CN105865089B - A kind of pin rib wall surface micro-channel heat exchanger - Google Patents
A kind of pin rib wall surface micro-channel heat exchanger Download PDFInfo
- Publication number
- CN105865089B CN105865089B CN201610245384.2A CN201610245384A CN105865089B CN 105865089 B CN105865089 B CN 105865089B CN 201610245384 A CN201610245384 A CN 201610245384A CN 105865089 B CN105865089 B CN 105865089B
- Authority
- CN
- China
- Prior art keywords
- pin rib
- heat exchanger
- wall surface
- pin
- silicon chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B39/00—Evaporators; Condensers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2339/00—Details of evaporators; Details of condensers
- F25B2339/02—Details of evaporators
- F25B2339/024—Evaporators with refrigerant in a vessel in which is situated a heat exchanger
- F25B2339/0241—Evaporators with refrigerant in a vessel in which is situated a heat exchanger having plate-like elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2339/00—Details of evaporators; Details of condensers
- F25B2339/04—Details of condensers
- F25B2339/042—Details of condensers of pcm condensers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
Abstract
The invention discloses a kind of pin rib wall surface micro-channel heat exchangers belonged in minute yardstick phase-change heat transfer technical field.The heat exchanger includes the first silicon chip and the second silicon chip that are bonded together, heat exchanger entrance and heat exchanger outlet are machined on second silicon chip, surface is machined with pin rib wall surface microchannel, and pin rib wall surface microchannel is between heat exchanger entrance and heat exchanger outlet；Pin rib wall surface microchannel separates into 12 optical channels by 11 step pin rib walls, and step pin rib wall is made of a large amount of single pin rib columns, and including pin rib compact district and pin rib puffs, pin rib puffs are located at the both sides of pin rib compact district.When the heat exchanger overcomes conventional microchannel phase-change heat transfer the problem of flow instabilities, there is overstable operation wall temperature when two-phase exchanges heat, and integrate evaporator and condenser function, there is inherent advantage in product commercialization.
Description
Technical field
The invention belongs to minute yardstick phase-change heat transfer technical fields, and in particular to a kind of pin rib wall surface micro-channel heat exchanger.
Background technology
Fluid is heated in conventional microchannel heat exchanger when undergoing phase transition, since passage water conservancy diameter is small, after bubble generates
Can only in the flowing direction upstream or downstream expansion, here it is occur that two-phase diabatic process commonly encounters in microchannel " by
Limit bubble " phenomenon.The channel size reduced weakens the 3D effects of passage, makes the very easy blocking channel of bubble of generation,
Cause serious flow instability in single channel.In addition, the micro-channel heat exchanger with application value is often using simultaneously unicom
The form in road, inherently there are various flow rate solution between parallel port under same drive ram, in addition the influence of " limited bubble ",
So that two-phase flow becomes extremely unstable in microchannel.
Under same hot-fluid load, the unstable erratic fluctuations for directly resulting in cooling wall temperature of flowing.When in face of precision
During the accurate temperature controlling condition that experimentation needs, conventional microchannel can not provide stable wall temperature.Stablize to develop high-performance
Micro- cooling system, there is an urgent need for research and develop a kind of micro-channel heat exchanger that can realize precise and stable temperature control.
The content of the invention
It is an object of the invention to provide the microchannels that a kind of pin rib wall surface regulation and control two phase flow signals reach accurate temperature controlling effect
Heat exchanger, the technical solution taken are as follows：
A kind of pin rib wall surface micro channel heat exchanger, the heat exchanger include the first silicon chip 1 and the second silicon chip 2,
First silicon chip 1 and the second silicon chip 2 are bonded together using high-voltage electrostatic field bonding techniques；
Heat exchanger entrance 4 and heat exchanger outlet 6, table are machined with by dry etching method on second silicon chip 2
Face is machined with pin rib wall surface microchannel by MEMS technology, and pin rib wall surface microchannel is located at heat exchanger entrance 4 and heat exchange
Between device outlet 6；The pin rib wall surface microchannel separates into 12 optical channels 9 by 11 step pin rib walls 3；The step pin rib
Wall 3 is made of a large amount of single pin rib columns 5, and including pin rib compact district 7 and pin rib puffs 8, it is intensive that pin rib puffs 8 are located at pin rib
The both sides in area 7；5 high 75 μm of the pin rib column, cross section are square, and the section length of side is 15 μm.
3 wide 336 μm of the step pin rib wall is 75 μm high；The distance between 7 two neighboring pin rib column 5 of pin rib compact district is 5
μm, 116 μm of overall width, the distance between 8 two neighboring pin rib column 5 of pin rib puffs is 15 μm, and overall width is 220 μm.
9 wide 164 μm of the optical channel, it is 75 μm deep.
The thickness of second silicon chip 2 is 400 μm.
The heat exchanger realizes that the principle of overstable operation wall temperature is：Pin rib wall surface has substantial amounts of corner angle, is passage
The nucleation boiling of interior fluid provides a large amount of coring caves, and the bubble of generation is close due to the pin rib of traction from the step pin rib wall of capillary force
Ji Qu is swum automatically to a certain optical channel.Since bubble expansion causes its pressure slightly to rise in the optical channel, make step pin rib wall
Fluid flow to adjacent optical channel, change the dissipation direction of bubble, be thusly-formed the alternating of bubble in adjacent optical channel
Harmomegathus.
In flow boiling heat transfer, heat transfer coefficient is related to two-phase heat transfer area, and the alternating harmomegathus of bubble means equivalent
Two-phase heat transfer area alternately changes so that the localized heat transfer effect of adjacent optical channel does small floating, wall temperature around equalization point
The minor fluctuations with the floating of optical channel local heat transfer coefficient, realize the overstable operation of wall temperature.
Beneficial effects of the present invention are：
1st, " limited bubble " blocking channel causes strongly not when the heat exchanger overcomes conventional microchannel phase-change heat transfer
The problem of steady flow, and then reduce between conventional tubeless wall surface parallel port due to there are various flow solution, and in entrance
Generate the mixed unstability for causing parallel port of friendship of flow；" high-frequency fluctuation " feature is presented in gas-liquid two-phase interface in optical channel,
Channel wall temperature fluctuation amplitude is less than 0.1 DEG C when so that the two-phase is exchanged heat, and has overstable operation wall temperature, to inhibit flow instabilities
Provide new direction；
2nd, the friendship of fluid mixes and has promoted augmentation of heat transfer in pin rib wall surface microchannel, is provided newly for the design of high-performance heat exchanger
Thinking；
3rd, the heat exchanger integrates evaporator and condenser function, is especially advantageous for producing in batches in the industrial production
It is exchanged with product, there is inherent advantage in product commercialization.
Description of the drawings
Fig. 1 is the appearance diagram of the heat exchanger.
Fig. 2 is the internal structure schematic diagram of the heat exchanger.
Fig. 3 is the structure diagram of step pin rib wall.
Fig. 4 is that bubble is grown and the schematic diagram of dissipation outward from pin rib compact district during boiling heat transfer.
Fig. 5 is gas-liquid two-phase flow pattern figure in optical channel；Wherein, Pg,i, Pf,iIt is saturation in bubble in i-th of optical channel respectively
Gas pressure and the outer fluid pressure of bubble, Pg,i+1, Pf,i+1Be respectively in i+1 optical channel in bubble saturated gas pressure with
The outer fluid pressure of bubble.
Figure label is respectively：The first silicon chips of 1-, the second silicon chips of 2-, 3- step pin ribs wall, 4- heat exchanger entrances, 5-
Pin rib column, 6- heat exchanger exits, 7- pin ribs compact district, 8- pin ribs puffs, 9- optical channels.
Specific embodiment
The invention will be further described with reference to the accompanying drawings and examples, but protection scope of the present invention is without being limited thereto.
Embodiment
A kind of pin rib wall surface micro channel heat exchanger, the heat exchanger include the first silicon chip 1 and the second silicon chip 2,
First silicon chip 1 and the second silicon chip 2 are bonded together using high-voltage electrostatic field bonding techniques；
Heat exchanger entrance 4 and heat exchanger outlet 6, table are machined with by dry etching method on second silicon chip 2
Face is machined with pin rib wall surface microchannel by MEMS technology, and pin rib wall surface microchannel is located at heat exchanger entrance 4 and heat exchange
Between device outlet 6；The pin rib wall surface microchannel separates into 12 optical channels 9 by 11 step pin rib walls 3；The step pin rib
Wall 3 is made of a large amount of single pin rib columns 5, and including pin rib compact district 7 and pin rib puffs 8, it is intensive that pin rib puffs 8 are located at pin rib
The both sides in area 7；5 high 75 μm of the pin rib column, cross section are square, and the section length of side is 15 μm.
3 wide 336 μm of the step pin rib wall is 75 μm high；The distance between 7 two neighboring pin rib column 5 of pin rib compact district is 5
μm, 116 μm of overall width, the distance between 8 two neighboring pin rib column 5 of pin rib puffs is 15 μm, and overall width is 220 μm.
9 wide 164 μm of the optical channel, it is 75 μm deep.
The thickness of second silicon chip 2 is 400 μm.
The heat exchanger includes gas liquid two-phase flow with the step of coupling adjusting and stability adjusting of conducting heat：
(1) phase-change heat transfer is carried out after the heat that the refrigerant at heat exchanger entrance is distributed in the enough heat sources of receiving, it is trapezoidal
The pin rib substantial amounts of corner angle in wall pin rib compact district provide substantial amounts of boiling nucleation cave for refrigerant, and bubble is generated from boiling nucleation cave
With grow up, under the action of capillary tractive force and evaporation momentum force, the bubble of pin rib compact district during growing up constantly to
The optical channel dissipation of both sides.Bubble dissipation process is as shown in figure 4, bubble produces in the boiling nucleation cave in pin rib compact district somewhere first
Raw, bubble starts gradually to grow up after absorbing the heat from step pin rib wall surface；On the one hand bubble is subject to edge in growth process
On the one hand the impact force of flow direction upstream fluid is subject to capillary tractive force of the small space of pin rib wall to large space, make bubble from
The pin rib compact district dissipation of step pin rib wall completes the passive regulation and control of two phase flow signals in heat exchanger to optical channel.
(2) bubble is after a certain sidelight passage dissipation, and based on film convection current heat-transfer mechanism, bubble is in the work of evaporation momentum force
With lower rapid increase, on the one hand increased bubble raises the fluid temperature (F.T.) in the optical channel, saturation pressure rise, on the other hand
Reduce the area of section in the optical channel shared by liquid, effective water conservancy diameter of liquid flowing reduces, and liquid phase resistance is caused to increase
Add；Force action in terms of the two makes fluid in the optical channel flow to adjacent optical channel across trapezoidal pin rib wall, adds
Use is mixed up in the friendship of Zhen Lei areas fluid, enhances heat exchange, while balances the pressure difference between adjacent optical channel, cuts adjacent optical channel
Reversed property is presented in face air content at any time.Fig. 5 is gas-liquid two-phase flow pattern figure in optical channel, and gas phase is collected in optical channel, according to
Pressure balance has Pg,i+Pf,i=Pg,i+1+Pf,i+1；According to The Ideal-Gas Equation, it is assumed that gas density is constant, saturated gas
Pressure is the monotropic function of saturation temperature, and the saturation temperature at same section is suitable, therefore the saturation in adjacent optical channel in bubble
Gas pressure Pg,iAnd Pg,i+1It is equal；Meanwhile the outer fluid pressure of bubble in i-th of optical channelμ in formulaf- liquid
Body dynamic viscosity, L- bubble lengths, mf- fluid mass flow rate, Deff- effective flowing diameter；When bubble width increases in i optical channels
Added-time, effective circulation diameter D of liquid in the optical channeleffReduce, resistance increase causes Pf,i＞ Pf,i+1, make liquid from i-th
Optical channel flows to i+1 optical channel, realizes that the friendship of pressure and liquid mixes in adjacent optical channel, the friendship of liquid radial direction mixes increase two
The stability of heat exchanger operation has been greatly reinforced while phase heat transfer coefficient.
(3) when certain optical channel section, air content increases, Local Condensing Heat Transfer Coefficients increase, and wall temperature declines, when section air content
During reduction, local heat transfer coefficient reduces, and wall temperature rises；Air content is in inverse change at any time with wall temperature in i.e. same optical channel,
The wall temperature of same optical channel and interface air content is made to change with time and reversed property is presented；Adjacent optical channel section air content is at any time
Between reversed property, the wall temperature of same optical channel and section air content be presented change with time and present two in reversed property and optical channel
The high-frequency fluctuation of boundary completes the superregulated property that turbulent flow and heat transfer adjusts and runs wall temperature jointly.
Claims (4)
1. a kind of pin rib wall surface micro channel heat exchanger is the list of square including the second silicon chip (2) and by a large amount of cross sections
The step pin rib wall (3) of a pin rib column (5) composition, wherein being provided with heat exchanger entrance (4) on the second silicon chip (2), heat is handed over
Parallel operation exports (6) and pin rib wall surface microchannel, pin rib wall surface microchannel are located at heat exchanger entrance (4) and heat exchanger outlet
(6) between, which is characterized in that the micro channel heat exchanger further includes the first silicon chip (1), the first silicon chip (1) and second
Silicon chip (2) is bonded together using high-voltage electrostatic field bonding techniques；
The pin rib wall surface microchannel separates into 12 optical channels (9) by 11 step pin rib walls (3)；Including pin rib compact district
(7) and pin rib puffs (8), pin rib puffs (8) are located at the both sides of pin rib compact district (7)；The pin rib column (5) is 75 μm high,
The section length of side is 15 μm.
A kind of 2. pin rib wall surface micro channel heat exchanger according to claim 1, which is characterized in that the step pin rib wall
(3) it is 336 μm wide, it is 75 μm high；The distance between two neighboring pin rib column (5) in pin rib compact district (7) is 5 μm, 116 μm of overall width,
The distance between two neighboring pin rib column (5) in pin rib puffs (8) is 15 μm, and overall width is 220 μm.
A kind of 3. pin rib wall surface micro channel heat exchanger according to claim 1, which is characterized in that the optical channel (9)
It is 164 μm wide, it is 75 μm deep.
A kind of 4. pin rib wall surface micro channel heat exchanger according to claim 1, which is characterized in that second silicon chip
(2) thickness is 400 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610245384.2A CN105865089B (en) | 2016-04-19 | 2016-04-19 | A kind of pin rib wall surface micro-channel heat exchanger |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610245384.2A CN105865089B (en) | 2016-04-19 | 2016-04-19 | A kind of pin rib wall surface micro-channel heat exchanger |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105865089A CN105865089A (en) | 2016-08-17 |
| CN105865089B true CN105865089B (en) | 2018-05-25 |
Family
ID=56633404
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610245384.2A Active CN105865089B (en) | 2016-04-19 | 2016-04-19 | A kind of pin rib wall surface micro-channel heat exchanger |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105865089B (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11199112B2 (en) | 2017-08-18 | 2021-12-14 | Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Onderzoek Tno | Method and system for heat recovery |
| CN107702566A (en) * | 2017-09-14 | 2018-02-16 | 华北电力大学 | A kind of dot matrix heat exchanger |
| CN108225079B (en) * | 2017-12-26 | 2020-04-28 | 华北电力大学 | Top-communicated non-uniform-wettability silicon-based micro-channel phase change heat exchanger |
| CN108521745A (en) * | 2018-03-12 | 2018-09-11 | 上海卫星工程研究所 | The efficient phase-change energy storage for adapting to the big heat spreader of pulsed is heat sink |
| CN108562067B (en) * | 2018-04-17 | 2023-12-05 | 华南理工大学 | Electric field enhanced refrigerant boiling heat transfer micro-channel heat exchanger based on needle electrode |
| TWM618807U (en) | 2021-01-08 | 2021-11-01 | 瑞領科技股份有限公司 | Two-phase immersion type ebullator with the trench structure |
| CN115474415B (en) * | 2022-10-14 | 2024-01-19 | 苏州浪潮智能科技有限公司 | Radiator and server |
Citations (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6244331B1 (en) * | 1999-10-22 | 2001-06-12 | Intel Corporation | Heatsink with integrated blower for improved heat transfer |
| CN2521755Y (en) * | 2001-11-22 | 2002-11-20 | 成都希望电子研究所 | Combined radiator |
| US6591897B1 (en) * | 2002-02-20 | 2003-07-15 | Delphi Technologies, Inc. | High performance pin fin heat sink for electronics cooling |
| US6817405B2 (en) * | 2002-06-03 | 2004-11-16 | International Business Machines Corporation | Apparatus having forced fluid cooling and pin-fin heat sink |
| CN1558448A (en) * | 2004-02-06 | 2004-12-29 | 中国科学院广州能源研究所 | Silicon based micro passage heat exchanger |
| WO2005064668A1 (en) * | 2003-12-30 | 2005-07-14 | Agency For Science, Technology And Research | Wafer level super stretch solder |
| US7215545B1 (en) * | 2003-05-01 | 2007-05-08 | Saeed Moghaddam | Liquid cooled diamond bearing heat sink |
| CN101026948A (en) * | 2007-03-26 | 2007-08-29 | 山东省科学院能源研究所 | Single-phase ultrahigh heat flow micro-column heat exchanger |
| US7301770B2 (en) * | 2004-12-10 | 2007-11-27 | International Business Machines Corporation | Cooling apparatus, cooled electronic module, and methods of fabrication thereof employing thermally conductive, wire-bonded pin fins |
| CN101500394A (en) * | 2008-01-30 | 2009-08-05 | 中国科学院工程热物理研究所 | Straight-fin heat expansion reinforced structure minuteness scale composite phase-change heat fetching apparatus |
| CN101541159A (en) * | 2009-04-16 | 2009-09-23 | 西安交通大学 | Boiling heat transfer device of electronic component |
| US7731079B2 (en) * | 2008-06-20 | 2010-06-08 | International Business Machines Corporation | Cooling apparatus and method of fabrication thereof with a cold plate formed in situ on a surface to be cooled |
| CN102683305A (en) * | 2012-05-14 | 2012-09-19 | 西安交通大学 | Chip reinforced boiling heat transfer structure of multi-pore microcolumn variable camber molded surfaces |
| CN103335549A (en) * | 2013-07-11 | 2013-10-02 | 华北电力大学 | Phase separation micro-channel condenser |
| CN103668367A (en) * | 2013-12-06 | 2014-03-26 | 宁波微极电子科技有限公司 | Manufacture method for micro-nano-structure array radiating fin |
| CN104112736A (en) * | 2014-07-08 | 2014-10-22 | 北京工业大学 | 3D-IC with inter-layer complex microchannel fluid cooling function |
| CN104658992A (en) * | 2015-02-13 | 2015-05-27 | 西安电子科技大学 | Novel micro heat sink provided with pin-fin array |
| CN105070696A (en) * | 2015-08-05 | 2015-11-18 | 沈阳理工大学 | Miniature radiator with columnar phyllotaxis configuration expanding structure |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6765793B2 (en) * | 2002-08-30 | 2004-07-20 | Themis Corporation | Ruggedized electronics enclosure |
| US20040170806A1 (en) * | 2003-02-28 | 2004-09-02 | University Of Colorado Research Foundation | Tile structures having phase change material (PCM) component for use in flooring and ceilings |
-
2016
- 2016-04-19 CN CN201610245384.2A patent/CN105865089B/en active Active
Patent Citations (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6244331B1 (en) * | 1999-10-22 | 2001-06-12 | Intel Corporation | Heatsink with integrated blower for improved heat transfer |
| CN2521755Y (en) * | 2001-11-22 | 2002-11-20 | 成都希望电子研究所 | Combined radiator |
| US6591897B1 (en) * | 2002-02-20 | 2003-07-15 | Delphi Technologies, Inc. | High performance pin fin heat sink for electronics cooling |
| US6817405B2 (en) * | 2002-06-03 | 2004-11-16 | International Business Machines Corporation | Apparatus having forced fluid cooling and pin-fin heat sink |
| US7215545B1 (en) * | 2003-05-01 | 2007-05-08 | Saeed Moghaddam | Liquid cooled diamond bearing heat sink |
| WO2005064668A1 (en) * | 2003-12-30 | 2005-07-14 | Agency For Science, Technology And Research | Wafer level super stretch solder |
| CN1558448A (en) * | 2004-02-06 | 2004-12-29 | 中国科学院广州能源研究所 | Silicon based micro passage heat exchanger |
| US7301770B2 (en) * | 2004-12-10 | 2007-11-27 | International Business Machines Corporation | Cooling apparatus, cooled electronic module, and methods of fabrication thereof employing thermally conductive, wire-bonded pin fins |
| CN101026948A (en) * | 2007-03-26 | 2007-08-29 | 山东省科学院能源研究所 | Single-phase ultrahigh heat flow micro-column heat exchanger |
| CN101500394A (en) * | 2008-01-30 | 2009-08-05 | 中国科学院工程热物理研究所 | Straight-fin heat expansion reinforced structure minuteness scale composite phase-change heat fetching apparatus |
| US7731079B2 (en) * | 2008-06-20 | 2010-06-08 | International Business Machines Corporation | Cooling apparatus and method of fabrication thereof with a cold plate formed in situ on a surface to be cooled |
| CN101541159A (en) * | 2009-04-16 | 2009-09-23 | 西安交通大学 | Boiling heat transfer device of electronic component |
| CN102683305A (en) * | 2012-05-14 | 2012-09-19 | 西安交通大学 | Chip reinforced boiling heat transfer structure of multi-pore microcolumn variable camber molded surfaces |
| CN103335549A (en) * | 2013-07-11 | 2013-10-02 | 华北电力大学 | Phase separation micro-channel condenser |
| CN103668367A (en) * | 2013-12-06 | 2014-03-26 | 宁波微极电子科技有限公司 | Manufacture method for micro-nano-structure array radiating fin |
| CN104112736A (en) * | 2014-07-08 | 2014-10-22 | 北京工业大学 | 3D-IC with inter-layer complex microchannel fluid cooling function |
| CN104658992A (en) * | 2015-02-13 | 2015-05-27 | 西安电子科技大学 | Novel micro heat sink provided with pin-fin array |
| CN105070696A (en) * | 2015-08-05 | 2015-11-18 | 沈阳理工大学 | Miniature radiator with columnar phyllotaxis configuration expanding structure |
Non-Patent Citations (1)
| Title |
|---|
| 流体横掠方形微针肋阵列热沉的传热特性;夏国栋,李宴君,孔凡金;《工程热物理学报》;20080430;第29卷(第4期);628-630 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105865089A (en) | 2016-08-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105865089B (en) | A kind of pin rib wall surface micro-channel heat exchanger | |
| Li et al. | Experimental investigation of flow boiling performance in microchannels with and without triangular cavities–A comparative study | |
| Kandlikar et al. | Enhanced flow boiling over open microchannels with uniform and tapered gap manifolds | |
| Xia et al. | Experimental and numerical study of fluid flow and heat transfer characteristics in microchannel heat sink with complex structure | |
| Li et al. | Experimental investigation of flow boiling characteristics in microchannel with triangular cavities and rectangular fins | |
| Kandlikar | Mechanistic considerations for enhancing flow boiling heat transfer in microchannels | |
| US20140138861A1 (en) | Internal liquid separating hood-type condensation heat exchange tube | |
| CN201383909Y (en) | Micro-channel cold plate device for liquid cooling radiator | |
| Jiang et al. | Experimental study on heat transfer performance of a novel compact spray cooling module | |
| Chen et al. | Improvement of flow and heat transfer performance of manifold microchannel with porous fins | |
| CN109671688B (en) | Refrigerant phase change cold plate | |
| Markal et al. | Experimental investigation and force analysis of flat-plate type pulsating heat pipes having ternary mixtures | |
| Markal et al. | Experimental investigation of flow boiling in single minichannels with low mass velocities | |
| Mao et al. | A critical review on measures to suppress flow boiling instabilities in microchannels | |
| Zhang et al. | Enhanced flow boiling in an interconnected microchannel net at different inlet subcooling | |
| Cui et al. | Enhanced flow boiling of HFE-7100 in picosecond laser fabricated copper microchannel heat sink | |
| Tang et al. | Effects of structural parameter on flow boiling performance of interconnected microchannel net | |
| Rui et al. | Experimental research on flow boiling thermal-hydraulic characteristics in novel microchannels | |
| CN204107488U (en) | Integrated micro-reaction device | |
| Hu et al. | Role of trapped liquid in flow boiling inside micro-porous structures: pore-scale visualization and heat transfer enhancement | |
| Tan et al. | Enhancement of flow boiling in the microchannel with a bionic gradient wetting surface | |
| Qi et al. | Thermo-hydraulic performance of nanofluids in a bionic fractal microchannel heat sink with traveling-wave fins | |
| Yu et al. | A critical review on geometric improvements for heat transfer augmentation of microchannels | |
| Tang et al. | Study on the flow and heat transfer of a nanofluid hybrid jet impinging on a corrugated microchannel heat sink | |
| Goel et al. | A compact falling film absorber |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |