AU2002217867A1 - Crosslinked polyethylene polishing pad for chemical-mechnical polishing, polishing apparatus and polishing method - Google Patents

Crosslinked polyethylene polishing pad for chemical-mechnical polishing, polishing apparatus and polishing method

Info

Publication number
AU2002217867A1
AU2002217867A1 AU2002217867A AU1786702A AU2002217867A1 AU 2002217867 A1 AU2002217867 A1 AU 2002217867A1 AU 2002217867 A AU2002217867 A AU 2002217867A AU 1786702 A AU1786702 A AU 1786702A AU 2002217867 A1 AU2002217867 A1 AU 2002217867A1
Authority
AU
Australia
Prior art keywords
polishing
chemical
mechnical
crosslinked polyethylene
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002217867A
Inventor
Yaw S. Obeng
Edward M. Yokley
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
psiloQuest Inc
Original Assignee
EXIGENT
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/000,101 external-priority patent/US6846225B2/en
Application filed by EXIGENT filed Critical EXIGENT
Priority claimed from PCT/US2001/044177 external-priority patent/WO2002043922A1/en
Publication of AU2002217867A1 publication Critical patent/AU2002217867A1/en
Abandoned legal-status Critical Current

Links

AU2002217867A 2000-11-29 2001-11-27 Crosslinked polyethylene polishing pad for chemical-mechnical polishing, polishing apparatus and polishing method Abandoned AU2002217867A1 (en)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US25029900P 2000-11-29 2000-11-29
US60250299 2000-11-29
US30437501P 2001-07-10 2001-07-10
US60304375 2001-07-10
US10/000,101 US6846225B2 (en) 2000-11-29 2001-10-24 Selective chemical-mechanical polishing properties of a cross-linked polymer and specific applications therefor
PCT/US2001/044177 WO2002043922A1 (en) 2000-11-29 2001-11-27 Crosslinked polyethylene polishing pad for chemical-mechnical polishing, polishing apparatus and polishing method
USNOTGIVEN 2002-04-17

Publications (1)

Publication Number Publication Date
AU2002217867A1 true AU2002217867A1 (en) 2002-06-11

Family

ID=27356605

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002217867A Abandoned AU2002217867A1 (en) 2000-11-29 2001-11-27 Crosslinked polyethylene polishing pad for chemical-mechnical polishing, polishing apparatus and polishing method

Country Status (4)

Country Link
EP (1) EP1345734B1 (en)
CN (1) CN1484566A (en)
AU (1) AU2002217867A1 (en)
DE (1) DE60118963T2 (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI510328B (en) * 2010-05-03 2015-12-01 Iv Technologies Co Ltd Base layer, polishing pad including the same and polishing method
CN102554764A (en) * 2012-02-15 2012-07-11 蔡桂芳 Machine and method for grinding and polishing ultra-long and ultra-thin quartz plate
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
KR102436416B1 (en) 2014-10-17 2022-08-26 어플라이드 머티어리얼스, 인코포레이티드 Cmp pad construction with composite material properties using additive manufacturing processes
US10946495B2 (en) * 2015-01-30 2021-03-16 Cmc Materials, Inc. Low density polishing pad
KR20240015161A (en) 2016-01-19 2024-02-02 어플라이드 머티어리얼스, 인코포레이티드 Porous chemical mechanical polishing pads
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
US20180134918A1 (en) * 2016-11-11 2018-05-17 Jh Rhodes Company, Inc. Soft polymer-based material polishing media
KR101945874B1 (en) * 2017-08-07 2019-02-11 에스케이씨 주식회사 Surface treated window for polishing pad and polishing pad comprising the same
CN116749093B (en) * 2023-08-11 2023-11-07 太原理工大学 Preparation process of magnetic grinding tool and slender tube internal polishing device based on magnetic grinding tool

Also Published As

Publication number Publication date
EP1345734A1 (en) 2003-09-24
EP1345734B1 (en) 2006-04-19
CN1484566A (en) 2004-03-24
DE60118963D1 (en) 2006-05-24
DE60118963T2 (en) 2006-12-21

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