01-29 | 2021-05-07 | 西南交通大学 | Electronic component pulsation and integral heat pipe coupling type air cooling radiator and method |
| CN114302608A (en) * | 2021-03-31 | 2022-04-08 | 华为数字能源技术有限公司 | Heat exchanger, cabinet and communication base station |
| US11859917B2 (en) | 2021-03-31 | 2024-01-02 | Huawei Digital Power Technologies Co., Ltd. | Heat exchanger, cabinet, and communications base station |
| CN114302608B (en) * | 2021-03-31 | 2024-01-30 | 华为数字能源技术有限公司 | Heat exchanger, cabinet and communication base station |
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