ZA8589B - High temperature stable adhesive compositions employing aromatic polyimide and polyisoimide bis-acetylene additives - Google Patents
High temperature stable adhesive compositions employing aromatic polyimide and polyisoimide bis-acetylene additivesInfo
- Publication number
- ZA8589B ZA8589B ZA8589A ZA8589A ZA8589B ZA 8589 B ZA8589 B ZA 8589B ZA 8589 A ZA8589 A ZA 8589A ZA 8589 A ZA8589 A ZA 8589A ZA 8589 B ZA8589 B ZA 8589B
- Authority
- ZA
- South Africa
- Prior art keywords
- polyisoimide
- acetylene
- bis
- additives
- high temperature
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/574,448 US4532270A (en) | 1984-01-27 | 1984-01-27 | High temperature stable adhesive compositions employing aromatic polyimide and polyisoimide bis-acetylene additives |
Publications (1)
Publication Number | Publication Date |
---|---|
ZA8589B true ZA8589B (en) | 1985-10-30 |
Family
ID=24296179
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ZA8589A ZA8589B (en) | 1984-01-27 | 1985-01-04 | High temperature stable adhesive compositions employing aromatic polyimide and polyisoimide bis-acetylene additives |
Country Status (10)
Country | Link |
---|---|
US (1) | US4532270A (fr) |
EP (1) | EP0156038B1 (fr) |
JP (1) | JPS60170683A (fr) |
AU (1) | AU558226B2 (fr) |
CA (1) | CA1251798A (fr) |
DE (1) | DE3483004D1 (fr) |
DK (1) | DK33785A (fr) |
FI (1) | FI78494C (fr) |
NO (1) | NO166950C (fr) |
ZA (1) | ZA8589B (fr) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4644040A (en) * | 1984-01-27 | 1987-02-17 | National Starch And Chemical Corporation | High temperature stable acrylic adhesive compositions employing aromatic polyimide and polyisoimide bis-acetylene additives |
US4522967A (en) * | 1984-06-08 | 1985-06-11 | Kimberly-Clark Corporation | Heat sealable water dispersible adhesive |
US6136949A (en) * | 1998-09-03 | 2000-10-24 | The Dow Chemical Company | Resins containing phenylethynl-terminated compounds |
US6727320B2 (en) * | 1998-11-02 | 2004-04-27 | Henkel Loctite Corporation | Polymerizable compositions in non-flowable forms |
US7041747B1 (en) | 1998-11-02 | 2006-05-09 | Henkel Corporation | Polymerizable compositions in non-flowable forms |
US7144956B2 (en) * | 1998-11-02 | 2006-12-05 | Henkel Corporation | Polymerizable compositions in non-flowable forms |
WO2000025628A1 (fr) * | 1998-11-02 | 2000-05-11 | Loctite Corporation | Compositions polymerisables sous formes non fluides |
US7408010B1 (en) | 2001-10-29 | 2008-08-05 | Henkel Corporation | Primer compositions in non-flowable forms |
US8302794B2 (en) * | 2006-04-28 | 2012-11-06 | Berry Plastics Corporation | Tamper-evident closure with directional molded retention tabs |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3639348A (en) * | 1968-06-28 | 1972-02-01 | Ciba Geigy Corp | Copolymers of propargyl methacrylate and acrylate |
US3845018A (en) * | 1973-04-03 | 1974-10-29 | Hughes Aircraft Co | Acetylene substituted polyamide oligomers |
US3879349A (en) * | 1973-11-12 | 1975-04-22 | Hughes Aircraft Co | Homopolymerization of acetylene substituted polyimide polymers |
US3988299A (en) * | 1974-10-10 | 1976-10-26 | Loctite Corporation | Anaerobic adhesive composition having improved strength at elevated temperature consisting of unsaturated diacrylate monomer and maleimide additive |
US4098767A (en) * | 1974-11-25 | 1978-07-04 | Hughes Aircraft Company | Copolymers of ethynyl terminated polyimides and diethynylbenzene |
US4100138A (en) * | 1975-05-12 | 1978-07-11 | Hughes Aircraft Company | Ethnyl terminated polyimide composites |
US4208477A (en) * | 1977-12-26 | 1980-06-17 | Asahi Kasei Kogyo Kabushiki Kaisha | Heat resistant photoresist composition and process for preparing the same |
CH635828A5 (de) * | 1978-08-30 | 1983-04-29 | Ciba Geigy Ag | N-substituierte imide und bisimide. |
DE3017619A1 (de) * | 1980-05-08 | 1981-11-12 | Basf Ag, 6700 Ludwigshafen | Verfahren zur herstellung von cyclopentadien-copolymerisaten |
US4404139A (en) * | 1980-10-22 | 1983-09-13 | Plastics Engineering Company | Addition products of terminally unsaturated polyimide derivatives with a diaryl conjugated butadiyne |
US4431792A (en) * | 1980-10-23 | 1984-02-14 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Thermoset-thermoplastic aromatic polyamide containing N-propargyl groups |
DE3046802A1 (de) * | 1980-12-12 | 1982-07-15 | Basf Ag, 6700 Ludwigshafen | Ethylen-alkin-copolymerisate, deren herstellung und verwendung als zusatz zu erdoeldestillaten |
US4438273A (en) * | 1981-07-24 | 1984-03-20 | Hughes Aircraft Company | Isoimide containing oligomers |
US4405770A (en) * | 1981-08-12 | 1983-09-20 | National Starch And Chemical Corporation | Novel polyimides, and polyamic acid and ester intermediates thereof |
US4381363A (en) * | 1981-09-10 | 1983-04-26 | The United States Of America As Represented By The Secretary Of The Air Force | Cure retarding additives for acetylene-terminated polymers |
US4365034A (en) * | 1981-09-21 | 1982-12-21 | The United States Of America As Represented By The Secretary Of The Air Force | Acetylene-terminated polyimide compositions |
-
1984
- 1984-01-27 US US06/574,448 patent/US4532270A/en not_active Expired - Fee Related
- 1984-12-29 EP EP84116502A patent/EP0156038B1/fr not_active Expired - Lifetime
- 1984-12-29 DE DE8484116502T patent/DE3483004D1/de not_active Expired - Fee Related
-
1985
- 1985-01-02 AU AU37268/85A patent/AU558226B2/en not_active Ceased
- 1985-01-04 ZA ZA8589A patent/ZA8589B/xx unknown
- 1985-01-09 CA CA000471744A patent/CA1251798A/fr not_active Expired
- 1985-01-25 FI FI850347A patent/FI78494C/fi not_active IP Right Cessation
- 1985-01-25 NO NO850306A patent/NO166950C/no unknown
- 1985-01-25 DK DK33785A patent/DK33785A/da not_active Application Discontinuation
- 1985-01-25 JP JP60011140A patent/JPS60170683A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
NO166950C (no) | 1991-09-18 |
NO166950B (no) | 1991-06-10 |
DE3483004D1 (de) | 1990-09-20 |
AU3726885A (en) | 1985-08-01 |
EP0156038A3 (en) | 1988-04-20 |
US4532270A (en) | 1985-07-30 |
DK33785D0 (da) | 1985-01-25 |
JPS60170683A (ja) | 1985-09-04 |
NO850306L (no) | 1985-07-29 |
EP0156038A2 (fr) | 1985-10-02 |
FI78494B (fi) | 1989-04-28 |
FI78494C (fi) | 1989-08-10 |
EP0156038B1 (fr) | 1990-08-16 |
DK33785A (da) | 1985-07-28 |
AU558226B2 (en) | 1987-01-22 |
FI850347L (fi) | 1985-07-28 |
FI850347A0 (fi) | 1985-01-25 |
CA1251798A (fr) | 1989-03-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
IL86750A (en) | Thermally conductive gel compositions and devices containing them | |
EP0153737A3 (en) | Circuit substrate having high thermal conductivity | |
EP0189643A3 (en) | Polyamic acid solution composition and polyimide film made therefrom | |
EP0224903A3 (en) | Polymer composition having positive temperature coefficient characteristics | |
GB8524320D0 (en) | Circuit arrangements | |
IL76582A0 (en) | Thermally stable adhesive composition | |
GB2168492B (en) | Electronic thermometer | |
GB2160869B (en) | Glutamic and aspartic acid derivatives | |
GB8530958D0 (en) | Electronic thermometer | |
EP0156038A3 (en) | High temperature stable adhesive compositions employing aromatic polyimide and polyisoimide bis-acetylene additives | |
GB2168486B (en) | Electronic thermometer | |
GB8414594D0 (en) | Addition polyimide composition | |
DE3570343D1 (en) | Arrangement for the tension compensation and the heat dissipation of an electronic component | |
GB2156823B (en) | Wax and ink composition for thermal ink transfer abstract of the disclosure | |
AR240562A1 (es) | Composicion aislante pulverizable y espumable para adherir con la misma una capa de material aislante espumado a un sustrato | |
GB2156196B (en) | Edible compositions based on vegetable fibre and lactulose | |
GB2173346B (en) | Microstrip circuit temperature compensation | |
DE3563530D1 (en) | Solder glass and electrical device employing same | |
EP0321398A3 (en) | Autophotocrosslinkable copolyimides and compositions of polyimides | |
GB8512997D0 (en) | Insulating surfaces | |
GB8513194D0 (en) | Insulating components | |
EP0161986A3 (en) | Stable high temperature cables and devices made therefrom | |
GB8414346D0 (en) | Thermal insulators | |
EP0173207A3 (en) | Polyamide-imides with modified end groups | |
AU548519B3 (en) | Stable high temperature cables and devices made therefrom |