ZA895724B - Hydrogen peroxide compositions containing a substituted oxybenzene compound - Google Patents
Hydrogen peroxide compositions containing a substituted oxybenzene compoundInfo
- Publication number
- ZA895724B ZA895724B ZA895724A ZA895724A ZA895724B ZA 895724 B ZA895724 B ZA 895724B ZA 895724 A ZA895724 A ZA 895724A ZA 895724 A ZA895724 A ZA 895724A ZA 895724 B ZA895724 B ZA 895724B
- Authority
- ZA
- South Africa
- Prior art keywords
- hydrogen peroxide
- compositions containing
- peroxide compositions
- oxybenzene compound
- substituted
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/44—Compositions for etching metallic material from a metallic material substrate of different composition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B15/00—Peroxides; Peroxyhydrates; Peroxyacids or salts thereof; Superoxides; Ozonides
- C01B15/01—Hydrogen peroxide
- C01B15/037—Stabilisation by additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
- C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
- C09K13/06—Etching, surface-brightening or pickling compositions containing an inorganic acid with organic material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/067—Etchants
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Inorganic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Anti-Oxidant Or Stabilizer Compositions (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/224,802 US4875972A (en) | 1988-07-27 | 1988-07-27 | Hydrogen peroxide compositions containing a substituted oxybenzene compound |
Publications (1)
Publication Number | Publication Date |
---|---|
ZA895724B true ZA895724B (en) | 1991-03-27 |
Family
ID=22842277
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ZA895724A ZA895724B (en) | 1988-07-27 | 1989-07-27 | Hydrogen peroxide compositions containing a substituted oxybenzene compound |
Country Status (14)
Country | Link |
---|---|
US (1) | US4875972A (fi) |
EP (1) | EP0353083A3 (fi) |
JP (1) | JPH02120210A (fi) |
KR (1) | KR910003148A (fi) |
CN (1) | CN1040183A (fi) |
AU (1) | AU613218B2 (fi) |
BR (1) | BR8903712A (fi) |
DK (1) | DK368389A (fi) |
FI (1) | FI893578A (fi) |
IL (1) | IL91112A0 (fi) |
NO (1) | NO893048L (fi) |
NZ (1) | NZ230079A (fi) |
PT (1) | PT91281A (fi) |
ZA (1) | ZA895724B (fi) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IT1251431B (it) * | 1991-10-25 | 1995-05-09 | Costante Fontana | Composto ad elevate caratteristiche stabilizzanti particolarmente per perossidi inorganici utilizzati in applicazioni industriali |
US5439569A (en) * | 1993-02-12 | 1995-08-08 | Sematech, Inc. | Concentration measurement and control of hydrogen peroxide and acid/base component in a semiconductor bath |
US5364510A (en) * | 1993-02-12 | 1994-11-15 | Sematech, Inc. | Scheme for bath chemistry measurement and control for improved semiconductor wet processing |
US5630950A (en) * | 1993-07-09 | 1997-05-20 | Enthone-Omi, Inc. | Copper brightening process and bath |
US6074960A (en) * | 1997-08-20 | 2000-06-13 | Micron Technology, Inc. | Method and composition for selectively etching against cobalt silicide |
US6068879A (en) * | 1997-08-26 | 2000-05-30 | Lsi Logic Corporation | Use of corrosion inhibiting compounds to inhibit corrosion of metal plugs in chemical-mechanical polishing |
JP2002219924A (ja) * | 2001-01-23 | 2002-08-06 | Zexel Valeo Climate Control Corp | 車両用空調装置の通風路切換装置 |
JP5378620B2 (ja) * | 2012-03-16 | 2013-12-25 | 住友ベークライト株式会社 | 積層板及びプリント配線板の製造方法 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3407141A (en) * | 1966-02-03 | 1968-10-22 | Allied Chem | Dissolution of metal with acidified hydrogen peroxide solutions |
BE758162A (fr) * | 1969-10-28 | 1971-04-01 | Fmc Corp | Stabilisation de solutions acidifiees d'eau |
JPS5120972B1 (fi) * | 1971-05-13 | 1976-06-29 | ||
US3974086A (en) * | 1972-05-04 | 1976-08-10 | American Cyanamid Company | Stabilization of hydrogen peroxide solutions |
GB1435893A (en) * | 1972-07-05 | 1976-05-19 | Ici Ltd | Treatment of textile materials |
US3945865A (en) * | 1974-07-22 | 1976-03-23 | Dart Environment And Services Company | Metal dissolution process |
SE400581B (sv) * | 1974-12-13 | 1978-04-03 | Nordnero Ab | Bad for kemisk polering av koppar och dess legeringar |
US4027008A (en) * | 1975-05-14 | 1977-05-31 | The Gillette Company | Hair bleaching composition containing water-soluble amino and quaternary ammonium polymers |
GB1565349A (en) * | 1975-10-20 | 1980-04-16 | Albright & Wilson | Aluminium polishing compositions |
US4141850A (en) * | 1977-11-08 | 1979-02-27 | Dart Industries Inc. | Dissolution of metals |
US4233113A (en) * | 1979-06-25 | 1980-11-11 | Dart Industries Inc. | Dissolution of metals utilizing an aqueous H2 O2 -H2 SO4 -thioamide etchant |
US4233111A (en) * | 1979-06-25 | 1980-11-11 | Dart Industries Inc. | Dissolution of metals utilizing an aqueous H2 SO4 -H2 O2 -3-sulfopropyldithiocarbamate etchant |
US4236957A (en) * | 1979-06-25 | 1980-12-02 | Dart Industries Inc. | Dissolution of metals utilizing an aqueous H2 SOY --H2 O.sub. -mercapto containing heterocyclic nitrogen etchant |
US4728497A (en) * | 1980-12-15 | 1988-03-01 | Betz Laboratories, Inc. | Use of aminophenol compounds as oxygen scavengers in an aqueous medium |
US4437931A (en) * | 1983-08-22 | 1984-03-20 | Dart Industries Inc. | Dissolution of metals |
US4437930A (en) * | 1983-08-22 | 1984-03-20 | Dart Industries Inc. | Dissolution of metals utilizing ε-caprolactam |
US4462861A (en) * | 1983-11-14 | 1984-07-31 | Shipley Company Inc. | Etchant with increased etch rate |
GB8415909D0 (en) * | 1984-06-21 | 1984-07-25 | Procter & Gamble Ltd | Peracid compounds |
US4636282A (en) * | 1985-06-20 | 1987-01-13 | Great Lakes Chemical Corporation | Method for etching copper and composition useful therein |
US4678594A (en) * | 1985-07-19 | 1987-07-07 | Colgate-Palmolive Company | Method of encapsulating a bleach and activator therefor in a binder |
US4744968A (en) * | 1985-09-03 | 1988-05-17 | Technicon Instruments Corporation | Stabilized aqueous hydrogen peroxide solution |
GB8522046D0 (en) * | 1985-09-05 | 1985-10-09 | Interox Chemicals Ltd | Stabilisation |
US4778618A (en) * | 1986-11-06 | 1988-10-18 | The Clorox Company | Glycolate ester peracid precursors |
-
1988
- 1988-07-27 US US07/224,802 patent/US4875972A/en not_active Expired - Fee Related
-
1989
- 1989-07-25 NZ NZ230079A patent/NZ230079A/xx unknown
- 1989-07-26 BR BR898903712A patent/BR8903712A/pt unknown
- 1989-07-26 KR KR1019890010580A patent/KR910003148A/ko not_active Application Discontinuation
- 1989-07-26 PT PT91281A patent/PT91281A/pt not_active Application Discontinuation
- 1989-07-26 IL IL91112A patent/IL91112A0/xx unknown
- 1989-07-26 NO NO89893048A patent/NO893048L/no unknown
- 1989-07-26 FI FI893578A patent/FI893578A/fi not_active Application Discontinuation
- 1989-07-26 DK DK368389A patent/DK368389A/da not_active Application Discontinuation
- 1989-07-27 EP EP89307686A patent/EP0353083A3/en not_active Withdrawn
- 1989-07-27 CN CN89107302A patent/CN1040183A/zh active Pending
- 1989-07-27 AU AU38999/89A patent/AU613218B2/en not_active Ceased
- 1989-07-27 ZA ZA895724A patent/ZA895724B/xx unknown
- 1989-07-27 JP JP1195396A patent/JPH02120210A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
EP0353083A3 (en) | 1990-04-18 |
US4875972A (en) | 1989-10-24 |
NO893048L (no) | 1990-01-29 |
JPH02120210A (ja) | 1990-05-08 |
BR8903712A (pt) | 1990-03-20 |
AU3899989A (en) | 1990-02-01 |
EP0353083A2 (en) | 1990-01-31 |
NZ230079A (en) | 1990-08-28 |
PT91281A (pt) | 1990-02-08 |
FI893578A (fi) | 1990-01-28 |
CN1040183A (zh) | 1990-03-07 |
IL91112A0 (en) | 1990-03-19 |
KR910003148A (ko) | 1991-02-27 |
AU613218B2 (en) | 1991-07-25 |
FI893578A0 (fi) | 1989-07-26 |
DK368389A (da) | 1990-01-28 |
NO893048D0 (no) | 1989-07-26 |
DK368389D0 (da) | 1989-07-26 |
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