ZA763718B - Circuit element - Google Patents

Circuit element

Info

Publication number
ZA763718B
ZA763718B ZA763718A ZA763718A ZA763718B ZA 763718 B ZA763718 B ZA 763718B ZA 763718 A ZA763718 A ZA 763718A ZA 763718 A ZA763718 A ZA 763718A ZA 763718 B ZA763718 B ZA 763718B
Authority
ZA
South Africa
Prior art keywords
circuit element
circuit
Prior art date
Application number
ZA763718A
Other languages
English (en)
Inventor
G Siegle
Original Assignee
Blaupunkt Werke Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Blaupunkt Werke Gmbh filed Critical Blaupunkt Werke Gmbh
Publication of ZA763718B publication Critical patent/ZA763718B/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R19/00—Arrangements for measuring currents or voltages or for indicating presence or sign thereof
    • G01R19/145—Indicating the presence of current or voltage
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Glass Compositions (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Led Devices (AREA)
ZA763718A 1975-06-23 1976-06-22 Circuit element ZA763718B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19752527858 DE2527858A1 (de) 1975-06-23 1975-06-23 Elektrisches bauelement

Publications (1)

Publication Number Publication Date
ZA763718B true ZA763718B (en) 1977-05-25

Family

ID=5949718

Family Applications (1)

Application Number Title Priority Date Filing Date
ZA763718A ZA763718B (en) 1975-06-23 1976-06-22 Circuit element

Country Status (5)

Country Link
BR (1) BR7604044A (pt)
DE (1) DE2527858A1 (pt)
ES (1) ES449149A1 (pt)
FR (1) FR2315700A1 (pt)
ZA (1) ZA763718B (pt)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2097581A (en) * 1981-04-24 1982-11-03 Hitachi Ltd Shielding semiconductor integrated circuit devices from light
DE102015121577B4 (de) * 2015-12-11 2023-06-29 Infineon Technologies Ag Verfahren zur erkennung eines sich abzeichnenden ausfalls eines halbleiterchips eines halbleitermoduls und halbeitermodulanordnung

Also Published As

Publication number Publication date
DE2527858A1 (de) 1977-01-13
BR7604044A (pt) 1977-07-05
FR2315700A1 (fr) 1977-01-21
FR2315700B3 (pt) 1979-03-09
ES449149A1 (es) 1977-08-01

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