AU2001286219A1 - Ultraviolet-curing resin composition and photo solder resist ink containing the same - Google Patents
Ultraviolet-curing resin composition and photo solder resist ink containing the sameInfo
- Publication number
- AU2001286219A1 AU2001286219A1 AU2001286219A AU8621901A AU2001286219A1 AU 2001286219 A1 AU2001286219 A1 AU 2001286219A1 AU 2001286219 A AU2001286219 A AU 2001286219A AU 8621901 A AU8621901 A AU 8621901A AU 2001286219 A1 AU2001286219 A1 AU 2001286219A1
- Authority
- AU
- Australia
- Prior art keywords
- ultraviolet
- resin composition
- same
- solder resist
- ink containing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
- C08F290/14—Polymers provided for in subclass C08G
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
- C08F290/14—Polymers provided for in subclass C08G
- C08F290/141—Polyesters; Polycarbonates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
- C08F290/14—Polymers provided for in subclass C08G
- C08F290/144—Polymers containing more than one epoxy group per molecule
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
Landscapes
- Chemical & Material Sciences (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Epoxy Resins (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Materials For Photolithography (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000281034 | 2000-09-14 | ||
| JP2000-281034 | 2000-09-14 | ||
| JP2000282403 | 2000-09-18 | ||
| JP2000-282403 | 2000-09-18 | ||
| JP2000-375130 | 2000-12-08 | ||
| JP2000375130 | 2000-12-08 | ||
| PCT/JP2001/007944 WO2002023275A1 (en) | 2000-09-14 | 2001-09-13 | Ultraviolet-curing resin composition and photo solder resist ink containing the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2001286219A1 true AU2001286219A1 (en) | 2002-03-26 |
Family
ID=27344637
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2001286219A Abandoned AU2001286219A1 (en) | 2000-09-14 | 2001-09-13 | Ultraviolet-curing resin composition and photo solder resist ink containing the same |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP4705311B2 (en) |
| CN (1) | CN1231815C (en) |
| AU (1) | AU2001286219A1 (en) |
| TW (1) | TW583510B (en) |
| WO (1) | WO2002023275A1 (en) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4554170B2 (en) * | 2003-06-03 | 2010-09-29 | 株式会社タムラ製作所 | UV curable alkali-soluble resin, UV curable resin for solder resist film and printed wiring board |
| KR101206780B1 (en) * | 2005-03-03 | 2012-11-30 | 주식회사 동진쎄미켐 | Photosensitive resin composition |
| CN100355802C (en) * | 2005-12-21 | 2007-12-19 | 中国印钞造币总公司 | Ultraviolet curing ink prepolymer and preparation method thereof |
| JP5788646B2 (en) * | 2009-06-25 | 2015-10-07 | 住友化学株式会社 | Polarizing plate, composite polarizing plate, and liquid crystal display device |
| TW201113303A (en) * | 2009-10-07 | 2011-04-16 | Sumitomo Chemical Co | Colored photosensitive resin compositions |
| KR101225953B1 (en) * | 2009-12-28 | 2013-01-24 | 제일모직주식회사 | Photosresist for protection layer of color filter, protection layer of color filter using same and image sensor including same |
| KR101361753B1 (en) * | 2010-03-22 | 2014-02-12 | 주식회사 엘지화학 | Photo-curable and thermo-curable resin composition, and dry film solder resist |
| WO2014038576A1 (en) * | 2012-09-05 | 2014-03-13 | 株式会社日本触媒 | Photosensitive resin composition for photo spacer, and photo spacer |
| JP6254389B2 (en) * | 2012-09-05 | 2017-12-27 | 株式会社日本触媒 | Photosensitive resin composition for photospacer and photospacer |
| CN103145988B (en) * | 2013-02-28 | 2014-11-05 | 中山大学 | Polyimide oligomer and liquid photoimagable solder resist ink |
| JP6404557B2 (en) * | 2013-10-04 | 2018-10-10 | 株式会社日本触媒 | Curable resin composition |
| TWI554567B (en) * | 2014-11-18 | 2016-10-21 | Chi Mei Corp | Alkali soluble resin and its photosensitive resin composition and its application |
| KR101975430B1 (en) * | 2014-12-10 | 2019-05-07 | 고오 가가쿠고교 가부시키가이샤 | Solder resist composition and covered printed wiring board |
| WO2016208472A1 (en) * | 2015-06-26 | 2016-12-29 | 日産化学工業株式会社 | Photocurable resin composition |
| CN108112171B (en) * | 2017-12-20 | 2019-12-03 | 厦门市铂联科技股份有限公司 | A kind of rolling FPC line pattern making apparatus and method |
| CN108124387B (en) * | 2017-12-20 | 2019-12-03 | 厦门市铂联科技股份有限公司 | A kind of FPC line pattern production method |
| CN111999982A (en) * | 2020-09-09 | 2020-11-27 | 广州斯达利电子原料有限公司 | Light-sensitive polyacrylic resin for LED light-sensitive solder-resistant white oil and preparation method thereof |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2684948B2 (en) * | 1993-02-03 | 1997-12-03 | 株式会社日本触媒 | Liquid photosensitive resin composition |
| JPH07233319A (en) * | 1994-02-24 | 1995-09-05 | Nippon Kayaku Co Ltd | Resin composition, resist ink composition and its cured product |
| JP3154383B2 (en) * | 1995-03-06 | 2001-04-09 | 凸版印刷株式会社 | Photosensitive resin and alkali-developable photosensitive resin composition containing the same |
| JP3718295B2 (en) * | 1995-08-11 | 2005-11-24 | ジャパンコンポジット株式会社 | Vinyl ester resin composition and cured product |
| JP2707495B2 (en) * | 1996-03-11 | 1998-01-28 | 太陽インキ製造株式会社 | Photosensitive thermosetting resin composition |
-
2001
- 2001-09-13 WO PCT/JP2001/007944 patent/WO2002023275A1/en active Application Filing
- 2001-09-13 CN CN 01815597 patent/CN1231815C/en not_active Expired - Fee Related
- 2001-09-13 JP JP2002527862A patent/JP4705311B2/en not_active Expired - Fee Related
- 2001-09-13 TW TW90122699A patent/TW583510B/en not_active IP Right Cessation
- 2001-09-13 AU AU2001286219A patent/AU2001286219A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| CN1455889A (en) | 2003-11-12 |
| WO2002023275A1 (en) | 2002-03-21 |
| CN1231815C (en) | 2005-12-14 |
| JPWO2002023275A1 (en) | 2004-01-22 |
| JP4705311B2 (en) | 2011-06-22 |
| TW583510B (en) | 2004-04-11 |
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