WO2025246732A1 - 发光模块、打印头及图像形成设备 - Google Patents

发光模块、打印头及图像形成设备

Info

Publication number
WO2025246732A1
WO2025246732A1 PCT/CN2025/090274 CN2025090274W WO2025246732A1 WO 2025246732 A1 WO2025246732 A1 WO 2025246732A1 CN 2025090274 W CN2025090274 W CN 2025090274W WO 2025246732 A1 WO2025246732 A1 WO 2025246732A1
Authority
WO
WIPO (PCT)
Prior art keywords
light
light source
emitting module
driving circuit
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/CN2025/090274
Other languages
English (en)
French (fr)
Inventor
宿斯凯
雷淑仪
刘苍
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huawei Technologies Co Ltd
Original Assignee
Huawei Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Technologies Co Ltd filed Critical Huawei Technologies Co Ltd
Publication of WO2025246732A1 publication Critical patent/WO2025246732A1/zh
Pending legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G15/00—Apparatus for electrographic processes using a charge pattern
    • G03G15/04—Apparatus for electrographic processes using a charge pattern for exposing, i.e. imagewise exposure by optically projecting the original image on a photoconductive recording material
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G15/00—Apparatus for electrographic processes using a charge pattern
    • G03G15/04—Apparatus for electrographic processes using a charge pattern for exposing, i.e. imagewise exposure by optically projecting the original image on a photoconductive recording material
    • G03G15/043—Apparatus for electrographic processes using a charge pattern for exposing, i.e. imagewise exposure by optically projecting the original image on a photoconductive recording material with means for controlling illumination or exposure

Definitions

  • This application relates to the field of image forming technology, and in particular to a light-emitting module, a print head, and an image forming device.
  • Image forming devices such as printers, copiers, fax machines, and display devices may include a light-emitting module.
  • the light-emitting module may include multiple light sources arranged in an array and multiple driving circuits corresponding to each of the multiple light sources.
  • the driving circuits are electrically connected to the corresponding light sources to drive the corresponding light sources to emit light.
  • the heat generated by the light source of the light-emitting module can easily affect the driving circuit, causing the performance of the driving circuit to drift or fail, which in turn affects the performance and lifespan of the light-emitting module.
  • This application provides a light-emitting module, a printhead, and an image forming apparatus, wherein the light emitted by the light-emitting module does not easily affect the performance of the driving circuit.
  • a first aspect of this application provides a light-emitting module, which includes a substrate, a driving circuit array, and a light source array.
  • the driving circuit array is disposed to the side of the light source array in a first direction, and the distance between the driving circuit array and the light source array in the first direction is greater than zero.
  • the light source array includes multiple light sources, and the driving circuit array includes multiple driving circuits corresponding one-to-one with the multiple light sources.
  • the light sources are electrically connected to their corresponding driving circuits via electrical connection lines.
  • the first direction is perpendicular to the thickness direction of the substrate, and the substrate is a glass substrate.
  • the light-emitting module provided in this application embodiment can increase the spacing between the driving circuit array and the light source array by utilizing the dimensions of the substrate in the length and width directions. This reduces the impact of heat generated by the light source on the driving circuit, making the performance of the driving circuit less prone to drift or failure, thus maintaining the performance of the light-emitting module and extending its service life. Furthermore, by placing the driving circuit array to the side of the light source array in the first direction, the size of the driving circuit is no longer limited by the center distance between two adjacent light sources in the light source array. This lowers the size requirements for the driving circuit, allowing for the use of a glass substrate as the substrate for high-resolution image forming equipment, thus reducing restrictions on substrate selection. In addition, using a glass substrate as the substrate for the light-emitting module results in lower costs, leading to a lower overall cost for the light-emitting module.
  • the light source array includes n groups of light sources distributed along a second direction
  • the driving circuit array includes n groups of driving circuits distributed along the second direction, each group of driving circuits corresponding to a group of light sources.
  • the second direction at least a portion of the driving circuit group is located between the two ends of the corresponding light source group.
  • Each light source group includes multiple light sources distributed along the second direction
  • each driving circuit group includes multiple driving circuits corresponding one-to-one with the multiple light sources in the corresponding light source group.
  • the second direction is perpendicular to the thickness direction of the substrate and perpendicular to the first direction, and n is an integer greater than or equal to 2.
  • each light source group contains m light sources, where m is an integer greater than or equal to 2. This ensures that the drive circuits in each drive circuit group have the same arrangement, reducing the likelihood of different parasitic capacitances in different drive circuit groups due to variations in their arrangement, thus improving the uniformity of light emission from the light-emitting module.
  • all the driving circuits are located on the same side of the light source array in the first direction.
  • the driving circuits have less impact on the routing of data lines, scan lines, and other lines, making the routing of data lines, scan lines, and other lines easier.
  • the two ends of the drive circuit extend along a second direction in the length direction.
  • all drive circuits are distributed along a first direction.
  • the drive circuits are formed along the length or width direction of the substrate, making it easier to control the forming direction of the drive circuits during formation, thus facilitating the formation of the drive circuits on the substrate.
  • the distribution of all drive circuits in the same group along the first direction facilitates the arrangement of a large number of drive circuits within a single group, making it easier to implement the arrangement of drive circuits in high-resolution image forming equipment.
  • the driving circuit includes a first end, which is one end of the driving circuit along its length.
  • the first ends of the driving circuits located on the same side of the light source array in the first direction have the same orientation.
  • the first ends of the driving circuits located on the same side of the light source array in the first direction are arranged in a straight line along the first direction.
  • the size of the driving circuit group in the second direction is smaller.
  • the electrical connection line includes a circuit connection segment, which is a straight line extending at both ends along a second direction, with one end of the circuit connection segment connected to the driving circuit. This facilitates ensuring that the projection of the electrical connection line in the thickness direction of the substrate does not intersect with the projections of all the driving circuits in the thickness direction of the substrate.
  • the driving circuit includes a first end, which is one end along the length of the driving circuit.
  • the first ends of the driving circuits located on the same side of the light source array in the first direction have the same orientation.
  • the first ends of the driving circuits located on the same side of the light source array in the first direction, away from the light source array protrude beyond the first ends of the driving circuits closer to the light source array.
  • the driving circuit can be connected to the electrical connection lines by means of the side facing the light source array, which reduces the space required for the circuit connection segment in the second direction. This allows for the arrangement of driving circuits with a larger size in the second direction. When the space for arranging the driving circuit group and its electrical connection lines is fixed in the second direction, the size requirements for the driving circuit can be reduced.
  • the electrical connection line includes a circuit connection segment, which is a straight line extending at both ends along a first direction, and one end of the circuit connection segment is connected to a driving circuit.
  • the circuit connection segment is a straight line extending at both ends along a second direction
  • the corners of the electrical connection line's projection in the thickness direction of the substrate can be reduced, resulting in lower process requirements for forming the electrical connection line and making its formation easier.
  • the electrical connection line can be shorter, leading to lower resistance and less current loss when current flows through it.
  • the two ends of the driving circuit extend along a third direction along its length.
  • the driving circuits located on the same side of the light source array in the first direction are arranged along a fourth direction. Both the third and fourth directions are perpendicular to the thickness direction of the substrate, and both are inclined relative to the second direction, with the fourth direction perpendicular to the third direction. This allows for a smaller spacing between adjacent groups of driving circuits along their length, enabling more flexible arrangement of the driving circuit array.
  • the light source array comprises multiple rows of light sources distributed along a first direction, each row including a light source. This allows for a reduction in the number of light sources per row while maintaining the same resolution, enabling the arrangement of larger light sources and improving their brightness. Furthermore, the smaller size of the light source array in the second direction allows for a smaller size of the light-emitting module in that direction.
  • the multiple rows of light sources in the light source group include adjacent first and second light source rows, each containing a light source.
  • the light sources of the first and second light source rows are staggered in a second direction.
  • the multiple rows of light sources in the light source group include adjacent third and fourth light source rows, each comprising multiple light sources arranged in a straight line along a second direction.
  • the light sources of the third and fourth light source rows are symmetrically arranged with respect to a plane of symmetry located between them, wherein the plane of symmetry is a plane perpendicular to the first direction.
  • the size of the light source array in the second direction is smaller, allowing the light-emitting module to also be smaller in the second direction.
  • the projections of any two electrical connection lines in the thickness direction of the substrate do not intersect.
  • the two electrical connection lines are less likely to experience parasitic capacitance at the intersection, which could affect the light source driving.
  • all electrical connection lines can be routed in the same layer of the semiconductor thin film structure, reducing the number of processes involved in forming the semiconductor thin film structure, resulting in a simpler and lower-cost process.
  • the projection of each electrical connection line in the thickness direction of the substrate does not intersect with the projections of all driving circuits in the thickness direction of the substrate.
  • the parasitic capacitance generated between the driving circuits and the electrical connection lines due to the intersection of their projections in the thickness direction of the substrate is less likely to affect the light source driving.
  • it facilitates the routing of electrical connection lines through the structural layer containing the driving circuits, reducing the process of forming the semiconductor thin film structure, making the process of forming the semiconductor thin film structure simpler and less costly.
  • the projection of the electrical connection line in the thickness direction of the substrate is a straight line extending from both ends along a first direction.
  • the projection of the electrical connection line in the thickness direction of the substrate has no corners, reducing the process requirements for forming the electrical connection line and making its formation easier.
  • the length of the electrical connection line can be shorter, resulting in lower resistance and less current loss when current flows through it.
  • the driving circuit is formed on a substrate using semiconductor technology. This allows for higher precision in the formed driving circuit and facilitates the formation of a smaller driving circuit.
  • the light-emitting module includes a first temperature zone and a second temperature zone separated by a preset isotherm.
  • the driving circuit array is located in the first temperature zone, and the light source array is located in the second temperature zone.
  • the preset isotherm is the isotherm at a preset temperature when the light source array emits light at its highest power.
  • the preset temperature is the temperature of the light-emitting module and is less than or equal to 60°C. This design minimizes the impact of heat generated by the light source on the driving circuit.
  • the resistance of each electrical connection line is the same.
  • the resistance between each driving circuit and its corresponding light source is identical, resulting in better uniformity of light emission from the light-emitting module.
  • a second aspect of this application provides a printhead, which includes a housing, a lens assembly, and a light-emitting module as described in any of the above embodiments.
  • the light-emitting module is disposed within the housing, and the substrate of the light-emitting module is connected to the housing.
  • the housing has a light-emitting aperture located on the light-emitting side of the light source array of the light-emitting module, and the lens assembly is disposed at the light-emitting aperture.
  • a third aspect of this application provides an image forming apparatus, which includes a body and a light-emitting module as described in any of the above embodiments.
  • the substrate of the light-emitting module is disposed on the body.
  • the image forming apparatus includes a printhead.
  • the printhead includes a housing, a lens assembly, and a light-emitting module.
  • the housing is mounted on a main body, the light-emitting module is disposed within the housing, and a substrate is connected to the housing.
  • the housing has a light-emitting aperture located on the light-emitting side of the light source array of the light-emitting module, and the lens assembly is disposed at the light-emitting aperture.
  • Figure 1 is a schematic diagram of an image forming apparatus provided in an embodiment of this application.
  • Figure 2 is a schematic diagram of a printhead provided in an embodiment of this application.
  • Figure 3 is a schematic diagram of the cooperation between a printhead and a photosensitive drum provided in an embodiment of this application;
  • Figure 4 is a schematic diagram of another printhead provided in an embodiment of this application.
  • Figure 5 is a schematic diagram of another printhead provided in an embodiment of this application.
  • Figure 6 is a schematic diagram of the electrical connections of a light-emitting module provided in an embodiment of this application.
  • Figure 7 is a schematic diagram of a light-emitting module provided in an embodiment of this application.
  • Figure 8 is a schematic diagram of the arrangement of a light source array and a driving circuit array in the direction perpendicular to the thickness of the substrate according to an embodiment of this application.
  • Figure 9 is a schematic diagram of the arrangement of a light source array and a driving circuit array in the direction perpendicular to the thickness of the substrate according to another embodiment of this application.
  • Figure 10 is a schematic diagram of the arrangement of a light source array and a driving circuit array in the direction perpendicular to the thickness of the substrate according to another embodiment of this application.
  • Figure 11 is a schematic diagram of the arrangement of a light source array and a driving circuit array in the direction perpendicular to the thickness of the substrate according to another embodiment of this application.
  • Figure 12 is a schematic diagram of the arrangement of a light source array and a driving circuit array in the direction perpendicular to the thickness of the substrate according to another embodiment of this application.
  • Figure 13 is a schematic diagram of a light-emitting module provided in an embodiment of this application on one side in the second direction;
  • Figure 14 is a schematic diagram of the arrangement of a light source array and a driving circuit array in the direction perpendicular to the thickness of the substrate according to another embodiment of this application.
  • Figure 15 is a schematic diagram of the arrangement of a light source array and a driving circuit array in the direction perpendicular to the thickness of the substrate according to another embodiment of this application.
  • Figure 16 is a schematic diagram of the arrangement of a light source array and a driving circuit array in a direction perpendicular to the thickness of the substrate according to another embodiment of this application.
  • Figure 17 is a schematic diagram of the arrangement of a light source array and a driving circuit array in the direction perpendicular to the thickness of the substrate according to another embodiment of this application.
  • Figure 18 is a schematic diagram of the arrangement of a light source array and a driving circuit array in the direction perpendicular to the thickness of the substrate according to another embodiment of this application.
  • Figure 19 is a schematic diagram of the arrangement of a light source array and a driving circuit array in the direction perpendicular to the thickness of the substrate according to another embodiment of this application.
  • This application provides an image forming apparatus, which may include, but is not limited to, a printer, copier, fax machine, display device, etc.
  • the display device may include, but is not limited to, a monitor, electronic notebook, electronic dictionary, e-book, electronic tag, electronic bulletin board, etc., any device capable of displaying images.
  • a printer refers to a device with printing capabilities
  • a copier refers to a device with copying capabilities
  • a fax machine refers to a device with faxing capabilities.
  • an all-in-one machine that integrates printing, copying, and faxing functions can be called a printer, a copier, or a fax machine.
  • the image forming apparatus includes a body and a light-emitting module.
  • the light-emitting module is disposed on the body and includes a light source array.
  • the image forming apparatus can use the light emitted by the light source array to form an image.
  • the following explanation uses a printer as an example of an image forming device.
  • Figure 1 is a schematic diagram of an image forming apparatus provided in an embodiment of this application.
  • the x-direction is the paper feeding direction.
  • the image forming apparatus may include a body 2, a printhead 1, a charging roller 4, a photosensitive drum 3, a developing roller 6, an ink cartridge 5, a transfer roller 8, a pressure roller 7, and a waste toner container 9.
  • the printhead 1, charging roller 4, photosensitive drum 3, developing roller 6, ink cartridge 5, transfer roller 8, pressure roller 7, and waste toner container 9 are all disposed within the body 2.
  • the charging roller 4, photosensitive drum 3, developing roller 6, transfer roller 8, and pressure roller 7 may be arranged in parallel.
  • the axial directions of the charging roller 4, photosensitive drum 3, developing roller 6, transfer roller 8, and pressure roller 7 are all perpendicular to the paper feeding direction of the paper p to be printed.
  • a charging roller 4 is positioned close to the photosensitive drum 3 and is used to charge the photosensitive drum 3 so that its surface carries a positive charge.
  • a printhead 1 is positioned close to the photosensitive drum 3 and is located downstream of the charging roller 4 in the rotation direction of the photosensitive drum 3. The printhead 1 is used to selectively expose the charged photosensitive drum 3. As the photosensitive drum 3 rotates, the light emitted by the printhead 1 sweeps across its surface. The potential of the exposed portion of the photosensitive drum 3 decreases, while the unexposed portion remains at a high potential, thus forming an electrostatic latent image on the surface of the photosensitive drum 3.
  • a developing roller 6 is positioned between the photosensitive drum 3 and the ink cartridge 5, downstream of the printhead 1 in the rotation direction of the photosensitive drum 3.
  • the developing roller 6 can rotate with the photosensitive drum 3, carrying charged toner from the ink cartridge 5. As the photosensitive drum 3 rotates, the charged toner is attracted from the developing roller 6 to the low-potential electrostatic latent image on the surface of the photosensitive drum 3, thereby developing the electrostatic latent image into a toner image.
  • the transfer roller 8 is positioned close to the photosensitive drum 3 and downstream of the developing roller 6 in the rotation direction of the photosensitive drum 3. Through the cooperation of the rotating photosensitive drum 3 and the transfer roller 8, the toner on the surface of the photosensitive drum 3 can be transferred onto the paper p.
  • the pressure roller 7 is positioned downstream of the transfer roller 8 in the paper feeding direction.
  • the paper p with toner transferred onto it moves to the pressure roller 7, where it is heated and the toner is solidified on the surface of the paper p, completing the fixing process and enabling image printing.
  • the waste toner bin 9 is positioned close to the photosensitive drum 3 and downstream of the transfer roller 8 in the rotation direction of the photosensitive drum 3. After the transfer is completed, the photosensitive drum 3 continues to rotate, carrying excess toner from its surface to the waste toner bin 9 for recycling.
  • Figure 2 is a schematic diagram of a printhead provided in an embodiment of this application
  • Figure 3 is a schematic diagram of the cooperation between a printhead and a photosensitive drum provided in an embodiment of this application.
  • the printhead 1 includes a housing 20, a lens group 30, and a light-emitting module 10.
  • the housing 20 is disposed on the body 2, and the light-emitting module 10 is disposed inside the housing 20.
  • the light-emitting module 10 includes a substrate 100 and a light source array 200.
  • the substrate 100 is connected to the housing 20, and the light source array 200 is disposed on one side of the substrate 100 in the thickness direction.
  • the light source array 200 emits light in a direction away from the substrate 100; that is, the side of the light source array 200 away from the substrate 100 is the light-emitting side of the light source array 200.
  • the housing 20 has a light-emitting hole 21, which is located on the light-emitting side of the light source array 200.
  • the light-emitting hole 21 is used to allow the light emitted by the light source array 200 to exit the housing 20.
  • the lens group 30 is disposed at the light-emitting hole 21 and can block the light-emitting hole 21.
  • the photosensitive drum 3 is located on the light-emitting side of the light source array 200. The light emitted by the light source array 200 is focused by the lens group 30 and then irradiates the surface of the photosensitive drum 3 to achieve selective exposure of the photosensitive drum 3.
  • the housing 20 can be a strip structure with both ends extending along the axial direction of the photosensitive drum 3 in the length direction
  • the light outlet 21 can be a strip hole with both ends extending along the axial direction of the photosensitive drum 3 in the length direction.
  • the housing 20 can be a cuboid structure, and the light-emitting hole 21 can be located on the surface where the long side and the wide side of the housing 20 are located.
  • the lens group 30 can be inserted into the light outlet 21, and a portion of the lens group 30 can extend to the outside of the housing 20.
  • the lens group 30 may be disposed on the surface of the housing 20.
  • the printhead 1 also includes a light-absorbing layer 40 disposed on the inner wall of the housing 20.
  • the light-absorbing layer 40 is used to absorb scattered light within the housing 20. By providing the light-absorbing layer 40, scattered light emitted by the light source array 200 that illuminates the portion outside the lens group 30 can be absorbed, preventing the scattered light from being reflected by the housing 20 and illuminating the photosensitive drum 3, thus preventing interference with imaging.
  • the light-absorbing layer 40 can be attached to the inner surface of the housing 20 and can be a polymer film, metal film, ceramic film, etc.
  • Figure 4 is a schematic diagram of another printhead provided in an embodiment of this application.
  • the lens group 30 includes a plurality of microlenses 31 arranged in a row along the axial direction of the photosensitive drum 3.
  • Figure 5 is a schematic diagram of another printhead provided in an embodiment of this application.
  • the lens group 30 may include multiple rows of microlens arranged along the width direction of the housing 20.
  • Each row of microlens may include multiple microlenses 31 arranged in a row along the axial direction of the photosensitive drum 3.
  • the width direction of the housing 20 is perpendicular to the axial direction of the photosensitive drum 3 and perpendicular to the thickness direction of the substrate 100.
  • Printhead 1 does not specifically refer to the device in a printer used for exposure to form an image.
  • other devices that can form images through exposure such as copiers and fax machines, can also include printhead 1.
  • Figure 6 is a schematic diagram of the electrical connection of a light-emitting module provided in an embodiment of this application
  • Figure 7 is a schematic diagram of a light-emitting module provided in an embodiment of this application.
  • direction a1 is the first direction
  • direction a2 is the second direction
  • direction b is the thickness direction of substrate 100. Both the first and second directions are perpendicular to the thickness direction of substrate 100, and the first direction is perpendicular to the second direction.
  • the light-emitting module 10 also includes a driving circuit array 300.
  • the light source array 200 includes multiple light sources 2111
  • the driving circuit array 300 includes multiple driving circuits 311 corresponding to the multiple light sources 2111.
  • the light sources 2111 are electrically connected to the corresponding driving circuits 311 through electrical connection lines L1.
  • the driving circuits 311 can be used to generate driving current to drive the corresponding light sources 2111 to emit light.
  • the substrate 100 has a strip-shaped structure.
  • the length direction of the substrate 100 is the same as the length direction of the housing 20, and the width direction of the substrate 100 is the same as the width direction of the housing 20. That is, the two ends of the length direction of the substrate 100 extend along the axial direction of the photosensitive drum 3, and the two ends of the width direction of the substrate 100 extend in a direction perpendicular to the axial direction of the photosensitive drum 3.
  • each light source 2111 in the light source array 200 is the same light source 2111
  • each driving circuit 311 in the driving circuit array 300 is the same driving circuit 311. In this way, the uniformity of light emission from the light source 2111 of the light-emitting module 10 can be improved.
  • the light source array 200 includes a plurality of light sources 2111 distributed along the length direction of the substrate 100.
  • substrate 100 can be a rectangular plate.
  • the light source 2111 may include, but is not limited to, an inorganic light-emitting diode (LED), an organic light-emitting diode (OLED), a mini organic light-emitting diode (Mini LED), a micro light-emitting diode (Micro LED), etc.
  • LED inorganic light-emitting diode
  • OLED organic light-emitting diode
  • Mini LED mini organic light-emitting diode
  • Micro LED micro light-emitting diode
  • the driving circuit 311 may include, but is not limited to, a thin film transistor (TFT) driving circuit, a metal oxide semiconductor field-effect transistor (MOS) driving circuit, a complementary metal oxide semiconductor (CMOS) driving circuit, etc.
  • TFT thin film transistor
  • MOS metal oxide semiconductor field-effect transistor
  • CMOS complementary metal oxide semiconductor
  • the drive circuit 311 may also have one or more of the following functions: data writing, reset, compensation, etc.
  • the light-emitting module 10 may include a semiconductor thin-film structure 600, which is formed on one side of the substrate 100 in the thickness direction.
  • the semiconductor thin-film structure 600 may include a driving circuit array 300 and electrical connection lines L1.
  • the semiconductor thin-film structure 600 is a structure formed on the substrate 100 based on semiconductor technology. That is, the driving circuit 311 and electrical connection lines L1 can be formed on the substrate 100 based on semiconductor technology. In this way, the formed driving circuit 311, electrical connection lines L1 and other structures have high precision, which facilitates the formation of small-sized microstructures such as driving circuit 311 and electrical connection lines L1 on the substrate 100.
  • the semiconductor thin film structure 600 includes a multilayer structure stacked along the thickness direction of the substrate.
  • the light source 2111 can be attached to the side of the semiconductor thin film structure 600 away from the substrate 100. In this case, the semiconductor thin film structure 600 may not include the light source 2111.
  • the semiconductor thin film structure 600 may include a light source 2111, that is, the light source 2111 may be formed on the substrate 100 based on semiconductor processes.
  • the light-emitting module 10 also includes a driver chip 400, and each driver circuit 311 is electrically connected to the driver chip 400 via a corresponding data line L2.
  • the driver chip 400 can be used to generate a drive signal to control the light source 2111 to emit light according to a target brightness, and send the drive signal to the driver circuit 311 corresponding to the light source 2111.
  • the driver circuit 311 generates a drive current to drive the light source 2111 to emit light according to the target brightness based on the drive signal.
  • the light-emitting module 10 also includes a circuit board 500.
  • Each driving circuit 311 is electrically connected to the circuit board 500 through the corresponding positive voltage line L4 (VDD) of the light-emitting power supply, and each light source 2111 is electrically connected to the circuit board 500 through the negative voltage line L5 (VSS) of the light-emitting power supply, so that a loop can be formed between the circuit board 500, the driving circuit 311 and the corresponding light source 2111.
  • VDD positive voltage line L4
  • VSS negative voltage line L5
  • circuit board 500 can be a flexible printed circuit board (FPC).
  • FPC flexible printed circuit board
  • the circuit board 500 is electrically connected to the controller (not shown), and the circuit board 500 is electrically connected to the drive circuit array 300 through the scan line L3, so that the controller can send scan signals to the drive circuit array 300 through the circuit board 500 and the scan line L3 to realize that the light sources 2111 of the light source array 200 emit light in sequence.
  • the circuit board 500 is also electrically connected to the driver chip 400, so that the controller is electrically connected to the driver chip 400 through the circuit board 500.
  • the driver chip 400 can be disposed on the circuit board 500 or on the substrate 100.
  • the controller can send a brightness control signal to the driver chip 400 through the circuit board 500, and the driver chip 400 can generate a drive signal based on the brightness control signal.
  • the brightness control signal can be a digital signal
  • the drive signal can be an analog signal
  • the brightness control signal and the drive signal can be voltage signals, or they can be current signals.
  • the semiconductor thin film structure 600 may include a data line L2, a scan line L3, a positive voltage line for light emission L4, and a negative voltage line for light emission L5.
  • the data line L2, the scan line L3, the positive voltage line for light emission L4, and the negative voltage line for light emission L5 can all be formed on the substrate 100 based on semiconductor technology.
  • the light source and the corresponding driving circuit are often arranged overlappingly in the thickness direction of the substrate. That is, the projection of the light source along the thickness direction of the substrate and the projection of the corresponding driving circuit along the thickness direction of the substrate at least partially overlap.
  • the heat generated by the light source can easily affect the driving circuit, causing the performance of the driving circuit to drift or fail, which in turn affects the performance and lifespan of the light-emitting module.
  • the size of the driving circuit is limited by the center distance between two adjacent light sources in the light source array. This places high demands on the size of the driving circuit. Specifically, when the size of the driving circuit is larger than the center distance between two adjacent light sources in the light source array, it is difficult to arrange the driving circuit one-to-one at each overlapping position of the light sources in the light source array. For high-resolution image forming equipment, the center distance between two adjacent light sources in the light source array is small. For example, for an image forming equipment with a resolution of 1200 dpi, the center distance between two adjacent light sources in the light source array is only 21.16 ⁇ m.
  • the size of the resulting driving circuit is often large due to limitations in the structural forming process and inspection process on the glass substrate, making it difficult to arrange in high-resolution image forming equipment.
  • the substrate is a glass substrate
  • an image forming equipment with a resolution of 1200 dpi it is difficult to arrange the driving circuit formed on the glass substrate one-to-one with the light sources in the light source array.
  • the driving circuits In order to ensure that the driving circuits can be arranged one-to-one with the light sources in the light source array, the driving circuits often need to be fabricated on a silicon substrate to form a smaller driving circuit. In other words, a silicon substrate is required.
  • a silicon substrate is required.
  • using a silicon substrate increases the cost of the light-emitting module. Therefore, in related technologies, for high-resolution image forming equipment, there are significant limitations on the selection of the substrate for the light-emitting module, resulting in a higher cost for the light-emitting module.
  • Figure 8 is a schematic diagram of the arrangement of a light source array and a driving circuit array in the direction perpendicular to the thickness of the substrate according to an embodiment of this application.
  • the driving circuit array 300 is disposed to the side of the light source array 200 in the first direction, and the interval between the driving circuit array 300 and the light source array 200 in the first direction is greater than 0. That is, the projection of the driving circuit array 300 in the thickness direction of the substrate 100 does not coincide with the projection of the light source array 200 in the thickness direction of the substrate 100, and the interval between the projection of the driving circuit array 300 in the thickness direction of the substrate 100 and the projection of the light source array 200 in the thickness direction of the substrate 100 in the first direction is greater than 0.
  • the substrate 100 has a relatively large dimension in the length and width directions. This allows for a larger spacing between the driving circuit array 300 and the light source array 200, thereby reducing the impact of heat generated by the light source 2111 on the driving circuit 311. This makes the performance of the driving circuit 311 less prone to drift or failure, helping to maintain the performance of the light-emitting module 10 and extending its lifespan. Furthermore, since the driving circuit array 300 is positioned to the side of the light source array 200 in the first direction, the size of the driving circuit 311 is no longer limited by the center-to-center distance between two adjacent light sources 2111 in the light source array 200.
  • the size of the driving circuit 311 can be larger than the center-to-center distance between two adjacent light sources 2111 in the light source array 200, thus lowering the size requirements for the driving circuit 311.
  • a glass substrate or similar material can be used as the substrate 100 of the light-emitting module 10. This reduces the selection restrictions on the substrate 100 of the light-emitting module 10, facilitating the use of lower-cost substrates to manufacture the light-emitting module 10 and reducing its cost.
  • the substrate 100 is a glass substrate, which has a lower cost and helps to reduce the cost of the light-emitting module 10.
  • the light-emitting module 10 includes a first temperature zone Q1 and a second temperature zone Q2 separated by a preset isotherm.
  • the second temperature zone Q2 is the area within the region enclosed by the preset isotherm
  • the first temperature zone Q1 is the area outside the region enclosed by the preset isotherm.
  • the driving circuit array 300 is located in the first temperature zone Q1, and the light source array 200 is located in the second temperature zone Q2.
  • the preset isotherm is the isotherm t of a preset temperature when the light source array 200 emits light at its highest power.
  • the preset temperature is the temperature of the light-emitting module 10, and the preset temperature is less than or equal to 60°C. When the light source array 200 emits light at its highest power, the temperature of the first temperature zone Q1 is lower than the preset temperature, and the temperature of the second temperature zone Q2 is higher than the preset temperature.
  • the driving circuit 311 is less affected by the heat generated by the light source 2111.
  • the preset isotherm, the first temperature zone Q1, and the second temperature zone Q2 can be obtained by performing thermal simulation on the light-emitting module 10 when the light source array 200 emits light at the highest power.
  • the preset temperature can be 60°C, 55°C, 50°C, 45°C, 40°C, 35°C, etc.
  • the first direction can be the width direction of the substrate 100, that is, the first direction can be perpendicular to the axis of the photosensitive drum 3.
  • the second direction is the length direction of the substrate 100.
  • the substrate 100 has a large space on both sides of the light source array 200 in the first direction, and the substrate 100 has a large space available for arranging the driving circuit array 300, which facilitates the arrangement of a large number of driving circuits 311 on the substrate 100.
  • the first direction can be the length direction of the substrate 100, that is, the first direction can be the axial direction of the photosensitive drum 3, and the second direction is the width direction of the substrate 100.
  • the light source array 200 includes a plurality of light sources 2111 distributed along a second direction. In the second direction, at least a portion of the driving circuit array 300 is located between the two ends of the light source array 200.
  • the positions of the driving circuit array 300 and the light source array 200 in the second direction at least partially overlap, which is beneficial to reducing the size of the light-emitting module 10 in the second direction.
  • the light source array 200 includes n groups of light sources 210 distributed along a second direction
  • the driving circuit array 300 includes n groups of driving circuits 310 distributed along the second direction.
  • Each group of driving circuits 310 corresponds to a group of light sources 210, and each group of driving circuits 310 is used to drive the corresponding group of light sources 210 to emit light.
  • at least a portion of the driving circuit group 310 is located between the two ends of the corresponding group of light sources 210.
  • the light source group 210 includes a plurality of light sources 2111 distributed along the second direction.
  • the driving circuit group 310 includes a plurality of driving circuits 311 corresponding one-to-one with the plurality of light sources 2111 in the corresponding light source group 210.
  • Each driving circuit 311 in the driving circuit group 310 is electrically connected to a corresponding light source 2111 in the corresponding light source group 210 through an electrical connection line L1.
  • Each driving circuit 311 in the driving circuit group 310 is used to drive a corresponding light source 2111 in the corresponding light source group 210 to emit light.
  • n is an integer greater than or equal to 2.
  • multiple groups of driving circuit groups 310 can be arranged in groups using the size of the substrate 100 in the second direction, which helps to reduce the size of the light-emitting module 10 in the first direction.
  • the number of light sources 2111 in the light source group 210 can be adjusted according to the size of the drive circuit 311 in the second direction.
  • all the drive circuit groups 310 are arranged in a straight line along the second direction, and all the light source groups 210 are arranged in a straight line along the second direction. In this way, the exposure imaging operation is relatively simple.
  • all the driving circuits 311 are located on the same side of the light source array 200 in the first direction, that is, the driving circuit array 300 is arranged on one side of the light source array 200 in the first direction.
  • the driving circuit 311 has less impact on the routing of data lines L2, scan lines L3, positive voltage lines of light source L4, negative voltage lines of light source L5, etc., and the routing of data lines L2, scan lines L3, positive voltage lines of light source L4, negative voltage lines of light source L5, etc. is easier.
  • the light source array 200 is located between the driving chip 400 and the driving circuit array 300 in the first direction.
  • all the drive circuits 311 are located on the same side of the light source array 200 in the first direction, where the drive circuit array 300 is located between the light source array 200 and the drive chip 400 in the first direction.
  • Figure 9 is a schematic diagram of the arrangement of a light source array and a driving circuit array in the direction perpendicular to the thickness of the substrate according to another embodiment of this application.
  • driving circuits 311 are provided on both sides of the light source array 200 in the first direction. This facilitates placing the light source array 200 at the middle position of the substrate 100 in the first direction.
  • the driving circuit group 310 includes a first sub-driving circuit group 310a and a second sub-driving circuit group 310b.
  • the first sub-driving circuit group 310a and the second sub-driving circuit group 310b are located on both sides of the light source array 200 in the first direction, respectively.
  • Both the first sub-driving circuit group 310a and the second sub-driving circuit group 310b include driving circuits 311.
  • the number of light sources 2111 in the light source group 210 is equal to the sum of the number of driving circuits 311 in the first sub-driving circuit group 310a and the second sub-driving circuit group 310b of the corresponding driving circuit group 310.
  • each group of light sources 2110 has m light sources 2111, where m is an integer greater than or equal to 2. That is, the number of light sources 2111 in each group of light sources 210 is the same, and the number of drive circuits 311 in each group of drive circuits 310 is the same.
  • each group of driving circuits 310 and its corresponding light source group 210 are in the same relative position. In this way, the difference in the relative position of different driving circuit groups 310 and their corresponding light source groups 210 will not easily lead to different parasitic capacitances between them, thus ensuring better uniformity of light emission from the light source 2111 of the light-emitting module 10.
  • the driving circuits 311 in each group of driving circuits 311 are arranged in the same way. In this way, it is not easy for different driving circuit groups 310 to have different parasitic capacitances due to different arrangements of the driving circuits 311, and the light source 2111 of the light-emitting module 10 can emit light with better uniformity.
  • the resistance of each electrical connection line L1 is the same.
  • each driving circuit 311 and the corresponding light source 2111 is the same, which can make the light emission of the light source 2111 of the light-emitting module 10 more uniform.
  • each electrical connection line L1 can be made the same by making the current-carrying cross section of the electrical connection line L1 the same as the product of the electrical connection lines L1.
  • the resistance of each electrical connection line L1 can be made the same by making the product of the length of electrical connection line L1 and the line width of electrical connection line L1 the same.
  • Figure 10 is a schematic diagram of the arrangement of a light source array and a driving circuit array in the direction perpendicular to the thickness of the substrate according to another embodiment of this application.
  • the driving circuit 311 includes a first end 3111 and a second end 3112.
  • the first end 3111 and the second end 3112 are located at the two ends of the driving circuit 311 along its length.
  • the first end 3111 of the driving circuit 311 located on the same side of the light source array 200 in the first direction has the same orientation
  • the second end 3112 of the driving circuit 311 located on the same side of the light source array 200 in the first direction has the same orientation.
  • the two ends of the drive circuit 311 extend along a second direction in the longitudinal direction; that is, the first end 3111 and the second end 3112 of the drive circuit 311 are spaced apart in the second direction. In the same group of drive circuits 310, all the drive circuits 311 are distributed along the first direction.
  • the driving circuit 311 is formed along the length or width direction of the substrate 100, making it easier to control the forming direction of the driving circuit 311 during its formation, thus facilitating its formation on the substrate 100. Furthermore, all the driving circuits 311 in the same group of driving circuits 310 are distributed along the first direction, which facilitates the arrangement of a larger number of driving circuits 311 within a single group of driving circuits 310, and makes it easier to implement the arrangement of driving circuits 311 in a high-resolution image forming apparatus.
  • both ends of the drive circuit 311 extend along the second direction and all drive circuits 311 in the same group of drive circuits 310 are distributed along the first direction
  • the first ends 3111 of the drive circuits 311 located on the same side of the light source array 200 in the first direction are arranged in a straight line along the first direction.
  • the size of the drive circuit group 310 in the second direction is smaller.
  • the second end 3112 of the driving circuit 311 located on the same side of the light source array 200 in the first direction in the same driving circuit group 310 is also arranged in a straight line along the first direction.
  • the projections of any two electrical connection lines L1 in the thickness direction of the substrate 100 do not intersect.
  • the two electrical connection lines L1 are less likely to generate parasitic capacitance at the point of intersection in the thickness direction of the substrate 100, thereby affecting the driving of the light source 2111. Furthermore, all electrical connection lines L1 can be routed in the same layer of the semiconductor thin film structure 600, reducing the fabrication process of the semiconductor thin film structure 600 and making the fabrication process simpler and less costly.
  • the projection of each electrical connection line L1 in the thickness direction of the substrate 100 does not intersect with the projection of all the drive circuits 311 in the thickness direction of the substrate 100.
  • the parasitic capacitance generated between the driving circuit 311 and the electrical connection line L1 due to the intersection of their projections in the thickness direction of the substrate 100 is less likely to affect the driving of the light source 2111. Furthermore, it facilitates the routing of the electrical connection line L1 through the structural layer containing the driving circuit 311, reducing the fabrication process for the semiconductor thin film structure 600, making the process for forming the semiconductor thin film structure 600 simpler and less costly.
  • the electrical connection line L1 includes a circuit connection section L11 and a light source connection section L12. One end of the circuit connection section L11 is connected to the drive circuit 311, and the other end of the circuit connection section L11 is connected to the light source 2111 through the light source connection section L12.
  • the circuit connection segment L11 is a straight line extending at both ends along the second direction. This facilitates ensuring that the projection of the electrical connection line L1 in the thickness direction of the substrate 100 does not intersect with the projections of all the drive circuits 311 in the thickness direction of the substrate 100.
  • Figure 11 is a schematic diagram of the arrangement of a light source array and a driving circuit array in the direction perpendicular to the thickness of the substrate according to another embodiment of this application.
  • both ends of the drive circuit 311 extend along the second direction and all drive circuits 311 in the same group of drive circuits 310 are distributed along the first direction
  • the first end 3111 of the drive circuit 311 located on the same side of the light source array 200 in the first direction, away from the light source array 200 protrudes beyond the first end 3111 of the drive circuit 311 close to the light source array 200.
  • the second end 3112 of the drive circuit 311 located on the same side of the light source array 200 in the first direction, close to the light source array 200 protrudes beyond the second end 3112 of the drive circuit 311 located away from the light source array 200.
  • the driving circuit 311 can be connected to the electrical connection line L1 on the side facing the light source array 200, which reduces the space required for the circuit connection section L11 in the second direction. This allows for the arrangement of a larger driving circuit 311 in the second direction.
  • the space for arranging the driving circuit group 310 and its electrical connection line L1 in the second direction is fixed, the size requirements for the driving circuit 311 can be reduced.
  • the circuit connection segment L11 is a straight line extending from both ends along a first direction.
  • the corners of the projection of the electrical connection line L1 in the thickness direction of the substrate 100 can be reduced, making the process requirements for forming the electrical connection line L1 lower and thus making the formation of the electrical connection line L1 easier.
  • the length of the electrical connection line L1 can be shorter, which in turn results in lower resistance and less loss when current flows through the electrical connection line L1.
  • Figure 12 is a schematic diagram of the arrangement of a light source array and a driving circuit array in the direction perpendicular to the thickness of the substrate according to another embodiment of this application.
  • the projection of the electrical connection line L1 in the thickness direction of the substrate 100 is a straight line with both ends extending along a first direction.
  • the projection of the electrical connection line L1 in the thickness direction of the substrate 100 has no corners, which reduces the process requirements for forming the electrical connection line L1 and makes it easier to form the electrical connection line L1.
  • the length of the electrical connection line L1 can be shorter, which in turn reduces the resistance of the electrical connection line L1 and the loss when current passes through the electrical connection line L1.
  • Figure 13 is a schematic diagram of a light-emitting module provided in an embodiment of this application on one side in the second direction.
  • the projection of at least one electrical connection line L1 in the thickness direction of the substrate 100 intersects the projection of at least one driving circuit 311 in the thickness direction of the substrate 100.
  • the at least one electrical connection line L1 includes a jumper segment L13, the projection of which intersects the projection of the at least one driving circuit 311 in the thickness direction of the substrate 100.
  • the jumper segment L13 and the driving circuit 311 are located in different structural layers of the semiconductor thin film structure 600 in the thickness direction of the substrate 100.
  • the drive circuit group 310 in the second direction, is located between the two ends of the corresponding light source group 210.
  • the drive circuit array 300 is smaller in size in the second direction, which in turn allows the light-emitting module 10 to be smaller in size in the second direction.
  • Figure 14 is a schematic diagram of the arrangement of a light source array and a driving circuit array in the direction perpendicular to the thickness of the substrate according to another embodiment of this application.
  • a portion of the drive circuit group 310 is located between the two ends of the corresponding light source group 210, and a portion protrudes from the corresponding light source group 210.
  • Figure 15 is a schematic diagram of the arrangement of a light source array and a driving circuit array in the direction perpendicular to the thickness of the substrate according to another embodiment of this application.
  • the two ends of the driving circuit 311 extend along a third direction in the length direction.
  • the driving circuits 311 located on the same side of the light source array 200 in the first direction are arranged along a fourth direction. Both the third and fourth directions are perpendicular to the thickness direction of the substrate 100, both are inclined relative to the second direction, and the fourth direction is perpendicular to the third direction.
  • the first end 3111 of the driving circuit 311 located on the same side of the light source array 200 in the first direction is arranged in a straight line along the fourth direction
  • the second end 3112 of the driving circuit 311 located on the same side of the light source array 200 in the first direction is arranged in a straight line along the fourth direction.
  • Figure 16 is a schematic diagram of the arrangement of a light source array and a driving circuit array in the direction perpendicular to the thickness of the substrate according to another embodiment of this application.
  • the light source group 210 includes multiple rows of light source rows 211 distributed along a first direction, each row of light source rows 211 including a light source 2111.
  • the number of light sources 2111 in each row can be reduced while maintaining the same resolution. This allows for the arrangement of larger light sources 2111, which is beneficial for increasing the brightness of the light emitted by the light sources 2111.
  • the size of the light source array 200 in the second direction is smaller, which allows the size of the light-emitting module 10 in the second direction to be smaller as well.
  • the multiple rows of light sources 211 in the light source group 210 include adjacent first light source rows 211a and second light source rows 211b, both of which include light sources 2111.
  • the light sources 2111 of the first light source row 211a and the light sources 2111 of the second light source row 211b are staggered in a second direction.
  • Figure 17 is a schematic diagram of the arrangement of a light source array and a driving circuit array in the direction perpendicular to the thickness of the substrate according to another embodiment of this application.
  • the light sources 2111 of all the light source rows 211 of the light source group 210 are staggered in the second direction.
  • each row of light sources 211 includes multiple light sources 2111 that are linearly distributed along the second direction.
  • Figure 18 is a schematic diagram of the arrangement of a light source array and a driving circuit array in the direction perpendicular to the thickness of the substrate according to another embodiment of this application.
  • each row of light sources 211 includes one light source 2111, and the light sources 2111 of all the light sources in the light source group 210 are staggered in the second direction.
  • Figure 19 is a schematic diagram of the arrangement of a light source array and a driving circuit array in the direction perpendicular to the thickness of the substrate according to another embodiment of this application.
  • the multiple rows of light sources 211 in the light source group 210 include adjacent third light source rows 211c and fourth light source rows 211d. Both the third light source rows 211c and fourth light source rows 211d include multiple light sources 2111 distributed in a straight line along the second direction. In the same light source group 210, the light sources 2111 of the third light source row 211c and the fourth light source row 211d are symmetrically arranged with respect to a plane of symmetry m located between them, where the plane of symmetry m is a plane perpendicular to the first direction.
  • the size of the light source array 200 in the second direction is smaller, which allows the size of the light-emitting module 10 in the second direction to be smaller as well.
  • the photosensitive drum 3 needs to be rotated, and the print head 1 or the light-emitting module 10 needs to be moved along the axis of the photosensitive drum 3 to make the position of the fourth light source row 211d emitting light different from that of the third light source row 211c. Then the fourth light source row 211d emits light. In this way, exposure imaging can be performed while keeping the resolution unchanged.

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Abstract

本申请实施例提供一种发光模块、打印头及图像形成设备，涉及图像形成技术领域。该发光模块包括基板、驱动电路阵列和光源阵列。驱动电路阵列设置在光源阵列在第一方向上的侧方，驱动电路阵列与光源阵列在第一方向上的间隔大于0。光源阵列包括多个光源，驱动电路阵列包括与多个光源一一对应的多个驱动电路，光源通过电连接线与对应的驱动电路电连接。其中，第一方向与基板的厚度方向垂直。这样，可使发光模块的光源发光不易对驱动电路的性能造成影响。

Description

发光模块、打印头及图像形成设备
本申请要求于2024年05月31日提交中国专利局、申请号为202410710863.1、申请名称为“发光模块、打印头及图像形成设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请实施例涉及图像形成技术领域，特别涉及一种发光模块、打印头及图像形成设备。
背景技术
在打印机、复印机、传真机、显示设备等图像形成设备中，可包括有发光模块，发光模块可以包括呈阵列分布的多个光源以及与多个光源一一对应的多个驱动电路，驱动电路与对应的光源电连接，以用于驱动对应的光源发光。
在相关技术中，发光模块的光源发光产生的热量易对驱动电路造成影响，使得驱动电路的性能易发生漂移或者失效，进而会影响发光模块的性能和使用寿命。
发明内容
本申请实施例提供一种发光模块、打印头及图像形成设备，发光模块的光源发光不易对驱动电路的性能造成影响。
本申请实施例第一方面提供一种发光模块，该发光模块包括基板、驱动电路阵列和光源阵列。驱动电路阵列设置在光源阵列在第一方向上的侧方，驱动电路阵列与光源阵列在第一方向上的间隔大于0。光源阵列包括多个光源，驱动电路阵列包括与多个光源一一对应的多个驱动电路，光源通过电连接线与对应的驱动电路电连接。其中，第一方向与基板的厚度方向垂直，基板为玻璃基板。
本申请实施例的提供的发光模块，可以利用基板长宽方向上的尺寸，将驱动电路阵列与光源阵列之间的间距拉大，进而可减小光源发光产生的热量对驱动电路的影响，使得驱动电路的性能不易发生漂移或者失效，利于保持发光模块的性能，提高使用寿命。另外，驱动电路阵列设置在光源阵列在第一方向上的侧方后，驱动电路的尺寸不再受光源阵列中相邻的两个光源的中心距的限制，使得对驱动电路的尺寸的要求较低，对于分辨率较高的图像形成设备也可以采用玻璃基板作为发光模块的基板，对发光模块的基板的选型限制较小。此外，选用玻璃基板作为发光模块的基板后，玻璃基板的成本较低，可使发光模块的成本较低。
在一种可能的实施方式中，光源阵列包括沿第二方向分布的n组光源组，驱动电路阵列包括沿第二方向分布的n组驱动电路组，每组驱动电路组与一组光源组相对应。在第二方向上，驱动电路组的至少部分位于对应的光源组的两端之间。光源组包括沿第二方向分布的多个光源，驱动电路组包括与对应的光源组的多个光源一一对应的多个驱动电路。其中，第二方向与基板的厚度方向垂直，第二方向与第一方向垂直，n为大于或者等于2的整数。如此，在驱动电路的数量较多时，可以利用基板在第二方向上的尺寸来分组布置多组驱动电路组，利于减小发光模块在第一方向上的尺寸。
在一种可能的实施方式中，每组光源组的光源的数量均为m个。其中，m为大于或者等于2的整数。如此，便于使每组驱动电路组中的驱动电路实现相同的布置，使得不易因不同驱动电路组的驱动电路的布置不同而使不同驱动电路组产生的寄生电容不同，可使发光模块的光源发光的均一性较好
在一种可能的实施方式中，所有的驱动电路位于光源阵列在第一方向上的同一侧。如此，相对于光源阵列在第一方向两侧都布置有驱动电路的方案，驱动电路对数据线、扫描线等线路的走线的影响较小，数据线、扫描线等线路的布线较为容易。
在一种可能的实施方式中，驱动电路的长度方向上的两端沿第二方向延伸。在同一组驱动电路组中，所有的驱动电路沿第一方向分布。如此，驱动电路沿基板的长度方向或者宽度方向形成，在形成驱动电路时对驱动电路的成型方向的控制较为容易，使得在基板上形成驱动电路较为容易。此外，同一组驱动电路组的所有的驱动电路沿第一方向分布，便于在一组驱动电路组中布置数量较多的驱动电路，便于在分辨率较高的图像形成设备中实现驱动电路的布置。
在一种可能的实施方式中，驱动电路包括第一端，第一端为驱动电路的长度方向上的一端，位于光源阵列在第一方向同一侧的驱动电路的第一端的朝向相同。在同一组驱动电路组中，位于光源阵列在第一方向同一侧的驱动电路的第一端沿第一方向呈直线排布。如此，驱动电路组在第二方向上的尺寸较小。
在一种可能的实施方式中，电连接线包括电路连接段，电路连接段为两端沿第二方向延伸的直线，电路连接段的一端与驱动电路相连。如此，便于实现电连接线在基板的厚度方向上的投影与所有的驱动电路在基板的厚度方向上的投影均不相交。
在一种可能的实施方式中，驱动电路包括第一端，第一端为驱动电路的长度方向上的一端，位于光源阵列在第一方向同一侧的驱动电路的第一端的朝向相同。在同一组驱动电路组中，位于光源阵列在第一方向同一侧的远离光源阵列的驱动电路的第一端凸出于靠近光源阵列的驱动电路的第一端。如此，驱动电路可以通过朝向光源阵列的一侧与电连接线相连，可使电路连接段在第二方向上所需的空间较小，进而可布置在第二方向上尺寸更大的驱动电路，在供驱动电路组及其电连接的电连接线布置的空间在第二方向上的尺寸一定时，可降低对驱动电路的尺寸的要求。
在一种可能的实施方式中，电连接线包括电路连接段，电路连接段为两端沿第一方向延伸的直线，电路连接段的一端与驱动电路相连。如此，相对于电路连接段为两端沿第二方向延伸的直线的方案，可以减少电连接线在基板的厚度方向上的投影的拐角，使得对形成电连接线的工艺要求较低，进而可使形成电连接线更为容易。此外，可使电连接线的长度较短，进而可使电连接线的电阻较小、电流通过电连接线时的损耗较小。
在一种可能的实施方式中，驱动电路的长度方向上的两端沿第三方向延伸。在同一组驱动电路组中，位于光源阵列在第一方向同一侧的驱动电路沿第四方向排布。其中，第三方向和第四方向均与基板的厚度方向垂直，第三方向和第四方向均相对于第二方向倾斜，第四方向与第三方向垂直。如此，可使相邻两组驱动电路组在驱动电路的长度方向上的间距较小，可使驱动电路阵列的布置较为灵活。
在一种可能的实施方式中，光源组包括沿第一方向分布的多排光源排，每排光源排均包括光源。如此，可以在分辨率保持不变的基础上，减少每排光源的数量，进而可以布置尺寸更大的光源，利于提高光源发光的亮度。此外，光源阵列在第二方向上的尺寸较小，可使发光模块在第二方向上的尺寸较小。
在一种可能的实施方式中，光源组的多排光源排包括相邻的第一光源排和第二光源排，第一光源排和第二光源排均包括光源。在同一组光源组中，第一光源排的光源与第二光源排的光源在第二方向上错位分布。如此，在第一光源排发光后，只需要转动感光鼓，再使第二光源排发光，就可以在分辨率保持不变的基础上进行曝光成像，曝光成像操作较为简单。
在一种可能的实施方式中，光源组的多排光源排包括相邻的第三光源排和第四光源排，第三光源排和第四光源排均包括沿第二方向呈直线分布的多个光源。在同一组光源组中，第三光源排的光源与第四光源排的光源相对于位于二者之间的对称面对称设置，其中，对称面为与第一方向垂直的平面。如此，光源阵列在第二方向上的尺寸较小，可使发光模块在第二方向上的尺寸较小。
在一种可能的实施方式中，任意两条电连接线在基板的厚度方向上的投影不相交。如此，相对于在基板的厚度方向上的投影相交的两条电连接线，两条电连接线不易因在基板的厚度方向上的投影相交的部分产生寄生电容而对光源驱动造成影响。此外，可实现所有的电连接线在半导体薄膜结构的同层走线，可减少形成半导体薄膜结构的制程，使得形成半导体薄膜结构的工艺较为简单、成本较低。
在一种可能的实施方式中，每条电连接线在基板的厚度方向上的投影与所有的驱动电路在基板的厚度方向上的投影均不相交。如此，相对于在基板的厚度方向上的投影与驱动电路在基板的厚度方向上的投影相交的电连接线，驱动电路与电连接线之间不易因在基板的厚度方向上的投影相交的部分产生寄生电容而对光源驱动造成影响。此外，便于实现电连接线通过驱动电路所在结构层走线，可减少形成半导体薄膜结构的制程，使得形成半导体薄膜结构的工艺较为简单、成本较低。
在一种可能的实施方式中，电连接线在基板的厚度方向上的投影为两端沿第一方向延伸的直线。如此，电连接线在基板的厚度方向上的投影无拐角，使得对形成电连接线的工艺要求较低，进而可使形成电连接线更为容易。此外，可使电连接线的长度较短，进而可使电连接线的电阻较小、电流通过电连接线时的损耗较小。
在一种可能的实施方式中，驱动电路基于半导体工艺形成于基板上。如此，可使形成的驱动电路的精度较高，便于形成尺寸较小的驱动电路。
在一种可能的实施方式中，发光模块包括由预设等温线分隔形成的第一温区和第二温区，驱动电路阵列位于第一温区，光源阵列位于第二温区。其中，预设等温线为光源阵列以最高功率发光时预设温度的等温线，预设温度为发光模块的温度，预设温度小于或者等于60℃。如此，可使驱动电路不易受到光源发光产生的热量的影响。
在一种可能的实施方式中，每条电连接线的电阻相同。如此，每个驱动电路与对应的光源之间的电阻均相同，可使发光模块的光源发光的均一性较好。
本申请实施例第二方面提供一种打印头，该打印头包括壳体、透镜组以及上述任一实施方式中的发光模块。发光模块设置在壳体内，发光模块的基板与壳体相连。壳体具有出光孔，出光孔位于发光模块的光源阵列的出光侧，透镜组设置在出光孔处。
本申请实施例第三方面提供一种图像形成设备，该图像形成设备包括机体以及上述任一实施方式中的发光模块。发光模块的基板设置在机体上。
在一些可能的实施方式中，该图像形成设备包括打印头。打印头包括壳体、透镜组以及发光模块。壳体设置在机体上，发光模块设置在壳体内，基板与壳体相连。壳体具有出光孔，出光孔位于发光模块的光源阵列的出光侧，透镜组设置在出光孔处。
附图说明
图1为本申请实施例提供的一种图像形成设备的示意图；
图2为本申请实施例提供的一种打印头的示意图；
图3为本申请实施例提供的一种打印头与感光鼓的配合示意图；
图4为本申请实施例提供的另一种打印头的示意图；
图5为本申请实施例提供的又一种打印头的示意图；
图6为本申请实施例提供的一种发光模块的电连接示意图；
图7为本申请实施例提供的一种发光模块的示意图；
图8为本申请实施例提供的一种光源阵列和驱动电路阵列在垂直于基板的厚度方向的布置示意图；
图9为本申请实施例提供的又一种光源阵列和驱动电路阵列在垂直于基板的厚度方向的布置示意图；
图10为本申请实施例提供的又一种光源阵列和驱动电路阵列在垂直于基板的厚度方向的布置示意图；
图11为本申请实施例提供的又一种光源阵列和驱动电路阵列在垂直于基板的厚度方向的布置示意图；
图12为本申请实施例提供的又一种光源阵列和驱动电路阵列在垂直于基板的厚度方向的布置示意图；
图13为本申请实施例提供的一种发光模块在第二方向一侧的示意图；
图14为本申请实施例提供的又一种光源阵列和驱动电路阵列在垂直于基板的厚度方向的布置示意图；
图15为本申请实施例提供的又一种光源阵列和驱动电路阵列在垂直于基板的厚度方向的布置示意图；
图16为本申请实施例提供的又一种光源阵列和驱动电路阵列在垂直于基板的厚度方向的布置示意图；
图17为本申请实施例提供的又一种光源阵列和驱动电路阵列在垂直于基板的厚度方向的布置示意图；
图18为本申请实施例提供的又一种光源阵列和驱动电路阵列在垂直于基板的厚度方向的布置示意图；
图19为本申请实施例提供的又一种光源阵列和驱动电路阵列在垂直于基板的厚度方向的布置示意图。
附图标记说明：
1、打印头；2、机体；3、感光鼓；4、充电辊；5、墨盒；6、显影辊；7、压力辊；8、转印辊；9、
废粉仓；
10、发光模块；20、壳体；21、出光孔；30、透镜组；31、微透镜；40、吸光层；
100、基板；
200、光源阵列；210、光源组；211、光源排；211a、第一光源排；211b、第二光源排；211c、第三
光源排；211d、第四光源排；2111、光源；
300、驱动电路阵列；310、驱动电路组；310a、第一子驱动电路组；310b、第二子驱动电路组；311、
驱动电路；3111、第一端；3112、第二端；
400、驱动芯片；500、电路板；600、半导体薄膜结构；
L1、电连接线；L11、电路连接段；L12、光源连接段；L13、跳线段；L2、数据线；L3、扫描线；
L4、发光电源正电压线；L5、发光电源负电压线；
p、纸张；t、预设温度的等温线；Q1、第一温区；Q2、第二温区；m、对称面；
x、进纸方向；a1、第一方向；a2、第二方向；a3、第三方向；a4、第四方向；b、基板的厚度方向。
具体实施方式
本申请的实施方式部分使用的术语仅用于对本申请的具体实施例进行解释，而非旨在限定本申请，下面将结合附图对本申请实施例的实施方式进行详细描述。
本申请实施例提供一种图像形成设备，该图像形成设备可以包括但不限于为打印机、复印机、传真机、显示设备等。其中，显示设备可以包括但不限于为显示器、电子笔记本、电子词典、电子书、电子标签、电子公告器等可以显示图像的设备。
本领域技术人员可以理解的是，打印机指的是具有打印功能的设备，复印机指的是具有复印功能的设备，传真机指的是具有传真功能的设备。例如，集成有打印、复印和传真功能的一体机既可以称为打印机，也可以称为复印机，还可以称为传真机。
在本申请实施例中，图像形成设备包括机体和发光模块，发光模块设置在机体上，发光模块包括光源阵列，图像形成设备可以利用光源阵列发出的光线来形成图像。
下面，以图像形成设备为打印机为例来进行说明。
图1为本申请实施例提供的一种图像形成设备的示意图。图中，x方向为进纸方向。
如图1所示，本申请实施例提供的图像形成设备，可以包括机体2、打印头1、充电辊4、感光鼓3、显影辊6、墨盒5、转印辊8、压力辊7和废粉仓9，打印头1、充电辊4、感光鼓3、显影辊6、墨盒5、转印辊8、压力辊7和废粉仓9均设置在机体2内，充电辊4、感光鼓3、显影辊6、转印辊8和压力辊7可以平行设置，充电辊4、感光鼓3、显影辊6、转印辊8和压力辊7的轴向均与待打印的纸张p的进纸方向垂直。
充电辊4靠近感光鼓3设置，充电辊4用于给感光鼓3充电，以使感光鼓3表面携带正电荷。打印头1靠近感光鼓3设置，打印头1设置在充电辊4在感光鼓3转动方向的下游，打印头1用于对已经充电的感光鼓3进行选择性曝光，随着感光鼓3转动，打印头1发出的光扫过感光鼓3的表面，感光鼓3的表面受到打印头1曝光的部分的电位降低，感光鼓3的表面没有受到打印头1曝光的部分保持高电位，如此，可在感光鼓3的表面形成静电潜像。显影辊6设置在感光鼓3与墨盒5之间，显影辊6设置在打印头1在感光鼓3的转动方向的下游，显影辊6可以随感光鼓3转动，转动的显影辊6可以从墨盒5中带出带电的墨粉，随着感光鼓3转动，带电的墨粉从显影辊6上被吸引到感光鼓3表面低电位的静电潜像上，进而可将静电潜像显影成墨粉图像。转印辊8靠近感光鼓3设置，转印辊8设置在显影辊6在感光鼓3的转动方向的下游，通过转动的感光鼓3与转印辊8的配合，可将感光鼓3表面的墨粉转印到纸张p上。压力辊7设置在转印辊8沿进纸方向的下游，转印有墨粉的纸张p移动到压力辊7处，经压力辊7加热，可将墨粉固化在纸张p表面，完成定影，进而可实现图像的打印。废粉仓9靠近感光鼓3设置，废粉仓9设置在转印辊8在感光鼓3的转动方向的下游，完成转印后，感光鼓3继续转动，可将感光鼓3表面多余的墨粉带到废粉仓9处，由废粉仓9回收。
图2为本申请实施例提供的一种打印头的示意图，图3为本申请实施例提供的一种打印头与感光鼓的配合示意图。
如图2、图3所示，在本申请实施例中，打印头1包括壳体20、透镜组30和发光模块10。壳体20设置在机体2上，发光模块10设置在壳体20内。发光模块10包括基板100和光源阵列200，基板100与壳体20相连，光源阵列200设置在基板100的厚度方向上的一侧，光源阵列200朝向背离基板100的方向发光，也就是说，光源阵列200背离基板100的一侧为光源阵列200的出光侧。壳体20具有出光孔21，出光孔21位于光源阵列200的出光侧，出光孔21用于供光源阵列200发出的光线射出壳体20，透镜组30设置在出光孔21处，透镜组30可以封堵出光孔21，感光鼓3位于光源阵列200的出光侧，光源阵列200发出的光线经透镜组30聚光后照射到感光鼓3的表面，以实现对感光鼓3的选择性曝光。
壳体20可以为长度方向上的两端沿感光鼓3的轴向延伸的条形结构，出光孔21可以为长度方向上的两端沿感光鼓3的轴向延伸的条形孔。
示例性的，壳体20可以为长方体结构，出光孔21可以位于壳体20的长边和宽边所在的面上。
示例性的，透镜组30可以穿设在出光孔21内，透镜组30的部分可以伸出到壳体20的外侧。
示例性的，透镜组30可以设置在壳体20的表面。
在一些示例中，打印头1还包括设置在壳体20的内壁上的吸光层40，吸光层40用于吸收壳体20内的散射光。通过设置吸光层40，可将光源阵列200发出的照射到透镜组30以外的部分的散射光吸收掉，可防止散射光被壳体20反射后照射到感光鼓3上对成像形成干扰。其中，吸光层40可贴合于壳体20的内表面，可为高分子薄膜、金属薄膜、陶瓷薄膜等。
图4为本申请实施例提供的另一种打印头的示意图。
示例性的，透镜组30包括沿感光鼓3的轴向成排布置的多个微透镜31。
图5为本申请实施例提供的又一种打印头的示意图。
如图5所示，透镜组30可以包括沿壳体20的宽度方向分布的多排微透镜排。每排微透镜排可以包括沿感光鼓3的轴向成排布置的多个微透镜31。其中，壳体20的宽度方向为与感光鼓3的轴向垂直、且与基板100的厚度方向垂直的方向。
本领域技术人员可以理解的是，本申请实施例中的“多”指的是数量大于或者等于2，例如，“多排”指的是大于或者等于2排，多个指的是大于或者等于2个。
打印头1并不是特指打印机中用于曝光形成图像的器件，除打印机外，复印机、传真机等其他可以通过曝光形成图像的设备均可以包括打印头1。
图6为本申请实施例提供的一种发光模块的电连接示意图，图7为本申请实施例提供的一种发光模块的示意图。图中，a1方向为第一方向，a2方向为第二方向，b方向为基板100的厚度方向，第一方向和第二方向均与基板100的厚度方向垂直，第一方向与第二方向垂直。
如图6、图7所示，发光模块10还包括驱动电路阵列300。光源阵列200包括多个光源2111，驱动电路阵列300包括与多个光源2111一一对应的多个驱动电路311，光源2111通过电连接线L1与对应的驱动电路311电连接，驱动电路311可以用于形成驱动电流，以通过驱动电流驱动对应的光源2111发光。
基板100为条形结构，基板100的长度方向与壳体20的长度方向相同，基板100的宽度方向与壳体20的宽度方向相同，也就是说，基板100的长度方向的两端沿感光鼓3的轴向延伸，基板100的宽度方向的两端沿垂直于感光鼓3的轴向的方向延伸。
示例性的，光源阵列200的每个光源2111均为相同的光源2111，驱动电路阵列300的每个驱动电路311均为相同的驱动电路311。如此，可使发光模块10的光源2111发光的均一性较好。
光源阵列200包括沿基板100的长度方向分布的多个光源2111。
示例性的，基板100可以为矩形板。
示例性的，光源2111可以包括但不限于为无机发光二极管(light-emitting diode，LED)、有机发光二极管(organic light-emitting diode，OLED)、迷你发光二极管(mini organic light-emitting diode，Mini LED)、微型发光二极管(micro light-emitting diode，Micro LED)等。
示例性的，驱动电路311可以包括但不限于为薄膜晶体管(thin film transistor，TFT)驱动电路、金属氧化物半导体场效应晶体管(metal oxide semiconductor，MOS)驱动电路、互补性金属氧化物半导体晶体管(complementary metal oxide Semiconductor，CMOS)驱动电路等。
在一些示例中，驱动电路311还可以具有数据写入、复位、补偿等功能中的一种或者多种。
发光模块10可以包括半导体薄膜结构600，半导体薄膜结构600形成在基板100的厚度方向上的一侧，半导体薄膜结构600可以包括驱动电路阵列300和电连接线L1。半导体薄膜结构600为基于半导体工艺形成于基板100上的结构，也就是说，驱动电路311和电连接线L1可以基于半导体工艺形成于基板100上。如此，形成的驱动电路311、电连接线L1等结构的精度较高，便于在基板100上形成尺寸较小的驱动电路311、电连接线L1等微结构。
半导体薄膜结构600包括沿基板的厚度方向层叠的多层结构层。
在一些示例中，光源2111可以贴设在半导体薄膜结构600背离基板100的一侧，此时，半导体薄膜结构600可以不包括光源2111。
在另一些示例中，半导体薄膜结构600可以包括光源2111，也就是说，光源2111可以基于半导体工艺形成在基板100上。
发光模块10还包括驱动芯片400，每个驱动电路311均通过对应的数据线L2与驱动芯片400电连接。驱动芯片400可以用于形成控制待发光的光源2111按照目标亮度发光的驱动信号，并将驱动信号发送给待发光的光源2111对应的驱动电路311，该驱动电路311根据该驱动信号形成驱动待发光的光源2111按照目标亮度发光的驱动电流。
发光模块10还包括电路板500，每个驱动电路311通过对应的发光电源正电压线L4(VDD)与电路板500电连接，每个光源2111通过发光电源负电压线L5(VSS)与电路板500电连接，使得电路板500与驱动电路311和对应的光源2111之间可以形成回路。
示例性的，电路板500可以为柔性电路板(flexible printed circuit board，FPC)。
电路板500与控制器(未示出)电连接，电路板500通过扫描线L3与驱动电路阵列300电连接，使得控制器可以通过电路板500和扫描线L3向驱动电路阵列300发送扫描信号，以实现光源阵列200的光源2111按序发光。
电路板500还与驱动芯片400电连接，使得控制器通过电路板500与驱动芯片400电连接。示例性的，驱动芯片400可以设置在电路板500上，驱动芯片400也可以设置在基板100上。
控制器可以通过电路板500向驱动芯片400发送亮度控制信号，驱动芯片400可以根据亮度控制信号形成驱动信号。
示例性的，亮度控制信号可以为数字信号，驱动信号可以为模拟信号。
示例性的，亮度控制信号和驱动信号可以电压信号，亮度控制信号和驱动信号也可以电流信号。
半导体薄膜结构600可以包括数据线L2、扫描线L3、发光电源正电压线L4和发光电源负电压线L5，也就是说，数据线L2、扫描线L3、发光电源正电压线L4和发光电源负电压线L5均可以基于半导体工艺形成于基板100上。
在相关技术中，光源与对应的驱动电路常在基板的厚度方向上重叠设置，也就是说，光源沿基板的厚度方向上的投影与对应的驱动电路沿基板的厚度方向上的投影至少部分重合。
在相关技术中，由于光源与驱动电路在基板的厚度方向上的间隔常常较小，光源发光产生的热量易对驱动电路造成影响，使得驱动电路的性能易发生漂移或者失效，进而会影响发光模块的性能和使用寿命。
另外，在相关技术中，由于驱动电路与对应的光源在基板的厚度方向上重叠设置，驱动电路的尺寸会受到光源阵列中相邻的两个光源的中心距的限制，对驱动电路的尺寸的要求较高，具体来说，在驱动电路的尺寸大于光源阵列中相邻的两个光源的中心距时，较难在光源阵列的每个光源重叠的位置一一对应的布置驱动电路。对于分辨率较高的图像形成设备，光源阵列中相邻的两个光源的中心距较小，例如，对于分辨率为1200dpi的图像形成设备，光源阵列中相邻的两个光源的中心距仅为21.16um。而在基板采用玻璃基板等时，受到在玻璃基板上的结构成型工艺、检测工艺等的限制，形成的驱动电路的尺寸常常较大，较难布置到分辨率较高的图像形成设备中。比如，在基板采用玻璃基板时，较难形成尺寸小于或者等于21.16um的驱动电路，对于分辨率为1200dpi的图像形成设备，在玻璃基板上形成的驱动电路较难一一对应的与光源阵列中的光源重叠布置。对于分辨率较高的图像形成设备，为使驱动电路能够一一对应的与光源阵列中的光源重叠布置，驱动电路常常需要在硅基板上制成，以形成尺寸较小的驱动电路，也就是说，基板需要采用硅基板，然而，采用硅基板会使发光模块的成本较高。因此，在相关技术中，对于分辨率较高的图像形成设备，对发光模块的基板的选型的限制较大，发光模块的成本较高。
图8为本申请实施例提供的一种光源阵列和驱动电路阵列在垂直于基板的厚度方向的布置示意图。
如图8所示，并参看图7，基于此，在本申请实施例中，驱动电路阵列300设置在光源阵列200在第一方向上的侧方，驱动电路阵列300与光源阵列200在第一方向上的间隔大于0。也就是说，驱动电路阵列300在基板100的厚度方向上的投影与光源阵列200在基板100的厚度方向上的投影不重合，且驱动电路阵列300在基板100的厚度方向上的投影与光源阵列200在基板100的厚度方向上的投影在第一方向上的间隔大于0。
基板100在长宽方向上的尺寸较大，这样，可以利用基板100长宽方向上的尺寸，将驱动电路阵列300与光源阵列200之间的间距拉大，进而可减小光源2111发光产生的热量对驱动电路311的影响，使得驱动电路311的性能不易发生漂移或者失效，利于保持发光模块10的性能，提高使用寿命。另外，驱动电路阵列300设置在光源阵列200在第一方向上的侧方后，驱动电路311的尺寸不再受光源阵列200中相邻的两个光源2111的中心距的限制，也就是说，驱动电路311的尺寸可以大于光源阵列200中相邻的两个光源2111的中心距，使得对驱动电路311的尺寸的要求较低，在本申请实施例的方案中，对于分辨率较高的图像形成设备也可以采用玻璃基板等作为发光模块10的基板100，对发光模块10的基板100的选型限制较小，便于选用成本较低的基板100来制造发光模块10，以降低发光模块10的成本。
在一些可能的实施方式中，基板100为玻璃基板，如此，玻璃基板的成本较低，利于降低发光模块10的成本。
在一些可能的实施方式中，发光模块10包括由预设等温线分隔形成的第一温区Q1和第二温区Q2，第二温区Q2为预设等温线围合形成的区域以内的区域，第一温区Q1为预设等温线围合形成的区域以外的区域。驱动电路阵列300位于第一温区Q1，光源阵列200位于第二温区Q2。其中，预设等温线为光源阵列200以最高功率发光时预设温度的等温线t，预设温度为发光模块10的温度，预设温度小于或者等于60℃。光源阵列200以最高功率发光时，第一温区Q1的温度小于预设温度，第二温区Q2的温度高于预设温度。
这样，可使驱动电路311不易受到光源2111发光产生的热量的影响。
预设等温线、第一温区Q1和第二温区Q2可以通过在光源阵列200以最高功率发光时对发光模块10进行热仿真得到。
示例性的，预设温度可以为60℃、55℃、50℃、45℃、40℃、35℃等。
在一些示例中，第一方向可以为基板100的宽度方向，也就是说，第一方向可以与感光鼓3的轴向垂直，此时，第二方向为基板100的长度方向。
这样，基板100位于光源阵列200在第一方向两侧的空间较大，基板100上可用于布置驱动电路阵列300的空间较大，便于数量较多的驱动电路311在基板100上的布置。
在另一些示例中，第一方向可以为基板100的长度方向，也就是说，第一方向可以为感光鼓3的轴向，此时，第二方向为基板100的宽度方向。
如图7、图8所示，在一些示例中，光源阵列200包括沿第二方向分布的多个光源2111。在第二方向上，驱动电路阵列300的至少部分位于光源阵列200的两端之间。
这样，驱动电路阵列300与光源阵列200在第二方向上的位置至少部分重合，利于减小发光模块10在第二方向上的尺寸。
在一些可能的实施方式中，光源阵列200包括沿第二方向分布的n组光源组210，驱动电路阵列300包括沿第二方向分布的n组驱动电路组310，每组驱动电路组310与一组光源组210相对应，每组驱动电路组310用于驱动对应的一组光源组210发光。在第二方向上，驱动电路组310的至少部分位于对应的光源组210的两端之间。
光源组210包括沿第二方向分布的多个光源2111，驱动电路组310包括与对应的光源组210的多个光源2111一一对应的多个驱动电路311，驱动电路组310的每个驱动电路311均通过电连接线L1与对应的光源组210中的一个对应的光源2111电连接，驱动电路组310的每个驱动电路311均用于驱动对应的光源组210中的一个对应的光源2111发光。其中，n为大于或者等于2的整数。
这样，在驱动电路311的数量较多时，可以利用基板100在第二方向上的尺寸来分组布置多组驱动电路组310，利于减小发光模块10在第一方向上的尺寸。
光源组210中的光源2111的数量可以根据驱动电路311在第二方向上的尺寸进行调整。
示例性的，所有的驱动电路组310沿第二方向呈直线排布，所有的光源组210沿第二方向呈直线排布。如此，曝光成像操作较为简单。
在一些可能的实施方式中，所有的驱动电路311位于光源阵列200在第一方向上的同一侧，也就是说，驱动电路阵列300设置在光源阵列200在第一方向上的一侧。
这样，相对于光源阵列200在第一方向两侧都布置有驱动电路311的方案，驱动电路311对数据线L2、扫描线L3、发光电源正电压线L4、发光电源负电压线L5等线路的走线的影响较小，数据线L2、扫描线L3、发光电源正电压线L4、发光电源负电压线L5等线路的布线较为容易。
在所有的驱动电路311位于光源阵列200在第一方向上的同一侧的一些示例中，在第一方向，光源阵列200位于驱动芯片400与驱动电路阵列300之间。
这样，便于将光源阵列200设置在基板100在第一方向上的中间的位置，光源阵列200不易因误触而发生损坏。
在所有的驱动电路311位于光源阵列200在第一方向上的同一侧的另一些示例中，在第一方向上，驱动电路阵列300位于光源阵列200与驱动芯片400之间。
这样，可使连接驱动芯片400与驱动电路311的数据线L2等线路布线较为容易。
图9为本申请实施例提供的又一种光源阵列和驱动电路阵列在垂直于基板的厚度方向的布置示意图。
如图9所示，在一些可能的实施方式中，光源阵列200在第一方向的两侧均设置有驱动电路311。如此，便于将光源阵列200设置在基板100在第一方向上的中间的位置。
在驱动电路阵列300包括沿第二方向分布的n组驱动电路组310的一些示例中，驱动电路组310包括第一子驱动电路组310a和第二子驱动电路组310b，第一子驱动电路组310a和第二子驱动电路组310b，第一子驱动电路组310a和第二子驱动电路组310b分别位于光源阵列200在第一方向上的两侧，第一子驱动电路组310a和第二子驱动电路组310b均包括驱动电路311，光源组210中的光源2111的数量等于对应的驱动电路组310的第一子驱动电路组310a和第二子驱动电路组310b中的驱动电路311的数量之和。
在一些可能的实施方式中，每组光源组210的光源2111的数量均为m个，其中，m为大于或者等于2的整数。也就是说，每组光源组210中的光源2111的数量相同，每组驱动电路组310中的驱动电路311的数量相同。
这样，便于使每组驱动电路组310中的驱动电路311实现相同的布置，使得不易因不同驱动电路组310的驱动电路311的数量不同而使不同驱动电路组310产生的寄生电容不同，可使发光模块10的光源2111发光的均一性较好。
示例性的，每组驱动电路组310与对应的光源组210均处于相同的相对位置。如此，不易因不同的驱动电路组310与对应的光源组210的相对位置的差异导致不同的驱动电路组310与对应的光源组210之间产生的寄生电容不同，可使发光模块10的光源2111发光的均一性较好。
示例性的，每组驱动电路311中的驱动电路311的按照相同的排布方式排布。如此，使得不易因不同驱动电路组310的驱动电路311的布置不同而使不同驱动电路组310产生的寄生电容不同，可使发光模块10的光源2111发光的均一性较好。
在一些可能的实施方式中，每条电连接线L1的电阻相同。
如此，每个驱动电路311与对应的光源2111之间的电阻均相同，可使发光模块10的光源2111发光的均一性较好。
可以通过使电连接线L1的通流截面与电连接线L1的乘积相同，来使每条电连接线L1的电阻相同。
例如，在电连接线L1的厚度相同，可以通过使电连接线L1的长度与电连接线L1的线宽的乘积相同，来使每条电连接线L1的电阻相同。
图10为本申请实施例提供的又一种光源阵列和驱动电路阵列在垂直于基板的厚度方向的布置示意图。
如图10所示，驱动电路311包括第一端3111和第二端3112，第一端3111和第二端3112分别位于驱动电路311的长度方向上的两端，位于光源阵列200在第一方向同一侧的驱动电路311的第一端3111的朝向相同，位于光源阵列200在第一方向同一侧的驱动电路311的第二端3112的朝向相同。
在一些可能的实施方式中，驱动电路311的长度方向上的两端沿第二方向延伸，也就是说，驱动电路311的第一端3111和第二端3112在第二方向上间隔设置。在同一组驱动电路组310中，所有的驱动电路311沿第一方向分布。
这样，驱动电路311沿基板100的长度方向或者宽度方向形成，在形成驱动电路311时对驱动电路311的成型方向的控制较为容易，使得在基板100上形成驱动电路311较为容易。此外，同一组驱动电路组310的所有的驱动电路311沿第一方向分布，便于在一组驱动电路组310中布置数量较多的驱动电路311，便于在分辨率较高的图像形成设备中实现驱动电路311的布置。
在驱动电路311的长度方向上的两端沿第二方向延伸、且同一组驱动电路组310中所有的驱动电路311沿第一方向分布的一些示例中，在同一组驱动电路组310中，位于光源阵列200在第一方向同一侧的驱动电路311的第一端3111沿第一方向呈直线排布。如此，驱动电路组310在第二方向上的尺寸较小。
在同一驱动电路组310中位于光源阵列200在第一方向同一侧的驱动电路311的第一端3111沿第一方向呈直线排布时，在同一驱动电路组310中位于光源阵列200在第一方向同一侧的驱动电路311的第二端3112也沿第一方向呈直线排布。
在一些可能的实施方式中，任意两条电连接线L1在基板100的厚度方向上的投影不相交。
如此，相对于在基板100的厚度方向上的投影相交的两条电连接线L1，两条电连接线L1不易因在基板100的厚度方向上的投影相交的部分产生寄生电容而对光源2111驱动造成影响。此外，可实现所有的电连接线L1在半导体薄膜结构600的同层走线，可减少形成半导体薄膜结构600的制程，使得形成半导体薄膜结构600的工艺较为简单、成本较低。
在一些可能的实施方式中，每条电连接线L1在基板100的厚度方向上的投影与所有的驱动电路311在基板100的厚度方向上的投影均不相交。
如此，相对于在基板100的厚度方向上的投影与驱动电路311在基板100的厚度方向上的投影相交的电连接线L1，驱动电路311与电连接线L1之间不易因在基板100的厚度方向上的投影相交的部分产生寄生电容而对光源2111驱动造成影响。此外，便于实现电连接线L1通过驱动电路311所在结构层走线，可减少形成半导体薄膜结构600的制程，使得形成半导体薄膜结构600的工艺较为简单、成本较低。
电连接线L1包括电路连接段L11和光源连接段L12，电路连接段L11的一端与驱动电路311相连，电路连接段L11的另一端通过光源连接段L12与光源2111相连。
在一些示例中，电路连接段L11为两端沿第二方向延伸的直线。如此，便于实现电连接线L1在基板100的厚度方向上的投影与所有的驱动电路311在基板100的厚度方向上的投影均不相交。
图11为本申请实施例提供的又一种光源阵列和驱动电路阵列在垂直于基板的厚度方向的布置示意图。
如图11所示，在驱动电路311的长度方向上的两端沿第二方向延伸、且同一组驱动电路组310中所有的驱动电路311沿第一方向分布的一些示例中，在同一组驱动电路组310中，位于光源阵列200在第一方向同一侧的远离光源阵列200的驱动电路311的第一端3111凸出于靠近光源阵列200的驱动电路311的第一端3111。此时，在同一组驱动电路组310中，位于光源阵列200在第一方向同一侧的靠近光源阵列200的驱动电路311的第二端3112凸出于远离光源阵列200的驱动电路311的第二端3112。
这样，驱动电路311可以通过朝向光源阵列200的一侧与电连接线L1相连，可使电路连接段L11在第二方向上所需的空间较小，进而可布置在第二方向上尺寸更大的驱动电路311，在供驱动电路组310及其电连接的电连接线L1布置的空间在第二方向上的尺寸一定时，可降低对驱动电路311的尺寸的要求。
在一些示例中，电路连接段L11为两端沿第一方向延伸的直线。
这样，相对于电路连接段L11为两端沿第二方向延伸的直线的方案，可以减少电连接线L1在基板100的厚度方向上的投影的拐角，使得对形成电连接线L1的工艺要求较低，进而可使形成电连接线L1更为容易。此外，可使电连接线L1的长度较短，进而可使电连接线L1的电阻较小、电流通过电连接线L1时的损耗较小。
图12为本申请实施例提供的又一种光源阵列和驱动电路阵列在垂直于基板的厚度方向的布置示意图。
如图12所示，在一些可能的实施方式中，电连接线L1在基板100的厚度方向上的投影为两端沿第一方向延伸的直线。
这样，电连接线L1在基板100的厚度方向上的投影无拐角，使得对形成电连接线L1的工艺要求较低，进而可使形成电连接线L1更为容易。此外，可使电连接线L1的长度较短，进而可使电连接线L1的电阻较小、电流通过电连接线L1时的损耗较小。
图13为本申请实施例提供的一种发光模块在第二方向一侧的示意图。
如图13所示，并参看图12，在一些示例中，至少一条电连接线L1在基板100的厚度方向上的投影与至少一个驱动电路311在基板100的厚度方向上的投影相交。至少一条电连接线L1包括跳线段L13，跳线段L13在基板100的厚度方向上的投影与至少一个驱动电路311在基板100的厚度方向上的投影相交，跳线段L13与驱动电路311位于半导体薄膜结构600在基板100的厚度方向上的不同结构层。
如此，便于实现电连接线L1在基板100的厚度方向上的投影为两端沿第一方向延伸的直线。
在一些示例中，在第二方向上，驱动电路组310位于对应的光源组210的两端之间。如此，驱动电路阵列300在第二方向上的尺寸较小，可使发光模块10在第二方向上的尺寸较小。
图14为本申请实施例提供的又一种光源阵列和驱动电路阵列在垂直于基板的厚度方向的布置示意图。
如图14所示，在另一些示例中，在第二方向上，驱动电路组310的部分位于对应的光源组210的两端之间，部分凸出于对应的光源组210。
这样，便于布置在第二方向上尺寸较大的驱动电路311，对驱动电路311的尺寸的限制较小。
图15为本申请实施例提供的又一种光源阵列和驱动电路阵列在垂直于基板的厚度方向的布置示意图。
如图15所示，在一些可能的实施方式中，驱动电路311的长度方向上的两端沿第三方向延伸。在同一组驱动电路组310中，位于光源阵列200在第一方向同一侧的驱动电路311沿第四方向排布。其中，第三方向和第四方向均与基板100的厚度方向垂直，第三方向和第四方向均相对于第二方向倾斜，第四方向与第三方向垂直。
这样，可使相邻两组驱动电路组310在驱动电路311的长度方向上的间距较小，可使驱动电路阵列300的布置较为灵活。
示例性的，在同一组驱动电路组310中，位于光源阵列200在第一方向同一侧的驱动电路311的第一端3111沿第四方向呈直线排布，位于光源阵列200在第一方向同一侧的驱动电路311的第二端3112沿第四方向呈直线排布。
图16为本申请实施例提供的又一种光源阵列和驱动电路阵列在垂直于基板的厚度方向的布置示意图。
如图16所示，在一些可能的实施方式中，光源组210包括沿第一方向分布的多排光源排211，每排光源排211均包括光源2111。
这样，通过沿第一方向布置多排光源2111，可以在分辨率保持不变的基础上，减少每排光源2111的数量，进而可以布置尺寸更大的光源2111，利于提高光源2111发光的亮度。此外，光源阵列200在第二方向上的尺寸较小，可使发光模块10在第二方向上的尺寸较小。
在一些可能的实施方式中，光源组210的多排光源排211包括相邻的第一光源排211a和第二光源排211b，第一光源排211a和第二光源排211b均包括光源2111。在同一组光源组210中，第一光源排211a的光源2111与第二光源排211b的光源2111在第二方向上错位分布。
这样，在第一光源排211a发光后，只需要转动感光鼓3，再使第二光源排211b发光，就可以在分辨率保持不变的基础上进行曝光成像，曝光成像操作较为简单。
图17为本申请实施例提供的又一种光源阵列和驱动电路阵列在垂直于基板的厚度方向的布置示意图。
如图17所示，在一些示例中，光源组210的所有的光源排211的光源2111在第二方向上均错位分布。
在一些示例中，每排光源排211均包括多个沿第二方向呈直线分布的光源2111。
图18为本申请实施例提供的又一种光源阵列和驱动电路阵列在垂直于基板的厚度方向的布置示意图。
如图18所示，在一些示例中，每排光源排211包括一个光源2111，光源组210的所有的光源排211的光源2111在第二方向上均错位分布。
图19为本申请实施例提供的又一种光源阵列和驱动电路阵列在垂直于基板的厚度方向的布置示意图。
如图19所示，在一些可能的实施方式中，光源组210的多排光源排211包括相邻的第三光源排211c和第四光源排211d，第三光源排211c和第四光源排211d均包括沿第二方向呈直线分布的多个光源2111。在同一组光源组210中，第三光源排211c的光源2111与第四光源排211d的光源2111相对于位于二者之间的对称面m对称设置，其中，对称面m为与第一方向垂直的平面。
这样，光源阵列200在第二方向上的尺寸较小，可使发光模块10在第二方向上的尺寸较小。
此时，在第三光源排211c发光后，需要转动感光鼓3，并沿感光鼓3的轴向移动打印头1或者发光模块10，使第四光源排211d与第三光源排211c发光的位置错位，然后在使第四光源排211d发光，如此，可以在分辨率保持不变的基础上进行曝光成像。
在本申请实施例的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应作广义理解，例如，可以是固定连接，也可以是通过中间媒介间接相连，可以是两个元件内部的连通或者两个元件的相互作用关系。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本申请实施例中的具体含义。
在本申请实施例或者暗示所指的装置或者元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请实施例的限制。在本申请实施例的描述中，“多个”的含义是两个或两个以上，除非是另有精确具体地规定。
本申请实施例的说明书和权利要求书及上述附图中的术语“第一”、“第二”、“第三”、“第四”等(如果存在)是用于区别类似的对象，而不必用于描述特定的顺序或先后次序。应该理解这样使用的数据在适当情况下可以互换，以便这里描述的本申请实施例的实施例例如能够以除了在这里图示或描述的那些以外的顺序实施。此外，术语“包括”和“具有”以及他们的任何变形，意图在于覆盖不排他的包含，例如，包含了一系列步骤或单元的过程、方法、系统、产品或设备不必限于清楚地列出的那些步骤或单元，而是可包括没有清楚地列出的或对于这些过程、方法、产品或设备固有的其它步骤或单元。
本文中的术语“多个”是指两个或两个以上。本文中术语“和/或”，仅仅是一种描述关联对象的关联关系，表示可以存在三种关系，例如，A和/或B，可以表示：单独存在A，同时存在A和B，单独存在B这三种情况。另外，本文中字符“/”，一般表示前后关联对象是一种“或”的关系；在公式中，字符“/”，表示前后关联对象是一种“相除”的关系。
可以理解的是，在本申请的实施例中涉及的各种数字编号仅为描述方便进行的区分，并不用来限制本申请的实施例的范围。
可以理解的是，在本申请的实施例中，上述各过程的序号的大小并不意味着执行顺序的先后，各过程的执行顺序应以其功能和内在逻辑确定，而不应对本申请的实施例的实施过程构成任何限定。

Claims (22)

  1. 一种发光模块，其特征在于，包括基板、驱动电路阵列和光源阵列；
    所述驱动电路阵列设置在所述光源阵列在第一方向上的侧方，所述驱动电路阵列与所述光源阵列在所述第一方向上的间隔大于0；
    所述光源阵列包括多个光源，所述驱动电路阵列包括与多个所述光源一一对应的多个驱动电路，所述光源通过电连接线与对应的所述驱动电路电连接；
    其中，所述第一方向与所述基板的厚度方向垂直，所述基板为玻璃基板。
  2. 根据权利要求1所述的发光模块，其特征在于，所述光源阵列包括沿第二方向分布的n组光源组，所述驱动电路阵列包括沿第二方向分布的n组驱动电路组，每组所述驱动电路组与一组所述光源组相对应；
    在所述第二方向上，所述驱动电路组的至少部分位于对应的所述光源组的两端之间；
    所述光源组包括沿所述第二方向分布的多个所述光源，所述驱动电路组包括与对应的所述光源组的多个所述光源一一对应的多个所述驱动电路；
    其中，所述第二方向与所述基板的厚度方向垂直，所述第二方向与所述第一方向垂直，n为大于或者等于2的整数。
  3. 根据权利要求2所述的发光模块，其特征在于，每组所述光源组的所述光源的数量均为m个；
    其中，m为大于或者等于2的整数。
  4. 根据权利要求2或3所述的发光模块，其特征在于，所有的所述驱动电路位于所述光源阵列在所述第一方向上的同一侧。
  5. 根据权利要求2-4任一项所述的发光模块，其特征在于，所述驱动电路的长度方向上的两端沿所述第二方向延伸；
    在同一组所述驱动电路组中，所有的所述驱动电路沿所述第一方向分布。
  6. 根据权利要求5所述的发光模块，其特征在于，所述驱动电路包括第一端，所述第一端为所述驱动电路的长度方向上的一端，位于所述光源阵列在所述第一方向同一侧的所述驱动电路的所述第一端的朝向相同；
    在同一组所述驱动电路组中，位于所述光源阵列在所述第一方向同一侧的所述驱动电路的所述第一端沿所述第一方向呈直线排布。
  7. 根据权利要求6所述的发光模块，其特征在于，所述电连接线包括电路连接段，所述电路连接段为两端沿所述第二方向延伸的直线，所述电路连接段的一端与所述驱动电路相连。
  8. 根据权利要求5所述的发光模块，其特征在于，所述驱动电路包括第一端，所述第一端为所述驱动电路的长度方向上的一端，位于所述光源阵列在所述第一方向同一侧的所述驱动电路的所述第一端的朝向相同；
    在同一组所述驱动电路组中，位于所述光源阵列在所述第一方向同一侧的远离所述光源阵列的所述驱动电路的所述第一端凸出于靠近所述光源阵列的所述驱动电路的所述第一端。
  9. 根据权利要求8所述的发光模块，其特征在于，所述电连接线包括电路连接段，所述电路连接段为两端沿所述第一方向延伸的直线，所述电路连接段的一端与所述驱动电路相连。
  10. 根据权利要求2-4任一项所述的发光模块，其特征在于，所述驱动电路的长度方向上的两端沿第三方向延伸；
    在同一组所述驱动电路组中，位于所述光源阵列在所述第一方向同一侧的所述驱动电路沿第四方向排布；
    其中，所述第三方向和所述第四方向均与所述基板的厚度方向垂直，所述第三方向和所述第四方向均相对于所述第二方向倾斜，所述第四方向与所述第三方向垂直。
  11. 根据权利要求2-10任一项所述的发光模块，其特征在于，所述光源组包括沿所述第一方向分布的多排光源排，每排所述光源排均包括所述光源。
  12. 根据权利要求11所述的发光模块，其特征在于，所述光源组的多排所述光源排包括相邻的第一光源排和第二光源排，所述第一光源排和所述第二光源排均包括所述光源；
    在同一组所述光源组中，所述第一光源排的所述光源与所述第二光源排的所述光源在所述第二方向上错位分布。
  13. 根据权利要求11或12所述的发光模块，其特征在于，所述光源组的多排所述光源排包括相邻的第三光源排和第四光源排，所述第三光源排和所述第四光源排均包括沿所述第二方向呈直线分布的多个所述光源；
    在同一组所述光源组中，所述第三光源排的所述光源与所述第四光源排的所述光源相对于位于二者之间的对称面对称设置，其中，所述对称面为与所述第一方向垂直的平面。
  14. 根据权利要求1-13任一项所述的发光模块，其特征在于，任意两条所述电连接线在所述基板的厚度方向上的投影不相交。
  15. 根据权利要求1-14任一项所述的发光模块，其特征在于，每条所述电连接线在所述基板的厚度方向上的投影与所有的所述驱动电路在所述基板的厚度方向上的投影均不相交。
  16. 根据权利要求1-15任一项所述的发光模块，其特征在于，所述电连接线在所述基板的厚度方向上的投影为两端沿所述第一方向延伸的直线。
  17. 根据权利要求1-16任一项所述的发光模块，其特征在于，所述驱动电路基于半导体工艺形成于所述基板上。
  18. 根据权利要求1-17任一项所述的发光模块，其特征在于，所述发光模块包括由预设等温线分隔形成的第一温区和第二温区，所述驱动电路阵列位于所述第一温区，所述光源阵列位于所述第二温区；
    其中，所述预设等温线为所述光源阵列以最高功率发光时预设温度的等温线，所述预设温度为所述发光模块的温度，所述预设温度小于或者等于60℃。
  19. 根据权利要求1-18任一项所述的发光模块，其特征在于，每条所述电连接线的电阻相同。
  20. 一种打印头，其特征在于，包括壳体、透镜组以及如权利要求1-19任一项所述的发光模块；
    所述发光模块设置在所述壳体内，所述发光模块的基板与所述壳体相连；
    所述壳体具有出光孔，所述出光孔位于所述发光模块的光源阵列的出光侧，所述透镜组设置在所述出光孔处。
  21. 一种图像形成设备，其特征在于，包括机体以及如权利要求1-19任一项所述的发光模块；
    所述发光模块的基板设置在所述机体上。
  22. 根据权利要求21所述的图像形成设备，其特征在于，包括打印头；
    所述打印头包括壳体、透镜组以及所述发光模块；
    所述壳体设置在所述机体上，所述发光模块设置在所述壳体内，所述基板与所述壳体相连；
    所述壳体具有出光孔，所述出光孔位于所述发光模块的光源阵列的出光侧，所述透镜组设置在所述出光孔处。
PCT/CN2025/090274 2024-05-31 2025-04-22 发光模块、打印头及图像形成设备 Pending WO2025246732A1 (zh)

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JP2002137437A (ja) * 2000-10-31 2002-05-14 Kyocera Corp 光プリンタヘッド
JP2013010334A (ja) * 2011-06-30 2013-01-17 Ricoh Co Ltd 光プリントヘッド及び画像形成装置
CN110361947A (zh) * 2018-04-09 2019-10-22 柯尼卡美能达株式会社 光学写入装置以及图像形成装置
CN215117079U (zh) * 2021-04-09 2021-12-10 深圳创维－Rgb电子有限公司 一种led光源模组及发光面板
CN114675515A (zh) * 2020-12-24 2022-06-28 东芝泰格有限公司 打印头及图像形成装置
CN117002160A (zh) * 2022-04-29 2023-11-07 华为技术有限公司 Led发光模块、led打印头和led打印机

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Publication number Priority date Publication date Assignee Title
US5600363A (en) * 1988-12-28 1997-02-04 Kyocera Corporation Image forming apparatus having driving means at each end of array and power feeding substrate outside head housing
JP2002137437A (ja) * 2000-10-31 2002-05-14 Kyocera Corp 光プリンタヘッド
JP2013010334A (ja) * 2011-06-30 2013-01-17 Ricoh Co Ltd 光プリントヘッド及び画像形成装置
CN110361947A (zh) * 2018-04-09 2019-10-22 柯尼卡美能达株式会社 光学写入装置以及图像形成装置
CN114675515A (zh) * 2020-12-24 2022-06-28 东芝泰格有限公司 打印头及图像形成装置
CN215117079U (zh) * 2021-04-09 2021-12-10 深圳创维－Rgb电子有限公司 一种led光源模组及发光面板
CN117002160A (zh) * 2022-04-29 2023-11-07 华为技术有限公司 Led发光模块、led打印头和led打印机

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