WO2025074828A1 - 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法、及びプリント配線板の製造方法 - Google Patents

感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法、及びプリント配線板の製造方法 Download PDF

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WO2025074828A1
WO2025074828A1 PCT/JP2024/032545 JP2024032545W WO2025074828A1 WO 2025074828 A1 WO2025074828 A1 WO 2025074828A1 JP 2024032545 W JP2024032545 W JP 2024032545W WO 2025074828 A1 WO2025074828 A1 WO 2025074828A1
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mass
resin composition
meth
photosensitive
photosensitive resin
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English (en)
French (fr)
Japanese (ja)
Inventor
夏木 戸田
琢 澤木
宏樹 ▲高▼松
拓也 南
謙介 吉原
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Resonac Corp
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Resonac Corp
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Priority to CN202480022980.7A priority Critical patent/CN120981773A/zh
Priority to JP2025550827A priority patent/JPWO2025074828A1/ja
Priority to KR1020267005863A priority patent/KR20260042570A/ko
Publication of WO2025074828A1 publication Critical patent/WO2025074828A1/ja
Anticipated expiration legal-status Critical
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material

Definitions

  • This disclosure relates to a photosensitive resin composition, a photosensitive element, a method for forming a resist pattern, and a method for manufacturing a printed wiring board.
  • photosensitive resin compositions and photosensitive elements comprising a layer formed on a support film using the photosensitive resin composition (hereinafter also referred to as a "photosensitive layer”) are widely used as resist materials for etching, plating, and the like.
  • Printed wiring boards are manufactured using the above-mentioned photosensitive element, for example, in the following manner. That is, first, the photosensitive layer of the photosensitive element is laminated onto a circuit-forming substrate such as a copper-clad laminate. Next, the photosensitive layer is exposed to light through a mask film or the like to form a photocured portion. At this time, the support film is peeled off before or after exposure. After that, the areas of the photosensitive layer other than the photocured portion are removed with a developer to form a resist pattern. Next, the resist pattern is used as a resist to perform an etching process or a plating process to form a conductor pattern, and finally the photocured portion of the photosensitive layer (resist pattern) is peeled off (removed).
  • the photosensitive layer is required to have excellent characteristics in etching or plating processes, as well as excellent adhesion to the circuit-forming substrate and excellent resolution in forming the resist pattern (see, for example, Patent Documents 1 and 2).
  • the present inventors have discovered a photosensitive resin composition that uses a binder polymer having a specific composition, which is capable of forming a resist pattern with excellent adhesion and shortening the time required to remove the resist pattern.
  • One aspect of the present disclosure relates to the following photosensitive resin composition, photosensitive element, method for forming a resist pattern, and method for producing a printed wiring board.
  • a photosensitive element comprising a support and a photosensitive layer formed on the support using the photosensitive resin composition according to any one of [1] to [5] above.
  • a method for forming a resist pattern comprising: a step of forming a photosensitive layer on a substrate using the photosensitive resin composition according to any one of [1] to [5] above or the photosensitive element according to [6] above; a step of irradiating at least a part of the photosensitive layer with actinic radiation to form a photocured portion; and a step of removing an unphotocured portion of the photosensitive layer from the substrate to form a resist pattern.
  • a method for producing a printed wiring board comprising the step of etching or plating a substrate on which a resist pattern has been formed by the method for forming a resist pattern according to [7] above to form a conductor pattern.
  • the present disclosure provides a photosensitive resin composition, a photosensitive element, a method for forming a resist pattern, and a method for manufacturing a printed wiring board that can achieve both adhesion and releasability.
  • FIG. 1 is a schematic cross-sectional view illustrating one embodiment of a photosensitive element.
  • the term “process” includes not only independent processes, but also processes that cannot be clearly distinguished from other processes, as long as the intended effect of the process is achieved.
  • the term “layer” includes structures that are formed on the entire surface as well as structures that are formed on a portion of the surface when observed in a plan view.
  • a numerical range indicated using “ ⁇ ” indicates a range that includes the numerical values before and after " ⁇ " as the minimum and maximum values, respectively.
  • the upper or lower limit of a numerical range of a certain stage may be replaced with the upper or lower limit of a numerical range of another stage.
  • the upper or lower limit of the numerical range may be replaced with the values shown in the examples.
  • the amount of each component in a photosensitive resin composition means the total amount of the multiple substances present in the composition when the composition contains multiple substances corresponding to each component, unless otherwise specified.
  • solid content refers to the non-volatile content in the photosensitive resin composition excluding volatile substances (water, solvent, etc.).
  • solid content refers to components other than the solvent that do not volatilize and remain when the photosensitive resin composition is dried, as described below, and includes components that are liquid, syrup-like, or waxy at room temperature (25°C).
  • the photosensitive resin composition according to the present embodiment contains (A) a binder polymer (hereinafter, sometimes referred to as "(A) component”); (B) a photopolymerizable compound (hereinafter, sometimes referred to as “(B) component”); (C) a photopolymerization initiator (hereinafter, sometimes referred to as “(C) component”); and (D) a sensitizer (hereinafter, sometimes referred to as "(D) component”).
  • A a binder polymer
  • (B) a photopolymerizable compound hereinafter, sometimes referred to as "(B) component”
  • C a photopolymerization initiator
  • D a sensitizer
  • the binder polymer has a first structural unit derived from acrylic acid, a second structural unit derived from styrene or a styrene derivative, and a third structural unit derived from a (meth)acrylate compound, and based on the total mass of the structural units derived from the polymerizable monomers constituting the binder polymer, the content of the first structural unit is 9% by mass or more and 25% by mass or less, the content of the second structural unit is 61% by mass or more, and the content of the third structural unit is 1% by mass or more and 20% by mass or less.
  • each component that may be contained in the photosensitive resin composition will be described in detail.
  • the content of the structural unit derived from acrylic acid may be 15 to 25% by mass, 16 to 25% by mass, 17 to 24% by mass, 18 to 24% by mass, or 19 to 23.5% by mass, from the viewpoint of improving developability and adhesion in a well-balanced manner.
  • the (A) component has a second structural unit derived from styrene or a styrene derivative, which can improve the resolution and adhesion of the photosensitive resin composition.
  • styrene derivatives include vinyl toluene, ⁇ -methyl styrene, p-methyl styrene, and p-ethyl styrene.
  • the content of the second structural unit in component (A) may be 61 mass% or more, 62 mass% or more, 64 mass% or more, or 66 mass% or more, based on the total mass of the structural units derived from the polymerizable monomers constituting the binder polymer, from the viewpoint of further improving adhesion.
  • the content of the second structural unit may be 85 mass% or less, 84 mass% or less, 83 mass% or less, or 80 mass% or less, from the viewpoint of further shortening the peeling time.
  • the (A) component has a third structural unit derived from a (meth)acrylate compound, which makes it possible to adjust the balance between the adhesion and releasability of the photosensitive resin composition.
  • the content of the third structural unit in component (A) may be 2% by mass or more, 2.5% by mass or more, or 3% by mass or more, based on the total mass of the structural units derived from the polymerizable monomers constituting the binder polymer, from the viewpoint of further shortening the peeling time.
  • the content of the third structural unit may be 19% by mass or less, 18% by mass or less, or 16% by mass or less, from the viewpoint of further improving adhesion.
  • the content of the structural unit derived from the (meth)acrylate compound may be 2 to 19% by mass, 2.5 to 18% by mass, or 3 to 16% by mass.
  • the (meth)acrylate compound it is preferable to use a (meth)acrylate compound having a solubility parameter of 15.7 to 18.7.
  • the solubility parameter of the (meth)acrylate compound may be 15.8 to 18.6, 16.0 to 18.5, or 16.5 to 18.4.
  • the (meth)acrylate compound a (meth)acrylate compound having a logarithm of an octanol/water partition coefficient (logP) of 0.5 or more may be used.
  • the logP of the (meth)acrylate compound may be 1.0 or more, 2.0 or more, or 3.0 or more, and from the viewpoint of improving developability, it may be 12.0 or less, 10.0 or less, or 6.0 or less.
  • the logP of a polymerizable monomer can be calculated, for example, using COSMOTHERM (registered trademark).
  • COSMOTHERM is thermodynamic property prediction software that uses the COSMO-RS method.
  • the COSMO-RS method is a method for predicting the physical properties of chemical substances based on the surface charge of the molecule obtained by quantum chemical calculations.
  • LogP is an index that indicates the hydrophilicity of the structural units that make up the binder polymer.
  • Examples of (meth)acrylate compounds include 2-hydroxypropyl (meth)acrylate, mono-2-(methacryloyloxy)ethyl phthalate, hydroxyethyl (meth)acrylate, (meth)acryloylmorpholine, dicyclopentanyl (meth)acrylate, p-diphenyl methacrylate, tetrahydrofurfuryl (meth)acrylate, and isostearyl (meth)acrylate.
  • Component (A) may further contain structural units derived from polymerizable monomers other than those mentioned above (hereinafter also referred to as "other monomers”).
  • other monomers include benzyl (meth)acrylate or derivatives thereof, furfuryl (meth)acrylate, dimethylaminoethyl (meth)acrylate, diethylaminoethyl (meth)acrylate, glycidyl (meth)acrylate, 2,2,2-trifluoroethyl (meth)acrylate, 2,2,3,3-tetrafluoropropyl (meth)acrylate, ⁇ -furyl (meth)acrylic acid, ⁇ -styryl (meth)acrylic acid, maleic acid, maleic anhydride, maleic acid monoalkyl ester, fumaric acid, cinnamic acid, ⁇ -cyanocinnamic acid, itaconic acid, crotonic acid, and propiolic acid. These may be used alone
  • the weight average molecular weight (Mw) of component (A) may be 25,000 to 55,000, 30,000 to 53,000, 32,000 to 50,000, or 35,000 to 48,000. When Mw is 55,000 or less, the resolution and developability tend to be improved, and when Mw is 25,000 or more, chipping and peeling of the resist pattern tend to be less likely to occur.
  • the dispersity (Mw/Mn) of component (A) may be 1.0 to 3.0, 1.0 to 2.5, or 1.0 to 2.3. When the dispersity is smaller, the resolution tends to be improved.
  • Mw and Mn can be measured, for example, by gel permeation chromatography (GPC) using a calibration curve of standard polystyrene. More specifically, they can be measured under the conditions described in the Examples.
  • GPC gel permeation chromatography
  • the acid value of component (A) may be 146 to 180 mgKOH/g, 148 to 178 mgKOH/g, or 150 to 176 mgKOH/g from the viewpoint of achieving both developability and releasability.
  • the acid value of component (A) can be adjusted by a structural unit derived from acrylic acid.
  • the acid value of component (A) can be measured in accordance with JIS K6901:2008 5.3.2.
  • the glass transition temperature (Tg) of component (A) may be 70 to 125°C, 90 to 120°C, 94 to 110°C, or 96 to 108°C from the viewpoint of resolution or adhesion.
  • the Tg of component (A) is a value determined according to the Fox formula, and can be calculated from the mass of each polymerizable monomer constituting component (A) and the Tg of the homopolymer of each polymerizable monomer.
  • the content of the (A) component may be 20 parts by mass or more, 30 parts by mass or more, 40 parts by mass or more, or 50 parts by mass or more, relative to 100 parts by mass of the total amount of the (A) component and the (B) component, from the viewpoint of excellent formability of the film, and may be 80 parts by mass or less, 70 parts by mass or less, or 60 parts by mass or less, from the viewpoint of further improving sensitivity and resolution.
  • bisphenol A type (meth)acrylates include, for example, BPE-200 (trade name, manufactured by Shin-Nakamura Chemical Co., Ltd.) as 2,2-bis(4-((meth)acryloxydipropoxy)phenyl)propane, BP-2EM (trade name, manufactured by Kyoeisha Chemical Co., Ltd.) as ethoxylated bisphenol A dimethacrylate, and BPE-500 (trade name, manufactured by Shin-Nakamura Chemical Co., Ltd.) and FA-321M (trade name, manufactured by Resonac Co., Ltd.) as 2,2-bis(4-(methacryloxypentaethoxy)phenyl)propane. These bisphenol A type (meth)acrylates may be used alone or in combination of two or more types.
  • the content of the bisphenol type (meth)acrylate may be 40 to 98 mass%, 50 to 97 mass%, 60 to 95 mass%, or 70 to 90 mass% based on the total amount of component (B). If the content is 40 mass% or more, the resolution, adhesion, and suppression of resist tail generation will be better, and if it is 98 mass% or less, the development time will be appropriately short and development residue will be less likely to occur.
  • the total number of oxyethylene groups (EO groups) and/or oxypropylene groups (PO groups) in the polyalkylene glycol di(meth)acrylate may be 2 to 40, 4 to 30, or 6 to 20, from the viewpoint of further improving adhesion and resolution.
  • polyalkylene glycol di(meth)acrylates examples include FA-023M (trade name, manufactured by Resonac Corporation), FA-024M (trade name, manufactured by Resonac Corporation), and NK Ester HEMA-9P (trade name, manufactured by Shin-Nakamura Chemical Co., Ltd.). These may be used alone or in combination of two or more.
  • the content of polyalkylene glycol di(meth)acrylate may be 2 to 40 mass%, 3 to 30 mass%, or 5 to 20 mass% based on the total amount of component (B).
  • component (B) may also be used as component (B).
  • component (B) may contain at least one selected from nonylphenoxy polyethyleneoxy acrylate and phthalic acid compounds.
  • the content thereof may be 5 to 50 mass%, 5 to 40 mass%, or 10 to 30 mass% based on the total amount of component (B).
  • nonylphenoxy polyethyleneoxyacrylates include nonylphenoxy triethyleneoxyacrylate, nonylphenoxy tetraethyleneoxyacrylate, nonylphenoxy pentaethyleneoxyacrylate, nonylphenoxy hexaethyleneoxyacrylate, nonylphenoxy heptaethyleneoxyacrylate, nonylphenoxy octaethyleneoxyacrylate, nonylphenoxy nonaethyleneoxyacrylate, nonylphenoxy decaethyleneoxyacrylate, and nonylphenoxy undecaethyleneoxyacrylate.
  • phthalic acid compounds include ⁇ -chloro- ⁇ -hydroxypropyl- ⁇ '-(meth)acryloyloxyethyl-o-phthalate, ⁇ -hydroxyethyl- ⁇ '-(meth)acryloyloxyethyl-o-phthalate, and ⁇ -hydroxypropyl- ⁇ '-(meth)acryloyloxyethyl-o-phthalate.
  • ⁇ -chloro- ⁇ -hydroxypropyl- ⁇ '-methacryloyloxyethyl-o-phthalate is commercially available as FA-MECH (trade name, manufactured by Resonac Corporation).
  • component (B) may contain a (meth)acrylic acid polyol ester.
  • (meth)acrylic acid polyol esters include trimethylolpropane polyethoxy tri(meth)acrylate, trimethylolpropane polypropoxy tri(meth)acrylate, trimethylolpropane polybutoxy tri(meth)acrylate, trimethylolpropane polyethoxy polypropoxy tri(meth)acrylate, trimethylolethane polyethoxy tri(meth)acrylate, trimethylolethane polypropoxy tri(meth)acrylate, trimethylolethane polybut ...propoxy tri(meth)acrylate, trimethylolethane polybutoxy tri(meth)acrylate, trimethylolethane polyethoxy tri(meth)acrylate, trimethylolethane polypropoxy tri(meth)acrylate, trimethylolethane polybutoxy tri(meth)acrylate, trimethylolethane polypropoxy tri(meth)acrylate,
  • the content of component (B) is preferably 20 to 60 parts by mass, more preferably 30 to 55 parts by mass, and even more preferably 35 to 50 parts by mass, relative to 100 parts by mass of the total amount of components (A) and (B).
  • the photosensitive resin composition has better photosensitivity and coating properties in addition to better resolution and adhesion.
  • component (C) Photopolymerization initiator
  • the component (C) is not particularly limited as long as it is a component that can polymerize the component (B), and can be appropriately selected from commonly used photopolymerization initiators.
  • Component (C) may contain a hexaarylbiimidazole compound from the viewpoint of improving the adhesion of the photosensitive layer to a smooth substrate.
  • the aryl group in the hexaarylbiimidazole compound may be a phenyl group or the like.
  • the hydrogen atom bonded to the aryl group in the hexaarylbiimidazole compound may be substituted with a halogen atom (such as a chlorine atom).
  • the hexaarylbiimidazole compound may be a 2,4,5-triarylimidazole dimer.
  • 2,4,5-triarylimidazole dimer examples include 2-(o-chlorophenyl)-4,5-diphenylimidazole dimer, 2-(o-chlorophenyl)-4,5-bis-(m-methoxyphenyl)imidazole dimer, and 2-(p-methoxyphenyl)-4,5-diphenylimidazole dimer.
  • the content of component (C) may be 1.0 to 10 parts by mass, 2.0 to 8 parts by mass, 3.0 to 7.0 parts by mass, or 4.0 to 6.0 parts by mass, per 100 parts by mass of the total amount of components (A) and (B). When the content of component (C) is within this range, it becomes easy to improve both photosensitivity and resolution in a well-balanced manner.
  • dialkylaminobenzophenone compounds examples include 4,4'-bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, and 4-benzoyl-4'-methyldiphenyl sulfide.
  • the content of the (D) component may be 1.60 parts by mass or less, 1.50 parts by mass or less, 1.40 parts by mass or less, or 1.35 parts by mass or less, per 100 parts by mass of the (C) component, from the viewpoint of further improving adhesion.
  • the content of the (D) component may be 0.15 to 1.60 parts by mass, 0.20 to 1.50 parts by mass, 0.25 to 1.40 parts by mass, or 0.30 to 1.35 parts by mass, per 100 parts by mass of the (C) component, from the viewpoint of improving developability, adhesion, and peelability in a balanced manner.
  • the content of component (D) may be 0.01 to 0.10 parts by mass, 0.01 to 0.09 parts by mass, 0.01 to 0.08 parts by mass, or 0.02 to 0.05 parts by mass per 100 parts by mass of the total amount of components (A) and (B).
  • the photosensitive resin composition may further contain a polymerization inhibitor as component (E) from the viewpoint of suppressing polymerization in unexposed areas during resist pattern formation and further improving resolution.
  • a polymerization inhibitor examples include 4-tert-butylcatechol and 2,2,6,6-tetramethyl-4-hydroxypiperidine-1-oxyl.
  • the content of component (E) may be 0.001 to 0.10 parts by mass, 0.005 to 0.08 parts by mass, or 0.01 to 0.06 parts by mass per 100 parts by mass of the total amount of components (A) and (B).
  • the photosensitive resin composition may further contain one or more other components other than the above-mentioned components.
  • the other components include hydrogen donors (bis[4-(dimethylamino)phenyl]methane, bis[4-(diethylamino)phenyl]methane, leuco crystal violet, N-phenylglycine, etc.), dyes (malachite green, etc.), tribromophenyl sulfone, photocoloring agents, thermal coloring inhibitors, plasticizers (p-toluenesulfonamide, etc.), pigments, fillers, defoamers, flame retardants, stabilizers, adhesion agents, leveling agents, peeling promoters, antioxidants, fragrances, imaging agents, and thermal crosslinking agents.
  • the content of the other components may be 0.005 parts by mass or more or 0.01 parts by mass or more, or may be 20 parts by mass or less, relative to 100 parts by mass of the total amount of the components (A) and
  • the support was peeled off from the test piece to expose the photosensitive layer, and a 1% by mass aqueous solution of sodium carbonate at 30° C. was sprayed onto the exposed surface. The time required for the photosensitive layer to be completely removed was measured and taken as the minimum development time.
  • a glass chrome type phototool (adhesion negative: having a wiring pattern with line width/space width of x/3x (x: 1 to 18, unit: ⁇ m)) was used as an evaluation negative on the support of the test piece, and the photosensitive layer was exposed with a predetermined energy amount using a projection exposure apparatus (manufactured by Ushio Inc., product name "UX-2240-SM-XJ01") with an ultra-high pressure mercury lamp (365 nm) as a light source. After exposure, the support was peeled off to expose the photosensitive layer, and a 1% by mass aqueous solution of sodium carbonate at 30° C. was sprayed for a time twice the minimum development time to remove the unexposed portion (development treatment).
  • the space areas (unexposed areas) were cleanly removed, and the line areas (exposed areas) were formed without any warping, meandering, or chipping.
  • the space width was widened in an evaluation pattern in which the sum of the line and space widths was 16 ⁇ m, the smallest line width at which a pattern could be formed was recorded as adhesion. The smaller this value, the better the adhesion.
  • a glass chrome type phototool (having a planar pattern of 50 mm x 40 mm) was used as a negative for evaluating the peel test on the support of the test piece, and the photosensitive layer was exposed to the above-mentioned predetermined energy amount using a projection exposure apparatus (manufactured by Ushio Inc., product name "UX-2240-SM-XJ01") with an ultra-high pressure mercury lamp (365 nm) as a light source.
  • Ushio Inc. product name "UX-2240-SM-XJ01”
  • UX-2240-SM-XJ01 ultra-high pressure mercury lamp
  • the substrate was immersed in an amine-based stripping solution (15% by volume R-100S + 8% by volume R-101 aqueous solution, manufactured by Mitsubishi Gas Chemical Co., Ltd.) heated to 50°C. The time until the photosensitive layer was completely removed was measured and used as the stripping time.
  • an amine-based stripping solution (15% by volume R-100S + 8% by volume R-101 aqueous solution, manufactured by Mitsubishi Gas Chemical Co., Ltd.

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  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
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  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
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  • Polymerisation Methods In General (AREA)
PCT/JP2024/032545 2023-10-06 2024-09-11 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法、及びプリント配線板の製造方法 Pending WO2025074828A1 (ja)

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Application Number Priority Date Filing Date Title
CN202480022980.7A CN120981773A (zh) 2023-10-06 2024-09-11 感光性树脂组合物、感光性元件、抗蚀剂图案的形成方法及印刷线路板的制造方法
JP2025550827A JPWO2025074828A1 (https=) 2023-10-06 2024-09-11
KR1020267005863A KR20260042570A (ko) 2023-10-06 2024-09-11 감광성 수지 조성물, 감광성 엘리먼트, 레지스트 패턴의 형성 방법, 및 프린트 배선판의 제조 방법

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JP2023-174284 2023-10-06
JP2023174284 2023-10-06

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JP2021047305A (ja) * 2019-09-19 2021-03-25 旭化成株式会社 低誘電感光性樹脂組成物、及びその硬化物
JP2023046106A (ja) * 2021-09-22 2023-04-03 旭化成株式会社 感光性樹脂積層体
WO2023136333A1 (ja) * 2022-01-14 2023-07-20 旭化成株式会社 感光性樹脂組成物、感光性樹脂積層体、及びレジストパターンの形成方法

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* Cited by examiner, † Cited by third party
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JP2021047305A (ja) * 2019-09-19 2021-03-25 旭化成株式会社 低誘電感光性樹脂組成物、及びその硬化物
JP2023046106A (ja) * 2021-09-22 2023-04-03 旭化成株式会社 感光性樹脂積層体
WO2023136333A1 (ja) * 2022-01-14 2023-07-20 旭化成株式会社 感光性樹脂組成物、感光性樹脂積層体、及びレジストパターンの形成方法

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