WO2025241998A1 - 触控显示面板和触控显示装置 - Google Patents

触控显示面板和触控显示装置

Info

Publication number
WO2025241998A1
WO2025241998A1 PCT/CN2025/095414 CN2025095414W WO2025241998A1 WO 2025241998 A1 WO2025241998 A1 WO 2025241998A1 CN 2025095414 W CN2025095414 W CN 2025095414W WO 2025241998 A1 WO2025241998 A1 WO 2025241998A1
Authority
WO
WIPO (PCT)
Prior art keywords
touch
display
module
terminals
display panel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/CN2025/095414
Other languages
English (en)
French (fr)
Inventor
王志强
刘帅
张贵玉
阮露
罗萍
刘建军
刘双绮
姜立清
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOE Technology Group Co Ltd, Chengdu BOE Optoelectronics Technology Co Ltd filed Critical BOE Technology Group Co Ltd
Publication of WO2025241998A1 publication Critical patent/WO2025241998A1/zh
Pending legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40—OLEDs integrated with touch screens
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/123—Connection of the pixel electrodes to the thin film transistors [TFT]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals

Definitions

  • This disclosure relates to the field of display technology, and more particularly to a touch display panel and a touch display device.
  • OLED Organic light-emitting diode
  • advantages such as self-illumination, rich colors, fast response speed, wide viewing angle, light weight, thinness, low power consumption, and the ability to achieve flexible displays. They are now widely used in mobile phones, televisions, and wearable devices.
  • the display module still needs to retain numerous electronic components, such as source driver chips, touch chips, and timing controller chips, resulting in high overall costs. How to gradually transition the numerous components in the display module from discrete ICs to integrated ICs is one of the important research topics for researchers.
  • a touch display panel comprising:
  • a substrate including a display area and a peripheral area
  • a first pad area located in the peripheral area, includes a plurality of first terminals, wherein the first pad area includes an output lead pad area; the plurality of first terminals include a plurality of touch electrode terminals disposed in the output lead pad area, and the plurality of touch electrode terminals are electrically connected to the plurality of touch electrodes through a plurality of lead traces; and
  • At least one source driver chip which is connected to the touch display panel through multiple first terminals in the first pad area.
  • the source driver chip includes a touch simulation front-end module, which in turn includes multiple touch electrode units, and...
  • the plurality of touch electrode units are electrically connected to the plurality of touch electrode terminals respectively, and are used to drive the touch electrodes of the touch display panel and collect touch data.
  • the plurality of touch electrodes include a plurality of touch driving electrodes spaced apart along a first direction and a plurality of touch sensing electrodes spaced apart along a second direction, wherein the first direction and the second direction intersect.
  • a portion of the plurality of touch electrode units is electrically connected to the touch driving electrode via the touch electrode terminal;
  • Another portion of the plurality of touch electrode units is electrically connected to the touch sensing electrode via the touch electrode terminal.
  • the first pad area further includes a plurality of first display signal terminals located in the output lead pad area for connection to the display driving circuit inside the touch display panel.
  • the output lead pad area includes a first region, a second region, and a third region arranged sequentially along a first direction;
  • the plurality of first display signal terminals are arranged in an array in the second region in a first direction and a second direction;
  • a portion of the plurality of touch electrode terminals are arranged in an array in the first region in a first direction and a second direction;
  • Another portion of the plurality of touch electrode terminals is arranged in an array in the third region in the first and second directions.
  • the first pad area further includes an input lead pad area, the input lead pad area being located on the side of the output lead pad area away from the display area;
  • the plurality of first terminals also include a plurality of signal input terminals disposed in the input lead pad area for connection to an external display touch driver board.
  • the plurality of signal input terminals include a plurality of second display signal terminals and a plurality of first touch signal terminals.
  • the input lead pad area includes a fourth region, a fifth region, and a sixth region arranged sequentially along a first direction;
  • the plurality of second display signal terminals are arranged in an array in the fifth region in the first direction and the second direction;
  • a portion of the plurality of first touch signal terminals are arranged in an array in the fourth region in the first and second directions;
  • Another portion of the plurality of first touch signal terminals is arranged in an array in the sixth region in the first direction and the second direction.
  • the touch simulation front-end module further includes a plurality of analog-to-digital conversion modules, each of the analog-to-digital conversion modules being connected to at least one of the touch electrode units.
  • the source driver chip further includes a first power management module, a first interface circuit module, a first timing control module, and a first storage unit module, wherein at least one of the first power management module, the first interface circuit module, the first timing control module, or the first storage unit module is used for the touch simulation front-end module.
  • a touch display device comprising: a touch display panel as described in any of the preceding claims;
  • At least one flexible circuit board bonded to the touch display panel; and a display touch driver board electrically connected to the touch display panel via the flexible circuit board.
  • the display touch driver board includes a timing controller and a touch digital back-end module.
  • the timing controller includes a display unit module, which is used to provide timing control signals and data display signals to the touch display panel.
  • the touch digital back-end module is used for algorithm noise reduction processing of touch data and touch coordinate reporting calculation.
  • the timing controller further includes an image data processing module, a second power management module, a second timing control module, and a second storage unit module.
  • At least one of the image data processing module, the second power management module, the second timing control module, or the second storage unit module is used in the touch digital back-end module.
  • At least one of the source driver chips is connected to the timing controller via at least one of the flexible circuit boards.
  • the flexible circuit board includes a third display signal terminal and a second touch signal terminal, wherein the third display signal terminal is connected to the second display signal terminal in a corresponding manner; and the second touch signal terminal is connected to the first touch signal terminal in a corresponding manner.
  • the touch simulation front-end module includes multiple touch data output interfaces; the timing controller includes multiple touch data input interfaces.
  • Each of the aforementioned touch data output interfaces is connected to one of the aforementioned touch data input interfaces; or...
  • Each of the multiple touch data output interfaces is connected to one touch data input interface.
  • touch data is transmitted between the touch data output interface and the touch data input interface in the form of an embedded clock differential signal.
  • the touch display device further includes a main control terminal, and the timing controller communicates with the main control terminal using an embedded display port protocol.
  • the display touch driver board includes at least one power management chip for providing voltage signals to the touch analog front-end module in the source driver chip or the touch digital back-end module in the timing controller.
  • the power management chip includes a first side and a second side disposed opposite to each other in a first direction.
  • the display touch driver board includes a third side and a fourth side disposed opposite to each other in the first direction.
  • first side and the third side are separated by a first interval distance in a first direction
  • second side and the fourth side are separated by a second interval distance in a first direction
  • the ratio of the first interval distance to the second interval distance is between 0.8 and 1.2.
  • Figure 1 is a schematic diagram of the structure of some existing exemplary touch display devices
  • Figure 2 is a plan view of some existing exemplary touch display panels, showing the connection relationship between touch electrodes, source driver chips and flexible circuit boards;
  • Figure 3 is a plan view of a touch display panel according to some embodiments of the present disclosure.
  • Figure 4 is a structural block diagram of a touch display panel according to some embodiments of the present disclosure.
  • Figure 5 is an enlarged planar schematic diagram of the first pad area in Figure 3;
  • Figure 6 is a structural block diagram of a source driver chip according to some embodiments of the present disclosure.
  • Figure 7 is a structural block diagram of a touch simulation front-end module according to some embodiments of the present disclosure.
  • Figure 8 is a plan view of a touch display device according to some embodiments of the present disclosure.
  • FIG. 9 is a structural block diagram of a timing controller according to some embodiments of the present disclosure.
  • Figures 10A-10C are schematic plan views of a touch display device according to an embodiment of the present disclosure.
  • Figure 11 is a plan view of a touch display device according to an embodiment of the present disclosure.
  • Figure 12 is a plan view of a touch display device according to an embodiment of the present disclosure.
  • first direction and second direction are used to describe different orientations of the display panel, such as the row direction and column direction of the display panel. It should be understood that such representations are merely exemplary descriptions and not limitations of this disclosure.
  • the term "electrical connection” can mean that two components or elements are directly electrically connected, for example, component or element A is in direct contact with component or element B, and an electrical signal can be transmitted between them; it can also mean that two components or elements are electrically connected through a conductive medium, such as a conductive wire, for example, component or element A is electrically connected to component or element B through a conductive wire to transmit an electrical signal between the two components or elements; it can also mean that two components or elements are electrically connected through at least one electronic component, for example, component or element A is electrically connected to component or element B through at least one thin-film transistor to transmit an electrical signal between the two components or elements.
  • parallel refers to the state where the angle formed by two straight lines is greater than -10° and less than 10°, and therefore also includes the state where the angle is greater than -5° and less than 5°.
  • the gate driver chip (source driver) is integrated on the panel as GOA (Gate Driven on Array), the touch chip and the source driver chip are integrated as TDDI chip (Touch and Display Driver Integration), the T-con chip (Timing Controller) and the source driver chip are integrated as TED chip, etc.
  • GOA Gate Driven on Array
  • TDDI chip Touch and Display Driver Integration
  • T-con chip Timing Controller
  • TED chip TED chip
  • OLED displays characterized by high contrast, high brightness, low power consumption, and flexibility, have garnered widespread attention and are playing an increasingly important role in consumer electronics such as mobile phones, tablets, and laptops.
  • OLED display modules still require the retention of numerous key electronic components.
  • an OLED display module includes multiple source driver chips, touch chips, T-con chips, multiple power management chips (PMICs), level shifters, flash chips, and other discrete IC chips.
  • touch chips are typically designed on a display touch driver board (also known as a PCB). Due to the numerous connection traces between the touch chip and the touch electrodes, the display touch driver board needs to have a large number of touch traces designed. This requires the use of a multi-layer high-density interconnect (HDI) PCB, resulting in a larger PCB size and increased costs.
  • HDMI high-density interconnect
  • Figure 1 is a structural schematic diagram of some existing touch display devices
  • Figure 2 is a planar schematic diagram of some existing touch display panels, showing the connection relationship between touch electrodes, source driver chips and flexible circuit boards.
  • the touch display device 100 includes a touch display panel 10, at least one flexible printed circuit board (FPC board) 20 bonded to the touch display panel 10, and a display touch driver board 30.
  • the touch display driver board 30 and the touch display panel 10 can be connected through one or more FPC boards 20 to realize signal transmission between the touch display driver board 30 and the touch display panel 10, thereby achieving different driving display effects.
  • the FPC board 20 and the touch display panel 10 can be bonded together in the FOP bonding area
  • the FPC board 20 and the touch display driver board 30 can be bonded together in the FOB bonding area.
  • the touch display device 100 may also include a source driver chip 11, a timing controller T-con, and a touch chip 50.
  • the source driver chip 11 is usually designed on the touch display panel 10, and the timing controller T-con and the touch chip 50 are usually designed on the touch display driver board 30.
  • the touch display panel 10 may include multiple touch electrodes 121, such as multiple touch sensing electrodes RX and multiple touch driving electrodes TX. Since the touch chip 50 is located on the touch display driver board 30, and multiple pins in the touch chip 50 need to be connected to the touch electrodes 121 located in the touch display panel 10, a large number of touch lead-out traces need to be designed on the touch display driver board 30. Therefore, the touch display driver board needs to use a multi-layer high-density interconnect (HDI) PCB board, resulting in a larger PCB size and increased cost.
  • HDMI high-density interconnect
  • the touch electrodes 121 of the touch display panel 10 and the pins in the touch chip 50 need to be electrically connected through leads in the FPC board.
  • the number of pins bonded to the touch display panel 10 in the FPC board also needs to be increased, leading to increased pin density and reduced spacing between pins in the FPC board, which adversely affects the yield of the display module.
  • the touch chips in existing touch display devices mainly include the following modules: Analog Front End (AFE), Digital Back End (DBE), Power Management Unit (PMU), and interface circuit modules, etc.
  • AFE Analog Front End
  • DBE Digital Back End
  • PMU Power Management Unit
  • interface circuit modules etc.
  • the touch simulation front-end module mainly includes the following modules or units: touch scanning control circuit, programmable gain amplifier (PGA) or operational amplifier (OP-AMP), anti-alias filter, multiple analog-to-digital converter (ADC) modules, touch driver electrode unit, and touch sensing electrode unit.
  • Each ADC module corresponds to at least one touch sensing pin, i.e., at least one touch sensing channel.
  • a touch chip for a flexible OLED laptop it can support displays up to 14 inches when supporting active stylus, including 49 touch driver pins and 74 touch sensing pins. If the ratio of ADC modules to touch sensing pins in the internal configuration of the touch chip is 1:1, then at least 74 ADC modules are required. If the ratio of ADC modules to touch sensing pins in the internal configuration of the touch chip is 1:2, then at least 37 ADC modules are required.
  • the touch digital back-end module mainly includes the following modules or units: image data processing module, such as MCU (Microcontroller Unit) or DSP (Digital Signal Processing) (including digital filters, hardware accelerators, etc.), clock module, storage unit module (SRAM or Flash), interface circuit module, and active pen control module.
  • image data processing module such as MCU (Microcontroller Unit) or DSP (Digital Signal Processing) (including digital filters, hardware accelerators, etc.), clock module, storage unit module (SRAM or Flash), interface circuit module, and active pen control module.
  • the two core modules of a touch chip are the analog front-end module (AFE) and the digital back-end module (DBE).
  • AFE analog front-end module
  • DBE digital back-end module
  • these functional modules can be separated and integrated into other existing chips or modules, thus eliminating the need for a separate touch chip.
  • the AFE can be integrated into the gate driver chip, and the DBE into the timing controller (T-con) chip, thereby eliminating the need for a separate touch chip and reducing costs. Simultaneously, it can reduce the number of pins on the FPC board, improving the yield rate of the display module.
  • Figure 3 is a plan view of a touch display panel according to some embodiments of the present disclosure
  • Figure 4 is a structural block diagram of a touch display panel according to some embodiments of the present disclosure.
  • a touch display panel 10 is provided.
  • the touch display panel 10 includes a substrate 1.
  • the substrate may include a flexible substrate, such as a PI substrate.
  • the substrate 1 includes a display area AA and a peripheral area NA.
  • the touch display panel 10 further includes a touch layer 120 disposed on the substrate 1, the touch layer 120 including a plurality of touch electrodes 121 located in the display area AA.
  • the touch display panel 10 further includes a first pad area 110 located in the peripheral area NA.
  • the first pad area 110 can be used to bond multiple source driver chips.
  • the touch display panel 10 may further include a driving circuit layer, a light-emitting layer, a cathode layer, and an encapsulation layer disposed between the substrate 1 and the touch layer 120.
  • the encapsulation layer may be a multilayer thin-film encapsulation layer.
  • the touch display panel 10 may also include components such as a polarizer, OCA transparent optical adhesive, and a cover plate disposed on the side of the touch layer 120 away from the substrate 1.
  • the first pad area 110 may include a plurality of first terminals 1000.
  • the plurality of first terminals 1000 can be used to bond and connect to a plurality of pins of the source driver chip.
  • the first pad area 110 includes an output lead pad area OLB.
  • the plurality of first terminals 1000 include a plurality of touch electrode terminals 511 disposed on the output lead pad area OLB.
  • the plurality of touch electrode terminals 511 can be electrically connected to a plurality of touch electrodes 121 through a plurality of lead-out traces 150, thereby acquiring touch data or driving touch electrodes.
  • the plurality of first terminals 1000 may also include a plurality of first display signal terminals 111 disposed on the output lead pad area OLB.
  • the first display signal terminals 111 can be correspondingly connected to the driving circuit layer inside the display panel, thereby providing driving control signals to the driving circuit layer.
  • the first pad area 110 may also include an input lead pad area ILB, the input lead pad area ILB being located on the side of the output lead pad area OLB away from the display area AA.
  • the multiple first terminals 1000 may also include multiple signal input terminals 200 located in the input lead pad area ILB.
  • the multiple signal input terminals 200 can be used to connect with an external display touch driver board (PCB board) to realize communication between the source driver chip and the external touch display driver board (PCB board), thereby realizing the drive control of the touch display panel.
  • PCB board external display touch driver board
  • the multiple signal input terminals 200 may include multiple second display signal terminals 112 and multiple first touch signal terminals 512.
  • the multiple second display signal terminals 112 may be electrically connected to a portion of the pins on an external PCB board used for transmitting display signals, thereby transmitting display-related signals.
  • the multiple first touch signal terminals 512 may be electrically connected to a portion of the pins on an external PCB board used for transmitting touch signals, thereby transmitting touch-related signals.
  • the touch display panel 10 may also include an FOP bonding area for bonding with an FPC.
  • the FOP bonding area has multiple terminals, which may be bonded to multiple pins in the FPC within the FOP bonding area, thereby achieving electrical connection between the touch display panel 10 and the FPC board.
  • the FPC board includes multiple third display signal terminals 113 and multiple second touch signal terminals 513 located in the FOP bonding area.
  • the multiple third display signal terminals 113 may be electrically connected to the multiple second display signal terminals 112 respectively.
  • the multiple second touch signal terminals 513 may be electrically connected to the multiple first touch signal terminals 512 respectively.
  • multiple terminals in the FOP bonding area are electrically connected to an external touch display driver board (PCB) via traces in the FPC, thereby enabling at least a portion of the multiple first terminals 1000 in the first pad area 110 to be electrically connected to the external touch display driver board (PCB).
  • PCB external touch display driver board
  • the touch display panel 10 further includes at least one source driver chip 11, which may be located in the peripheral area of the touch display panel.
  • the number of source driver chips may also be multiple.
  • the source driver chip 11 may include multiple pins.
  • the source driver chip 11 is connected to the touch display panel 10 by bonding multiple pins of the source driver chip 11 to multiple first terminals 1000 of the first pad area 110. Since the multiple signal input terminals 200 included in the input lead pad area ILB in the first pad area 110 are electrically connected to the external touch display driver board (PCB) through an FPC board, the source driver chip 11 can also be electrically connected to the external touch display driver board (PCB), thereby enabling signal transmission between the touch display driver board (PCB) and the source driver chip 11.
  • PCB external touch display driver board
  • the source driver chip 11 may include a touch analog front-end module (AFE).
  • the touch analog front-end module AFE includes multiple touch electrode units (TRX), such as a first touch electrode unit TRX-1, a second touch electrode unit TRX-2, ..., an Nth touch electrode unit TRX-N.
  • the multiple touch electrode units TRX in the touch analog front-end AFE may include a portion of the pins of the multiple pins in the source driver chip 11 for electrical connection with the touch electrodes in the display area. Therefore, in the embodiments of this disclosure, the touch electrode unit may also be referred to as a touch electrode channel pin.
  • the multiple touch electrode units TRX of the touch analog front-end AFE can be correspondingly connected to the multiple touch electrode terminals 511 and the multiple touch signal terminals 512, thereby driving the touch electrodes of the touch display panel or acquiring touch data.
  • the plurality of touch electrodes 121 include a plurality of touch driving electrodes TX spaced apart along a first direction X and a plurality of touch sensing electrodes RX spaced apart along a second direction Y, wherein the first direction X and the second direction Y intersect.
  • the plurality of touch electrode units TRX can be electrically connected to the touch sensing electrodes RX and/or the touch driving electrodes TX in the touch display panel, respectively.
  • a portion of the plurality of touch electrode units TRX in the touch simulation front-end module AFE can be electrically connected to the touch driving electrodes TX via touch electrode terminals 511.
  • Another portion of the plurality of touch electrode units TRX can be electrically connected to the touch sensing electrodes RX via touch electrode terminals 511.
  • the touch simulation front-end module AFE can drive the touch electrodes or acquire touch data.
  • the touch electrode units in the touch simulation front-end module AFE and the touch electrodes 121 in the display area AA of the touch display panel can be electrically connected through multiple touch electrode terminals 511 of the first pad area 110.
  • the ports where the touch simulation front-end module AFE needs to communicate with the external touch display driver board (PCB) can retain only the pins (or touch signal units) corresponding to the multiple first touch signal terminals 512 shown in Figure 3.
  • the multiple first touch signal terminals 512 are electrically connected to multiple second touch signal terminals 513 via lead-out traces.
  • the multiple touch signal terminals 513 are connected to the FPC board, and the FPC board is connected to the external touch display driver board (PCB), thereby realizing signal transmission between the touch display driver board (PCB) and the touch simulation front-end module AFE.
  • This design significantly reduces the number of touch-related traces on the display touch driver board (or PCB), allowing for a corresponding reduction in the number of PCB layers (e.g., from 8 layers to 6 or 4 layers).
  • the size of the display touch driver board can be further reduced, thereby lowering costs.
  • the number of touch signal-related pins in the FPC board can be significantly reduced, which helps improve the yield rate of the display module.
  • the touch display driver board (PCB) requires 49 touch driver pin traces, 74 touch sensing pin traces, and about 10 communication interface traces.
  • the touch driving pin traces and touch sensing pin traces no longer need to be laid out on the touch display driver board (PCB). Therefore, the number of touch-related traces on the touch display driver board (PCB) can be reduced by more than 80%, thereby reducing the cost of the PCB.
  • AFE touch simulation front-end module
  • Figure 5 is an enlarged planar schematic diagram of the first pad area in Figure 3.
  • the output lead pad area OLB includes a first region S1, a second region S2, and a third region S3 sequentially arranged along a first direction X.
  • a plurality of first display signal terminals 111 may be arranged in an array in the second region S2 along the first direction X and the second direction Y.
  • a portion of a plurality of touch electrode terminals 511 may be arranged in an array in the first region S1 along the first direction X and the second direction Y.
  • Another portion of the multiple touch electrode terminals 511 can be arranged in an array in the third region S3 along the first direction X and the second direction Y. That is, the multiple touch electrode terminals 511 can be located in the regions on both sides of the multiple first display signal terminals 111.
  • the input lead pad area ILB includes a fourth region S4, a fifth region S5, and a sixth region S6 sequentially arranged along a first direction X.
  • a plurality of second display signal terminals 112 are arranged in an array in the fifth region S5 along the first direction X and the second direction Y.
  • a portion of a plurality of first touch signal terminals 512 are arranged in an array in the fourth region S4 along the first direction X and the second direction Y.
  • Another portion of the plurality of first touch signal terminals 512 are arranged in an array in the sixth region S6 along the first direction X and the second direction Y.
  • the output lead pad area may include at least one row of terminals.
  • the output lead pad area may include a single row of terminals, a double row of terminals, a triple row of terminals, or more rows of terminals.
  • the input lead pad area ILB may include at least one row of terminals.
  • the input lead pad area ILB may include a single row of terminals, a double row of terminals, or more rows of terminals.
  • Figure 5 is only an illustrative representation of the terminal arrangement in the first pad area, but the embodiments of this disclosure are not limited thereto.
  • the terminal arrangement in the first pad area can be flexibly designed according to the number of terminals and the connection method with external traces.
  • multiple touch electrode units (TRX) in the touch analog front-end module (AFE) of each source driver chip 11 can be connected to the touch driving electrode (TX) and/or touch sensing electrode (RX) in the corresponding area of the touch display panel.
  • the touch electrode units (TRX) in the touch analog front-end module (AFE) connected to the touch driving electrode (TX) in the touch display panel can be configured as touch driving pins
  • the touch electrode units (TRX) in the touch analog front-end module (AFE) connected to the touch sensing electrode (RX) in the touch display panel can be configured as touch sensing pins.
  • the touch electrode units (TRX) in the touch analog front-end module (AFE) of each source driver chip 11 can be freely and flexibly configured as touch driving pins or touch sensing pins according to specific needs. This design greatly enhances the flexibility of the touch trace design on the outer perimeter of the touch display panel, significantly reduces the number of vias and trace wrapping in the touch channel, and is beneficial for narrow bezel design of OLED panels.
  • Figure 6 is a structural block diagram of a source driver chip according to some embodiments of the present disclosure
  • Figure 7 is a structural block diagram of a touch simulation front-end module according to some embodiments of the present disclosure.
  • the source driver chip 11 in the touch display panel may include a touch scanning control module 1101, a touch analog front-end module AFE, a line latch module 1102, a level shifter module 1103, a digital-to-analog converter module DAC, a voltage buffer module 11104, a first power management module PMU1, a first interface circuit module 1105, a first timing control module OSC1, a first storage unit module 1106, and a logic controller module 1107.
  • At least one of the first power management module PMU1, the first interface circuit module 1105, the first timing control module OSC1, or the first storage unit module 1106 can be used in the touch analog front-end module. That is, when the touch analog front-end module AFE is integrated into the source driver chip 11, some modules in the touch analog front-end module AFE can be integrated and shared with some functional modules in the original source driver chip 11. For example, one or more modules of the first power management module PMU1, the first interface circuit module 1105, the first timing control module OSC1, or the first storage unit module 1106 can be used simultaneously in both the touch analog front-end module AFE and the source driver chip 11.
  • the first interface circuit module 1105 of the source driver chip 11 may include a display communication unit 051 and a touch communication unit 052.
  • the display communication unit 051 can communicate with the display unit module in the timing controller T-con chip.
  • the display communication unit 051 and the display unit modules in the T-con chip can transmit various types of signals, such as BCL (Bi-directional Command Link) and PHI (Point-to-point High-speed Interface).
  • the touch communication unit 052 can communicate with the touch unit modules in the T-con chip, for example, to transmit touch data.
  • the first power management module PMU1 can simultaneously provide the required voltage to the touch analog front-end module AFE and other modules of the source driver chip.
  • the multiple line latch modules 1102 may include multiple line latches, which can be switched between two stable states by a 1 and a 0 stable state control signal.
  • the source driver chip may also include a grayscale voltage processing module (GMA), which can transmit different grayscale voltage data to the digital-to-analog converter (DAC).
  • GAA grayscale voltage processing module
  • DAC digital-to-analog converter
  • different grayscale voltage data may include multiple different grayscale voltage data such as VGAM1, VGAM2, ..., VGAM13, thereby controlling the corresponding pixels to achieve different display effects.
  • the touch analog front-end module (AFE) in the source driver chip may include multiple touch electrode units (TRX) and multiple analog-to-digital converter (ADC) modules for driving the touch electrodes of the touch display panel and acquiring touch data.
  • Each ADC module is connected to at least one touch electrode unit (TRX).
  • an analog-to-digital converter can be connected to one touch electrode unit (TRX).
  • an analog-to-digital converter can connect to multiple touch electrode units (TRXs).
  • TRXs touch electrode units
  • an ADC can connect to two touch electrode units (TRXs).
  • TRXs touch electrode units
  • TRXs three touch electrode units
  • the touch-simulated front-end module may also include at least one low-pass filter (LPF).
  • LPF low-pass filter
  • Figure 8 is a plan view of a touch display device according to some embodiments of the present disclosure
  • Figure 9 is a structural block diagram of a timing controller according to some embodiments of the present disclosure.
  • a touch display device 100 may include the touch display panel 10 of any of the above embodiments.
  • the touch display device can include, but is not limited to, any product or component with a display function, such as electronic paper, mobile phones, tablet computers, monitors, laptops, digital photo frames, and navigators. It should be understood that this touch display device has the same beneficial effects as the touch display panel provided in the foregoing embodiments.
  • the touch display device 100 may further include: at least one FPC board 20 bonded to the touch display panel 10; and a display touch driver board 30 connected to the touch display panel 10 via the FPC board 20.
  • the display touch driver board 30 may include a PCB board and various electronic components disposed on the PCB board.
  • the various electronic components may include a timing controller T-con, at least one power management chip (PMIC chip), a level shift chip, a cache chip Flash, etc.
  • the touch display panel 10 may include multiple source driver chips 11, and each source driver chip 11 may include a touch analog front-end module (AFE).
  • the multiple source driver chips 11 in the touch display panel 10 can be connected to the display touch driver board 30 via multiple FPC boards.
  • each source driver chip 11 can be connected to the display touch driver board 30 via a corresponding FPC board, thereby enabling signal transmission between the multiple source driver chips 11 and the display touch driver board 30.
  • the touch display panel 10 may include a bending area 180, which is located on the side of the source driver chip 11 near the display area AA.
  • the touch display panel 10 may be designed with a bending feature in the bending area 180, thereby allowing the driver module to be designed to the side or backlight surface of the touch display panel, which is beneficial for achieving a narrow bezel of the touch display panel.
  • the display touch driver board 30 may include a timing controller T-con.
  • the timing controller T-con can provide various signals required by the touch display panel, such as timing control signals, display data signals, and other control signals (e.g., gate drive signals).
  • the timing controller T-con can also process the display data to improve the image quality of the panel.
  • the timing controller T-con may include display unit modules, such as a display signal receiving module T02 and a display signal transmitting module T05. These display unit modules can provide timing control signals and data display signals to the touch display panel 10.
  • display unit modules such as a display signal receiving module T02 and a display signal transmitting module T05.
  • These display unit modules can provide timing control signals and data display signals to the touch display panel 10.
  • at least one source driver chip 11 is connected to the timing controller T-con via at least one FPC board, thereby enabling the timing controller T-con to provide timing control signals and data display signals to the source driver chip 11, and ultimately controlling the touch display panel to display different images.
  • the timing controller T-con may further include a touch digital back-end module (DBE).
  • the touch digital back-end module (DBE) can be used for algorithmic noise reduction processing of touch data and touch coordinate reporting calculation.
  • the Digital Back-End Module is another key functional module in a discrete touch chip.
  • the timing controller T-con can be used to perform algorithmic noise reduction processing of touch data and touch coordinate reporting calculations. This eliminates the need for a separate touch chip, reducing the number of components and lowering costs.
  • the touch digital back-end module includes multiple modules such as an image data processing module, a touch barcode scanning control module, a power management module, a timing control module, a storage unit module, and an active pen control module.
  • the timing controller T-con may include an image data processing module T04, a second power management module PMU2, a second timing control module OSC2, a second storage unit module T03, a display signal receiving module T02, a display signal transmitting module T05, and an interface circuit module T01.
  • the touch digital back-end module DBE is integrated into the timing controller T-con, most of the functional modules in the touch digital back-end module DBE can be integrated and shared with some functional modules in the original timing controller T-con.
  • the integrated interface circuit module T01 may include a display interface circuit T011 and a touch interface circuit T012.
  • the integrated second power management module PMU2 includes a display power management unit PMU21 and a touch power management unit PMU22.
  • the touch digital back-end module may include an active pen control module (T06) which can be used to encode and decode touch signals.
  • T06 active pen control module
  • the timing controller T-con may also include a gate drive circuit GOA, which can be used to provide gate drive signals to the touch display panel.
  • GOA gate drive circuit
  • the timing controller T-con can also be connected to the host.
  • the timing controller T-con can aggregate the touch data transmitted by all the source driver chips of the OLED module through the internal image data processing module, perform algorithm noise reduction processing on the touch data and perform touch coordinate reporting calculation, and then upload the reported coordinates to the host.
  • the host realizes unified processing of the reported coordinates.
  • Figures 10A-10C are schematic plan views of a touch display device according to an embodiment of the present disclosure.
  • the touch simulation front-end module includes multiple touch data output interfaces.
  • the timing controller includes multiple touch data input interfaces.
  • the multiple touch data output interfaces in the touch simulation front-end module (AFE) and the multiple touch data input interfaces in the timing controller (T-con) can transmit touch data via touch data signal traces (ATL).
  • the touch data sampled by the touch simulation front-end module can be transmitted to the timing controller (T-con) via the corresponding touch data output interface using an embedded clock differential signal.
  • the timing controller (T-con) aggregates the touch data transmitted from all source driver chips in the touch display panel through its internal data processing module, performs algorithmic noise reduction processing and touch coordinate reporting calculations on the touch data, and then uploads the reported coordinates to the host terminal via interfaces such as SPI/12C/13C.
  • each touch data output interface can be connected to a corresponding touch data input interface. That is, there is an independent touch data signal trace (ATL) between a touch data output interface and a touch data input interface.
  • ATL independent touch data signal trace
  • multiple touch data output interfaces can be connected to the same touch data input interface. That is, multiple touch data output interfaces and one touch data input interface share a common touch data signal trace (ATL). For example, in Figure 10B, two touch data output interfaces and one touch data input interface share a common touch data signal trace (ATL). As another example, in Figure 10C, four touch data output interfaces and one touch data input interface share a common touch data signal trace (ATL).
  • the embedded clock differential signal has a very high transmission rate. Touch data from different areas of the touch display panel acquired by multiple source driver chips can be transmitted in a time-division manner to the internal storage unit module of the timing controller T-con through the same touch data signal trace (ATL). This reduces the number of touch data input interfaces required on the timing controller T-con chip, which helps to reduce chip cost and size.
  • Figure 11 is a plan view of a touch display device according to an embodiment of the present disclosure.
  • the touch display device further includes a host.
  • the timing controller T-con and the host can communicate using the Embedded Display Port (eDP) protocol.
  • eDP Embedded Display Port
  • the AUX channel of the eDP interface of the timing controller T-con chip can be used to report touch coordinates to the host or transmit touch data to the host, thus eliminating the need for SPI/I2C/I3C pins on the timing controller T-con chip used for communication with the host.
  • the touch digital back-end module is embedded inside the timing controller T-con chip.
  • auxiliary channel (AUX Channel) of the eDP interface to transmit touch data has a particular advantage, which can further reduce the number of communication interface pins between the timing controller T-con and the host, and help to reduce the size of the display touch driver board.
  • Figure 12 is a plan view of a touch display device according to an embodiment of the present disclosure.
  • the touch driver board 30 may further include at least one power management chip (PMIC), which can be used to provide voltage signals to the touch analog front-end module (AFE) in the source driver chip 11 or the touch digital back-end module (DBE) in the timing controller T-con.
  • PMIC power management chip
  • the power management chip can also provide operating voltages to other units/modules.
  • the power management chip includes a first side L1 and a second side L2 disposed opposite to each other in the first direction X.
  • the display touch driver board 30 includes a third side L3 and a fourth side L4 disposed opposite to each other in the first direction X.
  • the first side L1 and the third side L3 are separated by a first spacing distance D1 in the first direction X
  • the second side L2 and the fourth side L4 are separated by a second spacing distance D2 in the first direction X.
  • the ratio of the first spacing distance D1 to the second spacing distance D2 is between 0.8 and 1.2.
  • the power management chip can be designed in the middle of the display touch driver board (PCB), ensuring that the trace impedance from the power management chip (PMIC) to the touch analog front-end modules (AFEs) of multiple source driver chips is as similar or close as possible, thereby ensuring that the power supply voltage provided to each touch analog front-end module (AFE) is consistent, which is beneficial to improving the capacitance consistency level of the display touch module.

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Abstract

提供了一种触控显示面板和触控显示装置。触控显示面板包括：衬底基板，衬底基板包括显示区和周边区；设置于衬底基板上的触控层，触控层包括位于显示区的多个触控电极；和第一焊盘区，位于周边区，第一焊盘区包括多个第一端子，其中，第一焊盘区包括输出引线焊盘区；所述多个第一端子包括多个触控电极端子，多个触控电极端子分别通过多条引出走线与多个触控电极电连接；以及至少一个源极驱动芯片，源极驱动芯片通过第一焊盘区的多个第一端子接入触控显示面板，其中，源极驱动芯片包括触控模拟前端模块，触控模拟前端模块包括多个触控电极单元，多个触控电极单元分别与多个触控电极端子电连接，用于驱动触控显示面板的触控电极和采集触控数据。

Description

触控显示面板和触控显示装置 技术领域
本公开涉及显示技术领域，尤其涉及一种触控显示面板和触控显示装置。
背景技术
有机发光二极管(OrganicLight-Emitting Diode，OLED)器件因其自发光、色彩丰富、响应速度快、视角宽、重量轻、厚度薄、耗电少、可实现柔性显示等优点备受关注，如今已经广泛用于手机、电视及可穿戴等设备中。目前中大尺寸的OLED显示装置中，显示模组上仍需要保留众多的电子元器件，例如源极驱动芯片、触控芯片和时序控制器芯片等，导致整体成本高。如何将显示模组中的众多元器件由分离式IC逐步转向集成式IC，是研发人员研究的重要课题之一。
需要说明的是，在上述背景技术部分公开的信息仅用于加强对本公开的背景的理解，因此可以包括不构成对本领域技术人员已知的现有技术的信息。
发明内容
在一个方面，提供一种触控显示面板，其中，包括：
衬底基板，所述衬底基板包括显示区和周边区；
设置于所述衬底基板上的触控层，所述触控层包括位于所述显示区的多个触控电极；和
第一焊盘区，位于所述周边区，所述第一焊盘区包括多个第一端子，其中，所述第一焊盘区包括输出引线焊盘区；所述多个第一端子包括设置于所述输出引线焊盘区的多个触控电极端子，所述多个触控电极端子分别通过多条引出走线与所述多个触控电极电连接；以及
至少一个源极驱动芯片，所述源极驱动芯片通过所述第一焊盘区的多个第一端子接入所述触控显示面板，
其中，所述源极驱动芯片包括触控模拟前端模块，所述触控模拟前端模块包括多个触控电极单元，以及，
所述多个触控电极单元分别与所述多个触控电极端子电连接，用于驱动所述触控显示面板的触控电极和采集触控数据。
根据一些示例性的实施例，所述多个触控电极包括沿第一方向间隔设置的多个触控驱动电极和沿第二方向间隔设置多个触控感应电极，第一方向和第二方向相交；
所述多个触控电极单元中的一部分通过所述触控电极端子与所述触控驱动电极电连接；以及
所述多个触控电极单元中的另一部分通过所述触控电极端子与所述触控感应电极电连接。
根据一些示例性的实施例，所述第一焊盘区还包括位于所述输出引线焊盘区的多个第一显示信号端子，用于与所述触控显示面板内部的显示驱动电路连接。
根据一些示例性的实施例，所述输出引线焊盘区包括沿第一方向依次设置的第一区域、第二区域和第三区域；
所述多个第一显示信号端子在第一方向和第二方向上成阵列排布于所述第二区域；
所述多个触控电极端子中的一部分在第一方向和第二方向上成阵列排布于所述第一区域；以及
所述多个触控电极端子中的另一部分在第一方向和第二方向上成阵列排布于所述第三区域。
根据一些示例性的实施例，所述第一焊盘区还包括：输入引线焊盘区，所述输入引线焊盘区位于所述输出引线焊盘区远离所述显示区的一侧；
所述多个第一端子还包括设置于所述输入引线焊盘区的多个信号输入端子，用于与外部的显示触控驱动板连接，
所述多个信号输入端子包括多个第二显示信号端子和多个第一触控信号端子。
根据一些示例性的实施例，所述输入引线焊盘区包括沿第一方向依次设置的第四区域、第五区域和第六区域；
所述多个第二显示信号端子在第一方向和第二方向上成阵列排布于所述第五区域；
所述多个第一触控信号端子中的一部分在第一方向和第二方向上成阵列排布于所述第四区域；以及
所述多个第一触控信号端子中的另一部分在第一方向和第二方向上成阵列排布于所述第六区域。
根据一些示例性的实施例，所述触控模拟前端模块还包括多个模数转换模块，每个所述模数转换模块至少连接一个所述触控电极单元。
根据一些示例性的实施例，所述源极驱动芯片还包括第一电源管理模块、第一接口电路模块、第一时序控制模块和第一存储单元模块，所述第一电源管理模块、所述第一接口电路模块、所述第一时序控制模块或所述第一储存单元模块中的至少一个用于所述触控模拟前端模块。
在另一方面，提供一种触控显示装置，其中，包括：如上任一项所述的触控显示面板；和
与所述触控显示面板绑定的至少一个柔性电路板；以及显示触控驱动板，所述显示触控驱动板通过所述柔性电路板与所述触控显示面板电连接。
根据一些示例性的实施例，所述显示触控驱动板包括时序控制器和触控数字后端模块，所述时序控制器包括：显示类单元模块，所述显示类单元模块用于为所述触控显示面板提供时序控制信号和数据显示信号；所述触控数字后端模块用于触控数据的算法降噪处理和触控坐标报点运算。
根据一些示例性的实施例，所述时序控制器还包括图像数据处理模块、第二电源管理模块、第二时序控制模块和第二储存单元模块，
所述图像数据处理模块、所述第二电源管理模块、所述第二时序控制模块或所述第二储存单元模块中的至少一个用于所述触控数字后端模块。
根据一些示例性的实施例，至少一个所述源极驱动芯片通过至少一个所述柔性电路板与所述时序控制器连接，
所述柔性电路板包括第三显示信号端子和第二触控信号端子，所述第三显示信号端子与所述第二显示信号端子对应连接；所述第二触控信号端子与所述第一触控信号端子对应连接。
根据一些示例性的实施例，所述触控模拟前端模块包括多个触控数据输出接口；所述时序控制器包括多个触控数据输入接口，
每个所述触控数据输出接口对应连接一个所述触控数据输入接口；或者，
多个所述触控数据输出接口对应连接一个所述触控数据输入接口。
根据一些示例性的实施例，所述触控数据输出接口和所述触控数据输入接口之间采用内嵌时钟差分信号形式传递触控数据。
根据一些示例性的实施例，所述触控显示装置还包括主控端，所述时序控制器与所述主控端采用嵌入式显示端口协议通讯。
根据一些示例性的实施例，所述显示触控驱动板包括至少一个电源管理芯片，用于为所述源极驱动芯片中的触控模拟前端模块或所述时序控制器中的触控数字后端模块提供电压信号，所述电源管理芯片包括在第一方向上相对设置的第一侧边和第二侧边；所述显示触控驱动板包括在第一方向上相对设置的第三侧边和第四侧边，
其中，所述第一侧边与所述第三侧边在第一方向上间隔第一间隔距离，所述第二侧边和所述第四侧边在第一方向上间隔第二间隔距离，所述第一间隔距离与所述第二间隔距离之比在0.8至1.2之间。
附图说明
通过以下参照附图对本公开实施例的描述，本公开的上述内容以及其他目的、特征和优点将更为清楚，在附图中：
图1是根据现有的一些示例性地的触控显示装置的结构示意图；
图2是根据现有的一些示例性地的触控显示面板的平面示意图，其中示出了触控电极、源极驱动芯片和柔性电路板的连接关系；
图3是根据本公开的一些实施例的触控显示面板的平面示意图；
图4是根据本公开的一些实施例的触控显示面板的结构框图；
图5是根据图3中第一焊盘区的放大的平面示意图；
图6是根据本公开的一些实施例的源极驱动芯片的结构框图；
图7是根据本公开的一些实施例的触控模拟前端模块的结构框图；
图8是根据本公开的一些实施例的触控显示装置的平面示意图；
图9是根据本公开的一些实施例的时序控制器的结构框图；
图10A-10C分别是根据本公开的实施例的触控显示装置的平面示意图；
图11是根据本公开的实施例的触控显示装置的平面示意图；
图12是根据本公开的实施例的触控显示装置的平面示意图。
需要注意的是，为了清晰起见，在用于描述本发明的实施例的附图中，层、结构或区域的尺寸可能被放大或缩小，即这些附图并非按照实际的比例绘制。
具体实施方式
为使本公开实施例的目的、技术方案和优点更加清楚，下面将结合本公开实施例的附图，对本公开实施例的技术方案进行清楚、完整地描述。显然，所描述的实施例是本公开的一部分实施例，而不是全部的实施例。基于所描述的本公开的实施例，本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例，都属于本公开保护的范围。
需要说明的是，在附图中，为了清楚和/或描述的目的，可以放大元件的尺寸和相对尺寸。如此，各个元件的尺寸和相对尺寸不必限于图中所示的尺寸和相对尺寸。在说明书和附图中，相同或相似的附图标号指示相同或相似的部件。
除非另外定义，本公开使用的技术术语或者科学术语应当为本领域普通技术人员所理解的通常意义。本公开中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。“包括”或者“包含”等类似的词语意指出现该词前面的元件或者物件涵盖出现在该词后面列举的元件或者物件及其等同，而不排除其他元件或者物件。
在本文中，除非另有特别说明，诸如“上”、“下”、“左”、“右”、“内”、“外”等方向性术语用于表示基于附图所示的方位或位置关系，仅是为了便于描述本公开，而不是指示或暗示所指的装置、元件或部件必须具有特定的方位、以特定的方位构造或操作。需要理解的是，当被描述对象的绝对位置改变后，则它们表示的相对位置关系也可能相应地改变。因此，这些方向性术语不能理解为对本公开的限制。
在本文中，使用方向性表述“第一方向”、“第二方向”来描述显示面板的不同方向，例如，显示面板的行方向和列方向。应该理解，这样的表示仅为示例性的描述，而不是对本公开的限制。
在本文中，除非另有说明，表述“电连接”可以表示两个部件或元件直接电连接，例如，部件或元件A与部件或元件B直接接触，并且二者之间可以传递电信号；也可以表示两个部件或元件通过例如导电线的导电媒介电连接，例如，部件或元件A通过导电线与部件或元件B电连接，以在两个部件或元件之间传递电信号；还可以表示两个部件或元件通过至少一个电子元器件电连接，例如，部件或元件A通过至少一个薄膜晶体管与部件或元件B电连接，以在两个部件或元件之间传递电信号。
本文中的“约”，是指不严格限定界限，允许工艺和测量误差范围内的数值。
在本文中，“平行”是指两条直线形成的角度为-10°以上且10°以下的状态，因此，也包括该角度为-5°以上且5°以下的状态。
在显示面板及其电子器件发展历程中，从CRT(Cathode Ray Tube)显示装置到LCD(Liquid Crystal Display)显示装置再到OLED显示装置，显示模组上各类重要驱动/控制芯片，由分离式IC演变至集成式IC，减少电子元器件数量，降低电子元器件成本，一直是显示行业各上下游企业多年来持续努力和追求的方向。
在LCD领域，栅极驱动芯片(Source Driver)被集成设置在面板上成为GOA(Gate Driven on Array)，触控芯片和源极驱动芯片集成为TDDI芯片(Touch and Display Driver Integration)、T-con芯片(Timing Controller，也被称作时序控制器)和源极驱动芯片集成为TED芯片等，上述各类显示/触控集成式芯片方案已得到广泛使用。
OLED显示器件具有高对比度、高亮度、低功耗和柔性可折叠的特点，得到了广泛关注，在手机、平板电脑、笔记本电脑等消费电子领域占据越来越重要作用。目前中大尺寸OLED显示领域，OLED显示模组上仍需要保留众多关键电子元器件。例如，OLED显示模组包括多颗源极驱动芯片、触控芯片、T-con芯片、多颗电源管理芯片PMIC(Power Management IC)、电平转换芯片(Level shifter)、Flash芯片等多种分离的IC芯片。
采用分离式的触控芯片设计，一方面会增加电子元器件数量，导致成本高；另一方面，触控芯片通常设计在显示触控驱动板(也可以称作PCB板)上，由于触控芯片与触控电极之间的连接走线较多，会导致显示触控驱动板上需要设计的触控走线数量较多，显示触控驱动板需要使用多层高阶HDI(High Density Interconnector)的PCB板，导致PCB板的尺寸较大，同时也会增加成本。
图1是根据现有的一些触控显示装置的结构示意图；图2是根据现有的一些触控显示面板的平面示意图，其中示出了触控电极、源极驱动芯片和柔性电路板的连接关系。
示例性地，在现有的一些触控显示装置中，参照图1，触控显示装置100包括触控显示面板10、与触控显示面板10绑定的至少一个柔性电路板(Flexible Printed Circuit，也可称作FPC板)20以及显示触控驱动板30。触控显示驱动板30和触控显示面板10可以通过一个或多个FPC板20实现连接，从而实现触控显示驱动板30与触控显示面板10之间的信号传输，实现不同的驱动显示效果。例如，FPC板20与触控显示面板10可以在FOP绑定区进行绑定连接，FPC板20与触控显示驱动板30可以在FOB绑定区绑定连接。触控显示装置100还可以包括源极驱动芯片11、时序控制器T-con和触控芯片50。其中，源极驱动芯片11通常设计在触控显示面板10上，时序控制器T-con和触控芯片50通常设计在触控显示驱动板30上。
示例性地，结合参照图1和图2，触控显示面板10可以包括多个触控电极121，例如包括多个触控感应电极RX和多个触控驱动电极TX。由于触控芯片50位于触控显示驱动板30上，而触控芯片50中的多个管脚需要与位于触控显示面板10中的触控电极121连接，因此会导致显示触控驱动板30上需要设计数量较多的触控引出走线。因此，显示触控驱动板需要使用多层高阶HDI(High Density Interconnector)的PCB板，导致PCB的尺寸较大，同时也会增加成本。
示例性地，继续结合参照图1和图2，触控显示面板10的触控电极121和触控芯片50中的管脚需要通过FPC板中的引线实现电连接。由此导致，触控显示面板10与FPC板20连接的FOP绑定区需要设计更多的触控信号端子，例如图2下侧位于FOP绑定区的触控端子510。相应地，FPC板中与触控显示面板10绑定的引脚数量也需要增加，从而导致FPC板中引脚密度增加，引脚之间的间距减小，对显示模组的良率产生不利影响。
发明人经研究发现，现有的触控显示装置中的触控芯片主要包括以下模块：触控模拟前端模块AFE(Analog Front End)、触控数字后端模块DBE(Digital Back End)、电源管理模块PMU(Power Management Unit)和接口电路模块等。
其中，触控模拟前端模块主要包括以下模块或单元：触控扫描控制电路、可编程增益放大器PGA(Programmable Gain Amplifier)或运算放大器OP-AMP(Operational Amplifier)、抗混频滤波器(Anti-alias filter)、多个模数转换模块ADC、触控驱动电极单元、触控感应电极单元。每个模数转换模块ADC至少对应1个触控感应管脚，即至少对应1个触控感应通道。以柔性OLED笔记本电脑的某触控芯片为例，支持主动式触控笔条件下可支持至14英寸显示屏，其中包括49个触控驱动管脚和74个触控感应管脚。若触控芯片内部配置中模数转换模块ADC数量：触控感应管脚数量＝1：1，则至少需74个模数转换模块ADC。若触控芯片内部配置中模数转换模块ADC数量：触控感应管脚数量＝1：2，则至少需37个模数转换模块ADC。
触控数字后端模块主要包括以下模块或单元：图像数据处理模块，例如MCU(Microcontroller Unit)或DSP(Digital Signal Processing)(包括数字滤波器、硬件加速器等)、时钟模块、存储单元模块(SRAM或Flash)、接口电路模块、主动笔控制模块。
触控芯片的两大核心模块为触控模拟前端模块AFE和触控数字后端模块DBE。针对触控芯片中的各个模块的作用和线路连接关系，可以将触控芯片中的各个功能模块分离，然后分别集成到其他已有的芯片或模块中，从而可以取消分离式的触控芯片。例如，可以将触控芯片中的触控模拟前端模块AFE集成到栅极驱动芯片中，将触控芯片中的触控数字后端模块DBE集成到时序控制器T-con芯片中，从而可以省去触控芯片，降低成本；同时还可以减少FPC板中的引脚的数量，提高显示模组的良率。
图3是根据本公开的一些实施例的触控显示面板的平面示意图；图4是根据本公开的一些实施例的触控显示面板的结构框图。
示例性地，在本公开的一些实施例中，参照图3，提供一种触控显示面板10。触控显示面板10包括：衬底基板1。示例性地，衬底基板可以包括柔性衬底，例如PI衬底。衬底基板1包括显示区AA和周边区NA。触控显示面板10还包括设置于衬底基板1之上的触控层120，触控层120可以包括位于显示区AA的多个触控电极121。触控显示面板10还包括第一焊盘区110，第一焊盘区110位于周边区NA。
示例性地，第一焊盘区110可以用于绑定多颗源极驱动芯片。
示例性地，触控显示面板10还可以包括设置在衬底基板1和触控层120之间的驱动电路层、发光层、阴极层、封装层。例如，封装层可以是多层薄膜封装层。
示例性地，触控显示面板10还可以包括设置在触控层120远离衬底基板1一侧的偏光片、OCA透明光学胶、盖板等部件。
示例性地，继续参照图3，第一焊盘区110可以包括多个第一端子1000。多个第一端子1000可以用于与源极驱动芯片的多个引脚绑定连接。例如，第一焊盘区110包括输出引线焊盘区OLB。多个第一端子1000包括设置于输出引线焊盘区OLB的多个触控电极端子511。多个触控电极端子511可以分别通过多条引出走线150与多个触控电极121电连接，从而可以采集触控数据或者驱动触控电极。再例如，多个第一端子1000还可以包括设置于输出引线焊盘区OLB的多个第一显示信号端子111。第一显示信号端子111可以与显示面板内部的驱动电路层对应连接，从而可以为驱动电路层提供驱动控制信号。再例如，第一焊盘区110还可以包括输入引线焊盘区ILB，输入引线焊盘区ILB位于输出引线焊盘区OLB远离显示区AA的一侧。多个第一端子1000还可以包括位于输入引线焊盘区ILB的多个信号输入端子200，多个信号输入端子200可以用于与外部的显示触控驱动板(PCB板)连接，从而实现源极驱动芯片和外部的触控显示驱动板(PCB板)的通讯，进而实现对触控显示面板的驱动控制。
示例性地，多个信号输入端子200可以包括多个第二显示信号端子112和多个第一触控信号端子512。多个第二显示信号端子112可以与外部的PCB板中用于传输显示信号的部分引脚电连接，从而传输显示相关的信号。多个第一触控信号端子512可以与外部PCB板中用于传输触控信号的部分引脚电连接，从而传输触控相关的信号。触控显示面板10还可以包括用于与FPC绑定连接的FOP绑定区。FOP绑定区中设置有多个端子，FOP绑定区中的多个端子可以与FPC中的多个引脚在FOP绑定区中绑定连接，从而实现触控显示面板10与FPC板之间的电连接。例如，FPC板包括位于FOP绑定区中的多个第三显示信号端子113和多个第二触控信号端子513。多个第三显示信号端子113可以分别和多个第二显示信号端子112电连接。多个第二触控信号端子513可以分别和多个第一触控信号端子512电连接。进一步地，FOP绑定区的多个端子通过FPC中的走线与外部的触控显示驱动板(PCB板)电连接，从而可以实现第一焊盘区110中的多个第一端子1000中的至少部分第一端子1000与外部的触控显示驱动板(PCB板)的电连接。
示例性地，结合参照图3和图4，触控显示面板10还包括至少一个源极驱动芯片11，源极驱动芯片11可以位于触控显示面板的周边区。示例性地，源极驱动芯片的数量也可以是多个。源极驱动芯片11可以包括多个管脚。通过将源极驱动芯片11的多个管脚与第一焊盘区110的多个第一端子1000绑定连接，从而将源极驱动芯片11接入触控显示面板10。由于第一焊盘区110中的输入引线焊盘区ILB包括的多个信号输入端子200与外部的触控显示驱动板(PCB板)之间通过FPC板电连接，因此源极驱动芯片11也可以与外部的触控显示驱动板(PCB板)电连接，从而可以实现触控显示驱动板(PCB板)和源极驱动芯片11之间的信号传输。
示例性地，结合参照图4和图6，源极驱动芯片11可以包括触控模拟前端模块AFE，触控模拟前端模块AFE包括多个触控电极单元TRX，例如第一触控电极单元TRX-1、第二触控电极单元TRX-2、...、第N触控电极单元TRX-N。触控模拟前端AFE中的多个触控电极单元TRX可以包括源极驱动芯片11中的多个管脚中的一部分管脚，用于与显示区中的触控电极电连接。因此，在本公开的实施例中，触控电极单元也可以称为触控电极通道管脚。结合参照图3，在将源极驱动芯片11的多个管脚与第一焊盘区110的多个第一端子1000绑定连接时，可以实现触控模拟前端AFE的多个触控电极单元TRX与多个触控电极端子511和多个触控信号端子512对应连接，从而可以驱动触控显示面板的触控电极或采集触控数据。
示例性地，在本公开的一些实施例中，继续参照图3，多个触控电极121包括沿第一方向X间隔设置的多个触控驱动电极TX和沿第二方向Y间隔设置多个触控感应电极RX，第一方向X和第二方向Y相交。多个触控电极单元TRX可以分别与触控显示面板中的触控感应电极RX和/或触控驱动电极TX电连接。例如，触控模拟前端模块AFE中的多个触控电极单元TRX中的一部分可以通过触控电极端子511与触控驱动电极TX电连接。多个触控电极单元TRX中的另一部分可以通过触控电极端子511与触控感应电极RX电连接。通过这样设计，触控模拟前端模块AFE可以实现对触控电极的驱动或者采集触控数据。
通过将触控模拟前端模块AFE集成到源极驱动芯片11中，触控模拟前端模块AFE中的触控电极单元与触控显示面板的显示区AA中的触控电极121可以通过第一焊盘区110的多个触控电极端子511实现电连接。触控模拟前端模块AFE需要与外部的触控显示驱动板(PCB板)进行通讯的端口可以仅保留如图3所示的多个第一触控信号端子512对应的部分管脚(或触控信号单元)。多个第一触控信号端子512通过引出走线分别与多个第二触控信号端子513电连接，多个触控信号端子513与FPC板连接，FPC板与外部的触控显示驱动板(PCB板)连接，从而实现触控显示驱动板(PCB板)与触控模拟前端模块AFE之间的信号传输。
通过这样的设计，可以大幅减少显示触控驱动板(或PCB板)上的触控相关走线的数量，PCB板的设计层数可以相应减少(例如从8层PCB减少至6层PCB或4层PCB)，显示触控驱动板的尺寸可以进一步缩小，从而降低成本。另一方面，FPC板中与触控信号相关的引脚数量可以大幅减少，有利于提高显示模组的良率。
示例性地，以14inch柔性OLED笔记本电脑产品为例(支持主动式触控笔条件下)，当使用分离式的触控芯片时，触控显示驱动板(PCB板)上需要49条触控驱动管脚走线、74个触控感应管脚走线以及10条左右的通讯接口走线。
在本公开的一些实施例中，通过采用将触控模拟前端模块AFE集成到源极驱动芯片11的设计，触控驱动管脚走线和触控感应管脚走线无需再布局走线在触控显示驱动板(PCB板)上，因此，触控显示驱动板(PCB板)上触控相关走线数量可减少超过80％，从而可以降低PCB板的成本。
图5是根据图3中第一焊盘区的放大的平面示意图。
示例性地，在本公开的一些实施例中，参照图5，输出引线焊盘区OLB包括沿第一方向X依次设置的第一区域S1、第二区域S2和第三区域S3。多个第一显示信号端子111可以在第一方向X和第二方向Y上成阵列排布于第二区域S2中。多个触控电极端子511中的一部分可以在第一方向X和第二方向Y上成阵列排布于第一区域S1。
多个触控电极端子511中的另一部分可以在第一方向X和第二方向Y上成阵列排布于第三区域S3中。也就是说，多个触控电极端子511可以位于多个第一显示信号端子111的两侧区域。
示例性地，输入引线焊盘区ILB包括沿第一方向X依次设置的第四区域S4、第五区域S5和第六区域S6。多个第二显示信号端子112在第一方向X和第二方向Y上成阵列排布于第五区域S5中。多个第一触控信号端子512中的一部分在第一方向X和第二方向Y上成阵列排布于第四区域S4。多个第一触控信号端子512中的另一部分在第一方向X和第二方向Y上成阵列排布于第六区域S6中。
示例性地，输出引线焊盘区OLB可以包括至少一排端子。例如输出引线焊盘区OLB可以包括单排端子、双排端子、三排端子或更多排端子。
示例性地，输入引线焊盘区ILB可以包括至少一排端子。例如输入引线焊盘区ILB可以包括单排端子、双排端子或更多排端子。
需要说明的是，图5仅为示例性说明第一焊盘区中的端子的排布方式，但本公开的实施例不仅限于此。在本公开的实施例中，可以根据端子的数量以及与外部的走线的连接方式对第一焊盘区中的端子的排布方式进行灵活的设计。
示例性地，参照图3和图6，每个源极驱动芯片11中的触控模拟前端模块AFE中的多个触控电极单元TRX可以与触控显示面板中对应区域的触控驱动电极TX和/或触控感应电极RX对应连接。与触控显示面板中的触控驱动电极TX相连接的触控模拟前端模块AFE中的触控电极单元TRX可被设置为触控驱动管脚，与触控显示面板中的触控感应电极RX相连接的触控模拟前端模块AFE中的触控电极单元TRX可被设置为触控感应管脚。每个源极驱动芯片11中的触控模拟前端模块AFE中的触控电极单元TRX，可根据实际具体需求，自由灵活地被配置为触控驱动管脚或触控感应管脚。通过这样设计，极大增强了触控显示面板上外围触控走线设计灵活度，大幅减少了触控通道走线过孔数量和走线绕线，并且有利于OLED面板窄边框设计。
图6是根据本公开的一些实施例的源极驱动芯片的结构框图；图7是根据本公开的一些实施例的触控模拟前端模块的结构框图。
示例性地，在本公开的一些实施例中，参照图6，触控显示面板中的源极驱动芯片11可以包括触控扫描控制模块1101、触控模拟前端模块AFE、线锁存模块(Line Latch)1102、电平转换模块(Level Shifter)1103、数模转换模块DAC、电压缓冲模块(Voltage Buffer11104、第一电源管理模块PMU1、第一接口电路模块(Interface)1105、第一时序控制模块OSC1、第一存储单元模块1106和逻辑控制模块(Logic Controller)1107。
示例性地，第一电源管理模块PMU1、第一接口电路模块1105、第一时序控制模块OSC1或第一储存单元模块1106中的至少一个可以用于触控模拟前端模块。也就是说，在将触控模拟前端模块AFE集成到源极驱动芯片11时，触控模拟前端模块AFE中的部分模块可与原有的源极驱动芯片11中的部分功能模块整合共用。例如，第一电源管理模块PMU1、第一接口电路模块1105、第一时序控制模块OSC1或第一储存单元模块1106中的一个或多个模块可以是同时用于触控模拟前端模块AFE和源极驱动芯片11。例如，源极驱动芯片11的第一接口电路模块1105可以包括显示通讯单元051和触控通讯单元052。显示通讯单元051可以与时序控制器T-con芯片中的显示类单元模块连接通讯。例如，显示通讯单元051和T-con芯片中的显示类单元模块之间可以传输BCL(Bi-directional Command Link)、PHI(Point-to-point High-speed Interface)等多种类型的讯号。触控通讯单元052可以与T-con中的触控类单元模块通讯连接通讯，例如传输触控数据。再例如，第一电源管理模块PMU1可以同时为触控模拟前端模块AFE和源极驱动芯片的其他模块提供所需的电压。
通过这样设计，有利于简化集成有触控模拟前端模块AFE的源极驱动芯片11的结构，部分模块功能整合共用，可以减少元器件数量，减小源极驱动芯片尺寸，降低成本。
示例性地，多个线锁存模块1102可以包括多个线锁存器，多个线锁存器可以通过1和0两种稳定状态控制信号在两个稳定状态之间切换。
示例性地，源极驱动芯片还可以包括灰阶电压处理模块GMA，可以将不同的灰阶电压数据传输至数模转换模块DAC中。例如，不同的灰阶电压数据可以包括VGAM1、VGAM2、…、VGAM13等多个不同灰阶的电压数据，从而控制对应的像素实现不同显示效果。
示例性地，在本公开的一些实施例中，结合参照图6和图7，源极驱动芯片中的触控模拟前端模块AFE可以包括多个触控电极单元TRX和多个模数转换模块ADC，用于驱动触控显示面板的触控电极和采集触控数据。一个模数转换模块ADC模块至少连接1个触控电极单元TRX。
在一些实施例中，一个模数转换模块ADC可以对应连接1个触控电极单元TRX。
在一些实施例中，一个模数转换模块ADC可以连接多个触控电极单元TRX。例如，一个模数转换模块ADC可以连接2个触控电极单元TRX。或者，一个模数转换模块ADC可以连接3个触控电极单元TRX。
示例性地，触控模拟前端模块AFE还可以包括至少一个低通滤波器LPF。
图8是根据本公开的一些实施例的触控显示装置的平面示意图；图9是根据本公开的一些实施例的时序控制器的结构框图。
示例性地，在本公开的一些实施例中，参照图8，提供一种触控显示装置100。该触控显示装置可以包括上述任一实施例的触控显示面板10。
需要说明的是，触控显示装置可以包括但不限于：电子纸、手机、平板电脑、显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件。应该理解，该触控显示装置具有与前述实施例提供的触控显示面板相同的有益效果。
在一些实施例中，继续参照图8，触控显示装置100还可以包括：与触控显示面板10绑定的至少一个FPC板20；和通过FPC板20与触控显示面板10连接的显示触控驱动板30。例如，显示触控驱动板30可以包括PCB板以及设置在PCB板上的多种电子元器件。例如，多种电子元器件可以包括时序控制器T-con、至少1个电源管理芯片(PMIC芯片)、电平转换芯片(Level shift)、缓存芯片Flash等。
示例性地，触控显示面板10可以包括多个源极驱动芯片11，源极驱动芯片11可以包括触控模拟前端模块AFE。触控显示面板10中的多个源极驱动芯片11可以通过多个FPC板分别连接至显示触控驱动板30。例如，每个源极驱动芯片11可以通过对应的一个FPC板与显示触控驱动板30连接，从而实现多个源极驱动芯片11与显示触控驱动板30之间的信号传输。
示例性地，触控显示面板10可以包括弯折区180，弯折区180位于源极驱动芯片11靠近显示区AA的一侧。在一些实施例中，触控显示面板10可以在弯折区180进行弯折设计，从而将驱动模组设计到触控显示面板的侧面或者背光面，有利于实现触控显示面板的窄边框化。
在一些实施例中，结合参照图8和图9，显示触控驱动板30可以包括时序控制器T-con。时序控制器T-con可以提供触控显示面板所需的时序控制信号、显示数据信号和其他控制信号(例如栅极驱动信号)等多种信号，时序控制器T-con还可以对显示数据进行数据处理，提升面板的画质效果。
时序控制器T-con可以包括显示类单元模块，例如显示信号接收模块T02和显示信号发送模块T05。显示类单元模块可以用于为触控显示面板10提供时序控制信号和数据显示信号。例如，至少一个源极驱动芯片11通过至少一个FPC板与时序控制器T-con连接，从而可以通过时序控制器T-con为源极驱动芯片11提供时序控制信号和数据显示信号，进而控制触控显示面板实现不同画面的显示。
在一些实施例中，继续参照图9，时序控制器T-con还可以包括触控数字后端模块DBE。触控数字后端模块DBE可以用于触控数据的算法降噪处理和触控坐标报点运算。
触控数字后端模块DBE是分离式触控芯片中另一个主要功能模块。在本公开的实施例中，通过将触控数字后端模块DBE集成到时序控制器T-con，可以利用时序控制器T-con完成触控数据的算法降噪处理和触控坐标报点运算，从而不必单独设计分离式的触控芯片，有利于减少元器件数量，降低成本。
例如，触控数字后端模块DBE包括图像数据处理模块、触控扫码控制模块、电源管理模块、时序控制模块、存储单元模块、主动笔控制模块等多个模块。
在本公开的一些实施例中，继续参照图9，时序控制器T-con可以包括图像数据处理模块T04、第二电源管理模块PMU2、第二时序控制模块OSC2、第二储存单元模块T03、显示信号接收模块T02、显示信号发送模块T05和接口电路模块T01。在将触控数字后端模块DBE集成到时序控制器T-con时，触控数字后端模块DBE中的大部分功能模块可以与原有的时序控制器T-con中部分功能模块整合共用。例如，时序控制器T-con中图像数据处理模块T04、第二电源管理模块PMU2、第二时序控制模块OSC2、第二储存单元模块T03或接口电路模块T01中的至少一个可以用于触控数字后端模块DBE。通过这样设计，可以共同满足触控数字后端模块DBE和时序控制器T-con的功能需求，从而可以减小时序控制器T-con的尺寸和降低成本。例如，整合后的接口电路模块T01可以包括显示接口电路T011和触控接口电路T012。整合后的第二电源管理模块PMU2包括显示电源管理单元PMU21和触控电源管理单元PMU22。
示例性地，触控数字后端模块DBE可以包括主动笔控制模块T06，可以用于对触控信号的编码和解码。
示例性地，时序控制器T-con还可以包括栅极驱动电路GOA，可以用于为触控显示面板提供栅极驱动信号。
示例性地，时序控制器T-con还可以与主控端Host连接，时序控制器T-con可以在通过内部的图像数据处理模块汇总OLED模组的全部源极驱动芯片传递的触控数据，对触控数据进行算法降噪处理、触控坐标报点运算之后，上传报点坐标至主控端Host，主控端Host实现对报点坐标的统一处理。
图10A-10C分别是根据本公开的实施例的触控显示装置的平面示意图。
示例性地，在本公开的实施例中，结合参照图10A-10C，触控模拟前端模块AFE包括多个触控数据输出接口。时序控制器T-con包括多个触控数据输入接口。触控模拟前端模块AFE中的多个触控数据输出接口和时序控制器T-con中的多个触控数据输入接口可以通过触控数据信号走线ATL进行触控数据的传输。
示例性地，触控模拟前端模块AFE采样的触控数据可以通过对应的触控数据输出接口以内嵌时钟差分信号传输给时序控制器T-con。时序控制器T-con通过内部数据处理模块汇总触控显示面板中的全部源极驱动芯片传递的触控数据，对触控数据进行算法降噪处理、触控坐标报点运算，然后通过SPI/12C/13C等接口上传报点坐标至主控端Host。
在一些实施例中，参照图10A，每个触控数据输出接口可以对应连接一个触控数据输入接口。也就是说，一个触控数据输出接口和一个触控数据输入接口之间存在独立的一条触控数据信号走线ATL。
在一些实施例中，结合参照图10B和10C，多个触控数据输出接口可以对应连接同一个触控数据输入接口。也就是说，多个触控数据输出接口和一个触控数据输入接口之间存在共用的一条触控数据信号走线ATL。例如，图10B中，2个触控数据输出接口和一个触控数据输入接口之间存在共用的一条触控数据信号走线ATL。再例如，图10C中，4个触控数据输出接口和一个触控数据输入接口之间存在共用的一条触控数据信号走线ATL。
相比于SPI和12C，内嵌时钟差分信号的传输速率非常高，多个源极驱动芯片获取的触控显示面板不同区域的触控数据可以通过同一条触控数据信号走线ATL分时传递给时序控制器T-con内部存储单元模块。这样可减少时序控制器T-con芯片上所需的触控数据输入接口的数量，有利于降低芯片成本和尺寸。
图11是根据本公开的实施例的触控显示装置的平面示意图。
示例性地，在本公开的一些实施例中，参照图11，触控显示装置还包括主控端Host。时序控制器T-con与主控端Host可以采用嵌入式显示端口协议(Embedded Display Port，缩写为eDP)通讯。与图8相比，当时序控制器T-con芯片使用eDP协议时，可使用时序控制器T-con芯片的eDP接口的附属通道(AUX Channel)上报触控坐标至主控端Host或传输触控资料数据至主控端Host，即可取消时序控制器T-con芯片用于与主控端Host通讯的SPI/12C/I3C等管脚。
在一些实施例中，触控数字后端模块DBE内嵌设置于时序控制器T-con芯片内部，使用eDP接口的附属通道(AUX Channel)传递触控资料具有特别的优势，可进一步减小时序控制器T-con与主控端Host之间的通讯接口管脚数量，有利于减小显示触控驱动板的尺寸。
图12是根据本公开的实施例的触控显示装置的平面示意图。
示例性地，在本公开的一些实施例中，参照图12，显示触控驱动板30还可以包括至少一个电源管理芯片PMIC，可以用于为源极驱动芯片11中的触控模拟前端模块AFE或时序控制器T-con中的触控数字后端模块DBE提供电压信号。电源管理芯片还可以为其他单元/模块提供工作电压。
示例性地，电源管理芯片PMIC包括在第一方向X上相对设置的第一侧边L1和第二侧边L2。显示触控驱动板30包括在第一方向X上相对设置的第三侧边L3和第四侧边L4。第一侧边L1与第三侧边L3在第一方向X上间隔第一间隔距离D1，第二侧边L2和第四侧边L4在第一方向X上间隔第二间隔距离D2。第一间隔距离D1与第二间隔距离D2之比在0.8至1.2之间。也就是说，可以将电源管理芯片PMIC设计在显示触控驱动板(PCB板)的中间位置，确保从电源管理芯片PMIC到多个源极驱动芯片的触控模拟前端模块AFE的走线阻抗尽量相同或接近，从而确保提供给每个触控模拟前端模块AFE的电源电压一致，有利于提升显示触控模组的容值一致性水平。
虽然本公开总体构思的一些实施例已被显示和说明，本领域普通技术人员将理解，在不背离本总体公开构思的原则和精神的情况下，可对这些实施例做出改变，本公开的范围以权利要求和它们的等同物限定。

Claims (16)

  1. 一种触控显示面板，其特征在于，包括：
    衬底基板，所述衬底基板包括显示区和周边区；
    设置于所述衬底基板上的触控层，所述触控层包括位于所述显示区的多个触控电极；和
    第一焊盘区，位于所述周边区，所述第一焊盘区包括多个第一端子，其中，所述第一焊盘区包括输出引线焊盘区；所述多个第一端子包括设置于所述输出引线焊盘区的多个触控电极端子，所述多个触控电极端子分别通过多条引出走线与所述多个触控电极电连接；以及
    至少一个源极驱动芯片，所述源极驱动芯片通过所述第一焊盘区的多个第一端子接入所述触控显示面板，
    其中，所述源极驱动芯片包括触控模拟前端模块，所述触控模拟前端模块包括多个触控电极单元，以及，
    所述多个触控电极单元分别与所述多个触控电极端子电连接，用于驱动所述触控显示面板的触控电极和采集触控数据。
  2. 根据权利要求1所述的触控显示面板，其中，所述多个触控电极包括沿第一方向间隔设置的多个触控驱动电极和沿第二方向间隔设置多个触控感应电极，第一方向和第二方向相交；
    所述多个触控电极单元中的一部分通过所述触控电极端子与所述触控驱动电极电连接；以及
    所述多个触控电极单元中的另一部分通过所述触控电极端子与所述触控感应电极电连接。
  3. 根据权利要求1或2所述的触控显示面板，其中，所述第一焊盘区还包括位于所述输出引线焊盘区的多个第一显示信号端子，用于与所述触控显示面板内部的显示驱动电路连接。
  4. 根据权利要求3所述的触控显示面板，其中，所述输出引线焊盘区包括沿第一方向依次设置的第一区域、第二区域和第三区域；
    所述多个第一显示信号端子在第一方向和第二方向上成阵列排布于所述第二区域；
    所述多个触控电极端子中的一部分在第一方向和第二方向上成阵列排布于所述第一区域；以及
    所述多个触控电极端子中的另一部分在第一方向和第二方向上成阵列排布于所述第三区域。
  5. 根据权利要求1-4任一项所述的触控显示面板，其中，所述第一焊盘区还包括：输入引线焊盘区，所述输入引线焊盘区位于所述输出引线焊盘区远离所述显示区的一侧；
    所述多个第一端子还包括设置于所述输入引线焊盘区的多个信号输入端子，用于与外部的显示触控驱动板连接，
    所述多个信号输入端子包括多个第二显示信号端子和多个第一触控信号端子。
  6. 根据权利要求5所述的触控显示面板，其中，所述输入引线焊盘区包括沿第一方向依次设置的第四区域、第五区域和第六区域；
    所述多个第二显示信号端子在第一方向和第二方向上成阵列排布于所述第五区域；
    所述多个第一触控信号端子中的一部分在第一方向和第二方向上成阵列排布于所述第四区域；以及
    所述多个第一触控信号端子中的另一部分在第一方向和第二方向上成阵列排布于所述第六区域。
  7. 根据权利要求1-6任一项所述的触控显示面板，其中，所述触控模拟前端模块还包括多个模数转换模块，每个所述模数转换模块至少连接一个所述触控电极单元。
  8. 根据权利要求1-7任一项所述的触控显示面板，其中，所述源极驱动芯片还包括第一电源管理模块、第一接口电路模块、第一时序控制模块和第一存储单元模块，
    所述第一电源管理模块、所述第一接口电路模块、所述第一时序控制模块或所述第一储存单元模块中的至少一个用于所述触控模拟前端模块。
  9. 一种触控显示装置，其特征在于，包括：如权利要求1-8任一项所述的触控显示面板；
    与所述触控显示面板绑定的至少一个柔性电路板；以及
    显示触控驱动板，所述显示触控驱动板通过所述柔性电路板与所述触控显示面板电连接。
  10. 根据权利要求9所述的触控显示装置，其中，所述显示触控驱动板包括时序控制器和触控数字后端模块，所述时序控制器包括：显示类单元模块，所述显示类单元模块用于为所述触控显示面板提供时序控制信号和数据显示信号；所述触控数字后端模块用于触控数据的算法降噪处理和触控坐标报点运算。
  11. 根据权利要求10所述的触控显示装置，其中，所述时序控制器还包括图像数据处理模块、第二电源管理模块、第二时序控制模块和第二储存单元模块，
    所述图像数据处理模块、所述第二电源管理模块、所述第二时序控制模块或所述第二储存单元模块中的至少一个用于所述触控数字后端模块。
  12. 根据权利要求10或11所述的触控显示装置，其中，至少一个所述源极驱动芯片通过至少一个所述柔性电路板与所述时序控制器连接，
    所述柔性电路板包括第三显示信号端子和第二触控信号端子，所述第三显示信号端子与所述第二显示信号端子对应连接；所述第二触控信号端子与所述第一触控信号端子对应连接。
  13. 根据权利要求10-12任一项所述的触控显示装置，其中，所述触控模拟前端模块包括多个触控数据输出接口；所述时序控制器包括多个触控数据输入接口，
    每个所述触控数据输出接口对应连接一个所述触控数据输入接口；或者，多个所述触控数据输出接口对应连接一个所述触控数据输入接口。
  14. 根据权利要求13所述的触控显示装置，其中，所述触控数据输出接口和所述触控数据输入接口之间采用内嵌时钟差分信号形式传递触控数据。
  15. 根据权利要求10-14任一项所述的触控显示装置，其中，所述触控显示装置还包括主控端，所述时序控制器与所述主控端采用嵌入式显示端口协议通讯。
  16. 根据权利要求10-15任一项所述的触控显示装置，其中，所述显示触控驱动板包括至少一个电源管理芯片，用于为所述源极驱动芯片中的触控模拟前端模块或所述时序控制器中的触控数字后端模块提供电压信号，所述电源管理芯片包括在第一方向上相对设置的第一侧边和第二侧边；所述显示触控驱动板包括在第一方向上相对设置的第三侧边和第四侧边，
    其中，所述第一侧边与所述第三侧边在第一方向上间隔第一间隔距离，所述第二侧边和所述第四侧边在第一方向上间隔第二间隔距离，所述第一间隔距离与所述第二间隔距离之比在0.8至1.2之间。
PCT/CN2025/095414 2024-05-21 2025-05-16 触控显示面板和触控显示装置 Pending WO2025241998A1 (zh)

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CN118550423A (zh) * 2024-05-21 2024-08-27 京东方科技集团股份有限公司 触控显示面板和触控显示装置
CN119274485A (zh) * 2024-09-19 2025-01-07 京东方科技集团股份有限公司 阵列基板、显示基板和电子设备
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