WO2026007707A1 - 一种调节机构、半导体工艺设备 - Google Patents

一种调节机构、半导体工艺设备

Info

Publication number
WO2026007707A1
WO2026007707A1 PCT/CN2025/102009 CN2025102009W WO2026007707A1 WO 2026007707 A1 WO2026007707 A1 WO 2026007707A1 CN 2025102009 W CN2025102009 W CN 2025102009W WO 2026007707 A1 WO2026007707 A1 WO 2026007707A1
Authority
WO
WIPO (PCT)
Prior art keywords
flange
spray head
cooling
gas spray
mounting flange
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/CN2025/102009
Other languages
English (en)
French (fr)
Inventor
刘�东
贺政康
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beijing Naura Microelectronics Equipment Co Ltd
Original Assignee
Beijing Naura Microelectronics Equipment Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Beijing Naura Microelectronics Equipment Co Ltd filed Critical Beijing Naura Microelectronics Equipment Co Ltd
Publication of WO2026007707A1 publication Critical patent/WO2026007707A1/zh
Pending legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45563—Gas nozzles
    • C23C16/45565—Shower nozzles
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/52—Controlling or regulating the coating process
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment

Definitions

  • This application relates to the field of semiconductor equipment technology, specifically to an adjustment mechanism and semiconductor process equipment.
  • the gas spray head is a core component of CVD (Chemical Vapor Deposition) and ALD (Atomic Layer Deposition) equipment. It is used to introduce process gases into the reaction chamber to form thin films on silicon wafers. During the film formation process, a constant airflow field needs to be maintained between the gas spray head and the silicon wafer. Precise control of the airflow field requires precise adjustment of the distance and level between the gas spray head and the silicon wafer.
  • the adjustment mechanism used to adjust the distance and level between the gas spray head and the silicon wafer after the position and level of the gas spray head are adjusted (the silicon wafer remains horizontal in the reaction chamber), the positioning of the gas spray head is achieved by spring compression. Since the spring is prone to elastic deformation, when the vacuum level in the reaction chamber changes, the gas spray head can easily overcome the spring compression force, causing fluctuations in the distance and level with the silicon wafer, which affects the film formation quality.
  • this application provides an adjustment mechanism that can improve the stability of the gas spray head, thereby improving the quality of thin film formation. Additionally, this application also provides a semiconductor process apparatus having the aforementioned adjustment mechanism.
  • an adjustment mechanism for connecting to a reaction chamber and a gas spray head and adjusting the position between the gas spray head, comprising:
  • a mounting flange is fixedly installed in the reaction chamber, and the gas spray head axially passes through the mounting flange.
  • a movable flange is movable relative to the mounting flange, and the movable flange is connected to the gas spray head;
  • a locking device connected to the mounting flange and the movable flange, is used to lock and unlock the mounting flange and the movable flange;
  • An adjusting component movably connected to the mounting flange and the movable flange, is used to adjust the relative position between the movable flange and the mounting flange, so that the movable flange drives the gas spray head to adjust its position.
  • one of the locking element and the adjusting element is a hollow structure and is sleeved on the outside of the other.
  • the above-described regulating mechanism further includes: a movable flange, which is detachably mounted on the movable flange and thermally connected to the gas spray head, wherein a cooling channel for guiding the cooling medium is provided on the cooling flange.
  • the cooling flange includes a plurality of flanges with different thermal conductivity, each of which can be assembled with the movable flange and cooperate with the mounting flange, the locking fastener, and the adjustment member.
  • the cooling flange in the above-described adjusting mechanism includes at least two annular portions that are stacked and fixedly connected along the axial direction.
  • the movable flange has a first threaded hole
  • the adjusting member is a threaded member that is threadedly connected to the first threaded hole, and one end of the adjusting member passing through the first threaded hole abuts against the mounting flange.
  • the adjusting member is a hollow structure and is sleeved on the outside of the locking fastener, and,
  • the mounting flange has a second threaded hole.
  • One end of the locking fastener that passes through the adjusting member is a threaded end that can be threadedly connected to the second threaded hole.
  • the other end of the locking fastener that does not pass through the adjusting member is provided with a flange that can press against the adjusting member.
  • a protrusion is provided on the end face of the cooling flange that abuts against the movable flange.
  • the protrusion is located in the flange hole of the movable flange and is fixed to and thermally connected to the gas spray head.
  • the cooling channel extends around the protrusion in the circumferential direction of the cooling flange, and the cooling flange is provided with a radially protruding coolant inlet connector and a coolant outlet connector, the two ends of the cooling channel being connected to the coolant inlet connector and the coolant outlet connector respectively.
  • the mounting flange and the movable flange are connected by a bellows, and the gas spray head passes through the bellows.
  • the cooling flange is provided with a purging air passage, and the gas blown out by the purging air passage enters the gap between the bellows and the gas spray head.
  • the purge air path in the above-described regulating mechanism includes:
  • An air inlet connector is located on the cooling flange
  • An annular air passage is provided on the cooling flange and is arranged around the protrusion in the circumferential direction of the cooling flange;
  • Multiple flow equalization holes are connected to the annular air passage and are axially opened on the cooling flange to form multiple air outlets.
  • the mounting flange and the movable flange are connected via a bellows, and,
  • An annular connecting groove is provided on the end face of the mounting flange facing the movable flange, and one end of the bellows is located in the annular connecting groove and connected to the bottom wall of the annular connecting groove.
  • the above-described adjustment mechanism includes a first annular portion and a second annular portion, and a splicing groove is provided on the joint surface of the first annular portion and the second annular portion.
  • the cooling channel is formed by splicing the splicing groove on the first annular portion and the splicing groove on the second annular portion.
  • a semiconductor process apparatus including a reaction chamber, a gas spray head, and an adjustment mechanism connected between the gas spray head and the reaction chamber for adjusting the position of the gas spray head, wherein the adjustment mechanism is the aforementioned adjustment mechanism.
  • the adjustment mechanism provided in this application has a mounting flange fixedly mounted on the reaction chamber.
  • a movable flange is connected to the mounting flange via adjusting components and locking fasteners.
  • a gas spray head is connected to the movable flange and extends into the reaction chamber through the axial direction of the movable flange and the mounting flange.
  • the gas spray head Since the gas spray head is connected to the movable flange, its movement and levelness can be adjusted as the movable flange moves, thereby adjusting the distance and levelness between the gas spray head and the silicon wafer.
  • the mounting flange and the movable flange are locked together (i.e., locked in place) via locking fasteners. This ensures a secure connection between the movable flange and the mounting flange, and consequently, a secure connection between the gas spray head and the reaction chamber. Even if the vacuum level of the reaction chamber changes, the gas spray head will not shift, preventing fluctuations in the distance and levelness between the gas spray head and the silicon wafer.
  • Figure 1 is a schematic diagram of the structure of the adjustment mechanism in conjunction with the gas spray head and the reaction chamber provided in the embodiment of this application;
  • Figure 2 is a top view of Figure 1;
  • Figure 3 is a cross-sectional view of Figure 2;
  • Figure 4 is a top view of the cooling flange
  • Figure 5 is a cross-sectional view of Figure 4.
  • Figure 6 is a cross-sectional view of Figure 5;
  • Figure 7 is a top view of the mounting flange and the movable flange
  • Figure 8 is a cross-sectional view of Figure 7;
  • Figure 9 is a top view of the gas spray head
  • Figure 10 is a cross-sectional view of Figure 9;
  • Figure 11 is a schematic diagram of the connection between the regulating mechanism and the gas spray head and the reaction chamber;
  • Figure 12 is a schematic diagram of the structure of the adjustment mechanism, gas spray head, silicon wafer, and heater.
  • this application embodiment provides an adjustment mechanism 1.
  • This adjustment mechanism 1 is used to install on a semiconductor process equipment to position a gas spray head 2 on the reaction chamber 3 of the semiconductor process equipment, and can adjust the position of the gas spray head 2.
  • the adjustment mechanism 1 mainly includes a mounting flange 11, a movable flange 12, a locking fastener 13, and an adjusting component 14.
  • the mounting flange 11 is fixedly mounted on the reaction chamber 3, specifically on the upper cover of the reaction chamber 3.
  • the mounting flange 11 serves as the mounting base for the movable flange 12, the locking fastener 13, the adjusting component 14, and the gas spray head 2. That is, other components of the adjustment mechanism 1 and the gas spray head 2 are all mounted on the reaction chamber 3 via the mounting flange 11.
  • the movable flange 12 is movably mounted on the mounting flange 11, and the gas spray head 2 is fixedly mounted on the movable flange 12. This allows the movable flange 12 to be moved relative to the mounting flange 11.
  • the gas spray head 2 is moved relative to the reaction chamber 3 (and the silicon wafer 4, which is horizontally and fixedly set in the reaction chamber 3), thereby adjusting the distance and level between the gas spray head 2 and the silicon wafer 4.
  • the distance and level between the gas spray head 2 and the silicon wafer 4 can be adjusted by moving the gas spray head 2 and changing its level.
  • the gas spray head 2 is connected to the moving flange 12
  • the part of the gas spray head 2 located outside the reaction chamber 3 i.e., the through part 22 described later
  • the other part of the gas spray head 2 i.e., the spray part 21 described later
  • the locking fastener 13 is a component that locks and fixes the moving flange 12.
  • the mounting flange 11 and the movable flange 12 can be locked together, preventing the movable flange 12 from changing position relative to the mounting flange 11.
  • This also prevents the gas spray head 2 from changing position relative to the reaction chamber 3 and the silicon wafer 4 inside (position changes include changes in spacing and levelness). This ensures the stable placement of the gas spray head 2 within the reaction chamber 3, preventing fluctuations in the distance and levelness between the gas spray head 2 and the silicon wafer 4 due to changes in the vacuum level of the reaction chamber 3.
  • the locking fastener 13 can unlock the movable flange 12, allowing the movable flange 12 to move the gas spray head 2, thus changing the distance and levelness between the gas spray head 2 and the silicon wafer 4.
  • the adjusting component 14 is used to adjust the position of the movable flange 12 relative to the mounting flange; that is, the adjusting component 14 is used to move the movable flange 12 and the gas spray head 12.
  • the moving parts of the shower head 2, the adjusting element 14, are movably connected to both the mounting flange 11 and the moving flange 12.
  • the movement includes movement, rotation, and extension/retraction.
  • the connection includes contact and natural contact.
  • the adjusting element 14 can move the moving flange 12 relative to the mounting flange 11 through movement, rotation, extension/retraction, and connection (contact or natural contact) with the mounting flange 11 and the moving flange 12.
  • the adjusting element 14 can adjust the distance between the two by rotating relative to the moving flange 12 and contacting the mounting flange 11, thereby driving the gas shower head 2 to move.
  • multiple adjusting elements 14 are provided, which are distributed around the mounting flange 11 and the moving flange 12, for example, at equal intervals (or equal angles) around the circumference. When the adjusting elements 14 at different angles are operated, the levelness of the moving flange 12 and the gas shower head 2 can be changed.
  • the adjustment mechanism 1 described above no longer uses a spring to position the adjusted gas spray head 2. Instead, it uses a locking fastener 13 to lock and fix the adjusted gas spray head 2.
  • This positioning method is less prone to elastic deformation and has a more stable and reliable positioning effect compared to springs, which are prone to elastic deformation. It can achieve a firm positioning of the gas spray head 2. Even if the vacuum level of the reaction chamber 3 changes, the gas spray head 2 will not be displaced, thus avoiding fluctuations in the distance and levelness between the gas spray head 2 and the silicon wafer 4 and ensuring the quality of thin film formation.
  • the spring pressing position on the adjusting component of the gas spray head is different from the support and adjustment position of the gas spray head. This can cause the adjusting component to deform due to uneven force, affecting the control accuracy of the distance and level between the gas spray head and the silicon wafer.
  • one of the locking fastener 13 and the adjusting member 14 can be made into a hollow structure and fitted over the other. That is, the adjusting member 14 can be made into a hollow structure with the locking fastener 13 passing through and positioned inside it. Alternatively, the locking fastener 13 can be made into a hollow structure with the adjusting member 14 passing through and positioned inside it, so that the adjustment point and locking point positions on the mounting flange 11 and the moving flange 12 coincide. By fitting the adjusting member 14 and the locking member together, their positions on the moving flange 12 and the mounting flange 11 coincide.
  • the aforementioned adjustment mechanism 1 also includes a cooling flange 15 detachably mounted on the movable flange 12 and thermally connected to the gas spray head 2.
  • This cooling flange 15 can dissipate heat from the gas spray head 2, thereby achieving heat dissipation.
  • the cooling flange 15 comprises multiple flanges with different thermal conductivity, each of which can be assembled with the movable flange 12 and cooperate with the mounting flange 11, locking fastener 13, and adjustment component 14. In some processes, it is necessary to adjust and control the temperature of the gas spray head 2.
  • the existing adjustment mechanism is a one-piece structure, meaning the entire mechanism is made of a single material with a fixed thermal conductivity.
  • the regulating mechanism 1 in this application is equipped with multiple cooling flanges 15 made of different materials, each with a different thermal conductivity. Therefore, it can provide different heat dissipation effects for the gas spray head 2. It is understood that the cooling flanges 15 are not only detachably connected to the moving flange 12, but also detachably connected to the gas spray head 2.
  • cooling flanges 15 with different thermal conductivity can be replaced with the moving flange 12 and the gas spray head 2 according to the actual situation, and the gas spray head 2 can be subjected to different degrees of temperature change and gas parameter change (the gas parameter change is, for example, selecting a cooling flange 15 of different materials to match the process gas).
  • the gas spray head 2 has more (or less) heat conduction to the cooling flange 15 and heat exchange with the cooling medium in the cooling flange 15, so as to more specifically reduce (or increase) the temperature of the gas spray head 2.
  • the requirements of different process equipment can be met and different functions can be achieved by only replacing a part of the structure of the regulating mechanism 1 (i.e., the cooling flange 15), making the regulating mechanism 1 more versatile.
  • a cooling channel 1501 for guiding the cooling medium is provided on the cooling flange 15. This allows the cooling flange 15 to dissipate heat not only through heat exchange with the environment on its outer surface, but also by allowing the cooling medium to flow inside the cooling flange 15 to remove heat more efficiently.
  • the cooling medium can be a liquid medium with higher heat exchange efficiency, such as cooling water or cooling oil, thus making the cooling flange 15 a liquid-cooled component.
  • the cooling medium flowing in the cooling channel 1501 can be a gas, such as air, thus making the cooling flange 15 an air-cooled component.
  • connection between the movable flange 12 and the gas spray head 2 is indirect.
  • the movable flange 12 is connected to the cooling flange 15, and the cooling flange 15 is connected to the gas spray head 2. That is, the movable flange 12 is connected to the gas spray head 2 through the cooling flange 15.
  • the cooling flange 15 is a component directly connected to the gas spray head 2, thus enabling the cooling flange 15 to have heat dissipation function and improving its heat dissipation efficiency by opening a cooling channel 1501, thereby better controlling the temperature of the gas spray head 2.
  • the gas spray head 2 has a contact surface 24, and as shown in Figure 5, the cooling flange 15 has a first sealing surface 1503.
  • the contact surface 24 and the first sealing surface 1503 are the surfaces where the gas spray head 2 and the cooling flange 15 contact and adhere to each other, respectively. Therefore, the heat on the gas spray head 2 is conducted to the cooling flange 15 through the contact surface 24 and the first sealing surface 1503.
  • the coolant flows in the cooling channel 1501 to carry away the heat conducted from the gas spray head 2 to the cooling flange 15, thereby achieving the cooling of the gas spray head 2.
  • the movable flange 12 has a first threaded hole 121
  • the adjusting member 14 is a threaded member that is threadedly connected to the first threaded hole 121, and one end of the adjusting member 14 passing through the first threaded hole 121 abuts against the mounting flange 11.
  • the adjusting member 14 is a threaded component, such as a bolt or threaded sleeve.
  • a first threaded hole 121 is opened on the movable flange 12 along its axial direction.
  • the adjusting member 14 can be screwed into the first threaded hole 121 to achieve a threaded connection with the first threaded hole 121. As it continues to be screwed, the adjusting member 14 can be screwed until one end protrudes from the first threaded hole 121 and abuts against the mounting flange 11 below the movable flange 12. Furthermore, under the gravity of components such as the movable flange 12, cooling flange 15, and gas spray head 2, the end of the adjusting member 14 protruding from the first threaded hole 121 will always remain in contact with the mounting flange 11.
  • the length of the adjusting member 14 protruding from the first threaded hole 121 can be changed, thereby changing the distance between the movable flange 12 and the mounting flange 11, and realizing the change of position of the movable flange 12 and the gas spray head 2 on it.
  • multiple adjusting members 14 are provided circumferentially on the movable flange 12 and the mounting flange 11.
  • multiple first threaded holes 121 are also circumferentially distributed on the movable flange 12, with each adjusting member 14 passing through one first threaded hole 121 and abutting against the mounting flange 11.
  • the movable flange 12 and the gas spray head 2 on it can be raised and lowered in different parts of the circumference, thereby adjusting the distance and level of the gas spray head 2.
  • a torque wrench can be used to turn the adjusting members 14, thus ensuring that the locking force of each adjusting member 14 is consistent after turning, thereby achieving precise adjustment of the distance and level of the gas spray head 2.
  • the adjusting members 14 are threaded parts, and threaded holes are provided on the movable flange 12 to cooperate with them.
  • the adjusting member 14 can also adopt other structures.
  • the adjusting member 14 can be a telescopic member that is set between the moving flange 12 and the mounting flange 11 and can extend and retract on its own, such as a telescopic sleeve, a scissor mechanism, etc.
  • the adjusting member 14 is a hollow structure and is sleeved on the outside of the locking member 13 (i.e., the adjusting member 14 can be set as a threaded sleeve). Furthermore, the mounting flange 11 is provided with a second threaded hole 111. One end of the locking member 13 that passes through the adjusting member 14 is a threaded end that can be threadedly connected to the second threaded hole 111. The other end of the locking member 13 that does not pass through the adjusting member 14 is provided with a flange that can press against the adjusting member 14.
  • the adjusting member 14 is preferably hollow, and the locking fastener 13 passes through the adjusting member 14 with a through hole.
  • the locking method between the locking fastener 13 and the mounting flange 11 is also selected as a threaded connection, while the locking method with the moving flange 12 is selected as blocking and pressing.
  • the end of the locking fastener 13 that protrudes from the through hole is a threaded end, and the other end that does not protrude from the through hole is provided with a flange.
  • This structure is similar to a bolt, or the locking fastener 13 can be set as a bolt.
  • the mounting flange 11 has a second threaded hole 111.
  • the fastener 13 can be screwed into the second threaded hole 111 for connection.
  • the fastener 13 penetrates deeper into the second threaded hole 111, the flange presses against the adjusting member 14 because the outer diameter of the flange is larger than the inner diameter of the through hole.
  • the adjusting member 14 and the moving flange 12 are locked together by the bolt-like fastener 13. Since the fastener 13 is fitted onto the adjusting member 14, the adjustment point and the fixing point on the moving flange 12 and the mounting flange 11 coincide, allowing opposing forces to cancel each other out and preventing the moving flange 12 from deforming due to bending moment.
  • the fastener 13 and the adjusting member 14 can be coaxially fitted together. That is, the through hole on the adjusting member 14 is preferably a axial hole, and correspondingly, the first threaded hole 121 on the moving flange 12 and the second threaded hole 111 on the mounting flange 11 are also coaxially arranged.
  • the diameter of the second thread on the mounting flange 11 can be smaller than the diameter of the first threaded hole 121 on the moving flange 12.
  • the locking member 13 can also have other structures or types.
  • the locking member 13 can be a magnetic component capable of magnetically connecting with the mounting flange 11, and the magnetic force of the locking member 13 should be greater than the maximum wave force generated when the vacuum level of the reverse chamber changes.
  • the locking fastener 13 can be a hollow structure and sleeved on the outside of the adjusting member 14, that is, the structures of the locking fastener 13 and the adjusting member 14 can be interchanged, so that the locking fastener 13 is a threaded sleeve and the adjusting member 14 is bolt-shaped.
  • the outer locking fastener 13 needs to be threadedly connected to both the first threaded hole 121 and the second threaded hole 111.
  • the inner wall of the locking fastener 13 is also provided with threads, which can cooperate with the threads on the inner adjusting member 14 (the threads on the adjusting member 14 can still be the threads that cooperate with the first threaded hole 121 in Figure 11).
  • the adjusting member 14 and the moving flange 12 are connected through the threads on the inner and outer walls of the locking fastener 13, and the abutting end of the adjusting member 14 abuts against the bottom wall of the second threaded hole 111.
  • the adjusting member 14 When adjusting the position, first, while ensuring the adjusting member 14 does not rotate, tighten the outer locking fastener 13 so that the end of the locking fastener 13 protruding from the first threaded hole 121 disengages from the second threaded hole 111, thereby releasing the locking fixation of the moving flange 12 and the mounting flange 11. Then, while ensuring the locking fastener 13 does not rotate in the first threaded hole 121, tighten the adjusting member 14.
  • the locking fastener 13 and the movable flange 12 can move synchronously relative to the mounting flange 11 through the engagement of the threads, thereby achieving the adjustment of the distance and level of the gas spray head 2.
  • the locking fastener 13 is turned in the opposite direction so that the locking fastener 13 extends into the second threaded hole 111 again to lock the movable flange 12 and the mounting flange 11.
  • the non-rotation of the locking fastener 13 and the adjusting component 14 can be achieved by using a wrench or screwdriver for positioning.
  • multiple adjusting components 14 are provided in the circumferential direction of the moving flange 12 and the mounting flange 11.
  • the number of locking fasteners 13 can be flexibly set when the locking function is normal.
  • one locking fastener 13 can be set in each adjusting component 14 to maximize the working stability and reliability of the adjusting mechanism 1.
  • locking fasteners 13 can be set only in some adjusting components 14, such as one locking fastener 13 in each of the two adjusting components 14 symmetrically arranged among the four circumferentially distributed adjusting components 14.
  • a protrusion 1502 is provided on the end face of the cooling flange 15 that abuts against the moving flange 12.
  • the protrusion 1502 which protrudes along the axial direction of the cooling flange 15, extends into the flange hole of the moving flange 12 and is fixed and thermally connected to the gas spray head 2.
  • the protrusion 1502 is a structure of the cooling flange 15 for connecting with the gas spray head 2. Its extension into the flange hole of the moving flange 12 allows for a more stable and convenient connection with the gas spray head 2.
  • the protrusion 1502 is circular and located at the center of the end face of the moving flange 12.
  • a flange hole penetrating the cooling flange 15 is opened at the center of the protrusion 1502 for the air inlet end 23 of the gas spray head 2 to pass through.
  • the surface of the protrusion 1502 forms a first sealing surface 1503 that connects with and seals the gas spray head 2, while the part of the end face of the cooling flange 15 surrounding the protrusion 1502 forms a second sealing surface 1504 that connects with and seals the moving flange 12.
  • the cooling channel 1501 extends around the protrusion 1502, and the cooling flange 15 is provided with a radially protruding coolant inlet connector 1505 and coolant outlet connector 1506.
  • the two ends of the cooling channel 1501 are connected to the coolant inlet connector 1505 and the coolant outlet connector 1506, respectively.
  • the coolant inlet connector 1505 is connected to an external pipeline to introduce coolant into the cooling channel 1501.
  • the coolant flows in the cooling channel 1501 and absorbs heat from the gas spray head 2. Then, it flows out of the cooling channel 1501 from the coolant outlet connector 1506.
  • the coolant outlet connector 1506 is also connected to an external pipeline to remove the heat-absorbing coolant.
  • the coolant inlet connector 1505 and the coolant outlet connector 1506 are located at the edge of the cooling flange 15 and extend radially along the cooling flange 15.
  • the flange hole of the mounting flange 11 and the flange hole of the movable flange 12 are connected by a bellows 16, and the gas spray head 2 passes through the bellows 16.
  • Radial gaps exist between the protrusion 1502 and the flange hole wall of the movable flange 12, between the gas spray head 2 and the bellows 16, and between the gas spray head 2 and the flange hole wall of the mounting flange 11.
  • a purging gas path is provided on the cooling flange 15. The gas blown out of the purging gas path enters the gap between the bellows 16 and the gas spray head 2.
  • the outlet of the purging gas path is located between the protrusion 1502 and the flange hole wall of the movable flange 12 and is connected to the radial gap, so that the purging gas blown out from the outlet can sequentially pass through the flange hole of the movable flange 12, the bellows 16, and the flange hole of the mounting flange 11 into the reaction chamber 3.
  • process gas needs to be introduced into the reaction chamber 3 to compensate for the pressure in the reaction chamber 3. Therefore, a purging gas path is provided on the cooling flange 15.
  • a bellows 16 is provided between the flange hole of the mounting flange 11 and the flange hole of the moving flange 12 to realize the connection between the two flange holes.
  • the gas spray head 2 connected to the cooling flange 15 passes through the bellows 16.
  • the bellows 16 is chosen because it can expand and contract, thereby ensuring normal adjustment between the moving flange 12 and the mounting flange 11.
  • the material of the bellows 16 is preferably metal.
  • the outlet of the purging gas path is located between the protrusion 1502 and the flange hole wall of the movable flange 12.
  • the inner diameter of the bellows 16 is larger than the inner diameter of the flange hole of the movable flange 12 and the inner diameter of the flange hole of the mounting flange 11.
  • the process gas is sequentially blown into the reaction chamber 3 through the aforementioned multiple radial gaps. This not only achieves pressure compensation but also prevents gas and particles in the reaction chamber 3 from entering the radial gaps, thereby avoiding contamination of the radial gaps. In fact, the blown-out gas can also purge the radial gaps to clean them.
  • the cooling channel 1501 for guiding coolant and the purging air path for guiding gas are both set on the detachable cooling flange 15.
  • the requirements of different process equipment can be met, making the design of the adjustment mechanism 1 more reasonable, lower in cost and more versatile.
  • the purging air path includes: an air inlet connector 1507, an annular air path 1508, and multiple flow equalization holes 1509.
  • the air inlet connector 1507 is protrudingly disposed on the cooling flange 15.
  • the annular air path 1508 is opened on the cooling flange 15 and is arranged around the protrusion 1502 in the circumferential direction of the cooling flange 15.
  • the multiple flow equalization holes 1509 are all connected to the annular air path 1508 and are all axially opened on the cooling flange 15 to form multiple air outlets evenly distributed around the protrusion 1502.
  • the process gas is guided by the annular gas path 1508 to be distributed circumferentially in the protrusion 1502. Then, the process gas is blown into the radial gap from the top of the gas spray head 2 through the flow equalization hole 1509, and an air curtain is formed around the protrusion 1502. After passing through the flange hole of the moving flange 12, the bellows 16 and the flange hole of the mounting flange 11, the air curtain will finally enter the reaction chamber 3 and pass through the upper surface of the silicon wafer 4 for thin film growth.
  • the flange hole of the mounting flange 11 and the flange hole of the movable flange 12 are connected by a bellows 16.
  • An annular connecting groove 112 is formed on the end face of the mounting flange 11 facing the movable flange 12.
  • the bellows 16 extends into the annular connecting groove 112 and connects to the bottom wall of the annular connecting groove 112.
  • the inner diameter of this annular connecting groove 112 is larger than the flange hole of the mounting flange 11, so that the bellows 16 surrounds the outside of the flange hole of the mounting flange 11.
  • the length of the bellows 16 can be increased, thereby allowing the movable flange 12 to have a larger adjustment stroke and a greater adjustment range, resulting in more outstanding performance of the gas spray head 2.
  • the annular connecting groove 112 can be formed to fit the flange hole of the mounting flange 11, that is, the annular connecting groove 112 and the flange hole are combined to form a stepped hole.
  • the end of the stepped hole closer to the moving flange 12 has a larger diameter to become the annular connecting groove 112, and the end of the stepped hole away from the moving flange 12 is the flange hole.
  • the bellows 16 is connected to the stepped surface of the stepped hole.
  • the cooling flange 15 includes at least two annular portions that are stacked and fixedly connected along the axial direction. In actual manufacturing, at least two annular portions can be machined first according to the structure of the cooling flange 15, then these annular portions can be stacked along the axial direction, and finally adjacent annular portions can be welded to ultimately form the cooling flange 15. Manufacturing the cooling flange 15 in this way facilitates the processing and manufacturing of the cooling flange 15 with cooling channels 1501 and purging air passages, reducing the manufacturing difficulty of the cooling flange 15.
  • the annular portion includes a first annular portion 1510 and a second annular portion. Both the first and second annular portions have splicing grooves 1511 on their mating surfaces.
  • the cooling channel 1501 is formed by the splicing grooves 1511 on the first and second annular portions. This arrangement allows for the splicing grooves 1511 to be machined on the annular portion first, and then the circumferentially closed cooling channel 1501 to be formed by the splicing of these grooves. This makes the cooling channel 1501 easier and more convenient to machine. Similarly, the purging air passage on the cooling flange 15 can also be machined in this way.
  • the cooling flange 15 and the moving flange 12, the cooling flange 15 and the gas spray head 2, and the mounting flange 11 and the reaction chamber 3 are all fixedly connected by bolts and threaded holes, and are all sealed by sealing rings.
  • the cooling flange 15 is provided with multiple first through holes 1512 and multiple second through holes 1513
  • the movable flange 12 is provided with multiple third threaded holes 122
  • the gas spray head 2 is provided with multiple fourth threaded holes 25
  • the mounting flange 11 is provided with multiple third through holes 113
  • the reaction chamber 3 is provided with multiple fifth threaded holes 31.
  • bolts pass through the first through holes 1512 and extend into the third threaded holes 122 and are threadedly connected to the third threaded holes 122 to achieve a fixed connection between the cooling flange 15 and the movable flange 12
  • bolts pass through the second through holes 1513 and extend into the fourth threaded holes 25 and are threadedly connected to the fourth threaded holes 25 to achieve a fixed connection between the cooling flange 15 and the gas spray head 2
  • bolts pass through the third through holes 113 and extend into the fifth threaded holes 31 and are threadedly connected to the fifth threaded holes 31 to achieve a fixed connection between the mounting flange 11 and the reaction chamber 3.
  • this application embodiment also provides a semiconductor process apparatus, which includes a reaction chamber 3, a gas spray head 2, and an adjustment mechanism 1 for installing the gas spray head 2 in the reaction chamber 3 and adjusting the position of the gas spray head 2.
  • the adjustment mechanism 1 is the adjustment mechanism 1 described above.

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Abstract

本申请提供了一种调节机构、半导体工艺设备，包括：安装法兰，固定设置于反应腔室，气体喷淋头轴向贯穿所述安装法兰；移动法兰，相对安装法兰可移动，移动法兰与气体喷淋头连接；锁固件，与安装法兰和移动法兰连接，用于实现安装法兰和移动法兰之间的锁固和解锁；调节件，与安装法兰和移动法兰活动连接，用于调节所述移动法兰与安装法兰之间的相对位置，以使移动法兰带动气体喷淋头进行位置调节。上述的调节机构由于使用锁固件对气体喷淋头进行锁固，避免了气体喷淋头与硅片的距离和水平度发生波动。

Description

一种调节机构、半导体工艺设备 技术领域
本申请涉及半导体设备技术领域，具体涉及一种调节机构、半导体工艺设备。
背景技术
气体喷淋头为CVD设备(CVD，全称为Chemical Vapor Deposition，即化学气相沉积设备)、ALD设备(ALD，全称为Atomic Layer Deposition，即原子层沉积设备)的核心部件，用于向反应腔室中输入工艺气体以在硅片上形成薄膜，并且在薄膜生成过程中需要与硅片之间保持恒定的气流场，精确控制气流场就需要对气体喷淋头与硅片之间的距离和水平度进行精确调节。
目前，用于调节气体喷淋头与硅片之间距离和水平度的调节机构，在气体喷淋头的位置和水平度调节完成后(硅片在反应腔室中保持水平不动)，气体喷淋头的定位是通过弹簧压紧的方式实现的，由于弹簧容易发生弹性形变，所以在反应腔室的真空度发生变化时气体喷淋头也容易克服弹簧的压紧力而导致与硅片的距离和水平度发生波动，影响成膜质量。
发明内容
有鉴于此，本申请提供了一种调节机构，其能够提高气体喷淋头的稳定性，进而提高薄膜的生成质量。另外，本申请还提供了具有上述调节机构的一种半导体工艺设备。
为了达到上述目的，本申请提供如下技术方案：
根据本申请的一个方面，公开了一种调节机构，用于连接在反应腔室与气体喷淋头并对所述气体喷淋头之间进行位置调节，包括：
安装法兰，固定设置于所述反应腔室，所述气体喷淋头轴向贯穿所述安装法兰；
移动法兰，相对所述安装法兰可移动，所述移动法兰与所述气体喷淋头连接；
锁固件，与所述安装法兰和所述移动法兰连接，用于实现所述安装法兰和所述移动法兰之间的锁固和解锁；
调节件，与所述安装法兰和所述移动法兰活动连接，用于调节所述移动法兰与所述安装法兰之间的相对位置，以使所述移动法兰带动所述气体喷淋头进行位置调节。
在一些实施例中，所述锁固件和所述调节件中的一者为中空结构，并套设在另一者的外侧。
在一些实施例中，上述调节机构中，还包括：移动法兰，可拆卸地设置在所述移动法兰上，并与所述气体喷淋头导热连接，所述冷却法兰上开设有导流冷却介质的冷却通道。
在一些实施例中，上述调节机构中，所述冷却法兰包括导热系数不同的多个，每个所述冷却法兰均能与所述移动法兰组装且与所述安装法兰、所述锁固件和所述调节件配合。
在一些实施例中，上述调节机构中，所述冷却法兰包括沿轴向层叠设置且固定连接的至少两个环状部。
在一些实施例中，上述调节机构中，所述移动法兰上开设有第一螺纹孔，所述调节件为与所述第一螺纹孔螺纹连接的螺纹件，且所述调节件穿过所述第一螺纹孔的一端与所述安装法兰抵接。
在一些实施例中，上述调节机构中，所述调节件为中空结构并套设在所述锁固件的外侧，并且，
所述安装法兰上开设有第二螺纹孔，所述锁固件的穿过所述调节件的一端为能与所述第二螺纹孔螺纹连接的螺纹端，所述锁固件的未穿过所述调节件的另一端设置有能抵压所述调节件的凸缘。
在一些实施例中，上述调节机构中，所述冷却法兰与所述移动法兰抵接的端面上设置有凸起部，所述凸起部位于所述移动法兰的法兰孔中并与所述气体喷淋头固定且导热连接。
在一些实施例中，上述调节机构中，在所述冷却法兰的周向上，所述冷却通道环绕所述凸起部延伸，且所述冷却法兰上设置有径向凸出的冷却液导入接头和冷却液导出接头，所述冷却通道的两端分别与所述冷却液导入接头和所述冷却液导出接头连通。
在一些实施例中，上述调节机构中，所述安装法兰和所述移动法兰之间通过波纹管连通，且所述气体喷淋头穿设所述波纹管内；
所述冷却法兰上设置有吹扫气路，所述吹扫气路吹出的气体进入所述波纹管和所述气体喷淋头之间的间隙。
在一些实施例中，上述调节机构中，所述吹扫气路包括：
进气接头，设置在所述冷却法兰上；
环形气路，设置在所述冷却法兰上，并在所述冷却法兰的周向上环绕所述凸起部设置；
多个匀流孔，均与所述环形气路连通，并均轴向开设在所述冷却法兰上，以形成多个出气口。
在一些实施例中，上述调节机构中，所述安装法兰和所述移动法兰通过波纹管连通，并且，
所述安装法兰的朝向所述移动法兰的端面上开设有环形连接槽，所述波纹管的一端位于所述环形连接槽中并与所述环形连接槽的底壁连接。
在一些实施例中，上述调节机构中，所述环状部包括第一环状部和第二环状部，且所述第一环状部和所述第二环状部的接合面上均开设有拼接凹槽，所述冷却通道通过所述第一环状部上的拼接凹槽与所述第二环状部上的拼接凹槽拼合而形成。
根据本申请的另一个方面，还公开了一种半导体工艺设备，包括反应腔室、气体喷淋头以及连接在所述气体喷淋头与所述反应腔室之间并对所述气体喷淋头进行位置调节的调节机构，所述调节机构为上述的调节机构。
本申请提供的调节机构，安装法兰固定设置在反应腔室上，移动法兰通过调节件和锁固件连接在安装法兰上，气体喷淋头又连接在移动法兰上，并沿移动法兰和安装法兰的轴向穿过移动法兰和安装法兰后伸入到反应腔室中，并且，在锁固件保持解锁的状态下，在移动法兰的周向上分布的多调节件能够对移动法兰进行位置调节，也就是使移动法兰的整体或局部沿轴向靠近或远离安装法兰，由于气体喷淋头连接在移动法兰上，所以随着移动法兰的移动能够使气体喷淋头移动以及改变水平度，进而实现气体喷淋头与硅片之间距离和水平度的调节，在调节完成后，再通过锁固件实现安装法兰和移动法兰之间的锁固(即锁止固定)，如此就可以实现移动法兰和安装法兰的牢固连接，也就是实现了气体喷淋头和反应腔室的牢固连接，即使反应腔室的真空度发生变化，气体喷淋头也不会产生位移，避免了气体喷淋头与硅片的距离和水平度发生波动。
附图说明
为了更清楚地说明本申请实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据提供的附图获得其他的附图。
图1为本申请实施例提供的调节机构与气体喷淋头、反应腔室配合的结构示意图；
图2为图1的俯视图；
图3为图2的剖视图；
图4为冷却法兰的俯视图；
图5为图4的剖视图；
图6为图5的剖视图；
图7为安装法兰和移动法兰的俯视图；
图8为图7的剖视图；
图9为气体喷淋头的俯视图；
图10为图9的剖视图；
图11为调节机构与气体喷淋头、反应腔室连接的结构示意图；
图12为调节机构、气体喷淋头与硅片、加热器配合的结构示意图。
在图1-图12中：
1-调节机构，2-气体喷淋头，3-反应腔室，4-硅片，5-加热器；
11-安装法兰，12-移动法兰，13-锁固件，14-调节件，15-冷却法兰，16-
波纹管，17-第一密封圈，18-第二密封圈，19-第三密封圈；
111-第二螺纹孔，112-环形连接槽，113-第三通孔；
121-第一螺纹孔，122-第三螺纹孔，123-第二密封槽；
1501-冷却通道，1502-凸起部，1503-第一密封面，1504-第二密封面，
1505-冷却液导入接头，1506-冷却液导出接头，1507-进气接头，1508-环形气路，1509-匀流孔，1510-第一环状部，1511-拼接凹槽，1512-第一通孔，1513-第二通孔；
21-喷淋部，22-穿设部，23-进气端，24-接触面，25-第四螺纹孔，26-
第一密封槽；
31-第五螺纹孔，32-第三密封槽。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
如图1-图12所示，本申请实施例提供了一种调节机构1，该调节机构1用于安装在半导体工艺设备上以将气体喷淋头2设置在半导体工艺设备的反应腔室3上，并能够对气体喷淋头2进行位置调节，该调节机构1主要包括安装法兰11、移动法兰12、锁固件13和调节件14，其中，安装法兰11固定设置在反应腔室3上，具体可以设置在反应腔室3的上盖上，安装法兰11为移动法兰12、锁固件13、调节件14和气体喷淋头2等部件的安装基础，即，调节机构1的其他组成部件以及气体喷淋头2都通过安装法兰11实现在反应腔室3上的安装；移动法兰12可移动地设置在安装法兰11上，并且将气体喷淋头2固定设置在移动法兰12上，从而通过使移动法兰12相对于安装法兰11移动带动气体喷淋头2相对于反应腔室3(以及水平且固定的设置在反应腔室3中的硅片4)的移动，进而实现气体喷淋头2与硅片4之间距离和水平度的调节(由于硅片4固定不动地放置在反应腔室3内的加热器5上，所以通过使气体喷淋头2移动以及水平度发生改变，就能实现气体喷淋头2与硅片4之间距离和水平度的调节)，气体喷淋头2与移动法兰12连接时，先使气体喷淋头2位于反应腔室3外部的部分(即后述的穿设部22)沿轴向穿过安装法兰11、后述的波纹管16和移动法兰12再进行连接，同时气体喷淋头2的另一部分(即后述的喷淋部21)则位于反应腔室3中以用于向硅片4喷淋工艺气体；锁固件13为锁止固定移动法兰12的部件，在移动法兰12带动气体喷淋头2移动到位后，通过操作锁固件13就能够实现安装法兰11和移动法兰12之间的锁固，使得移动法兰12无法再相对于安装法兰11发生位置改变，从而也就使气体喷淋头2无法再相对于反应腔室3及其内部的硅片4发生位置改变(位置改变包括间距改变和水平度改变)，进而实现气体喷淋头2在反应腔室3内的稳定设置，避免因反应腔室3的真空度发生变化而导致气体喷淋头2与硅片4的距离和水平度发生波动，当需要调节气体喷淋头2的位置时，锁固件13则能够实现对移动法兰12的解锁，使得移动法兰12能够带动气体喷淋头2移动，实现气体喷淋头2与硅片4的距离以及水平度的改变；调节件14用来调节移动法兰12相对于安装法兰的位置，也就是说调节件14为带动移动法兰12及其上的气体喷淋头2移动的部件，调节件14与安装法兰11和移动法兰12均活动连接，活动包括移动、转动和自身的伸缩等，连接包括抵接、自然接触等，也就是说，调节件14可以通过移动、转动和自身的伸缩等动作方式以及与安装法兰11和移动法兰12的连接(抵接或自然接触等)配合方式实现移动法兰12相对于安装法兰11的移动，例如调节件14可以通过相对于移动法兰12转动以及与安装法兰11抵接的方式实现两者之间的间距调节，以此来带动气体喷淋头2移动，更优地，调节件14还设置有多个，这些调节件14在安装法兰11和移动法兰12的周向上分布，例如在周向上等间距(或者说等角度)分布，当分别操作不同角度的调节件14时，就可以改变移动法兰12和气体喷淋头2的水平度。上述结构的调节机构1，与现有技术中的调节机构相比，一方面，不再使用弹簧压紧的方式来定位调节后的气体喷淋头2，而是使用锁固件13来锁止固定调节后的气体喷淋头2，此种定位方式更不容易发生弹性形变，相对于容易发生弹性变形的弹簧而言，具有更加稳定、可靠的定位效果，能够实现对气体喷淋头2的牢固定位，即使反应腔室3的真空度发生变化，气体喷淋头2也不会产生位移，避免了气体喷淋头2与硅片4的距离和水平度发生波动，保证了薄膜的生成质量。
在一些现有技术中，调节机构的连接气体喷淋头的调节部件上，弹簧的压紧位置与气体喷淋头的支撑、调节位置不同，会导致调节部件因受力不均衡而发生变形，影响气体喷淋头与硅片之间距离和水平度的控制精度。
而为了解决该技术问题，在上述结构中，可以将锁固件13和调节件14中的一者设置为中空结构，并使其套设在另一者的外侧，也就是说，可以将调节件14设置为中空结构并使锁固件13穿过并设置于调节件14的内部，或者，也可以将锁固件13设置为中空结构并使调节件14穿过并设置于锁固件13的内部，以使安装法兰11和移动法兰12上调节点位置和锁固点位置重合。通过将调节件14和锁定件以套设的方式设置，使得调节件14和锁固件13在移动法兰12和安装法兰11上的设置位置重合，也就是说，移动法兰12和安装法兰11承受锁固力的位置即为承受调节力的位置，又由于这两个力的方向相反，所以如此设置就可以均衡移动法兰12和安装法兰11在轴向上的受力，消除移动法兰12和安装法兰11之间的弯矩而避免受力变形，提高了气体喷淋头2的调节效率和精度。
进一步的，如图1-图6所示，上述的调节机构1还包括可拆卸地设置在移动法兰12上，并与气体喷淋头2导热连接的冷却法兰15，此冷却法兰15能够导出气体喷淋头2的热量，以实现对气体喷淋头2的散热，并且，冷却法兰15包括导热系数不同的多个，每个冷却法兰15均能与移动法兰12组装且与安装法兰11、锁固件13和调节件14配合。在一些工艺中，需要对气体喷淋头2的温度进行调节、控制，但是现有技术中的调节机构为一体式结构，即整个调节机构为单一材料构成，其导热系数是固定不变的，导致调节机构对气体喷淋头2的散热效果无法调节，无法满足多样化的工艺要求。而且，现有技术中一体式结构的调节机构，当其无法满足不同工艺要求时，只能更换整个调节机构，导致生产成本增加。而本申请中的调节机构1通过配备多个材质不同的冷却法兰15，使每个冷却法兰15具有不同的导热系数，因此，能够对气体喷淋头2起到不同的散热效果，并且可以理解的是，冷却法兰15不仅与移动法兰12可以拆卸连接，还与气体喷淋头2之间采用可拆卸连接，因此，可以根据实际情况更换具有不同导热系数的冷却法兰15与移动法兰12、气体喷淋头2连接并使气体喷淋头2进行不同程度的温度改变以及气体参数的改变(气体参数的改变例如为根据工艺气体的不同选用不同材质的冷却法兰15来与其匹配)，使相同冷却条件下气体喷淋头2有更多(或更少)的热量传导给冷却法兰15而与冷却法兰15中的冷却介质进行热交换，更具有针对性的降低(或提高)气体喷淋头2的温度。同时，通过将冷却法兰15与移动法兰12、气体喷淋头2设置为分体结构，可以只更换调节机构1的一部分结构(即冷却法兰15)就能满足不同工艺设备的要求，实现不同的功能，使调节机构1的通用性更高。
为了提升冷却法兰15对气体喷淋头2的散热效率，如图4-6以及图11所示，还使冷却法兰15上开设有导流冷却介质的冷却通道1501，以使冷却法兰15不仅仅通过其外表面与环境换热而实现散热，还可以通过使冷却介质在冷却法兰15的内部流动来更高效率的带走热量，其中的冷却介质可以为换热效率更高的液态介质，例如冷却水或冷却油等，从而使得冷却法兰15为液冷部件，或者，也可以使冷却通道1501中流动的冷却介质为气体，例如空气等，以使冷却法兰15为风冷部件。在本申请中，移动法兰12和气体喷淋头2的连接方式是间接连接，移动法兰12与冷却法兰15连接，而冷却法兰15与气体喷淋头2连接，也就是说，移动法兰12是通过冷却法兰15实现与气体喷淋头2连接的，冷却法兰15为与气体喷淋头2直接连接的部件，所以使冷却法兰15具有散热功能以及通过开设冷却通道1501来提升冷却法兰15的散热效率，能够更好的实现对气体喷淋头2的温度控制。具体的，如图9和图10所示，气体喷淋头2具有接触面24，而如图5所示，冷却法兰15具有第一密封面1503。接触面24和第一密封面1503分别为气体喷淋头2和冷却法兰15彼此相互接触、贴合的表面。因此，气体喷淋头2上的热量通过接触面24和第一密封面1503的接触传导给冷却法兰15，冷却液通过在冷却通道1501中流动以将气体喷淋头2传导给冷却法兰15的热量带走，从而实现对气体喷淋头2的冷却。
在在一些实施例中，如图1-图12所示，移动法兰12上开设有第一螺纹孔121，调节件14为与第一螺纹孔121螺纹连接的螺纹件，且调节件14穿过第一螺纹孔121的一端与安装法兰11抵接。此种结构是通过使调节件14和移动法兰12螺纹配合的方式实现对移动法兰12的调节，具体的，将调节件14设置为螺纹件，例如螺栓或螺套等，与之配合的，在移动法兰12上沿其轴向开设第一螺纹孔121，调节件14能够旋拧伸入到第一螺纹孔121中以实现与第一螺纹孔121的螺纹连接，随着继续旋拧，可以将调节件14旋拧到其一端穿出第一螺纹孔121并与移动法兰12下方的安装法兰11抵接的状态，并且，在移动法兰12、冷却法兰15和气体喷淋头2等部件的重力作用下，调节件14穿出第一螺纹孔121的一端会始终保持与安装法兰11的抵接，之后再旋拧调节件14时，就可以改变调节件14穿出第一螺纹孔121的长度，从而改变移动法兰12和安装法兰11之间的间距，实现对移动法兰12及其上的气体喷淋头2的位置改变。如前述内容，调节件14在移动法兰12和安装法兰11的周向上设置有多个，与之对应的，移动法兰12上开设的第一螺纹孔121也为周向分布的多个，并且使每个调节件14都穿过一个第一螺纹孔121而与安装法兰11抵接，在此种情况下，通过分别旋拧不同位置的调节件14，就能够实现移动法兰12及其上的气体喷淋头2周向上不同局部的升降，从而实现气体喷淋头2距离和水平度的调节，而且，在此种结构中，可以使用扭矩扳手对调节件14进行旋拧，如此就可以保证旋拧后各调节件14的锁紧力一致，从而实现气体喷淋头2距离和水平度的精确调节。调节件14选用螺纹件，并在移动法兰12上开设螺纹孔与其配合，不仅能够通过加工精度较高的螺纹实现对距离和水平度的精细调节，可以使调节精度更高，而且螺纹件和螺纹孔的结构较为简单，便于加工，更加适于在本申请提供的调节机构1上使用。此外，调节件14还可以采用其他结构，例如调节件14可以为设置在移动法兰12和安装法兰11之间、自身能够伸缩的伸缩件，例如伸缩套管、剪叉机构等。
在在一些实施例中实施例中，如图1-图12所示，调节件14为中空结构并套设在锁固件13的外侧(即调节件14可以设置为螺纹套)，并且，安装法兰11上开设有第二螺纹孔111，锁固件13的穿过调节件14的一端为能与第二螺纹孔111螺纹连接的螺纹端，锁固件13的未穿过调节件14的另一端设置有能抵压调节件14的凸缘。其中，一方面，优选调节件14为中空结构，并使锁固件13从开设有通孔的调节件14中穿过；另一方面，锁固件13与安装法兰11的锁固方式也选择为螺纹连接，而与移动法兰12的锁固方式选择为阻挡和抵压，具体的，锁固件13穿出通孔的一端为螺纹端，未穿过通孔的另一端设置有凸缘，此结构类似于螺栓，或者可以将锁固件13设置为螺栓，安装法兰11上开设有第二螺纹孔111，在锁固件13的螺纹端穿出通孔后，可以旋拧进入到第二螺纹孔111而与第二螺纹孔111连接，随着锁固件13向第二螺纹孔111中的深入，由于凸缘的外径大于通孔的内径，所以凸缘会抵压在调节件14上，如此就通过螺栓状的锁固件13实现了对调节件14、移动法兰12的锁固，由于锁固件13被调节件14套设，移动法兰12上以及安装法兰11上调节点位置和固定点位置重合，所以可以使相反的作用力相互抵消以避免移动法兰12产生弯矩而受力变形。进一步的，为了更加充分的抵消移动法兰12和安装法兰11在轴向上的受力，可以使锁固件13和调节件14同轴套设，也就是说，调节件14上开设的上述通孔优选为轴心孔，与之对应的，移动法兰12上的第一螺纹孔121和安装法兰11上的第二螺纹孔111也同轴设置。而采用调节件14套设在锁固件13外侧的设置方式，可以使安装法兰11上第二螺纹的直径小于移动法兰12上的第一螺纹孔121的直径，从而使得调节件14穿出第一螺纹孔121的一端直接抵接在安装法兰11的表面，抵接位置为第二螺纹孔111的开口的外侧环形部位，如此可以提高调节精度以及加工精度。其中，锁固件13也可以为其他结构或类型，例如，锁固件13可以为能够与安装法兰11磁吸连接的磁性件，并且锁固件13的磁吸力大于反向腔室真空度变化时产生的最大波动力。
或者，也可以使锁固件13为中空结构并套设在调节件14的外侧，也就是互换锁固件13和调节件14的结构，以使锁固件13为螺纹套、调节件14为螺栓状，并且，还需要使外侧的锁固件13与第一螺纹孔121和第二螺纹孔111均螺纹连接，同时锁固件13的内壁上也设置有螺纹，此螺纹能与位于内侧的调节件14上的螺纹(调节件14上的螺纹仍可以为图11中与第一螺纹孔121配合的螺纹)配合，以通过锁固件13内壁和外壁的螺纹实现调节件14和移动法兰12的连接，且调节件14的抵接端抵接在第二螺纹孔111的底壁上。在进行位置调节时，首先在保证调节件14不转动的情况下旋拧外侧的锁固件13，以使锁固件13穿出第一螺纹孔121的一端从第二螺纹孔111中脱出，从而解除移动法兰12和安装法兰11的锁止固定，然后在保证锁固件13不在第一螺纹孔121中转动的情况下旋拧调节件14，由于调节件14抵接在安装法兰11的第二螺纹孔111的底壁上，且调节件14上的螺纹与锁固件13内壁上的螺纹啮合，所以旋拧调节件14就能够通过螺纹的啮合使锁固件13和移动法兰12(由于锁固件13在第一螺纹孔121中不转动，所以此时的锁固件13和移动法兰12可视为固定连接)相对于安装法兰11同步移动，从而实现对气体喷淋头2的距离和水平度的调节，最后，在保证调节件14不转动的情况下反向旋拧锁固件13，以使锁固件13再次伸入到第二螺纹孔111中以实现移动法兰12和安装法兰11的锁固。其中，锁固件13、调节件14的不转动可以通过使用扳手或螺丝刀定位的方式实现。
需要说明的是，为了实现对气体喷淋头2水平度的调节，调节件14在移动法兰12和安装法兰11的周向上设置有多个，且在调节件14和锁固件13套设的情况下，在锁固功能正常实现的情况下，锁固件13的数量可以灵活设置，例如可以在每个调节件14中均设置一个锁固件13以最大程度的提高调节机构1的工作稳定性和可靠性，或者，也可以仅在部分调节件14中设置锁固件13，例如在周向均布的四个调节件14中对称设置的两个调节件14内各设置一个锁固件13。
如图3、图5和图11所示，冷却法兰15与移动法兰12抵接的端面上凸出的设置有凸起部1502，沿冷却法兰15的轴向凸起的凸起部1502伸入到移动法兰12的法兰孔中并与气体喷淋头2固定且导热连接。凸起部1502为冷却法兰15的用于与气体喷淋头2连接的结构，其伸入到移动法兰12的法兰孔中能够更加稳定且更方便的与气体喷淋头2连接，凸起部1502为圆形并位于移动法兰12端面的中心部位，并且凸起部1502的中心开设有贯穿冷却法兰15的法兰孔，以供气体喷淋头2的进气端23穿过，凸起部1502的表面形成与气体喷淋头2连接并密封的第一密封面1503，而冷却法兰15的端面上环绕凸起部1502的部分表面则形成与移动法兰12连接并密封的第二密封面1504。通过设置凸起部1502，能够优化冷却法兰15、气体喷淋头2和移动法兰12的配合结构，提高气体喷淋头2与冷却法兰15的连接稳定性，并且还能提升冷却法兰15对气体喷淋头2的冷却效果，同时也有利于后述向反应腔室3中补偿工艺气体。
进一步的，如图4和图5所示，在冷却法兰15的周向上，冷却通道1501环绕凸起部1502延伸，且冷却法兰15上设置有径向凸出的冷却液导入接头1505和冷却液导出接头1506，冷却通道1501的两端分别与冷却液导入接头1505和冷却液导出接头1506连通。通过使冷却通道1501沿冷却法兰15的周向延伸，不仅能够增长冷却通道1501的长度，而且还能够使冷却通道1501更加均匀的分布在冷却法兰15上，使冷却液可以更加充分的流经冷却法兰15，从而尽可能的提升冷却法兰15的冷却效果。由于气体喷淋头2连接在凸起部1502上，所以使冷却通道1501环绕凸起部1502设置能够更加充分、高效的带走气体喷淋头2传递给冷却法兰15的热量。冷却液导入接头1505与外部管路连接，用于向冷却通道1501中导入冷却液，冷却液在冷却通道1501中流动而吸收气体喷淋头2的热量，之后从冷却液导出接头1506流出冷却通道1501，冷却液导出接头1506也与外部管路连接，以将吸收热量的冷却液送走，为了优化结构、便于管路的连接以及便于螺纹孔等结构在冷却法兰15上的设置，本申请中将冷却液导入接头1505和冷却液导出接头1506设置在冷却法兰15的边缘部位，并使其沿冷却法兰15的径向伸出。
并且，如图3、图8和图11所示，安装法兰11的法兰孔和移动法兰12的法兰孔之间通过波纹管16连通，且气体喷淋头2穿过波纹管16，并且，凸起部1502和移动法兰12的法兰孔壁之间、气体喷淋头2和波纹管16之间、气体喷淋头2和安装法兰11的法兰孔壁之间均具有径向间隙；冷却法兰15上设置有吹扫气路，吹扫气路吹出的气体进入波纹管16和气体喷淋头2之间的间隙，即，吹扫气路的出气口位于凸起部1502和移动法兰12的法兰孔壁之间并与径向间隙连通，以使从出气口吹出的吹扫气体能依次通过移动法兰12的法兰孔、波纹管16和安装法兰11的法兰孔进入到反应腔室3中。在一些工艺中，需要对反应腔室3中充入工艺气体以补偿反应腔室3中的压力，因此在冷却法兰15上设置了吹扫气路，而为了保证工艺气体可以通过吹扫气路进入到反应腔室3中，在安装法兰11的法兰孔和移动法兰12的法兰孔之间设置了波纹管16以实现两个法兰孔的连通，与冷却法兰15连接的气体喷淋头2从波纹管16中穿过，之所以选用波纹管16，是因为波纹管16能够进行伸缩，从而可以保证移动法兰12和安装法兰11之间的正常调节，同时为了更好的适用于不同的工艺气体，同时也为了延长波纹管16的寿命，波纹管16的材质优选为金属。吹扫气路的出气孔位于凸起部1502和移动法兰12的法兰孔壁之间，波纹管16的内径大于移动法兰12的法兰孔内径以及安装法兰11的法兰孔内径，并通过上述多个径向间隙的设置，使得工艺气体可以顺利的进入到反应腔室3中而实现压力补偿，从而可以在其他工艺气体流量变化时，通过改变此路气体的流量来平衡反应腔室3内的压力。
并且，工艺气体依次通过上述多个径向间隙吹入到反应腔室3中，在实现压力补偿的同时，还能够避免反应腔室3中的气体和颗粒进入到径向间隙中，从而避免对径向间隙造成污染，甚至吹出的气体还可以对径向间隙进行吹扫，以对径向间隙进行清洁。
在上述结构中，将导流冷却液的冷却通道1501、导流气体的吹扫气路均设置在可拆卸的冷却法兰15上，可以使调节机构1的结构得到优化，功能布局更加合理，即，将水路、气路及气体喷淋头2的连接结构均设置在了冷却法兰15上，而安装法兰11和移动法兰12仅起到调节气体喷淋头2距离和水平度的作用，从而通过仅更换冷却法兰15就可以满足不同的工艺设备要求，使调节机构1的设计更合理、成本更低，通用性更高。
如图2-图5以及图11所示，吹扫气路包括：进气接头1507、环形气路1508和多个匀流孔1509，进气接头1507凸出地设置在冷却法兰15上；环形气路1508开设在冷却法兰15上，并在冷却法兰15的周向上环绕凸起部1502设置；多个匀流孔1509均与环形气路1508连通，并均轴向开设在冷却法兰15上，以形成环绕凸起部1502均匀分布的多个出气口。通过如此设置吹扫气路，能够使工艺气体从进气接头1507进入到环形气路1508中，通过环形气路1508的导流使工艺气体在凸起部1502的周向分布，然后工艺气体再通过匀流孔1509使工艺气体从气体喷淋头2的上部吹入到径向间隙中，并且在凸起部1502的周围形成气帘，气帘经过移动法兰12的法兰孔、波纹管16和安装法兰11的法兰孔后，最后会进入到反应腔室3中并经过硅片4的上表面以进行薄膜生长。
在在一些实施例中，如图8所示，安装法兰11的法兰孔和移动法兰12的法兰孔之间通过波纹管16连通，并且，安装法兰11的朝向移动法兰12的端面上开设有环形连接槽112，波纹管16伸入到环形连接槽112中并与环形连接槽112的底壁连接。此环形连接槽112的内径大于安装法兰11的法兰孔，以使波纹管16包围在安装法兰11的法兰孔外侧。其中，通过开设环形连接槽112并使波纹管16连接在槽底壁上，可以增大波纹管16的长度，从而使得移动法兰12可以具有更大的调节行程，调节量更大，气体喷淋头2的工作性能更加突出。具体的，环形连接槽112可以与安装法兰11的法兰孔配合成型，即把环形连接槽112和法兰孔组合形成阶梯孔，阶梯孔的靠近移动法兰12的一端具有更大的直径以成为环形连接槽112，阶梯孔的远离移动法兰12的一端为法兰孔，波纹管16连接在阶梯孔的阶梯面上。
另外，冷却法兰15包括沿轴向层叠设置且固定连接的至少两个环状部。在具体加工时，可以先根据冷却法兰15的结构加工出至少两个环状部，然后再沿轴向层叠设置这些环状部，最后再焊接相邻的环状部而最终使冷却法兰15成型。通过此种方式制造冷却法兰15，便于设置有冷却通道1501、吹扫气路的冷却法兰15的加工制造，降低了冷却法兰15的制造难度。
其中，如图4-图6所示，环状部包括第一环状部1510和第二环状部，且第一环状部1510和第二环状部的接合面上均开设有拼接凹槽1511，冷却通道1501通过第一环状部1510上的拼接凹槽1511与第二环状部上的拼接凹槽1511拼合而形成。通过如此设置，可以先在环状部上加工出拼接凹槽1511，再通过拼接凹槽1511的拼合形成周向封闭的冷却通道1501，从而使冷却通道1501可以更加简单、方便的加工成型。同样的，冷却法兰15上的吹扫气路也可以通过此种方式加工成型。
本申请中，如图4-图11所示，冷却法兰15和移动法兰12之间、冷却法兰15和气体喷淋头2之间、以及安装法兰11和反应腔室3之间均通过螺栓和螺纹孔的配合实现固定连接，且均通过密封圈实现密封连接。在具体设置时，在冷却法兰15上设置有多个第一通孔1512和多个第二通孔1513，移动法兰12上设置有多个第三螺纹孔122，气体喷淋头2上设置有多个第四螺纹孔25，安装法兰11上设置有多个第三通孔113，反应腔室3上设置有多个第五螺纹孔31，在连接时，螺栓穿过第一通孔1512并伸入到第三螺纹孔122中且与第三螺纹孔122螺纹连接以实现冷却法兰15和移动法兰12的固定连接，螺栓穿过第二通孔1513并伸入到第四螺纹孔25中且与第四螺纹孔25螺纹连接以实现冷却法兰15和气体喷淋头2的固定连接，螺栓穿过第三通孔113并伸入到第五螺纹孔31中且与第五螺纹孔31螺纹连接以实现安装法兰11和反应腔室3的固定连接。同时，气体喷淋头2上开设有第一密封槽26，移动法兰12上开设第二密封槽123，反应腔室3上开设有第三密封槽32，第一密封圈17设置在第一密封槽26中并通过与第一密封面1503抵接而实现冷却法兰15和气体喷淋头2的密封连接，第二密封圈18设置在第二密封槽123中并通过与第二密封面1504抵接而实现冷却法兰15和移动法兰12的密封连接，第三密封圈19设置在第三密封槽32中并通过与安装法兰11抵接而实现安装法兰11和气体反应腔室3的密封连接，从而实现径向间隙与外界的密封隔离，使得工艺气体可以顺利的从吹扫气路进入到反应腔室3中。
另外，本申请实施例还提供了一种半导体工艺设备，其包括反应腔室3、气体喷淋头2以及将气体喷淋头2安装于反应腔室3并对气体喷淋头2进行位置调节的调节机构1，该调节机构1为上述的调节机构1。
由于此半导体工艺设备具有上述的调节机构1，所以半导体工艺设备由调节机构1带来的有益效果请参见上述内容，在此不再赘述。
如图9-图11所示，半导体工艺设备的气体喷淋头2包括：喷淋部21，位于反应腔室3中，并具有均匀分布的多个气体出口；穿设部22，与喷淋部21连通并用于向喷淋部21导流工艺气体，且穿过反应腔室3的上盖、安装法兰11和移动法兰12；进气端23，与穿设部22的远离喷淋部21的一端连通，并穿过冷却法兰15；其中，穿设部22的远离喷淋部21的一端开设有多个第四螺纹孔25和第一密封槽26，以通过与穿过冷却法兰15的螺栓螺纹连接而实现与冷却法兰15的固定连接。此种结构的气体喷淋头2与上述的调节机构1适配，从而能够更加高效和精确的提升调节效果，使薄膜可以高质量生成。
以上结合具体实施例描述了本申请的基本原理，但是，需要指出的是，在本申请中提及的优点、优势、效果等仅是示例而非限制，不能认为这些优点、优势、效果等是本申请的各个实施例必须具备的。另外，上述公开的具体细节仅是为了示例的作用和便于理解的作用，而非限制，上述细节并不限制本申请为必须采用上述具体的细节来实现。
本申请中涉及的器件、装置、设备、系统的方框图仅作为例示性的例子并且不意图要求或暗示必须按照方框图示出的方式进行连接、布置、配置。如本领域技术人员将认识到的，可以按任意方式连接、布置、配置这些器件、装置、设备、系统。诸如“包括”、“包含”、“具有”等等的词语是开放性词汇，指“包括但不限于”，且可与其互换使用。这里所使用的词汇“或”和“和”指词汇“和/或”，且可与其互换使用，除非上下文明确指示不是如此。这里所使用的词汇“诸如”指词组“诸如但不限于”，且可与其互换使用。
还需要指出的是，在本申请的装置、设备和方法中，各部件或各步骤是可以分解和/或重新组合的。这些分解和/或重新组合应视为本申请的等效方案。
提供所公开的方面的以上描述以使本领域的任何技术人员能够做出或者使用本申请。对这些方面的各种修改对于本领域技术人员而言是非常显而易见的，并且在此定义的一般原理可以应用于其他方面而不脱离本申请的范围。因此，本申请不意图被限制到在此示出的方面，而是按照与在此公开的原理和新颖的特征一致的最宽范围。
应当理解，本申请实施例描述中所用到的限定词“第一”、“第二”、“第三”、“第四”、“第五”和“第六”仅用于更清楚的阐述技术方案，并不能用于限制本申请的保护范围。
为了例示和描述的目的已经给出了以上描述。此外，此描述不意图将本申请的实施例限制到在此公开的形式。尽管以上已经讨论了多个示例方面和实施例，但是本领域技术人员将认识到其某些变型、修改、改变、添加和子组合。

Claims (14)

  1. 一种调节机构，其特征在于，用于连接在反应腔室与气体喷淋头之间并对所述气体喷淋头进行位置调节，包括：
    安装法兰，固定设置于所述反应腔室，所述气体喷淋头轴向贯穿所述安装法兰；
    移动法兰，相对所述安装法兰可移动，所述移动法兰与所述气体喷淋头连接；
    锁固件，与所述安装法兰和所述移动法兰连接，用于实现所述安装法兰和所述移动法兰之间的锁固和解锁；
    调节件，与所述安装法兰和所述移动法兰活动连接，用于调节所述移动法兰与所述安装法兰之间的相对位置，以使所述移动法兰带动所述气体喷淋头进行位置调节。
  2. 根据权利要求1所述的调节机构，其特征在于，所述锁固件和所述调节件中的一者为中空结构，并套设在另一者的外侧。
  3. 根据权利要求1所述的调节机构，其特征在于，还包括：
    冷却法兰，可拆卸地设置在所述移动法兰上，并与所述气体喷淋头导热连接，所述冷却法兰上开设有用于导流冷却介质的冷却通道。
  4. 根据权利要求3所述的调节机构，其特征在于，所述冷却法兰包括导热系数不同的多个，每个所述冷却法兰均能与所述移动法兰组装且与所述安装法兰、所述锁固件和所述调节件配合。
  5. 根据权利要求3所述的调节机构，其特征在于，所述冷却法兰包括沿轴向层叠设置且固定连接的至少两个环状部。
  6. 根据权利要求1所述的调节机构，其特征在于，所述移动法兰上开设有第一螺纹孔，所述调节件为与所述第一螺纹孔螺纹连接的螺纹件，且所述调节件穿过所述第一螺纹孔的一端与所述安装法兰抵接。
  7. 根据权利要求1或6所述的调节机构，其特征在于，所述调节件为中空结构并套设在所述锁固件的外侧，并且，
    所述安装法兰上开设有第二螺纹孔，所述锁固件的穿过所述调节件的一端为能与所述第二螺纹孔螺纹连接的螺纹端，所述锁固件的未穿过所述调节件的另一端设置有能抵压所述调节件的凸缘。
  8. 根据权利要求3所述的调节机构，其特征在于，所述冷却法兰与所述移动法兰抵接的端面上设置有凸起部，所述凸起部位于所述移动法兰的法兰孔内并与所述气体喷淋头固定且导热连接。
  9. 根据权利要求8所述的调节机构，其特征在于，在所述冷却法兰的周向上，所述冷却通道环绕所述凸起部延伸，且所述冷却法兰上设置有径向凸出的冷却液导入接头和冷却液导出接头，所述冷却通道的两端分别与所述冷却液导入接头和所述冷却液导出接头连通。
  10. 根据权利要求8所述的调节机构，其特征在于，所述安装法兰和所述移动法兰通过波纹管连通，且所述气体喷淋头穿设在所述波纹管内；
    所述冷却法兰上设置有吹扫气路，所述吹扫气路吹出的气体进入所述波纹管和所述气体喷淋头之间的间隙。
  11. 根据权利要求10所述的调节机构，其特征在于，所述吹扫气路包括：
    进气接头，设置在所述冷却法兰上；
    环形气路，设置在所述冷却法兰上，并在所述冷却法兰的周向上环绕所述凸起部设置；
    多个匀流孔，均与所述环形气路连通，并均轴向开设在所述冷却法兰上，以形成多个出气口。
  12. 根据权利要求1所述的调节机构，其特征在于，所述安装法兰和所述移动法兰通过波纹管连通，并且，
    所述安装法兰的朝向所述移动法兰的端面上开设有环形连接槽，所述波纹管的一端位于所述环形连接槽中并与所述环形连接槽的底壁连接。
  13. 根据权利要求5所述的调节机构，其特征在于，所述环状部包括第一环状部和第二环状部，且所述第一环状部和所述第二环状部的接合面上均开设有拼接凹槽，所述冷却通道通过所述第一环状部上的拼接凹槽与所述第二环状部上的拼接凹槽拼合而形成。
  14. 一种半导体工艺设备，其特征在于，包括反应腔室、气体喷淋头以及连接在所述气体喷淋头与所述反应腔室之间并对所述气体喷淋头进行位置调节的调节机构，所述调节机构为权利要求1-13中任一项所述的调节机构。
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CN119194405A (zh) * 2024-07-01 2024-12-27 北京北方华创微电子装备有限公司 一种调节机构、半导体工艺设备

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