ZA200507277B - A lamp and a process for producing a lamp - Google Patents

A lamp and a process for producing a lamp

Info

Publication number
ZA200507277B
ZA200507277B ZA200507277A ZA200507277A ZA200507277B ZA 200507277 B ZA200507277 B ZA 200507277B ZA 200507277 A ZA200507277 A ZA 200507277A ZA 200507277 A ZA200507277 A ZA 200507277A ZA 200507277 B ZA200507277 B ZA 200507277B
Authority
ZA
South Africa
Prior art keywords
lamp
producing
Prior art date
Application number
ZA200507277A
Inventor
Balu Jeganathan
John A Montagnat
Original Assignee
Lednium Pty Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lednium Pty Ltd filed Critical Lednium Pty Ltd
Publication of ZA200507277B publication Critical patent/ZA200507277B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
ZA200507277A 2003-03-12 2005-09-09 A lamp and a process for producing a lamp ZA200507277B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
AU2003901114A AU2003901114A0 (en) 2003-03-12 2003-03-12 A lamp and a method of producing a lamp

Publications (1)

Publication Number Publication Date
ZA200507277B true ZA200507277B (en) 2006-08-30

Family

ID=31500158

Family Applications (1)

Application Number Title Priority Date Filing Date
ZA200507277A ZA200507277B (en) 2003-03-12 2005-09-09 A lamp and a process for producing a lamp

Country Status (3)

Country Link
CN (2) CN101098576A (en)
AU (1) AU2003901114A0 (en)
ZA (1) ZA200507277B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI481071B (en) * 2012-01-12 2015-04-11 Light-emitting device LED 3D surface lead frame
EP3340296B1 (en) * 2016-12-20 2019-10-02 Melexis Technologies NV Light emitting diode device

Also Published As

Publication number Publication date
AU2003901114A0 (en) 2003-03-27
CN1777991A (en) 2006-05-24
CN101098576A (en) 2008-01-02

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