WO2025200892A1 - 发声模组和电子设备 - Google Patents

发声模组和电子设备

Info

Publication number
WO2025200892A1
WO2025200892A1 PCT/CN2025/078500 CN2025078500W WO2025200892A1 WO 2025200892 A1 WO2025200892 A1 WO 2025200892A1 CN 2025078500 W CN2025078500 W CN 2025078500W WO 2025200892 A1 WO2025200892 A1 WO 2025200892A1
Authority
WO
WIPO (PCT)
Prior art keywords
magnetic
module
magnetic conductive
sound
central
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/CN2025/078500
Other languages
English (en)
French (fr)
Inventor
蔡晓东
刘松
杨鑫峰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Goertek Inc
Original Assignee
Goertek Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Goertek Inc filed Critical Goertek Inc
Publication of WO2025200892A1 publication Critical patent/WO2025200892A1/zh
Pending legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers

Definitions

  • the present invention relates to the technical field of electroacoustic transducer technology, and in particular to a sound module and an electronic device using the sound module.
  • a sound-emitting unit including a magnetic circuit system and a vibration system arranged in the installation space, the magnetic circuit system including a magnetic yoke and a central magnetic portion and a side magnetic portion arranged on the magnetic yoke, the central magnetic portion and the side magnetic portion being spaced apart to form a magnetic gap, the vibration system being arranged on one side of the magnetic circuit system, the vibration system including a diaphragm assembly and a voice coil connected to the diaphragm assembly, the end of the voice coil away from the diaphragm assembly being arranged corresponding to the magnetic gap, the diaphragm assembly including a diaphragm and a vibration plate arranged on the diaphragm, the vibration plate having a magnetic conductive portion, the module upper shell being located on the side of the diaphragm assembly facing away from the magnetic circuit system, the module upper shell being provided with an auxiliary magnet, the magnetization direction of the auxiliary magnet being opposite to the magnetization direction of the central magnetic portion;
  • the recessed area is a through-hole structure penetrating the central magnetic conductive plate.
  • the recessed area is a through hole
  • the central magnet is provided with a protrusion corresponding to the through hole
  • the protrusion is located in the through hole
  • the end surface of the protrusion facing the diaphragm does not exceed the end surface of the central magnetic conductive plate facing the diaphragm.
  • the diaphragm is provided with an inner ring hole
  • the vibration plate cover is provided on the inner ring hole
  • the side of the vibration plate facing away from the central magnetic part is recessed toward the direction close to the central magnetic part to form a fixed groove
  • the magnetic conductive part is provided in the fixed groove.
  • the auxiliary magnet is arranged on the side of the module upper shell facing the front acoustic cavity; and/or, the auxiliary magnet is arranged on the side of the module upper shell facing away from the front acoustic cavity; and/or, the module upper shell is provided with an installation cavity, and the auxiliary magnet is arranged in the installation cavity.
  • the auxiliary magnet is bonded to the upper shell of the module
  • auxiliary magnet and the module upper shell are integrally injection molded.
  • the auxiliary magnets include a plurality of auxiliary magnets; the plurality of auxiliary magnets are arranged on the same side or different sides of the upper shell of the module; and/or the plurality of auxiliary magnets are arranged in a spliced manner or in an interval manner;
  • the auxiliary magnet is circular, elliptical or polygonal;
  • the auxiliary magnet is a magnet
  • the central axis of the auxiliary magnet coincides with the central axis of the sound-emitting unit
  • the auxiliary magnet is arranged to face the magnetic conductive portion
  • a mounting groove is provided on a side of the module upper shell facing the diaphragm assembly, and the auxiliary magnet is provided in the mounting groove.
  • the module housing further includes a module middle shell, and the module middle shell, the module upper shell, and the module lower shell together define the installation space;
  • the present invention also provides an electronic device, which includes the sound module described above.
  • the sound module of the technical solution of the present invention is configured so that the module shell is configured as a connected module upper shell and module lower shell, so that the module upper shell is located on the side of the diaphragm assembly of the sound unit facing away from the magnetic circuit system, and the diaphragm assembly is configured as a diaphragm and a vibration plate arranged on the diaphragm, and a magnetic conductive part is arranged on the vibration plate, and an auxiliary magnet is arranged on the module upper shell, so that the magnetization direction of the auxiliary magnet is opposite to the magnetization direction of the central magnetic part, so that there is a first attraction between the magnetic conductive part and the auxiliary magnet, and a second attraction between the magnetic conductive part and the magnetic circuit system.
  • the magnetic conductive part interacts with the auxiliary magnet and the magnetic circuit system respectively, and a static magnetic force is introduced into the vibration system, thereby effectively reducing the strain recovery force of the diaphragm assembly during movement.
  • a static magnetic force is introduced into the vibration system, so that when the vibration system is working, the combined force of the first suction force and the second suction force is opposite to the direction of the strain recovery force of the diaphragm and is smaller than the strain recovery force of the diaphragm; when the vibration system stops working, the vibration system is located in a balanced position between the auxiliary magnet and the magnetic circuit system under the action of the combined force of the first suction force and the second suction force, thereby reducing the stiffness of the vibration system through the static magnetic force, making the diaphragm assembly more compliant, thereby greatly improving the low-frequency effect of the sound module.
  • FIG1 is a schematic structural diagram of a sound module according to an embodiment of the present invention.
  • FIG2 is a schematic structural diagram of a sound module from another perspective according to an embodiment of the present invention.
  • FIG3 is an exploded schematic diagram of a sound module according to an embodiment of the present invention.
  • FIG4 is a cross-sectional schematic diagram of a sound module according to an embodiment of the present invention.
  • FIG5 is a cross-sectional schematic diagram of a sound module according to another embodiment of the present invention.
  • FIG6 is a cross-sectional schematic diagram of a sound-emitting unit according to an embodiment of the present invention.
  • FIG7 is a cross-sectional schematic diagram of a sound-emitting unit in another embodiment of the present invention.
  • FIG8 is a magnetostatic force curve diagram of the vibration direction of the sound module in one embodiment of the present invention.
  • FIG9 is a stiffness curve diagram of the sound module of the present invention and the prior art design
  • the present invention provides a sound module 500. It is understandable that the sound module 500 can be applied to electronic devices, and the electronic devices can be smart watches, mobile phones, speakers, computers, headphones or televisions, etc., which are not limited here.
  • loudness is the main performance indicator of the sound module 500.
  • the low-frequency loudness of the sound module 500 is closely related to the maximum amount of air that the diaphragm assembly 31 of its sound unit 100 can push.
  • the volume reserved for the sound module 500 in smart devices is getting smaller and smaller, which makes the effective vibration area (Sd) and the back cavity volume of the sound module 500 smaller and smaller. Therefore, a larger vibration space needs to be reserved to meet the large amplitude (X max ) requirements.
  • the driving force factor BL value of the product will decrease with the increase of the displacement of the vibration system 3 of the sound unit 100. This results in that although a larger vibration space is reserved, at actual low frequencies, even if the PA outputs the driving signal at full amplitude, the displacement of the vibration system 3 of the sound unit 100 still cannot reach X max , which greatly limits the performance of the product.
  • the present invention adjusts the system stiffness (Kms) in the sound module 500 to achieve a significant improvement in low frequency.
  • Kms system stiffness
  • static magnetotropy is introduced into the vibration system 3 of the sound unit 100, and the static magnetotropy is used to reduce the stiffness of the vibration system 3, thereby achieving a significant improvement in low frequency.
  • the sound module 500 includes a module shell 400 and a sound unit 100.
  • the module shell 400 is provided with an installation space 421.
  • the module shell 400 includes a module upper shell 410 and a module lower shell 420 connected to each other.
  • the sound unit 100 includes a magnetic circuit system 2 and a vibration system 3 arranged in the installation space 421.
  • the magnetic circuit system 2 includes a magnetic yoke 21 and a central magnetic portion 22 and a side magnetic portion 23 arranged on the magnetic yoke 21.
  • the central magnetic portion 22 and the side magnetic portion 23 are spaced apart to form a magnetic gap 24.
  • the vibration system 3 is arranged on one side of the magnetic circuit system 2.
  • the module upper shell 410 is provided with an auxiliary magnet 411, and the magnetization direction of the auxiliary magnet 411 is opposite to the magnetization direction of the central magnetic portion 22; wherein, there is a first suction force between the magnetic conductive portion 3121 and the auxiliary magnet 411, and there is a second suction force between the magnetic conductive portion 3121 and the magnetic circuit system 2.
  • the vibration system 3 When in a non-working state, the vibration system 3 is located in a balanced position between the auxiliary magnet 411 and the magnetic circuit system 2 under the action of the combined force of the first suction force and the second suction force.
  • the sound unit 100 of the sound module 500 can be a speaker unit, and the speaker can be a micro speaker.
  • the sound module 500 can optionally have a modular structure, and the module housing 400 of the sound module 500 forms an installation space 421, and the sound unit 100 is disposed within the installation space 421 of the module housing 400.
  • the module housing 400 includes a module upper shell 410 and a module lower shell 420.
  • the sound unit 100 is disposed within the installation space 421, such that at least a portion of the module upper shell 410 is located on the side of the diaphragm assembly 31 facing away from the magnetic circuit system 2.
  • the sound outlet hole 413 may be disposed directly opposite the diaphragm assembly 31, so that the sound module 500 has a front sound-emitting structure.
  • the sound outlet hole 413 may not be disposed directly opposite the diaphragm assembly 31.
  • the sound outlet hole 413 may be located on the side or periphery of the diaphragm assembly 31, in which case the sound module 500 has a side sound-emitting structure.
  • the module upper shell 410 is also provided with a sound guide, which forms a sound outlet channel, one end of which is connected to the front sound cavity 430, and the other end of the sound outlet channel is connected to the sound outlet hole 413.
  • the module upper shell 410 is provided with a support platform 412 surrounding the auxiliary magnet 411, the sound unit 100 is supported on the support platform 412, and is enclosed with the module upper shell 410 to form a front sound cavity 430, the diaphragm assembly 31 faces the front sound cavity 430, the sound unit 100, the module upper shell 410 and the module lower shell 420 are enclosed to form a rear sound cavity 440, the magnetic circuit system 2 faces the rear sound cavity 440, and the module upper shell 410 is also provided with a sound outlet hole 413 connected to the front sound cavity 430.
  • the module upper shell 410 is provided with a support platform 412 surrounding the auxiliary magnet 411.
  • the vibration system 3 of the sound unit 100 is supported on the support platform 412 and encloses the module upper shell 410 to form a front acoustic cavity 430, with the diaphragm assembly 31 facing the front acoustic cavity 430.
  • the magnetic circuit system 2 and vibration system 3 of the sound unit 100 are arranged in the installation space 421, so that the vibration system 3, the module upper shell 410, and the module lower shell 420 enclose a rear acoustic cavity 440, and the magnetic circuit system 2 is located in the rear acoustic cavity 440.
  • both ends of the support platform 412 are connected to the sound guide, so that the support platform 412 and the sound guide enclose a mounting groove or groove structure.
  • the support platform 412 can be a flat support platform structure.
  • the support platform 412 can also be arranged in a stepped structure so that the peripheral support of the vibration system 3 of the sound unit 100 is fixed to the stepped structure, which is not limited here.
  • the rear acoustic cavity 440 of the sound module 500 may be filled with sound-absorbing particles.
  • the sound module 500 also includes an isolation and ventilation structure, which is provided within the rear acoustic cavity 440 and is used to prevent the sound-absorbing particles from entering the interior of the sound unit 100. This is not limited to this.
  • the structure of the module housing 400 is not limited to the module upper shell 410 and the module lower shell 420.
  • the module housing 400 also includes a module middle shell, which together with the module upper shell 410 and the module lower shell 420 defines the installation space 421, which is not limited here.
  • the module middle shell of the module housing 400 is located between the module upper shell 410 and the module lower shell 420, and the two ends of the module middle shell are respectively connected to the module upper shell 410 and the module lower shell 420.
  • the structure of the module upper shell 410 of the module housing 400 is not limited to the structural form of the present invention, and can also be other structural design forms, as long as it can support and fix the auxiliary magnet 411, which is not limited here.
  • the magnetic circuit system 2 and the vibration system 3 of the sound-emitting unit 100 are arranged relative to each other.
  • the magnetic circuit system 2 can be arranged in a square shape.
  • the magnetic circuit system 2 can include a central magnetic portion 22 and a side magnetic portion 23, both of which are square structures.
  • the vibration system 3 is also arranged in a square shape. It can be understood that the periphery of the diaphragm assembly 31 of the vibration system 3 can be connected to the magnetic circuit system 2, or the magnetic circuit system 2 and the vibration system 3 can be separately assembled on the outer shell or module shell, etc., which is not limited here.
  • the sound unit 100 also includes a housing 1, the magnetic circuit system 2 is connected to one end of the housing 1, and the vibration system 3 is connected to the other end of the housing 1 and is arranged opposite to the magnetic circuit system 2. That is, the periphery of the diaphragm assembly 31 of the vibration system 3 is connected to the other end of the housing 1 and is arranged opposite to the magnetic circuit system 2.
  • the sound unit 100 sets the magnetic circuit system 2 as a magnetic yoke 21 and a central magnetic part 22 and a side magnetic part 23 provided on the magnetic yoke 21.
  • the magnetic circuit system 2 can be connected to the outer shell 1 through the periphery of the magnetic yoke 21; or, the magnetic circuit system 2 can be connected to the outer shell 1 through the side magnetic part 23, which is not limited here.
  • the side magnetic portion 23 is located outside the central magnetic portion 22 and is enclosed with the central magnetic portion 22 to form a magnetic gap 24, so that the diaphragm assembly 31 of the vibration system 3 is connected to the end of the housing 1 away from the magnetic yoke 21, and is opposite to and spaced from the magnetic circuit system 2, so that one end of the voice coil 32 is connected to the diaphragm assembly 31, and the other end of the voice coil 32 is set corresponding to the magnetic gap 24.
  • the sound unit 100 further includes a centering support 33, one end of which is connected to the voice coil 32, and the other end of which is connected to the housing 1.
  • the ends of the damper 33 are electrically connected to the leads of the voice coil 32 and the external circuit, respectively.
  • the dampers 33 can be disposed at the bottom of the voice coil 32, positioned at the four corners of the sound unit 100 or along the minor or major axis of the sound unit 100.
  • the dampers 33 can be disposed at the top of the voice coil 32, positioned between the voice coil 32 and the diaphragm assembly 31, without limitation.
  • the diaphragm assembly 31 includes a diaphragm 311 and a vibration plate 312 disposed on the diaphragm 311.
  • the magnetic conductive portion 3121 is disposed on the vibration plate 312.
  • the diaphragm 311 includes a rim portion, a fixed portion connected to the outer side of the rim portion, and a central portion connected to the inner side of the rim portion.
  • the vibration plate 312 is disposed in the central portion.
  • the fixed portion, rim portion, and central portion of the diaphragm 311 are sequentially connected to form an integrally formed structure, thereby ensuring the vibration performance and structural strength of the diaphragm 311.
  • the rim portion of the diaphragm 311 may have an upwardly protruding convex structure or a downwardly concave structure, which is not limited here.
  • the vibrating plate 312 disposed in the center of the diaphragm 311 effectively strengthens the structural strength of the center portion of the diaphragm 311.
  • the magnetic conductive portion 3121 interacts with the auxiliary magnet 411 or the magnetic circuit system 2 to generate a static magnetostatic force, thereby changing the stiffness of the diaphragm 311.
  • the center portion of the diaphragm 311 may be a flat plate structure or an annular structure.
  • a receiving groove is provided in the central portion of the diaphragm 311, and at least a portion of the vibration plate 312 is confined within the receiving groove. It is understood that by providing the receiving groove on the side of the diaphragm 311 facing away from the voice coil 32, the receiving groove can be conveniently utilized to install and accommodate the vibration plate 312, ensuring that the upper surface of the vibration plate 312 is flush with the upper surface of the diaphragm 311, thereby reducing the height of the sound-emitting unit 100 along the vibration direction of the vibration system 3 and ensuring the vibration performance of the entire diaphragm assembly 31.
  • the diaphragm 311 is provided with an inner annular hole 3111, and the vibration plate 312 is disposed over the inner annular hole 3111.
  • the inner annular hole 3111 is provided in the center of the diaphragm 311, and the periphery of the vibration plate 312 is connected to the center.
  • the vibration plate 312 can be connected to the side of the center of the diaphragm 311 facing the voice coil 32 or the side facing away from the voice coil 32.
  • a stepped surface is formed on the periphery of the vibration plate 312, and the side of the diaphragm 311 adjacent to the inner ring hole 3111 is supported and connected to the stepped surface, and the stepped surface is located between the voice coil 32 and the diaphragm 311.
  • the vibration system 3 when the vibration system 3 is working, the resultant force of the first suction force and the second suction force is opposite to the direction of the strain recovery force of the vibration system 3 and is less than the strain recovery force of the diaphragm 311; when the vibration system 3 stops working, the equivalent stiffness of the resultant force of the first suction force and the second suction force is no greater than the stiffness of the vibration system 3.
  • the vibration system 3 Under the action of the resultant force of the first suction force and the second suction force, the vibration system 3 is located in a balanced position between the auxiliary magnet 411 and the magnetic circuit system 2. In this way, the stiffness of the vibration system 3 is reduced by static magnetoelectric force. In this way, by introducing static magnetoelectric force into the vibration system 3 and reducing the stiffness of the vibration system 3 by static magnetoelectric force, the effect of significantly improving low frequencies is achieved.
  • the magnetization direction of the auxiliary magnet 411 is opposite to that of the central magnet 221 in the central magnetic portion 22.
  • the magnetic flux lines generated by the auxiliary magnet 411 and the magnetic flux lines generated by the central magnetic portion 22 are opposite in direction and repel each other. These two magnetic flux lines pass transversely through the voice coil 32, thereby increasing the magnetic flux lines acting on the voice coil 32, increasing the BL value of the product, and thus improving the sound sensitivity of the sound unit 100.
  • the magnetic permeable portion 3121 when the magnetic permeable portion 3121 approaches the magnetic circuit system 2, it moves away from the auxiliary magnet 411. Therefore, the attractive force between the magnetic permeable portion 3121 and the auxiliary magnet 411 decreases, while the attractive force between the magnetic permeable portion 3121 and the magnetic circuit system 2 increases. The combined force of the first and second attractive forces is directed toward the magnetic circuit system 2. The total attractive force exerted on the magnetic permeable portion 3121 acts as a force on the vibration system 3.
  • the equivalent stiffness of the resultant force of the first attractive force between the magnetic conductive portion 3121 and the auxiliary magnet 411 and the second attractive force between the magnetic conductive portion 3121 and the magnetic circuit system 2 is no greater than the stiffness of the diaphragm 311.
  • the force exerted on the vibration system 3 by the first attraction between the magnetic conductive part 3121 and the auxiliary magnet 411 and the second attraction between the magnetic conductive part 3121 and the magnetic circuit system 2 is not fixed.
  • the greater the distance the vibration system 3 deviates from its equilibrium position the greater the force exerted on the vibration system 3 by the first attraction between the magnetic conductive part 3121 and the auxiliary magnet 411 and the second attraction between the magnetic conductive part 3121 and the magnetic circuit system 2.
  • the smaller the distance the vibration system 3 deviates from its equilibrium position the smaller the force exerted on the vibration system 3 by the first attraction between the magnetic conductive part 3121 and the auxiliary magnet 411 and the second attraction between the magnetic conductive part 3121 and the magnetic circuit system 2.
  • the static magnetic force performance is shown in Figure 8.
  • Kms Km + Kb - Kt, where Kms is the system stiffness, Km is the stiffness of the vibration system 3, and Kb is the cavity stiffness.
  • the magnetic conductive portion 3121 interacts with the auxiliary magnet 411 of the module upper shell 410 and the magnetic circuit system 2 respectively, thereby introducing static magnetic force into the vibration system 3, thereby effectively reducing the strain recovery force of the diaphragm assembly 31 during movement.
  • a static magnetic force is introduced into the vibration system 3, so that when the vibration system 3 is working, the resultant force of the first suction force and the second suction force is opposite to the direction of the strain recovery force of the diaphragm 311 and is smaller than the strain recovery force of the diaphragm 311; when the vibration system 3 stops working, the equivalent stiffness of the resultant force of the first suction force and the second suction force is not greater than the stiffness of the diaphragm 311, and the stiffness of the vibration system 3 is reduced by the static magnetic force, so that the compliance of the diaphragm assembly 31 is better, thereby greatly improving the low-frequency effect of the sound module 500.
  • the magnetic conductive portion 3121 may be a magnetic conductive plate made of SPCC or SUS430.
  • the vibration plate 312 may also be made of a magnetic conductive material, so that the vibration plate 312 forms the magnetic conductive portion 3121 .
  • the magnetic conductive portion 3121 is bonded to the vibration plate 312.
  • the magnetic conductive portion 3121 may be attached to the vibration plate 312 using glue.
  • the magnetic conductive portion 3121 may be welded to the vibration plate 312.
  • the magnetic conductive portion 3121 may be attached to the vibration plate 312 using soldering.
  • the magnetic conductive portion 3121 and the vibration plate 312 may also be integrally injection molded, that is, the magnetic conductive portion 3121 and the vibration plate 312 are injection molded into a single piece, which is not limited here.
  • the magnetic conductive portion 3121 is disposed on the side of the vibration plate 312 facing the module upper shell 410; and/or, the magnetic conductive portion 3121 is disposed on the side of the vibration plate 312 facing the central magnetic portion 22; and/or, the vibration plate 312 is provided with a fixed cavity, and the magnetic conductive portion 3121 is disposed in the fixed cavity.
  • the magnetic conductive portion 3121 can be disposed on at least one side of the vibration plate 312, that is, the magnetic conductive portion 3121 can be disposed on one side of the vibration plate 312 or on two opposing sides.
  • the vibration plate 312 has a first surface and a second surface disposed in opposite directions, with the first surface facing the module upper shell 410.
  • the magnetic conductive portion 3121 can be disposed on the first surface, as shown in Figures 4 to 7; the magnetic conductive portion 3121 can also be disposed on the second surface; or the magnetic conductive portion 3121 can be disposed on both the first surface and the second surface.
  • the magnetic conductive portion 3121 is circular, elliptical, or polygonal. That is, the shape of the magnetic conductive portion 3121 can be circular, elliptical, triangular, square, or other polygonal structures, without limitation. To ensure a balanced magnetic attraction between the auxiliary magnet 411 and the magnetic conductive portion 3121, the structure of the magnetic conductive portion 3121 can be symmetrical or regular, without limitation.
  • the central magnetic portion 22 includes a stacked central magnet 221 and a central magnetic conductive plate 222 .
  • the central magnet 221 is connected to the magnetic conductive yoke 21 .
  • the central magnetic conductive plate 222 has a recessed area 223 corresponding to the magnetic conductive portion 3121 .
  • the central magnetic portion 22 includes one or more central magnets 221 and a central magnetic plate 222.
  • the central magnets 221 and the central magnetic plate 222 are stacked.
  • the multiple central magnets 221 and the multiple central magnetic plates 222 are alternately stacked, and one central magnet 221 is connected to the magnetic yoke 21.
  • the central magnet 221 is sandwiched between the central magnetic plate 222 and the magnetic yoke 21.
  • the central magnetic portion 22 may be provided in an annular structure, such that a through-hole structure is formed in the center of the central magnetic portion 22.
  • the central magnetic portion 22 includes multiple strip-shaped structures, which enclose a ring-shaped structure, and the multiple strip-shaped structures enclose a through-hole structure, which is not limited here.
  • the central magnetic portion 22 may be a square plate-shaped structure, which is not limited here.
  • the central magnetic conductive plate 222 is arranged in an integral ring shape, so that a recessed area 223 is formed in the center of the central magnetic conductive plate 222.
  • the central magnetic conductive plate 222 includes multiple central magnetic conductive plates 222, and the multiple central magnetic conductive plates 222 are surrounded in an annular shape to form the recessed area 223; or, the central magnetic conductive plate 222 is a plate-like structure, which is not limited here.
  • the central magnet 221 can be optionally arranged in an annular shape, that is, the central magnet 221 is arranged in an integral ring shape, so that a second through hole is formed in the center of the central magnet 221.
  • the influence of the magnetic focusing effect of the central magnetic conductive plate 222 on the second attractive force can be reduced, thereby effectively increasing the magnetic attraction between the magnetic conductive portion 3121 and the central magnet 221.
  • the provision of the recessed area 223 is also conducive to avoiding the fixing groove 3122 of the vibration plate 312.
  • a portion of the central magnetic conductive plate 222 is recessed in a direction away from the diaphragm assembly 31 to form the recessed area 223.
  • the recessed area 223 is a through-hole structure that passes through the central magnetic conductive plate 222.
  • the recessed area 223 may be a through hole or notch structure penetrating the central magnetic conductive plate 222.
  • the recessed area 223 may also be a groove structure formed by the central magnetic conductive plate 222 being recessed in a direction away from the diaphragm assembly 31, which is not limited here.
  • the recessed area 223 is a through hole
  • the central magnet 221 is provided with a protrusion 224 corresponding to the through hole, and the protrusion 224 is located in the through hole.
  • the magnetic attraction between the central magnet 221 and the magnetic conductive portion 3121 can be effectively increased.
  • the end surface of the protrusion 224 facing the diaphragm 311 may optionally not exceed the end surface of the central magnetic conductive plate 222 facing the diaphragm 311, thereby effectively avoiding the fixing groove 3122 of the vibration plate 312.
  • the recessed area 223 may be provided corresponding to the fixing groove 3122, which is not limited herein.
  • the side magnet portion 23 includes side magnets and side magnetic conductive plates disposed on the side magnets. As will be appreciated, as shown in Figures 3 to 7 , the side magnets and side magnetic conductive plates of the side magnet portion 23 are stacked on the magnetic yoke 21, with the side magnets connected to the magnetic yoke 21. The side magnets and side magnetic conductive plates of the side magnet portion 23 are located outside the central magnetic portion 22 and separated to form a magnetic gap 24.
  • the edge magnet portion 23 may be annular, in which case the annular edge magnet portion 23 is located outside the central magnet portion 22 and is spaced apart from the central magnet portion 22 to form a magnetic gap 24.
  • the edge magnets and/or the edge magnetic conductive plates form a closed, integrated annular structure.
  • the edge magnetic portion 23 includes a plurality of edge magnetic portions 23, and the plurality of edge magnetic portions 23 are arranged around the outside of the central magnetic portion 22, and are spaced apart from the central magnetic portion 22 to form a magnetic gap 24.
  • both the edge magnets and the edge magnetic conductive plates are multiple, and are arranged one-to-one, and adjacent edge magnets are connected end to end to form a closed annular structure.
  • the edge magnets form a closed integral annular structure
  • the edge magnetic conductive plates are multiple, and adjacent edge magnetic conductive plates are connected end to end to form a closed annular structure, and are arranged corresponding to the annular edge magnets; or, the edge magnetic conductive plates form a closed integral annular structure, the edge magnets are multiple, and adjacent edge magnets are connected end to end to form a closed annular structure, and are arranged corresponding to the annular edge magnetic conductive plates. This is not limited here.
  • multiple side magnets 23 are arranged around the outside of the central magnet part 22, and a gap is provided between two adjacent side magnets 23 for avoiding the centering support piece 33, which is not limited here.
  • a positioning post is provided on the periphery of the side of the housing 1 facing away from the diaphragm assembly 31.
  • a positioning notch is provided on the magnetic yoke 21 corresponding to the positioning post, and the positioning post and the positioning notch are positioned and engaged. It will be appreciated that by providing the positioning post on the housing 1 and forming the positioning notch on the magnetic yoke 21 to engage with the positioning post, the magnetic circuit system 2 can be positioned and installed, thereby improving installation convenience and accuracy.
  • the edge magnetic portion 23 includes stacked edge magnets and edge magnetic conductive plates.
  • the edge magnets are sandwiched between the edge magnetic conductive plates and the magnetic conductive yoke 21.
  • the edge magnetic conductive plates are connected to the housing 1.
  • the edge magnetic conductive plates and the housing 1 are integrally formed, which can simplify the structure and improve installation stability.
  • the centering supports 33 include multiple ones, one ends of the multiple centering supports 33 are respectively connected to the voice coil 32 and are respectively electrically connected to the leads of the voice coil 32, and the other ends of the multiple centering supports 33 are respectively connected to the housing 1, thereby improving the operating stability of the vibration system 3.
  • multiple centering supports 33 are distributed along the long axis direction and/or short axis direction of the magnetic circuit system 2 and/or the diagonal or four corner positions of the magnetic circuit system 2. It is understandable that multiple centering supports 33 can be symmetrically distributed along the long axis direction of the magnetic circuit system 2; multiple centering supports 33 can also be symmetrically distributed along the short axis direction of the magnetic circuit system 2; multiple centering supports 33 can also be arranged in correspondence at the diagonal positions of the magnetic circuit system 2; multiple centering supports 33 can also be arranged in correspondence at the four corner positions of the magnetic circuit system 2. Of course, in other embodiments, multiple centering supports 33 can be distributed along the long axis direction of the magnetic circuit system 2, the short axis direction of the magnetic circuit system 2, and the diagonal or four corner positions of the magnetic circuit system 2, and this is not limited here.
  • the centering supports 33 include two or four. This arrangement can not only utilize the centering supports 33 to connect the voice coil 32 to the external circuit, but also ensure the vibration balance of the sound unit 100.
  • the two centering supports 33 are spaced apart along the long axis of the magnetic circuit system 2; alternatively, the two centering supports 33 are spaced apart along the short axis of the magnetic circuit system 2, without limitation herein.
  • the four centering supports 33 can also be positioned correspondingly along the four corners of the magnetic circuit system 2. The present invention does not specifically limit the arrangement of the centering supports 33.
  • each centering support 33 includes a first connection portion, an elastic arm, and a second connection portion connected in sequence.
  • the first connection portion is connected to the voice coil 32 and electrically connected to the lead of the voice coil 32
  • the second connection portion is connected to the housing 1 .
  • the first connecting portion, elastic arm, and second connecting portion of the centering arm 33 can be integrally formed. This effectively ensures the structural strength of the centering arm 33 while simplifying the processing steps for the centering arm 33. It will be appreciated that to ensure the deformability of the centering arm 33, the elastic arm has at least one bend.
  • the module upper shell 410 cooperates with the sound unit 100 to form a front sound cavity 430, and the module shell 400 is provided with a sound outlet hole 413 connected to the front sound cavity 430; wherein, the auxiliary magnet 411 is arranged on the side of the module upper shell 410 facing the front sound cavity 430; and/or, the auxiliary magnet 411 is arranged on the side of the module upper shell 410 facing away from the front sound cavity 430; and/or, the module upper shell 410 is provided with an installation cavity, and the auxiliary magnet 411 is arranged in the installation cavity.
  • the position where the auxiliary magnet 411 is set on the module upper shell 410 is spaced apart from the diaphragm assembly 31, that is, a front sound cavity 430 is formed between the module upper shell 410 and the diaphragm assembly 31.
  • the module upper shell 410 can optionally be in an inverted U-shape or a pot cover or a hat structure, which is not limited here.
  • the structure of the module upper shell 410 is not limited to the above-mentioned structural form, and can also be other structural design forms, as long as it can support and fix the auxiliary magnet 411, which is not limited here.
  • the module upper shell 410 can be made of metal, plastic, or injection molded from metal and plastic, which is not limited here.
  • the auxiliary magnet 411 is bonded to the module upper shell 410.
  • the auxiliary magnet 411 can be fixed to the module upper shell 410 by bonding with an adhesive layer.
  • the auxiliary magnet 411 can also be welded to the module upper shell 410, for example, the auxiliary magnet 411 can be fixed to the module upper shell 410 by soldering, which is not limited here.
  • the auxiliary magnet 411 is optionally integrally injection molded with the module upper shell 410.
  • the auxiliary magnet 411 is optionally made of a magnetic conductive material.
  • the auxiliary magnet 411 is a magnet.
  • the auxiliary magnet 411 is arranged on the side of the module upper shell 410 facing the diaphragm assembly 31; and/or, the auxiliary magnet 411 is arranged on the side of the module upper shell 410 facing away from the diaphragm assembly 31; and/or, the module upper shell 410 is provided with an installation cavity, and the auxiliary magnet 411 is arranged in the installation cavity.
  • the auxiliary magnet 411 can be disposed on at least one side of the module upper shell 410, that is, the auxiliary magnet 411 can be disposed on one side or two opposite sides of the module upper shell 410.
  • the module upper shell 410 has an upper surface and a lower surface disposed opposite to each other, with the lower surface facing the diaphragm assembly 31.
  • the auxiliary magnet 411 can be disposed on the upper surface; the auxiliary magnet 411 can also be disposed on the lower surface, as shown in Figures 4 and 5; the auxiliary magnet 411 can also be disposed on both the upper and lower surfaces.
  • the auxiliary magnet 411 can also be disposed in the module upper shell 410, that is, the auxiliary magnet 411 is embedded in the module upper shell 410 or injection molded in the module upper shell 410.
  • the module upper shell 410 is provided with a mounting cavity, and the auxiliary magnet 411 is disposed in the mounting cavity.
  • auxiliary magnets 411 there are multiple auxiliary magnets 411. It is understood that the multiple auxiliary magnets 411 can be simultaneously disposed on the same side of the module upper shell 410; or, the multiple auxiliary magnets 411 can be simultaneously disposed on different sides of the module upper shell 410. For example, the multiple auxiliary magnets 411 can be simultaneously disposed on the upper or lower surface of the module upper shell 410; or, the multiple auxiliary magnets 411 can be simultaneously disposed on both the upper and lower surfaces of the module upper shell 410, without limitation.
  • the multiple auxiliary magnets 411 are arranged in a spliced arrangement. For example, two adjacent auxiliary magnets 411 in the multiple auxiliary magnets 411 are arranged closely together, i.e., there is no gap.
  • the multiple auxiliary magnets 411 are arranged in an interval arrangement. For example, there is a gap between two adjacent auxiliary magnets 411 in the multiple auxiliary magnets 411.
  • a mounting groove 414 is provided on a side of the module upper shell 410 facing the diaphragm assembly 31 , and the auxiliary magnet 411 is disposed in the mounting groove 414 .
  • the mounting groove 414 can be a groove structure formed by a concave inward on one side surface of the module upper shell 410, or a concave structure formed by a concave on one side surface of the module upper shell 410 toward the other side surface, so that the other side surface is raised, without limitation here. It is understood that the mounting groove 414 can be provided on the lower surface of the module upper shell 410. Of course, in other embodiments, the mounting groove 414 can be provided on the upper surface of the module upper shell 410, without limitation here.
  • the sound module 500 further includes a flexible circuit board, one end of the flexible circuit board is electrically connected to the sound unit 100, and the other end of the flexible circuit board is used to connect to an external power supply.
  • the flexible circuit board is used to connect the external circuit to the sound unit 100.
  • the flexible circuit board is provided with inner and outer pads. The inner pads of the flexible circuit board are connected to the sound unit 100, while the outer pads of the flexible circuit board are used to connect to external terminals.
  • at least the end of the flexible circuit board connected to the sound unit 100 is located within the installation space 421 of the module housing 400.
  • the entire flexible circuit board can also be placed within the installation space 421 of the module housing 400, and this is not limited here.
  • the present invention further provides an electronic device comprising the aforementioned sound module 500.
  • the specific structure of the sound module 500 is similar to that of the aforementioned embodiments. Since the present electronic device utilizes all the technical solutions of all the aforementioned embodiments, it at least has all the beneficial effects brought about by the technical solutions of the aforementioned embodiments, and therefore will not be further elaborated here.
  • the electronic device further includes a device housing, and the sound module 500 is disposed within the device housing.
  • the device housing has a cavity, and the sound unit 100 is disposed within the cavity of the device housing.
  • the electronic device can be headphones, mobile phones, computers, tablet computers, smart wearable devices, etc., without limitation.
  • the electronic device can also be an MP3, MP4, wearable device, etc., which are not listed here one by one.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)

Abstract

本发明公开一种发声模组和电子设备，该发声模组包括模组壳体和发声单体，发声单体的振膜组件的振动板具有导磁部，模组壳体的模组上壳位于振膜组件背向磁路系统一侧，模组上壳设有辅助磁铁，辅助磁铁的充磁方向与中心磁部的充磁方向相反；其中，导磁部与辅助磁铁之间具有第一吸力，导磁部与磁路系统之间具有第二吸力，在非工作状态时，振动系统在第一吸力和第二吸力的合力的作用下位于辅助磁铁和磁路系统之间的平衡位置。本发明通过设置导磁部和辅助磁铁，在振动系统中引入静磁力，来降低振动系统的刚度，从而达到大幅提升发声模组的低频效果。

Description

发声模组和电子设备 技术领域
本发明涉及电声换能技术领域，特别涉及一种发声模组以及应用该发声模组的电子设备。
背景技术
近年来，消费类电子产品得到快速发展，智能手机、VR设备等电子设备得到消费者的认可，得到了广泛的应用。本领域技术人员对相关的配套产品如耳机等也相应进行了改进，以满足电子产品的性能要求，满足消费者对产品性能的需要。
发声装置是消费类电子产品中重要的电声换能部件，其作为扬声器、听筒、耳机等得到广泛地应用。随着电子产品的性能改进，有关发声装置的声学性能的改进也是必然的趋势。响度(灵敏度)是发声装置的主要性能指标，理论上，发声装置低频响度的大小，与其振膜组件能够推动的最大空气量密切相关。
相关技术中，随着对电子设备的轻薄化要求越来越高，电子设备中留给微型发声装置的装配空间越来越小，为了满足声学性能的要求，因此需要预留较大的振动空间来满足大振幅需求。而产品的驱动力因子BL值随着振动系统位移的增加会减小，从而限制产品的性能，无法大幅提升产品的低频效果。
发明内容
本发明的主要目的是提供一种发声模组和电子设备，旨在通过设置导磁部和辅助磁铁，在振动系统中引入静磁力，通过静磁力来降低振动系统的刚度，从而达到大幅提升发声模组的低频效果。
为实现上述目的，本发明提出一种发声模组，所述发声模组包括：
模组壳体，所述模组壳体内设有安装空间，所述模组壳体包括相连接的模组上壳和模组下壳；和
发声单体，所述发声单体包括设于所述安装空间内的磁路系统和振动系统，所述磁路系统包括导磁轭以及设于所述导磁轭的中心磁部和边磁部，所述中心磁部与所述边磁部间隔设置形成磁间隙，所述振动系统设于所述磁路系统的一侧，所述振动系统包括振膜组件和连接于所述振膜组件的音圈，所述音圈远离所述振膜组件的一端与所述磁间隙对应设置，所述振膜组件包括振膜和设于所述振膜的振动板，所述振动板具有导磁部，所述模组上壳位于所述振膜组件背向所述磁路系统一侧，所述模组上壳设有辅助磁铁，所述辅助磁铁的充磁方向与所述中心磁部的充磁方向相反；
其中，所述导磁部与所述辅助磁铁之间具有第一吸力，所述导磁部与所述磁路系统之间具有第二吸力，在非工作状态时，所述振动系统在所述第一吸力和所述第二吸力的合力的作用下位于所述辅助磁铁和所述磁路系统之间的平衡位置。
在一实施例中，所述导磁部粘接于所述振动板；
或，所述导磁部与所述振动板一体注塑成型；
或，所述振动板由导磁材料制成，所述振动板形成为所述导磁部。
在一实施例中，所述导磁部设于所述振动板面向所述模组上壳的一侧；
且/或，所述导磁部设于所述振动板面向所述中心磁部的一侧；
且/或，所述振动板设有固定腔，所述导磁部设于所述固定腔内。
在一实施例中，所述导磁部包括多个；多个所述导磁部设于所述振膜组件的同一侧或不同侧；且/或，多个所述导磁部呈拼接设置或间隔设置；
且/或，所述导磁部呈圆形、椭圆形或多边形；
且/或，所述导磁部的中心轴线与所述发声模组的中心轴线重合；
且/或，所述导磁部为导磁板，所述导磁板的材质为SPCC或SUS430。
在一实施例中，所述中心磁部包括层叠设置的中心磁铁和中心导磁板，所述中心磁铁连接于所述导磁轭，所述中心导磁板对应所述导磁部设有凹陷区域。
在一实施例中，部分所述中心导磁板朝向远离所述振膜组件的方向凹陷设置形成所述凹陷区域；
或，所述凹陷区域为贯通所述中心导磁板的通孔结构。
在一实施例中，所述凹陷区域为贯通孔，所述中心磁铁对应所述贯通孔设有凸出部，所述凸出部位于所述贯通孔内。
在一实施例中，所述凸出部面向所述振膜的一侧端面不超过所述中心导磁板面向所述振膜的一侧端面。
在一实施例中，所述振膜设有内环孔，所述振动板盖设于所述内环孔，所述振动板背向所述中心磁部的一侧朝向靠近所述中心磁部的方向凹陷形成固定槽，所述导磁部设于所述固定槽内。
在一实施例中，所述模组上壳与所述发声单体配合形成前声腔，所述模组壳体上设有与所述前声腔连通的出声孔；
其中，所述辅助磁铁设于所述模组上壳面向所述前声腔的一侧；且/或，所述辅助磁铁设于所述模组上壳背向所述前声腔的一侧；且/或，所述模组上壳设有安装腔，所述辅助磁铁设于所述安装腔内。
在一实施例中，所述辅助磁铁粘接于所述模组上壳；
或，所述辅助磁铁与所述模组上壳一体注塑成型。
在一实施例中，所述辅助磁铁包括多个；多个所述辅助磁铁设于所述模组上壳的同一侧或不同侧；且/或，多个所述辅助磁铁呈拼接设置或间隔设置；
且/或，所述辅助磁铁呈圆形、椭圆形或多边形；
且/或，所述辅助磁铁为磁铁；
且/或，所述辅助磁铁的中心轴线与所述发声单体的中心轴线重合；
且/或，所述辅助磁铁与所述导磁部呈正对设置；
且/或，所述模组上壳面向所述振膜组件的一侧设有安装槽，所述辅助磁铁设于所述安装槽内。
在一实施例中，所述模组壳体还包括模组中壳，所述模组中壳与所述模组上壳和所述模组下壳共同限定出所述安装空间；
沿所述振动系统的振动方向，所述模组中壳位于所述模组上壳和所述模组下壳之间且两端分别与所述模组上壳和所述模组下壳连接。
本发明还提出一种电子设备，所述电子设备包括上述所述的发声模组。
本发明技术方案的发声模组通过将模组壳体设置为相连接的模组上壳和模组下壳，使得模组上壳位于发声单体的振膜组件背向磁路系统一侧，且将振膜组件设置为振膜和设于振膜的振动板，并在振动板设置导磁部，且在模组上壳设置辅助磁铁，使得辅助磁铁的充磁方向与中心磁部的充磁方向相反，从而使得导磁部和辅助磁铁之间具有第一吸力，导磁部与磁路系统之间具有第二吸力，如此利用导磁部分别与辅助磁铁以及磁路系统相互作用，在振动系统中引入了静磁力，从而有效降低振膜组件在运动过程中的应变回复力。可以理解的，通过设置导磁部和辅助磁铁，在振动系统中引入静磁力，使得振动系统在工作时，第一吸力和第二吸力的合力与振膜的应变回复力的方向相反且小于振膜的应变回复力；振动系统停止工作时，振动系统在第一吸力和第二吸力的合力的作用下位于辅助磁铁和磁路系统之间的平衡位置，由此通过静磁力来降低振动系统的刚度，使得振膜组件的顺性更好，从而可以大幅提升发声模组的低频效果。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图示出的结构获得其他的附图。
图1为本发明一实施例中发声模组的结构示意图；
图2为本发明一实施例中发声模组另一视角的结构示意图；
图3为本发明一实施例中发声模组的分解示意图；
图4为本发明一实施例中发声模组的剖面示意图；
图5为本发明另一实施例中发声模组的剖面示意图；
图6为本发明一实施例中发声单体的剖面示意图；
图7为本发明另一实施例中发声单体的剖面示意图；
图8为本发明一实施例中发声模组的振动方向静磁力曲线图；
图9为本发明的发声模组与现有设计的刚度曲线图；
图10为本发明的发声模组与现有设计的频响性能测试图。
附图标号说明：

本发明目的的实现、功能特点及优点将结合实施例，参照附图做进一步说明。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明的一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
需要说明，本发明实施例中所有方向性指示(诸如上、下、左、右、前、后……)仅用于解释在某一特定姿态(如附图所示)下各部件之间的相对位置关系、运动情况等，如果该特定姿态发生改变时，则该方向性指示也相应地随之改变。
同时，全文中出现的“和/或”或“且/或”的含义为，包括三个方案，以“A和/或B”为例，包括A方案，或B方案，或A和B同时满足的方案。
另外，在本发明中如涉及“第一”、“第二”等的描述仅用于描述目的，而不能理解为指示或暗示其相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。另外，各个实施例之间的技术方案可以相互结合，但是必须是以本领域普通技术人员能够实现为基础，当技术方案的结合出现相互矛盾或无法实现时应当认为这种技术方案的结合不存在，也不在本发明要求的保护范围之内。
本发明提出一种发声模组500。可以理解的，发声模组500可以应用于电子设备，电子设备可以是智能手表、手机、音响、电脑、耳机或电视等，在此不做限定。
需要说明的是，响度(灵敏度)是发声模组500的主要性能指标。理论上，发声模组500低频响度的大小，与其发声单体100的振膜组件31能够推动的最大空气量密切相关。而智能设备中留给发声模组500的体积越来越小，使得发声模组500的有效振动面积(Sd)和后腔体积越来越小，因此需要预留较大的振动空间来满足大振幅(Xmax)需求。但是，产品的驱动力因子BL值随着发声单体100的振动系统3位移的增加会减小，这导致虽然预留了较大的振动空间，但实际低频时，即使PA满幅输出驱动信号，发声单体100的振动系统3位移仍无法达到Xmax，极大限制了产品的性能。
考虑到，在给定的物理空间限制下Sd受限，BL值在一定的物理空间和制造水平限制下提升幅度也有限。因此，本发明通过调整发声模组500中的系统刚度(Kms)，以实现低频大幅提升的效果。在本发明中通过新的磁路设计，在发声单体100的振动系统3中引入静磁力，通过静磁力来降低振动系统3的刚度，从而达到大幅提升低频的效果。
请结合参照图1至图7所示，在本发明实施例中，该发声模组500包括模组壳体400和发声单体100，模组壳体400内设有安装空间421，模组壳体400包括相连接的模组上壳410和模组下壳420，发声单体100包括设于安装空间421内的磁路系统2和振动系统3，磁路系统2包括导磁轭21以及设于导磁轭21的中心磁部22和边磁部23，中心磁部22与边磁部23间隔设置形成磁间隙24，振动系统3设于磁路系统2的一侧，振动系统3包括振膜组件31和连接于振膜组件31的音圈32，音圈32远离振膜组件31的一端与磁间隙24对应设置，振膜组件31包括振膜311和设于振膜311的振动板312，振动板312具有导磁部3121，模组上壳410位于振膜组件31背向磁路系统2一侧，模组上壳410设有辅助磁铁411，辅助磁铁411的充磁方向与中心磁部22的充磁方向相反；其中，导磁部3121与辅助磁铁411之间具有第一吸力，导磁部3121与磁路系统2之间具有第二吸力，在非工作状态时，振动系统3在第一吸力和第二吸力的合力的作用下位于辅助磁铁411和磁路系统2之间的平衡位置。
在本实施例中，发声模组500的发声单体100可以是扬声器发声单体，扬声器可以为微型扬声器。发声模组500可选为模组结构，发声模组500的模组壳体400形成有安装空间421，发声单体100设于模组壳体400的安装空间421内。可选地，模组壳体400包括模组上壳410和模组下壳420。发声单体100设于安装空间421内，使得模组上壳410的至少部分结构位于振膜组件31背向磁路系统2一侧。
可以理解的，发声单体100设于安装空间421内，使得发声单体100与模组壳体400的模组上壳410配合形成前声腔430，且发声单体100与模组壳体400的模组上壳410和模组下壳420配合形成后声腔440内。在本实施例中，如图4和图5所示，发声单体100的振膜组件31面向前声腔430，磁路系统2位于后声腔440内。可选地，辅助磁铁411设于模组上壳410。
为了方便发声模组500顺利发声，在一实施例中，模组上壳410与发声单体100配合形成前声腔430，模组壳体400上设有与前声腔430连通的出声孔413。
在本实施例中，出声孔413可以是正对振膜组件31设置，使得发声模组500呈正出声结构。当然，在其他实施例中，出声孔413也可不与振膜组件31正对设置，可选地出声孔413位于振膜组件31的侧边或周缘位置，此时发声模组500呈侧出声结构。
可以理解的，如图4和图5所示，模组上壳410还设有导声件，导声件形成出声通道，出声通道的一端连通前声腔430，出声通道的另一端连通出声孔413。
在一实施例中，模组上壳410环绕辅助磁铁411设有支撑台412，发声单体100支撑于支撑台412，并与模组上壳410围合形成前声腔430，振膜组件31面向前声腔430，发声单体100与模组上壳410和模组下壳420围合形成后声腔440，磁路系统2面向后声腔440，模组上壳410还设有连通前声腔430的出声孔413。
在本实施例中，如图4和图5所示，模组上壳410环绕辅助磁铁411设有支撑台412，发声单体100的振动系统3支撑于支撑台412，并与模组上壳410围合形成前声腔430，振膜组件31面向前声腔430。发声单体100的磁路系统2和振动系统3设于安装空间421内，使得振动系统3与模组上壳410和模组下壳420围合形成后声腔440，磁路系统2位于后声腔440内。
可选地，支撑台412的两端分别与导声件连接，使得支撑台412与导声件围合形成安装槽或凹槽结构。为了方便安装固定发声单体100，支撑台412可以是平面支撑台结构，支撑台412也可以呈台阶结构设置，使得发声单体100的振动系统3的周缘支撑固定于该台阶结构，在此不做限定。
可以理解的，为了进一步提高发声模组500的出声效果，发声模组500的后声腔440可填充有吸音颗粒。为了避免吸音颗粒进入发声单体100的内部，影响发声单体100的磁路系统2和振动系统3。发声模组500还包括隔离透气结构，该隔离透气结构设于后声腔440内，用于阻隔吸音颗粒进入发声单体100内部，在此不做限定。
需要说明的是，模组壳体400的结构不限于模组上壳410和模组下壳420。当然，在其他实施例中，模组壳体400还包括模组中壳，模组中壳与模组上壳410和模组下壳420共同限定出安装空间421，在此不做限定。在本实施例中，沿发声单体100的振动系统3的振动方向，模组壳体400的模组中壳位于模组上壳410和模组下壳420之间，且模组中壳的两端分别与模组上壳410和模组下壳420连接。
可以理解的，模组壳体400的模组上壳410的结构不限于本发明的结构形式，还可以是其他结构设计形式，只要是能够支撑和固定辅助磁铁411即可，在此不做限定。
在本发明中，发声单体100的磁路系统2和振动系统3呈相对设置。可选地，磁路系统2可以呈方形设置。例如，磁路系统2可以包括均为方形结构的中心磁部22和边磁部23。振动系统3也呈方形设置。可以理解的，振动系统3的振膜组件31周缘可与磁路系统2连接，或磁路系统2和振动系统3分别装配于外壳或模组壳体上等，在此不做限定。
为了更好地装配发声单体100的磁路系统2和振动系统3。在一实施例中，如图3至图7所示，发声单体100还包括外壳1，磁路系统2连接于外壳1的一端，振动系统3连接于外壳1的另一端，并与磁路系统2相对设置，也即振动系统3的振膜组件31的周缘连接于外壳1的另一端，并与磁路系统2相对设置。
在本实施例中，外壳1用于安装、固定和支撑磁路系统2和振动系统3等部件，也即外壳1为磁路系统2和振动系统3等部件提供安装基础。可以理解的，外壳1可以是一个整体结构，也可以是多个分体结构配合形成，在此不做限定。本实施例中的外壳1可选为方形的框体或框架结构，也即外壳1具有两端开口的容腔，磁路系统2和振动系统3分别连接于外壳1的两侧，并呈相对设置，使得磁路系统2、外壳1及振动系统3的振膜组件31围合形成振动腔体。
可以理解的，发声单体100通过将磁路系统2设置为导磁轭21以及设于导磁轭21的中心磁部22和边磁部23，磁路系统2可通过导磁轭21的周缘与外壳1连接；或，磁路系统2可通过边磁部23与外壳1连接，在此不做限定。
在本实施例中，将边磁部23位于中心磁部22的外侧，并与中心磁部22围合形成磁间隙24，如此使得振动系统3的振膜组件31与外壳1远离导磁轭21的一端连接，并与磁路系统2相对且间隔，从而将音圈32的一端与振膜组件31连接，音圈32的另一端与磁间隙24对应设置。
需要说明的是，音圈32可以是扁平音圈，此时固定于振膜组件31面向磁路系统2的一侧，并与磁路系统2的磁间隙24相对且间隔设置，也即音圈32的另一端位于磁间隙24外，沿振动系统3的振动方向，音圈32的另一端的与磁间隙24相对设置；或者，音圈32为环形跑道音圈，此时音圈32的一端与振膜组件31连接，音圈32的另一端悬设于磁间隙24内，在此不做限定。
为了实现发声单体100的音圈32与外部电路的电连接。在一实施例中，如图3至图7所示，发声单体100还包括定心支片33，定心支片33的一端连接于音圈32，定心支片33的另一端与外壳1连接。
可以理解的，定心支片33的两端分别与音圈32的引线和外部电路电连接。在本实施例中，定心支片33可设置在音圈32的底部，定心支片33位于发声单体100的四角位置或发声单体100的短轴或长轴方向，当然，定心支片33也可设置在音圈32的顶部，定心支片33位于音圈32和振膜组件31之间，在此不做限定。
在一实施例中，振膜组件31包括振膜311和设于振膜311的振动板312。可选地，导磁部3121设于振动板312。
在本实施例中，如图3至7所示，振膜311包括折环部、连接于折环部外侧的固定部以及连接于折环部内侧的中央部，振动板312设于中央部。可以理解的，振膜311的固定部、折环部及中央部依次连接为一体成型结构，从而确保振膜311的振动性能和结构强度。可选地，振膜311的折环部呈向上凸起的凸包结构或向下凹陷的凹陷结构，在此不做限定。
可以理解的，振动板312设于振膜311的中央部，可有效加强振膜311的中央部的结构强度。通过将导磁部3121设于振动板312，从而利用导磁部3121分别与辅助磁铁411或磁路系统2相互作用产生静磁力，以改变振膜311的刚度。可选地，振膜311的中央部可以是平板结构，也可以是环形结构。
可选地，振膜311的中央部设有容置槽，振动板312的至少部分位于限位于容置槽内。可以理解的，通过在振膜311背向音圈32的一侧设置容置槽，如此可方便利用容置槽安装和容置振动板312，确保振动板312的上表面与振膜311的上表面齐平，从而可以减小发声单体100沿振动系统3的振动方向的高度，以及确保整个振膜组件31的振动性能。
为了降低振膜组件31的重量，振膜311设有内环孔3111，振动板312盖设于内环孔3111。在本实施例中，振膜311的中央部设有内环孔3111，振动板312的周缘与中央部连接。振动板312可连接于振膜311的中央部面向音圈32的一侧或背向音圈32的一侧。
可选地，振动板312的周缘形成有台阶面，振膜311邻近内环孔3111的一侧支撑连接于台阶面，台阶面位于音圈32和振膜311之间。可以理解的，通过在振动板312的周缘设置台阶面，使得台阶面朝向音圈32的一侧凹陷，从而确保振膜311的中央部搭接支撑于振动板312的台阶面时，确使得振膜311的中央部的上表面与振动板312的上表面呈齐平设置，从而使得装配结构更加紧凑，以及确保整个振膜组件31的振动性能。
在本实施例中，通过在振动系统3的振膜组件31设置导磁部3121，并使得模组壳体400的模组上壳410的至少部分位于振膜组件31背向磁路系统2一侧，且在模组上壳410设置辅助磁铁411，使得导磁部3121和辅助磁铁411之间具有第一吸力，导磁部3121与磁路系统2之间具有第二吸力，在发声单体100处于非工作状态时，振动系统3在第一吸力和第二吸力的合力的作用下位于辅助磁铁411和磁路系统2之间的平衡位置。
可以理解的，振动系统3在工作时，第一吸力和第二吸力的合力与振动系统3的应变回复力的方向相反且小于振膜311的应变回复力；振动系统3停止工作时，第一吸力和第二吸力的合力的等效刚度不大于振动系统3的刚度，振动系统3在第一吸力和第二吸力的合力的作用下位于辅助磁铁411和磁路系统2之间的平衡位置。如此通过静磁力来降低振动系统3的刚度。如此通过在振动系统3中引入静磁力，通过静磁力来降低振动系统3的刚度，从而达到大幅提升低频的效果。
需要说明的是，导磁部3121在振动方向上的两侧还设有用于吸引导磁部3121的辅助磁铁411和磁路系统2，也即辅助磁铁411和磁路系统2分别位于导磁部3121的两侧，使得当导磁部3121随着振动系统3振动时，导磁部3121可以靠近辅助磁铁411或者靠近磁路系统2。可选地，辅助磁铁411和磁路系统2可通过磁铁来提供。
在本实施例中，辅助磁铁411的充磁方向与中心磁部22中的中心磁铁221的充磁方向相反。由此，辅助磁铁411产生的磁感线与中心磁部22产生的磁感线方向相反且相互排斥，两部分磁感线横向穿过音圈32，由此可以增大作用于音圈32的磁感线强度，增大产品的BL值，进而可以提升发声单体100的发声灵敏度。
当导磁部3121靠近辅助磁铁411时，其远离磁路系统2。因此导磁部3121与辅助磁铁411的吸引力变大，其与磁路系统2的吸引力变小，第一吸力和第二吸力的合力朝向辅助磁铁411的方向。导磁部3121受到的总的吸引力便可以作为施加在振动系统3上的作用力。
基于同样的原理，当导磁部3121靠近磁路系统2时，其远离辅助磁铁411。因此导磁部3121与辅助磁铁411的吸引力变小，其与磁路系统2的吸引力变大，第一吸力和第二吸力的合力朝向磁路系统2的方向。导磁部3121受到的总的吸引力便可以作为施加在振动系统3上的作用力。
可选地，当振动系统3位于平衡位置时，导磁部3121受到辅助磁铁411的吸引力等于其受到磁路系统2的吸引力。以避免导磁部3121受到的吸引力影响振动系统3的平衡位置。
具体而言，以振动系统3沿上下方向振动为例，当振动系统3不工作时，振膜组件31位于初始位置。当振动系统3工作时，音圈32驱动振膜组件31上下振动，当振膜组件31位于初始位置的上方时，振膜311的应变回复力的方向向下，此时导磁部3121与辅助磁铁411之间的第一吸力方向向上，导磁部3121与磁路系统2之间的第二吸力方向向下，且第一吸力大于第二吸力，第一吸力和第二吸力的合力小于振膜311的应变回复力且方向向上，由此第一吸力和第二吸力的合力作用于振膜311以抵消一部分振膜311的应变回复力。同理，当振膜组件31位于初始位置的下方时，振膜311的应变回复力的方向向上，此时导磁部3121与辅助磁铁411之间的第一吸力方向向上，导磁部3121与磁路系统2之间的第二吸力方向向下，且第二吸力大于第一吸力，第一吸力和第二吸力的合力小于振膜311的应变回复力且方向向下，由此第一吸力和第二吸力的合力作用于振膜311以抵消一部分振膜311的应变回复力。
综上，振动系统3在工作时，第一吸力和第二吸力的合力与振膜311的应变回复力的方向相反且小于振膜311的应变回复力。振动系统3停止工作时，第一吸力和第二吸力的合力的等效刚度不大于振膜311的刚度。
具体而言，当发声单体100处于非工作状态时，振动系统3处于平衡位置时，导磁部3121和辅助磁铁411之间的第一吸力与导磁部3121和磁路系统2之间的第二吸力的合力的等效刚度不大于振膜311的刚度。也就是说，在非工作状态下，当振动系统3处于平衡位置时，导磁部3121和辅助磁铁411之间的第一吸力与导磁部3121和磁路系统2之间的第二吸力的合力无法驱动振膜组件31振动，从而可以避免发声单体100处于非工作状态时静磁力对振动系统3平衡位置的影响。
需要说明的是，导磁部3121和辅助磁铁411之间的第一吸力与导磁部3121和磁路系统2之间的第二吸力施加在振动系统3上的作用力并不是固定的。当振动系统3偏离其平衡位置的距离越大时，导磁部3121和辅助磁铁411之间的第一吸力与导磁部3121和磁路系统2之间的第二吸力施加在振动系统3上的作用力也越大。当振动系统3偏离其平衡位置的距离越小时，导磁部3121和辅助磁铁411之间的第一吸力与导磁部3121和磁路系统2之间的第二吸力在振动系统3上的作用力也越小。静磁力表现如图8所示。
具体地，系统刚度Kms由振动系统3刚度Km以及腔体刚度Kb两部分组成，即Kms＝Km+Kb。考虑到静磁力与振膜组件31的位置相关，与系统刚度Kms类似，定义静磁力产生的刚度为Kt，Kt＝静磁力/振动方向位移，此时系统的总刚度变为：Kms＝Km+Kb-Kt，其中，Kms为系统刚度，Km为振动系统3刚度，Kb为腔体刚度。这时，随着位移的增大，静磁力产生的刚度增大，系统刚度减小，即振幅越大，系统越“软”，与BL(x)曲线走势相“匹配”，低频性能更高，如图9和图10所示。
本发明的发声模组500通过将模组壳体400设置为相连接的模组上壳410和模组下壳420，使得模组上壳410位于发声单体100的振膜组件31背向磁路系统2一侧，且将振膜组件31设置为振膜311和设于振膜311的振动板312，并在振动板312设置导磁部3121，且在模组上壳410设置辅助磁铁411，使得辅助磁铁411的充磁方向与中心磁部22的充磁方向相反，从而使得导磁部3121和辅助磁铁411之间具有第一吸力，导磁部3121与磁路系统2之间具有第二吸力，如此利用导磁部3121分别与模组上壳410的辅助磁铁411以及磁路系统2相互作用，在振动系统3中引入了静磁力，从而有效降低振膜组件31在运动过程中的应变回复力。
可以理解的，通过设置导磁部3121和辅助磁铁411，在振动系统3中引入静磁力，使得振动系统3在工作时，第一吸力和第二吸力的合力与振膜311的应变回复力的方向相反且小于振膜311的应变回复力；振动系统3停止工作时，第一吸力和第二吸力的合力的等效刚度不大于振膜311的刚度，通过静磁力来降低振动系统3的刚度，使得振膜组件31的顺性更好，从而可以大幅提升发声模组500的低频效果。
在一实施例中，导磁部3121可选为导磁板，导磁板的材质为SPCC或SUS430。当然，也可将振动板312采用导磁材料制成，使得振动板312形成为导磁部3121。
在一实施例中，导磁部3121粘接于振动板312。例如，导磁部3121可采用黏胶的方式连接于振动板312。或者，导磁部3121焊接于振动板312。例如，导磁部3121可采用锡焊的方式连接于振动板312。当然，在其他实施例中，导磁部3121与振动板312也可一体注塑成型，也即导磁部3121与振动板312采用注塑方式加工为一体结构，在此不做限定。
在一实施例中，导磁部3121设于振动板312面向模组上壳410的一侧；且/或，导磁部3121设于振动板312面向中心磁部22的一侧；且/或，振动板312设有固定腔，导磁部3121设于固定腔内。
可以理解的，导磁部3121可以设置于振动板312的至少一侧，也即导磁部3121可以设置于振动板312的一侧或相背离的两侧。在本实施例中，振动板312具有相背离设置的第一表面和第二表面，第一表面面向模组上壳410，此时导磁部3121可设置于第一表面，如图4至图7所示；导磁部3121也可设置于第二表面；导磁部3121还可以同时设置在第一表面和第二表面。
当然，导磁部3121还可设置于振动板312内，也即导磁部3121嵌设于振动板312内或注塑于振动板312内。在一实施例中，振动板312内设有固定腔，导磁部3121设于固定腔内。
在一实施例中，导磁部3121包括多个。可以理解的，多个导磁部3121可同时设置于振动板312的同一侧；或，多个导磁部3121可同时设置在振动板312的不同侧。例如，多个导磁部3121可同时设置于振动板312的第一表面或第二表面；或者，多个导磁部3121可同时设置于振动板312的第一表面和第二表面，在此不做限定。
可以理解的，多个导磁部3121设置于振动板312的同一侧时，多个导磁部3121呈拼接设置。例如，多个导磁部3121中相邻的两个导磁部3121之间紧贴设置，也即没有间隙。多个导磁部3121设置于振动板312的同一侧时，多个导磁部3121呈间隔设置。例如，多个导磁部3121中相邻的两个导磁部3121之间具有间隙。
可选地，导磁部3121呈圆形、椭圆形或多边形。也即导磁部3121的形状可以是圆形、椭圆形、三角形、方形等多边形结构，在此不做限定。为了确保辅助磁铁411与导磁部3121之间的磁吸力平衡，导磁部3121的结构可选为对称结构或规则结构，在此不做限定。
在本实施例中，辅助磁铁411与导磁部3121可选地呈正对设置。可以理解的，如此设置可确保辅助磁铁411与导磁部3121之间的磁吸力。为了进一步确保发声单体100的振动系统3的平衡性，导磁部3121的中心轴线与发声模组500的中心轴线重合。可选地，导磁部3121的中心轴线可选地与发声单体100的中心轴线重合。
在一实施例中，振膜311设有内环孔3111，振动板312盖设于内环孔3111，振动板312设有固定槽3122，导磁部3121设于固定槽3122内。可以理解的，如图3至图7所示，固定槽3122可以是凹设于振动板312的凹槽结构。可选地，固定槽3122由振动板312背向中心磁部22的一侧朝向靠近中心磁部22的方向凹陷形成，也即振动板312背向中心磁部22的一侧朝向靠近中心磁部22的方向凹陷形成固定槽3122。或者，固定槽3122可以是由振动板312面向中心磁部22的一侧朝向模组上壳410凹陷形成，在此不做限定。
在一实施例中，中心磁部22包括层叠设置的中心磁铁221和中心导磁板222，中心磁铁221连接于导磁轭21，中心导磁板222对应导磁部3121设有凹陷区域223。
在本实施例中，如图3至7所示，中心磁部22包括一个或多个中心磁铁221和中心导磁板222，中心磁铁221和中心导磁板222呈层叠设置。当中心磁铁221和中心导磁板222均包括多个时，多个中心磁铁221和多个中心导磁板222呈交替层叠设置，且一中心磁铁221连接于导磁轭21。当中心磁铁221和中心导磁板222包括一个时，中心磁铁221夹设于中心导磁板222和导磁轭21之间。
可选地，中心磁部22可呈环形结构设置，使得中心磁部22的中央形成通孔结构。当然，在其他实施例中，中心磁部22包括多个条形结构，多个条形结构围合形成环状结构，使得多个条形结构围合形成通孔结构，在此不做限定。或者，中心磁部22呈方形的板状结构，在此不做限定。
可以理解的，中心导磁板222呈一体环形设置，使得中心导磁板222的中央形成凹陷区域223。当然，在其他实施例中，中心导磁板222包括多个，多个中心导磁板222呈环形围合形成凹陷区域223；或者，中心导磁板222呈板状结构，在此不做限定。可选地，中心磁铁221可选地呈环形设置，也即中心磁铁221呈一体环形设置，使得中心磁铁221的中央形成第二通孔。当然，在其他实施例中，中心磁铁221包括多个，多个中心磁铁221呈环形围合形成第二通孔；或者，中心磁铁221呈板状结构，在此不做限定。
在本实施例中，通过在中心磁部22的中心导磁板222设置凹陷区域223，可以减小因中心导磁板222的聚磁作用而对第二吸力的影响，从而有效增大导磁部3121与中心磁铁221之间的磁吸力。可以理解的，凹陷区域223的设置也有利于对振动板312的固定槽3122实现避让。可选地，部分中心导磁板222朝向远离振膜组件31的方向凹陷设置形成凹陷区域223。当然，在其他实施例中，凹陷区域223为贯通中心导磁板222的通孔结构。
可以理解的，凹陷区域223可以为贯通中心导磁板222的通孔或缺口结构。当然，凹陷区域223也可以是中心导磁板222朝向远离振膜组件31的方向凹陷设置形成凹槽结构，在此不做限定。
在一实施例中，凹陷区域223为贯通孔，中心磁铁221对应贯通孔设有凸出部224，凸出部224位于贯通孔内。
在本实施例中，如图7所示，通过在中心磁铁221上设置凸出部224，使得凸出部224位于贯通孔内，如此可有效增大中心磁铁221与导磁部3121之间的磁吸力。可以理解的，为了避免中心磁铁221的凸出部224影响振膜311振动时振动板312的固定槽3122的振动，可选地，凸出部224面向振膜311的一侧端面不超过中心导磁板222面向振膜311的一侧端面，如此有效对振动板312的固定槽3122实现避让。可选地，凹陷区域223对应固定槽3122设置，在此不做限定。
在一实施例中，边磁部23包括边磁铁和设于边磁铁的边导磁板。可以理解的，如图3至图7所示，边磁部23的边磁铁和边导磁板层叠设置于导磁轭21，边磁铁连接于导磁轭21。边磁部23的边磁铁和边导磁板位于中心磁部22的外侧，并间隔以形成磁间隙24。
在一实施例中，边磁部23可选地呈环形设置，此时环状的边磁部23位于中心磁部22的外侧，并与中心磁部22间隔围合形成磁间隙24。可选地，边磁铁和/或边导磁板形成封闭的一体环状结构。
当然，在其他实施例中，边磁部23包括多个，多个边磁部23环绕设置于中心磁部22的外侧，并与中心磁部22间隔围合形成磁间隙24。可选地，边磁铁和边导磁板均为多个，且一一对应设置，相邻的边磁铁首尾相接以形成封闭的环状结构。或者，边磁铁形成封闭的一体环状结构，边导磁板为多个，相邻的边导磁板首尾相接以形成封闭的环状结构，并与环状边磁铁对应设置；或者，边导磁板形成封闭的一体环状结构，边磁铁为多个，相邻的边磁铁首尾相接以形成封闭的环状结构，并与环状边导磁板对应设置，在此不做限定。
需要说明的是，为了方便定心支片33的安装，多个边磁部23环绕设置于中心磁部22的外侧，相邻的两个边磁部23之间设置有用于避让定心支片33的缺口，在此不做限定。
在一实施例中，外壳1背向振膜组件31的一侧周缘设有定位柱，导磁轭21对应定位柱设有定位缺口，定位柱与定位缺口定位配合。可以理解的，通过在外壳1上设置定位柱，并在导磁轭21上形成与定位柱定位配合的定位缺口，从而实现磁路系统2的定位安装配合，提高安装便利性和精确性。
在本实施例中，如图3至图7所示，边磁部23包括层叠设置的边磁铁和边导磁板，边磁铁夹设于边导磁板和导磁轭21之间，边导磁板与外壳1连接。可选地，边导磁板与外壳1为一体成型结构，如此既可以简化结构，又可以提高安装稳定性。
在一实施例中，定心支片33包括多个，多个定心支片33的一端分别与音圈32连接，并分别与音圈32的引线电连接，多个定心支片33的另一端分别与外壳1连接，从而可以提升振动系统3的运行平稳性。
可选地，多个定心支片33沿磁路系统2的长轴方向和/或短轴方向和/或磁路系统2的对角或四角位置对应分布。可以理解的，多个定心支片33可沿磁路系统2的长轴方向对称分布；多个定心支片33也可沿磁路系统2的短轴方向对称分布；多个定心支片33还可在磁路系统2的对角对应设置；多个定心支片33还可在磁路系统2的四角位置对应设置。当然，在其他实施例中，多个定心支片33可以沿磁路系统2的长轴方向、磁路系统2的短轴方向以及磁路系统2的对角或四角位置对应分布，在此不做限定。
可选地，定心支片33包括两个或四个，如此设置既可以利用定心支片33将音圈32与外部电路连接导通，又可以确保发声单体100的振动平衡性。
可以理解的，定心支片33为两个时，两个定心支片33沿磁路系统2的长轴方向间隔排布；或，两个定心支片33沿磁路系统2的短轴方向间隔排布，在此不做限定。当然，当定心支片33为四个时，四个定心支片33也可以沿磁路系统2的四角位置对应设置。关于定心支片33的排布方式，本发明在此不做具体限定。
在一实施例中，每一定心支片33包括依次连接的第一连接部、弹性臂及第二连接部，第一连接部与音圈32连接，并与音圈32的引线电连接，第二连接部与外壳1连接。
在本实施例中，如图3所示，定心支片33的第一连接部、弹性臂及第二连接部可选为一体成型结构。如此可有效保证定心支片33的结构强度，同时简化定心支片33的加工步骤。可以理解的，为了确保定心支片33的形变能力，弹性臂具有至少一个折弯。
在一实施例中，如图3所示，定心支片33的第一连接部、弹性臂及第二连接部可位于同一平面。当然，在其他实施例中，定心支片33的第一连接部与第二连接部也可位于不同平面。可以理解的，利用定心支片33实现将外部电路与音圈32连接，又可以利用定心支片33有效避免音圈32在振动过程中发生摆动或偏振等问题。
在一实施例中，模组上壳410与发声单体100配合形成前声腔430，模组壳体400上设有与前声腔430连通的出声孔413；其中，辅助磁铁411设于模组上壳410面向前声腔430的一侧；且/或，辅助磁铁411设于模组上壳410背向前声腔430的一侧；且/或，模组上壳410设有安装腔，辅助磁铁411设于安装腔内。
在本实施例中，模组上壳410设置辅助磁铁411的位置与振膜组件31间隔，也即模组上壳410与振膜组件31之间形成有前声腔430。可以理解的，模组上壳410可选地呈倒U型或锅盖或帽子等结构，在此不做限定。需要说明的是，模组上壳410的结构不限于上述的结构形式，还可以是其他结构设计形式，只要是能够支撑和固定辅助磁铁411即可，在此不做限定。
可以理解的，模组上壳410可以是金属材质，也可以是塑胶材质，还可以是金属件和塑胶材质注塑成型，在此不做限定。可选地，辅助磁铁411粘接于模组上壳410。例如，辅助磁铁411可采用黏胶层粘结固定在模组上壳410上。当然，在其他实施例中，辅助磁铁411也可焊接于模组上壳410，例如辅助磁铁411可采用焊锡焊接固定于模组上壳410，在此不做限定。
为了方便加工模组上壳410，提高模组上壳410和辅助磁铁411的连接强度，可选地，辅助磁铁411与模组上壳410一体注塑成型。在本实施例中，辅助磁铁411可选地采用导磁材料制成。可选地，辅助磁铁411为磁铁。
在一实施例中，辅助磁铁411设于模组上壳410面向振膜组件31的一侧；且/或，辅助磁铁411设于模组上壳410背向振膜组件31的一侧；且/或，模组上壳410设有安装腔，辅助磁铁411设于安装腔内。
可以理解的，辅助磁铁411可以设置于模组上壳410的至少一侧，也即辅助磁铁411可以设置于模组上壳410的一侧或相背离的两侧。在本实施例中，模组上壳410具有相背离设置的上表面和下表面，下表面面向振膜组件31，此时辅助磁铁411可设置于上表面；辅助磁铁411也可设置于下表面，如图4、图5所示；辅助磁铁411还可以同时设置在上表面和下表面。
当然，辅助磁铁411还可设置于模组上壳410内，也即辅助磁铁411嵌设于模组上壳410内或注塑于模组上壳410内。在一实施例中，模组上壳410内设有安装腔，辅助磁铁411设于安装腔内。
在一实施例中，辅助磁铁411包括多个。可以理解的，多个辅助磁铁411可同时设置于模组上壳410的同一侧；或，多个辅助磁铁411可同时设置在模组上壳410的不同侧。例如，多个辅助磁铁411可同时设置于模组上壳410的上表面或下表面；或者，多个辅助磁铁411可同时设置于模组上壳410的上表面和下表面，在此不做限定。
可以理解的，多个辅助磁铁411设置于模组上壳410的同一侧时，多个辅助磁铁411呈拼接设置。例如，多个辅助磁铁411中相邻的两个辅助磁铁411之间紧贴设置，也即没有间隙。多个辅助磁铁411设置于模组上壳410的同一侧时，多个辅助磁铁411呈间隔设置。例如，多个辅助磁铁411中相邻的两个辅助磁铁411之间具有间隙。
可选地，辅助磁铁411呈圆形、椭圆形或多边形。也即辅助磁铁411的形状可以是圆形、椭圆形、三角形、方形等多边形结构，在此不做限定。为了确保辅助磁铁411与导磁部3121之间的磁吸力平衡，辅助磁铁411的结构可选为对称结构或规则结构，在此不做限定。
在本实施例中，辅助磁铁411与导磁部3121可选地呈正对设置。可以理解的，如此设置可确保辅助磁铁411与导磁部3121之间的磁吸力。为了进一步确保发声单体100的振动系统3的平衡性，辅助磁铁411的中心轴线可选地与发声模组500的中心轴线重合。可选地，辅助磁铁411的中心轴线可选地与发声单体100的中心轴线重合。可选地，辅助磁铁411为磁铁。
在一实施例中，如图5所示，模组上壳410面向振膜组件31的一侧设有安装槽414，辅助磁铁411设于安装槽414内。
在本实施例中，安装槽414可以是模组上壳410的一侧表面内凹形成的凹槽结构，也可以是模组上壳410的一侧表面朝向另一侧表面凹陷，使得另一侧表面凸起形成的凹陷结构，在此不做限定。可以理解的，安装槽414可以设置在模组上壳410的下表面。当然，在其他实施例，安装槽414可以设置在模组上壳410的上表面，在此不做限定。
在一实施例中，发声模组500还包括柔性电路板，柔性电路板的一端与发声单体100电连接，柔性电路板的另一端用于连接外部电源。
可以理解的，柔性电路板用于将外部电路与发声单体100连接导通。柔性电路板设有内焊盘和外焊盘，柔性电路板的内焊盘与发声单体100连接导通，柔性电路板的外焊盘用于与外部端子连接。在本实施例中，柔性电路板至少与发声单体100连接的一端位于模组壳体400的安装空间421内。当然，在其他实施例中，柔性电路板也可全部设置于模组壳体400的安装空间421内，在此不做限定。
本发明还提出一种电子设备，该电子设备包括上述的发声模组500。该发声模组500的具体结构参照前述实施例，由于本电子设备采用了前述所有实施例的全部技术方案，因此至少具有前述实施例的技术方案所带来的所有有益效果，在此不再一一赘述。
在一实施例中，电子设备还包括设备壳体，发声模组500设于设备壳体内。在本实施例中，设备壳体具有容腔，发声单体100设于设备壳体的容腔内。可以理解的，电子设备可以是耳机、手机、电脑、平板电脑、智能穿戴设备等，在此不做限定。当然，该电子设备还可以是MP3、MP4、可穿戴设备等，在此不再一一列举。
以上所述仅为本发明的可选实施例，并非因此限制本发明的专利范围，凡是在本发明的构思下，利用本发明说明书及附图内容所作的等效结构变换，或直接/间接运用在其他相关的技术领域均包括在本发明的专利保护范围内。

Claims (14)

  1. 一种发声模组，其特征在于，所述发声模组包括：
    模组壳体，所述模组壳体内设有安装空间，所述模组壳体包括相连接的模组上壳和模组下壳；和
    发声单体，所述发声单体包括设于所述安装空间内的磁路系统和振动系统，所述磁路系统包括导磁轭以及设于所述导磁轭的中心磁部和边磁部，所述中心磁部与所述边磁部间隔设置形成磁间隙，所述振动系统设于所述磁路系统的一侧，所述振动系统包括振膜组件和连接于所述振膜组件的音圈，所述音圈远离所述振膜组件的一端与所述磁间隙对应设置，所述振膜组件包括振膜和设于所述振膜的振动板，所述振动板具有导磁部，所述模组上壳位于所述振膜组件背向所述磁路系统一侧，所述模组上壳设有辅助磁铁，所述辅助磁铁的充磁方向与所述中心磁部的充磁方向相反；
    其中，所述导磁部与所述辅助磁铁之间具有第一吸力，所述导磁部与所述磁路系统之间具有第二吸力，在非工作状态时，所述振动系统在所述第一吸力和所述第二吸力的合力的作用下位于所述辅助磁铁和所述磁路系统之间的平衡位置。
  2. 如权利要求1所述的发声模组，其特征在于，所述导磁部粘接于所述振动板；
    或，所述导磁部与所述振动板一体注塑成型；
    或，所述振动板由导磁材料制成，所述振动板形成为所述导磁部。
  3. 如权利要求1所述的发声模组，其特征在于，所述导磁部设于所述振动板面向所述模组上壳的一侧；
    且/或，所述导磁部设于所述振动板面向所述中心磁部的一侧；
    且/或，所述振动板设有固定腔，所述导磁部设于所述固定腔内。
  4. 如权利要求1所述的发声模组，其特征在于，所述导磁部包括多个；多个所述导磁部设于所述振膜组件的同一侧或不同侧；且/或，多个所述导磁部呈拼接设置或间隔设置；
    且/或，所述导磁部呈圆形、椭圆形或多边形；
    且/或，所述导磁部的中心轴线与所述发声模组的中心轴线重合；
    且/或，所述导磁部为导磁板，所述导磁板的材质为SPCC或SUS430。
  5. 如权利要求1所述的发声模组，其特征在于，所述中心磁部包括层叠设置的中心磁铁和中心导磁板，所述中心磁铁连接于所述导磁轭，所述中心导磁板对应所述导磁部设有凹陷区域。
  6. 如权利要求5所述的发声模组，其特征在于，部分所述中心导磁板朝向远离所述振膜组件的方向凹陷设置形成所述凹陷区域；
    或，所述凹陷区域为贯通所述中心导磁板的通孔结构。
  7. 如权利要求5所述的发声模组，其特征在于，所述凹陷区域为贯通孔，所述中心磁铁对应所述贯通孔设有凸出部，所述凸出部位于所述贯通孔内。
  8. 如权利要求7所述的发声模组，其特征在于，所述凸出部面向所述振膜的一侧端面不超过所述中心导磁板面向所述振膜的一侧端面。
  9. 如权利要求5所述的发声模组，其特征在于，所述振膜设有内环孔，所述振动板盖设于所述内环孔，所述振动板背向所述中心磁部的一侧朝向所述中心磁部凹陷形成固定槽，所述导磁部设于所述固定槽内。
  10. 如权利要求1所述的发声模组，其特征在于，所述模组上壳与所述发声单体配合形成前声腔，所述模组壳体上设有与所述前声腔连通的出声孔；
    其中，所述辅助磁铁设于所述模组上壳面向所述前声腔的一侧；且/或，所述辅助磁铁设于所述模组上壳背向所述前声腔的一侧；且/或，所述模组上壳设有安装腔，所述辅助磁铁设于所述安装腔内。
  11. 如权利要求1所述的发声模组，其特征在于，所述辅助磁铁粘接于所述模组上壳；
    或，所述辅助磁铁与所述模组上壳一体注塑成型。
  12. 如权利要求1所述的发声模组，其特征在于，所述辅助磁铁包括多个；多个所述辅助磁铁设于所述模组上壳的同一侧或不同侧；且/或，多个所述辅助磁铁呈拼接设置或间隔设置；
    且/或，所述辅助磁铁呈圆形、椭圆形或多边形；
    且/或，所述辅助磁铁为磁铁；
    且/或，所述辅助磁铁的中心轴线与所述发声单体的中心轴线重合；
    且/或，所述辅助磁铁与所述导磁部呈正对设置；
    且/或，所述模组上壳面向所述振膜组件的一侧设有安装槽，所述辅助磁铁设于所述安装槽内。
  13. 如权利要求1至12中任一项所述的发声模组，其特征在于，所述模组壳体还包括模组中壳，所述模组中壳与所述模组上壳和所述模组下壳共同限定出所述安装空间；
    沿所述振动系统的振动方向，所述模组中壳位于所述模组上壳和所述模组下壳之间且两端分别与所述模组上壳和所述模组下壳连接。
  14. 一种电子设备，其特征在于，所述电子设备包括如权利要求1至13中任一项所述的发声模组。
PCT/CN2025/078500 2024-03-26 2025-02-21 发声模组和电子设备 Pending WO2025200892A1 (zh)

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