AU2000270415A1 - Polishing apparatus comprising pad and polishing method using the same - Google Patents

Polishing apparatus comprising pad and polishing method using the same

Info

Publication number
AU2000270415A1
AU2000270415A1 AU2000270415A AU7041500A AU2000270415A1 AU 2000270415 A1 AU2000270415 A1 AU 2000270415A1 AU 2000270415 A AU2000270415 A AU 2000270415A AU 7041500 A AU7041500 A AU 7041500A AU 2000270415 A1 AU2000270415 A1 AU 2000270415A1
Authority
AU
Australia
Prior art keywords
polishing
pad
same
polishing apparatus
polishing method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2000270415A
Inventor
Chan-Hwa Chung
Sung-Yong Park
Sung-Joon Yoon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fine Semitech Corp
Original Assignee
Fine Semitech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fine Semitech Corp filed Critical Fine Semitech Corp
Publication of AU2000270415A1 publication Critical patent/AU2000270415A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/32115—Planarisation
    • H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/14—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the temperature during grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
AU2000270415A 2000-08-23 2000-09-09 Polishing apparatus comprising pad and polishing method using the same Abandoned AU2000270415A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR0048870 2000-08-23
KR10-2000-0048870A KR100470137B1 (en) 2000-08-23 2000-08-23 Polishing apparatus comprising frozen pad and method for polishing using the same
PCT/KR2000/001030 WO2002017411A1 (en) 2000-08-23 2000-09-09 Polishing apparatus comprising pad and polishing method using the same

Publications (1)

Publication Number Publication Date
AU2000270415A1 true AU2000270415A1 (en) 2002-03-04

Family

ID=19684638

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2000270415A Abandoned AU2000270415A1 (en) 2000-08-23 2000-09-09 Polishing apparatus comprising pad and polishing method using the same

Country Status (3)

Country Link
KR (1) KR100470137B1 (en)
AU (1) AU2000270415A1 (en)
WO (1) WO2002017411A1 (en)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030050105A (en) * 2001-12-18 2003-06-25 삼성전자주식회사 Chemical mechanical polishing apparatus
JP2003332274A (en) 2002-05-17 2003-11-21 Tokyo Seimitsu Co Ltd Chemical mechanical polishing method and chemical mechanical polishing apparatus
KR20030095589A (en) * 2002-06-12 2003-12-24 동부전자 주식회사 Method For Manufacturing Semiconductors
CN100425405C (en) * 2006-08-03 2008-10-15 南京航空航天大学 Freezing nanometer abrasive polishing pad and its prepn. method
CN101774160B (en) * 2010-03-01 2011-05-11 南京航空航天大学 Grainofice-type concretion abrasive polishing pad as well as rapid preparation method and device
KR101330827B1 (en) * 2011-11-10 2013-11-18 한국기계연구원 Apparatus forming frost, laser processing system including the same and laser processing method using the same
CN102615555B (en) * 2012-04-16 2014-02-05 大连理工大学 Kindle direct publishing (KDP) crystal micro-nano hygroscopic ultraprecision polishing method based on ultrasonic atomization moisture
CN104875116B (en) * 2015-06-09 2017-09-12 青岛理工大学 Nano-fluid electrostatic atomization and the integrated micro lubricating grinding attachment of electric card heat pipe
US10058975B2 (en) 2016-02-12 2018-08-28 Applied Materials, Inc. In-situ temperature control during chemical mechanical polishing with a condensed gas
KR20210014205A (en) 2018-06-27 2021-02-08 어플라이드 머티어리얼스, 인코포레이티드 Temperature control of chemical mechanical polishing
CN109037033A (en) * 2018-07-17 2018-12-18 武汉新芯集成电路制造有限公司 A kind of wafer thining method
CN110039382A (en) * 2018-10-16 2019-07-23 天通控股股份有限公司 A kind of thining method of large-size ultra-thin lithium tantalate wafer
US11628478B2 (en) 2019-05-29 2023-04-18 Applied Materials, Inc. Steam cleaning of CMP components
US11633833B2 (en) 2019-05-29 2023-04-25 Applied Materials, Inc. Use of steam for pre-heating of CMP components
TW202110575A (en) 2019-05-29 2021-03-16 美商應用材料股份有限公司 Steam treatment stations for chemical mechanical polishing system
CN110190020A (en) * 2019-07-03 2019-08-30 中国振华集团云科电子有限公司 A kind of lithographic method and system
JP7295412B2 (en) * 2019-07-09 2023-06-21 日本製鉄株式会社 Evaluation method for metallic materials
US11897079B2 (en) 2019-08-13 2024-02-13 Applied Materials, Inc. Low-temperature metal CMP for minimizing dishing and corrosion, and improving pad asperity
WO2022006008A1 (en) 2020-06-29 2022-01-06 Applied Materials, Inc. Control of steam generation for chemical mechanical polishing
EP4171873A1 (en) 2020-06-29 2023-05-03 Applied Materials, Inc. Temperature and slurry flow rate control in cmp
US11577358B2 (en) 2020-06-30 2023-02-14 Applied Materials, Inc. Gas entrainment during jetting of fluid for temperature control in chemical mechanical polishing
KR20220156633A (en) 2020-06-30 2022-11-25 어플라이드 머티어리얼스, 인코포레이티드 Apparatus and method for CMP temperature control
CN112139859A (en) * 2020-09-21 2020-12-29 大连理工大学 Method for anhydrous polishing of KDP crystal

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4450652A (en) * 1981-09-04 1984-05-29 Monsanto Company Temperature control for wafer polishing
US5127196A (en) * 1990-03-01 1992-07-07 Intel Corporation Apparatus for planarizing a dielectric formed over a semiconductor substrate
JPH09123059A (en) * 1995-11-02 1997-05-13 Fujitsu Ltd Polishing method
JPH11347935A (en) * 1998-06-10 1999-12-21 Ebara Corp Polishing device

Also Published As

Publication number Publication date
KR20000064128A (en) 2000-11-06
WO2002017411A1 (en) 2002-02-28
KR100470137B1 (en) 2005-02-04

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