CN104850197A - Gravity heat pipe chip heat sink with composite bottom plate - Google Patents
Gravity heat pipe chip heat sink with composite bottom plate Download PDFInfo
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- CN104850197A CN104850197A CN201510211721.1A CN201510211721A CN104850197A CN 104850197 A CN104850197 A CN 104850197A CN 201510211721 A CN201510211721 A CN 201510211721A CN 104850197 A CN104850197 A CN 104850197A
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Abstract
The present invention discloses a gravity heat pipe chip heat sink with a composite bottom plate. The gravity heat pipe chip heat sink adopts the structure that a CPU heat-dissipating plate is arranged in a central region of the heat sink bottom plate and the heat-dissipating plate and the heat sink bottom plate are welded into one whole body. Laminated fins are arranged at the upper part of the heat sink bottom plate; a plurality of vertical U-shaped heat pipes pass through the cascaded fins; the bottom ends of the heat pipes are embedded and dip-welded in the CPU heat-dissipating plate; and the top ends of the heat pipes protrude out of the laminated fins. The bottom ends of the U-shaped heat pipes are used as evaporating sections. Because the heat pipes are vertically placed, a working substance flows back to the evaporating sections under the action of gravity of the working substance after being condensed at condensation sections, so that the circulation is formed. The bottom ends of the plurality of U-shaped heat pipes and the CPU heat-dissipating plate are dip-welded and welded into one whole body, and thus, the areas of the evaporating sections are enlarged relatively, so that the gravity heat pipe chip heat sink has very high thermal conductivity efficiency. Compared with other heat sinks, the heat sink has the advantages that not only can the temperature of the heat sink be reduced, but also a temperature equalization effect of the heat sink bottom plate is better, so that the working temperature of a chip in a mainframe computer server can be reduced more efficiently.
Description
Technical field
The invention belongs to Thermal Power Engineering Field, be specifically related to a kind of heat-pipe type radiator device with efficient heat transfer effect.
Background technology
The cpu chip of high-performance computer can as the Typical Representative of high heat flux heater members, and a large server has tens pieces of even hundreds of pieces of multinuclear formula cpu chips, usually in the behind of powerful performance, along with higher thermal value and heat flow density.Increase the effect that the area of dissipation of chip can not reach to equal proportion enhanced heat exchange, but utilize heat pipe there is extremely strong heat conduction feature, effectively can improve the radiating effect of chip when area of dissipation is constant.The radiating mode that current heat pipe is used for high-power CPU cooling is: be embedded with the heat pipe of different arrangement mode at base plate of radiator in the mode of inlaying, the upper surface of base plate of radiator studs with fin (as Fig. 1).The Main Function of heat pipe is not direct heat radiation, but utilizes the part heat pipe (evaporator section) that contacts with CPU, by cpu chip produce heat and extend to whole base plate in the mode of heat conduction, heat is finally taken away with air-cooled form by fin.But the defect existing for this kind of heating radiator is: heat pipe lies against in base plate, the ultimate principle according to adopting heat pipes for heat transfer: the heated portion of heat pipe is evaporator section; End is condensation segment; Part between evaporator section and condensation segment belongs to adiabatic section.Because whole heat pipe is all embedded in the base plate of heating radiator, namely evaporator section and condensation segment are all arranged in hotter base plate (evaporator section is only limitted to the part contacted with CPU).Because the temperature difference between evaporator section and condensation segment is less, so the usefulness of heat pipe is subject to very large restriction or impact.Again because the space in huge computer servers is very narrow, even if the heat interchanging area increasing heat pipe can not significantly improve its radiating efficiency.How to improve the performance of heat-pipe type radiator in the case, just become the focus of the problem of research high heat flux device cooling both at home and abroad.
Summary of the invention
In order to solve the technological deficiency of above-mentioned heat-pipe type radiator, the object of the invention is to propose a kind of can the gravity heat-pipe type chip radiator with composite bottom board of enhance heat.
The technical pattern proposed for realizing object of the present invention is: the central area of base plate of radiator is provided with CPU heat sink, and CPU heat sink and base plate of radiator are welded as a whole.The top of base plate of radiator is provided with stacked fin, and several upright U-shaped heat pipe is through stacked fin, and immersed solder is inlayed in CPU heat sink in the bottom of U-shaped heat pipe, and the top of heat pipe passes stacked fin.
The bottom surface of heating radiator is made up of the CPU heat sink of fine copper material and base plate of radiator two parts of aluminium material, and its reason is, the coefficient of heat conductivity of fine copper is approximately high than cast aluminium 1.5 times, but the quality of cast aluminium is more light than fine copper.In huge computer servers, the weight of part of appliance to be alleviated as far as possible, but consider the capacity of heat transmission that must improve CPU heat sink simultaneously.So this heating radiator is except U-shaped heat pipe and CPU heat sink adopt fine copper, all the other are all aluminiums.
Principle of work of the present invention is: the bottom of U-shaped heat pipe is as evaporator section, the working medium of inside heat pipe absorbs the heat of CPU and produces phase transformation, because this heat pipe is upright placement, working medium utilizes the gravity reflux of self to evaporator section after condensation segment condensation, is formed circulation with this.Here heat pipe is as the medium of CPU heat loss, and its effect utilizes (in heat pipe) Working fluid phase changing to be spread out of by heat, and final heat is dissipated by (being integrated with heat pipe is mutually embedding) stacked fin and cold wind heat exchange.Because the heat transfer efficiency of gravity type heat pipe is far above flatwise heat pipe, so this structure has higher radiating efficiency.
The beneficial effect of feature of the present invention and generation is, due to by the bottom of multiple U-shaped heat pipe and the immersed solder of CPU heat sink in one, so relatively expand the area of heat pipe evaporator section, " can shift " with the working medium in this heat pipe and go out more heat, thus there is very high heat transfer efficiency.U-shaped heat pipe and stacked fin are assembled together, and not only increase the heat diffusion capabilities of base plate of radiator, the more important thing is the radiating efficiency that improve heat pipe and fin, and heat exchange is obviously strengthened.This kind of heating radiator is compared with other (heat pipe lies against base plate of radiator) heating radiators, heating radiator own temperature not only can be made to reduce, and the even temperature effect of radiating bottom plate is better, the working temperature of the inner high heat flux device of huge computer servers more effectively can be reduced.
Accompanying drawing explanation
Fig. 1 is Principles and methods diagrammatic perspective view of the present invention.
Fig. 2 is the heat pipe arrangement diagrammatic perspective view being positioned at CPU heat sink top in the present invention.
Fig. 3 is the structure principle chart that in the present invention, base plate of radiator and CPU heat sink are welded as a whole.
Embodiment
Principles and methods of the present invention to be further described by specific embodiment below in conjunction with accompanying drawing.It should be noted that the present embodiment is narrative, instead of determinate, do not limit protection scope of the present invention with this embodiment.
Gravity heat-pipe type chip radiator with composite bottom board has base plate of radiator, U-shaped heat pipe and stacked fin, its concrete structure is: the central area of base plate of radiator 1 is provided with CPU heat sink 2, CPU heat sink and base plate of radiator is welded as a whole (as Fig. 2).The top of base plate of radiator is provided with stacked fin 3, and several upright U-shaped heat pipe 4 is through stacked fin (as Fig. 1 Fig. 3).Immersed solder is inlayed in CPU heat sink in the bottom of U-shaped heat pipe, and the top of heat pipe passes stacked fin.The stacked fin on base plate of radiator top is as a whole, and stacked fin and base plate of radiator are fixed as one, and semicircle assembly space 3-1 is left on four limits of stacked fin.Base plate of radiator is provided with 4 bolt hole 1-1.
The root of each U-shaped heat pipe in CPU heat sink top is equipped with reinforcement fin 4-1 (Fig. 3); The diameter of U-shaped heat pipe is 6-8mm.In order to reduce heat insulation thermal resistance, the gap between U-shaped heat pipe and reinforcement fin and the gap wicking shutoff between U-shaped heat pipe and stacked fin.The material of base plate of radiator is aluminium; The material of CPU heat sink is fine copper material.
The bottom of this U-shaped heat pipe is the straight tube of one section of relative level, and it is relatively longer to be positioned at that horizontal segment middle in three heat pipes.Therefore this heat pipe can be inlayed in CPU heat sink very well, in order to reduce thermal contact resistance, adopting the method for roll forming and wicking, heat pipe and CPU heat sink are fixed as one.
The structure of U-shaped heat pipe is the cavity right cylinder of a sealing, and the inwall of cavity is processed as porous surface, makes cycle fluid produce capillary force.U-shaped heat pipe is divided into evaporation, adiabatic and condensation three active sections.For this device, using the bottom (straight tube of one section of relative level) of three heat pipes as evaporator section.Because the evaporator section of these three heat pipes combination welding is integrated by CPU heat sink, so the high hot-fluid (temperature) that CPU distributes, made the working medium evaporation gasification in chamber by tube wall.Steam flows to condensation segment heat release by span line (adiabatic section) and condenses into liquid, and liquid flows back to evaporator section by gravity along porous surface and capillary action again.Iterative cycles like this, constantly transfers to condensation segment by the heat of CPU from evaporator section.Because heat pipe leans on the phase transformation of working medium to absorb, discharge the latent heat of vaporization, so its heat-transfer capability is superpower.
As embodiment, this device is provided with 3 U-shaped heat pipes, and the diameter of heat pipe is 6mm.The top of heat pipe passes stacked fin 5mm.The base areas of heating radiator is 65 × 105mm; Wherein the area of CPU heat sink is 50 × 50mm.Liquid working substance in U-shaped heat pipe is water.
During use, the CPU heat sink of cpu chip (representative of high heat flux device) with base plate of radiator central region is fitted tightly, be provided with the thermal bond material of high thermal conductivity between cpu chip and CPU heat sink, utilize the bolt hole on heating radiator four limit and server master board fastening.
Claims (6)
1. with the gravity heat-pipe type chip radiator of composite bottom board, there is base plate of radiator, U-shaped heat pipe and stacked fin, it is characterized in that: the central area of base plate of radiator (1) is provided with CPU heat sink (2), CPU heat sink and base plate of radiator are welded as a whole, the top of base plate of radiator is provided with stacked fin (3), several upright U-shaped heat pipe (4) is through stacked fin, immersed solder is inlayed in CPU heat sink in the bottom of U-shaped heat pipe, and the top of heat pipe passes stacked fin.
2. according to the gravity heat-pipe type chip radiator with composite bottom board according to claim 1, it is characterized in that: the stacked fin on described base plate of radiator top is as a whole, stacked fin and base plate of radiator are fixed as one, and semicircle assembly space (3-1) is left on four limits of stacked fin.
3. according to the gravity heat-pipe type chip radiator with composite bottom board according to claim 1, it is characterized in that: the root of each U-shaped heat pipe in described CPU heat sink top is equipped with reinforcement fin (4-1); The diameter of U-shaped heat pipe is 6-8mm.
4. according to the gravity heat-pipe type chip radiator with composite bottom board according to claim 1, it is characterized in that: described base plate of radiator is provided with 4 bolts hole (1-1).
5. according to the gravity heat-pipe type chip radiator with composite bottom board according to claim 1, it is characterized in that: the material of described base plate of radiator is aluminium; The material of described CPU heat sink is fine copper material.
6. according to the gravity heat-pipe type chip radiator with composite bottom board according to claim 1, it is characterized in that: the gap between described U-shaped heat pipe and reinforcement fin and the gap wicking shutoff between U-shaped heat pipe and stacked fin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201510211721.1A CN104850197A (en) | 2015-04-28 | 2015-04-28 | Gravity heat pipe chip heat sink with composite bottom plate |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510211721.1A CN104850197A (en) | 2015-04-28 | 2015-04-28 | Gravity heat pipe chip heat sink with composite bottom plate |
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| CN104850197A true CN104850197A (en) | 2015-08-19 |
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| CN201510211721.1A Pending CN104850197A (en) | 2015-04-28 | 2015-04-28 | Gravity heat pipe chip heat sink with composite bottom plate |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107182191A (en) * | 2017-07-20 | 2017-09-19 | 四川斯普信信息技术有限公司 | It is a kind of to realize the system radiated to cpu chip and server simultaneously |
| CN107357393A (en) * | 2017-07-25 | 2017-11-17 | 合肥铭剑信息技术有限公司 | A kind of fast computer heat radiating device of radiating rate |
| CN116075140A (en) * | 2023-04-06 | 2023-05-05 | 毫厘机电(苏州)有限公司 | Hierarchical radiator with nested radiating structure and radiating method thereof |
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| CN103019345A (en) * | 2012-12-21 | 2013-04-03 | 天津商业大学 | Heat pipe type radiator with enhanced heat exchange effect |
| CN204576403U (en) * | 2015-04-28 | 2015-08-19 | 天津商业大学 | Gravity heat-pipe type chip radiator |
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Patent Citations (7)
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| CN2655327Y (en) * | 2003-08-07 | 2004-11-10 | 珍通科技股份有限公司 | Radiating structure for central processor |
| CN1967820A (en) * | 2005-11-18 | 2007-05-23 | 富准精密工业(深圳)有限公司 | Fin heat abstractor |
| TWM291559U (en) * | 2005-12-26 | 2006-06-01 | Lea Min Technologies Co Ltd | Heat-pipe type heat-dissipation apparatus |
| CN201243430Y (en) * | 2008-08-05 | 2009-05-20 | 利民科技开发有限公司 | Multi-channel hot pipe type radiator |
| US20120312509A1 (en) * | 2011-06-09 | 2012-12-13 | Foxconn Technology Co., Ltd. | Heat dissipation device |
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| CN204576403U (en) * | 2015-04-28 | 2015-08-19 | 天津商业大学 | Gravity heat-pipe type chip radiator |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107182191A (en) * | 2017-07-20 | 2017-09-19 | 四川斯普信信息技术有限公司 | It is a kind of to realize the system radiated to cpu chip and server simultaneously |
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| CN107357393A (en) * | 2017-07-25 | 2017-11-17 | 合肥铭剑信息技术有限公司 | A kind of fast computer heat radiating device of radiating rate |
| CN116075140A (en) * | 2023-04-06 | 2023-05-05 | 毫厘机电(苏州)有限公司 | Hierarchical radiator with nested radiating structure and radiating method thereof |
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Application publication date: 20150819 |
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