ZA202205995B - Preparation method of high-insulation low-temperature electronic packaging material - Google Patents

Preparation method of high-insulation low-temperature electronic packaging material

Info

Publication number
ZA202205995B
ZA202205995B ZA2022/05995A ZA202205995A ZA202205995B ZA 202205995 B ZA202205995 B ZA 202205995B ZA 2022/05995 A ZA2022/05995 A ZA 2022/05995A ZA 202205995 A ZA202205995 A ZA 202205995A ZA 202205995 B ZA202205995 B ZA 202205995B
Authority
ZA
South Africa
Prior art keywords
preparation
packaging material
electronic packaging
temperature electronic
insulation low
Prior art date
Application number
ZA2022/05995A
Inventor
Liu Li
Huang Jun
Wu Huan
Original Assignee
Jiangsu Baifu Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiangsu Baifu Tech Co Ltd filed Critical Jiangsu Baifu Tech Co Ltd
Publication of ZA202205995B publication Critical patent/ZA202205995B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/504—Amines containing an atom other than nitrogen belonging to the amine group, carbon and hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/02—Ingredients treated with inorganic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/382—Boron-containing compounds and nitrogen
    • C08K2003/385—Binary compounds of nitrogen with boron
ZA2022/05995A 2021-10-27 2022-05-30 Preparation method of high-insulation low-temperature electronic packaging material ZA202205995B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN202111252613 2021-10-27
CN202111351812.7A CN113956617A (en) 2021-10-27 2021-11-16 Preparation method of high-insulation low-temperature electronic packaging material
PCT/CN2022/089223 WO2022156832A2 (en) 2021-10-27 2022-04-26 Preparation method for high-insulativity low-temperature electronic packaging material

Publications (1)

Publication Number Publication Date
ZA202205995B true ZA202205995B (en) 2022-10-26

Family

ID=79470646

Family Applications (1)

Application Number Title Priority Date Filing Date
ZA2022/05995A ZA202205995B (en) 2021-10-27 2022-05-30 Preparation method of high-insulation low-temperature electronic packaging material

Country Status (3)

Country Link
CN (1) CN113956617A (en)
WO (1) WO2022156832A2 (en)
ZA (1) ZA202205995B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113956617A (en) * 2021-10-27 2022-01-21 江苏拜富科技股份有限公司 Preparation method of high-insulation low-temperature electronic packaging material
CN117467243B (en) * 2023-12-05 2024-04-09 昆山兴凯半导体材料有限公司 High-heat-conductivity and high-insulativity epoxy composition and application thereof

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101195676B (en) * 2007-12-27 2012-08-22 东莞理工学院 Phosphor A containing novolac epoxy and method for producing the same
CN101633723A (en) * 2009-07-04 2010-01-27 山东兄弟科技股份有限公司 Production method for brominated epoxy resin and produced brominated epoxy resin
CN104311794A (en) * 2014-10-23 2015-01-28 卢儒 Organosilicone modified epoxy resin and preparation method thereof as well as mica capacitor
CN107501610A (en) * 2017-08-30 2017-12-22 桂林电子科技大学 A kind of composite heat interfacial material based on boron nitride and preparation method thereof
CN110157153B (en) * 2018-02-11 2022-02-08 中国科学院深圳先进技术研究院 Epoxy resin/ordered boron nitride composite material and preparation method thereof
CN109535658A (en) * 2018-12-04 2019-03-29 河北工业大学 A kind of hexagonal boron nitride/epoxy resin composite material preparation method of high heat conductance
CN111057347A (en) * 2019-12-10 2020-04-24 西安科技大学 Preparation method of dopamine-modified boron nitride high-thermal-conductivity composite material
KR102123231B1 (en) * 2019-12-17 2020-06-16 국방기술품질원 Silanized silane boron nitride composite and method of preparing same
CN113956617A (en) * 2021-10-27 2022-01-21 江苏拜富科技股份有限公司 Preparation method of high-insulation low-temperature electronic packaging material

Also Published As

Publication number Publication date
WO2022156832A9 (en) 2022-12-01
WO2022156832A2 (en) 2022-07-28
WO2022156832A3 (en) 2022-09-22
CN113956617A (en) 2022-01-21

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