WO2025179869A1 - 服务器散热设备的控制方法、装置、存储介质和电子设备 - Google Patents

服务器散热设备的控制方法、装置、存储介质和电子设备

Info

Publication number
WO2025179869A1
WO2025179869A1 PCT/CN2024/122123 CN2024122123W WO2025179869A1 WO 2025179869 A1 WO2025179869 A1 WO 2025179869A1 CN 2024122123 W CN2024122123 W CN 2024122123W WO 2025179869 A1 WO2025179869 A1 WO 2025179869A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat dissipation
network card
target
dissipation device
slot
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/CN2024/122123
Other languages
English (en)
French (fr)
Inventor
孙秀强
姬飞飞
王向芳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Metabrain Intelligent Technology Co Ltd
Original Assignee
Suzhou Metabrain Intelligent Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzhou Metabrain Intelligent Technology Co Ltd filed Critical Suzhou Metabrain Intelligent Technology Co Ltd
Priority to US19/469,146 priority Critical patent/US20260113907A1/en
Publication of WO2025179869A1 publication Critical patent/WO2025179869A1/zh
Pending legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20836—Thermal management, e.g. server temperature control
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for supporting printed circuit boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

Definitions

  • the embodiments of the present application relate to the field of computers, and more specifically, to a control method and apparatus for server heat dissipation equipment, a non-volatile readable storage medium, and an electronic device.
  • the first heat dissipation device is controlled to operate according to target operating parameters, wherein the target operating parameters are used to dissipate heat from the target network card device to a target operating state, which is a state that allows the target network card device to continue operating after the server host is started.
  • receiving the target slot deployment location sent by the server host includes: receiving the target slot deployment location sent by a basic input/output system deployed on the server host to the server controller after completing the network card device enumeration phase.
  • receiving a target slot deployment position sent by a server host includes: detecting the startup progress of a basic input/output system deployed on the server host in starting the server host; sending a target request to the basic input/output system when the startup progress indicates that the basic input/output system has completed the network card device enumeration phase, wherein the target request is used to request to obtain the slot deployment position of a network card slot into which a network card device connected to the server host is inserted; and receiving the target slot deployment position sent by the basic input/output system deployed on the server host to the server controller in response to the target request.
  • a first heat dissipation device at a target device deployment position corresponding to a target slot deployment position is screened out from a heat dissipation device array, including: searching for a device deployment position corresponding to the target slot deployment position as the target device deployment position from slot deployment positions and device deployment positions having a corresponding relationship; and determining the heat dissipation device located at the target device deployment position in the heat dissipation device array as the first heat dissipation device.
  • a first heat dissipation device at a target device deployment position corresponding to a target slot deployment position is screened out from a heat dissipation device array, including: searching for the first device deployment position corresponding to the target slot deployment position from slot deployment positions and device deployment positions having a corresponding relationship; obtaining a second device deployment position whose distance from the first device deployment position falls within a target distance range; determining the first device deployment position and the second device deployment position as target device deployment positions; and determining the heat dissipation device located at the target device deployment position in the heat dissipation device array as the first heat dissipation device.
  • controlling the first heat dissipation device to operate according to the target operating parameters includes: determining the target operating parameters according to the distribution information of the first heat dissipation device, wherein the distribution information is used to indicate the distribution of the first heat dissipation device on the server host; controlling the first heat dissipation device to operate according to the target operating parameters. Run according to the target operating parameters.
  • a target operating parameter is determined based on distribution information of a first heat dissipation device, including: when the distribution information is used to indicate that the first heat dissipation device is a heat dissipation device whose device deployment position in a heat dissipation device array has a corresponding relationship with the target slot deployment position, obtaining the highest operating parameter of the first heat dissipation device; and determining the highest operating parameter as the target operating parameter.
  • target operating parameters are determined based on distribution information of a first heat dissipation device, including: in a case where the distribution information is used to indicate that the target slot deployment position of the first heat dissipation device includes a first device deployment position and a second device deployment position, operating parameters are allocated to the heat dissipation devices in the first heat dissipation device based on the highest operating parameter of the first heat dissipation device and the distance between the heat dissipation devices in the first heat dissipation device, wherein the first device deployment position is a device deployment position corresponding to the target slot deployment position found from slot deployment positions and device deployment positions with corresponding relationships, and the second device deployment position is a device deployment position whose distance from the first device deployment position falls within a target distance range; the heat dissipation device and operating parameters with corresponding relationships are determined as target operating parameters.
  • operating parameters are assigned to the heat dissipation devices in the first heat dissipation device based on the maximum operating parameter of the first heat dissipation device and the distance between the heat dissipation devices in the first heat dissipation device, including: determining a first operating parameter for the heat dissipation device at the first device deployment position based on the maximum operating parameter of the first heat dissipation device, wherein the first operating parameter is less than or equal to the maximum operating parameter; determining a second operating parameter for the heat dissipation device at the second device deployment position based on the first operating parameter and the distance between the second device deployment position and the first device deployment position, wherein the distance is inversely proportional to the second operating parameter.
  • operating parameters are assigned to heat dissipation devices in the first heat dissipation device based on the maximum operating parameter of the first heat dissipation device and the distance between the heat dissipation devices in the first heat dissipation device, including: assigning a first operating parameter to the heat dissipation device at the first device deployment position, and assigning a second operating parameter to the heat dissipation device at the second device deployment position, wherein the first operating parameter is less than or equal to the maximum operating parameter, and the second operating parameter is less than or equal to the first operating parameter.
  • the method before detecting the target slot deployment position of the target network card slot into which the target network card device connected to the server host is inserted, the method further includes: when detecting that the server host is powered on, detecting the current power-on information of the server host, wherein the current power-on information is used to indicate the power-on status of the server host being powered on this time; determining the presence information of the network card slots in the network card slot array based on the current power-on information, wherein the presence information is used to indicate the presence status of the network card device on the corresponding network card slot; screening out a second heat dissipation device from the heat dissipation device array based on the presence information, and controlling the second heat dissipation device to operate according to reference operating parameters, wherein the reference operating parameters are used to dissipate heat from the network card slot array to a reference operating state, and the reference operating state is the operating state of the network card slot array when the server host is allowed to start.
  • the presence information of a network card slot in a network card slot array is determined based on current power-on information, including: when the current power-on information is used to indicate that a server host is powered on for the first time, determining that the presence information is used to indicate that there is a network card slot connected to a network card device on the network card slot array; screening out a second heat dissipation device from the heat dissipation device array based on the presence information, and controlling the second heat dissipation device to operate according to reference operating parameters, including: determining all heat dissipation devices in the heat dissipation device array as second heat dissipation devices; assigning operating parameters to the second heat dissipation device according to the device deployment position of the heat dissipation device in the heat dissipation device array to obtain reference operating parameters; and controlling the second heat dissipation device to operate according to the reference operating parameters.
  • the presence information of a network card slot in a network card slot array is determined based on current power-on information, including: when the current power-on information is used to indicate that a server host has been started, determining the presence information of the network card slot in the network card slot array based on a target slot deployment position of a target network card slot into which a target network card device connected to the server host is inserted, as detected during a historical startup process of the server host; and screening out a second heat dissipation device from a heat dissipation device array based on the presence information, including: determining a heat dissipation device in the heat dissipation device array that corresponds to the slot deployment position of the network card slot of the network card device connected to the server host, as detected during a historical startup process of the server host, as the second heat dissipation device.
  • the control module is configured to control the first heat dissipation device to operate according to the target operating parameters, wherein the target operating parameters are used to set the target network card device
  • the target operating state is to allow the target network card device to continue to run after the server host is started.
  • a computer non-volatile readable storage medium in which a computer program is stored, wherein the computer program is configured to execute the steps of any of the above method embodiments when running.
  • an electronic device including a memory and a processor, wherein a computer program is stored in the memory, and the processor is configured to run the computer program to execute the steps in any of the above method embodiments.
  • a computer program product including a computer program, which implements the steps of any of the above method embodiments when executed by a processor.
  • the server controller since the server controller detects the target slot deployment position of the target network card slot into which the target network card device connected to the server host is inserted; and selects the first heat dissipation device at the target device deployment position corresponding to the target slot deployment position from the heat dissipation device array, the heat dissipation devices in the heat dissipation device array can also adjust the first heat dissipation device in real time to operate according to the target operating parameters when there is no physical I2C link to monitor the temperature of the network card device and thus adjust the heat dissipation strategy of the entire server. Therefore, the problem of low control efficiency of the server heat dissipation device can be solved, thereby achieving the effect of improving the control efficiency of the server heat dissipation device.
  • FIG1 is a hardware structure block diagram of a server device according to a method for controlling a server heat dissipation device according to an embodiment of the present application
  • FIG2 is a flow chart of a method for controlling a server heat dissipation device according to an embodiment of the present application
  • FIG3 is a schematic diagram of a server according to an embodiment of the present application.
  • FIG4 is a schematic diagram of a server motherboard according to an embodiment of the present application.
  • FIG7 is a swim-lane diagram of a control process of a server heat dissipation device according to an embodiment of the present application.
  • FIG8 is a structural block diagram of a control device for a server heat dissipation device according to an embodiment of the present application.
  • FIG1 is a hardware structure block diagram of a server device of a control method for a server heat dissipation device in an embodiment of the present application.
  • the server device may include one or more (only one is shown in FIG1 ) processors 102 (the processor 102 may include but is not limited to a processing device such as a microprocessor MCU (Microcontroller Unit) or a programmable logic device FPGA (Field Programmable Gate Array)) and a memory 104 configured to store data, wherein the above-mentioned server device may also include a transmission device 106 and an input and output device 108 for communication functions. It can be understood by those skilled in the art that the structure shown in FIG1 is only for illustration, and it does not limit the structure of the above-mentioned server device. For example, the server device may also include more or fewer components than those shown in FIG1 , or have a configuration different from that shown in FIG1 .
  • processors 102 may include but is not limited to a processing device such as a microprocessor MCU (Microcontroller Unit) or a programmable logic device FPGA (Field Programmable Gate Array)
  • a memory 104
  • the memory 104 can be configured to store computer programs, for example, software programs and modules of application software, such as the computer program corresponding to the control method of the server heat dissipation device in the embodiment of the present application.
  • the processor 102 executes various functional applications and data processing by running the computer program stored in the memory 104, that is, implementing the above method.
  • the memory 104 may include a high-speed random access memory, and may also include a non-volatile memory, such as one or more magnetic storage devices, flash memory, or other non-volatile solid-state memory.
  • the memory 104 may include a memory remotely located relative to the processor 102, and these remote memories may be connected to the server device via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.
  • the transmission device 106 is configured to receive or transmit data via a network.
  • Specific examples of the aforementioned network may include a wireless network provided by a communication provider of the server device.
  • the transmission device 106 includes a network interface controller (NIC), which can be connected to other network devices via a base station to communicate with the Internet.
  • the transmission device 106 can be a radio frequency (RF) module, which is configured to communicate with the Internet wirelessly.
  • NIC network interface controller
  • RF radio frequency
  • a method for controlling a server heat dissipation device includes a server host and a server controller.
  • a network card slot array and a heat dissipation device array are deployed on the server host.
  • the slot deployment positions of the network card slots in the network card slot array correspond to the device deployment positions of the heat dissipation devices in the heat dissipation device array.
  • the network card slots are configured to connect to network card devices, and the heat dissipation devices are configured to dissipate heat for the network card devices connected to the corresponding network card slots.
  • the method is applied to the server controller.
  • FIG2 is a flow chart of the method for controlling a server heat dissipation device according to an embodiment of the present application. As shown in FIG2 , the process includes the following steps:
  • Step S202 When it is detected that the server host is started, detecting the target slot deployment position of the target network card slot into which the target network card device connected to the server host is inserted;
  • Step S204 selecting a first heat dissipation device at a target device deployment position corresponding to a target slot deployment position from the heat dissipation device array;
  • the server controller detects the target slot deployment position of the target network card slot into which the target network card device connected to the server host is inserted; and selects the first heat dissipation device at the target device deployment position corresponding to the target slot deployment position from the heat dissipation device array
  • the heat dissipation devices in the heat dissipation device array can adjust the first heat dissipation device in real time to operate according to the target operating parameters even when there is no physical I2C link to monitor the temperature of the network card device and thus adjust the heat dissipation strategy of the entire server. Therefore, the problem of low control efficiency of the server heat dissipation device can be solved, thereby achieving the effect of improving the control efficiency of the server heat dissipation device.
  • the above-mentioned network card device may include but is not limited to basic function network cards, SNICs (Smart Network Interface Cards) and DPUs (Data Processing Units) smart network cards, as well as other devices with computing capabilities that can undertake data processing functions related to networking, security, and storage that are not suitable for CPUs (Central Processing Units), reduce CPU consumption, enable servers to run key applications and operating systems more efficiently, and optimize the overall efficiency of business data processing.
  • SNICs Smart Network Interface Cards
  • DPUs Data Processing Units
  • CPUs Central Processing Units
  • the server host further deploys a heat dissipation device array consisting of multiple heat dissipation devices.
  • Each heat dissipation device is a device that provides heat dissipation for a network interface card (NIC) device connected to a corresponding NIC slot, such as a fan, heat sink, heat pipe, or heat dissipation channel.
  • NIC network interface card
  • the heat dissipation devices may be arranged in various ways, including, but not limited to, parallel, vertical, or mixed arrangements.
  • connection status of the network card slot on the server host can be detected by, but is not limited to, a device with hardware detection and identification functions, such as: BIOS (Basic Input Output System), UEFI (Unified Extensible Firmware Interface), etc.
  • BIOS Basic Input Output System
  • UEFI Unified Extensible Firmware Interface
  • the server host when the server host is started, may be configured, but not limited to, to send the target slot deployment location of the target network card slot connected to the target network card device to the server controller.
  • the server host may, but not limited to, immediately send the target slot deployment location to the server controller when the server host is started.
  • the server host may also send the target slot deployment location to the server controller in response to a request from the server controller when the server host is already started.
  • the server host may trigger the operation of sending the target slot deployment location to the server controller in response to other set trigger conditions.
  • the basic input and output system deployed on the server host may be The system is not limited to being configured to detect a target network card slot connected to a target network card device through a network card device enumeration phase, and actively sending the target slot deployment position to the server controller when the network card device enumeration phase is completed.
  • the target slot deployment position sent by the server host can be received in the following manner, but is not limited to: detecting the startup progress of the basic input and output system deployed on the server host to start the server host; when the startup progress is used to indicate that the basic input and output system has completed the network card device enumeration phase, sending a target request to the basic input and output system, wherein the target request is used to request to obtain the slot deployment position of the network card slot into which the network card device connected to the server host is inserted; receiving the target slot deployment position sent by the basic input and output system deployed on the server host to the server controller in response to the target request.
  • the server host can, but is not limited to, perform a startup operation through the boot of a basic input/output system.
  • the server host can, but is not limited to, obtaining the slot deployment position of the network card slot into which the network card device on the server host is inserted through the network card device enumeration phase.
  • the server controller sends a target request to the basic input/output system to request to obtain the slot deployment position of the network card slot into which the network card device connected to the server host is inserted, and receives the target slot deployment position sent by the basic input/output system deployed on the server host in response to the target request.
  • the basic input/output system and the server controller may interact through, but not limited to, IPMI commands or other transmission protocols supported by the server controller.
  • the operation of the heat dissipation device can be controlled in the following manner, but is not limited to: when it is detected that the server host is powered on, the current power-on information of the server host is detected, wherein the current power-on information is used to indicate the power-on status of the server host being powered on this time; the presence information of the network card slots in the network card slot array is determined based on the current power-on information, wherein the presence information is used to indicate the presence status of the network card device on the corresponding network card slot; a second heat dissipation device is selected from the heat dissipation device array based on the presence information, and the second heat dissipation device is controlled to operate according to reference operating parameters, wherein the reference operating parameters are used to dissipate the heat of the network card slot array to a reference operating state, and the reference operating state is the operating state of the network card
  • the server host may be powered on but not started, so that the server host is in a powered-on but not started state, and whether the server host is powered on for the first time, that is, whether the server host has been started before, is detected as the current power-on information of the server host.
  • the current power-on information of the server host may include, but is not limited to: whether the server is powered on for the first time, that is, the server host has not been started before; or whether the server is not powered on for the first time, that is, the server host has been started before.
  • the presence information of the network card slots in the network card slot array is determined based on the target slot deployment position of the target network card slot into which the target network card device connected to the server host is inserted, which was detected during the historical server host startup process.
  • the heat dissipation device corresponding to the network card device in place on the network card slot can be determined as the second heat dissipation device, for example: when the current power-on information of the server host indicates that the server host has been started, the heat dissipation device in the heat dissipation device array corresponding to the target slot deployment position of the target network card slot into which the target network card device connected to the server host is inserted, which is detected during the historical server host startup process, is determined as the second heat dissipation device.
  • the network card devices in place are set to include all but the first and last network card devices, and the second heat dissipation device includes the heat dissipation device corresponding to the network card devices in place.
  • the current power-on information of the server host indicates that the server host has not been started, due to the presence information of the network card slots in the unknown network card slot array, but to protect the server host from overheating due to the network card devices during the current startup process, all network card devices are set to be in place, and the second heat dissipation device includes all heat dissipation devices, etc.
  • the default in-place network card device can be set adaptively according to, but not limited to, the network card slot array deployed on the server host, so that during the current server host startup process, no matter which network card device is deployed in which network card slot, the normal startup of the server host can be guaranteed, that is, there will be no overheating problem.
  • the reference operating parameters are used to dissipate heat from the network card slot array to a state that allows the server host to start up.
  • the reference operating parameters of the second heat dissipation device can be determined based on, but not limited to, the temperature conditions for the normal startup of the server host and the heat generated during the startup of the server host.
  • the reference operating parameters of the second heat dissipation device can be calculated in a variety of ways, including but not limited to, based on the temperature conditions for the normal startup of the server host and the heat generated during the startup of the server host.
  • a deep learning model can be trained so that the model can calculate the reference operating parameters of the second heat dissipation device, or the reference operating parameters of the second heat dissipation device can be calculated through an algorithm.
  • the operating parameters of the heat dissipation device can be determined based on, but not limited to, parameters such as the rotational speed and air volume of the heat dissipation device.
  • the following method can be used but is not limited to determine the presence information of a network card slot in a network card slot array based on the current power-on information: when the current power-on information is used to indicate that the server host is powered on for the first time, determine that the presence information is used to indicate that there is a network card slot connected to a network card device on the network card slot array; the following method can be used but is not limited to screen out a second heat dissipation device from the heat dissipation device array based on the presence information, and control the second heat dissipation device to operate according to reference operating parameters: determine all heat dissipation devices in the heat dissipation device array as second heat dissipation devices; assign operating parameters to the second heat dissipation device according to the device deployment position of the heat dissipation device in the heat dissipation device array to obtain reference operating parameters; and control the second heat dissipation device to operate according to the reference operating parameters.
  • the current power-on information indicates that the server host is powered on for the first time
  • all heat dissipation devices in the heat dissipation device array are determined as second heat dissipation devices.
  • Operating parameters are assigned to the second heat dissipation device according to the device deployment position of the heat dissipation device in the heat dissipation device array, reference operating parameters are obtained, and the second heat dissipation device is controlled to operate according to the reference operating parameters.
  • heat dissipation device array includes heat dissipation device 1, heat dissipation device 2, heat dissipation device 3, heat dissipation device 4, and heat dissipation device 5 as an example
  • all heat dissipation devices in the heat dissipation device array are determined as second heat dissipation devices, and operating parameters can be assigned to the second heat dissipation devices according to the device deployment positions of the heat dissipation devices in the following manner, but not limited to, to obtain reference operating parameters:
  • heat dissipation device 2 and heat dissipation device 4 can realize heat dissipation for corresponding network card device 1, network card device 2, network card device 3, network card device 4 and network card device 5, it is possible but not limited to assigning a higher operating parameter of 80% to heat dissipation device 2 and heat dissipation device 4, and assigning a lower operating parameter of 30% to heat dissipation device 1, heat dissipation device 3 and heat dissipation device 5;
  • heat dissipation device 2 heat dissipation device 3, and heat dissipation device 4 can also provide heat dissipation for network card device 1, network card device 2, network card device 3, network card device 4, and network card device 5, it is possible, but not limited to, to allocate 75% of the operating parameters to heat dissipation device 2, heat dissipation device 3, and heat dissipation device 4, and allocate 30% of the operating parameters to heat dissipation device 1 and heat dissipation device 5;
  • 30% of the operating parameters are allocated to heat dissipation device 1, heat dissipation device 2, heat dissipation device 3, heat dissipation device 4, and heat dissipation device 5, and so on.
  • the operating parameters of the second heat dissipation device can be adaptively adjusted according to, but not limited to, the network card slot arrays and heat dissipation device arrays deployed on the server hosts, so that the heat dissipation device operates according to the operating parameters to ensure the normal startup of the server host.
  • the presence information of the network card slot in the network card slot array can be determined based on the current power-on information, but is not limited to the following method: when the current power-on information is used to indicate that the server host is not powered on for the first time, the presence information is determined to indicate that the network card device connected when the server host was last shut down is in place; the second heat dissipation device can be filtered out from the heat dissipation device array based on the presence information, but is not limited to the following method: obtain the candidate slot deployment position of the network card slot where the network card device connected when the server host was last shut down is located; search for the candidate device deployment position corresponding to the candidate slot deployment position from the slot deployment positions and device deployment positions with a corresponding relationship; and determine the heat dissipation device at the candidate device deployment position as the second heat dissipation device.
  • the current power-on information indicates that the server host is not powered on for the first time
  • the corresponding reference operating parameters can be assigned to the second heat dissipation device, and the second heat dissipation device can be controlled to operate according to the reference operating parameters.
  • the second heat dissipation device can include, but is not limited to, one or more heat dissipation devices, and the reference operating parameters of the second heat dissipation device can be adaptively adjusted to ensure that the heat dissipation device operates according to the operating parameters to ensure the normal startup of the server host.
  • FIG3 is a schematic diagram of a server machine according to an embodiment of the present application.
  • the server machine includes a server motherboard and a heat dissipation device array.
  • the server controller is a BMC deployed on the server motherboard.
  • the heat dissipation device array includes fan 1, fan 2, fan 3, and fan 4.
  • the network card slot array includes slot 1, slot 2, slot 3, and slot 4.
  • CPU1 and CPU2 are also deployed on the server motherboard.
  • CPU1 and CPU2 communicate via UPI (Ultra Path Interconnect, Ultra Path Interconnect Protocol).
  • the slots in the network card slot array can, but are not limited to, communicate with the CPU via PCI (Peripheral Component Interconnect, defining a local bus standard).
  • the fans in the heat dissipation device array communicate with the BMC and the CPU via I2C.
  • the BMC can, but is not limited to, work in the following manner:
  • the BMC obtains whether the server host is powered on for the first time.
  • the BMC can, but is not limited to, screen out the second heat dissipation devices including fan 1, fan 2, fan 3, and fan 4, and assign reference operating parameters to them, including assigning a speed of fan 3 and fan 4 to 73% and a speed of fan 1 and fan 2 to 30%.
  • the server host When the server host is not powered on for the first time, obtain the candidate slot deployment position of the network card slot where the network card device connected when it was last shut down is located.
  • the candidate slot deployment position as slot 2 as an example, it can be but not limited to finding the second cooling device corresponding to slot 2 as fan 2, and assigning operating parameters to fan 2 including a speed of 30%.
  • the candidate slot deployment position of the network card slot where the network card device connected at the last shutdown is located can be, but is not limited to, detected by BIOS during the network card device enumeration phase and transmitted to the BMC through SPI (Serial Peripheral Interface) or LPC (Low Pin Count).
  • SPI Serial Peripheral Interface
  • LPC Low Pin Count
  • FIG4 is a schematic diagram of a server motherboard according to an embodiment of the present application. As shown in FIG4 , taking a network card device as a DPU as an example, in a server, the DPU is connected to a PCI slot and powered via a gold finger. The PCI slot interacts with the CPU via a PCI bus.
  • step S204 it is possible but not limited to screening out the first heat dissipation device at the target device deployment position corresponding to the target slot deployment position from the heat dissipation device array based on the correspondence between the slot deployment position of the network card slot in the network card slot array and the device deployment position of the heat dissipation device in the heat dissipation device array.
  • the correspondence between the slot deployment positions of the network card slots in the network card slot array and the device deployment positions of the heat dissipation devices in the heat dissipation device array may be, but is not limited to, a one-to-one correspondence, or may be a many-to-many correspondence, so the first heat dissipation device may be, but is not limited to, the same number of heat dissipation devices as the target slot deployment positions, or may be a different number of heat dissipation devices.
  • the first heat dissipation device at the target device deployment position corresponding to the target slot deployment position can be filtered out from the heat dissipation device array in the following manner, but is not limited to: searching for the device deployment position corresponding to the target slot deployment position from the slot deployment positions and device deployment positions with a corresponding relationship as the target device deployment position; and determining the heat dissipation device located at the target device deployment position in the heat dissipation device array as the first heat dissipation device.
  • the first heat dissipation device at the target device deployment position corresponding to the target slot deployment position can be filtered out from the heat dissipation device array in the following manner, but is not limited to: searching for the first device deployment position corresponding to the target slot deployment position from the slot deployment positions and device deployment positions having a corresponding relationship; obtaining a second device deployment position whose distance from the first device deployment position falls within a target distance range; determining the first device deployment position and the second device deployment position as the target device deployment position; and determining the heat dissipation device located at the target device deployment position in the heat dissipation device array as the first heat dissipation device.
  • the target distance range may be determined based on, but not limited to, the network card slot array. For example, if the network card slot array is arranged in parallel, a certain horizontal distance may be determined as the target distance range; if the network card slot array is arranged in vertical arrangement, a certain vertical distance may be determined as the target distance range; if the network card slot array is a mixed arrangement of parallel and vertical arrangements, a distance within a certain radius may be determined as the target distance range.
  • the certain distance may be determined based on, but not limited to, the number of network card slots in the network card slot array, such as 1/2 or 1/4 of the number of network card slots.
  • the target device deployment position includes a first device deployment position corresponding to the target slot deployment position and a second device deployment position whose distance from the first device deployment position falls within a target distance range.
  • the heat dissipation device located at the target device deployment position in the heat dissipation device array can be determined as the first heat dissipation device, but is not limited to being determined.
  • the target network card device can be enabled to continue to operate after the server host is started by controlling the first heat dissipation device to operate according to the target operating parameters, but is not limited to.
  • the operating parameters of the heat dissipation device can be determined based on, but not limited to, parameters such as the rotational speed and air volume of the heat dissipation device.
  • the first heat dissipation device can be controlled to operate according to target operating parameters in the following manner, but is not limited to: determining the target operating parameters based on distribution information of the first heat dissipation device, wherein the distribution information is used to indicate the distribution of the first heat dissipation device on the server host; and controlling the first heat dissipation device to operate according to the target operating parameters.
  • the first heat dissipation device may be, but is not limited to, one or more heat dissipation devices on a server host, and the target operating parameters of the first heat dissipation device may be determined based on, but is not limited to, the distribution of the first heat dissipation device in the heat dissipation device array. For example, if the first heat dissipation device is a heat dissipation device corresponding to the slot deployment position of the network card slot of the network card device in place, a higher operating parameter may be assigned to the first heat dissipation device.
  • the operating parameter may be assigned to the first heat dissipation device based on the distance between the first heat dissipation device and the heat dissipation device corresponding to the slot deployment position of the network card slot of the network card device in place, with the distance being inversely proportional to the operating parameter.
  • the target operating parameter can be determined based on the distribution information of the first heat dissipation device in the following manner, but is not limited to: when the distribution information is used to indicate that the first heat dissipation device is a heat dissipation device whose device deployment position in the heat dissipation device array corresponds to the target slot deployment position, the highest operating parameter of the first heat dissipation device is obtained; and the highest operating parameter is determined as the target operating parameter.
  • the first heat dissipation device when the first heat dissipation device is a heat dissipation device whose device deployment position in the heat dissipation device array corresponds to the target slot deployment position, the first heat dissipation device can be set to operate according to the highest operating parameters but is not limited to being set.
  • operating parameters may be assigned to the heat dissipation devices in the first heat dissipation device based on, but not limited to, the highest operating parameter of the first heat dissipation device and the distance between the heat dissipation devices in the first heat dissipation device.
  • a first operating parameter is assigned to the heat dissipation device at the first device deployment position
  • a second operating parameter is assigned to the heat dissipation device at the second device deployment position, where the second operating parameter is less than or equal to the first operating parameter.
  • the second operating parameter may be assigned based on, but not limited to, the distance between the second device deployment position and the first device deployment position, with the second operating parameter decreasing in descending order as the distance increases.
  • operating parameters can be assigned to the heat dissipation devices in the first heat dissipation device according to the maximum operating parameter of the first heat dissipation device and the distance between the heat dissipation devices in the first heat dissipation device in the following manner, but is not limited to: determining a first operating parameter for the heat dissipation device at the first device deployment position according to the maximum operating parameter of the first heat dissipation device, wherein the first operating parameter is less than or equal to the maximum operating parameter; determining a second operating parameter for the heat dissipation device at the second device deployment position according to the first operating parameter and the distance between the second device deployment position and the first device deployment position, wherein the distance is inversely proportional to the second operating parameter.
  • the maximum operating parameter of the first heat dissipation device may be determined as, but is not limited to, the first operating parameter of the heat dissipation device at the first device deployment location.
  • a value less than the maximum operating parameter of the first heat dissipation device may be obtained as the first operating parameter of the heat dissipation device at the first device deployment location.
  • the second operating parameter allocated to the heat dissipation device at the second device deployment location can be, but is not limited to, based on the first operating parameter and the distance between the second device deployment location and the first device deployment location. For example, the longer the distance, the lower the second operating parameter allocated to the heat dissipation device at the second device deployment location.
  • FIG5 is a schematic diagram of a fan speed according to an embodiment of the present application.
  • the server controller can adjust the fan speed to adjust the operating parameter of the heat dissipation device in the following manner, but is not limited to:
  • the fan at the device deployment position corresponding to the slot deployment position of the network card slot connected to the network card device is kept running at 100% speed, so that the fan maintains high power to cool the smart network card.
  • the fan at the device deployment position corresponding to the slot deployment position of the network card slot connected to the network card device maintains a rotational speed of 73%
  • the fan at the device deployment position corresponding to the slot deployment position of the network card slot not connected to the network card device maintains a rotational speed of 30%.
  • FIG6 is a flow chart of the operation process of a server controller according to an embodiment of the present application.
  • the server controller can operate in, but is not limited to, the following manner:
  • the DPU When the server is powered on for the first time, the DPU is in place by default. Set the speeds of Fans 2 and 3 to 73%, and Fans 0 and 1 to 30%. Start the server. When the server is started, obtain the DPU location information through the IPMI protocol and control the speed of the fan directly in front of the DPU to 100%.
  • the speed of the fan directly in front of the DPU position information of the DPU that was in place before the last shutdown is controlled to be 30%.
  • FIG7 is a swim-lane diagram of a control process for a server cooling device according to an embodiment of the present application.
  • the server cooling device can be controlled to perform cooling operations for the server in the following manner, but is not limited to:
  • the BMC cannot determine whether the DPU card is in place, and the auxiliary firmware CPLD (Complex Programmable Logic Device) cannot detect whether the DPU card is in place. As a result, the BMC cannot accurately detect the DPU card location information. Therefore, the BMC assumes that the DPU card is in place (condition 1).
  • condition 2 If the server is powered on and has been booted in the past, obtain the DPU location information obtained during the PCI enumeration portion of the last boot (condition 2).
  • the BMC controls the operation of all cooling devices.
  • the speed of fans 2 and 3 is set to 73% of the maximum speed
  • the speed of fans 0 and 1 is set to 30% of the maximum speed.
  • the BMC controls the operation of the cooling device corresponding to the obtained DPU location information, for example, setting the fan speed corresponding to the DPU location information to 30% of the maximum speed.
  • the BIOS will confirm the location of the DPU card by identifying the PCI devices during the PCI enumeration process at the startup stage;
  • the BIOS transmits the identified DPU card location information to the BMC through the IPMI protocol or other protocols that interact with the BMC.
  • the BMC confirms the location of the DPU card based on the location information transmitted by the BIOS and sets the speed of the fan directly in front of the DPU card to the maximum speed to reduce the power consumption and temperature of the entire server.
  • this application determines whether the server where the network card device is located has been powered on after power-on.
  • the server controller assumes that the network card device exists and adaptively controls the cooling device to work; when the server is powered on, the PCI enumeration part started by the basic input and output system enumerates the PCI slot information where the network card device is located and transmits the location information of the network card device to the server controller through the communication protocol with the server controller.
  • the server controller controls the cooling device corresponding to the network card device to operate according to the location information of the network card device to reduce the overall temperature of the server, and when the server is shut down, the server controller reduces the power of the cooling device corresponding to the network card device because it already knows the location information of the network card device; or, when the server has been started once and is in the shutdown state, the cooling device corresponding to the network card device can be turned on because the location information of the historically deployed network card device is known.
  • the control method for server heat dissipation equipment proposed in the present application realizes interaction between the basic input/output system (BIOS) and the server controller firmware through a communication protocol by combining the server hardware design. That is, the location information of the network card device identified by the BIOS is transmitted to the server controller, and the server controller controls the corresponding heat dissipation device to operate according to the location information of the network card device transmitted by the BIOS.
  • a method is provided for determining and adjusting the working mode of the corresponding heat dissipation device for servers running at different stages by judging whether the server is powered on for the first time.
  • the server controller can still adaptively adjust the working condition of the heat dissipation device to reduce the overall temperature and power consumption of the server, thereby ensuring the normal RAS (Reliability, Availability, and Serviceability) function of the server.
  • RAS Reliability, Availability, and Serviceability
  • server cooling device control method proposed in this application can meet the actual business needs of data centers and supports servers of any architecture, with strong versatility and high applicability. This further improves the safety of server operation and ensures that servers and network card devices will not malfunction due to overheating under various circumstances.
  • a server includes a server host and a server controller.
  • a network card slot array and a heat dissipation device array are deployed on the server host.
  • the slot deployment position of the network card slot in the network card slot array corresponds to the device deployment position of the heat dissipation device in the heat dissipation device array.
  • the network card slot is configured to connect the network card device, and the heat dissipation device is configured to dissipate heat for the network card device connected to the corresponding network card slot.
  • the server controller When it is detected that the server host is started, the server controller detects the target slot deployment position of the target network card slot into which the target network card device connected to the server host is inserted; selects a first heat dissipation device at the target device deployment position corresponding to the target slot deployment position from the heat dissipation device array; and controls the first heat dissipation device to operate according to target operating parameters, wherein the target operating parameters are used to dissipate the heat of the target network card device to a target operating state, and the target operating state is a state that allows the target network card device to continue to operate after the server host is started.
  • the server controller detects the target slot deployment position of the target network card slot into which the target network card device connected to the server host is inserted, and selects the first heat dissipation device at the target device deployment position corresponding to the target slot deployment position from the heat dissipation device array, the heat dissipation devices in the heat dissipation device array can adjust the first heat dissipation device to operate according to the target operating parameters in real time even when there is no physical I2C link to monitor the temperature of the network card device and thus adjust the heat dissipation strategy of the entire server. Therefore, the problem of low control efficiency of the server heat dissipation device can be solved, thereby achieving the effect of improving the control efficiency of the server heat dissipation device.
  • the method according to the above embodiment can be implemented by means of software plus the necessary general hardware platform, and of course it can also be implemented by hardware, but in many cases the former is a better implementation method.
  • the technical solution of the present application is essentially or the part that contributes to the prior art can be embodied in the form of a software product, which is stored in a non-volatile readable storage medium (such as ROM/RAM, magnetic disk, optical disk), including a number of instructions for enabling a terminal device (which can be a mobile phone, computer, server, or network device, etc.) to execute the methods of each embodiment of the present application.
  • a non-volatile readable storage medium such as ROM/RAM, magnetic disk, optical disk
  • a control device for a server heat dissipation device is also provided.
  • the server includes a server host and a server controller.
  • a network card slot array and a heat dissipation device array are deployed on the server host.
  • the slot deployment position of the network card slot in the network card slot array corresponds to the device deployment position of the heat dissipation device in the heat dissipation device array.
  • the network card slot is configured to connect a network card device, and the heat dissipation device is configured to dissipate heat for the network card device connected to the corresponding network card slot.
  • the device is applied to the server controller.
  • the device is used to implement the above-mentioned embodiments and optional implementation methods. Those that have been explained will not be repeated here.
  • module can implement a combination of software and/or hardware that implements a predetermined function.
  • device described in the following embodiments is preferably implemented in software, implementation in hardware, or a combination of software and hardware, is also possible and conceived.
  • FIG8 is a structural block diagram of a control device for a server heat dissipation device according to an embodiment of the present application. As shown in FIG8 , the device includes:
  • the first detection module 82 is configured to detect the target network card device connected to the server host when the server host is detected to be started.
  • a first screening module 84 is configured to screen out a first heat dissipation device at a target device deployment position corresponding to a target slot deployment position from the heat dissipation device array;
  • the control module 86 is configured to control the first heat dissipation device to operate according to target operating parameters, wherein the target operating parameters are used to dissipate heat from the target network card device to a target operating state, which is a state that allows the target network card device to continue operating after the server host is started.
  • the server controller detects the target slot deployment position of the target network card slot into which the target network card device connected to the server host is inserted; and selects the first heat dissipation device at the target device deployment position corresponding to the target slot deployment position from the heat dissipation device array
  • the heat dissipation devices in the heat dissipation device array can also adjust the first heat dissipation device in real time to operate according to the target operating parameters when there is no physical I2C link to monitor the temperature of the network card device and thus adjust the heat dissipation strategy of the entire server. Therefore, the problem of low control efficiency of the server heat dissipation device can be solved, thereby achieving the effect of improving the control efficiency of the server heat dissipation device.
  • the first detection module includes:
  • the receiving unit is configured to receive the target slot deployment position sent by the server host, wherein the target slot deployment position is detected by the server host during the network card device enumeration phase during the startup process.
  • the receiving unit is further configured to receive the target slot deployment location sent by the basic input and output system deployed on the server host to the server controller after completing the network card device enumeration phase.
  • the receiving unit is further configured to: detect the startup progress of the basic input/output system deployed on the server host to start the server host; when the startup progress is used to indicate that the basic input/output system has completed the network card device enumeration phase, send a target request to the basic input/output system, wherein the target request is used to request to obtain the slot deployment position of the network card slot into which the network card device connected to the server host is inserted; receive the target slot deployment position sent by the basic input/output system deployed on the server host to the server controller in response to the target request.
  • the first screening module includes:
  • the first searching unit is configured to search for a device deployment position corresponding to a target slot deployment position from slot deployment positions and device deployment positions having a corresponding relationship as a target device deployment position;
  • the first determining unit is configured to determine a heat dissipation device located at a target device deployment position in the heat dissipation device array as a first heat dissipation device.
  • the first screening module includes:
  • a second searching unit is configured to search for a first device deployment position corresponding to the target slot deployment position from the slot deployment positions and device deployment positions having a corresponding relationship;
  • An acquiring unit configured to acquire a second device deployment position whose distance from the first device deployment position falls within a target distance range
  • a second determining unit configured to determine the first device deployment location and the second device deployment location as target device deployment locations
  • the third determining unit is configured to determine a heat dissipation device located at the target device deployment position in the heat dissipation device array as a first heat dissipation device.
  • a control module includes:
  • the control unit is configured to control the first heat dissipation device to operate according to target operating parameters.
  • the fourth determination unit is further configured to: obtain the highest operating parameter of the first heat dissipation device when the distribution information is used to indicate that the first heat dissipation device is a heat dissipation device whose device deployment position in the heat dissipation device array has a corresponding relationship with the target slot deployment position; and determine the highest operating parameter as the target operating parameter.
  • the fourth determination unit is further configured to: in a case where the distribution information is used to indicate that the target slot deployment position of the first heat dissipation device includes a first device deployment position and a second device deployment position, allocate operating parameters to the heat dissipation devices in the first heat dissipation device according to the highest operating parameter of the first heat dissipation device and the distance between the heat dissipation devices in the first heat dissipation device, wherein the first device deployment position is the device deployment position corresponding to the target slot deployment position found from the slot deployment positions and device deployment positions with a corresponding relationship, and the second device deployment position is the device deployment position whose distance from the first device deployment position falls within the target distance range; the heat dissipation device and operating parameter with a corresponding relationship are determined as the target operating parameters.
  • the fourth determination unit is further configured to: determine a first operating parameter for the heat dissipation device at the first device deployment position based on the maximum operating parameter of the first heat dissipation device, wherein the first operating parameter is less than or equal to the maximum operating parameter; determine a second operating parameter for the heat dissipation device at the second device deployment position based on the first operating parameter and the distance between the second device deployment position and the first device deployment position, wherein the distance is inversely proportional to the second operating parameter.
  • the apparatus further comprises:
  • the second detection module is configured to detect current power-on information of the server host when detecting that the server host is powered on, wherein the current power-on information is used to indicate the power-on status of the server host being powered on this time;
  • a determination module configured to determine presence information of a network card slot in the network card slot array according to current power-on information, wherein the presence information is used to indicate a presence status of a network card device in the corresponding network card slot;
  • the second screening module is configured to screen out the second heat dissipation device from the heat dissipation device array according to the in-position information, and control the second heat dissipation device to operate according to the reference operating parameters, wherein the reference operating parameters are used to dissipate heat to the network card slot array to a reference operating state, and the reference operating state is to allow service The operating status of the network card slot array when the server host is started.
  • the determination module includes: a fifth determination unit, configured to, when the current power-on information is used to indicate that the server host is powered on for the first time, determine that the in-position information is used to indicate that there is a network card slot connected to a network card device on the network card slot array; the second screening module is further configured to: determine all heat dissipation devices in the heat dissipation device array as second heat dissipation devices; assign operating parameters to the second heat dissipation device according to the device deployment position of the heat dissipation device in the heat dissipation device array to obtain reference operating parameters; and control the second heat dissipation device to operate according to the reference operating parameters.
  • the determination module includes: a sixth determination unit, configured to, when the current power-on information is used to indicate that the server host is not powered on for the first time, determine that the in-place information is used to indicate that the network card device connected when the server host was last shut down is in place; the second screening module is also configured to: obtain a candidate slot deployment position of the network card slot where the network card device connected when the server host was last shut down is located; search for a candidate device deployment position corresponding to the candidate slot deployment position from the slot deployment positions and device deployment positions with a corresponding relationship; and determine the heat dissipation device at the candidate device deployment position as the second heat dissipation device.
  • the above modules can be implemented through software or hardware. For the latter, it can be implemented in the following ways, but not limited to: the above modules are all located in the same processor; or the above modules are located in different processors in any combination.
  • An embodiment of the present application further provides a computer non-volatile readable storage medium, in which a computer program is stored, wherein the computer program is configured to execute the steps of any of the above method embodiments when running.
  • the above-mentioned computer non-volatile readable storage medium may include but is not limited to: USB flash drive, read-only memory (ROM), random access memory (RAM), mobile hard disk, magnetic disk or optical disk, and other non-volatile readable storage media that can store computer programs.
  • FIG. 9 is a structural block diagram of an electronic device according to an embodiment of the present application.
  • the above-mentioned electronic device includes a memory and a processor.
  • the memory stores a computer program
  • the processor is configured to run the computer program to execute the steps in any of the above-mentioned method embodiments.
  • the electronic device may further include a transmission device and an input/output device, wherein the transmission device is connected to the processor, and the input/output device is connected to the processor.
  • An embodiment of the present application further provides a computer program product, which includes a computer program.
  • a computer program product which includes a computer program.
  • modules or steps of the present application described above can be implemented using a general-purpose computing device, they can be concentrated on a single computing device, or distributed across a network composed of multiple computing devices, they can be implemented using program code executable by the computing device, and thus, they can be stored in a storage device and executed by the computing device, and in some cases, the steps shown or described can be performed in a different order than herein, or they can be fabricated into separate integrated circuit modules, or multiple modules or steps can be fabricated into a single integrated circuit module for implementation.
  • the present application is not limited to any specific combination of hardware and software.

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Abstract

本申请实施例提供了一种服务器散热设备的控制方法、装置、非易失性可读存储介质和电子设备，其中，该方法包括：在检测到服务器主机启动的情况下，检测连接到服务器主机上的目标网卡设备所插入的目标网卡插槽的目标插槽部署位置；从散热设备阵列中筛选出目标插槽部署位置所对应的目标设备部署位置上的第一散热设备；控制第一散热设备按照目标运行参数运行，其中，目标运行参数用于将目标网卡设备散热到目标运行状态，目标运行状态是允许目标网卡设备在服务器主机启动后继续运行的状态。通过本申请，解决了服务器散热设备的控制效率较低的问题，进而达到了提高服务器散热设备的控制效率的效果。

Description

服务器散热设备的控制方法、装置、存储介质和电子设备
相关申请的交叉引用
本申请要求于2024年02月28日提交中国专利局，申请号为202410223197.9，申请名称为“服务器散热设备的控制方法、装置、存储介质和电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请实施例涉及计算机领域，具体而言，涉及一种服务器散热设备的控制方法、装置、非易失性可读存储介质和电子设备。
背景技术
目前，网卡设备被广泛应用于数据中心的各种架构服务器中，由于网卡设备的功耗较大，若无及时调整服务器整机的散热，将出现服务器整机系统高温导致服务器内部的部件或者其他核心组件因为过温问题出现宕机或者关机，一旦出现宕机或者关机将对业务造成致命的危害。
传统的散热策略均是通过物理I2C(Inter-Integrated Circuit，集成电路总线)链路监控网卡设备的温度从而调整服务器整机的散热策略，但是，在I2C链路出现故障或者服务器整机未部署I2C链路的情况下，将无法实时动态的调整服务器整机的散热策略，使得服务器整机系统出现过温问题。
针对相关技术中，服务器散热设备的控制效率较低等问题，尚未提出有效的解决方案。
发明内容
本申请实施例提供了一种服务器散热设备的控制方法、装置、非易失性可读存储介质和电子设备，以至少解决相关技术中服务器散热设备的控制效率较低的问题。
根据本申请的实施例，提供了一种服务器散热设备的控制方法，服务器包括服务器主机和服务器控制器，服务器主机上部署了网卡插槽阵列和散热设备阵列，网卡插槽阵列中的网卡插槽的插槽部署位置与散热设备阵列中的散热设备的设备部署位置具有对应关系，网卡插槽被配置为连接网卡设备，散热设备被配置为为对应的网卡插槽上连接的网卡设备散热，方法应用于服务器控制器，方法包括：
在检测到服务器主机启动的情况下，检测连接到服务器主机上的目标网卡设备所插入的目标网卡插槽的目标插槽部署位置；
从散热设备阵列中筛选出目标插槽部署位置所对应的目标设备部署位置上的第一散热设备；
控制第一散热设备按照目标运行参数运行，其中，目标运行参数用于将目标网卡设备散热到目标运行状态，目标运行状态是允许目标网卡设备在服务器主机启动后继续运行的状态。
在一个示例性实施例中，检测连接到服务器主机上的目标网卡设备所插入的目标网卡插槽的目标插槽部署位置，包括：接收服务器主机发送的目标插槽部署位置，其中，目标插槽部署位置是服务器主机在启动过程中的网卡设备枚举阶段检测到的。
在一个示例性实施例中，接收服务器主机发送的目标插槽部署位置，包括：接收服务器主机上部署的基本输入输出系统在完成网卡设备枚举阶段的运行后向服务器控制器发送的目标插槽部署位置。
在一个示例性实施例中，接收服务器主机发送的目标插槽部署位置，包括：检测服务器主机上部署的基本输入输出系统对服务器主机进行启动的启动进度；在启动进度用于指示基本输入输出系统已完成网卡设备枚举阶段的运行的情况下，向基本输入输出系统发送目标请求，其中，目标请求用于请求获取已连接到服务器主机上的网卡设备所插入的网卡插槽的插槽部署位置；接收服务器主机上部署的基本输入输出系统响应目标请求向服务器控制器发送的目标插槽部署位置。
在一个示例性实施例中，从散热设备阵列中筛选出目标插槽部署位置所对应的目标设备部署位置上的第一散热设备，包括：从具有对应关系的插槽部署位置和设备部署位置中查找目标插槽部署位置所对应的设备部署位置作为目标设备部署位置；将散热设备阵列中位于目标设备部署位置上的散热设备确定为第一散热设备。
在一个示例性实施例中，从散热设备阵列中筛选出目标插槽部署位置所对应的目标设备部署位置上的第一散热设备，包括：从具有对应关系的插槽部署位置和设备部署位置中查找目标插槽部署位置所对应的第一设备部署位置；获取与第一设备部署位置之间的距离落入目标距离范围内的第二设备部署位置；将第一设备部署位置和第二设备部署位置确定为目标设备部署位置；将散热设备阵列中位于目标设备部署位置上的散热设备确定为第一散热设备。
在一个示例性实施例中，控制第一散热设备按照目标运行参数运行，包括：根据第一散热设备的分布信息确定目标运行参数，其中，分布信息用于指示第一散热设备在服务器主机上的分布情况；控制第一散热设备按 照目标运行参数运行。
在一个示例性实施例中，根据第一散热设备的分布信息确定目标运行参数，包括：在分布信息用于指示第一散热设备是散热设备阵列中设备部署位置与目标插槽部署位置具有对应关系的散热设备的情况下，获取第一散热设备的最高运行参数；将最高运行参数确定为目标运行参数。
在一个示例性实施例中，根据第一散热设备的分布信息确定目标运行参数，包括：在分布信息用于指示第一散热设备的目标插槽部署位置包括第一设备部署位置和第二设备部署位置的情况下，根据第一散热设备的最高运行参数和第一散热设备中的散热设备之间的距离为第一散热设备中的散热设备分配运行参数，其中，第一设备部署位置是从具有对应关系的插槽部署位置和设备部署位置中查找到的目标插槽部署位置所对应的设备部署位置，第二设备部署位置是与第一设备部署位置之间的距离落入目标距离范围内的设备部署位置；将具有对应关系的散热设备和运行参数确定为目标运行参数。
在一个示例性实施例中，根据第一散热设备的最高运行参数和第一散热设备中的散热设备之间的距离为第一散热设备中的散热设备分配运行参数，包括：根据第一散热设备的最高运行参数为第一设备部署位置上的散热设备确定第一运行参数，其中，第一运行参数小于或者等于最高运行参数；根据第一运行参数和第二设备部署位置与第一设备部署位置之间的距离为第二设备部署位置上的散热设备确定第二运行参数，其中，距离与第二运行参数成反比。
在一个示例性实施例中，根据第一散热设备的最高运行参数和第一散热设备中的散热设备之间的距离为第一散热设备中的散热设备分配运行参数，包括：为第一设备部署位置的散热设备分配第一运行参数，并为第二设备部署位置的散热设备分配第二运行参数，其中，第一运行参数小于或者等于最高运行参数，第二运行参数小于或者等于第一运行参数。
在一个示例性实施例中，在检测连接到服务器主机上的目标网卡设备所插入的目标网卡插槽的目标插槽部署位置之前，方法还包括：在检测到服务器主机上电的情况下，检测服务器主机的当前上电信息，其中，当前上电信息用于指示服务器主机本次被上电的上电情况；根据当前上电信息确定网卡插槽阵列中的网卡插槽的在位信息，其中，在位信息用于指示对应网卡插槽上网卡设备的在位情况；根据在位信息从散热设备阵列中筛选出第二散热设备，并控制第二散热设备按照参考运行参数运行，其中，参考运行参数用于将网卡插槽阵列散热到参考运行状态，参考运行状态是允许服务器主机启动的情况下网卡插槽阵列的运行状态。
在一个示例性实施例中，根据当前上电信息确定网卡插槽阵列中的网卡插槽的在位信息，包括：在当前上电信息用于指示服务器主机首次上电的情况下，确定在位信息用于指示网卡插槽阵列上存在连接了网卡设备的网卡插槽；根据在位信息从散热设备阵列中筛选出第二散热设备，并控制第二散热设备按照参考运行参数运行，包括：将散热设备阵列中全部散热设备确定为第二散热设备；根据散热设备阵列中的散热设备的设备部署位置为第二散热设备分配运行参数，得到参考运行参数；控制第二散热设备按照参考运行参数运行。
在一个示例性实施例中，根据当前上电信息确定网卡插槽阵列中的网卡插槽的在位信息，包括：在当前上电信息用于指示服务器主机未被启动过的情况下，确定在位信息用于指示网卡插槽阵列上的默认网卡插槽连接了网卡设备；根据在位信息从散热设备阵列中筛选出第二散热设备，包括：将散热设备阵列中散热设备的设备部署位置与默认网卡插槽的插槽部署位置对应的散热设备确定为第二散热设备。
在一个示例性实施例中，根据当前上电信息确定网卡插槽阵列中的网卡插槽的在位信息，包括：在当前上电信息用于指示服务器主机被启动过的情况下，根据服务器主机历史启动的过程中检测到的，连接到服务器主机上的目标网卡设备所插入的目标网卡插槽的目标插槽部署位置确定网卡插槽阵列中的网卡插槽的在位信息；根据在位信息从散热设备阵列中筛选出第二散热设备，包括：将散热设备阵列中与根据服务器主机历史启动过程中检测到的连接到服务器主机上的网卡设备的网卡插槽的插槽部署位置对应的散热设备确定为第二散热设备。
在一个示例性实施例中，根据当前上电信息确定网卡插槽阵列中的网卡插槽的在位信息，包括：在当前上电信息用于指示服务器主机非首次上电的情况下，确定在位信息用于指示服务器主机上一次关机时所连接的网卡设备在位；根据在位信息从散热设备阵列中筛选出第二散热设备，包括：获取服务器主机上一次关机时所连接的网卡设备所在网卡插槽的候选插槽部署位置；从具有对应关系的插槽部署位置和设备部署位置中查找候选插槽部署位置所对应的候选设备部署位置；将候选设备部署位置上的散热设备确定为第二散热设备。
根据本申请的实施例，提供了一种服务器散热设备的控制装置，服务器包括服务器主机和服务器控制器，服务器主机上部署了网卡插槽阵列和散热设备阵列，网卡插槽阵列中的网卡插槽的插槽部署位置与散热设备阵列中的散热设备的设备部署位置具有对应关系，网卡插槽被配置为连接网卡设备，散热设备被配置为为对应的网卡插槽上连接的网卡设备散热，装置应用于服务器控制器，装置包括：
第一检测模块，被配置为在检测到服务器主机启动的情况下，检测连接到服务器主机上的目标网卡设备所插入的目标网卡插槽的目标插槽部署位置；
第一筛选模块，被配置为从散热设备阵列中筛选出目标插槽部署位置所对应的目标设备部署位置上的第一散热设备；
控制模块，被配置为控制第一散热设备按照目标运行参数运行，其中，目标运行参数用于将目标网卡设备 散热到目标运行状态，目标运行状态是允许目标网卡设备在服务器主机启动后继续运行的状态。
根据本申请的实施例，还提供了一种计算机非易失性可读存储介质，计算机非易失性可读存储介质中存储有计算机程序，其中，计算机程序被设置为运行时执行上述任一项方法实施例中的步骤。
根据本申请的实施例，还提供了一种电子设备，包括存储器和处理器，存储器中存储有计算机程序，处理器被设置为运行计算机程序以执行上述任一项方法实施例中的步骤。
根据本申请的实施例，还提供了一种计算机程序产品，包括计算机程序，计算机程序被处理器执行时实现上述任一项方法实施例中的步骤。
通过本申请，由于服务器控制器通过检测连接到服务器主机上的目标网卡设备所插入的目标网卡插槽的目标插槽部署位置；从散热设备阵列中筛选出目标插槽部署位置所对应的目标设备部署位置上的第一散热设备，使得散热设备阵列中的散热设备在不存在物理I2C链路监控网卡设备的温度从而调整服务器整机的散热策略的情况下，也能实时调整第一散热设备按照目标运行参数运行，因此，可以解决服务器散热设备的控制效率较低的问题，达到提高服务器散热设备的控制效率的效果。
附图说明
图1是本申请实施例的一种服务器散热设备的控制方法的服务器设备的硬件结构框图；
图2是根据本申请实施例的服务器散热设备的控制方法的流程图；
图3是根据本申请实施例的一种服务器整机的示意图；
图4是根据本申请实施例的一种服务器主板的示意图；
图5是根据本申请实施例的一种风扇的转速的示意图；
图6是根据本申请实施例的一种服务器控制器的工作过程的流程图；
图7是根据本申请实施例的一种服务器散热设备的控制过程的泳道图；
图8是根据本申请实施例的服务器散热设备的控制装置的结构框图；
图9是根据本申请实施例的一种电子设备的结构框图。
具体实施方式
下文中将参考附图并结合实施例来详细说明本申请的实施例。
需要说明的是，本申请的说明书和权利要求书及上述附图中的术语“第一”、“第二”等是用于区别类似的对象，而不必用于描述特定的顺序或先后次序。
本申请实施例中所提供的方法实施例可以在服务器设备或者类似的运算装置中执行。以运行在服务器设备上为例，图1是本申请实施例的一种服务器散热设备的控制方法的服务器设备的硬件结构框图。如图1所示，服务器设备可以包括一个或多个(图1中仅示出一个)处理器102(处理器102可以包括但不限于微处理器MCU(Microcontroller Unit)或可编程逻辑器件FPGA(Field Programmable Gate Array)等的处理装置)和被配置为存储数据的存储器104，其中，上述服务器设备还可以包括用于通信功能的传输设备106以及输入输出设备108。本领域普通技术人员可以理解，图1所示的结构仅为示意，其并不对上述服务器设备的结构造成限定。例如，服务器设备还可包括比图1中所示更多或者更少的组件，或者具有与图1所示不同的配置。
存储器104可被配置为存储计算机程序，例如，应用软件的软件程序以及模块，如本申请实施例中的服务器散热设备的控制方法对应的计算机程序，处理器102通过运行存储在存储器104内的计算机程序，从而执行各种功能应用以及数据处理，即实现上述的方法。存储器104可包括高速随机存储器，还可包括非易失性存储器，如一个或者多个磁性存储装置、闪存、或者其他非易失性固态存储器。在一些实例中，存储器104可包括相对于处理器102远程设置的存储器，这些远程存储器可以通过网络连接至服务器设备。上述网络的实例包括但不限于互联网、企业内部网、局域网、移动通信网及其组合。
传输设备106被配置为经由一个网络接收或者发送数据。上述的网络具体实例可包括服务器设备的通信供应方提供的无线网络。在一个实例中，传输设备106包括一个网络适配器(Network Interface Controller，简称为NIC)，其可通过基站与其他网络设备相连从而可与互联网进行通讯。在一个实例中，传输设备106可以为射频(Radio Frequency，简称为RF)模块，其被配置为通过无线方式与互联网进行通讯。
在本申请实施例中提供了一种服务器散热设备的控制方法，服务器包括服务器主机和服务器控制器，服务器主机上部署了网卡插槽阵列和散热设备阵列，网卡插槽阵列中的网卡插槽的插槽部署位置与散热设备阵列中的散热设备的设备部署位置具有对应关系，网卡插槽被配置为连接网卡设备，散热设备被配置为为对应的网卡插槽上连接的网卡设备散热，方法应用于服务器控制器，图2是根据本申请实施例的服务器散热设备的控制方法的流程图，如图2所示，该流程包括如下步骤：
步骤S202，在检测到服务器主机启动的情况下，检测连接到服务器主机上的目标网卡设备所插入的目标网卡插槽的目标插槽部署位置；
步骤S204，从散热设备阵列中筛选出目标插槽部署位置所对应的目标设备部署位置上的第一散热设备；
步骤S206，控制第一散热设备按照目标运行参数运行，其中，目标运行参数用于将目标网卡设备散热到目标运行状态，目标运行状态是允许目标网卡设备在服务器主机启动后继续运行的状态。
通过上述步骤，由于服务器控制器通过检测连接到服务器主机上的目标网卡设备所插入的目标网卡插槽的目标插槽部署位置；从散热设备阵列中筛选出目标插槽部署位置所对应的目标设备部署位置上的第一散热设备，使得散热设备阵列中的散热设备在不存在物理I2C链路监控网卡设备的温度从而调整服务器整机的散热策略的情况下，也能实时调整第一散热设备按照目标运行参数运行，因此，可以解决服务器散热设备的控制效率较低的问题，达到提高服务器散热设备的控制效率的效果。
可选的，在本申请实施例中，本申请提出的服务器散热设备的控制方法应用于服务器上部署的服务器控制器，上述服务器控制器可以但不限于是BMC(Baseboard Management Controller，基板管理控制器)或者其他具有服务器管理功能的设备。
可选的，在本申请实施例中，上述服务器主机部署了由多个网卡插槽组成的网卡插槽阵列，上述网卡插槽被配置为连接网卡设备，可以但不限于按照多种方式排列上述网卡插槽得到网卡插槽阵列，比如：平行排列、垂直排列、包括平行排列和垂直排列的混合排列等。
可选的，在本申请实施例中，上述网卡设备可以但不限于包括基础功能网卡、SNIC(Smart Network Interface Card，智能网卡)以及DPU(Data Processing unit，数据处理器)智能网卡，以及其他具备计算能力，能够担负网络、安全、存储中不适合CPU(Central Processing Unit，中央处理器)相关的数据处理功能，降低CPU的消耗，使服务器能够更有效运行关键应用程序和操作系统，实现优化业务数据处理整体效力功能的设备。
需要说明的是，在相关技术中，DPU是一种围绕数据处理提供网络、存储、安全、管理等数据中心基础设施虚拟化服务的专用处理器，基于ARM(Advanced RISC Machine)/X86等架构的CPU与ASIC(Application Specific Integrated Circuit，专用集成电路)/NP(Network Processor，网络处理器)/FPGA(Field Programmable Gate Array，现场可编程门阵列)等专用硬件加速引擎组成的计算架构，形成提供虚拟化功能的实体。DPU允许应用于数据中心的各种架构服务器中，包括但不限于X86架构和ARM架构等，因为DPU的功耗较大，若无及时调整服务器整机的散热控制将出现服务器整机系统高温导致机器内部的部件或者其他核心组件因为过温问题导致机器无法使用，出现宕机或者关机的问题，一旦在不知情的前提下出现宕机或者关机将对业务造成致命的危害，因此无论何种架构的服务器均需要制定合理的散热策略。
可选的，在本申请实施例中，上述服务器主机还部署了由多个散热设备组成的散热设备阵列，上述散热设备是具有为对应的网卡插槽上连接的网卡设备进行散热功能的设备，比如：风扇设备、散热片、散热管、散热通道等。可以但不限于按照多种方式排列散热设备得到散热设备阵列，比如：平行排列、垂直排列、包括平行排列和垂直排列的混合排列等。
可选的，在本申请实施例中，可以但不限于在网卡插槽阵列中的一个或者多个网卡插槽中连接网卡设备，并控制对应的一个或者多个散热设备为网卡设备散热。
在上述步骤S202提供的技术方案中，可以但不限于通过检测服务器主机上网卡插槽的连接情况确定连接了网卡设备的目标网卡插槽，从而得到目标网卡插槽的目标插槽部署位置。
可选的，在本申请实施例中，可以但不限于通过具有硬件检测和识别功能的设备检测服务器主机上网卡插槽的连接情况，比如：BIOS(Basic Input Output System，基本输入输出系统)、UEFI(Unified Extensible Firmware Interface，统一可扩展固件接口)等。
在一个示例性实施例中，可以但不限于采用以下方式检测连接到服务器主机上的目标网卡设备所插入的目标网卡插槽的目标插槽部署位置：接收服务器主机发送的目标插槽部署位置，其中，目标插槽部署位置是服务器主机在启动过程中的网卡设备枚举阶段检测到的。
可选的，在本申请实施例中，在服务器主机启动的过程中，可以但不限于通过网卡设备枚举阶段检测连接了目标网卡设备的目标网卡插槽，上述网卡设备枚举阶段可以但不限于被配置为分配总线号和分配BAR(Base Address Register，基地址寄存器)空间，分配的总线号用于访问配置空间，BAR空间被配置为与PCIe(Peripheral Component Interconnect express，外设部件互连标准)设备进行数据交互。
可选的，在本申请实施例中，在服务器主机启动的情况下，服务器主机可以但不限于被配置为将连接了目标网卡设备的目标网卡插槽的目标插槽部署位置发送至服务器控制器。服务器主机可以但不限于在服务器主机完成启动的情况下，立刻向服务器控制器发送目标插槽部署位置，也可以是在服务器主机已启动的情况下响应于服务器控制器的请求向服务器控制器发送目标插槽部署位置，或者，服务器主机也可以通过响应于设定的其他触发条件触发向服务器控制器发送目标插槽部署位置的操作。
可选的，在本申请实施例中，服务器主机可以但不限于通过IPMI(Intelligent Platform Management Interface，智能平台管理接口)命令或者服务器控制器能够支持的其他传输协议将目标网卡插槽的目标插槽部署传递给服务器控制器。
在一个示例性实施例中，可以但不限于采用以下方式接收服务器主机发送的目标插槽部署位置：接收服务器主机上部署的基本输入输出系统在完成网卡设备枚举阶段的运行后向服务器控制器发送的目标插槽部署位置。
可选的，在本申请实施例中，在服务器主机启动的过程中，服务器主机上部署的基本输入输出系统可以但 不限于被配置为通过网卡设备枚举阶段检测连接了目标网卡设备的目标网卡插槽，并在完成网卡设备枚举阶段的情况下，主动向服务器控制器发送的目标插槽部署位置。
可选的，在本申请实施例中，在基本输入输出系统完成网卡设备枚举阶段的情况下，基本输入输出系统可以但不限于通过IPMI命令或者服务器控制器能够支持的其他传输协议将目标网卡插槽的目标插槽部署传递给服务器控制器。
在一个示例性实施例中，可以但不限于采用以下方式接收服务器主机发送的目标插槽部署位置：检测服务器主机上部署的基本输入输出系统对服务器主机进行启动的启动进度；在启动进度用于指示基本输入输出系统已完成网卡设备枚举阶段的运行的情况下，向基本输入输出系统发送目标请求，其中，目标请求用于请求获取已连接到服务器主机上的网卡设备所插入的网卡插槽的插槽部署位置；接收服务器主机上部署的基本输入输出系统响应目标请求向服务器控制器发送的目标插槽部署位置。
可选的，在本申请实施例中，服务器主机可以但不限于通过基本输入输出系统的引导执行启动操作，在基本输入输出系统引导服务器主机启动的过程中，可以但不限于通过网卡设备枚举阶段获取服务器主机上的网卡设备所插入的网卡插槽的插槽部署位置，在基本输入输出系统已完成网卡设备枚举阶段的运行的情况下，服务器控制器通过向基本输入输出系统发送目标请求，请求获取已连接到服务器主机上的网卡设备所插入的网卡插槽的插槽部署位置，并接收服务器主机上部署的基本输入输出系统响应目标请求发送的目标插槽部署位置。
可选的，在本申请实施例中，在基本输入输出系统和服务器控制器可以但不限于通过IPMI命令或者服务器控制器能够支持的其他传输协议进行交互。
在一个示例性实施例中，在检测连接到服务器主机上的目标网卡设备所插入的目标网卡插槽的目标插槽部署位置之前，可以但不限于采用以下方式控制散热设备运行：在检测到服务器主机上电的情况下，检测服务器主机的当前上电信息，其中，当前上电信息用于指示服务器主机本次被上电的上电情况；根据当前上电信息确定网卡插槽阵列中的网卡插槽的在位信息，其中，在位信息用于指示对应网卡插槽上网卡设备的在位情况；根据在位信息从散热设备阵列中筛选出第二散热设备，并控制第二散热设备按照参考运行参数运行，其中，参考运行参数用于将网卡插槽阵列散热到参考运行状态，参考运行状态是允许服务器主机启动的情况下网卡插槽阵列的运行状态。
可选的，在本申请实施例中，可以但不限于对服务器主机上电但未启动服务器，使得服务器主机处于上电但未启动的状态，检测服务器主机是否为首次上电，即服务器主机是否启动过作为服务器主机的当前上电信息，服务器主机的当前上电信息可以但不限于包括：服务器为首次上电，即服务器主机未被启动过。或者，服务器为非首次上电，即服务器主机被启动过。
可选的，在本申请实施例中，在服务器主机启动的情况下，服务器主机可以但不限于被配置为检测连接到服务器主机上的目标网卡设备所插入的目标网卡插槽的目标插槽部署位置，因此可以但不限于根据服务器主机的当前上电信息确定网卡插槽阵列中的网卡插槽的在位信息，比如：在服务器主机的当前上电信息指示服务器主机未被启动过的情况下，确定未知网卡插槽阵列中的网卡插槽的在位信息。或者，在服务器主机的当前上电信息指示服务器主机被启动过的情况下，根据历史服务器主机启动的过程中检测到的连接到服务器主机上的目标网卡设备所插入的目标网卡插槽的目标插槽部署位置确定网卡插槽阵列中的网卡插槽的在位信息。
可选的，在服务器主机的当前上电信息指示服务器主机未被启动过的情况下，由于未知网卡插槽阵列中的网卡插槽的在位信息，但是为了保护服务器主机在当前启动的过程中，不会由于网卡设备出现过温问题，可以但不限于通过设定默认在位的网卡设备，通过控制默认在位的网卡设备的网卡插槽的插槽部署位置对应的散热设备进行散热操作，对全部网卡插槽上连接的网卡设备散热，实现不论当前的网卡设备部署在任何一个网卡插槽中都能够保证服务器主机的正常启动过程不会出现过温问题。
可选的，在本申请实施例中，可以但不限于将网卡插槽上在位的网卡设备对应的散热设备确定为第二散热设备，比如：在服务器主机的当前上电信息指示服务器主机被启动过的情况下，根据历史服务器主机启动的过程中检测到的，连接到服务器主机上的目标网卡设备所插入的目标网卡插槽的目标插槽部署位置确定的网卡插槽阵列中的网卡插槽的在位信息，将散热设备阵列中与根据历史服务器主机启动的过程中检测到的连接到服务器主机上的目标网卡设备所插入的目标网卡插槽的目标插槽部署位置对应的散热设备的确定为第二散热设备。
或者，在服务器主机的当前上电信息指示服务器主机未被启动过的情况下，由于未知网卡插槽阵列中的网卡插槽的在位信息，但是为了保护服务器主机在当前启动的过程中，不会由于网卡设备出现过温问题，设定在位的网卡设备包括除首个和最后一个网卡设备，第二散热设备包括与在位的网卡设备对应的散热设备。或者，在服务器主机的当前上电信息指示服务器主机未被启动过的情况下，由于未知网卡插槽阵列中的网卡插槽的在位信息，但是为了保护服务器主机在当前启动的过程中，不会由于网卡设备出现过温问题，设定全部的网卡设备在位，第二散热设备包括全部的散热设备等。
需要说明的是，在服务器主机的当前上电信息指示服务器主机未被启动过的情况下，由于未知网卡插槽阵列中的网卡插槽的在位信息，可以但不限于根据服务器主机上部署的网卡插槽阵列适应性的设定默认在位的网卡设备，使得能够实现在当前服务器主机启动的过程中，不论网卡设备部署在任何一个网卡插槽中都能够保证服务器主机的正常启动，即不会出现过温问题。
可选的，在本申请实施例中，参考运行参数用于将网卡插槽阵列散热到允许服务器主机启动的状态下，可以但不限于根据运行服务器主机正常启动的温度条件以及服务器主机启动的过程中所产生的热量确定第二散热设备的参考运行参数。
可选的，可以但不限于通过多种方式根据运行服务器主机正常启动的温度条件以及服务器主机启动的过程中所产生的热量计算上述第二散热设备的参考运行参数，比如：通过训练深度学习模型使得模型能够计算上述第二散热设备的参考运行参数、通过算法计算上述第二散热设备的参考运行参数等。
可选的，在本申请实施例中，可以但不限于根据散热设备的转速、风量等参数确定散热设备的运行参数。
在一个示例性实施例中，可以但不限于采用以下方式根据当前上电信息确定网卡插槽阵列中的网卡插槽的在位信息：在当前上电信息用于指示服务器主机首次上电的情况下，确定在位信息用于指示网卡插槽阵列上存在连接了网卡设备的网卡插槽；可以但不限于采用以下方式根据在位信息从散热设备阵列中筛选出第二散热设备，并控制第二散热设备按照参考运行参数运行：将散热设备阵列中全部散热设备确定为第二散热设备；根据散热设备阵列中的散热设备的设备部署位置为第二散热设备分配运行参数，得到参考运行参数；控制第二散热设备按照参考运行参数运行。
可选的，在本申请实施例中，在当前上电信息指示服务器主机是首次上电的情况下，确定网卡插槽阵列上存在连接了网卡设备的网卡插槽，并将散热设备阵列中全部散热设备确定为第二散热设备，根据散热设备阵列中的散热设备的设备部署位置为第二散热设备分配运行参数，得到参考运行参数，并控制第二散热设备按照参考运行参数运行。
可选的，在本申请实施例中，以散热设备按照平行排列的方式组成散热设备阵列，散热设备阵列包括散热设备1、散热设备2、散热设备3、散热设备4和散热设备5为例，将散热设备阵列中的全部散热设备确定为第二散热设备，可以但不限于通过以下方式根据散热设备的设备部署位置为第二散热设备分配运行参数得到参考运行参数：
由于散热设备2和散热设备4能够实现为对应的网卡设备1、网卡设备2、网卡设备3、网卡设备4和网卡设备5散热，因此可以但不限于为散热设备2和散热设备4分配较高的运行参数80％，为散热设备1、散热设备3和散热设备5分配较小的运行参数30％；
或者，由于散热设备2、散热设备3和散热设备4也能够实现为网卡设备1、网卡设备2、网卡设备3、网卡设备4和网卡设备5散热，因此可以但不限于为散热设备2、散热设备3和散热设备4分配运行参数75％，为散热设备1和散热设备5分配运行参数30％；
或者，为散热设备3、散热设备4和散热设备5分配运行参数75％，为散热设备1和散热设备2分配运行参数30％；
或者，为散热设备1、散热设备2、散热设备3、散热设备4和散热设备5均分配运行参数30％等。
由于部署的服务器主机不同，服务器主机上部署的网卡插槽阵列和散热设备阵列也存在差异，因此，可以但不限于根据服务器主机上部署的网卡插槽阵列和散热设备阵列适应性的调整第二散热设备的运行参数，使得散热设备按照运行参数运行能够实现确保服务器主机的正常启动。
在一个示例性实施例中，可以但不限于采用以下方式根据当前上电信息确定网卡插槽阵列中的网卡插槽的在位信息：在当前上电信息用于指示服务器主机非首次上电的情况下，确定在位信息用于指示服务器主机上一次关机时所连接的网卡设备在位；可以但不限于采用以下方式根据在位信息从散热设备阵列中筛选出第二散热设备：获取服务器主机上一次关机时所连接的网卡设备所在网卡插槽的候选插槽部署位置；从具有对应关系的插槽部署位置和设备部署位置中查找候选插槽部署位置所对应的候选设备部署位置；将候选设备部署位置上的散热设备确定为第二散热设备。
可选的，在本申请实施例中，在当前上电信息指示服务器主机非首次上电的情况下，确定服务器主机上一次关机时所连接的网卡设备在位，并获取服务器主机上一次关机时所连接的网卡设备所在网卡插槽的候选插槽部署位置，从具有对应关系的插槽部署位置和设备部署位置中查找候选插槽部署位置所对应的候选设备部署位置；将候选设备部署位置上的散热设备确定为第二散热设备。
可选的，在本申请实施例中，在当前上电信息指示服务器主机非首次上电的情况下，可以但不限于为第二散热设备分配其对应的参考运行参数，并控制第二散热设备按照参考运行参数运行，第二散热设备可以但不限于包括一个或者多个散热设备，可以但不限于适应性的调整第二散热设备的参考运行参数，以保证散热设备按照运行参数运行能够实现确保服务器主机的正常启动。
在一个示例性实施例中，提供了一种服务器整机的示例。图3是根据本申请实施例的一种服务器整机的示意图，如图3所示，上述服务器整机包括服务器主板和散热设备阵列，服务器控制器为部署在服务器主板上的BMC，散热设备阵列包括风扇1、风扇2、风扇3和风扇4，网卡插槽阵列包括插槽1、插槽2、插槽3和插槽4，服务器主板上还部署了CPU1和CPU2，CPU1和CPU2通过UPI(Ultra Path Interconnect，超路径互连协议)通信，网卡插槽阵列中的插槽可以但不限于与CPU通过PCI(Peripheral Component Interconnect)，定义局部总线标准)通信，散热设备阵列中的风扇通过I2C和BMC以及CPU通信，在服务器主机上电的情况下，BMC可以但不限于通过以下方式工作：
BMC获取服务器主机是否为首次上电；
在服务器主机首次上电的情况下，确定网卡插槽阵列上存在连接了网卡设备的网卡插槽，BMC可以但不限于筛选出第二散热设备包括风扇1、风扇2、风扇3和风扇4，并为其分配参考运行参数包括分配风扇3和风扇4的转速为73％，分配风扇1和风扇2的转速为30％。
在服务器主机非首次上电的情况下，获取上一次关机时连接的网卡设备所在网卡插槽的候选插槽部署位置，以候选插槽部署位置为插槽2为例，可以但不限于查找插槽2对应的第二散热设备为风扇2，为风扇2分配运行参数包括转速为30％。
在服务器主机非首次上电的情况下，上一次关机时连接的网卡设备所在网卡插槽的候选插槽部署位置可以但不限于是BIOS在网卡设备枚举阶段检测到的，通过SPI(Serial Peripheral interface，串行外围设备接口)或者LPC(Low Pin Count，低速总线协议)传输至BMC的。
在一个示例性实施例中，提供了一种服务器主板的示例。图4是根据本申请实施例的一种服务器主板的示意图，如图4所示，以网卡设备为DPU为例，在服务器中，DPU连接在PCI插槽中，通过金手指供电，PCI插槽通过PCI总线和CPU交互。
在上述步骤S204提供的技术方案中，可以但不限于根据网卡插槽阵列中的网卡插槽的插槽部署位置与散热设备阵列中的散热设备的设备部署位置的对应关系，从散热设备阵列中筛选出目标插槽部署位置所对应的目标设备部署位置上的第一散热设备。
可选的，在本申请实施例中，网卡插槽阵列中的网卡插槽的插槽部署位置与散热设备阵列中的散热设备的设备部署位置的对应关系可以但不限于是一对一的对应关系，或者也可以是多对多的对应关系，因此第一散热设备可以但不限于是与目标插槽部署位置的数量相同的散热设备，也可以是数量不同的散热设备。
在一个示例性实施例中，可以但不限于采用以下方式从散热设备阵列中筛选出目标插槽部署位置所对应的目标设备部署位置上的第一散热设备：从具有对应关系的插槽部署位置和设备部署位置中查找目标插槽部署位置所对应的设备部署位置作为目标设备部署位置；将散热设备阵列中位于目标设备部署位置上的散热设备确定为第一散热设备。
可选的，在本申请实施例中，可以但不限于根据目标插槽部署位置从具有对应关系的插槽部署位置和设备部署位置中查找目标插槽部署位置对应的设备部署位置作为目标设备部署位置，并将散热设备阵列中位于目标设备部署位置上的散热设备确定为第一散热设备。
在一个示例性实施例中，可以但不限于采用以下方式从散热设备阵列中筛选出目标插槽部署位置所对应的目标设备部署位置上的第一散热设备：从具有对应关系的插槽部署位置和设备部署位置中查找目标插槽部署位置所对应的第一设备部署位置；获取与第一设备部署位置之间的距离落入目标距离范围内的第二设备部署位置；将第一设备部署位置和第二设备部署位置确定为目标设备部署位置；将散热设备阵列中位于目标设备部署位置上的散热设备确定为第一散热设备。
可选的，在本申请实施例中，可以但不限于根据网卡插槽阵列确定上述目标距离范围，比如：在网卡插槽阵列为平行排列的情况下，确定一定水平距离为上述目标距离范围；在网卡插槽阵列为垂直排列的情况下，确定一定垂直距离为上述目标距离范围；在网卡插槽阵列为包括平行排列和垂直排列的混合排列的情况下，确定一定半径内的距离为上述目标距离范围等。上述一定距离可以但不限于是根据网卡插槽阵列中包括的网卡插槽的个数确定的，比如：网卡插槽的个数的1/2、1/4等。
可选的，在本申请实施例中，目标设备部署位置包括目标插槽部署位置所对应的第一设备部署位置以及与第一设备部署位置之间的距离落入目标距离范围内的第二设备部署位置，可以但不限于将散热设备阵列中位于目标设备部署位置上的散热设备确定为第一散热设备。
在上述步骤S206提供的技术方案中，可以但不限于通过控制第一散热设备按照目标运行参数运行使得目标网卡设备在服务器主机启动后能够继续运行。
可选的，在本申请实施例中，可以但不限于根据散热设备的转速、风量等参数确定散热设备的运行参数。
在一个示例性实施例中，可以但不限于采用以下方式控制第一散热设备按照目标运行参数运行：根据第一散热设备的分布信息确定目标运行参数，其中，分布信息用于指示第一散热设备在服务器主机上的分布情况；控制第一散热设备按照目标运行参数运行。
可选的，在本申请实施例中，第一散热设备可以但不限于是服务器主机上的一个或者多个散热设备，可以但不限于根据第一散热设备的在散热设备阵列中的分布情况确定第一散热设备的目标运行参数，比如：在第一散热设备是与在位的网卡设备的网卡插槽的插槽部署位置具有对应的散热设备的情况下，为第一散热设备分配较高的运行参数。或者，在第一散热设备不是与在位的网卡设备的网卡插槽的插槽部署位置具有对应的散热设备的情况下，根据第一散热设备和在位的网卡设备的网卡插槽的插槽部署位置具有对应的散热设备之间的距离为第一散热设备分配运行参数，距离和运行参数成反比等。
在一个示例性实施例中，可以但不限于采用以下方式根据第一散热设备的分布信息确定目标运行参数：在分布信息用于指示第一散热设备是散热设备阵列中设备部署位置与目标插槽部署位置具有对应关系的散热设备的情况下，获取第一散热设备的最高运行参数；将最高运行参数确定为目标运行参数。
可选的，在本申请实施例中，在第一散热设备是散热设备阵列中设备部署位置与目标插槽部署位置具有对应关系的散热设备的情况下，可以但不限于设定第一散热设备按照最高运行参数运行。
在一个示例性实施例中，可以但不限于采用以下方式根据第一散热设备的分布信息确定目标运行参数：在分布信息用于指示第一散热设备的目标插槽部署位置包括第一设备部署位置和第二设备部署位置的情况下，根据第一散热设备的最高运行参数和第一散热设备中的散热设备之间的距离为第一散热设备中的散热设备分配运行参数，其中，第一设备部署位置是从具有对应关系的插槽部署位置和设备部署位置中查找到的目标插槽部署位置所对应的设备部署位置，第二设备部署位置是与第一设备部署位置之间的距离落入目标距离范围内的设备部署位置；将具有对应关系的散热设备和运行参数确定为目标运行参数。
可选的，在本申请实施例中，在第一散热设备的目标插槽部署位置包括第一设备部署位置和第二设备部署位置的情况下，可以但不限于根据第一散热设备的最高运行参数和第一散热设备中的散热设备之间的距离为第一散热设备中的散热设备分配运行参数，比如：为第一设备部署位置的散热设备分配第一运行参数，为第二设备部署位置的散热设备分配第二运行参数，第二运行参数小于或者等于第一运行参数。在包括多个第二设备部署位置的情况下，可以但不限于根据第二设备部署位置与第一设备部署位置之间的距离，距离越远依次递减第二运行参数。
在一个示例性实施例中，可以但不限于采用以下方式根据第一散热设备的最高运行参数和第一散热设备中的散热设备之间的距离为第一散热设备中的散热设备分配运行参数：根据第一散热设备的最高运行参数为第一设备部署位置上的散热设备确定第一运行参数，其中，第一运行参数小于或者等于最高运行参数；根据第一运行参数和第二设备部署位置与第一设备部署位置之间的距离为第二设备部署位置上的散热设备确定第二运行参数，其中，距离与第二运行参数成反比。
可选的，在本申请实施例中，可以但不限于确定第一散热设备的最高运行参数为第一设备部署位置上的散热设备的第一运行参数。或者，获取小于第一散热设备的最高运行参数的数值作为第一设备部署位置上的散热设备的第一运行参数。
可选的，在本申请实施例中，可以但不限于根据第一运行参数和第二设备部署位置与第一设备部署位置之间的距离为第二设备部署位置上的散热设备分配的第二运行参数，比如：距离越长，为第二设备部署位置上的散热设备分配的第二运行参数依次递减。
在一个示例性实施例中，提供了一种风扇的转速的示例。图5是根据本申请实施例的一种风扇的转速的示意图，如图5所示，以散热设备为风扇，散热设备的运行参数为风扇的转速为例，服务器控制器可以但不限于按照以下方式调整风扇的转速实现对散热设备的运行参数的调整：
在服务器运行的过程中，保持连接了网卡设备的网卡插槽的插槽部署位置对应的设备部署位置的风扇保持100％的转速运行，让风扇保持大功率为智能网卡降温。
在服务器处于非启动的情况下，保持连接了网卡设备的网卡插槽的插槽部署位置对应的设备部署位置的风扇保持73％的转速运行，未连接网卡设备的网卡插槽的插槽部署位置对应的设备部署位置的风扇保持30％的转速运行，这样的运行方式，能够保证在服务器启动的情况下，即使网卡设备的连接位置发生的变化，也能够保证服务器的温度处于正常范围内，以免造成服务器过温产生故障。
可选的，在本申请实施例中，为了更好的理解本申请提出的服务器散热设备的控制方法中上述服务器控制器的工作过程，以下再结合可选实施例对上述流程进行说明，但不用于限定本申请实施例的技术方案。
在一个示例性实施例中，提供了一种服务器控制器的工作过程的示例。图6是根据本申请实施例的一种服务器控制器的工作过程的流程图，如图6所示，以网卡设备为DPU，散热设备包括风扇1、风扇2、风扇3和风扇4为例，服务器控制器可以但不限于通过以下方式工作：
在服务器主机上电的情况下，确定服务器主机是否为首次上电；
在服务器主机为首次上电的情况下，默认DPU卡在位，设置风扇2和风扇3的转速为73％，风扇0和风扇1的转速为30％，启动服务器，在服务器启动的情况下，通过IPMI协议获取DPU的位置信息，控制DPU位置信息正前方的风扇转速为100％。
在服务器主机为非首次上电的情况下，控制上一次关机前在位的DPU的DPU位置信息正前方的风扇转速为30％。
在一个示例性实施例中，提供了一种服务器散热设备的控制过程的示例。图7是根据本申请实施例的一种服务器散热设备的控制过程的泳道图，如图7所示，以服务器控制器为BMC，基本输入输出系统为BIOS，网卡设备为DPU，散热设备包括风扇1、风扇2、风扇3和风扇4为例，可以但不限于通过以下方式控制服务器散热设备为服务器进行散热操作：
在服务器上电且历史时间段内未执行启动操作的情况下，BMC无法获取DPU卡是否在位或者辅助固件CPLD(Complex Programmable Logic Device，复杂可编程逻辑器件)也无法检测DPU卡是否在位，导致BMC无法准确检测DPU卡的位置信息，因此BMC默认DPU卡在位(条件1)；
在服务器上电且历史时间段内执行过启动操作的情况下，获取上一次启动操作的过程中通过PCI枚举部分时获取到的DPU位置信息(条件2)；
在条件1的前提下，BMC控制全部散热设备工作，比如：将风扇2和风扇3转速设置为最大转速的73％；风扇0和风扇1转速设置为最大转速的30％；
在条件2的前提下，BMC控制获取到的DPU位置信息对应的散热设备工作，比如：将DPU位置信息对应的风扇转速设置为最大转速的30％。
在服务器启动的情况下，BIOS在启动阶段的PCI枚举过程中将通过对PCI设备的识别确认DPU卡所在的位置信息；
BIOS通过IPMI协议或者其他与BMC交互的协议将识别的DPU卡的位置信息传递给BMC端；
BMC根据BIOS传递的位置信息确认DPU卡所在的位置信息并将DPU卡正前方的风扇的转速设置为最大转速，以降低服务器整机的功耗温度。
值得注意的是，在本申请提出的方案中，为了解决基于主板服务器硬件物理链路链接设计无法支持服务器控制器通过I2C协议读取网卡设备卡的温度寄存器对服务器散热设备进行控制以降低服务器运行及关机时的温度的技术问题，本申请通过对网卡设备所在服务器上电后是否存在开机的情况进行判断，若未进行过上电后的任何开机则服务器控制器默认认为网卡设备存在并适应性的控制散热设备进行工作；当服务器开机后，通过基本输入输出系统启动的PCI枚举部分枚举网卡设备所在的PCI槽位信息并通过与服务器控制器的通信协议将网卡设备的位置信息传递给服务器控制器，服务器控制器根据网卡设备的位置信息，控制网卡设备对应的散热设备运行降低服务器整体的温度，并且当服务器关机时因服务器控制器已知道网卡设备所在的位置信息后将网卡设备对应的散热设备的功率降低；或者，当服务器启动过一次且处于关机状态时，由于已知历史部署的网卡设备的位置信息，可以将网卡设备对应的散热设备开启。在本申请提出的方案中，只需关注服务器上电后是否是首次启动以及部署网卡设备的位置，即可为运行在不同阶段的服务器调整对应的散热设备的工作方式实现为网卡设备以及服务器整机的降温。
通过本申请提出的服务器散热设备的控制方法，通过结合服务器硬件设计将基本输入输出系统和服务器控制器两个固件通过通信协议实现交互，即将基本输入输出系统端识别的网卡设备的位置信息传递给服务器控制器，服务器控制器根据基本输入输出系统传递的网卡设备的位置信息控制对应的散热设备进行工作；同时，给出了一种通过判断服务器是否为首次上电，为运行在不同阶段的服务器确定调整对应的散热设备的工作方式的方法，对于无法准确确定网卡设备的位置信息的情况下，服务器控制器仍然能够适应性的调整散热设备的工作情况，以降低服务器的整机温度及整机功耗，保证服务器的RAS(Reliability,Availability,and Serviceability，可靠性、可用性和可维护性)功能正常。
同时，本申请提出的服务器散热设备的控制方法可满足数据中心的实际业务需求且支持任何架构服务器，通用性强，适用度高。进一步提高了服务器运行的安全性，确保服务器以及网卡设备在各种情况下均不会因为过温导致故障的情况发生。
通过本申请，服务器包括服务器主机和服务器控制器，服务器主机上部署了网卡插槽阵列和散热设备阵列，网卡插槽阵列中的网卡插槽的插槽部署位置与散热设备阵列中的散热设备的设备部署位置具有对应关系，网卡插槽被配置为连接网卡设备，散热设备被配置为为对应的网卡插槽上连接的网卡设备散热，在检测到服务器主机启动的情况下，服务器控制器检测连接到服务器主机上的目标网卡设备所插入的目标网卡插槽的目标插槽部署位置；从散热设备阵列中筛选出目标插槽部署位置所对应的目标设备部署位置上的第一散热设备；控制第一散热设备按照目标运行参数运行，其中，目标运行参数用于将目标网卡设备散热到目标运行状态，目标运行状态是允许目标网卡设备在服务器主机启动后继续运行的状态。由于服务器控制器通过检测连接到服务器主机上的目标网卡设备所插入的目标网卡插槽的目标插槽部署位置；从散热设备阵列中筛选出目标插槽部署位置所对应的目标设备部署位置上的第一散热设备，使得散热设备阵列中的散热设备在不存在物理I2C链路监控网卡设备的温度从而调整服务器整机的散热策略的情况下，也能实时调整第一散热设备按照目标运行参数运行，因此，可以解决服务器散热设备的控制效率较低的问题，达到提高服务器散热设备的控制效率的效果。
通过以上的实施方式的描述，本领域的技术人员可以清楚地了解到根据上述实施例的方法可借助软件加必需的通用硬件平台的方式来实现，当然也可以通过硬件，但很多情况下前者是更佳的实施方式。基于这样的理解，本申请的技术方案本质上或者说对现有技术做出贡献的部分可以以软件产品的形式体现出来，该计算机软件产品存储在一个非易失性可读存储介质(如ROM/RAM、磁碟、光盘)中，包括若干指令用以使得一台终端设备(可以是手机，计算机，服务器，或者网络设备等)执行本申请各个实施例的方法。
在本申请实施例中还提供了一种服务器散热设备的控制装置，服务器包括服务器主机和服务器控制器，服务器主机上部署了网卡插槽阵列和散热设备阵列，网卡插槽阵列中的网卡插槽的插槽部署位置与散热设备阵列中的散热设备的设备部署位置具有对应关系，网卡插槽被配置为连接网卡设备，散热设备被配置为为对应的网卡插槽上连接的网卡设备散热，装置应用于服务器控制器，该装置用于实现上述实施例及可选实施方式，已经进行过说明的不再赘述。如以下所使用的，术语“模块”可以实现预定功能的软件和/或硬件的组合。尽管以下实施例所描述的装置较佳地以软件来实现，但是硬件，或者软件和硬件的组合的实现也是可能并被构想的。
图8是根据本申请实施例的服务器散热设备的控制装置的结构框图，如图8所示，该装置包括：
第一检测模块82，被配置为在检测到服务器主机启动的情况下，检测连接到服务器主机上的目标网卡设备 所插入的目标网卡插槽的目标插槽部署位置；
第一筛选模块84，被配置为从散热设备阵列中筛选出目标插槽部署位置所对应的目标设备部署位置上的第一散热设备；
控制模块86，被配置为控制第一散热设备按照目标运行参数运行，其中，目标运行参数用于将目标网卡设备散热到目标运行状态，目标运行状态是允许目标网卡设备在服务器主机启动后继续运行的状态。
通过上述装置，由于服务器控制器通过检测连接到服务器主机上的目标网卡设备所插入的目标网卡插槽的目标插槽部署位置；从散热设备阵列中筛选出目标插槽部署位置所对应的目标设备部署位置上的第一散热设备，使得散热设备阵列中的散热设备在不存在物理I2C链路监控网卡设备的温度从而调整服务器整机的散热策略的情况下，也能实时调整第一散热设备按照目标运行参数运行，因此，可以解决服务器散热设备的控制效率较低的问题，达到提高服务器散热设备的控制效率的效果。
在一个示例性实施例中，第一检测模块，包括：
接收单元，被配置为接收服务器主机发送的目标插槽部署位置，其中，目标插槽部署位置是服务器主机在启动过程中的网卡设备枚举阶段检测到的。
在一个示例性实施例中，接收单元，还被配置为：接收服务器主机上部署的基本输入输出系统在完成网卡设备枚举阶段的运行后向服务器控制器发送的目标插槽部署位置。
在一个示例性实施例中，接收单元，还被配置为：检测服务器主机上部署的基本输入输出系统对服务器主机进行启动的启动进度；在启动进度用于指示基本输入输出系统已完成网卡设备枚举阶段的运行的情况下，向基本输入输出系统发送目标请求，其中，目标请求用于请求获取已连接到服务器主机上的网卡设备所插入的网卡插槽的插槽部署位置；接收服务器主机上部署的基本输入输出系统响应目标请求向服务器控制器发送的目标插槽部署位置。
在一个示例性实施例中，第一筛选模块，包括：
第一查找单元，被配置为从具有对应关系的插槽部署位置和设备部署位置中查找目标插槽部署位置所对应的设备部署位置作为目标设备部署位置；
第一确定单元，被配置为将散热设备阵列中位于目标设备部署位置上的散热设备确定为第一散热设备。
在一个示例性实施例中，第一筛选模块，包括：
第二查找单元，被配置为从具有对应关系的插槽部署位置和设备部署位置中查找目标插槽部署位置所对应的第一设备部署位置；
获取单元，被配置为获取与第一设备部署位置之间的距离落入目标距离范围内的第二设备部署位置；
第二确定单元，被配置为将第一设备部署位置和第二设备部署位置确定为目标设备部署位置；
第三确定单元，被配置为将散热设备阵列中位于目标设备部署位置上的散热设备确定为第一散热设备。
在一个示例性实施例中，控制模块，包括：
第四确定单元，被配置为根据第一散热设备的分布信息确定目标运行参数，其中，分布信息用于指示第一散热设备在服务器主机上的分布情况；
控制单元，被配置为控制第一散热设备按照目标运行参数运行。
在一个示例性实施例中，第四确定单元，还被配置为：在分布信息用于指示第一散热设备是散热设备阵列中设备部署位置与目标插槽部署位置具有对应关系的散热设备的情况下，获取第一散热设备的最高运行参数；将最高运行参数确定为目标运行参数。
在一个示例性实施例中，第四确定单元，还被配置为：在分布信息用于指示第一散热设备的目标插槽部署位置包括第一设备部署位置和第二设备部署位置的情况下，根据第一散热设备的最高运行参数和第一散热设备中的散热设备之间的距离为第一散热设备中的散热设备分配运行参数，其中，第一设备部署位置是从具有对应关系的插槽部署位置和设备部署位置中查找到的目标插槽部署位置所对应的设备部署位置，第二设备部署位置是与第一设备部署位置之间的距离落入目标距离范围内的设备部署位置；将具有对应关系的散热设备和运行参数确定为目标运行参数。
在一个示例性实施例中，第四确定单元，还被配置为：根据第一散热设备的最高运行参数为第一设备部署位置上的散热设备确定第一运行参数，其中，第一运行参数小于或者等于最高运行参数；根据第一运行参数和第二设备部署位置与第一设备部署位置之间的距离为第二设备部署位置上的散热设备确定第二运行参数，其中，距离与第二运行参数成反比。
在一个示例性实施例中，装置还包括：
第二检测模块，被配置为在检测到服务器主机上电的情况下，检测服务器主机的当前上电信息，其中，当前上电信息用于指示服务器主机本次被上电的上电情况；
确定模块，被配置为根据当前上电信息确定网卡插槽阵列中的网卡插槽的在位信息，其中，在位信息用于指示对应网卡插槽上网卡设备的在位情况；
第二筛选模块，被配置为根据在位信息从散热设备阵列中筛选出第二散热设备，并控制第二散热设备按照参考运行参数运行，其中，参考运行参数用于将网卡插槽阵列散热到参考运行状态，参考运行状态是允许服务 器主机启动的情况下网卡插槽阵列的运行状态。
在一个示例性实施例中，确定模块，包括：第五确定单元，被配置为在当前上电信息用于指示服务器主机首次上电的情况下，确定在位信息用于指示网卡插槽阵列上存在连接了网卡设备的网卡插槽；第二筛选模块，还被配置为：将散热设备阵列中全部散热设备确定为第二散热设备；根据散热设备阵列中的散热设备的设备部署位置为第二散热设备分配运行参数，得到参考运行参数；控制第二散热设备按照参考运行参数运行。
在一个示例性实施例中，确定模块，包括：第六确定单元，被配置为在当前上电信息用于指示服务器主机非首次上电的情况下，确定在位信息用于指示服务器主机上一次关机时所连接的网卡设备在位；第二筛选模块，还被配置为：获取服务器主机上一次关机时所连接的网卡设备所在网卡插槽的候选插槽部署位置；从具有对应关系的插槽部署位置和设备部署位置中查找候选插槽部署位置所对应的候选设备部署位置；将候选设备部署位置上的散热设备确定为第二散热设备。
需要说明的是，上述各个模块是可以通过软件或硬件来实现的，对于后者，可以通过以下方式实现，但不限于此：上述模块均位于同一处理器中；或者，上述各个模块以任意组合的形式分别位于不同的处理器中。
本申请的实施例还提供了一种计算机非易失性可读存储介质，该计算机非易失性可读存储介质中存储有计算机程序，其中，该计算机程序被设置为运行时执行上述任一项方法实施例中的步骤。
在一个示例性实施例中，上述计算机非易失性可读存储介质可以包括但不限于：U盘、只读存储器(Read-Only Memory，简称为ROM)、随机存取存储器(Random Access Memory，简称为RAM)、移动硬盘、磁碟或者光盘等各种可以存储计算机程序的非易失性可读存储介质。
本申请的实施例还提供了一种电子设备，图9是根据本申请实施例的一种电子设备的结构框图，如图9所示，上述电子设备包括存储器和处理器，该存储器中存储有计算机程序，该处理器被设置为运行计算机程序以执行上述任一项方法实施例中的步骤。
在一个示例性实施例中，上述电子设备还可以包括传输设备以及输入输出设备，其中，该传输设备和上述处理器连接，该输入输出设备和上述处理器连接。
本申请的实施例还提供了一种计算机程序产品，上述计算机程序产品包括计算机程序，计算机程序被处理器执行时实现上述任一项方法实施例中的步骤。
本申请实施例中的具体示例可以参考上述实施例及示例性实施方式中所描述的示例，本申请实施例在此不再赘述。
显然，本领域的技术人员应该明白，上述的本申请的各模块或各步骤可以用通用的计算装置来实现，它们可以集中在单个的计算装置上，或者分布在多个计算装置所组成的网络上，它们可以用计算装置可执行的程序代码来实现，从而，可以将它们存储在存储装置中由计算装置来执行，并且在某些情况下，可以以不同于此处的顺序执行所示出或描述的步骤，或者将它们分别制作成各个集成电路模块，或者将它们中的多个模块或步骤制作成单个集成电路模块来实现。这样，本申请不限制于任何特定的硬件和软件结合。
以上所述仅为本申请的可选实施例而已，并不用于限制本申请，对于本领域的技术人员来说，本申请可以有各种更改和变化。凡在本申请的原则之内，所作的任何修改、等同替换、改进等，均应包括在本申请的保护范围之内。

Claims (20)

  1. 一种服务器散热设备的控制方法，其特征在于，
    服务器包括服务器主机和服务器控制器，所述服务器主机上部署了网卡插槽阵列和散热设备阵列，所述网卡插槽阵列中的网卡插槽的插槽部署位置与所述散热设备阵列中的散热设备的设备部署位置具有对应关系，所述网卡插槽被配置为连接网卡设备，所述散热设备被配置为为对应的网卡插槽上连接的网卡设备散热，所述方法应用于所述服务器控制器，所述方法包括：
    在检测到所述服务器主机启动的情况下，检测连接到所述服务器主机上的目标网卡设备所插入的目标网卡插槽的目标插槽部署位置；
    从所述散热设备阵列中筛选出目标插槽部署位置所对应的目标设备部署位置上的第一散热设备；
    控制所述第一散热设备按照目标运行参数运行，其中，所述目标运行参数用于将所述目标网卡设备散热到目标运行状态，所述目标运行状态是允许所述目标网卡设备在所述服务器主机启动后继续运行的状态。
  2. 根据权利要求1所述的方法，其特征在于，
    所述检测连接到所述服务器主机上的目标网卡设备所插入的目标网卡插槽的目标插槽部署位置，包括：
    接收所述服务器主机发送的所述目标插槽部署位置，其中，所述目标插槽部署位置是所述服务器主机在启动过程中的网卡设备枚举阶段检测到的。
  3. 根据权利要求2所述的方法，其特征在于，
    所述接收所述服务器主机发送的所述目标插槽部署位置，包括：
    接收所述服务器主机上部署的基本输入输出系统在完成所述网卡设备枚举阶段的运行后向所述服务器控制器发送的所述目标插槽部署位置。
  4. 根据权利要求2所述的方法，其特征在于，
    所述接收所述服务器主机发送的所述目标插槽部署位置，包括：
    检测所述服务器主机上部署的基本输入输出系统对所述服务器主机进行启动的启动进度；
    在所述启动进度用于指示所述基本输入输出系统已完成所述网卡设备枚举阶段的运行的情况下，向所述基本输入输出系统发送目标请求，其中，所述目标请求用于请求获取已连接到所述服务器主机上的网卡设备所插入的网卡插槽的插槽部署位置；
    接收所述服务器主机上部署的基本输入输出系统响应所述目标请求向所述服务器控制器发送的所述目标插槽部署位置。
  5. 根据权利要求1所述的方法，其特征在于，
    所述从所述散热设备阵列中筛选出目标插槽部署位置所对应的目标设备部署位置上的第一散热设备，包括：
    从具有对应关系的插槽部署位置和设备部署位置中查找所述目标插槽部署位置所对应的设备部署位置作为所述目标设备部署位置；
    将所述散热设备阵列中位于所述目标设备部署位置上的散热设备确定为所述第一散热设备。
  6. 根据权利要求1所述的方法，其特征在于，
    所述从所述散热设备阵列中筛选出目标插槽部署位置所对应的目标设备部署位置上的第一散热设备，包括：
    从具有对应关系的插槽部署位置和设备部署位置中查找所述目标插槽部署位置所对应的第一设备部署位置；
    获取与所述第一设备部署位置之间的距离落入目标距离范围内的第二设备部署位置；
    将所述第一设备部署位置和所述第二设备部署位置确定为所述目标设备部署位置；
    将所述散热设备阵列中位于所述目标设备部署位置上的散热设备确定为所述第一散热设备。
  7. 根据权利要求1所述的方法，其特征在于，
    所述控制所述第一散热设备按照目标运行参数运行，包括：
    根据所述第一散热设备的分布信息确定所述目标运行参数，其中，所述分布信息用于指示所述第一散热设备在所述服务器主机上的分布情况；
    控制所述第一散热设备按照所述目标运行参数运行。
  8. 根据权利要求7所述的方法，其特征在于，
    所述根据所述第一散热设备的分布信息确定所述目标运行参数，包括：
    在所述分布信息用于指示所述第一散热设备是所述散热设备阵列中设备部署位置与所述目标插槽部署位置具有对应关系的散热设备的情况下，获取所述第一散热设备的最高运行参数；
    将所述最高运行参数确定为所述目标运行参数。
  9. 根据权利要求7所述的方法，其特征在于，
    所述根据所述第一散热设备的分布信息确定所述目标运行参数，包括：
    在所述分布信息用于指示所述第一散热设备的所述目标插槽部署位置包括第一设备部署位置和第二设备部署位置的情况下，根据所述第一散热设备的最高运行参数和所述第一散热设备中的散热设备之间的距离为所述第一散热设备中的散热设备分配运行参数，其中，所述第一设备部署位置是从具有对应关系的插槽部署位置和设备部署位置中查找到的所述目标插槽部署位置所对应的设备部署位置，所述第二设备部署位置是与所述第一设备部署位置之间的距离落入目标距离范围内的设备部署位置；
    将具有对应关系的散热设备和运行参数确定为所述目标运行参数。
  10. 根据权利要求9所述的方法，其特征在于，
    所述根据所述第一散热设备的最高运行参数和所述第一散热设备中的散热设备之间的距离为所述第一散热设备中的散热设备分配运行参数，包括：
    根据所述第一散热设备的最高运行参数为所述第一设备部署位置上的散热设备确定第一运行参数，其中，所述第一运行参数小于或者等于所述最高运行参数；
    根据所述第一运行参数和所述第二设备部署位置与所述第一设备部署位置之间的距离为所述第二设备部署位置上的散热设备确定第二运行参数，其中，所述距离与所述第二运行参数成反比。
  11. 根据权利要求9所述的方法，其特征在于，
    所述根据所述第一散热设备的最高运行参数和所述第一散热设备中的散热设备之间的距离为所述第一散热设备中的散热设备分配运行参数，包括：
    为所述第一设备部署位置的散热设备分配第一运行参数，并为所述第二设备部署位置的散热设备分配第二运行参数，其中，所述第一运行参数小于或者等于所述最高运行参数，所述第二运行参数小于或者等于所述第一运行参数。
  12. 根据权利要求1所述的方法，其特征在于，
    在所述检测连接到所述服务器主机上的目标网卡设备所插入的目标网卡插槽的目标插槽部署位置之前，所述方法还包括：
    在检测到所述服务器主机上电的情况下，检测所述服务器主机的当前上电信息，其中，所述当前上电信息用于指示所述服务器主机本次被上电的上电情况；
    根据所述当前上电信息确定所述网卡插槽阵列中的网卡插槽的在位信息，其中，所述在位信息用于指示对应网卡插槽上网卡设备的在位情况；
    根据所述在位信息从所述散热设备阵列中筛选出第二散热设备，并控制所述第二散热设备按照参考运行参数运行，其中，所述参考运行参数用于将所述网卡插槽阵列散热到参考运行状态，所述参考运行状态是允许所述服务器主机启动的情况下所述网卡插槽阵列的运行状态。
  13. 根据权利要求12所述的方法，其特征在于，
    所述根据所述当前上电信息确定所述网卡插槽阵列中的网卡插槽的在位信息，包括：在所述当前上电信息用于指示所述服务器主机首次上电的情况下，确定所述在位信息用于指示所述网卡插槽阵列上存在连接了网卡设备的网卡插槽；
    所述根据所述在位信息从所述散热设备阵列中筛选出第二散热设备，并控制所述第二散热设备按照参考运行参数运行，包括：将所述散热设备阵列中全部散热设备确定为所述第二散热设备；根据所述散热设备阵列中的散热设备的设备部署位置为所述第二散热设备分配运行参数，得到所述参考运行参数；控制所述第二散热设备按照参考运行参数运行。
  14. 根据权利要求12所述的方法，其特征在于，
    所述根据所述当前上电信息确定所述网卡插槽阵列中的网卡插槽的在位信息，包括：在所述当前上电信息用于指示所述服务器主机未被启动过的情况下，确定所述在位信息用于指示所述网卡插槽阵列上的默认网卡插槽连接了网卡设备；
    所述根据所述在位信息从所述散热设备阵列中筛选出第二散热设备，包括：将所述散热设备阵列中散热设备的设备部署位置与所述默认网卡插槽的插槽部署位置对应的散热设备确定为所述第二散热设备。
  15. 根据权利要求12所述的方法，其特征在于，
    所述根据所述当前上电信息确定所述网卡插槽阵列中的网卡插槽的在位信息，包括：在所述当前上电信息用于指示所述服务器主机被启动过的情况下，根据服务器主机历史启动的过程中检测到的，连接到服务器主机上的目标网卡设备所插入的目标网卡插槽的目标插槽部署位置确定网卡插槽阵列中的网卡插槽的在位信息；
    所述根据所述在位信息从所述散热设备阵列中筛选出第二散热设备，包括：将所述散热设备阵列中与根据所述服务器主机历史启动过程中检测到的连接到所述服务器主机上的网卡设备的网卡插槽的插槽部署位置对应的散热设备确定为所述第二散热设备。
  16. 根据权利要求12所述的方法，其特征在于，
    所述根据所述当前上电信息确定所述网卡插槽阵列中的网卡插槽的在位信息，包括：在所述当前上电信息用于指示所述服务器主机非首次上电的情况下，确定所述在位信息用于指示所述服务器主机上一次关机时所连接的网卡设备在位；
    所述根据所述在位信息从所述散热设备阵列中筛选出第二散热设备，包括：获取所述服务器主机上一 次关机时所连接的网卡设备所在网卡插槽的候选插槽部署位置；从具有对应关系的插槽部署位置和设备部署位置中查找所述候选插槽部署位置所对应的候选设备部署位置；将所述候选设备部署位置上的散热设备确定为所述第二散热设备。
  17. 一种服务器散热设备的控制装置，其特征在于，
    服务器包括服务器主机和服务器控制器，所述服务器主机上部署了网卡插槽阵列和散热设备阵列，所述网卡插槽阵列中的网卡插槽的插槽部署位置与所述散热设备阵列中的散热设备的设备部署位置具有对应关系，所述网卡插槽被配置为连接网卡设备，所述散热设备被配置为为对应的网卡插槽上连接的网卡设备散热，所述装置应用于所述服务器控制器，所述装置包括：
    第一检测模块，被配置为在检测到所述服务器主机启动的情况下，检测连接到所述服务器主机上的目标网卡设备所插入的目标网卡插槽的目标插槽部署位置；
    第一筛选模块，被配置为从所述散热设备阵列中筛选出目标插槽部署位置所对应的目标设备部署位置上的第一散热设备；
    控制模块，被配置为控制所述第一散热设备按照目标运行参数运行，其中，所述目标运行参数用于将所述目标网卡设备散热到目标运行状态，所述目标运行状态是允许所述目标网卡设备在所述服务器主机启动后继续运行的状态。
  18. 一种计算机非易失性可读存储介质，其特征在于，
    所述计算机非易失性可读存储介质中存储有计算机程序，其中，所述计算机程序被处理器执行时实现权利要求1至16任一项中所述的方法的步骤。
  19. 一种电子设备，包括存储器、处理器以及存储在所述存储器上并可在所述处理器上运行的计算机程序，其特征在于，
    所述处理器执行所述计算机程序时实现权利要求1至16任一项中所述的方法的步骤。
  20. 一种计算机程序产品，包括计算机程序，其特征在于，
    所述计算机程序被处理器执行时实现权利要求1至16任一项中所述的方法的步骤。
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